WO2019142545A1 - パワー半導体装置 - Google Patents

パワー半導体装置 Download PDF

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Publication number
WO2019142545A1
WO2019142545A1 PCT/JP2018/045407 JP2018045407W WO2019142545A1 WO 2019142545 A1 WO2019142545 A1 WO 2019142545A1 JP 2018045407 W JP2018045407 W JP 2018045407W WO 2019142545 A1 WO2019142545 A1 WO 2019142545A1
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Prior art keywords
base
terminal
power semiconductor
semiconductor device
semiconductor element
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PCT/JP2018/045407
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English (en)
French (fr)
Inventor
円丈 露野
裕之 宝藏寺
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日立オートモティブシステムズ株式会社
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Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to CN201880086160.9A priority Critical patent/CN111587528B/zh
Priority to DE112018006878.1T priority patent/DE112018006878T5/de
Priority to US16/768,215 priority patent/US11367671B2/en
Publication of WO2019142545A1 publication Critical patent/WO2019142545A1/ja

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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
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Definitions

  • the present invention relates to a power semiconductor device, and more particularly to a power semiconductor device having a power semiconductor element compatible with high output.
  • a power conversion device based on switching of power semiconductor elements has a high conversion efficiency, and thus is widely used for consumer products, vehicles, railways, transformation facilities, and the like.
  • Patent document 1 is disclosed regarding the power semiconductor device which cools both surfaces of a power semiconductor element.
  • a semiconductor device resin-molded with a thermosetting resin is molded with a thermoplastic resin to form a water channel.
  • the resin absorbs moisture to a saturated state, and there is a possibility that the water diffused to the minute peeling portion at the interface between the semiconductor element and the resin may precipitate.
  • An object of the present invention is to improve the reliability of a power semiconductor device.
  • a power semiconductor device includes a semiconductor element, first and second terminals for transmitting current to the semiconductor element, a part of the first terminal, a part of the second terminal, and the semiconductor element
  • the semiconductor device further includes: a first base and a second base disposed to be opposed to each other, and a sealing material provided in a space between the first base and the second base, wherein the second terminal is the semiconductor And an intermediate portion formed to increase a distance from the first terminal along a direction away from the element, the intermediate portion being between the first base and the second base and in the sealing It is provided in the material.
  • the reliability of the power semiconductor device can be improved.
  • FIG. 18 is an overall perspective view of the front side of the power semiconductor device 140 from which the flow path cover 1003 has been removed.
  • FIG. 16 is a transparent front view of the power semiconductor device 140.
  • FIG. 5 is a cross-sectional view of power semiconductor unit 300 with respect to a cross section passing through line segment AA of FIG. 4.
  • FIG. 5 is a cross-sectional view of power semiconductor unit 300 with respect to a cross section passing through line segment BB in FIG. 4.
  • FIG. 19 is a cross-sectional view of the manufacturing process of power semiconductor device 140.
  • FIG. It is a top view of the power semiconductor unit 300 in the step of process (c) of FIG. It is a perspective view of the manufacturing process centering on the 2nd base 804 of power semiconductor device 140 concerning this embodiment. It is a perspective view of the manufacturing process centering on the 1st base 803 of power semiconductor device 140 concerning this embodiment. It is a perspective view of the manufacturing process centering on the sealing material 603 of the power semiconductor device 140 which concerns on this embodiment. It is a perspective view which shows the external appearance of the power converter device 200 which concerns on this embodiment which mounts the power semiconductor device 140. FIG. It is the schematic which shows the cross-section of the power converter device 200 which concerns on this embodiment.
  • a first terminal and a second terminal for transmitting a current to a semiconductor element, a part of the first terminal, a part of the second terminal, and the semiconductor element are opposed to each other.
  • a sealing material provided in a space between the first base and the second base, and the second terminal is disposed in a direction away from the semiconductor element.
  • the cooling water does not come in contact with the sealing material while cooling the both sides of the semiconductor element. For this reason, there is no moisture absorption of the sealing material by a cooling water, and there is an effect which is excellent in insulation.
  • the second terminals are formed such that the distance between the terminals is increased along the direction away from the semiconductor element, there is an effect that it is easy to secure the creepage distance and the spatial distance to be satisfied by the high voltage device.
  • the distance between the terminals is expanded without expanding the expensive insulating substrate on which the semiconductor element is mounted for cost reduction, the distance between the terminals located outside the power semiconductor device is extended. As the distance between the second terminals increases, the electrical resistance increases and the amount of heat generation increases.
  • the second base is formed by sandwiching the intermediate portion formed so as to increase the distance from the first terminal along the direction away from the semiconductor element. This has the effect of improving the cooling performance of the terminal and allowing a large current to flow.
