WO2019119758A1 - 一种芯片插槽及网络系统 - Google Patents

一种芯片插槽及网络系统 Download PDF

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Publication number
WO2019119758A1
WO2019119758A1 PCT/CN2018/092328 CN2018092328W WO2019119758A1 WO 2019119758 A1 WO2019119758 A1 WO 2019119758A1 CN 2018092328 W CN2018092328 W CN 2018092328W WO 2019119758 A1 WO2019119758 A1 WO 2019119758A1
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WO
WIPO (PCT)
Prior art keywords
metal sheets
terminal
slot
metal
row
Prior art date
Application number
PCT/CN2018/092328
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English (en)
French (fr)
Inventor
刘天任
欧康华
蔡远彬
钟军威
陈显峰
王峰
张志伟
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201880003873.4A priority Critical patent/CN110088986B/zh
Priority to EP18890859.4A priority patent/EP3716410A4/en
Publication of WO2019119758A1 publication Critical patent/WO2019119758A1/zh
Priority to US16/904,849 priority patent/US11189970B2/en
Priority to US17/534,954 priority patent/US11777257B2/en
Priority to US18/243,779 priority patent/US20240072493A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base

Definitions

  • the present application relates to the technical field of communication, and in particular to a chip socket and a network system.
  • the next-generation DDR (Double Data Rate) memory doubles the speed (3.2Gbps ⁇ 6.4Gbps), and SI (Signal Integrity) changes.
  • DDR5 Double Data Rate
  • SI Signal Integrity
  • the SI performance of the passive link between the CPU (Central Processing Unit) and the memory module is also crucial, how to pass the DDR signal passively. The effects of crosstalk, reflection, and impedance of the link are minimized, which is the focus of product engineering application design.
  • the memory slot is an important part of the passive link.
  • the pin size/form/pin arrangement (pin arrangement) design will directly affect the SI performance; the memory bank can do the signal pin S (Signal) and ground.
  • the pin G (GND) is staggered, and the crosstalk resistance is good.
  • the memory slot pins are continuously arranged in a plurality of signal pins due to the terminal fabrication process, and the PCB (Printed Circuit Board) pad is also corresponding. Arranged, causing large crosstalk between signals.
  • the present application provides a chip slot and a network system for facilitating crosstalk between signals to improve signal transmission.
  • a chip slot in a first aspect, includes: a slot in which a plurality of terminal groups are disposed, and terminals in each terminal group include symmetrically disposed opposite to the slot a metal piece of two inner side walls, and each metal piece has a bent pin that extends outside the slot;
  • the bending direction of the bent pins of the terminals in each terminal group is the same;
  • the bending pins of the metal sheets in the adjacent terminal groups are alternately arranged on both sides of the row of metal sheets along the arrangement direction of the row of metal sheets.
  • the length direction of the bend pins is perpendicular to the direction in which the metal sheets are arranged.
  • the distance between the bent pins is further improved, and the signal transmission effect is improved.
  • At least two terminals are included in each terminal set.
  • the terminals are grouped according to functions, so that the interval between the terminals of the same function is larger, the signal crosstalk is further avoided, and the signal transmission effect is improved.
  • each terminal set includes a first terminal and a second terminal.
  • the ends of the bend pins are provided with pads.
  • the pads of the bend pins are provided with solder.
  • the pads are circular pads.
  • the pad when the terminal group includes the first terminal and the second terminal, the pad has a convex structure convexly protruding from the bent pin, and a convex direction of the adjacent pad Opposite.
  • the number of terminals in the terminal set is the same.
  • a network system comprising the chip socket of any of the above.
  • FIG. 1 is a schematic structural diagram of a slot provided by an embodiment of the present application.
  • FIG. 2 is a bottom end view of a slot provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a terminal according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of cooperation between a slot and a terminal according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a bent pin of a terminal according to an embodiment of the present application.
  • FIG. 6 is a schematic view showing a connection between a chip slot and a circuit board in the prior art
  • FIG. 7 is a schematic diagram of a chip slot connected to a circuit board according to an embodiment of the present application.
  • the embodiment of the present application provides a chip slot, which improves the arrangement of the bent pins of the terminal, thereby Increase the spacing between the bend pins to improve signal crosstalk between the terminals.
  • FIG. 1 and FIG. 2 show the structure of the chip socket 10 provided by the embodiment of the present application.
  • the chip socket 10 comprises two parts: a slot 10 and a terminal set 20.
