JP2002036497A - Cream solder printing apparatus and printing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cream solder printing apparatus which can print stably even in high speed printing and a printing method. SOLUTION: A lengthy pressurization member 28 is installed over the neighbourhood of the tip of a squeegee, while being positioned at a pressurization position where the cream solder is pressurized from a shelter position where the solder is not pressurized, when the solder passes through the first clearance formed between a printing mask and the pressurization member and rolls, the solder is pressurized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001] 1. Field of the Invention [0002] The present invention relates to a cream solder printing apparatus and a printing method for printing cream solder on a circuit forming body, for example, a circuit board, which is a printing substrate.

2. Description of the Related Art Conventionally, cream solder is mainly used for soldering electronic components such as chip components on a printed circuit board in the manufacture of electronic circuit boards, and this cream solder is printed in a desired pattern. A cream solder printing apparatus is used. As an example of a squeegee head mounted on a conventional cream solder printing apparatus, one having a configuration as shown in FIG.

Normally, the printing operation is performed by the squeegee head 102.
Move alternately from left to right and from right to left in FIG. 13 for each printed circuit board 5. At this time, the rightward printing squeegee 101a is used in the rightward printing from left to right.
However, in the opposite leftward printing, the leftward printing squeegee 101
b is used.

[0002] Such a conventional cream solder printing apparatus 1
The printing operation of cream solder on the printed circuit board 5 according to 00 will be described with reference to FIGS. 13 to 1
In 5, reference numeral 3 denotes a printing mask in which an opening 4 having a desired pattern is formed, 5 denotes a printed board, 6 denotes a land on which a cream solder 7 is printed, and 8 denotes a solder resist. Note that the desired pattern of the printing mask 3 refers to a pattern in which the openings 4 are formed corresponding to the lands 6 on the printed board 5.

[0003] First, when performing the rightward printing, the printed board 5 is positioned on the printing mask 3 so that the openings 4 and the lands 6 coincide with each other, and then the leftward printing squeegee 101b is raised. In this state, the rightward printing squeegee 101a is lowered to bring the squeegee tip 103 into contact with the surface 3a of the printing mask 3 at an appropriate printing pressure.

In this state, the cream solder 7 previously provided on the surface 3a of the printing mask 3 is filled in the opening 4 of the printing mask 3 by linearly moving the right printing squeegee 101a along the right direction. Let me do it. After the rightward printing squeegee 101a moves to the right end of the printing mask 3,
The printing operation ends when the printed board 5 is separated from the printing mask 3.

When performing the leftward printing, similarly to the rightward printing described above, the printed circuit board 5 is positioned on the printing mask 3 and overlapped, and then the rightward printing squeegee 101a is reversed. The leftward printing squeegee 101b is lowered while the squeegee tip 10 is raised.
3 is brought into contact. The subsequent operation is the same as the above-described rightward printing.

As described above, these operations are alternately repeated for each of the printed circuit boards 5, so that the cream solder 7 is placed on the lands 6 of each of the printed circuit boards 5 via the printing mask 3, as shown in FIG. Printing is performed continuously.

In printing using the conventional cream solder printing apparatus 100, the tip 103 of the printing squeegee 101 a or the printing squeegee 101 b is attached to the surface 3 of the printing mask 3.
a with the printing squeegee 10 in contact with a
1a or the printing squeegee 101b is moved, as shown in FIG.
101b is a type of squeegee that performs two operations of a scraping operation of scraping the cream solder 7 on the surface 3a of the printing mask 3 and a filling operation of filling the opening 4 of the printing mask 3 with the cream solder 7. ing. FIG. 14 and FIG.
5 will be described.

FIGS. 14 and 15 are enlarged views of the printing squeegee 101a and the like in the case of rightward printing. First, as shown in FIG.
When the right-direction printing squeegee 101a descends and moves linearly along the right direction so as to contact the right-direction printing squeegee 101a, the right-direction printing squeegee 101a reaches the cream solder 7 supplied to the surface 3a of the printing mask 3. It moves while scraping it.

This scraping operation allows the cream solder 7 to be removed.
Flows while performing a rotational movement called rolling, as indicated by an arrow I in FIG. At this time, fluid pressure is generated inside the cream solder 7.

In this state, when the rightward printing squeegee 101a further moves rightward and reaches the opening 4 of the printing mask 3, the cream solder 7
Is pushed into the opening 4 to form a so-called cream solder 7.
Is filled. Hereinafter, the pressure at which the cream solder 7 is pushed into the opening 4 is referred to as a filling pressure.

On the other hand, it is desired to reduce the printing time in the cream solder printing step from the viewpoint of improving productivity. However, in the conventional cream solder printing apparatus 100, when the moving speed (squeegee speed) of the squeegee 101a is increased to shorten the time, as shown in FIG. The so-called unfilled portion 9 where the filling amount of the solder 7 is insufficient occurs to cause printing failure, and the cream solder 7 printed on the land 6 on the printed circuit board 5 is chipped as shown in FIG. And stable printing cannot be performed. The reason is as follows.

When the squeegee speed is increased, the time during which the leading end 103 of the printing squeegee 101a passes over the opening 4 becomes shorter. Therefore, the time for filling the opening 4 with the cream solder 7 (hereinafter, referred to as filling time) is naturally shortened. In order to investigate this phenomenon, as shown in FIG. 17, a pressure sensor 51 is arranged on the back surface of the printing mask 3, an opening 4 is provided in the printing mask 3 at a corresponding location, and a squeegee
The filling pressure when a was moved at a moving speed of 40 mm / sec and 200 mm / sec was measured. FIG. 19 is a graph showing the measurement results. The time t on the horizontal axis is the time when the squeegee 101a passes over the pressure sensor 51,
The filling pressure P is a pressure detected by the pressure sensor 51 via the cream solder 7 when the squeegee 101a passes over the pressure sensor 51. According to this graph, the squeegee 101a
It can be clearly understood that the filling time is shortened when the moving speed of is increased.

When the squeegee speed is increased, the filling pressure itself increases, but the time required for the squeegee tip 103 to pass over the opening 4 is shortened, and the duration of the high pressure is short. A short filling time cannot be obtained. As a result, an unfilled portion 9 occurs.

As described above, the conventional cream solder printing apparatus cannot achieve both high printing speed and stable printing.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and to provide a cream solder printing apparatus and a printing method capable of performing stable printing even when the printing time is shortened. Is to do.