  • the first base and the second base are collectively sealed with the sealing material, which has an effect of high productivity.
  • a power semiconductor device used for a vehicle-mounted power converter will be described as an embodiment of a structure according to the present invention.
  • a power semiconductor element as a heat generating body
  • a power semiconductor unit mounted with the power semiconductor element a base having a fin portion as a heat sink mounting the power semiconductor unit
  • a power semiconductor unit The respective components such as the input / output terminal, the sealing member for collectively sealing the power semiconductor unit and the base, the waterway cover for forming the waterway, and the flow path forming portion for connecting the upper and lower waterways will be described with reference to the drawings.
  • the same elements will be denoted by the same reference symbols and redundant description will be omitted.
  • FIG. 1 is an overall perspective view of the front side of a power semiconductor device 140 according to the present embodiment.
  • FIG. 2 is an overall perspective view of the back side of the power semiconductor device 140 according to the present embodiment.
  • FIG. 3 is an overall perspective view of the front side of the power semiconductor device 140 with the flow path cover 1003 removed.
  • FIG. 4 is a transparent front view of the power semiconductor device 140.
  • FIG. 5 is a cross-sectional view of power semiconductor unit 300 with respect to the cross section passing through line segment AA of FIG. 4.
  • 6 is a cross-sectional view of power semiconductor unit 300 with respect to the cross section passing through line segment BB of FIG.
  • the power semiconductor unit 300 is a circuit body incorporating a semiconductor element 860 described later. As shown in FIGS. 1 and 6, etc., three power semiconductor units 300 are arranged in a line.
  • the power semiconductor unit 300 has a 2-in-1 structure in which two arm circuits of an upper arm circuit and a lower arm circuit are integrated into one module. In addition to the 2 in 1 structure, when the 3 in 1 structure, the 4 in 1 structure, the 6 in 1 structure, etc. are used, the number of output terminals from the power semiconductor device can be reduced and the size can be reduced.
  • the collector sense signal terminal 325C, the lower arm gate signal terminal 325L, and the temperature sense signal terminal 325S transmit an electrical signal between the power semiconductor unit 300 and the control board or driver board. These signal terminals protrude from the two surfaces of the power semiconductor device 140 and are then bent in the same direction to be connected to a control circuit or a driver circuit. By dividing the signal terminal into two surfaces, there is an effect that it is easy to secure a creeping distance and a spatial distance between the terminals.
  • the DC terminal 315B is a terminal on the positive electrode side that transmits the DC current from the capacitor.
  • the direct current terminal 319B is a terminal on the negative electrode side.
  • the AC terminal 320B transmits AC drive current to the motor.
  • the metal first base 803 and the second base 804 are disposed such that their main surfaces face each other.
  • the first base 803 forms a fin 800 to improve the heat transfer coefficient with the refrigerant.
  • the second base 804 also forms fins.
  • the first base 803 and the second base 804 are not particularly limited as long as they are metal materials, but copper or aluminum is desirable in terms of heat dissipation, and aluminum is desirable in terms of cost.
  • the flow path cover 1003 is laser welded to the first base 803 it is particularly desirable to use a pure aluminum base as the first base 803 in order to prevent voids due to volatilization of impurities.
  • the sealing material 603 shown in FIGS. 1 and 6 collectively seals the semiconductor element 860, the first base 803, the second base 804, and the like by transfer molding.
  • the sealing material 603 is not particularly limited as long as it is a sealing material to be transfer molded, but in view of heat resistance, one having a glass transition temperature of 150 ° C. or higher is desirable.
  • the fixing portion 612 is a portion fixed to the housing 12 described later.
  • the opening 611 is formed in the flow path cover 1003 to allow the flow of the refrigerant into and out of the flow path.
  • the direct current terminal 315B and the direct current terminal 319B protrude from one surface of the power semiconductor device 140 in a row. With the direct current terminal 315B and the direct current terminal 319B adjacent to each other, the input and output currents are brought close to each other to reduce the inductance. Further, in order to connect the DC terminal 315B and the DC terminal 319B to the capacitor module 500 connected to the battery, there is an effect that the inverter layout can be simplified by projecting from one surface.
  • the AC terminal 320B protrudes from the surface of the power semiconductor unit 300 of the solder river on the side where the DC terminal 315B and the DC terminal 319B are arranged.
  • the inverter layout can be simplified. is there.
  • the first terminal 600 and the second terminal 601 correspond to the AC terminal 320B, the DC terminal 315B and the DC terminal 319B described in FIGS. 1 to 3.