  • the terminal set 20 includes at least one terminal, such as each terminal set 20 including a terminal. , or at least two terminals (two terminals, three terminals or three or more terminals), when divided specifically, according to the function of different terminals, and the number of terminals between different terminal groups 20 may be the same, different.
  • the terminal group 20 includes two terminals, which are a first terminal 21a and a second terminal 21b, respectively.
  • each terminal includes two metal pieces 211, which are referred to as a pair of metal pieces 211.
  • the metal piece 211 has a bent pin 212.
  • the metal piece 211 is located in the slot 10 for mating with the inserted chip, and the bent pin 212 is extended outside the slot 10 for electrically connecting the chip socket 10 to the circuit board.
  • the structure of the slot 10 includes a recess 11 and a solid structure carrying the recess 11.
  • the bottom of the groove of the groove 11 is provided with a through hole 13, and when assembled, a pair of metal pieces are respectively disposed on the opposite inner side walls of the slot 10, that is, two opposite inner side walls of the groove 11, and are bent
  • the pin passes through the through hole 13 and is exposed outside the bottom surface 12 of the slot 10.
  • embodiments of the present application improve the orientation of the bend pins of the terminals in the different terminal sets 20 during specific assembly.
  • the bent pins exposed outside the slot 10 are turned into four rows to increase the distance between the bent pins of the same signal.
  • FIG. 4 when the bending structure in each terminal group 20 is specifically provided, the bending direction of each of the bent structures of the terminals is the same, and for any two adjacent terminals, one of the terminals In any row of metal sheets in the group 20, along the direction in which the rows of metal sheets are arranged, the bent pins of the metal sheets in the adjacent terminal groups 20 are alternately arranged on both sides of the row of metal sheets. 4 is a terminal group, which is shown in FIG.
  • the 20b includes a first terminal 21a and a second terminal 21b. Further, the terminal group 20a and the terminal group 20b are alternately arranged (only one set of the terminal group 20a and the terminal group 20b are shown in the drawing).
  • the bending pins of the two metal sheets in the first terminal 21a included in the first terminal 21a have the same bending direction, and are bent upwards (the direction in which the slot is shown in FIG. 4 is In the reference direction), the bending direction of the bending pins of the two metal pieces of the second terminal 21b is the same as the bending direction of the bending pin of the first terminal 21a. That is, for the terminal group 20a, the bending directions of the bent pins included are the same.
  • the bending pins of the first terminal 21a and the second terminal 21b included are the same, but the bending of the first terminal 21a and the second terminal 21b in the terminal group 20b
  • the feet are bent downwards. That is, the bending directions of the bent pins of the terminals in the adjacent two terminal groups are opposite.
  • four rows of bent pins are formed on the bottom surface of the slot.
  • the four rows of pins are respectively two rows of bent pins formed by the terminals in the terminal group 20a, and the two rows of bent pins formed by the terminals in the terminal group 20b.
  • the auxiliary line c is a line formed by arranging a row of metal sheets
  • the auxiliary line e is formed by arranging another row of metal sheets.
  • a straight line, the auxiliary line d is a straight line between the auxiliary line c and the auxiliary line d, and the vertical distances of the auxiliary line d to the auxiliary line c and the auxiliary line e are equal.
  • one row of bent structures is located on the upper side of the auxiliary line c, and the other row of bent structures is located on the upper side of the auxiliary line e, in the terminal group 20b
  • one row of the bending structure is located on the lower side of the auxiliary line c, and the other row of the bending structure is located on the lower side of the auxiliary line e.
  • a row of the bent structure of the terminal group 20a and a row of bent structures of the terminal group 20b are arranged on both sides of the auxiliary line d, thereby There is a sufficient distance between the two adjacent rows of bent structures.
  • the two rows of bending structures located between the auxiliary line c and the auxiliary line e are arranged in a staggered manner. Therefore, the distance between the bending structures is maximized, thereby reducing the distance between the solder joints when the bending structure is connected to the circuit board, and reducing the signal crosstalk between the terminals.
  • the distance between the pins can be increased, as in a specific example, when two rows of pins are used and four rows of pins provided by the embodiment of the present application are used,
  • the pitch of the feet is increased from 0.85mm to 1.25mm, and the distance between the vias on the board is increased from 40mil to 88mil.
  • the board layout can be designed in common (to achieve common ground on the board) to improve crosstalk.
  • the chip slot provided by the present application includes a slot and two rows of metal pieces located in the slot.
  • the so-called row extends in the same direction as the slot.
  • the two rows of metal sheets are respectively disposed on the two opposite inner side walls of the slot.
