WO2019061963A1 - 激光切割方法 - Google Patents

激光切割方法 Download PDF

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Publication number
WO2019061963A1
WO2019061963A1 PCT/CN2018/073501 CN2018073501W WO2019061963A1 WO 2019061963 A1 WO2019061963 A1 WO 2019061963A1 CN 2018073501 W CN2018073501 W CN 2018073501W WO 2019061963 A1 WO2019061963 A1 WO 2019061963A1
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Prior art keywords
cutting
substrate
heat absorbing
absorbing layer
cut
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PCT/CN2018/073501
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English (en)
French (fr)
Inventor
袁朝煜
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2019061963A1 publication Critical patent/WO2019061963A1/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators

Definitions

  • the present invention relates to the field of display panel manufacturing technology, and in particular, to a laser cutting method.
  • the whole mother board is usually cut to obtain a display panel of a suitable size.
  • laser cutting is a common method.
  • a large temperature gradient is generated between the cutting position and the non-cutting position around it, which causes thermal stress to be easily generated between the cutting position and the position nearby.
  • cracks are easily generated in the direction in which the temperature gradient is pressed.
  • irregular cutting regions such as chamfers and perforations, irregular deformation is likely to occur, and concentration of thermal stress is easily generated, so that defects such as cracks are more likely to occur, thereby affecting the quality of the display panel product.
  • the invention provides a laser cutting method, which can avoid defects such as cracks during laser cutting, and obtain a product with better quality.
  • the laser cutting method provided by the invention comprises the steps of:
  • the heat absorbing layer on the substrate to be cut after the cutting is completed is removed.
  • the cutting track includes a regular track and an irregular track.
  • the heat absorption layer covered on the regular track is a plurality of layers, and the heat absorption layer covered on the irregular track is at least one layer.
  • the number of layers of the heat absorption layer of the regular track is less than the number of layers of the heat absorption layer of the irregular track.
  • the irregular track includes a chamfer cutting track and a perforated cutting track; and the regular track includes a straight cutting track.
  • the heat absorbing layer is covered on the cutting region of the substrate to be cut by any one of coating, sputtering or vapor deposition.
  • the heat absorbing layer is UV photo-debonding.
  • the "laser irradiation to the heat absorption layer and cutting the substrate to be cut along the cutting track” includes: the heat absorption layer is melted under the laser irradiation, and flows into the laser to cut the to-be-processed Cutting the substrate into the cutting gap.
  • the heat absorbing layer on the substrate to be cut after cutting is completed by wiping or wind sweeping.
  • the width of the heat absorbing layer covering the cutting track is larger than the spot diameter of the laser.
  • the substrate to be cut is an OLED panel or an LCD panel.
  • the laser cutting method provided by the present invention covers a heat absorbing layer on a cutting track of the substrate to be cut before laser cutting, so that when the laser cuts the substrate to be cut along the cutting track, the suction
  • the thermal layer can partially absorb the thermal energy of the laser, thereby reducing the temperature gradient of the cutting position on the substrate to be cut and the non-cutting position around the cutting surface during cutting, reducing the generation of thermal stress, thereby reducing defects such as cracks. , get better quality products.
  • FIG. 1 is a schematic flow chart of a laser cutting method according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a substrate to be cut before cutting according to an embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional view of a substrate to be cut before cutting according to an embodiment of the present invention
  • FIG. 4 is a schematic cross-sectional view showing a process of cutting a substrate to be cut according to an embodiment of the present invention.
  • the present invention provides a laser cutting method, the laser cutting method comprising the steps of:
  • Step 110 Referring to FIG. 2 and FIG. 3 together, the heat absorption layer 20 is covered on the cutting track of the substrate 10 to be cut.
  • the substrate 10 to be cut is cut by laser cutting.
  • the cutting includes cutting the substrate 10 to be cut to obtain a substrate of a suitable size, and further including chamfering, perforating, or the like of the substrate 10 to be cut to obtain a good appearance effect or satisfying certain use requirements.
