WO2019080563A1 - 柔性太阳能电池芯片包装盒 - Google Patents

柔性太阳能电池芯片包装盒

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Publication number
WO2019080563A1
WO2019080563A1 PCT/CN2018/097226 CN2018097226W WO2019080563A1 WO 2019080563 A1 WO2019080563 A1 WO 2019080563A1 CN 2018097226 W CN2018097226 W CN 2018097226W WO 2019080563 A1 WO2019080563 A1 WO 2019080563A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
side wall
flexible solar
cell chip
card slot
Prior art date
Application number
PCT/CN2018/097226
Other languages
English (en)
French (fr)
Inventor
孙红霞
胡超
舒毅
朱朋建
陈凡
潘登
周波
Original Assignee
米亚索乐装备集成（福建）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 米亚索乐装备集成（福建）有限公司 filed Critical 米亚索乐装备集成（福建）有限公司
Publication of WO2019080563A1 publication Critical patent/WO2019080563A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/005—Side walls formed with an aperture or a movable portion arranged to allow removal or insertion of contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1082—Other
    • H01L2924/10821—Copper indium gallium selenide, CIGS [Cu[In,Ga]Se2]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/10—Photovoltaic [PV]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • Embodiments of the present application relate to, but are not limited to, the field of packaging boxes, and in particular, but not limited to, a flexible solar cell chip package.
  • Battery packaging has been widely used in the field of photovoltaic power generation, especially the packaging of flexible solar cell chips, and its packaging integrity directly affects the quality of flexible solar cell chips.
  • the existing flexible solar cell chip packaging technology is only covered by a plastic film and then placed in a vacuum polyester film packaging bag. This method is artificially interfering, and the operator's improper method can easily cause folding, bending, etc. Phenomenon, thereby damaging the flexible solar cell chip; on the other hand, the technology has the limitation that the position of the flexible solar cell chip cannot be completely fixed, which easily causes the flexible battery chip to sway during transportation, thereby causing problems such as folding, bending, deformation and the like.
  • the embodiment of the present application provides a flexible solar cell chip packaging box, which can avoid the problems of folding, bending and deformation during the transportation and handling of the flexible solar cell chip, and reduce the loss.
  • a housing comprising a bottom wall and a first side wall, the first side wall being vertically fixedly connected to the bottom wall, the first side wall and the bottom wall surrounding a receiving cavity, the receiving An opening is reserved in the cavity, and the first side wall is provided with a first card slot;
  • a cover comprising a top wall and a second side wall, the second side wall being vertically fixedly connected to the top wall, the top wall covering the opening, the second side wall sleeve Provided on the outer side of the first side wall.
  • the first card slot extends from a top end to a bottom end of the first side wall.
  • the first sidewall is provided with a plurality of the first card slots.
  • the plurality of the first card slots may be divided into at least one group, and each group includes two of the first card slots that are oppositely disposed.
  • the housing includes two first sidewalls disposed opposite to each other, and two of the first slots in each group are respectively disposed opposite to each other. On the side wall.
  • two sets of the first card slots are disposed on two opposite first sidewalls.
  • the housing has a rectangular parallelepiped shape, and the first card slot is disposed on the first side wall of the rectangular parallelepiped extending in a length direction.
  • the edge of the first card slot is a curved edge.
  • the edge of the first card slot is provided with a protective cover.
  • the second sidewall is provided with a second card slot.
  • the position of the second slot is offset from the position of the first slot.
  • the second card slot extends from a bottom end to a top end of the second side wall.
  • the second sidewall is provided with a plurality of the second card slots.
  • the plurality of the second card slots may be divided into at least one group, and each group includes two of the second card slots that are oppositely disposed.
  • the cover is in the shape of a rectangular parallelepiped, and the second slot is disposed on the second side wall of the rectangular parallelepiped extending in the length direction.
  • the flexible solar cell chip package further includes a first shielding piece for covering the first card slot, and the first card slot is provided with a first track on both sides thereof. Both side edges of the first shielding piece are inserted in the first track.
  • the flexible solar cell chip package further includes a second shielding piece for covering the second card slot, and a second track is disposed on both sides of the second card slot. Two side edges of the second shielding piece are inserted into the second track.
  • the inner side of the second side wall and/or the outer side of the first side wall are provided with a protrusion.
  • a cushion is disposed on an inner side surface of the bottom wall and/or the first side wall.
  • the bottom wall and the first side wall are adhesively fixed, and the top wall and the second side wall are adhesively fixed.
  • the flexible solar cell chip package provided by the embodiment of the present application includes a casing and a cover, wherein the casing includes a bottom wall and a first side wall, and the first side wall and the bottom wall are vertically fixedly connected, the first side wall and the bottom
  • the wall surrounds the accommodating cavity, the receiving cavity has an opening, and the first side wall is provided with a first card slot;
  • the shell cover comprises a top wall and a second side wall, and the second side wall is vertically fixedly connected with the top wall, and the top wall cover The second sidewall is sleeved on the first sidewall.
  • the flexible solar cell chip In use, the flexible solar cell chip is placed from the opening into the accommodating cavity, and then the case is covered with the cover, and the flexible solar cell chip can be protected to the greatest extent during the transportation of the flexible solar cell chip.
  • the cover When the flexible solar cell chip needs to be taken out of the package, the cover can be opened, and then the flexible solar cell chip can be grasped from the first card slot by using a manual or pick-up device, and the flexible solar cell chip can be taken out from the opening.
