WO2019081710A1

WO2019081710A1 - Waveguide assembly and associated assembly method

Info

Publication number: WO2019081710A1
Application number: PCT/EP2018/079413
Authority: WO
Inventors: Anthony Ghiotto; Frédéric PARMENT; Ludovic Carpentier; Vincent Armengaud
Original assignee: Université De Bordeaux; Institut Polytechnique De Bordeaux; Centre National De La Recherche Scientifique; Centre National D'etudes Spatiales
Priority date: 2017-10-27
Filing date: 2018-10-26
Publication date: 2019-05-02
Also published as: FR3073085A1; FR3073085B1

Abstract

This waveguide assembly comprises a receiving component (14) and an active electronic component (12). The receiving component (14) comprises a waveguide (16), the waveguide (16) defining a propagation zone (40) extending along a propagation axis, the waveguide (16) successively comprising, in a vertical direction that is orthogonal to the propagation axis, an upper layer (18), an upper intermediate layer, a central layer (22), a lower intermediate layer (24) and a lower layer (26), the receiving component (14) delimiting a receiving cavity (28) for receiving the active component (12), the active component (12) being received in the cavity (28), the cavity (28) being made through the upper layer (18) and the upper intermediate layer, and extending in the vertical direction from the central layer (22) up to an upper surface (42A) of the upper layer (18).

Description

Waveguide assembly and associated assembly method

The present invention relates to a waveguide assembly.

At present, an important problem of the telecom industry, millimeter radar for drones, autonomous cars and more generally any type of robot, is to reduce the losses in the systems drastically, on time where energy saving is essential for the applications of tomorrow. These loss levels are indeed prohibitive for equipment such as "front-end RF" equipment.

To reduce the losses, it is known to design passive electronic structures by using the technology of Vacuum Suspended Line (ESISL in English). The passive structure then forms a microwave transmission line.

In the context of the aforementioned industries, it is often necessary to interconnect an active component, that is to say a component requiring to operate an additional source of energy other than the input signal, to a passive structure.

To achieve the interconnection between the active component and the passive structure, it is known to provide a shielded outer housing to the passive structure and comprising the active component, and to connect this housing to the passive structure. The shielded housing makes it possible, among other things, to protect the active component from all or part of the external radiation and to ensure the electromagnetic compatibility with other circuits.

However, the shielded case containing the active component is expensive to manufacture, and the interconnection with the passive structure is complicated.

Document WO 2007/149046 discloses a waveguide assembly in which an electronic component is received within a cavity defined in an empty suspended line waveguide.

However, the whole does not give full satisfaction. In particular, such an assembly is likely to come into resonance in operation. The resonance leads to the appearance of resonance modes associated with parasitic frequencies which disturb the operation of the assembly, in particular when the assembly operates for millimeter wavelength signals.

An object of the invention is therefore to provide an assembly adapted to operate in the field of millimeter wavelengths, allowing easy interconnection of an active component in structures with low losses and low manufacturing costs, while protecting the active component of external radiation and ensuring good electromagnetic compatibility. For this purpose, the subject of the invention is a waveguide assembly comprising a reception component and an electronic active component received by the reception component,

the receiving component comprising a waveguide, the waveguide defining a propagation zone extending along an axis of propagation, the waveguide comprising successively, in a vertical direction orthogonal to the axis of propagation, at least one upper layer, one upper intermediate layer, one central layer, a lower intermediate layer, and a lower layer,

the upper intermediate layer defining an upper longitudinal cavity filled with a fluid or empty, the upper longitudinal cavity being closed by the upper layer and the central layer,

the lower intermediate layer defining laterally a lower longitudinal cavity filled with a fluid or empty, the lower longitudinal cavity being closed by the central layer and the lower layer,

the core layer comprising an electrically conductive line, the active component being electrically connected to the electrically conductive line; the receiving component defining a receiving cavity of the active component, the active component being received in the receiving cavity, the receiving cavity being arranged at least through the upper layer and the upper intermediate layer, and extending in the direction vertically from the central layer at least to an upper surface of the upper layer.

The assembly according to the invention may comprise one or more of the following characteristics, taken separately or in any technically possible combination:

- The receiving cavity is delimited by a bottom at least formed by the central layer, and is delimited transversely by two transverse walls perpendicular to the axis of propagation, formed at least by the upper layer and the upper intermediate layer;

the receiving component comprises at least a first additional layer arranged on the upper layer, the receiving cavity being further arranged at least through the first additional layer, and extending in the vertical direction from the central layer at least until an upper surface of the first additional layer;

- The receiving cavity is open laterally on at least one side;

the receiving cavity is open laterally on two opposite sides; - The receiving cavity is defined parallel to the axis of propagation by at least one side wall formed by at least the upper layer and the upper intermediate layer;

- The receiving cavity is defined parallel to the axis of propagation, on either side of the axis of propagation respectively, by at least one side wall formed by at least the upper layer and the upper intermediate layer;

the receiving cavity is blind in a vertical direction and open while opening opposite the central layer;

the receiving component comprises a closure layer of the receiving cavity, the closure layer covering the receiving cavity and being disposed at a distance from the central layer;

the closure layer comprises an electrically conductive upper sub-layer, a dielectric central sub-layer and an electrically conductive lower sub-layer;

the closure layer comprises a wave absorption sub-layer, the absorption sub-layer having an attenuation coefficient, for a wavelength between 0.1 μηι and 1 m, comprised between - 0.5 dB and -50 dB;

the closure layer further comprises an insulating sub-layer, the insulation sub-layer being electrically conductive and covering the absorption sub-layer in line with the receiving cavity;

in projection on a longitudinal plane, the receiving cavity has a greater dimension greater than 0.1 mm and less than 100 mm;

the receiving component comprises one or a plurality of other additional layers superimposed on the first additional layer, the receiving cavity being also arranged through the other one or more additional layer (s), and extending in the vertical direction from the center layer at least to an upper surface of one of the other additional layers;

the insulation sub-layer of the closure layer is made of metal;

in projection on a longitudinal plane, the active component has a larger dimension greater than 0.1 mm and less than 30 mm;

the active component is fixed to the receiving component, in particular to the central layer, by gluing or brazing;

the cavity comprises a single active component, the active component being selected from the group consisting of a low noise amplifier (LNA), a power amplifier (PA), a diode or a varactor diode, SSPA , a monolithic microwave integrated circuit (MMIC), a phase shifter, a variable gain amplifier, a limiter, a linearizer, a detector, a mixer, an active filter, and a flatness corrector;

