WO2019045449A1 - Cleaning composition for cleaning glass article and method of cleaning glass substrate using the same - Google Patents
Cleaning composition for cleaning glass article and method of cleaning glass substrate using the same Download PDFInfo
- Publication number
- WO2019045449A1 WO2019045449A1 PCT/KR2018/009991 KR2018009991W WO2019045449A1 WO 2019045449 A1 WO2019045449 A1 WO 2019045449A1 KR 2018009991 W KR2018009991 W KR 2018009991W WO 2019045449 A1 WO2019045449 A1 WO 2019045449A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- weight
- cleaning composition
- range
- cleaning
- formula
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 171
- 239000000203 mixture Substances 0.000 title claims abstract description 126
- 239000011521 glass Substances 0.000 title claims abstract description 85
- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003381 stabilizer Substances 0.000 claims abstract description 40
- 239000006185 dispersion Substances 0.000 claims abstract description 32
- 239000004094 surface-active agent Substances 0.000 claims abstract description 31
- 239000002738 chelating agent Substances 0.000 claims abstract description 28
- 239000003960 organic solvent Substances 0.000 claims abstract description 23
- 239000003513 alkali Substances 0.000 claims abstract description 20
- -1 alkyl phenol ether Chemical compound 0.000 claims description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 229910052751 metal Chemical class 0.000 claims description 12
- 239000002184 metal Chemical class 0.000 claims description 12
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 11
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 11
- 239000000194 fatty acid Substances 0.000 claims description 11
- 229930195729 fatty acid Natural products 0.000 claims description 11
- 150000003839 salts Chemical class 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 229960003330 pentetic acid Drugs 0.000 claims description 10
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 9
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000004215 Carbon black (E152) Substances 0.000 claims description 8
- 229930195733 hydrocarbon Natural products 0.000 claims description 8
- 150000002430 hydrocarbons Chemical class 0.000 claims description 8
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 6
- 239000012964 benzotriazole Substances 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- 229960001484 edetic acid Drugs 0.000 claims description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 5
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 4
- 229930182478 glucoside Natural products 0.000 claims description 4
- 150000008131 glucosides Chemical class 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 159000000000 sodium salts Chemical class 0.000 claims description 4
- 239000000600 sorbitol Substances 0.000 claims description 4
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 4
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- HMBHAQMOBKLWRX-UHFFFAOYSA-N 2,3-dihydro-1,4-benzodioxine-3-carboxylic acid Chemical compound C1=CC=C2OC(C(=O)O)COC2=C1 HMBHAQMOBKLWRX-UHFFFAOYSA-N 0.000 claims description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 229910019440 Mg(OH) Inorganic materials 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- 150000003973 alkyl amines Chemical class 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- NWEKXBVHVALDOL-UHFFFAOYSA-N butylazanium;hydroxide Chemical compound [OH-].CCCC[NH3+] NWEKXBVHVALDOL-UHFFFAOYSA-N 0.000 claims description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 229940075419 choline hydroxide Drugs 0.000 claims description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 3
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 229940005657 pyrophosphoric acid Drugs 0.000 claims description 3
- 229960004889 salicylic acid Drugs 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 3
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 3
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 55
- 239000000356 contaminant Substances 0.000 abstract description 7
- 238000011109 contamination Methods 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 28
- 208000009766 Blau syndrome Diseases 0.000 description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 239000005416 organic matter Substances 0.000 description 8
- 229960004418 trolamine Drugs 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000007689 inspection Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004615 ingredient Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229940043237 diethanolamine Drugs 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000036962 time dependent Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 2
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 2
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- RGICCULPCWNRAB-UHFFFAOYSA-N 2-[2-(2-hexoxyethoxy)ethoxy]ethanol Chemical compound CCCCCCOCCOCCOCCO RGICCULPCWNRAB-UHFFFAOYSA-N 0.000 description 1
- KCBPVRDDYVJQHA-UHFFFAOYSA-N 2-[2-(2-propoxyethoxy)ethoxy]ethanol Chemical compound CCCOCCOCCOCCO KCBPVRDDYVJQHA-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- ACQVEWFMUBXEMR-UHFFFAOYSA-N 4-bromo-2-fluoro-6-nitrophenol Chemical compound OC1=C(F)C=C(Br)C=C1[N+]([O-])=O ACQVEWFMUBXEMR-UHFFFAOYSA-N 0.000 description 1
- PCWGTDULNUVNBN-UHFFFAOYSA-N 4-methylpentan-1-ol Chemical compound CC(C)CCCO PCWGTDULNUVNBN-UHFFFAOYSA-N 0.000 description 1
- BWDBEAQIHAEVLV-UHFFFAOYSA-N 6-methylheptan-1-ol Chemical compound CC(C)CCCCCO BWDBEAQIHAEVLV-UHFFFAOYSA-N 0.000 description 1
- PLLBRTOLHQQAQQ-UHFFFAOYSA-N 8-methylnonan-1-ol Chemical compound CC(C)CCCCCCCO PLLBRTOLHQQAQQ-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- AKNUHUCEWALCOI-UHFFFAOYSA-N N-ethyldiethanolamine Chemical compound OCCN(CC)CCO AKNUHUCEWALCOI-UHFFFAOYSA-N 0.000 description 1
- 229910019093 NaOCl Inorganic materials 0.000 description 1
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- WVPMEZSWYJEBNP-UHFFFAOYSA-N ethyl 2-methoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OC WVPMEZSWYJEBNP-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 1
- XPIWVCAMONZQCP-UHFFFAOYSA-N methyl 2-oxobutanoate Chemical compound CCC(=O)C(=O)OC XPIWVCAMONZQCP-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
- C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/08—Silicates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/10—Carbonates ; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2079—Monocarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2082—Polycarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/116—Deposition methods from solutions or suspensions by spin-coating, centrifugation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
-
- C11D2111/18—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Surface Treatment Of Glass (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Provided are a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same. The cleaning composition includes, with respect to 100 weight% of the cleaning composition: an alkali in a range of about 1 weight% to about 20 weight%; a surfactant in a range of about 0.1 weight% to about 10 weight%; a chelating agent in a range of about 0.1 weight% to about 10 weight%; an organic solvent in a range of about 0.1 weight% to about 10 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 10 weight%, wherein the dispersion stabilizer has a structure of Formula (1) below. The use of the cleaning composition makes it possible to effectively remove particle contamination and organic contaminants on a surface of a glass substrate.