  • the protrusion 606 is a portion of the first terminal 600 and the second terminal 601 that protrudes from the sealing material 603.
  • the intermediate portion 604 is covered with the sealing material 603 in the first terminal 600 and the second terminal 601. Since the protrusion 606 is not covered by the sealing material 603, it is necessary to secure a creepage distance and a space distance to be satisfied by the high voltage device.
  • the first terminal 600 and the second terminal 601 When a large current of 300 A or more flows through the first terminal 600 and the second terminal 601, the first terminal 600 and the second terminal 601 generate heat. Due to this heat generation, the intermediate portion 604 may be at a temperature higher than the glass transition temperature of the sealing material 603, and at a temperature higher than the glass transition temperature, the adhesion of the sealing material 603 may be reduced.
  • the middle portion 604 is a part of the first terminal 600 or the second terminal 601 integrally formed with the protrusion 606, and is a portion located outside the electrical connection portion such as the power semiconductor element 860 or the like.
  • the outer side of the power semiconductor device 140 Is extended outward.
  • the electrical resistance is increased and the calorific value is increased.
  • the heat generated in the middle portion 604 is transferred to the first base 803 and the second base 804 through the cooling path 613.
  • the first base 803 and the second base 804 are made of a metal material having a high thermal conductivity, and the first base 803 and the second base 804 have an area in contact with the flow path, the transferred heat is Be cooled through. As described above, by providing the first base 803 and the second base 804 on both sides of the intermediate portion 604, the heat dissipation of the first terminal 600 or the second terminal 601 is excellent.
  • the refrigerant is separated from the sealing material 603 by a metal material such as the first base 803, the second base 804, and the flow path cover 1003. Thereby, the moisture absorption of the sealing material by the cooling water can be prevented, and high insulation can be ensured.
  • FIG. 7 is a cross-sectional view of the manufacturing process of the power semiconductor device 140. As shown in FIG.
  • a collector side substrate 810 on which a conductor portion is mounted is prepared.
  • the semiconductor element 860 is connected to the collector side substrate 810 via a connecting member such as solder or sintered metal.
  • the metal block 159 is connected to the semiconductor element 860 through a connection member such as solder or sintered metal.
  • the metal block 159 is not particularly limited as long as it is a metal material having electrical conductivity, but copper having high electrical conductivity is desirable, and aluminum may be used for weight reduction. Plating or the like may be performed on the surface of the metal block in order to ensure connection with the connection member. Further, in the state of step (b) of FIG. 7, an Al wire not shown is connected.
  • the lead frame 830 and the lead frame 831 are mounted on the conductor portion of the collector side substrate 810 via the connection member. Further, the emitter side substrate 820 is mounted on the conductor portion of the collector side substrate 810 and the semiconductor element 860 through the connection member.
  • the first base 803 having the fins 800 is connected to the emitter side substrate 820.
  • a second base 804 having fins 800 is connected to the collector side substrate 810.
  • the sealing material 603 is transfer-molded to fill the space between the first base 803 and the second base 804, and a resin portion is further provided around the space. Form.
  • each member may be coated with a resin thin film 851 before transfer molding.
  • FIG. 8 is a plan view of power semiconductor unit 300 in the stage of step (c) of FIG. 7.
  • the power semiconductor unit 300 has three types of lead frame shapes depending on where it is mounted thereafter.
  • the control terminals such as the upper arm gate signal terminals 325U are provided with tie bars 832 to prevent the sealing material from flowing between the control terminals.
  • FIG. 9 is a perspective view of the manufacturing process centering on the second base 804 of the power semiconductor device 140 according to the present embodiment.
  • the second base 804 has a first flow path forming portion 605 and a fixing portion 612.
  • Three power semiconductor units 300 are arranged between the two first flow path forming portions 605 and arranged in the second base 804.
  • the bonding between the power semiconductor unit 300 and the second base 804 uses a metal material such as solder.
  • the bonding of the second base 804 and the first flow path forming portion 605 and the bonding of the second base 804 and the fixing portion 612 are bonded by metal bonding such as laser welding.
  • FIG. 10 is a perspective view of the manufacturing process centering on the first base 803 of the power semiconductor device 140 according to the present embodiment.
  • the first base 804 is connected to the three power semiconductor units 300, the fixing portion 612, and the first flow path forming portion 605. Bonding between the power semiconductor unit 800 and the first base 803 is performed using a metal material such as solder. The bonding between the first base 803 and the first flow path forming portion 605 and the bonding between the first base 803 and the fixing portion 612 are performed by metal bonding such as laser welding.