  • the two rows of metal sheets are divided into a plurality of terminal groups.
  • Each of the terminal sets includes a pair of metal pieces, the pair of metal pieces are symmetrically disposed in the slots, and the pair of metal pieces are respectively located in the two rows of metal pieces.
  • the bending directions of the bending pins of the plurality of metal sheets located in the same terminal group are the same.
  • the bending direction of the bending pins of the plurality of metal sheets located in the same terminal group is the bending direction of the terminal group, and the bending directions of the adjacent two terminal groups are opposite. Further, the bending direction of each terminal group is perpendicular to the depth direction of the slot.
  • each metal piece includes a body 211 and a bent pin 212.
  • the body 211 and the bend pin 212 are integrally formed. After the metal sheet is placed in the slot 10, the body 211 is located in the slot 10, and the through hole of the bent pin 212 passing through the bottom of the slot 10 is located outside the slot 10.
  • the bodies of all the metal sheets located in the adjacent two terminal groups and located in a row of metal sheets are located on the first straight line.
  • the chip slot provided by the present application includes two rows of metal sheets, and one row of metal sheets described herein is one of the two rows of metal sheets.
  • the bending pins of all the metal sheets located in one of the terminal groups and located in the row of metal sheets are located on one side of the first straight line, and are located in the other terminal group and located in the row of gold fingers.
  • the bending pins of all the metal sheets are located on the other side of the first straight line. Wherein one side of the first straight line and the other side of the first straight line are opposite sides.
  • the ends of the bent pins of all the metal sheets located in one of the terminal groups and located in the row of metal sheets are located on the second straight line. Further, the second line is parallel to the first line.
  • the ends of the bent pins of all the metal sheets located in the other terminal group and located in the row of gold fingers are located on the third straight line. Further, the third line is parallel to the first line.
  • two adjacent pairs of metal sheets are used to transmit different types of signals, respectively.
  • one of the two adjacent pairs of metal sheets is used to transmit signals, and the other pair of metal sheets is used for grounding.
  • the terminals having the same function are spaced apart when the terminals are specifically set.
  • the functions of the first terminal 21a and the second terminal 21b are different, for example, the first terminal 21a is a signal terminal, and the second terminal 21b is Ground terminal.
  • the terminal groups are arranged, the first terminal 21a, the second terminal 21b, the first terminal 21a, and the second terminal 21b are alternately arranged.
  • the interval between the terminals of the same function is increased, and, as shown in FIG. 4, since the bending directions of the bent structures of the adjacent terminal groups are opposite, the bending of the bent structure of the terminals of the same function is performed.
  • the opposite direction is, so that the spacing between the solder joints of the same function terminal when soldering to the circuit board is increased, the signal crosstalk is further reduced, and the effect of the chip slot on the signal transmission is improved.
  • each terminal group may have three terminals, four terminals, and the like.
  • the bending structure is provided, as shown in FIG. 4, the longitudinal direction of the bending pin is perpendicular to the direction in which the metal sheets are arranged.
  • the bending structure is not limited to one structure shown in FIG. 4, and a certain angle between the bending structure and the auxiliary line may be adopted. Taking the structure shown in FIG. 4 as an example, the first terminal When the bending structure of 21a is bent upward with respect to the auxiliary line c, it can be inclined in the left-right direction.
  • the inclination direction of each row of bending structures should be uniform to ensure the spacing between the bending pins.
  • solder 214 is disposed on the pad 213, and the solder may be a solder ball or a rectangular parallelepiped solder.
  • a solder ball is used, a BGA (Ball Grid Array) surface array lead package is formed. Thereby avoiding signal reflections.
  • FIG. 6 and FIG. 7 wherein FIG.
  • FIG. 6 is a schematic diagram of the connection of the chip slot 1 in the prior art when soldered to the circuit board 4
  • FIG. 7 is a chip slot provided in the embodiment of the present application.
  • the chip slot 1 connects the pin 2 to the circuit board 4 through the solder 3, and the bent pin 2 forms a pile line (where the signal does not pass), and the length thereof is L, and the pile line exists.
  • Parasitic capacitance which reflects the signal and affects the normal waveform of the signal, causing bit errors.
  • the chip slot 10 provided in the embodiment of the present application is a BGA surface array lead package.
  • the terminal 20 When the connection is made, the terminal 20 is directly soldered to the circuit board 30 through the solder ball. Therefore, when soldering, Pile lines are formed so that there are no reflection problems. Further, the effect of signal transmission is further improved. In addition, in the BGA surface array lead package, the soldering effect can be greatly improved, and the soldering defect rate can be reduced from 1000ppm to less than 100ppm, which greatly improves the yield of the product.
