WO2019093230A1 - Appareil de réglage de température de dispositif - Google Patents

Appareil de réglage de température de dispositif Download PDF

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Publication number
WO2019093230A1
WO2019093230A1 PCT/JP2018/040774 JP2018040774W WO2019093230A1 WO 2019093230 A1 WO2019093230 A1 WO 2019093230A1 JP 2018040774 W JP2018040774 W JP 2018040774W WO 2019093230 A1 WO2019093230 A1 WO 2019093230A1
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WO
WIPO (PCT)
Prior art keywords
working fluid
coolers
cooler
pipe
piping
Prior art date
Application number
PCT/JP2018/040774
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English (en)
Japanese (ja)
Inventor
義則　毅
康光 大見
功嗣 三浦
竹内　雅之
Original Assignee
株式会社デンソー
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Priority claimed from JP2018082432A external-priority patent/JP2019086275A/ja
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Publication of WO2019093230A1 publication Critical patent/WO2019093230A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00—Arrangement or mounting of electrical propulsion units
    • B60K1/04—Arrangement or mounting of electrical propulsion units of the electric storage means for propulsion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/615—Heating or keeping warm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/625—Vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/64—Heating or cooling; Temperature control characterised by the shape of the cells
    • H01M10/647—Prismatic or flat cells, e.g. pouch cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6556—Solid parts with flow channel passages or pipes for heat exchange
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
    • H01M10/6569—Fluids undergoing a liquid-gas phase change or transition, e.g. evaporation or condensation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present disclosure relates to a device temperature control apparatus that adjusts the temperature of a target device by phase change between a liquid phase and a gas phase of a working fluid.
  • thermosiphon as a device temperature control device for adjusting the temperature of an electric device such as a power storage device mounted on an electric vehicle such as an electric vehicle or a hybrid vehicle
  • the working fluid inside the device heat exchanger absorbs heat from the battery, evaporates, and flows into the condenser through the gas phase passage.
  • the liquid phase working fluid condensed by the condenser flows through the liquid phase passage into the equipment heat exchanger.
  • the device temperature control device is configured to cool the battery by the phase change of the working fluid circulating in the thermosyphon circuit.
  • thermosiphon-type instrument temperature control apparatus as described in Patent Document 1. That is, the apparatus temperature control apparatus mounted in vehicles, such as a motor vehicle, becomes a structure which connected the several temperature control part by piping, in order to adjust temperature of object apparatuses, such as a secondary battery.
  • the device temperature control device when the device temperature control device is mounted on a vehicle such as a car, the device temperature control device may tilt along with the vehicle. For example, when the vehicle is moving up a hill, the front side in the traveling direction of the vehicle is positioned higher than the rear side in the vehicle traveling direction. And an apparatus temperature control apparatus will also be in the inclined state similarly to a vehicle.
  • the working fluid of the device temperature control apparatus is concentrated in the lower temperature control unit among the plurality of temperature control units under the influence of gravity. That is, a sufficient working fluid may not be supplied to the higher temperature control unit among the plurality of temperature control units.
  • the device temperature control device when the device temperature control device is mounted on a vehicle such as a car, it is preferable to install an electric device such as a secondary battery and a temperature control unit on a flat surface.
  • an electric device such as a secondary battery and a temperature control unit
  • a flat space there may be a case where a flat space sufficient for installing the device temperature control device and the temperature control unit in the vehicle can not be secured.
  • the working fluid of the device temperature control apparatus is concentrated in the lower temperature control section among the plurality of temperature control sections under the influence of gravity. That is, a sufficient working fluid may not be supplied to the higher temperature control unit among the plurality of temperature control units.
  • An object of the present disclosure is to enable temperature control of a target device to be implemented more stably.
  • an apparatus temperature control device that has a circulation circuit that circulates a working fluid and that adjusts the temperature of a target device by a phase change between the liquid phase and the gas phase of the working fluid is a circulation circuit.
  • a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler to dissipate the heat Condensers for condensing fluid,
  • Outgoing piping which is included in the circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to the plurality of coolers, and is included in the circulation circuit and which has the plurality of coolers
  • a return pipe forming a gas passage for supplying the working fluid thus evaporated to the condenser, the plurality of coolers each having an inlet for introducing the working fluid flowing in the forward pipe into the internal space of the main body; Discharge port that discharges the working fluid that has evaporated
  • the liquid storage portion is formed in the internal space of the main body of each cooler by the forward piping, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control apparatus that includes a circulation circuit that circulates a working fluid and adjusts the temperature of a target device by a phase change of a liquid phase and a gas phase of the working fluid is a circulation circuit. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler to dissipate the heat Condensers for condensing fluid, Outgoing piping which is included in the circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to the plurality of coolers, and is included in the circulation circuit and which has the plurality of coolers Backflow piping for forming a gas passage for supplying the working fluid thus evaporated to the condenser, and the plurality of coolers are respectively provided at the inlet and the main body for introducing the working fluid flowing in the forward piping into the internal space of the main body Exhaust port for
  • the liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers
  • the return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Draining the working fluid that has evaporated
  • the outlet pipe has a port, and the forward
  • the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers The return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Draining the working fluid that has evaporated
  • the outlet piping has a convex piping
  • the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers
  • the return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Has an outlet that allows the working fluid introduced to flow out
  • the forward piping is a conve
  • the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers
  • the return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Has an outlet that allows the working fluid introduced to flow out , At least one of the inlet
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers The return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Draining the working fluid that has evaporated
  • a plurality of coolers having a mouth include
  • the forward piping has high-low connection piping that connects between the low-stage cooler inlet and the high-stage cooler inlet, and at least a portion of the liquid passage formed by the high-low connection piping is low-stage cooling It projects vertically above the inlet of the vessel and the inlet of the high stage cooler.
  • the liquid storage portion is formed in the internal space of the main body of the high-stage cooler by the convex piping
  • the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers
  • the return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Has an outlet that allows the working fluid introduced to flow out
  • the plurality of coolers includes a
  • the high-stage cooler is disposed at the second height position higher than the low-stage cooler, at least a part of the liquid passage formed by the high-low connection piping is high-stage cooling
  • the liquid storage portion is formed in the inner space of the main body of the high stage cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Be liquid. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • an apparatus temperature control device includes a circulation circuit that circulates a working fluid, and adjusts a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. And a plurality of coolers for cooling the target equipment by heat exchange between the heat of the target equipment and the heat of the working fluid, and the heat contained in the circulation circuit, the heat of the working fluid evaporated by the cooler being dissipated Condenser for condensing working fluid, Outgoing piping which is included in circulation circuit and forms a liquid passage for supplying working fluid condensed in the condenser to multiple coolers, included in circulation circuit, for multiple coolers
  • the return line forming a gas passage for supplying the working fluid evaporated in step to the condenser, and the plurality of coolers are respectively provided to the inlet and the body for introducing the working fluid flowing in the forward line into the internal space of the main body Has an outlet that allows the working fluid introduced to flow out
  • the plurality of coolers includes a
  • the liquid storage portion is formed in the internal space of the main body of the high-stage cooler, The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • parenthesized reference symbol attached to each component etc. shows an example of the correspondence of the component etc. and the specific component etc. as described in the embodiment to be described later.
  • FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 4; It is a figure showing the state of the apparatus temperature control apparatus in case the vehicle carrying the apparatus temperature control apparatus of 1st Embodiment is driving an upward slope.
  • FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. It is the block diagram which showed the cooler and secondary battery of 3rd Embodiment. It is the block diagram which showed the cooler and secondary battery of 4th Embodiment. It is the block diagram which showed the cooler and secondary battery of 5th Embodiment. It is a figure showing the comparative example with respect to the cooler and secondary battery of 5th Embodiment. It is the block diagram which showed the cooler and secondary battery of 6th Embodiment.
  • FIG. 16 is a configuration view showing a cooler according to a twelfth embodiment, and is a view showing a modified example of the VV sectional view in FIG. 4; It is a figure for demonstrating a modification.
  • FIG. 25 is a cross-sectional view taken along the line XXV-XXV in FIG. 24. It is the block diagram which showed the cooler and secondary battery of 13th Embodiment. It is a figure showing the flow of the refrigerant at the time of cooling of the object apparatus of the cooler of a 13th embodiment. It is the figure which showed the flow of the refrigerant
  • FIG. 25 is a cross-sectional view taken along line XXIX-XXIX in FIG. 24.
  • FIG. 42 is a cross-sectional view taken along the line XXXXIII-XXXIII in FIG. It is a top view of a heat source machine of a modification.
  • FIG. 42 is a cross-sectional view taken along line XXXXV-XXXXV in FIG. It is the block diagram which showed the cooler and secondary battery of 25th Embodiment. It is the block diagram which showed the cooler and secondary battery of 26th Embodiment.
  • the device temperature control apparatus will be described with reference to FIGS. 1 to 7.
  • the device temperature control device 10 shown in FIG. 1 is mounted on a vehicle such as an electric vehicle or a hybrid vehicle. Then, in the present embodiment, the device temperature control device 10 cools the secondary batteries 12a and 12b mounted on the electric vehicle. That is, the objects to be cooled which the device temperature control apparatus 10 of the present embodiment is cooled are the secondary batteries 12a and 12b.
  • a storage device including the secondary batteries 12a and 12b as components is supplied to the electric motor via an inverter circuit or the like, whereby the vehicle travels.
  • the secondary batteries 12a, 12b generate heat when outputting power to the electric motor via the inverter.
  • a cooling device for maintaining the secondary batteries 12a and 12b at a predetermined temperature or lower is required.
  • the battery temperature rises not only while the vehicle is traveling but also when it is parked in summer.
  • the power storage device is often arranged under the floor of the vehicle or under the trunk room, the amount of heat per unit time given to the secondary batteries 12a and 12b is small, but the battery temperature gradually rises by leaving for a long time .
  • the battery temperature is maintained at a low temperature by cooling the secondary batteries 12a and 12b even while the vehicle is left. Is desired.
  • the secondary batteries 12a and 12b of the present embodiment are configured as a battery pack formed by stacking a plurality of battery cells 13 in the traveling direction of the vehicle, but if the temperature of each battery cell 13 varies, the battery cells 13 Deterioration is uneven and performance of the power storage device is degraded.