the upper layer, the upper intermediate layer, the lower intermediate layer, and the lower layer each comprise an electrically conductive upper sub-layer, a dielectric central sub-layer and an electrically conductive lower sub-layer;

the central layer comprises a dielectric central sub-layer on which the electrically conductive line is disposed;

the electrically conductive line has a width, taken in a transverse direction, smaller than the widths of the longitudinal cavities of upper and lower propagation, a portion of dielectric being interposed between the electrically conductive line and lateral edges of one of the longitudinal cavities of upper and lower propagation on both sides of the electrically conductive line;

the receiving component comprises a decoupling and supply circuit of the active component, the decoupling and supply circuit being arranged in at least one of the layers of the receiving component;

the decoupling and supply circuit is laterally projecting with respect to the receiving cavity;

the decoupling and supply circuit is arranged on one of the layers of the reception component;

the decoupling and supply circuit is at least partially arranged on a layer of the reception component, distinct from the central layer, the circuit comprising electrically conductive wires or through vias the layers of the reception component up to the central layer, for electrically connecting the circuit to the active component;

the decoupling and supply circuit is arranged in the receiving cavity for part or in whole, and;

the waveguide assembly further comprises a microwave component of the transmission line type integrated into the substrate, said microwave component being connected to the receiving component and comprising at least one upper layer, one central layer and one layer; lower part defining an auxiliary zone of propagation of an electromagnetic wave.

The invention also relates to a method for assembling a waveguide assembly comprising the following steps:

- supply of an electronic active component; supply of a reception component, the reception component comprising a waveguide, the waveguide extending along an axis of propagation and comprising at least one upper layer, one upper intermediate layer, one central layer, a lower intermediate layer, and a lower layer, the upper intermediate layer defining an upper longitudinal cavity filled with a fluid or empty, the upper longitudinal cavity being closed by the upper layer and the central layer, the lower intermediate layer defining laterally a lower longitudinal cavity filled with a fluid or empty, the lower longitudinal cavity being closed by the central layer and the lower layer, the central layer comprising an electrically conductive line, the receiving component defining a receiving cavity of the active component, the receiving cavity being arranged at least through the upper layer and the upper intermediate layer, and extending orthogonally to the core layer from the core layer at least to an upper surface of the upper layer, the electronic active component being away from the receiving component, and;

inserting the active component into the receiving cavity of the receiving component, so that the active component is electrically connected to the electrically conductive line of the central layer, to form a waveguide assembly as defined above.

The assembly method according to the invention may comprise one or more of the following characteristics, taken separately or in any technically possible combination:

the method comprises a step of supplying the waveguide of the reception component with an electromagnetic wave having a predetermined wavelength, the electromagnetic wave being converted into an input signal for the active component, the reception cavity; having, in projection on a longitudinal plane, a greater dimension less than 10 times said predetermined wavelength; and

the predetermined wavelength of the electromagnetic wave is less than 500 mm.

The invention will be better understood on reading the description which follows, given solely by way of example, and with reference to the appended drawings, in which:

- Figure 1 is a schematic sectional view of a first waveguide assembly according to the invention;

FIGS. 2 and 3 are diagrammatic perspective views respectively of side and face of the assembly of FIG. 1; FIG. 4 is a schematic view from above of the first set of FIG.

1;

FIG. 5 is a schematic side perspective view of a second waveguide assembly according to the invention;

FIG. 6 is a schematic view from above of the second set of FIG. 5;

FIG. 7 is a diagrammatic side perspective view of a third waveguide assembly according to the invention, and

- Figures 8 to 10 are respectively schematic sectional views of a fourth, a fifth and a sixth waveguide assemblies according to the invention.

A first waveguide assembly 10A according to the invention is illustrated in the figures

1 to 4.

The first set 10A comprises an electronic active component 12 and a receiving component 14, the electronic active component 12 being received by the receiving component 14.

Active component 12, illustrated in FIG. 1, is an electronic component capable of receiving an input signal and typically capable of providing an output signal.

For the sake of clarity, the active component 12 has not been shown in FIGS. 2 to 4.

Active component 12 differs from a passive electronic component.

Typically, a passive component requires no additional power source other than the input signal to operate, i.e. to produce an output signal. In particular, a passive component does not contain any source of energy capable of adding energy to the input signal to operate. The electrical power of the output signal is thus less than or equal to the electrical power of the input signal.

A passive component is for example a resistor, a capacitor, a coil, an antenna, a passive filter, a coupler, a power divider, or a passive phase shifter.

An active component 12 requires an additional power source other than the input signal to operate, i.e. to produce an output signal.

The active component 12 of FIG. 1 is for example chosen from the group consisting of a low-noise amplifier (so-called LNA in English), a power amplifier (called PA), a diode or a varactor diode, SSPA, a circuit integrated monolithic microwave (dit MMIC), a phase-shifter, an amplifier variable gain, a limiter, a linearizer, a detector, a mixer, an active filter, and a flatness corrector.

The elements of this group are typically circuits made in technology III-V (GaAs type or GAN for example) or silicon (CMOS type or Bi-CMOS for example) or carbon (graphene, or CNFET for example).

The active component 12 here has a larger dimension greater than 0.1 mm and less than 30 mm.

The active component 12 is fixed to the receiving component 14 by gluing or brazing, such as in "flip-chip" type assemblies.

The receiving component 14 of the first set 10A comprises a waveguide 16 comprising successively at least one upper layer 18, an upper intermediate layer 20, a central layer 22, a lower intermediate layer 24, and a lower layer 26.

The receiving component 14 delimits a receiving cavity 28 of the active component 12, the active component 12 being received in the receiving cavity 28.

The receiving component 14 here comprises a first additional layer 30 and an additional second layer 32 superimposed on the upper layer 18 of the waveguide 16.

It also comprises a decoupling and supply circuit 34 of the active component 12.

The waveguide 16 is of type "suspended line empty".

The waveguide 16 extends along an X-X propagation axis. Subsequently, a longitudinal plane will designate a plane parallel to the axis of propagation and to the layers 18, 20, 22, 24 and 26. In addition, the term "longitudinal direction" will be used to designate a direction parallel to the axis of propagation.

In addition, the term "transverse", a plane orthogonal to the axis of propagation, and a direction orthogonal to the axis of propagation and contained in a longitudinal plane.

In addition, the term "lateral" a plane parallel to the axis of propagation and orthogonal to a longitudinal plane.

The waveguide 16 is adapted to guide an electromagnetic wave along the axis of propagation X-X, between an input 36 and an output 38.

