JPWO2019130496A1 - Laminated body and its manufacturing method - Google Patents

Abstract

A method for manufacturing a laminated body 100 having a laminated structure in which an insulating member 30 is interposed between a substrate 10 and a substrate 20. A through hole 12a penetrating the substrate 10 is formed in the substrate 10 and penetrates the substrate 20. A through hole 22a is formed in the substrate 20, and a through hole 32a is formed in the insulating member 30 in a state where the insulating member 30 is arranged between the substrate 10 and the substrate 20, and the through hole 12a, the through hole 22a, and the through hole 32a are formed. A step of forming a through hole 100a penetrating the laminated body 100 is provided, the substrate 10 has a conductor portion 14a arranged on the inner wall of the through hole 12a, and the substrate 20 is arranged on the inner wall of the through hole 22a. The surface electrode 16a is arranged at a position different from the formation position of the through hole 12a on the main surface 10a of the substrate 10 facing the substrate 20 and facing the substrate 10 of the substrate 20. On the main surface 20a, the surface electrode 26a is arranged at a position different from the position where the through hole 22a is formed, and the end portion of the through hole 12a opposite to the substrate 20 and the end portion of the through hole 22a opposite to the substrate 10 A method for manufacturing a laminated body 100, wherein the end portion of the laminated body 100 is electrically connected via a conductor portion 14a, a surface electrode 16a, a surface electrode 26a, and a conductor portion 24a.

Description

The present invention relates to a laminate and a method for producing the same.

In the multi-layer wiring board, for example, a circuit-formed double-sided copper-clad laminate and an insulating adhesive are alternately laminated and integrated, and then the entire multi-layer wiring board is laminated at a location required for connection. It can be obtained by providing a through hole that penetrates the through hole and further forming a conductor portion on the inner wall of the through hole by metal plating to provide a through hole that electrically connects both ends of the through hole.

Since the through-holes are formed over the entire stacking direction of the multi-layer wiring board, the circuit is designed to avoid the formation position of the through-through holes on the surface of the multi-layer wiring board in order to avoid electrical connection with the through-holes. The pattern is placed. Therefore, in the through-hole structure, there is a limit to improving the wiring density.

The components mounted on the multilayer wiring board are mainly surface-mounted, and the connecting portion for connecting the components and the multilayer wiring board is getting narrower year by year. With the increase in the density of components mounted on the multilayer wiring board, the number of mounting points is increasing more and more, and it is required to narrow the through-hole pitch of the multilayer wiring board and increase the number of layers of the wiring circuit. For example, an interstitial via hole (IVH: non-IVH) provided with a through hole obtained by forming a conductor portion on the inner wall of the through hole by metal plating after providing a through hole penetrating the entire multilayer wiring board in the stacking direction. Multilayer wiring boards with through holes) are known. Compared to a multi-layer wiring board having only through-holes, this multi-layer wiring board can drill holes with a small diameter and can easily cope with a narrower pitch.

Interlayer connection technology has been developed to support higher densities. For example, after forming a build-up layer on the surface of the wiring board, the inner wall of the non-through hole provided by a laser or the like is plated and both ends of the non-through hole are electrically connected, depending on the required number of layers. The build-up method of stacking one by one is known. Further, as an interlayer connection technique other than the build-up method, a technique for manufacturing a multilayer wiring board using a conductive paste, an anisotropic conductive material, or the like as an interlayer connection member without using plating has been proposed.

For example, in Patent Document 1 below, a member filled with a conductive paste, a circuit board, or the like is superposed in a hole provided in a thin prepreg, and then heated and pressurized to form a single multilayer wiring board. The method of doing so is disclosed.

In Patent Document 2 below, a circuit board, copper foil, etc. are superposed on a structure obtained by pressing an insulating material against a bump formed on the circuit board, copper foil, etc. to allow the bump to penetrate from the insulating material. A multi-layer wiring board obtained by laminating by heating and pressurizing after combining and integrating them is disclosed.

In Patent Document 3 below, vias made of conductive bumps are formed by forming chevron or substantially conical conductive bumps on a conductor plate, and then heating and softening the insulating prepreg base material to allow it to be press-penetrated. The method of forming is disclosed.

In Patent Document 4 below, a plurality of members having conductive vias penetrating in the thickness direction of the insulating member are laminated by filling the holes provided in the cured insulating member with a conductive paste. A method of forming a multi-layer circuit board is disclosed.

Japanese Unexamined Patent Publication No. 11-87870 Japanese Unexamined Patent Publication No. 9-162553 Japanese Unexamined Patent Publication No. 2013-110230 Japanese Unexamined Patent Publication No. 2015-26689

By the way, as a component mounted on the multilayer wiring board, a pin insertion type (press fit pin type) component in which a pin is inserted and held in a through hole (through hole) can be mentioned. In order to use the pin insertion type component, through holes penetrating a plurality of substrates in the multilayer wiring board are required.

It is possible to provide through holes in the multilayer wiring board after obtaining a multilayer wiring board by laminating (interlayer connection) a plurality of substrates, but since it is necessary to penetrate the plurality of substrates, manufacturing the multilayer wiring board There are concerns that the process will be long and the manufacturing cost of the multilayer wiring board will be high. Therefore, it is required to efficiently obtain a laminate on which a pin insertion type component can be mounted as a laminate used as a multilayer wiring board or a laminate used to obtain a multilayer wiring board.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a laminated body capable of efficiently obtaining a laminated body capable of mounting a pin insertion type component. Another object of the present invention is to provide a laminate that can be obtained by the above-mentioned production method.

The method for manufacturing a laminated body according to the present invention is a method for manufacturing a laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate, and penetrates the first substrate. A first through hole is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is formed in the first substrate and the first substrate. A through hole is formed in the insulating member in a state of being arranged between the two substrates, and the first through hole, the second through hole, and the through hole of the insulating member are used to form the through hole. The first substrate has a first conductor portion arranged on the inner wall of the first through hole, and the second substrate has the step of forming a through hole penetrating the laminate. A position where the first through hole is formed on a first main surface of the first substrate facing the second substrate and having a second conductor portion arranged on the inner wall of the second through hole. The first surface electrode is arranged at a position different from that of the second main surface of the second substrate, which is different from the position where the second through hole is formed on the second main surface facing the first substrate. A second surface electrode is arranged in the first through hole on the side opposite to the second substrate and on the second through hole on the side opposite to the first substrate. The end portion is electrically connected via the first conductor portion, the first surface electrode, the second surface electrode, and the second conductor portion.