  • Substrate Moreover, in order to obtain a substrate of a desired size or having a desired chamfer, perforation, etc., the substrate to be cut 10 has a predetermined cutting trajectory, and the laser 11 is cut along the cutting trajectory to obtain a desired A substrate having a size or having a desired chamfer, perforation, or the like.
  • the laser 11 can be cut along the cutting trajectory by fixing the trajectory of the laser head of the laser 11 by fixing the substrate 10 to be cut; or, the laser 11 can be fixedly generated.
  • a laser head that cuts the laser light 11 along the cutting trajectory by preset a motion trajectory of the substrate 10 to be cut; or, by preset a motion trajectory of the substrate 10 to be cut and generates the laser 11
  • the trajectory of the laser head causes the laser 11 to move relative to the substrate 10 to be cut so that the laser 11 cuts along the cutting trajectory.
  • the substrate 10 to be cut may be an OLED panel, an AMOLED panel or an LCD panel, or an OLED substrate, an AMOLED substrate or an array substrate, a color film substrate, or the like, or other metal substrate, glass substrate, and flexible which need to be cut.
  • Various types of substrates such as substrates.
  • the substrate to be cut 10 is a flexible OLED panel, and the substrate to be cut is cut by the laser 11 cutting method, so that the substrate after the cutting is completed meets the use requirements.
  • the heat absorbing layer 20 is a material having a strong heat absorbing ability.
  • the heat absorbing layer 20 is covered on the cutting track of the substrate 10 to be cut, and the heat absorbing layer 20 can partially absorb and cut the material.
  • the thermal energy of the laser light of the substrate 10 to be cut reduces the magnitude of the temperature gradient generated on the substrate 10 to be cut during cutting, and reduces the change of thermal stress, thereby reducing the occurrence of defects such as cracks, and obtaining a product of better quality.
  • the heat absorbing layer 20 can be converted from a solid state to a molten state under the irradiation of the laser light 11, so that the generated cutting gap can be flowed when the laser 11 cuts the substrate 10 to be cut.
  • the heat absorbing layer 20 can always be located in the cutting of the substrate 10 to be cut.
  • the inside of the panel 10 to be cut can still be reduced, and cracks can be generated, thereby protecting the quality of the surface and the interior of the substrate 10 to be cut. Thereby, a substrate having a better quality is obtained.
  • the heat absorbing layer 20 is UV photo-debonded, and is coated on the cutting track by coating.
  • the UV photo-decomposing gel has a strong heat-absorbing ability, and the heat-absorbing process loses viscosity and is in a molten state and has a certain fluidity.
  • the heat absorbing layer 20 can also be other materials having strong heat absorbing ability, and the heat absorbing layer 20 covers the cutting trajectory according to the material of the heat absorbing layer 20. Different ways, for example, may also be sputtering or vapor deposition (including PVD, CVD, etc.); or, when the heat absorbing layer 20 is prefabricated into a sheet-like bonding material, the heat absorbing layer 20 may be directly attached. It is combined with the substrate 10 to be cut.
  • the cutting track includes a regular track and an irregular track
  • the heat absorption layer 20 includes a first heat absorption layer 21 and the second heat absorption layer 22.
  • the heat absorbing layer 20 covered on the regular track is a first heat absorbing layer 21, and the heat absorbing layer 20 covered on the irregular track is a second heat absorbing layer 22.
  • the substrate 10 to be cut after the cutting is completed as a mobile phone display panel
  • the cutting track of the substrate 10 to be cut includes a straight cutting track of three sides of the substrate 10 to be cut to meet the display panel of the mobile phone.
  • the size requirement also includes the chamfering of the substrate 10 to be cut and the opening of the earpiece area and the camera area, so as to meet the requirements of the use, assembly requirements and appearance effects of the display panel of the mobile phone.
  • the regular trajectory includes a straight cut trajectory or a curved straight cut trajectory with a large curvature.
  • the cutting track is a regular track
  • the deformation of each position of the cutting track is small, so that the stress concentration is small, and therefore, the cutting track is a regular track.
