TWI820073B - Laminated body and manufacturing method thereof - Google Patents

Abstract

A method for manufacturing a laminated body 100 having a laminated structure in which an insulating member 30 is interposed between a substrate 10 and a substrate 20 , the method comprising: converting a through hole penetrating through the substrate 10 The hole 12a is formed in the substrate 10, and the through-hole 22a penetrating the substrate 20 is formed in the substrate 20. In a state where the insulating member 30 is arranged between the substrate 10 and the substrate 20, the through-hole 32a is formed in the insulating member 30. hole 12a, through-hole 22a, and through-hole 32a to form a through-hole 100a that penetrates the laminated body 100. The substrate 10 has a conductor portion 14a disposed on the inner wall of the through-hole 12a, and the substrate 20 has an inner wall disposed on the through-hole 22a. The conductor portion 24a has a surface electrode 16a disposed at a position different from the formation position of the through hole 12a in the main surface 10a of the substrate 10 that faces the substrate 20, and in the main face 20a of the substrate 20 that faces the substrate 10 The surface electrode 26 a is arranged at a position different from the formation position of the through hole 22 a. The end of the through hole 12 a on the side opposite to the substrate 20 and the end of the through hole 22 a on the side opposite to the substrate 10 are connected via a conductor. The portion 14a, the surface electrode 16a, the surface electrode 26a and the conductor portion 24a are electrically connected.

Description

Laminated body and manufacturing method thereof

The present invention relates to a laminated body and a manufacturing method thereof.

A multilayer wiring board can be obtained, for example, by alternately laminating double-sided copper-clad laminates with circuits and an insulating adhesive to integrate them, and then placing the entire multilayer wiring board at the locations where connections are required. A through-hole is formed through the through-hole in the lamination direction, and a conductor is formed on the inner wall of the through-hole by metal plating to provide a through-hole that electrically connects both ends of the through-hole.

The through-via hole is formed across the entirety of the multilayer wiring board in the lamination direction. Therefore, in order to avoid electrical connection with the through-via hole, the circuit is arranged on the surface of the multi-layer wiring board so as to avoid the formation position of the through-via hole. pattern. Therefore, there is a limit to increasing the wiring density in the through-via structure.

The components packaged in the multilayer wiring board are mainly surface-mounted, so the connection portion used to connect the components to the multilayer wiring board is becoming smaller every year. As the density of components packaged in multilayer wiring boards increases, the number of packages is gradually increasing, which requires narrowing of the pitch of through-holes in multilayer wiring boards and an increase in the number of layers of wiring circuits. For example, a multilayer wiring board with interstitial via holes (IVH: non-through holes) is known, which is provided with through holes that penetrate the entire multilayer wiring board in the lamination direction. , a through-hole obtained by forming a conductor portion on the inner wall of the through-hole by metal plating. Compared with a multilayer wiring board having only through-holes, this multilayer wiring board can open holes with small diameters, making it easier to cope with narrower pitches.

Interlayer connection technology has been developed to cope with further densification. For example, it is known that after forming a build up layer on the surface of a wiring board, the inner walls of non-through holes provided by laser or the like are plated, and the two sides of the non-through holes are sequentially deposited as many layers as necessary. A build-up construction method for structures whose ends are electrically connected. Furthermore, as an interlayer connection technology other than the build-up method, a technology for manufacturing a multilayer wiring board using conductive paste, anisotropic conductive material, etc. as an interlayer connection member without using plating has been proposed.

For example, the following Patent Document 1 discloses that members, circuit boards, and the like filled with conductive paste in holes provided in thin prepregs are stacked together and then heated and pressurized to form a multilayer structure. patch panel method.

The following Patent Document 2 discloses a multilayer wiring board obtained by pressing an insulating material against bumps formed on a circuit board, copper foil, etc., so that the bumps are self-insulated. On the structure obtained by penetrating the material, a circuit board, copper foil, etc. are laminated, and then laminated by heating and pressure to integrate.

The following Patent Document 3 discloses that after forming mountain-shaped or substantially conical conductive bumps on a conductive plate, the insulating prepreg base material is heated to soften and pressed through, thereby forming a conductive bump including conductive bumps. Bump via method.

The following Patent Document 4 discloses that a plurality of members having conductive via holes penetrating through the thickness direction of the insulating member are laminated by filling holes provided in the hardened insulating member with a conductive paste. A method to form a multilayer circuit substrate. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 11-87870 [Patent Document 2] Japanese Patent Application Laid-Open No. 9-162553 [Patent Document 3] Japanese Patent Application Publication No. 2013-110230 [Patent Document 4] Japanese Patent Application Publication No. 2015-26689

[Problem to be solved by the invention] Examples of components packaged in a multilayer wiring board include pin insertion type (press fit pin type) components in which a pin is inserted and held in a through hole (through hole). In order to use pin insertion type components, through holes are required that penetrate a plurality of substrates in a multilayer wiring board.

After a multilayer wiring board is obtained by laminating (interlayer connection) a plurality of substrates, through holes can be provided in the multilayer wiring board. However, since multiple substrates need to be penetrated, there is a concern that the manufacturing steps of the multilayer wiring board will become longer and the multilayer wiring board will be multilayered. The manufacturing cost of wiring boards becomes higher, etc. Therefore, there is a demand for efficiently obtaining a laminate for use as a multilayer wiring board or for obtaining a multilayer wiring board that can package pin insertion type components.

The present invention has been made in view of the above-mentioned circumstances, and an object thereof is to provide a method for manufacturing a laminated body that can efficiently obtain a laminated body capable of encapsulating pin insertion type components. Moreover, an object of this invention is to provide the laminated body obtainable by the said manufacturing method. [Means to solve the problem]

A method for manufacturing a laminated body of the present invention is a method for manufacturing a laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate. The method for manufacturing a laminated body includes: A first through hole is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is disposed between the first substrate and the second substrate. In a state between the substrates, a through hole is formed in the insulating member, and a through hole penetrating the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member. hole step, the first substrate has a first conductor portion disposed on the inner wall of the first through hole, and the second substrate has a second conductor portion disposed on the inner wall of the second through hole, On the first main surface of the first substrate facing the second substrate, a first surface electrode is arranged at a position different from the formation position of the first through hole, and on the second substrate In the second main surface facing the first substrate, a second surface electrode is arranged at a position different from the formation position of the second through hole, and in the first through hole and the second surface electrode The end portion on the opposite side of the two substrates and the end portion of the second through hole on the opposite side to the first substrate pass through the first conductor portion, the first surface electrode, the second The surface electrode and the second conductor part are electrically connected.

