FR3073085A1 - WAVE GUIDE ASSEMBLY AND ASSOCIATED ASSEMBLY METHOD - Google Patents

Abstract

This waveguide assembly includes a receiving component (14) and an electronic active component (12). The receiving component (14) comprises a waveguide (16), the waveguide (16) defining a propagation zone (40) extending along an axis of propagation, the waveguide (16) comprising successively, in a vertical direction orthogonal to the axis of propagation, an upper layer (18), an upper intermediate layer, a central layer (22), a lower intermediate layer (24), and a lower layer ( 26), the receiving component (14) delimiting a receiving cavity (28) of the active component (12), the active component (12) being received in the cavity (28), the cavity (28) being arranged through the upper layer (18) and the upper intermediate layer, and extending in the vertical direction from the core layer (22) to an upper surface (42A) of the upper layer (18).

Description

Waveguide assembly and associated assembly method

The present invention relates to a waveguide assembly.

At the moment, an important problem in the telecom industry, millimeter radars for drones, autonomous cars and more generally any type of robot, is to reduce losses in systems drastically, on time where saving energy is essential for the applications of tomorrow. These loss levels are in fact prohibitive for equipment such as “RF front-end” type equipment.

To reduce losses, it is known to design passive electronic structures by using empty suspended line technology (ESISL in English). The passive structure then forms a microwave transmission line.

In the aforementioned industries, it is often necessary to interconnect an active component, that is to say a component requiring to operate an additional energy source other than the input signal, with a passive structure.

To make the interconnection between the active component and the passive structure, it is known to provide a shielded box outside the passive structure and comprising the active component, and to connect this box to the passive structure. Among other things, the shielded housing protects the active component from all or part of the external radiation and ensures electromagnetic compatibility with other circuits.

However, the shielded housing containing the active component is expensive to manufacture, and interconnection with the passive structure is complicated.

Document WO 2007/149046 also discloses a waveguide assembly in which an electronic component is received within a cavity defined in an empty suspended line type waveguide.

However, the whole is not entirely satisfactory. In particular, such an assembly is likely to resonate in operation. Resonance leads to the appearance of resonance modes associated with spurious frequencies which disturb the operation of the assembly, in particular when the assembly operates for signals of millimeter wavelengths.

An object of the invention is therefore to provide an assembly suitable for operating in the millimeter wavelength range, making it possible to easily interconnect an active component in structures with low losses and low manufacturing costs, while protecting the active component of external radiation and ensuring good electromagnetic compatibility.

To this end, the subject of the invention is a waveguide assembly comprising a reception component and an electronic active component received by the reception component, the reception component comprising a waveguide, the waveguide defining a propagation zone extending along a propagation axis, the waveguide successively comprising, in a vertical direction orthogonal to the propagation axis, at least one upper layer, an upper intermediate layer, a central layer , a lower intermediate layer, and a lower layer, the upper intermediate layer defining an upper longitudinal cavity filled with a fluid or empty, the upper longitudinal cavity being closed by the upper layer and the central layer, the lower intermediate layer defining laterally a lower longitudinal cavity filled with fluid or empty, the lower longitudinal cavity re being closed by the central layer and the lower layer, the central layer comprising an electrically conductive line, the active component being electrically connected to the electrically conductive line;

the receiving component delimiting a receiving cavity of the active component, the active component being received in the receiving cavity, the receiving cavity being arranged at least through the upper layer and the upper intermediate layer, and extending in the direction vertical from the central layer at least to an upper surface of the upper layer.

The assembly according to the invention may include one or more of the following characteristics, taken in isolation or in any technically possible combination:

- The receiving cavity is delimited by a bottom at least formed by the central layer, and is delimited transversely by two transverse walls perpendicular to the axis of propagation, formed at least by the upper layer and the upper intermediate layer;

the reception component comprises at least a first additional layer arranged on the upper layer, the reception cavity being further arranged at least through the first additional layer, and extending in the vertical direction from the central layer at least up to 'to an upper surface of the first additional layer;

- The receiving cavity is open laterally on at least one side;

- the receiving cavity is open laterally on two opposite sides;

- The receiving cavity is delimited parallel to the axis of propagation by at least one side wall formed by at least the upper layer and the upper intermediate layer;

- The receiving cavity is delimited parallel to the axis of propagation, on either side of the axis of propagation respectively, by at least one side wall formed by at least the upper layer and the upper intermediate layer;

- The receiving cavity is blind in a vertical direction, and open by opening opposite the central layer;

- The receiving component comprises a closing layer of the receiving cavity, the closing layer covering the receiving cavity and being arranged at a distance from the central layer;

the closing layer comprises an electrically conductive upper sublayer, a central dielectric sublayer and an electrically conductive lower sublayer;

the closure layer comprises a wave absorption sublayer, the absorption sublayer having an attenuation coefficient, for a wavelength between 0.1 μm and 1 m, between -0, 5 dB and -50 dB;

- The closure layer further comprises an insulation sublayer, the insulation sublayer being electrically conductive and covering the absorption sublayer in line with the receiving cavity;

- in projection on a longitudinal plane, the receiving cavity has a larger dimension greater than 0.1 mm and less than 100 mm;

the receiving component comprises one or a plurality of other additional layers superimposed on the first additional layer, the receiving cavity also being arranged through the other or the other additional layer (s), and extending in the vertical direction from the central layer at least to an upper surface of one of the other additional layers;

- the insulating sublayer of the closing layer is made of metal;

- when projected onto a longitudinal plane, the active component has a larger dimension greater than 0.1 mm and less than 30 mm;

the active component is fixed to the receiving component, in particular to the central layer, by gluing or by brazing;

the cavity comprises a single active component, the active component being chosen from the group consisting of a low noise amplifier (known as LNA in English), a power amplifier (known as PA in English), a diode or a varactor diode, SSPA , a monolithic microwave integrated circuit (known as MMIC), a phase shifter, a variable gain amplifier, a limiter, a linearizer, a detector, a mixer, an active filter, and a flatness corrector;

the upper layer, the upper intermediate layer, the lower intermediate layer, and the lower layer each comprise an electrically conductive upper sublayer, a central dielectric sublayer and an electrically conductive lower sublayer;

the central layer comprises a central dielectric sublayer on which the electrically conductive line is disposed;

the electrically conductive line has a width, taken in a transverse direction, less than the widths of the longitudinal cavities of upper and lower propagation, a portion of dielectric being interposed between the electrically conductive line and the lateral edges of one of the longitudinal cavities of upper and lower propagation on either side of the electrically conductive line;

- The receiving component comprises a decoupling and supply circuit of the active component, the decoupling and supply circuit being arranged in at least one of the layers of the receiving component;

- the decoupling and supply circuit protrudes laterally from the receiving cavity;

- the decoupling and supply circuit is arranged on one of the layers of the receiving component;

the decoupling and supply circuit is at least partly arranged on a layer of the receiving component, distinct from the central layer, the circuit comprising electrically conductive wires or vias passing through the layers of the receiving component up to the central layer, for electrically connecting the circuit to the active component;

- the decoupling and supply circuit is arranged in the receiving cavity, in part or in whole, and;

the waveguide assembly further comprises a microwave component of the transmission line type integrated into the substrate, said microwave component being connected to the receiving component and comprising at least one upper layer, a central layer and a layer lower defining an auxiliary area of propagation of an electromagnetic wave.