  • FIG. 11 is a perspective view of the manufacturing process centering on the sealing material 603 of the power semiconductor device 140 according to the present embodiment.
  • the space between the first base 803 and the second base 804 is sealed with a sealing material 603 by transfer molding. There is an effect of high productivity by collectively sealing by transfer molding.
  • FIG. 12 is a perspective view showing the appearance of the power conversion device 200 according to the present embodiment in which the power semiconductor device 140 is mounted.
  • the appearance of the power change device 200 includes a housing 12 having a substantially rectangular top or bottom surface, an upper case 10 provided on one of the outer circumferences on the short side of the housing 12, and the housing 12. And a lower case 16 for closing the lower opening of the lower case.
  • the housing 12 and the lower case may be integrally formed. By making the shape of the bottom view or the top view of the housing 12 substantially rectangular, the mounting to the vehicle becomes easy and it is easy to produce.
  • the refrigerant inlet portion 13 allows the refrigerant to flow into one surface of the housing 12, and the refrigerant outlet portion 14 causes the refrigerant to flow out to the one surface of the housing 12.
  • the connector 21 transmits and receives signals for driving the power semiconductor device 140 and the like.
  • the AC terminal 18 connects the power change device 200 and the motor, and transmits an alternating current.
  • FIG. 13 is a schematic view showing a cross-sectional structure of a power conversion device 200 according to the present embodiment.
  • the AC terminal 320B is welded to the bus bar on which the current sensor 180 is mounted. Further, the direct current terminal 315 B and the direct current terminal 319 B of the power semiconductor device 140 are welded to the terminals of the capacitor module 500.
  • the control circuit board 172 carrying the mounted components and the driver circuit board 174 are assembled and connected to the signal terminal.
  • the power conversion device 200 can be miniaturized by installing the control circuit board 172, the driver circuit board 174, and the capacitor module 500 under the power semiconductor device 140 above the power semiconductor device 140 in which the flow path is formed. it can.
