WO2019058926A1 - Method for displaying printing result and screen printing method - Google Patents

Method for displaying printing result and screen printing method Download PDF

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Publication number
WO2019058926A1
WO2019058926A1 PCT/JP2018/032303 JP2018032303W WO2019058926A1 WO 2019058926 A1 WO2019058926 A1 WO 2019058926A1 JP 2018032303 W JP2018032303 W JP 2018032303W WO 2019058926 A1 WO2019058926 A1 WO 2019058926A1
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WO
WIPO (PCT)
Prior art keywords
pressure
mask
printing
filling
squeegee
Prior art date
Application number
PCT/JP2018/032303
Other languages
French (fr)
Japanese (ja)
Inventor
礒端 美伯
聖弥 黒田
奨 豊田
Original Assignee
パナソニックIpマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックIpマネジメント株式会社 filed Critical パナソニックIpマネジメント株式会社
Priority to JP2019543518A priority Critical patent/JP7113183B2/en
Priority to CN201880059200.0A priority patent/CN111093997B/en
Priority to DE112018004326.6T priority patent/DE112018004326T5/en
Publication of WO2019058926A1 publication Critical patent/WO2019058926A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/40Inking units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F33/00Indicating, counting, warning, control or safety devices
    • B41F33/02Arrangements of indicating devices, e.g. counters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F33/00Indicating, counting, warning, control or safety devices
    • B41F33/16Programming systems for automatic control of sequence of operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing

Definitions

  • the present invention relates to a method of displaying printing results and a screen printing method in a screen printing apparatus that moves a squeegee on a mask close to a substrate to print paste on the substrate.
  • the screen printing apparatus includes a mask having a pattern hole and being in proximity to the substrate, and a squeegee moving on the mask in proximity to the substrate, and the pattern hole of the mask is moved by moving the squeegee on the mask. Is filled with paste so that the paste is printed on the substrate.
  • Patent Document 1 describes a screen printing apparatus provided with a pressure sensor for detecting the pressure of cream solder to be printed through an opening for pressure detection formed in a mask.
  • the waveform detection result of the pressure detected by the pressure sensor is compared with the optimum waveform registered in the database, and the change of the printing condition and the measurement of the filling pressure are repeated until the two coincide.
  • the present invention has an object of providing a display method and a screen printing method of a printing result in a screen printing apparatus which can easily determine the suitability of printing conditions or can automatically set the printing conditions. I assume.
  • the display method of the printing result of the present invention includes a mask having a pattern hole and a squeegee moving on the mask, and moves the squeegee based on a preset printing condition to make the paste on the mask a pattern hole
  • the pattern hole is made to move with respect to a mask based on the printing conditions set beforehand.
  • the inspection hole provided in the mask separately is filled with paste, the change in pressure of the paste filled in the inspection hole is acquired as a pressure waveform, the filling pressure and filling time are detected from the pressure waveform, and the detected filling The pressure and the filling time are displayed on the display monitor together with the judgment criteria set in advance.
  • the screen printing method of the present invention comprises a mask having a pattern hole and a squeegee moving on the mask, and the paste on the mask is filled into the pattern hole by moving the squeegee based on a preset printing condition. And a screen printing method in a screen printing apparatus for transferring the paste filled in the pattern holes to a substrate, wherein the pattern holes are obtained by moving the squeegee with respect to the mask based on preset temporary printing conditions.
  • the inspection holes provided in the mask with paste Separately fill the inspection holes provided in the mask with paste, acquire the change in pressure of the paste filled in the inspection holes as a pressure waveform, detect the filling pressure and filling time from the pressure waveform, and fill pressure and filling time It is determined whether or not the preset determination criteria are satisfied, and when the determination criteria are satisfied, the temporary printing conditions are set as the printing conditions for production If the determination criteria are not satisfied, the temporary printing conditions are changed, and based on the changed temporary printing conditions, the process from the filling of the paste into the inspection hole to the determination as to whether the determination criteria are satisfied is performed again.
  • the paste on the mask is filled in the pattern holes by moving the squeegee based on the printing conditions, and the paste filled in the pattern holes is transferred to the substrate.
  • printing conditions it is possible to easily determine whether the printing conditions are appropriate. Further, according to the present invention, printing conditions can be set automatically.
  • FIG. 1 is a plan view of a screen printing apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a front view of the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 3 is a side view of the screen printing apparatus in the first embodiment of the present invention.
  • FIG. 4 is a plan view of a mask provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 5 is a block diagram showing a control system of the screen printing apparatus in the first embodiment of the present invention.
  • FIG. 6 is a side view showing a mask provided in the screen printing apparatus according to the first embodiment of the present invention together with a substrate.
  • FIG. 7 is a plan view of a mask provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 8 is a view showing the screen printing apparatus in the first embodiment of the present invention filling the substrate with the paste through the mask.
  • FIG. 9 is a view showing the screen printing apparatus in the first embodiment of the present invention filling the inspection holes of the mask with paste.
  • FIG. 10A is a view showing a state in which cleaning is performed by the cleaning unit provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 10B is a view showing a state in which cleaning is performed by the cleaning unit provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 10C is a diagram showing a state in which cleaning is performed by the cleaning unit provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 11 is a graph showing temporal changes in filling pressure measured by the screen printing apparatus in the first embodiment of the present invention.
  • FIG. 12 is a graph showing an example of determination criteria set by the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 13A is a view showing the printing pressure and the filling time obtained by measuring the temporal change of the filling pressure by the screen printing apparatus according to the first embodiment of the present invention, together with the set judgment criteria graph.
  • FIG. 13B is a view showing the printing pressure and the filling time obtained by measuring the temporal change of the filling pressure by the screen printing apparatus according to the first embodiment of the present invention, together with the set determination reference graph.
  • FIG. 14 is a block diagram showing a control system of the screen printing apparatus in the second embodiment of the present invention.
  • FIG. 15 is a flow chart showing the setting procedure of the printing conditions performed by the screen printing apparatus in the second embodiment of the present invention.
  • FIG. 16 is a view showing how the screen printing apparatus in the modified example of the first and second embodiments of the present invention fills the paste in the inspection hole of the mask.
  • FIGS. 1, 2 and 3 show a screen printing apparatus 1 according to a first embodiment of the present invention.
  • FIG. 1 is a plan view of the screen printing apparatus 1.
  • FIG. 2 is a front view of the screen printing apparatus 1.
  • FIG. 3 is a side view of the screen printing apparatus 1.
  • the screen printing apparatus 1 is an apparatus for carrying in the substrate 2 supplied from the upstream process side, printing a paste such as solder on the surface of the substrate 2 and carrying it out to the downstream process side.
  • the left-right direction of the screen printing apparatus 1 viewed from the operator OP is taken as the X-axis direction
  • the left side is taken as the upstream process side
  • the right side is taken as the downstream process side.
  • the front-rear direction of the screen printing apparatus 1 viewed from the operator OP is taken as a Y-axis direction
  • the front side viewed from the operator OP is referred to as the front
  • the back side viewed from the operator OP is referred to as the rear.
  • the vertical direction of the screen printing apparatus 1 is taken as the Z-axis direction.
  • the screen printing apparatus 1 includes a substrate holding unit 21 and a substrate holding unit moving mechanism 22 on a base 11.
  • a mask 13 is provided above the substrate holding unit 21.
  • a carry-in conveyor 14 is provided on the upstream process side of the substrate holding unit 21, and a carry-out conveyor 15 is provided on the downstream process side of the substrate holding unit 21 (FIG. 1).
  • the print head 16 is provided above the mask 13, and the imaging unit 17 and the cleaning unit 18 are provided in the region between the mask 13 and the substrate holding unit 21 (FIGS. 2 and 3).
  • the substrate holding unit 21 includes a pair of clamp members 21A that can be opened and closed in the Y-axis direction.
  • the pair of clamp members 21A clamps and holds both side portions of the substrate 2 carried in from the upstream process side facing in the Y-axis direction.
  • the substrate holding unit 21 includes a lift table 21 a and a substrate support unit 21 b that supports the substrate 2 from below.
  • the substrate holding portion moving mechanism 22 is provided on an XY table 22A that moves in a horizontal plane with respect to the base 11, a ⁇ table 22B that rotates around the Z axis provided on the XY table 22A, and a ⁇ table 22B.
  • a substrate lifting mechanism 22C for lifting and lowering the unit 21 is provided.
  • the substrate lifting mechanism 22C moves the substrate 2 against the mask 13. It can be approached and separated.
  • the mask 13 is made of a metal plate-like member and is disposed in a horizontal posture.
  • a pattern formation region 13R is set at the central portion of the mask 13.
  • a large number of pattern holes 13H corresponding to the electrodes provided on the upper surface of the substrate 2 are provided in the pattern formation region 13R (FIG. 4).
  • the print head 16 is provided with a print head moving table 31, two squeegee elevators 32 and two squeegees 33.
  • the print head moving table 31 extends in the X-axis direction in the upper region of the mask 13, and the print head moving unit 16K (FIG. 5) moves the print head moving table 31 (that is, the print head 16) in the Y axis direction.
  • the two squeegee elevators 32 are provided on the print head moving table 31 side by side in the Y-axis direction, and the rods 32R directed downward respectively protrude below the print head moving table 31.
  • the two squeegees 33 are attached to the lower end of the rod 32R of each of the two squeegee elevators 32, and are arranged below the print head moving table 31 in the Y-axis direction.
  • each squeegee 33 includes a squeegee base 41, a blade 42, and an attack angle adjusting unit 41M.
  • the squeegee base 41 is attached to the rod 32R of the squeegee lifting unit 32, and the blade 42 is attached to the squeegee base 41 so as to be pivotable about the X axis.
  • the two blades 42 extend in a direction in which opposing surfaces (referred to as paste scraping surfaces 42M) spread downward as viewed from the X-axis direction (FIG. 3).
  • the attack angle adjustment unit 41M has a function of adjusting an angle formed by the paste scraping surface 42M of the blade 42 and the upper surface of the mask 13, that is, the attack angle ⁇ .
  • the imaging unit 17 incorporates a camera with the imaging optical axis facing upward and a camera with the imaging optical axis facing downward, and images imaging objects located above and below at the same time or not simultaneously.
  • the imaging unit moving unit 17 K (FIG. 5) moves the imaging unit 17 in the X-axis direction and the Y-axis direction in the lower area of the mask 13.
  • the cleaning unit 18 includes a base 51, a mask cleaning unit 52 and a sensor cleaning unit 53.
  • the base body 51 extends in the X-axis direction in the lower region of the mask 13, and the cleaning unit moving unit 18K (FIG. 5) moves the base body 51 (that is, the cleaning unit 18) in the Y-axis direction.
  • the mask cleaning unit 52 is formed of a paper member disposed to protrude above the base body 51.
  • the sensor cleaning unit 53 includes a suction mechanism provided to protrude downward of the base body 51.
  • the substrate holding unit moving mechanism 22 displaces the substrate holding unit 21 in the horizontal direction so that the positions of the electrode 2D of the substrate 2 held by the substrate holding unit 21 and the pattern holes 13H of the mask 13 coincide with each other.
  • the substrate 2 is raised by contact with the lower surface of the mask 13 and positioned (FIG. 6).
  • the pattern formation region 13R of the mask 13 faces the upper surface of the substrate 2
  • the pattern hole 13H of the mask 13 faces the electrode 2D of the substrate 2 vertically (FIG. 6).
  • graphics and characters are printed on the upper surface of the substrate 2 by silk printing 2E, and even when the substrate 2 is brought into contact with the lower surface of the mask 13, there may be a gap GP between the electrode 2D and the mask 13 .
  • an inspection hole 13K is provided at a position deviated from the pattern formation region 13R of the mask 13 in the X-axis direction.
  • the inspection holes 13 K penetrate in the thickness direction of the mask 13.
  • a sensor mount 21M is provided on the upper surface of the substrate holder 21 at a position opposed to the inspection hole 13K in the state where the substrate 2 is positioned.
  • a pressure detection sensor 60 for detecting the pressure applied to the upper surface is provided on the upper portion of the sensor mount portion 21M (FIGS. 1, 2 and 3).
  • the sensor mount unit 21M is lifted and lowered by a sensor mount lifting and lowering mechanism 21c disposed on the lifting and lowering table 21a.
  • the sensor mount elevating mechanism 21 c lowers the sensor mount unit 21 M so that the sensor mount unit 21 M and the pressure detection sensor 60 do not interfere with the transfer of the substrate 2.
  • the sensor mount elevating mechanism 21c raises the sensor mount portion 21M so that the pressure received by the pressure detection sensor 60 is positioned immediately below the inspection hole 13K when at least the substrate 2 is positioned on the mask 13.
  • the squeegee lifting unit 32 lowers the squeegee 33 with the substrate 2 positioned, and brings the blade 42 into contact with the upper surface of the mask 13.
  • the squeegee lifting unit 32 has a function of adjusting a force (printing pressure) for pressing the squeegee 33 against the upper surface of the mask 13.
