WO2019130496A1 - Laminated body and method for manufacturing same - Google Patents

Abstract

Disclosed is a method for manufacturing a laminated body 100 having a laminated structure wherein an insulating member 30 is disposed between a substrate 10 and a substrate 20. The method is provided with a step for: forming, in the substrate 10, a through hole 12a penetrating the substrate 10; forming, in the substrate 20, a through hole 22a penetrating the substrate 20; forming, in the insulating member 30, a through hole 32a, in a state wherein the insulating member 30 is disposed between the substrate 10 and the substrate 20; and forming, with the through hole 12a, the through hole 22a, and the through hole 32a, a through hole 100a penetrating the laminated body 100. The method is provided for the purpose of manufacturing the substrate 100 wherein: the substrate 10 has a conductor section 14a disposed on the inner wall of the through hole 12a; the substrate 20 has a conductor section 24a disposed on the inner wall of the through hole 22a; a surface electrode 16a is disposed on a substrate 10 main surface 10a facing the substrate 20, said surface electrode being at a position different from the position where the through hole 12a is formed; a surface electrode 26a is disposed on a substrate 20 main surface 20a facing the substrate 10, said surface electrode being at a position different from the position where the through hole 22a is formed; and a through hole 12a end section on the reverse side of the substrate 20, and a through hole 22a end section on the reverse side of the substrate 10 are electrically connected to each other via the conductor section 14a, the surface electrode 16a, the surface electrode 26a, and the conductor section 24a.

Description

LAMINATE AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a laminate and a method of manufacturing the same.

In the multilayer wiring board, for example, after alternately laminating and integrating a double-sided copper-clad laminate on which circuits are formed and an insulating adhesive, the entire multilayer wiring board is laminated in the direction required for connection. By providing a through hole passing through and forming a conductor portion on the inner wall of the through hole by metal plating, it can be obtained by providing a through through hole electrically connecting both ends of the through hole.

Since the through holes are formed in the entire stacking direction of the multilayer wiring board, on the surface of the multilayer wiring board, in order to avoid electrical connection with the through holes, the circuit is formed so as to avoid the formation positions of the through holes. The pattern is placed. Therefore, there is a limit in improving the wiring density in the through through hole structure.

The components mounted on the multilayer wiring board are mainly surface mounted, and the connecting parts for connecting the components and the multilayer wiring board are becoming smaller year by year. With the higher density of components mounted on a multilayer wiring board, the number of mounting points is also increasing, and a reduction in through-hole pitch of the multilayer wiring board and an increase in the number of layers of wiring circuits are required. For example, an interstitial via hole (IVH: not formed) is provided with a through hole obtained by forming a conductor portion on the inner wall of the through hole by providing a through hole which penetrates the entire multilayer wiring board in the stacking direction. A multilayer wiring board with through holes (through holes) is known. This multilayer wiring board is capable of drilling holes of a smaller diameter than a multilayer wiring board having only through holes, and can easily cope with narrowing of the pitch.

Interlayer connection techniques have been developed to accommodate further densification. For example, after a build-up layer is formed on the surface of the wiring board, the inner wall of the non-through hole provided by a laser or the like is plated to electrically connect both ends of the non-through hole. Build-up method is known. Furthermore, as an interlayer connection technology other than the build-up method, a manufacturing technology of a multilayer wiring board using a conductive paste, an anisotropic conductive material or the like as an interlayer connection member without using plating has been proposed.

For example, in Patent Document 1 below, after laminating a member filled with a conductive paste in a hole provided in a thin prepreg, a circuit board, etc., heating and pressure are applied to form a single multilayer wiring board. Methods are disclosed.

In Patent Document 2 listed below, a circuit board, copper foil or the like is superimposed on a structure obtained by penetrating the bump from the insulation material by pressing the insulating material against the bumps formed on the circuit board, copper foil or the like. There is disclosed a multilayer wiring board obtained by integration by heating and pressing after integration.

In Patent Document 3 below, a via made of a conductive bump is formed by forming a mountain-shaped or substantially conical conductive bump on a conductor plate and then heating the insulating prepreg base material to soften and press-insert it. Methods of forming are disclosed.

In Patent Document 4 below, a plurality of members having conductive vias penetrating in the thickness direction of the insulating member are laminated by filling the holes provided in the hardened insulating member with the conductive paste. A method of forming a multilayer circuit board is disclosed.

Japanese Patent Application Laid-Open No. 11-87870 Unexamined-Japanese-Patent No. 9-162553 gazette JP, 2013-110230, A JP, 2015-26689, A

By the way, as a component mounted on a multilayer wiring board, a pin insertion type (press fit pin type) component in which a pin is inserted and held in a through hole (through through hole) can be mentioned. In order to use a pin insertion type component, through holes penetrating through a plurality of substrates in a multilayer wiring board are required.

Although it is possible to provide a through hole in the multilayer wiring board after obtaining the multilayer wiring board by laminating a plurality of substrates (interlayer connection), it is necessary to penetrate the plurality of substrates, so the manufacture of the multilayer wiring board It is feared that the process becomes long and the manufacturing cost of the multilayer wiring board becomes high. Therefore, as a laminate used as a multilayer wiring board or a laminate used to obtain a multilayer wiring board, it is required to efficiently obtain a laminate on which pin insertion type components can be mounted.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing a laminate capable of efficiently obtaining a laminate capable of mounting a pin insertion type component. Moreover, this invention aims at providing the laminated body which can be obtained by the said manufacturing method.

A manufacturing method of a layered product concerning the present invention is a manufacturing method of a layered product which has a layered structure which an insulating member intervenes between the 1st substrate and the 2nd substrate, and penetrates the 1st above-mentioned substrate A first through hole is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is the first substrate and the first substrate. A through hole is formed in the insulating member in a state of being disposed between the two substrates, and the first through hole, the second through hole, and the through hole of the insulating member form the through hole. And forming a through hole through the laminate, wherein the first substrate has a first conductor portion disposed on the inner wall of the first through hole, and the second substrate is formed by A second conductor portion disposed on the inner wall of the second through hole, and a second substrate facing the second substrate in the first substrate; The first surface electrode is disposed at a position different from the position where the first through hole is formed on the main surface of the second main surface, and the second main surface of the second substrate facing the first substrate is disposed. A second surface electrode is disposed at a position different from the formation position of the second through hole, and an end of the first through hole on the opposite side to the second substrate, and the second The end of the through hole on the opposite side to the first substrate is the first conductor, the first surface electrode, the second surface electrode, and the second conductor. Are electrically connected via