According to the method for manufacturing a laminated body of the present invention, a first through hole penetrating the first substrate is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is disposed on the first substrate. In the state between the substrate and the second substrate, a through hole is formed in the insulating member, and a through hole penetrating the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member. In this case, when the operation of forming the through hole penetrating the laminated body is performed, the first substrate and the second substrate have the through hole formed in advance, so there is no need to form the through hole in the first substrate and the second substrate in addition to the insulating member. . Therefore, the manufacturing process of a laminated body can be simplified, and it can suppress that the manufacturing cost of a laminated body becomes high. Therefore, according to the manufacturing method of a laminated body of this invention, it is possible to efficiently obtain a laminated body capable of encapsulating pin insertion type components.

In addition, although it is possible to provide through-holes in the multilayer wiring board after laminating (interlayer connection) a plurality of substrates to obtain a multilayer wiring board, however, if the substrate is thick, it may be difficult to use a drill with a small diameter. There is a risk of machining (drill breakage), and there is a risk of plating uniformity (throwing power) of the conductor portion arranged on the inner wall of the through-hole. For example, when the aspect ratio of the through-hole exceeds 25, the plating Uniformity) may decrease. On the other hand, according to the method of manufacturing a laminated body of the present invention, even when the substrate is thick, a small-diameter drill can be used to form a through hole penetrating the laminated body. Furthermore, even when the substrate is thick, since the conductor portion is formed on the substrate in advance before stacking a plurality of substrates, there is no need to consider the uniformity of plating after stacking the substrates. According to this, the hole diameter can be easily reduced, so the distance between the through holes formed in the substrate can be increased. In this case, it is possible to increase the number of signal lines and the like, and it is also easy to route the signal lines.

The manufacturing method of the laminated body of this invention may be a form which forms the said through hole of the said insulating member by laser processing. The manufacturing method of the laminated body of this invention may be a form which forms the said through hole of the said insulating member by drilling processing.

The laminated body of the present invention has a laminated structure in which an insulating member is interposed between a first substrate and a second substrate, wherein a first through hole penetrating the first substrate, a second through hole penetrating the second substrate, and a through hole are formed. The through-hole of the insulating member constitutes a through-hole penetrating the laminated body, the first substrate has a first conductor portion arranged on an inner wall of the first through-hole, and the second substrate has a first conductor portion arranged on the inner wall of the first through-hole. The second conductor portion of the inner wall of the second through hole is at a position different from the formation position of the first through hole on the first main surface of the first substrate that faces the second substrate. A first surface electrode is arranged, and a second surface electrode is arranged on a second main surface of the second substrate facing the first substrate at a position different from the formation position of the second through hole. , the end of the first through hole on the opposite side to the second substrate and the end of the second through hole on the opposite side to the first substrate pass through the first conductor part, the first surface electrode, the second surface electrode and the second conductor part are electrically connected.

The first surface electrode and the second surface electrode may also be electrically connected to each other through a conductive member disposed between the first surface electrode and the second surface electrode.

The laminate of the present invention may be in a form in which a third through hole penetrating the first substrate is formed in the first substrate, and the first substrate further has an inner wall arranged in the third through hole. a third conductor portion, a fourth through hole penetrating the second substrate is formed in the second substrate, and the second substrate further has a fourth conductor portion disposed on an inner wall of the fourth through hole , a third surface electrode is arranged on the first main surface, and a fourth surface electrode is arranged on the second main surface.

The laminate of the present invention may have a form in which the third through hole and the fourth through-hole are formed at positions where the first substrate, the insulating member, and the second substrate overlap each other in the lamination direction. through hole, the third surface electrode is arranged at the formation position of the third through hole in the first main surface, and the fourth surface electrode is arranged at the fourth through hole in the second main surface The location where the hole is formed.

The laminate of the present invention may have a form in which the third through hole and the third through hole are formed at positions where the first substrate, the insulating member, and the second substrate do not overlap with each other in the lamination direction. Four through holes, the third surface electrode is arranged at the formation position of the third through hole in the first main surface, and the fourth surface electrode is arranged in the second main surface at the position where the third through hole is formed. The positions where the three surface electrodes face each other.

Alternatively, the third surface electrode and the fourth surface electrode may be electrically connected to each other through a conductive member disposed between the third surface electrode and the fourth surface electrode.

The laminate of the present invention may have a form in which a conductive member is not disposed between the third surface electrode and the fourth surface electrode.

The diameter of at least one of the first through hole and the second through hole may be larger than the diameter of the through hole of the insulating member.

The diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member.

[Effects of the invention] According to the present invention, a laminated body capable of encapsulating pin insertion type components can be obtained efficiently and easily. According to the present invention, the degree of freedom in designing the laminate and the degree of freedom in forming through-holes can be improved.

Hereinafter, embodiments of the present invention will be described with appropriate reference to the drawings. However, the present invention is not limited to the following embodiments. The sizes of the constituent elements in each drawing are conceptual, and the relative size relationship between the constituent elements is not limited to what is shown in each drawing.

The laminated body of this embodiment has a laminated structure in which an insulating member is interposed between a first substrate and a second substrate, wherein a first through hole penetrating the first substrate, a second through hole penetrating the second substrate, and an insulating member penetrating The through-hole constitutes a through-hole that penetrates the laminated body. The first substrate has a first conductor portion arranged on the inner wall of the first through-hole. The second substrate has a second conductor portion arranged on the inner wall of the second through-hole. In the third through-hole, On the first main surface of the first substrate facing the second substrate, a first surface electrode is arranged at a position different from the formation position of the first through hole, and on the second main surface of the second substrate facing the first substrate On the main surface, a second surface electrode is arranged at a position different from the position where the second through hole is formed, and the end of the first through hole on the side opposite to the second substrate is the same as the end of the second through hole on the side opposite to the second substrate. The end portion on the opposite side of a substrate is electrically connected through the first conductor portion, the first surface electrode, the second surface electrode and the second conductor portion.

The diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate (the diameter in the direction orthogonal to the thickness direction of the substrate) may be 0.1 mm or more, may be 0.2 mm or more, or may be 0.3 mm or more, can be 0.4 mm or more, can be 0.5 mm or more. The diameter of the through hole of the substrate (the first substrate and/or the second substrate) may be 5 mm or less, may be 3 mm or less, or may be 1 mm or less. The diameter of the through hole of the first substrate and the diameter of the through hole of the second substrate may be the same as or different from each other.

The diameter of the through hole of the insulating member (the diameter in the direction orthogonal to the thickness direction of the insulating member) may be 0.1 mm or more, may be 0.2 mm or more, may be 0.3 mm or more, may be 0.4 mm or more, may be 0.45 mm Above, it can be 0.5 mm or more. The diameter of the through hole of the insulating member may be 1 mm or less, 0.9 mm or less, 0.8 mm or less, 0.7 mm or less, or 0.6 mm or less.

