WO2019119715A1 - 硅基oled产品 - Google Patents

硅基oled产品 Download PDF

Info

Publication number
WO2019119715A1
WO2019119715A1 PCT/CN2018/086537 CN2018086537W WO2019119715A1 WO 2019119715 A1 WO2019119715 A1 WO 2019119715A1 CN 2018086537 W CN2018086537 W CN 2018086537W WO 2019119715 A1 WO2019119715 A1 WO 2019119715A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
silicon
based oled
region
product
Prior art date
Application number
PCT/CN2018/086537
Other languages
English (en)
French (fr)
Inventor
钱栋
顾铁
邹文晖
吴桐
李启
Original Assignee
上海视涯信息科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海视涯信息科技有限公司 filed Critical 上海视涯信息科技有限公司
Priority to US16/627,506 priority Critical patent/US11043162B2/en
Publication of WO2019119715A1 publication Critical patent/WO2019119715A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0404—Matrix technologies
    • G09G2300/0408—Integration of the drivers onto the display substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/027—Details of drivers for data electrodes, the drivers handling digital grey scale data, e.g. use of D/A converters
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0286—Details of a shift registers arranged for use in a driving circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0289—Details of voltage level shifters arranged for use in a driving circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/08—Details of timing specific for flat panels, other than clock recovery
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element