  • cooling devices for cooling the secondary batteries 12a and 12b air blowing with a blower, air cooling using a refrigeration cycle, water cooling, or direct refrigerant cooling has been generally used.
  • the blower has only a low cooling capacity because it only blows the air in the room.
  • the secondary batteries 12a and 12b are cooled by the sensible heat of air in the blowing by the blower, the temperature difference between the upstream and the downstream of the air flow becomes large, and the temperature variation among the battery cells 13 can not be sufficiently suppressed. .
  • the cooling capacity is high, since the heat exchange portion with the battery cell 13 is sensible heat cooling in either air cooling or water cooling, temperature variation among the battery cells 13 can not be sufficiently suppressed as well. Furthermore, it is not preferable to drive the compressor and the cooling fan of the refrigeration cycle while leaving the vehicle parked because it causes an increase in power consumption and noise.
  • thermosyphon system in which the secondary batteries 12a and 12b are cooled by natural convection of the refrigerant without using a compressor.
  • the device temperature control device 10 includes a cooler 14, a condenser 16, a forward pipe 21, and a return pipe 22.
  • the condenser 16, the forward pipe 21, the cooler 14 and the return pipe 22 are annularly connected to form a thermosyphon circuit 26 in which a refrigerant as a working fluid of the device temperature control apparatus 10 circulates.
  • thermosiphon circuit 26 constitutes a thermosiphon that transfers heat by evaporation and condensation of the refrigerant.
  • the thermosyphon circuit 26 is configured to be a loop-type thermosyphon in which a flow path through which the gas phase refrigerant flows and a flow path through which the liquid phase refrigerant flows are separated.
  • the thermosiphon circuit 26 corresponds to a circulation circuit for circulating the working fluid.
  • the arrow DR1 indicates the vertical direction
  • the upper arrow indicates the upper side in the vertical direction of the vehicle
  • the lower arrow indicates the lower side in the vertical direction of the vehicle.
  • An arrow DR2 indicates the longitudinal direction of the vehicle.
  • An arrow DR3 indicates the vehicle width direction.
  • thermosyphon circuit 26 A refrigerant is sealed and filled in the thermosyphon circuit 26 of the present embodiment.
  • the thermosiphon circuit 26 is filled with the refrigerant.
  • the refrigerant circulates through the thermosyphon circuit 26 by natural convection, and the device temperature adjusting device 10 adjusts the temperature of the secondary batteries 12a and 12b by the phase change between the liquid phase and the gas phase of the refrigerant.
  • the secondary batteries 12a and 12b are cooled by the phase change of the refrigerant.
  • the refrigerant charged in the thermosyphon circuit 26 is, for example, a fluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a.
  • a fluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a
  • various working fluids other than fluorocarbon-based refrigerants such as water and ammonia may be used as the refrigerant.
  • the cooler 14 is disposed between the secondary batteries 12 a and 12 b.
  • the cooler 14 exchanges heat between the heat of the secondary batteries 12a and 12b and the heat of the refrigerant to cool the secondary batteries 12a and 12b.
  • the cooler 14 has a main body 143 made of, for example, a metal having high thermal conductivity.
  • an inlet 141 and an outlet 142 are formed in the main body 143 of the cooler 14.
  • the outlet 142 is disposed above the inlet 141 in the vertical direction.
  • the liquid passage 21 a formed inside the forward piping 21 is connected to the main body 143 of the cooler 14. Therefore, when the refrigerant circulates in the thermosyphon circuit 26, the liquid-phase refrigerant in the liquid passage 21 a flows into the internal space of the main body 143 via the inflow port 141.
  • the liquid passage 21 a is a flow path of a refrigerant that causes the liquid phase refrigerant to flow from the condenser 16 to the cooler 14.
  • the outlet 142 of the cooler 14 is connected to the main body 143 of the cooler 14.
  • the gas passage 22 a is a refrigerant flow passage that causes the gas phase refrigerant to flow from the outlet 142 of the cooler 14 to the condenser 16.
  • a liquid phase refrigerant with a relatively large specific gravity is accumulated below the main body 143 of the cooler 14, and a gas phase refrigerant with a relatively low specific gravity is accumulated above the main body 143 of the cooler 14. Therefore, the gas phase refrigerant in the main body 143 is exclusively discharged from the outlet 142 among the inlet 141 and the outlet 142.
  • the condenser 16 is a heat exchanger that exchanges heat between the gas phase refrigerant and the heat receiving fluid in the condenser 16 to dissipate the heat from the refrigerant to the heat receiving fluid.
  • the gas phase refrigerant flows from the return pipe 22 into the condenser inlet 161 of the condenser 16, and the condenser 16 condenses the refrigerant by radiating heat from the refrigerant to the heat receiving fluid.
  • the liquid-phase refrigerant condensed by the condenser 16 flows out of the condenser outlet 162.
  • the heat receiving fluid which is heat-exchanged with the refrigerant in the condenser 16 is, for example, air outside the passenger compartment or water.
  • the condenser 16 of the present embodiment is installed so as to be positioned above the cooler 14 in the vertical direction even when the vehicle traveling direction of the vehicle or the vehicle width direction is inclined with respect to the horizontal direction. There is.
  • the condenser 16 is disposed above the cooler 14 in the vertical direction.
  • the condenser 16 is housed in the front storage room or the trunk room.
  • the front storage room is a room which is disposed on the front side in the vehicle traveling direction with respect to a vehicle compartment of the vehicle and stores a traveling engine and a traveling motor.
  • the trunk room is a storage room which is disposed on the rear side in the vehicle traveling direction with respect to the vehicle compartment of the vehicle and stores luggage and the like.
  • a return pipe 22 is connected to the upper part of the condenser 16 in the vertical direction. Specifically, the return line pipe 22 is connected to the condenser 16 above the forward line pipe 21 in the vertical direction.
  • the device temperature control apparatus 10 has a configuration in which a large number of coolers 14 are connected by the forward pipe 21 and the return pipe 22 in order to adjust the temperature of the secondary batteries 12 a and 12 b mounted on the vehicle.
  • FIG. 4 shows a configuration in which four coolers 14 A to 14 D are connected by the forward pipe 21 and the return pipe 22 as the large number of coolers 14.
  • the coolers 14A to 14D are respectively disposed between the secondary battery 12a and the secondary battery 12b.
  • Each of the coolers 14A to 14D has an inlet 141 disposed at the lower portion of the main body 143, and an outlet 142 disposed above the inlet 141.
  • the inflow port 141 is for flowing the liquid-phase refrigerant from the condenser 16 into the main body 143.
  • the discharge port 142 is for discharging the gas phase refrigerant evaporated in the main body 143, and is disposed above the inflow port 141.
  • the respective coolers 14A to 14D are connected in parallel to the condenser 16. That is, the forward pipe 21 connects between the condenser outlet 162 of the condenser 16 and the inlet 141 of each of the coolers 14A to 14D.
  • the forward pipe 21 distributes the liquid phase refrigerant flowing out of the condenser outlet 162 of the condenser 16 to the respective coolers 14A to 14D.
  • the liquid-phase refrigerant is indicated by dot hatching.
  • the return pipe 22 is connected between the outlet 142 of each of the coolers 14 A to 14 D and the condenser inlet 161 of the condenser 16.
  • the return pipe 22 collects the gas phase refrigerant discharged from the outlet 142 of each of the coolers 14A to 14D and supplies it to the condenser inlet 161 of the condenser 16.
  • the forward pipe 21 includes a liquid phase connecting pipe 211 which forms a liquid passage 211a extending in the front and rear direction, and a connecting pipe 212 which connects between the inlet 141 of each of the coolers 14A to 14D and the liquid phase connecting pipe 211.
  • a liquid phase connecting pipe 211 which forms a liquid passage 211a extending in the front and rear direction
  • a connecting pipe 212 which connects between the inlet 141 of each of the coolers 14A to 14D and the liquid phase connecting pipe 211.
  • connection piping 212 extends in the horizontal direction from the inlets 141 of the respective coolers 14A to 14D, then turns upward and is connected to the liquid phase connection piping 211.
  • the forward pipe 21 is disposed such that at least a part of the liquid passage formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the respective coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connection piping 211 is at a higher position than the inflow ports 141 of the respective coolers 14A to 14D.
  • the charging of the refrigerant into the thermosyphon circuit 26 is performed in a state where the heat exchange between the secondary batteries 12a and 12b and the refrigerant is stopped.
  • the filling amount of the refrigerant into the thermosyphon circuit 26 is set such that the liquid level in the main body 143 of the cooler 14 is an appropriate liquid level.
  • the refrigerant is filled in the thermosyphon circuit 26 so that the liquid level in the main body 143 of the cooler 14 becomes a predetermined target liquid level.
  • the liquid phase connecting pipe 211 has a height higher than the target liquid level of the refrigerant in each of the coolers 14A to 14D when the liquid passage 211a formed by the liquid phase connecting pipe 211 fills the thermosiphon circuit 26 with the working fluid. Is located in
  • FIG. 4 shows the case where the device temperature control apparatus 10 is in the horizontal state.
  • the liquid phase refrigerant condensed in the condenser 16 flows from the condenser outlet 162 of the condenser 16 to the forward pipe 21 by its own weight, and is distributed to the main bodies 143 of the respective coolers 14A to 14D from the inlets 141 of the respective coolers 14A to 14D. And stored in the body 143 of each of the coolers 14A-14D.
  • the liquid phase refrigerant stored in the main body 143 of each of the coolers 14A to 14D is evaporated and vaporized by heat exchange with the secondary batteries 12a and 12b.
  • the secondary batteries 12a and 12b are cooled by the latent heat of vaporization of the liquid phase refrigerant.
  • the refrigerant in the gas phase is discharged from the outlet 142 of the main body 143 of each of the coolers 14A to 14D.
  • the gas phase refrigerant discharged from the outlet 142 of the main body 143 of each of the coolers 14A to 14D is collected in the return pipe 22, and then returns to the condenser 16 from the condenser inlet port 161 of the condenser 16.