  • the paste scraping surface 42M of each blade 42 abuts on the upper surface of the mask 13 at a predetermined angle (the above-mentioned attack angle ⁇ , FIG. 3).
  • the control device 70 included in the screen printing apparatus 1 performs the loading operation of the substrate 2 by the loading conveyor 14, the holding operation of the substrate 2 by the substrate holding unit 21, and the positioning of the substrate 2 with respect to the mask 13 by the substrate holding unit moving mechanism 22. Operation and control of the unloading operation of the substrate 2 by the unloading conveyor 15 are performed. Further, the control device 70 controls the moving operation of the print head 16 by the print head moving unit 16K, the raising and lowering operation of the squeegee 33 by the squeegee lifting unit 32, and the adjustment operation of the attack angle ⁇ of the blade 42 by the attack angle adjusting unit 41M. Do. The control device 70 controls the moving operation of the imaging unit 17 by the imaging unit moving unit 17K, the imaging operation by the imaging unit 17, the moving operation of the cleaning unit 18 by the cleaning unit moving unit 18K, and the cleaning operation by the cleaning unit 18. Do.
  • the pressure detection sensor 60 is connected to the control device 70, and the pressure detected by the pressure detection sensor 60 is input to the control device 70.
  • the control device 70 is connected to a touch panel 71 as an input / output device.
  • the touch panel 71 functions as an input device for the operator OP to perform required input to the control device 70, and the control device 70 displays the state of the screen printing device 1 to the operator OP or gives an operation instruction to the operator OP. Function as a display monitor.
  • the control device 70 includes a source data storage unit 70a, a printing condition storage unit 70b, and a print control unit 70c.
  • the matrix data storage unit 70a stores information on the substrate 2 to be screen-printed and the mask 13 to be used for the substrate 2 (hereinafter referred to as mask / substrate data).
  • the mask data storage unit 70a stores, as mask / substrate data, data of at least a pattern hole maximum dimension, a pattern hole minimum area, a mask thickness, and a gap GP. These data are stored in the master data storage unit 70a before the screen printing operation.
  • the largest dimension of the pattern hole stored in the data storage unit 70a is the maximum value among the dimensions (dimension DH shown in FIG. 7) in the moving direction of the squeegee 33 of all the pattern holes 13H included in the mask 13. is there.
  • the pattern hole minimum area is the minimum value among the opening areas SH (areas of the regions shown by oblique lines in FIG. 7) of all the pattern holes 13H included in the mask 13.
  • the mask thickness is the dimension TH in the thickness direction of the mask 13 shown in FIG.
  • the gap GP is, as described above, the vertical distance between the electrode 2D and the mask 13 when the substrate 2 is positioned with respect to the mask 13 (FIG. 6).
  • the printing condition storage unit 70 b stores printing conditions necessary for the screen printing apparatus 1 to perform the printing operation.
  • the printing conditions stored in the printing condition storage unit 70 b include the printing conditions regarding the squeegee 33, the printing conditions regarding the substrate holding unit moving mechanism 22, and the printing conditions regarding the operation of the cleaning unit 18.
  • the printing conditions for the squeegee 33 include printing pressure, attack angle ⁇ , and moving speed (squeegee speed).
  • the printing conditions for the substrate holding unit moving mechanism 22 include information on an operation (a plate separating operation) for separating the substrate 2 from the mask 13, for example, the lowering speed of the substrate 2.
  • the printing conditions for the operation of the cleaning unit 18 include information on the frequency of cleaning of the mask 13.
  • the printing conditions for the squeegee 33 are susceptible to the paste used. For this reason, when the state of the paste changes due to the printing operation of the screen printing apparatus 1 and a printing failure occurs, it is necessary to adjust the printing conditions for the squeegee 33.
  • the operator can use the touch panel 71 to input setting of printing conditions for the squeegee 33, that is, an input for setting the attack angle ⁇ and an input for setting the squeegee speed.
  • the input value is stored in the printing condition storage unit 70b.
  • the print control unit 70 c controls a series of printing operations for printing the paste on the substrate 2 based on the printing conditions stored in the printing condition storage unit 70 b. At this time, the print control unit 70c operates the attack angle adjustment unit 41M such that the attack angle ⁇ of the squeegee 33 becomes the angle stored in the printing condition storage unit 70b, and the moving speed of the squeegee 33 is stored in the printing condition storage unit 70b.
  • the print head moving unit 16K is operated to achieve the stored speed.
  • the print control unit 70 c operates the substrate holding unit moving mechanism 22 so that the lowering speed of the substrate 2 in the plate separation operation becomes the speed stored in the printing condition storage unit 70 b.
  • the loading conveyor 14 receives the substrate 2 input from the outside and delivers it to the substrate holding unit 21.
  • the substrate holding unit 21 clamps the substrate 2 by the pair of clamp members 21A. Hold.
  • the imaging unit 17 images both the substrate 2 or the substrate 2 and the mask 13.
  • the control device 70 recognizes the image captured by the imaging unit 17 and determines the positional deviation (relative positional relationship) between the mask 13 and the substrate 2
  • the substrate holding unit moving mechanism 22 operates based on the result, and the substrate 2 is positioned close to the mask 13 from below and positioned.
  • the substrate holding unit moving mechanism 22 moves the substrate holding unit 21 holding the substrate 2 in the horizontal plane by the XY table 22A and rotates the ⁇ table 22B in the horizontal plane. This is performed by raising and lowering by the substrate lifting mechanism 22C.
  • the squeegee lifting unit 32 lowers the squeegee 33 to bring the blade 42 into contact with the upper surface of the mask 13, and the blade 42 is masked by the printing pressure set in the printing conditions. Press on 13 Then, the print head moving unit 16K moves the print head 16 in the horizontal direction (Y-axis direction) at a moving speed set in the printing conditions, and scrapes the paste Pst with the paste scraping surface 42M of the blade 42. At this time, the squeegee 33 passes (moves) through the pattern formation region 13R of the mask 13 and fills the paste hole P with the paste Pst (FIG. 8). Further, at the time of filling the paste Pst into the pattern hole 13H, the squeegee 33 also fills the paste Pst in the inspection hole 13K located on the passage (FIG. 9).
  • the substrate holding unit moving mechanism 22 operates to lower the substrate 2 at a descending speed set as the printing condition, and from the mask 13 The substrate 2 is separated (plate separation). Printing of the paste Pst on the substrate 2 is thus completed.
  • the substrate holding unit 21 delivers the substrate 2 on which the printing of the paste Pst is completed to the unloading conveyor 15, and the unloading conveyor 15 takes the substrate 2 received from the substrate holding unit 21 to the outside. Take it out.
  • the cleaning unit moving unit 18K moves the cleaning unit 18 in the Y-axis direction.
  • the mask cleaning unit 52 is brought into contact with the lower surface of the mask 13 and rubbed against the mask 13 to wipe off the paste Pst attached to the lower surface of the mask 13 and clean it (FIG. 10A ⁇ FIG. 10B ⁇ FIG. 10C).
  • the cleaning of the mask 13 by the cleaning unit 18 is performed based on the frequency set as the printing condition (performed every time the printing operation is completed, or performed when the printing operation is completed a predetermined number of times).
  • the cleaning unit 18 cleans the pressure detection sensor 60 by the sensor cleaning unit 53.
  • the sensor cleaning unit 53 removes the paste Pst attached to the pressure detection sensor 60 through the inspection hole 13K by the suction operation and the wiping operation (FIG. 10B).
  • the paste Pst can be printed on the next substrate 2.
  • the control device 70 includes a measurement unit 70 d, a determination reference setting unit 70 e, and a measurement result display unit 70 f.
  • the measurement unit 70d obtains the voltage output from the pressure detection sensor 60 as a pressure waveform, and obtains the filling time and the filling pressure from the pressure waveform.
  • FIG. 11 shows an example of the pressure waveform acquired by the measuring unit 70d.
  • Pt is a threshold value for determining the start and end of the filling of the paste Pst into the inspection hole 13K.
  • the measuring unit 70d determines that the paste Pst is filled in the inspection hole 13K and the pressure exceeds the threshold Pt and that the filling starts and determines that the squeegee 33 passes the inspection hole 13K and the filling is completed when the pressure is less than the threshold Pt.
  • measurement part 70d detects time from a filling start to filling completion as filling time. Furthermore, the measuring unit 70d detects the peak value of the pressure as the filling pressure.
  • the filling pressure is susceptible to the printing pressure and the attack angle ⁇ , and the higher the printing pressure or the smaller the attack angle ⁇ , the higher the filling pressure.
  • the filling time changes with the squeegee speed, and tends to increase as the squeegee speed decreases.
  • the determination criterion setting unit 70e sets a determination criterion for determining whether or not the filling pressure and the filling time measured by the measuring unit 70d are within appropriate ranges. If this determination criterion is satisfied, the printing conditions set in the printing condition storage unit 70b are treated as appropriate. In other words, the determination reference setting unit 70e sets the determination reference for determining the suitability of the printing condition by the filling pressure and the filling time. The judgment criteria are shown in FIG.
  • FIG. 12 shows a two-dimensional graph with the filling pressure on the vertical axis and the filling time on the horizontal axis.
  • the hatched rectangular area indicated by the hatched box surrounded by lower limit value P1 (lower limit pressure), upper limit value P2 (upper limit pressure) and lower limit value T1 (lower limit time) of filling time, upper limit T2 (upper limit time) (Range satisfying the determination criteria) GR.
  • Fading is a defect that a sufficient amount of paste Pst is not printed on the substrate 2, and the main factor is the insufficient filling of the paste Pst into the pattern holes 13H.
  • Underfilling is known to occur easily when the filling pressure is insufficient or the filling time is short.
  • bleeding is a phenomenon in which the paste Pst is printed excessively on the substrate 2 and is generated when the paste Pst protruding from the pattern hole 13H to the back surface of the mask 13 is transferred to the substrate 2. It is known that the protrusion of the paste Pst to the back surface of the mask 13 occurs when the filling pressure is too high or the filling time is too long. Based on such knowledge, the lower limit value P1 and the upper limit value P2 of the filling pressure for determining the acceptance range GR and the lower limit value T1 and the upper limit value T2 of the filling time are set.
  • the pass range GR changes depending on the size and area of the pattern hole 13H, the thickness of the mask 13 and the gap GP.
  • a small pattern hole 13H requires a filling pressure higher than the filling pressure required for the large pattern hole 13H.
  • the substrate 2 having a large gap GP it is necessary to reduce the filling pressure to suppress the occurrence of bleeding.
  • the determination criteria setting unit 70e obtains a print result based on various mask and substrate data obtained in past experiments and screen printing, and a filling pressure indicating a passing range GR according to a learning model in which the print result is machine-learned.
  • the lower limit value P1 and the upper limit value P2 of the above, and the lower limit value T1 and the upper limit value T2 of the filling time are set.
  • the measurement result display unit 70 f visually displays the filling pressure and the filling time measured by the measuring unit 70 d together with the determination reference displayed by the touch panel 71.
  • the operator OP sets the mask 13 and the substrate 2 used for screen printing in the screen printing apparatus 1.
  • the substrate 2 may use a dummy.
  • the operator OP operates the touch panel 71 to register mask / substrate data and printing conditions (temporary printing conditions) to be checked for suitability in the source data storage unit 70a and the printing condition storage unit 70b.
  • the determination criterion setting unit 70e sets the lower limit P1 and the upper limit P2 of the filling pressure indicating the acceptable range GR and the lower limit T1 and the upper limit T2 of the filling time.
  • the operator OP causes the screen printing apparatus 1 to execute screen printing by operating the touch panel 71, and causes the measurement unit 70d to measure the filling pressure and causes the measurement result display unit 70f to display the measurement result.
  • the operator OP checks the measurement result displayed on the touch panel 71 to determine whether the filling pressure and the filling time are within the acceptance range GR, that is, whether the determination criterion is satisfied. Then, if it is determined that the operator OP satisfies the determination criteria, the operator OP determines that the temporary printing conditions are appropriate, and causes the screen printing apparatus 1 to execute screen printing as the printing conditions for production. On the other hand, if it is determined that the operator OP does not satisfy the determination criterion, the operator OP determines that the temporary printing condition is inappropriate, and operates the touch panel 71 to correct the printing condition. In FIG. 13B, the filling time is shorter than the lower limit value T1.
  • the moving speed of the squeegee 33 which is one of the printing conditions, is made slower than the provisional setting.
  • the operator OP executes the confirmation of the suitability of the printing conditions after the correction according to the above-described procedure, and repeats the process until the printing conditions are determined to be appropriate.
  • printing conditions for production are set in the printing condition storage unit 70b.
  • the screen printing apparatus 1 in the second embodiment differs from the screen printing apparatus 1 in the first embodiment in that it has a function of automatically correcting and setting printing conditions. Specifically, as shown in FIG. 14, only the printing condition setting unit 70 g of the control device 70 is provided. Next, a method of setting printing conditions will be described according to the flowchart shown in FIG. As in the first embodiment, the mask / substrate data is registered in advance in the matrix data storage unit 70a, and the printing conditions are registered in the printing condition storage unit 70b.