Description
One or more embodiments relate to a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same, and more particularly, to a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same, which may effectively remove particle contamination and organic contaminants on a surface of a glass substrate.
<Cross-Reference to Related Application>
This application claims the benefit of priority under 35 U.S.C. § 119 of Korean Application No. 10-2017-0109487 filed on August 29, 2017, the content of which is relied upon and incorporated herein by reference in its entirety.
Various cleaning processes including physical methods and chemical methods are used to manufacture glass substrates used in flat panel displays and the like. Cleaning compositions with further improved cleaning ability are still required to remove particle contamination and organic contaminants on glass substrates.
One or more embodiments include a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same, which may effectively remove particle contamination and organic contaminants on a surface of a glass substrate.
Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.
According to one or more embodiments, a cleaning composition for cleaning a glass article includes, with respect to 100 weight% of the cleaning composition: an alkali in a range of about 1 weight% to about 20 weight%; a surfactant in a range of about 0.1 weight% to about 10 weight%; a chelating agent in a range of about 0.1 weight% to about 10 weight%; an organic solvent in a range of about 0.1 weight% to about 10 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 10 weight%, wherein the dispersion stabilizer has a structure of Formula (1) below.
<Formula (1)>
(where "n" is an integer of 10 to 5,000, "M
+" is a positive ion of an alkali metal or alkaline earth metal, and "R
-" is O
- or COO
-)
In some embodiments, the cleaning composition may include, with respect to 100 weight% of the cleaning composition: an alkali in a range of about 5 weight% to about 20 weight%; a surfactant in a range of about 2 weight% to about 5 weight%; a chelating agent in a range of about 3 weight% to about 8 weight%; an organic solvent in a range of about 3 weight% to about 8 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%.
In this case, the dispersion stabilizer may have a structure of Formula (1-1) below.
<Formula (1-1)>
(where "n" is an integer of 50 to 1,000 and "M" is sodium or potassium)
Also, the surfactant may include at least one selected from the group consisting of polyoxyalkylene alkyl phenol ether, polyoxyalkylene aryl phenol ether, polyoxyalkylene fatty acid ester, polyoxyalkylene sorbitan fatty acid ester, polyoxyalkylene alkylamine, sorbitan fatty acid ester, polyalkyl glucoside, alkyl alcohol amine, and aryl alcohol amine.
In some embodiments, the surfactant may have a structure of Formula (2) below.
<Formula (2)>
CS-(EOS)
a-(POS)
b
(where a segment represented by "CS" is a straight-chain hydrocarbon having a carbon number of 10 to 14, a segment represented by "EOS" is ethylene oxide, a segment represented by "POS" is propylene oxide, EOS and POS each form a block or alternate with each other, and a:b is 7:3 to 9.5:0.5)
In particular, the segment represented by CS may be a straight-chain hydrocarbon having a carbon number of 12, and a:b may be about 8.5:1.5 to about 9.3:0.7.
Also, the alkali may include at least one selected from the group consisting of sodium hydroxide (NaOH), potassium hydroxide (KOH), magnesium hydroxide (Mg(OH)
2), calcium hydroxide (Ca(OH)
2), ammonia (NH
3), tetraethylammonium hydroxide, tetramethylammonium hydroxide, aminoethoxy ethanol, triethanolamine, diethanolamine, monoethanolamine, ammonium hydroxide, tetrapropylammonium hydroxide, butyl ammonium hydroxide, and choline hydroxide.
The chelating agent may include: at least one selected from the group consisting of potassium pyrophosphate, calcium carbonate, sodium carbonate, sodium silicate, sodium gluconate, citric acid, salicylic acid, malonic acid, succinic acid, glutaric acid, pyrophosphoric acid, polyphosphoric acid, benzotriazole, sorbitol, glucose, carboxylic benzotriazole, and tolyltriazole. In some embodiments, the chelating agent may include nitrilo-2,2',2"-triacetic acid (NTA), diethylene triamine pentaacetic acid (DTPA), ethylenedinitrilo tetraacetic acid (EDTA), or a metal salt thereof, and the metal salt may include a potassium salt or a sodium salt. In this case, the chelating agent may include a metal salt in a range of about 2 weight% to about 7 weight% of NTA and a metal salt in a range of about 1 weight% to about 6 weight% of DTPA with respect to 100 weight% of the cleaning composition.
In some embodiments, the cleaning composition may further include a bleacher, a phase stabilizer, or a buffer.
According to one or more embodiments, a cleaning composition for cleaning a glass article includes, with respect to 100 weight% of the cleaning composition 100: an alkali in a range of about 5 weight% to about 20 weight%; a surfactant in a range of about 2 weight% to about 5 weight%; a chelating agent in a range of about 3 weight% to about 8 weight%; an organic solvent in a range of about 3 weight% to about 8 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%, wherein the surfactant has a structure of Formula (2) above.
According to one or more embodiments, a method of cleaning a glass substrate includes: supplying a cleaning composition onto a glass substrate; cleaning a surface of the glass substrate by using a frictional cleaning unit with the cleaning composition contacting the glass substrate; and removing the cleaning composition from the glass substrate. The cleaning composition may include, with respect to 100 weight% of the cleaning composition: an alkali in a range of about 5 weight% to about 20 weight%; surfactant in a range of about 2 weight% to about 5 weight%; a chelating agent in a range of about 3 weight% to about 8 weight%; an organic solvent in a range of about 3 weight% to about 8 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%.