According to the method for producing a laminate according to the present invention, a first through hole penetrating the first substrate is formed in the first substrate, and a second through hole penetrating the second substrate is a second. A through hole is formed in the insulating member in a state of being formed on the substrate and the insulating member is arranged between the first substrate and the second substrate, and the first through hole and the second through hole are formed. Through holes of the insulating member form through holes that penetrate the laminated body. In this case, since the through holes are formed in advance on the first substrate and the second substrate when the operation of forming the through holes penetrating the laminated body is performed, the first substrate and the first substrate are added to the insulating member. It is not necessary to form a through hole in the substrate of 2. Therefore, it is possible to simplify the manufacturing process of the laminated body and suppress the increase in the manufacturing cost of the laminated body. Therefore, according to the method for manufacturing a laminate according to the present invention, it is possible to efficiently obtain a laminate on which a pin insertion type component can be mounted.

By the way, it is possible to provide through holes in the multilayer wiring board after obtaining a multilayer wiring board by laminating (interlayer connection) a plurality of substrates, but if the substrate is thick, it is difficult to process with a small-diameter drill ( (Drill breakage may occur), and the plating around the conductors placed on the inner wall of the through hole (throwing power. For example, the plating around when the aspect ratio of the through hole exceeds 25). May decrease. On the other hand, according to the method for manufacturing a laminated body according to the present invention, even when the substrate is thick, a through hole penetrating the laminated body can be formed by using a drill having a small diameter. Further, even when the substrate is thick, since the conductor portion is formed on the substrate in advance before laminating the plurality of substrates, it is not necessary to consider the circumstance of plating after laminating the substrates. As a result, the diameter of the holes can be easily reduced, so that the distance between the through holes formed in the substrate can be increased. In this case, the number of signal lines can be increased, and the signal lines can be easily routed.

The method for producing a laminate according to the present invention may be an embodiment in which the through hole of the insulating member is formed by laser processing. The method for producing a laminate according to the present invention may be an embodiment in which the through hole of the insulating member is formed by drilling.

The laminated body according to the present invention is a laminated body having a laminated structure in which an insulating member is interposed between the first substrate and the second substrate, and has a first through hole penetrating the first substrate. The second through hole penetrating the second substrate and the through hole penetrating the insulating member form a through hole penetrating the laminated body, and the first substrate is the first substrate. The first substrate has a first conductor portion arranged on the inner wall of the first through hole, and the second substrate has a second conductor portion arranged on the inner wall of the second through hole. On the first main surface of the substrate facing the second substrate, the first surface electrode is arranged at a position different from the position where the first through hole is formed, and the first surface electrode is arranged at a position different from the position where the first through hole is formed. On the second main surface facing the first substrate, the second surface electrode is arranged at a position different from the position where the second through hole is formed, and the second surface electrode in the first through hole is arranged. The end portion on the side opposite to the substrate and the end portion on the side opposite to the first substrate in the second through hole are the first conductor portion, the first surface electrode, and the first surface electrode. It is electrically connected to the surface electrode of No. 2 via the second conductor portion.

The first surface electrode and the second surface electrode may be electrically connected to each other by a conductive member arranged between the first surface electrode and the second surface electrode.

In the laminate according to the present invention, a third through hole penetrating the first substrate is further formed in the first substrate, and the first substrate is formed in the inner wall of the third through hole. It further has an arranged third conductor portion, and a fourth through hole penetrating the second substrate is further formed in the second substrate, and the second substrate is the fourth substrate. It further has a fourth conductor portion arranged on the inner wall of the through hole, a third surface electrode is arranged on the first main surface, and a fourth surface electrode is arranged on the second main surface. It may be the aspect which is done.

In the laminated body according to the present invention, the third through hole and the fourth through hole are formed at positions where the first substrate, the insulating member, and the second substrate overlap each other in the stacking direction. The third surface electrode is arranged at the position where the third through hole is formed on the first main surface, and the fourth surface electrode is the fourth surface electrode on the second main surface. The mode may be arranged at the formation position of the through hole.

In the laminated body according to the present invention, the third through hole and the fourth through hole are formed at positions where the first substrate, the insulating member, and the second substrate do not overlap each other in the stacking direction. The third surface electrode is arranged at the position where the third through hole is formed on the first main surface, and the fourth surface electrode is the third surface electrode on the second main surface. It may be arranged at a position facing the surface electrode of the above.

Even in a mode in which the third surface electrode and the fourth surface electrode are electrically connected to each other by a conductive member arranged between the third surface electrode and the fourth surface electrode. Good.

The laminate according to the present invention may have a mode in which a conductive member is not arranged between the third surface electrode and the fourth surface electrode.

The diameter of at least one of the first through hole and the second through hole may be larger than the diameter of the through hole of the insulating member.

The diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member.

According to the present invention, it is possible to efficiently and easily obtain a laminated body on which a pin insertion type component can be mounted. According to the present invention as described above, the degree of freedom in designing the laminated body and the degree of freedom in forming through holes can be increased.

FIG. 1 is a schematic cross-sectional view showing a laminated body according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a laminated body according to another embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing a method for manufacturing a laminate according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing a method for manufacturing a laminated body according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the present invention is not limited to the following embodiments. The sizes of the components in each figure are conceptual, and the relative size relationships between the components are not limited to those shown in each figure.

The laminated body according to the present embodiment is a laminated body having a laminated structure in which an insulating member is interposed between the first substrate and the second substrate, and has a first through hole penetrating the first substrate. , The second through hole penetrating the second substrate and the through hole penetrating the insulating member form a through hole penetrating the laminated body, and the first substrate is the first through hole. It has a first conductor portion arranged on the inner wall, and the second substrate has a second conductor portion arranged on the inner wall of the second through hole, and has a second conductor portion in the first substrate. On the first main surface facing each other, the first surface electrode is arranged at a position different from the position where the first through hole is formed, and the second main surface facing the first substrate in the second substrate. In, the second surface electrode is arranged at a position different from the position where the second through hole is formed, and the end portion of the first through hole on the opposite side of the second substrate and the second through hole. The end portion on the opposite side of the first substrate is electrically connected via the first conductor portion, the first surface electrode, the second surface electrode, and the second conductor portion. ing.

The diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate (diameter in the direction orthogonal to the thickness direction of the substrate) may be 0.1 mm or more, and 0.2 mm or more. It may be 0.3 mm or more, 0.4 mm or more, and 0.5 mm or more. The diameter of the through hole of the substrate (first substrate and / or the second substrate) may be 5 mm or less, 3 mm or less, and 1 mm or less. The diameter of the through hole of the first substrate and the diameter of the through hole of the second substrate may be the same as or different from each other.

The diameter of the through hole of the insulating member (diameter in the direction orthogonal to the thickness direction of the insulating member) may be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, and 0. It may be .4 mm or more, 0.45 mm or more, and 0.5 mm or more. The diameter of the through hole of the insulating member may be 1 mm or less, 0.9 mm or less, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less. Good.

The difference between the diameter of the through hole of the substrate (at least one of the first through hole and the second through hole) and the diameter of the through hole of the insulating member is the through hole of the substrate when the through hole is formed in the insulating member. From the viewpoint of easily suppressing damage to the inner conductor portion, it may be 0.1 mm or more, 0.15 mm or more, or 0.2 mm or more. The upper limit of the difference between the diameter of at least one of the first through hole and the second through hole and the diameter of the through hole of the insulating member is, for example, 0.5 mm.

The diameter of the through hole of the insulating member may be the same as or different from the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate. For example, the diameter of the through hole of the substrate (at least one of the first through hole and the second through hole) may be larger than the diameter of the through hole of the insulating member. Further, the diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member. It is preferable that the diameter of the through hole of the insulating member and the diameter of the through hole of the substrate are the same (same diameter). In this case, after forming the through hole in the insulating member, the constituent material of the insulating member is easily removed from the through hole of the substrate, and it is possible to prevent foreign matter and the like from accumulating in the through hole of the substrate. Further, when mounting the component, it is possible to prevent the insulating member from coming into contact with the insertion type pin and scattering the constituent material of the insulating member.

The thickness of the conductor portion (the radial thickness of the through hole in the conductor portion) may be 10 μm or more, 15 μm or more, and 20 μm or more. The thickness of the conductor portions 14a to 14d and the conductor portions 24a to 24d may be 40 μm or less, 35 μm or less, and 30 μm or less.

FIG. 1 is a schematic cross-sectional view showing a laminated body according to the present embodiment. The laminated body (multilayer wiring board) 100 shown in FIG. 1 includes a substrate (first substrate) 10, a substrate (second substrate) 20, and an insulating member 30, and includes the substrate 10 and the substrate 20. It has a laminated structure in which an insulating member 30 is interposed between the two. The insulating member 30 is in contact with the substrate 10 and the substrate 20. The substrate 10, the insulating member 30, and the substrate 20 are laminated in this order.

The size, shape, etc. of the substrates 10 and 20 are not particularly limited. The size, shape, and the like of the substrate 10 and the substrate 20 may be the same or different from each other.

Printed wiring boards can be used as the substrates 10 and 20. Examples of the printed wiring board include a double-sided circuit board, a multi-layer wiring board, and a multi-wire wiring board. The type of base material used for the printed wiring board is not limited, but an insulating base material containing a reinforcing material such as glass cloth is preferable from the viewpoint of controlling deformation (dimensional change) due to pressurization and heating during lamination. From the same viewpoint, as the base material, a base material of FR (Flame Retardant) -5 grade of NEMA (National Electrical Manufacturers Association) standard, a base material having a high glass transition temperature (for example, a base material containing a polyimide resin or the like). Is preferable.

The substrate 10 has a plurality of through holes 12a to 12d penetrating the substrate 10 in the thickness direction of the substrate 10, and has conductor portions (vias) 14a to 14d arranged on the inner wall of the through holes 12a to 12d. doing. The conductor portions 14a to 14d extend from the end portion of the through hole 12a to 12d on the substrate 20 side to the end portion of the through hole 12a to 12d opposite to the substrate 20 along the axial direction of the through hole. The substrate 20 has a plurality of through holes 22a to 22d penetrating the substrate 20 in the thickness direction of the substrate 20, and has conductor portions (vias) 24a to 24d arranged on the inner wall of the through holes 22a to 22d. doing. The conductor portions 24a to 24d extend from the end portion of the through hole 22a to 22d on the substrate 10 side to the end portion of the through hole 22a to 22d opposite to the substrate 10 along the axial direction of the through hole. The substrate 10 and the substrate 20 have a through-hole structure. The through holes 12a to 12d and the through holes 22a to 22d are formed at positions facing each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20.

In the laminated body 100, a through hole 12a (first through hole) penetrating the substrate 10 in the thickness direction of the substrate 10 and a through hole 22a (second through hole) penetrating the substrate 20 in the thickness direction of the substrate 20. The through hole 32a penetrating the insulating member 30 in the thickness direction of the insulating member 30 forms a through hole 100a penetrating the laminated body 100 in the thickness direction of the laminated body 100. The through hole 12b penetrating the substrate 10, the through hole 22b penetrating the substrate 20, and the through hole 32b penetrating the insulating member 30 form a through hole 100b penetrating the laminate 100 in the thickness direction of the laminate 100. doing. The through holes 12a, 12b, 22a, and 22b have a structure in which the central portion in the radial direction is hollow. The hole filling resin 40 is filled in a space other than the occupied space of the conductor portions 14c, 14d, 24c, 24d in the through holes 12c, 12d, 22c, 22d. As the hole filling resin 40, a product name: THP-100DX1 manufactured by Taiyo Ink Mfg. Co., Ltd., a product name: AE1244 manufactured by Tatsuta Electric Wire Co., Ltd., and the like can be used.

The through hole 12a and the through hole 22a constituting the through hole 100a are formed at positions overlapping each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20. The through hole 12b and the through hole 22b constituting the through hole 100b are formed at positions overlapping each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20. When the through hole of the substrate 10 and the through hole of the substrate 20 are formed at positions where they overlap each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20, the central axes of both through holes may be the same axis. , It does not have to be the same axis. At the position where the through hole penetrating the laminated body 100 is not formed, the through hole of the substrate 10 and the through hole of the substrate 20 are formed at positions overlapping each other in the lamination direction of the substrate 10, the insulating member 30, and the substrate 20. It may be formed at a position where it does not overlap with each other.