In order to achieve the above object, the present invention is configured as follows. According to the first aspect of the present invention, the squeegee moves in the printing direction on the surface of the printing mask in which the opening is formed, so that the cream solder supplied on the front surface is positioned on the back surface of the printing mask. In the cream solder printing apparatus for printing through the opening on the circuit forming body to be applied, the squeegee is moved between a pressure applying position for applying pressure to the cream solder and a retracting position for canceling the application of the pressure. Movably attached, and at the pressure applying position, has an axial direction extending substantially parallel to the axial direction of the squeegee, and the cream solder is printed with the squeegee at the time of cream solder printing. A first gap that can pass in the opposite direction can be formed between the first gap and the printing mask, and the first gap can be formed in the first gap.
Providing a long pressure applying member disposed so as to form a second gap between the squeegee and the second gap through which the cream solder passing from the gap to the squeegee can pass, in the vicinity of the tip of the squeegee; Cream solder printing for applying pressure toward the printing mask from the pressure applying member to the cream solder when the cream solder passes through the first gap between the pressure applying member and the printing mask during printing Provide equipment. According to a second aspect of the present invention, there is provided the cream solder printing apparatus according to the first aspect, wherein the pressure applying member is a round bar. According to a third aspect of the present invention, there is provided the cream solder printing apparatus according to the first or second aspect, wherein the pressure applying member includes a heating element for heating the cream solder. According to the fourth aspect of the present invention, a pair of the squeegees are provided, and at least one of the pair of squeegees is always in contact with the printing mask at least during printing. An cream printing device according to one aspect is provided. According to a fifth aspect of the present invention, there is provided the cream solder printing apparatus according to any one of the first to fourth aspects, wherein the first gap has a substantially wedge-shaped cross section that narrows toward the squeegee. According to the sixth aspect of the present invention, the height of the pressure applying member from the surface of the printing mask is lower than the rolling height of the cream solder at the time of printing, and the pressure applying member is in the state of rolling during printing. No. 1 buried in cream solder
5 provides a cream solder printing apparatus according to any one of aspects 5. According to a seventh aspect of the present invention, there is provided the cream solder printing apparatus according to any one of the first to sixth aspects, wherein the pressure applying member is non-rotatably fixed.
According to the eighth aspect of the present invention, the sectional shape perpendicular to the axial direction of the pressure applying member is made different in the axial direction of the pressure applying member depending on the number and size of the openings of the printing mask. The present invention also provides the cream solder printing apparatus according to any one of the first to seventh aspects, wherein the pressure applied to the printing mask applied to the cream solder by the pressure applying member is different. According to a ninth aspect of the present invention, the pressure applying member is any one of first to sixth and eighth rotated in a direction opposite to a rolling direction of the cream solder around the pressure applying member during printing. The present invention provides a cream solder printing apparatus according to one aspect. According to the tenth aspect of the present invention, the squeegee moves in the printing direction on the surface of the printing mask in which the opening is formed, so that the cream solder on the surface is positioned on the back surface of the printing mask. In the cream solder printing method of printing through the opening on the body, a long pressure applying member provided over the vicinity of the tip of the squeegee,
A first gap formed between the printing mask and the pressure applying member at the time of printing cream solder while being positioned at a pressure applying position for applying pressure from a retracted position where pressure is not applied to the cream solder. The cream solder passes in a direction opposite to the printing direction of the squeegee,
A pressure toward the printing mask is applied to the cream solder from the pressure applying member, and the cream solder passing from the first gap to the squeegee side is provided between the squeegee and the pressure applying member. A cream solder printing method is provided wherein the cream solder passes through the first gap between the pressure applying member and the printing mask again after passing through the gap. According to an eleventh aspect of the present invention, there is provided the cream solder printing method according to the tenth aspect, wherein the pressure applying member is a round bar. According to a twelfth aspect of the present invention, there is provided the cream solder printing method according to the tenth or eleventh aspect, wherein the pressure applying member includes a heating element for heating the cream solder. According to the thirteenth aspect of the present invention, when a pair of the squeegees is provided, at least one of the pair of squeegees is in contact with the printing mask at least during printing at least during the tenth to twelfth. A cream solder printing method according to any one of the aspects is provided. According to a fourteenth aspect of the present invention, there is provided the cream solder printing method according to any one of the tenth to thirteenth aspects, wherein the first gap has a wedge-shaped cross section that narrows toward the squeegee. According to the fifteenth aspect of the present invention, the interval of the first gap is lower than the rolling height of the cream solder during printing, and the pressure applying member is buried in the cream solder during rolling during printing. A cream solder printing method according to any one of the tenth to fourteenth aspects is provided. According to a sixteenth aspect of the present invention, there is provided the cream solder printing method according to any one of the tenth to fifteenth aspects, wherein the pressure applying member is non-rotatably fixed. First of the present invention
According to the seventh aspect, the pressure application member is formed such that a cross-sectional shape orthogonal to the axial direction of the pressure application member varies in the axial direction of the pressure application member depending on the number and size of the openings of the printing mask. The cream solder printing method according to any one of the tenth to sixteenth aspects, wherein a pressure applied to the printing mask applied to the cream solder varies depending on a member. The eighteenth aspect of the present invention
According to the aspect, the cream solder according to any one of the tenth to fifteenth and seventeenth aspects, wherein the pressure applying member is rotated in a direction opposite to a rolling direction of the cream solder around the pressure applying member during printing. Provide a printing method.

Embodiments of the present invention will be described below in detail with reference to the drawings. (First Embodiment) A cream solder printing apparatus and a printing method according to a first embodiment of the present invention will be described below with reference to the drawings. The printing method is executed by the cream solder printing apparatus. In each of the drawings, components that perform the same or similar functions have the same reference characters allotted, and description thereof will not be repeated. In this specification, cream solder refers to paste solder in which powder solder is mixed with high-viscosity flux.

FIG. 1 is a view schematically showing a periphery of a squeegee in a cream solder printing apparatus 10 according to the first embodiment. The cream solder printing apparatus 10 is of a type in which a pair of squeegees move in the above-described left and right printing directions. That is, the cream solder printing apparatus 10 is provided with a squeegee 12a used for the rightward printing and a squeegee 12b used for the leftward printing.

The squeegees 12a and 12b are respectively connected to a large number of openings 4,..., 4 of a printing mask 3 mounted on a circuit board 5 as an example of a circuit forming body during cream solder printing. The cream solder 7 is filled, and the cream solder 7 on the printing mask 3 is scraped off. Each of the squeegees 12a and 12b is moved to a lower end of a squeegee by vertical driving devices 16 and 18 each including a squeegee air cylinder attached to a base plate 14 of a squeegee head constituting the cream solder printing device 10. Can be independently raised and lowered between a stand-by position 20 located above the printing mask 3 and an operating position 22 where the lower end of the squeegee is in contact with the printing mask 3. The squeegees 12a and 12b are formed in a plate shape, and are made of hard rubber such as urethane rubber, for example. Here, the circuit forming body is a resin substrate, paper-
Circuit board such as phenolic board, ceramic board, glass epoxy (glass epoxy) board, film board, circuit board such as single-layer board or multilayer board, component, housing, or object such as frame, etc. Means

The base plate 14 is moved in the left and right printing directions by a driving device 26 such as a motor whose operation is controlled by a control device 24. FIG. 1 shows a state in which printing is performed in the right direction, so that one of the squeegees 12a located on the left side of FIG.
And the other squeegee 12b located on the right side of FIG.
Has been raised to the standby position 20.

When the squeegee 12a or 12b is in the operating position 22
, The squeegees 12a, 12b
Is in contact with the surface 3a of the printing mask 3 in a state where an appropriate printing pressure is applied to the surface 3a of the printing mask 3, and the opening of the printing mask 3 of the cream solder 7 on the surface 3a. The filling of the portion 4 and the scraping operation on the printing mask surface 3a are performed.