The difference between the diameter of the through-hole (at least one of the first through-hole and the second through-hole) of the substrate and the diameter of the through-hole of the insulating member makes it easier to suppress conductors in the through-hole of the substrate when the through-hole is formed on the insulating member. From the perspective of partial damage, it may be 0.1 mm or more, 0.15 mm or more, or 0.2 mm or more. The upper limit of the difference between the diameter of at least one of the first through hole and the second through hole and the diameter of the through hole of the insulating member is, for example, 0.5 mm.

The diameter of the through hole of the insulating member may be the same as or different from the diameter of the through hole of the substrate (at least one of the first through hole and the second through hole). For example, the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate may be larger than the diameter of the through hole of the insulating member. Furthermore, the diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member. It is preferable that the diameter of the through hole of the insulating member is the same as the diameter of the through hole of the substrate (same diameter). In this case, the constituent material of the insulating member can be easily removed from the through hole of the substrate after the through hole is formed in the insulating member, and accumulation of foreign matter or the like in the through hole of the substrate can be suppressed. Furthermore, it is possible to suppress the insulating member from contacting the plug-in pin and scattering of the constituent material of the insulating member during component packaging.

The thickness of the conductor portion (thickness of the conductor portion in the radial direction of the through-hole) may be 10 μm or more, 15 μm or more, or 20 μm or more. The thickness of the conductor portions 14a to 14d and the conductor portions 24a to 24d may be 40 μm or less, 35 μm or less, or 30 μm or less.

FIG. 1 is a schematic cross-sectional view showing the laminated body of this embodiment. The laminated body (multilayer wiring board) 100 shown in FIG. 1 includes a substrate (first substrate) 10, a substrate (second substrate) 20, and an insulating member 30, and has a laminated structure in which the insulating member 30 is interposed between the substrate 10 and the substrate 20. . The insulating member 30 is in contact with the substrate 10 and the substrate 20 . The substrate 10, the insulating member 30 and the substrate 20 are laminated in this order.

The size, shape, etc. of the substrate 10 and the substrate 20 are not particularly limited. The size, shape, etc. of the substrate 10 and the substrate 20 may be the same or different from each other.

As the substrate 10 and the substrate 20, a printed wiring board can be used. Examples of printed wiring boards include double-sided circuit boards, multilayer wiring boards, multi-wire wiring boards, and the like. The type of base material used for the printed wiring board is not limited. From the viewpoint of suppressing deformation (dimensional change) due to pressure heating during lamination, an insulating base material containing a reinforcing material such as glass cloth is preferred. From the same point of view, as the base material, a flame retardant (FR)-5 grade according to the National Electrical Manufacturers Association (NEMA) standard or a base material with a high glass transition temperature is preferred. Base material (for example, a base material containing polyimide resin, etc.).

The substrate 10 has a plurality of through holes 12 a to 12 d penetrating the substrate 10 in the thickness direction of the substrate 10 , and has conductor portions (conductor holes) 14 a to conductor portions arranged on the inner walls of the through holes 12 a to 12 d. (Guide hole) 14d. The conductor portions 14a to 14d extend along the axial direction of the through-holes from the end of the through-holes 12a to 12d on the substrate 20 side to the one of the through-holes 12a to 12d opposite to the substrate 20 side end. The substrate 20 has a plurality of through holes 22 a to 22 d penetrating the substrate 20 in the thickness direction of the substrate 20 , and has conductor portions (conductor holes) 24 a to conductor portions arranged on the inner walls of the through holes 22 a to 22 d. (Guide hole) 24d. The conductor portions 24a to 24d extend along the axial direction of the through holes from the end of the through holes 22a to 22d on the substrate 10 side to the one of the through holes 22a to 22d opposite to the substrate 10 side end. The substrate 10 and the substrate 20 have a through-hole structure. The through-holes 12 a to 12 d and the through-holes 22 a to 22 d are formed at positions facing each other in the lamination direction of the substrate 10 , the insulating member 30 and the substrate 20 .

In the laminated body 100 , the through hole 12 a (first through hole) penetrating the substrate 10 in the thickness direction of the substrate 10 , the through hole 22 a (second through hole) penetrating the substrate 20 in the thickness direction, and the insulating The through-hole 32a penetrating the insulating member 30 in the thickness direction of the member 30 forms the through-hole 100a penetrating the laminated body 100 in the thickness direction. The through hole 12 b penetrating the substrate 10 , the through hole 22 b penetrating the substrate 20 , and the through hole 32 b penetrating the insulating member 30 form a through hole 100 b penetrating the laminated body 100 in the thickness direction of the laminated body 100 . The through-hole 12a, the through-hole 12b, the through-hole 22a, and the through-hole 22b have the structure which has a hollow center part in the radial direction. Buried via resin 40 is filled in the space other than the space occupied by the conductor portions 14c, 14d, 24c, and 24d among the through-holes 12c, 12d, 22c, and 22d. As the buried hole resin 40, trade name: THP-100DX1 manufactured by TAIYO INK MFG. Co., Ltd., trade name: AE1244 manufactured by Tatsuta Electric Wire Co., Ltd., etc. can be used.

The through-hole 12 a and the through-hole 22 a constituting the through-hole 100 a are formed at positions overlapping each other in the lamination direction of the substrate 10 , the insulating member 30 and the substrate 20 . The through-hole 12 b and the through-hole 22 b constituting the through-hole 100 b are formed at positions overlapping each other in the stacking direction of the substrate 10 , the insulating member 30 and the substrate 20 . When the through hole of the substrate 10 and the through hole of the substrate 20 are formed at positions overlapping each other in the stacking direction of the substrate 10 , the insulating member 30 and the substrate 20 , the central axes of the two through holes may be the same axis, or It's not the same axis. In a position where no through hole is formed penetrating the laminated body 100 , the through hole of the substrate 10 and the through hole of the substrate 20 may be formed at a position overlapping each other in the lamination direction of the substrate 10 , the insulating member 30 and the substrate 20 , or may be formed in positions that do not overlap each other.

On the main surface (first main surface) 10 a of the substrate 10 facing the substrate 20 , a surface electrode (first surface electrode, land) 16 a is arranged at a position different from the formation position of the through hole 12 a. The surface electrode 16a is arranged at a position adjacent to the formation position of the through hole 12a on the main surface 10a. The surface electrode 16a is in contact with the conductor part 14a in the through hole 12a, and is electrically connected to the conductor part 14a. On the main surface (second main surface) 20 a of the substrate 20 facing the substrate 10 , a surface electrode (second surface electrode, pad) 26 a is arranged at a position different from the position where the through hole 22 a is formed. The surface electrode 26a is arranged at a position adjacent to the formation position of the through hole 22a on the main surface 20a. The surface electrode 26a is in contact with the conductor part 24a in the through hole 22a, and is electrically connected to the conductor part 24a.

