WO2019090749A1

WO2019090749A1 - Contact sensor and electronic device

Info

Publication number: WO2019090749A1
Application number: PCT/CN2017/110613
Authority: WO
Inventors: 林峰
Original assignee: 深圳信炜科技有限公司
Priority date: 2017-11-11
Filing date: 2017-11-11
Publication date: 2019-05-16
Also published as: CN211124064U

Abstract

Disclosed are a contact sensor and an electronic device. The contact sensor comprises a circuit board, a wafer die arranged on the circuit board, and at least one electrostatic protection element arranged on the circuit board. The electrostatic protection element surrounds the wafer die, and the electrostatic protection element has a sharp end, wherein the sharp end extends beyond an upper surface of the wafer die. The electrostatic protection element is used for discharging static electricity. The electronic device comprises the contact sensor.

Description

Contact sensors and electronic devices

Technical field

The utility model relates to an antistatic contact sensor and an electronic device.

Background technique

As the name suggests, a touch sensor is a sensor that senses a contacted object when the user touches or approaches it. For example, a fingerprint sensor can sense an object that is in contact with or near the sensor and obtain a fingerprint image.

However, the human body is a conductor. When the user touches or approaches the sensor, the static electricity of the human body may affect the circuit in the sensor, resulting in a decrease in the sensing efficiency of the contact sensor or even failure.

Utility model content

The embodiments of the present invention aim to at least solve one of the technical problems existing in the prior art. To this end, the embodiments of the present invention need to provide a contact sensor and an electronic device.

The contact sensor of the embodiment of the present invention includes: a circuit board, a die dies disposed on the circuit board, and at least one static electricity protection component disposed on the circuit board; the static electricity protection component is located in the crystal Around the circular die, and the ESD element has a tip that extends beyond the upper surface of the wafer die.

In the embodiment of the present invention, the electrostatic protection component is disposed on the circuit board and located outside the wafer die, and the vertical height of the electrostatic protection component relative to the circuit board is greater than the vertical height of the wafer die relative to the circuit board. Therefore, when the object contacts the biosensor chip, the electrostatic protection component is closer to the object than the wafer die, and the static electricity generated by the object is first discharged through the electrostatic protection component, thereby preventing the static electricity from passing through the wafer die and the wafer is bare. The film has an impact. In addition, since the ESD protection component is located outside the wafer die, the ESD protection component does not affect the biosensing of the wafer die, thereby improving the biosensing effect. Moreover, since the electrostatic protection element achieves electrostatic discharge by a height setting, the electrostatic protection element can be disposed as a small volume of the conductive member, thereby saving the manufacturing cost of the biosensor chip.

In certain embodiments, the ESD protection element is a wire. The electrostatic protection element through the wire structure is not only simple in structure, but also has a small amount of material, thereby reducing material cost. In addition, the ESD protection component of the wire structure is located outside the die dies, which not only does not affect the normal line of the die dies, but also the wires disposed outside the die dies can realize short-distance design and improve the support strength of the wires. .

In some embodiments, the ESD protection component is disposed on the circuit board by wire bonding. The electrostatic protection component is realized by wire bonding, and the manufacturing process is simple and quick, and is easy to implement.

In certain embodiments, the ESD protection element is directly or indirectly connected to the ground through the circuit board.

In some embodiments, the circuit board is provided with two pads corresponding to the ESD protection component, the ESD protection component is connected to one pad at one end, and the other end of the ESD protection component is connected to another pad.

In some embodiments, the ESD protection component comprises a plurality of and is distributed around the wafer die. As such, even if the object deviates from contact with the contact sensor, the ESD element can direct static electricity to the ground more quickly, thereby improving the electrostatic discharge effect.

In some embodiments, the contact sensor further includes a package for encapsulating the wafer die, an ESD protection component, and filling a gap between the Wafer die and the ESD protection component.

In some embodiments, if the package is in a QFN package, the board is replaced by a lead frame.

