WO2019098014A1 - Capteur de pression de type capacitif - Google Patents

Capteur de pression de type capacitif Download PDF

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Publication number
WO2019098014A1
WO2019098014A1 PCT/JP2018/040364 JP2018040364W WO2019098014A1 WO 2019098014 A1 WO2019098014 A1 WO 2019098014A1 JP 2018040364 W JP2018040364 W JP 2018040364W WO 2019098014 A1 WO2019098014 A1 WO 2019098014A1
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WO
WIPO (PCT)
Prior art keywords
substrate
electrode
movable
pressure sensor
flexible substrate
Prior art date
Application number
PCT/JP2018/040364
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English (en)
Japanese (ja)
Inventor
淳也 山本
貴弘 増田
千紘 宮原
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2019098014A1 publication Critical patent/WO2019098014A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor

Definitions

  • the present invention relates to a capacitive pressure sensor.
  • the pressure sensor mainly detects the pressure of gas or liquid, and is applied to various devices as an air pressure sensor, an altitude sensor, and a water pressure sensor. Also, in recent years, as an aspect of using this as an altitude sensor, its application range is applicable to a navigation device for obtaining position information, an application to a measuring instrument that precisely measures the user's exercise amount, etc. It is spreading.
  • a capacitive pressure sensor is known as a MEMS (Micro Electro Mechanical System) sensor chip.
  • the capacitive pressure sensor includes a flexible substrate having a movable electrode and a rigid substrate having a fixed electrode.
  • An electrostatic capacitance corresponding to the gap is generated between the movable electrode and the fixed electrode.
  • the flexible substrate is flexed, and the gap between the movable electrode and the fixed electrode is changed, thereby detecting a change in electrostatic capacitance.
  • a pressure is detected according to the change in capacitance.
  • a capacitive semiconductor physical quantity sensor has been proposed (see Patent Document 1).
  • an object of the present invention is to provide a capacitive pressure sensor in which peeling between a flexible substrate and a hard substrate is suppressed.
  • the present invention adopts the following means in order to solve the above problems. That is, the present invention includes a flexible substrate having a first electrode, and a second electrode disposed opposite to the first electrode, with a hollow portion between the flexible substrate and the flexible substrate. Between the flexible substrate and the hard substrate, and a bonding portion provided between the flexible substrate and the hard substrate and surrounding the hollow portion and bonding the flexible substrate and the hard substrate, and the periphery of the bonding portion A reinforcing resin provided between the flexible substrate and the hard substrate, and in the hollow portion, a change in capacitance caused by the first electrode bending relative to the second electrode A capacitance type pressure sensor which measures a pressure applied to a surface of a first electrode facing a second electrode by detecting, the reinforcing resin is a part of a flexible substrate, hard Part of substrate and bonding And it covers a part of.
  • the flexible resin is reinforced by the reinforcing resin covering a part of the flexible substrate.
  • the hard resin is reinforced by the reinforcing resin covering a part of the hard substrate.
  • the reinforcing resin reinforces the joint by covering a part of the joint.
  • the reinforcing resin reinforces the flexible substrate, the hard substrate, and the bonding portion, whereby the bonding between the flexible substrate and the hard substrate is maintained, and the peeling between the flexible substrate and the hard substrate is suppressed.
  • the Young's modulus of the reinforcing resin may be the same as the Young's modulus of the flexible substrate or may be smaller than the Young's modulus of the flexible substrate, and the Young's modulus of the flexible substrate is the Young's modulus of the hard substrate It may be smaller.
  • the deformation of the flexible substrate when pressure is applied to the capacitive pressure sensor is not inhibited, and the pressure applied to the capacitive pressure sensor can be measured with high accuracy.
  • the thickness of the reinforcing resin may be the same as the thickness of the flexible substrate or may be smaller than the thickness of the flexible substrate, and the thickness of the flexible substrate is larger than the thickness of the hard substrate It may be small.
  • the deformation of the flexible substrate when pressure is applied to the capacitive pressure sensor is not inhibited, and the pressure applied to the capacitive pressure sensor can be measured with high accuracy.
  • the reinforcing resin is a part of a surface of the hard substrate facing the flexible substrate, a side surface of the hard substrate, and at least a part of the opposite surface of the hard substrate facing the flexible substrate. May be covered.
  • the surface of the hard substrate facing the flexible substrate is the upper surface of the hard substrate.
  • the opposite surface of the hard substrate to the surface facing the flexible substrate is the lower surface of the hard substrate.
  • the side surface of the rigid substrate is continuous with the upper surface and the lower surface of the rigid substrate, and is orthogonal to the upper surface and the lower surface of the rigid substrate. Peeling between the flexible substrate and the hard substrate is further suppressed by the reinforcing resin covering at least a portion of the surface of the hard substrate facing the flexible substrate, the side surface of the hard substrate, and the lower surface of the hard substrate.
  • the flexible substrate may include a plurality of first electrodes, and a plurality of second electrodes corresponding to the plurality of first electrodes, a plurality of rigid substrates, a plurality of joints, and a plurality of electrodes.
