CN111278962A - Cleaning composition for cleaning glass article and method for cleaning glass substrate using the same - Google Patents
Cleaning composition for cleaning glass article and method for cleaning glass substrate using the same Download PDFInfo
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- CN111278962A CN111278962A CN201880062884.XA CN201880062884A CN111278962A CN 111278962 A CN111278962 A CN 111278962A CN 201880062884 A CN201880062884 A CN 201880062884A CN 111278962 A CN111278962 A CN 111278962A
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- Prior art keywords
- cleaning composition
- range
- cleaning
- formula
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- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 169
- 239000000203 mixture Substances 0.000 title claims abstract description 127
- 239000011521 glass Substances 0.000 title claims abstract description 85
- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000003381 stabilizer Substances 0.000 claims abstract description 39
- 239000006185 dispersion Substances 0.000 claims abstract description 32
- 239000004094 surface-active agent Substances 0.000 claims abstract description 31
- 239000002738 chelating agent Substances 0.000 claims abstract description 24
- 239000003960 organic solvent Substances 0.000 claims abstract description 23
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 239000002585 base Substances 0.000 claims description 15
- -1 aryl phenol ethers Chemical class 0.000 claims description 14
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- 229910052751 metal Chemical class 0.000 claims description 12
- 239000002184 metal Chemical class 0.000 claims description 12
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 11
- 150000003839 salts Chemical class 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 229960003330 pentetic acid Drugs 0.000 claims description 10
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 9
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000004215 Carbon black (E152) Substances 0.000 claims description 8
- 229930195733 hydrocarbon Natural products 0.000 claims description 8
- 150000002430 hydrocarbons Chemical class 0.000 claims description 8
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 5
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 239000011591 potassium Substances 0.000 claims description 5
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 4
- 150000001768 cations Chemical class 0.000 claims description 4
- 150000002170 ethers Chemical class 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 239000000600 sorbitol Substances 0.000 claims description 4
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 4
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- HMBHAQMOBKLWRX-UHFFFAOYSA-N 2,3-dihydro-1,4-benzodioxine-3-carboxylic acid Chemical compound C1=CC=C2OC(C(=O)O)COC2=C1 HMBHAQMOBKLWRX-UHFFFAOYSA-N 0.000 claims description 3
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 claims description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- 150000003973 alkyl amines Chemical class 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- NWEKXBVHVALDOL-UHFFFAOYSA-N butylazanium;hydroxide Chemical compound [OH-].CCCC[NH3+] NWEKXBVHVALDOL-UHFFFAOYSA-N 0.000 claims description 3
- 235000010216 calcium carbonate Nutrition 0.000 claims description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 229940075419 choline hydroxide Drugs 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- 229930182470 glycoside Natural products 0.000 claims description 3
- 150000002338 glycosides Chemical class 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 3
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 3
- 229940005657 pyrophosphoric acid Drugs 0.000 claims description 3
- 229960004889 salicylic acid Drugs 0.000 claims description 3
- 239000003352 sequestering agent Substances 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- 159000000000 sodium salts Chemical class 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- 235000019794 sodium silicate Nutrition 0.000 claims description 3
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 3
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 3
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 3
- 229960003563 calcium carbonate Drugs 0.000 claims 1
- 229960004106 citric acid Drugs 0.000 claims 1
- 229940098424 potassium pyrophosphate Drugs 0.000 claims 1
- 229940032158 sodium silicate Drugs 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 54
- 238000011109 contamination Methods 0.000 abstract description 7
- 230000000052 comparative effect Effects 0.000 description 27
- 208000009766 Blau syndrome Diseases 0.000 description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 230000008859 change Effects 0.000 description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000007844 bleaching agent Substances 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 5
- 239000000872 buffer Substances 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003568 Sodium, potassium and calcium salts of fatty acids Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000007853 buffer solution Substances 0.000 description 2
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 2
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 2
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 2
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- RGICCULPCWNRAB-UHFFFAOYSA-N 2-[2-(2-hexoxyethoxy)ethoxy]ethanol Chemical compound CCCCCCOCCOCCOCCO RGICCULPCWNRAB-UHFFFAOYSA-N 0.000 description 1
- KCBPVRDDYVJQHA-UHFFFAOYSA-N 2-[2-(2-propoxyethoxy)ethoxy]ethanol Chemical compound CCCOCCOCCOCCO KCBPVRDDYVJQHA-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- ACQVEWFMUBXEMR-UHFFFAOYSA-N 4-bromo-2-fluoro-6-nitrophenol Chemical compound OC1=C(F)C=C(Br)C=C1[N+]([O-])=O ACQVEWFMUBXEMR-UHFFFAOYSA-N 0.000 description 1
- PCWGTDULNUVNBN-UHFFFAOYSA-N 4-methylpentan-1-ol Chemical compound CC(C)CCCO PCWGTDULNUVNBN-UHFFFAOYSA-N 0.000 description 1
- BWDBEAQIHAEVLV-UHFFFAOYSA-N 6-methylheptan-1-ol Chemical compound CC(C)CCCCCO BWDBEAQIHAEVLV-UHFFFAOYSA-N 0.000 description 1
- PLLBRTOLHQQAQQ-UHFFFAOYSA-N 8-methylnonan-1-ol Chemical compound CC(C)CCCCCCCO PLLBRTOLHQQAQQ-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- AKNUHUCEWALCOI-UHFFFAOYSA-N N-ethyldiethanolamine Chemical compound OCCN(CC)CCO AKNUHUCEWALCOI-UHFFFAOYSA-N 0.000 description 1
- 229910019093 NaOCl Inorganic materials 0.000 description 1
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- WVPMEZSWYJEBNP-UHFFFAOYSA-N ethyl 2-methoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OC WVPMEZSWYJEBNP-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 1
- XPIWVCAMONZQCP-UHFFFAOYSA-N methyl 2-oxobutanoate Chemical compound CCC(=O)C(=O)OC XPIWVCAMONZQCP-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000013966 potassium salts of fatty acid Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 235000013875 sodium salts of fatty acid Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
- C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/08—Silicates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/10—Carbonates ; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2079—Monocarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2082—Polycarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/116—Deposition methods from solutions or suspensions by spin-coating, centrifugation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/18—Glass; Plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention provides a cleaning composition for cleaning glass products anda method for cleaning a glass substrate using the same. The cleaning composition comprises, relative to 100 wt% of the cleaning composition: a base in the range of about 1 wt% to about 20 wt%; a surfactant in the range of about 0.1 wt% to about 10 wt%; a chelating agent in the range of about 0.1 wt% to about 10 wt%; an organic solvent in the range of about 0.1 wt% to about 10 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 10 wt%, wherein the dispersion stabilizer has the structure of the following formula (1). The cleaning composition can effectively remove particle contamination and organic contamination on the surface of the glass substrate.