The surface electrode 16b is arranged on the main surface 10a at a position different from the position where the through-hole 12b is formed. Surface electrodes (pads) 16c and surface electrodes (pads) 16d are arranged at the formation positions of the through-holes 12c and 12d on the main surface 10a. The surface electrode 26b is arranged on the main surface 20a at a position different from the position where the through-hole 22b is formed. Surface electrodes (bonding pads) 26c and surface electrodes (bonding pads) 26d are arranged at the formation positions of the through-holes 22c and 22d in the main surface 20a. If the through-hole 12c, the through-hole 12d, the through-hole 22c, and the through-hole 22d are filled with the buried-hole resin 40, it becomes easy to form the surface electrode 16c at the formation position of the through-hole 12c, the through-hole 12d, the through-hole 22c, and the through-hole 22d. , surface electrode 16d, surface electrode 26c, surface electrode 26d. Furthermore, the surface electrodes 16c, 16d, 26c, and 26d are easily in contact with a conductive member (for example, a conductive member 50c to be described later) electrically connected to the conductor portions 14c, 14d, 24c, and 24d. , so the electrical connection between the conductor portions 14c, 14d, 24c, 24d and the conductive member can be easily obtained by arranging the surface electrodes 16c, 16d, 26c, and 26d.

In the laminated body 100 , the end portion of the through hole (for example, the through hole 12 a ) of the substrate 10 on the side opposite to the substrate 20 (the side opposite to the main surface 10 a ) is in contact with the through hole (for example, the through hole 12 a ) of the substrate 20 . The end of the hole 22a) on the side opposite to the substrate 10 (the side opposite to the main surface 20a) passes through at least the conductor portion (for example, the conductor portion 14a (first conductor portion)) of the substrate 10 and the surface of the substrate 10 The electrode (eg, surface electrode 16 a ), the surface electrode (eg, surface electrode 26 a ) of the substrate 20 , and the conductor portion (eg, conductor portion 24 a (second conductor portion)) of the substrate 20 are electrically connected. The surface electrode 16a and the surface electrode 26a are electrically connected to each other through the conductive member 50a disposed between the surface electrode 16a and the surface electrode 26a. The surface electrode 16c and the surface electrode 26c are electrically connected to each other through the conductive member 50c disposed between the surface electrode 16c and the surface electrode 26c. The surface electrode 16d and the surface electrode 26d are not electrically connected to each other because no conductive member is disposed between the surface electrode 16d and the surface electrode 26d, but the insulating member 30 is present between the surface electrode 16d and the surface electrode 26d.

The conductive material used for the conductive member (for example, the conductive member 50a, the conductive member 50c) is not limited as long as it has conductivity, but it is preferably at a general lamination temperature (200° C. or lower) in a printed wiring board. A material whose remelting temperature after melting to form an intermetallic bond is 250°C or higher. Examples of conductive materials include copper, tin alloy, and the like. For example, the conductive material preferably contains at least one of copper particles and metal-coated copper particles (for example, copper particles coated with silver, gold, or tin) as the first metal, and contains a material selected from the group consisting of tin, bismuth, and silver. At least one metal from the group consisting of zinc and palladium is used as the second metal. The second metal preferably forms an intermetallic compound with the first metal. In this case, the second metal preferably contains at least tin. As the conductive member, conductive paste can be used. Examples of the conductive member include HT-710 (trade name) manufactured by Ormet Co., Ltd., MPA500 (trade name) manufactured by Tatsuta Electric Wire Co., Ltd., and the like.

In order to protect the surface of the surface electrode, the surface of the substrate may also be subjected to surface treatment (surface finishing). The preferred surface treatment is gold plating. Depending on the type of material of the surface electrode (for example, copper), if left in the atmosphere, an oxide film (for example, copper oxide film) may form on the surface, and the connectivity between the surface electrode and the conductive member may decrease. In this case, by protecting the surface of the surface electrode by gold plating or the like, oxidative deterioration of the surface electrode can be easily suppressed.

The insulating member 30 is not particularly limited as long as it has insulating properties. As the insulating member 30 , for example, an insulating film can be used. The insulating material of the insulating member 30 includes, for example, a resin composition. From the viewpoint of easy control of fluidity, the resin composition preferably contains a resin (polymer), and more preferably contains a thermosetting resin. Examples of the thermosetting resin include epoxy resin, phenol resin, polyimide resin, and the like.

When the resin composition contains a thermosetting resin, the glass transition temperature of the cured material (thermosetting material) is preferably 150°C or higher, more preferably 150°C or more, from the viewpoint of improving reflow resistance during component packaging. Above 180℃. When the resin composition contains a thermosetting resin, the resin composition preferably contains particles such as fillers as reinforcing materials from the viewpoint of suppressing the thermal expansion coefficient of the cured product.

The glass transition temperature can be measured by the following method. (Sample preparation method) The thermosetting resin composition is applied to a release polyethylene terephthalate (PET) film (Teijin DuPont Film) using an applicator so that the thickness after drying becomes 100 μm. DuPont Films), trade name: A-53), and then dried at a temperature of 130°C for 30 minutes to produce a semi-hardened film. Secondly, the self-released PET film peels off the semi-hardened film. Furthermore, after fixing the semi-hardened film by sandwiching it between two metal frames, the film was dried at a temperature of 185° C. for 60 minutes to produce a thermosetting film including curing. Film of resin composition. (Measurement method) Made by TA Instruments, device name: TMA-2940, clamp: stretch, distance between clamps: 15 mm, measurement temperature: room temperature to 350°C, heating temperature: 10°C/min, stretch The measurement was carried out under the conditions of load: 5 gf, sample size: width 5 mm × length 25 mm, and the glass transition temperature was calculated by the tangent method from the obtained temperature-displacement curve.

Examples of the insulating material of the insulating member 30 include AS-401HS, a product of Hitachi Chemical Co., Ltd., and AS-9500, a product of Hitachi Chemical Co., Ltd. When using an insulating material including nonwoven fabric or glass cloth or carbon cloth containing glass fiber or carbon fiber, the height of the surface electrode is likely to vary depending on the thickness of the nonwoven fabric or cloth due to the density of the cloth. Because of unevenness, the connection resistance value may become unstable. Therefore, the insulating material does not need to contain non-woven fabric, glass cloth, carbon cloth, etc. containing glass fiber or carbon fiber.

