WO2019065519A1 - Piezoelectric oscillator and method for producing piezoelectric oscillator - Google Patents

Abstract

The present invention enables stable conduction between a base member and a lid member. A crystalline oscillator of the present invention is provided with: a crystalline oscillation element; a base member; a conductive lid member that is joined to the base member via a joining member and an insulating sealing frame, so as to accommodate the crystalline oscillation element in an internal space formed with the base member; and a brazing material accommodated in the internal space and joined to the base member and the lid member so as to electrically connect the base member and the lid member.

Description

Piezoelectric vibrator and method of manufacturing piezoelectric vibrator

The present invention relates to a piezoelectric vibrator and a method of manufacturing the piezoelectric vibrator.

In general, a quartz oscillator is known as one of the piezoelectric oscillators. The quartz crystal vibrator includes, for example, a quartz crystal vibrating element, a base member on which the quartz crystal vibrating element is mounted, and a lid member joined to the base member so as to accommodate the quartz crystal vibrating element in the internal space.

Here, when the lid member having conductivity is joined to the base member by using a bonding member having electrical insulation (hereinafter, referred to as “insulation”), the insulating member is provided between the lid member and the base member. The presence of the joining member means that the lid member is not grounded. As a result, for example, the oscillation frequency of the crystal vibrating element may fluctuate due to the influence of external electromagnetic wave noise.

Therefore, for example, in Patent Document 1, the substrate, a conductor pattern provided along the outer peripheral edge of the upper surface of the substrate, a quartz crystal element bonded to the upper surface of the substrate, and the substrate are bonded to the substrate And a lid body is disclosed. In this quartz crystal device, the ridge portion of the lid is in contact with the conductor pattern electrically connected to the external terminal of the substrate connected to the ground potential.

JP, 2016-184779, A

However, in the quartz crystal device of Patent Document 1, since the connection between the ridge and the conductor pattern is exposed outside the internal space, the connection is affected by the external environment such as temperature, humidity, corrosive gas, etc. And electrical connection could be blocked. Further, since the connection between the ridge and the conductor pattern is a simple contact, the connection may be easily released, for example, by thermal shock or mechanical shock.

The present invention has been invented in view of such circumstances, and an object of the present invention is to provide a piezoelectric vibrator and a method of manufacturing the piezoelectric vibrator which can stably conduct the base member and the lid member. It is.

A piezoelectric vibrator according to one aspect of the present invention includes a base via an insulating bonding member such that the piezoelectric vibrating element is accommodated in an internal space formed by the piezoelectric vibrating element, the base member, and the base member. A brazing material which is joined to the member and is electrically conductive and is accommodated in the lid member and the internal space, and joined to the base member and the lid member so as to electrically connect the base member and the lid member And.

In a method of manufacturing a piezoelectric vibrator according to another aspect of the present invention, a process of preparing a base member, a process of arranging a brazing material on one of a base member or a conductive lid member, a piezoelectric vibration element and a brazing material A step of joining the base member and the lid member by the insulating joint member so as to form an internal space in which the metal is accommodated, and a step of electrically connecting the base member and the lid member by joining the brazing material And.

According to the present invention, it is possible to stably conduct the base member and the lid member.

FIG. 1 is an exploded perspective view of a crystal unit according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of FIG. FIG. 3 is a plan view of the base member of FIG. FIG. 4 is a flowchart showing a method of manufacturing a crystal resonator according to the first embodiment of the present invention. FIG. 5 is a view showing the process of disposing the brazing material on the lid member. FIG. 6 is a cross-sectional view of a crystal unit according to a second embodiment of the present invention. FIG. 7 is a flowchart showing a method of manufacturing a quartz oscillator according to a second embodiment of the present invention. FIG. 8 is a view showing the process of arranging the brazing material on the base member.

Hereinafter, embodiments of the present invention will be described. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of the respective parts are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiments.

In the following description, a quartz crystal resonator unit (Quartz Crystal Resonator Unit) including a quartz crystal resonator element (Quartz Crystal Resonator) will be described as an example of a piezoelectric resonator (Piezoelectric Resonator Unit). The quartz crystal vibrating element utilizes a quartz crystal element as a piezoelectric body that vibrates according to an applied voltage. However, the piezoelectric vibrating element according to the embodiment of the present invention is not limited to the quartz vibrating element, and another piezoelectric body such as ceramic may be used.

First Embodiment
A quartz oscillator according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. Here, FIG. 1 is an exploded perspective view of the crystal unit according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of FIG. FIG. 3 is a plan view of the base member shown in FIG.

As shown in FIG. 1, the crystal unit 1 according to the present embodiment includes a crystal vibrating element 10, a lid member 20, and a base member 30. The lid member 20 and the base member 30 are a part of the configuration of an enclosure for accommodating the crystal vibrating element 10 in the inner space. The lid member 20 is joined to the base member 30 via the sealing frame 37 and the joining member 40.

The crystal vibrating element 10 includes an AT-cut crystal piece 11. The AT cut type crystal piece 11 is a crystallographic axis (Crystallographic Axes) of Quartz Crystal, among the X axis, Y axis, and Z axis, the Y axis and the Z axis are around the X axis, the Y axis to the Z axis If the axes rotated in the direction of 35 ° 15 minutes ± 1 minute 30 seconds are Y ′ and Z ′ axes, respectively, a plane parallel to the plane specified by the X and Z ′ axes (hereinafter, “XZ ′ The same applies to the planes specified by the other axes. The quartz crystal piece 11 has a first major surface 12 a and a second major surface 12 b which are XZ ′ planes facing each other.

The crystal piece 11, which is an AT-cut crystal piece, has a long side direction in which a long side parallel to the X axis direction extends, a short side direction in which a short side parallel to the Z 'axis direction extends, and a Y' axis direction The thickness parallel to the has an extending thickness direction. In addition, the crystal piece 11 has a rectangular shape in the XZ ′ plane.

The quartz crystal vibrating element using the AT-cut quartz piece has high frequency stability in a wide temperature range. In addition, the AT-cut quartz crystal vibrating element is excellent in time-dependent change characteristics, and can be manufactured at low cost. Furthermore, the AT-cut crystal vibrating element uses a thickness shear vibration mode as a main vibration.

In the present embodiment, the crystal piece 11 has a flat plate shape. The first main surface 12a and the second main surface 12b of the crystal piece 11 are respectively flat surfaces.