In one embodiment, the electromagnetic wave has at least one predetermined wavelength. The predetermined wavelength of the electromagnetic wave is advantageously included in an operating bandwidth, the operating bandwidth having a wavelength predetermined maximum and a predetermined minimum wavelength. The predetermined maximum wavelength is typically less than 1 m, preferably less than 500 mm. The predetermined minimum wavelength is typically between 0.1 μηι and 1 m, preferably between 0.1 μηι and 500 mm.

As illustrated in Figures 1 to 3, the waveguide 16 defines a propagation zone 40 of the electromagnetic wave extending in a longitudinal direction.

Each of the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 extends in an XY plane defined by the propagation axis XX and by a transverse axis YY, orthogonal to the axis of propagation XX. The transverse axis Y-Y is in particular for example parallel to an upper surface of the upper layer 18.

In the remainder of the description, the term "width" will be understood in a direction parallel to the transverse axis Y-Y.

In addition, the receiving component 14 comprises a Z-Z axis orthogonal to the X-X propagation axis and to the Y-Y transverse axis. The thickness of each of the waveguide layers 16 is typically taken along the Z-Z axis orthogonal to the X-X propagation axis and the Y-Y transverse axis.

In what follows, will be designated by "vertical" a direction parallel to the Z-Z axis. The terms "above", "below", "above" and "below" will be to be understood relative to a vertical direction.

The upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 form a stack.

Each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 respectively has an upper surface 42A, 42B, 42C, 42D that is electrically conductive and, respectively, a lower surface 44A, 44B, 44C, 44D electrically conductive. In addition, the central layer 22 has an upper surface 42E and a lower surface 44E.

The lower surface 44A of the upper layer 18 is in contact with the upper surface 42B of the upper intermediate layer 20. The lower surface 44B of the upper intermediate layer 20 is in contact with the upper surface 42E of the central layer 22. The surface bottom 44E of the central layer 22 is in contact with the upper surface 42C of the lower intermediate layer 24. The lower surface 44C of the lower intermediate layer 24 is in contact with the upper surface 42D of the lower layer 26. In a preferred embodiment, each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 forms a substrate.

Preferably, each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 thus comprises respectively an electrically conductive upper sub-layer 46, a central dielectric underlayer 48 and an electrically conductive lower sub-layer 50, the central dielectric underlayer 48 being interposed between the upper sub-layer 46 and the lower sub-layer 50.

Subsequently, the term "electrically conductive element" means that said element has an electrical conductivity greater than 1 ^* 10 ⁶ S. m- ¹ , preferably equivalent to that of a metal of the copper, silver or aluminum type.

Subsequently, the term "dielectric element" means that said element has a relative dielectric permittivity greater than or equal to 1.

The upper sub-layer 46 and the lower sub-layer 50 of each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 are for example made of copper.

The central sub-layer 48 of each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 is for example made of epoxy resin, or Teflon.

The central layer 22 comprises an electrically conductive line 52 and a dielectric central sub-layer 54.

In the example of FIGS. 1 to 3, the electrically conductive line 52 is disposed on said central dielectric sub-layer 54, extending along a longitudinal direction. In particular, the electrically conductive line 52 is disposed between the upper layer 18 and the central dielectric sub-layer 54 of the central layer 22, along a longitudinal direction.

The electrically conductive line 52 extends parallel to the axis of propagation X-X, in a longitudinal plane.

The active component 12 is fixed for example to the central layer 22, and is electrically connected to the electrically conductive line 52, at transitions 56.

At said transitions 56, the electromagnetic wave propagating in the waveguide 16 is adapted to be converted into an input signal for the active component 12. The propagation zone 40 corresponds to a zone of the waveguide 16 in which the electromagnetic wave is confined during its propagation in the waveguide 16.

The propagation zone 40 comprises an upper longitudinal cavity 58 and a lower longitudinal cavity 60.

The propagation zone 40 is delimited laterally by lateral boundaries

62.

The electrically conductive line 52 is disposed in the propagation zone 40, in particular in the upper longitudinal cavity 58.

The upper longitudinal cavity 58 is defined in the upper intermediate layer 20 and is closed by the upper layer 18 and the central layer 22.

It is filled with a fluid, for example air. Alternatively, in the case where the upper longitudinal cavity 58 defines a sealed closed volume, it is filled with air, nitrogen or is empty of fluid. It is especially empty of fluid for example in the case of a spatial application of the waveguide assembly. It can also be filled with foam or a material that does not interfere with the propagation wave. Said foam or material not interfering with the propagation wave typically has a zero attenuation coefficient, for a wavelength between 0.1 μηι and 1 m, for example a relative permittivity substantially equal to 1 and preferably a delta tangent of less than 0.001. Said foam or material that does not interfere with the propagation wave is, for example, expanded foam of polystyrene or teflon.

The upper longitudinal cavity 58 is in particular delimited by the lower surface 44A of the upper layer 18, the upper surface 42E of the central layer 22 and the lateral edges 64 defined by the upper intermediate layer 20.

As illustrated in FIG. 3, the electrically conductive line 52 here has a width, taken in a transverse direction, smaller than the width of the upper longitudinal cavity 58. In addition, a portion of dielectric 66 is advantageously interposed between the electrically conductive line. 52 and the lateral edges 64 of the upper longitudinal cavity 58 on either side of the electrically conductive line 52.

As illustrated in FIG. 1, the upper longitudinal cavity 58 opens into the receiving cavity 28.

The lower longitudinal cavity 60 is defined in the lower intermediate layer 24 and is closed by the central layer 22 and the lower layer 26.

It is filled with a fluid, for example air. As a variant, in the case where the lower longitudinal cavity 60 defines a sealed closed volume, it is filled with air, nitrogen or is empty of fluid. It is especially empty of fluid for example in the case of a spatial application of the waveguide assembly. It can also be filled with foam or a material that does not interfere with the propagation wave. Said foam or material not interfering with the propagation wave typically has a zero attenuation coefficient, for a wavelength between 0.1 μηι and 1 m, for example a relative permittivity substantially equal to 1 and preferably a delta tangent of less than 0.001. Said foam or material that does not interfere with the propagation wave is, for example, expanded foam of polystyrene or teflon.

The lower longitudinal cavity 60 is in particular delimited by the lower surface 44E of the central layer 22, the upper surface 42D of the lower layer 26 and the lateral edges 68 defined by the lower intermediate layer 24.

The width of the electrically conductive line 52 is smaller than the width of the lower longitudinal cavity 60.

As illustrated in FIG. 1, at the right of the receiving cavity 28, the lower longitudinal cavity 60 is longitudinally interrupted by the lower intermediate layer 24.