  • the thickness of the heat absorbing layer 20 can be made thinner, that is, the thickness of the first heat absorbing layer 21 can be thinner, and the substrate 10 to be cut is ensured.
  • the straight cut track belongs to a regular track, and the first heat absorption layer 21 is covered thereon.
  • the irregular trajectory includes a chamfered cutting trajectory, a perforated cutting trajectory, or various varying shapes of cutting trajectories such as zigzag, wavy, and the like.
  • the cutting trajectory is an irregular trajectory
  • the deformation of each position of the cutting trajectory when the substrate 10 to be cut is cut is large, so that the stress is easily concentrated and defects are easily generated. Therefore, at a position where the cutting track is an irregular track, the thickness of the heat absorbing layer 20 needs to be thicker than when the cutting track is a regular track, so as to ensure that the deformation of each position of the cutting track can be reduced. Reduce the occurrence of such defects.
  • the thickness of the second heat absorbing layer 22 is greater than the thickness of the first heat absorbing layer 21, so that the heat absorbing layer is minimized while ensuring that the defect at the cutting track can be reduced.
  • the use of 20 endothermic materials saves resources and reduces production costs.
  • the thickness of the heat absorbing layer 20 is also different, thereby reducing the defects generated by the laser cutting position and reducing the heat absorbing material of the heat absorbing layer 20. Use, save resources and reduce production costs.
  • the thickness of the heat absorbing layer 20 may be thin; when the thickness of the substrate 10 to be cut is thick, the thickness of the heat absorbing layer 20 is relatively thick.
  • the heat absorbing layer 20 is formed on the substrate to be cut by coating one by one by coating, and the heat absorbing is controlled by controlling the number of layers to be coated.
  • the heat absorbing layer 20 covered on the regular track is a plurality of layers, and the heat absorbing layer covered on the irregular track is at least one layer.
  • the number of layers of the heat absorbing layer 20 of the regular trajectory is less than the number of layers of the heat absorbing layer 20 of the irregular trajectory, so that the thickness of the first heat absorbing layer 21 is smaller than The thickness of the second heat absorption layer 22 is described.
  • the chamfering and the cutting track of the opening of the earpiece area and the camera area belong to the irregular track, and the second heat absorbing layer 22 is covered thereon.
  • the width of the heat absorbing layer 20 covering the cutting trajectory is larger than the spot diameter of the laser light 11, so that the position of the spot irradiation of the laser light 11 is covered by the heat absorbing layer 20,
  • the heat of each spot of the spot of the laser light 11 is partially absorbed by the heat absorbing layer 20, avoiding a large temperature gradient between the cutting position irradiated by the spot and the non-cutting position around the spot, thereby reducing the cutting position and
  • the concentration of stress between the surrounding non-cutting locations reduces the occurrence of defects on the substrate 10 to be cut.
  • the width direction of the heat absorbing layer 20 is perpendicular to the extending direction of the heat absorbing layer 20 and parallel to the plane of the substrate 10 to be cut.
  • Step 120 referring to FIG. 4, laser light is irradiated to the heat absorption layer 20 and the substrate to be cut 10 is cut along the cutting track.
  • the laser 11 cuts the substrate 10 to be cut along the cutting trajectory, and at this time, the laser 11 is first irradiated onto the heat absorbing layer 20 covering the cutting trajectory.
  • the heat absorbing layer 20 absorbs part of the thermal energy of the laser light 11 to be melted into a fluid, and flows into the cutting slit generated by the laser 11 to cut the substrate 10 to be cut. That is, the heat absorbing material of the heat absorbing layer 20 is always located at the cutting position of the substrate 10 to be cut, absorbs part of the heat energy of the laser light irradiated at the position, and reduces the temperature gradient generated by the laser irradiation, thereby reducing the heat treatment.
  • the unevenness of the thermal stress on the surface and the inside of the cutting position of the substrate 10 is cut, thereby reducing defects such as cracks which may occur on the surface and the inside of the cutting position of the substrate 10 to be cut.