In the laminated body of this embodiment, the substrate only needs to have through holes (for example, the above-mentioned through holes 12a, 12b, through-hole 22a, through-hole 22b). Only one through hole penetrating the laminated body may be formed, or a plurality of through holes may be formed. Only one through hole constituting the through hole penetrating the laminated body may be formed in each substrate, or a plurality of through holes may be formed in at least one substrate.

In the laminated body of this embodiment, the substrate may have through holes that do not constitute through holes penetrating the laminated body. For example, as shown in the laminated body 100 described above, the substrate 10 may have the through-hole 12c and the through-hole 12d (third through-hole) as the through-holes penetrating the substrate 10 in addition to the through-hole 12a. Furthermore, the substrate 20 may have a through hole 22 c and a through hole 22 d (fourth through hole) in addition to the through hole 22 a as through holes penetrating the substrate 20 . These through-holes 12c, 12d, 22c, and 22d do not constitute through-holes penetrating the laminated body 100. The through holes 12 c and 12 d and the through holes 22 c and 22 d are formed at positions facing each other in the lamination direction of the substrate 10 , the insulating member 30 and the substrate 20 .

The substrate 10 has conductor portions 14c and 14d (third conductor portions) arranged on the inner walls of the through-holes 12c and 12d. Surface electrodes 16 c and 16 d (third surface electrodes) are arranged on the main surface 10 a of the substrate 10 . The surface electrodes 16 c and 16 d are arranged at positions where the through holes 12 c and 12 d are formed on the main surface 10 a. The substrate 20 has conductor portions 24c and 24d (fourth conductor portions) arranged on the inner walls of the through-holes 22c and 22d. Surface electrodes 26 c and 26 d (fourth surface electrodes) are arranged on the main surface 20 a of the substrate 20 . The surface electrodes 26 c and 26 d are arranged at positions where the through holes 22 c and 22 d are formed in the main surface 20 a. The surface electrodes disposed at the formation positions of the through holes that do not constitute the through holes penetrating the laminated body may be electrically connected to each other via the conductive member disposed between the surface electrodes (the form of the surface electrode 16 c and the surface electrode 26 c ), it may be a form in which no conductive member is arranged between the surface electrodes (the form of the surface electrodes 16d and 26d). In the form where no conductive member is arranged between the surface electrodes, the insulating member 30 is present between the surface electrodes.

As another example of a through hole that does not constitute a through hole penetrating the laminated body, examples shown in FIGS. 2(a) and 2(b) can be cited. In FIGS. 2( a ) and 2 ( b ), through-holes 12 c and 22 c are formed in positions where the substrate 10 , the insulating member 30 and the substrate 20 do not overlap with each other in the lamination direction, and the surface electrode 16 c is arranged on the main surface. At the formation position of the through hole 12c in the main surface 10a, the surface electrode 26c is arranged at a position facing the surface electrode 16c on the main surface 20a. The surface electrode 16 c and the surface electrode 26 c may be electrically connected to each other through the conductive member 50 c disposed between the surface electrode 16 c and the surface electrode 26 c ( FIG. 2( a )), or they may be in a state between the surface electrode 16 c and the surface electrode 26 c. A form in which a conductive member is not arranged between the surface electrodes 26c (Fig. 2(b)).

The laminated body of this embodiment can be obtained by the manufacturing method of the laminated body of this embodiment. The manufacturing method of the laminated body of this embodiment includes forming a first through hole penetrating the first substrate in the first substrate, forming a second through hole penetrating the second substrate in the second substrate, and arranging the insulating member on the second substrate. A through-hole forming step is to form a through-hole in an insulating member between a substrate and a second substrate, and form a through-hole penetrating the laminated body using the first through-hole, the second through-hole, and the through-hole in the insulating member.

The manufacturing method of the laminated body of this embodiment includes, for example, a substrate preparation step, a conductor portion forming step, a surface electrode forming step, a lamination step, and a through hole forming step in this order.

The substrate preparation step is a step of preparing substrates (first substrate and second substrate) having through holes penetrating the substrate in the thickness direction of the substrate. As a method of forming the through hole, the same method as the method of forming the through hole of the insulating member described later (for example, drilling) can be used.

The conductor portion forming step is a step of forming a conductor portion on the inner wall of the through hole of the substrate (the first substrate and the second substrate). The conductor part can be formed by plating, for example. In the conductor portion forming step, after the conductor portion is formed, the through-holes that do not constitute the through-holes penetrating the laminated body may be filled with an insulating material.

The surface electrode forming step is a step of forming the surface electrode on the main surface of the substrate (the first substrate and the second substrate) at a position different from the formation position of the through hole constituting the through hole penetrating the laminated body. In the surface electrode forming step, the surface electrode may be formed at a position adjacent to the formation position of the through hole constituting the through hole penetrating the laminated body. Furthermore, the surface electrode can be formed in contact with the conductor portion in the through hole of the substrate. The surface electrode can be formed, for example, by etching a metal layer (for example, copper foil) disposed on the main surface of the substrate. The metal layer can be formed by plating, for example. In the surface electrode forming step, the surface electrode may be formed at a position on the main surface of the substrate that does not constitute a through hole penetrating the laminated body.

The lamination step is a step of laminating the first substrate and the second substrate via an insulating member. In the lamination step, the first substrate and the second substrate may be laminated via the insulating member and the conductive member. In order to electrically connect the surface electrodes of the first substrate and the surface electrodes of the second substrate, the substrates may be laminated and heated and pressurized with the surface electrodes facing each other.

When the substrates are laminated, from the viewpoint of performing positioning with high accuracy, it is preferable to insert pins for positioning of the stacked layers into through holes (through holes for positioning) provided for inserting the pins. to align the substrate. The pin for layer alignment can be inserted into only one through hole or into multiple through holes.

In the lamination step, in order to electrically connect the surface electrodes arranged on the main surface of the substrate, through holes are formed in the insulating member at positions between the surface electrodes. Through-holes may not be formed or may be formed at positions in the insulating member that do not electrically connect the surface electrodes to each other. The method of forming the through hole of the insulating member is not particularly limited, and the method of forming the through hole of the insulating member described later in the through hole forming step may be used.

Preferably, a release film is disposed on the surface of the insulating member. In this case, adhesion of foreign matter to the surface of the insulating member can be prevented. Furthermore, the release film functions as a protective film to protect the surface of the insulating member when the conductive member (for example, conductive paste) is supplied in the subsequent step, and it is no longer necessary to prepare an opening aligned with the supply position of the conductive member. Protective mask, thus reducing the manufacturing cost of the laminated body. Examples of the release film include a single-sided release-treated PET film manufactured by Teijin DuPont Co., Ltd. (for example, trade name: A-31). The release film is peeled off when the substrates are laminated.