A surface electrode (first surface electrode, land) 16a is arranged on the main surface (first main surface) 10a of the substrate 10 facing the substrate 20 at a position different from the position where the through hole 12a is formed. The surface electrode 16a is arranged at a position adjacent to the formation position of the through hole 12a on the main surface 10a. The surface electrode 16a is in contact with the conductor portion 14a in the through hole 12a and is electrically connected to the conductor portion 14a. A surface electrode (second surface electrode, land) 26a is arranged on the main surface (second main surface) 20a of the substrate 20 facing the substrate 10 at a position different from the position where the through hole 22a is formed. The surface electrode 26a is arranged at a position adjacent to the formation position of the through hole 22a on the main surface 20a. The surface electrode 26a is in contact with the conductor portion 24a in the through hole 22a and is electrically connected to the conductor portion 24a.

On the main surface 10a, the surface electrode 16b is arranged at a position different from the position where the through hole 12b is formed. Surface electrodes (pads) 16c and 16d are arranged at the positions where the through holes 12c and 12d are formed on the main surface 10a. On the main surface 20a, the surface electrode 26b is arranged at a position different from the position where the through hole 22b is formed. Surface electrodes (pads) 26c and 26d are arranged at the positions where the through holes 22c and 22d are formed on the main surface 20a. When the hole filling resin 40 is filled in the through holes 12c, 12d, 22c, 22d, the surface electrodes 16c, 16d, 26c, 26d are likely to be formed at the formation positions of the through holes 12c, 12d, 22c, 22d. Further, since the surface electrodes 16c, 16d, 26c, and 26d are easily brought into contact with the conductive member (for example, the conductive member 50c described later) electrically connected to the conductor portions 14c, 14d, 24c, and 24d, the surface electrode 16c , 16d, 26c, 26d can be arranged to easily obtain an electrical connection between the conductor portions 14c, 14d, 24c, 24d and the conductive member.

In the laminated body 100, the end portion of the through hole (for example, the through hole 12a) of the substrate 10 on the side opposite to the substrate 20 (the side opposite to the main surface 10a) and the through hole (for example, the through hole 22a) of the substrate 20. The end portion on the side opposite to the substrate 10 (the side opposite to the main surface 20a) is at least the conductor portion of the substrate 10 (for example, the conductor portion 14a (first conductor portion)) and the surface electrode of the substrate 10. (For example, the surface electrode 16a), the surface electrode of the substrate 20 (for example, the surface electrode 26a), and the conductor portion of the substrate 20 (for example, the conductor portion 24a (second conductor portion)) are electrically connected. Has been done. The surface electrode 16a and the surface electrode 26a are electrically connected to each other by a conductive member 50a arranged between the surface electrode 16a and the surface electrode 26a. The surface electrode 16c and the surface electrode 26c are electrically connected to each other by a conductive member 50c arranged between the surface electrode 16c and the surface electrode 26c. The surface electrode 16d and the surface electrode 26d are electrically connected to each other because the insulating member 30 is interposed between the surface electrode 16d and the surface electrode 26d without the conductive member being arranged between the surface electrode 16d and the surface electrode 26d. Not connected to.

The conductive material used for the conductive member (for example, the conductive members 50a and 50c) is not limited as long as it has conductivity, and is melted at a general lamination temperature (200 ° C. or less) in a printed wiring board to be a metal. A material having a remelting temperature of 250 ° C. or higher after the interbonding is formed is preferable. Examples of the conductive material include copper and tin alloys. The conductive material contains, for example, at least one of copper particles and metal-coated copper particles (eg, silver, gold or tin-coated copper particles) as the first metal and tin as the second metal. It preferably contains at least one metal selected from the group consisting of bismuth, silver, zinc and palladium. The second metal preferably forms an intermetallic compound with the first metal. In this case, the second metal preferably contains at least tin. As the conductive member, a conductive paste can be used. Examples of the conductive member include a trade name: HT-710 manufactured by ORMET, and a trade name: MPA500 manufactured by Tatsuta Electric Wire Co., Ltd.

In order to protect the surface of the surface electrode, the surface of the substrate may be subjected to surface treatment (surface finish). The surface treatment is preferably gold plating. Depending on the type of material of the surface electrode (for example, copper), when left in the atmosphere, an oxide film (for example, copper oxide film) may be formed on the surface to reduce the connectivity between the surface electrode and the conductive member. In this case, by protecting the surface of the surface electrode by gold plating or the like, it is easy to suppress the oxidative deterioration of the surface electrode.

The insulating member 30 is not particularly limited as long as it has an insulating property. As the insulating member 30, for example, a film having an insulating property can be used. The insulating material of the insulating member 30 is composed of, for example, a resin composition. The resin composition preferably contains a resin (polymer), and more preferably contains a thermosetting resin, from the viewpoint of easily controlling the fluidity. Examples of the thermosetting resin include epoxy resin, phenol resin, and polyimide resin.

When the resin composition contains a thermosetting resin, the glass transition temperature of the cured product (thermosetting product) is preferably 150 ° C. or higher, more preferably 180 ° C. or higher, from the viewpoint of improving the reflow resistance at the time of component mounting. .. When the resin composition contains a thermosetting resin, the resin composition preferably contains particles such as a filler as a reinforcing material from the viewpoint of suppressing the coefficient of thermal expansion of the cured product.

The glass transition temperature can be measured by the following method.
(Sample preparation method)
The thermosetting resin composition was applied onto a release PET (polyethylene terephthalate) film (manufactured by Teijin DuPont Film Co., Ltd., trade name: A-53) using an applicator so that the thickness after drying was 100 μm. After that, a semi-cured film is prepared by drying under the conditions of a temperature of 130 ° C. and a time of 30 minutes. Next, the semi-cured film is peeled off from the release PET film. Then, after fixing the film by sandwiching the semi-curable film between two metal frames, the film is made of a thermosetting resin composition cured by drying under the conditions of a temperature of 185 ° C. and a time of 60 minutes. To make.
(Measuring method)
Using TA Instruments, device name: TMA-2940, jig: tension, distance between chucks: 15 mm, measurement temperature: room temperature to 350 ° C, temperature rise temperature: 10 ° C / min, tensile load: 5 gf, sample Size: Measured under the condition of width 5 mm × length 25 mm, and obtain the glass transition temperature by the tangential method from the obtained temperature-displacement curve.

Examples of the insulating material of the insulating member 30 include a product name: AS-401HS manufactured by Hitachi Kasei Co., Ltd. and a product name: AS-9500 manufactured by Hitachi Kasei Co., Ltd. When using a non-woven fabric made of glass fiber or carbon fiber, or an insulating material containing glass cloth / carbon cloth, the height of the surface electrode tends to vary from surface electrode to surface electrode due to the difference in thickness due to the density of the non-woven fabric / cloth. The resistance value may become unstable. Therefore, the insulating material does not have to include a non-woven fabric made of glass fiber or carbon fiber, glass cloth, carbon cloth, or the like.