  • the flow of the refrigerant during cooling of the secondary batteries 12a and 12b is in the order of the condenser 16 ⁇ the forward pipe 21 ⁇ the main body 143 of each of the coolers 14A to 14D ⁇ the return pipe 22 ⁇ the condenser 16. That is, a looped flow path including the condenser 16 and the respective coolers 14A to 14D is formed.
  • FIG. 6 shows a state where a vehicle in which the condenser 16 is disposed forward of the coolers 14A to 14D is traveling uphill.
  • each cooler 14A-14D is inclined, it is distributed to the main body 143 of each cooler 14A-14D from the condenser 16 through the forward piping 21 and the main body of each cooler 14A-14D. It is stored in 143.
  • the forward pipe 21 is disposed such that at least a part of the liquid passage formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the respective coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connection piping 211 is at a higher position than the inflow ports 141 of the respective coolers 14A to 14D.
  • the liquid level H of the liquid phase refrigerant stored in the internal space of the main body 143 of each of the coolers 14A to 14D is approximately the same as the height of the connection portion between the connection pipe 212 and the liquid phase connecting pipe 211. It represents a lost state.
  • FIG. 7 shows a state where the vehicle having the condenser 16 disposed forward of the coolers 14A to 14D is traveling downhill.
  • each cooler 14A-14D is inclined, it is distributed to the main body 143 of each cooler 14A-14D from the condenser 16 through the forward piping 21 and the main body of each cooler 14A-14D. It is stored in 143.
  • the forward pipe 21 is disposed such that at least a part of the liquid passage 21a formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connection piping 211 is at a higher position than the inflow ports 141 of the respective coolers 14A to 14D.
  • the coolers 14A to 14D are inclined, a liquid storage portion is formed in the internal space of the main body 143 of each of the coolers 14A to 14D, and the liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.
  • the liquid level H of the liquid phase refrigerant stored in the internal space of the main body 143 of each of the coolers 14A to 14D is approximately the same as the height of the connection portion between the connection pipe 212 and the liquid phase connecting pipe 211. It represents a lost state.
  • the device temperature control device 10 of the present embodiment includes the circulation circuit 26 that circulates the working fluid, and the temperature of the target devices 12a and 12b is determined by the phase change between the liquid phase and the gas phase of the working fluid.
  • the forward pipe 21 is included in the circulation circuit and forms the liquid passage 21a for supplying the working fluid condensed in the condenser to the plurality of coolers, and the operation included in the circulation circuit and evaporated in the plurality of coolers And a return pipe 22 forming a gas passage 22a for supplying the fluid to the condenser.
  • Each of the plurality of coolers has an inlet 141 for introducing the working fluid flowing in the forward piping into the internal space of the main body 143, and an outlet 142 for discharging the working fluid evaporated in the main body to the return piping. ing.
  • the forward piping is arranged such that at least a part of the liquid passage formed by the forward piping is at a higher position than the inlets of the plurality of coolers.
  • the forward piping has a liquid phase connection pipe 211 which forms a liquid passage extending in the front-rear direction, and a connection pipe 212 which connects between the inlets of the plurality of coolers and the liquid phase connection pipe.
  • the liquid passage formed by the liquid phase connecting pipe is disposed at a position higher than the inlets of the plurality of coolers.
  • the liquid passage formed by the liquid phase connection piping can be configured to be at a higher position than the inlets of the plurality of coolers.
  • the liquid phase connection piping is disposed such that the liquid passage formed by the liquid phase connection piping is at a height higher than the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Is preferred.
  • the liquid passage 211a formed by the liquid phase connecting pipe 211 is positioned higher than the inflow ports 141 of the respective coolers 14A to 14D for all the four coolers 14A to 14D.
  • the liquid-phase refrigerant can be stably supplied to the four coolers 14A to 14D.
  • the liquid passage 211a formed by the liquid phase connecting pipe 211 is not necessarily configured to be higher than the inflow ports 141 of the respective coolers 14A to 14D for all the plurality of coolers 14. That is, the liquid passage 211 a formed by the liquid phase connection pipe 211 may be configured to be at a position equivalent to or lower than the inflow ports 141 of the plurality of coolers 14 with respect to a part of the plurality of coolers 14.
  • the inlets 141 of the plurality of coolers 14 are disposed below the main body 143 of the cooler 14, and the forward piping 21 is more than the inlets 141 of the plurality of coolers 14. It is located high.
  • the forward piping 21 and the inlets 141 of the plurality of coolers 14 are higher than the lowermost end of the inner space of the main body 143 of each cooler 14A to 14D. It is different in that it is placed at the high position of.
  • the inlets 141 of the respective coolers 14A to 14D are disposed at a position higher than the lowermost end of the internal space of the main body 143 of the respective coolers 14A to 14D.
  • At least a part of the liquid passage 21a formed by the forward pipe 21 is disposed at a position higher than the lowermost end of the internal space of the main body 143 of each of the coolers 14A to 14D.
  • the forward pipe 21 is a connection that connects between the liquid phase connecting pipe 211 forming the liquid passage 211a extending in the front-rear direction, the inlet 141 of each of the coolers 14A to 14D, and the liquid phase connecting pipe 211. And a pipe 213.
  • the liquid phase connection piping 211 is disposed at substantially the same height as the inlets 141 of the respective coolers 14A to 14D. Further, the connection pipe 213 is connected to the liquid phase connection pipe 211 so as to extend in the horizontal direction from the inlets 141 of the respective coolers 14A to 14D.
  • the liquid passage 211a formed by the liquid phase connection pipe 211 is disposed at a position higher in height than the lowermost end of the internal space of the main body 143 of each of the coolers 14A to 14D.
  • the liquid phase connecting pipe 211 is a target liquid surface of the refrigerant in each of the coolers 14A to 14D when the liquid path 211a formed by the liquid phase connecting pipe 211 is filled with the refrigerant in the thermosyphon circuit 26. It is arranged to be at a level above the proper liquid level.
  • the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe. And, at least one of the inlets of the plurality of coolers is disposed at a height higher than the lowermost end of the internal space of the main body.
  • the liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • At least one of the inlets of the plurality of coolers is disposed at a height above the appropriate liquid level, which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. Is preferred.
  • the forward piping has a liquid phase connection piping 211 that forms a liquid passage extending in the front-rear direction.
  • the liquid phase connecting pipe is higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase linking pipe is filled with the working fluid in the circulation circuit.
  • they are arranged to
  • the forward piping 21 of the device temperature control apparatus of the present embodiment has a convex portion piping 214 that forms the liquid passage 214a, and at least a portion of the liquid passage 214a is the first cooler of the plurality of coolers 14 It projects vertically above the inlet 141 of the second cooler 14 different from the inlet 141 of the first cooler 14 and the first cooler 14.
  • the convex portion pipe 214 is disposed between the inlet 141 of the first cooler and the inlet 141 of the second cooler 14. A part of the liquid passage 214 a formed by the convex portion pipe 214 protrudes upward in the vertical direction with respect to the inflow port 141 of the first cooler and the inflow port 141 of the second cooler 14.
  • the liquid passage 214 a formed by the convex portion pipe 214 is between the inlet 141 of the first cooler 14 and the inlet 141 of the second cooler 14, and the inlet 141 of the first cooler and the second cooling. It has an inverted U-shape projecting upward in the vertical direction with respect to the inlet 141 of the vessel 14.
  • the convex portion pipe 214 is provided between the inlet 141 of the cooler 14A and the inlet 141 of the cooler 14B, between the inlet 141 of the cooler 14B and the inlet 141 of the cooler 14C, and of the cooler 14C. It is disposed between the inlet 141 and the inlet 141 of the cooler 14D.
  • the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.
  • the forward piping is disposed between the inlet of the first cooler of one of the plurality of coolers and the inlet of the second cooler different from the first cooler of the plurality of coolers. It has a convex portion pipe 214. Then, at least a part of the liquid passage formed by the convex portion pipe protrudes vertically upward from the inflow port of the first cooler and the inflow port of the second cooler.
  • the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • the inlet of the first cooler and the inlet of the second cooler are positioned lower than the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. .
  • At least a part of the liquid passage formed by the convex portion pipe has a height equal to or higher than a target liquid level of the working fluid in the plurality of coolers when the working circuit is filled Preferably it is arranged.
  • the forward piping forms a liquid passage extending in the front-rear direction
  • the flow of the first liquid phase connecting piping connected to the inlet of the first cooler and a flow of the second cooler forming the liquid passage extending in the front-rear direction
  • It has a second liquid phase connecting pipe connected to the inlet.
  • the convex portion pipe is disposed between the first liquid phase connecting pipe and the second liquid phase connecting pipe.
  • the projection piping is provided between the first liquid phase connecting pipe connected to the inlet of the first cooler and the second liquid phase connecting pipe connected to the inlet of the second cooler. be able to.
  • the convex portion piping is disposed on the upstream side of the fluid flow of the working fluid flowing inside the liquid phase connection piping 211 from the center of the inlet of the first cooler and the inlet of the second cooler.
  • the convex portion pipe is disposed downstream of the working fluid flow that flows inside the liquid phase connecting pipe rather than at the center of the inlet of the first cooler and the inlet of the second cooler.
  • the flow rate of the working fluid stored in the cooler on the upstream side of the fluid flow of the working fluid from the projection piping can be increased as compared with the case of arranging.
  • the liquid passage 211a formed by the liquid phase connection pipe 211 is a target liquid of the refrigerant in each of the coolers 14A to 14D when the thermosiphon circuit 26 is filled with the refrigerant. It is arranged to be higher than the appropriate liquid level, which is the surface.
  • the liquid passage 211a formed by the liquid phase connection pipe 211 is positioned lower than the appropriate liquid level between the inlets 141 of the coolers 14A to 14D. It is configured.
  • a liquid passage 211a formed by the liquid phase connection pipe 211 is formed to be depressed downward in the vertical direction between the inlets 141 of the coolers 14A to 14D.
  • the liquid passage 211a formed by the liquid phase connection pipe 211 may be formed to be depressed downward in the vertical direction between the inlets 141 of the coolers 14A to 14D.
  • the forward piping 21 of the device temperature control apparatus 10 of the present embodiment has a convex piping 215 that forms the liquid passage 215a.