  • the use of the package is very convenient, and the problem of folding, bending and deformation of the flexible solar cell chip during the removal process is avoided.
  • FIG. 1 is a schematic axial view of a housing of a flexible solar cell chip package provided by an embodiment of the present application
  • FIG. 2 is a schematic axial view of a cover of a flexible solar cell chip package provided by an embodiment of the present application
  • FIG. 3 is a schematic exploded view of a housing assembly of a flexible solar cell chip package provided by an embodiment of the present application
  • Figure 4 is a schematic structural view of the housing of Figure 3;
  • Figure 5 is an enlarged schematic view showing the structure of the portion A of Figure 4.
  • FIG. 6 is a schematic exploded view of a cover assembly of a flexible solar cell chip package according to an embodiment of the present application.
  • Figure 7 is a schematic structural view of the cover of Figure 6;
  • Figure 8 is an enlarged schematic view showing the structure of the portion B of Figure 7;
  • FIG. 9 is a schematic exploded view of a flexible solar cell chip package provided by an embodiment of the present application.
  • the flexible solar cell chip package provided by the embodiment of the present application includes a casing 10 and a casing cover 20.
  • the housing 10 includes a bottom wall 11 and a first side wall 12 .
  • the first side wall 12 is vertically fixedly connected to the bottom wall 11 , and the first side wall 12 and the bottom wall 11 surround the receiving cavity 13 .
  • the receiving cavity 13 has an opening 14 defined therein, and the first sidewall 12 is provided with a first card slot 15; as shown in FIG. 2, the cover 20 includes a top wall 21 and a second sidewall 22, and the second sidewall 22 and the top
  • the wall 21 is vertically fixedly connected, the top wall 21 is covered on the opening 14, and the second side wall 22 is sleeved on the outer side of the first side wall 12.
  • first side wall and the second side wall may be one or more, depending on the shape of the package.
  • Both the housing 10 and the cover 20 described above may be made of plastic to reduce the weight of the entire package.
  • the flexible solar cell chip package provided by the embodiment of the present application, in use, places the flexible solar cell chip from the opening 14 into the accommodating cavity 13, and then covers the casing 10 using the cover 20 to transport the flexible solar cell chip. In the process, the flexible solar cell chip can be protected to the greatest extent, avoiding the problems of folding, bending and deformation, and reducing the loss during transportation of the flexible solar cell chip.
  • the cover 20 can be opened, and the flexible solar cell chip can be connected through the first card slot 15 by using a manual or pick-up device (eg, using a manual or pick-up device to place the flexible solar cell chip) By pinching or clamping, it is achieved at this time that the solar cell chip is grasped to take the flexible solar cell chip out of the opening 14.
  • a manual or pick-up device eg, using a manual or pick-up device to place the flexible solar cell chip
  • the first side wall 12 and the second side wall 22 may have an interference fit, a transition fit or a clearance fit. Since the housing 10 and the cover 20 are both made of plastic, when the first side wall 12 and the second side wall 22 are interference fit, the elasticity of the housing 10 and the cover 20 can be combined to fasten the package. Tightly, avoid accidentally opening the package and avoid dropping the flexible solar cell chip. The use of a clearance fit or a transition fit facilitates the worker to open the package and improve the efficiency of taking the flexible solar cell chip.
  • a locking mechanism may be disposed between the cover 20 and the housing 10,
  • a positioning hole may be formed in the second side wall 22 of the cover 20 and the first side wall 12 of the housing 10, and then the positioning pin is passed through the positioning hole to lock the cover 20 and the housing 10 during transportation. This arrangement also facilitates opening the cover 20 and picking up the flexible solar cell chip.
  • the edge of the first card slot 15 is set in order to avoid damage to the flexible solar cell chip by the edge of the first card slot 15.
  • the right angle edge of the first card slot 15 scratches the hand.
  • the protective sleeve may be wrapped on the edge of the first card slot 15 , and the protective cover may be made of a rubber material to prevent the flexible solar cell chip from being squeezed and bent when contacting the edge of the first card slot 15 . Waiting for the situation. At the same time, the protective cover can also protect the hand and prevent the hand from being scratched by the first card slot 15 during the process of picking and placing the flexible solar cell chip.
  • a second card slot 23 may be formed in the second side wall 22.
  • the second card slot 23 can be offset from the position of the first card slot 15.
  • the flexible solar cell chip can be grasped by the manual or pick-up device at the second card slot 23 of the cover 20 and the flexible solar cell chip can be removed from the case.
  • the cover 20 is taken out, and the entire package is not required to be placed in the whole, so that the flexible solar cell chip can be placed in the casing 10 for multiple operations, thereby improving the convenience of use of the package.
  • the edge of the second card slot 23 can also be arranged as an arc edge, that is, a chamfer is provided at the edge of the second card slot 23 (see FIG. 8).
  • the protective cover can also be wrapped on the edge of the second card slot 23, and the protective cover can be made of a rubber material to prevent the flexible solar cell chip from being squeezed and bent when it contacts the edge of the second card slot 23. .
  • the protective cover can also protect the hand and prevent the hand from being scratched by the second card slot 23 during the process of picking up and placing the flexible solar cell chip.
  • the flexible solar cell chip is entirely placed in the cover 20, and an indication mark may be provided on the package to prevent the package from being inverted and causing erroneous operation.