  • the printing conditions at the present time are temporary values, that is, temporary printing conditions.
  • the operator OP operates the touch panel 71 to cause the control device 70 to start the processing of the flowchart shown in FIG.
  • the print control unit 70c reads the printing conditions stored in the printing condition storage unit 70b (step ST1). Here, if it is necessary to change the attack angle ⁇ , the attack angle ⁇ is adjusted by the attack angle adjustment unit 41M.
  • the print control unit 70c starts a printing operation for printing the paste Pst on the substrate 2 under the printing conditions read in step ST1 (step ST2). During this time, the measurement process of detecting the pressure waveform by the measurement unit 70d is performed (step ST3).
  • the measuring unit 70d obtains the filling pressure and the filling time from the pressure waveform (step ST5). Then, the measurement result display unit 70f displays the measurement result on the touch panel 71 together with the determination criterion (the acceptance range GR) (step ST6).
  • the printing condition setting unit 70g determines whether the filling pressure and the filling time measured in the measurement process satisfy the determination criteria (step ST7). Specifically, if the filling pressure is within the range between the lower limit value P1 and the upper limit value P2 and the filling time is within the range between the lower limit value T1 and the upper limit value T2, it is judged as pass. Then, the printing condition setting unit 70g sets the printing conditions stored in the printing condition storage unit 70b as temporary printing conditions as printing conditions for production. On the other hand, if it is determined that the printing conditions do not pass, the printing condition setting unit 70g executes a correction process of correcting the printing conditions (step ST8). Then, the process returns to the process of step ST1 again, and the propriety judgment and correction for the corrected printing conditions are performed.
  • the filling time depends on the squeegee speed. Therefore, if the measured filling time falls below the lower limit value T1, correction is performed to slow the squeegee speed. Conversely, if the filling time upper limit value T2 is exceeded, correction is performed to increase the squeegee speed.
  • the filling pressure is susceptible to the printing pressure and the attack angle ⁇ , and the higher the printing pressure or the smaller the attack angle ⁇ ⁇ , the higher. If the measured filling pressure falls below the lower limit value P1, correction is performed to increase the printing pressure or to reduce the attack angle ⁇ .
  • the filling pressure exceeds the upper limit value P2
  • a correction to lower the printing pressure or a correction to increase the attack angle ⁇ is performed.
  • the printing pressure and the correction of the attack angle ⁇ may be used in combination.
  • the correction of the printing conditions is automatically performed by the printing condition setting unit 70g, and the printing condition storage unit 70b is overwritten.
  • setting of printing conditions is automatically performed.
  • the setting of the printing conditions is performed in the preparation stage before starting the substrate production, but may be appropriately performed during the substrate production.
  • the cream solder has a large change in viscosity and thixo during substrate production, and printing defects may occur due to the change in the cream solder even under the optimum printing conditions set before substrate production. For this reason, during substrate production, it is regularly checked whether the condition where the printing conditions meet the judgment criteria is maintained, and if not maintained, the printing conditions are self-corrected so as to satisfy the judgment criteria. Be done.
  • the pressure detection sensor 60 detects the filling pressure via the paste Pst filled in the inspection holes 13K. By doing this, the measurement process of step ST3 is performed.
  • the printing conditions of the screen printing apparatus 1 always become appropriate values, and the non-defective rate of the substrate 2 to be produced (substrate 2 on which screen printing is performed) is improved. be able to.
  • the squeegee 33 is moved with respect to the mask 13 under the temporary printing conditions read from the storage unit (the printing condition storage unit 70b)
  • the paste Pst is filled in the inspection holes 13 K provided in the mask 13, and the filling pressure and the filling time are detected from the pressure waveform measured at the time of the filling. Then, it is determined whether or not the detected filling pressure and filling time satisfy the judgment criteria, and if satisfied, temporary printing conditions are set as production printing conditions, and if not satisfied, printing conditions are automatically generated. I am trying to fix it. Then, the correction of the printing conditions is repeated until the filling pressure and the filling time detected under the corrected printing conditions satisfy the judgment criteria. This makes it possible to automatically set the printing conditions regardless of the experience of the worker OP individual.
  • the present invention is not limited to the above.
  • the inspection hole 13K is deviated from the pattern formation region 13R of the mask 13 in the X-axis direction, that is, on the passage of the squeegee 33 when the squeegee 33 fills the pattern hole 13H with the paste Pst.
  • this is an example and the position of the inspection hole 13K on the mask 13 is not limited. Therefore, for example, it may be provided on the mask 13 opposite to one of the two clamp members 21A clamping the both sides of the substrate 2 located at the printable position.
  • the shape of the pattern hole 13H is rectangular (square), it may be a circle or the like.
  • the paste Pst filled in the inspection hole 13K is configured to be in direct contact with the pressure detection sensor 60.
  • a (for example, a film-like) closing member 13F made of a material that allows the pressure detection sensor 60 to detect the pressure applied to the paste Pst filled in the inspection hole 13K while closing the lower end side of the inspection hole 13K. It can also be done. In this case, the paste Pst does not adhere to the pressure detection sensor 60, so that the cleaning unit 18 does not have to include the sensor cleaning unit 53.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)

Abstract

Provided is a method for displaying a printing result in a screen printing apparatus that is provided with a mask having a pattern hole and a squeegee moving on the mask, wherein the pattern hole is filled with a paste on the mask by moving the squeegee on the basis of a preset printing condition, and the paste with which the pattern hole is filled is transferred onto a substrate. The squeegee is moved with respect to the mask on the basis of the preset printing condition, whereby an examination hole provided in the mask separately from the pattern hole is filled with the paste. A change in pressure of the paste with which the examination hole is filled is acquired as a pressure waveform, and a filling pressure and a filling time are detected from the pressure waveform. Then, the detected filling pressure and the filling time are displayed on a display monitor together with a preset determination criterion.

Description

印刷結果の表示方法及びスクリーン印刷方法Display method of printing result and screen printing method
 本発明は、基板に近接させたマスク上でスキージを移動させて基板にペーストを印刷するスクリーン印刷装置における印刷結果の表示方法及びスクリーン印刷装方法に関する。 The present invention relates to a method of displaying printing results and a screen printing method in a screen printing apparatus that moves a squeegee on a mask close to a substrate to print paste on the substrate.
 スクリーン印刷装置は、パターン孔を有して基板に近接されるマスクと、基板に近接されたマスク上を移動するスキージとを備えており、スキージをマスク上で移動させることで、マスクのパターン孔にペーストが充填されて基板にペーストが印刷されるようになっている。このようなスクリーン印刷装置では、印刷の品質に影響を与える種々の印刷条件を適切に設定することが重要である。下記の特許文献1には、マスクに形成した圧力検出用の開口部を介して、印刷されるクリーム半田の圧力を検出する圧力センサを設けたスクリーン印刷装置が記載されている。このスクリーン印刷装置では、圧力センサで検出した圧力の波形検出結果をデータベースに登録されている最適波形と比較し、両者が一致するまで印刷条件の変更と充填圧力の計測を繰り返す。 The screen printing apparatus includes a mask having a pattern hole and being in proximity to the substrate, and a squeegee moving on the mask in proximity to the substrate, and the pattern hole of the mask is moved by moving the squeegee on the mask. Is filled with paste so that the paste is printed on the substrate. In such a screen printing apparatus, it is important to properly set various printing conditions that affect the quality of printing. Patent Document 1 below describes a screen printing apparatus provided with a pressure sensor for detecting the pressure of cream solder to be printed through an opening for pressure detection formed in a mask. In this screen printing apparatus, the waveform detection result of the pressure detected by the pressure sensor is compared with the optimum waveform registered in the database, and the change of the printing condition and the measurement of the filling pressure are repeated until the two coincide.
特開2001-71455号公報JP 2001-71455 A
 しかしながら、圧力センサで検出した圧力の波形検出結果と最適波形とを比較しただけでは、印刷条件が適切であるか否かの判断を的確に行うことは困難であった。また、上記のように、圧力の実測値が得られる場合でも、良好な印刷結果が得られるようにするためには複数の印刷条件のどれをどのように変化させたらよいかという判断は作業者の経験に頼る面が大きく、経験の未熟な作業者は印刷条件の設定を或る程度試行錯誤で行わざるを得ないという問題点があった。 However, it has been difficult to accurately determine whether the printing conditions are appropriate only by comparing the pressure waveform detection result detected by the pressure sensor with the optimum waveform. In addition, as described above, even if the actual value of the pressure can be obtained, it is the operator who decides which one of the plurality of printing conditions should be changed in order to obtain a good printing result. In the face of relying on the experience of the above, there was a problem that an unskilled worker of the experience had to set printing conditions to some extent by trial and error.
 そこで本発明は、印刷条件の適否の判断を容易に行うことができる、或いは印刷条件を自動的に設定することができるスクリーン印刷装置における印刷結果の表示方法及びスクリーン印刷方法を提供することを目的とする。 Therefore, the present invention has an object of providing a display method and a screen printing method of a printing result in a screen printing apparatus which can easily determine the suitability of printing conditions or can automatically set the printing conditions. I assume.
 本発明の印刷結果の表示方法は、パターン孔を有するマスクと、マスク上を移動するスキージとを備え、予め設定された印刷条件に基づいてスキージを移動させることによりマスク上のペーストをパターン孔に充填し、パターン孔に充填されたペーストを基板に転写するスクリーン印刷装置における印刷結果の表示方法であって、予め設定された印刷条件に基づいてスキージをマスクに対して移動させることにより、パターン孔とは別にマスクに設けられた検査孔にペーストを充填し、検査孔に充填されるペーストの圧力の変化を圧力波形として取得し、圧力波形より充填圧力と充填時間を検出し、検出された充填圧力及び充填時間を予め設定した判定基準とともに表示モニタに表示する。 The display method of the printing result of the present invention includes a mask having a pattern hole and a squeegee moving on the mask, and moves the squeegee based on a preset printing condition to make the paste on the mask a pattern hole It is a display method of the printing result in the screen printing apparatus which transcribe | transfers the paste with which it filled and was filled in the pattern hole to a board | substrate, Comprising: The pattern hole is made to move with respect to a mask based on the printing conditions set beforehand. The inspection hole provided in the mask separately is filled with paste, the change in pressure of the paste filled in the inspection hole is acquired as a pressure waveform, the filling pressure and filling time are detected from the pressure waveform, and the detected filling The pressure and the filling time are displayed on the display monitor together with the judgment criteria set in advance.
 本発明のスクリーン印刷方法は、パターン孔を有するマスクと、マスク上を移動するスキージとを備え、予め設定された印刷条件に基づいてスキージを移動させることによりマスク上のペーストをパターン孔に充填し、パターン孔に充填されたペーストを基板に転写するスクリーン印刷装置におけるスクリーン印刷方法であって、予め設定された仮の印刷条件に基づいてスキージをマスクに対して移動させることにより、パターン孔とは別にマスクに設けられた検査孔にペーストを充填し、検査孔に充填されるペーストの圧力の変化を圧力波形として取得し、圧力波形より充填圧力と充填時間を検出し、充填圧力と充填時間が予め設定した判定基準を満たすか否かを判定し、判定基準を満たす場合は仮の印刷条件を生産用の印刷条件に設定し、判定基準を満たさない場合は仮の印刷条件を変更し、変更した仮の印刷条件に基づいて検査孔へのペーストの充填から判定基準を満たすか否かの判定までを再度行い、生産用の印刷条件に基づいてスキージを移動させることによりマスク上のペーストをパターン孔に充填し、パターン孔に充填されたペーストを基板に転写する。 The screen printing method of the present invention comprises a mask having a pattern hole and a squeegee moving on the mask, and the paste on the mask is filled into the pattern hole by moving the squeegee based on a preset printing condition. And a screen printing method in a screen printing apparatus for transferring the paste filled in the pattern holes to a substrate, wherein the pattern holes are obtained by moving the squeegee with respect to the mask based on preset temporary printing conditions. Separately fill the inspection holes provided in the mask with paste, acquire the change in pressure of the paste filled in the inspection holes as a pressure waveform, detect the filling pressure and filling time from the pressure waveform, and fill pressure and filling time It is determined whether or not the preset determination criteria are satisfied, and when the determination criteria are satisfied, the temporary printing conditions are set as the printing conditions for production If the determination criteria are not satisfied, the temporary printing conditions are changed, and based on the changed temporary printing conditions, the process from the filling of the paste into the inspection hole to the determination as to whether the determination criteria are satisfied is performed again. The paste on the mask is filled in the pattern holes by moving the squeegee based on the printing conditions, and the paste filled in the pattern holes is transferred to the substrate.
 本発明によれば、印刷条件の適否についての判断を容易に行うことができる。また、本発明によれば、印刷条件を自動的に設定することができる。 According to the present invention, it is possible to easily determine whether the printing conditions are appropriate. Further, according to the present invention, printing conditions can be set automatically.