Description
Technical Field
This application claims the benefit of priority from korean application No. 10-2017-0109487, filed on 29/8/2017 under patent laws, and is in accordance with the contents of that application and is incorporated herein by reference in its entirety.
One or more embodiments relate to a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same, and more particularly, to a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same, which can effectively remove particle contamination and organic contamination of a glass substrate
Background
Various cleaning methods including physical methods and chemical methods have been used to manufacture glass substrates used in flat panel displays and the like. There is still a need for cleaning compositions with further improved cleaning capabilities to remove particulate contamination and organic contaminants on the surface of glass substrates.
Disclosure of Invention
One or more embodiments include a cleaning composition for cleaning a glass article and a method of cleaning a glass substrate using the same, which can effectively remove particle contamination and organic contaminants on the surface of the glass substrate.
Additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the presented embodiments.
According to one or more aspects, a cleaning composition for cleaning a glass article, the cleaning composition comprising, relative to 100 wt% of the cleaning composition: a base in the range of about 1 wt% to about 20 wt%; a surfactant in the range of about 0.1 wt% to about 10 wt%; a chelating agent in the range of about 0.1 wt% to about 10 wt%; an organic solvent in the range of about 0.1 wt% to about 10 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 10 wt%, wherein the dispersion stabilizer has the structure of the following formula (1).
< formula (1) >
Wherein "n" is an integer of 10 to 5,000 and "M" is+"is a cation of an alkali metal or alkaline earth metal, and" R－Is "O－Or COO－。
In some embodiments, the cleaning composition may include, relative to 100 wt% of the cleaning composition: a base in the range of about 5 wt% to about 20 wt%; a surfactant in the range of about 2 wt% to about 5 wt%; a chelating agent in the range of about 3 wt% to about 8 wt%; an organic solvent in the range of about 3 wt% to about 8 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%.
In this case, the dispersion stabilizer may have a structure represented by the following formula (1-1).
< formula (1-1) >
Wherein "n" is an integer of 50 to 1,000, and "M" is sodium or potassium.
In addition, the surfactant may include at least one selected from the group consisting of polyoxyalkylene alkylphenol ethers (polyoxyalkylenealkylphenol ethers), polyoxyalkylene aryl phenol ethers, polyoxyalkylene fatty acid esters, polyoxyalkylene sorbitan fatty acid esters, polyoxyalkylene alkylamines, sorbitan fatty acid esters, polyalkyl glycosides, alkanolamines, and aralkanolamines.
In some embodiments, the surfactant can have the structure of formula (2) below.
< formula (2) >
CS-(EOS)a-(POS)b
Wherein the chain segment represented by "CS" is straight chain hydrocarbon having 10 to 14 carbon atoms, the chain segment represented by "EOS" is ethylene oxide, the chain segment represented by "POS" is propylene oxide, the EOS and the POS form blocks or are mutually alternated, and a: b is 7:3 to 9.5: 0.5.
In particular, the segment represented by CS may be a straight-chain hydrocarbon having 12 carbon atoms, and a: b may be 8.5:1.5 to 9.3: 0.7.
In addition, the base may include one or more selected from sodium hydroxide (NaOH), potassium hydroxide (KOH), magnesium hydroxide (Mg (OH)2) Calcium hydroxide (Ca (OH)2) Ammonia (NH)3) At least one selected from the group consisting of tetraethylammonium hydroxide, tetramethylammonium hydroxide, aminoethoxyethanol, triethanolamine, diethanolamine, monoethanolamine, ammonium hydroxide, tetrapropylammonium hydroxide, butylammonium hydroxide and choline hydroxide.
The chelating agent may include: at least one selected from the group consisting of potassium pyrophosphate, calcium carbonate, sodium silicate, sodium gluconate, citric acid, salicylic acid, malonic acid, succinic acid, glutaric acid, pyrophosphoric acid, polyphosphoric acid, benzotriazole, sorbitol, glucose, carboxybenzotriazole, and tolyltriazole. In some embodiments, the chelating agent may comprise: nitro-2, 2', 2 "-triacetic acid (NTA), diethylenetriaminepentaacetic acid (DTPA), ethylenediaminetetraacetic acid (EDTA), or metal salts of the foregoing, and the metal salts may include potassium or sodium salts. At this time, the chelating agent may include a metal salt of NTA in a range of about 2 wt% to about 7 wt% and a metal salt of DTPA in a range of about 1 wt% to about 6 wt% with respect to 100 wt% of the cleaning composition.
