WO2019071657A1 - 一种玻璃基板的布线结构、玻璃基板及显示装置 - Google Patents

一种玻璃基板的布线结构、玻璃基板及显示装置 Download PDF

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WO2019071657A1
WO2019071657A1 PCT/CN2017/108287 CN2017108287W WO2019071657A1 WO 2019071657 A1 WO2019071657 A1 WO 2019071657A1 CN 2017108287 W CN2017108287 W CN 2017108287W WO 2019071657 A1 WO2019071657 A1 WO 2019071657A1
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glass substrate
connecting lines
mux
line
wiring structure
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PCT/CN2017/108287
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English (en)
French (fr)
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吴焕达
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深圳市华星光电半导体显示技术有限公司
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Priority to US15/745,121 priority Critical patent/US10566306B2/en
Publication of WO2019071657A1 publication Critical patent/WO2019071657A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/171—Frame
    • H01L2924/176—Material
    • H01L2924/17786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/17788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular, to a wiring structure of a glass substrate, a glass substrate, and a display device.
  • the multi-channel distributor MUX to the integrated circuit IC is basically connected by a plurality of equal-width line-width connecting lines a, but is limited by The wiring space between the MUX and the IC, the wiring resistance has not been improved, and the charging effect of the glass substrate cannot be improved.
  • a technical problem to be solved by the embodiments of the present invention is to provide a wiring structure of a glass substrate, a glass substrate, and a display device, which can reduce the wiring resistance value in the existing limited wiring space and improve the charging effect of the glass substrate.
  • an embodiment of the present invention provides a wiring junction of a glass substrate.
  • the demultiplexer MUX and the integrated circuit IC comprising a plurality of connecting lines, both ends of which are connected to the MUX and the IC, and between any two adjacent connecting lines Pre-set spacing is reserved;
  • One or more conductive protruding teeth are disposed on at least one connecting line, and each convex tooth on any connecting line is reserved between each protruding line or each protruding line on the adjacent connecting line There is a certain distance.
  • the convex teeth on the opposite sides between any two adjacent connecting lines are arranged in a staggered manner.
  • the length of any of the connecting lines is the shortest distance between the MUX and the IC.
  • the material of any convex tooth is made of the same material as the connecting wire of the corresponding connection.
  • the material of the odd-numbered arrangement of the connecting lines is the same, and the materials of the even-numbered connecting lines are the same.
  • the connecting wire is made of metal aluminum and metal molybdenum.
  • an embodiment of the present invention further provides a glass substrate, including a wiring structure of a glass substrate, the wiring structure of the glass substrate includes a wiring structure of a glass substrate, and the wiring structure of the glass substrate is used for a multi-channel distributor MUX.
  • the integrated circuit IC includes a plurality of connecting lines, and both ends of each connecting line are connected to the MUX and the IC, and a preset spacing is reserved between any two adjacent connecting lines; among them,
  • One or more conductive protruding teeth are disposed on at least one connecting line, and each convex tooth on any connecting line is reserved between each protruding line or each protruding line on the adjacent connecting line There is a certain distance.
  • the convex teeth on the opposite sides between any two adjacent connecting lines are arranged in a staggered manner.
  • the length of any of the connecting lines is the shortest distance between the MUX and the IC.
  • the material of any convex tooth is made of the same material as the connecting wire of the corresponding connection.
  • connection lines of the odd-numbered arrangement are all made of the same material, and the even-numbered arrangement is arranged.
  • the connecting wires are made of the same material.
  • the connecting wire is made of metal aluminum and metal molybdenum.
  • the embodiment of the present invention further provides a display device, including a glass substrate, the glass substrate includes a wiring structure of a glass substrate, and the wiring structure of the glass substrate is used between the multi-channel distributor MUX and the integrated circuit IC. a plurality of connecting lines, each of which is connected to the MUX and the IC, and a predetermined spacing is reserved between any two adjacent connecting lines;
  • One or more conductive protruding teeth are disposed on at least one connecting line, and each convex tooth on any connecting line is reserved between each protruding line or each protruding line on the adjacent connecting line There is a certain distance.
  • the convex teeth on the opposite sides between any two adjacent connecting lines are arranged in a staggered manner.