The subject of the invention is also a method of assembling a waveguide assembly comprising the following steps:

- supply of an active electronic component;

supply of a reception component, the reception component comprising a waveguide, the waveguide extending along a propagation axis and comprising at least one upper layer, an upper intermediate layer, a central layer, a lower intermediate layer, and a lower layer, the upper intermediate layer defining an upper longitudinal cavity filled with a fluid or empty, the upper longitudinal cavity being closed by the upper layer and the central layer, the lower intermediate layer defining laterally a lower longitudinal cavity filled with a fluid or empty, the lower longitudinal cavity being closed by the central layer and the lower layer, the central layer comprising an electrically conductive line, the receiving component delimiting a receiving cavity of the active component, the receiving cavity being arranged at least through the upper layer and the upper intermediate layer, and extending orthogonally to the central layer from the central layer at least to an upper surface of the upper layer, the electronic active component being apart from the receiving component , and;

- insertion of the active component into the receiving cavity of the receiving component, so that the active component is electrically connected to the electrically conductive line of the central layer, to form a waveguide assembly as defined above.

The assembly process according to the invention may include one or more of the following characteristics, taken in isolation or in any technically possible combination:

the method comprises a step of supplying the waveguide of the receiving component by an electromagnetic wave having a predetermined wavelength, the electromagnetic wave being converted into an input signal for the active component, the receiving cavity having, in projection on a longitudinal plane, a larger dimension less than 10 times said predetermined wavelength; and

- the predetermined wavelength of the electromagnetic wave is less than 500 mm.

The invention will be better understood on reading the description which follows, given solely by way of example, and made with reference to the appended drawings, in which:

- Figure 1 is a schematic sectional view of a first waveguide assembly according to the invention;

- Figure 2 and 3 are schematic perspective views respectively from the side and from the front of the assembly of Figure 1;

- Figure 4 is a schematic top view of the first set of Figure 1;

- Figure 5 is a schematic perspective side view of a second waveguide assembly according to the invention;

- Figure 6 is a schematic top view of the second set of Figure 5;

- Figure 7 is a schematic perspective side view of a third waveguide assembly according to the invention, and;

- Figures 8 to 10 are respectively schematic sectional views of a fourth, fifth and sixth waveguide assemblies according to the invention.

A first waveguide assembly 10A according to the invention is illustrated in FIGS. 1 to 4.

The first assembly 10A comprises an electronic active component 12 and a reception component 14, the electronic active component 12 being received by the reception component 14.

The active component 12, illustrated in FIG. 1, is an electronic component suitable for receiving an input signal and typically suitable for supplying an output signal.

For reasons of clarity, the active component 12 has not been shown in FIGS. 2 to 4.

The active component 12 is distinguished from a passive electronic component.

Typically, a passive component requires no additional energy source other than the input signal to operate, that is, to produce an output signal. In particular, a passive component does not contain any energy source capable of adding energy to the input signal to operate. The electrical power of the output signal is therefore less than or equal to the electrical power of the input signal.

A passive component is for example a resistor, a capacitor, a coil, an antenna, a passive filter, a coupler, a power divider, or a passive phase shifter.

An active component 12 requires an additional power source other than the input signal to operate, that is to say to produce an output signal.

The active component 12 of FIG. 1 is for example chosen from the group consisting of a low noise amplifier (called LNA in English), power amplifier (said PA in English), a diode or a varactor diode, SSPA, a circuit integrated monolithic microwave (known as MMIC), a phase shifter, a variable gain amplifier, a limiter, a linearizer, a detector, a mixer, an active filter, and a flatness corrector.

The elements of this group are typically circuits produced in III-V technology (of the GaAs or GAN type for example) or of silicon (of the CMOS or Bi-CMOS type for example) or of carbon (graphene or CNFET for example).

The active component 12 here has a larger dimension greater than 0.1 mm and less than 30 mm.

The active component 12 is fixed to the receiving component 14 by gluing or soldering, such as in “flip-chip” type assemblies.

The receiving component 14 of the first set 10A comprises a waveguide 16 successively comprising at least one upper layer 18, an upper intermediate layer 20, a central layer 22, a lower intermediate layer 24, and a lower layer 26.

The receiving component 14 delimits a receiving cavity 28 of the active component 12, the active component 12 being received in the receiving cavity 28.

The receiving component 14 here comprises a first additional layer 30 and a second additional layer 32 superimposed on the upper layer 18 of the waveguide 16.

It also includes a decoupling and supply circuit 34 for the active component 12.

The waveguide 16 is of the "Empty suspended line" type.

The waveguide 16 extends along an axis of propagation X-X. Thereafter, a longitudinal plane will designate a plane parallel to the axis of propagation and to layers 18, 20, 22, 24 and 26. We will also denote by "longitudinal direction" a direction parallel to the axis of propagation.

In addition, the term "transverse" will mean a plane orthogonal to the axis of propagation, and a direction orthogonal to the axis of propagation and contained in a longitudinal plane.

In addition, "lateral" means a plane parallel to the axis of propagation and orthogonal to a longitudinal plane.

The waveguide 16 is suitable for guiding an electromagnetic wave along the axis of propagation X-X, between an input 36 and an output 38.

In one embodiment, the electromagnetic wave has at least one predetermined wavelength. The predetermined wavelength of the electromagnetic wave is advantageously included in an operating bandwidth, the operating bandwidth having a predetermined maximum wavelength and a predetermined minimum wavelength. The predetermined maximum wavelength is typically less than 1 m, preferably less than 500 mm. The predetermined minimum wavelength is typically between 0.1 pm and 1 m, preferably between 0.1 pm and 500 mm.