  • an arrow may be provided on the second side wall 22 of the cover 20 to indicate the up and down direction of the package.
  • a first shielding piece 16 may be disposed at the first card slot 15, and the first shielding piece 16 is used to block the first card slot 15.
  • the first card slot 15 can be blocked to avoid accidental damage of the flexible solar cell chip.
  • the first shielding piece 16 is removed, so that Take the flexible solar cell chip.
  • the first card slot 15 can be disposed on both sides of the first card slot 15 , and the two sides of the first shielding plate 16 are inserted into the first track 17 and can be along the first The track 17 slides.
  • a second shielding piece 24 can be disposed at the second card slot 23, and the second shielding piece 24 is used to block the second card slot 23.
  • a second track 25 may be disposed on both sides of the second card slot 23, and both side edges of the second shielding piece 24 are inserted on the second track 25 and may be along the second track. 25 slides.
  • the size and shape of the housing 10 and the cover 20 can be practically designed according to the size and shape of the flexible solar cell chip, for example, the flexible solar cell chip is circular, and accordingly, the housing Both the 10 and the cover 20 may be provided in a circular shape.
  • the flexible solar cell chip is mostly rectangular (including a square), and therefore, in an exemplary embodiment, the housing 10 may have a rectangular parallelepiped shape (including a cube shape), and accordingly, the cover 20 is also a rectangular parallelepiped.
  • Shape including cube shape
  • the shape of the bottom wall 11 is a rectangle
  • the number of the first side walls 12 is four
  • the four first side walls 12 are respectively fixedly connected to the four sides of the bottom wall 11 respectively, and the adjacent first side The walls 12 are each fixedly connected.
  • the shape of the top wall 21 is rectangular
  • the number of the second side walls 22 is four.
  • the four second side walls 22 are respectively fixedly connected to the four sides of the top wall 21, and the adjacent second side walls 22 are fixedly connected.
  • the package requires a flexible solar cell chip (e.g., a flexible CIGS battery chip) having a length of 312 mm, a width of 56.95 mm, and a thickness of 0.23 mm.
  • the housing 10 may be sized to have a length of 323 mm, a width of 67.5 mm, and a height of 68 mm as needed; please refer to FIG. 1 in which the X direction is the length direction, the Y direction is the width direction, and the Z direction is the height direction.
  • the cover 20 is sized to have a length of 331 mm, a width of 75.5 mm, and a height of 68 mm. Referring to FIG.
  • the X direction is the length direction
  • the Y direction is the width direction
  • the Z direction is the height direction.
  • the wall thickness of the housing 10 and the cover 20 may be 3 mm. In the package of this size, 177 pieces of flexible solar cell chips of the above size can be placed in the accommodating chamber 13.
  • the first card slot 15 may extend from the top end to the bottom end of the first side wall 12 (the top and bottom ends herein are referenced in the direction of FIG. 1). That is, the flexible solar cell chips located at the bottommost layer and the topmost layer of the accommodating cavity 13 can be grasped from the first card slot 15 for easy removal, which increases the convenience of the flexible solar cell chip.
  • the second card slot 23 can extend from the bottom end of the second side wall 22 to the top end.
  • the first sidewall 12 is provided with a plurality of first card slots 15 .
  • the flexible solar cell chip can be multi-pointed from the plurality of first card slots 15 . Grab for easy to take out.
  • the plurality of first card slots 15 can be divided into at least one group, and each group includes two first card slots 15 disposed oppositely, so that the flexible solar cell chip is grasped from the first card slot 15 for picking.
  • the thumb and forefinger (or middle finger) of the hand can respectively grab (eg, clamp) the two sides of the flexible solar cell chip from the two first card slots 15 disposed opposite each other. It can be understood that both sides of the flexible solar cell chip can also be grasped from the two first card slots 15 disposed opposite each other by other instruments to take out the flexible solar cell chip.
  • the housing 10 (such as the rectangular parallelepiped housing 10) may include two first sidewalls 12 disposed opposite each other, and the two first slots 15 in each group are respectively disposed on opposite first sides of the two sides. On the wall 12.
  • Two sets of first card slots can be disposed on the two opposite side walls 12, that is, two first card slots 15 can be opened on the two opposite first side walls 12, and one first side wall 12 is The two first card slots 15 are respectively disposed in one-to-one correspondence with the two first card slots 15 on the opposite first side wall 12 .
  • the flexible solar cell chip When the flexible solar cell chip is grasped from the first card slot 15 for grasping, the two hands can cooperate with each other to grasp the two ends of the flexible solar cell chip, so as to facilitate the take-up and prevent the solar cell from being taken during the process.
  • the chip is deformed. It should be understood that one or more than one set of first card slots may be disposed on the two first sidewalls 12 disposed opposite each other, and the number of the first card slots may be set according to the length of the flexible solar cell chip.
  • the housing 10 has a rectangular parallelepiped shape, and the first card slot 15 is disposed on the first side wall 12 of the rectangular parallelepiped extending in the longitudinal direction (ie, the X direction in FIG. 1) so that Both ends of the solar cell chip along the length direction can be grasped when taken.
  • the size of the first card slot 15 can be designed according to actual needs.
  • four first card slots 15 are disposed on two first side walls 12 extending in the length direction, wherein the first card slot 15 on the left side is away from the first side wall 12
  • the distance of the edge of the side may be 50 mm
  • the distance of the first card slot 15 on the right side from the edge of the right side of the first side wall 12 may be 50 mm
  • the length of each of the first card slots 15 in the X direction may be 40 mm.