  • the width of the pad 213 is greater than the width of the bending pin 212, and therefore, the pad 213 may be rounded in a specific arrangement.
  • the center of the circle is located at the center line of the bend pin 212 in its length direction.
  • each terminal group has two terminals, and therefore, the bending pins 212 in the same direction only have Two, when considering the soldering space, when the pad 213 is disposed, the pad 213 has a convex structure that is convexly convex to the bent pin 212, and the convex directions of the adjacent pads 213 are opposite to each other.
  • the placement direction of the terminals shown in FIG. 5 is referred to as a reference direction, one pad is disposed obliquely upward, and the other pad is disposed downward, thereby increasing the distance between the two pads 215. As shown in FIG.
  • the upper terminal is the first terminal 21a
  • the lower terminal is the second terminal 21b
  • the first pad 213a of the first terminal 21a has an upward convex structure 215a to increase the first The area of the pad 213a
  • the second pad 213b of the second terminal 21b has a downward convex structure 215b to increase the area of the second pad 213b.
  • the application also provides a network system, which can be a common communication network system such as a server.
  • the network system includes the chip socket of any of the above.

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种芯片插槽(10)，该芯片插槽(10)包括：插槽(10)，所述插槽(10)内设置有多个端子组(20)，每个端子组(20)中的端子包括对称设置在所述插槽(19)相对的两个内侧壁的金属片(211)，且每个金属片(211)具有外延到所述插槽(10)外的折弯引脚(212)；其中，每个端子组(20)中的端子的折弯引脚(212)的折弯方向相同；任意相邻的两个端子组(20)中的任一排金属片(211)，沿该排金属片(211)的排列方向，相邻端子组(20)中的金属片(211)的折弯引脚(212)交替排列在该排金属片(211)的两侧。通过将一排金属片(211)的折弯引脚(212)朝向两个不同的方向折弯，从而增大了折弯引脚(212)之间的间距，进而增大了折弯引脚(212)之间的电隔离效果，降低了信号之间的信号串扰，提高了信号传递的效果。

Description

一种芯片插槽及网络系统
本申请要求在2017年12月19日提交中国专利局、申请号为201721784967.9、发明名称为“一种芯片插槽及网络系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到通信的技术领域，尤其涉及到一种芯片插槽及网络系统。
背景技术