The quartz crystal vibrating element 10 includes a first excitation electrode 14 a and a second excitation electrode 14 b that constitute a set of electrodes. The first excitation electrode 14a is provided on the first major surface 12a. The second excitation electrode 14b is provided on the second major surface 12b. The first excitation electrode 14a and the second excitation electrode 14b are provided so as to face each other with the quartz crystal piece 11 in a region including the center of each main surface. The first excitation electrode 14 a and the second excitation electrode 14 b are disposed so that substantially the whole thereof overlaps in plan view of the XZ ′ plane.

Each of the first excitation electrode 14a and the second excitation electrode 14b has a long side parallel to the X-axis direction, a short side parallel to the Z'-axis direction, and a thickness parallel to the Y'-axis direction. . In the example shown in FIG. 1, the long sides of the first excitation electrode 14 a and the second excitation electrode 14 b are parallel to the long sides of the quartz piece 11 in the XZ ′ plane. Similarly, the short sides of the first excitation electrode 14a and the second excitation electrode 14b are parallel to the short sides of the quartz piece 11, respectively. Further, the long sides of the first excitation electrode 14 a and the second excitation electrode 14 b are respectively separated from the long side of the quartz piece 11. Similarly, the short sides of the first excitation electrode 14 a and the second excitation electrode 14 b are respectively away from the short sides of the quartz piece 11.

The quartz crystal vibrating element 10 includes extraction electrodes 15a and 15b and connection electrodes 16a and 16b. The connection electrode 16a is electrically connected to the first excitation electrode 14a via the extraction electrode 15a. The connection electrode 16 b is electrically connected to the second excitation electrode 14 b via the lead-out electrode 15 b. The connection electrode 16a and the connection electrode 16b are terminals for electrically connecting to the base member 30, respectively. The connection electrode 16 a and the connection electrode 16 b are respectively provided on the second major surface 12 b of the crystal piece 11. The connection electrode 16 a and the connection electrode 16 b are respectively arranged along the short side direction near the short side on the Z′-axis negative direction side of the crystal piece 11.

The extraction electrode 15a electrically connects the first excitation electrode 14a and the connection electrode 16a. Specifically, the extraction electrode 15a extends from the first excitation electrode 14a in the Z'-axis negative direction and the X-axis negative direction on the first major surface 12a, and the extraction electrode 15a extends from the first major surface 12a to the quartz crystal piece 11. It extends to reach the second major surface 12 b through each side surface, and is electrically connected to the connection electrode 16 a on the second major surface 12 b. Further, the extraction electrode 15 b electrically connects the second excitation electrode 14 b and the connection electrode 16 b. Specifically, the extraction electrode 15b extends from the second excitation electrode 14b in the negative X-axis direction on the second major surface 12b, and is electrically connected to the connection electrode 16b on the second major surface 12b. ing. By extending the lead-out electrodes 15a and 15b in this manner, the lead-out electrodes 15a and 15b are electrically connected to the first excitation electrode 14a and the second excitation electrode 14b provided on both the main surfaces of the first main surface 12a and the second main surface 12b. The connected connection electrodes 16a and 16b can be disposed on one of the second main surfaces 12b.

The connection electrodes 16a and 16b are electrically connected to the electrodes of the base member 30 via the conductive holding members 36a and 36b. The conductive holding members 36a and 36b are formed by thermally solidifying an adhesive having conductivity.

The material of each of the first excitation electrode 14a and the second excitation electrode 14b, the extraction electrodes 15a and 15b, and the connection electrodes 16a and 16b is not particularly limited, but, for example, a chromium (Cr) layer as a base And may further have a gold (Au) layer on the surface of the chromium layer.

In the present embodiment, the crystal vibrating element 10 has been described as including the flat plate-shaped crystal piece 11, but the present invention is not limited to this. The quartz crystal piece may employ a mesa structure in which the vibrating portion including the center of the main surface is thicker than the peripheral portion, or may adopt an inverse mesa structure in which the vibrating portion is thinner than the peripheral portion. Alternatively, the quartz crystal piece may have a convex shape or a bevel shape in which changes (steps) in thickness of the vibrating portion and the peripheral portion change continuously. Moreover, you may apply different cut other than AT cut, for example, BT cut etc., as a cut angle of a crystal piece. Furthermore, the quartz crystal vibrating element includes at least a base portion and a base portion extending from the base portion using a quartz plate cut at a predetermined angle with respect to X, Y and Z axes orthogonal to one another as crystal axes of quartz. The tuning fork type quartz crystal vibrating element may be provided with a quartz piece having one vibrating arm, and an excitation electrode provided on the vibrating arm so as to cause bending vibration.

The lid member 20 is joined to the base member 30 via a sealing frame 37 and a joining member 40 which will be described later. The base member 30 and the lid member 20 form an internal space 26 for housing the quartz crystal vibrating element 10.

The lid member 20 has a concave shape, specifically a box shape including an opening, and has an inner surface 24 and an outer surface 25. The lid member 20 is connected to the top surface 21 facing the first main surface 32 a of the base member 30 and the outer edge of the top surface 21 and extends in the normal direction to the main surface of the top surface 21. And a side wall portion 22. The lid member 20 has, for example, a long side direction in which a long side parallel to the X axis direction extends, a short side direction in which a short side parallel to the Z ′ axis direction extends, and a high side parallel to the Y ′ axis direction. Vertical direction. The lid member 20 also has an opposing surface 23 that faces the first major surface 32 a of the base member 30 at the opening edge of the concave shape. The facing surface 23 has a frame shape and extends to surround the quartz vibrating element 10.

The lid member 20 has conductivity. The material of the lid member 20 is, for example, metal. Specifically, the lid member 20 is made of an alloy (for example, 42 alloy) containing iron (Fe) and nickel (Ni). A nickel (Ni) layer or the like formed by plating may be provided on the innermost surface (the surface including the inner surface 24) of the lid member 20. In addition, a gold (Au) layer or the like that prevents oxidation may be provided on the outermost surface (surface including the outer surface 25) of the lid member 20. However, the material of the lid member 20 is not particularly limited.

The base member 30 carries the crystal vibrating element 10. Specifically, the quartz crystal vibrating element 10 is vibratably held on the first major surface 32 a of the base member 30 via the conductive holding members 36 a and 36 b.