In other words, the lower intermediate layer 24 extends to the right of the receiving cavity 28. In projection on a longitudinal plane, the lower intermediate layer 24 covers the receiving cavity 28.

The upper and lower longitudinal cavities 58 and 58 have a constant width along a longitudinal direction.

The upper and lower longitudinal cavities 58 and 58 have the same width.

The lateral boundaries 62 of the propagation zone 40 are adapted to prevent the passage of an electromagnetic wave having a wavelength greater than or equal to the predetermined minimum wavelength.

The lateral boundaries 62 are orthogonal to the lower surface 44A of the upper layer 18 and to the upper surface 42D of the lower layer 26.

The lateral boundaries 62 are disposed at a distance from the lateral edges 64, 68 of the upper and lower longitudinal cavities 58 and 60. In other words, a part of the upper intermediate layer 20 is interposed between the lateral boundaries 62 and the lateral edges 64 of the upper longitudinal cavity 58, and a portion of the lower intermediate layer 24 is interposed between the lateral boundaries 62 and the lateral edges 68 of the lower longitudinal cavity 60. In the example of FIGS. 2 to 4, the lateral boundaries 62 of the propagation zone 40 each have a slot shape in projection on a longitudinal plane.

Each lateral border 62 is thus formed by a first sub-border 70, a second sub-border 72 and a third sub-border 74 longitudinal, the second sub-border 72 being respectively connected to the first sub-border 70 and the third sub-border 74 by a fourth sub-border 76 and a fifth sub-border 78 transverse.

The distance between the second sub-borders 72 of the two lateral boundaries 62 is greater than the distance between the two first sub-borders 70 of said two lateral boundaries 62.

In projection on a transverse plane, the respective distances between the first sub-borders 70 of the lateral boundaries 62 and the electrically conductive line 52 are equal.

In projection on a transverse plane, the distance between the second sub-border

72 of one of the lateral boundaries 62 and the electrically conductive line 52 is smaller than the distance between the second sub-border 72 of the other of the lateral boundaries 62 and the electrically conductive line 52.

In projection on a transverse plane, the respective distances between the third subframes 74 of the lateral boundaries 62 and the electrically conductive line 52 are equal.

The second sub-borders 72 of the two lateral boundaries 62 are located on either side of the receiving cavity 28.

The lateral boundaries 62 thus surround the receiving cavity 28.

In projection on a lateral plane, the fourth sub-borders 76 of the two lateral borders 62 are superimposed.

Similarly, in a projection on a lateral plane, the fifth sub-borders 78 of the two lateral boundaries 62 are superimposed.

In an exemplary embodiment, each lateral boundary 62 comprises a row of electrically conductive vias (not shown in the figures), arranged through the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26.

By "via" means a hole, arranged at least through one of the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 , the hole presenting walls covered with an electrically conductive coating, for example a coating made of metal.

Each via extends along a vertical axis.

The vias typically have a section along a longitudinal plane of round or rectangular shape.

In the example of FIG. 2, each via passes through each of the layers 18, 20, 22, 24, 26 of the waveguide 16.

The spacing between two successive vias of the same row is less than the predetermined minimum wavelength, for example less than or equal to one fifth of the predetermined minimum wavelength.

At the right of the receiving cavity 28, the rows of vias of the lateral boundaries 62 of the propagation zone 40 pass through only the central layer 22, the lower intermediate layer 24 and the lower layer 26.

The first additional layer 30 and the second additional layer 32 of the receiving component 14 each extend in a longitudinal plane.

The first additional layer 30 is arranged on the upper layer 18 of the waveguide 16 and the second supplementary layer 32 is arranged on the first additional layer 30.

The additional layers 30, 32, the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 form a stack in at least one region of the receiving component 14.

The first additional layer 30 and the second supplementary layer 32 each respectively have an electrically conductive upper surface 80A, 80B and an electrically conductive lower surface 82A, 82B.

The lower surface 82B of the second additional layer 32 is in contact with the upper surface 80A of the first additional layer 30. The lower surface 82A of the first additional layer 30 is in contact with the upper surface 42A of the upper layer 18.

In a preferred embodiment, each additional layer 30, 32 forms a substrate.

Each additional layer 30, 32 thus comprises respectively an electrically conductive upper sub-layer 84A, 84B, a dielectric central sub-layer 86A, 86B and an electrically conductive lower sub-layer 88A, 88B, the dielectric central sub-layer 86A, 86B being interposed between the upper sub-layer 84A, 84B and the lower sub-layer 88A, 88B. The upper sub-layer 84A, 84B and the lower sub-layer 88A, 88B of each additional layer 30, 32 are for example made of copper.

The central sub-layer 86A, 86B of each additional layer 30, 32 is for example made of epoxy resin, or Teflon.

Each additional layer 30, 32 extends respectively between a front edge

90A, 90B and a trailing edge 92A, 92B, the leading edge 90A, 90B and the trailing edge 92A, 92B extending in a transverse plane. By "edge" is meant a face of a layer, such that all said layer is disposed on one side of said face.

The additional layers 30, 32 have substantially equal lengths. By "length" is meant here the distance, taken along a longitudinal direction, between the leading edge 90A, 90B and the trailing edge 92A, 92B.

In the example illustrated in the figures, the length of each additional layer 30, 32 is less than the length of the layers of the waveguide 16. In other words, the receiving component 14 comprises a region devoid of additional layers As a variant, the length of each additional layer 30, 32 is equal to the length of the layers of the waveguide 16.

In the example of FIG. 2, to the right of the additional layers 30, 32, each via of each lateral border 62 passes further through the additional layers 30, 32.

The receiving cavity 28 is formed through the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32.

It extends orthogonally to the central layer 22, in a vertical direction, from the central layer 22 to the upper surface 80B of the second additional layer 32.

The receiving cavity 28 is delimited by a bottom 94 at least formed by the central layer 22, and is delimited transversely by two transverse walls 96 formed by the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32.

In projection on a longitudinal plane, the transverse walls 96 each form a hollow 98 defined in the additional layers 30, 32, the upper layer 18 and the upper intermediate layer 20.

The hollows 98 are arranged facing one another.

More precisely, each depression 98 is formed by a first surface 100 and a second lateral surface 102, and by a third transverse surface 104 joining the first and the second surface 102. As illustrated in FIGS. 2 and 4, the first surface 100 and the second surface 102 are, for example, respectively aligned and flush with the lateral edges 64 of the upper longitudinal cavity 58.