In some embodiments, the package body is remote from a side surface of the circuit board for receiving contact or proximity input of an object, and the wafer die is used for information sensing of an object in contact or proximity.

In some embodiments, the object information sensed by the wafer die includes one or more of a fingerprint, a palm print, an ear print, a heart rate, blood oxygen, blood pressure, vein, body temperature, humidity, and pressure.

In some embodiments, the wafer die is at least one.

In certain embodiments, the ESD element is arched or curved.

The embodiment of the present invention further provides an electronic device including the outer casing and the contact sensor of any of the above embodiments, and the contact sensor is disposed in the inner hole of the outer casing or inside the outer casing. The electronic device therefore has all the benefits of the contact sensor described above.

The additional aspects and advantages of the embodiments of the invention will be set forth in part in the description in the written description

DRAWINGS

The above and/or additional aspects and advantages of the embodiments of the invention will be apparent from the

1 is a schematic view showing a mounting structure of a conventional contact sensor;

2 is a schematic view showing a package structure of another conventional contact sensor;

3 is a schematic side view showing the structure of a touch sensor according to an embodiment of the present invention;

4 is a schematic structural view of an electrostatic protection component of the contact sensor of the present invention;

Figure 5a is a schematic view showing a distribution structure of two electrostatic protection elements in the contact sensor of the present invention;

Figure 5b is a schematic view showing another distribution structure of two electrostatic protection elements in the contact sensor of the present invention;

5c is a schematic view showing another distribution structure of two electrostatic protection elements in the biosensor chip of the present invention;

6 is a schematic structural view of a touch sensor according to another embodiment of the present invention;

7 is a structural diagram of an embodiment of a wafer die in a contact sensor of the present invention;

FIG. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed ways

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. . Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more, and unless otherwise specifically defined, the definition applies to the terms "multiple", "multiple", and the like. "Contact" or "touch" includes direct or indirect contact.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be, for example, a fixed connection or a Disassembling the connection, or connecting integrally; may be mechanical connection, electrical connection or communication with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or mutual interaction of two elements Role relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may repeat reference numerals and/or reference numerals in different examples, which are for the purpose of simplicity and clarity, and do not in themselves indicate the relationship between the various embodiments and/or settings discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Further, the described features, structures may be combined in any suitable manner in one or more embodiments. in. In the following description, numerous specific details are set forth However, those skilled in the art will appreciate that the technical solution of the present invention may be practiced without one or more of the specific details or other structures, components, and the like. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the invention.

The touch sensor provided by the utility model includes a biosensor for sensing one or more of a fingerprint, a palm print, an ear print, a heart rate, a blood oxygen, a blood pressure, and a vein of an object, or is used for sensing the body temperature and humidity of the object. One or more contact sensors in the pressure.

Referring to FIG. 1, FIG. 1 is a schematic view showing a mounting structure of a conventional contact sensor. When the module is installed, the contact sensor 10 is provided with a metal ring 11 connected to the ground through the conduction line 12; and the metal ring 11 is provided with a center hole, and the contact sensor 10 is located at the center of the metal ring 11 Inside the hole. When the user touches or approaches the contact sensor 10, the static electricity of the human body will be directed to the ground through the metal ring 11 for venting, thereby preventing the static electricity flowing from the human body to the contact sensor 10 and damaging the contact sensor 10.

Referring to FIG. 2, FIG. 2 is a schematic diagram of a package structure of another prior contact sensor. The contact sensor 10' includes a package housing 13 and a sensing die 14 located within the package housing 13 and a circuit protection device 15, such as a TVS (Transient Voltage Suppressor) diode, when a finger contacts or approaches the contact At the time of sensor 10, human body static electricity will be clamped by the circuit protection device 15, thereby protecting the sensing die 14 from static electricity.

Although the electrostatic problem can be solved by providing the metal ring 11 and the circuit protection device 15, the metal ring 11 and the circuit protection device 15 are both increased in manufacturing cost of the contact sensor 10, 10', so the present invention proposes a novel The contact sensor of the electrostatic protection structure can reduce the manufacturing cost of the contact sensor.