The base member 30 has a flat plate shape. The base member 30 has a thickness parallel to the Y ′ axis direction, a long side direction in which the long side parallel to the X axis direction extends, a short side direction in which the short side parallel to the Z ′ axis direction extends, And an extending thickness direction.

The base member 30 includes a base 31. The base 31 has a first major surface 32 a and a second major surface 32 b which are XZ ′ planes facing each other. The base 31 is, for example, a sintered material such as insulating ceramic (alumina). In this case, the base 31 may be laminated by sintering a plurality of insulating ceramic sheets. Alternatively, the substrate 31 is a glass material (for example, silicate glass or a material having as a main component other than silicate and having a glass transition phenomenon at elevated temperature), a quartz material (for example, AT cut quartz) or You may form with a glass epoxy resin etc. The base 31 is preferably made of a heat resistant material. The base 31 may be a single layer or a plurality of layers, and in the case of a plurality of layers, the base 31 includes an insulating layer formed on the outermost layer of the first major surface 32 a.

The base member 30 includes electrode pads 33a and 33b and an internal electrode 33c provided on the first major surface 32a, and external electrodes 35a, 35b, 35c and 35d provided on the second major surface 32b. The electrode pads 33 a and 33 b are electrically connected to the crystal vibrating element 10. The internal electrode 33 c is electrically connected to the brazing material 50. The external electrodes 35a, 35b, 35c and 35d are electrically connected to a circuit board (not shown). The electrode pad 33a is electrically connected to the external electrode 35a through the via electrode 34a extending in the Y ′ axis direction, and the electrode pad 33b is an external electrode through the via electrode 34b extending in the Y ′ axis direction It is electrically connected to 35b. The via electrodes 34a and 34b are formed in via holes (not shown) penetrating the base 31 in the Y 'axis direction. The height of the brazing material 50 is preferably smaller than the distance between the first major surface 32 a of the base material 30 and the crystal vibrating element 10.

The electrode pads 33a and 33b are provided near the short side of the base member 30 in the negative X-axis direction on the first major surface 32a. In the example illustrated in FIG. 1, the electrode pads 33 a and 33 b are arranged apart from the short side of the base member 30 and along the short side direction. The electrode pad 33a is connected to the connection electrode 16a of the crystal vibrating element 10 through the conductive holding member 36a. The electrode pad 33 b is connected to the connection electrode 16 b of the crystal vibrating element 10 through the conductive holding member 36 b.

The internal electrode 33c is provided on the first major surface 32a near the short side of the base member 30 in the positive X-axis direction and near the long side of the base member 30 in the negative Z'-axis direction. In the example shown in FIG. 1, the internal electrode 33c is disposed along the short side direction and the long side direction. The internal electrode 33 c is in contact with the corner on the Z′-axis negative direction side and the X-axis positive direction side on the inner periphery of the sealing frame 37.

The internal electrode 33c is electrically connected to the external electrode 35c. In the example shown in FIG. 3, the internal electrode 33 c is electrically connected to the external electrode 35 c via the via electrode 42 extending in the Y′-axis direction.

The plurality of external electrodes 35a, 35b, 35c, 35d are provided near the corners of the second major surface 32b. In the example shown in FIG. 1, the external electrodes 35a and 35b are disposed immediately below the electrode pads 33a and 33b. Thus, the external electrodes 35a and 35b can be electrically connected to the electrode pads 33a and 33b by the via electrodes 34a and 34b extending in the Y'-axis direction. In addition, the external electrode 35c is disposed immediately below the internal electrode 33c. Thus, the external electrode 35c can be electrically connected to the internal electrode 33c by the via electrode 42 extending in the Y'-axis direction.

In the example shown in FIG. 1, of the four external electrodes 35a to 35d, the external electrodes 35a and 35b disposed near the short side of the base member 30 in the negative X-axis direction have input / output signals of the crystal vibrating element 10 It is an input / output electrode to be supplied. The external electrodes 35c and 35d disposed near the short side of the base member 30 in the positive X-axis direction are dummy electrodes to which the input / output signal of the crystal vibrating element 10 is not supplied.

A sealing frame 37 having an insulating property is provided on the first main surface 32 a of the base 31. The sealing frame 37 has a rectangular frame shape when viewed in plan from the first major surface 32 a. The electrode pads 33 a and 33 b and the internal electrode 33 c are respectively disposed inside the sealing frame 37. On the sealing frame 37, a bonding member 40 described later is provided, and further, a lid member 20 is provided. Thus, the lid member 20 is joined to the base member 30 via the sealing frame 37 and the joining member 40. When the sealing frame 37 has electrical insulation, the first main surface 32 a, the first main surface 32 a, and the first main surface 32 a pass between the base 31 of the base member 30, which is a single layer, and the sealing frame 37. A base provided on the surface of the base 31 continuously to the side surface connecting the main surface 32a and the second main surface 32 and the second main surface 32b, and electrically connecting the internal electrode to the external electrode Preferably, it is a member 30. In this case, since a via electrode is not used for electrical conduction on the front and back surfaces of the base member 30, an effect of eliminating sealing leakage occurring at the interface between the via electrode and the base 31 is preferable. When the base member 30 having a via electrode is used, the manufacturing process such as printing, sputtering, vapor deposition and the like can be made common with the process of forming the internal electrode by using the sealing frame 37 having conductivity. And the sealing frame 37 can be formed simultaneously.

In the example shown in FIG. 3, the inner periphery of the sealing frame 37 has a rectangular shape (hereinafter referred to as “rectangular shape”) in plan view from the first major surface 32 a. In the first major surface 32 a, the inner portion of the sealing frame 37 whose outer edge is the inner periphery constitutes a surface surrounding the internal space 26. Therefore, when viewed in plan from the first major surface 32 a of the base member 30, the internal space 26 has a rectangular shape, as with the inner periphery of the sealing frame 37.

The electrode pads 33a and 33b, the internal electrode 33c, and the external electrodes 35a to 35d of the base member 30 are all made of a metal film. For example, the electrode pads 33a and 33b, the internal electrodes 33c, and the external electrodes 35a to 35d are formed by laminating a molybdenum (Mo) layer, a nickel (Ni) layer, and a gold (Au) layer from the lower layer to the upper layer, respectively. ing. The via electrode 42 is formed, for example, by filling a hole 41 passing through the base 31 from the first major surface 32a to the second major surface 32b with a metal material such as molybdenum (Mo).