After the through-hole is formed in the insulating member, the insulating member is bonded (laminated) to the main surface of the substrate. Next, when the surface electrodes are connected to each other using a conductive member, the through-holes of the insulating member are filled with the conductive member. The conductive member filled in the through hole is in contact with the surface electrode. The conductive member may be filled in the through-hole after the substrate and the insulating member are laminated, or may be filled in the through-hole before lamination. For example, after the insulating member is bonded to the first substrate, the through hole may be filled with the conductive member, and then the second substrate may be laminated on the first substrate and the insulating member. When an opening is formed in the insulating member at a position where a through hole constituting a through hole penetrating the laminated body is formed, the conductive member is disposed in the opening and becomes an obstacle when the through hole constituting the through hole penetrating the laminated body is formed, Therefore, it is preferable that no opening is formed at the formation position of the through hole constituting the through hole penetrating the laminated body.

As a method of supplying the conductive member, for example, a method of arranging conductive paste by a screen printing method, a dispensing method, or the like can be cited. Examples of the conductive paste include materials that maintain viscosity by mixing a metal material with a binder resin and simplify screen printing, dispensing processing, and the like. When using such a conductive paste, from the viewpoint of maintaining the shape of the conductive member, it is preferable to preliminarily harden the binder resin by performing heat treatment after disposing the conductive paste, thereby improving the conductive paste. The stickiness. In this case, the heat treatment can be performed at a temperature of 70°C to 150°C and a time of 10 minutes to 120 minutes. If the temperature is 70° C. or more or the time is 10 minutes or more, the viscosity is easily increased sufficiently and the shape of the conductive paste is easily maintained. If the temperature is 150° C. or less or the time is 120 minutes or less, it is easy to suppress excessive increase in viscosity and/or advancement of hardening of the binder resin, and it is easy to form sufficient intermetallic compounds even if the conductive paste melts. By maintaining the shape of the conductive member, sufficient connectivity is easily ensured.

In the through-hole forming step, a first through-hole penetrating the first substrate is formed in the first substrate, a second through-hole penetrating the second substrate is formed in the second substrate, and the insulating member is arranged on the first substrate and the second substrate. In the state between the two substrates, a through hole is formed in the insulating member, and a through hole penetrating the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member. The through hole of the insulating member can be formed by processing a portion of the insulating member exposed from the through hole through the first through hole or the second through hole.

The method of forming the through hole of the insulating member is not particularly limited. The through hole can be formed by physical treatment or chemical treatment. Examples of physical processing include laser processing (laser irradiation), drilling (cutting), and stamping. Examples of chemical treatment include chemical solution treatment and the like. During the drilling process, the conductor portion in the through-hole of the substrate may peel off. When through-holes are formed by melting the insulating material by chemical treatment, it is preferable to attach a release film (eg, PET film) or the like to suppress adhesion of the chemical solution on the surface of the substrate. When laser processing is used, since the processing is performed by irradiating the laser, compared with cutting processing such as drilling, it does not depend on the diameter of the hole or the diameter of the drill hole, and it is easy to suppress damage to the conductor portion. Therefore, as a method of forming the through-hole of the insulating member, laser processing is preferred.

Examples of lasers used in laser processing include: CO ₂ laser, UV laser, YAG laser, UV-YAG laser, etc. The laser wavelength of CO ₂ laser is 9400 nm. In contrast, the laser wavelength of UV-YAG laser is 355 nm. UV-YAG laser is excellent in processing small diameters, but using CO ₂ laser can currently Holes with a diameter of 50 μm or more are formed in mass production processing. Furthermore, the output of CO ₂ laser is more than 10 times greater than that of UV laser, so the production efficiency of CO ₂ laser is higher than that of UV laser. Therefore, as the laser, CO ₂ laser is preferred.

Hereinafter, the manufacturing method of the laminated body 100 of FIG. 1 is demonstrated as an example using FIG.3(a), FIG.3(b) and FIG.4(a), FIG.4(b). 3(a) and 3(b) and 4(a) and 4(b) are schematic cross-sectional views showing the manufacturing method of the laminated body according to this embodiment.

First, as shown in FIG. 3( a ), a substrate 10 having through-holes 12 a to 12 d penetrating the substrate 10 in the thickness direction is prepared. The substrate 10 has a main surface 10 a facing the substrate (substrate 20 ) laminated on the substrate 10 .

Next, as shown in FIG. 3( b ), conductor portions 14 a to 14 d are formed on the inner walls of the through holes 12 a to 12 d of the substrate 10 . Next, the through-hole 12c and the through-hole 12d are filled with insulating material. Surface electrodes 16 a and 16 b are formed on the main surface 10 a of the substrate 10 at positions different from the formation positions of the through holes 12 a and 12 b constituting the through holes 100 a and 100 b penetrating the laminated body 100 . Furthermore, surface electrodes 16c and 16d are formed on the main surface 10a of the substrate 10 at the formation positions of the through-holes 12c and 12d that do not constitute the through-holes penetrating the laminated body 100.

Furthermore, as a substrate laminated on the substrate 10 , a substrate 20 having the same structure as the substrate 10 is prepared.

Next, as shown in FIG. 4( a ), an insulating member 30 having a through hole formed at a position corresponding to the arrangement position of the surface electrode 16 a and the surface electrode 16 c of the substrate 10 is prepared. Next, after the insulating member 30 is attached to the main surface 10a of the substrate 10, heating and pressing are performed. Then, the through holes of the insulating member 30 are filled with the conductive members 50 a and 50 c, so that the surface electrode 16 a and the conductive member 50 a are brought into contact, and the surface electrode 16 c is brought into contact with the conductive member 50 c. Furthermore, an insulating member is attached to the main surface 20a of the substrate 20 on which the surface electrodes 26a to 26d are arranged so that the surface electrodes 26a to 26d of the substrate 20 face the surface electrodes 16a to 16d of the substrate 10 30, and then heat and pressurize. In this case, the insulating member 30 is disposed between the through hole 12a and the through hole 22a, between the through hole 12b and the through hole 22b, and between the through hole 12d and the through hole 22d.

Next, as shown in FIG. 4( b ), a through-hole 32 a is formed in the portion between the through-hole 12 a and the through-hole 22 a in the insulating member 30 , and a through-layered layer is formed by the through-hole 12 a, the through-hole 22 a, and the through-hole 32 a. through hole 100a of the body 100. Furthermore, by forming the through hole 32b in the portion between the through hole 12b and the through hole 22b in the insulating member 30, the through hole 100b penetrating the laminated body 100 is formed by the through hole 12b, the through hole 22b, and the through hole 32b. By the above, the laminated body 100 of FIG. 1 can be obtained.