  • Control circuit board 174: driver circuit board, 180: current sensor, 200: power conversion device, 300: power semiconductor unit, 315B: positive electrode side DC terminal, 319B: negative electrode side DC terminal, 320B: AC terminal, 325U: upper arm gate Signal terminal 325L: lower arm gate signal terminal 325S: temperature sense signal terminal 325C: collector sense signal terminal 600: first terminal 601: second terminal 603: sealing material 604: middle part 605: 605 1st flow path formation part, 606 ... projection part, 612 ... fixing part, 613 ... cooling path, 800 ... fin, 803 ... 1st beam Part 804, second base part 810, collector side substrate 820, emitter side substrate 830 lead frame 831 lead frame 832 tie bar 851 resin thin film 860 semiconductor element 1003 flow path cover

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Abstract

本発明の課題は、パワー半導体装置の信頼性を向上させることである。　本発明に係るパワー半導体装置は、半導体素子と、前記半導体素子に電流を伝達する第１端子及び第２端子と、前記第１端子の一部と前記第２端子の一部と前記半導体素子と挟むとともに互いに対向して配置される第１ベース及び第２ベースと、前記第１ベースと前記第２ベースの間の空間に設けられる封止材と、を備え、前記第２端子は、前記半導体素子から離れる方向に沿って前記第１端子から距離が大きくなるように形成される中間部を有し、前記中間部は、前記第１ベースと前記第２ベースの間であってかつ前記封止材内に設けられる。

Description

パワー半導体装置
　本発明は、パワー半導体装置に関し、特に、高出力に対応したパワー半導体素子を有するパワー半導体装置に関する。
　パワー半導体素子のスイッチングによる電力変換装置は変換効率が高いため、民生用、車載用、鉄道用、変電設備等に幅広く利用されている。
　このパワー半導体素子は通電により発熱するため、高い放熱性が求められる。特に車載用途においては、小型、軽量化のため水冷を用いた高効率な冷却システムが採用されている。パワー半導体素子の両面を冷却するパワー半導体装置に関し特許文献１が開示されている。
　特許文献１に記載されたパワー半導体装置は、熱硬化性樹脂で樹脂モールドされた半導体装置を熱可塑性樹脂でモールドして水路を形成する。この水路は常時冷却水が樹脂に接することで、樹脂が飽和状態まで吸湿するため、半導体素子と樹脂の界面にある微小な剥離部に拡散した水が析出するおそれがある。
特開２０１２－９５６８号公報
　本発明の課題は、パワー半導体装置の信頼性を向上させることである。
　本発明に係るパワー半導体装置は、半導体素子と、前記半導体素子に電流を伝達する第１端子及び第２端子と、前記第１端子の一部と前記第２端子の一部と前記半導体素子と挟むとともに互いに対向して配置される第１ベース及び第２ベースと、前記第１ベースと前記第２ベースの間の空間に設けられる封止材と、を備え、前記第２端子は、前記半導体素子から離れる方向に沿って前記第１端子から距離が大きくなるように形成される中間部を有し、前記中間部は、前記第１ベースと前記第２ベースの間であってかつ前記封止材内に設けられる。
　本発明により、パワー半導体装置の信頼性を向上させることができる。
本実施形態に係るパワー半導体装置１４０の表側の全体斜視図である。 本実施形態に係るパワー半導体装置１４０の裏側の全体斜視図である。 流路カバー１００３を取り除いたパワー半導体装置１４０の表側の全体斜視図である。 パワー半導体装置１４０の透過正面図である。 図４の線分ＡＡを通る断面に関するパワー半導体ユニット３００の断面図である。 図４の線分ＢＢを通る断面に関するパワー半導体ユニット３００の断面図である。 パワー半導体装置１４０の製造工程の断面図である。 図７の工程（ｃ）の段階におけるパワー半導体ユニット３００の平面図である。 本実施形態に係るパワー半導体装置１４０の第２ベース８０４を中心にした製造工程の斜視図である。 本実施形態に係るパワー半導体装置１４０の第１ベース８０３を中心にした製造工程の斜視図である。 本実施形態に係るパワー半導体装置１４０の封止材６０３を中心にした製造工程の斜視図である。 パワー半導体装置１４０を実装する本実施形態に係る電力変換装置２００の外観を示す斜視図である。 本実施形態に係る電力変換装置２００の断面構造を示す概略図である。