A pressure applying member 28 is provided near the tip of each of the squeegees 12a and 12b. Further, each of the driving device 26 and the vertical driving devices 16 and 18 is connected to a control device 24 for controlling the operation of the cream solder printing device 10, and both squeegees by the driving device 26 are controlled by the control device 24. The movement control of the left-right direction of 12a, 12b and the up-down operation control of each of the up-down drive devices 16 and 18 are performed.

FIG. 2 is a side view showing a mounting structure of a pressure applying member provided near the tip of the squeegee 12a. FIG. 3 is a schematic diagram showing a relationship between the squeegee 12a and a pressure applying member provided near the tip of the squeegee 12a. Since the other squeegee 12b is similarly configured,
Only the configuration of one squeegee 12a will be described.

The pressure applying member 28 is, for example, a round bar having a circular cross section. The fixing member 32 such as a bracket 30 and a bolt / nut is used to extend the vicinity of the tip of the squeegee 12a in the longitudinal direction as an example of the axial direction of the squeegee 12a. The surface of the squeegee 12a and the central axis of the pressure applying member 28 are fixed so as to be parallel. When the squeegee 12a comes into contact with the printing mask 3, the pressure applying member 28 forms a narrow path 34 with a slight interval S between the squeegee 12a and the surface 3a of the printing mask 3. The distance S between the narrow paths 34 is preferably about 1 mm to 3 mm.

Further, the pressure applying member 28 is
A flow path 36 having an interval T, which is a flow path of the cream solder 7 to be rolled at the time of printing the cream solder, is formed between the flow path 36 and a. The interval T between the flow paths 36 is preferably about 1 mm to 3 mm. As shown in FIG. 4, the rolling cream solder 7 flows on both upper and lower sides of the pressure applying member 28, and in particular, the cream solder 7 on the lower side of the pressure applying member 28 is a narrow path 34 between the printing solder 3. After passing through the flow path 36 between the squeegee 12a and the pressure applying member 28, move to the right side in FIG. 4 above or above the pressure applying member 28, and then pass through the narrow path 34 again. Circulates so as to rotate clockwise as indicated by. Surface 3a of printing mask 3
Of the pressure applying member 28 from the pressure, ie, the pressure applying member 2
8 is lower than the rolling height of the cream solder 7 at the time of printing, that is, the height H1 of the upper end surface of the cream solder 7 during the rolling operation, and the pressure applying member 28 during the printing is being rolled. It is buried in the cream solder 7. The pressure applying member 28 is fixed so as not to rotate.

As described above, when the pressure applying member 28 is formed of a round bar, the diameter d of the round bar is preferably 2 to 10 mm, particularly preferably 5 to 7 mm.

The squeegee 12 is formed by forming a narrow path 34 between the pressure applying member 28 and the printing mask 3.
a, 12b, the narrow path 34 during rolling.
Is higher than before. As a result, the opening 4 of the printing mask 3 is appropriately filled with the cream solder 7, and the insufficient filling caused by the insufficient pressure of the cream solder 7 as in the related art is eliminated.

If the pressure applying member 28 bends when a high pressure is generated in the narrow path 34, a uniform pressure cannot be obtained in the longitudinal direction. Therefore, the pressure applying member 28 is formed of a highly rigid material that does not bend. Is preferably performed. For example, the pressure applying member 28 is made of metal, ceramic, or
Made of hard plastic.

FIG. 5 is a graph showing the result of measuring the change in the filling pressure of the cream solder 7 into the opening 4 during the squeegee operation at a high speed at a squeegee speed of 200 mm / sec. FIG.
A is a squeegee 12 provided with the pressure applying member 28.
a and 12b, and B is a characteristic of a conventional squeegee without a pressure applying member. As shown in FIG. 17, when the pressure sensor 51 is arranged on the back surface of the printing mask 3, the opening 4 is provided in the printing mask 3 at a predetermined position, and the squeegees 12a and 12b are moved at a moving speed of 200 mm / sec. The filling pressure was measured. Time t on the horizontal axis
Is the time during which the squeegees 12a and 12b pass over the pressure sensor 51, and the filling pressure P on the vertical axis is
The pressure detected by the pressure sensor 51 via the cream solder 7 when a and 12b pass over the pressure sensor 51.

As can be seen from this graph, in the squeegees 12a and 12b provided with the pressure applying member 28, even if the squeegee speed is increased, a pressure higher than a required pressure required for filling (for example, Pf shown in the drawing) is generated for a long time. However, in the conventional squeegee, when the squeegee speed is increased, a pressure equal to or higher than the required pressure Pf required for filling occurs only for a short time.

Therefore, even when the squeegee speed is increased by the squeegees 12a and 12b provided with the pressure applying members 28, the cream solder 7 can be sufficiently inserted into the openings 5 of the printing mask 3.
Is filled.

As described above, the pressure applying member 2 made of a round bar
In the case of 8, the cross-sectional shape of the narrow path 34 is formed in a substantially wedge shape by the curved surface of the round bar of the pressure applying member 28, so that the pressure can be increased while inviting the cream solder 7.

The narrow path 34 may have a wedge-shaped cross section as shown in FIGS. 6 and 7 for the same purpose. FIG.
Is a rod having a semicircular cross section having a pressure applying member 28A having an inclined flat surface 28a on the lower side, and a narrow path 34 having a wedge-shaped cross section is formed by the pressure applying member 28A. FIG. 7 shows a pressure applying member 28B formed into a wedge-shaped cross-section, leaving a part of the outer peripheral surface of a bar having a semicircular cross-section so that the pressure-applying member 28B has an inclined plane on the upper side and an inclined plane 28a on the lower side. A narrow path 34 having a wedge-shaped cross section is formed by the pressure applying member 28B.

The pressure applying members 28, 28A, 28B
The cross-sectional shape of the narrow path 34 between the printing mask 3 and the printing mask 3 is not particularly limited, and a narrow gap may be simply formed between the printing mask 3 and the pressure applying member.

The narrow path 34 only needs to have a gap of about 0.5 mm to 10 mm between the pressure applying members 28, 28A, 28B and the printing mask 3 as described above. It is preferable that a gap of the order is generated.

As shown in FIGS. 6 and 7, the pressure applying members 28A, 28A,
When the surface 28a facing the printing mask 3 of 28B is an inclined surface, the inclination angle θ with respect to the printing mask 3 is preferably about 30 degrees. Even if the shape of the pressure applying member 28 is changed to the pressure applying members 28A and 28B as described above, the filling pressure of the cream solder 7 into the opening 4 of the printing mask 3 generally has the characteristic of A shown in FIG. As a result, the required pressure required for filling is longer than before.

The pressure applying member 28C has a built-in heating element 38 as shown in FIG.
It is preferable to heat to about 0 to 30 ° C. The pressure applying member 28C incorporating the heating element 38 appropriately heats the cream solder 7 to maintain the temperature of the cream solder 7 constant, so that the viscosity of the cream solder 7 is maintained constant and stable filling characteristics are obtained. .