Definitions

  • the present invention relates to the field of semiconductor manufacturing, and in particular to a silicon-based OLED product.
  • Silicon-based OLED products are distinguished from conventional AMOLED devices that use amorphous silicon, microcrystalline silicon, or low-temperature polysilicon thin film transistors as backplanes.
  • the OLED display pixel size is based on a single crystal silicon chip.
  • One-tenth of the traditional display devices, the fineness is much higher than the traditional devices.
  • the silicon-based OLED display panel (monocrystalline silicon chip) can adopt the existing mature integrated circuit CMOS process, which not only realizes the active addressing matrix of the display OLED display pixel, but also can be realized on the silicon-based OLED display panel.
  • Drive control circuits with various functions such as SRAM memory reduce external wiring of the device, increase reliability, and achieve light weight.
  • the problem addressed by the present invention is to provide a silicon-based OLED product to better improve silicon-based OLED products.
  • the present invention provides a silicon-based OLED product including a circuit board, and a central control board and a silicon-based OLED display panel on the circuit board; the core control module and timing are integrated in the central control board a control module; the silicon-based OLED display panel includes a display area, a gate row driving region, a source signal driving region, and a binding region; the display region has an OLED display pixel; and the gate row driving region is integrated with a gate a driving circuit for integrating the active signal in the source signal driving region; the binding region is an area where the silicon-based OLED display panel is bound to the central control panel.
  • the gate row driving region is located at two sides of the OLED display pixel in the display region, the source signal driving region and the binding region are located at one side of the display region, and The binding area is located outside the source signal driving area.
  • the source signal driving circuit includes a serially connected interface module, a line buffer module, a level conversion module, a digital to analog converter module, and an analog buffer module.
  • the line buffer module includes a shift register module and a latch module
  • the latch module includes a sampling module and a storage module
  • the device of the latch module is a low voltage device.
  • the source signal driving circuit further includes a reference voltage module.
  • the device of the digital-to-analog converter module is a medium voltage device.
  • the digital-to-analog converter module is a ramp digital-to-analog converter or a resistor digital-to-analog converter.
  • the interface in the interface module is an LVDS interface, an MIPI interface, or an eDP interface.
  • the central control board further includes an interface module, an oscillator module, a primary programming module, and a static random storage module.
  • the silicon-based OLED product is a micro display product.
  • each module in the source signal driving circuit is integrated into a silicon-based OLED display panel (specifically integrated in the source signal driving region), and the central control panel is disposed outside the silicon-based OLED display panel by lamination or the like.
  • the board (which can be a PCB or FPC).
  • modules that have relatively simple process requirements such as modules that process analog signals
  • modules that have relatively complex process requirements such as modules that process digital circuits
  • the integrated bonding area (ie, the IC area) on the silicon-based OLED display panel is smaller, so that the silicon-based OLED product can be made smaller (the corresponding display area area ratio is Increased, that is, increased screen share).
  • the layout task of the silicon-based OLED display panel is greatly reduced, and the development cycle is reduced.
  • FIG. 1 is a schematic view of a conventional silicon-based OLED product
  • FIG. 2 is a schematic view of a silicon-based OLED product according to an embodiment of the present invention.
  • 3 is a schematic structural view of each module in a source signal driving region
  • the chips are basically directly integrated in the silicon-based OLED display panel.
  • the modules of the modules in the chip have more types, especially the modules for processing digital signals in the chip, the manufacturing process is more complicated, the preparation process is higher, and the Can be produced in higher production lines. This makes the process cost high.
  • the layout area of the non-light-emitting area is greatly increased, so that the entire product is larger in size and cannot be made smaller.
  • the integration of so many modules in the silicon-based OLED display panel has greatly increased the product development cycle.
  • FIG. 1 shows a silicon-based OLED display panel (not labeled) in the product, which includes a display area 10 and a non-display area 20. .
  • ICs integrated circuits
  • the IC mainly includes various driver circuit modules and a Timer Control Register (TCON).
  • TCON Timer Control Register
  • the integrated circuit fabricated in the non-display area 20 actively includes a core-state controller, various driver circuits, a timing control module, and an interface module.
  • the non-light-emitting area layout area of the silicon-based OLED display panel is increased, and the non-light-emitting area occupies a large area.
  • the size of the whole product is larger and cannot be made smaller; and the integration of so many modules in the silicon-based OLED display panel increases the product development cycle.
  • the process is also different, the process will be very different, in order to ensure product yield, it needs to be manufactured according to the most demanding process required, increasing the cost of the process, which will lead to the cost of the entire product. It will be quite high.
  • the present application provides a silicon-based OLED product that improves the integrated circuit architecture on a silicon-based OLED display panel in order to streamline the corresponding process, reduce cost, and reduce the overall size of the product, while shortening the development cycle. Further reduce the cost of the entire product.
  • Embodiments of the present invention provide a silicon-based OLED product, as shown in FIG. 2 .
  • the silicon-based OLED product includes a circuit board 600, and a central control board 500 and a silicon-based OLED display panel (not labeled) on the circuit board 600.
  • the central control board 500 and the silicon-based OLED display panel are both located on the same surface of the circuit board 600, adjacent to each other, and may be spaced apart or directly adjacent.
  • the silicon-based OLED display panel includes a display region 100, a gate row driving region 200, a source signal driving region 300, and a bonding region 400.
  • the display area 100 has OLED display pixels (not shown).
  • a gate row driving circuit (not shown) is integrated in the gate row driving region 200.
  • An active signal driving circuit is integrated in the source signal driving region 300 (please refer to FIG. 3 in combination).
  • the bonding area 400 is an area where the silicon-based OLED display panel is bonded to the center control board 500.
  • the display region 100 of the silicon-based OLED display panel has OLED display pixels arranged in rows and columns.
  • display area 100 can have other numbers and other arrangements of OLED display pixels.
  • the gate row driving region 200 is integrated with a gate row driving circuit, and the function of the gate row driving circuit includes providing a gate scanning signal to the display region 100.
  • the display area 100 is rectangular, and the gate row driving area 200 is located at two corresponding side regions (left and right sides in FIG. 2) except the two ends of the OLED display pixel row, and the source signal driving area 300
  • the binding region 400 is located at a corresponding side region (lower side in FIG. 2) than one end of the OLED display pixel column.
  • the gate row driving region 200 is located outside the two opposite sides of the rectangular of the display region 100, and the source signal driving region 300 and the bonding region 400 are located outside the other side of the rectangle of the display region 100.
  • the binding area is located outside the source signal driving area. That is, as shown in FIG. 2, the binding area 400 is further located below the source signal driving area 300.
  • the silicon-based OLED product may also be disposed in the corresponding two side regions except the two ends of the OLED display pixel column, that is, the gate row driving circuit is located at the OLED display.
  • the gate row driving circuit is located at the OLED display.
  • the source signal driving area and the binding area are set to be located in a corresponding side area other than one end of the OLED display pixel row.
  • the binding area 400 can be a wire bonding.
  • all the required driving signals on the silicon-based OLED display panel can be bound to the central control board 500, thereby being connected to the central control board.
  • the drive signals provided by the 500 are connected.
  • the specific binding method can be wired.
  • the circuit board 600 can be a printed circuit board (PCB) or a flexible printed circuit board (FPC).
  • PCB printed circuit board
  • FPC flexible printed circuit board
  • the silicon-based OLED display panel may be disposed on the surface of the circuit board 600 by pasting or the like.
  • the center control panel 500 may also be attached to the surface of the circuit board 600 by means of bonding or the like (or other suitable means).
  • the source signal driving circuit in the source signal driving region 300 is used to provide a data signal to the OLED display pixels in the display region 100.
  • the source signal driving circuit in the source signal driving area 300 includes: an interface module 310 (interface) connected in sequence, a line buffer module 320 (Line buffer), a level shifting module 330 (Level Shifter), A digital to analog converter (DAC) 340 and an analog buffer module 350 (Analog buffer).
  • the line buffer module 320 includes a shift register module 321 (shift register, SR) and a latch module 322 (LATCH).
  • the latch module 322 includes a sampling module 3221 (sampling) and a storage module 3222 (latch).
  • the source signal driving circuit further includes a reference voltage module 360 (Regulator) that provides a stable voltage to the entire system.
  • a reference voltage module 360 (Regulator) that provides a stable voltage to the entire system.