図1は、本発明の第1実施形態におけるスクリーン印刷装置の平面図である。FIG. 1 is a plan view of a screen printing apparatus according to a first embodiment of the present invention. 図2は、本発明の第1実施形態におけるスクリーン印刷装置の正面図である。FIG. 2 is a front view of the screen printing apparatus according to the first embodiment of the present invention. 図3は、本発明の第1実施形態におけるスクリーン印刷装置の側面図である。FIG. 3 is a side view of the screen printing apparatus in the first embodiment of the present invention. 図4は、本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクの平面図である。FIG. 4 is a plan view of a mask provided in the screen printing apparatus according to the first embodiment of the present invention. 図5は、本発明の第1実施形態におけるスクリーン印刷装置の制御系統を示すブロック図である。FIG. 5 is a block diagram showing a control system of the screen printing apparatus in the first embodiment of the present invention. 図6は、本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクを基板とともに示す側面図である。FIG. 6 is a side view showing a mask provided in the screen printing apparatus according to the first embodiment of the present invention together with a substrate. 図7は、本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクの平面図である。FIG. 7 is a plan view of a mask provided in the screen printing apparatus according to the first embodiment of the present invention. 図8は、本発明の第1実施形態におけるスクリーン印刷装置がマスクを介して基板にペーストを充填している様子を示す図である。FIG. 8 is a view showing the screen printing apparatus in the first embodiment of the present invention filling the substrate with the paste through the mask. 図9は、本発明の第1実施形態におけるスクリーン印刷装置がマスクの検査孔にペーストを充填している様子を示す図である。FIG. 9 is a view showing the screen printing apparatus in the first embodiment of the present invention filling the inspection holes of the mask with paste. 図10Aは、本発明の第1実施形態におけるスクリーン印刷装置が備えるクリーニングユニットによりクリーニングを行っている様子を示す図である。FIG. 10A is a view showing a state in which cleaning is performed by the cleaning unit provided in the screen printing apparatus according to the first embodiment of the present invention. 図10Bは、本発明の第1実施形態におけるスクリーン印刷装置が備えるクリーニングユニットによりクリーニングを行っている様子を示す図である。FIG. 10B is a view showing a state in which cleaning is performed by the cleaning unit provided in the screen printing apparatus according to the first embodiment of the present invention. 図10Cは、本発明の第1実施形態におけるスクリーン印刷装置が備えるクリーニングユニットによりクリーニングを行っている様子を示す図である。FIG. 10C is a diagram showing a state in which cleaning is performed by the cleaning unit provided in the screen printing apparatus according to the first embodiment of the present invention. 図11は、本発明の第1実施形態におけるスクリーン印刷装置が計測した充填圧力の時間的変化を示すグラフである。FIG. 11 is a graph showing temporal changes in filling pressure measured by the screen printing apparatus in the first embodiment of the present invention. 図12は、本発明の第1実施形態におけるスクリーン印刷装置が設定する判定基準の一例を示すグラフである。FIG. 12 is a graph showing an example of determination criteria set by the screen printing apparatus according to the first embodiment of the present invention. 図13Aは、本発明の第1実施形態におけるスクリーン印刷装置が充填圧力の時間的変化を計測して得られた印圧と充填時間を、設定した判定基準のグラフとともに示す図である。FIG. 13A is a view showing the printing pressure and the filling time obtained by measuring the temporal change of the filling pressure by the screen printing apparatus according to the first embodiment of the present invention, together with the set judgment criteria graph. 図13Bは、本発明の第1実施形態におけるスクリーン印刷装置が充填圧力の時間的変化を計測して得られた印圧と充填時間を、設定した判定基準のグラフとともに示す図である。FIG. 13B is a view showing the printing pressure and the filling time obtained by measuring the temporal change of the filling pressure by the screen printing apparatus according to the first embodiment of the present invention, together with the set determination reference graph. 図14は、本発明の第2実施形態におけるスクリーン印刷装置の制御系統を示すブロック図である。FIG. 14 is a block diagram showing a control system of the screen printing apparatus in the second embodiment of the present invention. 図15は、本発明の第2実施形態におけるスクリーン印刷装置が実行する印刷条件の設定手順を示すフロー図である。FIG. 15 is a flow chart showing the setting procedure of the printing conditions performed by the screen printing apparatus in the second embodiment of the present invention. 図16は、本発明の第1及び第2実施形態の変形例におけるスクリーン印刷装置がマスクの検査孔にペーストを充填している様子を示す図である。FIG. 16 is a view showing how the screen printing apparatus in the modified example of the first and second embodiments of the present invention fills the paste in the inspection hole of the mask.
 (第1実施形態)
 図1、図2及び図3は、本発明の第1実施形態におけるスクリーン印刷装置1を示している。なお、図1は、スクリーン印刷装置1の平面図である。図2は、スクリーン印刷装置1の正面図である。図3は、スクリーン印刷装置1の側面図である。スクリーン印刷装置1は上流工程側から供給された基板2を搬入し、基板2の表面に半田等のペーストを印刷して下流工程側に搬出する装置である。ここでは説明の便宜上、作業者OPから見たスクリーン印刷装置1の左右方向をX軸方向とし、左方を上流工程側、右方を下流工程側とする。また、作業者OPから見たスクリーン印刷装置1の前後方向をY軸方向とし、作業者OPから見た手前側を前方、作業者OPから見た奥側を後方とする。更に、スクリーン印刷装置1の上下方向をZ軸方向とする。
First Embodiment
FIGS. 1, 2 and 3 show a screen printing apparatus 1 according to a first embodiment of the present invention. FIG. 1 is a plan view of the screen printing apparatus 1. FIG. 2 is a front view of the screen printing apparatus 1. FIG. 3 is a side view of the screen printing apparatus 1. The screen printing apparatus 1 is an apparatus for carrying in the substrate 2 supplied from the upstream process side, printing a paste such as solder on the surface of the substrate 2 and carrying it out to the downstream process side. Here, for convenience of explanation, the left-right direction of the screen printing apparatus 1 viewed from the operator OP is taken as the X-axis direction, the left side is taken as the upstream process side, and the right side is taken as the downstream process side. Further, the front-rear direction of the screen printing apparatus 1 viewed from the operator OP is taken as a Y-axis direction, the front side viewed from the operator OP is referred to as the front, and the back side viewed from the operator OP is referred to as the rear. Furthermore, the vertical direction of the screen printing apparatus 1 is taken as the Z-axis direction.
 図1、図2及び図3において、スクリーン印刷装置1は基台11上に基板保持部21と基板保持部移動機構22を備えている。基板保持部21の上方にはマスク13が設置されている。基板保持部21の上流工程側には搬入コンベア14が設けられており、基板保持部21の下流工程側には搬出コンベア15が設けられている(図1)。マスク13の上方には印刷ヘッド16が設けられており、マスク13と基板保持部21との間の領域には撮像ユニット17とクリーニングユニット18が設けられている(図2及び図3)。 In FIG. 1, FIG. 2 and FIG. 3, the screen printing apparatus 1 includes a substrate holding unit 21 and a substrate holding unit moving mechanism 22 on a base 11. A mask 13 is provided above the substrate holding unit 21. A carry-in conveyor 14 is provided on the upstream process side of the substrate holding unit 21, and a carry-out conveyor 15 is provided on the downstream process side of the substrate holding unit 21 (FIG. 1). The print head 16 is provided above the mask 13, and the imaging unit 17 and the cleaning unit 18 are provided in the region between the mask 13 and the substrate holding unit 21 (FIGS. 2 and 3).
 図1において、基板保持部21はY軸方向に開閉自在な一対のクランプ部材21Aを備えている。一対のクランプ部材21Aは、上流工程側から搬入した基板2のY軸方向に対向する両側部をクランプして保持する。図2において、基板保持部21は昇降テーブル21aと基板2を下方から支持する基板支持部21bを備えている。基板保持部移動機構22は、基台11に対して水平面内に移動するXYテーブル22A、XYテーブル22Aに設けられたZ軸回りに回動するθテーブル22B、θテーブル22Bに設けられて基板保持部21を昇降させる基板昇降機構22Cを備えている。これらは下から順に積層されており、最上段の基板昇降機構22Cが昇降テーブル21aに結合されている。従って、XYテーブル22Aとθテーブル22Bにより基板保持部21に保持された基板2を水平面内でXY方向へ移動、Z軸回りに回動させ、基板昇降機構22Cによって基板2をマスク13に対して近接・離反させることができる。 In FIG. 1, the substrate holding unit 21 includes a pair of clamp members 21A that can be opened and closed in the Y-axis direction. The pair of clamp members 21A clamps and holds both side portions of the substrate 2 carried in from the upstream process side facing in the Y-axis direction. In FIG. 2, the substrate holding unit 21 includes a lift table 21 a and a substrate support unit 21 b that supports the substrate 2 from below. The substrate holding portion moving mechanism 22 is provided on an XY table 22A that moves in a horizontal plane with respect to the base 11, a θ table 22B that rotates around the Z axis provided on the XY table 22A, and a θ table 22B. A substrate lifting mechanism 22C for lifting and lowering the unit 21 is provided. These are stacked in order from the bottom, and the uppermost substrate lifting mechanism 22C is coupled to the lifting table 21a. Therefore, the substrate 2 held by the substrate holding unit 21 is moved in the horizontal plane in the horizontal direction by the XY table 22A and the θ table 22B and rotated about the Z axis, and the substrate lifting mechanism 22C moves the substrate 2 against the mask 13. It can be approached and separated.
 図1、図2及び図3において、マスク13は金属製の板状部材から成り、水平姿勢に配置されている。マスク13の中央部にはパターン形成領域13Rが設定されている。パターン形成領域13Rには基板2の上面に設けられた電極に対応した多数のパターン孔13Hが設けられている(図4)。 In FIG. 1, FIG. 2 and FIG. 3, the mask 13 is made of a metal plate-like member and is disposed in a horizontal posture. A pattern formation region 13R is set at the central portion of the mask 13. A large number of pattern holes 13H corresponding to the electrodes provided on the upper surface of the substrate 2 are provided in the pattern formation region 13R (FIG. 4).
 図1、図2及び図3において、印刷ヘッド16は、印刷ヘッド移動テーブル31、2つのスキージ昇降部32及び2つのスキージ33を備えている。印刷ヘッド移動テーブル31はマスク13の上方領域をX軸方向に延びており、印刷ヘッド移動部16K(図5)は印刷ヘッド移動テーブル31を(すなわち印刷ヘッド16を)Y軸方向に移動させる。 In FIG. 1, FIG. 2 and FIG. 3, the print head 16 is provided with a print head moving table 31, two squeegee elevators 32 and two squeegees 33. The print head moving table 31 extends in the X-axis direction in the upper region of the mask 13, and the print head moving unit 16K (FIG. 5) moves the print head moving table 31 (that is, the print head 16) in the Y axis direction.
 2つのスキージ昇降部32は印刷ヘッド移動テーブル31にY軸方向に並んで設けられており、それぞれ下方に向けたロッド32Rを印刷ヘッド移動テーブル31の下方に突出させている。2つのスキージ33は2つのスキージ昇降部32それぞれのロッド32Rの下端に取り付けられており、印刷ヘッド移動テーブル31の下方にY軸方向に並んで配置されている。 The two squeegee elevators 32 are provided on the print head moving table 31 side by side in the Y-axis direction, and the rods 32R directed downward respectively protrude below the print head moving table 31. The two squeegees 33 are attached to the lower end of the rod 32R of each of the two squeegee elevators 32, and are arranged below the print head moving table 31 in the Y-axis direction.
 図2及び図3において、各スキージ33は、スキージベース41とブレード42とアタック角調整部41Mとを備えている。スキージベース41はスキージ昇降部32のロッド32Rに取り付けられており、ブレード42はスキージベース41にX軸回りに揺動自在に取り付けられている。2つのブレード42は互いに対向する面(ペースト掻寄せ面42Mと称する)がX軸方向から見て下側に向かって広がる方向に延びている(図3)。アタック角調整部41Mは、ブレード42のペースト掻寄せ面42Mとマスク13の上面とがなす角度、すなわちアタック角Φを調整する機能を有する。 2 and 3, each squeegee 33 includes a squeegee base 41, a blade 42, and an attack angle adjusting unit 41M. The squeegee base 41 is attached to the rod 32R of the squeegee lifting unit 32, and the blade 42 is attached to the squeegee base 41 so as to be pivotable about the X axis. The two blades 42 extend in a direction in which opposing surfaces (referred to as paste scraping surfaces 42M) spread downward as viewed from the X-axis direction (FIG. 3). The attack angle adjustment unit 41M has a function of adjusting an angle formed by the paste scraping surface 42M of the blade 42 and the upper surface of the mask 13, that is, the attack angle Φ.
 撮像ユニット17は、上方に撮像光軸を向けたカメラと下方に撮像光軸を向けたカメラとを内蔵しており、上方及び下方のそれぞれに位置する撮像対象物を同時又は非同時に撮像する。撮像ユニット移動部17K(図5)は撮像ユニット17をマスク13の下方領域でX軸方向及びY軸方向に移動させる。 The imaging unit 17 incorporates a camera with the imaging optical axis facing upward and a camera with the imaging optical axis facing downward, and images imaging objects located above and below at the same time or not simultaneously. The imaging unit moving unit 17 K (FIG. 5) moves the imaging unit 17 in the X-axis direction and the Y-axis direction in the lower area of the mask 13.