The recesses 98 make it possible to free up space for mounting the active component 12.

In the example of Figures 2 to 4, the receiving cavity 28 is open laterally on two opposite sides.

It presents, in projection on a longitudinal plane, an open contour.

In particular, in this example, the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second supplementary layer 32 are interrupted over all their respective widths.

In the example of Figures 2 to 4, the receiving cavity 28 is blind in a vertical direction. In particular, it is open by opening opposite the central layer 22 in a vertical direction.

The decoupling and supply circuit 34 is suitable for supplying the active component 12 with voltage. For example, the decoupling and supply circuit 34 is adapted to supply the active component 12 with a direct current signal or a signal having a frequency preferably of less than 100 MHz. For this, the decoupling and supply circuit 34 is typically connected to an external power source not shown.

The active component 12 is thus electrically connected to the decoupling and supply circuit 34.

Preferably, the circuit 34 is further able to control the active component 12. By "control" is meant that the active component 12 is able to pass at least a first electrical state to a second electrical state, the circuit 34 being able to emit a control signal capable of passing the active component 12 from the first electrical state to the second electrical state. The control signal typically has a frequency below 100 MHz.

Advantageously, the circuit 34 is able to provide a decoupling function of the active component 12 with respect to the external current source. By "decoupling function" is meant that the circuit 34 is able to filter a current from the external current source or the active component.

As illustrated in FIGS. 2 to 4, the decoupling and supply circuit 34 is arranged at least partly in the receiving cavity 28.

It is here laterally protruding with respect to the receiving cavity 28. The circuit 34 projects in particular with respect to a lateral edge of the layers 18, 20, 22, 24, 26, 30, 32 of the reception component 14. In other words, the central layer 22 has a width, taken at the level of the circuit 14, greater than the maximum width presented by the upper intermediate layer 20 and the upper layer 18.

In a variant not shown, the decoupling and supply circuit 34 is arranged integrally in the receiving cavity 28. In another preferred variant, not shown, the layers 18, 20, 22, 24, 26, 30, 32 of the 14 all have an equal width, for example constant, along the axis of propagation XX.

The decoupling and supply circuit 34 is arranged in at least one of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14.

In the example illustrated in FIGS. 2 to 4, the decoupling and supply circuit 34 is arranged on the central layer 22. In a variant, the decoupling and supply circuit 34 is arranged on another layer 18, 20 , 24, 26, 30, 32 of the receiving component 14, preferably on the upper layer 18 or on the lower layer 26, the circuit 34 then typically comprising electrically conductive wires or vias through the layers of the receiving component 14 until to the central layer 22, for electrically connecting the circuit 34 to the active component 12. In yet another variant, a first portion of the decoupling and supply circuit 34 is arranged on one of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14, and a second portion is provided on another of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14, the circuit 34 then typically comprising electrically conduc or through vias the layers of the receiving component 14 for electrically connecting the first portion and the second portion of the circuit 34.

A method of assembling the first waveguide assembly 10A will now be described.

The method comprises the provision of the electronic active component 12 described above, and the supply of the reception component 14 described above, the electronic active component being disposed away from the receiving component 14.

For example, the step of providing the receiving component 14 comprises providing each of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14, each layer 18, 20, 22, 24, 26 , 30, 32 then being arranged apart from one another and without a receiving cavity 28 of the active component 12. The step of providing the receiving component 14 comprises assembling the lower layer 26, the lower intermediate layer 24 and the central layer 22, during which the central layer 22 is fixed to the lower intermediate layer 24, and the lower intermediate layer 24 is fixed to the lower layer 26.

These layers 22, 24, 26 are fixed for example by fixing screws, by rivets, by stirring, by a conductive or non-adhesive film, by thermocompression or by prepreg for example. In a variant or this assembly involves an insulator for joining the layers 22, 24, 26, then an electrical contact between the layers 22, 24, 26 is provided by vias through conductors.

The active component 12 is then fixed on the central layer 22 by gluing or brazing.

The active component 12 is electrically connected to the electrically conductive line 52, at the level of the transitions 56.

The step of providing the receiving component 14 then comprises the assembly of the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second supplementary layer 32, during which the second supplementary layer 32 is attached to the first additional layer 30, the first additional layer 30 is attached to the upper layer 18, and the upper layer 18 is attached to the upper intermediate layer 20.

These layers 18, 20, 30, 32 are fixed in a manner similar to the layers 22, 24,

26.

The step of supplying the receiving component 14 then further comprises a step of cutting the receiving cavity 28 of the active component 12 through the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32.

This cutting step is for example implemented by laser or milling. The step of providing the receiving component 14 further comprises a step of mounting the layers of the receiving component 14, during which the active component 12 is inserted into the receiving cavity 28 and the upper intermediate layer 20 is fixed. at the central layer 22.

Subsequently, a plurality of vias are arranged in rows through each of the layers 18, 20, 22, 24, 26, 30, 32 to form said side boundaries 62.

The first waveguide assembly 10A described above is then formed.

Subsequently, the active component 12 is supplied with voltage and controlled by the decoupling and supply circuit 34. The method further comprises a step of supplying the waveguide 16 of the reception component 14 with an electromagnetic wave at the input 36 of the waveguide, the electromagnetic wave typically having a predetermined wavelength preferably comprised in operating bandwidth.

The predetermined wavelength of the electromagnetic wave is advantageously less than 500 mm.

The receiving cavity 28 has, in projection on a longitudinal plane, a larger dimension less than 10 times said predetermined wavelength.

The electromagnetic wave propagates in particular on the electrically conductive line 52.

At the level of the transitions 56, the electromagnetic wave propagating in the waveguide 16 is converted into an input signal for the active component 12.

The active component 12 provides an output signal which is guided by the waveguide 16 to the output 38 of the waveguide 16.

Alternatively, the electromagnetic wave guided by the waveguide 16 is a continuous signal having a zero frequency. In yet another variant, the electromagnetic wave guided by the waveguide 16 is the sum of a continuous signal having a zero frequency and a signal having the predetermined wavelength.

In addition not shown to the first waveguide assembly 10A, the receiving component 14 comprises a plurality of additional vias passing through the central layer 22, the lower intermediate layer 24 and the lower layer 26, arranged below the receiving cavity 28. .

The additional vias are arranged away from the rows of vias of the lateral boundaries 62.

The additional vias are made of metal and are thermally conductive. In operation, they cool the active component 12 by conducting the heat produced by the active component 12.

As a variant of the first waveguide assembly 10A, each lateral boundary 62 of the propagation zone 40 comprises a row of vias per layer of the waveguide 16, said rows of vias being aligned or not.