As illustrated in Figures 1 to 3, the waveguide 16 defines a propagation region 40 of the electromagnetic wave extending in a longitudinal direction.

Each of the upper layer 18, of the upper intermediate layer 20, of the central layer 22, of the lower intermediate layer 24, and of the lower layer 26 extends in a plane XY, defined by the axis of propagation XX and by a transverse axis YY, orthogonal to the axis of propagation XX. The transverse axis Y-Y is in particular for example parallel to an upper surface of the upper layer 18.

In the following description, the term "width" should be understood in a direction parallel to the transverse axis Y-Y.

In addition, the receiving component 14 comprises an axis Z-Z orthogonal to the axis of propagation X-X and to the transverse axis Y-Y. The thickness of each of the layers of the waveguide 16 is typically taken along the axis Z-Z orthogonal to the axis of propagation X-X and to the transverse axis Y-Y.

In the following, "vertical" will designate a direction parallel to the Z-Z axis. The terms "above", "below", "upper" and "lower" will be understood with respect to a vertical direction.

The upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 form a stack.

Each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 respectively have an electrically conductive upper surface 42A, 42B, 42C, 42D and respectively a lower surface 44A, 44B, 44C, 44D electrically conductive. In addition, the central layer 22 has an upper surface 42E and a lower surface 44E.

The lower surface 44A of the upper layer 18 is in contact with the upper surface 42B of the upper intermediate layer 20. The lower surface 44B of the upper intermediate layer 20 is in contact with the upper surface 42E of the central layer 22. The surface lower 44E of the central layer 22 is in contact with the upper surface 42C of the lower intermediate layer 24. The lower surface 44C of the lower intermediate layer 24 is in contact with the upper surface 42D of the lower layer 26.

In a preferred embodiment, each of the upper layer 18, the upper intermediate layer 20, the lower intermediate layer 24, and the lower layer 26 form a substrate.

Preferably, each of the upper layer 18, of the upper intermediate layer 20, of the lower intermediate layer 24, and of the lower layer 26 thus respectively comprise an electrically conductive upper sublayer 46, a central dielectric sublayer 48 and an electrically conductive lower sublayer 50, the central dielectric sublayer 48 being interposed between the upper sublayer 46 and the lower sublayer 50.

Subsequently, by “electrically conductive element”, it is meant that said element has an electrical conductivity greater than Γ10 ⁶ S.rrT ¹ , preferably equivalent to that of a metal of copper, silver, or aluminum type.

Subsequently, by “dielectric element”, it is meant that said element has a relative dielectric permittivity greater than or equal to 1.

The upper sublayer 46 and the lower sublayer 50 of each of the upper layer 18, of the upper intermediate layer 20, of the lower intermediate layer 24, and of the lower layer 26 are for example made of copper.

The central sublayer 48 of each of the upper layer 18, of the upper intermediate layer 20, of the lower intermediate layer 24, and of the lower layer 26 is for example made of epoxy resin, or teflon.

The central layer 22 comprises an electrically conductive line 52 and a central dielectric sublayer 54.

In the example of Figures 1 to 3, the electrically conductive line 52 is arranged on said central dielectric underlayer 54, extending along a longitudinal direction. In particular, the electrically conductive line 52 is disposed between the upper layer 18 and the central dielectric sublayer 54 of the central layer 22, along a longitudinal direction.

The electrically conductive line 52 extends parallel to the axis of propagation X-X, in a longitudinal plane.

The active component 12 is fixed for example to the central layer 22, and is electrically connected to the electrically conductive line 52, at transitions 56.

At said transitions 56, the electromagnetic wave propagating in the waveguide 16 is suitable for being converted into an input signal for the active component 12.

The propagation zone 40 corresponds to a zone of the waveguide 16 in which the electromagnetic wave is confined during its propagation in the waveguide 16.

The propagation zone 40 comprises an upper longitudinal cavity 58 and a lower longitudinal cavity 60.

The propagation zone 40 is delimited laterally by lateral borders 62.

The electrically conductive line 52 is disposed in the propagation zone 40, in particular in the upper longitudinal cavity 58.

The upper longitudinal cavity 58 is defined in the upper intermediate layer 20 and is closed by the upper layer 18 and the central layer 22.

It is filled with a fluid, for example air. Alternatively, in the case where the upper longitudinal cavity 58 defines a sealed closed volume, it is filled with air, nitrogen or is empty of fluid. It is notably empty of fluid, for example in the case of a spatial application of the waveguide assembly. It can also be filled with foam or a material that does not interfere with the propagation wave. Said foam or material which does not interfere with the propagation wave typically has a zero attenuation coefficient, for a wavelength between 0.1 μm and 1 m, for example a relative permittivity substantially equal to 1 and of preferably a delta tangent of less than 0.001. Said foam or material which does not interfere with the propagation wave is for example expanded polystyrene foam or teflon.

The upper longitudinal cavity 58 is in particular delimited by the lower surface 44A of the upper layer 18, the upper surface 42E of the central layer 22 and the lateral edges 64 defined by the upper intermediate layer 20.

As illustrated in FIG. 3, the electrically conductive line 52 here has a width, taken in a transverse direction, less than the width of the upper longitudinal cavity 58. In addition, a portion of dielectric 66 is advantageously interposed between the electrically conductive line 52 and the lateral edges 64 of the upper longitudinal cavity 58 on either side of the electrically conductive line 52.

As illustrated in FIG. 1, the upper longitudinal cavity 58 opens into the receiving cavity 28.

The lower longitudinal cavity 60 is defined in the lower intermediate layer 24 and is closed by the central layer 22 and the lower layer 26.

It is filled with a fluid, for example air. Alternatively, in the case where the lower longitudinal cavity 60 defines a sealed closed volume, it is filled with air, nitrogen or is empty of fluid. It is notably empty of fluid, for example in the case of a spatial application of the waveguide assembly. It can also be filled with foam or a material that does not interfere with the propagation wave. Said foam or material which does not interfere with the propagation wave typically has a zero attenuation coefficient, for a wavelength between 0.1 μm and 1 m, for example a relative permittivity substantially equal to 1 and of preferably a delta tangent of less than 0.001. Said foam or material which does not interfere with the propagation wave is for example expanded polystyrene foam or teflon.

The lower longitudinal cavity 60 is in particular delimited by the lower surface 44E of the central layer 22, the upper surface 42D of the lower layer 26 and lateral edges 68 defined by the lower intermediate layer 24.

The width of the electrically conductive line 52 is less than the width of the lower longitudinal cavity 60.