  • a plurality of second card slots 23 can be formed in the second sidewall 22 .
  • the position, number, size, and the like of the second card slot 23 may be the same as or different from the first card slot.
  • the cover 20 has a rectangular parallelepiped shape, and two second slots 23 are disposed on the two second sidewalls 22 extending in the longitudinal direction of the rectangular parallelepiped, and two The two card slots 23 are oppositely disposed so that when the flexible solar cell chip is entirely placed in the case cover 20, the solar cell chips can be grasped from the two second card slots 23 and then taken.
  • protrusions may be provided on the inner side of the second side wall 22 and/or the outer side of the first side wall 12.
  • the protrusion can increase the mating force between the first side wall 12 and the second side wall 22 to prevent the cover 20 from loosening during transportation, causing the flexible solar cell chip to fall, causing unnecessary loss.
  • the outer side of the first side wall 12 of the housing 10 is provided with a projection 19.
  • the inner side of the second side wall 22 of the cover 20 is provided with a projection 27.
  • a cushion may be disposed on the bottom wall 11 and/or the first side wall 12 of the housing 10.
  • the cushion can prevent the flexible solar cell chip from being damaged and buffering due to falling or the like during transportation of the package.
  • a cushion 18 is disposed on the bottom wall 11 and the opposite first side walls 12.
  • a cushion 18 is provided on the bottom wall 11.
  • the cushion 18 may be a layer of plastic soft film, or a rubber sheet, or a sponge sheet or the like.
  • a cushion may be disposed on the top wall 21 of the cover 20.
  • the cushion can act as a buffer to avoid damage to the flexible solar cell chip.
  • a cushion 26 is provided on the top wall 21 of the cover 20.
  • the cushion 26 may be a layer of plastic soft film, or a rubber sheet, or a sponge sheet or the like.
  • the package is preferably made of acrylic plastic material.
  • the package made of the material has a flat surface, clean and no bumps, and has no slag, no color difference and no deformation.
  • the bottom wall 11 and the first side wall 12 may be bonded together by hot melt adhesive, and the top wall 21 and the second side wall 22 are bonded together by hot melt adhesive.