The dispersion stabilizer may have a structure of Formula (1) above. Also, the surfactant may have a structure of Formula (2) above.
When the cleaning composition is used, particle contamination and organic contaminants on the glass substrate surface may be effectively removed.
These and/or other aspects will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:
FIG. 1 is a graph illustrating changes in contact angles between before and after cleaning using cleaning compositions of Example 1, Comparative Example 1, and Comparative Example 2;
FIG. 2 is a graph illustrating averages of glass particle removal rates when cleaning is performed by using cleaning compositions of Example 1, Comparative Example 1, and Comparative Example 2;
FIG. 3 is a graph illustrating time-dependent changes in the numbers of particles before and after the application of a cleaning composition of Example 1 and after the re-application of a conventional cleaning composition; and
FIG. 4 is a graph illustrating a continuous time-dependent change in the number of particles during the application of a cleaning composition of Example 1 (indicated by a shaded portion).
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, the disclosure may be embodied in many different forms and should not be construed as being limited to the embodiments described below. The embodiments may be interpreted as being provided to more fully describe the disclosure to those of ordinary skill in the art. Like reference numerals denote like elements throughout. Also, various elements and regions in the drawings are illustrated schematically. Thus, the disclosure is not limited by the relative sizes or distances illustrated in the accompanying drawings.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that terms such as "comprise", "include", and "have", when used herein, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art. Also, it will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
When a certain embodiment may be implemented differently, a specific process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially at the same time or performed in an order opposite to the described order.
In the accompanying drawings, variations from the illustrated shapes may be expected as a result of, for example, manufacturing techniques and/or tolerances. Thus, the embodiments should not be construed as being limited to the particular shapes of regions illustrated herein but may include deviations in shapes that result, for example, from manufacturing processes. The term "and/or" used herein includes any and all combinations of one or more of the associated listed components. Also, the term "substrate" used herein may refer to a substrate itself or a stack structure including a substrate and a layer or film formed thereon. Also, the term "substrate surface" used herein may refer to an exposed surface of a substrate itself or an outer surface of a layer or film formed on a substrate.
An embodiment provides a cleaning composition including an alkali, a surfactant, a chelating agent, an organic solvent, and a dispersion stabilizer. The cleaning composition may include, with respect to 100 weight% of the cleaning composition: an alkali in a range of about 1 weight% to about 20 weight%; a surfactant in a range of about 0.1 weight% to about 10 weight%; a chelating agent in a range of about 0.1 weight% to about 10 weight%; an organic solvent in a range of about 0.1 weight% to about 10 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 10 weight%. A remainder of the cleaning composition may include water, for example, deionized water (DIW).
In some embodiments, the cleaning composition may include, with respect to 100 weight% of the cleaning composition: an alkali in a range of about 5 weight% to about 20 weight%; a surfactant in a range of about 2 weight% to about 5 weight%; a chelating agent in a range of about 3 weight% to about 8 weight%; an organic solvent in a range of about 3 weight% to about 8 weight%; and a dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%.
[Dispersion Stabilizer]
The dispersion stabilizer may have a structure of Formula (1) below.
<Formula (1)>
(where "n" is an integer of 10 to 5,000, "M
+" is a positive ion of an alkali metal or an alkaline earth metal, and "R
-" is O
- or COO
-)
In some embodiments, the dispersion stabilizer may have a structure of Formula (1-1) below.
<Formula (1-1)>
(where "n" is an integer of 50 to 1,000 and "M" is sodium or potassium)
More particularly, the dispersion stabilizer may include at least one of the structures listed in Formula (1-2) below.
<Formula (1-2)>
It is presumed that the dispersion stabilizer removes a particle through attachment of the moiety of -R
-M
+ to the particle. That is, it is assumed that since moieties of -R
-M
+ may attach to a particle, the particle may be easily removed from a surface of a glass article. However, the disclosure is not limited by this theory.
When the cleaning composition is used to clean a glass article, if the content of the dispersion stabilizer is too small, it may lack the ability to prevent a particle from being reattached to a glass article such as a glass substrate. On the other hand, if the content of the dispersion stabilizer is too large, it may be economically disadvantageous.
[Surfactant]
The surfactant may include at least one selected from the group consisting of polyoxyalkylene alkyl phenol ether, polyoxyalkylene aryl phenol ether, polyoxyalkylene fatty acid ester, polyoxyalkylene sorbitan fatty acid ester, polyoxyalkylene alkylamine, sorbitan fatty acid ester, polyalkyl glucoside, alkyl alcohol amine, and aryl alcohol amine.
In some embodiments, the surfactant may have a structure of Formula (2) below.
<Formula (2)>
CS-(EOS)
a-(POS)
b
(where a segment represented by "CS" is a straight-chain hydrocarbon of a carbon number of 10 to 14, a segment represented by "EOS" is ethylene oxide, a segment represented by "POS" is propylene oxide, EOS and POS each form a block or alternate with each other, and a:b is 7:3 to 9.5:0.5)
Herein, the segment of ethylene oxide represents a repeating unit derived from ethylene oxide, and the segment of propylene oxide represents a repeating unit derived from propylene oxide.
In the surfactant of Formula (2), the CS may be any one of decyl, undecyl, lauryl, tridecyl, and tetradecyl. In some embodiments, in the surfactant of Formula (2), the CS may have a carbon number of 11 to 13 and it may be, for example, a straight-chain hydrocarbon having a carbon number of 12.
In Formula (2), although the EOS and the POS are represented as forming their respective blocks, the EOS and the POS may not need to form their respective blocks. Therefore, as for a denotation of -(EOS)
a-(POS)
b in Formula (2), like -(EOS)
2-(POS)-(EOS)
5-(POS)
2-, -(EOS)-(POS)
2-(EOS)
6-(POS)-, and -(EOS)
9-(POS)-(EOS)-(POS)-, one or more POSs may be interposed between two EOSs, and one or more EOSs may be interposed between two POSs.