As illustrated in FIG. 1, in line with the receiving cavity 28, the lower longitudinal cavity 60 is longitudinally interrupted by the lower intermediate layer 24.

In other words, the lower intermediate layer 24 extends in line with the receiving cavity 28. When projected onto a longitudinal plane, the lower intermediate layer 24 covers the receiving cavity 28.

The upper 58 and lower 60 longitudinal cavities have a constant width along a longitudinal direction.

The upper 58 and lower 60 longitudinal cavities have the same width.

The lateral borders 62 of the propagation zone 40 are suitable for preventing the passage of an electromagnetic wave having a wavelength greater than or equal to the predetermined minimum wavelength.

The lateral borders 62 are orthogonal to the lower surface 44A of the upper layer 18 and to the upper surface 42D of the lower layer 26.

The lateral borders 62 are arranged at a distance from the lateral edges 64, 68 of the upper 58 and lower 60 longitudinal cavities. In other words, part of the upper intermediate layer 20 is interposed between the lateral borders 62 and the lateral edges 64 of the upper longitudinal cavity 58, and part of the lower intermediate layer 24 is interposed between the lateral borders 62 and the lateral edges 68 of the lower longitudinal cavity 60.

In the example of FIGS. 2 to 4, the lateral borders 62 of the propagation area 40 each have a niche shape in projection on a longitudinal plane.

Each lateral border 62 is thus formed by a first sub-border 70, a second sub-border 72 and a third longitudinal sub-border 74, the second sub-border 72 being respectively connected to the first sub-border 70 and to the third sub-border 74 by a fourth sub-border 76 and a fifth sub-border 78 transverse.

The distance between the second sub-borders 72 of the two lateral borders 62 is greater than the distance between the first two sub-borders 70 of said two lateral borders 62.

In projection on a transverse plane, the respective distances between the first sub-borders 70 of the lateral borders 62 and the electrically conductive line 52 are equal.

In projection on a transverse plane, the distance between the second sub-border 72 of one of the lateral borders 62 and the electrically conductive line 52 is less than the distance between the second sub-border 72 of the other of the lateral borders 62 and the electrically conductive line 52.

In projection on a transverse plane, the respective distances between the third sub-borders 74 of the lateral borders 62 and the electrically conductive line 52 are equal.

The second sub-borders 72 of the two lateral borders 62 are situated on either side of the reception cavity 28.

The lateral borders 62 thus surround the receiving cavity 28.

In projection on a lateral plane, the fourth sub-borders 76 of the two lateral borders 62 overlap.

Similarly, in projection on a lateral plane, the fifth sub-borders 78 of the two lateral borders 62 are superimposed.

In an exemplary embodiment, each lateral border 62 comprises a row of electrically conductive vias (not shown in the figures), arranged through the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26.

By "via" is meant a hole, arranged at least through one of the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26, the hole having walls covered with an electrically conductive coating, for example a coating made of metal.

Each via extends along a vertical axis.

The vias typically have a section along a longitudinal plane of round or rectangular shape.

In the example of FIG. 2, each via passes through each of the layers 18, 20, 22, 24, 26 of the waveguide 16.

The spacing between two successive vias of the same row is less than the predetermined minimum wavelength, for example less than or equal to one fifth of the predetermined minimum wavelength.

In line with the receiving cavity 28, the rows of vias of the lateral borders 62 of the propagation zone 40 only pass through the central layer 22, the lower intermediate layer 24 and the lower layer 26.

The first additional layer 30 and the second additional layer 32 of the receiving component 14 each extend in a longitudinal plane.

The first additional layer 30 is arranged on the upper layer 18 of the waveguide 16 and the second additional layer 32 is arranged on the first additional layer 30.

The additional layers 30, 32, the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 form a stack in at least one region of the receiving component 14.

The first additional layer 30 and the second additional layer 32 each have an electrically conductive upper surface 80A, 80B and an electrically conductive lower surface 82A, 82B respectively.

The lower surface 82B of the second additional layer 32 is in contact with the upper surface 80A of the first additional layer 30. The lower surface 82A of the first additional layer 30 is in contact with the upper surface 42A of the upper layer 18.

In a preferred embodiment, each additional layer 30, 32 forms a substrate.

Each additional layer 30, 32 thus respectively comprises an electrically conductive upper sublayer 84A, 84B, a central dielectric sublayer 86A, 86B and a lower electrically conductive sublayer 88A, 88B, the central dielectric sublayer 86A, 86B being interposed between the upper sublayer 84A, 84B and the lower sublayer 88A, 88B.

The upper sublayer 84A, 84B and the lower sublayer 88A, 88B of each additional layer 30, 32 are for example made of copper.

The central sub-layer 86A, 86B of each additional layer 30, 32 is for example made of epoxy resin, or Teflon.

Each additional layer 30, 32 extends respectively between a front edge 90A, 90B and a rear edge 92A, 92B, the front edge 90A, 90B and the rear edge 92A, 92B extending in a transverse plane. By "edge" is meant a face of a layer, such that the entire said layer is arranged on one side of said face.

The additional layers 30, 32 have substantially equal lengths. By “length” is meant here the distance, taken in a longitudinal direction, between the front edge 90A, 90B and the rear edge 92A, 92B.

In the example illustrated in the figures, the length of each additional layer 30, 32 is less than the length of the layers of the waveguide 16. In other words, the receiving component 14 comprises a region devoid of additional layers 30, 32. As a variant, the length of each additional layer 30, 32 is equal to the length of the layers of the waveguide 16.

In the example of FIG. 2, in line with the additional layers 30, 32, each via of each lateral border 62 also crosses the additional layers 30, 32.

The receiving cavity 28 is arranged through the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32.

It extends orthogonally to the central layer 22, in a vertical direction, from the central layer 22 to the upper surface 80B of the second additional layer 32.

The receiving cavity 28 is delimited by a bottom 94 at least formed by the central layer 22, and is delimited transversely by two transverse walls 96 formed by the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32.

When projected onto a longitudinal plane, the transverse walls 96 each form a recess 98 defined in the additional layers 30, 32, the upper layer 18 and the upper intermediate layer 20.

The hollows 98 are arranged opposite one another.

More precisely, each recess 98 is formed by a first surface 100 and a second side surface 102, and by a third transverse surface 104 joining the first and the second surface 102.

As illustrated in FIGS. 2 and 4, the first surface 100 and the second surface 102 are, for example, respectively aligned and flush with the lateral edges 64 of the upper longitudinal cavity 58.