  • Step 130 removing the heat absorbing layer 20 on the substrate 10 to be cut after the cutting is completed.
  • the heat absorbing layer 20 on the substrate 10 to be cut after the cutting is completed. This ensures that the substrate is cleaned for the next step.
  • the heat absorbing layer 20 absorbs the heat energy of the laser light 11 and melts into a liquid state. Therefore, the heat absorbing layer 20 can be removed by wiping or sweeping by a sweeper, and can be removed. The heat absorbing layer 20 is recycled and recycled, thereby saving resources and reducing production costs. It can be understood that when the heat absorbing layer 20 is other heat absorbing materials, the removing manner is that other operations such as cleaning or tearing may be selected according to the difference of the heat absorbing layer 20.
  • the laser 11 cutting method provided by the present invention covers the heat absorbing layer 20 on the cutting track of the substrate to be cut before the laser cutting, so that the laser cuts the substrate to be cut along the cutting track.
  • the heat absorbing layer 20 can partially absorb the thermal energy of the laser light 11, thereby reducing the magnitude of the temperature gradient at the cutting position of the tape cutting substrate 10 and the non-cutting position around the cutting substrate 10, and reducing the thermal stress. Produced, thereby reducing the occurrence of defects such as cracks, resulting in a better quality product.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种激光(11)切割方法，通过在进行激光(11)切割前，在待切割基板(10)的切割轨迹上覆盖吸热层(20)，使得激光(11)沿所述待切割基板(10)的切割轨迹切割所述待切割基板(10)时，所述吸热层(20)能够部分吸收所述激光(11)的热能，从而减小切割时在所述待切割基板(10)上切割位置与其周围的非切割位置的温度梯度的大小，减少热应力的产生，进而减少裂纹等缺陷的产生，得到品质较佳的产品。

Description

激光切割方法 技术领域
本发明涉及一种显示面板制造技术领域，尤其涉及一种激光切割方法。