  • the source signal driving circuit further includes other modules 370 (else), which refer to other conventional modules included in the source signal driving circuit, so as to ensure that the source signal driving circuit can work normally, or can satisfy other functions.
  • modules 370 (else), which refer to other conventional modules included in the source signal driving circuit, so as to ensure that the source signal driving circuit can work normally, or can satisfy other functions.
  • the external signal first passes through the interface module 310.
  • the interface module 310 adopts the LVDS interface technology to process the digital signal, and correspondingly uses the low voltage device; after that, the signal enters the line buffer module 320 of the source signal driving circuit,
  • the module includes a shift register module 321 and a latch module 322, wherein the sampling module 3221 and the storage module 3222 in the latch module 322 process digital signals, correspondingly using low voltage devices; subsequently, the signals are level-shifted
  • the module 330 enters the digital-to-analog converter module 340, and the digital-to-analog converter module 340 correspondingly uses a medium voltage device.
  • the analog-to-digital converter module 340 outputs an analog signal through the analog buffer module 350 as the OLED.
  • a data signal of the display pixel is output to the OLED display pixel circuit.
  • the interface in the interface module 310 is an LVDS (Low-Voltage Differential Signaling) interface.
  • the LVDS interface utilizes low voltage differential signaling. With this interface, signals can be transmitted on differential printed circuit board (PCB) lines or balanced cables. Due to the low voltage and low current drive, the LVDS interface enables low noise and low power consumption.
  • PCB printed circuit board
  • the interface in the interface module 310 may also be an MIPI (Mobile Industry Processor Interface) interface or an eDP (Embedded Display Port) interface.
  • MIPI Mobile Industry Processor Interface
  • eDP embedded Display Port
  • the signals of the MIPI interface are transmitted in pairs, mainly to reduce interference.
  • the signals of the MIPI interface are wired in pairs. The two lines are inverted from the waveform, so if there is external interference, it will be offset by a large part.
  • the device in which the latch module 322 is provided is a low voltage device.
  • the device of the digital-to-analog converter module 340 is a medium voltage device.
  • the device of the OLED display pixel can be fabricated by using a medium voltage device.
  • the device of the digital-to-analog converter module 340 and the device in the OLED display pixel can be fabricated using a production line with the same process capability, thereby providing conditions for simplifying the process and saving cost.
  • the digital-to-analog converter module 340 can be a ramp digital-to-analog converter or a resistor digital-to-analog converter.
  • a core control module 560 Core-State Controller
  • a timing control module 540 timing control
  • the timing control module 540 is configured to provide a control signal to the source signal driving circuit.
  • the timing control module 540 and the core control module 560 process digital signals, and all of them are low voltage devices, and are also small-sized devices. However, they require more stringent process requirements. For example, the production of modules such as an OLED display pixel array and a source signal driving circuit can be produced by using a manufacturing process with low precision (fineness). However, the production of the module 560 such as the timing control module 540 and the core control module requires a high-precision manufacturing process to complete the good production. The higher the process precision, the stronger the corresponding process capability is required; and the stronger the process capability, the higher the corresponding production cost. At the same time, the internal circuits of the modules such as the timing control module 540 and the core control module 560 are complicated.
  • the center control board 500 further includes an oscillator module 510 (OSC), an interface module 520, a static random access memory module 530 (SRAM), and a one-time programming module 550 (OTP).
  • OSC oscillator module
  • SRAM static random access memory
  • OTP one-time programming module
  • the medium voltage device in this specification refers to a device that operates from 3.3V to 8V.
  • the silicon-based OLED product (silicon-based AMOLED product) provided by the present embodiment is a micro display product, and the micro display product may specifically be an AR product and a VR product.
  • the micro display product mainly refers to a panel display product of less than 2 inches, and the main application is a wearable product such as an AR product and a VR product, but the present invention is not limited to this, and the corresponding silicon-based OLED product needs to be adjusted as long as it needs to be adjusted.
  • the technical solution of the present invention can be applied to products of display area and non-display area, or products that need to be considered to be fabricated on a display panel or on an external chip.
  • different integrated modules and OLED display pixels in the display area 100 can be integrated in corresponding regions of the silicon-based OLED display panel, because in the process, their processes are the same or close. It can be produced by the production line with the same process capability (saving steps and preventing different steps from adversely affecting other devices), and does not require a process with strong process capability to make and save costs.
  • the device modules that are consistent with or close to the OLED display pixel fabrication process are integrated and fabricated, and the process can be simplified.
  • circuits such as core control modules with complex process requirements and fine requirements are separately fabricated in external chips.
  • the silicon-based OLED display panel can be completed by a relatively simple process, which reduces the cost, reduces the bonding area required for the subsequent external chip, increases the proportion of the display area, and reduces the size of the entire product.
  • some device modules originally fabricated in the central control board 500 are directly integrated into the source signal driving region 300, that is, integrated into the silicon-based OLED display panel.
  • These device modules are device modules that use a relatively simple process, specifically including some of the gate row driver circuit and the source signal driver circuit, which simplifies the process, reduces the cost, and reduces the overall size of the product.
  • the proportion of the display area is increased, and at the same time, the circuit structure and overall size inside the external center control board 500 can be reduced.
  • a specific source signal driving circuit is mainly integrated into the integrated circuit region of the silicon-based OLED display panel, and the redesigned source signal driving circuit only needs to be adopted.
  • the production line of the general process capability can be completed without the need for high-precision, high-process production lines, thereby reducing costs.
  • the module with relatively simple process requirements and the module with relatively complicated process requirements are separated, and the complicated process is avoided, the waste is avoided, and the cost is reduced.
  • the binding area 400 (ie, the IC binding area, or the central control board binding area) integrated on the silicon-based OLED display panel is smaller, so that the product can be made. Smaller, the oscillator module 510 (OSC), the interface module 520, the static random access module 530 (SRAM), the one-time programming module 550 (OTP), the timing control module 540, and the core control module 560 are no longer integrated on the silicon-based OLED display panel. This reduces the number of non-light-emitting area layout tasks and reduces the development cycle.
  • OSC oscillator module 510
  • SRAM static random access module 530
  • OTP one-time programming module
  • the timing control module 540 the timing control module 560
  • the module with high precision and small size required for the process (which needs to be produced in the production line of high process capability) is separated from the module of the ordinary process (the production line of the general process capability), and the overall panel is simplified.
  • the process is reduced, the cost is reduced; the development cycle is shortened, and the cost is further reduced.
  • existing silicon-based OLED products usually integrate the entire chip (IC) into a silicon-based OLED display panel, thus making the area of the non-light-emitting area of the silicon-based OLED display panel Very big.
  • the signal properties (digital signal and analog signal) processed by different OLED display pixels and different modules in the chip are different, the corresponding device amplitude and device size are different, and the process process is also very different.
  • it needs to be manufactured according to the most demanding process required, which obviously increases the process cost.
  • the process requires a complicated module for processing digital signals (oscillator module 510, interface module 520, static random access memory module 530, primary programming module 550, timing control module 540, and The core control module 560) is no longer integrated into the silicon-based OLED display panel, which not only simplifies the process, greatly reduces the process cost, but also reduces the overall size of the product. At the same time, it shortens the development cycle and further reduces The cost of the entire product.
  • the advantage of this architecture is that the module with high precision and small size of the process, that is, the corresponding module of the central control board for processing digital signals (TCON, needs high process capability) Production line), and ordinary process modules (ie, the above-mentioned silicon-based OLED display panel processing analog signal OLED display pixels, gate row drive circuit and source signal drive circuit, these three general process
  • the production line of the capability is separated, which reduces the difficulty of the overall process of making the panel and greatly reduces the cost.
  • the internal composition of the source signal driving circuit and the internal composition of the central control board 500 are mainly adjusted, so that the corresponding integration mode is more reasonable, the area of the non-light emitting area in the panel is reduced, and the size of the entire panel is reduced.
  • the development cycle of the silicon-based OLED display panel itself is shortened, and the product cost is further reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of El Displays (AREA)