According to the method of manufacturing a laminate according to the present invention, the first through hole penetrating the first substrate is formed in the first substrate, and the second through hole penetrating the second substrate is the second A through hole is formed in the insulating member in a state where the insulating member is formed between the first substrate and the second substrate, and the first through hole and the second through hole are formed on the substrate. A through hole penetrating the laminated body is formed by the through hole of the insulating member. In this case, since the through holes are formed in advance in the first substrate and the second substrate when performing the operation of forming the through holes penetrating the stacked body, the first substrate and the first substrate in addition to the insulating member are formed. There is no need to form a through hole in the second substrate. Therefore, while being able to simplify the manufacturing process of a laminated body, it can suppress that the manufacturing cost of a laminated body becomes high. Therefore, according to the method for manufacturing a laminate according to the present invention, it is possible to efficiently obtain a laminate capable of mounting a pin insertion type component.

By the way, although it is possible to provide a through hole in a multilayer wiring board after obtaining a multilayer wiring board by laminating a plurality of substrates (interlayer connection), when the substrate is thick, processing with a small diameter drill is difficult ( In addition to the possibility of occurrence of drill breakage, the plating rotation of the conductor part arranged on the inner wall of the through hole (slowing power, eg plating rotation when the aspect ratio of the through hole exceeds 25) May decrease. On the other hand, according to the method for manufacturing a laminate according to the present invention, even when the substrate is thick, through holes can be formed through the laminate using a small diameter drill. In addition, even when the substrate is thick, since the conductor portion is formed on the substrate in advance before stacking the plurality of substrates, it is not necessary to consider the roundness of plating after the substrates are stacked. Since the diameter of the holes can be easily reduced by these, the distance between the through holes formed in the substrate can be increased. In this case, the number of signal lines can be increased, and the signal lines can be easily routed.

The method for manufacturing a laminate according to the present invention may be an aspect in which the through hole of the insulating member is formed by laser processing. In the method of manufacturing a laminate according to the present invention, the through hole of the insulating member may be formed by drilling.

A laminate according to the present invention is a laminate having a laminate structure in which an insulating member is interposed between a first substrate and a second substrate, and the first through hole penetrating the first substrate and A second through hole penetrating the second substrate and a through hole penetrating the insulating member constitute a through hole penetrating the laminated body, and the first substrate is the first through hole. A first conductor portion disposed on the inner wall of the first through hole, and the second substrate having a second conductor portion disposed on the inner wall of the second through hole; The first surface electrode is disposed at a position different from the position where the first through hole is formed on the first main surface of the substrate facing the second substrate, and the first surface electrode is disposed on the second substrate. Second surface electrode at a position different from the position where the second through hole is formed on the second main surface facing the first substrate An end of the first through hole opposite to the second substrate and an end of the second through hole opposite to the first substrate are disposed It is electrically connected via the 1st conductor part, the said 1st surface electrode, the said 2nd surface electrode, and the said 2nd conductor part.

The first surface electrode and the second surface electrode may be electrically connected to each other by a conductive member disposed between the first surface electrode and the second surface electrode.

In the laminate according to the present invention, a third through hole penetrating the first substrate is further formed in the first substrate, and the first substrate is formed on the inner wall of the third through hole. And a fourth through hole penetrating the second substrate is further formed in the second substrate, and the second substrate is the fourth conductor portion. The semiconductor device further includes a fourth conductor portion disposed on the inner wall of the through hole, the third surface electrode is disposed on the first main surface, and the fourth surface electrode is disposed on the second main surface. It may be the aspect which is carried out.

In the laminate according to the present invention, the third through hole and the fourth through hole are formed at positions overlapping with each other in the stacking direction of the first substrate, the insulating member, and the second substrate. The third front surface electrode is disposed at a formation position of the third through hole in the first main surface, and the fourth front surface electrode is disposed in the fourth main surface in the second main surface. The aspect arrange | positioned in the formation position of a through-hole may be sufficient.

In the laminate according to the present invention, the third through hole and the fourth through hole are formed at positions not overlapping each other in the stacking direction of the first substrate, the insulating member, and the second substrate. The third surface electrode is disposed at the formation position of the third through hole in the first main surface, and the fourth surface electrode is disposed in the third main surface in the second main surface. The aspect may be arranged at a position facing the surface electrode of

The third surface electrode and the fourth surface electrode may be electrically connected to each other by a conductive member disposed between the third surface electrode and the fourth surface electrode. Good.

The layered product concerning the present invention may be a mode in which a conductive member is not arranged between the 3rd surface electrode and the 4th surface electrode.

The diameter of at least one of the first through hole and the second through hole may be larger than the diameter of the through hole of the insulating member.

The diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member.

According to the present invention, a laminate capable of mounting a pin insertion type component can be efficiently and easily obtained. According to the present invention, the degree of freedom in the design of the laminate and the degree of freedom in the formation of the through holes can be increased.

FIG. 1 is a schematic cross-sectional view showing a laminate according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a laminate according to another embodiment of the present invention. FIG. 3: is a schematic sectional drawing which shows the manufacturing method of the laminated body which concerns on one Embodiment of this invention. FIG. 4 is a schematic cross-sectional view showing a method of manufacturing a laminate according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the present invention is not limited to the following embodiments. The sizes of components in the respective drawings are conceptual, and the relative relationship between the sizes of the components is not limited to those shown in the respective drawings.

The laminate according to the present embodiment is a laminate having a laminate structure in which an insulating member is interposed between the first substrate and the second substrate, and the first through hole penetrating the first substrate and A second through hole penetrating the second substrate and a through hole penetrating the insulating member constitute a through hole penetrating the laminate, and the first substrate is a portion of the first through hole. A second substrate having a first conductor portion disposed on the inner wall, and a second substrate having a second conductor portion disposed on the inner wall of the second through hole; The first surface electrode is disposed at a position different from the formation position of the first through hole on the opposing first main surface, and a second main surface facing the first substrate in the second substrate. , The second surface electrode is disposed at a position different from the formation position of the second through hole, and the second substrate in the first through hole is The end on the opposite side and the end on the opposite side to the first substrate in the second through hole are a first conductor, a first surface electrode, a second surface electrode, and a second Are electrically connected to each other through the conductor portion of

The diameter (diameter in the direction orthogonal to the thickness direction of the substrate) of the through hole (at least one of the first through hole and the second through hole) of the substrate may be 0.1 mm or more, and 0.2 mm or more It may be 0.3 mm or more, may be 0.4 mm or more, and may be 0.5 mm or more. The diameter of the through hole of the substrate (the first substrate and / or the second substrate) may be 5 mm or less, 3 mm or less, or 1 mm or less. The diameter of the through hole of the first substrate and the diameter of the through hole of the second substrate may be the same as or different from each other.