The arrangement relationship between the electrode pads 33a and 33b, the internal electrodes 33c, and the external electrodes 35a to 35d is not limited to the example described above. For example, the electrode pad 33 a may be disposed near one short side of the base member 30, and the electrode pad 33 b may be disposed near the other short side of the base member 30. In such a configuration, the quartz crystal vibrating element 10 is held by the base member 30 at both ends in the long side direction of the quartz piece 11.

Further, the arrangement of the internal electrodes 33c is not limited to the example described above. For example, the internal electrode may be provided on the first major surface 32 a of the base member 30 having the via electrode and over the entire inner periphery of the sealing frame 37. Alternatively, the internal electrode may be disposed not in the corner of the inner periphery of the sealing frame 37 but in the area inside the sealing frame 37 on the first major surface 32 a. Further, the number of internal electrodes is not limited to one, and for example, a plurality of internal electrodes may be provided.

Further, the arrangement of the external electrodes is not limited to the example described above. For example, two external electrodes, which are input / output electrodes, may be provided diagonally on the second major surface 32b. Alternatively, the four external electrodes may be disposed near the center of each side rather than at the corners of the second major surface 32b. Further, the number of external electrodes is not limited to four, and may be, for example, only two external electrodes which are input / output electrodes.

In addition, the aspect of the electrical connection between the electrode pad or the internal electrode and the external electrode is not limited to the via electrode. For example, the electrical connection between the electrode pad or the internal electrode and the external electrode may be achieved by drawing out the lead-out electrode on the first main surface 32a or the second main surface 32b. Alternatively, the base 31 of the base member 30 is formed in a plurality of layers, the via electrode is extended to the intermediate layer, and the lead electrode is drawn out in the intermediate layer to electrically connect the electrode pad or the inner electrode and the outer electrode. Connection may be attempted.

As shown in FIG. 2, the crystal vibrating element 10 is surrounded by the lid member 20 and the base member 30 by joining both the lid member 20 and the base member 30 through the sealing frame 37 and the bonding member 40. The interior space 26 is sealed. In this case, the pressure of the internal space 26 is preferably in a vacuum state lower than the atmospheric pressure. Thereby, the time-dependent change etc. by oxidation of the 1st excitation electrode 14a and the 2nd excitation electrode 14b can be reduced.

At this time, the internal electrode 33 c provided on the first major surface 32 a is also accommodated in the internal space 26. On the other hand, the external electrodes 35a to 35d provided on the second major surface 32b are disposed outside the internal space 26. Thus, the external electrodes 35a to 35d can be electrically connected to a circuit board (not shown) on which the crystal unit 1 is mounted. In addition, when the ground potential is supplied from the circuit board to the external electrodes 35c and 35d, the external electrodes 35c and 35d become grounding electrodes, and the lid member 20 is electrically connected to the external electrodes 35c and 35d to provide a lid. The member 20 can be further added with an electromagnetic shielding function having high shielding performance.

The bonding member 40 bonds the lid member 20 and the base member 30. The bonding member 40 is provided over the entire circumference of each of the lid member 20 and the base member 30. Specifically, the bonding member 40 has a rectangular frame shape when the first main surface 32 a of the base member 30 is viewed in plan, and is provided on the sealing frame 37.

Further, like the sealing frame 37, the bonding member 40 has an insulating property. The material of the sealing frame 37 and the bonding member 40 is, for example, inorganic glass. Inorganic glass is, for example, low melting point glass such as lead boric acid type and tin phosphoric acid type. Here, the inorganic glass is characterized in that the amount of released gas released upon solidification is smaller than that of the organic resin adhesive. As a result, it is possible to suppress a change in the atmospheric pressure in the internal space 26 caused by the released gas, and a fluctuation in the frequency characteristics of the crystal vibrating element 10 due to the adsorption of the released gas. In addition, the inorganic glass also has a feature that the airtightness performance is good as compared with the resin adhesive. Thereby, the airtightness of internal space 26 can be improved.

When the sealing frame 37 and the bonding member 40 are low melting point glass adhesives, they may contain lead-free vanadium (V) -based glass which melts at a temperature of 300 ° C. or more and 410 ° C. or less. The vanadium-based glass exhibits an adhesive action by being added in the form of a paste, a solvent and the like, melted, and solidified. The vanadium-based glass may contain other metals such as silver (Ag). Vanadium-based glass has a feature that it has good airtightness performance at the time of bonding and higher reliability with respect to water resistance performance, moisture resistance performance, etc., as compared to other glass adhesives. Vanadium-based glass also has a feature that the thermal expansion coefficient can be flexibly controlled by controlling the glass structure. Furthermore, the vanadium-based glass also has a feature that the melting temperature is lower than that of SiO ₂ glass. Thereby, damage to the crystal unit 1 in the bonding process can be reduced.

The sealing frame 37 and the bonding member 40 may be, for example, a resin adhesive. The resin adhesive may contain a thermosetting resin or a photocurable resin. For example, an epoxy-based adhesive containing an epoxy resin as a main component can be used. As the epoxy resin, for example, a bifunctional epoxy resin such as bisphenol A epoxy resin and bisphenol F epoxy resin, a novolac epoxy resin such as phenol novolac epoxy resin and cresol novolac epoxy resin can be used. In addition, generally known ones such as polyfunctional epoxy resin, glycidyl amine type epoxy resin, heterocycle-containing epoxy resin or alicyclic epoxy resin can be applied.

As described above, since the sealing frame 37 and the bonding member 40 are glass adhesive or resin adhesive, the heating temperature at bonding can be suppressed as compared with the case of bonding with metal, and the manufacturing process can be performed. It can be simplified.

The brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the base member 30 and the lid member 20. As a result, the bonding strength can be increased as compared with the case where the base member 30 and the lid member 20 are electrically connected by mere contact. For example, the electric connection can be made even when receiving thermal shock or mechanical shock. Is less likely to be released.

The brazing material 50 is melted by heating and solidified to join the lid member 20 and the base member 30. The brazing material 50 is an alloy composed of a plurality of metals. Specifically, the brazing material 50 is made of, for example, a gold (Au) -tin (Sn) eutectic alloy. In this case, the melting point of the brazing material 50 is 280 ° C. In addition, the brazing material 50 may contain a flux.