In another variant, each lateral border 62 comprises a number of rows of vias smaller than the number of layers of the waveguide 16, the rows of vias being aligned or not. At least one of said rows of vias then passes through a plurality of layers of the waveguide 16. As a variant of the first waveguide assembly 10A, the electrically conductive line 52 is disposed between the dielectric central sub-layer 54 of the central layer 22 and the lower layer 26, along a portion of the central layer 22 in accordance with a longitudinal direction.

In another variant not shown, the electrically conductive line 52 is alternately arranged between the central dielectric sub-layer 54 of the central layer 22 and the lower layer 26 and between the central dielectric sub-layer 54 of the central layer 22 and the layer upper 18 along a longitudinal direction.

In yet another variant not shown, the electrically conductive line 52 is disposed between the central dielectric sub-layer 54 and the upper layer 18 in a longitudinal direction, and the central layer 22 further comprises a second electrically conductive line disposed between the sub-layer dielectric central layer 54 and the lower layer 26 in a longitudinal direction, the electrically conductive line 52 and the second electrically conductive line being electrically connected to each other by conducting vias passing through the central dielectric sub-layer 54.

In yet another variant not shown, the central layer 22 is devoid of dielectric portion 66, or the dielectric portion 66 is interposed between the electrically conductive line 52 and only one of the lateral edges 64, 68 of one of the longitudinal cavities of upper propagation 58 and lower 60.

As a variant of the first waveguide assembly 10A, the receiving component 14 comprises a single additional layer. The receiving cavity 28 then extends orthogonally to the central layer 22 from the central layer 22 to an upper surface of said additional layer.

In another variant, the receiving component 14 comprises a number of additional superposed layers greater than two. The receiving cavity 28 then extends orthogonally to the central layer 22 from the central layer 22 to an upper surface of one of the additional layers, in particular to an upper surface of the additional layer farthest from the central layer 22.

In addition to the first waveguide assembly 10A, the waveguide assembly further comprises a microwave component (not shown) of the transmission line type integrated into the substrate.

The microwave component is connected to the receiving component 14 and comprises at least one upper layer, one core layer, and one lower layer defining an auxiliary electromagnetic wave propagation zone. The auxiliary propagation zone and the propagation zone 40 are connected. By "connected" is meant that an electromagnetic wave confined in the auxiliary propagation zone and propagating in said auxiliary zone is adapted to propagate in the propagation zone 40 of the reception component 14.

The waveguide assembly 10A is then compact and flexible.

A second waveguide assembly 10B is illustrated in Figures 5 and 6.

The second waveguide assembly 10B differs from the first set 10A in that the receiving cavity 28 is not open laterally on two opposite sides.

The receiving cavity 28 is closed laterally on a first side 106.

As illustrated in FIG. 5, on this first side 106, the receiving cavity 28 is thus delimited, parallel to the propagation axis XX, by a first lateral wall 108 formed here by the additional layers 30, 32, the upper layer 18 and the upper intermediate layer 20.

In this example, the receiving cavity 28 is open laterally on a second side 1 10. The receiving cavity 28 has, however, in projection on a longitudinal plane, a closed contour.

The second side 1 10 is in this example, a side of the receiving cavity 28 with respect to which the decoupling and supply circuit 34 is laterally projecting.

More precisely, the receiving cavity 28 is open laterally on this second side 1 10 at the level of the upper intermediate layer 20.

On this second side 1 10, the receiving cavity 28 is thus delimited, parallel to the axis of propagation XX, by a second side wall 1 12 formed by the additional layers 30, 32 and the upper layer 18, the upper intermediate layer. 20 having a through hole 1 14 in a transverse direction.

Said through hole 1 14 has a height equal to the thickness of the upper intermediate layer 20.

The first side wall 108 and the second side wall January 12 are parallel.

The maximum width of the receiving cavity 28, taken in a transverse direction, between the first side wall 108 and the second side wall January 12, is greater than the width of each of the longitudinal cavities of upper propagation 58 and lower 60.

The difference between the second sub-borders 72 of two lateral boundaries 62 is greater than said maximum width of the reception cavity 28.

The receiving cavity 28 has, in projection on a longitudinal plane, a larger dimension greater than 0.1 mm and less than 100 mm. In projection on a transverse plane, the distance between the first side wall 108 and the electrically conductive line 52 is smaller than the distance between the second side wall 1 12 and the electrically conductive line 52.

A method of assembling the second waveguide assembly 10B has substantially identical steps to the steps of the method of assembling the first assembly 10A.

A third waveguide assembly 10C according to the invention is illustrated in FIG.

7.

This third waveguide assembly 10C differs from the second waveguide assembly 10B in that the receiving cavity 28 is closed laterally on two opposite sides.

The receiving cavity 28 has, in projection on a longitudinal plane, a closed contour.

In particular, the second side wall 12 defining the receiving cavity 28 is formed by the additional layers 30, 32, the upper layer 18, and the upper intermediate layer 20.

Each of the additional layers 30, 32, of the upper layer 18, and of the upper intermediate layer 20 has no through orifice in a direction transverse to the level of the receiving cavity 28.

The first side wall 108 and the second side wall 12 thus extend vertically, without interruption, from the central layer 22 to the upper surface 80B of the second supplementary layer 32.

Thus, the receiving cavity 28 is delimited laterally, on either side of the X-X propagation axis respectively, by the first lateral wall 108 and the second lateral wall January 12.

A method of assembling the third waveguide assembly 10C has substantially identical steps to the steps of the method of assembling the first assembly 10A.

A fourth waveguide assembly 10D according to the invention is illustrated in FIG. 8.

This fourth waveguide assembly 10D differs from the third waveguide assembly 10C in that the receiving cavity 28 is not blind in a vertical direction and is not open opposite to the central layer 22 according to a vertical direction. The receiving cavity 28 is closed laterally on either side of the propagation axis XX, and is closed vertically on either side of the X-X propagation axis.

The reception component 14 then comprises a closure layer 1 16 of the receiving cavity 28.

The closure layer 1 16 covers the receiving cavity 28 and is spaced apart from the central layer 22.

In projection on a longitudinal plane, the closure layer 1 16 covers the entire receiving cavity 28.

The closure layer 1 16 extends in a longitudinal plane.

It is arranged on the second supplementary layer 32.

The closure layer 1 16, the additional layers 30, 32, the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 form a stack, in at least one region of the reception component 14.

The closure layer 1 16 has an electrically conductive upper surface 1 18 and an electrically conductive lower surface 120.