In some embodiments, the cleaning composition may further comprise: bleaching agents, phase-fixing agents or buffers.
According to one or more aspects, a cleaning composition for cleaning a glass article, the cleaning composition comprising, relative to 100 wt% of the cleaning composition 100: a base in the range of about 5 wt% to about 20 wt%; a surfactant in the range of about 2 wt% to about 5 wt%; a chelating agent in the range of about 3 wt% to about 8 wt%; an organic solvent in the range of about 3 wt% to about 8 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%, wherein the surfactant has the structure of formula (2) above.
According to one or more aspects, a method of cleaning a glass substrate, the method comprising: supplying a cleaning composition onto a glass substrate; cleaning a surface of the glass substrate by using a friction cleaning unit in such a manner that the cleaning composition contacts the glass substrate; and removing the cleaning composition from the glass substrate. The cleaning composition may include, with respect to 100 wt% of the cleaning composition: a base in the range of about 5 wt% to about 20 wt%; a surfactant in the range of about 2 wt% to about 5 wt%; a chelating agent in the range of about 3 wt% to about 8 wt%; an organic solvent in the range of about 3 wt% to about 8 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%.
The dispersion stabilizer may have the structure of the above formula (1). Further, the surfactant may have the structure of formula (2) described above.
Drawings
These and/or other aspects will be apparent from and elucidated with reference to the embodiments described hereinafter, when taken in conjunction with the following figures.
Fig. 1 is a graph illustrating changes in contact angle between before and after cleaning using the cleaning compositions of example 1, comparative example 1, and comparative example 2.
Fig. 2 is a graph illustrating an average glass particle removal rate when cleaning is performed by using the cleaning compositions of example 1, comparative example 1, and comparative example 2.
Fig. 3 is a graph illustrating the change in particle number over time before and after application of the cleaning composition of example 1 and after reapplication of the conventional cleaning composition.
Fig. 4 is a graph illustrating the continuous temporal change in the number of particles (indicated by the shaded portion) during application of the cleaning composition of example 1.
Detailed Description
Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. In this regard, the present embodiments may take different forms and should not be construed as limited to the description herein. Accordingly, the embodiment will be described below only by referring to the drawings to explain aspects of the present description. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. This embodiment is to be construed as providing the more complete description of the present invention to those skilled in the art to which the present invention pertains. Like reference numerals refer to like elements throughout the drawings. In addition, various elements and regions in the drawings have been schematically illustrated. Accordingly, the invention is not limited by the relative sizes or distances illustrated in the drawings.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be understood that: terms such as "comprising," "including," and "having," when used herein, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Furthermore, it should be understood that: terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
When the specific embodiment can be implemented in a different manner, the specific processing procedure can be performed in a different manner from the described procedure. For example: two methods recited in succession may be executed substantially concurrently or in the reverse order to that recited.
Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected in the drawings. Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing processes. As used herein, the term "and/or" includes any and all combinations of more than one of the associated listed elements. Further, the term "substrate" as used herein may refer to the substrate itself or a stacked structure including the substrate and a layer or a thin film formed thereon. Further, the term "substrate surface" as used herein may refer to an exposed surface of the substrate itself or an outer side surface of a layer or film formed on the substrate.
In one aspect, a cleaning composition is provided, comprising: alkali, surfactant, chelating agent, organic solvent and dispersion stabilizer. The cleaning composition may include, with respect to 100 wt% of the cleaning composition: a base in the range of about 1 wt% to about 20 wt%; a surfactant in the range of about 0.1 wt% to about 10 wt%; a chelating agent in the range of about 0.1 wt% to about 10 wt%; an organic solvent in the range of about 0.1 wt% to about 10 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 10 wt%. The remainder of the cleaning composition may include water, such as deionized water (DIW).
In some embodiments, the cleaning composition may include, relative to 100 wt% of the cleaning composition: a base in the range of about 5 wt% to about 20 wt%; a surfactant in the range of about 2 wt% to about 5 wt%; a chelating agent in the range of about 3 wt% to about 8 wt%; an organic solvent in the range of about 3 wt% to about 8 wt%; and a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%.
[ Dispersion stabilizer ]
The dispersion stabilizer may have a structure of the following formula (1).
< formula (1) >
Wherein "n" is an integer of 10 to 5,000 and "M" is+"is a cation of an alkali metal or alkaline earth metal, and" R－Is "O－Or COO－。
In some embodiments, the dispersion stabilizer may have a structure of formula (1-1) below.
< formula (1-1) >
Wherein "n" is an integer of 50 to 1,000, and "M" is sodium or potassium.
More specifically, the dispersion stabilizer may include at least one of the structures represented by the following formula (1-2).
< formula (1-2) >
We speculate that: the dispersion stabilizer is permeable to-R－M+Partially attached to the particles to remove the particles. That is, we consider: due to-R－M+The portion may be attached to the particles so the particles may be easily removed from the surface of the glass article. However, the invention is not limited by this theory.
When the cleaning composition is used to clean a glass article, if the content of the dispersion stabilizer is too small, the ability to prevent particles from reattaching to the glass article such as a glass substrate may be lacking. On the other hand, if the content of the dispersion stabilizer is too large, it may be economically disadvantageous.