Abstract

一种硅基OLED产品，包括电路板，以及位于所述电路板上的中心控制板和硅基OLED显示面板；所述中心控制板中集成有核心控制模块和时序控制模块；所述硅基OLED显示面板包括显示区域、栅极行驱动区域、源信号驱动区域和绑定区域；所述显示区域中具有OLED显示像素；所述栅极行驱动区域中集成有栅极行驱动电路；所述源信号驱动区域中集成有源信号驱动电路；所述绑定区域为所述硅基OLED显示面板与所述中心控制板进行绑定的区域。所述硅基OLED产品精简了工艺制程，降低了成本，同时还可以减小产品的整体尺寸，增大显示区域面积的占比。

Description

硅基OLED产品
本申请要求于2017年12月19日提交中国专利局、申请号为201711372791.0、发明名称为“硅基OLED产品”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及半导体制造领域，尤其涉及一种硅基OLED产品。
背景技术
硅基OLED产品(如硅基OLED微显示器件)区别于常规利用非晶硅、微晶硅或低温多晶硅薄膜晶体管为背板的AMOLED器件，它以单晶硅芯片为基底，OLED显示像素尺寸为传统显示器件的十分之一，精细度远远高于传统器件。
其中，硅基OLED显示面板(单晶硅芯片)可以采用现有成熟的集成电路CMOS工艺，不但实现了显示屏OLED显示像素的有源寻址矩阵，还可以在硅基OLED显示面板上实现了如SRAM存储器等多种功能的驱动控制电路，减少了器件的外部连线，增加了可靠性，实现了轻量化。
发明内容
本发明解决的问题是提供一种硅基OLED产品，以更好地改进硅基OLED产品。
为解决上述问题，本发明提供一种硅基OLED产品，包括电路板，以及位于所述电路板上的中心控制板和硅基OLED显示面板；所述中心控制板中集成有核心控制模块和时序控制模块；所述硅基OLED显示面板包括显示区域、栅极行驱动区域、源信号驱动区域和绑定区域；所述显示区域中具有OLED显示像素；所述栅极行驱动区域中集成有 栅极行驱动电路；所述源信号驱动区域中集成有源信号驱动电路；所述绑定区域为所述硅基OLED显示面板与所述中心控制板进行绑定的区域。
可选的，所述栅极行驱动区域位于所述显示区域中所述OLED显示像素的两侧，所述源信号驱动区域和所述绑定区域位于所述显示区域的一侧，并且所述绑定区域位于所述源信号驱动区域的外侧。
可选的，所述源信号驱动电路包括顺次连接的接口模块、线缓冲区模块、电平转换模块、数模转换器模块和模拟缓冲区模块。
可选的，所述线缓冲区模块包含移位寄存器模块和锁存器模块，所述锁存器模块包括采样模块和存储模块；所述锁存器模块的器件为低压器件。
可选的，所述源信号驱动电路还包括基准电压模块。
可选的，所述数模转换器模块的器件为中压器件。
可选的，所述数模转换器模块为斜坡数模变换器或者电阻数模转换器。
可选的，所述接口模块中的接口为LVDS接口、MIPI接口或者eDP接口。
可选的，所述中心控制板还包括接口模块、振荡器模块、一次编程模块和静态随机存储模块。
可选的，所述硅基OLED产品为微显示产品。
与现有技术相比，本发明的技术方案具有以下优点：
本发明中，将源信号驱动电路中的各个模块集成到了硅基OLED显示面板内(具体集成在源信号驱动区域内)，将中心控制板通过贴合等方式设置在硅基OLED显示面板外的电路板(所述电路板可以为PCB或者FPC)上。
这么做的好处就是，把制程要求相对简单的模块(例如处理模拟信号的模块)与制程要求相对复杂的模块(例如处理数字电路的模块)分离开来，因此可以分别制作，从而避免了都采用复杂制程的情况，避免了成本的浪费，降低了成本。并且，本发明的设计方案之下，硅基OLED显示面板上集成的绑定区域(亦即IC区域)面积更小，使得硅基OLED产品可以做的更小(相应的显示区域面积占比却增大了，即提高了屏占比)。同时，由于硅基OLED显示面板内不再集成的中心控制板相应模块，使得硅基OLED显示面板的布局(layout)任务大大减少，缩减了研发周期。
附图说明
图1是一种现有的硅基OLED产品示意图；
图2是本发明实施例硅基OLED产品示意图；
图3是源信号驱动区域中各模块结构示意图；
图4是中心控制板中各模块结构示意图。
具体实施方式
现有的硅基OLED产品中，芯片(IC)基本都是直接集成在硅基OLED显示面板内。然而，相对于显示区域中的OLED显示像素而言，芯片内各模块的器件种类更多，特别是芯片中用于处理数字信号的各个模块，制作工艺更复杂，制备工艺要求更高，需要在更高代产线中才能制作。这样，就使得制程成本很高。同时，如果所有的模块都集成在显示面板上，非发光区域的布局(layout)面积大大增加，使得整个产品的尺寸更大，无法做小。硅基OLED显示面板内要集成如此多的模块，产品研发周期也大大增长。
具体的，现有的硅基OLED产品中，其中一种产品如图1所示，图1显示了产品中的硅基OLED显示面板(未标注)，其包括有显示 区域10和非显示区域20。这种产品中，大多数集成电路(IC)基本都是直接集成在硅基OLED显示面板的非显示区域20内。广义来说，IC内主要包含各种驱动电路(Driver)模块和中心控制板(Timer Control Register，TCON)。其中，制作在非显示区域20的集成电路主动包括核心控制模块(Core-State controller)、各种驱动电路(Drivers)、时序控制模块以及接口模块(interface)等。相对于显示区域10中的显示OLED显示像素阵列(pixel array)而言，由于集成电路中各模块和结构的器件种类更多，制作工艺更复杂，需要在更高代(世代)产线中才能制作。当把集成电路中各模块和结构全部直接集成在显示面板的非显示区域20内时，不仅制程复杂导致成本高昂，而且集成电路集成区域所占的面积也会很大。
综上可知，在硅基OLED产品中，如果完全把相应的集成电路集成在硅基OLED显示面板内，硅基OLED显示面板的非发光区域布局(layout)面积增加，非发光区域占用面积很大，使得整个产品的尺寸更大，无法做小；并且，硅基OLED显示面板内要集成如此多的模块，产品研发周期也增长。同时，由于显示区域中的OLED显示像素和集成电路内不同模块处理的信号性质(数字信号和模拟信号)不同，对应的器件幅值和器件尺寸大小(有低压器件、中压器件、高压器件之分)等也随之不同，工艺制程会有很大差异，为保证产品良率，就需要按照所需的最严苛的工艺制程来制作，增加了制程成本，这就会导致整个产品的成本会相当高。