  • the length of any of the connecting lines is the shortest distance between the MUX and the IC.
  • the material of any convex tooth is made of the same material as the connecting wire of the corresponding connection.
  • the material of the odd-numbered arrangement of the connecting lines is the same, and the materials of the even-numbered connecting lines are the same.
  • the present invention provides conductive protruding teeth on the connection line of the original MUX and the IC, and increases the wiring area of the connecting line by the convex teeth to reduce the resistance value of the connecting line, thereby utilizing
  • the existing limited wiring space achieves the purpose of reducing the wiring resistance and improving the charging effect of the glass substrate.
  • FIG. 1 is a partial cross-sectional structural view showing a wiring structure of a glass substrate in the prior art
  • FIG. 2 is a partial cross-sectional structural view of a wiring structure of a glass substrate according to Embodiment 1 of the present invention.
  • a wiring structure of a glass substrate is provided between a multi-channel distributor MUX and an integrated circuit IC, including a plurality of connecting lines 1, each connecting line. Both ends of the 1 are connected to the MUX and the IC, and a preset spacing is reserved between any two adjacent connecting lines 1;
  • At least one connecting wire 1 is provided with one or more conductive protruding teeth 11 , and each protruding tooth 11 on any connecting wire 1 and its adjacent connecting wire 1 or each protruding tooth on the adjacent connecting wire 1 There is also a certain distance reserved between the 11th.
  • the protruding teeth 11 on the connecting line 1 do not intersect with the adjacent connecting lines 1 and also do not intersect with any of the protruding teeth 11 on the adjacent connecting lines 1, so that in the original limited wiring space, In the case where the length of the wiring of any of the connecting wires 1 is not increased, the wiring area of the connecting wires 1 is increased by the protruding teeth 11, so that the resistance value of the connecting wires 1 is minimized.
  • any two adjacent connecting lines 1 are arranged in a staggered manner, so that the routing area between the adjacent connecting lines 1 can be maximized and the intersections are not generated. interference.
  • the length of any of the connecting lines 1 is the shortest distance between the MUX and the IC, so that the arrangement density (ie, the number) of the connecting lines 1 can be increased in the original limited wiring space, thereby further securing the MUX and Conduction between ICs.
  • the width between any two adjacent connecting lines 1 is equal, which makes the wiring structure more convenient and more reasonable.
  • the material of any of the convex teeth 11 is made of the same material as the connecting wire 1 of the corresponding connection, so that the connection line 1 does not have a sudden change in resistance due to the difference in materials.
  • the material of the connecting wire 1 includes metal aluminum and metal molybdenum, so that the convex teeth 11 corresponding to the connecting wire 1 made of the metal molybdenum are also made of metal aluminum, and the connecting wire 1 made of metal aluminum is used.
  • the corresponding convex teeth 11 are also made of metal molybdenum.
  • any adjacent connecting wires 1 may be filled with an insulating material.
  • the material of the odd-numbered arrangement of the connecting lines 1 is the same, and the materials of the even-numbered connecting lines 1 are all made of the same material, so that two different materials are alternately distributed, which is advantageous for design and anti-interference.
  • the second embodiment of the present invention further provides a glass substrate, including the wiring structure of the glass substrate in the first embodiment of the present invention.
  • the wiring structure of the glass substrate in the second embodiment of the present invention has the same structure and connection relationship as the wiring structure of the glass substrate in the first embodiment of the present invention, and therefore will not be further described herein.
  • the third embodiment of the present invention further provides a display device comprising the glass substrate in the second embodiment of the present invention.
  • the glass substrate in the third embodiment of the present invention has the same structure and connection relationship as the glass substrate in the second embodiment of the present invention, and therefore will not be further described herein.