The diameter of the through hole of the insulating member (diameter in the direction orthogonal to the thickness direction of the insulating member) may be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0 .4 mm or more, 0.45 mm or more may be 0.5 mm or more. The diameter of the through hole of the insulating member may be 1 mm or less, 0.9 mm or less, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less Good.

The difference between the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate and the diameter of the through hole of the insulating member is the through hole of the substrate when forming the through hole in the insulating member It may be 0.1 mm or more, 0.15 mm or more, or 0.2 mm or more, from the viewpoint of suppressing breakage of the inner conductor portion. The upper limit of the difference between the diameter of at least one of the first through hole and the second through hole and the diameter of the through hole of the insulating member is, for example, 0.5 mm.

The diameter of the through hole of the insulating member may be the same as or different from the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate. For example, the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate may be larger than the diameter of the through hole of the insulating member. Further, the diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member. It is preferable that the diameter of the through hole of the insulating member and the diameter of the through hole of the substrate be the same (the same diameter). In this case, after forming the through hole in the insulating member, the constituent material of the insulating member can be easily removed from the through hole of the substrate, and foreign matter and the like can be suppressed from being accumulated in the through hole of the substrate. Moreover, at the time of component mounting, it can suppress that an insulation member contacts an insertion-type pin and the constituent material of an insulation member scatters.

The thickness of the conductor portion (the thickness in the radial direction of the through hole in the conductor portion) may be 10 μm or more, 15 μm or more, or 20 μm or more. The thicknesses of the conductor portions 14a to 14d and the conductor portions 24a to 24d may be 40 μm or less, 35 μm or less, and 30 μm or less.

FIG. 1 is a schematic cross-sectional view showing a laminate according to the present embodiment. A laminated body (multilayer wiring board) 100 shown in FIG. 1 includes a substrate (first substrate) 10, a substrate (second substrate) 20, and an insulating member 30, and the substrate 10 and the substrate 20 Between the layers, the insulating member 30 intervenes between them. The insulating member 30 is in contact with the substrate 10 and the substrate 20. The substrate 10, the insulating member 30, and the substrate 20 are stacked in this order.

The size, shape, and the like of the substrates 10 and 20 are not particularly limited. The size, shape, etc. of the substrate 10 and the substrate 20 may be the same as or different from each other.

A printed wiring board can be used as the substrates 10 and 20. As a printed wiring board, a double-sided circuit board, a multilayer wiring board, a multi-wire wiring board, etc. are mentioned. Although the kind of base material used for a printed wiring board is not limited, An insulating base material containing reinforcing materials, such as glass cloth, is preferred from a viewpoint of controlling modification (dimensional change) by pressurization heating at the time of lamination. From the same viewpoint, as a substrate, a substrate of FR (Flame Retardant) -5 grade of NEMA (National Electrical Manufacturers Association) standard, a substrate having a high glass transition temperature (for example, a substrate containing a polyimide resin etc.) Is preferred.

The substrate 10 has a plurality of through holes 12a to 12d penetrating the substrate 10 in the thickness direction of the substrate 10, and has conductor portions (vias) 14a to 14d disposed on the inner walls of the through holes 12a to 12d. doing. The conductor portions 14a to 14d extend from the end of the through holes 12a to 12d on the substrate 20 side to the end of the through holes 12a to 12d opposite to the substrate 20 along the axial direction of the through holes. The substrate 20 has a plurality of through holes 22a to 22d penetrating the substrate 20 in the thickness direction of the substrate 20, and has conductor portions (vias) 24a to 24d disposed on the inner walls of the through holes 22a to 22d. doing. The conductor portions 24a to 24d extend from the end of the through holes 22a to 22d on the substrate 10 side to the end of the through holes 22a to 22d opposite to the substrate 10 along the axial direction of the through holes. The substrate 10 and the substrate 20 have a through hole structure. The through holes 12a to 12d and the through holes 22a to 22d are formed at positions opposed to each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20.

In the laminate 100, a through hole 12a (first through hole) penetrating the substrate 10 in the thickness direction of the substrate 10 and a through hole 22a (second through hole) penetrating the substrate 20 in the thickness direction of the substrate 20 The through holes 32 a penetrating the insulating member 30 in the thickness direction of the insulating member 30 form the through holes 100 a penetrating the stacked body 100 in the thickness direction of the stacked body 100. The through holes 12b penetrating the substrate 10, the through holes 22b penetrating the substrate 20, and the through holes 32b penetrating the insulating member 30 form the through holes 100b penetrating the laminate 100 in the thickness direction of the laminate 100. doing. The through holes 12a, 12b, 22a, 22b have a hollow central portion in the radial direction. A hole filling resin 40 is filled in a space other than the space occupied by the conductor portions 14c, 14d, 24c, 24d in the through holes 12c, 12d, 22c, 22d. As the hole filling resin 40, trade name: THP-100 DX1 manufactured by Taiyo Ink Mfg. Co., Ltd., trade name: AE1244 manufactured by Tatsuta Electric Wire Co., Ltd., etc. can be used.

The through holes 12 a and the through holes 22 a constituting the through holes 100 a are formed at positions overlapping with each other in the stacking direction of the substrate 10, the insulating member 30 and the substrate 20. The through holes 12 b and the through holes 22 b constituting the through holes 100 b are formed at positions overlapping with each other in the stacking direction of the substrate 10, the insulating member 30 and the substrate 20. When the through holes of the substrate 10 and the through holes of the substrate 20 are formed at mutually overlapping positions in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20, the central axes of both through holes may be the same axis. , May not be the same axis. At positions where the through holes penetrating through the laminated body 100 are not formed, the through holes of the substrate 10 and the through holes of the substrate 20 are formed at overlapping positions in the stacking direction of the substrate 10, the insulating member 30 and the substrate 20. It may be formed in the position which does not overlap mutually.