Herein, "a" and "b", which represent the numbers of their corresponding repetition units, may form a predetermined ratio, and a:b may be, for example, 7:3 to 9.5:0.5 or 8.5:1.5 to 9.3:0.7. If a:b becomes too small (that is, if a fraction of the POS among the EOS and the POS becomes too high), a phase inversion temperature (PIT) may decrease, and thus the cleaning power may degrade. On the other hand, if a:b becomes too large (that is, if a fraction of the POS among the EOS and the POS becomes too low), bubbles may be generated excessively in a cleaning process.
[Alkali]
The alkali may include, for example, but is not limited to, at least one selected from the group consisting of sodium hydroxide (NaOH), potassium hydroxide (KOH), magnesium hydroxide (Mg(OH)
2), calcium hydroxide (Ca(OH)
2), ammonia (NH
3), tetraethylammonium hydroxide, tetramethylammonium hydroxide, aminoethoxy ethanol, triethanolamine, diethanolamine, monoethanolamine, ammonium hydroxide, tetrapropylammonium hydroxide, butyl ammonium hydroxide, and choline hydroxide.
A hydroxy group of the alkali may disassemble an organic chain such that it may be efficiently removed. Also, in the case of a glass particle to be removed, a hydroxy group may finely etch a contact region between the glass particle and the glass substrate (that is, change a silicon dioxide state into a silicic acid state) such that the glass particle may be easily detached. Therefore, if the alkali content is too small, the cleaning power may be insufficient. On the other hand, if the alkali content is too large, it may be harmful to the environment.
[Chelating Agent]
The chelating agent may remove a metal material among contaminants; however, the disclosure is not limited thereto.
The chelating agent may include: at least one selected from the group consisting of potassium pyrophosphate, calcium carbonate, sodium carbonate, sodium silicate, sodium gluconate, citric acid, salicylic acid, malonic acid, succinic acid, glutaric acid, pyrophosphoric acid, polyphosphoric acid, benzotriazole, sorbitol, glucose, carboxylic benzotriazole, and tolyltriazole.
In some embodiments, the chelating agent may include diethylene triamine pentaacetic acid (DTPA) (CAS No.: 67-43-6), nitrilo-2,2',2"-triacetic acid (NTA) (CAS No.: 139-13-9), ethylenedinitrilo tetraacetic acid (EDTA) (CAS No.: 60-00-4), or a metal salt thereof. In this case, the metal salt may include a potassium salt or a sodium salt.
The chelating agents may be used alone or together. For example, a mixture of about 2 weight% to about 7 weight% of NTA and about 1 weight% to about 6 weight% of DTPA may be used as the chelating agent with respect to 100 weight% of the cleaning composition.
If the content of the chelating agents is too low, metal contaminants may be insufficiently removed. On the other hand, if the content of the chelating agents is too high, the phase of a cleaning may become unstable, the production cost may increase, and a T-N value may increase, and thus, there may be a possibility of an environmental problem.
[Organic Solvent]
As the organic solvent, organic solvents such as alcohols, alcohol amines, ketones, esters, and amides may be used; however, the disclosure is not limited thereto.
Alcohols used as the organic solvent may include at least one selected from the group consisting of ethanol, propanol, butanol, hexanol, heptanol, octanol, decanol, isopropanol, isohexanol, isooctanol, isodecanol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol methyl ether, diethylene glycol methyl ether, triethylene glycol methyl ether, ethylene glycol ethyl ether, diethylene glycol ethyl ether, triethylene glycol ethyl ether, ethylene glycol monopropyl ether, diethylene glycol monopropyl ether, triethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol dibutyl ether, diethylene glycol dibutyl ether, triethylene glycol dibutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, and triethylene glycol monohexyl ether.
Alcohol amines used as the organic solvent may include at least one selected from the group consisting of monoethanol amine (MEA), diethanol amine (DEA), triethanol amine (TEA), N-ethyldiethanolamine, N,N-diethylethanolamine, and triisopropanolamine.
The ketones used as the organic solvent may include at least one selected from the group consisting of acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, and cyclohexanone.
The esters used as the organic solvent may include at least one selected from the group consisting of ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, alkyl esters, methyl lactate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-methoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl carbitol acetate, butyl carbitol acetate, and γ-butyrolactone.
The amides used as the organic solvent may include at least one selected from the group consisting of N,N-dimethylformamide, N-methylpyrrolidone, and N,N-dimethylacetamide.
In some embodiments, the organic solvent may include a mixture of TEA and MEA. In this case, a weight ratio of TEA to MEA may be about 7:3 to about 9:1. If the weight ratio of TEA to MEA is out of the above range, the cleaning composition may change in color when left for a long time.
[Other Ingredients]
According to embodiments, the cleaning composition may further include a phase stabilizer, a buffer, and a bleacher, in addition to the above ingredients.
(1) Phase Stabilizer
A fatty acid or a metal salt thereof may be used as the phase stabilizer. For example, a sodium salt or a potassium salt of a fatty acid of a carbon number of 5 to 15 may be used. However, the disclosure is not limited thereto.
The content of the phase stabilizer may be in a range of about 2 weight% to about 8 weight% with respect to 100 weight% of the cleaning composition. If the content of the phase stabilizer is too small, the phase stabilizer may not function to prevent phase separation. Also, if the content of the phase stabilizer is too large, the cleaning power of the cleaning composition may be weakened.
(2) Bleacher
For example, NaOCl may be used as the bleacher; however, the disclosure is not limited thereto.
The content of the bleacher may be in a range of about 0.1 weight% to about 1 weight% with respect to 100 weight% of the cleaning composition. If the content of the bleacher is too small, the organic material removal efficiency may degrade. Also, if the content of the bleacher is too large, the amount of the active oxygen may increase, and thus the cleaning power may be weakened.
(3) Buffer
For example, K
2CO
3 may be used as a buffer material; however, the disclosure is not limited thereto.