随着内存DDR信号传输速率越来越快，下一代DDR(Double Data Rate：双倍数据速率)内存(DDR5)翻倍提速(3.2Gbps→6.4Gbps),SI(Signal Integrity：信号完整性)变得越发重要，除了有源电路部分的SI能力提升之外，CPU(Central Processing Unit：中央处理单元)和内存条之间的无源链路的SI表现也至关重要，如何将DDR信号无源链路的串扰、反射、阻抗等影响降低到最小，是产品工程应用设计的重点。
内存插槽作为无源链路的重要一个环节，其引脚大小/形态/管脚排布(引脚排布)设计将直接影响SI表现；内存条做到信号管脚S(Signal)和地管脚G(GND)交错排列，抗串扰效果好，而内存插槽引脚因端子制作工艺存在多个信号管脚连续排列在一起，PCB(Printed Circuit Board：印刷电路板)焊盘也是对应的排列，造成信号之间串扰较大。
申请内容
本申请提供了一种芯片插槽及网络系统，用利于信号之间的串扰，提高信号传递的效果。
第一方面，提供了一种芯片插槽，该芯片插槽包括：插槽，所述插槽内设置有多个端子组，每个端子组中的端子包括对称设置在所述插槽相对的两个内侧壁的金属片，且每个金属片具有外延到所述插槽外的折弯引脚；其中，
每个端子组中的端子的折弯引脚的折弯方向相同；
任意相邻的两个端子组中的任一排金属片，沿该排金属片的排列方向，相邻端子组中的金属片的折弯引脚交替排列在该排金属片的两侧。
在上述技术方案中，通过将一排金属片的折弯引脚朝向两个不同的方向折弯，从而增大了折弯引脚之间的间距，进而增大了折弯引脚之间的电隔离效果，降低了信号之间的信号串扰，提高了信号传递的效果。
在一个具体的实施方案中，所述折弯引脚的长度方向垂直于所述金属片排列的方向。更进一步的提高了折弯引脚之间的距离，提高信号传递的效果。
在一个具体的实施方案中，每个端子组中包括至少两个端子。按照功能将端子分组，从而使得相同功能的端子之间的间隔较大，更进一步的避免了信号串扰，提高了信号传递的效果。
在一个具体的实施方案中，每个端子组包括第一端子及第二端子。
在一个具体的实施方案中，所述折弯引脚的端部设置有焊盘。
在一个具体的实施方案中，所述折弯引脚的焊盘上设置有焊料。
在一个具体的实施方案中，所述焊盘为圆形焊盘。
在一个具体的实施方案中，在所述端子组包括第一端子和第二端子时，所述焊盘具有外凸于折弯引脚的凸起结构，且相邻的焊盘的凸起方向相背。
在一个具体的实施方案中，所述端子组中的端子个数相同。
第二方面，提供了一种网络系统，该网络系统包括上述任一项所述的芯片插槽。
在上述技术方案中，通过将一排金属片的折弯引脚朝向两个不同的方向折弯，从而增大了折弯引脚之间的间距，进而增大了折弯引脚之间的电隔离效果，降低了信号之间的信号串扰，提高了信号传递的效果。
附图说明
图1为本申请实施例提供的插槽的结构示意图；
图2为本申请实施例提供的插槽的底部端面视图；
图3为本申请实施例提供的端子的结构示意图；
图4为本申请实施例提供的插槽与端子的配合示意图；
图5为本申请实施例提供的端子的折弯引脚的结构示意图；
图6为现有技术中的芯片插槽与电路板连接时的示意图；
图7为本申请实施例提供的芯片插槽与电路板连接时的示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了解决现有技术中的中芯片插槽上的端子之间的信号串扰，本申请实施例提供了一种芯片插槽，该芯片插槽通过改善端子的折弯引脚的排布方式，从而增大折弯引脚之间的间距，进而改善端子之间信号串扰的问题。为了方便理解本申请实施例提供的芯片插槽，下面结合具体的附图对其进行详细的说明。
首先参考图1及图2，图1及图2示出了本申请实施例提供的芯片插槽10的结构。如图1中所示，该芯片插槽10包含两部分：插槽10以及端子组20，在具体设置端子组20时，该端子组20包含至少一个端子，如每个端子组20包括一个端子，或至少两个端子(两个端子、三个端子或三个以上的端子)，具体划分时，根据不同端子的功能进行划分，并且不同端子组20之间的端子个数可以相同，也可以不同。以图4所示的结构为例，该端子组20中包含两个端子，分别为第一端子21a及第二端子21b。
针对每个端子如图3及图4所示，每个端子包括两个金属片211，称为一对金属片211，如图3中所示，该金属片211具有一个折弯引脚212，其中，金属片211位于插槽10内，用于与插入的芯片配合，折弯引脚212外延到插槽10外，用于将芯片插槽10与电路板电连接。在端子与插槽10装配时，如图1所示，该插槽10的结构包括一个凹槽11以及承载凹槽11的实体结构。并且凹槽11的槽底设置了通孔13，在装配时，一对金属片分别设置在插槽10相对的两个内侧壁，即凹槽11的两个相对的内侧壁上，并且折弯引脚穿过通孔13后外露在插槽10的底面12外部。