[ surfactant ]
The surfactant may include at least one selected from the group consisting of polyoxyalkylene alkylphenol ethers, polyoxyalkylene aryl phenol ethers, polyoxyalkylene fatty acid esters, polyoxyalkylene sorbitan fatty acid esters, polyoxyalkylene alkylamines, sorbitan fatty acid esters, polyalkyl glycosides, alkanolamines, and arylalkanolamines.
In some embodiments, the surfactant can have the structure of formula (2) below.
< formula (2) >
CS-(EOS)a-(POS)b
Wherein the chain segment represented by "CS" is straight chain hydrocarbon having 10 to 14 carbon atoms, the chain segment represented by "EOS" is ethylene oxide, the chain segment represented by "POS" is propylene oxide, the EOS and the POS form blocks or are mutually alternated, and a: b is 7:3 to 9.5: 0.5.
Herein, the ethylene oxide segments represent repeating units derived from ethylene oxide and the propylene oxide segments represent repeating units derived from propylene oxide.
In the surfactant of formula (2), the CS may be any one of decyl, undecyl, lauryl, tridecyl, and tetradecyl. In some embodiments, in the surfactant of formula (2), the CS may have 11 to 13 carbon atoms, and the CS may be, for example, a linear hydrocarbon having 12 carbon atoms.
In formula (2), although the EOS and POS represent the formation of the respective blocks, the EOS and POS may not need to form the respective blocks. Thus, as for- (EOS) represented in the formula (2)a-(POS)bE.g. (EOS)2-(POS)-(EOS)5-(POS)2-、-(EOS)-(POS)2-(EOS)6- (POS) -and- (EOS)9- (POS) - (EOS) - (POS) -, one or more POS may be interposed between two EOSs, and one or more EOS may be interposed between two POS.
Here, "a" and "b" representing the number of the corresponding repeating units may be formed in a predetermined ratio, and a: b may be, for example, 7:3 to 9.5:0.5 or 8.5:1.5 to 9.3: 0.7. If a: b is too small (i.e., the ratio of EOS to POS in the POS is too high), the Phase Inversion Temperature (PIT) may be reduced and, therefore, the cleaning power may be reduced. On the other hand, if a: b is too large (i.e., the ratio of EOS to POS in the POS is too low), foam may be excessively generated during the cleaning process.
[ alkali ]
The base may include, but is not limited to, for example: from sodium hydroxide (NaOH), potassium hydroxide (KOH), magnesium hydroxide (Mg (OH)2) Calcium hydroxide (Ca (OH)2) Ammonia (NH)3) At least one selected from the group consisting of tetraethylammonium hydroxide, tetramethylammonium hydroxide, aminoethoxyethanol, triethanolamine, diethanolamine, monoethanolamine, ammonium hydroxide, tetrapropylammonium hydroxide, butylammonium hydroxide and choline hydroxide.
The hydroxyl group of the base decomposes the organic chain and can be efficiently removed. In addition, when the glass particles are removed, the hydroxyl groups can finely etch the contact region between the glass particles and the glass substrate (i.e., change the state of silica to the state of silicic acid) and can easily separate the glass particles. Therefore, if the content of alkali is too small, the cleaning force may be insufficient. On the other hand, if the content of the alkali is too large, it may cause damage to the environment.
[ mixture for tweezers ]
The chelating agent may remove metallic material from the contaminants, however, the present invention is not limited thereto.
The chelating agent may include: at least one selected from the group consisting of potassium pyrophosphate, calcium carbonate, sodium silicate, sodium gluconate, citric acid, salicylic acid, malonic acid, succinic acid, glutaric acid, pyrophosphoric acid, polyphosphoric acid, benzotriazole, sorbitol, glucose, carboxybenzotriazole, and tolyltriazole.
In some embodiments, the chelating agent may comprise: diethylenetriaminepentaacetic acid (DTPA) (CAS No.:67-43-6), nitro-2, 2', 2 "-triacetic acid (NTA) (CAS No.:139-13-9), ethylenediaminetetraacetic acid (EDTA) (CAS No.:60-00-4), or metal salts thereof. At this time, the metal salt may include a potassium salt or a sodium salt.
The chelating agents may be used alone or in combination. For example: a mixture of NTA of about 2 wt% to about 7 wt% and DTPA of about 1 wt% to about 6 wt% may be used as a chelating agent with respect to 100 wt% of the cleaning composition.
If the amount of chelating agent is too low, the metal contaminants may not be sufficiently removed. On the other hand, if the content of the chelating agent is too high, the clean phase may be unstable, the production cost may increase, and the T-N value may increase, and thus, there may be a possibility of causing environmental problems.
[ organic solvent ]
As the organic solvent, an organic solvent such as alcohols, alcamines, ketones, esters, and amides may be used, however, the present invention is not limited thereto.
The alcohol used as the organic solvent may include at least one selected from the group consisting of ethanol, propanol, butanol, hexanol, heptanol, octanol, decanol, isopropanol, isohexanol, isooctanol, isodecanol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol methyl ether, diethylene glycol methyl ether, triethylene glycol methyl ether, ethylene glycol ethyl ether, diethylene glycol ethyl ether, triethylene glycol ethyl ether, ethylene glycol monopropyl ether, diethylene glycol monopropyl ether, triethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol dibutyl ether, diethylene glycol dibutyl ether, triethylene glycol dibutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, and triethylene glycol monohexyl ether.
The alkanolamines used as the organic solvent may include at least one selected from the group consisting of Monoethanolamine (MEA), Diethanolamine (DEA), Triethanolamine (TEA), N-ethyldiethanolamine, N-diethylethanolamine, and triisopropanolamine.