The lower surface 120 of the closure layer 1 16 is in contact with the upper surface 80B of the second additional layer 32.

In a preferred embodiment, the closure layer 116 forms a substrate.

In the fourth waveguide assembly 10D, the closure layer 1 16 comprises an electrically conductive upper sub-layer 122, a dielectric central sub-layer 124 and an electrically conductive lower sub-layer 126, the dielectric central sub-layer 124 being interposed between the upper sub-layer 122 and the lower sub-layer 126.

The upper sub-layer 122 and the lower sub-layer 126 of the closure layer 1 16 are for example made of copper.

The central sub-layer 124 of the closure layer 1 16 is for example made of epoxy resin, or Teflon.

The closure layer 1 16 extends in a longitudinal direction between a transverse front edge 128 and a trailing edge 130.

The leading edge 128 and the trailing edge 130 of the closure layer 1 16 are respectively flush with the leading edges 90A, 90B and the trailing edges 92A, 92B of the additional layers 30, 32. The lateral boundaries 62 extend up to the closure layer 1 16. In particular, the vias of each lateral boundary line 62 further pass through the closure layer 1 16.

In the fourth waveguide assembly 10D, the dimensions of the cavity are chosen so that in operation, the receiving cavity 28 has resonance modes associated with parasitic wavelengths, parasitic wavelengths. being outside said operating bandwidth.

A method of assembling the fourth waveguide assembly 10D will now be described.

This assembly method differs from the assembly method of the first waveguide assembly 10A in that it further comprises a step of supplying the closure layer 1 16, the closure layer 1 16 being disposed at the distance from the waveguide 16.

Following the step of mounting the layers of the receiving component 14, the method then comprises the application of the closure layer 1 16 to the second additional layer 32.

The closure layer 1 16 is then fixed on the second additional layer 32, this attachment being for example made by bonding with an electrically conductive adhesive or prepreg (prepreg), or solder.

This fixing step is performed before the step of arranging the plurality of vias. Subsequently, the plurality of vias are arranged in rows through each of the layers 18, 20, 22, 24, 26, 30, 32 and further through the closure layer 1 16 to form said side boundaries 62.

In addition, this assembly method differs from the assembly method of the first assembly 10A in that, during the step of cutting the receiving cavity 28, the receiving cavity 28 is cut to present selected dimensions of such so that in operation, the receiving cavity 28 has resonance modes associated with parasitic wavelengths, the parasitic wavelengths being outside said operating bandwidth.

In variant not shown of the fourth waveguide assembly 10D, the closure layer 1 16 further comprises an absorption sub-layer having an attenuation coefficient, for a wavelength of between 0.1 μηι and 1 m, between -0.5 dB and -50 dB.

The absorption sub-layer is disposed integrally in the receiving cavity 28 between the active component 12 and the first additional layer 30. It is attached to the first additional layer 30. It is away from the transverse walls 96 and the side walls 108, 1 12 of the receiving cavity 28.

The absorption sub-layer is not interposed between the first additional layer 30 and the upper layer 18.

A fifth waveguide assembly 10E according to the invention is illustrated in FIG.

9.

This fifth waveguide assembly 10E differs from the fourth waveguide assembly 10D in that the closure layer 1 16 is not formed by an electrically conductive upper sub-layer, a dielectric core sub-layer and a sub-layer. electrically conductive lower layer.

In the fifth waveguide assembly 10E, the closure layer 1 16 comprises a wave absorbing sub-layer 132 and an insulation sub-layer 134.

The absorption sub-layer 132 has an attenuation coefficient, for a wavelength between 0.1 μηι and 1 m, between -0.5 dB and -50 dB.

In projection on a longitudinal plane, the absorption sub-layer 132 covers the entire receiving cavity 28.

The absorption sub-layer 132 has a thickness, typically in a vertical direction, greater than 0.1 mm.

The insulation sub-layer 134 is electrically conductive.

It is typically made of metal, for example copper.

The absorption sub-layer 132 and the insulation sub-layer 134 respectively have an upper surface 136A, 136B and a lower surface 138A, 138B.

The insulation sub-layer 134 covers the absorption sub-layer 132 at the right of the receiving cavity 28. In particular, in projection on a longitudinal plane, the insulation sub-layer 134 and the underlayer absorption 132 overlap and cover the entire receiving cavity 28.

The lower surface 138B of the insulation sub-layer 134 is in contact with the upper surface 136A of the absorption sub-layer 132. In addition, the lower surface 138A of the absorption sub-layer 132 is in contact with the upper surface 80B of the second supplementary layer 32.

The vias of each lateral border 62 also pass through the absorption sub-layer 132 and the insulation sub-layer 134.

A method of assembling the fifth waveguide assembly 10E has substantially identical steps to the steps of the method of assembling the fourth waveguide assembly 10D. A sixth waveguide assembly 10F according to the invention is illustrated in FIG.

10.

This sixth waveguide assembly 10F differs from the fifth waveguide assembly 10E in that, in projection on a longitudinal plane, the insulation sub-layer 134 does not cover the entire receiving cavity 28.

As illustrated in FIG. 10, the insulation sub-layer 134 has here a through-opening 140 opening onto the absorption sub-layer 132. In projection on a longitudinal plane, the through opening 140 has an overlapping inner contour at the contour of the receiving cavity 28.

In this example, in projection on a longitudinal plane, the insulation sub-layer 134 is disposed outside the receiving cavity 28.

A method of assembling the sixth waveguide assembly 10F has substantially identical steps to the steps of the method of assembling the fourth waveguide assembly 10D.

As a variant of the sixth waveguide assembly 10F, the closure layer 1 16 is devoid of an electrically conductive insulation layer.

A seventh waveguide assembly according to the invention not shown differs from the first assembly 10A in that the receiving component 14 comprises a closure layer 1 16 of the receiving cavity 28 identical to the closing layer 1 16 described in FIG. fourth set 10D, the fifth set, or the sixth set.

An eighth waveguide assembly according to the invention not shown differs from the second assembly 10B in that the receiving component 14 comprises a closure layer 1 16 of the receiving cavity 28 identical to the closure layer 1 16 described in FIG. fourth set 10D, the fifth set, or the sixth set.

The embodiments described above can be combined in any technically possible combination.

Thanks to the characteristics described above, the waveguide assembly integrates an active component 12 into a passive structure with low losses and low costs.

Indeed, the receiving component 14 uses the standard manufacturing methods of the multilayer printed circuits to be designed. Its manufacturing cost is therefore very low and its design time is fast.

