WO2019167540A1 - Polishing composition, method for producing polishing composition, and polishing method - Google Patents

Polishing composition, method for producing polishing composition, and polishing method Download PDF

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Publication number
WO2019167540A1
WO2019167540A1 PCT/JP2019/003462 JP2019003462W WO2019167540A1 WO 2019167540 A1 WO2019167540 A1 WO 2019167540A1 JP 2019003462 W JP2019003462 W JP 2019003462W WO 2019167540 A1 WO2019167540 A1 WO 2019167540A1
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Prior art keywords
polishing
polishing composition
mass
parts
compound
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PCT/JP2019/003462
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French (fr)
Japanese (ja)
Inventor
俊彦 福原
一博 芝
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株式会社フジミインコーポレーテッド
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Publication of WO2019167540A1 publication Critical patent/WO2019167540A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Definitions

  • the present invention relates to a polishing composition used for polishing an object to be polished made of a synthetic resin such as a plastic lens, a method for producing the polishing composition, and a polishing method using the polishing composition.
  • Patent Document 1 describes a polishing composition containing a polyether polyol and abrasive grains as a polishing composition used for polishing a synthetic resin polishing object.
  • the polishing composition of Patent Document 1 has a high polishing rate when the polishing object is made of CR39, but the polishing rate is lower than that of CR39 when the polishing object is made of polycarbonate. was there.
  • the present invention relates to a polishing composition that can be suitably used in an application for polishing an object to be polished made of synthetic resin, in particular, a polishing composition that can improve the polishing rate of CR39 and polycarbonate, and the polishing thereof. It is an object of the present invention to provide a method for producing a composition for polishing and a polishing method using the polishing composition.
  • the polishing composition according to one embodiment of the present invention is a polishing composition used for polishing a polishing object made of a synthetic resin, and includes R—O — ((CH 2 ) m —O) n.
  • the gist is to contain a compound represented by ZO 3 ⁇ M + and abrasive grains.
  • R represents a linear or branched alkyl group
  • Z represents a sulfur atom or a phosphorus atom
  • M + represents a counter cation.
  • M represents an integer of 1 to 4
  • n represents an integer of 4 to 100.
  • the gist of a polishing method according to another aspect of the present invention is to polish a polishing object made of synthetic resin using the polishing composition according to the above aspect.
  • the gist of a polishing method according to another aspect of the present invention is to polish the surface of a synthetic resin substrate using the polishing composition according to the above aspect.
  • polishing target object made from a synthetic resin, especially the polishing composition which can improve the polishing rate of CR39 and a polycarbonate, respectively, and its A method for producing a polishing composition is provided.
  • polishing method which can improve the grinding
  • the polishing composition of the present embodiment is produced by mixing Compound A, which will be described later, abrasive grains, and water, and contains Compound A, abrasive grains, and water.
  • This polishing composition is used for polishing an object to be polished made of a synthetic resin such as a plastic lens, particularly CR39 and polycarbonate.
  • a synthetic resin such as a plastic lens, particularly CR39 and polycarbonate.
  • CR39 means a synthetic resin containing diethylene glycol bisallyl carbonate.
  • the polycarbonate is also referred to as “PC” hereinafter.
  • R-O - is a polymeric surfactant represented by M + - ((CH 2) m -O) n ZO 3.
  • This compound A is considered to have an action of suppressing polishing scraps and pad scraps from adhering to abrasive grains and objects to be polished.
  • the polishing composition of this embodiment can suppress the adhesion of polishing scraps and pad scraps to abrasive grains and polishing objects, and the polishing composition for polishing a polishing object made of synthetic resin. It is thought that this ability will improve.
  • R represents a linear or branched alkyl group
  • Z represents a sulfur atom or a phosphorus atom
  • M + represents a counter cation.
  • m represents an integer of 1 to 4
  • n represents an integer of 4 to 100.
  • Z is a sulfur atom, the handling of the compound A tends to be easier.
  • n is not particularly limited, but if it is 4 or more, the hydrophobicity is increased, and the affinity for a synthetic resin polishing object, particularly CR39 and polycarbonate tends to be increased. Moreover, since the viscosity of the compound A tends to increase when n exceeds 100, n is 100 or less, preferably 80 or less, more preferably 60 or less. Further, m is not particularly limited, but if it is 1 or more, the hydrophobicity increases, and the affinity for a synthetic resin polishing object, particularly CR39 and polycarbonate tends to increase. Moreover, since m tends to increase the viscosity of Compound A when m exceeds 4, m is 4 or less, and 2 is particularly preferable.
  • R that is, the number of carbon atoms of the alkyl group is not particularly limited, but if it is 8 or more, the hydrophobicity increases, and the affinity for a synthetic resin polishing object, particularly CR39 and polycarbonate tends to increase. Moreover, since the viscosity of the compound A tends to increase when the carbon number of R exceeds 16, the carbon number of R is preferably 16 or less.
  • M serving as a counter cation include those capable of forming a water-soluble salt with R—O — ((CH 2 ) m —O) n ZO 3 — . Specific examples of M include alkali metals, alkaline earth metals, ammonium (NH 4 ), and alkanol ammonium, and alkali metals and ammonium are preferable.
  • Compound A examples include Arscope (manufactured by Toho Chemical Industry Co., Ltd.), Fusuanol (manufactured by Toho Chemical Industry Co., Ltd.), Sandet (manufactured by Sanyo Chemical Industries Co., Ltd.), Emar (manufactured by Kao Corporation), and the like. .
  • the HSP value of Compound A in the polishing composition is preferably in the range of 2 or more and 6 or less from the viewpoint of polishing rate.
  • HSP means a Hansen solubility parameter (Hansen solubility parameter).
  • the abrasive grains play a role of mechanically polishing the object to be polished, and contribute to improving the ability of the polishing composition to polish the object to be polished made of synthetic resin.
  • the abrasive grains contained in the polishing composition of the present embodiment may be alumina such as ⁇ -alumina, ⁇ -alumina, ⁇ -alumina, ⁇ -alumina and amorphous alumina, or silicon carbide. It may be other than alumina such as silica, zirconia, ceria and titania. However, in order to obtain a higher polishing rate, alumina is preferable, and ⁇ -alumina is more preferable among them.
  • the content of abrasive grains in the polishing composition is less than 10 parts by mass with respect to 100 parts by mass of water, more specifically less than 5 parts by mass, more specifically less than 3 parts by mass
  • the content of abrasive grains in the polishing composition is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, most preferably 100 parts by mass of water. Preferably it is 10 mass parts or more.
  • the content of abrasive grains in the polishing composition is more than 50 parts by mass with respect to 100 parts by mass of water, more specifically, when the content is more than 40 parts by mass, the viscosity of the polishing composition is high. Therefore, there is a tendency that the amount of the polishing composition attached to the object to be polished and taken out after polishing increases, resulting in poor economic efficiency. Therefore, from the viewpoint of economy, the content of abrasive grains in the polishing composition is preferably 50 parts by mass or less, more preferably 40 parts by mass or less with respect to 100 parts by mass of water.
  • the average particle diameter of the abrasive grains contained in the polishing composition is preferably 0.015 ⁇ m or more.
  • the average particle diameter of the abrasive grains contained in the polishing composition is 12 ⁇ m or less.
  • Alumina having an average particle size of abrasive grains smaller than 0.7 ⁇ m, more specifically alumina having an average particle size smaller than 0.6 ⁇ m, more specifically, alumina having an average particle size smaller than 0.5 ⁇ m is made of synthetic resin.
  • the average particle diameter of the alumina is preferably 0.5 ⁇ m or more, more preferably 0.6 ⁇ m. As described above, it is most preferably 0.7 ⁇ m or more.
  • the average particle diameter of alumina contained in the polishing composition as abrasive grains is larger than 8 ⁇ m, more specifically larger than 4 ⁇ m, more specifically larger than 2 ⁇ m, the surface roughness increases. Due to the occurrence of scratches, the surface quality of the polished object after polishing, particularly the surface quality of CR39 and PC, may be deteriorated. Therefore, when the abrasive grains contained in the polishing composition are alumina, the average particle diameter of the alumina is preferably 8 ⁇ m or less in order to maintain the surface quality of the polished object after polishing, and more preferably Is 4 ⁇ m or less, most preferably 2 ⁇ m or less.
  • the polishing composition according to the present embodiment preferably contains an additive.
  • the additive include an oil agent, an emulsion stabilizer, and a thickener. These additives may be used alone or in combination of two or more. By adding these additives, the long-term stability of the polishing composition tends to be improved. In addition, you may use the surface modifier mentioned later, an alkali, etc. as an additive.
  • oils examples include liquid paraffin, polybutene, ⁇ -olefin oligomer, alkylbenzene, polyol ester, phosphate ester, synthetic oil such as silicone oil, spindle oil, neutral oil, mineral oil such as bright stock, castor oil, soybean oil And vegetable oils such as coconut oil, linseed oil, cottonseed oil, rapeseed oil, drill oil and olive oil, and animal oils such as beef tallow, squalane and lanolin.
  • the emulsion stabilizer include polyhydric alcohols such as glycerin, ethylene glycol and propylene glycol, and aliphatic alcohols such as cetyl alcohol and stearyl alcohol.
  • thickeners examples include synthetic acrylic thickeners such as polyacrylic acid and sodium polyacrylate (for example, fully neutralized products, partially neutralized products, associative alkali-soluble polyacrylic acid (acrylic polymer), etc.) Agents, cellulosic thickeners (semi-synthetic thickeners) such as carboxymethylcellulose and carboxyethylcellulose, natural thickeners such as agar, carrageenan, xanthan gum and gum arabic.
  • associative alkali-soluble polyacrylic acid is used, polyacrylic acid and alkali are used in combination.
  • alkali include inorganic alkalis such as sodium hydroxide and potassium hydroxide, and organic alkalis such as ammonia and triethanolamine. By adding an alkali, polyacrylic acid tends to exhibit a thickening action.
  • the content of the additive in the polishing composition is preferably 0.1% by mass or more, and more preferably 1.0% by mass or more. Moreover, it is preferable that it is 12.0 mass% or less, and, as for content of the additive in polishing composition, it is more preferable that it is 8.0 mass% or less. When content of an additive exists in said range, there exists a tendency for the dispersibility and stability of various substances in polishing composition to increase.