The ketones used as the organic solvent may include at least one selected from the group consisting of acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-methyl-2-pentanone, cyclopentanone, and cyclohexanone.
Esters useful as organic solvents may include those selected from the group consisting of ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, alkyl esters, methyl lactate, ethyl lactate, methyl glycolate, ethyl glycolate, butyl glycolate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl 3-hydroxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, propyl 2-hydroxypropionate, methyl 2-methoxypropionate, methyl 2-hydroxypropionate, ethyl methoxypropionate, ethyl lactate, ethyl glycolate, butyl glycolate, methyl methoxyacetate, Ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-methoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-ketobutyrate, ethyl 2-ketobutyrate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl carbitol acetate, butyl carbitol acetate and gamma-butyrolactone.
The amide used as the organic solvent may include at least one selected from the group consisting of N, N-dimethylformamide, N-methylpyrrolidone and N, N-dimethylacetamide.
In some embodiments, the organic solvent can comprise a mixture of TEA and MEA. At this point, the ratio of TEA to MEA weight can be about 7:3 to about 9: 1. If the weight ratio of TEA to MEA is outside the above range, the color of the cleaning composition may change when left for a long time.
[ other ingredients ]
According to an embodiment, the cleaning composition may further include a phase stabilizer, a buffer, and a bleaching agent in addition to the above components.
(1) Phase stabilizer
Fatty acids or metal salts thereof may be used as phase stabilizers. For example: sodium or potassium salts of fatty acids having 5 to 15 carbon atoms can be used. However, the present invention is not limited thereto.
The content of the phase stabilizer may be in the range of about 2 wt% to about 8 wt% with respect to 100 wt% of the cleaning composition. If the content of the phase stabilizer is too small, the phase stabilizer may not exert a function of preventing phase separation. In addition, if the content of the phase stabilizer is too large, the cleansing power of the cleansing composition may be weakened.
(2) Bleaching agent
For example: NaOCl may be used as a bleaching agent, however, the present invention is not limited thereto.
The bleaching agent may be present in an amount ranging from about 0.1 wt% to about 1 wt% relative to 100 wt% of the cleaning composition. If the content of the bleaching agent is too small, the organic material removal efficiency may be degraded. Further, if the content of the bleaching agent is too large, the amount of active oxygen may increase, and thus, the cleaning power may be weakened.
(3) Buffer solution
For example: can use K2CO3As a buffer material, however, the present invention is not limited thereto.
The buffer solution may be included in an amount ranging from about 0.2 wt% to about 2 wt% with respect to 100 wt% of the cleaning composition. If the buffer content is too small, the pH of the cleaning composition may not be stable. Furthermore, if the buffer content is too large, it may be outside the pH range suitable for cleaning.
When the cleaning composition is used, particle contamination and organic contaminants on the surface of the glass substrate can be effectively removed.
Hereinafter, the constitution and effect of the present invention will be described in more detail with reference to specific embodiments and comparative examples, however, these embodiments are only intended to provide a more clear understanding of the present invention and are not intended to limit the scope of the present invention.
Example 1 production of cleaning composition
A cleaning composition of the following composition was prepared (wt% based on the total weight of the cleaning composition).
(1)10 wt% of a base (5 wt% KOH 5, 5 wt% NaOH)
(2) 3% by weight of a surfactant (C12- (EOS)9-(POS)1)
(3)5 wt% of a chelating agent (2 wt% of calcium carbonate, 3 wt% of sodium carbonate)
(4) 5% by weight of an organic solvent (2% by weight of diethylene glycol, 3% by weight of triethylene glycol)
(5)1 wt% of a dispersion stabilizer (in the formula (1), n is 150, and-COONa is used as-R－M+)
(6) The rest of deionized water
After the above-mentioned composition was provided by quantifying the weight of each component, the cleaning composition was manufactured by mixing the components at room temperature.
Comparative examples 1 and 2
The performance was compared by using two commercial cleaning compositions (LGL200, Parker225X) currently used to clean glass substrates.
[ organic Material removing ability test 1]
First, in order to manufacture a glass substrate sample having a surface contaminated with organic substances, an adhesive tape was attached to the surface of the glass substrate sample (100mm × 100mm), and the adhesive tape was removed by applying a force perpendicular to the surface of the glass substrate sample after 1 hour. In this way, 60 glass substrate samples whose surfaces were contaminated with adhesive organic components were prepared.
Then, by using the cleaning composition of example 1, contact angles of 20 glass substrate samples before and after cleaning were measured. For each glass substrate sample, the contact angle of a water drop was measured, and the contact angle was measured again after cleaning the glass substrate sample with the cleaning composition. The average contact angle before cleaning was calculated and the average contact angle after cleaning was calculated.
Further, the average contact angle before/after cleaning was calculated in the same manner by using the cleaning composition of comparative example 1 for another 20 glass substrate samples and the cleaning composition of comparative example 2 for the remaining 20 glass substrate samples.
Fig. 1 is a graph illustrating changes in contact angle between before and after cleaning using the cleaning compositions of example 1, comparative example 1, and comparative example 2.
Referring to fig. 1, the average contact angles before cleaning using the cleaning compositions of comparative examples 1 and 2 were 69 ° and 76 °, respectively, and the average contact angles after cleaning were 30 ° and 29 °, respectively. That is, the degrees of decrease in the average contact angle between before and after cleaning were 39 ° and 47 °, respectively.