In the laminated body according to the present embodiment, the substrate is a through hole (for example, the above-mentioned through hole 12a, 12b) forming a through hole (for example, a through hole 100a, 100b penetrating the above-mentioned laminate 100) that penetrates the laminate. , 22a, 22b). Only one through hole may be formed through the laminated body, or a plurality of through holes may be formed. Only one through hole forming the through hole penetrating the laminated body may be formed on each substrate, or a plurality of through holes may be formed on at least one substrate.

In the laminated body according to the present embodiment, the substrate may have through holes that do not form through holes that penetrate the laminated body. For example, like the above-mentioned laminated body 100, the substrate 10 may have through holes 12c and 12d (third through holes) in addition to the through holes 12a as through holes penetrating the substrate 10. Further, the substrate 20 may have through holes 22c and 22d (fourth through holes) in addition to the through holes 22a as through holes that penetrate the substrate 20. These through holes 12c, 12d, 22c, 22d do not form through holes that penetrate the laminated body 100. The through holes 12c and 12d and the through holes 22c and 22d are formed at positions facing each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20.

The substrate 10 has conductor portions 14c and 14d (third conductor portions) arranged on the inner walls of the through holes 12c and 12d. Surface electrodes 16c and 16d (third surface electrodes) are arranged on the main surface 10a of the substrate 10, and the surface electrodes 16c and 16d are arranged at positions where through holes 12c and 12d are formed on the main surface 10a. There is. The substrate 20 has conductor portions 24c and 24d (fourth conductor portions) arranged on the inner walls of the through holes 22c and 22d. Surface electrodes 26c and 26d (fourth surface electrodes) are arranged on the main surface 20a of the substrate 20, and the surface electrodes 26c and 26d are arranged at positions where through holes 22c and 22d are formed on the main surface 20a. There is. The surface electrodes arranged at the positions where the through holes that do not form the through holes that penetrate the laminated body are formed are electrically connected to each other by the conductive members arranged between the surface electrodes (the aspects of the surface electrodes 16c and 26c). ), Or a mode in which the conductive member is not arranged between the surface electrodes (aspects of the surface electrodes 16d and 26d). In the embodiment in which the conductive member is not arranged between the surface electrodes, the insulating member 30 is interposed between the surface electrodes.

As another example of the through hole that does not form the through hole that penetrates the laminated body, the example shown in FIG. 2 can be mentioned. In FIG. 2, a through hole 12c and a through hole 22c are formed at positions where the substrate 10, the insulating member 30, and the substrate 20 do not overlap each other in the stacking direction, and the surface electrode 16c forms the through hole 12c on the main surface 10a. It is arranged at a position, and the surface electrode 26c is arranged at a position facing the surface electrode 16c on the main surface 20a. The surface electrodes 16c and 26c may be electrically connected to each other by a conductive member 50c arranged between the surface electrodes 16c and 26c (FIG. 2A), and between the surface electrodes 16c and 26c. There may be a mode in which the conductive member is not arranged in (FIG. 2B).

The laminate according to the present embodiment can be obtained by the method for producing the laminate according to the present embodiment. In the method for manufacturing a laminated body according to the present embodiment, a first through hole penetrating the first substrate is formed in the first substrate, and a second through hole penetrating the second substrate is a second substrate. A through hole is formed in the insulating member in a state where the insulating member is arranged between the first substrate and the second substrate to insulate the first through hole and the second through hole. A through hole forming step of forming a through hole penetrating the laminated body is provided by the through hole of the member.

The method for manufacturing a laminated body according to the present embodiment includes, for example, a substrate preparation step, a conductor portion forming step, a surface electrode forming step, a laminating step, and a through hole forming step in this order.

The substrate preparation step is a step of preparing a substrate (first substrate and second substrate) having through holes penetrating the substrate in the thickness direction of the substrate. As a method for forming the through hole, a method similar to the method for forming the through hole of the insulating member described later (for example, drilling) can be used.

The conductor portion forming step is a step of forming a conductor portion on the inner wall of the through hole of the substrate (the first substrate and the second substrate). The conductor portion can be formed by, for example, plating. In the conductor portion forming step, after forming the conductor portion, an insulating material may be filled in the through holes that do not form the through holes that penetrate the laminated body.

The surface electrode forming step is a step of forming a surface electrode on the main surface of the substrate (first substrate and second substrate) at a position different from the forming position of the through hole forming the through hole penetrating the laminated body. is there. In the surface electrode forming step, the surface electrode can be formed at a position adjacent to the forming position of the through hole forming the through hole penetrating the laminated body. Further, the surface electrode can be formed so as to be in contact with the conductor portion in the through hole of the substrate. The surface electrode can be formed, for example, by etching a metal layer (for example, copper foil) arranged on the main surface of the substrate. The metal layer can be formed, for example, by plating. In the surface electrode forming step, a surface electrode may be further formed on the main surface of the substrate at a position where a through hole that does not form a through hole that penetrates the laminated body is formed.

The laminating step is a step of laminating the first substrate and the second substrate via the insulating member. In the laminating step, the first substrate and the second substrate can be laminated via the insulating member and the conductive member. Since the surface electrodes of the first substrate and the surface electrodes of the second substrate are electrically connected, the substrates can be laminated and heated / pressurized with these surface electrodes facing each other.

When stacking boards together, from the viewpoint of accurate alignment, the pins for stacking alignment are inserted into the through holes (through holes for alignment) provided for inserting the pins to align the substrates. Is preferable. The stacking alignment pin may be inserted into only one through hole or may be inserted into a plurality of through holes.

In the laminating step, since the surface electrodes arranged on the main surface of the substrate are electrically connected to each other, a through hole is formed at a position between the surface electrodes in the insulating member. A through hole may not be formed at a position where the surface electrodes of the insulating member are not electrically connected to each other, or a through hole may be formed. The method for forming the through hole of the insulating member is not particularly limited, and the method for forming the through hole of the insulating member described later in the through hole forming step can be used.