The content of the buffer may be in a range of about 0.2 weight% to about 2 weight% with respect to 100 weight% of the cleaning composition. If the content of the buffer is too small, the pH of the cleaning composition may become unstable. Also, if the content of the buffer is too large, it may be out of the range of pH suitable for cleaning.
Hereinafter, the configuration and effect of the disclosure will be described in more detail with reference to particular embodiments and comparative examples; however, these embodiments are just intended to provide a clearer understanding of the disclosure, and are not intended to limit the scope thereof.
[Example 1 - Production of Cleaning Composition]
A cleaning composition with the following composition was produced (weight% is based on a total weight of the cleaning composition).
(1) 10 weight% of alkali (5 weight% of KOH 5, 5 weight% of NaOH)
(2) 3 weight% of surfactant (C12-(EOS)
9-(POS)
1)
(3) 5 weight% of chelating agent (2 weight% of calcium carbonate, 3 weight% of sodium carbonate)
(4) 5 weight% of organic solvent (2 weight% of diethylene glycol, 3 weight% of triethylene glycol)
(5) 1 weight% of dispersion stabilizer (In Formula (1), n=150, and -COONa is used as -R
-M
+)
(6) Remainder deionized water
After the weight of each ingredient was quantified to provide the above composition, the ingredients were mixed at room temperature to produce the cleaning composition.
[Comparative Example 1 and Comparative Example 2]
The performances were compared by using two kinds of commercial cleaning compositions (LGL200, Parker225X) that are currently used to clean glass substrates.
[Organic Material Removability Test 1]
First, in order to produce a glass substrate sample with a surface contaminated with organic matter, an adhesive tape was attached to a surface of a glass substrate sample (100 mm x 100 mm), and the adhesive tape was removed after 1 hour by applying a force vertical to the surface of the glass substrate sample. In this way, 60 glass substrate samples having surfaces contaminated with adhesive organic ingredients were prepared.
Thereafter, by using the cleaning composition of Example 1, the contact angles of 20 glass substrate samples before and after cleaning were measured. With respect to each glass substrate sample, the contact angle for a water droplet was measured, and the contact angle was measured again after the glass substrate samples were cleaned with the cleaning composition. The average of contact angles before cleaning was calculated, and the average of contact angles after cleaning was calculated.
Also, by using the cleaning composition of Comparative Example 1 with respect to other 20 glass substrate samples and using the cleaning composition of Comparative Example 2 with respect to the other 20 glass substrate samples, the average of contact angles before/after cleaning was calculated in the same way.
FIG. 1 is a graph illustrating changes in contact angles between before and after cleaning using cleaning compositions of Example 1, Comparative Example 1, and Comparative Example 2.
Referring to FIG. 1, the average contact angles before the cleaning using the cleaning compositions of Comparative Examples 1 and 2 were respectively 69° and 76°, and the average contact angles after the cleaning were respectively 30° and 29°. That is, the degrees of reduction of the average contact angles between before and after the cleaning were respectively 39° and 47°.
On the other hand, the average contact angle before the cleaning using the cleaning composition of Example 1 was 75°, and the average contact angle after the cleaning was 21°. That is, the degree of reduction of the average contact angle between before and after the cleaning was 54°.
Thus, it may be seen that the cleaning composition of Example 1 exhibited excellent organic matter removability since the degree of change of the average contact angle was remarkably large.
[Glass Particle Removability Force Test 1]
First, in order to produce a glass substrate sample with a surface contaminated with glass particles, fine glass particles were applied to a surface of a glass substrate sample (100mm x 100mm). For this purpose, fine glass particles were dispersed in ethanol, and then the surface of the glass substrate sample was coated by a spin-coating method. Thereafter, drying was performed to sufficiently remove the ethanol. In this way, 60 glass substrate samples having surfaces contaminated with glass particles were prepared.
Thereafter, by using the cleaning composition of Example 1, the glass particle removal rates of 20 glass substrate samples before/after cleaning were measured. Glass particle removal rates were measured with respect to 9 points of each glass substrate sample, and an average value thereof was defined as a glass particle removal rate of the glass substrate sample. Also, a glass particle removal rate was measured with respect to each of 20 glass substrate samples, and then an average value thereof was defined as a glass particle removal rate of the cleaning composition of Example 1.
Also, by using the cleaning composition of Comparative Example 1 with respect to another 20 glass substrate samples and using the cleaning composition of Comparative Example 2 with respect to the remaining 20 glass substrate samples, the average of glass particle removal rates before/after cleaning was calculated in the same way.
FIG. 2 is a graph illustrating averages of glass particle removal rates when cleaning is performed by using cleaning compositions of Example 1, Comparative Example 1, and Comparative Example 2.
Referring to FIG. 2, when the cleaning compositions of Comparative Examples 1 and 2 were used, the glass particle removal rates were 8.60% (Comparative Example 1) and 14.77% (Comparative Example 2).
On the other hand, when the cleaning composition of Example 1 was used, the glass particle removal rate was 17.07%.
Thus, it may be seen that the cleaning composition of Example 1 exhibited excellent glass particle removability because the glass particle removal rate was relatively large.
[Line Application Test 1]
A change in the number of particles in the case of applying the cleaning composition of Example 1 to a production line was measured and is illustrated in FIG. 3. FIG. 3 illustrates time-dependent changes in the numbers of particles before and after the application of a cleaning composition of Example 1 and after the re-application of a conventional cleaning composition. Here, the number of particles refers to the number of particles having a diameter of 0.3 micrometers (μm) or greater.
Referring to FIG. 3, in comparison with the average number of particles (represented by a horizontal dashed line) in the case of applying the cleaning composition of Comparative Example 1, the average number of particles (represented by a horizontal dashed line) in the case of applying the cleaning composition of Example 1 was reduced by about 16%.
Thus, it may be seen that the number of particles may also be effectively reduced in an actual process when the cleaning composition is applied.