  • You may provide reinforcement resin. As a result, bonding between the flexible substrate and the plurality of hard substrates is maintained, and peeling between the flexible substrate and the plurality of hard substrates is suppressed.
  • the electrostatic capacitance type pressure sensor which suppressed peeling of a flexible substrate and a hard substrate can be provided.
  • FIG. 1 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 2 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 3 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 4 is a diagram showing an example of the configuration of a capacitance measurement circuit.
  • FIG. 5 is a diagram showing an example of a state before pressure is applied to the pressure sensor.
  • FIG. 6 is a diagram showing an example of a state when pressure is applied to the pressure sensor.
  • FIG. 7 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 8 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 9 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 1 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 2 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 3 is
  • FIG. 10A is a first view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10B is a second view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10C is a third diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10D is a fourth drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10E is a fifth diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10F is a sixth drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10G is a seventh drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10H is an eighth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10I is a ninth view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 10J is a tenth diagram illustrating the example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 1 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 1 is an example of a cross-sectional view of a pressure sensor 100.
  • the pressure sensor 100 is an example of a capacitive pressure sensor.
  • the pressure sensor 100 includes the sheet substrate 11 and the movable electrode 12, includes the flexible movable portion 10, the substrate portion 21, the fixed electrode 22 and the fixed substrate side plated portion 24, and is hollow between the movable portion 10.
  • a fixed substrate portion 20 disposed opposite to the movable portion 10 via the portion 13.
  • the fixed electrode 22 is disposed to face the movable electrode 12.
  • the movable portion 10 is an example of a flexible substrate.
  • the movable electrode 12 is an example of a first electrode.
  • the fixed substrate unit 20 is an example of a hard substrate.
  • the fixed electrode 22 is an example of a second electrode.
  • the pressure sensor 100 includes a fixed substrate side plated portion 24 provided so as to surround the hollow portion 13 between the movable portion 10 and the fixed substrate portion 20.
  • the pressure sensor 100 is provided with a reinforcing resin 30 provided around the fixed substrate side plated portion 24 and between the movable portion 10 and the fixed substrate portion 20.
  • the reinforcing resin 30 is a member that bonds the movable portion 10 and the fixed substrate portion 20 but does not inhibit the deformation of the movable portion 10, and has a smaller rigidity than the movable portion 10 and the fixed substrate portion 20.
  • the fixed substrate side plated portion 24 joins the movable portion 10 and the fixed substrate portion 20.
  • the fixed substrate plating portion 24 is an example of a bonding portion.
  • the pressure sensor 100 is directed toward the surface of the movable electrode 12 facing the fixed electrode 22 by detecting a change in electrostatic capacitance caused by the movable electrode 12 bending relative to the fixed electrode 22 in the hollow portion 13. Measure the applied pressure.
  • the reinforcing resin 30 covers a portion of the movable portion 10, a portion of the fixed substrate portion 20, and a portion of the fixed substrate side plated portion 24.
  • the reinforcing resin 30 includes a portion of the lower surface of the movable portion 10, a portion of the upper surface of the fixed substrate portion 20, a portion of the side surface of the fixed substrate portion 20, and the fixed substrate side plated portion 24. Covering a part.
  • the reinforcing resin 30 covers a part of the movable portion 10 to reinforce the movable portion 10.
  • the reinforcing resin 30 covers a part of the fixed substrate portion 20, whereby the fixed substrate portion 20 is reinforced.
  • the reinforcing resin 30 covers a part of the fixed substrate side plated portion 24 to reinforce the fixed substrate side plated portion 24.
  • the lower surface of the movable portion 10 and the upper surface of the fixed substrate portion 20 face each other. Further, the lower surface of the movable electrode 12 and the upper surface of the fixed substrate portion 20 face each other. Therefore, the lower surface of the movable portion 10 is a surface facing the fixed substrate portion 20 in the movable portion 10, and the upper surface of the fixed substrate portion 20 is a surface facing the movable portion 10 in the fixed substrate portion 20.
  • the side surface of the fixed substrate portion 20 is continuous with the upper surface and the lower surface of the fixed substrate portion 20, and is orthogonal to the upper surface and the lower surface of the fixed substrate portion 20.
  • a reinforcing resin 30 is provided around the fixed substrate side plating portion 24 between the movable portion 10 and the fixed substrate portion 20, and a portion of the movable portion 10, a portion of the fixed substrate portion 20 and the fixed substrate side By covering a part of the plated portion 24, peeling between the movable portion 10 and the fixed substrate portion 20 is suppressed.
  • the reinforcing resin 30 is preferably soft so as not to inhibit the deformation of the movable portion 10.
  • FIG. 2 and 3 are diagrams showing an example of a pressure sensor according to the embodiment.
  • FIG. 2 is an example of a plan view of the pressure sensor 100
  • FIG. 3 is an example of a cross-sectional view taken along the line AA of FIG.