The brazing material 50 preferably has a melting point of 270 ° C. or more and a melting point or less of the sealing frame 37 and the bonding member 40. As described above, when the melting point of the brazing material 50 is 270 ° C. or more, the brazing material 50 can be melted again to release the bonding by heating when mounting the crystal unit 1 on a circuit board (not shown). Can be reduced. Further, when the melting point of the brazing material 50 is equal to or lower than the melting points of the sealing frame 37 and the joining member 40, the brazing material 50 is melted at the time of joining by the sealing frame 37 and the joining member 40 The members 30 can be electrically connected. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

When the lid member 20 is a metal member, metal bonding occurs between the lid member 20 and the brazing material 50 at the time of joining with the brazing material 50 to form an alloy layer. Therefore, compared with the case where the lid member 20 is a member other than metal, the bonding strength by the brazing material 50 can be enhanced.

In the example shown in FIG. 1, the brazing material 50 is disposed on a part of the inner surface 24 of the lid member 20. As shown in FIG. 2, the brazing material 50 is accommodated in the internal space 26 by the sealing frame 37 and the joining member 40 joining the lid member 20 and the base member 30. As a result, the bonding by the brazing material 50 is less susceptible to the influence of external humidity, corrosive gas, and the like, and the change with time can be reduced.

Further, the brazing material 50 disposed on the lid member 20 wets and spreads at the time of joining, and is provided on the internal electrode 33 c of the base member 30 as shown in FIG. 2. As described above, the internal electrode 33 c is electrically connected to the external electrode 35 c via the via electrode 42. As described above, the brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the internal electrode 33 c and the lid member 20, whereby conduction between the base member 30 and the lid member 20 is achieved. Can be easily realized. In addition, the lid member 20 can be grounded by supplying the ground potential to the external electrode 35d. Therefore, the floating capacity which may be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal vibrating element 10 can be prevented.

Further, as described above, the internal electrode 33c is disposed at a corner in the rectangular shape of the internal space 26 when the first major surface 32a of the base member 30 is viewed in plan. As described above, by providing the brazing material 50 at the rectangular corner of the quartz-crystal vibrating element 10 held at the approximate center of the rectangular shape, an effect that can be exerted on the quartz-crystal vibrating element 10 by bonding the brazing material 50 Can be reduced.

The brazing material 50 may be provided at corners relatively far from the electrode pads 33a and 33b of the base member 30 among the four rectangular corners when the first main surface 32a of the base member 30 is viewed in plan. preferable. In the example shown in FIGS. 1 and 2, the brazing material 50 is provided at the corner on the X-axis positive direction side and the Z′-axis negative direction side. As a result, the influence that can be exerted on the conduction of the quartz crystal vibrating element 10 through the electrode pads 33a and 33b can be reduced.

The arrangement of the brazing material 50 is not limited to the above-described example. For example, a portion of the brazing material 50 may enter between the facing surface 23 of the lid member 20 and the first major surface 32 a of the base member 30. Also in this case, the brazing material 50 is contained in the sealed internal space 26 formed by the base member 30 and the lid member 20. Alternatively, in the rectangular shape of the internal space 26 when viewed in plan from the first main surface 32 a of the base member 30, the brazing material 50 may be provided over the entire circumference in contact with the sealing frame 37. In addition, the brazing material 50 may be provided at a plurality of the four corner portions of the rectangular shape. Furthermore, when the brazing material 50 is disposed at a corner relatively distant from the conductive holding members 36 a and 36 b of the base member 30, instead of the corner at the X axis positive direction side and the Z ′ axis negative direction side, Alternatively, in addition to this, it may be provided at the corner on the X axis positive direction side and the Z 'axis positive direction side.

Further, the rectangular shape of the internal space 26 is not limited to the case of having corners in a strict sense. For example, the rectangular shape of the inner space 26 may be rounded or truncated at some or all of the corners. Thus, the term "corner" in the present application means an area including corners, rounded (R) corners, and truncated corners. Also, the term "rectangular" in the present application does not exclude square, but is meant to include rectangular and square shapes.

In the quartz crystal vibrating element 10 according to this embodiment, one end in the long side direction of the quartz piece 11 (the end on the side on which the conductive holding members 36a and 36b are disposed) is a fixed end, and the other end is It is a free end. The quartz crystal vibrating element 10, the lid member 20, and the base member 30 each have a rectangular shape in the XZ 'plane, and the long side direction and the short side direction are the same.

The position of the fixed end of the crystal vibrating element 10 is not particularly limited. As a modification, the quartz crystal vibrating element 10 may be fixed to the base member 30 at both ends in the long side direction of the quartz piece 11. In this case, the electrodes of the quartz crystal vibrating element 10 and the base member 30 may be formed in a mode in which the quartz crystal vibrating element 10 is fixed at both ends in the long side direction of the quartz piece 11.

In the crystal unit 1 according to the present embodiment, an alternating electric field is generated between the pair of first excitation electrode 14a and the second excitation electrode 14b in the crystal vibrating element 10 through the external electrodes 35a and 35b of the base member 30. Apply. As a result, the vibrating portion of the crystal piece 11 vibrates in a predetermined vibration mode such as thickness shear vibration mode, and resonance characteristics associated with the vibration can be obtained.

(Production method)
Next, with reference to FIG. 4 and FIG. 5, a method of manufacturing the crystal unit according to the first embodiment of the present invention will be described. Here, FIG. 4 is a flowchart showing a method of manufacturing the crystal unit 1, and FIG. 5 is a view for explaining the process of arranging the brazing material 50 on the lid member 20.

As shown in FIG. 4, first, the base member 30 is prepared (S101). Specifically, the internal electrode 33c and the external electrodes 35a to 35d are provided on a base 31, which is an insulating ceramic such as alumina, for example. The internal electrode 33c and the external electrodes 35a to 35d can be formed by laminating molybdenum (Mo), nickel (Ni), and gold (Au). As described above, the internal electrode 33 c is provided at the corner of the inner periphery of the sealing frame 37 on the first major surface 32 a of the base 31, and is accommodated in the internal space 26. On the other hand, the external electrodes 35 a to 35 d are provided on the second major surface 32 b of the base 31 and disposed outside the internal space 26.

In addition, various electrodes including the electrode pads 33a and 33b, the via electrodes 34a and 34b, the sealing frame 37, and the holes 41 are formed. Thus, the base member 30 shown in FIGS. 1 to 3 can be prepared.