FIG. 9 shows a cream solder printing operation using the cream solder printing apparatus 10 configured as described above.
This will be described below with reference to FIG. In step (indicated by "S" in FIG. 9) 1, the following operation is performed.
First, a predetermined amount of cream solder 7 is supplied to the surface 3a of the printing mask 3. The printed board 5 is raised to a printing position and held by a printed board lifting device (not shown) or the like, and the printing mask 3 is placed on the land 6 of the printed board 5.
The printed circuit board 5 is positioned on the printing mask 3 so that the openings 4 are positioned, and are superposed. In the case of rightward printing, the up-down drive 16
To lower the squeegee 12a for rightward printing. At this time, the tip portion 20 of the squeegee 12a is brought into contact with the surface 3a of the printing mask 3 with an appropriate printing pressure. Further, the squeegee 12b for leftward printing is kept at the standby position by the vertical driving device 18.

In step 2, the squeegee 1 for rightward printing
While the surface 2a of the squeegee 2a contacts the surface 3a of the printing mask 3 with an appropriate printing pressure, the base plate 14 is moved rightward in FIG.
2a is linearly moved in the right printing direction. Thus, in step 3, the operation of filling the opening 4 of the printing mask 3 with the cream solder 7 and the operation of scraping the surface 3 a of the printing mask 3 by the squeegee 12 a are started. At this time, the cream solder 7 rolling on the front surface 3a of the printing mask 3 is, as shown in FIG.
8, flows in a clockwise direction, and in particular, after the cream solder 7 on the lower side of the pressure applying member 28 has passed through the narrow path 34 between the printing mask 3 and the leftward direction opposite to the printing direction. 3 between the squeegee 12a and the pressure applying member 28
6, the pressure applying member 28 moves upward and to the right in FIG. 4 while moving downward and to the right and then circulates again through the narrow path 34. This narrow road 3
When the cream solder 7 passes through the opening 4, the filling pressure is higher than before, and the opening 4 is sufficiently filled with the cream solder 7 even if the squeegee speed is increased.

In step 4, when the squeegee 12a arrives at the movement end position, the movement of the squeegee 12a is stopped by the driving device 26 under the control of the control device 24. After this,
In step 5, the printed circuit board 5 is lowered by a printed circuit board lifting device (not shown) and the printed circuit board 5 is separated from the printing mask 3, thereby completing the printing of the cream solder 7. Next, in the leftward printing, similarly to the rightward printing described above, the printed board 5 is raised to a printing position and held by a printed board lifting device (not shown) or the like, and printed on the land 6 of the printed board 5. After the printed circuit board 5 is positioned on the printing mask 3 so that the opening 4 of the printing mask 3 is positioned and overlapped, the control device 24
The squeegee 12b for leftward printing is lowered by the up-down driving device 18 under the control of. Also at this time, the squeegee 12
The leading end of b contacts the surface 3a of the printing mask 3 with an appropriate printing pressure. At this time, the rightward printing squeegee 12a is kept at the standby position by the vertical driving device 16. Subsequent operations are performed in the same manner as in the above-described rightward printing. The cream solder 7 is continuously printed on the lands 6 of the printed circuit board 5 via the printing mask 3 by alternately repeating the printing operation as described above.

The cream solder printing apparatus 10 of the first embodiment is of a type that moves in both the left and right printing directions, and therefore has both the squeegees 12a and 12b.
The cream solder printing apparatus may be of a type that moves to only one of them, and in that case, a squeegee 12a or a squeegee 12b corresponding to the moving direction is provided.

(Second Embodiment) In the first embodiment, the squeegees 12a and 12b are vertically moved. FIG. 10 shows a cream solder printing apparatus according to a second embodiment of the present invention. Thus, both squeegees may not always move up and down during printing, and may always contact the surface 3a of the printing mask 3. The printing apparatus shown in FIG. 10 includes a pair of squeegees 12a,
The filling and scraping operation of the cream solder 7 is performed in a state in which the printing board 12b is always in contact with the printing mask 3 during printing, and the printing pressure applied when the movement of the squeegees 12a and 12b is completed is released. 5 is separated from the printing mask 3. Printing is continuously performed by repeating this operation. By doing so, the cream solder 7 is always held between the squeegees 12a and 12b, and the vertical movement of each squeegee 12a and 12b can be omitted, so that the printing time can be further reduced. When printing is completed, the squeegees 12a and 12b are raised by the driving devices 16 and 18 and held at the standby position 20. The configuration of the printing apparatus shown in FIG. 10 is different from that of the printing apparatus shown in FIG. 1 in the operation control, but the configuration is the same, so that the description of the configuration is omitted. Reference numeral 50 denotes a side plate that is provided so as to straddle one or both of the squeegees 12a and 12b, and that the cream solder 7 moves to a position off the squeegees 12a and 12b along the axial direction of the squeegees 12a and 12b. Can be prevented. Further, although the squeegees 12a and 12b are configured to be driven by independent vertical drive devices 16 and 18, respectively, both squeegees may be attached to one vertical drive device.

[0040]

Next, embodiments of the present invention will be described. The squeegee speed in each of the following embodiments is 200 mm / sec, which is higher than the conventional squeegee speed (40 mm / sec).

(Example 1) A conventional squeegee having no pressure applying member and a pressure applying member made of a round bar were provided in order to observe the presence or absence of a pressure applying member and a change in filling pressure due to a change in squeegee angle. Printing was performed with the squeegee of Example 1 of the present invention at a squeegee angle α of 60 degrees. The squeegee used was made of urethane rubber.

Sample a (Example 1): With pressure applying member. Sample b (Comparative Example): No pressure applying member. The sample a used a round bar having a diameter of 5 mm as a pressure applying member, the gap between the pressure applying member and the printing mask was 3 mm,
The gap between the pressure applying member and the squeegee was set to 1 mm.
The results are shown in FIG.

As is clear from the graph shown in FIG.
With the pressure applying member as in sample a, the high pressure state could be maintained for a long time. Therefore, it can be seen that good printing can be performed even when the squeegee speed is increased. In contrast,
As in the case of the sample b, a sufficient pressure could not be obtained without the pressure applying member. This indicates that the pressure applying member is extremely effective.

Example 2 In Example 2, the printing state was observed by changing the cross-sectional shape of the pressure applying member. Other printing conditions are almost the same as in the first embodiment. Sample e: circular cross section having a diameter d of 5 mm. Sample f: a semicircular cross section having a diameter d of 5 mm, and an angle θ with respect to a printing mask of 30 ° (FIG. 6). Sample g: a semicircular cross section having a diameter d of 8 mm, and an angle θ with the printing mask of 30 ° (FIG. 6). Sample h: A semicircle having a diameter d of 8 mm was processed into a wedge-shaped cross section having an angle β of 30 ° while leaving a diameter surface, and an angle θ with a printing mask was obtained.
30 degrees (FIG. 7). Sample i: circular cross section having a diameter d of 6 mm. Sample j: circular section having a diameter d of 7 mm. Sample k: No pressure applying member (Comparative Example). The result is shown in FIG.