  • the fixed-substrate-side plated portion 24, the first hollow portion 18, the second hollow portion 19, the fixed electrode 22, and the substrate portion 21 which are not visible in plan view are shown by dotted lines.
  • three pressure sensors 100 (100a, 100b, 100c) are illustrated, as well as a connector 200 and a capacitance measuring circuit 300.
  • the three pressure sensors 100 a, 100 b and 100 c share the sheet substrate 11.
  • FIG. 2 is an example of a plan view of the pressure sensor 100
  • FIG. 3 is an example of a cross-sectional view taken along the line AA of FIG.
  • the fixed-substrate-side plated portion 24, the first hollow portion 18, the second hollow portion 19, the fixed electrode 22, and the substrate portion 21 which are not visible in plan view
  • the pressure sensor 100 includes the movable portion 10 having the movable electrode 12 and the fixed substrate portion 20 including the flexible electrode 22.
  • the pressure sensor 100 is formed by bonding the movable portion 10 and the fixed substrate portion 20 so that the movable electrode 12 of the movable portion 10 and the fixed electrode 22 of the fixed substrate portion 20 face each other.
  • the movable electrode 12 includes a first movable electrode 121 and a second movable electrode 122 provided separately from the first movable electrode 121.
  • a first hollow portion 18 is formed between the first movable electrode 121 and the fixed electrode 22. By forming the first hollow portion 18, the movable portion 10 can be deformed toward the fixed substrate portion 20 when pressure is applied to a region on the sheet substrate 11 corresponding to the first movable electrode 121.
  • a second hollow portion 19 is formed between the second movable electrode 122 and the fixed electrode 22.
  • the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are substantially circular, but the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are limited to substantially circular. is not.
  • the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 may be formed into a substantially polygonal shape, and may be, for example, a substantially square, a substantially hexagonal, a substantially octagonal, or the like.
  • the direction from the second hollow portion 19 to the first hollow portion 18 in FIG. 2 is referred to as the right, and the opposite direction is referred to as the left.
  • the direction from the pressure sensor 100 a to the pressure sensor 100 c is rear, and the opposite direction is front.
  • the direction from the movable portion 10 to the fixed substrate portion 20 in FIG. 3 is downward, and the opposite direction is upward.
  • the movable portion 10 includes a sheet substrate 11, a movable electrode 12, and a movable portion side plated portion 14.
  • the sheet substrate 11 is formed of a flexible member (for example, polyimide).
  • the thickness of the sheet substrate 11 is, for example, 25 ⁇ m.
  • the thickness of the sheet substrate 11 is the length of the sheet substrate 11 in the vertical direction.
  • the lower surface of the sheet substrate 11 is provided with a movable electrode 12 formed of a conductive member (for example, copper).
  • the movable electrode 12 includes the first movable electrode 121 and the second movable electrode 122 provided to be separated from the first movable electrode 121 as described above.
  • the thickness of the movable electrode 12 is, for example, 10 ⁇ m.
  • the length of the first movable electrode 121 in the left-right direction is, for example, 2.0 mm.
  • the length of the second movable electrode 122 in the left-right direction is, for example, 0.5 mm.
  • the lengths of the first movable electrode 121 and the second movable electrode 122 in the front-rear direction are, for example, 1 mm to 2 mm.
  • the distance between the first movable electrode 121 and the second movable electrode 122 is, for example, 0.1 mm.
  • the movable portion side plated portion 14 is provided on the lower surface of the movable electrode 12.
  • the movable portion-side plated portion 14 includes a first plated portion 141 provided on the lower surface of the first movable electrode 121 and a second plated portion 142 provided on the lower surface of the second movable electrode 122.
  • the movable portion-side plated portion 14 is formed, for example, by gold plating.
  • the fixed substrate portion 20 includes a substrate portion 21, a fixed electrode 22, an insulating portion 23 and a fixed substrate side plated portion 24.
  • the substrate unit 21 is formed of a member (for example, glass) which is not easily deformed.
  • the thickness of the substrate portion 21 is, for example, 300 ⁇ m to 600 ⁇ m. Since the substrate portion 21 is formed of a member that is not easily deformed, deformation of the fixed substrate portion 20 is suppressed even if the movable portion 10 is bent by the application of pressure to the sheet substrate 11.
  • a fixed electrode 22 formed of a conductive member (for example, chromium) is disposed on the upper surface of the substrate unit 21.
  • an insulating portion 23 is provided which surrounds the periphery of the fixed electrode 22 and covers a part of the upper side of the fixed electrode 22.
  • the insulating portion 23 is formed of an insulator (for example, tetraethoxysilane (TEOS) or silicon dioxide).
  • TEOS tetraethoxysilane
  • the thickness of the insulating portion 23 is, for example, 0.5 ⁇ m.
  • a portion for forming a part of the first hollow portion 18 described above is provided in a part of a region where the first movable electrode 121 and the fixed electrode 22 overlap in a plan view.
  • a part for forming the above-described second hollow portion 19 is provided in a part of a region where the second movable electrode 122 and the fixed electrode 22 overlap in plan view.