  • the polishing composition of the present embodiment is not particularly limited, but the pH of the polishing composition can be, for example, 0.5 or more and 12.0 or less, and may be 0.5 or more and 10.0 or less. From the viewpoint of polishing rate, surface roughness, etc., the pH of the polishing composition can be 0.5 or more and 7.0 or less, more preferably 1.0 or more and 5.0 or less. More preferably, it is 0 or more and 4.0 or less. If necessary, a pH adjusting agent such as an organic acid, an inorganic acid, or a basic compound can be contained so that the above pH is realized in the polishing composition.
  • a pH adjusting agent such as an organic acid, an inorganic acid, or a basic compound can be contained so that the above pH is realized in the polishing composition.
  • the polishing composition of the present embodiment suppresses corrosion of the polishing object, an oxidizing agent that oxidizes the surface of the polishing object, a water-soluble polymer that acts on the surface of the polishing object or the surface of the abrasive grain, if necessary. It may further contain other components such as anticorrosives and chelating agents, antiseptics having other functions, antifungal agents, surface modifiers and the like.
  • the polishing composition may further contain Compound B for further improvement of the polishing rate.
  • Compound B is at least one compound selected from the group consisting of metal salts of inorganic acids, metal salts of organic acids other than Compound A, ammonium salts of inorganic acids, or ammonium salts of organic acids other than Compound A.
  • the inorganic acid may be any of nitric acid, sulfuric acid and hydrochloric acid
  • the organic acid is any of oxalic acid, lactic acid, acetic acid, formic acid, citric acid, tartaric acid, malic acid, gluconic acid, glycolic acid and malonic acid. May be.
  • the metal salt may be any of aluminum salt, nickel salt, lithium salt, magnesium salt, sodium salt and potassium salt.
  • the compound B contained in the polishing composition is preferably nitric acid, sulfuric acid, hydrochloric acid, or an aluminum salt of lactic acid, more preferably aluminum nitrate, because it has an excellent ability to chemically polish an object to be polished. is there.
  • the content of the compound B in the polishing composition is less than 1 part by mass with respect to 100 parts by mass of the abrasive, more specifically less than 3 parts by mass, and more specifically less than 5 parts by mass. Is difficult to improve the polishing rate of the synthetic resin polishing object, particularly CR39 and PC. Therefore, in order to obtain a higher polishing rate, the content of Compound B in the polishing composition is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and most preferably 5 parts by mass or more. is there.
  • the content of the compound B in the polishing composition is more than 20 parts by mass, more specifically, when it is more than 15 parts by mass, the polishing machine is corroded because the pH of the polishing composition is lowered. There is a tendency to be easy to be. Therefore, from the viewpoint of preventing corrosion of the polishing machine, the content in the polishing composition is preferably 20 parts by mass or less, more preferably 15 parts by mass or less.
  • alumina sol When the abrasive grains are alumina, it is preferable to add alumina sol to the polishing composition. From the viewpoint of suppressing the aggregation of alumina particles and improving the redispersibility, it is preferable to further contain an alumina sol as an aggregation inhibitor.
  • Alumina sol for example, has a property of being dispersed in a colloidal manner in a polishing composition, and exhibits redispersibility by suppressing agglomeration of alumina, generation of agglomerated hard precipitate (hard caking), and solidified alumina. This tends to suppress the generation of scratches on the surface to be polished.
  • the alumina sol of this embodiment is, for example, a hydrated alumina or aluminum hydroxide dispersed in a colloidal form in an acidic aqueous solution.
  • the hydrated alumina include boehmite, pseudoboehmite, diaspore, dibsite, bayerite and the like.
  • the alumina sol contained in the polishing composition is particularly preferably obtained by dispersing boehmite or pseudoboehmite in an acidic aqueous solution.
  • water-soluble polymers examples include polycarboxylic acids such as polyacrylic acid, polysulfonic acids such as polyphosphonic acid and polystyrene sulfonic acid, polysaccharides such as chitansan gum and sodium alginate, cellulose derivatives such as hydroxyethyl cellulose and carboxymethyl cellulose, polyethylene glycol , Polyvinyl alcohol, polyvinyl pyrrolidone, polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, sorbitan monooleate, oxyalkylene polymers having a single kind or plural kinds of oxyalkylene units.
  • the salt of said compound can also be used suitably as a water-soluble polymer.
  • anticorrosive examples include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid and the like.
  • chelating agents include carboxylic acid chelating agents such as gluconic acid, amine chelating agents such as ethylenediamine, diethylenetriamine, and trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetraminehexaacetic acid.
  • Polyaminopolycarboxylic chelating agents such as diethylenetriaminepentaacetic acid, 2-aminoethylphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, aminotri (methylenephosphonic acid), ethylenediaminetetrakis (methylenephosphonic acid), diethylenetriaminepenta ( Methylenephosphonic acid), ethane-1,1-diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphosphonic acid, 1-phosphonobutane-2,3,4-to Organic phosphonic acid chelating agents such as carboxylic acid, phenol derivatives, 1,3-diketones and the like.
  • preservatives include sodium hypochlorite and the like.
  • antifungal agents include oxazolines such as oxazolidine-2,5-dione.
  • surface modifier include alkylol ammonium salt of a copolymer having an acid group.
  • the method for producing the polishing composition of the present embodiment is not particularly limited, and for example, compound A which is a surfactant in water, that is, R—O — ((CH 2 ) m —O) n ZO 3 ⁇ M +
  • the compound represented by is dissolved and mixed with stirring.
  • the polishing composition of this embodiment can be obtained by stirring and mixing the abrasive grains and other components as necessary.
  • the temperature at the time of mixing each component is not particularly limited, but is preferably 10 ° C. or higher and 40 ° C. or lower.
  • water and a surfactant may be stirred and mixed to perform phase inversion emulsification. Further, the mixing time is not particularly limited.
  • polishing machine Coburn 505 aspherical lens polishing machine
  • Polishing pad Plastic lens blanket Polishing pressure: 240 g / cm 2
  • Polishing time 5 minutes
  • Polishing temperature 13 ⁇ 1 ° C ⁇
  • Slurry supply rate Circulation at 2 liters / minute
  • a 70 mm diameter sample of diethylene glycol bisallyl carbonate resin (CR39) or a 70 mm diameter sample of polycarbonate resin (PC) is polished using the polishing composition of this embodiment under the above polishing conditions to produce a substrate.
  • Compound A is considered to have an action of suppressing polishing dust and pad scraps from adhering to abrasive grains and objects to be polished. Therefore, according to the polishing composition of the present embodiment containing compound A, without being hindered by the adhesion of polishing scraps and pad scraps to abrasive grains and polishing objects, polishing objects made of synthetic resin, In particular, it is considered that CR39 and PC can be polished at a high polishing rate. Compound A can suppress the adhesion of polishing scraps and pad scraps to abrasive grains and objects to be polished because compound A acts on the surface of polishing scraps and pad scraps to disperse polishing scraps and pad scraps. This is considered to improve the performance.
  • this embodiment may be changed as follows.
  • two or more kinds of compounds A may be contained in the polishing composition of the present embodiment.
  • a higher polishing rate tends to be obtained by the action of different types of compound A.
  • the polishing composition of this embodiment may contain two or more kinds of compounds B. In this case, a higher polishing rate tends to be obtained by the action of different types of compound B.
  • the polishing composition of the present embodiment may contain two or more kinds of abrasive grains. In this case, a higher polishing rate tends to be obtained by the action of different types of abrasive grains.
  • antifoamers such as a silicone type antifoamer, an ether type antifoamer, and an alcohol type antifoamer, to the polishing composition of this embodiment as needed.
  • the antifoaming agent added to the polishing composition preferably has a strong foam suppressing action in order to suppress foaming of the polishing composition, and preferably has a strong foam breaking action in order to destroy the generated foam.
  • the content of the antifoaming agent in the polishing composition is preferably 1% by mass or less, more preferably 0.1% by mass or less.
  • polishing composition of this embodiment may be prepared by diluting the undiluted
  • the preferable range of content of Compound A, Compound B, and abrasive grains in the polishing composition in the description of the present embodiment is about the content in the polishing composition at the time of use.
  • polishing compositions of Examples 1 to 6 and Comparative Example 1 were prepared by appropriately mixing Compound A, Compound B, ⁇ -alumina and alumina sol with water, and further adding an emulsion type silicone antifoaming agent and antiseptic and antifungal agent. A product was prepared. Details of Compound A and Compound B in each polishing composition are as shown in Table 1, respectively. Incidentally, polyoxyethylene alkyl ether sulfate ester Compound A, i.e. R-O- (C 2 H 4 O) n SO 3 - was used Na +.
  • the content of Compound A was 0.6 parts by mass in Example 1, 6 parts by mass in Example 2, and 10 parts by mass in Example 3.
  • the content of Compound A was 1 part by mass in Example 4, 6 parts by mass in Example 5, and 10 parts by mass in Example 6.
  • a surfactant composition containing 2% by mass that is, a surfactant dilution, is 1.5 parts by mass in Example 1, 15 parts by mass in Example 2, and 25 parts by mass in Example 3. Therefore, the content of the compound A was determined.
  • compound B aluminum nitrate was used.
  • the content of Compound B was 20 parts by mass.
  • the content of ⁇ -alumina as abrasive grains was 200 parts by mass.
  • the average particle diameter of ⁇ -alumina was 0.8 ⁇ m.
  • the average particle diameter of ⁇ -alumina was measured by an electric resistance method (Coulter Counter method).
  • the content of the alumina sol having a solid content of 10% by mass was 200 parts by mass.
  • the water content was 720 parts by mass.
  • the content of the emulsion type silicone antifoaming agent was 15 parts by mass. Further, the content of the antiseptic and fungicide was 0.5 parts by mass.
  • “ ⁇ ” described in Comparative Example 1 in Table 1 means that the compound A is not contained and thus cannot be defined.
  • Polishing object 70 mm diameter plastic lens made of diethylene glycol bisallyl carbonate (CR39), or 70 mm diameter plastic lens made of polycarbonate (PC)
  • Polishing machine LOH lens polishing machine “TORO-X-2000”
  • Polishing pad “CPR0400M” manufactured by DAC vision -Convex polishing dish: 5.00-6.00 diopter
  • Polishing time 3 minutes ⁇
  • Amount of polishing composition used 1.0 liter (circulation use)
  • -Supply rate of polishing composition 1.2 liters per minute-Temperature of polishing composition: 10 ° C
  • polishing rate (g / 3 min.), And the calculated polishing rate was evaluated according to the following criteria.