继续参考图3及图4，在具体装配时，本申请的实施例改善了不同端子组20中的端子的折弯引脚的方向。从而将外露在插槽10外的折弯引脚变成四排，以增大相同信号的折弯引脚之间的距离。如图4所示，在具体设置每个端子组20中的折弯结构时，每个端子的折弯结构的折弯方向相同，并且针对任意相邻的两个端子来说，其中任一个端子组20中的任一排金属片，沿该排金属片的排列方向，相邻端子组20中的金属片的折弯引脚交替排列在该排金属片的两侧。以图4所示的端子为例，在图4中示出了两个端子组，分别为端子组20a及端子组20b，其中，端子组20a包括第一端子21a及第二端子21b；端子组20b包括第一端子21a及第二端子21b。且端子组20a及端子组20b交替排列(图中仅标示出了一组端子组20a及端子组20b)。首先针对端子组20a来说，其包含的第一端子21a中的两个金属片的折弯引脚的折弯方向相同，均为向上折弯(以图4所示的插槽的放置方向为参考方向)，第二端子21b的两个金属片的折弯引脚的折弯方向与第一端子21a的折弯引脚的折弯方向相同。即对于端子组20a来说，其包含的折弯引脚的折弯方向均相同。同样的，对于端子组20b来说，其包含的第一端子21a及第二端子21b的折弯引脚也相同，但是该端子组20b中的第一端子21a及第二端子21b的折弯引脚均向下折弯。即相邻的两个端子组中的端子的折弯引脚的折弯方向相反。从而在插槽的底面形成四排折弯引脚。
继续参考图4，四排引脚分别为：端子组20a中的端子形成的两排折弯引脚，端子组20b中的端子形成的两排折弯引脚。如图4中所示，为了方便描述四排折弯引脚，引入了几条辅助线，其中辅助线c为一排金属片排列形成的直线，辅助线e为另一排金属片排列形成的直线，辅助线d为辅助线c与辅助线d中间的一条直线，且辅助线d到辅助线c及辅助线e的垂直距离相等。由图4可以看出，端子组20a中的两排折弯结构，一排折弯结构位于辅助线c的上侧，另一排折弯结构位于辅助线e的上侧，端子组20b中的两排折弯结构中，一排折弯结构位于辅助线c的下侧，另一排折弯结构位于辅助线e的下侧。另外针对位于辅助线c及辅助线e之间的两排折弯结构，端子组20a的一排折弯结构及端子组20b的一排折弯结构分列在辅助线d的两侧，从而使得相对靠近的两排折弯结构之间具有足够的距离。并且由于采用端子组20a中的折弯结构的折弯方向相同的方式设置，因此，位于辅助线c及辅助线e之间的两排折弯结构在设置时，形成交错设置的方式。从而最大限度的增大了折弯结构之间的距离，进而减少了折弯结构在与电路板连接时，焊点的距离，降低了端子之间信号串扰的问题。
此外，在采用四排折弯引脚时，可以增大引脚之间的距离，如在一个具体的实例中，采用两排引脚与采用本申请实施例提供的四排引脚时，引脚间距从0.85mm拉大到1.25mm，电路板上的过孔的距离从40mil拉大到88mil，同时电路板布局可以做到共地设计(在电路板上实现共地)，改善串扰。
需要说明的是，本申请提供的芯片插槽包括插槽和位于该插槽内的两排金属片。所谓的排的延伸方向和插槽的长度方向相同。这两排金属片分别被设置在该插槽的两个相对的内侧壁上。这两排金属片被划分为多个端子组。其中，每一端子组包括一对金属片，这一对金属片被对称设置在插槽内，且这一对金属片分别位于前述两排金属片内。在本申请提供的方案中，位于同一端子组内的多个金属片的折弯引脚的折弯方向相同。假设，位于同一端子组内的多个金属片的折弯引脚的折弯方向为该端子组的折弯方向，则相邻两个端子组的折弯方向相反。进一步地，每一端子组的折弯方向均垂直于该插槽的深度方向。
值得注意的是，如图3所示，每一金属片包括主体211和折弯引脚212。通常，主体 211和折弯引脚212是一体成型的。在金属片被放置在插槽10后，主体211位于插槽10内，折弯引脚212穿过插槽10底部的通孔位于插槽10的外部。
作为本申请的一个实施例，位于相邻两个端子组内且位于一排金属片内的所有金属片的主体均位于第一直线上。已知本申请提供的芯片插槽包括两排金属片，则此处所述的一排金属片为该两排金属片中的其中一排金属片。则位于其中一个端子组内且位于该一排金属片内的所有金属片的折弯引脚均位于该第一直线的一侧，位于另一端子组内且位于该一排金手指内的所有金属片的折弯引脚均位于该第一直线的另一侧。其中，该第一直线的一侧和该第一直线的另一侧是相对的两侧。
可选的，位于其中一个端子组内且位于该一排金属片内的所有金属片的折弯引脚的端部均位于第二直线上。进一步地，该第二直线平行于该第一直线。