As can be seen from the results shown in FIG. 12, the presence of the pressure applying members such as samples e to j could maintain the high pressure state for a longer time than before, and therefore the squeegee speed was increased. However, it can be seen that good printing can be performed, and the pressure applying member is extremely effective. Further, in the case of the samples e, i, and j using the round bars having the diameters d of 5 mm, 6 mm, and 7 mm as the pressure applying members, there is no need to perform complicated machining on the material in connection with the production of the pressure applying members. Since the pressure applying member can be provided with a simple configuration, the pressure applying member can be provided without increasing the manufacturing cost, which is more effective.

FIG. 12 shows that the cross-sectional shape of the pressure-applying member is shown in the embodiment since the high-pressure state can be maintained for a longer time than before in any of the cross-sectional shapes of the pressure-applying members. The shape is not limited to the cross section, and any shape may be used as long as a narrow path is formed between the pressure applying member and the printing mask. According to the first and second embodiments, the pressure applying members 28, 28A, 28B which form the narrow path 34 with the printing mask 3 and also form the flow path 36 with the squeegees 12a, 12b. , 28C,
By providing 28D near the tips of the squeegees 12a and 12b, the cream solder 7 rolling during the movement of the squeegee for cream solder printing passes through the narrow path 34, and the narrow path 34 is used. Higher pressures can be applied. That is, the pressure of the cream solder 7 flowing between the pressure applying members 28, 28A, 28B, 28C, 28D and the printing mask 3 is higher than before, and the increased pressure causes the cream solder 7 to move downward. The more the flow printing mask 3 is filled in the opening 4. Pressure applying members 28, 28A, 28B, 28
Since C and 28D form a narrow path 34 with the surface 3a of the printing mask 3, the pressure applying members 28, 28A, 28
The high pressure state of the cream solder 7 flowing between B, 28C, 28D and the surface 3a of the printing mask 3 is maintained for a long time. Therefore, even if the squeegee speed is increased, the pressure applying members 28, 28A, 28B, 28C, 2
When 8D faces the opening 4 of the printing mask 3, the opening 4 is sufficiently filled with the cream solder 7, and the insufficient filling is eliminated. Further, when the pressure applying member 28 is formed of a round bar, the manufacturing of the pressure applying member 28 does not require complicated machining of the material, and the pressure applying member 28 can be provided with a simple configuration. Never rise. Further, when the pressure applying member 28C incorporates the heating element 38, the temperature of the cream solder 7 can be maintained at a constant level. As a result, the viscosity of the cream solder 7 is maintained at a constant level, and constant printing characteristics can be obtained. Can be In the second embodiment, in particular, a pair of squeegees 12a and 12b are provided, and both squeegees 12a and 12b are always in contact with the print mask 3 at least during printing. The removal of the solder 7 is prevented, and the set amount of the cream solder 7 can be always held on the printing mask 3.
In addition, since the squeegees 12a and 12b do not move up and down during printing, the printing time can be reduced and the productivity can be improved. In addition, as shown in FIG. 26A, in the conventional configuration, when printing is repeated, the cream solder 7 protrudes from both sides of the squeegee 12a like 7A. The extruded cream solder 7A does not return naturally, but is collected and returned to the operator at regular intervals, or is discarded. On the other hand, the pressure applying member 2
8, 28A, 28B, 28C, 28D are arranged and pressure is applied to the cream solder 7 so that the cream solder 7
Are pressure applying members 28, 28A, 28B, 28C, 28D
Around the pressure applying members 28, 28A, 2
As shown in FIG. 26 (B), even if printing is repeated, a large amount of cream solder does not protrude as in the related art, even if printing is repeated so as to stick to 8B, 28C, 28D. Work can be reduced and productivity can be improved. Further, a predetermined gap is provided between the squeegees 12a and 12b, and the pressure applying members 28, 28A, 28B, 28C, 28
Since only D is supported and there is no sealed portion, it can be easily cleaned when cleaning a squeegee or the like. Also,
Since the narrow path 34 has a substantially wedge-shaped cross section, the cream solder 7 is pressed by the pressure applying members 28, 28A, 28B, 28.
The pressure of the cream solder 7 efficiently introduced by the inclined surfaces 28a of C and 28D and flowing between the pressure applying members 28, 28A, 28B, 28C and 28D and the surface 3a of the printing mask 3 is efficiently increased. Can be. Further, the pressure applying members 28, 28 from the surface 3a of the printing mask 3
The height H2 of A, 28B, 28C, 28D is lower than the rolling height H1 of the cream solder 7 during printing,
Since the pressure applying members 28, 28A, 28B, 28C, 28D are buried in the cream solder 7 being rolled during printing, the pressure applying members 28, 28A, 28B, 28
The pressure of the cream solder 7 flowing between the C and 28D and the surface 3a of the printing mask 3 can be increased without adversely affecting the rolling of the cream solder 7.
Further, the pressure applying members 28, 28A, 28B, 28
Since C and 28D are fixed non-rotatably, they can be attached with a simple configuration. Note that the present invention is not limited to the above embodiment, and can be implemented in other various aspects. For example, as shown in FIG. 32, the cross-sectional shape orthogonal to the axial direction of the pressure applying member 28D is large in the axial direction of the pressure applying member 28D depending on the number and size of the openings 4 of the printing mask 3. Diameter 28t
And a small-diameter portion 28s having a diameter smaller than the large-diameter portion 28t so as to have different diameters.
Can be made different. For example, in a region where the openings 4 of the printing mask 3 are large or a region where the openings 4 are arranged at a high density, the large-diameter portions 28t face each other and it is necessary to increase the filling pressure.
It is preferable that s is opposed to a normal pressure. More specifically, for example, a high filling area in which the openings 4,..., 4 of the large printing mask 3 such as a square having a side of 2 mm or more are concentrated or 0.3 m of about 0.15 mm × 1.4 mm.
m pitch QFP (Quad Flat Package) pattern and 0.5mm pitch CSP around 0.25mm diameter
In the high filling region where the fine openings 4,..., 4 corresponding to narrow pitch patterns such as (Chip Size Package) patterns are concentrated, the pressure applying members 28, 28A, 2
8B, 28C, and 28D, the cross-sectional shape of which is orthogonal to the axial direction is increased, and a greater pressure is applied to the pressure applying members 28, 2
8A, 28B, 28C, and 28D allow the cream solder 7 to be applied. On the other hand, in cases other than the above, in the low filling region where the openings 4 of a normal size are sparsely arranged, the pressure applying members 28, 28A, 2
The cross-sectional shape orthogonal to the axial direction of 8B, 28C, 28D is reduced so that a lower pressure than the high-density region can be applied to the cream solder 7 by the pressure applying members 28, 28A, 28B, 28C, 28D. To (Third Embodiment) In a cream solder printing apparatus according to a third embodiment of the present invention, as shown in FIGS. 20 to 23, the pressure applying member 28 of a round bar is set so that the rolling direction of the cream solder 7 is reversed. It is to rotate. A pair of brackets 30, 30 are provided so that the pressure applying member 28 of a round bar is rotatable.