　本発明の実施形態を説明する前に、本発明の原理について説明する。
　本発明に係る一つの構成は、半導体素子に電流を伝達する第１端子及び第２端子と、前記第１端子の一部と前記第２端子の一部と前記半導体素子と挟むとともに互いに対向して配置される第１ベース及び第２ベースと、前記第１ベースと前記第２ベースの間の空間に設けられる封止材と、を備え、前記第２端子は、前記半導体素子から離れる方向に沿って前記第１端子から距離が大きくなるように形成される中間部を有し、前記中間部は、前記第１ベースと前記第２ベースの間であってかつ前記封止材内に設けられる。
　本発明によれば、半導体素子の両面に金属製の第１ベースと第２ベースがあるため、半導体素子の両面を冷却しながらも冷却水が封止材に接することがない。このため、冷却水による封止材の吸湿はなく、絶縁性に優れる効果がある。
　また第２端子は、半導体素子から離れる方向に沿って端子間隔が大きくなるように形成されるため、高電圧機器が満たすべき沿面距離や、空間距離の確保が容易となる効果がある。一方で、低コスト化のため、半導体素子を搭載した高価な絶縁基板を拡大することなく、端子間隔を拡大する場合、パワー半導体装置の外側に位置する端子の距離が延長する。第２端子の距離が長くなると電気抵抗が増加し発熱量が増加する。
　第２端子が突出する長手方向の外形サイズ１７０ｍｍ以下の小型のパワー半導体装置の場合、３００Ａ以上の大電流を通電すると、最短距離で端子が封止材から突出する場合に比べ、増加した発熱量で、端子を封止している封止材のガラス転移温度を超え、封止材と端子の密着力が低下する新たな課題が生じる。
　この点に対して、本発明のように、半導体素子から離れる方向に沿って第１端子から距離が大きくなるように形成される中間部を第１ベース及び第２ベースではさむことで、第２端子の冷却性を向上し、大電流を通電できる効果がある。また、第１ベース及び第２ベースは、封止材で一括封止されることで、生産性が高い効果がある。
　以下、本発明に係る構造体の実施の形態として、車両搭載用の電力変換装置に用いられるパワー半導体装置について説明する。以下に説明するパワー半導体装置の実施形態においては、発熱体としてのパワー半導体素子、パワー半導体素子を搭載したパワー半導体ユニット、パワー半導体ユニットを搭載する放熱板としてのフィン部を有するベース、パワー半導体ユニットの入出力端子、パワー半導体ユニット及びベースを一括封止する封止材、水路を形成する水路カバー、上下水路を連結する流路形成部等の各構成要素について、図面を参照して説明する。なお、各図において同一要素については同一の符号を記し、重複する説明は省略する。
　図１は、本実施形態に係るパワー半導体装置１４０の表側の全体斜視図である。図２は、本実施形態に係るパワー半導体装置１４０の裏側の全体斜視図である。図３は、流路カバー１００３を取り除いたパワー半導体装置１４０の表側の全体斜視図である。図４は、パワー半導体装置１４０の透過正面図である。図５は、図４の線分ＡＡを通る断面に関するパワー半導体ユニット３００の断面図である。図６は、図４の線分ＢＢを通る断面に関するパワー半導体ユニット３００の断面図である。
　パワー半導体ユニット３００は、後述する半導体素子８６０を内蔵する回路体である。図１や図６等に示されるように、パワー半導体ユニット３００は３つが一列に並べられる。パワー半導体ユニット３００は、上アーム回路及び下アーム回路の２つのアーム回路を、１つのモジュールに一体化した構造である２ｉｎ１構造である。２ｉｎ１構造の他にも、３ｉｎ１構造、４ｉｎ１構造、６ｉｎ１構造等を用いた場合、パワー半導体装置からの出力端子の数を低減し小型化することができる。
　コレクタセンス信号端子３２５Ｃや下アームゲート信号端子３２５Ｌや温度センス信号端子３２５Ｓは、パワー半導体ユニット３００と制御基板やドライバ基板との間で電気的信号を伝達する。これらの信号端子は、パワー半導体装置１４０の二面から突出した後、制御回路やドライバ回路に接続するため、曲げ加工により同一方向に向きを変えている。信号端子を二面に分けて出すことで、端子間の沿面距離や空間距離を確保しやすい効果がある。
　直流端子３１５Ｂは、コンデンサからの直流電流を伝達する正極側の端子である。直流端子３１９Ｂは、負極側の端子である。交流端子３２０Ｂは、モータに交流駆動電流を伝達する。
　図６に示されるように、金属製の第１ベース８０３と第２ベース８０４は、互いの主面が対向するように配置される。図３に示されるように、第１ベース８０３は、フィン８００を形成し、冷媒との熱伝達率を向上させている。第２ベース８０４も同様にフィンを形成する。第１ベース８０３や第２ベース８０４は金属材料であれば特に制約されないが、放熱性の点で、銅又はアルミが望ましく、コストの点ではアルミが望ましい。図１に示されるように、流路カバー１００３を第１ベース８０３にレーザ溶接する場合、不純物の揮発によるボイドを防止するため、第１ベース８０３は純アルミ系を用いることが特に望ましい。
　図１や図６等に示される封止材６０３は、半導体素子８６０や第１ベース８０３や第２ベース８０４等をトランスファーモールドで一括封止する。封止材６０３は、トランスファーモールド成型する封止材であれば特に制約されないが、耐熱性の点で、ガラス転移温度が１５０℃以上のものが望ましい。固定部６１２は、後述する筐体１２へ固定される部分である。開口部６１１は、流路カバー１００３に形成され、流路内に冷媒の流入や流出をさせる。