  • the bottom wall 11 and the first side wall 12, the top wall 21 and the second side wall 22 may also be fixedly connected by other means such as welding, or the bottom wall 11 and the first side wall. 12.
  • the top wall 21 and the second side wall 22 may be integrally formed by injection molding or the like.
  • all edges L of the housing 10 and the cover 20 are chamfered (the radius of the chamfer is 0.3 mm), all the corners L1 Chamfers are set (the radius of the chamfer is 1mm).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Buffer Packaging (AREA)

Abstract

一种柔性太阳能电池芯片包装盒，包括壳体(10)和壳盖(20)，其中，壳体(10)包括底壁(11)和第一侧壁(12)，第一侧壁(12)与底壁(11)垂直固定连接，第一侧壁(12)和底壁(11)围合成容纳腔(13)，容纳腔(13)预留有开口(14)，第一侧壁(12)上开设有第一卡槽(15)；壳盖(20)包括顶壁(21)和第二侧壁(22)，第二侧壁(22)与顶壁(21)垂直固定连接，顶壁(21)盖合于开口(14)上，第二侧壁(22)套设于第一侧壁(12)的外侧。

Description

柔性太阳能电池芯片包装盒
本申请基于申请号为201721384663.3、申请日为2017.10.25的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请实施例涉及但不限于包装盒技术领域，尤其涉及但不限于一种柔性太阳能电池芯片包装盒。
背景技术
电池包装已经广泛的应用在光伏发电领域，尤其是柔性太阳能电池芯片的包装，其包装完整度直接影响柔性太阳能电池芯片的质量。
现有的柔性太阳能电池芯片包装技术仅仅是通过塑料薄膜包覆，再放入真空聚酯薄膜包装袋中，此方法一方面人为干涉性较强，操作人员的手法不当极易引起折角、弯曲等现象，从而损坏柔性太阳能电池芯片；另一方面该技术具有不能完全固定柔性太阳能电池芯片位置的局限性，容易引起柔性电池芯片在运输过程中晃动，从而造成折角、弯曲、形变等问题。
发明概述
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种柔性太阳能电池芯片包装盒，可避免柔性太阳能电池芯片运输和拿取过程中，出现折角、弯曲和变形问题，降低损失。
本申请实施例提供的柔性太阳能电池芯片包装盒，包括：
壳体，所述壳体包括底壁和第一侧壁，所述第一侧壁与所述底壁垂直固定连接，所述第一侧壁和所述底壁围合成容纳腔，所述容纳腔预留有开口， 所述第一侧壁上开设有第一卡槽；
壳盖，所述壳盖包括顶壁和第二侧壁，所述第二侧壁与所述顶壁垂直固定连接，所述顶壁盖合于所述开口上，所述第二侧壁套设于所述第一侧壁的外侧。
在一示例性实施例中，所述第一卡槽从所述第一侧壁的顶端延伸至底端。
在一示例性实施例中，所述第一侧壁上开设有多个所述第一卡槽。
在一示例性实施例中，多个所述第一卡槽可分成至少一组，每一组包括相对地设置的两个所述第一卡槽。
在一示例性实施例中，所述壳体包括相对设置的两个所述第一侧壁，每一组中的两个所述第一卡槽分别设置在相对设置的两个所述第一侧壁上。
在一示例性实施例中，相对设置的两个所述第一侧壁上设有两组所述第一卡槽。
在一示例性实施例中，所述壳体呈长方体状，所述第一卡槽设置在所述长方体的沿长度方向延伸的所述第一侧壁上。
在一示例性实施例中，所述第一卡槽的边沿为弧形边。
在一示例性实施例中，所述第一卡槽的边沿设置有保护套。
在一示例性实施例中，所述第二侧壁上开设有第二卡槽。
在一示例性实施例中，所述第二侧壁套设于所述第一侧壁外侧时，所述第二卡槽与所述第一卡槽的位置错开。
在一示例性实施例中，所述第二卡槽从所述第二侧壁的底端延伸至顶端。
在一示例性实施例中，所述第二侧壁上开设有多个所述第二卡槽。
在一示例性实施例中，多个所述第二卡槽可分成至少一组，每一组包括相对地设置的两个所述第二卡槽。
在一示例性实施例中，所述壳盖呈长方体状，所述第二卡槽设置在所述长方体的沿长度方向延伸的所述第二侧壁上。
在一示例性实施例中，所述的柔性太阳能电池芯片包装盒还包括用于遮盖所述第一卡槽的第一遮挡片，所述第一卡槽的两侧设置有第一轨道，所述 第一遮挡片的两侧边缘插设于所述第一轨道内。
在一示例性实施例中，所述的柔性太阳能电池芯片包装盒还包括用于遮盖所述第二卡槽的第二遮挡片，所述第二卡槽的两侧设置有第二轨道，所述第二遮挡片的两侧边缘插设于所述第二轨道内。
在一示例性实施例中，所述第二侧壁的内侧面和/或所述第一侧壁的外侧面设置有凸起。
在一示例性实施例中，所述底壁和/或所述第一侧壁的内侧面上设置有缓冲垫。
在一示例性实施例中，所述底壁和所述第一侧壁粘接固定，所述顶壁和所述第二侧壁粘接固定。