背景技术
现有显示面板的制作过程中，通常是将整块的母板进行切割得到适合尺寸的显示面板。其中，激光切割是常用的方式。但是，在激光切割的过程中，由于激光的能量密度高，使得切割位置及其周围的非切割位置之间产生较大的温度梯度，造成切割位置及其附近的位置之间容易产生热应力，进而使得压着所述温度梯度的方向容易产生裂纹。尤其对于倒角、穿孔等不规则的切割区域，容易产生不规则的变形而容易产热应力的集中，从而更容易产生裂纹等缺陷，进而影响显示面板产品的品质。
发明内容
本发明提供一种激光切割方法，避免在激光切割的过程中可能产生裂纹等缺陷，得到品质较佳的产品。
本发明提供的所述激光切割方法，包括步骤：
在待切割基板的切割轨迹上覆盖吸热层；
激光照射至所述吸热层并沿所述切割轨迹切割所述待切割基板；
去除完成切割后的所述待切割基板上的吸热层。
其中，所述切割轨迹包括规则轨迹及非规则轨迹，所述规则轨迹上覆盖的所述吸热层为多层，所述非规则轨迹上覆盖的所述吸热层为至少一层。
其中，所述规则轨迹的所述吸热层的层数少于所述非规则轨迹的所述吸热层的层数。
其中，所述非规则轨迹包括倒角切割轨迹、穿孔切割轨迹；所述规则轨迹包括直线切割轨迹。
其中，通过涂布、溅射或气相沉积中任一种方法在所述待切割基板的切割区上覆盖所述吸热层。
其中，所述吸热层为UV光解胶。
其中，所述“激光照射至所述吸热层并沿所述切割轨迹切割所述待切割基板”包括：所述吸热层在所述激光照射下熔融，并流入所述激光切割所述待切割基板产生的切割缝隙中。
其中，通过擦拭或者风扫去除完成切割后的所述待切割基板上的吸热层。
其中，覆盖于所述切割轨迹上的所述吸热层的宽度大于所述激光的光斑直径。
其中，所述待切割基板为OLED面板或者LCD面板。本发明提供的所述激光切割方法，通过在进行激光切割前，在所述待切割基板的切割轨迹上覆盖吸热层，使得激光沿所述切割轨迹切割所述待切割基板时，所述吸热层能够部分吸收所述激光的热能，从而减小切割时在所述待切割基板上切割位置与其周围的非切割位置的温度梯度的大小，减少热应力的产生，进而减少裂纹等缺陷的产生，得到品质较佳的产品。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例所述激光切割方法的流程示意图；
图2是本发明实施例所述待切割基板切割前的结构示意图；
图3是本发明实施例所述待切割基板切割前的截面示意图；
图4是本发明实施例所述待切割基板切割过程中的截面示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参与图1，本发明提供一种激光切割方法，所述激光切割方法包括步骤：
步骤110、请一并参阅图2及图3，在待切割基板10的切割轨迹上覆盖吸热层20。
本发明中，通过激光切割的方式对所述待切割基板10进行切割。所述切割包括对于所述待切割基板10进行切割以得到合适尺寸的基板，还包括对所述待切割基板10进行倒角、穿孔等以得到具有较好的外观效果或者满足一定的使用需求的基板。并且，为了能够得到所需尺寸或者具有所需倒角、穿孔等的基板，所述待切割基板10具有预设的切割轨迹，激光11沿着所述切割轨迹进行切割，即可得到具有所需尺寸或者具有所需倒角、穿孔等的基板。具体的，能够通过固定所述待切割基板10，通过预设产生所述激光11的激光头的运动轨迹使得所述激光11沿着所述切割轨迹进行切割；或者，固定产生所述激光11的激光头，通过预设所述待切割基板10的运动轨迹使得所述激光11沿着所述切割轨迹进行切割；或者，通过预设所述待切割基板10的运动轨迹及产生所述激光11的激光头的运动轨迹，使得所述激光11头与所述待切割基板10进行相对运动，以使得所述激光11沿着所述切割轨迹进行切割。
本发明中，所述待切割基板10可以为OLED面板、AMOLED面板或者LCD面板，或者为OLED基板、AMOLED基板或者阵列基板、彩膜基板等，或者其它需要进行切割的金属基板、玻璃基板、柔性基板等各种类型的基板。本实施例中，所述待切割基板10为柔性的OLED面板，通过所述激光11切割方法对所述待切割基板进行切割，以使切割完成后的基板满足使用需求。