It is preferable that a release film is arranged on the surface of the insulating member. In this case, it is possible to prevent foreign matter from adhering to the surface of the insulating member. Further, the release film serves as a protective film for protecting the surface of the insulating member when the conductive member (for example, the conductive paste) is supplied in the subsequent step, and is adjusted to the supply position of the conductive member. Since it is not necessary to prepare an open protective mask, the manufacturing cost of the laminate can be reduced. Examples of the release film include a single-sided release-treated PET film manufactured by Teijin DuPont Co., Ltd. (for example, trade name: A-31). When laminating the substrates, the release film is peeled off.

After forming a through hole in the insulating member, the insulating member is laminated on the main surface of the substrate. Next, when the surface electrodes are connected to each other by a conductive member, the through hole of the insulating member is filled with the conductive member. The conductive member filled in the through hole is in contact with the surface electrode. The conductive member may be filled in the through hole after laminating the substrate and the insulating member, or may be filled in the through hole before laminating. For example, after the insulating member is attached to the first substrate, the through hole can be filled with the conductive member, and then the second substrate can be laminated on the first substrate and the insulating member. In the insulating member, if an opening is formed at a position where the through hole forming the through hole penetrating the laminated body is formed, the conductive member is arranged in the opening and the through hole forming the through hole penetrating the laminated body is formed. It is preferable that the opening is not formed at the position where the through hole forming the through hole penetrating the laminated body is formed because it hinders the formation of the hole.

Examples of the method of supplying the conductive member include a method of arranging the conductive paste by a screen printing method, a dispenser method, or the like. Examples of the conductive paste include a material in which a metal material is mixed with a binder resin to maintain viscosity and facilitate screen printing, dispenser processing, and the like. When such a conductive paste is used, it is preferable to increase the viscosity of the conductive paste by pre-curing the binder resin by performing a heat treatment after arranging the conductive paste from the viewpoint of maintaining the shape of the conductive member. In this case, the heat treatment can be performed at a temperature of 70 to 150 ° C. and a time of 10 to 120 minutes. When the temperature is 70 ° C. or higher, or the time is 10 minutes or longer, the viscosity can be sufficiently increased and the shape of the conductive paste can be easily maintained. When the temperature is 150 ° C. or lower or the time is 120 minutes or less, the viscosity becomes excessively high and / or the curing of the binder resin is likely to be suppressed, and it is sufficient even if the conductive paste melts. Intermetallic compounds are likely to be formed. Sufficient connectivity can be easily ensured by maintaining the shape of the conductive member.

In the through-hole forming step, a first through-hole that penetrates the first substrate is formed in the first substrate, a second through-hole that penetrates the second substrate is formed in the second substrate, and the insulating member is formed. A through hole is formed in the insulating member in a state where is arranged between the first substrate and the second substrate, and the first through hole, the second through hole, and the through hole of the insulating member form a through hole. , Form a through hole penetrating the laminate. The through hole of the insulating member can be formed by treating a portion of the insulating member exposed from the through hole through the first through hole or the second through hole.

The method of forming the through hole of the insulating member is not particularly limited. The through hole may be formed by a physical treatment or a chemical treatment. Examples of the physical processing include laser processing (laser irradiation), drilling (cutting), punching and the like. Examples of the chemical treatment include chemical treatment. In the drilling process, the conductor portion in the through hole of the substrate may be scraped. When the insulating material is melted by the chemical treatment to form a through hole, it is preferable to attach a release film (for example, PET film) or the like in order to suppress the adhesion of the chemical solution on the substrate surface. When laser machining is used, since the machining is performed by irradiating a laser, it is easier to suppress damage to the conductor portion regardless of the hole diameter or the drill diameter, as compared with cutting machining such as a drill. Therefore, laser machining is preferable as a method for forming through holes in the insulating member.

Examples of the laser in laser processing include a CO ₂ laser, a UV laser, a YAG laser, and a UV-YAG laser. Laser wavelength of CO ₂ laser while a 9400Nm, laser wavelength of UV-YAG laser is 355 nm, although toward the UV-YAG laser is superior in small machining, mass production of current even with CO ₂ laser Can form a hole having a diameter of 50 μm or more. Furthermore, since the output of the CO ₂ laser is 10 times or more larger than the output of the UV laser, the production efficiency of the CO ₂ laser is higher than that of the UV laser. Therefore, as the laser, a CO ₂ laser is preferable.

Hereinafter, a method for manufacturing the laminated body 100 of FIG. 1 will be described as an example with reference to FIGS. 3 and 4. 3 and 4 are schematic cross-sectional views showing a method of manufacturing a laminated body according to the present embodiment.

First, as shown in FIG. 3A, a substrate 10 having through holes 12a to 12d penetrating the substrate 10 in the thickness direction of the substrate 10 is prepared. The substrate 10 has a main surface 10a that faces the substrate (board 20) laminated on the substrate 10.

Next, as shown in FIG. 3B, conductor portions 14a to 14d are formed on the inner walls of the through holes 12a to 12d of the substrate 10. Subsequently, the through holes 12c and 12d are filled with an insulating material. Then, the surface electrodes 16a and 16b are formed on the main surface 10a of the substrate 10 at positions different from the positions where the through holes 12a and 12b forming the through holes 100a and 100b penetrating the laminated body 100 are formed. Further, on the main surface 10a of the substrate 10, surface electrodes 16c and 16d are formed at positions where through holes 12c and 12d that do not form through holes that penetrate the laminated body 100 are formed.

Further, as a substrate to be laminated on the substrate 10, a substrate 20 having the same configuration as the substrate 10 is prepared.

Next, as shown in FIG. 4A, an insulating member 30 having a through hole formed at a position corresponding to the arrangement position of the surface electrodes 16a and 16c of the substrate 10 is prepared. Subsequently, the insulating member 30 is attached to the main surface 10a of the substrate 10 and then heated and pressurized. Then, the through holes of the insulating member 30 are filled with the conductive members 50a and 50c so that the surface electrode 16a and the conductive member 50a are brought into contact with each other, and the surface electrode 16c and the conductive member 50c are brought into contact with each other. Further, the insulating member 30 is attached to the main surface 20a on which the surface electrodes 26a to 26d of the substrate 20 are arranged so that the surface electrodes 26a to 26d of the substrate 20 face the surface electrodes 16a to 16d of the substrate 10, and then heated. Pressurize. In this case, the insulating member 30 is arranged at a position between the through hole 12a and the through hole 22a, a position between the through hole 12b and the through hole 22b, and a position between the through hole 12d and the through hole 22d. Has been done.