In the main surface (first main surface) 10a of the substrate 10 facing the substrate 20, surface electrodes (first surface electrodes, lands) 16a are disposed at positions different from the positions where the through holes 12a are formed. The surface electrode 16a is disposed at a position adjacent to the formation position of the through hole 12a in the main surface 10a. The surface electrode 16a is in contact with the conductor portion 14a in the through hole 12a, and is electrically connected to the conductor portion 14a. In the main surface (second main surface) 20a of the substrate 20 facing the substrate 10, surface electrodes (second surface electrodes, lands) 26a are disposed at positions different from the positions where the through holes 22a are formed. The surface electrode 26a is disposed at a position adjacent to the formation position of the through hole 22a in the main surface 20a. The surface electrode 26a is in contact with the conductor portion 24a in the through hole 22a, and is electrically connected to the conductor portion 24a.

In main surface 10a, surface electrode 16b is disposed at a position different from the formation position of through hole 12b. Surface electrodes (pads) 16c and 16d are disposed at positions where the through holes 12c and 12d are formed on the main surface 10a. In the main surface 20a, the surface electrode 26b is disposed at a position different from the position where the through hole 22b is formed. Surface electrodes (pads) 26c and 26d are disposed at positions where the through holes 22c and 22d are formed in the main surface 20a. When the hole filling resin 40 is filled in the through holes 12c, 12d, 22c, 22d, the surface electrodes 16c, 16d, 26c, 26d can be easily formed at the formation positions of the through holes 12c, 12d, 22c, 22d. Further, since the surface electrodes 16c, 16d, 26c, 26d are easily brought into contact with the conductive members (for example, the conductive members 50c described later) electrically connected to the conductor portions 14c, 14d, 24c, 24d, the surface electrodes 16c , 16d, 26c, and 26d, electrical connection between the conductor portions 14c, 14d, 24c, and 24d and the conductive member can be easily obtained.

In the laminate 100, the end of the through hole (for example, the through hole 12a) of the substrate 10 on the opposite side to the substrate 20 (the opposite side to the main surface 10a) and the through hole for the substrate 20 (for example, the through hole 22a) The end of the substrate 10 opposite to the substrate 10 (opposite to the main surface 20a) is at least a conductor (for example, the conductor 14a (first conductor)) of the substrate 10 and a surface electrode of the substrate 10 (For example, the surface electrode 16a), the surface electrode of the substrate 20 (for example, the surface electrode 26a), and the conductor portion of the substrate 20 (for example, the conductor portion 24a (second conductor portion)) It is done. The surface electrode 16a and the surface electrode 26a are electrically connected to each other by the conductive member 50a disposed between the surface electrode 16a and the surface electrode 26a. The surface electrode 16c and the surface electrode 26c are electrically connected to each other by a conductive member 50c disposed between the surface electrode 16c and the surface electrode 26c. The front surface electrode 16d and the front surface electrode 26d do not have a conductive member disposed between the front surface electrode 16d and the front surface electrode 26d, and the insulating member 30 is interposed between the front surface electrode 16d and the front surface electrode 26d. Not connected to.

The conductive material used for the conductive members (for example, the conductive members 50a and 50c) is not limited as long as it has conductivity, and is melted at a general lamination temperature (200 ° C. or less) in the printed wiring board A material having a re-melting temperature of 250 ° C. or higher after formation of an interbonding is preferred. Examples of the conductive material include copper, tin alloy and the like. The conductive material contains, for example, at least one of copper particles and metal-coated copper particles (eg, copper particles coated with silver, gold or tin) as the first metal, and tin as the second metal. It is preferable to contain at least one metal selected from the group consisting of bismuth, silver, zinc and palladium. The second metal preferably forms an intermetallic compound with the first metal. In this case, the second metal preferably contains at least tin. A conductive paste can be used as the conductive member. As the conductive member, trade name: HT-710 manufactured by ORMET, trade name: MPA 500 manufactured by Tatsuta Electric Wire Co., Ltd., etc. may be mentioned.

In order to protect the surface of the surface electrode, the surface of the substrate may be subjected to surface treatment (surface finish). The surface treatment is preferably gold plating. Depending on the type of material of the surface electrode (for example, copper), when left in the atmosphere, an oxide film (for example, a copper oxide film) may be formed on the surface to reduce the connectivity between the surface electrode and the conductive member. In this case, oxidation protection of the surface electrode can be easily suppressed by protecting the surface of the surface electrode by gold plating or the like.

The insulating member 30 is not particularly limited as long as it has an insulating property. For example, a film having an insulating property can be used as the insulating member 30. The insulating material of the insulating member 30 is made of, for example, a resin composition. The resin composition preferably contains a resin (polymer), and more preferably contains a thermosetting resin, from the viewpoint of easily controlling the flowability. As a thermosetting resin, an epoxy resin, a phenol resin, a polyimide resin etc. are mentioned.

When the resin composition contains a thermosetting resin, the glass transition temperature of the cured product (thermally cured product) is preferably 150 ° C. or higher, and more preferably 180 ° C. or higher, from the viewpoint of improving the reflow resistance during component mounting. . When the resin composition contains a thermosetting resin, the resin composition preferably contains particles such as a filler as a reinforcing material from the viewpoint of suppressing the coefficient of thermal expansion of the cured product.

The glass transition temperature can be measured by the following method.
(Sample preparation method)
The thermosetting resin composition was applied onto a release PET (polyethylene terephtalate) film (manufactured by Teijin DuPont Films, trade name: A-53) using an applicator so that the thickness after drying was 100 μm. After that, a semi-cured film is produced by drying at a temperature of 130 ° C. for 30 minutes. Next, the semi-cured film is peeled off from the release PET film. Then, after fixing the film by sandwiching the semi-cured film between two metal frames, a film composed of a thermosetting resin composition cured by drying under the conditions of a temperature of 185 ° C. and a time of 60 minutes. Make
(Measuring method)
Fixture made by TA Instruments, device name: TMA-2940, jig: tension, distance between chucks: 15 mm, measurement temperature: room temperature to 350 ° C., temperature rise temperature: 10 ° C./min, tensile load: 5 gf, sample Size: Measured under the condition of width 5 mm × length 25 mm, and the glass transition temperature is determined by the tangent method from the obtained temperature-displacement curve.

Examples of the insulating material of the insulating member 30 include a trade name: AS-401HS manufactured by Hitachi Chemical Co., Ltd., and a trade name: AS-9500 manufactured by Hitachi Chemical Co., Ltd. When using a non-woven fabric made of glass fiber or carbon fiber, or an insulating material containing glass cloth or carbon cloth, the height of the surface electrode is likely to vary from surface to surface electrode due to the difference in the thickness of the non-woven fabric or cloth. The resistance may be unstable. Therefore, the insulating material may not contain non-woven fabric made of glass fiber or carbon fiber, glass cloth / carbon cloth or the like.