According to the manufacturing method of the laminated body 100 of this embodiment, the through-holes 12a and 12b penetrating the substrate 10 are formed in the substrate 10, the through-holes 22a and 22b penetrating the substrate 20 are formed in the substrate 20, and the insulating member is With 30 disposed between the substrate 10 and the substrate 20, through-holes 32a and 32b are formed in the insulating member 30. Through the through-holes 12a, 12b, 22a, 22b and the through-holes 32a, The holes 32b form through-holes 100a and 100b penetrating the laminated body 100. In this case, when performing the operation of forming the through-holes 100a and 100b penetrating the laminated body 100, the through-holes 12a, 12b, 22a, and 22b are formed in advance on the substrate 10 and the substrate 20. Therefore, It is not necessary to form through holes in the substrate 10 and the substrate 20 in addition to the insulating member 30 . Therefore, the manufacturing process of a laminated body can be simplified, and it can suppress that the manufacturing cost of a laminated body becomes high. Therefore, according to the manufacturing method of the laminated body 100 of this embodiment, the laminated body 100 which can encapsulate a pin insertion type component can be efficiently obtained.

According to the manufacturing method of the laminated body 100 of this embodiment, even when the substrate is thick, a small-diameter drill can be used to form a through hole penetrating the laminated body. Furthermore, even when the substrate is thick, since the conductor portion is formed on the substrate in advance before stacking a plurality of substrates, there is no need to consider the uniformity of plating after stacking the substrates. According to this, the hole diameter can be easily reduced, so the distance between the through holes formed in the substrate can be increased. In this case, it is possible to increase the number of signal lines and the like, and it is also easy to route the signal lines.

In the manufacturing method of the laminated body 100 of this embodiment, the end portion of the through-hole 12 a on the opposite side to the substrate 20 and the end portion of the through-hole 22 a on the opposite side to the substrate 10 pass through the conductor portion 14 a and the surface. The electrode 16a, the conductive member 50a, the surface electrode 16b, and the conductor portion 24a are electrically connected, thereby electrically connecting both surfaces of the laminated body 100.

According to this embodiment, a laminated body excellent in connection reliability can be obtained. Furthermore, even when the thickness of the substrate is thick, a laminated body capable of encapsulating pin insertion type components can be efficiently obtained.

The embodiments of the present invention have been described above, but the present invention is not limited to the embodiments. For example, the number of stacked layers of the substrate is not particularly limited, and may be three or more layers. In a laminated body with three or more layers, it is only necessary to form through-holes penetrating the entire laminated structure from one side of the laminated structure to the other side. The through-holes do not need to be formed from one side of the laminated body to the other side. Through holes above the layer. When a through hole is formed that penetrates the entire laminated body, even when a process using a liquid is performed on the laminated body, it is easy to suppress residual liquid in the through hole.

Example

(Example 1)

A wiring circuit was formed on both sides of an epoxy resin-based copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-679) with a resin layer thickness of 0.10 mm, a copper foil thickness of 18 μm, and a size of 660 mm × 615 mm. 10 inner substrates.

Next, 20 pieces of prepreg A (manufactured by Hitachi Chemical Co., Ltd., trade name: GEA-679) with a resin layer thickness of 0.1 mm and a size of 660 mm × 615 mm were prepared. Then, alignment between the inner substrates is performed by pin lamination. Furthermore, one inner layer substrate and two prepregs A are alternately arranged, and one prepreg B (the same prepreg as prepreg A) is arranged further outside the inner layer substrate arranged on the outermost side. dip body). Furthermore, an electrolytic copper foil (manufactured by Nippon Electrolytic Co., Ltd., trade name: YGP-18) with a thickness of 18 μm and a size of 660 mm × 615 mm was placed on the prepreg B, and then heated and processed with a vacuum press. Suppressed and integrated. After heating and pressing, the substrate was cut to a size of 605 mm × 500 mm in order to remove the resin of the prepreg exposed on the end surface, and a structure A with a thickness of 3.00 mm was obtained.

Secondly, numerical control (NC) is used to control the drilling machine, and a drill with a diameter of 0.65 mm is used to drill holes at the inner layer of the structure A to form a through hole (diameter 0.65 mm).

Next, the smear in the hole is removed by permanganic acid treatment, and then thickened electrolytic copper plating is used to form a 25 μm thick plating layer (conductor part).

Next, a hole-buried resin (manufactured by Taiyo Ink Manufacturing Co., Ltd., trade name: THP-100DX1) was prepared as a non-conductive material, and then the resin was embedded using a screen printing method using a vacuum printer. The resin embedding at this time is not performed on the through-holes constituting the through-holes penetrating the multilayer wiring board (finally obtained laminated body), but is performed on the through-holes not constituting the through-holes penetrating the multilayer wiring board. Next, electroless copper plating was performed on the entire main surface of the substrate including the portion where the resin was embedded, to form a copper layer with a thickness of 15 μm. Next, the copper layer is etched by a tenting method to produce two surface electrodes A having positions adjacent to the formation position of the through-hole constituting the through-hole penetrating the multilayer wiring board in the substrate. A printed wiring board in which the surface electrode B (lid plating) is placed in the resin-embedded area.

Secondly, for an insulating member having a resin layer (nominal thickness: 0.075 mm) including a resin composition containing a thermosetting resin and a single-sided PET film (thickness: 0.025 mm) disposed on the resin layer (Hitachi Chemical Co., Ltd. Manufactured by the company, trade name: AS-401HS, size 605 mm × 500 mm), using an NC controlled drilling machine and a drill with a diameter of 0.55 mm, it is formed at the position where the conductive member is configured to electrically connect the surface electrodes to each other Through holes. Furthermore, through holes are formed at positions where pins for maintaining layer spacing during lamination are arranged.

Next, the insulating member is placed on one surface of the first printed wiring board so that the resin layer of the insulating member is in contact with the first printed wiring board and the surface electrodes are exposed from the through holes of the insulating member. Next, a vacuum laminator was used to perform heating and pressurization under the conditions of a temperature of 85° C., a pressure of 0.5 MPa, and a pressurization time of 30 seconds (vacuum suction for 30 seconds).

Next, a conductive material (trade name: MPA500, manufactured by Tatsuta Electric Wire Co., Ltd.) is filled in the through-hole of the insulating member exposing the electrically connected surface electrode. The number of holes filled is 12,000 holes. At this time, the PET film disposed on the surface of the insulating member serves as a protective mask, thereby supplying MPA 500 only into the through holes of the insulating member, thereby preventing MPA 500 from adhering to other locations in the insulating member.