可选的，位于另一端子组内且位于该一排金手指内的所有金属片的折弯引脚的端部均位于第三直线上。进一步地，该第三直线平行于该第一直线。
作为本申请的另一个实施例，相邻两对金属片分别用于传输不同类型的信号。可选的，相邻两对金属片中的其中一对金属片用于传输信号，另一对金属片用于接地。
为了更进一步的增大端子之间的间隔，在具体设置端子时，具有相同功能的端子被间隔设置。继续参考图4，在每个端子组具有第一端子21a及第二端子21b时，其中第一端子21a与第二端子21b的功能不同，如第一端子21a为信号端子，第二端子21b为接地端子。在端子组排列时，形成第一端子21a、第二端子21b、第一端子21a、第二端子21b……交替排列的方式。从而增大了相同功能的端子之间的间隔，另外，如图4所示，由于相邻的端子组的折弯结构的折弯方向相反，因此，相同功能的端子的折弯结构的折弯方向相反，从而使得相同功能的端子在与电路板焊接时的焊点之间的间距增大，更进一步的降低了信号串扰的情况，提高了芯片插槽在信号传输的效果。
应当理解的是，上述实施例中，仅仅列举了一个端子组具有两个端子的情况，当然每个端子组还可以有三个端子、四个端子等不同的情况。并且在设置折弯结构时，如图4中所示，折弯引脚的长度方向垂直于所述金属片排列的方向。但是在具体设置时，该折弯结构不仅限于图4所示的一种结构，还可以采用折弯结构与辅助线之间呈一定夹角，以图4所示的结构为例，第一端子21a的折弯结构在相对辅助线c向上折弯时，可以朝左右方向倾斜。但应当理解的时，在具体设置时，各排折弯结构的倾斜方向应一致，以保证折弯引脚之间的间距。
在将芯片插槽与电路板连接时，该芯片插槽的端子与电路板焊接连接。在具体焊接时，如图3中所示，每个折弯引脚212的端部设置有焊盘213。可以通过焊盘213与电路板接触，并通过焊锡焊接连接。或者更佳的，采用在焊盘213上设置有焊料214，该焊料可以为焊球，或者长方体形的焊料。在采用焊球时，形成BGA(Ball Grid Array，焊球阵列封装)面阵列引脚封装。从而避免信号反射。为了方便理解，一并参考图6及图7，其中，图6为现有技术中的芯片插槽1在与电路板4焊接时的连接示意图，图7为本申请实施例提供的芯片插槽在与电路板焊接时的连接示意图。如图6所示，芯片插槽1通过焊锡3将引脚2与电路板4连接，折弯的引脚2形成桩线(信号不经过的地方)，其长度为L，该桩线上存在寄生电容，对信号形成反射，影响信号的正常波形，造成误码。如图7所示，而本申请实施例提供的芯片插槽10由于采用BGA面阵列引脚封装，在具体连接时，端子20通过焊球直接与电路板30焊接连接，因此在焊接时，不会形成桩线，从而不会有反射问 题。进而更进一步的提高了信号传输的效果。此外，在采用BGA面阵列引脚封装，还可以极大的提高焊接效果，将焊接不良率从1000ppm降低到100ppm以下，极大的提高了产品的合格率。
在具体设置焊盘213时，为了方便植球以及保证连接强度，因此，焊盘213的宽度要大于折弯引脚212的宽度，因此，在具体设置时，该焊盘213可以做成圆形，且圆形的中心位于折弯引脚212在其长度方向上的中心线。或者在一个具体的实施方式中，当端子组具有两个端子时，如图4及图5所示，每个端子组具有两个端子，因此，在同一方向上的折弯引脚212仅仅有两个，在考虑焊接空间时，在设置焊盘213时，焊盘213具有外凸于折弯引脚212的凸起结构，且相邻的焊盘213的凸起方向相背。以图5所示的端子的放置方向为参考方向，一个焊盘偏向上设置，另一个焊盘偏向下设置，从而增大两个焊盘215之间的距离。如图5中，位于上方的端子为第一端子21a，位于下方的端子为第二端子21b，其中，第一端子21a的第一焊盘213a具有向上的凸起结构215a，来增大第一焊盘213a的面积，第二端子21b的第二焊盘213b具有向下的凸起结构215b，来增大第二焊盘213b的面积。
此外，参考图6及图7，在芯片插槽采用如图6的设置方式时，由于引脚之间的空间较小，并且焊接连接时占用较大的空间，造成无法在表面走线，所有走线均设置在电路板内，从而造成电路板厚度较大，以印刷电路板为例，印刷电路板的层数需要26层。而采用本实施例提供的折弯引脚以及BGA面阵列引脚封装方式，可以在折弯引脚之间形成走线的空间，从而将原来需要设置在电路板内部的线，设置在电路板的表面，从而降低了电路板的厚度，还以印刷电路板为例，在采用本申请实施例提供的芯片插槽时，印刷电路板的厚度可以降低到24层。从而降低印刷电路板的成本。
本申请还提供了一种网络系统，该网络系统可以为服务器等常见的通信网络系统。该网络系统包括上述任一项所述的芯片插槽。在上述技术方案中，通过将一排金属片的折弯引脚朝向两个不同的方向折弯，从而增大了折弯引脚之间的间距，进而增大了折弯引脚之间的电隔离效果，降低了信号之间的信号串扰，提高了信号传递的效果。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (18)