Referring to FIG. 3, FIG. 3 is a schematic side view of a contact sensor according to an embodiment of the present invention. The contact sensor 2 includes a circuit board 20, a die dies 21 disposed on the circuit board 20, and an electrostatic protection component 22, and the vertical height h1 of the static electricity protection component 22 relative to the circuit board 20 is greater than the bare wafer. The vertical height h2 of the sheet 21 relative to the circuit board 20.

The embodiments of the present invention have the following advantages over the prior art:

1. By placing the ESD protection component on the circuit board, and the vertical height of the ESD protection component is greater than the vertical height of the die die, when the object contacts the biosensor chip, the ESD protection component is more opposite to the die die. Close to the object, the static electricity generated by the object is first vented through the ESD protection component, thereby preventing static electricity from affecting the wafer die through the die.

Second, since the ESD protection component is located outside the wafer die, the ESD protection component does not affect the biosensing of the wafer die, thereby improving the biosensing effect.

Third, since the electrostatic protection component is electrostatically discharged by the height setting, the electrostatic protection component can be set as a small volume of the conductive member, thereby saving the manufacturing cost of the biosensor chip.

In some embodiments, the circuit board 20 can be a rigid material or a flexible material such as a flexible film. After the die dies 21 are disposed on the circuit board 20, the die dies 21 are connected to the circuit board 20 through the conductive traces 202.

Further, the static electricity protection element 22 is disposed on the periphery of the wafer die 21. Moreover, a pad 201 is disposed on the circuit board 20, and the static electricity protection element 22 is fixed to the circuit board 20 through the pad 201. It should be noted that the ground here includes the ground of the contact sensor 2, or the system ground or equipment ground to which the sensor 2 is applied. In this manner, the static electricity of the human body is guided to the ground by the electrostatic protection element 22 and the connection line between the pad 201 and the ground.

In some embodiments, the ESD protection element 22 includes a raised portion disposed on the circuit board 20 and is directly or indirectly connected to the ground. For example, the ESD protection element 22 is directly connected to the ground through a connection line, or through other A circuit (eg, a modulation circuit) is indirectly coupled to ground to conduct static electricity received on the ESD protection element 22 to ground for electrostatic discharge. The vertical height of the ESD protection element 22 relative to the circuit board 20 is greater than the vertical height of the Wafer die 21 relative to the circuit board 20.

Further, the convex portion has a sharp angle or an arc shape to use the lightning rod principle to cause static electricity of the object to flow to the ground through the convex portion, thereby preventing static electricity from affecting the wafer die 21.

In some embodiments, referring to FIG. 4, FIG. 4 is a schematic structural view of an electrostatic protection component of the contact sensor of the present invention. The electrostatic protection element 22 is, for example, a wire. The raised portion of the static electricity protection element 22 is formed, for example, by wire bonding. In some embodiments, the wires for the ESD protection component 22 are metal wires, the material of which is, for example, gold, copper, aluminum, etc., and of course other suitable electrically conductive materials. The electrostatic protection element 22 through the wire structure is not only simple in structure, but also has a small amount of material, thereby reducing material cost. In addition, the electrostatic protection component 22 can be realized by wire bonding, and the manufacturing process is simple and quick, and is easy to implement.

Specifically, with continued reference to FIG. 4, it should be noted that two electrostatic protection elements 22 are shown in FIG. 4, and of course, only one electrostatic protection element 22 may be provided, or two or more electrostatic protection elements 22 may be provided. As shown in FIG. 4, the circuit board 20 is provided with a first pad 201a and a second pad 201b, a third pad 201c, and a fourth pad 201d. One end of the first conductive line is connected to the first pad 201a by wire bonding, and the other end of the first conductive line is connected to the second pad 201b, thereby forming the static electricity protection element 22a. The first conductive line has an arc shape, and a maximum value h1 of the vertical height of the first conductive line relative to the circuit board 20 is greater than a vertical height h2 of the wafer die 21 relative to the circuit board 20. One end of the second conductive line is connected to the third pad 201c by wire bonding, and the other end of the second conductive line is connected to the fourth pad 201d, thereby forming the static electricity protection element 22b. The second conductive line also has an arc shape, and the maximum value of the vertical height of the second conductive line relative to the circuit board 20 is greater than the vertical height of the wafer die 21 relative to the circuit board 20. height. In the present embodiment, the vertical height of the ESD element 22a with respect to the circuit board 20 and the vertical height of the ESD protection element 22b with respect to the circuit board 20 are equal or within an allowable tolerance range. Of course, it is also possible to provide electrostatic protection elements 22 of different heights.