为此，本申请提供一种硅基OLED产品，改进硅基OLED显示面板上的集成电路架构，以便精简相应的工艺制程，降低成本，也减小产品的整体尺寸，同时，缩短了研发周期，进一步降低整个产品的成本。
为使本发明的上述目的、特征和优点能够更为明显易懂，下面结合附图对本发明的具体实施例做详细的说明。
本发明实施例提供一种硅基OLED产品，如图2所示。
所述硅基OLED产品包括电路板600，以及位于电路板600上的中心控制板500和硅基OLED显示面板(未标注)。中心控制板500和硅基OLED显示面板均位于电路板600的同一表面，两者相邻，可以有一定间隔，也可以直接相邻。
硅基OLED显示面板包括显示区域100、栅极行驱动区域200、源信号驱动区域300和绑定区域400。
显示区域100中具有OLED显示像素(未示出)。
栅极行驱动区域200中集成有栅极行驱动电路(未示出)。
源信号驱动区域300中集成有源信号驱动电路(请结合参考图3)。
绑定区域400为硅基OLED显示面板与中心控制板500进行绑定的区域。
本实施所提供的硅基OLED产品中，所述硅基OLED显示面板的显示区域100中具有行列排布的OLED显示像素。
其它实施例中，显示区域100可以具有其它个数和其它排布方式的OLED显示像素。
本实施例中，栅极行驱动区域200中，集成有栅极行驱动电路，所述栅极行驱动电路的作用包括给显示区域100提供栅极扫描信号。
本实施例进一步设置，显示区域100呈矩形，栅极行驱动区域200位于所述OLED显示像素行两端以外的对应两个侧边区域(图2中的左右两侧)，源信号驱动区域300和绑定区域400位于OLED显示像素列一端以外的对应侧边区域(图2中的下侧)。栅极行驱动区域200位于显示区域100矩形的两条对边以外，源信号驱动区域300和绑定区域400位于显示区域100矩形的另一条边以外。并且，本实施例中，所述绑定区域位于所述源信号驱动区域的外侧。即如图2所示，绑定区域400进一步位于源信号驱动区域300下方。
需要说明的是，其它实施中，硅基OLED产品也可以是将栅极行驱动区域设置在OLED显示像素列两端以外的对应两个侧边区域，即此时栅极行驱动电路位于OLED显示像素列两端以外的对应两个侧边区域。而相应的，设置源信号驱动区域和绑定区域位于OLED显示像素行一端以外的一个对应侧边区域。
绑定区域400可以为打线绑定区域(wire bonding)，本实施例可以把所述硅基OLED显示面板上所有需要的驱动信号，通过与中心控制板500进行绑定，从而与中心控制板500所提供的驱动信号连接起来。具体绑定方法可以采用打线的方式。
电路板600可以为印刷电路板(PCB)或者柔性印刷电路板(FPC)。
硅基OLED显示面板可以是通过粘贴等方式设置在电路板600表面。
中心控制板500也可以是通过粘贴等方式(或者其它适合方式)固定在电路板600表面。
本实施中，源信号驱动区域300内的源信号驱动电路用于给显示区域100中的OLED显示像素提供数据(data)信号。
如图3所示，源信号驱动区域300内的源信号驱动电路包括：顺次连接的接口模块310(Interface)、线缓冲区模块320(Line buffer)、电平转换模块330(Level Shifter)、数模转换器模块340(digital to analog，DAC)和模拟缓冲区模块350(Analog buffer)。
如图3所示，线缓冲区模块320包含移位寄存器模块321(shift register，SR)和锁存器模块322(LATCH)。锁存器模块322包括采样模块3221(sampling)和存储模块3222(latch)。
如图3所示，源信号驱动电路还包括基准电压模块360(Regulator)，基准电压模块360为整个系统提供稳定电压。
如图3所示，源信号驱动电路还包括其它模块370(else)，指源信号驱动电路内还包含的其他一些常规模块，以便保证源信号驱动电路能正常工作，或能够满足其他一些功能。
图3所显示的各电路模块中，相互配合的过程如下：
外界信号先经过接口模块310，如前所述，接口模块310采用LVDS接口技术，处理的是数字信号，对应使用的是低压器件；之后，信号进入源信号驱动电路的线缓冲区模块320，该模块包含移位寄存器模块321和锁存器模块322，其中，锁存器模块322中的采样模块3221和存储模块3222处理的是数字信号，对应使用的也是低压器件；随后，信号经过电平转换模块330，进入到数模转换器模块340，数模转换器模块340对应使用的是中压器件；最后，由数模转换器模块340输出模拟信号，经过模拟缓冲区模块350，作为所述OLED显示像素的数据信号，输出到所述OLED显示像素电路。
本实施中，接口模块310中的接口为LVDS(Low-Voltage Differential Signaling)接口。LVDS接口利用低压差分信号传输。采用这种接口，可以使得信号在差分印刷电路板(PCB)线或平衡电缆上传输。由于采用低压和低电流驱动方式，因此，LVDS接口能够实现了低噪声和低功耗。
其它实施例中，接口模块310中的接口也可以为MIPI(Mobile Industry Processor Interface)接口或者eDP(Embedded Display Port)接口。其中，MIPI接口的信号是成对传输的，主要是为了减少干扰。MIPI接口的信号成对走线，两根线从波形看是成反相，所以有外部干扰过来，就会被抵消很大部分。
本实施中，与前述原因相似的，设置锁存器模块322的器件为低压器件。
本实施所提供的硅基OLED产品中，数模转换器模块340的器件为中压器件(medium voltage device)。本实施例的显示区域100中， 所述OLED显示像素的器件可以采用中压器件制作。此时，数模转换器模块340的器件和所述OLED显示像素中的器件，可以采用相同制程工艺能力的产线来制作，从而为实现简化工艺和节约成本提供条件。