And one end of the pressure applying member 28 is protruded from one of the brackets 30 so that a pulley 5
3 is fixed. In the vicinity of the pressure applying member 28 of the one bracket 30, a motor 49 is disposed, and a pulley 52 fixed to a rotation shaft of the motor 49 and a pulley 53 at a protruding end of the pressure applying member 28 are connected to a belt 54. Connect with. Accordingly, when the rotation shaft of the motor 49 is rotated in the counterclockwise direction in FIG. 20, the pressure applying member 28 moves in the counterclockwise direction (the direction of the arrow Y in FIG. 22) via the pulley 52, the belt 54, and the pulley 53. When the printing is performed in the rightward direction in FIG. 20, the pressure applying member 28 is rotated by the flow of the cream solder 7 (arrow X in FIG. 22).
(Rotational flow in the same direction). In addition, if the motor 49 is connected to the control device 24, the control device 24 allows the motor 49 to be connected at the time of printing or immediately before printing.
Can be rotationally controlled. Note that the rotation mechanism of the pressure applying member 28 may be such that the motor 49 is directly connected to the pressure applying member 28, and is not limited to the above configuration. According to the above configuration, as shown in FIG. 22, the cream solder 7 is rotated by rotating the pressure applying member 28 in the arrow Y direction opposite to the arrow X direction in the flow direction by the rolling of the cream solder 7 during printing. As compared with the case where the pressure applying member 28 is fixedly arranged so as not to rotate, the narrow path 34
And it becomes difficult to pass through the flow path 36. Generally, when the fluid such as the cream solder 7 hardly flows, the pressure increases. Therefore, as shown in FIG. 23C, the filling pressure is higher than that of A in FIG. 23 (corresponding to A in FIG. 5). Is further increased in pressure, so that insufficient filling due to insufficient filling pressure of cream solder as in the prior art is eliminated. That is, in FIG. 23, C shows the case of the squeegee provided with the pressure applying member of the cream solder printing apparatus of the third embodiment. A is the first
4 shows a case of a squeegee provided with the pressure applying member of the cream solder printing apparatus of the embodiment. B shows the case of a squeegee without a pressure applying member. (Fourth Embodiment) In a cream solder printing apparatus according to a fourth embodiment of the present invention, as shown in FIGS. 24 and 25, the pressure applying member 28 can be opened and closed with respect to the squeegees 12a and 12b by an opening and closing mechanism. It may be attached so that cleaning such as clogging of cream solder is facilitated. The pressure applying members 28A, 28B, 28C
Although the pressure applying member 28 can be applied in the same manner as the pressure applying member 28, the pressure applying member 28 will be typically described to simplify the description. In the fourth embodiment, the pressure applying member 28
Are supported not by the bracket 30 but by the holding member 45. The holding member 45 is at least 90 degrees around the opening / closing pin 47, that is, between the pressure applying position P1 where the pressure applying member 28 applies pressure to the cream solder 7 and the retracting position P2 where the application of the pressure is released. The mounting member 48 is rotatable with and can be positioned and held at each position.
Is attached to a holder 33 that holds the squeegee 12a. The holding member 45 has a fixing bolt 4
6 is rotatably held and non-removably attached. By screwing a fixing bolt 46 into a screw hole 33 a of the holder 33, the holding member 45 comes into contact with the holder 33 and is supported by the holding member 45. The applied pressure applying member 28 can be positioned at the pressure applying position P1. Therefore, at the time of cream solder printing, as shown in FIG. 24, the holding member 45 is fixed to the holder 33 by the fixing bolt 46, and the pressure applying member 28 is positioned and held at the pressure applying position P1, so that a predetermined pressure is applied. It is applied to the solder 7. On the other hand, when it is necessary to clean the squeegee 12a, for example, at the end of cream solder printing or at the time of switching the board model, the fixing bolt 46 is loosened and the fixing bolt 46 is After being pulled out from the screw hole 33a, the holding member 45 is rotated counterclockwise by 90 degrees around the opening / closing pin 47 to be positioned and held at the retreat position P2, and the holding member 45 is kept open. Can be held. With the above-described configuration, the pressure applying member 28 is separated from the squeegee 12a at the time of cleaning or the like. FIG. 27 shows a graph and an explanatory diagram showing a change due to the arrangement of the pressure applying member 28 of a round bar. When the inclination angle θ of the squeegee is fixed to 60 degrees, the intervals T between the flow paths 36 are 1 mm, 2 mm, and 3 mm, and the intervals S between the narrow paths 34 are 1 mm, 2 mm, 3 mm, and 5 mm. At this time, the pressure applied to the cream solder, that is, the printing pressure P is measured, and the solder rolling property, the solder scraping state on the print mask, and the printing state are determined. The solder rolling property, the state of scraping the solder on the print mask, and the printing state were visually determined, and ○ was good and Δ was not good. From FIG. 27, when the interval T between the flow paths 36 is 1 mm and 2 mm, respectively, the interval S between the narrow paths 34 is 1 mm and 2 m.
m, 3 mm, the solder rolling property, the solder scraping state on the print mask, and the printing state are all good, but when the interval S of the narrow path 34 is 5 mm,
The solder rollability and the printing state are all poor. From FIG. 27, it is understood that the interval T between the flow paths 36 is preferably about 1 mm to 3 mm, and the interval S between the narrow paths 34 is preferably about 1 mm to 3 mm. 28 and 29 show the relationship between the printing speed and the filling pressure profile. FIG. 28A is an explanatory diagram showing the relationship between the substrate and the printing direction. FIG. 28B shows a filling pressure profile showing the relationship between filling pressure and time when the printing speed is changed in five steps from 40 mm / sec to 400 mm / sec when the squeegee has no pressure applying member.
FIG. 29 shows that when the squeegee has the pressure applying member 28 of a round bar, the printing speed is increased from 40 mm / sec to 400 mm / sec.
5 shows a filling pressure profile of the relationship between filling pressure and time when changing in five steps until sec. FIG. 30 shows the relationship between the type (viscosity) of the cream solder and the printing conditions when the squeegee has no pressure applying member. FIG. 31 shows the relationship between the type (viscosity) of cream solder and printing conditions when the squeegee has the pressure applying member 28 of a round bar.
In FIGS. 30 and 31, each of the scraping state, the solder rolling property, and the filling (printing) state on the print mask is visually determined. ○ indicates good, Δ indicates unfavorable, and X indicates defective. Comparing FIG. 30 with FIG. 31, when the scraping state on the print mask, the solder rolling property, and the filling (printing) state are all good, the round bar of FIG. It can be seen that the case where the pressure applying member is provided is better even when the printing speed is high.
Note that by appropriately combining any of the various embodiments described above, the effects of the respective embodiments can be achieved.