  • a portion for forming a part of the first hollow portion 18 and the second hollow portion 19 is formed as a through hole extending from the surface on the movable portion 10 side of the insulating portion 23 to the surface on the fixed electrode 22 side. Be done.
  • the diameter of the first hollow portion 18 in plan view is, for example, 0.6 mm to 1.2 mm. When the pressure sensor 100 is viewed in plan, the area of the second hollow portion 19 is smaller than the area of the first hollow portion 18.
  • the diameter of the second hollow portion 19 in plan view is smaller than the diameter of the first hollow portion 18 in plan view.
  • the distance d between the first movable electrode 121 of the first hollow portion 18 and the fixed electrode 22 when no pressure is applied is, for example, 1 ⁇ m.
  • a fixed substrate plating portion 24 is provided on the inner side surface and the bottom of the second hollow portion 19 in addition to a part of the upper surface of the insulating portion 23.
  • the fixed substrate plating portion 24 includes a third plating portion 241 and a fourth plating portion 242.
  • the third plated portion 241 is provided in a region near the edge of the through hole that forms a part of the first hollow portion 18 on the upper surface of the insulating portion 23 so as to surround the region.
  • a space formed by the portion surrounded by the third plated portion 241 and the through hole provided in the insulating portion 23 in this manner is a first hollow portion.
  • the fourth plated portion 242 is provided in a region near the edge of the through hole for forming the second hollow portion 19 on the upper surface of the insulating portion 23 so as to surround the region, and the inner side surface of the through hole And the upper surface of the fixed electrode 22 corresponding to the bottom of the through hole. That is, the fourth plated portion 242 is formed of a portion which is formed to project from the upper surface of the insulating portion 23 toward the second movable electrode 122 and a portion which covers the inside of the through hole, and is surrounded by these The space is the second hollow portion 19.
  • the fixed substrate plating portion 24 is formed, for example, by gold plating. By bonding the movable portion-side plated portion 14 and the fixed substrate-side plated portion 24, the movable portion 10 and the fixed substrate portion 20 are integrated to form the pressure sensor 100. In addition, the second movable portion 122 and the fixed electrode 22 are electrically connected by joining the second plated portion 142 and the fourth plated portion 242.
  • the second movable electrode 122 and the connector 200 are connected by a signal line 15 extending from the second movable electrode 122.
  • the ground (GND) line 16a extending from the first movable electrode 121 is connected between the first movable electrodes 121 of the pressure sensors 100a and 100b and between the first movable electrodes 121 of the pressure sensors 100b and 100c.
  • the distance between adjacent pressure sensors 100 is, for example, 0.1 mm to 0.3 mm. That is, the length of the GND line 16a is 0.1 mm to 0.3 mm.
  • the first movable electrode 121 of the pressure sensor 100 c is connected to the connector 200 by the GND line 16 b extending from the first movable electrode 121.
  • GND is shared by the pressure sensors 100a, 100b, and 100c.
  • both the signal line 15 and the GND line 16 are formed on the lower surface of the sheet substrate 11. That is, in the pressure sensor 100, the wiring extending from the first movable electrode 121 and the wiring extending from the fixed electrode 22 are formed in the same layer.
  • the pressure sensor 100 can realize a simple wiring structure by adopting such a configuration.
  • the pressure sensor 100 having the above-described configuration includes an area overlapping the fixed electrode 22 of the first movable electrode 121 and an area overlapping the first movable electrode 121 of the fixed electrode 22 which are arranged at a distance d (see FIG. 3). It works as a plate capacitor.
  • the capacitance C of the capacitor is calculated, for example, by the following equation 1 using the distance d described above and the area S of the area where the first movable electrode 121 and the fixed electrode 22 overlap (see FIG. 3). .
  • ⁇ 0 is the dielectric constant of vacuum
  • ⁇ r is the dielectric constant of the atmosphere. That is, according to (Expression 1), the electrostatic capacitance C fluctuates according to the fluctuation of the distance d between the first movable electrode 121 and the fixed electrode 22 which is caused by the force applied to the movable portion 10. I understand.
  • the pressure P is calculated by the following (Formula 2), for example using the area S mentioned above.
  • F is the magnitude of the force applied to the pressure sensor 100.
  • the substrate unit 21 is formed of a member that is not easily deformed, even if a force is applied to the pressure sensor 100, the fluctuation of the area S serving as a reference of pressure calculation is suppressed. Therefore, the pressure sensor 100 can detect the pressure with higher accuracy than a pressure sensor formed of a member that the substrate portion 21 is easily deformed.
  • FIG. 4 is a diagram showing an example of the configuration of the capacitance measuring circuit 300. As shown in FIG. In FIG. 4, pressure sensors 100 a, 100 b and 100 c are also illustrated. Further, in FIG. 4, the illustration of the connector 200 is omitted.