Next, the PET film arranged on the surface of the insulating member is peeled off from the insulating member. Next, pins were inserted into the through holes of the first printed wiring board for positioning, and based on this, the second printed wiring board was stacked on the insulating member. After that, a vacuum press was used to press at a temperature of 180° C., a pressure of 3 MPa, and a time of Heat and pressure were pressed under the pressing conditions of 90 minutes, and Structure B was produced. At this time, the printed wiring boards are overlapped so that the surface electrodes of the first printed wiring board and the surface electrodes of the second printed wiring board face each other.

Next, a laser drilling machine ( _CO2 laser) is used to irradiate the portion of the insulating member exposed from the through hole of the printed wiring board with laser, and a through hole (0.55 mm in diameter) is formed in the insulating member. Laser irradiation was performed under the conditions of output 6.0 W, period 1.0 ms, pulse width 30 μs, and shot count 20 times. As a result, the portion of the insulating member located between the through holes of the two printed wiring boards was removed, and a multilayer wiring board (laminated body) having a through hole penetrating the multilayer wiring board was obtained.

(Example 2) After the structure B was produced in the same manner as in Example 1, a through hole (diameter 0.45 mm) was drilled into the portion of the insulating member exposed from the through hole of the printed wiring board using an NC controlled drilling machine with a drill of 0.45 mm in diameter. mm) is formed on the insulating member, whereby a multilayer wiring board (laminated body) having a through hole penetrating the multilayer wiring board is obtained.

10, 20‧‧‧Substrate 10a, 20a‧‧‧Main side 12a～12d, 22a～22d, 32a～32b‧‧‧through hole 14a～14d, 24a～24d‧‧‧Conductor part 16a～16d, 26a～26d‧‧‧Surface electrode 30‧‧‧Insulating components 40‧‧‧Buried hole resin 50a, 50c‧‧‧Conductive components 100‧‧‧Laminated body 100a, 100b‧‧‧through hole

FIG. 1 is a schematic cross-sectional view showing a laminated body according to an embodiment of the present invention. 2(a) and 2(b) are schematic cross-sectional views showing a laminated body according to another embodiment of the present invention. 3(a) and 3(b) are schematic cross-sectional views showing a method of manufacturing a laminated body according to one embodiment of the present invention. 4(a) and 4(b) are schematic cross-sectional views showing a method of manufacturing a laminated body according to one embodiment of the present invention.

10, 20‧‧‧Substrate

10a, 20a‧‧‧Main side

12a~12d, 22a~22d, 32a~32b‧‧‧Through holes

14a~14d, 24a~24d‧‧‧Conductor part

16a~16d, 26a~26d‧‧‧Surface electrode

30‧‧‧Insulating components

40‧‧‧Buried hole resin

50a, 50c‧‧‧Conductive components

100‧‧‧Laminated body

100a, 100b‧‧‧through hole

Claims (11)

A method for manufacturing a laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate, the manufacturing method of the laminated body comprising: A first through hole is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is disposed between the first substrate and the second substrate. In a state between the substrates, a through hole is formed in the insulating member, and a through hole penetrating the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member. hole step, the first substrate has a first conductor portion disposed on the inner wall of the first through hole, and the second substrate has a second conductor portion disposed on the inner wall of the second through hole, On the first main surface of the first substrate facing the second substrate, a first surface electrode is arranged at a position different from the formation position of the first through hole, and on the second substrate In the second main surface facing the first substrate, a second surface electrode is arranged at a position different from the formation position of the second through hole, and in the first through hole and the second surface electrode The end portion on the opposite side of the two substrates and the end portion of the second through hole on the opposite side to the first substrate pass through the first conductor portion, the first surface electrode, the second The surface electrode and the second conductor part are electrically connected. The method for manufacturing a laminated body according to claim 1, wherein the through hole of the insulating member is formed by laser processing. The method for manufacturing a laminated body according to claim 1, wherein the through hole of the insulating member is formed by drilling. A laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate, wherein a first through hole penetrating the first substrate, a second through hole penetrating the second substrate, and a first through hole penetrating the second substrate. The through-hole of the insulating member constitutes a through-hole penetrating the laminated body, the first substrate has a first conductor portion arranged on an inner wall of the first through-hole, and the second substrate has a first conductor portion arranged on an inner wall of the first through-hole. The second conductor portion of the inner wall of the two through holes is disposed on the first main surface of the first substrate facing the second substrate at a position different from the formation position of the first through hole. a first surface electrode, and a second surface electrode is arranged on a second main surface of the second substrate facing the first substrate at a position different from the formation position of the second through hole, An end of the first through hole on the opposite side to the second substrate and an end of the second through hole on the opposite side to the first substrate pass through the first conductor portion. , the first surface electrode, the second surface electrode and the second conductor part are electrically connected, and the diameter of at least one of the first through hole and the second through hole is greater than The diameter of the through hole of the insulating member. The laminated body according to claim 4, wherein the first surface electrode and the second surface electrode are connected by a conductive member disposed between the first surface electrode and the second surface electrode. and are electrically connected to each other. The laminated body according to claim 4, wherein a third through hole penetrating the first substrate is formed in the first substrate, and the first substrate further has a third through hole disposed in the third through hole. The third conductor portion on the inner wall of the hole further forms a fourth through hole penetrating the second substrate on the second substrate, and the second substrate further has a conductor portion disposed on the inner wall of the fourth through hole. In the fourth conductor part, a third surface electrode is arranged on the first main surface, and a fourth surface electrode is arranged on the second main surface. The laminated body according to claim 6, wherein the third through hole and the second substrate are formed at positions where the first substrate, the insulating member and the second substrate overlap each other in the lamination direction. The fourth through hole, the third surface electrode is arranged at the formation position of the third through hole in the first main surface, and the fourth surface electrode is arranged at all positions in the second main surface. The formation position of the fourth through hole. The laminated body according to claim 6, wherein the third through hole is formed at a position where the first substrate, the insulating member, and the second substrate do not overlap with each other in the lamination direction. and the fourth through hole, the third surface electrode is arranged at the formation position of the third through hole in the first main surface, and the fourth surface electrode is arranged at the formation position of the second main surface. A position opposite to the third surface electrode. The laminated body according to claim 6, wherein the third surface electrode and the fourth surface electrode are connected by a conductive member disposed between the third surface electrode and the fourth surface electrode. and are electrically connected to each other. The laminate according to claim 6, wherein no conductive member is disposed between the third surface electrode and the fourth surface electrode. The laminated body according to any one of claims 4 to 10, wherein the diameter of the first through hole and the diameter of the second through hole are larger than the diameter of the through hole of the insulating member. diameter.