Next, as shown in FIG. 4B, the through hole 12a, the through hole 22a, and the through hole 32a are formed by forming the through hole 32a in the portion between the through hole 12a and the through hole 22a in the insulating member 30. Therefore, a through hole 100a penetrating the laminated body 100 is formed. Further, by forming the through hole 32b in the portion between the through hole 12b and the through hole 22b in the insulating member 30, the through hole 100b penetrates the laminated body 100 through the through hole 12b, the through hole 22b and the through hole 32b. To form. From the above, the laminated body 100 of FIG. 1 can be obtained.

According to the method for manufacturing the laminated body 100 according to the present embodiment, through holes 12a and 12b penetrating the substrate 10 are formed in the substrate 10, and through holes 22a and 22b penetrating the substrate 20 are formed in the substrate 20 for insulation. Through holes 32a and 32b are formed in the insulating member 30 in a state where the member 30 is arranged between the substrate 10 and the substrate 20, and the through holes 12a and 12b, the through holes 22a and 22b and the through holes 32a and 32b are formed. , The through holes 100a and 100b that penetrate the laminated body 100 are formed. In this case, when the operation of forming the through holes 100a and 100b penetrating the laminated body 100 is performed, the through holes 12a, 12b, 22a and 22b are formed in advance on the substrate 10 and the substrate 20, so that the insulating member 30 has In addition, it is not necessary to form through holes in the substrate 10 and the substrate 20. Therefore, it is possible to simplify the manufacturing process of the laminated body and suppress the increase in the manufacturing cost of the laminated body. Therefore, according to the method for manufacturing the laminated body 100 according to the present embodiment, it is possible to efficiently obtain the laminated body 100 to which the pin insertion type component can be mounted.

According to the method for manufacturing the laminated body 100 according to the present embodiment, even when the substrate is thick, a through hole penetrating the laminated body can be formed by using a drill having a small diameter. Further, even when the substrate is thick, since the conductor portion is formed on the substrate in advance before laminating the plurality of substrates, it is not necessary to consider the circumstance of plating after laminating the substrates. As a result, the diameter of the holes can be easily reduced, so that the distance between the through holes formed in the substrate can be increased. In this case, the number of signal lines can be increased, and the signal lines can be easily routed.

In the method for manufacturing the laminated body 100 according to the present embodiment, the end portion of the through hole 12a on the opposite side of the substrate 20 and the end portion of the through hole 22a on the opposite side of the substrate 10 are the conductor portion 14a and the surface. By being electrically connected via the electrode 16a, the conductive member 50a, the surface electrode 16b, and the conductor portion 24a, both sides of the laminate 100 can be electrically connected.

According to this embodiment, it is possible to obtain a laminated body having excellent connection reliability. Further, even when the substrate is thick, it is possible to efficiently obtain a laminated body on which pin insertion type components can be mounted.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, the number of laminated substrates is not particularly limited, and may be three or more layers. In a laminated body having three or more layers, it is sufficient that through holes penetrating the entire laminated structure are formed from one surface to many directions of the laminated structure of two or more layers, and the three layers are formed from one surface to many directions of the laminated body. It is not necessary that a through hole penetrating the above is formed. When a through hole penetrating the entire laminate is formed, it is easy to prevent the liquid from remaining in the through hole even when the laminate is treated with a liquid.

(Example 1)
Wiring circuits are formed on both sides of an epoxy resin-based copper-clad laminate (manufactured by Hitachi Kasei Co., Ltd., trade name: MCL-E-679) having a resin layer thickness of 0.10 mm, a copper foil thickness of 18 μm, and a size of 660 mm × 615 mm. 10 inner layer substrates were prepared.

Next, 20 sheets of prepreg A (manufactured by Hitachi Kasei Co., Ltd., trade name: GEA-679) having a resin layer thickness of 0.1 mm and a size of 660 mm × 615 mm were prepared. Subsequently, the alignment between the inner layer substrates was performed by the pin lamination method. Then, one inner layer substrate and two prepregs A were arranged alternately, and one prepreg B (prepreg similar to prepreg A) was arranged further outside the inner layer substrate arranged on the outermost side. Further, after placing an electrolytic copper foil (manufactured by Nippon Electrolytic Co., Ltd., trade name: YGP-18) having a thickness of 18 μm and a size of 660 mm × 615 mm on the prepreg B, it is heated and pressed by a vacuum press to be integrated. It became. After the heating / pressurizing press, the prepreg resin protruding from the end face was cut to a substrate size of 605 mm × 500 mm to obtain a structure A having a thickness of 3.00 mm.

Next, using an NC control drilling machine, drilling was performed with a drill having a diameter of 0.65 mm according to the position of the inner layer of the structure A to form a through hole (diameter: 0.65 mm).

Next, after removing smear in the pores by permanganate treatment, a plating layer (conductor portion) having a thickness of 25 μm was formed using thick electroless copper plating.

Next, a hole filling resin (manufactured by Taiyo Ink Mfg. Co., Ltd., trade name: THP-100DX1) was prepared as a non-conductive material, and then the resin was filled by a screen printing method using a vacuum printing machine. At this time, the resin filling is not performed on the through holes that form the through holes that penetrate the multilayer wiring board (finally obtained laminate), but on the through holes that do not form the through holes that penetrate the multilayer wiring board. went. Next, thick electroless copper plating was performed on the entire main surface of the substrate including the resin-filled portion to form a copper layer having a thickness of 15 μm. Next, by etching the copper layer by the tenting method, the surface electrode A arranged at a position adjacent to the formation position of the through hole forming the through hole penetrating the multilayer wiring board on the substrate was embedded with resin. Two printed wiring boards having a surface electrode B (lid plating) arranged at a location were produced.

Next, insulation including a resin layer (nominal thickness: 0.075 mm) made of a resin composition containing a thermosetting resin and a PET film (thickness: 0.025 mm) arranged on one side of the resin layer. The surface electrodes are electrically connected to the member (manufactured by Hitachi Kasei Co., Ltd., trade name: AS-401HS, size 605 mm x 500 mm) with a drill having a diameter of 0.55 mm using an NC control drilling machine. A through hole was formed at a position where the conductive member for the purpose was arranged. Further, a through hole was formed at a position where a pin for holding the layers was arranged during stacking.

Next, the insulating member was placed on one surface of the first printed wiring board so that the resin layer of the insulating member was in contact with the first printed wiring board and the surface electrode was exposed from the through hole of the insulating member. Subsequently, using a vacuum laminator, heating and pressurization were performed under the conditions of a temperature of 85 ° C., a pressure of 0.5 MPa, and a pressurization time of 30 seconds (evacuation for 30 seconds).