In the laminate according to the present embodiment, the substrate is a through hole (for example, the above-mentioned through holes 12a, 12b) which constitutes a through hole which penetrates the laminate (for example, the through holes 100a, 100b which penetrate the above-mentioned laminate 100) , 22a, 22b). Only one through hole may be formed through the laminate, or a plurality of through holes may be formed. Only one through hole forming a through hole penetrating the laminated body may be formed in each substrate, or a plurality of through holes may be formed in at least one of the substrates.

In the layered product concerning this embodiment, a substrate may have a penetration hole which does not constitute a penetration hole which penetrates a layered product. For example, as in the above-described laminated body 100, the substrate 10 may have through holes 12c and 12d (third through holes) in addition to the through holes 12a as the through holes penetrating the substrate 10. In addition to the through holes 22a, the substrate 20 may have through holes 22c and 22d (fourth through holes) as the through holes penetrating the substrate 20. The through holes 12 c, 12 d, 22 c, 22 d do not constitute through holes penetrating the laminated body 100. The through holes 12 c and 12 d and the through holes 22 c and 22 d are formed at positions opposed to each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20.

The substrate 10 has conductor portions 14c and 14d (third conductor portions) disposed on the inner walls of the through holes 12c and 12d. The surface electrodes 16c and 16d (third surface electrodes) are disposed on the main surface 10a of the substrate 10, and the surface electrodes 16c and 16d are disposed at positions where the through holes 12c and 12d are formed on the main surface 10a. There is. The substrate 20 has conductor portions 24c and 24d (fourth conductor portions) disposed on the inner walls of the through holes 22c and 22d. The surface electrodes 26c and 26d (fourth surface electrodes) are disposed on the main surface 20a of the substrate 20, and the surface electrodes 26c and 26d are disposed at positions where the through holes 22c and 22d are formed in the main surface 20a. There is. A mode (a mode of surface electrodes 16c and 26c) where surface electrodes arranged in a formation position of a through hole which does not constitute a through hole which penetrates a layered product are electrically connected with each other by a conductive member arranged between the surface electrodes Or a mode in which the conductive member is not disposed between the surface electrodes (a mode of the surface electrodes 16d and 26d). In the aspect in which the conductive member is not disposed between the surface electrodes, the insulating member 30 is interposed between the surface electrodes.

The example shown in FIG. 2 is mentioned as another example of the through-hole which does not comprise the through-hole which penetrates a laminated body. In FIG. 2, the through holes 12c and the through holes 22c are formed at positions where they do not overlap each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20, and the surface electrodes 16c form the through holes 12c in the main surface 10a. It is arrange | positioned in the position and the surface electrode 26c is arrange | positioned in the position which opposes the surface electrode 16c in the main surface 20a. The surface electrodes 16c and 26c may be electrically connected to each other by the conductive member 50c disposed between the surface electrodes 16c and 26c (FIG. 2A), and between the surface electrodes 16c and 26c. The aspect (FIG.2 (b)) in which the electrically-conductive member is not arrange | positioned may be sufficient.

The layered product concerning this embodiment can be obtained by the manufacturing method of the layered product concerning this embodiment. In the method of manufacturing a laminate according to the present embodiment, a first through hole penetrating the first substrate is formed in the first substrate, and a second through hole penetrating the second substrate is the second substrate Forming a through hole in the insulating member in a state where the insulating member is disposed between the first substrate and the second substrate, the first through hole, the second through hole, and the insulating The through-hole formation process of forming the through-hole which penetrates a laminated body by the through-hole of a member is provided.

The method of manufacturing a laminate according to the present embodiment includes, for example, a substrate preparation step, a conductor portion formation step, a surface electrode formation step, a lamination step, and a through hole formation step in this order.

The substrate preparation step is a step of preparing a substrate (a first substrate and a second substrate) having through holes penetrating the substrate in the thickness direction of the substrate. As a formation method of a penetration hole, the same method (for example, drilling) as a formation method of a penetration hole of an insulating member mentioned below can be used.

The conductor portion forming step is a step of forming the conductor portion on the inner wall of the through hole of the substrate (the first substrate and the second substrate). The conductor portion can be formed by plating, for example. In the conductor portion forming step, after forming the conductor portion, the insulating material may be filled in the through hole which does not constitute the through hole penetrating the laminated body.

The surface electrode forming step is a step of forming the surface electrode on the main surface of the substrate (the first substrate and the second substrate) at a position different from the formation position of the through hole forming the through hole penetrating the laminated body. is there. In the front surface electrode forming step, the front surface electrode can be formed at a position adjacent to the formation position of the through hole forming the through hole penetrating the laminated body. Further, the surface electrode can be formed to be in contact with the conductor portion in the through hole of the substrate. The surface electrode can be formed, for example, by etching a metal layer (for example, copper foil) disposed on the main surface of the substrate. The metal layer can be formed, for example, by plating. In the front surface electrode forming step, the front surface electrode may be further formed on the main surface of the substrate at the formation position of the through hole which does not constitute the through hole penetrating the laminated body.

The laminating step is a step of laminating the first substrate and the second substrate through the insulating member. In the stacking step, the first substrate and the second substrate can be stacked via the insulating member and the conductive member. In order to electrically connect the surface electrode of the first substrate and the surface electrode of the second substrate, the substrates can be stacked in a state where these surface electrodes face each other to perform heating and pressing.

When laminating the substrates, from the viewpoint of accurate alignment, the alignment alignment pins are inserted into the through holes (alignment through holes) provided for inserting the pins to align the substrates. Is preferred. The stacking alignment pin may be inserted into only one through hole or may be inserted into a plurality of through holes.

In the laminating step, in order to electrically connect the surface electrodes disposed on the main surface of the substrate, through holes are formed at positions between the surface electrodes in the insulating member. The through hole may not be formed at a position where the surface electrodes in the insulating member are not electrically connected to each other, and the through hole may be formed. The formation method of the through-hole of an insulation member is not specifically limited, The formation method of the through-hole of the below-mentioned insulation member in a through-hole formation process can be used.