　直流端子３１５Ｂと直流端子３１９Ｂは、パワー半導体装置１４０の一面から一列に突出している。直流端子３１５Ｂと直流端子３１９Ｂが隣接することで、入出力の電流を近接させインダクタンスを低減する効果がある。また直流端子３１５Ｂと直流端子３１９Ｂは、バッテリに連結したコンデンサモジュール５００に接続させるために、一面から突出させてインバータレイアウトを簡略化できる効果がある。交流端子３２０Ｂは、直流端子３１５Ｂ及び直流端子３１９Ｂが配置された側とは半田川のパワー半導体ユニット３００の面から突出している。これにより、電流センサに接続した後、インバータから出力しモータに接続されるため、コンデンサモジュール５００と接続する直流端子３１５Ｂと直流端子３１９Ｂと別方向とする事で、インバータレイアウトが簡略化できる効果がある。
　図４を用いて、本実施形態に係る第１端子６００と、第２端子６０１と、第２端子６０１に設けられる中間部６０４と、突出部６０６と、第１流路形成部６０５との関係について説明する。
　第１端子６００及び第２端子６０１は、図１ないし図３に説示された交流端子３２０Ｂ、直流端子３１５Ｂ及び直流端子３１９Ｂに対応する。突出部６０６は、第１端子６００及び第２端子６０１における封止材６０３から突出する部分である。一方、中間部６０４は、第１端子６００及び第２端子６０１において封止材６０３に覆われている。突出部６０６は、封止材６０３に覆われていないため、高電圧機器が満たすべき沿面距離や空間距離の確保が必要となる。
　第１端子６００及び第２端子６０１に３００Ａ以上の大電流が流れた場合、第１端子６００及び第２端子６０１が発熱する。この発熱により、中間部６０４が封止材６０３のガラス転移温度より高い温度になる場合があり、ガラス転移温度より高い温度では、封止材６０３の密着力が低下する恐れがある。
　中間部６０４は、突出部６０６に対して一体形成された第１端子６００又は第２端子６０１の一部であり、パワー半導体素子８６０等の電気的接続部より外部に位置する部分である。
　パワー半導体素子８６０を搭載した高価な絶縁基板を拡大することなく低コスト化を図り、かつ高電圧機器が満たすべき沿面距離や、空間距離の確保端子間隔を拡大する場合、パワー半導体装置１４０の外側に位置する第２端子６０１を外側に延長させる。一方、第２端子６０１の距離が長くなると電気抵抗が増加し発熱量が増加する。
　図５及び図６に示されるように、中間部６０４で発生した熱は、冷却経路６１３を経て、第１ベース８０３及び第２ベース８０４に伝達される。
　第１ベース８０３及び第２ベース８０４は、熱伝度率の高い金属材料からなり、第１ベース８０３及び第２ベース８０４自体に流路と接する領域があるため、伝熱された熱は、冷媒を通じて冷却される。このように中間部６０４の両側に第１ベース８０３と第２ベース８０４を有することで、第１端子６００又は第２端子６０１の放熱性に優れる効果がある。
　また冷媒は、第１ベース８０３、第２ベース８０４、流路カバー１００３といった金属製材料により封止材６０３と隔離されている。これにより、冷却水による封止材の吸湿を防止し高い絶縁性を確保できる。
　本実施形態に係るパワー半導体装置１４０の製造手順について、図７から図１１を用いて説明する。図７は、パワー半導体装置１４０の製造工程の断面図である。
　図７の工程（ａ）に示されるように、導体部を実装したコレクタ側基板８１０を準備する。
　図７の工程（ｂ）に示されるように、半導体素子８６０が、はんだや焼結金属等の接続部材を介して、コレクタ側基板８１０に接続される。さらに金属ブロック１５９は、はんだや焼結金属等の接続部材を介して、半導体素子８６０に接続される。金属ブロック１５９は、電気伝導性を有する金属材料であればとくに制約されないが、電気伝導性が高い銅が望ましく、軽量化のためアルミを用いてもよい。接続部材との接続を確保するため金属ブロックの表面にめっき等を施してもよい。さらに図７の工程（ｂ）の状態において、図示していないＡｌワイヤを接続する。
　図７の工程（ｃ）に示されるように、リードフレーム８３０及びリードフレーム８３１が、接続部材を介して、コレクタ側基板８１０の導体部に搭載される。さらにエミッタ側基板８２０が、接続部材を介して、コレクタ側基板８１０の導体部及び半導体素子８６０に搭載される。
　次に図７の工程（ｄ）に示されるように、フィン８００を有する第１ベース８０３が、エミッタ側基板８２０に接続される。フィン８００を有する第２ベース８０４が、コレクタ側基板８１０に接続される。
　次に図７の工程（ｅ）に示されるように、封止材６０３がトランスファーモールドにより、第１ベース８０３と第２ベース８０４の間の空間に充填され、さらに当該空間の周辺に樹脂部を形成する。
　なお、封止材６０３と他の部品との密着性を向上するために、トランスファーモールド前の段階で、各部材を樹脂薄膜８５１で被覆してもよい。
　次に、図７に示された工程（ｃ）から工程（ｅ）について、詳細に説明する。図８は、図７の工程（ｃ）の段階におけるパワー半導体ユニット３００の平面図である。
　パワー半導体ユニット３００は、その後搭載する場所により、３種類のリードフレーム形状を有する。上アームゲート信号端子３２５Ｕ等の制御端子には、タイバー８３２が設けられ、制御端子間に封止材が流入するのを防止する。