  • the convex portion pipe 215 connects between the condenser outlet 162 of the condenser 16 and the inlet 141 of the cooler 14 of the plurality of coolers 14 connected to the condenser 16 and at least a part of the liquid passage 21 a.
  • Form a liquid passage 215 a which protrudes vertically upward above the condenser outlet 162 of the condenser 16 and the inlet 141 of the cooler 14 connected to the condenser 16.
  • the height of the condenser 16 is higher than that of the cooler 14 ⁇ / b> A connected to the condenser 16.
  • the liquid refrigerant flows from the condenser 16 to the cooler 14A and further to the lower cooler.
  • the liquid refrigerant may flow from the cooler 14A to the condenser 16. For this reason, supply of the liquid phase refrigerant to cooler 14 becomes unstable, and temperature control of secondary batteries 12a and 12b will become unstable.
  • the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.
  • the forward piping has a convex portion piping 215 that connects between the condenser outlet of the condenser and the inlet of the cooler connected to the condenser among the plurality of coolers.
  • the convex portion piping protrudes vertically above the condenser outlet of the condenser and the inlet of the cooler connected to the condenser.
  • the convex piping connects each cooler or condenser A liquid storage portion is formed in the internal space of the main body, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • the convex portion pipe in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is at a height equal to or higher than the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Preferably it is arranged.
  • the convex portion pipe 214 corresponds to a first convex portion pipe
  • the convex portion pipe 215 corresponds to a second convex portion pipe.
  • each cooler 14 has an inlet 141 for introducing the liquid phase refrigerant into the internal space of the main body 143 and an outlet 144 for discharging the liquid phase refrigerant introduced to the main body 143.
  • the inlet 141 of the cooler 14A is connected to the condenser outlet 162 of the condenser 16 via the forward pipe 21.
  • the forward piping 21 has an outlet 144 of one first cooler 14 of the plurality of coolers 14 and an inlet 141 of the second cooler 14 different from the first cooler 14 of the plurality of coolers 14.
  • a convex portion pipe 216 connecting the two.
  • the convex portion pipe 216 at least a part of the liquid passage 216a formed by the convex portion pipe 216 protrudes upward in the vertical direction from the outlet port 144 of the first cooler 14 and the inlet port 141 of the second cooler 14.
  • the projection piping 216 is between the outlet 144 of the cooler 14A and the inlet 141 of the cooler 14B, and between the outlet 144 of the cooler 14B and the inlet 141 of the cooler 14C. It is arranged.
  • the convex portion pipe 216 connects between the outlet 144 of the cooler 14A and the inlet 141 of the cooler 14B, and connects between the outlet 144 of the cooler 14B and the inlet 141 of the cooler 14C. ing.
  • the convex portion pipe 216 forms a liquid passage 216a which protrudes upward in the vertical direction with respect to the inflow ports 144 of the respective coolers 14A to 14B and the inflow ports 141 of the respective coolers 14B to 14C.
  • each cooler 14A to 14C is inclined such that the vehicle travels uphill and the position of the cooler 14A becomes higher, the liquid storage portion is in the internal space of the main body 143 of each cooler 14A to 14C.
  • the liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.
  • the coolers 14A to 14C are inclined such that the vehicle travels downhill and the position of the cooler 14A becomes lower, the liquid storage portion in the internal space of the main body 143 of each cooler 14B to 14C The liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.
  • the plurality of coolers are the inlet 141 for introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the operation introduced into the main body It has an outlet 144 through which the fluid flows out.
  • the forward piping 21 connects between the outlet 144 of one first cooler of the plurality of coolers 14 and the inlet 141 of the second cooler different from the first cooler of the plurality of coolers 14. It has a convex portion pipe 216 to be connected.
  • the convex portion pipe 216 at least a part of the liquid passage 216a formed by the convex portion pipe protrudes vertically above the outlet port 144 of the first cooler and the inlet port 141 of the second cooler. .
  • the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • At least a part of the liquid passage formed by the convex portion pipe is at a height equal to or higher than a target liquid level of the working fluid in the plurality of coolers when the working circuit is filled Preferably it is arranged.
  • each cooler 14 has an inlet 141 for introducing the liquid phase refrigerant into the internal space of the main body 143 and an outlet 144 for discharging the liquid phase refrigerant introduced to the main body 143.
  • the inlet 141 of the cooler 14A is connected to the condenser outlet 162 of the condenser 16 via the forward pipe 21.
  • liquid passage 21a formed by the forward piping 21 is disposed at a position higher in height than the lowermost end of the internal space of the main body 143 of each of the coolers 14A to 14D. There is.
  • the forward piping 21 has a liquid phase connecting piping 211 that forms a liquid passage 211 a extending in the front-rear direction.
  • the liquid phase connection pipe 211 is disposed at substantially the same height as the inlets 141 of the respective coolers 14A to 14D.
  • the liquid path 211a formed by the liquid phase connecting pipe 211 is a target liquid of the refrigerant in each of the coolers 14A to 14D when the thermosiphon circuit 26 is filled with the refrigerant. It is arranged to be higher than the appropriate liquid level, which is the surface.
  • the plurality of coolers are introduced into the inlet 141 and the main body 143 that introduce the working fluid flowing through the forward piping 21 into the internal space of the main body 143. It has an outlet 144 through which the working fluid flows out. And, at least one of the inlet 141 and the outlet 144 of the plurality of coolers is disposed at a position higher than the lowermost end of the internal space of the main body 143.
  • the liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • At least one of the inlets 141 and the outlets 144 of the plurality of coolers is higher than the appropriate liquid level, which is the target fluid level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is preferred that the appropriate liquid level, which is the target fluid level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is preferred that the
  • the forward piping has a liquid phase connection piping 211 that forms a liquid passage extending in the front-rear direction.
  • the liquid phase connecting pipe is higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase linking pipe is filled with the working fluid in the circulation circuit.
  • they are arranged to
  • the device temperature control apparatus of the present embodiment is disposed at the second height position higher than the first height position and the low-stage coolers 14B to 14C disposed at the first height position. And a high-stage cooler 14A.
  • a plurality of coolers 14A to 14C are connected in series by the forward pipe 21 and the return pipe 22.
  • Outgoing piping 21 connects high-low connection piping 217 connecting between the inlet 141 of low-stage cooler 14B and the outlet 144 of high-stage cooler 14A, the outlet 144 of low-stage cooler 14B, and the low-stage cooler And a convex portion pipe 216 connected to the inflow port 141 of 14 C.
  • the high / low connection piping 217 is between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A. Also, a liquid passage 217a that protrudes upward in the vertical direction is formed.
  • convex portion piping 216 is between the outlet 144 of the low-stage cooler 14B and the inlet of the low-stage cooler 14C between the outlet 144 of the low-stage cooler 14B and the inlet 141 of the low-stage cooler 14C.
  • a liquid passage 216 a is formed to project upward in the vertical direction more than 141.
  • the forward piping 21 has high-low connection piping 217 as high-low connection piping that connects between the inflow port 141 of the low-stage cooler 14B and the outflow port 144 of the high-stage cooler 14A. Then, at least a part of the liquid passage 217a formed by the high and low connection piping protrudes vertically above the inflow port 141 of the low stage cooler 14B and the outflow port 144 of the high stage cooler 14A.
  • FIG. 17 shows a comparative example in which the high / low connection pipe 217 is not provided between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A.
  • the liquid phase refrigerant to be stored in the main body 143 of the high stage cooler 14A flows into the low stage cooler 14B through the forward pipe 21 under the influence of gravity. That is, sufficient liquid phase refrigerant is not supplied to the high-stage cooler 14A disposed at the second height position higher than the first height position.
  • the high and low connection piping 217 is disposed between the inlet 141 of the low stage cooler 14B and the outlet 144 of the high stage cooler 14A. It is done.
  • the high-low connection piping 217 forms a liquid passage 217a which protrudes upward in the vertical direction with respect to the inflow port 141 of the low-stage cooler 14B and the outflow port 144 of the high-stage cooler 14A.
  • the high-low connection piping 217 stores the liquid phase refrigerant inside the main body of the high-stage cooler 14A. A liquid storage portion to be liquid is formed, and the outflow of the liquid phase refrigerant from the high stage cooler 14A to the low stage cooler 14B can be prevented.
  • the main pipe 143 for the low-stage cooler 14B and the low-stage cooler 14C by the convex portion pipe 216 A liquid storage portion is formed in the inner space of the liquid crystal, and the liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant between the low-stage cooler 14B and the low-stage cooler 14C is suppressed.
  • the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.
  • the plurality of coolers may include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position.
  • the forward piping has high and low connection piping 217 that connects between the inlet of the low stage cooler and the outlet of the high stage cooler.
  • at least a part of the liquid passage formed by the high and low connection piping 217 protrudes vertically above the inlet of the low stage cooler and the outlet of the high stage cooler.
  • the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • the ninth embodiment An apparatus temperature control apparatus according to a ninth embodiment will be described with reference to FIG.
  • the device temperature control apparatus of this embodiment includes low-stage coolers 14B to 14C disposed at a first height position, and a high-stage cooler 14A disposed at a second height position higher than the first height position. ,have.
  • a plurality of coolers 14A to 14C are connected in series by the forward pipe 21 and the return pipe 22.
  • Each of the coolers 14A to 14C has an inlet 141 for introducing the liquid phase refrigerant into the inner space of the main body 143 and an outlet 144 for discharging the liquid phase refrigerant introduced to the main body 143.
  • the forward piping 21 has high-low connection piping 217 that connects between the inlet 141 of the low-stage coolers 14B to 14C and the outlet 144 of the high-stage cooler 14A. Then, at least a part of the liquid passage 217a formed by the high-low connection piping 217 is disposed at a position higher than the lowermost end of the internal space of the main body 143 of the high-stage cooler 14A.
  • At least a portion of the fluid passage 217a formed by the high and low connection piping 217 is a target fluid surface or more of the working fluid in the plurality of coolers 14 when the working fluid is filled in the circulation circuit. Is located at the height of the
  • At least a part of the liquid passage 217a formed by the high and low connection piping 217 is disposed at a position higher in height than the lowermost end of the internal space of the main body 143 of the high stage cooler 14A.