  • the capacitance measurement circuit 300 includes two multiplexers 301 and 301 (denoted as MUX in the drawing) and a converter 302. Signals associated with fluctuations in capacitance of the pressure sensors 100 a, 100 b, 100 c are input to the multiplexers 301, 301 via the signal line 15. Each of the multiplexers 301 and 301 outputs a selected one of the signals input from the pressure sensors 100a, 100b and 100c.
  • MUX multiplexers
  • the signal output from each of the multiplexers 301 and 301 is input to the converter 302.
  • the converter 302 stores, for example, the correspondence between signal values input from the multiplexers 301 and 301 and pressure.
  • the correspondence relationship managed by the converter 302 may be, for example, a table indicating the correspondence between the input signal value and the pressure, or may be a mathematical expression for calculating the pressure from the input signal value.
  • the converter 302 converts, for example, the signal value input from the multiplexers 301 and 301 into a signal value indicating pressure according to the correspondence relationship, and outputs a signal value indicating pressure.
  • FIG. 5 shows an example of a state before pressure is applied to the pressure sensor 100
  • FIG. 6 shows an example of a state when pressure is applied to the pressure sensor 100.
  • the pressure sensor 100 when pressure is applied from above the first hollow portion 18, as illustrated in FIG. 6, the pressure is applied according to the force applied to the movable portion 10 including the sheet substrate 11 and the first movable electrode 121. And bend toward the fixed substrate portion 20.
  • the pressure sensor 100 returns from the state of FIG. 6 to the state of FIG. That is, in the pressure sensor 100, the distance d between the first movable electrode 121 and the fixed electrode 22 fluctuates according to the applied force.
  • the capacitance of the pressure sensor 100 changes according to (Expression 1).
  • the pressure applied to the pressure sensor 100 is detected by measuring the fluctuation of the capacitance of the pressure sensor 100 by the capacitance measuring circuit 300 illustrated in FIG. 2.
  • the pressure sensor 100 has a second hollow portion 19 in addition to the first hollow portion 18.
  • the cylindrical fourth plating portion 242 which reaches from the fixed electrode 22 to the second movable electrode 122 is formed. If the fixed electrode 22 and the second movable electrode 122 are only electrically connected, it is sufficient to connect only one wire instead of forming the fourth plated portion 242 in a cylindrical shape.
  • both of the first movable electrode 121 and the second movable electrode 122 provided apart from each other are provided on the sheet substrate 11.
  • the first movable electrode 121 when a force is applied from above the first movable electrode 121, the first movable electrode 121 is bent to the fixed electrode 22 side, and the second movable electrode 122 is also distorted to the fixed electrode 22 side.
  • the first movable electrode 121 bends with respect to the fixed electrode 22 without deviation in the front-rear direction and the left-right direction.
  • the second movable electrode 122 is distorted to the fixed electrode 22 side, the first movable electrode 121 is affected by the deflection, and it becomes difficult to deflect the fixed electrode 22 uniformly.
  • the cross-sectional shape when planarly viewing the 4th plated part 242 is formed in substantially circle shape or substantially polygon shape.
  • distortion in the second movable electrode 122 portion when pressure is applied is suppressed as compared with the configuration in which the fixed electrode 22 and the second movable electrode 122 are connected by one wire.
  • the fourth plated portion 242 having a substantially circular or polygonal cross-sectional shape can support the second movable electrode 122 more stably than in the case where the second movable electrode 122 is supported by one wire. .
  • FIGS. 7 and 8 are diagrams showing an example of the pressure sensor according to the embodiment. 7 and 8 are examples of cross-sectional views taken along the line AA of FIG.
  • the pressure sensor 100 includes a reinforcing resin 30 provided between the movable portion 10 and the fixed substrate portion 20 around the first hollow portion 18 and the second hollow portion 19.
  • the reinforcing resin 30 is provided around the first hollow portion 18 and the second hollow portion 19 and between the movable portion 10 and the fixed substrate portion 20.
  • the reinforcing resin 30 bonds the movable portion 10 and the fixed substrate portion 20.
  • FIG. 1 is bonded to bond the movable portion 10 and the fixed substrate portion 20.
  • the reinforcing resin 30 covers a portion of the lower surface of the movable portion 10, a portion of the upper surface of the fixed substrate portion 20, and a portion of the side surface of the fixed substrate portion 20.
  • the reinforcing resin 30 covers a portion of the lower surface of the movable portion 10, a portion of the upper surface of the fixed substrate portion 20, and the side and lower surfaces of the fixed substrate portion 20.
  • the reinforcing resin 30 covers a portion of the movable portion 10 and a portion of the fixed substrate portion 20, whereby the movable portion 10 and the fixed substrate portion 20 are reinforced.
  • a single reinforcing resin 30 may cover a portion of the movable portion 10 and a portion of the fixed substrate portion 20, and a plurality of reinforcing resins 30 may be a portion of the movable portion 10 and a portion of the fixed substrate portion 20. You may cover it.
  • the pressure sensors of FIGS. 7 and 8 are exemplary and are not limited to the examples of pressure sensors of FIGS. 7 and 8.