  • the present invention compared with the conventional wiring structure for realizing a glass substrate, provides conductive protruding teeth on the connecting lines of the original MUX and the IC, and increases the wiring area of the connecting line by the convex teeth to reduce the resistance of the connecting line. Therefore, in the use of the existing limited wiring space, the purpose of reducing the wiring resistance value and improving the charging effect of the glass substrate is achieved.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种玻璃基板的布线结构，用于多路分配器MUX和集成电路IC之间，包括多个连接线（1），每一连接线（1）的两端均与MUX和IC相连，且任意两个相邻连接线（1）之间均预留有预设的间距；其中，至少一连接线（1）上设有一个或多个可导电的凸齿（11），且任一连接线（1）上的每一凸齿（11）与其相邻连接线（1）或相邻连接线（1）上的每一凸齿（11）之间还均预留有一定距离。还提供了一种玻璃基板及显示装置。该布线结构，玻璃基板及显示装置能够在现有的有限布线空间中降低布线阻值，提高玻璃基板充电效果。

Description

一种玻璃基板的布线结构、玻璃基板及显示装置
本申请要求于2017年10月11日提交中国专利局、申请号为201710939964.6、发明名称为“一种玻璃基板的布线结构、玻璃基板及显示装置”的中国专利申请的优先权，上述专利的全部内容通过引用结合在本申请中。
技术领域
本发明涉及液晶显示技术领域，尤其涉及一种玻璃基板的布线结构、玻璃基板及显示装置。
背景技术
随着平板显示行业的发展，现代人对显示器画质精细度不断提出更高的要求，选择搭配一款高ppi(Pixels per Inch，每英寸包含画素个数)显示器已经成为一款数码电子产品的标准配置。
如图1所示，在高ppi显示器的TFT玻璃基板制作工艺中，多路分配器MUX到集成电路IC之间基本采用多条等间距等线宽的连接线a进行连接，然而由于受限于MUX和IC之间的布线空间，布线阻值一直无法得到改善，导致无法提高玻璃基板充电效果。
发明内容
本发明实施例所要解决的技术问题在于，提供一种玻璃基板的布线结构、玻璃基板及显示装置，能够在现有的有限布线空间中降低布线阻值，提高玻璃基板充电效果。
为了解决上述技术问题，本发明实施例提供了一种玻璃基板的布线结 构，用于多路分配器MUX和集成电路IC之间，包括多个连接线，每一连接线的两端均与所述MUX和所述IC相连，且任意两个相邻连接线之间均预留有预设的间距；其中，
至少一连接线上设有一个或多个可导电的凸齿，且任一连接线上的每一凸齿与其相邻连接线或相邻连接线上的每一凸齿之间还均预留有一定距离。
其中，任意两个相邻连接线之间相对侧上的凸齿均呈交错咬合方式排列。
其中，任一连接线的长度均为所述MUX至所述IC之间的最短距离。
其中，任一凸齿的制作材质与其对应连接的连接线的制作材质均相同。
其中，任意两个相邻连接线之间的制作材质均相异。
其中，奇数位排列分布的连接线的制作材质均相同，偶数位排列分布的连接线的制作材质均相同。
其中，所述连接线的制作材质包括金属铝和金属钼。
相应的，本发明实施例还提供了一种玻璃基板，包括玻璃基板的布线结构，所述玻璃基板的布线结构包括玻璃基板的布线结构，所述玻璃基板的布线结构用于多路分配器MUX和集成电路IC之间，包括多个连接线，每一连接线的两端均与所述MUX和所述IC相连，且任意两个相邻连接线之间均预留有预设的间距；其中，
至少一连接线上设有一个或多个可导电的凸齿，且任一连接线上的每一凸齿与其相邻连接线或相邻连接线上的每一凸齿之间还均预留有一定距离。