The recesses 98 make it possible to free up space for mounting the active component 12.

In the example of Figures 2 to 4, the receiving cavity 28 is open laterally on two opposite sides.

It presents, in projection on a longitudinal plane, an open contour.

In particular, in this example, the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32 are interrupted over their respective widths.

In the example of Figures 2 to 4, the receiving cavity 28 is blind in a vertical direction. In particular, it is open by opening opposite the central layer 22 in a vertical direction.

The decoupling and supply circuit 34 is suitable for supplying the active component 12 with voltage. For example, the decoupling and supply circuit 34 is suitable for supplying the active component 12 with a DC signal or a signal preferably having a frequency of less than 100 MHz. For this, the decoupling and supply circuit 34 is typically connected to an external power source, not shown.

The active component 12 is thus electrically connected to the decoupling and supply circuit 34.

Preferably, the circuit 34 is further able to control the active component

12. “Command” means that the active component 12 is capable of passing at least from a first electrical state to a second electrical state, the circuit 34 being capable of emitting a control signal capable of passing the active component 12 from the first electrical state to the second electrical state. The control signal typically has a frequency of less than 100 MHz.

Advantageously, the circuit 34 is capable of ensuring a decoupling function of the active component 12 relative to the external current source. By “decoupling function”, it is meant that the circuit 34 is suitable for filtering a current coming from the external current source or from the active component.

As illustrated in FIGS. 2 to 4, the decoupling and supply circuit 34 is arranged at least partially in the reception cavity 28.

Here it projects laterally with respect to the receiving cavity 28.

The circuit 34 notably projects with respect to a lateral edge of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14. In other words, the central layer 22 has a width, taken at the level of circuit 14, greater than the maximum width presented by the upper intermediate layer 20 and the upper layer

18.

In a variant not shown, the decoupling and supply circuit 34 is disposed integrally in the receiving cavity 28. In another preferred variant not shown, the layers 18, 20, 22, 24, 26, 30, 32 of the component reception 14 all have an equal width, and for example constant, along the axis of propagation XX.

The decoupling and supply circuit 34 is arranged in at least one of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14.

In the example illustrated in FIGS. 2 to 4, the decoupling and supply circuit 34 is arranged on the central layer 22. As a variant, the decoupling and supply circuit 34 is arranged on another layer 18, 20 , 24, 26, 30, 32 of the receiving component 14, preferably on the upper layer 18 or on the lower layer 26, the circuit 34 then typically comprising electrically conductive wires or vias passing through the layers of the receiving component 14 up to 'to the central layer 22, for electrically connecting the circuit 34 to the active component 12. In yet another variant, a first part of the decoupling and supply circuit 34 is arranged on one of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14, and a second part is arranged on another of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14, the circuit 34 then typically comprising electrical wires. ent conductors or vias passing through the layers of the receiving component 14 to electrically connect the first part and the second part of the circuit 34.

A method of assembling the first waveguide assembly 10A will now be described.

The method includes the supply of the electronic active component 12 described above, and the supply of the reception component 14 described above, the electronic active component 12 being disposed away from the reception component 14.

For example, the step of providing the receiving component 14 includes providing each of the layers 18, 20, 22, 24, 26, 30, 32 of the receiving component 14, each layer 18, 20, 22, 24, 26 , 30, 32 then being arranged apart from one another and devoid of receiving cavity 28 of the active component 12.

The step of supplying the receiving component 14 comprises assembling the lower layer 26, the lower intermediate layer 24 and the central layer 22, during which the central layer 22 is fixed to the lower intermediate layer 24, and the lower intermediate layer 24 is fixed to the lower layer 26.

These layers 22, 24, 26 are fixed for example by fixing screws, by rivets, by stirring, by a conductive or non-adhesive film, by thermocompression or by prepreg for example. In a variant where this assembly involves an insulator to unite the layers 22, 24, 26, then an electrical contact between the layers 22, 24, 26 is ensured by through conductive vias.

The active component 12 is then fixed on the central layer 22 by gluing or by brazing.

The active component 12 is electrically connected to the electrically conductive line 52, at the transitions 56.

The step of supplying the receiving component 14 then comprises the assembly of the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32, during which the second additional layer 32 is attached to the first additional layer 30, the first additional layer 30 is attached to the upper layer 18, and the upper layer 18 is attached to the upper intermediate layer 20.

These layers 18, 20, 30, 32 are fixed similarly to layers 22, 24, 26.

The step of supplying the receiving component 14 then further comprises a step of cutting the receiving cavity 28 of the active component 12 through the upper intermediate layer 20, the upper layer 18, the first additional layer 30 and the second additional layer 32.

This cutting step is for example implemented by laser or by milling.

The step of supplying the receiving component 14 further comprises a step of mounting the layers of the receiving component 14, during which the active component 12 is inserted into the receiving cavity 28 and the upper intermediate layer 20 is fixed. to the central layer 22.

Thereafter, a plurality of vias are arranged in the form of rows through each of the layers 18, 20, 22, 24, 26, 30, 32 to form said lateral borders 62.

The first waveguide assembly 10A described above is then formed.

Subsequently, the active component 12 is supplied with voltage and controlled by the decoupling and supply circuit 34.

The method further comprises a step of supplying the waveguide 16 of the receiving component 14 by an electromagnetic wave at the input 36 of the waveguide, the electromagnetic wave typically having a predetermined wavelength preferably comprised in the operating bandwidth.

The predetermined wavelength of the electromagnetic wave is advantageously less than 500 mm.

The receiving cavity 28 has, in projection on a longitudinal plane, a larger dimension less than 10 times said predetermined wavelength.

The electromagnetic wave propagates in particular on the electrically conductive line 52.

At transitions 56, the electromagnetic wave propagating in the waveguide 16 is converted into an input signal for the active component 12.

The active component 12 provides an output signal which is guided by the waveguide 16 to the output 38 of the waveguide 16.

Alternatively, the electromagnetic wave guided by the waveguide 16 is a continuous signal having a zero frequency. In yet another variant, the electromagnetic wave guided by the waveguide 16 is the sum of a continuous signal having a zero frequency and a signal having the predetermined wavelength.

In addition not shown to the first waveguide assembly 10A, the receiving component 14 comprises a plurality of additional vias passing through the central layer 22, the lower intermediate layer 24 and the lower layer 26, arranged below the receiving cavity 28 .

The additional vias are arranged away from the rows of vias at the lateral borders 62.

The additional vias are made of metal and are thermally conductive. In operation, they cool the active component 12 by conducting the heat produced by the active component 12.