In addition, the waveguide assembly according to the invention is particularly compact.

An assembly open laterally or in a vertical direction, as in the first or the second assembly 10A, 10B described, allows a simplification of the manufacture and assembly of the active component 12 in the receiving cavity 28 of the receiving component 14.

In addition, since the receiving cavity 28 is open, no resonance develops and no parasitic wavelength disturbs the operation of the assembly.

A laterally closed set in a vertical direction, as in the fourth and fifth sets, provides optimum protection against external radiation, and greatly improves electromagnetic compatibility with other circuits.

In the fourth waveguide assembly 10D, since the dimensions of the receiving cavity 28 are chosen so that the spurious wavelengths are outside the operating bandwidth, these parasitic wavelengths do not disturb the operation of the waveguide assembly.

In the fifth waveguide assembly 10E, the absorption sub-layer 132 absorbs waves having parasitic frequencies typically derived from the resonance of the cavity. In addition, the electrically conductive insulation sub-layer 134 protects the active component 12 against any external radiation.

In the sixth set, the absorption sub-layer 132 absorbs waves from outside and thus improves the isolation of the active component 12 from the outside.

Claims

1. - Waveguide assembly comprising a receiving component (14) and an electronic active component (12) received by the receiving component (14),

the receiving component (14) having a waveguide (16), the waveguide

(16) defining a propagation zone (40) extending along an axis of propagation (XX), the waveguide (16) comprising successively, in a vertical direction orthogonal to the axis of propagation, the at least one upper layer (18), an upper intermediate layer (20), a central layer (22), a lower intermediate layer (24), and a lower layer (26),

the upper intermediate layer (20) defining an upper longitudinal cavity (58) filled with a fluid or empty, the upper longitudinal cavity (58) being closed by the upper layer (18) and the central layer (22),

the lower intermediate layer (24) defining laterally a lower longitudinal cavity (60) filled with a fluid or empty, the lower longitudinal cavity (60) being closed by the central layer (22) and the lower layer (26),

the core layer (22) comprising an electrically conductive line (52), the active component (12) being electrically connected to the electrically conductive line (52);

the receiving component (14) delimiting a receiving cavity (28) of the active component (12), the active component (12) being received in the receiving cavity (28), the receiving cavity (28) being arranged at least through the upper layer (18) and the upper intermediate layer (20), and extending in the vertical direction from the core layer (22) at least to an upper surface (42A) of the upper layer (18) .

2. - assembly according to claim 1, wherein the receiving cavity (28) is delimited by a bottom (94) at least formed by the central layer (22), and is delimited transversely by two transverse walls (96) perpendicular to the axis of propagation (XX), formed at least by the upper layer (18) and the upper intermediate layer (20).

3. - An assembly according to any one of claims 1 or 2, wherein the receiving component (14) comprises at least a first additional layer (30) arranged on the upper layer (18), the receiving cavity (28) being further arranged at least through the first additional layer (30), and extending in the vertical direction from the core layer (22) at least to an upper surface (80A) of the first additional layer (30).

4. - An assembly according to any one of claims 1 to 3, wherein the receiving cavity (28) is open laterally on at least one side.

5. - The assembly of claim 4, wherein the receiving cavity (28) is open laterally on two opposite sides. 6. An assembly according to any one of claims 1 to 4, wherein the receiving cavity (28) is delimited parallel to the axis of propagation (XX) by at least one side wall formed by at least the upper layer ( 18) and the upper intermediate layer (20). 7. An assembly according to any one of claims 1 to 3, wherein the receiving cavity (28) is delimited parallel to the axis of propagation (XX), on either side of the axis of propagation ( XX) respectively, by at least one side wall formed by at least the upper layer (18) and the upper intermediate layer (20). 8. An assembly according to any one of claims 1 to 7, wherein the receiving cavity (28) is blind in a vertical direction, and open opening opposite the central layer (22).

An assembly according to any one of claims 1 to 7, wherein the receiving component (14) comprises a closure layer (1 16) of the receiving cavity (28), the closure layer (1 16). covering the receiving cavity (28) and being spaced apart from the core layer (22).

10. The assembly of claim 9, wherein the closure layer (1 16) comprises an electrically conductive upper sub-layer, a dielectric core sub-layer and an electrically conductive lower sub-layer.

1 1. An assembly according to claim 9, wherein the closure layer (1 16) comprises a wave absorption sub-layer (132), the absorption sub-layer (132) having an attenuation coefficient, for a wavelength between 0.1 μηι and 1 m, between -0.5 dB and -50 dB.

12. - The assembly of claim 1 1, wherein the closure layer (1 16) further comprises an insulation sub-layer (134), the insulation sub-layer (134) being electrically conductive and covering the absorption sub-layer (132) in line with the receiving cavity (28).

13. - An assembly according to any one of claims 1 to 12, wherein, in projection on a longitudinal plane, the receiving cavity (28) has a larger dimension greater than 0.1 mm and less than 100 mm.

14. - Method of assembling a waveguide assembly comprising the following steps:

providing an active electronic component (12);

- providing a receiving component (14), the receiving component (14) having a waveguide (16), the waveguide (16) extending along an axis of propagation (XX) ) and comprising at least one upper layer (18), an upper intermediate layer (20), a central layer (22), a lower intermediate layer (24), and a lower layer (26), the upper intermediate layer (20) defining an upper longitudinal cavity (58) filled with a fluid or empty, the upper longitudinal cavity (58) being closed by the upper layer (18) and the central layer (22), the lower intermediate layer (24) laterally defining a lower longitudinal cavity (60) filled with a fluid or empty, the lower longitudinal cavity (60) being closed by the central layer (22) and the lower layer (26), the central layer (22) comprising an electrically conductive line ( 52), the receiving component (14) delimited a receiving cavity (28) of the active component (12), the receiving cavity (28) being arranged at least through the upper layer (18) and the upper intermediate layer (20), and extending orthogonally to the central layer (22) from the core layer (22) at least to an upper surface (42A) of the top layer (18), the active component (12) being away from the receiving component (14) , and;

inserting the active component into the receiving cavity of the receiving component, so that the active component is electrically connected to the electrically conductive line of the central layer; ) to form a waveguide assembly according to any one of claims 1 to 13.

15.- Method according to claim 14, comprising a step of supplying the waveguide (16) of the receiving component (14) with an electromagnetic wave having a predetermined wavelength, the electromagnetic wave being converted into a signal input to the active component (12), the receiving cavity (28) having, in projection on a longitudinal plane, a larger dimension less than 10 times said predetermined wavelength.