On the other hand, the average contact angle before cleaning using the cleaning composition of example 1 was 75 °, and the average contact angle after cleaning was 21 °. That is, the degree of decrease in the average contact angle between before and after cleaning was 54 °.
Therefore, since the degree of change in the average contact angle was significantly large, it was observed that the cleaning composition of example 1 exhibited excellent organic substance removing ability.
[ glass particle removal ability test 1]
First, in order to manufacture a glass substrate sample having a surface contaminated with glass particles, fine glass particles were applied to the surface of the glass substrate sample (100mm × 100 mm). For this purpose, fine glass particles were dispersed in ethanol and then coated on the surface of the glass substrate sample by a spin coating method. Then, drying was performed to sufficiently remove ethanol. In this way, 60 glass substrate samples whose surfaces were contaminated with glass particles were prepared.
Then, by using the cleaning composition of example 1, the glass particle removal rate of 20 glass substrate samples before/after cleaning was measured. The glass particle removal rate was measured at 9 points for each glass substrate sample, and the average thereof was defined as the glass particle removal rate of the glass substrate sample. Further, the glass particle removal rate was measured for each of the 20 glass substrate samples, and then the average value thereof was defined as the glass particle removal rate of the cleaning composition of example 1.
Further, the average glass particle removal rate before/after cleaning was calculated in the same manner by using the cleaning composition of comparative example 1 for another 20 glass substrate samples and the cleaning composition of comparative example 2 for the remaining 20 glass substrate samples.
Fig. 2 is a graph illustrating an average glass particle removal rate when cleaning is performed by using the cleaning compositions of example 1, comparative example 1, and comparative example 2.
Referring to fig. 2, when the cleaning compositions of comparative examples 1 and 2 were used, the glass particle removal rates were 8.60% (comparative example 1) and 14.77% (comparative example 2).
On the other hand, when the cleaning composition of example 1 was used, the glass particle removal rate was 17.07%.
Therefore, since the glass particle removal rate is relatively large, it can be observed that the cleaning composition of example 1 exhibits an excellent glass particle removal rate.
[ wire application test 1]
The change in particle number when the cleaning composition of example 1 was applied to a production line was measured and illustrated in fig. 3. Fig. 3 illustrates the change in particle number over time before and after application of the cleaning composition of example 1 and after reapplication of the conventional cleaning composition. Here, the particle number means a particle number of 0.3 micrometers (μm) or more in diameter.
Referring to fig. 3, the average number of particles (shown by the horizontal dotted line) when the cleaning composition of example 1 was applied was more reduced by about 16% than the average number of particles (shown by the horizontal dotted line) when the cleaning composition of comparative example 1 was applied.
Thus, it was observed that the particle number can also be effectively reduced in a practical process when applying the cleaning composition.
[ wire application test 2]
The change in particle number when the cleaning composition of example 1 was applied to the production line was continuously measured and illustrated in fig. 4. Fig. 4 illustrates the continuous temporal change in the number of particles (shaded portion) during application of the cleaning composition of example 1.
In fig. 4, the continuous graph represents the results of all examinations of the number of particles in all articles, and the square points represent the results of sample examinations of the number of particles in articles at corresponding points in time. Since the results of the sample inspection showed substantially the same tendency as all the inspection results (hatched portions) during the time period in which the cleaning composition of example 1 was applied, it was determined that the inspection of the particle number had been performed substantially accurately.
Furthermore, as a result of calculation of all the mean values, from the results (square points) of the sample examinations carried out, it can be observed that: the number of particles was reduced by about 15% more when the cleaning composition of example 1 was used than when a conventional cleaning composition was used. Furthermore, from the results of all examinations (black line), it is observed that: the number of particles was reduced by about 17% more when the cleaning composition of example 1 was used than when a conventional cleaning composition was used.
Thus, it was observed that the particle number can also be effectively reduced in a practical process when applying the cleaning composition.
Comparative example 3
A cleaning composition was produced in the same manner as in example 1, except that a material having a structure of the following formula (3) was used as a dispersion stabilizer.
< formula (3) >
[ example 2]
A cleaning composition was produced in the same manner as in example 1, except that a material having a structure of the following formula (1-3) was used as a dispersion stabilizer.
< formula (1-3) >
[ glass particle removal ability test 2]
The glass particle removal ability test was performed by using the cleaning compositions of example 1, example 2, and comparative example 3. The test method was the same as in the glass particle removing ability test 1.
As a result, it was observed that the glass particle removal rate when the cleaning composition of comparative example 3 was used was 11.91%, whereas the glass particle removal rate when the cleaning composition of example 1 was used was 18.11%, and the glass particle removal rate when the cleaning composition of example 2 was used was 16.53%.
Thus, it can be observed that: in order to remove glass particles, it is advantageous to use the dispersion stabilizer of the present invention in which-COO is contained－Na+The radicals are attached directly to the main chain. In addition, it can be observed that the glass particle removal rate of the dispersion stabilizer of example 1 is higher than that of the dispersion stabilizer of example 2.
[ example 3]
A cleaning composition was produced in the same manner as in example 1, except that a: b in the surfactant was adjusted to 7.5: 2.5.
[ example 4]
A cleaning composition was produced in the same manner as in example 1, except that a: b in the surfactant was adjusted to 7: 3.
Comparative example 4
A cleaning composition was produced in the same manner as in example 1, except that a: b in the surfactant was adjusted to 6.5: 3.5.
[ organic Material removing force test 2]
By using the cleaning compositions of example 1, example 3, example 4 and comparative example 4, the contact angle change was measured in the same manner as in the organic substance removing force test 1, and the measurement results are illustrated in the following table 1.