  • the reinforcing resin 30 may cover a portion of the lower surface of the movable portion 10 and a portion of the upper surface of the fixed substrate portion 20, and may cover all of the side surfaces of the fixed substrate portion 20 and a portion of the lower surface.
  • the reinforcing resin 30 may cover a portion of the lower surface of the movable portion 10 and a portion of the upper surface of the fixed substrate portion 20 and a portion of the side surface and the lower surface of the fixed substrate portion 20.
  • the reinforcing resin 30 may cover a portion of the lower surface of the movable portion 10 and a portion of the upper surface of the fixed substrate portion 20, and may cover a portion of the side surface and the entire lower surface of the fixed substrate portion 20.
  • FIG. 9 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 9 is an example of a cross-sectional view taken along the line AA of FIG.
  • the reinforcing resin 30 is in contact with the sheet substrate 11, the movable electrode 12 and the movable portion side plated portion 14.
  • the reinforcing resin 30 may be in contact with the movable electrode 12 and the movable portion-side plated portion 14 and not in contact with the sheet substrate 11 without being limited to the example shown in FIG. Further, the reinforcing resin 30 may be in contact with the movable portion side plated portion 14 and not in contact with the sheet substrate 11 and the movable electrode 12. As shown in FIG.
  • a third plated portion 241 provided so as to surround the first hollow portion 18 and a second hollow portion 19 are provided between the movable portion 10 and the fixed substrate portion 20.
  • the fourth plated portion 242 is disposed. Therefore, the reinforcing resin 30 is provided around the fixed substrate side plated portion 24 including the third plated portion 241 and the fourth plated portion 242.
  • the reinforcing resin 30 covers a portion of the third plated portion 241 and a portion of the fourth plated portion 242.
  • the reinforcing resin 30 covers a part of the third plated part 241 and a part of the fourth plated part 242, thereby reinforcing the third plated part 241 and the fourth plated part 242.
  • a single reinforcing resin 30 may cover a portion of the movable portion 10 and a portion of the fixed substrate portion 20, a portion of the third plated portion 241, and a portion of the fourth plated portion 242.
  • the plurality of reinforcing resins 30 may cover a portion of the movable portion 10, a portion of the fixed substrate portion 20, a portion of the third plated portion 241, and a portion of the fourth plated portion 242.
  • a single reinforcing resin 30 may cover a portion of the movable portion 10, a portion of the fixed substrate portion 20, a portion of the third plated portion 241, and a portion of the fourth plated portion 242.
  • the plurality of reinforcing resins 30 may cover a portion of the movable portion 10, a portion of the fixed substrate portion 20, a portion of the third plated portion 241, and a portion of the fourth plated portion 242.
  • a reinforcing resin 30 is embedded between the movable portion 10 and the fixed substrate portion 20 around the first hollow portion 18 and the second hollow portion 19, and a part of the movable portion 10, one of the fixed substrate portion 20.
  • peeling between the movable portion 10 and the fixed substrate portion 20 is suppressed.
  • the peeling between the movable portion 10 and the fixed substrate portion 20 is further suppressed. Bonding of the movable portion 10 and the fixed substrate portion 20 by the reinforcing resin 30 maintains the bonding between the movable portion 10 and the fixed substrate portion 20, and the peeling between the movable portion 10 and the fixed substrate portion 20 is suppressed. .
  • the movable portion 10 and the fixed substrate portion 20 are joined by joining the movable portion-side plated portion 14 and the fixed substrate side plated portion 24.
  • the reinforcing resin 30 covers a portion of the movable portion 10, a portion of the fixed substrate portion 20, and a portion of the fixed substrate side plated portion 24 so that the bonding between the movable portion 10 and the fixed substrate portion 20 is maintained. Peeling between the portion 10 and the fixed substrate side plated portion 24 is suppressed.
  • the reinforcement resin 30 is embedded between the movable portion 10 and the fixed substrate portion 20 around the first hollow portion 18 and the second hollow portion 19 so that the intrusion of water into the pressure sensor 100 is suppressed. The short circuit of the pressure sensor 100 is suppressed.
  • the reinforcing resin 30 may cover either one or both of the signal line 15 and the GND line 16 shown in FIG.
  • the reinforcing resin 30 covering the signal line 15 and the GND line 16 suppresses the disconnection of the signal line 15 and the GND line 16.
  • the reinforcing resin 30 be soft so as not to inhibit the deformation of the movable portion 10 when a pressure is applied to the pressure sensor 100.
  • the reinforcing resin 30 include epoxy resin and polyimide resin.
  • the Young's modulus (elastic modulus) of the reinforcing resin 30 be the same as the Young's modulus of the movable portion 10 or smaller than the Young's modulus of the movable portion 10.
  • the Young's modulus of the movable portion 10 is smaller than the Young's modulus of the fixed substrate portion 20.
  • the Young's modulus (E1) of the reinforcing resin 30, the Young's modulus (E2) of the movable portion 10, and the Young's modulus (E3) of the fixed substrate portion 20 may be in the order of E1 ⁇ E2 ⁇ E3.