  • ⁇ indicates that the polishing rate is 0.150 or more
  • ⁇ indicates that the polishing rate is 0.125 or more and less than 0.150
  • ⁇ indicates that the polishing rate is Indicates less than 0.125.
  • ⁇ indicates that the polishing rate is 0.070 or more
  • ⁇ indicates that the polishing rate is 0.060 or more and less than 0.070
  • ⁇ indicates polishing. Indicates that the speed is less than 0.050.
  • the surface roughness Ra of the plastic lens after polishing using the polishing compositions of Examples 1 to 6 and Comparative Example 1 under the above polishing conditions was fixed by Phase Shift, Inc. to which an objective lens having a magnification of 50 times was attached. It measured using the contact-type surface roughness measuring instrument “MicroXAM”.
  • the results of evaluating the surface roughness Ra of the plastic lens after polishing using each polishing composition based on the measurement results are shown in the “Surface roughness” column of Table 1. In the column, “ ⁇ ” indicates that the surface roughness Ra is 0.02 ⁇ m or less, and “ ⁇ ” indicates that the surface roughness Ra is more than 0.02 ⁇ m. If the evaluation is “ ⁇ ” or higher, there is no problem in using the product.
  • each polishing rate for CR39 and PC was improved as compared with each polishing rate for CR39 and PC of the polishing composition of Comparative Example 1. did.
  • the surface roughness when CR39 and PC were polished was the same as the surface roughness when CR39 and PC were polished with the polishing composition of Comparative Example 1. It was almost the same. That is, the polishing compositions of Examples 1 to 6 can polish CR39 and PC with the same surface roughness as the polishing composition of Comparative Example 1, that is, the polishing composition according to the prior art.

Abstract

Provided are: a polishing composition that can be suitably used for polishing a polishing-object made of synthetic resin; a method for producing the polishing composition; and a polishing method using the polishing composition. A polishing composition according to one embodiment is used for polishing a polishing-object made of synthetic resin, and the composition contains: a compound represented by chemical formula R-O-((CH2)m-O)nZO3 -M+; and abrasive grains. In the chemical formula, R is a straight-chain or branched-chain alkyl group, Z is a sulfur atom or a phosphorus atom, M+ is a counter cation, m is an integer of 1-4, and n is an integer of 4-100.

Description

研磨用組成物、研磨用組成物の製造方法及び研磨方法Polishing composition, method for producing polishing composition, and polishing method
　本発明は、プラスチックレンズなどの合成樹脂製の研磨対象物を研磨する用途で使用される研磨用組成物、その研磨用組成物の製造方法、及びその研磨用組成物を用いた研磨方法に関する。 The present invention relates to a polishing composition used for polishing an object to be polished made of a synthetic resin such as a plastic lens, a method for producing the polishing composition, and a polishing method using the polishing composition.
　特許文献１には、合成樹脂製の研磨対象物を研磨する用途で使用される研磨用組成物として、ポリエーテルポリオールと砥粒とを含有する研磨用組成物が記載されている。しかしながら、特許文献１の研磨用組成物には、研磨対象物がＣＲ３９製である場合は研磨レートが高いが、研磨対象物がポリカーボネート製である場合は研磨レートがＣＲ３９と比べて低くなるという課題があった。 Patent Document 1 describes a polishing composition containing a polyether polyol and abrasive grains as a polishing composition used for polishing a synthetic resin polishing object. However, the polishing composition of Patent Document 1 has a high polishing rate when the polishing object is made of CR39, but the polishing rate is lower than that of CR39 when the polishing object is made of polycarbonate. was there.
特開２００７－６３４４０号公報JP 2007-63440 A
　そこで本発明は、合成樹脂製の研磨対象物を研磨する用途において好適に使用することができる研磨用組成物、特にＣＲ３９及びポリカーボネートの研磨レートをそれぞれ向上させることができる研磨用組成物、その研磨用組成物の製造方法、及びその研磨用組成物を用いた研磨方法を提供することを課題とする。 Therefore, the present invention relates to a polishing composition that can be suitably used in an application for polishing an object to be polished made of synthetic resin, in particular, a polishing composition that can improve the polishing rate of CR39 and polycarbonate, and the polishing thereof. It is an object of the present invention to provide a method for producing a composition for polishing and a polishing method using the polishing composition.
　本発明の一態様に係る研磨用組成物は、合成樹脂製の研磨対象物を研磨する用途で使用される研磨用組成物であって、Ｒ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される化合物と、砥粒と、を含有することを要旨とする。なお、Ｒは直鎖状又は分岐鎖状のアルキル基を表し、Ｚは硫黄原子又はリン原子を表し、Ｍ＋は対カチオンを表す。また、ｍは１以上４以下の整数を表し、ｎは４以上１００以下の整数を表す。 The polishing composition according to one embodiment of the present invention is a polishing composition used for polishing a polishing object made of a synthetic resin, and includes R—O — ((CH 2 ) m —O) n. The gist is to contain a compound represented by ZO 3 − M + and abrasive grains. R represents a linear or branched alkyl group, Z represents a sulfur atom or a phosphorus atom, and M + represents a counter cation. M represents an integer of 1 to 4, and n represents an integer of 4 to 100.
　本発明の他の態様に係る研磨用組成物の製造方法は、上記一態様に係るＲ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される化合物と、砥粒と、を混合することを要旨とする。 Method for producing a polishing composition according to another aspect of the present invention, according to the one aspect R-O - ((CH 2 ) m -O) n ZO 3 - a compound represented by M +, abrasive And the gist of mixing.
　本発明の他の態様に係る研磨方法は、上記一態様に係る研磨用組成物を用いて合成樹脂製の研磨対象物を研磨することを要旨とする。 The gist of a polishing method according to another aspect of the present invention is to polish a polishing object made of synthetic resin using the polishing composition according to the above aspect.
　本発明の他の態様に係る研磨方法は、上記一態様に係る研磨用組成物を用いて合成樹脂製の基板の表面を研磨することを要旨とする。 The gist of a polishing method according to another aspect of the present invention is to polish the surface of a synthetic resin substrate using the polishing composition according to the above aspect.
　本発明によれば、合成樹脂製の研磨対象物を研磨する用途において好適に使用することができる研磨用組成物、特にＣＲ３９及びポリカーボネートの研磨レートをそれぞれ向上させることができる研磨用組成物及びその研磨用組成物の製造方法が提供される。また、本発明によれば、合成樹脂製の研磨対象物、特にＣＲ３９及びポリカーボネートの研磨レートをそれぞれ向上させることができる研磨方法が提供される。 ADVANTAGE OF THE INVENTION According to this invention, the polishing composition which can be used suitably in the use which grind | polishes the grinding | polishing target object made from a synthetic resin, especially the polishing composition which can improve the polishing rate of CR39 and a polycarbonate, respectively, and its A method for producing a polishing composition is provided. Moreover, according to this invention, the grinding | polishing method which can improve the grinding | polishing rate of a synthetic resin grinding | polishing target object, especially CR39, and a polycarbonate, respectively is provided.
　以下、本発明の実施形態を説明する。
（研磨用組成物）
　本実施形態の研磨用組成物は、後述する化合物Ａと砥粒と水とを混合することにより製造され、化合物Ａ、砥粒及び水を含有する。この研磨用組成物は、プラスチックレンズなどの合成樹脂製の研磨対象物、特にＣＲ３９及びポリカーボネートを研磨する用途で使用される。ここで、「ＣＲ３９」とは、ジエチレングリコールビスアリルカーボネートを含む合成樹脂を意味する。また、ポリカーボネートについては、以下「ＰＣ」とも称する。 Embodiments of the present invention will be described below.
(Polishing composition)
The polishing composition of the present embodiment is produced by mixing Compound A, which will be described later, abrasive grains, and water, and contains Compound A, abrasive grains, and water. This polishing composition is used for polishing an object to be polished made of a synthetic resin such as a plastic lens, particularly CR39 and polycarbonate. Here, “CR39” means a synthetic resin containing diethylene glycol bisallyl carbonate. The polycarbonate is also referred to as “PC” hereinafter.
　〔化合物Ａ〕
　本実施形態の研磨用組成物に含まれる化合物Ａは、Ｒ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される高分子界面活性剤である。この化合物Ａは、研磨屑やパッド屑が砥粒や研磨対象物に付着するのを抑制する作用を有していると考えられる。このため、本実施形態の研磨用組成物は、砥粒や研磨対象物への研磨屑やパッド屑の付着を抑制することが可能となり、合成樹脂製の研磨対象物を研磨する研磨用組成物の能力が向上するものと考えられる。
　化合物Ａを示す構造式中において、Ｒは直鎖状又は分岐鎖状のアルキル基を表し、Ｚは硫黄原子又はリン原子を表し、Ｍ＋は対カチオンを表す。また、化合物Ａにおいて、ｍは１以上４以下の整数を表し、ｎは４以上１００以下の整数を表す。
　なお、Ｚが硫黄原子であれば、化合物Ａの取り扱いがより容易となる傾向がある。 [Compound A]
Compound A contained in the polishing composition of this embodiment, R-O - is a polymeric surfactant represented by M + - ((CH 2) m -O) n ZO 3. This compound A is considered to have an action of suppressing polishing scraps and pad scraps from adhering to abrasive grains and objects to be polished. For this reason, the polishing composition of this embodiment can suppress the adhesion of polishing scraps and pad scraps to abrasive grains and polishing objects, and the polishing composition for polishing a polishing object made of synthetic resin. It is thought that this ability will improve.
In the structural formula showing Compound A, R represents a linear or branched alkyl group, Z represents a sulfur atom or a phosphorus atom, and M + represents a counter cation. In Compound A, m represents an integer of 1 to 4, and n represents an integer of 4 to 100.
In addition, if Z is a sulfur atom, the handling of the compound A tends to be easier.