本实施所提供的硅基OLED产品中，数模转换器模块340可以为斜坡数模变换器或者电阻数模转换器。
如图4所示，中心控制板500中集成有核心控制模块560(Core-State Controller)和时序控制模块540(timing control)。时序控制模块540用于给源信号驱动电路提供控制信号。
时序控制模块540和核心控制模块560，处理的都是数字信号，使用的也都是低压器件，也都是些小尺寸器件。但是，它们要制程要求比较苛刻。比如OLED显示像素阵列和源信号驱动电路等模块的制作，则采用精度(精细度)较低的制作工艺就可以制作出来。但是，时序控制模块540和核心控制模块等模块560的制作，却需要精度较高的制作工艺才能完成良好制作。而工艺精度越高，要求相应的工艺能力越强；而工艺能力越强，相应的制作成本也就越高。同时，时序控制模块540和核心控制模块560等模块内部电路复杂，如果制作在硅基OLED显示面板上，则它们本身就需要占用特别多的面积。因此，选择将它们单独制作于外芯片中(即中心控制板500中)，而不是集成在硅基OLED显示面板上。
如图4所示，中心控制板500还包括振荡器模块510(OSC)、接口模块520、静态随机存储模块530(SRAM)和一次编程模块550(OTP)。
本说明书提到低压器件和中压器件，需要说明的是，一般来说，本说明书中的低压器件，主要是指工作电压在3.3V及以下的器件，这类器件尺寸会更小，也更难以制作，本说明书中的中压器件只要是指工作在3.3V～8V的器件。
本实施所提供的硅基OLED产品(硅基AMOLED产品)为微显示产品，所述微显示产品具体可以为AR产品和VR产品等。通常，微显示产品主要是指小于2英寸的面板显示产品，并主要应用是AR产品和VR产品等穿戴式产品，但本发明不仅仅局限于此，相应的硅基OLED产品，只要是需要调整显示区域和非显示区域面积的产品，或者需要考虑将集成电路制作在显示面板上还是制作在外置芯片上的产品，均可以运用本发明的技术方案。
本实施例中，能够把不同的集成模块和显示区域100中的OLED显示像素都集成在硅基OLED显示面板的相应区域内，这是因为，在工艺制程中，它们的工艺流程相同或者接近，可以采用相同制程工艺能力的产线来制作(节约步骤，并且防止不同步骤对其它器件造成不良影响)，不需要工艺能力较强的制程来制作，节约成本。
本实施例中，把与所述OLED显示像素制作工艺一致或接近的器件模块集成在一起制作，可以达到简化工艺的作用。同时，把制程复杂、要求精细的核心控制模块等电路，单独制作在外部芯片中。此时，硅基OLED显示面板可以采用相对简单的工艺制程来完成，降低成本，也减小了后续外部芯片所需的绑定面积，提高显示面积的占比，减小整个产品的尺寸。
本实施例所提供的硅基OLED产品中，将原本全部制作在中心控制板500内的一些器件模块，直接集成到源信号驱动区域300，也就是说，被集成到硅基OLED显示面板内。这些器件模块为采用相对简单工艺制程的器件模块，具体包括所述栅极行驱动电路和源信号驱动电路中的一些模块，精简了工艺制程，降低了成本，也减小了产品的整体尺寸，提高了显示面积的占比，同时还能够减小外部中心控制板500内部的电路结构和整体尺寸。
本实施例所提供的硅基OLED产品中，主要是将特定的源信号驱动电路集成到了硅基OLED显示面板的所述集成电路区域内，而这种重新设计后的源信号驱动电路只需要采用一般的工艺制程能力的产 线就可以完成制作，不需要在高精度，高制程能力的产线制作，从而降低了成本。
本实施中，把制程要求相对简单的模块与制程要求相对复杂的模块分离开来制作，避免了都采用复杂制程的情况，避免了浪费，降低了成本。
本实施例所提供的硅基OLED产品中，硅基OLED显示面板上集成的绑定区域400(即IC绑定区域，或者说是中心控制板绑定区域)面积更小，使得产品可以做的更小，硅基OLED显示面板上不再集成振荡器模块510(OSC)、接口模块520、静态随机存储模块530(SRAM)、一次编程模块550(OTP)、时序控制模块540和核心控制模块560，使得非发光区域布局任务减少，缩减了研发周期。
本实施例将制程需求高精细、小尺寸的模块(需在高工艺制程能力的产线制作)，与普通制程的模块(一般工艺制程能力的产线制作)分隔开来，精简了整体面板的工艺制程，降低了成本；研发周期缩短，进一步降低成本。
综上可知，现有硅基OLED产品(硅基AMOLED穿戴式产品)，通常会把整个芯片(IC)集成在硅基OLED显示面板内，这样就使得硅基OLED显示面板的非发光区域占用面积很大。同时，OLED显示像素和芯片内不同模块处理的信号性质(数字信号和模拟信号)不同，对应的器件幅值、器件尺寸大小随之不同，工艺制程也有很大差异。为保证产品良率，就需要按照所需的最严苛的工艺制程来制作，这显然大大增加了制程成本。
而本实施例所提供的新的硅基OLED产品中，制程要求复杂的处理数字信号的模块(振荡器模块510、接口模块520、静态随机存储模块530、一次编程模块550、时序控制模块540和核心控制模块560)，不再集成到硅基OLED显示面板上，这样，不仅精简了工艺制程，大大降低了制程成本，还减小了产品的整体尺寸，同时，还缩短了研发周期，进一步降低了整个产品的成本。
本实施例所提供的新的硅基OLED产品中，这种架构的优势就是把制程需求高精细、小尺寸的模块，即处理数字信号的中心控制板相应模块(TCON，需在高工艺制程能力的产线制作)，与普通制程的模块(即上面提到的硅基OLED显示面板内处理模拟信号的OLED显示像素、栅极行驱动电路和源信号驱动电路三者，这三者一般工艺制程能力的产线制作)分隔开来，降低了整体面板制作的工艺制程难度，大大降低了成本。其中，主要是将源信号驱动电路的内部组成与中心控制板500的内部组成进行了调整，使得相应的集成方式更加合理，减小了面板内非发光区域的面积，减小了整个面板的尺寸，缩短了硅基OLED显示面板自身的研发周期，进一步降低产品成本。
虽然本发明披露如上，但本发明并非限定于此。任何本领域技术人员，在不脱离本发明的精神和范围内，均可作各种更动与修改，因此本发明的保护范围应当以权利要求所限定的范围为准。