Preferably, a release film is disposed on the surface of the insulating member. In this case, adhesion of foreign matter to the surface of the insulating member can be prevented. Furthermore, the release film plays a role as a protective film for protecting the surface of the insulating member when the conductive member (for example, conductive paste) is supplied in a later step, and is matched to the supply position of the conductive member. Since it is not necessary to prepare an open protective mask, the manufacturing cost of the laminate can be reduced. As the release film, for example, a single-side release-treated PET film (for example, trade name: A-31) manufactured by Teijin DuPont Co., Ltd. may be mentioned. When laminating the substrates, the release film is peeled off.

After forming the through holes in the insulating member, the insulating member is bonded (laminated) to the main surface of the substrate. Next, when connecting surface electrodes with a conductive member, the conductive member is filled in the through hole of the insulating member. The conductive member filled in the through hole is in contact with the surface electrode. The conductive member may be filled in the through hole after laminating the substrate and the insulating member, or may be filled in the through hole before lamination. For example, after the insulating member is attached to the first substrate, the through hole can be filled with the conductive member, and then the second substrate can be stacked over the first substrate and the insulating member. In the insulating member, when the opening is formed at the formation position of the through hole constituting the through hole penetrating the laminated body, the conductive member is disposed in the opening and the through hole constituting the through hole penetrating the laminated body In order to be an obstacle at the time of formation of a hole, it is preferable that an opening is not formed in a formation position of a penetration hole which constitutes a penetration hole which penetrates a layered product.

As a method of supplying the conductive member, for example, a method of disposing a conductive paste by a screen printing method, a dispenser method or the like can be mentioned. As the conductive paste, for example, there is a material in which viscosity is maintained by mixing a metal material with a binder resin to facilitate screen printing, dispenser processing, and the like. When using such a conductive paste, it is preferable to increase the viscosity of the conductive paste by performing pre-curing of the binder resin by performing heat treatment after disposing the conductive paste, from the viewpoint of maintaining the shape of the conductive member. In this case, the heat treatment can be performed at a temperature of 70 to 150 ° C. for a time of 10 to 120 minutes. When the temperature is 70 ° C. or more or the time is 10 minutes or more, the viscosity is easily increased sufficiently, and the shape of the conductive paste is easily maintained. When the temperature is 150 ° C. or less or the time is 120 minutes or less, the viscosity is excessively increased and / or the curing of the binder resin is easily suppressed, and the conductive paste is sufficiently melted Intermetallic compounds are easily formed. By maintaining the shape of the conductive member, it is easy to ensure sufficient connectivity.

In the through hole forming step, a first through hole penetrating the first substrate is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is formed. A through hole is formed in the insulating member in a state of being disposed between the first substrate and the second substrate, and the first through hole, the second through hole, and the through hole of the insulating member are formed. , Forming a through hole penetrating the laminated body. The through hole of the insulating member can be formed by processing a portion of the insulating member exposed from the through hole through the first through hole or the second through hole.

The formation method of the through-hole of an insulation member is not specifically limited. The through holes may be formed by physical treatment or may be formed by chemical treatment. Examples of physical processing include laser processing (laser irradiation), drill processing (cutting processing), punching processing and the like. Examples of the chemical treatment include chemical treatment and the like. In the drilling process, the conductor in the through hole of the substrate may be scraped off. When the insulating material is dissolved by chemical treatment to form the through holes, a release film (for example, a PET film) or the like is preferably attached in order to suppress adhesion of the chemical solution on the substrate surface. In the case of using laser processing, since processing is performed by irradiating a laser, damage to the conductor portion can be easily suppressed regardless of the hole diameter or the drill diameter, as compared with cutting processing using a drill or the like. Therefore, laser processing is preferable as a method of forming the through holes of the insulating member.

Examples of the laser in laser processing include a CO ₂ laser, a UV laser, a YAG laser, a UV-YAG laser and the like. Although the laser wavelength of the CO ₂ laser is 9400 nm, the laser wavelength of the UV-YAG laser is 355 nm, and although the UV-YAG laser is superior in small diameter processing, the current mass production processing is possible even using the CO ₂ laser. In the above, holes having a diameter of 50 μm or more can be formed. Further, since the CO ₂ laser output is greater than 10 times than the output of the UV laser, CO ₂ laser of production efficiency is higher than UV laser. Therefore, a CO ₂ laser is preferable as the laser.

Hereinafter, the manufacturing method of the laminated body 100 of FIG. 1 is demonstrated as an example using FIG.3 and FIG.4. FIG.3 and FIG.4 is a schematic sectional drawing which shows the manufacturing method of the laminated body which concerns on this embodiment.

First, as shown in FIG. 3A, the substrate 10 having the through holes 12a to 12d penetrating the substrate 10 in the thickness direction of the substrate 10 is prepared. The substrate 10 has a main surface 10 a that is to be opposed to the substrate (substrate 20) to be stacked on the substrate 10.

Next, as shown in FIG. 3B, the conductor portions 14a to 14d are formed on the inner walls of the through holes 12a to 12d of the substrate 10. Subsequently, the through holes 12c and 12d are filled with an insulating material. Then, on the main surface 10a of the substrate 10, the surface electrodes 16a and 16b are formed at positions different from the formation positions of the through holes 12a and 12b constituting the through holes 100a and 100b penetrating the laminated body 100. Further, on the main surface 10a of the substrate 10, the surface electrodes 16c and 16d are formed at the formation positions of the through holes 12c and 12d which do not constitute the through holes penetrating the stacked body 100.

Furthermore, as a substrate to be stacked on the substrate 10, a substrate 20 having the same configuration as the substrate 10 is prepared.

Next, as shown in FIG. 4A, the insulating member 30 having a through hole formed at a position corresponding to the arrangement position of the surface electrodes 16a and 16c of the substrate 10 is prepared. Subsequently, the insulating member 30 is attached to the major surface 10 a of the substrate 10 and then heated and pressurized. Then, the through holes of the insulating member 30 are filled with the conductive members 50a and 50c to bring the surface electrode 16a and the conductive member 50a into contact with each other, and to bring the surface electrode 16c into contact with the conductive member 50c. Furthermore, after the insulating member 30 is attached to the major surface 20 a of the substrate 20 on which the surface electrodes 26 a to 26 d are disposed such that the surface electrodes 26 a to 26 d of the substrate 20 face the surface electrodes 16 a to 16 d of the substrate 10, heating is performed. Pressurize. In this case, the insulating member 30 is disposed at a position between the through hole 12a and the through hole 22a, a position between the through hole 12b and the through hole 22b, and a position between the through hole 12d and the through hole 22d. It is done.