　また、ｎは特に制限されないが、４以上であれば疎水性が高まり、合成樹脂製の研磨対象物、特にＣＲ３９及びポリカーボネートに対する親和性が高まる傾向がある。また、ｎが１００を超えると化合物Ａの粘度が高まる傾向があるため、ｎは１００以下、好ましくは８０以下、より好ましくは６０以下である。また、ｍは特に制限されないが、１以上であれば疎水性が高まり、合成樹脂製の研磨対象物、特にＣＲ３９及びポリカーボネートに対する親和性が高まる傾向がある。また、ｍが４を超えると化合物Ａの粘度が高まる傾向があるため、ｍは４以下、特に２が好ましい。また、Ｒ、即ちアルキル基の炭素数は特に制限されないが、８以上であれば疎水性が高まり、合成樹脂製の研磨対象物、特にＣＲ３９及びポリカーボネートに対する親和性が高まる傾向がある。また、Ｒの炭素数が１６を超えると化合物Ａの粘度が高まる傾向があるため、Ｒの炭素数は１６以下が好ましい。また、対カチオンとなるＭとしては、Ｒ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －とともに水溶性の塩を形成しうるものが挙げられる。Ｍとしては具体的にはアルカリ金属、アルカリ土類金属、アンモニウム（ＮＨ４）、アルカノールアンモニウムなどが挙げられ、アルカリ金属、アンモニウムが好ましい。 Further, n is not particularly limited, but if it is 4 or more, the hydrophobicity is increased, and the affinity for a synthetic resin polishing object, particularly CR39 and polycarbonate tends to be increased. Moreover, since the viscosity of the compound A tends to increase when n exceeds 100, n is 100 or less, preferably 80 or less, more preferably 60 or less. Further, m is not particularly limited, but if it is 1 or more, the hydrophobicity increases, and the affinity for a synthetic resin polishing object, particularly CR39 and polycarbonate tends to increase. Moreover, since m tends to increase the viscosity of Compound A when m exceeds 4, m is 4 or less, and 2 is particularly preferable. Further, R, that is, the number of carbon atoms of the alkyl group is not particularly limited, but if it is 8 or more, the hydrophobicity increases, and the affinity for a synthetic resin polishing object, particularly CR39 and polycarbonate tends to increase. Moreover, since the viscosity of the compound A tends to increase when the carbon number of R exceeds 16, the carbon number of R is preferably 16 or less. Examples of M serving as a counter cation include those capable of forming a water-soluble salt with R—O — ((CH 2 ) m —O) n ZO 3 — . Specific examples of M include alkali metals, alkaline earth metals, ammonium (NH 4 ), and alkanol ammonium, and alkali metals and ammonium are preferable.
　化合物Ａの具体例としては、アルスコープ（東邦化学工業株式会社製）、フオスフアノール（東邦化学工業株式会社製）、サンデット（三洋化成工業株式会社製）、エマール（花王株式会社製）等が挙げられる。 Specific examples of Compound A include Arscope (manufactured by Toho Chemical Industry Co., Ltd.), Fusuanol (manufactured by Toho Chemical Industry Co., Ltd.), Sandet (manufactured by Sanyo Chemical Industries Co., Ltd.), Emar (manufactured by Kao Corporation), and the like. .
　研磨用組成物中の化合物Ａの含有量が砥粒１００質量部に対して０．１質量部よりも少ない場合には合成樹脂製の研磨対象物、特にＣＲ３９及びＰＣを研磨する研磨用組成物の能力が向上しにくい傾向がある。従って、より高い研磨速度を得るためには、研磨用組成物中の化合物Ａの含有量は、砥粒１００質量部に対して０．１質量部以上であることが好ましく、より好ましくは２質量部以上である。一方、研磨用組成物中の化合物Ａの含有量が砥粒１００質量部に対して１０質量部よりも多い場合には化合物Ａの粘性が高くなる傾向がある。従って、粘性の観点からすると、研磨用組成物中の化合物Ａの含有量は、砥粒１００質量部に対して１０質量部以下であることが好ましく、より好ましくは５質量部以下である。 Polishing composition for polishing polishing object made of synthetic resin, especially CR39 and PC when content of compound A in polishing composition is less than 0.1 part by weight with respect to 100 parts by weight of abrasive grains Tend to be difficult to improve. Therefore, in order to obtain a higher polishing rate, the content of Compound A in the polishing composition is preferably 0.1 parts by mass or more, more preferably 2 parts by mass with respect to 100 parts by mass of the abrasive grains. More than a part. On the other hand, when the content of Compound A in the polishing composition is more than 10 parts by mass with respect to 100 parts by mass of the abrasive grains, the viscosity of Compound A tends to increase. Therefore, from the viewpoint of viscosity, the content of the compound A in the polishing composition is preferably 10 parts by mass or less, more preferably 5 parts by mass or less with respect to 100 parts by mass of the abrasive grains.
　研磨用組成物中の化合物ＡのＨＳＰ値は、研磨速度の観点からすると、２以上６以下の範囲内が好適である。ここで、「ＨＳＰ」とは、ハンセン溶解度パラメーター（Ｈａｎｓｅｎ　ｓｏｌｕｂｉｌｉｔｙ　ｐａｒａｍｅｔｅｒ）を意味する。 The HSP value of Compound A in the polishing composition is preferably in the range of 2 or more and 6 or less from the viewpoint of polishing rate. Here, “HSP” means a Hansen solubility parameter (Hansen solubility parameter).
　〔砥粒〕
　砥粒は、研磨対象物を機械的に研磨する役割を担い、合成樹脂製の研磨対象物を研磨する研磨用組成物の能力の向上に寄与する。本実施形態の研磨用組成物に含まれる砥粒は、例えば、α－アルミナ、δ－アルミナ、θ－アルミナ、κ－アルミナ及び非晶質アルミナのようなアルミナであってもよいし、炭化ケイ素、シリカ、ジルコニア、セリア及びチタニアのようなアルミナ以外であってもよい。ただし、より高い研磨速度を得るためにはアルミナであることが好ましく、その中でもより好ましくはα－アルミナである。 [Abrasive]
The abrasive grains play a role of mechanically polishing the object to be polished, and contribute to improving the ability of the polishing composition to polish the object to be polished made of synthetic resin. The abrasive grains contained in the polishing composition of the present embodiment may be alumina such as α-alumina, δ-alumina, θ-alumina, κ-alumina and amorphous alumina, or silicon carbide. It may be other than alumina such as silica, zirconia, ceria and titania. However, in order to obtain a higher polishing rate, alumina is preferable, and α-alumina is more preferable among them.
　研磨用組成物中の砥粒の含有量が水１００質量部に対して１０質量部よりも少ない場合、さらに言えば５質量部よりも少ない場合、もっと言えば３質量部よりも少ない場合には、合成樹脂製の研磨対象物、特にＣＲ３９及びＰＣを研磨する研磨用組成物の能力が向上しにくい傾向がある。従って、より高い研磨速度を得るためには、研磨用組成物中の砥粒の含有量は水１００質量部に対して３質量部以上であることが好ましく、より好ましくは５質量部以上、最も好ましくは１０質量部以上である。一方、研磨用組成物中の砥粒の含有量が水１００質量部に対して５０質量部よりも多い場合、さらに言えば４０質量部よりも多い場合には、研磨用組成物の粘度が高くなるために研磨後に研磨対象物に付着して持ち出される研磨用組成物の量が増大して経済性に劣る傾向がある。従って、経済性の観点からすると、研磨用組成物中の砥粒の含有量は水１００質量部に対して５０質量部以下であることが好ましく、より好ましくは４０質量部以下である。 When the content of abrasive grains in the polishing composition is less than 10 parts by mass with respect to 100 parts by mass of water, more specifically less than 5 parts by mass, more specifically less than 3 parts by mass The ability of polishing compositions for polishing polishing objects made of synthetic resin, particularly CR39 and PC, tends to be difficult to improve. Therefore, in order to obtain a higher polishing rate, the content of abrasive grains in the polishing composition is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, most preferably 100 parts by mass of water. Preferably it is 10 mass parts or more. On the other hand, when the content of abrasive grains in the polishing composition is more than 50 parts by mass with respect to 100 parts by mass of water, more specifically, when the content is more than 40 parts by mass, the viscosity of the polishing composition is high. Therefore, there is a tendency that the amount of the polishing composition attached to the object to be polished and taken out after polishing increases, resulting in poor economic efficiency. Therefore, from the viewpoint of economy, the content of abrasive grains in the polishing composition is preferably 50 parts by mass or less, more preferably 40 parts by mass or less with respect to 100 parts by mass of water.
　砥粒の平均粒子径が０．０１５μｍよりも小さい砥粒は、合成樹脂製の研磨対象物を研磨する能力を有さない傾向がある。従って、高い研磨速度を得るためには、研磨用組成物に含まれる砥粒の平均粒子径は０．０１５μｍ以上であることが好ましい。一方、砥粒の平均粒子径が１２μｍよりも大きい場合には、表面粗さの増大やスクラッチの発生などにより研磨後の研磨対象物の表面品質に低下がみられることがある。従って、研磨後の研磨対象物の表面品質の維持のためには、研磨用組成物に含まれる砥粒の平均粒子径は１２μｍ以下であることが好ましい。 Abrasive grains having an average grain size smaller than 0.015 μm tend not to have the ability to polish a synthetic resin polishing object. Therefore, in order to obtain a high polishing rate, the average particle diameter of the abrasive grains contained in the polishing composition is preferably 0.015 μm or more. On the other hand, when the average particle size of the abrasive grains is larger than 12 μm, the surface quality of the polished object after polishing may be reduced due to an increase in surface roughness or generation of scratches. Therefore, in order to maintain the surface quality of the object to be polished after polishing, it is preferable that the average particle diameter of the abrasive grains contained in the polishing composition is 12 μm or less.