  • the material of the sheet substrate 11 and the material of the reinforcing resin 30 may be the same.
  • the Young's modulus of the movable electrode 12 is larger than the Young's modulus of the sheet substrate 11 and the reinforcing resin 30.
  • the Young's modulus of the reinforcing resin 30 is smaller than the Young's modulus of the movable portion 10.
  • the bending stress ⁇ can be determined by the bending moment M / the cross section coefficient Z.
  • the width of each of the movable portion 10, the fixed substrate portion 20, and the reinforcing resin 30 is constant, as the thickness T of each of the movable portion 10, the fixed substrate portion 20, and the reinforcing resin 30 decreases, the movable portion 10, the fixed substrate
  • the section coefficient Z of each of the portion 20 and the reinforcing resin 30 becomes smaller.
  • the section coefficient Z of each of the movable portion 10 becomes smaller, the bending stress ⁇ of each of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 becomes larger. Therefore, when the respective widths of the movable portion 10, the fixed substrate portion 20, and the reinforcing resin 30 are constant, as the thickness T of the movable portion 10, the fixed substrate portion 20, and the reinforcing resin 30 decreases, the movable portion 10, The rigidity of each of the fixed substrate portion 20 and the reinforcing resin 30 is reduced.
  • the thickness (T1) of the reinforcing resin 30, the thickness (T2) of the movable portion 10, and the thickness (T3) of the fixed substrate portion 20 are The order may be T1 ⁇ T2 ⁇ T3.
  • the pressure sensor 100 has a plurality of sensor elements that share a single sheet substrate 11.
  • a plurality of reinforcing resins 30 are disposed on a single sheet substrate 11, and each of the plurality of reinforcing resins 30 covers each movable electrode 12, each fixed substrate portion 20, and each fixed substrate side plated portion 24.
  • the plurality of movable electrodes 12 are separated, the plurality of fixed substrate portions 20 are separated, the plurality of fixed substrate side plated portions 24 are separated, and the plurality of reinforcing resins 30 are separated. Therefore, when pressure is applied to the pressure sensor 100, one of the adjacent sensor elements does not inhibit the deformation of the movable portion 10 included in the other of the adjacent sensor elements. Therefore, the deformation of the movable portion 10 when the pressure is applied to the pressure sensor 100 is not inhibited, and the pressure applied to the pressure sensor 100 can be measured with high accuracy.
  • 10A to 10I are diagrams showing an example of a manufacturing process of the pressure sensor 100.
  • FIG. Hereinafter, an example of a manufacturing process of the pressure sensor 100 will be described with reference to FIGS. 10A to 10I.
  • FIG. 10A to 10E show an example of the manufacturing process of the fixed substrate portion 20.
  • FIG. 10A the fixed electrode 22 is formed on the surface of the substrate 21 facing the movable portion 10.
  • FIG. 10B the insulating film 231 is formed so as to cover the fixed electrode 22.
  • a resist film 51 is formed on the surface of the insulating film 231 facing the movable portion 10.
  • FIG. 10C a resist film 51 having a predetermined pattern is formed on the insulating film 231 by performing a photoresist using a photomask in which a desired pattern is formed on the resist film 51.
  • FIG. 10C a resist film 51 having a predetermined pattern is formed on the insulating film 231 by performing a photoresist using a photomask in which a desired pattern is formed on the resist film 51.
  • the etching process is performed, and the resist film 51 is further removed, whereby the insulating portion 23 is formed.
  • the fixed substrate side plated portion 24 is formed on the surface of the insulating portion 23 facing the movable portion 10.
  • the plating resist is performed on the area where the fixed substrate side plated portion 24 is not formed, and then the plating process is performed to form the fixed substrate side plated portion 24 in a desired area.
  • the fixed substrate side plated portion 24 may be formed by sputtering. That is, after a plating layer is formed on the surface of the insulating portion 23 facing the movable portion 10 by a sputtering apparatus, a resist is applied and etched to form a pattern of the fixed substrate plating portion 24. May be
  • FIG. 10F the movable electrode 12 is formed on the surface of the flexible sheet substrate 11 facing the fixed substrate portion 20. Furthermore, the plating process is performed on the surface of the movable electrode 12 facing the fixed substrate portion 20, whereby the movable portion-side plated portion 14 is formed.
  • the etching resist is performed on the region corresponding to the first movable electrode 121 and the second movable electrode 122 on the surface of the movable portion plating portion 14 facing the fixed substrate portion 20, and then the etching is performed. By being performed, the first movable electrode 121 and the second movable electrode 122 are formed.
  • FIG. 10H and FIG. 10I show an example of the process of joining the fixed substrate part 20 and the movable part 10.
  • the movable portion 10 and the fixed substrate portion 20 are joined.
  • the movable portion 10 and the fixed substrate portion 20 may be joined by, for example, normal temperature bonding.