 図2及び図3において、クリーニングユニット18はベース体51、マスククリーニング部52及びセンサクリーニング部53を備えている。ベース体51はマスク13の下方領域をX軸方向に延びており、クリーニングユニット移動部18K(図5)はベース体51を(すなわちクリーニングユニット18を)Y軸方向に移動させる。マスククリーニング部52はベース体51の上方に突出して配置されたペーパー部材から成る。センサクリーニング部53はベース体51の下方に突出して設けられた吸引機構から成る。 In FIGS. 2 and 3, the cleaning unit 18 includes a base 51, a mask cleaning unit 52 and a sensor cleaning unit 53. The base body 51 extends in the X-axis direction in the lower region of the mask 13, and the cleaning unit moving unit 18K (FIG. 5) moves the base body 51 (that is, the cleaning unit 18) in the Y-axis direction. The mask cleaning unit 52 is formed of a paper member disposed to protrude above the base body 51. The sensor cleaning unit 53 includes a suction mechanism provided to protrude downward of the base body 51.
 基板保持部移動機構22は、基板保持部21を水平方向に変位させて基板保持部21に保持した基板2の電極2Dとマスク13のパターン孔13Hの位置を一致させるとともに、基板保持部21を上昇させてマスク13の下面に基板2を当接させて位置決めする(図6)。基板2が位置決めされた状態では、マスク13のパターン形成領域13Rが基板2の上面と対向し、マスク13のパターン孔13Hは基板2の電極2Dと上下に対向する(図6)。なお、基板2の上面にはシルク印刷2Eによって図形や文字が印刷されており、基板2をマスク13の下面に接触させても電極2Dとマスク13の間にはギャップGPが存在する場合がある。 The substrate holding unit moving mechanism 22 displaces the substrate holding unit 21 in the horizontal direction so that the positions of the electrode 2D of the substrate 2 held by the substrate holding unit 21 and the pattern holes 13H of the mask 13 coincide with each other. The substrate 2 is raised by contact with the lower surface of the mask 13 and positioned (FIG. 6). In a state where the substrate 2 is positioned, the pattern formation region 13R of the mask 13 faces the upper surface of the substrate 2, and the pattern hole 13H of the mask 13 faces the electrode 2D of the substrate 2 vertically (FIG. 6). Note that graphics and characters are printed on the upper surface of the substrate 2 by silk printing 2E, and even when the substrate 2 is brought into contact with the lower surface of the mask 13, there may be a gap GP between the electrode 2D and the mask 13 .
 図1及び図4において、マスク13のパターン形成領域13RからX軸方向に外れた位置には検査孔13Kが設けられている。検査孔13Kはマスク13の厚さ方向に貫通している。図2に示すように、基板保持部21の上面のうち、基板2を位置決めした状態で検査孔13Kと上下に対向する位置にはセンサマウント部21Mが設けられている。このセンサマウント部21Mの上部には上面に作用した圧力を検出する圧力検出センサ60が設けられている(図1、図2及び図3)。 In FIGS. 1 and 4, an inspection hole 13K is provided at a position deviated from the pattern formation region 13R of the mask 13 in the X-axis direction. The inspection holes 13 K penetrate in the thickness direction of the mask 13. As shown in FIG. 2, a sensor mount 21M is provided on the upper surface of the substrate holder 21 at a position opposed to the inspection hole 13K in the state where the substrate 2 is positioned. A pressure detection sensor 60 for detecting the pressure applied to the upper surface is provided on the upper portion of the sensor mount portion 21M (FIGS. 1, 2 and 3).
 センサマウント部21Mは、昇降テーブル21aに配置されたセンサマウント昇降機構21cによって昇降する。搬入コンベア14から基板保持部21に基板2を搬入する場合、センサマウント昇降機構21cはセンサマウント部21Mを下降させて、センサマウント部21Mや圧力検出センサ60を基板2の搬送の妨げにならない位置へ移動させる。また、センサマウント昇降機構21cは、少なくとも基板2がマスク13に位置決めされたときに、圧力検出センサ60の受圧が検査孔13Kの直下に位置するようにセンサマウント部21Mを上昇させる。 The sensor mount unit 21M is lifted and lowered by a sensor mount lifting and lowering mechanism 21c disposed on the lifting and lowering table 21a. When loading the substrate 2 from the loading conveyor 14 into the substrate holding unit 21, the sensor mount elevating mechanism 21 c lowers the sensor mount unit 21 M so that the sensor mount unit 21 M and the pressure detection sensor 60 do not interfere with the transfer of the substrate 2. Move to Further, the sensor mount elevating mechanism 21c raises the sensor mount portion 21M so that the pressure received by the pressure detection sensor 60 is positioned immediately below the inspection hole 13K when at least the substrate 2 is positioned on the mask 13.
 スキージ昇降部32は、基板2が位置決めされた状態でスキージ33を下降させ、ブレード42をマスク13の上面に当接させる。また、スキージ昇降部32は、スキージ33をマスク13の上面に押し付ける力(印圧)を調整する機能を備えている。このとき各ブレード42のペースト掻寄せ面42Mはマスク13の上面に対して設定された所定の角度(前述のアタック角Φ。図3)で当接する。 The squeegee lifting unit 32 lowers the squeegee 33 with the substrate 2 positioned, and brings the blade 42 into contact with the upper surface of the mask 13. In addition, the squeegee lifting unit 32 has a function of adjusting a force (printing pressure) for pressing the squeegee 33 against the upper surface of the mask 13. At this time, the paste scraping surface 42M of each blade 42 abuts on the upper surface of the mask 13 at a predetermined angle (the above-mentioned attack angle。, FIG. 3).
 図5において、スクリーン印刷装置1が備える制御装置70は、搬入コンベア14による基板2の搬入動作、基板保持部21による基板2の保持動作、基板保持部移動機構22によるマスク13に対する基板2の位置決め動作、搬出コンベア15による基板2の搬出動作の各制御を行う。また、制御装置70は、印刷ヘッド移動部16Kによる印刷ヘッド16の移動動作、スキージ昇降部32によるスキージ33の昇降動作、アタック角調整部41Mによるブレード42のアタック角Φの調整動作の各制御を行う。また、制御装置70は、撮像ユニット移動部17Kによる撮像ユニット17の移動動作、撮像ユニット17による撮像動作、クリーニングユニット移動部18Kによるクリーニングユニット18の移動動作及びクリーニングユニット18によるクリーニング動作の各制御を行う。 In FIG. 5, the control device 70 included in the screen printing apparatus 1 performs the loading operation of the substrate 2 by the loading conveyor 14, the holding operation of the substrate 2 by the substrate holding unit 21, and the positioning of the substrate 2 with respect to the mask 13 by the substrate holding unit moving mechanism 22. Operation and control of the unloading operation of the substrate 2 by the unloading conveyor 15 are performed. Further, the control device 70 controls the moving operation of the print head 16 by the print head moving unit 16K, the raising and lowering operation of the squeegee 33 by the squeegee lifting unit 32, and the adjustment operation of the attack angle Φ of the blade 42 by the attack angle adjusting unit 41M. Do. The control device 70 controls the moving operation of the imaging unit 17 by the imaging unit moving unit 17K, the imaging operation by the imaging unit 17, the moving operation of the cleaning unit 18 by the cleaning unit moving unit 18K, and the cleaning operation by the cleaning unit 18. Do.
 図5において、圧力検出センサ60は制御装置70に接続されており、圧力検出センサ60が検出する圧力は制御装置70に入力される。制御装置70には、入出力装置としてのタッチパネル71が接続されている。タッチパネル71は、作業者OPが制御装置70に所要の入力を行う入力装置として機能するほか、制御装置70がスクリーン印刷装置1の状態を作業者OPに表示したり作業者OPに作業指示を与えたりする表示モニタとして機能する。 In FIG. 5, the pressure detection sensor 60 is connected to the control device 70, and the pressure detected by the pressure detection sensor 60 is input to the control device 70. The control device 70 is connected to a touch panel 71 as an input / output device. The touch panel 71 functions as an input device for the operator OP to perform required input to the control device 70, and the control device 70 displays the state of the screen printing device 1 to the operator OP or gives an operation instruction to the operator OP. Function as a display monitor.
 図5において、制御装置70は、緒元データ記憶部70a、印刷条件記憶部70b及び印刷制御部70cを備えている。緒元データ記憶部70aは、スクリーン印刷の対象となる基板2やそれに使用するマスク13に関する情報(以下、マスク・基板データと呼ぶ)を記憶する。緒元データ記憶部70aは、マスク・基板データとして、少なくとも、パターン孔最大寸法、パターン孔最小面積、マスク厚及びギャップGPのデータを記憶している。これらのデータはスクリーン印刷の作業前に緒元データ記憶部70aに記憶されている。 In FIG. 5, the control device 70 includes a source data storage unit 70a, a printing condition storage unit 70b, and a print control unit 70c. The matrix data storage unit 70a stores information on the substrate 2 to be screen-printed and the mask 13 to be used for the substrate 2 (hereinafter referred to as mask / substrate data). The mask data storage unit 70a stores, as mask / substrate data, data of at least a pattern hole maximum dimension, a pattern hole minimum area, a mask thickness, and a gap GP. These data are stored in the master data storage unit 70a before the screen printing operation.
 緒元データ記憶部70aが記憶するパターン孔最大寸法とは、マスク13が備える全てのパターン孔13Hのスキージ33の移動方向における寸法(図7中に示す寸法DH)のうちの最大値のことである。パターン孔最小面積とは、マスク13が備える全てのパターン孔13Hそれぞれの開口面積SH(図7中に斜線で示す領域の面積)のうちの最小値のことである。マスク厚とは、図6に示す、マスク13の厚さ方向の寸法THのことである。ギャップGPとは、前述したように、基板2をマスク13に対して位置決めしたときの電極2Dとマスク13の上下方向間隔のことである(図6)。 The largest dimension of the pattern hole stored in the data storage unit 70a is the maximum value among the dimensions (dimension DH shown in FIG. 7) in the moving direction of the squeegee 33 of all the pattern holes 13H included in the mask 13. is there. The pattern hole minimum area is the minimum value among the opening areas SH (areas of the regions shown by oblique lines in FIG. 7) of all the pattern holes 13H included in the mask 13. The mask thickness is the dimension TH in the thickness direction of the mask 13 shown in FIG. The gap GP is, as described above, the vertical distance between the electrode 2D and the mask 13 when the substrate 2 is positioned with respect to the mask 13 (FIG. 6).
 印刷条件記憶部70bは、スクリーン印刷装置1が印刷動作を行うために必要な印刷条件を記憶している。印刷条件記憶部70bに記憶されている印刷条件には、スキージ33に関する印刷条件と基板保持部移動機構22に関する印刷条件と、クリーニングユニット18の動作に関する印刷条件が含まれる。スキージ33に関する印刷条件としては、印圧、アタック角Φ、移動速度(スキージ速度)が含まれている。 The printing condition storage unit 70 b stores printing conditions necessary for the screen printing apparatus 1 to perform the printing operation. The printing conditions stored in the printing condition storage unit 70 b include the printing conditions regarding the squeegee 33, the printing conditions regarding the substrate holding unit moving mechanism 22, and the printing conditions regarding the operation of the cleaning unit 18. The printing conditions for the squeegee 33 include printing pressure, attack angle Φ, and moving speed (squeegee speed).
 基板保持部移動機構22に関する印刷条件としては、マスク13から基板2を引き離す動作(版離れ動作)に関する情報、例えば基板2の下降速度を含んでいる。クリーニングユニット18の動作に関する印刷条件としては、マスク13のクリーニングの頻度に関する情報が含まれる。これらの印刷条件の中でもスキージ33に関する印刷条件は、使用するペーストの影響を受け易い。このためスクリーン印刷装置1の印刷動作によってペーストの状態が変化して印刷不良が発生する場合はスキージ33に関する印刷条件の調整が必要になる。 The printing conditions for the substrate holding unit moving mechanism 22 include information on an operation (a plate separating operation) for separating the substrate 2 from the mask 13, for example, the lowering speed of the substrate 2. The printing conditions for the operation of the cleaning unit 18 include information on the frequency of cleaning of the mask 13. Among these printing conditions, the printing conditions for the squeegee 33 are susceptible to the paste used. For this reason, when the state of the paste changes due to the printing operation of the screen printing apparatus 1 and a printing failure occurs, it is necessary to adjust the printing conditions for the squeegee 33.
 作業者は、スキージ33に関する印刷条件の設定入力、すなわちアタック角Φを設定する入力とスキージ速度を設定する入力を、タッチパネル71から行うことができる。作業者がアタック角Φとスキージ速度を設定する入力を行うと、その入力した値が印刷条件記憶部70bに記憶される。 The operator can use the touch panel 71 to input setting of printing conditions for the squeegee 33, that is, an input for setting the attack angle と and an input for setting the squeegee speed. When the operator performs an input for setting the attack angle と and the squeegee speed, the input value is stored in the printing condition storage unit 70b.