　砥粒の平均粒子径が０．７μｍよりも小さいアルミナ、さらに言えば平均粒子径が０．６μｍよりも小さいアルミナ、もっと言えば平均粒子径が０．５μｍよりも小さいアルミナは、合成樹脂製の研磨対象物、特にＣＲ３９及びＰＣを研磨する能力が高くない傾向がある。従って、研磨用組成物に含まれる砥粒がアルミナである場合、より高い研磨速度を得るためには、そのアルミナの平均粒子径は０．５μｍ以上であることが好ましく、より好ましくは０．６μｍ以上、最も好ましくは０．７μｍ以上である。一方、砥粒として研磨用組成物に含まれるアルミナの平均粒子径が８μｍよりも大きい場合、さらに言えば４μｍよりも大きい場合、もっと言えば２μｍよりも大きい場合には、表面粗さの増大やスクラッチの発生などにより研磨後の研磨対象物の表面品質、特にＣＲ３９及びＰＣの表面品質に低下がみられることがある。従って、研磨用組成物に含まれる砥粒がアルミナである場合、研磨後の研磨対象物の表面品質の維持のためには、そのアルミナの平均粒子径は８μｍ以下であることが好ましく、より好ましくは４μｍ以下、最も好ましくは２μｍ以下である。 Alumina having an average particle size of abrasive grains smaller than 0.7 μm, more specifically alumina having an average particle size smaller than 0.6 μm, more specifically, alumina having an average particle size smaller than 0.5 μm is made of synthetic resin. There is a tendency that the ability to polish a polishing object, particularly CR39 and PC, is not high. Therefore, when the abrasive grains contained in the polishing composition are alumina, in order to obtain a higher polishing rate, the average particle diameter of the alumina is preferably 0.5 μm or more, more preferably 0.6 μm. As described above, it is most preferably 0.7 μm or more. On the other hand, when the average particle diameter of alumina contained in the polishing composition as abrasive grains is larger than 8 μm, more specifically larger than 4 μm, more specifically larger than 2 μm, the surface roughness increases. Due to the occurrence of scratches, the surface quality of the polished object after polishing, particularly the surface quality of CR39 and PC, may be deteriorated. Therefore, when the abrasive grains contained in the polishing composition are alumina, the average particle diameter of the alumina is preferably 8 μm or less in order to maintain the surface quality of the polished object after polishing, and more preferably Is 4 μm or less, most preferably 2 μm or less.
　〔添加剤〕
　本実施形態に係る研磨用組成物は、添加剤を含むことが好ましい。添加剤の具体的な例としては、例えば、油剤、乳化安定剤、増粘剤が挙げられる。これらの添加剤は、単独でもまたは２種以上混合して用いてもよい。これらの添加剤を添加することで、研磨用組成物の長時間安定性が向上する傾向がある。なお、添加剤として、後述する表面改質剤及びアルカリ等を用いてもよい。 〔Additive〕
The polishing composition according to the present embodiment preferably contains an additive. Specific examples of the additive include an oil agent, an emulsion stabilizer, and a thickener. These additives may be used alone or in combination of two or more. By adding these additives, the long-term stability of the polishing composition tends to be improved. In addition, you may use the surface modifier mentioned later, an alkali, etc. as an additive.
　油剤の例としては、流動パラフィン、ポリブテン、α－オレフィンオリゴマー、アルキルベンゼン、ポリオールエステル、リン酸エステル、シリコーン油などの合成油、スピンドル油、ニュートラル油、ブライトストックなどの鉱物油、ヒマシ油、大豆油、ヤシ油、亜麻仁油、綿実油、ナタネ油、キリ油、オリーブ油などの植物性油脂、牛脂、スクワラン、ラノリンなどの動物性油脂等が挙げられる。
　乳化安定剤の例としては、グリセリン、エチレングリコール、プロピレングリコール等の多価アルコール、セチルアルコール、ステアリルアルコール等の脂肪族アルコール等が挙げられる。 Examples of oils include liquid paraffin, polybutene, α-olefin oligomer, alkylbenzene, polyol ester, phosphate ester, synthetic oil such as silicone oil, spindle oil, neutral oil, mineral oil such as bright stock, castor oil, soybean oil And vegetable oils such as coconut oil, linseed oil, cottonseed oil, rapeseed oil, drill oil and olive oil, and animal oils such as beef tallow, squalane and lanolin.
Examples of the emulsion stabilizer include polyhydric alcohols such as glycerin, ethylene glycol and propylene glycol, and aliphatic alcohols such as cetyl alcohol and stearyl alcohol.
　増粘剤の例としては、ポリアクリル酸、ポリアクリル酸ナトリウム（例えば、完全中和物、部分中和物、会合型のアルカリ可溶性のポリアクリル酸（アクリルポリマー）など）等の合成系増粘剤、カルボキシメチルセルロース、カルボキシエチルセルロース等のセルロース系増粘剤（半合成系増粘剤）、寒天、カラギーナン、キサンタンガム、アラビアゴム等の天然系増粘剤等が挙げられる。会合型のアルカリ可溶性のポリアクリル酸を用いる場合には、ポリアクリル酸とアルカリとが併用される。アルカリとしては、水酸化ナトリウム、水酸化カリウム等の無機アルカリ、アンモニア、トリエタノールアミン等の有機アルカリなどが挙げられる。アルカリを添加することにより、ポリアクリル酸が増粘作用を発揮する傾向がある。 Examples of thickeners include synthetic acrylic thickeners such as polyacrylic acid and sodium polyacrylate (for example, fully neutralized products, partially neutralized products, associative alkali-soluble polyacrylic acid (acrylic polymer), etc.) Agents, cellulosic thickeners (semi-synthetic thickeners) such as carboxymethylcellulose and carboxyethylcellulose, natural thickeners such as agar, carrageenan, xanthan gum and gum arabic. When associative alkali-soluble polyacrylic acid is used, polyacrylic acid and alkali are used in combination. Examples of the alkali include inorganic alkalis such as sodium hydroxide and potassium hydroxide, and organic alkalis such as ammonia and triethanolamine. By adding an alkali, polyacrylic acid tends to exhibit a thickening action.
　研磨用組成物中の添加剤の含有量は、０．１質量％以上であることが好ましく、１．０質量％以上であることがより好ましい。また、研磨用組成物中の添加剤の含有量は、１２．０質量％以下であることが好ましく、８．０質量％以下であることがより好ましい。添加剤の含有量が上記の範囲内にある場合、研磨用組成物中における各種物質の分散性及び安定性が増す傾向がある。 The content of the additive in the polishing composition is preferably 0.1% by mass or more, and more preferably 1.0% by mass or more. Moreover, it is preferable that it is 12.0 mass% or less, and, as for content of the additive in polishing composition, it is more preferable that it is 8.0 mass% or less. When content of an additive exists in said range, there exists a tendency for the dispersibility and stability of various substances in polishing composition to increase.
（研磨用組成物のｐＨ）
　本実施形態の研磨用組成物は、特に制限されないが、研磨用組成物のｐＨは例えば、０．５以上１２．０以下とすることができ、０．５以上１０．０以下としてもよい。研磨レートや表面粗さ等の観点から、研磨用組成物のｐＨは、０．５以上７．０以下とすることができ、１．０以上５．０以下とすることがより好ましく、３．０以上４．０以下とすることがさらに好ましい。研磨用組成物において上記ｐＨが実現されるように、必要に応じて有機酸、無機酸、塩基性化合物などのｐＨ調整剤を含有させることができる。 (PH of polishing composition)
The polishing composition of the present embodiment is not particularly limited, but the pH of the polishing composition can be, for example, 0.5 or more and 12.0 or less, and may be 0.5 or more and 10.0 or less. From the viewpoint of polishing rate, surface roughness, etc., the pH of the polishing composition can be 0.5 or more and 7.0 or less, more preferably 1.0 or more and 5.0 or less. More preferably, it is 0 or more and 4.0 or less. If necessary, a pH adjusting agent such as an organic acid, an inorganic acid, or a basic compound can be contained so that the above pH is realized in the polishing composition.
　〔他の成分〕
　本実施形態の研磨用組成物は、必要に応じて、研磨対象物の表面を酸化させる酸化剤、研磨対象物の表面や砥粒表面に作用する水溶性高分子、研磨対象物の腐食を抑制する防食剤やキレート剤、その他の機能を有する防腐剤、防黴剤、表面改質剤等の他の成分をさらに含有してもよい。 [Other ingredients]
The polishing composition of the present embodiment suppresses corrosion of the polishing object, an oxidizing agent that oxidizes the surface of the polishing object, a water-soluble polymer that acts on the surface of the polishing object or the surface of the abrasive grain, if necessary. It may further contain other components such as anticorrosives and chelating agents, antiseptics having other functions, antifungal agents, surface modifiers and the like.
　研磨用組成物は、研磨速度のさらなる向上のために化合物Ｂをさらに含有してもよい。化合物Ｂは無機酸の金属塩、化合物Ａ以外の有機酸の金属塩、無機酸のアンモニウム塩又は化合物Ａ以外の有機酸のアンモニウム塩からなる群から選ばれる少なくとも一種の化合物である。無機酸は、硝酸、硫酸及び塩酸のいずれであってもよく、有機酸は、シュウ酸、乳酸、酢酸、ギ酸、クエン酸、酒石酸、リンゴ酸、グルコン酸、グリコール酸及びマロン酸のいずれであってもよい。金属塩は、アルミニウム塩、ニッケル塩、リチウム塩、マグネシウム塩、ナトリウム塩及びカリウム塩のいずれであってもよい。
　研磨用組成物に含まれる化合物Ｂは、研磨対象物を化学的に研磨する能力に優れている点で、硝酸、硫酸、塩酸又は乳酸のアルミニウム塩であることが好ましく、より好ましくは硝酸アルミニウムである。 The polishing composition may further contain Compound B for further improvement of the polishing rate. Compound B is at least one compound selected from the group consisting of metal salts of inorganic acids, metal salts of organic acids other than Compound A, ammonium salts of inorganic acids, or ammonium salts of organic acids other than Compound A. The inorganic acid may be any of nitric acid, sulfuric acid and hydrochloric acid, and the organic acid is any of oxalic acid, lactic acid, acetic acid, formic acid, citric acid, tartaric acid, malic acid, gluconic acid, glycolic acid and malonic acid. May be. The metal salt may be any of aluminum salt, nickel salt, lithium salt, magnesium salt, sodium salt and potassium salt.
The compound B contained in the polishing composition is preferably nitric acid, sulfuric acid, hydrochloric acid, or an aluminum salt of lactic acid, more preferably aluminum nitrate, because it has an excellent ability to chemically polish an object to be polished. is there.