Next, as shown in FIG. 4B, the through hole 32a is formed in the portion between the through hole 12a and the through hole 22a in the insulating member 30, whereby the through hole 12a, the through hole 22a and the through hole 32a are formed. Thus, the through holes 100 a penetrating the stacked body 100 are formed. In addition, by forming through holes 32 b in the portion between the through holes 12 b and the through holes 22 b in the insulating member 30, the through holes 100 b penetrate the laminate 100 by the through holes 12 b, the through holes 22 b and the through holes 32 b. Form By the above, the laminated body 100 of FIG. 1 can be obtained.

According to the method of manufacturing the laminate 100 according to the present embodiment, the through holes 12a and 12b penetrating the substrate 10 are formed in the substrate 10, and the through holes 22a and 22b penetrating the substrate 20 are formed in the substrate 20 The through holes 32a and 32b are formed in the insulating member 30 in a state where the member 30 is disposed between the substrate 10 and the substrate 20, and the through holes 12a and 12b, the through holes 22a and 22b, and the through holes 32a and 32b. The through holes 100 a and 100 b penetrating the stacked body 100 are formed. In this case, when performing the operation of forming the through holes 100 a and 100 b penetrating the stacked body 100, the through holes 12 a, 12 b, 22 a and 22 b are formed in advance in the substrate 10 and the substrate 20. In addition, it is not necessary to form through holes in the substrate 10 and the substrate 20. Therefore, while being able to simplify the manufacturing process of a laminated body, it can suppress that the manufacturing cost of a laminated body becomes high. Therefore, according to the method of manufacturing the laminated body 100 according to the present embodiment, the laminated body 100 capable of mounting a pin insertion type component can be efficiently obtained.

According to the method of manufacturing the laminate 100 according to the present embodiment, even when the substrate is thick, through holes can be formed through the laminate using a small-diameter drill. In addition, even when the substrate is thick, since the conductor portion is formed on the substrate in advance before stacking the plurality of substrates, it is not necessary to consider the roundness of plating after the substrates are stacked. Since the diameter of the holes can be easily reduced by these, the distance between the through holes formed in the substrate can be increased. In this case, the number of signal lines can be increased, and the signal lines can be easily routed.

In the method of manufacturing the laminate 100 according to the present embodiment, the end of the through hole 12a on the opposite side to the substrate 20 and the end of the 22a through hole on the opposite side to the substrate 10 have the conductor portion 14a and the surface. By electrically connecting the electrode 16a, the conductive member 50a, the surface electrode 16b, and the conductor portion 24a, both surfaces of the laminate 100 can be electrically connected.

According to this embodiment, it is possible to obtain a laminate excellent in connection reliability. In addition, even when the thickness of the substrate is large, it is possible to efficiently obtain a laminate capable of mounting a pin insertion type component.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, the number of laminated layers of the substrate is not particularly limited, and may be three or more. In a laminate of three or more layers, a through hole may be formed so as to penetrate the whole of the multilayer structure from one surface to multiple areas of the multilayer structure of two or more layers; The through hole penetrating through the above may not be formed. In the case where a through hole penetrating the entire laminate is formed, it is easy to suppress the liquid from remaining in the through hole even when the treatment using a liquid is performed on the laminate.

Example 1
A wiring circuit is formed on both sides of an epoxy resin copper clad laminate (made by Hitachi Chemical Co., Ltd., trade name: MCL-E-679) with a resin layer thickness of 0.10 mm, a copper foil thickness of 18 μm, and a size of 660 mm × 615 mm. Ten inner layer substrates were produced.

Next, 20 sheets of prepreg A (manufactured by Hitachi Chemical Co., Ltd., trade name: GEA-679) having a resin layer thickness of 0.1 mm and a size of 660 mm × 615 mm were prepared. Subsequently, alignment between the inner layer substrates was performed by a pin lamination method. Then, one inner layer substrate and two prepregs A were alternately arranged, and one prepreg B (a prepreg similar to the prepreg A) was arranged on the further outside of the inner layer substrate arranged at the outermost side. Furthermore, an electrolytic copper foil (manufactured by Nippon Electrolytic Co., Ltd., trade name: YGP-18) having a thickness of 18 μm and a size of 660 mm × 615 mm is disposed on the prepreg B, and heating and pressing are performed with a vacuum press machine Turned After the heating and pressure pressing, in order to remove the resin of the prepreg that has run out to the end face, the substrate was cut into a substrate size of 605 mm × 500 mm to obtain a structure A with a thickness of 3.00 mm.

Next, using an NC control drilling machine, drilling was performed according to the inner layer position of the structure A with a drill having a diameter of 0.65 mm to form a through hole (diameter: 0.65 mm).

Next, after removing the smear in the holes by permanganic acid treatment, a plated layer (conductor portion) with a thickness of 25 μm was formed using thick electroless copper plating.

Next, a hole-filling resin (manufactured by Taiyo Ink Mfg. Co., Ltd., trade name: THP-100DX1) was prepared as a non-conductive material, and then resin filling was performed by a screen printing method using a vacuum printing machine. At this time, resin filling is not performed in the through holes that form through holes that penetrate the multilayer wiring board (the laminate finally obtained), and the through holes that do not form through holes that penetrate the multilayer wiring board went. Next, the entire main surface of the substrate including the resin-filled portion was thickened and electroless copper plating was performed to form a copper layer having a thickness of 15 μm. Next, by etching the copper layer by the tenting method, the surface electrode A disposed at the position adjacent to the formation position of the through hole constituting the through hole penetrating the multilayer wiring board in the substrate, and the resin was embedded Two printed wiring boards having a surface electrode B (lid plating) disposed at a location were produced.

Next, an insulation comprising a resin layer (nominal thickness: 0.075 mm) made of a resin composition containing a thermosetting resin, and a PET film (thickness: 0.025 mm) disposed on one side of the resin layer The surface electrodes are electrically connected to each other (Hitachi Chemical Co., Ltd., trade name: AS-401HS, size 605 mm × 500 mm) using a drill with a diameter of 0.55 mm using an NC control drilling machine. A through hole was formed at the position where the conductive member for the Furthermore, through holes were formed at positions where pins for holding the layers were placed at the time of stacking.

Next, the insulating member was placed on one surface of the first printed wiring board so that the resin layer of the insulating member was in contact with the first printed wiring board and the surface electrode was exposed from the through hole of the insulating member. Subsequently, using a vacuum laminator, heating and pressing were performed under the conditions of a temperature of 85 ° C., a pressure of 0.5 MPa, and a pressurization time of 30 seconds (vacuum evacuation for 30 seconds).