< Table 1>
| a:b | Before cleaning | After cleaning | Contact angle reduction | |
| Example 1 | 9:1 | 75 | 21 | 54 |
| Example 3 | 7.5:2.5 | 69 | 17 | 52 |
| Example 4 | 7:3 | 74 | 23 | 51 |
| Comparative example 4 | 6.5:3.5 | 72 | 24 | 48 |
Referring to table 1, it can be observed that the cleaning compositions of examples 1, 3 and 4 have a larger contact angle reduction effect than the cleaning composition of comparative example 4. In other words, it can be observed that the cleaning compositions of examples 1, 3 and 4 have greater organic substance removing effects than the cleaning composition of comparative example 4.
Further, it was observed that the cleaning composition of example 1 had a greater effect of removing organic substances than the cleaning compositions of examples 3 and 4.
[ example 5]
A cleaning composition was prepared in the same manner as in example 1, except that 2 wt% of Na salt of NTA and 3 wt% of Na salt of DTPA were used as a sequestering agent in place of 2 wt% of calcium carbonate and 3 wt% of sodium carbonate.
[ example 6]
Except that 3 wt% of polyoxymethylene ethyl phenol ether (polyoxymethyl phenol ether) was used as a surfactant instead of 3 wt% of C12- (EOS)9-(POS)1Except that, a cleaning composition was produced in the same manner as in example 1.
[ example 7]
A cleaning composition was prepared in the same manner as in example 1, except that 4 wt% of TEA and 1 wt% of MEA were used as the organic solvent in place of 2 wt% of diethylene glycol and 3 wt% of triethylene glycol.
[ example 8]
A cleaning composition was produced in the same manner as in example 1, except that 2% by weight of potassium pyrophosphate and 3% by weight of sorbitol were used as a sequestering agent in place of 2% by weight of calcium carbonate and 3% by weight of sodium carbonate.
[ example 9]
Except that 3 wt% of the polypropyleneoside was used as a surfactant instead of 3 wt% of C12- (EOS)9-(POS)1Except that, a cleaning composition was produced in the same manner as in example 1.
Although embodiments of the present invention have been described in detail above, those skilled in the art will appreciate that various modifications can be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Recitation of features or aspects within each embodiment is typically considered to be other similar features or aspects that can be employed in other embodiments.
While one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (13)
1. A cleaning composition for cleaning glass articles, comprising, relative to 100 wt% of the cleaning composition:
a base in the range of about 1 wt% to about 20 wt%;
a surfactant in the range of about 0.1 wt% to about 10 wt%;
a chelating agent in the range of about 0.1 wt% to about 10 wt%;
an organic solvent in the range of about 0.1 wt% to about 10 wt%; and
a dispersion stabilizer in the range of about 0.1 wt% to about 10 wt%,
wherein the dispersion stabilizer has the following structure of formula (1):
< formula (1) >
Wherein "n" is an integer of 10 to 5,000 and "M" is+"is a cation of an alkali metal or alkaline earth metal, and" R－Is "O－Or COO－。
2. The cleaning composition of claim 1, wherein the cleaning composition comprises, relative to 100 wt% of the cleaning composition:
a base in the range of about 5 wt% to about 20 wt%;
a surfactant in the range of about 2 wt% to about 5 wt%;
a chelating agent in the range of about 3 wt% to about 8 wt%;
an organic solvent in the range of about 3 wt% to about 8 wt%; and
a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%.
3. The cleaning composition of claim 1, wherein the dispersion stabilizer has the following formula (1-1):
< formula (1-1) >
Wherein "n" is an integer of 50 to 1,000, and "M" is sodium or potassium.
4. The cleaning composition as set forth in claim 1, wherein the surfactant comprises at least one selected from the group consisting of polyoxyalkylene alkylphenol ethers, polyoxyalkylene aryl phenol ethers, polyoxyalkylene fatty acid esters, polyoxyalkylene sorbitan fatty acid esters, polyoxyalkylene alkylamines, sorbitan fatty acid esters, polyalkyl glycosides, alkanolamines, and aralkanolamines.
5. The cleaning composition as set forth in claim 1, wherein the surfactant has a structure of the following formula (2):
< formula (2) >
CS-(EOS)a-(POS)b
Wherein the chain segment represented by "CS" is straight chain hydrocarbon having 10 to 14 carbon atoms, the chain segment represented by "EOS" is ethylene oxide, the chain segment represented by "POS" is propylene oxide, the EOS and the POS form blocks or are mutually alternated, and a: b is 7:3 to 9.5: 0.5.
6. The cleaning composition according to claim 5, wherein the segment represented by CS is a linear hydrocarbon having 12 carbon atoms, and a: b is 8.5:1.5 to 9.3: 0.7.
7. The cleaning composition of claim 1, wherein the base comprises one or more of sodium hydroxide (NaOH), potassium hydroxide (KOH), magnesium hydroxide (Mg (OH)2) Calcium hydroxide (Ca (OH)2) Ammonia (NH)3) At least one selected from the group consisting of tetraethylammonium hydroxide, tetramethylammonium hydroxide, aminoethoxyethanol, triethanolamine, diethanolamine, monoethanolamine, ammonium hydroxide, tetrapropylammonium hydroxide, butylammonium hydroxide and choline hydroxide.