其中，任意两个相邻连接线之间相对侧上的凸齿均呈交错咬合方式排列。
其中，任一连接线的长度均为所述MUX至所述IC之间的最短距离。
其中，任一凸齿的制作材质与其对应连接的连接线的制作材质均相同。
其中，任意两个相邻连接线之间的制作材质均相异。
其中，奇数位排列分布的连接线的制作材质均相同，偶数位排列分布的 连接线的制作材质均相同。
其中，所述连接线的制作材质包括金属铝和金属钼。
相应的，本发明实施例又提供了一种显示装置，包括玻璃基板，所述玻璃基板包括玻璃基板的布线结构，所述玻璃基板的布线结构用于多路分配器MUX和集成电路IC之间，包括多个连接线，每一连接线的两端均与所述MUX和所述IC相连，且任意两个相邻连接线之间均预留有预设的间距；其中，
至少一连接线上设有一个或多个可导电的凸齿，且任一连接线上的每一凸齿与其相邻连接线或相邻连接线上的每一凸齿之间还均预留有一定距离。
其中，任意两个相邻连接线之间相对侧上的凸齿均呈交错咬合方式排列。
其中，任一连接线的长度均为所述MUX至所述IC之间的最短距离。
其中，任一凸齿的制作材质与其对应连接的连接线的制作材质均相同。
其中，任意两个相邻连接线之间的制作材质均相异。
其中，奇数位排列分布的连接线的制作材质均相同，偶数位排列分布的连接线的制作材质均相同。
实施本发明实施例，具有如下有益效果：
与传统实现玻璃基板的布线结构相比，本发明在原有MUX和IC的连接线上设置导电的凸齿，通过凸齿来增加连接线的走线面积而实现降低连接线阻值，从而在利用现有的有限布线空间，达到降低布线阻值，提高玻璃基板充电效果的目的。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲， 在不付出创造性劳动性的前提下，根据这些附图获得其他的附图仍属于本发明的范畴。
图1为现有技术中玻璃基板的布线结构的局部剖视结构示意图；
图2为本发明实施例一提供的一种玻璃基板的布线结构的局部剖视结构示意图。
具体实施方式
下面参考附图对本发明的优选实施例进行描述。
请参见图2所示，为本发明实施例一中，提供的一种玻璃基板的布线结构，用于多路分配器MUX和集成电路IC之间，包括多个连接线1，每一连接线1的两端均与MUX和IC相连，且任意两个相邻连接线1之间均预留有预设的间距；其中，
至少一连接线1上设有一个或多个可导电的凸齿11，且任一连接线1上的每一凸齿11与其相邻连接线1或相邻连接线1上的每一凸齿11之间还均预留有一定距离。
可以理解的是，连接线1上的凸齿11与其相邻连接线1不相交，也与其相邻连接线1上的任一凸齿11不相交，从而可以在原有的有限布线空间中，在不增加任一连接线1走线长度的情况下，由凸齿11来增加连接线1的走线面积，从而最大程度的降低连接线1的阻值。
更进一步的，任意两个相邻连接线1之间相对侧上的凸齿11均呈交错咬合方式排列，这样就可以最大化的增加相邻连接线1之间的走线面积并且不相交产生干扰。
更进一步的，任一连接线1的长度均为MUX至IC之间的最短距离，这样就可以在原有的有限布线空间中，增加连接线1的布置密度(即数量)，从而进一步保障MUX和IC之间的导通。当然，任意两个相邻连接线1之间的宽度均相等，可以使得布线结构更方便、更合理。
更进一步的，任一凸齿11的制作材质与其对应连接的连接线1的制作材质均相同，这样不会由于材质不同，使得连接线1不会出现阻值突变。例如，连接线1的制作材质包括金属铝和金属钼，使得金属钼制作而成的连接线1上所对应的凸齿11也是由金属铝制作而成，金属铝制作而成的连接线1上所对应的凸齿11也是由金属钼制作而成。
更进一步的，任意两个相邻连接线1之间的制作材质均相异，这样可以降低相邻连接线1之间的干扰性。应当说明的是，为了提高连接线1之间的抗干扰性，任意相邻连接线1之间可以填充绝缘材料。
更进一步的，奇数位排列分布的连接线1的制作材质均相同，偶数位排列分布的连接线1的制作材质均相同，这样使用两种不同材质交替分布，有利于设计及抗干扰性。
相应于本发明实施例一的玻璃基板的布线结构，本发明实施例二还提供了一种玻璃基板，包括本发明实施例一中的玻璃基板的布线结构。由于本发明实施例二中的玻璃基板的布线结构与本发明实施例一中的玻璃基板的布线结构具有相同的结构及连接关系，因此在此不再一一赘述。