  • the plurality of coolers includes the low-stage cooler disposed at the first height position, and the second height higher than the first height position. And a high stage cooler disposed at a position.
  • the forward piping 21 has high-low connection piping 217 that connects between the inlet of the low-stage cooler and the outlet of the high-stage cooler.
  • at least a part of the liquid passage 217a formed by the high and low connection piping 217 is disposed at a position higher in height than the lowermost end of the internal space of the main body of the high stage cooler.
  • the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • the liquid passage formed by the high and low connection piping is disposed at a height higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled in the circulation circuit. Is preferred.
  • FIG. 10 An apparatus temperature control apparatus according to a tenth embodiment will be described with reference to FIG.
  • a plurality of coolers 14A to 14C are connected in series by the forward pipe 21 and the return pipe 22.
  • a plurality of coolers 14A to 14D are connected in parallel by the forward pipe 21 and the return pipe 22.
  • the device temperature control apparatus of the present embodiment includes low-stage coolers 14C to 14D disposed at a first height position, and high-stage coolers 14A to 14A disposed at a second height position higher than the first height position. And 14B.
  • High-low connection piping 217 is disposed between low-stage cooler 14C disposed at the first height position and high-stage cooler 14B disposed at the second height position higher than the first height position. ing.
  • the high-low connection piping 217 connects the inlet 141 of the low-stage cooler 14C and the inlet 141 of the high-stage cooler 14B, and also connects the inlet 141 of the low-stage cooler 14C and the high-stage cooler 14B.
  • a liquid passage 217 a that protrudes upward in the vertical direction with respect to the inflow port 141 is formed.
  • the forward piping 21 has high-low connection piping 217 as high-low connection piping that connects between the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B. Then, at least a part of the liquid passage 217a formed by the high-low connection piping 217 protrudes vertically above the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B.
  • the high and low connection piping 217 is a target liquid surface of the liquid phase refrigerant in the plurality of coolers 14 when the thermosiphon circuit 26 is filled with the refrigerant at least a part of the liquid passage 217a formed by the high and low connection piping 217 It is arranged to have the above height.
  • the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.
  • the plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position.
  • the forward piping has high-low connection piping 217 that connects between the inlet of the low-stage cooler and the inlet of the high-stage cooler.
  • at least a part of the liquid passage formed by the high and low connection piping 217 protrudes vertically above the inlet of the low-stage cooler and the inlet of the high-stage cooler.
  • the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • the apparatus temperature control apparatus according to an eleventh embodiment includes the low stage cooler 14C disposed at the first height position and the high stage cooler 14B disposed at the second height position higher than the first height position. High-low connection piping 217 was disposed between them.
  • the forward piping 21 of the apparatus temperature control apparatus of the present embodiment includes the lower pipe 219 connecting between the respective inlets 141 of the low-stage coolers 14C to 14D and the high-stage coolers 14A to 14B.
  • the device temperature control apparatus 10 includes the low-stage coolers 14C to 14D disposed at the first height position, and the high-stage cooler 14A disposed at the second height position higher than the first height position. To 14 B. The inlets 141 of the high stage coolers 14A to 14B are disposed at the lower part of the main body 143.
  • the low point piping 219 forms a liquid passage 219a connecting between the respective inlets 141 of the low stage coolers 14C to 14D.
  • the high / low connection piping 218 connects between the respective inlets 141 of the high stage coolers 14A to 14B and also connects between the respective inlets 141 of the high stage coolers 14A to 14B and the low place piping 219 a.
  • a portion of the liquid passage 218a formed by the high-low connection piping 218 is higher in height than the inlet 141 of the high-stage cooler 14 and the inlet 141 of the low-stage cooler 14C.
  • the passage 218a is formed.
  • the forward piping 21 has high-low connection piping 218 as high-low connection piping that connects between the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B. Further, a part of the liquid passage 218a formed by the high and low connection piping 218 is configured to be higher in height than the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B.
  • the high / low connection piping 218 causes the main body 143 of the high stage coolers 14A to 14B.
  • a liquid storage portion for storing the liquid phase refrigerant is formed inside, and the outflow of the liquid phase refrigerant from the high stage coolers 14A to 14B to the low stage coolers 14C to 14D is prevented.
  • the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.
  • the plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position.
  • the forward piping has high-low connection piping 218 that connects between the inlet of the low-stage cooler and the inlet of the high-stage cooler.
  • at least a part of the liquid passage formed by the high and low connection piping 218 protrudes vertically above the inlet of the low stage cooler and the inlet of the high stage cooler.
  • the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.
  • the liquid phase connection pipe 211 is disposed at substantially the same height as the inlets 141 of the coolers 14A to 14D, and the connection pipe 213 is the inlet 141 of the coolers 14A to 14D. Is connected to the liquid phase connecting pipe 211 so as to extend in the horizontal direction.
  • connection piping 213 of this embodiment is bent so that the middle portion between the inlets 141 of the coolers 14A to 14D and the liquid phase connection piping 211 is lowered.
  • the device temperature control device of the present embodiment differs from the device temperature control device of the first embodiment in that it has a function of warming up a target device.
  • Each of the coolers 14A to 14D of the present embodiment includes a heating outlet 145 for flowing out to heat the refrigerant introduced into the internal space of the main body 143, and the refrigerant flowing out from the heating outlet 145 in the main body 143. And a heating inlet 146 introduced into the internal space.
  • the heating inlet 146 is disposed above the heating outlet 145 in the vertical direction.
  • the heating outlet 145 and the heating inlet 146 are formed on the surface of the main body 143 opposite to the surface on which the inlet 141 and the outlet 142 are formed.
  • a warming-up pipe 40 for connecting the heating outlet 145 and the heating inlet 146 is provided between the heating outlet 145 and the heating inlet 146.
  • the warming-up pipe 40 introduces the refrigerant flowing out of the heating outlet 145 into the heating inlet 146.
  • the heating pipe 30 is provided with a heating source 30 for heating the liquid-phase refrigerant introduced into the warming pipe 40.
  • the heating source 30 is constituted by a PTC (Positive Temperature Coefficient) heater.
  • the heating source 30 is disposed at a position away from the main body 143.
  • the heating source 30 is disposed below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14 in the vertical direction.
  • at least a portion of the heating source 30 is from the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14. It is preferable to arrange the heating source 30 so as to be located on the lower side in the vertical direction.
  • the device temperature control apparatus of this embodiment is equipped with the valve
  • the heating source 30 is controlled to be turned off, and the valve 50 is controlled to open the liquid passage formed by the forward pipe 21. Then, as shown in FIG. 26, the liquid refrigerant supplied from the condenser 16 flows into the internal space of the main body 143 through the forward pipe 21 and the connection pipe 212.
  • the liquid refrigerant that has flowed into the internal space of the main body 143 receives heat from the high temperature batteries 12a and 12b, and moves upward in the vertical direction while being evaporated and vaporized. In this process, the batteries 12a, 12b are cooled.
  • the vaporized gas phase refrigerant passes through the return pipe 22 and flows into the condenser 16. At this time, the liquid refrigerant also flows into the warming-up pipe 40, but the evaporation of the liquid refrigerant is not performed inside the warming-up pipe 40 because the heating source 30 is off. There is almost no refrigerant flow.
  • the heating source 30 is controlled to be turned on, and the valve 50 is controlled to close the liquid passage formed by the forward piping 21.
  • the liquid refrigerant introduced into the warming-up pipe 40 is heated by the heating source 30, evaporated and vaporized, moves upward in the vertical direction, and is introduced into the internal space of the main body 143 from the heating inlet 146 Be done. In this process, the battery is heated.
  • the refrigerant that has dissipated heat in the main body 143 moves downward, turns into liquid refrigerant, and flows into the warming up pipe 40 again.
  • the valve 50 is controlled to close the liquid passage formed by the forward pipe 21, the refrigerant flow in the forward pipe 21 and the return pipe 22 hardly occurs.
  • the plurality of coolers 14A to 14D respectively have the heating outlet 145 for flowing out to heat the refrigerant introduced into the internal space of the main body 143, and the upper side in the vertical direction above the heating outlet 145 And a heating inlet 146 for introducing the refrigerant flowing out from the heating outlet into the internal space of the main body 143.
  • a warming-up pipe 40 for introducing the refrigerant flowing out from the heating outlet 145 to the heating inlet 146 is provided between the heating outlet 145 and the heating inlet 146.
  • the heating pipe 30 is provided with a heating source 30 for heating the liquid-phase refrigerant introduced into the heating pipe 40. Then, the refrigerant heated by the heating source 30 is introduced into the internal space of the main body 143 from the heating inlet 146 through the warming up pipe 40. Thus, the refrigerant can be heated by the heat source 30 to warm up the target device.
  • the PTC heater constitutes the heating source 30.
  • an electric heater other than a PTC heater a hot water heat exchanger, a radiator of a refrigeration cycle, a thermoelectric element such as a Peltier element, SMR (System Main Relay)
  • the heating source 30 can also be configured by a method such as
  • FIGS. 28 to 31 An apparatus temperature control apparatus according to a fourteenth embodiment will be described with reference to FIGS. 28 to 31.
  • the present embodiment differs from the device temperature control apparatus shown in FIG. 2 in that it has a function of warming up the target device.
  • the device temperature control apparatus heats the liquid phase refrigerant introduced into the interior of the warm-up pipe 41 and the warm-up pipe 41 connecting the forward pipe 21 and the return pipe 22.
  • a source 30 disposed such that at least a portion thereof is positioned vertically below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14.
  • the device temperature control apparatus of this embodiment is equipped with the valve
  • the heating source 30 is controlled to be turned off, and the valve 50 shown in FIG. 24 is controlled to open the liquid passage formed by the forward piping 21.
  • the liquid refrigerant supplied from the condenser 16 flows into the internal space of the main body 143 through the forward pipe 21 and the connection pipe 212.
  • the liquid refrigerant that has flowed into the internal space of the main body 143 receives heat from the high temperature batteries 12a and 12b, and moves upward in the vertical direction while being evaporated and vaporized. In this process, the batteries 12a, 12b are cooled.
  • the gas phase refrigerant flows into the condenser 16 through the return pipe 22.