8. The cleaning composition of claim 1, wherein the chelating agent comprises:
at least one selected from the group consisting of potassium pyrophosphate, calcium carbonate, sodium silicate, sodium gluconate, citric acid, salicylic acid, malonic acid, succinic acid, glutaric acid, pyrophosphoric acid, polyphosphoric acid, benzotriazole, sorbitol, glucose, carboxybenzotriazole, and tolyltriazole; or is
Nitro-2, 2', 2 "-triacetic acid (NTA), diethylenetriaminepentaacetic acid (DTPA), ethylenediaminetetraacetic acid (EDTA), or metal salts of the above,
wherein the metal salt comprises a potassium or sodium salt.
9. The cleaning composition of claim 8, wherein the sequestering agent comprises a metal salt of NTA in the range of about 2 wt% to about 7 wt% and a metal salt of DTPA in the range of about 1 wt% to about 6 wt% relative to 100 wt% of the cleaning composition.
10. A cleaning composition for cleaning glass articles, comprising, relative to 100 wt% of the cleaning composition:
a base in the range of about 5 wt% to about 20 wt%;
a surfactant in the range of about 2 wt% to about 5 wt%;
a chelating agent in the range of about 3 wt% to about 8 wt%;
an organic solvent in the range of about 3 wt% to about 8 wt%; and
a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%,
wherein the surfactant has the following structure of formula (2):
< formula (2) >
CS-(EOS)a-(POS)b
Wherein the chain segment represented by "CS" is straight chain hydrocarbon having 10 to 14 carbon atoms, the chain segment represented by "EOS" is ethylene oxide, the chain segment represented by "POS" is propylene oxide, the EOS and the POS form blocks or are mutually alternated, and a: b is 7:3 to 9.5: 0.5.
11. A method of cleaning a glass substrate, the method comprising:
supplying a cleaning composition onto a glass substrate;
cleaning a surface of the glass substrate by using a friction cleaning unit in such a manner that the cleaning composition contacts the glass substrate; and
removing the cleaning composition from the glass substrate,
wherein the cleaning composition comprises, relative to 100 wt% of the cleaning composition:
a base in the range of about 5 wt% to about 20 wt%;
a surfactant in the range of about 2 wt% to about 5 wt%;
a chelating agent in the range of about 3 wt% to about 8 wt%;
an organic solvent in the range of about 3 wt% to about 8 wt%; and
a dispersion stabilizer in the range of about 0.1 wt% to about 3 wt%.
12. The method of claim 11, wherein the dispersion stabilizer has the structure of formula (1):
< formula (1) >
Wherein "n" is an integer of 10 to 5,000 and "M" is+"is a cation of an alkali metal or alkaline earth metal, and" R－Is "O－Or COO－。
13. The method of claim 11, wherein the surfactant has the structure of formula (2):
< formula (2) >
CS-(EOS)a-(POS)b
Wherein the chain segment represented by "CS" is straight chain hydrocarbon having 10 to 14 carbon atoms, the chain segment represented by "EOS" is ethylene oxide, the chain segment represented by "POS" is propylene oxide, the EOS and the POS form blocks or are mutually alternated, and a: b is 7:3 to 9.5: 0.5.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0109487 | 2017-08-29 | ||
| KR1020170109487A KR20190023558A (en) | 2017-08-29 | 2017-08-29 | Composition for cleaning a glass article and cleaning method of glass substrate using the same |
| PCT/KR2018/009991 WO2019045449A1 (en) | 2017-08-29 | 2018-08-29 | Cleaning composition for cleaning glass article and method of cleaning glass substrate using the same |
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| CN111278962A true CN111278962A (en) | 2020-06-12 |
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| CN201880062884.XA Pending CN111278962A (en) | 2017-08-29 | 2018-08-29 | Cleaning composition for cleaning glass article and method for cleaning glass substrate using the same |
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| JP (1) | JP2020532642A (en) |
| KR (1) | KR20190023558A (en) |
| CN (1) | CN111278962A (en) |
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| CN110606666A (en) * | 2019-08-28 | 2019-12-24 | 晟光科技股份有限公司 | Industrial control LCD display panel coating process and cleaning method thereof |
| CN110484379A (en) * | 2019-09-05 | 2019-11-22 | 广东荣强化学有限公司 | A kind of mobile phone glass cleansing composition and preparation method thereof |
| KR20220157931A (en) * | 2020-03-25 | 2022-11-29 | 니폰 덴키 가라스 가부시키가이샤 | Manufacturing method of glass plate |
| KR102295216B1 (en) * | 2021-03-02 | 2021-09-01 | 회명산업 주식회사 | Metal mask detergent composition and the method thereof |
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| JP2514520B2 (en) * | 1992-02-19 | 1996-07-10 | 横浜油脂工業株式会社 | Composition for removing water-repellent silicone film on glass surface |
| JP2008007617A (en) * | 2006-06-29 | 2008-01-17 | Sanyo Chem Ind Ltd | Low foaming surfactant for alkaline cleaning agent |
| JP5379441B2 (en) * | 2008-10-09 | 2013-12-25 | 関東化学株式会社 | Alkaline aqueous solution composition for substrate processing |
| KR20110121122A (en) * | 2010-04-30 | 2011-11-07 | 동우 화인켐 주식회사 | A detergent composition for a glass substrate of flat panel display device |
| KR101841698B1 (en) * | 2015-09-07 | 2018-03-23 | 유수열 | Cleaning solution composition for display window glass |
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| KR20190023558A (en) | 2019-03-08 |
| JP2020532642A (en) | 2020-11-12 |
| WO2019045449A1 (en) | 2019-03-07 |
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Application publication date: 20200612 |