  1. 一种芯片插槽，其特征在于，包括：插槽，所述插槽内设置有多个端子组，每个端子组中的端子包括对称设置在所述插槽相对的两个内侧壁的金属片，且每个金属片具有外延到所述插槽外的折弯引脚；其中，
    每个端子组中的端子的折弯引脚的折弯方向相同；
    任意相邻的两个端子组中的任一排金属片，沿该排金属片的排列方向，相邻端子组中的金属片的折弯引脚交替排列在该排金属片的两侧。
  2. 根据权利要求1所述的芯片插槽，其特征在于，所述折弯引脚的长度方向垂直于所述金属片排列的方向。
  3. 根据权利要求1所述的芯片插槽，其特征在于，每个端子组中包括至少两个端子。
  4. 根据权利要求3所述的芯片插槽，其特征在于，每个端子组包括第一端子及第二端子。
  5. 根据权利要求1～4任一项所述的芯片插槽，其特征在于，所述折弯引脚的端部设置有焊盘。
  6. 根据权利要求5所述的芯片插槽，其特征在于，所述折弯引脚的焊盘上设置有焊料。
  7. 根据权利要求5所述的芯片插槽，其特征在于，所述焊盘为圆形焊盘。
  8. 根据权利要求5所述的芯片插槽，其特征在于，在所述端子组包括第一端子和第二端子时，所述焊盘具有外凸于折弯引脚的凸起结构，且相邻的焊盘的凸起方向相背。
  9. 根据权利要求5所述的芯片插槽，其特征在于，所述端子组中的端子个数相同。
  10. 一种网络系统，其特征在于，包括：如权利要求1～9任一项所述的芯片插槽。
  11. 一种芯片插槽，其特征在于，包括插槽和位于所述插槽内的两排金属片，其中一排金属片被设置在所述插槽的一个内侧壁上，另一排金属片被设置在所述插槽的另一个内侧壁上，所述一个内侧壁和所述另一个内壁侧是相对的，且所述一个内侧壁的长边的延伸方向与所述插槽的长度方向相同；
    所述两排金属片包括多个端子组，每一端子组包括至少一对金属片，每对金属片中的一个金属片位于所述一排金属片内，另一个金属片位于所述另一排金属片内，且每对金属片被对称设置在所述插槽内；
    位于同一端子组内的多个金属片的折弯引脚的折弯方向相同，相邻两个端子组的折弯方向相反，其中，所述端子组的折弯方向是指位于该端子组内的多个金属片的折弯引脚的折弯方向。
  12. 根据权利要求11所述的芯片插槽，其特征在于，每一端子组的折弯方向均垂直于所述插槽的深度方向。
  13. 根据权利要求11或12所述的芯片插槽，其特征在于，相邻两个端子组中位于所述一排金属片内的多个金属片的主体均位于第一直线上，则其中一个端子组内位于所述一排金属片内的至少一个金属片的折弯引脚位于所述第一直线的一侧，另一端子组内位于所述一排金属片内的至少一个金属片的折弯引脚位于所述第一直线的另一侧。
  14. 根据权利要求13所述的芯片插槽，其特征在于，其中一个端子组内位于所述一排金属片内的至少一个金属片的折弯引脚的端部位于第二直线上，另一端子组内位于所述一排金属片内的至少一个金属片的折弯引脚的端部位于第三直线上，其中，所述第二直线 和所述第三直线均平行于所述第一直线。
  15. 根据权利要求11至14任一项所述的芯片插槽，其特征在于，相邻两对金属片分别用于传输不同类型的信号。
  16. 根据权利要求15所述的芯片插槽，其特征在于，相邻两对金属片中的其中一对金属片用于传输信号，另一对金属片用于接地。
  17. 根据权利要求11至16任一项所述的芯片插槽，其特征在于，每一金属片的折弯引脚的端部具有焊盘，所述焊盘具有凸起结构。
  18. 根据权利要求17所述的芯片插槽，其特征在于，同一端子组内位于所述第一排金属片内的相邻两个金属片的所述凸起结构的凸起方向相背。
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US16/904,849 US11189970B2 (en) 2017-12-19 2020-06-18 Chip slot and network system
US17/534,954 US11777257B2 (en) 2017-12-19 2021-11-24 Memory slot and printed circuit board and network system
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US11189970B2 (en) 2021-11-30
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