 印刷制御部70cは、印刷条件記憶部70bに記憶された印刷条件に基づいて、基板2にペーストを印刷する一連の印刷動作を制御する。このとき印刷制御部70cは、スキージ33のアタック角Φが印刷条件記憶部70bに記憶された角度となるようにアタック角調整部41Mを作動させ、スキージ33の移動速度が印刷条件記憶部70bに記憶された速度となるように印刷ヘッド移動部16Kを作動させる。また、印刷制御部70cは、版離れ動作における基板2の下降速度が印刷条件記憶部70bに記憶された速度となるように基板保持部移動機構22を動作させる。 The print control unit 70 c controls a series of printing operations for printing the paste on the substrate 2 based on the printing conditions stored in the printing condition storage unit 70 b. At this time, the print control unit 70c operates the attack angle adjustment unit 41M such that the attack angle Φ of the squeegee 33 becomes the angle stored in the printing condition storage unit 70b, and the moving speed of the squeegee 33 is stored in the printing condition storage unit 70b. The print head moving unit 16K is operated to achieve the stored speed. The print control unit 70 c operates the substrate holding unit moving mechanism 22 so that the lowering speed of the substrate 2 in the plate separation operation becomes the speed stored in the printing condition storage unit 70 b.
 スクリーン印刷装置1が行う印刷動作では、先ず、外部から投入された基板2を搬入コンベア14が受け取って基板保持部21に受け渡し、基板保持部21は一対のクランプ部材21Aによって基板2をクランプして保持する。基板保持部21が基板2を保持したら、撮像ユニット17が基板2若しくは基板2とマスク13の双方を撮像する。制御装置70は撮像ユニット17が撮像した画像を認識してマスク13と基板2の位置ずれ(相対的な位置関係)を求めたら、その結果に基づいて基板保持部移動機構22が作動し、基板2をマスク13に下方から近接させて位置決めする。この位置決めの動作は、具体的には、基板保持部移動機構22が、基板2を保持した基板保持部21をXYテーブル22Aによって水平面内方向に移動させ、θテーブル22Bによって水平面内で回転させ、基板昇降機構22Cによって昇降させることによって行う。 In the printing operation performed by the screen printing apparatus 1, first, the loading conveyor 14 receives the substrate 2 input from the outside and delivers it to the substrate holding unit 21. The substrate holding unit 21 clamps the substrate 2 by the pair of clamp members 21A. Hold. When the substrate holding unit 21 holds the substrate 2, the imaging unit 17 images both the substrate 2 or the substrate 2 and the mask 13. When the control device 70 recognizes the image captured by the imaging unit 17 and determines the positional deviation (relative positional relationship) between the mask 13 and the substrate 2, the substrate holding unit moving mechanism 22 operates based on the result, and the substrate 2 is positioned close to the mask 13 from below and positioned. Specifically, the substrate holding unit moving mechanism 22 moves the substrate holding unit 21 holding the substrate 2 in the horizontal plane by the XY table 22A and rotates the θ table 22B in the horizontal plane. This is performed by raising and lowering by the substrate lifting mechanism 22C.
 基板保持部移動機構22が基板2を位置決めしたら、スキージ昇降部32はスキージ33を下降させてブレード42をマスク13の上面に当接させ、印刷条件に設定されている印圧でブレード42をマスク13に押し付ける。そして、印刷ヘッド移動部16Kが印刷ヘッド16を水平方向(Y軸方向)に印刷条件に設定されている移動速度で移動させて、ブレード42のペースト掻寄せ面42MでペーストPstを掻寄せる。このときスキージ33はマスク13のパターン形成領域13Rを通過(移動)し、パターン孔13HにペーストPstを充填する(図8)。また、パターン孔13H内へのペーストPstの充填時に、スキージ33は、その通路上に位置する検査孔13KにもペーストPstを充填する(図9)。 When the substrate holding unit moving mechanism 22 positions the substrate 2, the squeegee lifting unit 32 lowers the squeegee 33 to bring the blade 42 into contact with the upper surface of the mask 13, and the blade 42 is masked by the printing pressure set in the printing conditions. Press on 13 Then, the print head moving unit 16K moves the print head 16 in the horizontal direction (Y-axis direction) at a moving speed set in the printing conditions, and scrapes the paste Pst with the paste scraping surface 42M of the blade 42. At this time, the squeegee 33 passes (moves) through the pattern formation region 13R of the mask 13 and fills the paste hole P with the paste Pst (FIG. 8). Further, at the time of filling the paste Pst into the pattern hole 13H, the squeegee 33 also fills the paste Pst in the inspection hole 13K located on the passage (FIG. 9).
 スキージ33がマスク13上を移動してパターン孔13HにペーストPstが充填されたら、基板保持部移動機構22が作動して基板2を印刷条件に設定されている下降速度で下降させ、マスク13から基板2を離間(版離れ)させる。これにより基板2へのペーストPstの印刷が終了する。基板2へのペーストPstの印刷が終了したら、基板保持部21は、ペーストPstの印刷が終了した基板2を搬出コンベア15に受け渡し、搬出コンベア15は基板保持部21から受け取った基板2を外部に搬出する。 When the squeegee 33 moves on the mask 13 and the pattern holes 13H are filled with the paste Pst, the substrate holding unit moving mechanism 22 operates to lower the substrate 2 at a descending speed set as the printing condition, and from the mask 13 The substrate 2 is separated (plate separation). Printing of the paste Pst on the substrate 2 is thus completed. When the printing of the paste Pst on the substrate 2 is completed, the substrate holding unit 21 delivers the substrate 2 on which the printing of the paste Pst is completed to the unloading conveyor 15, and the unloading conveyor 15 takes the substrate 2 received from the substrate holding unit 21 to the outside. Take it out.
 搬出コンベア15が基板2を外部に搬出したら、クリーニングユニット移動部18Kは、クリーニングユニット18をY軸方向に移動させる。この際、マスククリーニング部52をマスク13の下面に当接させてマスク13に対して摺擦させることにより、マスク13の下面に付着したペーストPstを拭き取ってクリーニングする(図10A→図10B→図10C)。なお、クリーニングユニット18によるマスク13のクリーニングは、印刷条件に設定されている頻度(印刷動作が完了したら毎回行う、或いは所定回数の印刷動作が完了したら行う)に基づいて実行する。 When the unloading conveyor 15 unloads the substrate 2 out, the cleaning unit moving unit 18K moves the cleaning unit 18 in the Y-axis direction. At this time, the mask cleaning unit 52 is brought into contact with the lower surface of the mask 13 and rubbed against the mask 13 to wipe off the paste Pst attached to the lower surface of the mask 13 and clean it (FIG. 10A → FIG. 10B → FIG. 10C). The cleaning of the mask 13 by the cleaning unit 18 is performed based on the frequency set as the printing condition (performed every time the printing operation is completed, or performed when the printing operation is completed a predetermined number of times).
 クリーニングユニット18は、上記のマスク13のクリーニングの終了後、センサクリーニング部53で圧力検出センサ60のクリーニングを実行する。センサクリーニング部53は吸引動作と拭取り動作により検査孔13Kを通じて圧力検出センサ60に付着したペーストPstを除去する(図10B)。このようにしてマスク13及び圧力検出センサ60のクリーニングが終了したら、次の基板2にペーストPstを印刷できる状態となる。 After the cleaning of the mask 13 is completed, the cleaning unit 18 cleans the pressure detection sensor 60 by the sensor cleaning unit 53. The sensor cleaning unit 53 removes the paste Pst attached to the pressure detection sensor 60 through the inspection hole 13K by the suction operation and the wiping operation (FIG. 10B). When the cleaning of the mask 13 and the pressure detection sensor 60 is completed in this manner, the paste Pst can be printed on the next substrate 2.
 図5において、制御装置70は、計測部70d、判定基準設定部70e及び計測結果表示部70fを備えている。計測部70dは圧力検出センサ60から出力される電圧を圧力波形として取得するとともに、圧力波形から充填時間と充填圧力を求める。 In FIG. 5, the control device 70 includes a measurement unit 70 d, a determination reference setting unit 70 e, and a measurement result display unit 70 f. The measurement unit 70d obtains the voltage output from the pressure detection sensor 60 as a pressure waveform, and obtains the filling time and the filling pressure from the pressure waveform.
 図11は、計測部70dが取得した圧力波形の一例を示している。図中、Ptは検査孔13KへのペーストPstの充填開始と終了を判定するための閾値である。計測部70dは、検査孔13KにペーストPstが充填されて圧力が閾値Ptを超えると充填開始と判断し、スキージ33が検査孔13Kを通過して圧力が閾値Ptを下回ると充填完了と判断する。そして、計測部70dは充填開始から充填完了までの時間を充填時間として検出する。更に、計測部70dは、圧力のピーク値を充填圧力として検出する。充填圧力は印圧やアタック角Φの影響を受け易く、印圧が高いほど、又はアタック角Φが小さいときほど高くなる。一方、充填時間はスキージ速度で変化し、スキージ速度が遅いほど長くなる傾向にある。 FIG. 11 shows an example of the pressure waveform acquired by the measuring unit 70d. In the figure, Pt is a threshold value for determining the start and end of the filling of the paste Pst into the inspection hole 13K. The measuring unit 70d determines that the paste Pst is filled in the inspection hole 13K and the pressure exceeds the threshold Pt and that the filling starts and determines that the squeegee 33 passes the inspection hole 13K and the filling is completed when the pressure is less than the threshold Pt. . And measurement part 70d detects time from a filling start to filling completion as filling time. Furthermore, the measuring unit 70d detects the peak value of the pressure as the filling pressure. The filling pressure is susceptible to the printing pressure and the attack angle Φ, and the higher the printing pressure or the smaller the attack angle Φ, the higher the filling pressure. On the other hand, the filling time changes with the squeegee speed, and tends to increase as the squeegee speed decreases.
 判定基準設定部70eは、計測部70dで計測された充填圧力及び充填時間がそれぞれ適正範内にあるか否かを判定するための判定基準を設定する。この判定基準を満たしていれば、印刷条件記憶部70bに設定されている印刷条件は適切なものとして取り扱われる。言い換えれば、判定基準設定部70eは、印刷条件の適否を判断するための判定基準を充填圧力と充填時間で設定する。図12にその判定基準を示す。 The determination criterion setting unit 70e sets a determination criterion for determining whether or not the filling pressure and the filling time measured by the measuring unit 70d are within appropriate ranges. If this determination criterion is satisfied, the printing conditions set in the printing condition storage unit 70b are treated as appropriate. In other words, the determination reference setting unit 70e sets the determination reference for determining the suitability of the printing condition by the filling pressure and the filling time. The judgment criteria are shown in FIG.
 図12は縦軸に充填圧力、横軸に充填時間をとった二次元のグラフを示している。充填圧力の下限値P1(下限圧力)、上限値P2(上限圧力)及び充填時間の下限値T1(下限時間)、上限値T2(上限時間)で囲まれた斜線で示す矩形の領域が合格範囲(判定基準を満たす範囲)GRである。 FIG. 12 shows a two-dimensional graph with the filling pressure on the vertical axis and the filling time on the horizontal axis. The hatched rectangular area indicated by the hatched box surrounded by lower limit value P1 (lower limit pressure), upper limit value P2 (upper limit pressure) and lower limit value T1 (lower limit time) of filling time, upper limit T2 (upper limit time) (Range satisfying the determination criteria) GR.
 スクリーン印刷において印刷不良の大半を占めるのが「かすれ」と「にじみ」である。かすれは、十分な量のペーストPstが基板2に印刷されない不良であり、その主要因はパターン孔13HへのペーストPstの充填不足である。充填不足は充填圧力が不足している場合や充填時間が短い場合に発生し易いことが知られている。一方、にじみはペーストPstが基板2に過剰に印刷される現象であり、パターン孔13Hからマスク13の裏面へはみ出したペーストPstが基板2に転写されることで発生する。マスク13の裏面へのペーストPstのはみ出しは、充填圧力が大き過ぎる場合や充填時間が長過ぎる場合に発生することが知られている。このような知見に基づき、合格範囲GRを定める充填圧力の下限値P1と上限値P2及び充填時間の下限値T1と上限値T2は設定されている。 In screen printing, "bad" and "blur" account for the majority of printing defects. Fading is a defect that a sufficient amount of paste Pst is not printed on the substrate 2, and the main factor is the insufficient filling of the paste Pst into the pattern holes 13H. Underfilling is known to occur easily when the filling pressure is insufficient or the filling time is short. On the other hand, bleeding is a phenomenon in which the paste Pst is printed excessively on the substrate 2 and is generated when the paste Pst protruding from the pattern hole 13H to the back surface of the mask 13 is transferred to the substrate 2. It is known that the protrusion of the paste Pst to the back surface of the mask 13 occurs when the filling pressure is too high or the filling time is too long. Based on such knowledge, the lower limit value P1 and the upper limit value P2 of the filling pressure for determining the acceptance range GR and the lower limit value T1 and the upper limit value T2 of the filling time are set.