[Line Application Test 2]
A change in the number of particles in the case of applying the cleaning composition of Example 1 to a production line was continuously measured, and is illustrated in FIG. 4. FIG. 4 illustrates a continuous time-dependent change in the number of particles during the application of the cleaning composition of Example 1 (a shaded portion).
In FIG. 4, a continuous graph represents the result of total inspection of the number of particles in all articles, and square points represent the result of sample inspection of the number of particles in an article at a corresponding time point. It is determined that the inspection of the number of particles is substantially accurately performed because the result of the sample inspection and the result of the total inspection in a time period of applying the cleaning composition of Example 1 (the shaded portion) show substantially the same trend.
Also, as a result of calculating an overall average, from the result of performing the sample inspection (square points), it is seen that the number of particles in the case of using the cleaning composition of Example 1 was reduced by about 15% in comparison with the case of using a conventional cleaning composition. Also, from the result of performing the total inspection (the black line), it is seen that the number of particles in the case of using the cleaning composition of Example 1 was reduced by about 17% in comparison with the case of using a conventional cleaning composition.
Thus, it may be seen that the number of particles may also be effectively reduced in an actual process when the cleaning composition is applied.
[Comparative Example 3]
A cleaning composition was produced in the same way as in Example 1, with the exception that a material having a structure of Formula (3) below was used as a dispersion stabilizer.
<Formula (3)>
[Example 2]
A cleaning composition was produced in the same way as in Example 1, with the exception that a material having a structure of Formula (1-3) below was used as a dispersion stabilizer.
<Formula (1-3)>
[Glass Particle Removability Test 2]
A glass particle removability test was performed by using the cleaning compositions of Example 1, Example 2, and Comparative Example 3. A test method was the same as in Glass Particle Removability Test 1.
As a result, it is seen that a glass particle removal rate was 11.91% in the case of using the cleaning composition of Comparative Example 3, whereas a glass particle removal rate was 18.11% in the case of using the cleaning composition of Example 1 and a glass particle removal rate was 16.53% in the case of using the cleaning composition of Example 2.
Thus, it is seen that it is advantageous to use the dispersion stabilizer of the disclosure, in which a -COO
-Na
+ group is attached directly to a main chain, in order to remove glass particles. Also, it may be seen that the dispersion stabilizer of Example 1 has a higher glass particle removal rate than the dispersion stabilizer of Example 2.
[Example 3]
A cleaning composition was produced in the same way as in Example 1, with the exception that a:b in a surfactant was adjusted to 7.5:2.5.
[Example 4]
A cleaning composition was produced in the same way as in Example 1, with the exception that a:b in a surfactant was adjusted to 7:3.
[Comparative Example 4]
A cleaning composition was produced in the same way as in Example 1, with the exception that a:b in a surfactant was adjusted to 6.5:3.5.
[Organic Matter Removal Force Test 2]
By using the cleaning compositions of Example 1, Example 3, Example 4, and Comparative Example 4, a contact angle change was measured in the same way as in Organic Matter Removability Force Test 1, and the measurement results are illustrated in Table 1 below.
| a:b | Before Cleaning | After Cleaning | Contact Angle Reduction | |
| Example 1 | 9:1 | 75 | 21 | 54 |
| Example 3 | 7.5:2.5 | 69 | 17 | 52 |
| Example 4 | 7:3 | 74 | 23 | 51 |
| Comparative Example 4 | 6.5:3.5 | 72 | 24 | 48 |
Referring to Table 1, it may be seen that a contact angle reduction effect of the cleaning compositions of Examples 1, 3, and 4 is greater than a contact angle reduction effect of the cleaning composition of Comparative Example 4. In other words, it is seen that an organic matter removal effect of the cleaning compositions of Examples 1, 3, and 4 is greater than an organic matter removal effect of the cleaning composition of Comparative Example 4.
In addition, it is seen that an organic matter removal effect of the cleaning composition of Example 1 is greater than an organic matter removal effect of the cleaning composition of Examples 3 and 4.
[Example 5]
A cleaning composition was produced in the same way as in Example 1, with the exception that 2 weight% of Na salt of NTA and 3 weight% of Na salt of DTPA were used as a chelating agent instead of 2 weight% of calcium carbonate and 3 weight% of sodium carbonate.
[Example 6]
A cleaning composition was produced in the same way as in Example 1, with the exception that 3 weight% of polyoxymethylene ethylphenol ether was used as a surfactant instead of 3 weight% of C12-(EOS)
9-(POS)
1.
[Example 7]
A cleaning composition was produced in the same way as in Example 1, with the exception that 4 weight% of TEA and 1 weight% of MEA were used as an organic solvent instead of 2 weight% of diethylene glycol and 3 weight% of triethylene glycol.
[Example 8]
A cleaning composition was produced in the same way as in Example 1, with the exception that 2 weight% of potassium pyrophosphate and 3 weight% of sorbitol were used as a chelating agent instead of 2 weight% of calcium carbonate and 3 weight% of sodium carbonate.
[Example 9]
A cleaning composition was produced in the same way as in Example 1, with the exception that 3 weight% of polypropyl glucoside was used as a surfactant instead of 3 weight% of C12-(EOS)
9-(POS)
1.
Although the embodiments of the disclosure have been described above in detail, those of ordinary skill in the art will understand that various changes may be made therein without departing from the spirit and scope thereof as defined by the following claims.
It should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments.
While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the following claims.
Claims (13)
- A cleaning composition for cleaning a glass article, the cleaning composition comprising, with respect to 100 weight% of the cleaning composition:an alkali in a range of about 1 weight% to about 20 weight%;a surfactant in a range of about 0.1 weight% to about 10 weight%;a chelating agent in a range of about 0.1 weight% to about 10 weight%;an organic solvent in a range of about 0.1 weight% to about 10 weight%; anda dispersion stabilizer in a range of about 0.1 weight% to about 10 weight%,wherein the dispersion stabilizer has a structure of Formula (1) below:<Formula (1)>
where "n" is an integer of 10 to 5,000, "M +" is a positive ion of an alkali metal or an alkaline earth metal, and "R -" is O - or COO -. - The cleaning composition of claim 1, wherein the cleaning composition comprises, with respect to 100 weight% of the cleaning composition:an alkali in a range of about 5 weight% to about 20 weight%;a surfactant in a range of about 2 weight% to about 5 weight%;a chelating agent in a range of about 3 weight% to about 8 weight%;an organic solvent in a range of about 3 weight% to about 8 weight%; anda dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%.