　研磨用組成物中の化合物Ｂの含有量が砥粒１００質量部に対して１質量部よりも少ない場合、さらに言えば３質量部よりも少ない場合、もっと言えば５質量部よりも少ない場合には、合成樹脂製の研磨対象物、特にＣＲ３９及びＰＣの研磨速度が向上しにくい傾向がある。従って、より高い研磨速度を得るためには、研磨用組成物中の化合物Ｂの含有量は１質量部以上であることが好ましく、より好ましくは３質量部以上、最も好ましくは５質量部以上である。一方、研磨用組成物中の化合物Ｂの含有量が２０質量部よりも多い場合、さらに言えば１５質量部よりも多い場合には、研磨用組成物のｐＨが低くなるために研磨機が腐食されやすくなる傾向がある。従って、研磨機の腐食を防ぐという観点からすると、研磨用組成物中の含有量は２０質量部以下であることが好ましく、より好ましくは１５質量部以下である。 When the content of the compound B in the polishing composition is less than 1 part by mass with respect to 100 parts by mass of the abrasive, more specifically less than 3 parts by mass, and more specifically less than 5 parts by mass. Is difficult to improve the polishing rate of the synthetic resin polishing object, particularly CR39 and PC. Therefore, in order to obtain a higher polishing rate, the content of Compound B in the polishing composition is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and most preferably 5 parts by mass or more. is there. On the other hand, when the content of the compound B in the polishing composition is more than 20 parts by mass, more specifically, when it is more than 15 parts by mass, the polishing machine is corroded because the pH of the polishing composition is lowered. There is a tendency to be easy to be. Therefore, from the viewpoint of preventing corrosion of the polishing machine, the content in the polishing composition is preferably 20 parts by mass or less, more preferably 15 parts by mass or less.
　砥粒がアルミナである場合は、研磨用組成物にアルミナゾルを添加することが好ましい。アルミナ粒子の凝集を抑制して再分散性を高める傾向があるという観点から、凝集抑制剤としてのアルミナゾルをさらに含有するのが好ましい。アルミナゾルは、例えば、研磨用組成物中でコロイド状に分散する特性を有し、アルミナの凝集を抑制して再分散性を発揮し、凝集した固い沈殿（ハードケーキング）の発生や、凝固したアルミナによって被研磨面にスクラッチが発生するのを抑制する傾向がある。本実施形態のアルミナゾルは、例えば、水和アルミナまたは水酸化アルミニウムを酸性水溶液中にコロイド状に分散させたものである。水和アルミナとしては、例えば、ベーマイト、擬ベーマイト、ダイアスポア、ジブサイト、バイヤライト等が挙げられる。研磨用組成物に含有されるアルミナゾルとしては、特にベーマイト又は擬ベーマイトを酸性水溶液中に分散させて得られたものが好ましい。 When the abrasive grains are alumina, it is preferable to add alumina sol to the polishing composition. From the viewpoint of suppressing the aggregation of alumina particles and improving the redispersibility, it is preferable to further contain an alumina sol as an aggregation inhibitor. Alumina sol, for example, has a property of being dispersed in a colloidal manner in a polishing composition, and exhibits redispersibility by suppressing agglomeration of alumina, generation of agglomerated hard precipitate (hard caking), and solidified alumina. This tends to suppress the generation of scratches on the surface to be polished. The alumina sol of this embodiment is, for example, a hydrated alumina or aluminum hydroxide dispersed in a colloidal form in an acidic aqueous solution. Examples of the hydrated alumina include boehmite, pseudoboehmite, diaspore, dibsite, bayerite and the like. The alumina sol contained in the polishing composition is particularly preferably obtained by dispersing boehmite or pseudoboehmite in an acidic aqueous solution.
　水溶性高分子の例としては、ポリアクリル酸などのポリカルボン酸、ポリホスホン酸、ポリスチレンスルホン酸などのポリスルホン酸、キタンサンガム、アルギン酸ナトリウムなどの多糖類、ヒドロキシエチルセルロース、カルボキシメチルセルロースなどのセルロース誘導体、ポリエチレングリコール、ポリビニルアルコール、ポリビニルピロリドン、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンアルキルフェニルエーテル、ソルビタンモノオレエート、単一種または複数種のオキシアルキレン単位を有するオキシアルキレン系重合体等が挙げられる。また、上記の化合物の塩も水溶性高分子として好適に用いることができる。 Examples of water-soluble polymers include polycarboxylic acids such as polyacrylic acid, polysulfonic acids such as polyphosphonic acid and polystyrene sulfonic acid, polysaccharides such as chitansan gum and sodium alginate, cellulose derivatives such as hydroxyethyl cellulose and carboxymethyl cellulose, polyethylene glycol , Polyvinyl alcohol, polyvinyl pyrrolidone, polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, sorbitan monooleate, oxyalkylene polymers having a single kind or plural kinds of oxyalkylene units. Moreover, the salt of said compound can also be used suitably as a water-soluble polymer.
　防食剤の例としては、アミン類、ピリジン類、テトラフェニルホスホニウム塩、ベンゾトリアゾール類、トリアゾール類、テトラゾール類、安息香酸等が挙げられる。キレート剤の例としては、グルコン酸等のカルボン酸系キレート剤、エチレンジアミン、ジエチレントリアミン、トリメチルテトラアミンなどのアミン系キレート剤、エチレンジアミン四酢酸、ニトリロ三酢酸、ヒドロキシエチルエチレンジアミン三酢酸、トリエチレンテトラミン六酢酸、ジエチレントリアミン五酢酸などのポリアミノポリカルボン系キレート剤、２－アミノエチルホスホン酸、１－ヒドロキシエチリデン－１，１－ジホスホン酸、アミノトリ（メチレンホスホン酸）、エチレンジアミンテトラキス（メチレンホスホン酸）、ジエチレントリアミンペンタ（メチレンホスホン酸）、エタン－１，１－ジホスホン酸、エタン－１，１，２－トリホスホン酸、メタンヒドロキシホスホン酸、１－ホスホノブタン－２，３，４－トリカルボン酸などの有機ホスホン酸系キレート剤、フェノール誘導体、１，３－ジケトン等が挙げられる。 Examples of the anticorrosive include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid and the like. Examples of chelating agents include carboxylic acid chelating agents such as gluconic acid, amine chelating agents such as ethylenediamine, diethylenetriamine, and trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetraminehexaacetic acid. , Polyaminopolycarboxylic chelating agents such as diethylenetriaminepentaacetic acid, 2-aminoethylphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, aminotri (methylenephosphonic acid), ethylenediaminetetrakis (methylenephosphonic acid), diethylenetriaminepenta ( Methylenephosphonic acid), ethane-1,1-diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphosphonic acid, 1-phosphonobutane-2,3,4-to Organic phosphonic acid chelating agents such as carboxylic acid, phenol derivatives, 1,3-diketones and the like.
　防腐剤の例としては、次亜塩素酸ナトリウム等が挙げられる。防黴剤の例としてはオキサゾリジン－２，５－ジオンなどのオキサゾリン等が挙げられる。
　また、表面改質剤の例としては、酸基を有する共重合物のアルキロールアンモニウム塩等が挙げられる。 Examples of preservatives include sodium hypochlorite and the like. Examples of antifungal agents include oxazolines such as oxazolidine-2,5-dione.
Examples of the surface modifier include alkylol ammonium salt of a copolymer having an acid group.
（研磨用組成物の製造方法）
　本実施形態の研磨用組成物の製造方法は、特に制限されず、例えば、水に界面活性剤である化合物Ａ、つまりＲ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される化合物を溶解させて攪拌混合する。その後、砥粒、及び必要に応じて他の成分を攪拌混合することによって、本実施形態の研磨用組成物を得ることができる。 (Method for producing polishing composition)
The method for producing the polishing composition of the present embodiment is not particularly limited, and for example, compound A which is a surfactant in water, that is, R—O — ((CH 2 ) m —O) n ZO 3 − M + The compound represented by is dissolved and mixed with stirring. Then, the polishing composition of this embodiment can be obtained by stirring and mixing the abrasive grains and other components as necessary.
　各成分を混合する際の温度は特に制限されないが、１０℃以上４０℃以下が好ましく、加熱することで、水と界面活性剤とを攪拌混合し転相乳化してもよい。また、混合時間も特に制限されない。 The temperature at the time of mixing each component is not particularly limited, but is preferably 10 ° C. or higher and 40 ° C. or lower. By heating, water and a surfactant may be stirred and mixed to perform phase inversion emulsification. Further, the mixing time is not particularly limited.
（研磨方法）
　ジエチレングリコールビスアリルカーボネート樹脂（ＣＲ３９）７０ｍｍ直径のレンズ試料、又はポリカーボネート樹脂（ＰＣ）７０ｍｍ直径のレンズ試料を、下記研磨条件で本実施形態の研磨用組成物を用いて研磨する。
・研磨機：コバーン５０５型非球面レンズ研磨機
・研磨パッド：プラスチックレンズ用植毛布
・研磨圧力：２４０ｇ／ｃｍ２
・研磨時間：５分
・研磨温度：１３±１℃
・スラリー供給量：２リットル／分で循環 (Polishing method)
A lens sample of 70 mm diameter of diethylene glycol bisallyl carbonate resin (CR39) or a lens sample of 70 mm diameter of polycarbonate resin (PC) is polished using the polishing composition of the present embodiment under the following polishing conditions.
Polishing machine: Coburn 505 aspherical lens polishing machine Polishing pad: Plastic lens blanket Polishing pressure: 240 g / cm 2
Polishing time: 5 minutes Polishing temperature: 13 ± 1 ° C
・ Slurry supply rate: Circulation at 2 liters / minute
（基板の製造方法）
　ジエチレングリコールビスアリルカーボネート樹脂（ＣＲ３９）７０ｍｍ直径の試料、又はポリカーボネート樹脂（ＰＣ）７０ｍｍ直径の試料を、上記研磨条件で本実施形態の研磨用組成物を用いて研磨して基板を製造する。 (Substrate manufacturing method)
A 70 mm diameter sample of diethylene glycol bisallyl carbonate resin (CR39) or a 70 mm diameter sample of polycarbonate resin (PC) is polished using the polishing composition of this embodiment under the above polishing conditions to produce a substrate.