Next, a conductive material (manufactured by Tatsuta Electric Wire Co., Ltd., trade name: MPA500) was filled in the through hole of the insulating member from which the surface electrode electrically connected was exposed. The number of holes filled was 12,000. At this time, the PET film arranged on the surface of the insulating member serves as a protective mask, and the MPA500 is supplied only into the through holes of the insulating member to prevent the MPA500 from adhering to other parts of the insulating member.

Next, the PET film arranged on the surface of the insulating member was peeled off from the insulating member. Subsequently, a pin is inserted into the through hole of the first printed wiring board to perform alignment, and then the second printed wiring board is placed on the insulating member, and then the temperature is 180 ° C. and the pressure is 3 MPa with a vacuum press. The structure B was produced by heating and pressurizing under the pressing conditions of 90 minutes. At this time, the printed wiring boards were overlapped with each other so that the surface electrodes of the first printed wiring board and the surface electrodes of the second printed wiring board faced each other.

Next, using a laser drilling machine (CO ₂ laser), a laser irradiation was performed on a portion of the insulating member exposed from the through hole of the printed wiring board to form a through hole (diameter 0.55 mm) in the insulating member. Laser irradiation was performed under the conditions of an output of 6.0 W, a period of 1.0 ms, a pulse width of 30 μs, and 20 shots. As a result, a portion of the insulating member located between the through holes of the two printed wiring boards was removed, and a multilayer wiring board (laminated body) having through holes penetrating the multilayer wiring boards was obtained.

(Example 2)
After manufacturing the structure B in the same manner as in the first embodiment, a through hole (diameter 0) is formed in a portion of the insulating member exposed from the through hole of the printed wiring board with a drill having a diameter of 0.45 mm using an NC control drilling machine. By forming .45 mm) on the insulating member, a multilayer wiring board (laminated body) having a through hole penetrating the multilayer wiring board was obtained.

10, 20 ... Substrate, 10a, 20a ... Main surface, 12a to 12d, 22a to 22d, 32a to 32b ... Through holes, 14a to 14d, 24a to 24d ... Conductor portion, 16a to 16d, 26a to 26d ... Surface electrodes, 30 ... Insulating member, 40 ... Filling resin, 50a, 50c ... Conductive member, 100 ... Laminate, 100a, 100b ... Through holes.

Claims (12)

A method for manufacturing a laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate.
A first through hole penetrating the first substrate is formed in the first substrate, a second through hole penetrating the second substrate is formed in the second substrate, and the insulating member is formed. A through hole is formed in the insulating member in a state of being arranged between the first substrate and the second substrate, and the first through hole, the second through hole, and the insulating member are formed. A step of forming a through hole penetrating the laminated body by the through hole of the above.
The first substrate has a first conductor portion arranged on the inner wall of the first through hole.
The second substrate has a second conductor portion arranged on the inner wall of the second through hole.
On the first main surface of the first substrate facing the second substrate, the first surface electrode is arranged at a position different from the position where the first through hole is formed.
On the second main surface of the second substrate facing the first substrate, the second surface electrode is arranged at a position different from the position where the second through hole is formed.
The end portion of the first through hole opposite to the second substrate and the end portion of the second through hole opposite to the first substrate are the first conductor portion. A method for manufacturing a laminated body, wherein the first surface electrode, the second surface electrode, and the second conductor portion are electrically connected to each other. The method for manufacturing a laminate according to claim 1, wherein the through hole of the insulating member is formed by laser processing. The method for manufacturing a laminate according to claim 1, wherein the through hole of the insulating member is formed by drilling. A laminated body having a laminated structure in which an insulating member is interposed between a first substrate and a second substrate.
A first through hole penetrating the first substrate, a second through hole penetrating the second substrate, and a through hole penetrating the insulating member form a through hole penetrating the laminated body. Consists and
The first substrate has a first conductor portion arranged on the inner wall of the first through hole.
The second substrate has a second conductor portion arranged on the inner wall of the second through hole.
On the first main surface of the first substrate facing the second substrate, the first surface electrode is arranged at a position different from the position where the first through hole is formed.
On the second main surface of the second substrate facing the first substrate, the second surface electrode is arranged at a position different from the position where the second through hole is formed.
The end portion of the first through hole opposite to the second substrate and the end portion of the second through hole opposite to the first substrate are the first conductor portion. , A laminate that is electrically connected via the first surface electrode, the second surface electrode, and the second conductor portion. 4. The fourth aspect of the present invention, wherein the first surface electrode and the second surface electrode are electrically connected to each other by a conductive member arranged between the first surface electrode and the second surface electrode. The laminate described. A third through hole penetrating the first substrate is further formed in the first substrate.
The first substrate further comprises a third conductor portion arranged on the inner wall of the third through hole.
A fourth through hole penetrating the second substrate is further formed in the second substrate.
The second substrate further has a fourth conductor portion arranged on the inner wall of the fourth through hole.
A third surface electrode is arranged on the first main surface, and the third surface electrode is arranged.
The laminate according to claim 4 or 5, wherein a fourth surface electrode is arranged on the second main surface. The third through hole and the fourth through hole are formed at positions where the first substrate, the insulating member, and the second substrate overlap each other in the stacking direction.
The third surface electrode is arranged at a position where the third through hole is formed on the first main surface.
The laminate according to claim 6, wherein the fourth surface electrode is arranged at a position where the fourth through hole is formed on the second main surface. The third through hole and the fourth through hole are formed at positions where the first substrate, the insulating member, and the second substrate do not overlap each other in the stacking direction.
The third surface electrode is arranged at a position where the third through hole is formed on the first main surface.
The laminate according to claim 6, wherein the fourth surface electrode is arranged at a position facing the third surface electrode on the second main surface. 6 to claim 6, wherein the third surface electrode and the fourth surface electrode are electrically connected to each other by a conductive member arranged between the third surface electrode and the fourth surface electrode. 8. The laminate according to any one of 8. The laminate according to any one of claims 6 to 8, wherein no conductive member is arranged between the third surface electrode and the fourth surface electrode. The laminate according to any one of claims 4 to 10, wherein the diameter of at least one of the first through hole and the second through hole is larger than the diameter of the through hole of the insulating member. The laminate according to any one of claims 4 to 11, wherein the diameter of the first through hole and the diameter of the second through hole are larger than the diameter of the through hole of the insulating member.

Images