- The cleaning composition of claim 1, wherein the dispersion stabilizer has a structure of Formula (1-1) below:<Formula (1-1)>
where "n" is an integer of 50 to 1,000 and "M" is sodium or potassium. - The cleaning composition of claim 1, wherein the surfactant comprises at least one selected from the group consisting of polyoxyalkylene alkyl phenol ether, polyoxyalkylene aryl phenol ether, polyoxyalkylene fatty acid ester, polyoxyalkylene sorbitan fatty acid ester, polyoxyalkylene alkylamine, sorbitan fatty acid ester, polyalkyl glucoside, alkyl alcohol amine, and aryl alcohol amine.
- The cleaning composition of claim 1, wherein the surfactant has a structure of Formula (2) below:< Formula (2)>CS-(EOS) a-(POS) bwhere a segment represented by "CS" is a straight-chain hydrocarbon having a carbon number of 10 to 14, a segment represented by "EOS" is ethylene oxide, a segment represented by "POS" is propylene oxide, EOS and POS each form a block or alternate with each other, and a:b is 7:3 to 9.5:0.5.
- The cleaning composition of claim 5, wherein the segment represented by CS is a straight-chain hydrocarbon having a carbon number of 12, and a:b is 8.5:1.5 to 9.3:0.7.
- The cleaning composition of claim 1, wherein the alkali comprises at least one selected from the group consisting of sodium hydroxide (NaOH), potassium hydroxide (KOH), magnesium hydroxide (Mg(OH) 2), calcium hydroxide (Ca(OH) 2), ammonia (NH 3), tetraethylammonium hydroxide, tetramethylammonium hydroxide, aminoethoxy ethanol, triethanolamine, diethanolamine, monoethanolamine, ammonium hydroxide, tetrapropylammonium hydroxide, butyl ammonium hydroxide, and choline hydroxide.
- The cleaning composition of claim 1, wherein the chelating agent comprises:at least one selected from the group consisting of potassium pyrophosphate, calcium carbonate, sodium carbonate, sodium silicate, sodium gluconate, citric acid, salicylic acid, malonic acid, succinic acid, glutaric acid, pyrophosphoric acid, polyphosphoric acid, benzotriazole, sorbitol, glucose, carboxylic benzotriazole, and tolyltriazole; ornitrilo-2,2',2"-triacetic acid (NTA), diethylene triamine pentaacetic acid (DTPA), ethylenedinitrilo tetraacetic acid (EDTA), or a metal salt thereof,wherein the metal salt comprises a potassium salt or a sodium salt.
- The cleaning composition of claim 8, wherein the chelating agent comprises a metal salt in a range of about 2 weight% to about 7 weight% of NTA and a metal salt in a range of about 1 weight% to about 6 weight% of DTPA, with respect to 100 weight% of the cleaning composition.
- A cleaning composition for cleaning a glass article, the cleaning composition comprising, with respect to 100 weight% of the cleaning composition:an alkali in a range of about 5 weight% to about 20 weight%;a surfactant in a range of about 2 weight% to about 5 weight%;a chelating agent in a range of about 3 weight% to about 8 weight%;an organic solvent in a range of about 3 weight% to about 8 weight%; anda dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%,wherein the surfactant has a structure of Formula (2) below:<Formula (2)>CS-(EOS) a-(POS) bwhere a segment represented by "CS" is a straight-chain hydrocarbon of a carbon number of 10 to 14, a segment represented by "EOS" is ethylene oxide, a segment represented by "POS" is propylene oxide, EOS and POS each form a block or alternate with each other, and a:b is 7:3 to 9.5:0.5.
- A method of cleaning a glass substrate, the method comprising:supplying a cleaning composition onto a glass substrate;cleaning a surface of the glass substrate by using a frictional cleaning unit with the cleaning composition contacting the glass substrate; andremoving the cleaning composition from the glass substrate,wherein the cleaning composition comprises, with respect to 100 weight% of the cleaning composition:an alkali in a range of about 5 weight% to about 20 weight%;a surfactant in a range of about 2 weight% to about 5 weight%;a chelating agent in a range of about 3 weight% to about 8 weight%;an organic solvent in a range of about 3 weight% to about 8 weight%; anda dispersion stabilizer in a range of about 0.1 weight% to about 3 weight%.