In some embodiments, the material of the pad includes, for example, one or more of aluminum, copper, gold, silver, platinum, palladium, nickel, and the like. Of course, the pad material can also be other suitable materials.

Further, in some embodiments, the ESD protection elements 22 are disposed on the outside of the wafer die. If there are two electrostatic protection elements 22, the two static protection elements 22 may be disposed on opposite sides or adjacent sides of the wafer die 21. 5a and 5b, FIG. 5a is a schematic view showing a distribution structure of two electrostatic protection elements in the contact sensor of the present invention; FIG. 5b is another distribution structure of two electrostatic protection elements in the contact sensor of the present invention; FIG. 5c is a schematic view showing another distribution structure of two electrostatic protection elements in the biosensor chip of the present invention. As shown in FIG. 5a, the projection surface of the wafer die 21 on the substrate 20 is quadrangular. Of course, the projection surface of the wafer die 21 on the substrate 20 may have other shapes, such as a triangle, a polygon, a circle, Oval and so on. The wafer die 21 includes a first side 21a and a second side 21b disposed opposite to each other, and a third side 21c and a second side 21d disposed opposite to each other. The static electricity shielding element 22a and the static electricity protection element 22b are disposed on the wafer die. The first side 21a of 21. It can be understood that the static electricity protection element 22a and the static electricity protection element 22b can also be disposed on the second side 21b, the third side 21c and the fourth side 21d of the wafer die 21.

As shown in FIG. 5b, the static electricity protection element 22a is disposed on the first side 21a of the wafer die 21, and the static electricity protection element 22b is disposed on the second side 21b of the wafer die 21. It can be understood that the ESD protection component 22a and the ESD protection component 22b can also be disposed on the third side 21c and the fourth side 21d of the wafer die 21.

By disposing the ESD protection components on the same side of the wafer die 21, the structure is compact and compact, and does not affect the wiring trace between the wafer die 21 and the substrate 20.

As shown in FIG. 5c, the static electricity protection element 22a is disposed at a corner formed by the first side 21a and the third side 21c of the wafer die 21, and the static electricity protection element 22b is disposed on the second side 21b of the wafer die 21 and The corner formed by the four sides 21d. Specifically, one end of the ESD protection element 22a is disposed on the first side 21a of the die dies 21, the other end of the ESD protection component 22a is disposed on the third side 21c of the die dies 21, and one end of the ESD protection component 22b is disposed on the wafer. The second side 21b of the die 21, the other end of the static electricity protection element 22b is disposed on the fourth side 21d of the wafer die 21. It can be understood that the ESD protection element 22a and the ESD protection element 22b can also be disposed at the other two opposite corners of the wafer die 21.

By the oppositely disposed electrostatic protection element 22a and electrostatic protection element 22b, the purpose of electrostatic discharge can be achieved even if the touch position of the contact sensor 2 is deviated.

Of course, the above-mentioned static electricity protection element 22 can be set to four, that is, correspondingly disposed on the wafer die The first side, the second side, the third side, and the fourth side of 21 are correspondingly disposed at four corners of the wafer die 21.

In some embodiments, the ESD protection elements 22 can also be disposed in other numbers and distributed around the wafer die 21 in a regular or irregular distribution rule to achieve a better electrostatic discharge effect. For example, it is evenly distributed outside the wafer die 21. In other words, as long as the position on which the electrostatic protection element can be disposed on the substrate 20 can be set to improve the electrostatic discharge effect.