Claims (10)

  1. 一种硅基OLED产品，其特征在于，
    包括电路板，以及位于所述电路板上的中心控制板和硅基OLED显示面板；
    所述中心控制板中集成有核心控制模块和时序控制模块；
    所述硅基OLED显示面板包括显示区域、栅极行驱动区域、源信号驱动区域和绑定区域；
    所述显示区域中具有OLED显示像素；
    所述栅极行驱动区域中集成有栅极行驱动电路；
    所述源信号驱动区域中集成有源信号驱动电路；
    所述绑定区域为所述硅基OLED显示面板与所述中心控制板进行绑定的区域。
  2. 如权利要求1所述的硅基OLED产品，其特征在于，所述栅极行驱动区域位于所述显示区域中所述OLED显示像素的两侧，所述源信号驱动区域和所述绑定区域位于所述显示区域的一侧，并且所述绑定区域位于所述源信号驱动区域的外侧。
  3. 如权利要求1所述的硅基OLED产品，其特征在于，所述源信号驱动电路包括顺次连接的接口模块、线缓冲区模块、电平转换模块、数模转换器模块和模拟缓冲区模块。
  4. 如权利要求3所述的硅基OLED产品，其特征在于，所述线缓冲区模块包含移位寄存器模块和锁存器模块，所述锁存器模块包括采样模块和存储模块；所述锁存器模块的器件为低压器件。
  5. 如权利要求3所述的硅基OLED产品，其特征在于，所述源信号驱动电路还包括基准电压模块。
  6. 如权利要求3所述的硅基OLED产品，其特征在于，所述数模转 换器模块的器件为中压器件。
  7. 如权利要求3所述的硅基OLED产品，其特征在于，所述数模转换器模块为斜坡数模变换器或者电阻数模转换器。
  8. 如权利要求3所述的硅基OLED产品，其特征在于，所述接口模块中的接口为LVDS接口、MIPI接口或者eDP接口。
  9. 如权利要求1所述的硅基OLED产品，其特征在于，所述中心控制板还包括接口模块、振荡器模块、一次编程模块和静态随机存储模块。
  10. 如权利要求1所述的硅基OLED产品，其特征在于，所述硅基OLED产品为微显示产品。
PCT/CN2018/086537 2017-12-19 2018-05-11 硅基oled产品 WO2019119715A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/627,506 US11043162B2 (en) 2017-12-19 2018-05-11 OLED on silicon product with separated central control board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711372791.0 2017-12-19
CN201711372791.0A CN109935195B (zh) 2017-12-19 2017-12-19 硅基oled产品

Publications (1)

Publication Number Publication Date
WO2019119715A1 true WO2019119715A1 (zh) 2019-06-27

Family

ID=66983427

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/086537 WO2019119715A1 (zh) 2017-12-19 2018-05-11 硅基oled产品