Next, a conductive material (product name: MPA500, manufactured by Tatsuta Electric Wire Co., Ltd.) was filled in the through hole of the insulating member to which the surface electrode to be electrically connected was exposed. The number of holes filled was 12000. At this time, the PET film disposed on the surface of the insulating member serves as a protective mask, the MPA 500 is supplied only in the through holes of the insulating member, and the MPA 500 is prevented from adhering to other places in the insulating member.

Next, the PET film disposed on the surface of the insulating member was peeled off from the insulating member. Subsequently, pins are inserted into the through holes of the first printed wiring board for alignment, and then the second printed wiring board is stacked on the insulating member, and then the temperature is 180 ° C. and the pressure is 3 MPa with a vacuum press. Heat and pressure were applied under the press conditions of 90 minutes for time to produce a structure B. Under the present circumstances, printed wiring boards were piled up so that the surface electrode of the 1st printed wiring board and the surface electrode of the 2nd printed wiring board might face.

Next, laser irradiation was performed on a portion of the insulating member exposed from the through hole of the printed wiring board using a laser drilling machine (CO ₂ laser) to form a through hole (diameter 0.55 mm) in the insulating member. Laser irradiation was performed under the conditions of an output of 6.0 W, a cycle of 1.0 ms, a pulse width of 30 μs, and a shot number of 20 times. As a result, the part located between the through holes of the two printed wiring boards in the insulating member was removed, and a multilayer wiring board (laminate) having through holes penetrating the multilayer wiring board was obtained.

(Example 2)
After manufacturing the structure B in the same manner as in Example 1, a through hole (diameter 0) is formed in a portion exposed from the through hole of the printed wiring board in the insulating member with a drill with a diameter of 0.45 mm using an NC control drilling machine. By forming the .45 mm) as an insulating member, a multilayer wiring board (laminated body) having through holes penetrating the multilayer wiring board was obtained.

DESCRIPTION OF SYMBOLS 10, 20 ... Board | substrate, 10a, 20a ... Principal surface, 12a-12d, 22a-22d, 32a-32b ... Through-hole, 14a-14d, 24a-24d ... Conductor part 16a-16d, 26a-26d ... Surface electrode, DESCRIPTION OF SYMBOLS 30 ... Insulation member, 40 ... Hole-filling resin, 50a, 50c ... Conductive member, 100 ... Laminated body, 100a, 100b ... Through-hole.

Claims (12)

1. A method of manufacturing a laminate having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate,
   A first through hole penetrating the first substrate is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is A through hole is formed in the insulating member in a state of being disposed between the first substrate and the second substrate, and the first through hole, the second through hole, and the insulating member Forming a through hole penetrating the laminate with the through hole of
   The first substrate has a first conductor portion disposed on an inner wall of the first through hole;
   The second substrate has a second conductor portion disposed on the inner wall of the second through hole;
   A first surface electrode is disposed at a position different from the position where the first through hole is formed on a first main surface of the first substrate facing the second substrate,
   In the second main surface of the second substrate facing the first substrate, the second surface electrode is disposed at a position different from the position where the second through hole is formed,
   An end of the first through hole opposite to the second substrate and an end of the second through hole opposite to the first substrate are the first conductor portion. A manufacturing method of a layered product electrically connected via said 1st surface electrode, said 2nd surface electrode, and said 2nd conductor part.
2. The manufacturing method of the laminated body of Claim 1 which forms the said through-hole of the said insulation member by laser processing.
3. The manufacturing method of the laminated body of Claim 1 which forms the said through-hole of the said insulation member by drilling.
4. A laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate,
   A first through hole passing through the first substrate, a second through hole passing through the second substrate, and a through hole passing through the insulating member are through holes passing through the laminate. Have configured
   The first substrate has a first conductor portion disposed on an inner wall of the first through hole;
   The second substrate has a second conductor portion disposed on the inner wall of the second through hole;
   A first surface electrode is disposed at a position different from the position where the first through hole is formed on a first main surface of the first substrate facing the second substrate,
   In the second main surface of the second substrate facing the first substrate, the second surface electrode is disposed at a position different from the position where the second through hole is formed,
   An end of the first through hole opposite to the second substrate and an end of the second through hole opposite to the first substrate are the first conductor portion. A stacked body electrically connected via the first surface electrode, the second surface electrode, and the second conductor portion.
5. The first surface electrode and the second surface electrode are electrically connected to each other by a conductive member disposed between the first surface electrode and the second surface electrode. Description laminate.
6. A third through hole penetrating the first substrate is further formed in the first substrate,
   The first substrate further includes a third conductor portion disposed on the inner wall of the third through hole,
   A fourth through hole penetrating the second substrate is further formed in the second substrate,
   The second substrate further includes a fourth conductor portion disposed on the inner wall of the fourth through hole,
   A third surface electrode is disposed on the first main surface,
   The laminated body of Claim 4 or 5 in which the 4th surface electrode is arrange | positioned at the said 2nd main surface.
7. The third through hole and the fourth through hole are formed at positions overlapping with each other in the stacking direction of the first substrate, the insulating member, and the second substrate,
   The third surface electrode is disposed at a formation position of the third through hole in the first main surface,
   The layered product according to claim 6 in which said 4th surface electrode is arranged in a formation position of said 4th penetration hole in said 2nd principal surface.
8. The third through hole and the fourth through hole are formed at positions not overlapping with each other in the stacking direction of the first substrate, the insulating member, and the second substrate,
   The third surface electrode is disposed at a formation position of the third through hole in the first main surface,
   The layered product according to claim 6 in which said 4th surface electrode is arranged in a position which counters said 3rd surface electrode in said 2nd principal surface.
9. The third surface electrode and the fourth surface electrode are electrically connected to each other by a conductive member disposed between the third surface electrode and the fourth surface electrode. The laminated body as described in any one of 8.
10. The laminate according to any one of claims 6 to 8, wherein a conductive member is not disposed between the third surface electrode and the fourth surface electrode.
11. The laminate according to any one of claims 4 to 10, wherein a diameter of at least one of the first through hole and the second through hole is larger than a diameter of the through hole of the insulating member.
12. The laminate according to any one of claims 4 to 11, wherein a diameter of the first through hole and a diameter of the second through hole are larger than a diameter of the through hole of the insulating member.

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