　本実施形態によれば以下の利点が得られる。
　化合物Ａは、研磨屑やパッド屑が砥粒や研磨対象物に付着するのを抑制する作用を有していると考えられる。そのため、化合物Ａを含有している本実施形態の研磨用組成物によれば、砥粒や研磨対象物への研磨屑やパッド屑の付着により妨げられることなく、合成樹脂製の研磨対象物、特にＣＲ３９及びＰＣの研磨を高い研磨速度でそれぞれ行なうことができると考えられる。化合物Ａが砥粒や研磨対象物への研磨屑やパッド屑の付着を抑制することができるのは、化合物Ａが研磨屑やパッド屑の表面に作用することにより、研磨屑やパッド屑の分散性が向上するためと考えられる。 According to the present embodiment, the following advantages can be obtained.
Compound A is considered to have an action of suppressing polishing dust and pad scraps from adhering to abrasive grains and objects to be polished. Therefore, according to the polishing composition of the present embodiment containing compound A, without being hindered by the adhesion of polishing scraps and pad scraps to abrasive grains and polishing objects, polishing objects made of synthetic resin, In particular, it is considered that CR39 and PC can be polished at a high polishing rate. Compound A can suppress the adhesion of polishing scraps and pad scraps to abrasive grains and objects to be polished because compound A acts on the surface of polishing scraps and pad scraps to disperse polishing scraps and pad scraps. This is considered to improve the performance.
　なお、本実施形態は次のように変更されてもよい。
　例えば、本実施形態の研磨用組成物には二種類以上の化合物Ａが含有されていてもよい。この場合、異なる種類の化合物Ａの働きによりさらに高い研磨速度が得られる傾向がある。
　また、本実施形態の研磨用組成物には二種類以上の化合物Ｂが含有されていてもよい。この場合、異なる種類の化合物Ｂの働きによりさらに高い研磨速度が得られる傾向がある。 In addition, this embodiment may be changed as follows.
For example, two or more kinds of compounds A may be contained in the polishing composition of the present embodiment. In this case, a higher polishing rate tends to be obtained by the action of different types of compound A.
Moreover, the polishing composition of this embodiment may contain two or more kinds of compounds B. In this case, a higher polishing rate tends to be obtained by the action of different types of compound B.
　また、本実施形態の研磨用組成物には二種類以上の砥粒が含有されていてもよい。この場合、異なる種類の砥粒の働きによりさらに高い研磨速度が得られる傾向がある。 Further, the polishing composition of the present embodiment may contain two or more kinds of abrasive grains. In this case, a higher polishing rate tends to be obtained by the action of different types of abrasive grains.
　また、本実施形態の研磨用組成物には必要に応じてシリコーン系消泡剤やエーテル系消泡剤、アルコール系消泡剤などの消泡剤を添加してもよい。研磨用組成物に添加される消泡剤は、研磨用組成物の泡立ちを抑えるためには抑泡作用が強いことが好ましく、生成した泡を破壊するためには破泡作用が強いことが好ましい。研磨用組成物中の消泡剤の含有量は、１質量％以下であることが好ましく、より好ましくは０．１質量％以下である。 Moreover, you may add antifoamers, such as a silicone type antifoamer, an ether type antifoamer, and an alcohol type antifoamer, to the polishing composition of this embodiment as needed. The antifoaming agent added to the polishing composition preferably has a strong foam suppressing action in order to suppress foaming of the polishing composition, and preferably has a strong foam breaking action in order to destroy the generated foam. . The content of the antifoaming agent in the polishing composition is preferably 1% by mass or less, more preferably 0.1% by mass or less.
　また、本実施形態の研磨用組成物には必要に応じてコロイダルシリカなどのコロイド粒子、ヒドロキシエチルセルロースなどのセルロース類を添加してもよい。
　また、本実施形態の研磨用組成物は、使用時に研磨用組成物の原液を希釈することによって調製されてもよい。この場合、保管、輸送の点で有利である。なお、本実施形態の説明における研磨用組成物中の化合物Ａ、化合物Ｂ及び砥粒の含有量の好ましい範囲は、使用時の研磨用組成物での含有量についてのものである。 Moreover, you may add celluloses, such as colloidal particles, such as colloidal silica, and a hydroxyethyl cellulose, to the polishing composition of this embodiment as needed.
Moreover, the polishing composition of this embodiment may be prepared by diluting the undiluted | stock solution of polishing composition at the time of use. In this case, it is advantageous in terms of storage and transportation. In addition, the preferable range of content of Compound A, Compound B, and abrasive grains in the polishing composition in the description of the present embodiment is about the content in the polishing composition at the time of use.
［実施例］
　次に、本発明の実施例及び比較例を説明する。
　化合物Ａ、化合物Ｂ、α－アルミナ及びアルミナゾルを適宜に水と混合し、さらにエマルジョン型シリコーン系消泡剤及び防腐防カビ剤を添加することにより実施例１～６及び比較例１の研磨用組成物を調製した。各研磨用組成物中の化合物Ａ及び化合物Ｂの詳細はそれぞれ表１に示すとおりである。なお、化合物Ａにはポリオキシエチレンアルキルエーテル硫酸エステルナトリウム、即ちＲ－Ｏ－（Ｃ２Ｈ４Ｏ）ｎＳＯ３ －Ｎａ＋を用いた。化合物Ａの含有量は、実施例１では０．６質量部とし、実施例２では６質量部とし、実施例３では１０質量部とした。また、化合物Ａの含有量は、実施例４では１質量部とし、実施例５では６質量部とし、実施例６では１０質量部とした。なお、実施例１～３では、ポリオキシエチレンアルキルエーテル硫酸エステルナトリウム（Ｒ＝炭素数８の直鎖状アルキル基、エチレンオキシドの平均付加モル数４）を４０質量％、水を５８質量％、メタノールを２質量％含んだ界面活性剤組成物、即ち界面活性剤の希釈液を、実施例１では１．５質量部、実施例２では１５質量部、実施例３では２５質量部それぞれ添加することで、上記化合物Ａの含有量とした。また、実施例４～６では、ポリオキシエチレンアルキルエーテル硫酸エステルナトリウム（Ｒ＝炭素数１２の直鎖状アルキル基及び炭素数１３の直鎖状アルキル基、エチレンオキシドの平均付加モル数６０）を２５質量％、水を７４．５質量％、メタノールを０．５質量％含んだ界面活性剤の希釈液を、実施例４では４質量部、実施例５では２４質量部、実施例６では４０質量部それぞれ添加することで、上記化合物Ａの含有量とした。 [Example]
Next, examples and comparative examples of the present invention will be described.
The polishing compositions of Examples 1 to 6 and Comparative Example 1 were prepared by appropriately mixing Compound A, Compound B, α-alumina and alumina sol with water, and further adding an emulsion type silicone antifoaming agent and antiseptic and antifungal agent. A product was prepared. Details of Compound A and Compound B in each polishing composition are as shown in Table 1, respectively. Incidentally, polyoxyethylene alkyl ether sulfate ester Compound A, i.e. R-O- (C 2 H 4 O) n SO 3 - was used Na +. The content of Compound A was 0.6 parts by mass in Example 1, 6 parts by mass in Example 2, and 10 parts by mass in Example 3. The content of Compound A was 1 part by mass in Example 4, 6 parts by mass in Example 5, and 10 parts by mass in Example 6. In Examples 1 to 3, sodium polyoxyethylene alkyl ether sulfate ester (R = linear alkyl group having 8 carbon atoms, average added mole number of ethylene oxide 4) is 40% by mass, water is 58% by mass, methanol. Of a surfactant composition containing 2% by mass, that is, a surfactant dilution, is 1.5 parts by mass in Example 1, 15 parts by mass in Example 2, and 25 parts by mass in Example 3. Therefore, the content of the compound A was determined. In Examples 4 to 6, sodium polyoxyethylene alkyl ether sulfate ester (R = linear alkyl group having 12 carbon atoms and linear alkyl group having 13 carbon atoms, average added mole number of ethylene oxide 60) was 25. 4% by mass in Example 4, 24 parts by mass in Example 5, and 40% in Example 6 by weight of a surfactant containing 7% by mass, 74.5% by mass of water, and 0.5% by mass of methanol By adding each part, the content of the compound A was obtained.
　化合物Ｂには硝酸アルミニウムを用いた。化合物Ｂの含有量は２０質量部とした。また、砥粒であるα－アルミナの含有量は、２００質量部とした。また、α－アルミナの平均粒子径は、０．８μｍとした。α－アルミナの平均粒子径は、電気抵抗法（Ｃｏｕｌｔｅｒ　Ｃｏｕｎｔｅｒ法）により測定した。また、固形分を１０質量％とするアルミナゾルの含有量は、２００質量部とした。また、水の含有量は７２０質量部とした。また、エマルジョン型シリコーン系消泡剤の含有量は、１５質量部とした。また、防腐防カビ剤の含有量は、０．５質量部とした。
　なお、表１の比較例１に記載した「－」は、化合物Ａを含有していないため、規定することができないことを意味している。 For compound B, aluminum nitrate was used. The content of Compound B was 20 parts by mass. The content of α-alumina as abrasive grains was 200 parts by mass. The average particle diameter of α-alumina was 0.8 μm. The average particle diameter of α-alumina was measured by an electric resistance method (Coulter Counter method). The content of the alumina sol having a solid content of 10% by mass was 200 parts by mass. The water content was 720 parts by mass. The content of the emulsion type silicone antifoaming agent was 15 parts by mass. Further, the content of the antiseptic and fungicide was 0.5 parts by mass.
In addition, “−” described in Comparative Example 1 in Table 1 means that the compound A is not contained and thus cannot be defined.
　実施例１～６及び比較例１の各研磨用組成物を用いて下記の研磨条件でプラスチックレンズを研磨した。
・研磨対象物：ジエチレングリコールビスアリルカーボネート（ＣＲ３９）からなる直径７０ｍｍのプラスチックレンズ、又はポリカーボネート（ＰＣ）からなる直径７０ｍｍのプラスチックレンズ
・研磨機：ＬＯＨ社製のレンズ研磨機“ＴＯＲＯ－Ｘ－２０００”
・研磨パッド：ＤＡＣ　ｖｉｓｉｏｎ社製の“ＣＰＲ０４００Ｍ”
・凸面研磨皿：５．００－６．００　ｄｉｏｐｔｅｒ
・研磨荷重：４０　ｋＰａ（＝０．４　ｂａｒ）
・研磨時間：３分
・研磨用組成物の使用量：１．０リットル（循環使用）
・研磨用組成物の供給速度：１．２リットル毎分
・研磨用組成物の温度：１０℃ Plastic lenses were polished using the polishing compositions of Examples 1 to 6 and Comparative Example 1 under the following polishing conditions.