As a variant of the first waveguide assembly 10A, each lateral border 62 of the propagation zone 40 comprises a row of vias per layer of the waveguide 16, said rows of vias being aligned or not.

In another variant, each lateral border 62 comprises a number of rows of vias less than the number of layers of the waveguide 16, the rows of vias being aligned or not. At least one of said rows of vias then crosses a plurality of layers of the waveguide 16.

As a variant of the first waveguide assembly 10A, the electrically conductive line 52 is disposed between the central dielectric sublayer 54 of the central layer 22 and the lower layer 26, along a part of the central layer 22 along a longitudinal direction.

In another variant not shown, the electrically conductive line 52 is alternately disposed between the central dielectric sublayer 54 of the central layer 22 and the lower layer 26 and between the central dielectric sublayer 54 of the central layer 22 and the layer upper 18 along a longitudinal direction.

In yet another variant not shown, the electrically conductive line 52 is disposed between the central dielectric sublayer 54 and the upper layer 18 in a longitudinal direction, and the central layer 22 further comprises a second electrically conductive line disposed between the dielectric central layer 54 and the lower layer 26 in a longitudinal direction, the electrically conductive line 52 and the second electrically conductive line being electrically connected to each other by conductive vias passing through the central dielectric underlayer 54.

In yet another variant not shown, the central layer 22 is devoid of dielectric portion 66, or the dielectric portion 66 is interposed between the electrically conductive line 52 and only one of the lateral edges 64, 68 of one of the longitudinal cavities of upper 58 and lower 60 propagation.

As a variant of the first waveguide assembly 10A, the receiving component 14 comprises a single additional layer. The receiving cavity 28 then extends orthogonally to the central layer 22 from the central layer 22 to an upper surface of said additional layer.

In another variant, the receiving component 14 comprises a number of additional superposed layers greater than two. The receiving cavity 28 then extends orthogonally to the central layer 22 from the central layer 22 to an upper surface of one of the additional layers, in particular to an upper surface of the additional layer farthest from the central layer 22.

In addition to the first waveguide assembly 10A, the waveguide assembly further includes a microwave component, not shown, of the transmission line type integrated into the substrate.

The microwave component is connected to the receiving component 14 and comprises at least an upper layer, a central layer and a lower layer defining an auxiliary area for propagation of an electromagnetic wave.

The auxiliary propagation zone and the propagation zone 40 are connected. By “connected”, it is meant that an electromagnetic wave confined in the auxiliary propagation zone and propagating in said auxiliary zone is capable of propagating in the propagation zone 40 of the receiving component 14.

The 10A waveguide assembly is then compact and flexible.

A second waveguide assembly 10B is illustrated in FIGS. 5 and 6.

The second waveguide assembly 10B differs from the first assembly 10A in that the receiving cavity 28 is not open laterally on two opposite sides.

The receiving cavity 28 is closed laterally on a first side 106.

As illustrated in FIG. 5, on this first side 106, the receiving cavity 28 is thus delimited, parallel to the axis of propagation XX, by a first side wall 108 formed here by the additional layers 30, 32, the upper layer 18 and the upper intermediate layer 20.

In this example, the receiving cavity 28 is open laterally on a second side 110. The receiving cavity 28 has, however, in projection on a longitudinal plane, a closed contour.

The second side 110 is in this example, one side of the receiving cavity 28 relative to which the decoupling and supply circuit 34 projects laterally.

More specifically, the receiving cavity 28 is open laterally on this second side 110 at the level of the upper intermediate layer 20.

On this second side 110, the receiving cavity 28 is thus delimited, parallel to the axis of propagation XX, by a second side wall 112 formed by the additional layers 30, 32 and the upper layer 18, the upper intermediate layer 20 having a through hole 114 in a transverse direction.

Said through orifice 114 has a height equal to the thickness of the upper intermediate layer 20.

The first side wall 108 and the second side wall 112 are parallel.

The maximum width of the receiving cavity 28, taken in a transverse direction, between the first side wall 108 and the second side wall 112, is greater than the width of each of the longitudinal propagation cavities upper 58 and lower 60.

The difference between the second sub-borders 72 of two lateral borders 62 is greater than said maximum width of the receiving cavity 28.

The receiving cavity 28 has, in projection on a longitudinal plane, a larger dimension greater than 0.1 mm and less than 100 mm.

In projection on a transverse plane, the distance between the first side wall 108 and the electrically conductive line 52 is less than the distance between the second side wall 112 and the electrically conductive line 52.

A method of assembling the second waveguide assembly 10B has steps which are substantially identical to the steps of the method of assembling the first assembly 10A.

A third waveguide assembly 10C according to the invention is illustrated in the figure

7.

This third waveguide assembly 10C differs from the second waveguide assembly 10B in that the receiving cavity 28 is closed laterally on two opposite sides.

The receiving cavity 28 has, in projection on a longitudinal plane, a closed contour.

In particular, the second side wall 112 delimiting the receiving cavity 28 is formed by the additional layers 30, 32, the upper layer 18, and the upper intermediate layer 20.

Each of the additional layers 30, 32, of the upper layer 18, and of the upper intermediate layer 20 is devoid of a through hole in a transverse direction at the level of the receiving cavity 28.

The first side wall 108 and the second side wall 112 thus extend vertically, without interruption, from the central layer 22 to the upper surface 80B of the second additional layer 32.

Thus, the receiving cavity 28 is delimited laterally, on either side of the axis of propagation X-X respectively, by the first side wall 108 and the second side wall 112.

A method of assembling the third waveguide assembly 10C has steps which are substantially identical to the steps of the method of assembling the first assembly 10A.

A fourth 10D waveguide assembly according to the invention is illustrated in the figure

8.

This fourth waveguide assembly 10D differs from the third waveguide assembly 10C in that the receiving cavity 28 is not blind in a vertical direction and is not open opposite the central layer 22 according to a vertical direction.

The receiving cavity 28 is closed laterally on either side of the propagation axis X-X, and is closed vertically on either side of the propagation axis XX.

The reception component 14 then comprises a closure layer 116 of the reception cavity 28.

The closing layer 116 covers the receiving cavity 28 and is arranged at a distance from the central layer 22.

When projected onto a longitudinal plane, the closure layer 116 covers the entire receiving cavity 28.

The closure layer 116 extends in a longitudinal plane.

It is arranged on the second additional layer 32.

The closure layer 116, the additional layers 30, 32, the upper layer 18, the upper intermediate layer 20, the central layer 22, the lower intermediate layer 24, and the lower layer 26 form a stack, in at least one region of the receiving component 14.