- The method of claim 11, wherein the dispersion stabilizer has a structure of Formula (1) below:<Formula (1)>
where "n" is an integer of 10 to 5,000, "M +" is a positive ion of an alkali metal or alkaline earth metal, and "R -" is O - or COO -. - The method of claim 11, wherein the surfactant has a structure of Formula (2) below:<Formula (2)>CS-(EOS) a-(POS) bwhere a segment represented by "CS" is a straight-chain hydrocarbon having a carbon number of 10 to 14, a segment represented by "EOS" is ethylene oxide, a segment represented by "POS" is propylene oxide, EOS and POS each form a block or alternate with each other, and a:b is 7:3 to 9.5:0.5.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201880062884.XA CN111278962A (en) | 2017-08-29 | 2018-08-29 | Cleaning composition for cleaning glass article and method for cleaning glass substrate using the same |
| JP2020534791A JP2020532642A (en) | 2017-08-29 | 2018-08-29 | A cleaning composition for cleaning glass articles and a method for cleaning a glass substrate using the same. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0109487 | 2017-08-29 | ||
| KR1020170109487A KR20190023558A (en) | 2017-08-29 | 2017-08-29 | Composition for cleaning a glass article and cleaning method of glass substrate using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019045449A1 true WO2019045449A1 (en) | 2019-03-07 |
Family
ID=65527780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2018/009991 WO2019045449A1 (en) | 2017-08-29 | 2018-08-29 | Cleaning composition for cleaning glass article and method of cleaning glass substrate using the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2020532642A (en) |
| KR (1) | KR20190023558A (en) |
| CN (1) | CN111278962A (en) |
| TW (1) | TW201920638A (en) |
| WO (1) | WO2019045449A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110484379A (en) * | 2019-09-05 | 2019-11-22 | 广东荣强化学有限公司 | A kind of mobile phone glass cleansing composition and preparation method thereof |
| CN114845966A (en) * | 2020-03-25 | 2022-08-02 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110606666A (en) * | 2019-08-28 | 2019-12-24 | 晟光科技股份有限公司 | Industrial control LCD display panel coating process and cleaning method thereof |
| KR102295216B1 (en) * | 2021-03-02 | 2021-09-01 | 회명산업 주식회사 | Metal mask detergent composition and the method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05229853A (en) * | 1992-02-19 | 1993-09-07 | Yokohama Yushi Kogyo Kk | Composition for removing water-repellent silicone coating film on glass surface |
| JP2008007617A (en) * | 2006-06-29 | 2008-01-17 | Sanyo Chem Ind Ltd | Low foaming surfactant for alkaline cleaning agent |
| KR20100040260A (en) * | 2008-10-09 | 2010-04-19 | 간토 가가꾸 가부시키가이샤 | Alkaline aqueous solution composition for treating a substrate |
| KR20110121122A (en) * | 2010-04-30 | 2011-11-07 | 동우 화인켐 주식회사 | A detergent composition for a glass substrate of flat panel display device |
| KR20170029226A (en) * | 2015-09-07 | 2017-03-15 | 유수열 | Cleaning solution composition for display window glass |
-
2017
- 2017-08-29 KR KR1020170109487A patent/KR20190023558A/en unknown
-
2018
- 2018-08-29 WO PCT/KR2018/009991 patent/WO2019045449A1/en active Application Filing
- 2018-08-29 CN CN201880062884.XA patent/CN111278962A/en active Pending
- 2018-08-29 JP JP2020534791A patent/JP2020532642A/en active Pending
- 2018-08-29 TW TW107130111A patent/TW201920638A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05229853A (en) * | 1992-02-19 | 1993-09-07 | Yokohama Yushi Kogyo Kk | Composition for removing water-repellent silicone coating film on glass surface |
| JP2008007617A (en) * | 2006-06-29 | 2008-01-17 | Sanyo Chem Ind Ltd | Low foaming surfactant for alkaline cleaning agent |
| KR20100040260A (en) * | 2008-10-09 | 2010-04-19 | 간토 가가꾸 가부시키가이샤 | Alkaline aqueous solution composition for treating a substrate |
| KR20110121122A (en) * | 2010-04-30 | 2011-11-07 | 동우 화인켐 주식회사 | A detergent composition for a glass substrate of flat panel display device |
| KR20170029226A (en) * | 2015-09-07 | 2017-03-15 | 유수열 | Cleaning solution composition for display window glass |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110484379A (en) * | 2019-09-05 | 2019-11-22 | 广东荣强化学有限公司 | A kind of mobile phone glass cleansing composition and preparation method thereof |
| CN114845966A (en) * | 2020-03-25 | 2022-08-02 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111278962A (en) | 2020-06-12 |
| TW201920638A (en) | 2019-06-01 |
| JP2020532642A (en) | 2020-11-12 |
| KR20190023558A (en) | 2019-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2019045449A1 (en) | Cleaning composition for cleaning glass article and method of cleaning glass substrate using the same | |
| US6475966B1 (en) | Plasma etching residue removal | |
| EP1043629B1 (en) | Photoresist stripping composition and process for stripping photoresist | |
| WO2017026803A1 (en) | Photoresist stripping solution composition for lcd manufacturing | |
| WO2011019189A2 (en) | Resist stripping solution composition, and method for stripping resist by using same | |
| WO2011008051A2 (en) | Composition for removing resists used with copper or copper alloy | |
| WO2018070837A1 (en) | Etching solution composition | |
| KR102032321B1 (en) | A resist stripper composition for preventing unevenness | |
| KR20060043033A (en) | Non-aqueous microelectronic cleaning compositions containing fructose | |
| KR100268108B1 (en) | A composition for stripping photoresist | |
| JP2008286881A (en) | Photoresist stripping agent composition | |
| WO2011037300A1 (en) | Photoresist stripper composition and photoresist peeling method employing same | |
| WO2011065603A1 (en) | Photoresist stripper composition, and method of stripping photoresist using same | |
| US6815150B2 (en) | Photoresist stripping composition and process for stripping resist | |
| WO2011031089A2 (en) | Cleaning solution composition | |
| WO2011014027A2 (en) | Cleaning fluid composition and a cleaning method for a panel using the same | |
| WO2010143794A1 (en) | Etching paste having doping function, and formation method of selective emitter of solar cell using same | |
| WO2018030703A1 (en) | Nano protrusion surface forming method and base material having nano protrusion surface formed by method | |
| JPH05281753A (en) | Peeling agent composition | |
| JP5885043B1 (en) | Resist stripper and method for producing the same | |
| KR101758051B1 (en) | Stripping composition for color filter | |
| WO2023018072A1 (en) | Resist stripper composition and pattern formation method using same | |
| KR101392551B1 (en) | Stripper composition for removal photoresist residue and stripping method of photoresists using the same | |
| KR100568558B1 (en) | Photoresist stripper composition for copper tft | |
| KR100876067B1 (en) | Methods and compositions for inhibiting sodium adsorption onto integrated circuit surfaces |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18852296 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2020534791 Country of ref document: JP Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 18852296 Country of ref document: EP Kind code of ref document: A1 |