According to the present invention, a pressure applying member which forms a narrow path between the squeegee and a printing mask at the time of printing, and which forms a flow path between the squeegee and the squeegee is provided near the tip of the squeegee. Thus, the cream solder rolling during the movement of the squeegee passes through the narrow path, so that a higher pressure can be applied to the narrow path than before. Therefore, even when the squeegee speed is increased, the cream solder is sufficiently filled in the opening when the pressure applying member faces the opening of the printing mask, and the insufficient filling is eliminated. Further, since the pressure applying member is movably attached to the squeegee between a pressure applying position for applying pressure to the cream solder and a retracted position for canceling the application of the pressure, the cream solder When cleaning of the squeegee becomes necessary, for example, at the end of printing or at the time of switching the board model, the squeegee can be located at the retracted position. Therefore, the pressure applying member can be separated from the squeegee at the time of cleaning or the like, and does not become an obstacle, so that the cleaning work of the cream solder adhered to the squeegee can be easily performed, and the maintainability is improved.
In addition, when the cross-sectional shape of the narrow path is formed in a substantially wedge-shaped cross section by the curved surface of the round bar of the pressure applying member or the like, the pressure can be increased while inducing the cream solder into the narrow path. . When the pressure applying member incorporates a heating element and appropriately heats the cream solder, by maintaining the temperature of the cream solder at a constant value, the viscosity of the cream solder is maintained at a constant value and stable filling characteristics are obtained. Can be Further, in the case where the pressure applying member is formed of a round bar, it is not necessary to perform complicated machining on the material for the production of the pressure applying member, and the pressure applying member can be provided with a simple configuration, so that the manufacturing cost is reduced. Never rise. In addition, a pair of squeegees is provided, and at least during printing, when both squeegees are always in contact with the print mask, the removal of cream solder due to the rise of the squeegee is prevented, and the set amount is always set on the print mask. Can hold the cream solder. Further, since the squeegee does not move up and down during printing, the printing time can be shortened and the productivity can be improved. Further, in the conventional configuration, when printing is repeated, the cream solder protrudes from both sides of the squeegee. The protruding cream solder does not return naturally, but is collected and returned to the operator at regular intervals, or is discarded. On the other hand, by applying the pressure to the cream solder by disposing the pressure applying member, the cream solder rolls around the pressure applying member and comes to cling to the pressure applying member. Even if is repeated, a large amount of cream solder does not protrude unlike the conventional case, so that the work of the operator can be reduced and the productivity can be improved. Further, the squeegee is simply supported by the pressure applying member with a predetermined gap, and has no sealed portion. Therefore, when the squeegee or the like is to be cleaned, it can be easily cleaned. When the narrow path has a substantially wedge-shaped cross section, the cream solder is efficiently introduced by the inclined surface of the pressure applying member, and the pressure of the cream solder flowing between the pressure applying member and the surface of the printing mask is increased. Can be efficiently raised. Further, the height of the pressure applying member from the surface of the printing mask is lower than the rolling height of the cream solder during printing, and the pressure applying member is embedded in the cream solder during rolling during printing. In this case, the pressure of the cream solder flowing between the pressure applying member and the surface of the printing mask can be increased without adversely affecting the rolling of the cream solder. When the pressure applying member is fixed so as not to rotate, the pressure applying member can be attached with a simple configuration. Further, the cross-sectional shape orthogonal to the axial direction of the pressure applying member is varied in the axial direction of the pressure applying member depending on the number and size of the openings of the printing mask, so that the cream is applied by the pressure applying member. The pressure applied to the solder can be made different. Also,
When the pressure applying member is rotated in the direction opposite to the flow direction of the cream solder during printing during printing, the cream solder forms a narrow path and a flow path as compared with the case where the pressure applying member is fixedly and non-rotatably fixed. It becomes difficult to pass. Generally, since the pressure of a fluid such as cream solder is increased when it becomes difficult to flow, the filling pressure is further increased, so that the insufficient filling caused by the insufficient filling pressure of the cream solder as in the prior art is eliminated. .

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a cream solder printing apparatus according to a first embodiment of the present invention.

FIG. 2 is a mounting configuration diagram of a pressure applying member of the cream solder printing apparatus of FIG. 1;

FIG. 3 is a schematic view showing a relationship between the pressure applying member and the squeegee of the cream solder printing apparatus of FIG. 1 (note that hatching of the squeegee 12a of FIG. 3 does not show a cross section; It has been added to clearly indicate the area.)

FIG. 4 is a diagram illustrating a rolling state of cream solder of the cream solder printing apparatus of FIG. 1;

5 is a graph showing the characteristics of the filling pressure of the squeegee provided with the pressure applying member and the squeegee not provided with the pressure applying member in the cream solder printing apparatus of FIG.

FIG. 6 is a diagram illustrating a modified example of the pressure applying member and the narrow path of the cream solder printing apparatus of FIG.

FIG. 7 is a view illustrating another modification of the pressure applying member and the narrow path of the cream solder printing apparatus of FIG. 1;

FIG. 8 is a diagram illustrating another modified example of the pressure applying member of the cream solder printing apparatus of FIG.

FIG. 9 is a flowchart showing an operation of the cream solder printing apparatus shown in FIG. 1;

FIG. 10 is a configuration diagram of a cream solder printing apparatus according to a second embodiment of the present invention.

FIG. 11 is a graph showing the results of Example 1.

FIG. 12 is a graph showing the results of Example 2.

FIG. 13 is a configuration diagram of a conventional cream solder printing apparatus.

FIG. 14 is a diagram illustrating a state in which printing is performed by the squeegee illustrated in FIG. 12;

15 is a diagram showing a state in which cream solder is being filled into an opening by the squeegee shown in FIG.

16 is an explanatory diagram showing cream solder formed on a land of a printed circuit board after the cream solder printing of FIG. 15 is performed.

FIG. 17 is a diagram illustrating a case where an unfilled portion of cream solder occurs in an opening of a printing mask.

18 is an explanatory view showing cream solder formed on a land of a printed circuit board after the cream solder printing of FIG. 17 is performed.

FIG. 19 is a graph showing a change in filling pressure according to a squeegee passage time by a conventional device.

FIG. 20 is a partially enlarged view of a cream solder printing apparatus according to a third embodiment of the present invention.

FIG. 21 is a schematic view showing the relationship between the pressure applying member and the squeegee of the cream solder printing apparatus according to the third embodiment (note that the hatching of the squeegee 12a in FIG. 12a is clearly shown.)

FIG. 22 is a diagram illustrating a rolling state of cream solder in the cream solder printing apparatus according to the third embodiment.

FIG. 23 shows a squeegee provided with the pressure applying member of the cream solder printing apparatus of the third embodiment, a squeegee provided with the pressure applying member of the cream solder printing apparatus of the first embodiment, and a pressure applying member. 9 is a graph showing characteristics of filling pressure by a squeegee not provided.

FIG. 24 is an enlarged side view of a cream solder printing apparatus according to a fourth embodiment of the present invention in a state where a pressure applying member is located at a pressure applying position.

FIG. 25 is an enlarged side view of the cream solder printing apparatus according to the fourth embodiment in a state where a pressure applying member is retracted to a retracted position.