本申请实施例提供的柔性太阳能电池芯片包装盒，包括壳体和壳盖，其中，壳体包括底壁和第一侧壁，第一侧壁与底壁垂直固定连接，第一侧壁和底壁围合成容纳腔，容纳腔预留有开口，第一侧壁上开设有第一卡槽；壳盖包括顶壁和第二侧壁，第二侧壁与顶壁垂直固定连接，顶壁盖合于开口上，第二侧壁套设于第一侧壁上。使用时，将柔性太阳能电池芯片从开口处放置至容纳腔中，然后使用壳盖将壳体盖合，在柔性太阳能电池芯片运输过程中，可以最大程度的保护柔性太阳能电池芯片。在需要将柔性太阳能电池芯片从包装盒中拿出来时，可以打开壳盖，然后从第一卡槽处利用人工或拾取装置抓取柔性太阳能电池芯片，并将柔性太阳能电池芯片从开口处取出，使得包装盒的使用非常方便，避免柔性太阳能电池芯片在取出过程中出现折角、弯曲和变形问题。
在阅读并理解了附图概述和本申请的实施方式后，可以明白其他方面。
附图概述
图1为本申请实施例提供的柔性太阳能电池芯片包装盒的壳体的轴测示意图；
图2为本申请实施例提供的柔性太阳能电池芯片包装盒的壳盖的轴测示意图；
图3为本申请实施例提供的柔性太阳能电池芯片包装盒的壳体组件的分解结构示意图；
图4为图3中壳体的结构示意图；
图5为图4的A部结构的放大示意图；
图6为本申请实施例提供的柔性太阳能电池芯片包装盒的壳盖组件的分解结构示意图；
图7为图6中壳盖的结构示意图；
图8为图7的B部结构的放大示意图；
图9为本申请实施例提供的柔性太阳能电池芯片包装盒的分解结构示意图。
附图标记说明：
10-壳体       11-底壁       12-第一侧壁     13-容纳腔
14-开口       15-第一卡槽   16-第一遮挡片   17第一轨道
18-缓冲垫     19-凸起       20-壳盖         21-顶壁
22-第二侧壁   23-第二卡槽   24-第二遮挡片   25第二轨道
26-缓冲垫     27-凸起
详述
下面详细描述本申请的实施例，实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能解释为对本申请的限制。
如图1和图2所示，本申请实施例提供的柔性太阳能电池芯片包装盒，包括壳体10和壳盖20。
其中，如图1所示，壳体10包括底壁11和第一侧壁12，第一侧壁12与底壁11垂直固定连接，第一侧壁12和底壁11围合成容纳腔13，容纳腔13预留有开口14，第一侧壁12上开设有第一卡槽15；如图2所示，壳盖20 包括顶壁21和第二侧壁22，第二侧壁22与顶壁21垂直固定连接，顶壁21盖合于开口14上，第二侧壁22套设于第一侧壁12的外侧。
本领域技术人员可以理解的是，上述第一侧壁和第二侧壁的数量可以为一个或者多个，具体根据包装盒的形状确定。上述壳体10和壳盖20均可以采用塑料制成，以降低整个包装盒的重量。
本申请实施例提供的柔性太阳能电池芯片包装盒，使用时，将柔性太阳能电池芯片从开口14处放置至容纳腔13中，然后使用壳盖20将壳体10盖合，在柔性太阳能电池芯片运输过程中，可以最大程度的保护柔性太阳能电池芯片，避免了出现折角、弯曲和变形的问题，降低了运输柔性太阳能电池芯片过程中的损失。在需要将柔性太阳能电池芯片从包装盒中取出时，可以打开壳盖20，利用人工或拾取装置通过第一卡槽15实现与柔性太阳能电池芯片连接(如利用人工或拾取装置将柔性太阳能电池芯片捏紧或夹持住)，此时实现了抓取太阳能电池芯片，以便将柔性太阳能电池芯片从开口14处取出。第一卡槽15的设置，使得包装盒的使用非常方便，避免柔性太阳能电池芯片在取出过程中出现折角、弯曲和变形的问题。
在壳盖20盖合至壳体10上时，第一侧壁12与第二侧壁22可以过盈配合、过渡配合或者间隙配合。由于壳体10和壳盖20均采用塑料制成，当第一侧壁12和第二侧壁22过盈配合时，结合壳体10和壳盖20的弹性，可以将包装盒扣合的更紧，避免包装盒意外打开，避免了柔性太阳能电池芯片掉落。采用间隙配合或者过渡配合则便于工人打开包装盒，提高拿取柔性太阳能电池芯片的效率，而此时为了防止壳盖20意外打开，可以在壳盖20与壳体10之间设置锁止机构，如可以在壳盖20的第二侧壁22和壳体10的第一侧壁12上开设定位孔，然后用定位销穿过定位孔，以将壳盖20与壳体10在运输过程中锁止，这样的设置，同时也便于打开壳盖20、取放柔性太阳能电池芯片。
从第一卡槽15处抓取柔性太阳能电池芯片并从开口14处将柔性太阳能电池芯片取出时，为了避免第一卡槽15的边沿损伤柔性太阳能电池芯片，将第一卡槽15的边沿设置为弧形边，即在第一卡槽15的边沿处设置倒角(见图5)，避免直角边沿损伤柔性太阳能电池芯片，并且避免从第一卡槽15处 抓取柔性太阳能电池芯片并从开口14处取放柔性太阳能电池芯片时，第一卡槽15的直角边沿刮伤手。
可选地，可以在第一卡槽15的边沿包裹保护套，该保护套可以选择橡胶材质制成，以避免柔性太阳能电池芯片与第一卡槽15边沿接触时，被挤压而出现弯折等情况。同时该保护套也可以在取放柔性太阳能电池芯片的过程中起到保护手、避免手被第一卡槽15刮伤的作用。
当操作人员需要拿取柔性太阳能电池芯片时，正常情况下，包装盒为正置放置，即壳盖20位于壳体10的上方，但是，有时，可能包装盒是倒置的，在包装盒倒置的情况下，操作人员容易误操作而从壳体10一侧打开包装盒。为了解决该问题，在图6、图7和图9所示的实施例中，可以在第二侧壁22上开设第二卡槽23。在第二侧壁22套设于所述第一侧壁12外侧时，第二卡槽23可与第一卡槽15的位置相互错开。此时若出现柔性太阳能电池芯片整体倒置于壳盖20中的情况时，可以在壳盖20的第二卡槽23处利用人工或拾取装置抓取柔性太阳能电池芯片并将柔性太阳能电池芯片从壳盖20中拿出，无需再将包装盒整体正置，避免了多次操作后才能使柔性太阳能电池芯片置于壳体10中进行拿取，提高了包装盒的使用便利性。