相应于本发明实施例二的玻璃基板，本发明实施例三又提供了一种显示装置，包括本发明实施例二中的玻璃基板。由于本发明实施例三中的玻璃基板与本发明实施例二中的玻璃基板具有相同的结构及连接关系，因此在此不再一一赘述。
综上，与传统实现玻璃基板的布线结构相比，本发明在原有MUX和IC的连接线上设置导电的凸齿，通过凸齿来增加连接线的走线面积而实现降低连接线阻值，从而在利用现有的有限布线空间，达到降低布线阻值，提高玻璃基板充电效果的目的。
以上所揭露的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的范围。

Claims (20)

  1. 一种玻璃基板的布线结构，用于多路分配器MUX和集成电路IC之间，包括多个连接线，每一连接线的两端均与所述MUX和所述IC相连，且任意两个相邻连接线之间均预留有预设的间距；其中，
    至少一连接线上设有一个或多个可导电的凸齿，且任一连接线上的每一凸齿与其相邻连接线或相邻连接线上的每一凸齿之间还均预留有一定距离。
  2. 如权利要求1所述的玻璃基板的布线结构，其中，任意两个相邻连接线之间相对侧上的凸齿均呈交错咬合方式排列。
  3. 如权利要求2所述的玻璃基板的布线结构，其中，任一连接线的长度均为所述MUX至所述IC之间的最短距离。
  4. 如权利要求3所述的玻璃基板的布线结构，其中，任一凸齿的制作材质与其对应连接的连接线的制作材质均相同。
  5. 如权利要求4中所述的玻璃基板的布线结构，其中，任意两个相邻连接线之间的制作材质均相异。
  6. 如权利要求5所述的玻璃基板的布线结构，其中，奇数位排列分布的连接线的制作材质均相同，偶数位排列分布的连接线的制作材质均相同。
  7. 如权利要求6所述的玻璃基板的布线结构，其中，所述连接线的制作材质包括金属铝和金属钼。
  8. 一种玻璃基板，其中，包括玻璃基板的布线结构，所述玻璃基板的布线结构用于多路分配器MUX和集成电路IC之间，包括多个连接线，每一连接线的两端均与所述MUX和所述IC相连，且任意两个相邻连接线之间均预留有预设的间距；其中，
    至少一连接线上设有一个或多个可导电的凸齿，且任一连接线上的每一凸齿与其相邻连接线或相邻连接线上的每一凸齿之间还均预留有一定距离。
  9. 如权利要求8所述的玻璃基板，其中，任意两个相邻连接线之间相 对侧上的凸齿均呈交错咬合方式排列。
  10. 如权利要求8所述的玻璃基板，其中，任一连接线的长度均为所述MUX至所述IC之间的最短距离。
  11. 如权利要求10所述的玻璃基板，其中，任一凸齿的制作材质与其对应连接的连接线的制作材质均相同。
  12. 如权利要求11中所述的玻璃基板，其中，任意两个相邻连接线之间的制作材质均相异。
  13. 如权利要求12所述的玻璃基板，其中，奇数位排列分布的连接线的制作材质均相同，偶数位排列分布的连接线的制作材质均相同。
  14. 如权利要求13所述的玻璃基板，其中，所述连接线的制作材质包括金属铝和金属钼。
  15. 一种显示装置，其中，包括玻璃基板，所述玻璃基板包括玻璃基板的布线结构，所述玻璃基板的布线结构用于多路分配器MUX和集成电路IC之间，包括多个连接线，每一连接线的两端均与所述MUX和所述IC相连，且任意两个相邻连接线之间均预留有预设的间距；其中，
    至少一连接线上设有一个或多个可导电的凸齿，且任一连接线上的每一凸齿与其相邻连接线或相邻连接线上的每一凸齿之间还均预留有一定距离。
  16. 如权利要求15所述的显示装置，其中，任意两个相邻连接线之间相对侧上的凸齿均呈交错咬合方式排列。
  17. 如权利要求16所述的显示装置，其中，任一连接线的长度均为所述MUX至所述IC之间的最短距离。
  18. 如权利要求17所述的显示装置，其中，任一凸齿的制作材质与其对应连接的连接线的制作材质均相同。
  19. 如权利要求18中所述的显示装置，其中，任意两个相邻连接线之间的制作材质均相异。
  20. 如权利要求19所述的显示装置，其中，奇数位排列分布的连接线 的制作材质均相同，偶数位排列分布的连接线的制作材质均相同。
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