  • the heating source 30 is controlled to be turned on, and the valve 50 is controlled to close the liquid passage formed by the forward piping 21.
  • the liquid refrigerant introduced into the warming-up pipe 41 is heated by the heating source 30 and moves upward in the vertical direction while being evaporated and vaporized, and is discharged from the discharge port 142 to the internal space of the main body 143 be introduced.
  • the batteries 12a, 12b are heated.
  • the refrigerant that has dissipated heat in the main body 143 moves downward, becomes liquid refrigerant, and again flows out from the inflow port 141 to the forward pipe 21.
  • the valve 50 is controlled to close the liquid passage formed by the forward pipe 21, the refrigerant flow in the forward pipe 21 and the return pipe 22 hardly occurs.
  • the refrigerant can be heated by the heating source 30 to warm up the target device.
  • FIG. 14 An apparatus temperature control apparatus according to a fifteenth embodiment will be described with reference to FIG.
  • the apparatus temperature control apparatus of this embodiment differs in that the apparatus temperature control apparatus shown in FIG. 14 has a function of warming up the target apparatus.
  • three coolers 14A to 14C are connected in series by a forward pipe 21. Further, among the three coolers 14A to 14C, the cooler 14C disposed at a position farthest from the condenser 16 is a heating outlet for causing the refrigerant introduced into the internal space of the main body 143 to flow out in order to heat it. And a heating inlet 146 for introducing the refrigerant flowing out of the heating outlet 145 into the internal space of the main body 143. The heating inlet 146 is disposed above the heating outlet 145 in the vertical direction.
  • a warming-up pipe 40 for introducing the refrigerant flowing out from the heating outlet 145 to the heating inlet 146 is provided.
  • the heating pipe 30 is provided with a heating source 30 for heating the liquid-phase refrigerant introduced into the warming pipe 40.
  • the device temperature control apparatus of this embodiment is equipped with the valve
  • the heating source 30 is controlled to be turned on, and the valve 50 shown in FIG. 24 is controlled to close the liquid passage formed by the forward piping 21.
  • the liquid refrigerant introduced from the internal space of the main body 143 of the cooler 14C through the heating outlet 145 into the warming-up pipe 40 is heated by the heating source 30, and moves upward in the vertical direction while being vaporized and vaporized. It is introduced from the heating inlet 146 into the internal space of the main body 143 of the cooler 14C. In this process, the batteries 12a and 12b disposed on both sides of the cooler 14C are heated.
  • the refrigerant introduced into the internal space of the main body 143 of the cooler 14C moves downward and becomes a liquid refrigerant and is introduced from the heating outlet 145 into the warming up pipe 40. Further, part of the refrigerant introduced into the internal space of the main body 143 of the cooler 14C is introduced into the internal space of the main body 143 of the cooler 14B through the return pipe 22. As a result, the batteries 12a and 12b disposed on both sides of the cooler 14B are heated.
  • the refrigerant can be heated by the heating source 30 to warm up the target device.
  • FIG. 16 An apparatus temperature control apparatus according to a sixteenth embodiment will be described with reference to FIG.
  • the coolers 14A to 14C are connected by the convex portion pipe 216.
  • the coolers 14A to 14C are connected by the liquid phase connecting pipe 211.
  • the warming pipe 40 is disposed between the heating outlet 145 and the heating inlet 146 of the cooler 14C, and the liquid introduced into the warming pipe 40 into the warming pipe 40.
  • the heat source 30 for heating the phase refrigerant is provided as in the fifteenth embodiment.
  • the function of warming up the target device can be provided.
  • the device temperature control device of the present embodiment is disposed at the second height position higher than the first height position and the low-stage coolers 14B to 14C disposed at the first height position. And a high-stage cooler 14A. Further, high and low connection pipes 217 are disposed between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A.
  • the warming pipe 40 is disposed between the heating outlet 145 and the heating inlet 146 of the cooler 14C, and the liquid introduced into the warming pipe 40 into the warming pipe 40.
  • the heat source 30 for heating the phase refrigerant is provided as in the fifteenth embodiment.
  • the device temperature control apparatus of this embodiment is equipped with the valve
  • the configuration can also have a function of warming up the target device.
  • the device temperature control apparatus of this embodiment is disposed at the second height position higher than the first height position and the low-stage coolers 14B to 14C disposed at the first height position. And a high-stage cooler 14A.
  • the forward piping 21 has high-low connection piping 217 that connects between the inlet 141 of the low-stage coolers 14B to 14C and the outlet 144 of the high-stage cooler 14A. Then, at least a part of the liquid passage 217a formed by the high-low connection piping 217 is disposed at a position higher than the lowermost end of the internal space of the main body 143 of the high-stage cooler 14A.
  • the warming pipe 40 is disposed between the heating outlet 145 and the heating inlet 146 of the cooler 14C, and the liquid introduced into the warming pipe 40 into the warming pipe 40.
  • the heat source 30 for heating the phase refrigerant is provided as in the fifteenth embodiment.
  • the device temperature control apparatus of this embodiment is equipped with the valve
  • the configuration can also have a function of warming up the target device.
  • the respective coolers 14A to 14D are connected in parallel to the condenser 16 as in the device temperature control apparatus shown in FIG. That is, the forward pipe 21 connects between the condenser outlet 162 of the condenser 16 and the inlet 141 of each of the coolers 14A to 14D.
  • the forward pipe 21 is disposed such that at least a part of the liquid passage formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the respective coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connection piping 211 is at a higher position than the inflow ports 141 of the respective coolers 14A to 14D.
  • a heating source 30 for heating the refrigerant introduced into the forward pipe 21 is provided in the forward pipe 21 between the condenser 16 and the cooler 14A.
  • the heating source 30 is disposed below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14 in the vertical direction.
  • the heating source 30 is disposed such that a part of the heating source 30 is positioned below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14 in the vertical direction.
  • the device temperature control apparatus of the present embodiment includes the forward pipe 21 between the valve 50 and the cooler 14A, and the vapor-phase liquid phase communication pipe 42 for connecting the condenser 16 and the cooler 14D. There is.
  • the device temperature control apparatus of this embodiment is equipped with the valve
  • the heating source 30 is controlled to be turned off, and the valve 50 is controlled to open the liquid passage formed by the forward pipe 21.
  • the liquid refrigerant supplied from the condenser 16 passes through the forward pipe 21 and flows into the internal space of the coolers 14A to 14D. Since the internal pressure of the return pipe 22 is higher than the internal pressure of the forward pipe 21, the liquid refrigerant supplied from the condenser 16 hardly flows to the return pipe 22 side.
  • the liquid refrigerant that has flowed into the internal space of the main body 143 receives heat from the high temperature batteries 12a and 12b, and moves upward in the vertical direction while being evaporated and vaporized. In this process, the batteries 12a, 12b are cooled.
  • the gas phase refrigerant flows into the condenser 16 through the return pipe 22.
  • the heating source 30 is controlled to be turned on, and the valve 50 is controlled to close the liquid passage formed by the forward piping 21.
  • the liquid refrigerant introduced from the condenser 16 to the forward pipe 21 is heated by the heating source 30, moves upward and downward while being evaporated and vaporized, and passes through the vapor phase liquid phase communication pipe 42 and the return pipe 22 to be a cooler It is introduced into the internal space of each main body 143 from the outlet 142 of 14A-14D. In this process, the batteries 12a, 12b are heated.
  • the refrigerant that has dissipated heat in the main body 143 moves downward, becomes liquid refrigerant, and again flows out from the inflow port 141 to the forward pipe 21. Then, the liquid refrigerant introduced into the forward piping 21 is again heated by the heating source 30.
  • the apparatus temperature control apparatus of the nineteenth embodiment includes the forward pipe 21 between the valve 50 and the cooler 14A, and the vapor-phase liquid phase communication pipe 42 for connecting the condenser 16 and the cooler 14D. There is.
  • the forward pipe 21 between the valve 50 and the cooler 14D, and the vapor phase liquid phase communication pipe 42 connecting between the condenser 16 and the cooler 14A. Have.
  • the heat source 30 is provided in the forward piping 21 between the condenser 16 and the cooler 14A, the outward piping 21 between the valve 50 and the cooler 14A, the condenser 16 and the cooler 14D, and the like.
  • the third embodiment is the same as the nineteenth embodiment in that a vapor phase liquid phase communication pipe 42 for connecting the two is provided.
  • the target device is warmed up. You can have the ability to play.
  • the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connection piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D, and the liquid phase connection is performed.
  • the pipe 211 is arranged to extend linearly in the longitudinal direction of the vehicle.
  • the outward flow pipe 21 is disposed such that the liquid passage 211a formed by the liquid phase connection pipe 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D. And the forward pipe 21 is partially arranged to be recessed downward in the vertical direction.
  • the heat source 30 is provided in the forward piping 21 between the condenser 16 and the cooler 14A, the outward piping 21 between the valve 50 and the cooler 14A, the condenser 16 and the cooler 14D, and the like. Is the same as the twentieth embodiment in that a vapor phase liquid phase communication pipe 42 for connecting the two is provided.
  • the forward piping 21 is arranged such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D, and a part of the forward piping 21 is Even in the configuration arranged to be recessed downward in the vertical direction, it is possible to have the function of warming up the target device.
  • the apparatus temperature control apparatus of this embodiment is provided with a vapor phase liquid phase communication pipe 43 connecting the inflow port 141 of the cooler 14D and the return path pipe 22. Further, the vapor phase liquid phase communication pipe 43 is provided with a heating source 30 for heating the refrigerant introduced into the vapor phase liquid phase communication pipe 43.
  • the heating source 30 may be provided in the vapor-phase liquid phase communication pipe 43 connecting between the inflow port 141 of the cooler 14D and the return pipe 22.
  • the device temperature control apparatus of the present embodiment includes a vapor-phase liquid phase communication pipe 44 connecting between the inflow port 141 of the cooler 14A and the return path pipe 22. Further, the vapor phase liquid phase communication pipe 44 is provided with a heating source 30 for heating the refrigerant introduced into the vapor phase liquid phase communication pipe 44.
  • the heating source 30 may be provided in the vapor-phase liquid phase communication pipe 44 connecting between the inflow port 141 of the cooler 14A and the return pipe 22.