Next, the brazing material 50 is placed on the lid member 20 (S102). Specifically, as shown in FIG. 5, the opening 27 of the lid member 20 has a rectangular shape when the top surface portion 21 of the lid member 20 is viewed in plan, and the brazing material 50 has a rectangular shape. Place in the department. This corner is a position corresponding to the internal electrode 33 c of the base member 30 when the base member 30 and the lid member 20 are joined.

Next, the crystal vibrating element 10 prepared in advance is mounted on the first major surface 32 a of the base 31 of the base member 30 (S 103). Specifically, a conductive adhesive is applied on the electrode pads 33a and 33b of the first main surface 32a of the base body 31, and the conductive adhesive is heated and solidified in a state where the crystal vibrating element 10 is mounted. Thus, the connection electrodes 16a and 16b of the quartz crystal vibrating element 10 and the electrode pads 33a and 33b of the base member 30 are electrically connected by the conductive holding members 36a and 36b in which the conductive adhesive is solidified. Further, the quartz crystal vibrating element 10 is movably held by the conductive holding members 36a and 36b. The crystal vibrating element 10 is mounted such that the second excitation electrode 14 b faces the first major surface 32 a of the base member 30.

In addition, the processing process of a crystal piece and the formation process of various electrodes are general, and the structure of the quartz crystal vibrating element 10 is as having already demonstrated. Therefore, the process of preparing the quartz crystal vibrating element 10 will not be described.

Next, the base member 30 and the lid member 20 are joined by the sealing frame 37 and the joining member 40 so as to form the internal space 26 in which the quartz crystal vibrating element 10 and the brazing material 50 are accommodated (S104). Thus, by the brazing material 50 being accommodated in the sealed internal space 26, bonding with the brazing material 50 becomes less susceptible to the influence of external humidity, corrosive gas, etc., and the change with time can be reduced. it can. In this case, it is desirable that the closed interior space 26 be an atmosphere having a lower degree of activity to the brazing material 50, such as an oxygen concentration lower than the atmosphere.

Specifically, on the first main surface 32 a of the base member 30, the sealing frame 37 is provided over the entire circumference. The sealing frame 37 is heated and solidified (temporarily solidified) after being provided by the screen printing method. Then, the bonding member 40, which is a glass adhesive, and the lid member 20 are placed on the sealing frame 37 of the base member 30, and the sealing frame 37 and the bonding member 40 are melted by heating again to perform firing (main firing ). As a result, the base member 30 and the lid member 20 are joined. Thus, the base member 30 and the lid member 20 can be joined.

Finally, by joining the brazing material 50, the base member 30 and the lid member 20 are electrically connected (S105). As a result, the bonding strength can be increased as compared with the case where the base member 30 and the lid member 20 are electrically connected by mere contact. For example, the electric connection can be made even when receiving thermal shock or mechanical shock. Is less likely to be released.

Specifically, the base member 30 and the lid member 20 joined by the sealing frame 37 and the joining member 40 are installed in a heating jig and heated, and the brazing material 50 disposed in the lid member 20 is melted and solidified Let At this time, the brazing material 50 wets and spreads from the lid member 20 to the internal electrode 33 c, and electrically connects the internal electrode 33 c and the lid member 20. Thereby, conduction between the base member 30 and the lid member 20 can be easily realized. Further, the lid member 20 can be grounded by supplying the ground potential to the external electrode 35d. Therefore, the floating capacity which may be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal vibrating element 10 can be prevented.

In this manner, by joining the brazing material 50, the internal electrode 33c and the lid member 20 can be electrically connected.

When the melting point of the brazing material 50 is 270 ° C. or more and the melting point of the sealing frame 37 and the joining member 40 or less, it is preferable that the sealing described above melt the sealing frame 37 and the joining member 40. Specifically, when the brazing material 50 is a gold (Au) -tin (Sn) eutectic alloy and its melting point is 280 ° C., it is not more than the melting points of the brazing material 50 and the sealing frame 37 and the joining member 40 After preheating at 250 ° C. for 5 minutes, the sealing frame 37 and the bonding member 40 are melted by heating for 5 minutes at 310 ° C., which is higher than 300 ° C., for example. In this case, the brazing material 50 is also melted together, and the internal electrode 33c and the lid member 20 are joined. Thus, the step of joining the base member 30 and the lid member 20 and the step of electrically coupling the base member 30 and the lid member 20 can be performed simultaneously. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

Second Embodiment
Next, a quartz oscillator according to a second embodiment of the present invention will be described with reference to FIGS. 6 to 8. In the second and subsequent embodiments, the description of matters common to the first embodiment will be omitted, and only different points will be described. In particular, the same operation and effect by the same configuration will not be sequentially referred to in each embodiment.

FIG. 6 is a cross-sectional view of a crystal unit 201 according to a second embodiment of the present invention. 6 is a view of the same cross section as FIG. The configuration example of the second embodiment shown in FIG. 6 is that the lid member 220 is a flat plate-like member, and the base member 230 has a box shape including an opening, the configuration of the first embodiment shown in FIG. It differs from the configuration example.

The base member 230 has an inner bottom surface 238a, an opposite surface 238b, and an inner surface 238c on the lid member 220 side. The inner bottom surface 238 a and the opposing surface 238 b are opposed to the first major surface 222 a of the lid member 220. The inner bottom surface 238 a is located at the central portion on the lid member 220 side. The crystal vibrating element 210 is mounted on the inner bottom surface 238a. The opposing surface 238 b is located outside the inner bottom surface 238 a when the inner bottom surface 238 a is viewed in plan, and has a frame shape. The inner side surface 238c is a surface connecting the inner bottom surface 238a and the opposite surface 238b. An internal electrode 233c is provided on a part of the inner side surface 238c. The internal electrode 233c is electrically connected to the external electrode 235c via a connection electrode (not shown). The inner space 226 is a space surrounded by the inner bottom surface 238 a, the facing surface 238 b, and the inner side surface 238 c, and the first main surface 222 a of the lid member 220.

The lid member 220 has a first main surface 222a and a second main surface 222b facing each other. The bonding member 240 is located between the facing surface 238 b of the base member 230 and the second major surface 222 b of the lid member 220. The base member 230 and the lid member 220 are joined by the joining member 240, and the internal space 226 is sealed. The crystal vibrating element 210 and the brazing material 250 are accommodated in the internal space 226.