In some embodiments, when the ESD protection element 22 includes at least two, the linear distances of the two pads for securing the ESD protection element 22 on the circuit board 20 may be equal, and may of course not be equal. As shown in FIG. 4, the linear distance L1 between the first pad 201a and the second pad 201b is equal to the linear distance L2 between the third pad 201c and the fourth pad 201d. If the ESD element 22 is a wire, since the wire is thin and the strength is limited, the strength of the ESD element 22 can be enhanced by providing a short linear distance, and the length of the wire is also saved. In addition, a larger number of ESD components can be placed on the same substrate.

Further, referring to FIG. 6, FIG. 6 is a schematic structural diagram of a contact sensor according to another embodiment of the present invention. The contact sensor 2 further includes a package body 23 for packaging the wafer die 21 and the static electricity protection element 22. The material of the package 23 is, for example, an epoxy resin material or other suitable insulating material.

The manufacturing process of the contact sensor is, for example, S1: forming a wafer die independently according to a predetermined circuit structure; S2, providing a circuit board 20 on which the position of the wafer die 21 is reserved, and At least two pads are disposed outside the reserved position; S3, the die dies 21 are correspondingly mounted on the specified position of the circuit board 20, and the die dies 21 are electrically connected to the circuit board 20 through the conductive lines 202. S4, the two ends of the ESD protection element 22 are connected to the two pads by wire bonding, and the height of the ESD protection component 22 relative to the circuit board 20 is greater than the height of the wafer die 21 relative to the circuit board 20; S5, will carry crystal The circuit board 20 of the circular die 21 and the ESD protection element 22 is placed in an injection mold containing an epoxy resin material; S6, by clamping the wafer die 21 and the ESD protection element 22 in the mold cavity forming. The plastic molding method is, for example, T mold or C mold.

However, the manufacturing process of the contact sensor 2 of the present invention is not limited to the above-listed steps and the order between the steps, and may be other suitable steps.

In some embodiments, the package of the above contact sensor 2 includes, for example, an LGA, BGA, QFN or the like. When the LGA or BGA package is used, the contact sensor 2 includes a circuit board; when the QFN package is used, the contact sensor 2 does not include a circuit board, but includes a lead frame disposed around the wafer die 21. Therefore, when the QFN packaging method is employed, the pads for fixing the static electricity protection element 22 are disposed on the lead frame.

It should be noted that the package body 23 in the above contact sensor 2 has a certain height to mold the wafer die 21 and the static electricity protection element 22. Of course, it can be modified that the package surface of the package 23 can also be substantially flush with the top of the electrostatic protection element 22. That is, the package height of the package 23 is equal to or slightly larger than the electrostatic protection element 22 the height of.

Further, the side surface S of the package body 23 away from the circuit board 20 is used to receive a contact or proximity input of an object, and the side surface S is defined as a sensing surface. When the object contacts or approaches the sensing surface, the ESD protection element 22 is closer to the object relative to the wafer die 21, so static electricity generated by the object will be directed to the ground through the ESD protection element 22, thereby preventing static electricity from entering the Wafer die 21 Damage to the wafer die 21 is caused.

In some embodiments, the number of the wafer dies 21 in the package body 23 may be one or two or more to achieve the corresponding functions. Correspondingly, the static electricity protection element 22 may be disposed for each of the wafer dies 21, or the plurality of wafer dies 21 may share the same static electricity protection element 22.

Further, referring to FIG. 7, FIG. 7 is a structure of an embodiment of a wafer die in the contact sensor of the present invention. The wafer die 21 includes a substrate 210 and a sensing unit 211 and a detecting circuit 212 formed on the substrate 210. The sensing unit 211 operates under the driving of the detecting circuit 212 to perform information sensing on the contact object. Taking the biometric information as an example, the sensing unit 211 includes, for example, one or more of an optical sensing unit, a capacitive sensing unit, and an ultrasonic sensing unit. The sensing unit 211 is of an array structure and includes a plurality of sensing devices arranged in a regular order, such as a matrix arrangement. Further, the sensing unit 211 further includes a circuit corresponding to the plurality of sensor devices, and the circuit is electrically connected to the detecting circuit 212.