其中，第二卡槽23的边沿也可以设置为弧形边，即在第二卡槽23的边沿处设置倒角(见图8)。还可以在第二卡槽23的边沿包裹保护套，该保护套可以选择橡胶材质制成，以避免柔性太阳能电池芯片与第二卡槽23的边沿接触时，被挤压而出现弯折等情况。该保护套也可以在取放柔性太阳能电池芯片的过程中起到保护手、避免手被第二卡槽23刮伤的作用。
为了防止误操作而将包装盒从壳体10一侧打开，导致柔性太阳能电池芯片整体倒置于壳盖20中，还可以在包装盒上设置指示标识，以防止包装盒倒置进而导致的误操作。如：可以在壳盖20的第二侧壁22上设置箭头以指示包装盒的上下方向。
在一示例性实施例中，如图3所示，可以在第一卡槽15处设置第一遮挡片16，该第一遮挡片16用于遮挡第一卡槽15。在不需要拿取柔性太阳能电池芯片时，可以将第一卡槽15遮挡，避免柔性太阳能电池芯片意外受损，在需要拿取柔性太阳能电池芯片时，再将第一遮挡片16移走，以便于拿取柔性 太阳能电池芯片。
其中，如图4和图5所示，第一卡槽15的两侧可设置有第一轨道17，第一遮挡片16的两侧边缘插设于第一轨道17内，并且可以沿第一轨道17滑动。同样的道理，如图6所示，可以在第二卡槽23处设置第二遮挡片24，该第二遮挡片24用于遮挡第二卡槽23。如图7和图8所示，可在第二卡槽23的两侧设置第二轨道25，第二遮挡片24的两侧边缘插设于第二轨道25上，并可以沿该第二轨道25滑动。
本领域技术人员可以理解的是，壳体10和壳盖20的尺寸和形状可以根据柔性太阳能电池芯片的尺寸和形状进行实际设计，例如：柔性太阳能电池芯片为圆形，则相应地，壳体10和壳盖20可以均设置为圆形。
在实际生产过程中，柔性太阳能电池芯片以长方形(包括正方形)居多，因此，在一个示例性实施例中，壳体10可以为长方体状(包括立方体状)，相应地，壳盖20也为长方体状(包括立方体状)。在一个具体的示例中，底壁11的形状为长方形，第一侧壁12的数量为四个，四个第一侧壁12分别与底壁11的四边垂直固定连接，相邻的第一侧壁12均固定连接。顶壁21的形状为长方形，第二侧壁22的数量为四个，四个第二侧壁22分别与顶壁21的四边垂直固定连接，相邻的第二侧壁22均固定连接。
在一个实施例中，包装盒需要放置长度为312mm，宽度为56.95mm，厚度为0.23mm的柔性太阳能电池芯片(如柔性CIGS电池芯片)。根据需要，可以将壳体10的尺寸设计成长度323mm，宽度67.5mm，高度68mm；请参考图1，其中X方向为长度方向，Y方向为宽度方向，Z方向为高度方向。相应地，壳盖20的尺寸设计成长度331mm，宽度75.5mm，高度68mm；请参考图2，其中X方向为长度方向，Y方向为宽度方向，Z方向为高度方向。壳体10和壳盖20的壁厚可为3mm。该种尺寸的包装盒，其容纳腔13中可以放置177片上述尺寸的柔性太阳能电池芯片。
为了便于使用者拿取柔性太阳能电池芯片，第一卡槽15可从第一侧壁12的顶端延伸至底端(此处的顶端和底端以附图1中的方向为参考)。也即位于容纳腔13最底层和最顶层的柔性太阳能电池芯片均可以从第一卡槽15处进行抓取以便于取出，增加了柔性太阳能电池芯片拿取的便利性。相同地， 第二卡槽23可从第二侧壁22的底端延伸至顶端。
在一示例性实施例中，第一侧壁12上开设有多个第一卡槽15，拿取柔性太阳能电池芯片时，可以从多个第一卡槽15处对柔性太阳能电池芯片进行多点抓取以便于拿出。
其中，多个第一卡槽15可分成至少一组，每一组包括相对地设置的两个第一卡槽15，这样从第一卡槽15处抓取住柔性太阳能电池芯片进行拿取时，手的拇指和食指(或中指)可分别从相对设置的两个第一卡槽15处抓取(如夹持住)柔性太阳能电池芯片的两侧。可以理解的是，也可以通过其他器械从相对设置的两个第一卡槽15处抓取柔性太阳能电池芯片的两侧，以将柔性太阳能电池芯片取出。
其中，壳体10(如长方体状的壳体10)可包括相对设置的两个第一侧壁12，每一组中的两个第一卡槽15分别设置在相对设置的两个第一侧壁12上。
相对设置的两个第一侧壁12上可设有两组第一卡槽，即可以在两相对的第一侧壁12上均开设两个第一卡槽15，且一个第一侧壁12上的两个第一卡槽15与相对设置的另一个第一侧壁12上的两个第一卡槽15分别一一对应设置。这样从第一卡槽15处抓取柔性太阳能电池芯片进行拿取时，两只手可以相互配合，分别抓取柔性太阳能电池芯片的两端，以便于拿取，且防止拿取过程中太阳能电池芯片变形。应当理解，相对设置的两个第一侧壁12上也可以设置一组或3组以上的第一卡槽，第一卡槽的数量可以根据柔性太阳能电池芯片的长度设置。
在附图1所示的实施例中，壳体10呈长方体状，且第一卡槽15设置在长方体的沿长度方向(即图1中的X方向)延伸的第一侧壁12上，以便拿取时可以抓取太阳能电池芯片的沿长度方向的两端。
第一卡槽15的尺寸可以根据实际需要进行设计。在图1所示的一个实施例中，4个第一卡槽15设置在沿长度方向延伸的两个第一侧壁12上，其中左侧的第一卡槽15距第一侧壁12左侧的边缘的距离可为50mm，右侧的第一卡槽15距第一侧壁12右侧的边缘的距离可为50mm，每一个第一卡槽15沿X方向的长度可为40mm。