Polishing object: 70 mm diameter plastic lens made of diethylene glycol bisallyl carbonate (CR39), or 70 mm diameter plastic lens made of polycarbonate (PC) Polishing machine: LOH lens polishing machine “TORO-X-2000”
Polishing pad: “CPR0400M” manufactured by DAC vision
-Convex polishing dish: 5.00-6.00 diopter
Polishing load: 40 kPa (= 0.4 bar)
・ Polishing time: 3 minutes ・ Amount of polishing composition used: 1.0 liter (circulation use)
-Supply rate of polishing composition: 1.2 liters per minute-Temperature of polishing composition: 10 ° C
　研磨前後のプラスチックレンズの質量の差を測定して研磨速度（ｇ／３ｍｉｎ．）を算出し、算出した研磨速度を下記の基準で評価した結果を表１の“研磨速度”欄に示す。ＣＲ３９の欄中、「◎」は研磨速度が０．１５０以上であることを示し、「○」は研磨速度が０．１２５以上０．１５０未満であることを示し、「△」は研磨速度が０．１２５未満であることを示す。また、ポリカーボネートの欄中、「◎」は研磨速度が０．０７０以上であることを示し、「○」は研磨速度が０．０６０以上０．０７０未満であることを示し、「×」は研磨速度が０．０５０未満であることを示す。 The difference in the mass of the plastic lens before and after polishing was measured to calculate the polishing rate (g / 3 min.), And the calculated polishing rate was evaluated according to the following criteria. In the column of CR39, “◎” indicates that the polishing rate is 0.150 or more, “◯” indicates that the polishing rate is 0.125 or more and less than 0.150, and “Δ” indicates that the polishing rate is Indicates less than 0.125. In the column of polycarbonate, “◎” indicates that the polishing rate is 0.070 or more, “◯” indicates that the polishing rate is 0.060 or more and less than 0.070, and “×” indicates polishing. Indicates that the speed is less than 0.050.
　実施例１～６及び比較例１の各研磨用組成物を用いて上記研磨条件で研磨した後のプラスチックレンズの表面粗さＲａを５０倍の倍率の対物レンズが取り付けられたＰｈａｓｅ　Ｓｈｉｆｔ社の非接触式表面粗さ測定器“ＭｉｃｒｏＸＡＭ”を用いて測定した。その測定結果に基づいて、各研磨用組成物を用いて研磨した後のプラスチックレンズの表面粗さＲａについて評価した結果を表１の“表面粗さ”欄に示す。同欄中、「○」は表面粗さＲａが０．０２μｍ以下であることを示し、「△」は表面粗さＲａが０．０２μｍ超であることを示す。なお、「△」以上の評価であれば、製品を使用する上で何ら支障はない。 The surface roughness Ra of the plastic lens after polishing using the polishing compositions of Examples 1 to 6 and Comparative Example 1 under the above polishing conditions was fixed by Phase Shift, Inc. to which an objective lens having a magnification of 50 times was attached. It measured using the contact-type surface roughness measuring instrument “MicroXAM”. The results of evaluating the surface roughness Ra of the plastic lens after polishing using each polishing composition based on the measurement results are shown in the “Surface roughness” column of Table 1. In the column, “◯” indicates that the surface roughness Ra is 0.02 μm or less, and “Δ” indicates that the surface roughness Ra is more than 0.02 μm. If the evaluation is “Δ” or higher, there is no problem in using the product.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示すように、実施例１～６の研磨用組成物ではいずれもＣＲ３９及びＰＣに対する各研磨速度が、比較例１の研磨用組成物のＣＲ３９及びＰＣに対する各研磨速度と比較して向上した。また、実施例１～６の研磨用組成物ではいずれもＣＲ３９及びＰＣを研磨した際の各表面粗さが、比較例１の研磨用組成物でＣＲ３９及びＰＣを研磨した際の各表面粗さとほぼ同じであった。つまり、実施例１～６の研磨用組成物は、比較例１の研磨用組成物、即ち従来技術に係る研磨用組成物と同程度の表面粗さでＣＲ３９及びＰＣを研磨することができる。 As shown in Table 1, in each of the polishing compositions of Examples 1 to 6, each polishing rate for CR39 and PC was improved as compared with each polishing rate for CR39 and PC of the polishing composition of Comparative Example 1. did. In each of the polishing compositions of Examples 1 to 6, the surface roughness when CR39 and PC were polished was the same as the surface roughness when CR39 and PC were polished with the polishing composition of Comparative Example 1. It was almost the same. That is, the polishing compositions of Examples 1 to 6 can polish CR39 and PC with the same surface roughness as the polishing composition of Comparative Example 1, that is, the polishing composition according to the prior art.

Claims (10)

  1. 　合成樹脂製の研磨対象物を研磨するために使用される研磨用組成物であって、
    　化学式Ｒ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される化合物と、砥粒と、を含有し、前記化学式において、Ｒは直鎖状又は分岐鎖状のアルキル基を表し、Ｚは硫黄原子又はリン原子を表し、Ｍ＋は対カチオンを表し、ｍは１以上４以下の整数を表し、ｎは４以上１００以下の整数を表す研磨用組成物。     A polishing composition used for polishing a polishing object made of synthetic resin,
    Formula R-O - ((CH 2 ) m -O) n ZO 3 - containing and represented by M + compound, abrasive grains, a, in Formula, R represents a linear or branched alkyl A polishing composition in which Z represents a sulfur atom or a phosphorus atom, M + represents a counter cation, m represents an integer of 1 or more and 4 or less, and n represents an integer of 4 or more and 100 or less.
  2. 　前記アルキル基の炭素数は、８以上１６以下の範囲内であり、
    　ｎは、４以上６０以下の範囲内である請求項１に記載の研磨用組成物。     The number of carbon atoms of the alkyl group is in the range of 8 to 16,
    The polishing composition according to claim 1, wherein n is in the range of 4 or more and 60 or less.
  3. 　ｍは、２であり、
    　Ｚは、硫黄原子である請求項１又は２に記載の研磨用組成物。     m is 2,
    The polishing composition according to claim 1 or 2, wherein Z is a sulfur atom.
  4. 　前記Ｒ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される化合物の含有量は、前記砥粒１００質量部に対して０．１質量部以上１０質量部以下の範囲内である請求項１～３のいずれか１項に記載の研磨用組成物。 Wherein R-O - ((CH 2 ) m -O) n ZO 3 - content of M + in the compound represented by, the abrasive grains 10 parts by weight or less than 0.1 parts by weight per 100 parts by weight The polishing composition according to any one of claims 1 to 3, which is within the range.
  5. 　無機酸又は有機酸の金属塩と、無機酸又は有機酸のアンモニウム塩と、からなる群から選ばれる少なくとも一種の化合物をさらに含有する請求項１～４のいずれか１項に記載の研磨用組成物。 The polishing composition according to any one of claims 1 to 4, further comprising at least one compound selected from the group consisting of a metal salt of an inorganic acid or an organic acid and an ammonium salt of an inorganic acid or an organic acid. object.
  6. 　前記無機酸又は有機酸の金属塩と、前記無機酸又は有機酸のアンモニウム塩と、からなる群から選ばれる少なくとも一種の化合物の含有量は、前記砥粒１００質量部に対して１質量部以上２０質量部以下の範囲内である請求項５に記載の研磨用組成物。 The content of at least one compound selected from the group consisting of the inorganic acid or organic acid metal salt and the inorganic acid or organic acid ammonium salt is 1 part by mass or more based on 100 parts by mass of the abrasive grains. The polishing composition according to claim 5, which is within a range of 20 parts by mass or less.
  7. 　前記砥粒は、酸化アルミニウム、炭化ケイ素、及び二酸化ケイ素の少なくとも一種を含有する請求項１～６のいずれか１項に記載の研磨用組成物。 The polishing composition according to any one of claims 1 to 6, wherein the abrasive grains contain at least one of aluminum oxide, silicon carbide, and silicon dioxide.
  8. 　請求項１～７のいずれか１項に記載の研磨用組成物を製造する方法であって、
    　前記Ｒ－Ｏ－（（ＣＨ２）ｍ－Ｏ）ｎＺＯ３ －Ｍ＋で表される化合物と、前記砥粒と、を混合する研磨用組成物の製造方法。     A method for producing the polishing composition according to any one of claims 1 to 7,
    Wherein R-O - ((CH 2 ) m -O) n ZO 3 - M and the compound represented by +, the production method of the polishing composition for mixing, and the abrasive grains.
  9. 　請求項１～７のいずれか１項に記載の研磨用組成物を用いて合成樹脂製の研磨対象物を研磨する方法。 A method for polishing a polishing object made of synthetic resin using the polishing composition according to any one of claims 1 to 7.
  10. 　請求項１～７のいずれか１項に記載の研磨用組成物を用いて合成樹脂製の基板の表面を研磨する方法。 A method of polishing a surface of a synthetic resin substrate using the polishing composition according to any one of claims 1 to 7.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209229A1 (en) * 2021-03-30 2022-10-06 株式会社フジミインコーポレーテッド Polishing composition and polishing method
JP7457586B2 (en) 2020-06-18 2024-03-28 株式会社フジミインコーポレーテッド Concentrated solution of polishing composition and polishing method using the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101590A (en) * 1978-01-05 1979-08-10 Eshirooru Intern Co Gen Topute Polishing material* particularly eye lens polishing organic polishing material
JP2007063440A (en) * 2005-08-31 2007-03-15 Fujimi Inc Polishing composition and polishing method
JP2013080751A (en) * 2011-09-30 2013-05-02 Fujimi Inc Polishing composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101590A (en) * 1978-01-05 1979-08-10 Eshirooru Intern Co Gen Topute Polishing material* particularly eye lens polishing organic polishing material
JP2007063440A (en) * 2005-08-31 2007-03-15 Fujimi Inc Polishing composition and polishing method
JP2013080751A (en) * 2011-09-30 2013-05-02 Fujimi Inc Polishing composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7457586B2 (en) 2020-06-18 2024-03-28 株式会社フジミインコーポレーテッド Concentrated solution of polishing composition and polishing method using the same
WO2022209229A1 (en) * 2021-03-30 2022-10-06 株式会社フジミインコーポレーテッド Polishing composition and polishing method

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