The closure layer 116 has an electrically conductive upper surface 118 and an electrically conductive lower surface 120.

The lower surface 120 of the closure layer 116 is in contact with the upper surface 80B of the second additional layer 32.

In a preferred embodiment, the closure layer 116 forms a substrate.

In the fourth waveguide assembly 10D, the closure layer 116 comprises an electrically conductive upper sublayer 122, a central dielectric sublayer 124 and a lower electrically conductive sublayer 126, the central dielectric sublayer 124 being interposed between the upper sublayer 122 and the lower sublayer 126.

The upper sublayer 122 and the lower sublayer 126 of the closure layer 116 are for example made of copper.

The central sub-layer 124 of the closure layer 116 is for example made of epoxy resin, or teflon.

The closure layer 116 extends in a longitudinal direction between a front edge 128 and a rear edge 130 transverse.

The front edge 128 and the rear edge 130 of the closure layer 116 are respectively flush with the front edges 90A, 90B and the rear edges 92A, 92B of the additional layers 30, 32.

The lateral borders 62 extend up to the closing layer 116. In particular, the vias of each lateral border 62 here also cross the closing layer 116.

In the fourth waveguide assembly 10D, the dimensions of the cavity are chosen such that, in operation, the reception cavity 28 has resonance modes associated with parasitic wavelengths, the parasitic wavelengths being outside of said operating bandwidth.

A method of assembling the fourth waveguide assembly 10D will now be described.

This assembly method differs from the assembly method of the first waveguide assembly 10A in that it further comprises a step of supplying the closure layer 116, the closure layer 116 being disposed away from the waveguide 16.

Following the step of mounting the layers of the receiving component 14, the method then comprises applying the closing layer 116 to the second additional layer 32.

The closure layer 116 is then fixed to the second additional layer 32, this fixing being for example produced by bonding with an electrically conductive adhesive or prepreg (prepreg), or by soldering.

This fixing step is carried out before the step of fitting out the plurality of vias. Thereafter, the plurality of vias is arranged in the form of rows through each of the layers 18, 20, 22, 24, 26, 30, 32 and also through the closing layer 116 to form said lateral borders 62.

In addition, this method of assembly differs from the method of assembling the first assembly 10A in that, during the step of cutting out the receiving cavity 28, the receiving cavity 28 is cut out in order to have selected dimensions of such so that in operation, the reception cavity 28 has resonance modes associated with parasitic wavelengths, the parasitic wavelengths being outside of said operating bandwidth.

In a variant not shown of the fourth waveguide assembly 10D, the closure layer 116 further comprises an absorption sublayer having an attenuation coefficient, for a wavelength between 0.1 μm and 1 m , between -0.5 dB and -50 dB.

The absorption sublayer is disposed integrally in the receiving cavity 28 between the active component 12 and the first additional layer 30. It is fixed to the first additional layer 30.

It is away from the transverse walls 96 and the side walls 108, 112 of the receiving cavity 28.

The absorption sublayer is not interposed between the first additional layer 30 and the upper layer 18.

A fifth waveguide assembly 10E according to the invention is illustrated in FIG. 9.

This fifth waveguide assembly 10E differs from the fourth waveguide assembly 10D in that the closure layer 116 is not formed by an electrically conductive upper sublayer, a central dielectric sublayer and a sublayer. lower electrically conductive.

In the fifth waveguide assembly 10E, the closure layer 116 includes a wave absorption sublayer 132 and an insulation sublayer 134.

The absorption sublayer 132 has a coefficient of attenuation, for a wavelength between 0.1 pm and 1 m, between -0.5 dB and -50 dB.

When projected onto a longitudinal plane, the absorption sub-layer 132 covers the entire receiving cavity 28.

The absorption sublayer 132 has a thickness, typically taken in a vertical direction, greater than 0.1 mm.

The insulation sublayer 134 is electrically conductive.

It is typically made of metal, for example copper.

The absorption sublayer 132 and the insulation sublayer 134 respectively have an upper surface 136A, 136B and a lower surface 138A, 138B.

The insulation sublayer 134 covers the absorption sublayer 132 in line with the receiving cavity 28. In particular, when projected on a longitudinal plane, the insulation sublayer 134 and the absorption sublayer 132 overlap and cover the entire receiving cavity 28.

The lower surface 138B of the insulation sublayer 134 is in contact with the upper surface 136A of the absorption sublayer 132. In addition, the lower surface 138A of the absorption sublayer 132 is in contact with the upper surface 80B of the second additional layer 32.

The vias of each lateral border 62 also pass through the absorption sublayer 132 and the insulation sublayer 134.

A method of assembling the fifth waveguide assembly 10E has steps substantially identical to the steps of the method of assembling the fourth waveguide assembly 10D.

A sixth waveguide assembly 10F according to the invention is illustrated in FIG. 10.

This sixth waveguide assembly 10F differs from the fifth waveguide assembly 10E in that, when projected onto a longitudinal plane, the insulation sublayer 134 does not cover the entire receiving cavity 28.

As illustrated in FIG. 10, the insulation sublayer 134 here has a through opening 140 leading to the absorption sublayer 132. In projection on a longitudinal plane, the through opening 140 has an overlapping inner contour around the receiving cavity 28.

In this example, when projected onto a longitudinal plane, the insulation sublayer 134 is arranged outside of the receiving cavity 28.

A method of assembling the sixth waveguide assembly 10F has steps substantially identical to the steps of the method of assembling the fourth waveguide assembly 10D.

As a variant of the sixth waveguide assembly 10F, the closure layer 116 is devoid of an electrically conductive insulation layer.

A seventh waveguide assembly according to the invention not shown differs from the first assembly 10A in that the receiving component 14 comprises a closing layer 116 of the receiving cavity 28 identical to the closing layer 116 described in the fourth set 10D, the fifth set, or the sixth set.

An eighth waveguide assembly according to the invention not shown differs from the second assembly 10B in that the reception component 14 comprises a closure layer 116 of the reception cavity 28 identical to the closure layer 116 described in the fourth assembly 10D, the fifth set, or the sixth set.

The embodiments described above can be combined in any technically possible combination.

Thanks to the characteristics described above, the waveguide assembly integrates an active component 12 in a passive structure with low losses and low costs.

Indeed, the receiving component 14 uses the standard manufacturing methods of multilayer printed circuits to be designed. Its manufacturing cost is therefore very low and its design time is rapid.

In addition, the waveguide assembly according to the invention is particularly compact.