Country Status (3)

Country Link
US (1) US11043162B2 (zh)
CN (1) CN109935195B (zh)
WO (1) WO2019119715A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817164B (zh) * 2017-11-20 2020-10-27 上海视涯技术有限公司 Amoled显示面板和图像显示装置
CN112102770B (zh) * 2020-11-03 2021-02-05 上海视涯技术有限公司 驱动芯片、显示屏和显示装置
CN113763877A (zh) * 2021-08-26 2021-12-07 南京观海微电子有限公司 一种硅基oled显示矩阵和驱动电路分开的制作方法
CN116867308A (zh) * 2022-03-25 2023-10-10 北京字跳网络技术有限公司 硅基微显示器、显示模组及电子设备
CN117222271B (zh) * 2023-11-07 2024-02-02 上海视涯技术有限公司 一种硅基显示模组和显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007120475A2 (en) * 2006-04-06 2007-10-25 Emagin Corporation Oled active matrix cell designed for optimal uniformity
CN101295080A (zh) * 2007-04-26 2008-10-29 奇景光电股份有限公司 硅基液晶显示器及其封装
CN101609872A (zh) * 2009-06-19 2009-12-23 云南北方奥雷德光电科技股份有限公司 微型oled显示器量产封装工艺
CN102074193A (zh) * 2010-12-29 2011-05-25 广东中显科技有限公司 一种硅基oled显示屏和驱动电路
US20140132578A1 (en) * 2012-11-15 2014-05-15 Apple Inc. Ambient Light Sensors with Infrared Compensation
CN105185816A (zh) * 2015-10-15 2015-12-23 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6497858B2 (ja) * 2014-07-11 2019-04-10 株式会社ジャパンディスプレイ 有機ｅｌ表示装置及び有機ｅｌ表示装置の製造方法
US10733946B2 (en) * 2016-08-26 2020-08-04 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US10223960B2 (en) * 2016-08-30 2019-03-05 Semiconductor Energy Laboratory Co., Ltd. Receiver for receiving differential signal, IC including receiver, and display device
US10467952B2 (en) * 2016-10-12 2019-11-05 Shaoher Pan Integrated light-emitting diode arrays for displays
US10388213B2 (en) * 2017-05-22 2019-08-20 Microsoft Technology Licensing, Llc Display and display integration method
KR102416705B1 (ko) * 2017-10-24 2022-07-05 엘지디스플레이 주식회사 유기발광표시장치 및 그 구동 방법
KR102476539B1 (ko) * 2017-12-12 2022-12-12 엘지디스플레이 주식회사 마이크로 디스플레이 장치 및 디스플레이 집적회로

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007120475A2 (en) * 2006-04-06 2007-10-25 Emagin Corporation Oled active matrix cell designed for optimal uniformity
CN101295080A (zh) * 2007-04-26 2008-10-29 奇景光电股份有限公司 硅基液晶显示器及其封装
CN101609872A (zh) * 2009-06-19 2009-12-23 云南北方奥雷德光电科技股份有限公司 微型oled显示器量产封装工艺
CN102074193A (zh) * 2010-12-29 2011-05-25 广东中显科技有限公司 一种硅基oled显示屏和驱动电路
US20140132578A1 (en) * 2012-11-15 2014-05-15 Apple Inc. Ambient Light Sensors with Infrared Compensation
CN105185816A (zh) * 2015-10-15 2015-12-23 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置

Also Published As

Publication number Publication date
US11043162B2 (en) 2021-06-22
US20200160782A1 (en) 2020-05-21
CN109935195A (zh) 2019-06-25
CN109935195B (zh) 2021-02-05

Similar Documents

Publication Publication Date Title
WO2019119715A1 (zh) 硅基oled产品
WO2021082793A1 (zh) 显示面板及其驱动方法、显示装置
WO2017133117A1 (zh) 移位寄存器及其驱动方法、栅极驱动电路和显示装置
US7920109B2 (en) Emission driving device of organic light emitting display device
JP4102309B2 (ja) 表示駆動制御システム
KR102659876B1 (ko) 쉬프트 레지스터 및 이를 포함하는 디스플레이 장치
CN111048024B (zh) 显示设备和显示面板
US20220366848A1 (en) Display substrate and display panel
US20220270530A1 (en) Driving Circuit and Driving Method of Display Panel, Display Panel, and Display Apparatus
WO2022227453A1 (zh) 移位寄存器及其驱动方法、栅极驱动电路、显示装置
US11100880B2 (en) Pixel array with gate driver and matrix sensor array
WO2021082756A1 (zh) 电子基板及其驱动方法、显示装置
US11221699B2 (en) Shift register, driving method thereof and device
US20230143178A1 (en) Display device and data driving circuit
US20220139304A1 (en) Light emitting device and light emitting unit
CN113035927B (zh) 显示基板和显示装置
WO2023207216A9 (zh) 移位寄存器、栅极驱动电路、显示面板及电子设备
WO2023207215A1 (zh) 移位寄存器、栅极驱动电路、显示面板及电子设备
US11538397B2 (en) First shift register, driving method thereof, gate driving circuit, and display device
WO2024021076A1 (zh) 显示基板和显示装置
US20210043124A1 (en) Gate driver circuit and driving method of display panel
US11935486B2 (en) Scan signal generation circuit and display device including the same
CN117012125B (zh) 移位寄存器、栅极驱动电路、显示面板及电子设备
US20240204006A1 (en) Cutting display panel
US20240194112A1 (en) Display panel and electronic terminal

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18890032

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 23.11.2020)

122 Ep: pct application non-entry in european phase

Ref document number: 18890032

Country of ref document: EP

Kind code of ref document: A1