(Production method)
Next, with reference to FIGS. 7 and 8, a method of manufacturing a quartz oscillator according to a second embodiment of the present invention will be described. Here, FIG. 7 is a flowchart showing a method of manufacturing the crystal unit 201, and FIG. 8 is a view for explaining a process of arranging the brazing material 250 on the base member 230.

As shown in FIG. 7, first, the base member 230 is prepared (S301). Specifically, the inner bottom surface 238a, the opposite surface 238b, and the inner side surface 238c of the base member 230 are formed by etching or the like. The process of preparing the base member 230 is the same as S101 of the first embodiment shown in FIG.

Next, the brazing material 250 is placed on the base member 230 (S302). Specifically, as shown in FIG. 8, the brazing material 250 is disposed on the opening edge side on the surface of the internal electrode 233 c of the base member 230. As such, by disposing the brazing material 250 on the internal electrode 233c, electrical connection between the internal electrode 233c and the lid member 220 can be easily realized.

Next, the crystal vibrating element 10 prepared in advance is mounted on the inner bottom surface 238a of the base member 230 (S303).

Next, the base member 230 and the lid member 220 are joined by the joining member 240 so as to form an internal space 326 in which the crystal vibrating element 210 and the brazing material 250 are accommodated (S304). Specifically, on the opposing surface 238b of the base member 230, a bonding member 240, which is a resin adhesive, is provided over the entire circumference. Then, the lid member 220 is placed on the bonding member 240, and the bonding member 240 is melted and solidified by, for example, heating at 200 ° C. for 10 minutes. Since the heating temperature (200 ° C.) is lower than the melting point (280 ° C.) of the brazing material 250, the brazing material 250 does not melt at this point.

Finally, by bonding the brazing material 250, the internal electrode 233c of the base member 230 and the lid member 220 are electrically connected (S305). Specifically, the base member 230 and the lid member 220 joined by the joining member 240 are heated at 290 ° C. higher than the melting point of the brazing material 250 for 2 minutes to melt and solidify the brazing material 250. At this time, the brazing material 250 wets and spreads from the internal electrode 233c to the lid member 220, and the internal electrode 33c and the lid member 220 are joined.

The exemplary embodiments of the present invention have been described above. In the quartz crystal vibrator 1, the sealing frame 37 and the bonding member having the insulating property so as to accommodate the quartz crystal vibrating element 10 in the internal space 26 formed by the quartz crystal vibrating element 10, the base member 30 and the base member 30. The base member 30 is joined to the base member 30 via the conductive member 40 and is electrically conductive, and is housed in the inner space 26 so that the base member 30 and the lid member 20 are electrically connected. And the brazing material 50 joined to the lid member 20. As described above, since the brazing material 50 is accommodated in the internal space 26, bonding by the brazing material 50 is less susceptible to the influence of external humidity, corrosive gas or the like, and the change with time can be reduced. In addition, the brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the base member 30 and the lid member 20, so that the base member 30 and the lid member 20 are simply contacted. As compared with the case of electrically connecting, it is possible to increase the bonding strength, and for example, it becomes difficult to release the electrical connection even when receiving a thermal shock or a mechanical shock. Therefore, the base member 30 and the lid member 20 can be stably conducted.

In the crystal unit 1 described above, the base member 30 includes external electrodes 35a to 35d provided outside the internal space 26, and an internal electrode 33c accommodated in the internal space 26 and electrically connected to the external electrode 35c. The brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the internal electrode 33 c and the lid member 20. Thereby, conduction between the base member 30 and the lid member 20 can be easily realized. Further, the lid member 20 can be grounded by supplying the ground potential to the external electrode 35c. Therefore, the floating capacity which may be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal vibrating element 10 can be prevented.

In the crystal unit 1 described above, the internal space 26 has a rectangular shape when the first main surface 32 a of the base member 30 is viewed in plan, and the brazing material 50 is provided at the rectangular corner. As described above, by providing the brazing material 50 at the rectangular corner of the quartz-crystal vibrating element 10 held at the approximate center of the rectangular shape, an effect that can be exerted on the quartz-crystal vibrating element 10 by bonding the brazing material 50 Can be reduced.

In the crystal unit 1 described above, the base member 30 includes the electrode pads 33 a and 33 b electrically connected to the crystal vibrating element 10, and the brazing material 50 is a plan view of the first main surface 32 a of the base member 30. The plurality of corner portions are provided at corners relatively far from the electrode pads 33a and 33b. As a result, the influence that can be exerted on the conduction of the quartz crystal vibrating element 10 through the electrode pads 33a and 33b can be reduced.

In the crystal unit 1 described above, the material of the lid member 20 is metal. Thereby, at the time of joining by the brazing material 50, metal bond arises between the cover member 20 and the brazing material 50, and an alloy layer is formed. Therefore, compared with the case where the material of the cover member 20 is other than metal, the bonding strength by the brazing material 50 can be enhanced.

In the crystal unit 1 described above, the material of the sealing frame 37 and the bonding member 40 is inorganic glass. Here, the inorganic glass is characterized in that the amount of released gas released upon solidification is smaller than that of the organic resin adhesive. As a result, it is possible to suppress a change in the atmospheric pressure in the internal space 26 caused by the released gas, and a fluctuation in the frequency characteristics of the crystal vibrating element 10 due to the adsorption of the released gas. In addition, the inorganic glass also has a feature that the airtightness performance is good as compared with the resin adhesive. Thereby, the airtightness of internal space 26 can be improved.

In the crystal unit 1 described above, the brazing material 50 has a melting point equal to or higher than 270 ° C. and equal to or lower than the melting points of the sealing frame 37 and the bonding member 40. As described above, when the melting point of the brazing material 50 is 270 ° C. or more, the brazing material 50 can be melted again to release the bonding by heating when mounting the crystal unit 1 on a circuit board (not shown). Can be reduced. Further, when the melting point of the brazing material 50 is equal to or lower than the melting points of the sealing frame 37 and the joining member 40, the brazing material 50 is melted at the time of joining by the sealing frame 37 and the joining member 40 The members 30 can be electrically connected. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

Further, in the method of manufacturing the crystal unit 1, the step of preparing the base member 30, the step of arranging the brazing material 50 on one of the base member 30 or the conductive lid member 20, the quartz crystal vibrating element 10 and the brazing material 50 Bonding the base member 30 and the lid member 20 with the insulating sealing frame 37 and the bonding member 40 so as to form the internal space 26 in which the metal is housed, and bonding the brazing material 50 to form the base member 30. And the step of electrically connecting the cover member 20 to the cover member 20. As described above, since the brazing material 50 is accommodated in the internal space 26, bonding by the brazing material 50 is less susceptible to the influence of external humidity, corrosive gas or the like, and the change with time can be reduced. Also, by electrically connecting the lid member 20 and the base member 30 by joining the brazing material 50, the bonding strength is compared to the case where the base member 30 and the lid member 20 are electrically connected by mere contact. For example, thermal connection or mechanical shock may make it difficult to release the electrical connection. Therefore, the base member 30 and the lid member 20 can be stably conducted.