所述吸热层20为具有较强吸热能力的材料，通过将所述吸热层20覆盖在所述待切割基板10的切割轨迹上，通过所述吸热层20能够部分吸收切割所述待切割基板10的激光的热能，减小切割时在所述待切割基板10上产生温度梯度的大小，减小热应力的变化，从而减少裂纹等缺陷的产生，得到品质较佳的产品。请参阅图4，优选的，所述吸热层20能够在所述激光11的照射下从固态转变为熔融态，从而能够在所述激光11切割所述待切割基板10时流入产生的切割缝隙中，从而使得所述激光11切割从所述待切割基板10的表面至所述待切割基板10的内部进行切割的过程中，所述吸热层20能够始终位于所述待切割基板10的切割位置，使得所述激光11切割至所述待切割基板10的内部 时，依然能够减少所述待切割面板10的内部也能够产生裂纹，进而保护了所述待切割基板10表面及内部的品质，从而得到具有较佳品质的基板。本实施例中，所述吸热层20为UV光解胶，通过涂布的方式覆盖于所述切割轨迹上。所述UV光解胶具有很强的吸热能力，并且激光作用过程中会先吸热失去粘性而呈熔融态并具有一定的流动性。可以理解的是，所述吸热层20还可以为其它具有强的吸热能力的材料，并且，根据所述吸热层20的材料的不同，所述吸热层20覆盖于所述切割轨迹上的方式不同，例如，还可以为溅射或气相沉积(包括PVD、CVD等)；或者，所述吸热层20预制为片状贴合材料时，可以直接将所述吸热层20贴合于所述待切割基板10上。
并且，所述切割轨迹包括规则轨迹及非规则轨迹，所述吸热层20包括第一吸热层21及所述第二吸热层22。所述规则轨迹上覆盖的所述吸热层20为第一吸热层21，在所述非规则轨迹上覆盖的所述吸热层20为第二吸热层22。本实施例中，切割完成后的所述待切割基板10作为手机显示面板，所述待切割基板10的切割轨迹包括所述待切割基板10三边的直线切割轨迹，以满足所述手机显示面板的大小需求，还包括对所述待切割基板10的倒角及听筒区、摄像头区的开孔设置，从而满足所述手机显示面板的使用需求、装配需求及外观效果等需求。
具体的，所述规则轨迹包括直线切割轨迹或者曲率较大的近直线的弧线切割轨迹。所述切割轨迹为规则轨迹时，沿所述切割轨迹切割所述待切割基板10时，所述切割轨迹各位置的变形较小，从而使得应力集中较小，因此，所述切割轨迹为规则轨迹时，产生缺陷的较少。因此，在所述切割轨迹为规则轨迹的位置，可以使得所述吸热层20的厚度可以较薄，即所述第一吸热层21的厚度可以较薄，在保证所述待切割基板10的切割位置的缺陷较少的情况下，尽量减薄所述吸热层20的厚度，从而节约资源，减少生产成本。本实施例中，所述直线切割轨迹属于规则轨迹，其上覆盖所述第一吸热层21。
所述非规则轨迹包括倒角切割轨迹、穿孔切割轨迹，或者各种锯齿状、波浪形等各种变化形状的切割轨迹。所述切割轨迹为非规则轨迹时，切割所述待切割基板10时的切割轨迹各位置的变形较大，从而使得应力较容易集中，容易产生缺陷。因此，在所述切割轨迹为非规则轨迹的位置，所述吸热层20的 厚度较所述切割轨迹为规则轨迹时的厚度需要较厚，以保证能够减少所述切割轨迹各位置的变形，减少所述缺陷的产生。本实施例中，所述第二吸热层22的厚度大于所述第一吸热层21的厚度，从而在保证能够减少所述切割轨迹处缺陷产生的同时，尽量较少所述吸热层20的吸热材料的使用，节约资源，降低生产成本。并且，根据所述待切割基板10的厚度的不同，所述吸热层20的厚度也不相同，从而实现减少激光切割位置产生的缺陷的同时，减少所述吸热层20的吸热材料的使用，节约资源，降低生产成本。所述待切割基板10的厚度较薄时，所述吸热层20的厚度可以较薄；所述待切割基板10的厚度较厚时，所述吸热层20的厚度较厚。本实施例中，所述吸热层20为通过涂布的方式一层一层的涂布形成于所述待切割基板10上的，通过控制所述涂布的层数来控制所述吸热层20的厚度。所述规则轨迹上覆盖的所述吸热层20为多层，所述非规则轨迹上覆盖的所述吸热层为至少一层。本实施例中，所述规则轨迹的所述吸热层20的层数少于所述非规则轨迹的所述吸热层20的层数，使得所述第一吸热层21的厚度小于所述第二吸热层22的厚度。本实施例中，所述倒角及听筒区、摄像头区的开孔的切割轨迹属于所述非规则轨迹，其上覆盖所述第二吸热层22。