  • the device temperature control apparatus heats the refrigerant inside the warming-up pipe 40 provided in the cooler 14A and the warming-up pipe 40 provided in the cooler 14B by one heating source 30. Further, the refrigerant in the warm-up pipe 40 provided in the cooler 14C and the warm-up pipe 40 provided in the cooler 14D are heated by one heating source 30.
  • the warming-up pipe 40 includes a first pipe 40a extending in the horizontal direction from the heating outlet 145, a second pipe 40b extending in the vertical direction from an end of the first pipe 40a, and an upper end of the second pipe 40b. And a third pipe 40 c extending horizontally from the heating inlet 146 to the heating inlet 146.
  • the heating source 30 has a block member 31 made of a metal such as aluminum, a plate-like heat conductive material 33, and a heater 32 having a planar shape. .
  • the heater 32 corresponds to a heating element.
  • the block member 31 is formed with two through holes 31a through which the warming-up pipe 40 is inserted, and the warming-up pipes 40 are arranged in the through holes 31a.
  • the heater 32 is disposed so as to be sandwiched between the heat conductive material 33 and the heat insulating material 34. Further, the heat conductive material 33 and the heat insulating material 34 are fixed by the support member 35.
  • the two through holes 31 a formed in the block member 31 have an L-shaped cross section.
  • the first pipe 40a and the second pipe 40b of the warming-up pipe 40 are disposed in the L-shaped through holes 31a. Therefore, the refrigerant stored in the first pipe 40 a and the second pipe 40 b of the warming-up pipe 40 can be efficiently heated by the heater 32.
  • the block member 31 is configured as shown in FIGS. 42 to 43. However, as shown in FIGS. 44 to 45, a heater disposed so as to be sandwiched between two heat transfer members 33 The block member 31 can also be configured to be disposed between the two through holes 31a.
  • two through holes 31 a formed in the block member 31 of the heat source 30 have an L-shaped cross section.
  • the cross section of the two through holes 31 a formed in the block member 31 of the heat source 30 of the present embodiment is I-shaped.
  • the second pipe 40b of the warming-up pipe 40 is disposed in the I-shaped through hole 31a. Thereby, size reduction and weight reduction of the heating source 30 are possible.
  • the apparatus temperature control apparatus of the present embodiment includes a warming-up pipe 40 connecting between the heating outlet 145 of the cooler 14A and the heating inlet 146, a heating outlet 145 of the cooler 14B, and a heating A warming-up pipe 40 connecting to the inlet 146, a warming-up pipe 40 connecting the heating outlet 145 for the cooler 14C and the heating inlet 146, and a heater for the cooler 14D
  • the heating pipe 40 connecting between the outlet 145 and the heating inlet 146 is configured to be heated by one heating source 30.
  • four or more warm-up pipes 40 can also be heated by one heating source 30.
  • the secondary battery 12a, 12b has been described as an example of the target device whose temperature is adjusted by the device temperature adjustment device 10.
  • other apparatuses such as a motor, an inverter, a charger, a semiconductor element, an information apparatus, etc. which require cooling or warming may be sufficient.
  • the device temperature control apparatus 10 is mounted on a car.
  • the device temperature control device is used for various moving objects other than cars such as trains, airplanes, electric bikes You may mount ten.
  • the working fluid may employ other fluids such as propane, carbon dioxide, water, ammonia and the like.
  • the convex portion piping 215 is provided between the condenser outlet 162 of the condenser 16 and the inlet 141 of the cooler 14 connected to the condenser 16 among the plurality of coolers 14. I did it.
  • the convex portion piping 215 provided in the device temperature adjusting device of the fifth embodiment can be disposed in the device temperature adjusting device of the first to fourth and sixth to twelfth embodiments.
  • the forward piping 21 is disposed such that the liquid passage 211 a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the plurality of coolers 14. It is not limited to the following configuration.
  • the forward piping 21 may be arranged such that at least a part of the liquid passage 21 a formed by the forward piping 21 is at a higher position than the inflow ports 141 of the plurality of coolers 14.
  • the projection piping is disposed such that the liquid flow path formed by the projection piping is higher than the inflow port 141 of the cooler 14.
  • the shape of the projection piping is The present invention is not limited to the shapes shown in the third to tenth embodiments.
  • a shielding plate extending upward in the vertical direction is provided in the liquid flow path, or the liquid flow path is formed in an inverted V-shape to form a weir in the middle of the forward flow pipe 21 to form the main body 143 of the cooler 14 It is also possible to form a reservoir within.
  • this indication is not limited to above-mentioned embodiment, and can be changed suitably. Moreover, said each embodiment is not mutually irrelevant and can be combined suitably, unless the combination is clearly impossible. Further, in each of the above-described embodiments, it is needless to say that the elements constituting the embodiment are not necessarily essential except when clearly indicated as being essential and when it is considered to be obviously essential in principle. Yes. Further, in the above embodiments, when numerical values such as the number, numerical value, amount, range, etc. of constituent elements of the embodiment are mentioned, it is clearly indicated that they are particularly essential and clearly limited to a specific number in principle. It is not limited to the specific number except when it is done. Further, in the above embodiments, when referring to materials, shapes, positional relationships, etc. of constituent elements etc., unless specifically stated otherwise or in principle when limited to a specific material, shape, positional relationship, etc., etc. It is not limited to the material, the shape, the positional relationship, etc.
  • the circulation circuit for circulating the working fluid, and the temperature of the target device is determined by the phase change between the liquid phase and the gas phase of the working fluid. It is an equipment temperature control device to adjust.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser.
  • Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping.
  • the forward piping is arranged such that at least a part of the liquid passage formed by the forward piping is at a higher position than the inlets of the plurality of coolers.
  • the forward piping has a liquid phase connection piping that forms a liquid passage, and a connection piping that connects between the inflow ports of the plurality of coolers and the liquid phase connection piping. ing.
  • the liquid passage formed by the liquid phase connecting pipe is disposed at a position higher than the inlets of the plurality of coolers.
  • the liquid passage formed by the liquid phase connection piping can be configured to be at a higher position than the inlets of the plurality of coolers.
  • the liquid phase connecting pipe is a target liquid surface of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. It is arranged to have the above height.
  • the liquid phase connecting pipe is such that the liquid passage formed by the liquid phase connecting pipe is at a height higher than the target liquid level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid.
  • it is arranged.
  • the device temperature control device includes a circulation circuit that circulates the working fluid, and adjusts the temperature of the target device by phase change between the liquid phase and the gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser.
  • Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping.
  • at least one of the inlets of the plurality of coolers is disposed at a height higher than the lowermost end of the internal space of the main body.
  • At least one of the inlets of the plurality of coolers is an appropriate liquid surface which is a target fluid level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is arranged at the height above.
  • At least one of the inlets of the plurality of coolers is disposed at a height above the appropriate liquid level, which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. Is preferred.
  • the forward piping has a liquid phase connecting piping that forms a liquid passage
  • the liquid phase connecting piping is a circulation of a liquid passage formed by the liquid phase connecting piping.
  • the circuit is disposed at a height higher than the appropriate liquid level which is a target liquid level of the working fluid in the plurality of coolers when the circuit is filled with the working fluid.
  • the liquid phase connecting pipe is a target liquid level or more of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. It is preferable to arrange so that it may become high.
  • a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser.
  • Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping.
  • the forward piping is disposed between the inlet of the first cooler of one of the plurality of coolers and the inlet of the second cooler different from the first cooler of the plurality of coolers.
  • the inlet of the first cooler and the inlet of the second cooler are not the target level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid. It is also located at a low position.
  • the inlet of the first cooler and the inlet of the second cooler are disposed at a position lower than the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Is preferred.
  • At least a part of the liquid passage formed by the convex portion pipe is a target of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged to be higher than the liquid level.
  • the projection piping has a height above the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid in at least a part of the liquid passage formed by the projection piping. It is preferable to arrange so that
  • the forward piping forms a liquid passage and forms a first liquid phase connecting piping connected to the inflow port of the first cooler and a second liquid passage extending in the front-rear direction. It has a second liquid phase connecting pipe connected to the inlet of the cooler. And convex part piping is arranged between the 1st liquid phase connecting piping and the 2nd liquid phase connecting piping.
  • the convex portion piping is disposed between the first liquid phase connecting piping connected to the inlet of the first cooler and the second liquid phase connecting piping connected to the inlet of the second cooler. can do.
  • the convex portion pipe is located upstream of the fluid flow of the working fluid flowing inside the liquid phase connecting pipe than the center of the inlet of the first cooler and the inlet of the second cooler. It is arranged.
  • the convex portion piping is the first convex portion piping
  • the forward piping is the flow of the condenser outlet connected to the condenser outlet and the cooler connected to the condenser among the plurality of coolers It has the 2nd convex part piping connected between inlets.
  • the second convex portion piping at least a part of the liquid passage formed by the second convex portion piping is vertically above the inlet of the cooler connected to the condenser outlet of the condenser and the condenser It protrudes.
  • a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser.
  • Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping.
  • the forward piping has a convex piping that connects between the condenser outlet of the condenser and the inlet of the cooler connected to the condenser among the plurality of coolers. And, at least a part of the liquid passage formed by the convex portion piping protrudes vertically upward from the condenser outlet of the condenser and the inlet of the cooler connected to the condenser.
  • At least a part of the liquid passage formed by the convex portion pipe is the target of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged to be higher than the liquid level.
  • the projection piping has a height above the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid in at least a part of the liquid passage formed by the projection piping. It is preferable to arrange so that
  • a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser.
  • each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the inner space of the main body and an outlet for discharging the working fluid introduced to the main body.
  • the forward piping is a convex piping that connects between the outlet of one first cooler of the plurality of coolers and the inlet of the second cooler different from the first cooler of the plurality of coolers.
  • the projection piping projects at least a part of the liquid passage formed by the projection piping in the upper and lower direction above the outlet of the first cooler and the inlet of the second cooler. Has a convex piping.
  • At least a part of the liquid passage formed by the convex portion pipe is a target of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged to be higher than the liquid level.