 なお、合格範囲GRは、パターン孔13Hの寸法、面積、マスク13の厚さやギャップGPによって変化する。例えば、小さなパターン孔13Hに対しては大きなパターン孔13Hに必要とされる充填圧力よりも高い充填圧力が必要である。また、ギャップGPが大きな基板2では、充填圧力を低くしてにじみの発生を抑える必要がある。マスク・基板データに含まれるパターン孔13Hの寸法、面積、マスク13の厚さやギャップGPの組み合わせは無数に存在する。本実施の形態の判定基準設定部70eは、過去の実験やスクリーン印刷で得た様々なマスク・基板データで印刷結果を取得し、これを機械学習させた学習モデルによって合格範囲GRを示す充填圧力の下限値P1及び上限値P2と、充填時間の下限値T1及び上限値T2を設定する。 The pass range GR changes depending on the size and area of the pattern hole 13H, the thickness of the mask 13 and the gap GP. For example, a small pattern hole 13H requires a filling pressure higher than the filling pressure required for the large pattern hole 13H. In the case of the substrate 2 having a large gap GP, it is necessary to reduce the filling pressure to suppress the occurrence of bleeding. There are innumerable combinations of the dimension and area of the pattern hole 13H, the thickness of the mask 13 and the gap GP included in the mask / substrate data. The determination criteria setting unit 70e according to the present embodiment obtains a print result based on various mask and substrate data obtained in past experiments and screen printing, and a filling pressure indicating a passing range GR according to a learning model in which the print result is machine-learned. The lower limit value P1 and the upper limit value P2 of the above, and the lower limit value T1 and the upper limit value T2 of the filling time are set.
 計測結果表示部70fは、計測部70dが計測した充填圧力と充填時間を、タッチパネル71が表示する判定基準とともに可視的に表示する。表示の一例としては図13A、図13Bに示すように、縦軸に充填圧力、横軸に充填時間をとった二次元のグラフ上に合格範囲GRを示す矩形枠と計測によって得られた充填圧力と充填時間の交点(図13Aに示す点Q1及び図13Bに示す点Q2)を表示する。 The measurement result display unit 70 f visually displays the filling pressure and the filling time measured by the measuring unit 70 d together with the determination reference displayed by the touch panel 71. As an example of the display, as shown in FIG. 13A and FIG. 13B, the filling pressure obtained on the vertical axis, and the filling time obtained on the two-dimensional graph having the filling time on the horizontal axis. And the filling time (the point Q1 shown in FIG. 13A and the point Q2 shown in FIG. 13B) are displayed.
 次に上記構成のスクリーン印刷装置1のスキージ33に関する印刷条件の適否確認手順について説明する。事前準備として、作業者OPは、スクリーン印刷装置1にスクリーン印刷で使用するマスク13と基板2をセットする。基板2はダミーを使用してもよい。次に、作業者OPは、タッチパネル71を操作して緒元データ記憶部70aと印刷条件記憶部70bにマスク・基板データ及び適否確認の対象となる印刷条件(仮の印刷条件)を登録する。緒元データ記憶部70aにマスク・基板データが登録されると、判定基準設定部70eは、合格範囲GRを示す充填圧力の下限値P1及び上限値P2と充填時間の下限値T1及び上限値T2を設定する。 Next, the procedure for confirming the propriety of the printing conditions regarding the squeegee 33 of the screen printing apparatus 1 configured as described above will be described. As a preparation, the operator OP sets the mask 13 and the substrate 2 used for screen printing in the screen printing apparatus 1. The substrate 2 may use a dummy. Next, the operator OP operates the touch panel 71 to register mask / substrate data and printing conditions (temporary printing conditions) to be checked for suitability in the source data storage unit 70a and the printing condition storage unit 70b. When the mask / substrate data is registered in the data storage unit 70a, the determination criterion setting unit 70e sets the lower limit P1 and the upper limit P2 of the filling pressure indicating the acceptable range GR and the lower limit T1 and the upper limit T2 of the filling time. Set
 次に、作業者OPは、タッチパネル71を操作してスクリーン印刷装置1にスクリーン印刷を実行させ、計測部70dによる充填圧力の計測と計測結果表示部70fによる計測結果の表示を実行させる。 Next, the operator OP causes the screen printing apparatus 1 to execute screen printing by operating the touch panel 71, and causes the measurement unit 70d to measure the filling pressure and causes the measurement result display unit 70f to display the measurement result.
 作業者OPは、タッチパネル71に表示された計測結果を確認することで、充填圧力と充填時間が合格範囲GR内にあるか、すなわち判定基準を満たすか否かを判定する。そして、作業者OPは、判定基準を満たしていると判定したら仮の印刷条件は適切であると判断し、その印刷条件を生産用の印刷条件としてスクリーン印刷装置1にスクリーン印刷を実行させる。一方、作業者OPは、判定基準を満たしていないと判定したら、仮の印刷条件は不適切であると判断し、タッチパネル71を操作して印刷条件を修正する。図13Bでは、充填時間が下限値T1よりも短い。従って、印刷条件のひとつであるスキージ33の移動速度を仮の設定よりも遅くする。作業者OPは、印刷条件の修正を行ったら、修正後の印刷条件の適否の確認を上述した手順で実行し、印刷条件が適切と判断されるまで繰り返す。これにより印刷条件記憶部70bには生産用の印刷条件が設定される。 The operator OP checks the measurement result displayed on the touch panel 71 to determine whether the filling pressure and the filling time are within the acceptance range GR, that is, whether the determination criterion is satisfied. Then, if it is determined that the operator OP satisfies the determination criteria, the operator OP determines that the temporary printing conditions are appropriate, and causes the screen printing apparatus 1 to execute screen printing as the printing conditions for production. On the other hand, if it is determined that the operator OP does not satisfy the determination criterion, the operator OP determines that the temporary printing condition is inappropriate, and operates the touch panel 71 to correct the printing condition. In FIG. 13B, the filling time is shorter than the lower limit value T1. Therefore, the moving speed of the squeegee 33, which is one of the printing conditions, is made slower than the provisional setting. After the operator OP corrects the printing conditions, the operator OP executes the confirmation of the suitability of the printing conditions after the correction according to the above-described procedure, and repeats the process until the printing conditions are determined to be appropriate. As a result, printing conditions for production are set in the printing condition storage unit 70b.
 (第2実施形態)
 第2実施形態におけるスクリーン印刷装置1が第1実施形態におけるスクリーン印刷装置1と異なるところは、印刷条件を自動的に修正して設定する機能を有する点である。具体的には、図14に示すように、制御装置70の印刷条件設定部70gを備えるところのみである。次に、図15に示すフローチャートに従って印刷条件の設定方法について説明する。第1実施形態の場合と同様、事前に緒元データ記憶部70aにはマスク・基板データが、印刷条件記憶部70bには印刷条件が登録されている。なお、現時点の印刷条件は仮の値、すなわち仮の印刷条件である。
Second Embodiment
The screen printing apparatus 1 in the second embodiment differs from the screen printing apparatus 1 in the first embodiment in that it has a function of automatically correcting and setting printing conditions. Specifically, as shown in FIG. 14, only the printing condition setting unit 70 g of the control device 70 is provided. Next, a method of setting printing conditions will be described according to the flowchart shown in FIG. As in the first embodiment, the mask / substrate data is registered in advance in the matrix data storage unit 70a, and the printing conditions are registered in the printing condition storage unit 70b. The printing conditions at the present time are temporary values, that is, temporary printing conditions.
 作業者OPは、タッチパネル71を操作して制御装置70に図15に示すフローチャートの処理を開始させる。印刷制御部70cは印刷条件記憶部70bに記憶されている印刷条件を読み取る(ステップST1)。ここで、アタック角Φを変更する必要があれば、アタック角調整部41Mによるアタック角Φの調整が行われる。 The operator OP operates the touch panel 71 to cause the control device 70 to start the processing of the flowchart shown in FIG. The print control unit 70c reads the printing conditions stored in the printing condition storage unit 70b (step ST1). Here, if it is necessary to change the attack angle Φ, the attack angle 部 is adjusted by the attack angle adjustment unit 41M.
 次に、印刷制御部70cはステップST1で読み取った印刷条件で基板2にペーストPstを印刷する印刷動作を開始する(ステップST2)。この間、計測部70dによる圧力波形を検出する計測工程が実行される(ステップST3)。 Next, the print control unit 70c starts a printing operation for printing the paste Pst on the substrate 2 under the printing conditions read in step ST1 (step ST2). During this time, the measurement process of detecting the pressure waveform by the measurement unit 70d is performed (step ST3).
 印刷動作が完了すると(ステップST4)、次に、計測部70dは圧力波形から充填圧力と充填時間を求める(ステップST5)。そして、計測結果表示部70fは、計測結果を判定基準(合格範囲GR)とともにタッチパネル71に表示する(ステップST6)。 When the printing operation is completed (step ST4), next, the measuring unit 70d obtains the filling pressure and the filling time from the pressure waveform (step ST5). Then, the measurement result display unit 70f displays the measurement result on the touch panel 71 together with the determination criterion (the acceptance range GR) (step ST6).
 次いで、印刷条件設定部70gは、計測工程で計測した充填圧力と充填時間が判定基準を満たしているか判断する(ステップST7)。具体的には、充填圧力が下限値P1と上限値P2の間の範囲内であり、かつ、充填時間が下限値T1と上限値T2の間の範囲内あれば合格と判断する。そして、印刷条件設定部70gは、仮の印刷条件として印刷条件記憶部70bに記憶されていた印刷条件を生産用の印刷条件として設定する。一方、不合格と判断した場合、印刷条件設定部70gは印刷条件を修正する修正工程を実行する(ステップST8)。そして、再びステップST1の処理へ戻って、修正後の印刷条件についての適否判断と修正が行われる。 Next, the printing condition setting unit 70g determines whether the filling pressure and the filling time measured in the measurement process satisfy the determination criteria (step ST7). Specifically, if the filling pressure is within the range between the lower limit value P1 and the upper limit value P2 and the filling time is within the range between the lower limit value T1 and the upper limit value T2, it is judged as pass. Then, the printing condition setting unit 70g sets the printing conditions stored in the printing condition storage unit 70b as temporary printing conditions as printing conditions for production. On the other hand, if it is determined that the printing conditions do not pass, the printing condition setting unit 70g executes a correction process of correcting the printing conditions (step ST8). Then, the process returns to the process of step ST1 again, and the propriety judgment and correction for the corrected printing conditions are performed.
 ここで、修正工程について説明する。充填時間はスキージ速度に依存する。このため、計測された充填時間は下限値T1を下回る場合はスキージ速度を遅くする修正を行う。逆に、充填時間の上限値T2を上回る場合はスキージ速度を早くする修正を行う。充填圧力は印圧やアタック角Φの影響を受け易く、印圧が高いほど、又はアタック角Φが小さいほど高くなる。計測された充填圧力が下限値P1を下回る場合は印圧を大きくする修正又はアタック角Φを小さくする修正を行う。逆に、充填圧力が上限値P2を上回る場合は印圧を下げる修正又はアタック角Φを大きくする修正を行う。印圧とアタック角Φの修正は併用してもよい。このように印刷条件の修正は印刷条件設定部70gによって自動的に行われ、印刷条件記憶部70bに上書きされる。 Here, the correction process will be described. The filling time depends on the squeegee speed. Therefore, if the measured filling time falls below the lower limit value T1, correction is performed to slow the squeegee speed. Conversely, if the filling time upper limit value T2 is exceeded, correction is performed to increase the squeegee speed. The filling pressure is susceptible to the printing pressure and the attack angle Φ, and the higher the printing pressure or the smaller the attack angle 高 く, the higher. If the measured filling pressure falls below the lower limit value P1, correction is performed to increase the printing pressure or to reduce the attack angle 角. On the contrary, when the filling pressure exceeds the upper limit value P2, a correction to lower the printing pressure or a correction to increase the attack angle Φ is performed. The printing pressure and the correction of the attack angle Φ may be used in combination. As described above, the correction of the printing conditions is automatically performed by the printing condition setting unit 70g, and the printing condition storage unit 70b is overwritten.
 第2実施形態では、印刷条件の設定が自動で行われる。通常、印刷条件の設定は基板生産を開始する前の準備段階に行うが、基板生産中に適宜実行してもよい。ペーストPstの中でもクリーム半田は基板生産中に粘度やチキソの変化が大きく、基板生産前に設定した最適な印刷条件であってもクリーム半田の変化に伴い印刷不良が発生する場合がある。このため、基板生産中も定期的に印刷条件が判定基準を満たした状態が維持されているかどうかを確認し、維持されていないときには印刷条件が判定基準を満たすように、自己補正するように実行される。 In the second embodiment, setting of printing conditions is automatically performed. Usually, the setting of the printing conditions is performed in the preparation stage before starting the substrate production, but may be appropriately performed during the substrate production. Among the pastes Pst, the cream solder has a large change in viscosity and thixo during substrate production, and printing defects may occur due to the change in the cream solder even under the optimum printing conditions set before substrate production. For this reason, during substrate production, it is regularly checked whether the condition where the printing conditions meet the judgment criteria is maintained, and if not maintained, the printing conditions are self-corrected so as to satisfy the judgment criteria. Be done.