In the manufacturing method of the quartz crystal vibrator 1 described above, providing the external electrodes 35a to 35d at positions outside the internal space 26 and electrically connecting the external electrodes 35a to 35d to the internal space 26. Providing the internal electrode 33 c at the position accommodated in the connecting step, and electrically connecting includes electrically connecting the internal electrode 33 c and the lid member 20 by joining the brazing material 50. Thereby, conduction between the base member 30 and the lid member 20 can be easily realized. Further, the lid member 20 can be grounded by supplying the ground potential to the external electrode 35d. Therefore, the floating capacity which may be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal vibrating element 10 can be prevented.

Further, in the method of manufacturing the quartz crystal vibrator 201, the step of arranging includes arranging the brazing material 250 on the internal electrode 233c. Thereby, the electrical connection between the internal electrode 233c and the lid member 220 can be easily realized.

In the method of manufacturing the quartz crystal vibrator 1 described above, the brazing material 50 has a melting point not less than 270 ° C. and not more than the melting point of the sealing frame 37 and the joining member 40. Heating and melting. Thus, the step of joining the base member 30 and the lid member 20 and the step of electrically coupling the base member 30 and the lid member 20 can be performed simultaneously. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

In addition, each embodiment described above is for making an understanding of this invention easy, and is not for limiting and interpreting this invention. The present invention can be modified / improved without departing from the gist thereof, and the present invention also includes the equivalents thereof. That is, those in which persons skilled in the art appropriately modify the design of each embodiment are also included in the scope of the present invention as long as they have the features of the present invention. For example, each element included in each embodiment and its arrangement, material, conditions, shape, size, and the like are not limited to those illustrated, and can be appropriately changed. Each embodiment is an exemplification, and it goes without saying that partial replacement or combination of the configurations shown in different embodiments is possible, and these are also included in the scope of the present invention as long as they include the features of the present invention. .

DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator, 10 ... Crystal vibrating element, 11 ... Crystal piece, 12a ... 1st main surface, 12b ... 2nd main surface, 14a ... 1st excitation electrode, 14b ... 2nd excitation electrode, 15a, 15b ... Drawer Electrodes 16a, 16b: connection electrodes 20: lid members 21: top surface portions 22: side wall portions 23: opposing surfaces 24: inner surfaces 25: outer surfaces 26: internal spaces 27: openings 30: base members 31: base body 32a: first main surface 32b: second main surface 33a: electrode pad 33b: electrode pad 33c: internal electrode 34a, 34b: via electrode 35a, 35b, 35c, 35d: external Electrodes 36a, 36b: conductive holding members, 37: sealing frames, 40: bonding members, 41: holes, 42: via electrodes, 50: brazing material, 201: crystal oscillator, 210: crystal vibrating element, 220: Lid member, 222a ... 1st main surface, 2 2b: second main surface, 226: internal space, 230: base member, 233c: internal electrode, 235d: external electrode, 238a: internal bottom surface, 238b: opposing surface, 238c: internal surface, 240: bonding member, 250: brazing Material, 326 ... internal space.

Claims (11)

1. A piezoelectric vibration element,
   A base member,
   A lid member which is joined to the base member via an insulating joint member and has conductivity so as to accommodate the piezoelectric vibrating element in an internal space formed by the base member;
   And a brazing material housed in the internal space and joined to the base member and the lid member so as to electrically connect the base member and the lid member.
   Piezoelectric vibrator.
2. The base member includes an external electrode provided outside the internal space, and an internal electrode accommodated in the internal space and electrically connected to the external electrode.
   The brazing material is joined to the base member and the lid member so as to electrically connect the internal electrode and the lid member.
   The piezoelectric vibrator according to claim 1.
3. The internal space has a rectangular shape when the main surface of the base member is planarly viewed,
   The brazing material is provided at the corner of the rectangular shape,
   The piezoelectric vibrator according to claim 1.
4. The base member includes an electrode pad electrically connected to the piezoelectric vibrating element,
   The brazing material is provided at a corner relatively distant from the electrode pad among a plurality of the corners when the main surface of the base member is planarly viewed.
   The piezoelectric vibrator according to claim 3.
5. The material of the lid member is metal,
   The piezoelectric vibrator according to any one of claims 1 to 4.
6. The material of the bonding member is inorganic glass,
   The piezoelectric vibrator according to any one of claims 1 to 5.
7. The brazing material has a melting point of not less than 270 ° C. and not more than the melting point of the joining member.
   The piezoelectric vibrator according to any one of claims 1 to 6.
8. Preparing a base member;
   Placing a brazing material on one of the base member or the conductive lid member;
   Bonding the base member and the lid member with an insulating bonding member so as to form an internal space in which a piezoelectric vibration element and the brazing material are accommodated;
   Electrically connecting the base member and the lid member by joining the brazing material.
   Method of manufacturing a piezoelectric vibrator.
9. The preparing step includes providing an external electrode at a position outside the internal space, and providing an internal electrode at a position electrically connected to the external electrode and accommodated in the internal space. ,
   The step of electrically connecting includes electrically connecting the internal electrode and the lid member by bonding the brazing material.
   A method of manufacturing a piezoelectric vibrator according to claim 8.
10. The disposing step includes disposing the brazing material on the internal electrode,
    A method of manufacturing a piezoelectric vibrator according to claim 9.
11. The brazing material has a melting point of not less than 270 ° C. and not more than the melting point of the joining member,
    The bonding step includes heating and melting the bonding member.
    The method of manufacturing a piezoelectric vibrator according to any one of claims 8 to 10.

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