所述激光11照射于所述待切割基板10上时会产生光斑，被所述激光11照射的区域的所述待切割基板10会由于温度的升高而进行汽化，从而完成对所述待切割基板10的切割。本发明中，覆盖于所述切割轨迹上的所述吸热层20的宽度大于所述激光11的光斑直径，从而使得所述激光11的光斑照射的位置均被所述吸热层20覆盖，使得所述激光11的光斑各位置的热量被所述吸热层20部分吸收，避免所述光斑照射的切割位置与其周围的非切割位置之间产生大的温度梯度，进而减少所述切割位置与其周围的非切割位置之间的应力集中，减少所述待切割基板10上缺陷的产生。其中，所述吸热层20的宽度方向垂直于所述吸热层20的延伸方向，并平行于所述待切割基板10平面。
步骤120、请参阅图4，激光照射至所述吸热层20并沿所述切割轨迹切割所述待切割基板10。
所述激光11沿着所述切割轨迹切割所述待切割基板10，此时，所述激光11先照射于覆盖于所述切割轨迹上的吸热层20上。所述吸热层20吸收所述 激光11的部分热能进而熔融成流体，并流至所述激光11切割所述待切割基板10产生的切割缝隙中。即所述吸热层20的吸热材料始终位于所述待切割基板10的切割位置，吸收照射于该位置的激光的部分热能，减小由于激光照射而产生的温度梯度，从而减少所述待切割基板10的切割位置的表面及内部的热应力的不均，进而减少所述待切割基板10的切割位置的表面及内部可能产生的裂纹等缺陷。
步骤130、去除完成切割后的所述待切割基板10上的吸热层20。
所述待切割基板10切割完成后，去除完成切割后的所述待切割基板10上的吸热层20。从而保证基板的清洁，以便进行下一步操作。本实施例中，所述吸热层20吸收所述激光11的热能熔融为液态，因此，可以简单的通过擦拭或者通过扫风机进行风扫将所述吸热层20去除，并能够将去除的所述吸热层20进行回收及循环利用，从而节约资源，降低生产成本。可以理解的是，当所述吸热层20为其它吸热材料时，所述去除方式为可以根据所述吸热层20的不同，而选择清洗或者撕除等其它操作。
本发明提供的所述激光11切割方法，通过在进行激光切割前，在所述待切割基板的切割轨迹上覆盖所述吸热层20，使得激光沿所述切割轨迹切割所述待切割基板10时，所述吸热层20能够部分吸收所述激光11的热能，从而减小切割时在所述带切割基板10的切割位置与其周围的非切割位置的温度梯度的大小，减小热应力的产生，进而减少裂纹等缺陷的产生，得到品质较佳的产品。
以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。

Claims (10)

  1. 一种激光切割方法，其中，包括步骤：
    在待切割基板的切割轨迹上覆盖吸热层；
    激光照射至所述吸热层并沿所述切割轨迹切割所述待切割基板；
    去除完成切割后的所述待切割基板上的吸热层。
  2. 如权利要求1所述的激光切割方法，其中，所述切割轨迹包括规则轨迹及非规则轨迹，所述规则轨迹上覆盖的所述吸热层为多层，所述非规则轨迹上覆盖的所述吸热层为至少一层。
  3. 如权利要求2所述的激光切割方法，其中，所述规则轨迹上覆盖的所述吸热层的层数少于所述非规则轨迹上覆盖的所述吸热层的层数。
  4. 如权利要求3所述的激光切割方法，其中，所述非规则轨迹包括倒角切割轨迹、穿孔切割轨迹；所述规则轨迹包括直线切割轨迹。
  5. 如权利要求1所述的激光切割方法，其中，通过贴合、涂布、溅射或气相沉积中任一种方法在所述待切割基板的切割轨迹上覆盖所述吸热层。
  6. 如权利要求1所述的激光切割方法，其中，所述吸热层为UV光解胶。
  7. 如权利要求6所述的激光切割方法，其中，所述“激光照射至所述吸热层并沿所述切割轨迹切割所述待切割基板”包括：所述吸热层在所述激光照射下熔融，并流入所述激光切割所述待切割基板产生的切割缝隙中。
  8. 如权利要求1所述的激光切割方法，其中，通过擦拭或者风扫去除完成切割后的所述待切割基板上的吸热层。
  9. 如权利要求1所述的激光切割方法，其中，覆盖于所述切割轨迹上的所述吸热层的宽度大于所述激光的光斑直径。
  10. 如权利要求1所述的激光切割方法，其中，所述待切割基板为OLED面板或者LCD面板。
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