 この場合、基板生産時にスキージ33がマスク13上を移動する際(パターン孔13HにペーストPstを充填する際)、検査孔13Kに充填されるペーストPstを介して圧力検出センサ60により充填圧力を検出することによって、ステップST3の計測工程を実行する。このように、基板生産中に印刷条件を設定することで、スクリーン印刷装置1の印刷条件は常に適正な値となり、生産される基板2(スクリーン印刷がなされた基板2)の良品率を向上させることができる。 In this case, when the squeegee 33 moves on the mask 13 during substrate production (when the pattern holes 13H are filled with the paste Pst), the pressure detection sensor 60 detects the filling pressure via the paste Pst filled in the inspection holes 13K. By doing this, the measurement process of step ST3 is performed. As described above, by setting the printing conditions during substrate production, the printing conditions of the screen printing apparatus 1 always become appropriate values, and the non-defective rate of the substrate 2 to be produced (substrate 2 on which screen printing is performed) is improved. be able to.
 以上説明したように、上述したスクリーン印刷装置1における印刷結果の表示方法及びスクリーン印刷方法では、記憶部(印刷条件記憶部70b)から読み取った仮の印刷条件でスキージ33をマスク13に対して移動させてマスク13に設けられた検査孔13KにペーストPstを充填し、その充填の際に計測した圧力波形より充填圧力と充填時間を検出する。そして、検出した充填圧力と充填時間が判定基準を満たすか否かを判定し、満たしている場合は仮の印刷条件を生産用の印刷条件として設定し、満たしていない場合は印刷条件を自動的に修正するようにしている。そして、修正した印刷条件の下で検出された充填圧力と充填時間が判定基準を満たすまで印刷条件の修正を繰り返す。これにより、作業者OP個人の経験によらず自動的に印刷条件の設定を行うことができる。 As described above, in the display method and the screen printing method of the printing result in the screen printing apparatus 1 described above, the squeegee 33 is moved with respect to the mask 13 under the temporary printing conditions read from the storage unit (the printing condition storage unit 70b) The paste Pst is filled in the inspection holes 13 K provided in the mask 13, and the filling pressure and the filling time are detected from the pressure waveform measured at the time of the filling. Then, it is determined whether or not the detected filling pressure and filling time satisfy the judgment criteria, and if satisfied, temporary printing conditions are set as production printing conditions, and if not satisfied, printing conditions are automatically generated. I am trying to fix it. Then, the correction of the printing conditions is repeated until the filling pressure and the filling time detected under the corrected printing conditions satisfy the judgment criteria. This makes it possible to automatically set the printing conditions regardless of the experience of the worker OP individual.
 これまで本発明の実施の形態1,2について説明してきたが、本発明は上述したものに限定されない。例えば、上述の実施の形態では、検査孔13Kはマスク13のパターン形成領域13RからX軸方向に外れた位置、すなわちスキージ33がパターン孔13HにペーストPstを充填するときのスキージ33の通路上に設けられていたが、これは一例であり、マスク13上の検査孔13Kの位置は限定されない。よって、例えば、印刷可能位置に位置した基板2の両側をクランプしている2つのクランプ部材21Aの一方と対向するマスク13上の位置に設けられていてもよい。また、パターン孔13Hの形状は矩形(正方形)であったが、円等であってもよい。 Although the first and second embodiments of the present invention have been described above, the present invention is not limited to the above. For example, in the above embodiment, the inspection hole 13K is deviated from the pattern formation region 13R of the mask 13 in the X-axis direction, that is, on the passage of the squeegee 33 when the squeegee 33 fills the pattern hole 13H with the paste Pst. Although provided, this is an example and the position of the inspection hole 13K on the mask 13 is not limited. Therefore, for example, it may be provided on the mask 13 opposite to one of the two clamp members 21A clamping the both sides of the substrate 2 located at the printable position. Further, although the shape of the pattern hole 13H is rectangular (square), it may be a circle or the like.
 上述の実施の形態1,2では、検査孔13Kに充填されたペーストPstは圧力検出センサ60に直接接触する構成となっていたが、図16の変形例に示すように、マスク13の下面に、検査孔13Kの下端側を閉止しつつも検査孔13Kに充填されたペーストPstに与えられる圧力を圧力検出センサ60によって検出できるような材質の(例えばフィルム状の)閉止部材13Fを取り付けておくこともできる。このようにすれば、圧力検出センサ60にペーストPstが付着しないので、クリーニングユニット18がセンサクリーニング部53を備える必要がなくなる。 In the first and second embodiments described above, the paste Pst filled in the inspection hole 13K is configured to be in direct contact with the pressure detection sensor 60. However, as shown in the modification of FIG. Attach a (for example, a film-like) closing member 13F made of a material that allows the pressure detection sensor 60 to detect the pressure applied to the paste Pst filled in the inspection hole 13K while closing the lower end side of the inspection hole 13K. It can also be done. In this case, the paste Pst does not adhere to the pressure detection sensor 60, so that the cleaning unit 18 does not have to include the sensor cleaning unit 53.
 印刷条件の設定を経験によらず簡易に行うことができるスクリーン印刷装置における印刷結果の表示方法及びスクリーン印刷方法を提供する。 Abstract: A display method and a screen printing method of a printing result in a screen printing apparatus capable of easily performing setting of printing conditions regardless of experience.
 1 スクリーン印刷装置
 2 基板
 13 マスク
 13H パターン孔
 13K 検査孔
 33 スキージ
 70b 印刷条件記憶部(記憶手段)
 Pst ペースト
Reference Signs List 1 screen printing apparatus 2 substrate 13 mask 13H pattern hole 13K inspection hole 33 squeegee 70b printing condition storage unit (storage means)
Pst paste

Claims (10)

  1.  パターン孔を有するマスクと、前記マスク上を移動するスキージとを備え、予め設定された印刷条件に基づいて前記スキージを移動させることにより前記マスク上のペーストを前記パターン孔に充填し、前記パターン孔に充填された前記ペーストを基板に転写するスクリーン印刷装置における印刷結果の表示方法であって、
     予め設定された前記印刷条件に基づいて前記スキージを前記マスクに対して移動させることにより、前記パターン孔とは別に前記マスクに設けられた検査孔に前記ペーストを充填し、
     前記検査孔に充填される前記ペーストの圧力の変化を圧力波形として取得し、
     前記圧力波形より充填圧力と充填時間を検出し、
     検出された前記充填圧力及び前記充填時間を予め設定した判定基準とともに表示モニタに表示する印刷結果の表示方法。
    A mask having a pattern hole, and a squeegee moving on the mask, the paste on the mask is filled into the pattern hole by moving the squeegee based on a preset printing condition, and the pattern hole A method of displaying a printing result in a screen printing apparatus for transferring the paste filled in the above to a substrate,
    The paste is filled in the inspection holes provided in the mask separately from the pattern holes by moving the squeegee with respect to the mask based on the printing conditions set in advance.
    Change in pressure of the paste filled in the inspection hole is acquired as a pressure waveform,
    The filling pressure and filling time are detected from the pressure waveform,
    The display method of the printing result displayed on a display monitor with the determination reference | standard which preset the said filling pressure and the said filling time which were detected.
  2.  前記充填圧力及び前記充填時間ならびに前記判定基準は、前記充填時間と前記充填圧力を2軸とするグラフ上に表示される請求項1に記載の印刷結果の表示方法。 The display method according to claim 1, wherein the filling pressure, the filling time, and the determination reference are displayed on a graph in which the filling time and the filling pressure are on two axes.
  3.  前記充填圧力は、前記圧力波形における前記圧力の最大値である請求項1に記載の印刷結果の表示方法。 The display method according to claim 1, wherein the filling pressure is a maximum value of the pressure in the pressure waveform.
  4.  前記充填時間は、前記圧力波形において所定の閾値を超える前記圧力を検出した時間である請求項1に記載の印刷結果の表示方法。 The display method according to claim 1, wherein the filling time is a time when the pressure exceeding a predetermined threshold value is detected in the pressure waveform.
  5.  前記印刷条件には、前記スキージを前記マスクの上面に押し付ける力を示す印圧、前記スキージのペースト掻寄せ面と前記マスクの前記上面とがなす角度であるアタック角、前記マスク上を移動する前記スキージの速度である移動速度を含む請求項1に記載の印刷結果の表示方法。 The printing conditions include a printing pressure indicating a force pressing the squeegee against the upper surface of the mask, an attack angle which is an angle formed by a paste scraping surface of the squeegee and the upper surface of the mask, and moving on the mask The display method of the printing result of Claim 1 including the moving speed which is the speed of a squeegee.
  6.  パターン孔を有するマスクと、前記マスク上を移動するスキージとを備え、予め設定された印刷条件に基づいて前記スキージを移動させることにより前記マスク上のペーストを前記パターン孔に充填し、前記パターン孔に充填された前記ペーストを基板に転写するスクリーン印刷装置におけるスクリーン印刷方法であって、
     予め設定された仮の印刷条件に基づいて前記スキージを前記マスクに対して移動させることにより、前記パターン孔とは別に前記マスクに設けられた検査孔に前記ペーストを充填し、
     前記検査孔に充填される前記ペーストの圧力の変化を圧力波形として取得し、
     前記圧力波形より充填圧力と充填時間を検出し、
     前記充填圧力と前記充填時間が予め設定した判定基準を満たすか否かを判定し、
     前記判定基準を満たす場合は前記仮の印刷条件を生産用の印刷条件に設定し、
     前記判定基準を満たさない場合は前記仮の印刷条件を変更し、変更した仮の印刷条件に基づいて前記検査孔への前記ペーストの充填から前記判定基準を満たすか否かの判定までを再度行い、
     前記生産用の印刷条件に基づいて前記スキージを移動させることにより前記マスク上の前記ペーストを前記パターン孔に充填し、前記パターン孔に充填された前記ペーストを前記基板に転写するスクリーン印刷方法。
    A mask having a pattern hole, and a squeegee moving on the mask, the paste on the mask is filled into the pattern hole by moving the squeegee based on a preset printing condition, and the pattern hole A screen printing method in a screen printing apparatus for transferring the paste filled in the above to a substrate,
    The paste is filled in the inspection holes provided in the mask separately from the pattern holes by moving the squeegee with respect to the mask based on preset temporary printing conditions;
    Change in pressure of the paste filled in the inspection hole is acquired as a pressure waveform,
    The filling pressure and filling time are detected from the pressure waveform,
    It is determined whether or not the filling pressure and the filling time satisfy predetermined criteria.
    When the determination criteria are satisfied, the temporary printing conditions are set as printing conditions for production;
    When the determination criteria are not satisfied, the temporary printing conditions are changed, and based on the changed temporary printing conditions, the process from filling the paste in the inspection hole to determining whether the determination criteria are satisfied is performed again. ,
    A screen printing method, wherein the paste on the mask is filled in the pattern holes by moving the squeegee based on the printing conditions for production, and the paste filled in the pattern holes is transferred to the substrate.
  7.  前記判定基準を満たすか否かの判定は、前記充填時間が所定の下限時間から上限時間の間であり前記充填圧力が所定の下限圧力から上限圧力の間であれば、前記判定基準を満たすと判断する請求項6に記載のスクリーン印刷方法。 If it is determined that the filling time is between the predetermined lower limit time and the upper limit time and the filling pressure is between the predetermined lower limit pressure and the upper limit pressure, it is determined whether the filling time is between the predetermined lower limit pressure and the upper limit pressure. The screen printing method according to claim 6, wherein the determination is made.
  8.  前記充填圧力は、前記圧力波形における前記圧力の最大値である請求項6に記載のスクリーン印刷方法。 The screen printing method according to claim 6, wherein the filling pressure is a maximum value of the pressure in the pressure waveform.
  9.  前記充填時間は、前記圧力波形において所定の閾値を超える前記圧力を検出した時間である請求項6に記載のスクリーン印刷方法。 The screen printing method according to claim 6, wherein the filling time is a time at which the pressure exceeding a predetermined threshold in the pressure waveform is detected.
  10.  前記印刷条件には、前記スキージを前記マスクの上面に押し付ける力を示す印圧、前記スキージのペースト掻寄せ面と前記マスクの前記上面とがなす角度であるアタック角、前記マスク上を移動する前記スキージの速度である移動速度を含む請求項6に記載のスクリーン印刷方法。 The printing conditions include a printing pressure indicating a force pressing the squeegee against the upper surface of the mask, an attack angle which is an angle formed by a paste scraping surface of the squeegee and the upper surface of the mask, and moving on the mask The screen printing method according to claim 6, wherein the moving speed which is the speed of the squeegee is included.
PCT/JP2018/032303 2017-09-25 2018-08-31 Method for displaying printing result and screen printing method WO2019058926A1 (en)

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