Further, the substrate 210 described above is a semiconductor substrate such as a silicon circuit board or other suitable circuit board. The wafer die 21 is formed by forming the sensing unit 211 and the detecting circuit 212 on the semiconductor substrate. The wafer die is fabricated separately and then mounted on the circuit board 20.

For further reference, please refer to FIG. 8. FIG. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. An electronic device 3 according to an embodiment of the present invention, comprising the contact sensor 2 of any of the above embodiments, not only realizes sensing of object information contacting or approaching the contact sensor 2, but also realizing static electricity generated by the object. The purpose of venting.

Specifically, the electronic device 3 is, for example, a consumer electronic product or a home-based electronic product or a vehicle-mounted electronic product. Among them, consumer electronic products such as mobile phones, tablets, notebook computers, desktop monitors, computer integrated machines and other electronic products using biometric identification technology. Home-based electronic products such as smart door locks, televisions, refrigerators, wearable devices and other electronic products that use biometric technology. Vehicle-mounted electronic products such as car navigation systems, car DVDs, etc.

In the example of FIG. 8, the electronic device 3 is a mobile phone, and the front surface of the mobile phone is provided with a touch screen and a display device 31, and the contact sensor 2 is disposed under the front cover of the electronic device 3. However, in other embodiments, the touch sensor 2 can also be disposed on the touch screen and the display device 31. In addition, the contact sensor 2 can also correspond It is disposed at a suitable position on the front side, the back side, and the side of the electronic device 3, and can expose the outer surface of the electronic device 3, for example, the opening of the electronic device housing, or can be disposed inside the electronic device 3 and adjacent to the outer casing. For example, it is located inside the outer casing.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. The specific features, structures, materials or characteristics described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

While the embodiments of the present invention have been shown and described above, it is understood that the foregoing embodiments are illustrative and are not to be construed as limiting the scope of the invention Variations, modifications, substitutions and variations of the embodiments described above are possible.

Claims

A touch sensor includes: a circuit board, a die dies disposed on the circuit board, and at least one static electricity protection component disposed on the circuit board; the static electricity protection component is located on the wafer die Surrounding, and the ESD protection member has a tip that extends beyond the upper surface of the wafer die.
The touch sensor of claim 1 wherein said electrostatic protection element is a wire.
The contact sensor according to claim 2, wherein said electrostatic protection element is disposed on said circuit board by wire bonding.
The touch sensor of claim 1 wherein said ESD protection element is directly or indirectly connected to ground through said circuit board.
The touch sensor of claim 1 , wherein the circuit board is provided with two pads corresponding to the ESD protection component, the ESD protection component is connected to one pad at one end, and the other end of the ESD protection component is connected to Another pad.
The touch sensor of claim 1 wherein said static protection element comprises a plurality of and is distributed around said wafer die.
The contact sensor according to any one of claims 1 to 4, wherein the contact sensor further comprises a package for encapsulating the die, the ESD protection component, and filling the bare wafer a gap between the sheet and the electrostatic protection element.
The touch sensor of claim 7 wherein said circuit board is replaced by a lead frame if said package is in a QFN package.
The contact sensor according to claim 7, wherein a side surface of the package body away from the circuit board is used to receive a contact or proximity input of an object, and the wafer die is used for contact or proximity The object is being sensed by the information.
The contact sensor according to claim 11, wherein the object information sensed by the wafer die includes fingerprints, palm prints, ear prints, heart rate, blood oxygen, blood pressure, veins, body temperature, humidity, and pressure. one or more.
The touch sensor of claim 1 wherein said electrostatic protection element is arched or curved.
An electronic device comprising: a housing and a contact sensor disposed in or on the inside of the housing, and the contact sensor is the contact sensor according to any one of claims 1-11 .