　図９は、本実施形態に係るパワー半導体装置１４０の第２ベース８０４を中心にした製造工程の斜視図である。
　第２ベース８０４は、第１流路形成部６０５及び固定部６１２を有する。３つのパワー半導体ユニット３００が、２つの第１流路形成部６０５の間に並べられ、第２ベース８０４に配置される。あらかじめパワー半導体ユニット３００を製造した後、第２ベース８０４に搭載することで、パワー半導体ユニット３００自体の反りを低減できる効果がある。パワー半導体ユニット３００と第２ベース８０４との接合は、はんだ等の金属材料を用いる。第２ベース８０４と第１流路形成部６０５の接合、及び第２ベース８０４と固定部６１２の接合は、レーザ溶接等の金属結合により接合する。
　図１０は、本実施形態に係るパワー半導体装置１４０の第１ベース８０３を中心にした製造工程の斜視図である。
　第１ベース８０４は、３つのパワー半導体ユニット３００と固定部６１２と第１流路形成部６０５に接続される。パワー半導体ユニット８００と第１ベース８０３との接合は、はんだ等の金属材料を用い接続する。第１ベース８０３と第１流路形成部６０５の接合、第１ベース８０３と固定部６１２の接合は、レーザ溶接等の金属結合により接合する。
　図１１は、本実施形態に係るパワー半導体装置１４０の封止材６０３を中心にした製造工程の斜視図である。
　第１ベース８０３と第２ベース８０４の間をトランスファーモールドにより封止材６０３で封止する。トランスファーモールドで一括封止することで、生産性が高い効果がある。
　図１２は、パワー半導体装置１４０を実装する本実施形態に係る電力変換装置２００の外観を示す斜視図である。
　本実施の形態に係る電力変化装置２００の外観は、上面あるいは底面が略長方形の筐体１２と、筐体１２の短辺側の外周の一つに設けられた上部ケース１０と、筐体１２の下部開口を塞ぐための下部ケース１６と、を固定して形成されたものである。筐体１２と下部ケースは一体で形成される場合もある。筐体１２の底面図あるいは上面図の形状を略長方形としたことで、車両への取付けが容易となり、また生産しやすい。冷媒入口部１３は筐体１２の一面に冷媒を流入させ、冷媒出口部１４は筐体１２の一面に冷媒を流出させる。コネクタ２１は、パワー半導体装置１４０等を駆動させるための信号を送受信する。交流ターミナル１８は、電力変化装置２００とモータを繋ぎ、交流電流を伝達する。
　図１３は、本実施形態に係る電力変換装置２００の断面構造を示す概略図である。
　パワー半導体装置１４０は、交流端子３２０Ｂは電流センサ１８０を搭載したバスバーに溶接する。また、パワー半導体装置１４０の直流端子３１５Ｂ及び直流端子３１９Ｂはコンデンサモジュール５００の端子と溶接される。次に、実装部品を搭載した制御回路基板１７２とドライバ回路基板１７４を組み付け、信号端子と接続する。流路が形成されたパワー半導体装置１４０の上部に制御回路基板１７２やドライバ回路基板１７４、パワー半導体装置１４０の下部にコンデンサモジュール５００を設置することで、電力変換装置２００の小型化を図ることができる。
１０…上部ケース、１２…筺体、１３…冷媒入口部、１４…冷媒出口部、１６…下部ケース、２１…コネクタ、１３６…バッテリ、１４０…パワー半導体装置、１５９…金属ブロック、１７２…制御回路基板、１７４…ドライバ回路基板、１８０…電流センサ、２００…電力変換装置、３００…パワー半導体ユニット、３１５Ｂ…正極側の直流端子、３１９Ｂ…負極側の直流端子、３２０Ｂ…交流端子、３２５Ｕ…上アームゲート信号端子、３２５Ｌ…下アームゲート信号端子、３２５Ｓ…温度センス信号端子、３２５Ｃ…コレクタセンス信号端子、６００…第１端子、６０１…第２端子、６０３…封止材、６０４…中間部、６０５…第１流路形成部、６０６…突出部、６１２…固定部、６１３…冷却経路、８００…フィン、８０３…第１ベース部、８０４…第２ベース部、８１０…コレクタ側基板、８２０…エミッタ側基板、８３０…リードフレーム、８３１…リードフレーム、８３２…タイバー、８５１…樹脂薄膜、８６０…半導体素子、１００３…流路カバー

Claims (3)

  1. 　半導体素子と、
    　前記半導体素子に電流を伝達する第１端子及び第２端子と、
    　前記第１端子の一部と前記第２端子の一部と前記半導体素子と挟むとともに互いに対向して配置される第１ベース及び第２ベースと、
    　前記第１ベースと前記第２ベースの間の空間に設けられる封止材と、を備え、
    　前記第２端子は、前記半導体素子から離れる方向に沿って前記第１端子から距離が大きくなるように形成される中間部を有し、
    　前記中間部は、前記第１ベースと前記第２ベースの間であってかつ前記封止材内に設けられるパワー半導体装置。
  2. 　請求項１に記載のパワー半導体装置であって、
    　前記第１ベースは、当該第１ベースと前記第２ベースの配列方向から見た場合、当該中間部と重なりかつ前記封止材の厚み方向に冷媒を流す第１流路形成部を設けるパワー半導体装置。
  3. 　請求項１または２に記載のパワー半導体装置であって、
    　前記中間部と繋がりかつ前記封止材から突出する突出部と、を備え、
    　前記中間部は、前記半導体素子から前記突出部までの間に突出部とは異なる角度に屈曲するパワー半導体装置。
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