同样地，第二侧壁22上可以开设多个第二卡槽23。第二卡槽23的设置位置、数量、尺寸等可与第一卡槽相同，或者不同。在图6和图7所示的实施例中，壳盖20呈长方体状，且两个第二卡槽23设置在长方体的沿长度方向延伸的两个第二侧壁22上，且两个第二卡槽23相对设置，以便柔性太阳能电池芯片整体倒置于壳盖20中时，可以从两个第二卡槽23处抓取太阳能电池芯片，然后再进行拿取。
为了增加壳盖20盖合在壳体10上的紧固性，可在第二侧壁22的内侧面和/或第一侧壁12的外侧面设置有凸起。该凸起可以增加第一侧壁12和第二侧壁22之间的配合力，避免壳盖20在运输过程中松脱，导致柔性太阳能电池芯片掉落，造成不必要的损失。在图3、图4所示的实施例中，壳体10的第一侧壁12的外侧面上设有凸起19。在图6、图7所示的实施例中，壳盖20的第二侧壁22的内侧面上设有凸起27。
壳体10的底壁11和/或第一侧壁12上可设置有缓冲垫。缓冲垫可以避免包装盒运输过程中，由于摔落等原因，导致柔性太阳能电池芯片损伤，起到缓冲作用。在图3所示的实施例中，底壁11和相对的两个第一侧壁12上设置有缓冲垫18。在图9所示的实施例中，底壁11上设置有缓冲垫18。在一示例性实施例中，该缓冲垫18可以是一层塑料软薄膜，或者是橡胶薄片，或者是海绵薄片等。
同样地，壳盖20的顶壁21上可设置有缓冲垫。缓冲垫可以起到缓冲作用，避免柔性太阳能电池芯片损伤。在图6、图9所示的实施例中，壳盖20的顶壁21上设置有缓冲垫26。在一示例性实施例中，该缓冲垫26可以是一层塑料软薄膜，或者是橡胶薄片，或者是海绵薄片等。
为了降低包装盒的整体重量，降低运输负担，包装盒优选采用亚克力塑料材质，该材质制成的包装盒，表面平整、干净且没有凹凸点，另外，无掉渣、无色差、无变形。
在加工过程中，可采用热熔胶将底壁11和第一侧壁12粘接成一体，采用热熔胶将顶壁21和第二侧壁22粘接成一体。本领域技术人员可以理解的是，底壁11和第一侧壁12、顶壁21和第二侧壁22之间也可以采用焊接等其他方式固定连接，或者，底壁11和第一侧壁12、顶壁21和第二侧壁22 可通过注塑等方式一体成型。
为了避免包装盒的边沿磕碰柔性太阳能电池芯片，同时增加包装盒的美观性，壳体10和壳盖20的所有边沿L均设置倒角(倒角的半径为0.3mm)，所有的边角L1均设置倒角(倒角的半径为1mm)。
在本申请的描述中，术语“多个”指两个或更多个。
以上依据图式所示的实施例详细说明了本申请实施例的构造、特征及作用效果，以上仅为本申请的示例性的实施例，但本申请不以图面所示限定实施范围，凡是依照本申请实施例的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本申请的保护范围内。

Claims (15)

  1. 一种柔性太阳能电池芯片包装盒，其中，包括：
    壳体，所述壳体包括底壁和第一侧壁，所述第一侧壁与所述底壁垂直固定连接，所述第一侧壁和所述底壁围合成容纳腔，所述容纳腔预留有开口，所述第一侧壁上开设有第一卡槽；
    壳盖，所述壳盖包括顶壁和第二侧壁，所述第二侧壁与所述顶壁垂直固定连接，所述顶壁盖合于所述开口上，所述第二侧壁套设于所述第一侧壁的外侧。
  2. 根据权利要求1所述的柔性太阳能电池芯片包装盒，其中，所述第一卡槽从所述第一侧壁的顶端延伸至底端。
  3. 根据权利要求1或2所述的柔性太阳能电池芯片包装盒，其中，所述第一侧壁上开设有多个所述第一卡槽。
  4. 根据权利要求3所述的柔性太阳能电池芯片包装盒，其中，多个所述第一卡槽可分成至少一组，每一组包括相对地设置的两个所述第一卡槽。
  5. 根据权利要求4所述的柔性太阳能电池芯片包装盒，其中，所述壳体包括相对设置的两个所述第一侧壁，每一组中的两个所述第一卡槽分别设置在相对设置的两个所述第一侧壁上。
  6. 根据权利要求5所述的柔性太阳能电池芯片包装盒，其中，相对设置的两个所述第一侧壁上设有两组所述第一卡槽。
  7. 根据权利要求1-6中任一项所述的柔性太阳能电池芯片包装盒，其中，所述壳体呈长方体状，所述第一卡槽设置在所述长方体的沿长度方向延伸的所述第一侧壁上。
  8. 根据权利要求1-7中任一项所述的柔性太阳能电池芯片包装盒，其中，所述第一卡槽的边沿为弧形边。
  9. 根据权利要求1-8中任一项所述的柔性太阳能电池芯片包装盒，其中，所述第一卡槽的边沿设置有保护套。
  10. 根据权利要求1-9中任一项所述的柔性太阳能电池芯片包装盒，还 包括用于遮盖所述第一卡槽的第一遮挡片，所述第一卡槽的两侧设置有第一轨道，所述第一遮挡片的两侧边缘插设于所述第一轨道内。
  11. 根据权利要求1-10中任一项所述的柔性太阳能电池芯片包装盒，其中，所述第二侧壁上开设有第二卡槽。
  12. 根据权利要求11所述的柔性太阳能电池芯片包装盒，其中，所述第二侧壁套设于所述第一侧壁外侧时，所述第二卡槽与所述第一卡槽的位置错开。
  13. 根据权利要求1-12中任一项所述的柔性太阳能电池芯片包装盒，其中，所述第二侧壁的内侧面和/或所述第一侧壁的外侧面设置有凸起。
  14. 根据权利要求1-13中任一项所述的柔性太阳能电池芯片包装盒，其中，所述底壁和/或所述第一侧壁的内侧面设置有缓冲垫。
  15. 根据权利要求1-14中任一项所述的柔性太阳能电池芯片包装盒，其中，所述底壁和所述第一侧壁粘接固定，和/或，所述顶壁和所述第二侧壁粘接固定。
PCT/CN2018/097226 2017-10-25 2018-07-26 柔性太阳能电池芯片包装盒 WO2019080563A1 (zh)

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