FIGS. 26A and 26B are explanatory views showing a state in which cream solder protrudes from both sides of a squeegee in the repetition of conventional cream solder printing, and cream solder printing in the first and second embodiments, respectively. It is explanatory drawing which shows the state in which cream solder does not protrude from both sides of a squeegee in repetition of.

FIG. 27 is an explanatory diagram showing an arrangement size relationship of a pressure applying member of a round bar.

FIG. 28A is an explanatory diagram showing a relationship between a substrate and a printing direction. FIG. 28B is a diagram showing a printing speed of 40 mm / sec to 400 mm when the squeegee has no pressure applying member.
5 is a graph showing a filling pressure profile of the relationship between filling pressure and time when changing in five steps to / sec.

29 shows a printing speed of 40 mm / sec to 400 mm / s when the squeegee has a round bar pressure applying member.
It is a graph which shows the filling pressure profile of the relationship between filling pressure and time when changing in 5 steps to ec.

FIG. 30 is an explanatory diagram showing the relationship between the type (viscosity) of cream solder and printing conditions when the squeegee has no pressure applying member.

FIG. 31 is an explanatory diagram showing the relationship between the type (viscosity) of cream solder and printing conditions when a squeegee has a round bar pressure applying member.

FIG. 32 is a schematic view showing a relationship between a pressure applying member and a squeegee of a cream solder printing apparatus according to a modification of the first embodiment of the present invention.

[Explanation of symbols]

3 printing mask, 3a surface, 4 opening, 5 circuit board, 6 land, 7 cream solder, 8 solder resist, 10 cream solder printing device, 12a, 12b
... Squeegee, 14 ... Base plate, 16, 18 ... Up and down drive,
20 standby position, 22 operating position, 24 control device, 2
6. Drive device, 28, 28A, 28B, 28C, 28D
... pressure applying member, 30 ... bracket, 32 ... fixing members such as bolts and nuts, 33 ... holder, 34 ... narrow path, 3
6 flow path, 38 heating element, 45 holding member, 46 fixing bolt, 47 opening / closing pin, 48 mounting member, 49
... Motor, 50 ... Side plate, 51 ... Pressure sensor, 52 ... Pulley, 53 ... Pulley, 54 ... Belt.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoichi Kaku 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Satoshi Takahashi 1006 Kazama Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Toshiyuki Murakami 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.F-term (reference)

Claims (18)

[Claims] 1. A squeegee (12a, 12b) moves in a printing direction on a surface (3a) of a printing mask (3) in which an opening (4) is formed, so that cream solder supplied on the surface is formed. In a cream solder printing apparatus for printing (7) through the opening on the circuit forming body (5) located on the back surface of the printing mask, a pressure application position (P1) for applying pressure to the cream solder. And withdrawal position (P2) where the application of the pressure is released
The squeegee is movably mounted between the squeegee and the pressure application position has an axial direction extending substantially parallel to the axial direction of the squeegee, and the cream solder is printed during cream solder printing. A first gap (34) that can pass through the squeegee in a direction opposite to the printing direction can be formed between the squeegee and the printing mask, and the cream solder that passes from the first gap to the squeegee side can be formed. An elongated pressure applying member (28, 28) disposed so as to form a second gap (36) that can pass therethrough with the squeegee.
28A, 28B, 28C, 28D) are provided over the vicinity of the tip of the squeegee to apply the pressure when the cream solder passes through the first gap between the pressure applying member and the printing mask during printing of the cream solder. A cream solder printing apparatus for applying pressure from a member to the cream solder toward the printing mask. 2. A cream solder printing apparatus according to claim 1, wherein said pressure applying member is a round bar. 3. The cream solder printing apparatus according to claim 1, wherein the pressure applying member includes a heating element for heating the cream solder. 4. The printing apparatus according to claim 1, wherein a pair of the squeegees is provided, and at least one of the pair of squeegees is always in contact with the printing mask at least during printing. Cream solder printing equipment. 5. The cream solder printing apparatus according to claim 1, wherein the first gap has a substantially wedge-shaped cross section that narrows toward the squeegee. 6. The height (H2) of the pressure applying member from the surface of the printing mask is lower than the rolling height (H1) of the cream solder at the time of printing, and the pressure applying member rolls during printing. The cream solder printing apparatus according to any one of claims 1 to 5, wherein the cream solder printing apparatus is buried in cream solder therein. 7. The cream solder printing apparatus according to claim 1, wherein the pressure applying member is fixed so as not to rotate. 8. The pressure applying member (28D) has a sectional shape perpendicular to the axial direction, which is varied in the axial direction of the pressure applying member according to the number and size of the openings of the printing mask. The cream solder printing apparatus according to any one of claims 1 to 7, wherein a pressure applied to the printing mask applied to the cream solder by a pressure applying member is made different. 9. The method according to claim 1, wherein the pressure applying member is rotated in a direction opposite to a rolling direction of the cream solder around the pressure applying member during printing. Cream solder printing equipment. 10. A squeegee moves in the printing direction on the surface of the printing mask having the opening formed thereon, so that the cream solder on the surface is transferred to the circuit forming body located on the back surface of the printing mask. And a long pressure applying member (28, 28A, 28B, 28C, 28D) provided over the vicinity of the tip of the squeegee.
In a state where the pressure is applied to the cream solder from the retracted position to which the pressure is not applied to the cream solder, a pressure forming member is formed between the printing mask and the pressure applying member at the time of cream solder printing. The cream solder passes through the gap in a direction opposite to the printing direction of the squeegee, and applies a pressure toward the printing mask to the cream solder from the pressure applying member.
After the cream solder passing from the gap to the squeegee side passes through the second gap between the squeegee and the pressure applying member, the cream solder is again placed between the pressure applying member and the printing mask. A cream solder printing method passing through the first gap. 11. The cream solder printing method according to claim 10, wherein the pressure applying member is a round bar. 12. The cream solder printing method according to claim 10, wherein the pressure applying member (28C) includes a heating element (38) for heating the cream solder. 13. The squeegee according to claim 1, wherein when a pair of the squeegees is provided, at least one of the pair of squeegees is always in contact with the printing mask at least during printing. 3. The cream solder printing method according to item 1. 14. The cream solder printing method according to claim 10, wherein the first gap has a wedge-shaped cross section that narrows toward the squeegee. 15. An apparatus according to claim 10, wherein the gap of said first gap is lower than a rolling height of said cream solder during printing, and said pressure applying member is buried in cream solder during rolling during printing. The solder paste printing method according to any one of the above. 16. The cream solder printing method according to claim 10, wherein the pressure applying member is fixed so as not to rotate. 17. The pressure applying member (28D) has a sectional shape perpendicular to the axial direction, which is varied in the axial direction of the pressure applying member according to the number and size of the openings of the printing mask. The cream solder printing method according to any one of claims 10 to 16, wherein a pressure applied to the printing mask applied to the cream solder by a pressure applying member is made different. 18. The printing apparatus according to claim 10, wherein the pressure applying member is rotated in a direction opposite to a rolling direction of the cream solder around the pressure applying member during printing.
The solder paste printing method according to any one of the above.