  • the projection piping has a height above the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid in at least a part of the liquid passage formed by the projection piping. It is preferable to arrange so that
  • the apparatus temperature control apparatus includes a circulation circuit that circulates the working fluid, and adjusts the temperature of the target device by a phase change between the liquid phase and the gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the inner space of the main body and an outlet for discharging the working fluid introduced to the main body. And, at least one of the inlet and the outlet of the plurality of coolers is arranged at a position higher than the lowermost end of the internal space of the main body.
  • At least one of the inlet and the outlet of the plurality of coolers is a target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is arranged at the height above the appropriate liquid level.
  • At least one of the inlet and the outlet of the plurality of coolers is higher than the appropriate liquid level which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is preferred that the appropriate liquid level which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is preferred that the
  • the forward piping has a liquid phase connection piping (211) forming a liquid passage.
  • the liquid phase connecting pipe is higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase linking pipe is filled with the working fluid in the circulation circuit. It is arranged to be
  • the liquid phase connecting pipe is a target liquid level or more of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. It is preferable to arrange so that it may become high.
  • a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers.
  • return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser.
  • Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping.
  • the plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position.
  • the forward piping has high and low connection piping that connects between the inlet of the low stage cooler and the inlet of the high stage cooler. Then, at least a part of the liquid passage formed by the high and low connection piping protrudes vertically above the inlet of the low stage cooler and the inlet of the high stage cooler.
  • a device temperature control apparatus that has a circulation circuit that circulates a working fluid and that adjusts the temperature of a target device by a phase change between the liquid phase and the gas phase of the working fluid.
  • a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid.
  • each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the inner space of the main body and an outlet for discharging the working fluid introduced to the main body.
  • the plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position.
  • the forward piping has high and low connection piping that connects between the inlet of the low stage cooler and the outlet of the high stage cooler. And, at least a part of the liquid passage formed by the high and low connection piping is disposed at a position higher than the lowermost end of the internal space of the main body of the high stage cooler.
  • At least a part of the liquid passage formed by the high and low connection piping is a target liquid surface of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged at the height more than a field.
  • At least a portion of the fluid passage formed by the high and low connection piping is at a height above the appropriate fluid level, which is the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid.
  • the appropriate fluid level which is the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid.
  • it is arranged.
  • an apparatus having a circulation circuit (26) for circulating the working fluid, and adjusting the temperature of the target device (12a, 12b) by the phase change between the liquid phase and the gas phase of the working fluid. It is a temperature control device.
  • a plurality of coolers (14) included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the working fluid included in the circulation circuit and evaporated by the cooler
  • a condenser (16) for dissipating heat from the heat source to condense the working fluid.
  • each of the plurality of coolers has an inlet (141) for introducing the working fluid flowing in the forward piping into the inner space of the main body (143) and an outlet (144) for discharging the working fluid introduced to the main body.
  • the plurality of coolers include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position.
  • the forward piping has high-low connection piping (217, 218) that connects between the inlet of the low-stage cooler and the outlet of the high-stage cooler. Further, at least a part of the liquid passage formed by the high and low connection piping protrudes vertically above the inflow port of the low stage cooler and the outflow port of the high stage cooler.
  • At least one of the plurality of coolers includes a heating outlet for heating the working fluid introduced into the internal space of the main body, and a vertical direction from the heating outlet. And a heating inlet disposed on the upper side for introducing the working fluid flowing out of the heating outlet into the internal space of the main body. Between the heating outlet and the heating inlet, a warming-up pipe for introducing the working fluid flowing out from the heating outlet to the heating inlet is provided, and the warming pipe is provided with the warming-up pipe.
  • a heating source is provided to heat the working fluid in the liquid phase introduced into the interior of the warm-up pipe. Then, the working fluid heated by the heating source is introduced into the internal space of the main body from the heating inlet through the warming-up pipe.
  • the working fluid can be heated by the heating source to warm up the target device.
  • the device temperature control device is disposed in at least one of the warming-up piping connecting the forward piping and the return piping, and at least one of the outward piping and the warming piping. And a heating source for heating a working fluid in a liquid phase introduced into at least one of the warm-up pipes. Then, the working fluid heated by the heating source is introduced into the internal space of the main body from the discharge port through the return pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.
  • the device temperature control device is disposed above the heating source and a heating source for heating the working fluid in the liquid phase introduced into the inside of the forward piping, and the outward piping and the return path And a vapor phase liquid phase communication pipe connecting between the pipe and the pipe. Then, the working fluid heated by the heating source is introduced into the internal space of the main body through the forward pipe, the gas phase liquid phase communication pipe, and the return pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.
  • the device temperature control device is disposed in the vapor-liquid-phase communicating pipe connecting the forward pipe and the return pipe, and the vapor-liquid phase communicating pipe, and the vapor phase liquid phase And a heating source for heating the working fluid in the liquid phase introduced into the communication pipe. Then, the working fluid heated by the heating source is introduced into the internal space of the main body through the forward pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.
  • the device temperature control apparatus includes a plurality of warming-up pipe flow paths, and the heating source includes a heating element that heats the plurality of warming-up pipes. Therefore, the working fluid in the plurality of warming-up pipes can be heated by the heating element.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un appareil de réglage de température de dispositif destiné à ajuster les températures de dispositifs cibles (12a, 12b) par conversion de phase d'un fluide de travail entre la phase liquide et la phase gazeuse, comprenant : une pluralité de refroidisseurs (14) destinés à refroidir les dispositifs cibles en effectuant un échange de chaleur entre la chaleur des dispositifs cibles et la chaleur du fluide de travail ; un condenseur (16) destiné à condenser le fluide de travail évaporé par les refroidisseurs en dissipant la chaleur du fluide de travail ; un tuyau sortant (21) qui forme un passage de liquide (21a) servant à fournir le fluide de travail condensé par le condenseur à la pluralité de refroidisseurs ; et un tuyau de retour (22) qui forme un passage de gaz (22a) servant à fournir le fluide de travail évaporé par la pluralité de refroidisseurs au condenseur. La pluralité de refroidisseurs comprend chacun un orifice d'entrée (141) destiné à guider le fluide de travail qui s'écoule à travers le tuyau sortant vers l'espace intérieur d'un corps (143), et un orifice d'évacuation (142) servant à l'évacuation du fluide de travail évaporé dans le corps vers le tuyau de retour. Le tuyau sortant est disposé de telle sorte qu'au moins une partie du passage de liquide formé par le tuyau sortant est disposée à une position plus haute que celle des orifices d'entrée de la pluralité de refroidisseurs.
PCT/JP2018/040774 2017-11-07 2018-11-01 Appareil de réglage de température de dispositif WO2019093230A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-214857 2017-11-07
JP2017214857 2017-11-07
JP2018-082432 2018-04-23
JP2018082432A JP2019086275A (ja) 2017-11-07 2018-04-23 機器温調装置

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Publication number Priority date Publication date Assignee Title
WO2020084956A1 (fr) * 2018-10-24 2020-04-30 株式会社デンソー Dispositif de régulation de température
EP4287356A1 (fr) * 2022-05-31 2023-12-06 Kidde Technologies, Inc. Gestion thermique et atténuation d'incendie combinées pour boîtiers de batterie à grande échelle

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JPS51123944A (en) * 1975-04-21 1976-10-29 Hitachi Ltd Heat transmitter device
JP2004085151A (ja) * 2002-08-29 2004-03-18 Mitsubishi Electric Corp 冷却装置
JP2008039373A (ja) * 2006-07-14 2008-02-21 Denso Corp 排気熱回収器
CN101251347A (zh) * 2008-04-03 2008-08-27 上海交通大学 自保护自适应回路重力热管换热装置
JP2013065227A (ja) * 2011-09-20 2013-04-11 Hitachi Ltd サーバラックの冷却システム及びサーバ機器
JP2015041418A (ja) * 2013-08-20 2015-03-02 トヨタ自動車株式会社 電池温度調節装置
US20150241094A1 (en) * 2012-09-03 2015-08-27 Abb Technology Ag Power electronics cooling
JP2015224830A (ja) * 2014-05-28 2015-12-14 ダイキン工業株式会社 冷凍装置
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
WO2018047529A1 (fr) * 2016-09-09 2018-03-15 株式会社デンソー Appareil de réglage de température de dispositif
WO2018047539A1 (fr) * 2016-09-09 2018-03-15 株式会社デンソー Appareil de réglage de température de dispositif
WO2018168276A1 (fr) * 2017-03-16 2018-09-20 株式会社デンソー Appareil de réglage de température de dispositif

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Publication number Priority date Publication date Assignee Title
JPS51123944A (en) * 1975-04-21 1976-10-29 Hitachi Ltd Heat transmitter device
JP2004085151A (ja) * 2002-08-29 2004-03-18 Mitsubishi Electric Corp 冷却装置
JP2008039373A (ja) * 2006-07-14 2008-02-21 Denso Corp 排気熱回収器
CN101251347A (zh) * 2008-04-03 2008-08-27 上海交通大学 自保护自适应回路重力热管换热装置
JP2013065227A (ja) * 2011-09-20 2013-04-11 Hitachi Ltd サーバラックの冷却システム及びサーバ機器
US20150241094A1 (en) * 2012-09-03 2015-08-27 Abb Technology Ag Power electronics cooling
JP2015041418A (ja) * 2013-08-20 2015-03-02 トヨタ自動車株式会社 電池温度調節装置
JP2015224830A (ja) * 2014-05-28 2015-12-14 ダイキン工業株式会社 冷凍装置
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
WO2018047529A1 (fr) * 2016-09-09 2018-03-15 株式会社デンソー Appareil de réglage de température de dispositif
WO2018047539A1 (fr) * 2016-09-09 2018-03-15 株式会社デンソー Appareil de réglage de température de dispositif
WO2018168276A1 (fr) * 2017-03-16 2018-09-20 株式会社デンソー Appareil de réglage de température de dispositif

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020084956A1 (fr) * 2018-10-24 2020-04-30 株式会社デンソー Dispositif de régulation de température
EP4287356A1 (fr) * 2022-05-31 2023-12-06 Kidde Technologies, Inc. Gestion thermique et atténuation d'incendie combinées pour boîtiers de batterie à grande échelle

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