An assembly open laterally or in a vertical direction, as in the first or second assembly 10A, 10B described, allows a simplification of the manufacture and mounting of the active component 12 in the receiving cavity 28 of the receiving component 14.

In addition, since the receiving cavity 28 is open, no resonance develops there and no parasitic wavelength disturbs the operation of the assembly.

A set closed laterally and in a vertical direction, as in the fourth and fifth sets, provides optimal protection against any external radiation, and greatly improves electromagnetic compatibility with other circuits.

In the fourth waveguide assembly 10D, since the dimensions of the reception cavity 28 are chosen so that the parasitic wavelengths are outside the operating bandwidth, these parasitic wavelengths do not disturb the operation of the waveguide assembly.

In the fifth waveguide assembly 10E, the absorption sublayer 132 absorbs waves having parasitic frequencies typically originating from the resonance of the cavity. In addition, the electrically conductive insulation sublayer 134 protects the active component 12 against any external radiation.

In the sixth set, the absorption sub-layer 132 absorbs waves from the outside and therefore improves the insulation of the active component 12 from the outside.

Claims (15)

1, -Wave guide assembly comprising a reception component (14) and an electronic active component (12) received by the reception component (14), the reception component (14) comprising a wave guide (16) , the waveguide (16) defining a propagation zone (40) extending along a propagation axis (XX), the waveguide (16) successively comprising, in a vertical direction orthogonal to l propagation axis, at least one upper layer (18), an upper intermediate layer (20), a central layer (22), a lower intermediate layer (24), and a lower layer (26), the upper intermediate layer ( 20) defining an upper longitudinal cavity (58) filled with a fluid or empty, the upper longitudinal cavity (58) being closed by the upper layer (18) and the central layer (22), the lower intermediate layer (24) defining laterally a lower longitudinal cavity (60 ) filled with a fluid or empty, the lower longitudinal cavity (60) being closed by the central layer (22) and the lower layer (26), the central layer (22) comprising an electrically conductive line (52), the component active (12) being electrically connected to the electrically conductive line (52); the receiving component (14) delimiting a receiving cavity (28) of the active component (12), the active component (12) being received in the receiving cavity (28), the receiving cavity (28) being arranged at least through the upper layer (18) and the upper intermediate layer (20), and extending in the vertical direction from the central layer (22) at least to an upper surface (42A) of the upper layer (18) . 2, - assembly according to claim 1, wherein the receiving cavity (28) is delimited by a bottom (94) at least formed by the central layer (22), and is delimited transversely by two transverse walls (96) perpendicular to the axis of propagation (XX), formed at least by the upper layer (18) and the upper intermediate layer (20). 3, - assembly according to any one of claims 1 or 2, wherein the receiving component (14) comprises at least a first additional layer (30) arranged on the upper layer (18), the receiving cavity (28) being further arranged at least through the first additional layer (30), and extending 28 in the vertical direction from the central layer (22) at least to an upper surface (80A) of the first additional layer (30). 4. - Assembly according to any one of claims 1 to 3, wherein the receiving cavity (28) is open laterally on at least one side. 5. - The assembly of claim 4, wherein the receiving cavity (28) is open laterally on two opposite sides. 6. - assembly according to any one of claims 1 to 4, in which the receiving cavity (28) is delimited parallel to the axis of propagation (XX) by at least one side wall formed by at least the upper layer ( 18) and the upper intermediate layer (20). 7. - An assembly according to any one of claims 1 to 3, wherein the receiving cavity (28) is delimited parallel to the axis of propagation (XX), on either side of the axis of propagation ( XX) respectively, by at least one side wall formed by at least the upper layer (18) and the upper intermediate layer (20). 8. - An assembly according to any one of claims 1 to 7, wherein the receiving cavity (28) is blind in a vertical direction, and open by opening opposite the central layer (22). 9. - Assembly according to any one of claims 1 to 7, in which the receiving component (14) comprises a closing layer (116) of the receiving cavity (28), the closing layer (116) covering the receiving cavity (28) and being arranged at a distance from the central layer (22). 10. - The assembly of claim 9, wherein the closure layer (116) comprises an electrically conductive upper sublayer, a central dielectric sublayer and an electrically conductive lower sublayer. 11. - assembly according to claim 9, in which the closure layer (116) comprises a wave absorption sublayer (132), the absorption sublayer (132) having a coefficient of attenuation, for a wavelength between 0.1 pm and 1 m, between -0.5 dB and -50 dB. 12, - assembly according to claim 11, wherein the closure layer (116) further comprises an insulation sublayer (134), the insulation sublayer (134) being electrically conductive and covering the sublayer absorption layer (132) in line with the receiving cavity (28). 13, - An assembly according to any one of claims 1 to 12, wherein, in projection on a longitudinal plane, the receiving cavity (28) has a larger dimension greater than 0.1 mm and less than 100 mm. 14, - Method for assembling a waveguide assembly comprising the following steps: - supply of an active electronic component (12); - supply of a reception component (14), the reception component (14) comprising a waveguide (16), the waveguide (16) extending along a propagation axis (XX ) and comprising at least an upper layer (18), an upper intermediate layer (20), a central layer (22), a lower intermediate layer (24), and a lower layer (26), the upper intermediate layer (20) defining an upper longitudinal cavity (58) filled with a fluid or empty, the upper longitudinal cavity (58) being closed by the upper layer (18) and the central layer (22), the lower intermediate layer (24) laterally defining a lower longitudinal cavity (60) filled with a fluid or empty, the lower longitudinal cavity (60) being closed by the central layer (22) and the lower layer (26), the central layer (22) comprising an electrically conductive line ( 52), the reception component n (14) delimiting a receiving cavity (28) of the active component (12), the receiving cavity (28) being arranged at least through the upper layer (18) and the upper intermediate layer (20), and s' extending orthogonally to the central layer (22) from the central layer (22) at least to an upper surface (42A) of the upper layer (18), the electronic active component (12) being separated from the component reception (14), and; - insertion of the active component (12) into the receiving cavity (28) of the receiving component (14), so that the active component (12) is electrically connected to the electrically conductive line (52) of the central layer (22 ), to form a waveguide assembly according to any one of claims 1 to 13. 15.- The method of claim 14, comprising a step of supplying the waveguide (16) of the receiving component (14) by an electromagnetic wave having a predetermined wavelength, the electromagnetic wave being converted into a signal input for the active component (12), the receiving cavity (28) having, in projection on a longitudinal plane, a larger dimension less than 10 times said predetermined wavelength.