  • the normal temperature bonding for example, the surface of the movable portion side plated portion 14 of the movable portion 10 facing the fixed substrate portion 20 and the surface of the fixed substrate portion 20 facing the movable portion 10 of the fixed substrate side plated portion 24 are A process of smoothing the surface and a process of removing impurities from the surface to clean the surface are performed.
  • FIG. 10I illustrates a state in which three pressure sensors 100 manufactured by the steps of FIGS. 10A to 10H are arranged side by side so as to share the sheet substrate 11. As illustrated in FIG. 10I, the pressure sensor 100 can widen the area targeted for pressure detection by sharing the sheet substrate 11 and arranging the plurality of pressure sensors 100.
  • manufacturing of the movable portion 10 and the fixed substrate portion 20 is performed without performing a process of flattening the surfaces of the movable portion side plated portion 14 and the fixed substrate side plated portion 24.
  • the flatness of the surface may be ensured in the process.
  • metal for example, copper
  • CMP Chemical Mechanical Polishing
  • FIG. 10J shows an example of the process of forming the reinforcing resin 30.
  • the reinforcing resin 30 is formed around the first hollow portion 18 and the second hollow portion 19 and between the movable portion 10 and the fixed substrate portion 20.
  • the reinforcing resin 30 is formed on a portion of the lower surface of the movable portion 10 and the side surface of the fixed substrate portion 20.
  • the reinforcing resin 30 may be applied to the movable portion 10 and the fixed substrate portion 20 by a dispenser.
  • the sheet-like reinforcing resin 30 may be attached to the movable portion 10 and the fixed substrate portion 20.
  • Second hollow portion 20 Fixed substrate portion 21: Substrate portion 22: Fixed electrode 23: Insulation portion 24: Fixed substrate side plated portion 241: Third plating Section 242 Fourth plating section 30 Reinforcing resin 51 Resist film 200 Connector 231 Insulating film 300 Capacitance measurement circuit 301 Multiplexer 302 converter

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

Selon la présente invention, le décollement d'un substrat flexible et d'un substrat dur est supprimé. La présente invention concerne un capteur de pression de type capacitif qui est pourvu de : un substrat flexible comprenant une première électrode, le substrat flexible étant flexible ; un substrat dur comprenant une deuxième électrode disposée face à la première électrode, le substrat dur étant disposé face au substrat flexible de part et d'autre d'une partie creuse entre le substrat flexible et le substrat dur ; une partie de jonction entre le substrat flexible et le substrat dur, la partie de jonction étant disposée de façon à entourer la partie creuse et assembler le substrat flexible et le substrat dur ; et une résine de renforcement disposée entre le substrat flexible et le substrat dur et à proximité de la partie de jonction ; le capteur de pression de type capacitif étant tel que, dans la partie creuse, la pression appliquée sur une surface de la première électrode faisant face à la deuxième électrode est mesurée par détection d'un changement de capacité survenant en raison de la flexion de la première électrode par rapport à la deuxième électrode, et la résine de renforcement recouvre une partie du substrat flexible, une partie du substrat dur, et une partie de la partie de jonction.
PCT/JP2018/040364 2017-11-15 2018-10-30 Capteur de pression de type capacitif WO2019098014A1 (fr)

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JP2017220486A JP6812953B2 (ja) 2017-11-15 2017-11-15 静電容量式圧力センサ
JP2017-220486 2017-11-15

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WO2019098014A1 true WO2019098014A1 (fr) 2019-05-23

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CN114279826A (zh) * 2021-12-25 2022-04-05 中国地震局地质研究所 高压容器内置载荷传感器及载荷计算方法

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JP2005207993A (ja) * 2004-01-26 2005-08-04 Alps Electric Co Ltd 面圧分布センサおよび面圧分布センサの製造方法
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JPH0743625Y2 (ja) * 1987-10-13 1995-10-09 株式会社トーキン 静電容量式荷重センサ
JP2012247372A (ja) * 2011-05-30 2012-12-13 Nippon Mektron Ltd 圧力センサ及びその製造方法並びに圧力検出モジュール
JP5983845B2 (ja) * 2015-01-15 2016-09-06 大日本印刷株式会社 圧力センサおよび接続部材の製造方法
JP2017044590A (ja) * 2015-08-27 2017-03-02 アルプス電気株式会社 押圧検知装置

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US4584625A (en) * 1984-09-11 1986-04-22 Kellogg Nelson R Capacitive tactile sensor
JP2001122010A (ja) * 1999-10-26 2001-05-08 Fujitsu Takamisawa Component Ltd 着座センサ
JP2005207993A (ja) * 2004-01-26 2005-08-04 Alps Electric Co Ltd 面圧分布センサおよび面圧分布センサの製造方法
JP2007315921A (ja) * 2006-05-25 2007-12-06 Omron Corp 静電容量式センサ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114279826A (zh) * 2021-12-25 2022-04-05 中国地震局地质研究所 高压容器内置载荷传感器及载荷计算方法
CN114279826B (zh) * 2021-12-25 2024-02-23 中国地震局地质研究所 高压容器内置载荷传感器及载荷计算方法

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