KR102295216B1 - Metal mask detergent composition and the method thereof - Google Patents

Abstract

The present invention relates to a metal mask cleaner composition with improved cleaning, corrosion prevention and precipitation prevention performance, and a method for manufacturing the same. More specifically, the present invention relates to: a metal mask cleaner composition comprising potassium iodide, iodine, ketone-based organic solvent and/or an ester-based organic solvent, alkanolamine, EDTA-4Na, and ultrapure water; and a method for manufacturing the same.

Description

Metal mask cleaning agent composition with improved cleaning, corrosion prevention and precipitation prevention performance and method for manufacturing the same

The present invention relates to a metal mask cleaning agent composition with improved cleaning, corrosion prevention and precipitation prevention performance and a method for manufacturing the same, and includes potassium iodide, iodine, ketone-based or ester-based organic solvent, alkanolamine, EDTA-4Na and ultrapure water. High solubility in gold (Au) or silver (Ag) without corrosion of the alloy without affecting alloys such as , iron-nickel (Fe-Ni), and precipitation even after dissolution of gold (Au) or silver (Ag) It relates to a metal mask cleaner composition with improved cleaning, corrosion prevention and precipitation prevention performance that does not occur, and a method for manufacturing the same.

Organic light emitting diodes (OLEDs) are self-luminous devices using organic materials, which can be used as display materials and lighting materials. It has been well known under the name AMOLED (active-matrix organic light emitting diodes). Compared to LCD, which is a major competitor in the display field, OLED has the advantage of being able to simplify the panel because it has self-luminous properties, so that the product can be made thinner and lighter. In addition, we are preparing to develop and release a foldable OLED display that goes beyond a flexible display using the advantages of a simple structure. As a lighting source, OLED is spotlighted as a next-generation lighting that succeeds LED using inorganic materials, which is currently established in the lighting market where fluorescent and incandescent lamps are the mainstream.

The organic light emitting diode display has a stacked structure in which a light emitting layer is inserted between the anode and the cathode to realize color by recombination of holes and electrons injected from the anode and the cathode in the light emitting layer to emit light. In addition, intermediate layers such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer are selectively inserted and used between each electrode and the light emitting layer.

The stacked structure of the organic light emitting diode display may be formed by a deposition method using a mask. The fine pattern of the organic layer such as the light emitting layer and the intermediate layer may be formed by a deposition method using a fine metal mask (FMM). Since the metal layers such as the anode and the cathode do not need to form a fine pattern, they may be formed by a deposition method using an open mask.

Since the stacked structure of the organic light emitting diode display requires high precision, it may be important to prevent contamination in the deposition process. However, if we compare the organic light emitting diode display to a paper print, the mask corresponds to a paper cut according to the draft, and the RGB pattern is engraved on the organic light emitting diode display panel as if the print is completed by pushing a roller with ink on it. When mass-producing diode displays, various foreign substances accumulate on the metal mask.

As such, a medium that introduces contaminants into the deposition process may be a mask, and thus, cleaning of the mask is required before and after inputting the mask to the deposition process.

In particular, the deposition mask made of a thin metal plate is bent by the weight of the deposited deposition material, thereby affecting the precision of the pattern. Therefore, it is essential to regularly remove the deposition material deposited on the deposition mask.

According to this situation, research and development for cleaning the metal mask has been conducted, and the cleaning composition for cleaning the metal mask requires excellent cleaning power for the material deposited on the mask surface and at the same time has low corrosion on the metal mask surface. And, the ability to prevent the formation and precipitation of solid substances in the composition is required.

Accordingly, the present invention intends to present a new composition for cleaning a metal mask and a method for manufacturing the same, which has improved cleaning power, anti-corrosion power, and anti-precipitation power than the conventional metal mask cleaning composition.

On the other hand, as a prior art in the same technical field as the present invention, Korean Patent Publication No. 10-1250777 (published on Aug. 8, 2013) relates to a cleaning solution for cleaning a mask having a metal electrode material deposited thereon and a cleaning method using the same. Specifically, the organic solvent contains iodine (I ₂ ), and the organic solvent is any one selected from the group consisting of dimethyl formamide, dimethyl acetamide and methyl pyrrolidone, and the alcohol solvent is excluded. A technique related to a cleaning solution for cleaning a mask having a metal electrode material deposited thereon is described.

In addition, Korean Patent Application Laid-Open No. 10-2017-0083025 (published on July 17, 2017) relates to a cleaning solution for semiconductor devices that suppresses cobalt damage, and a method for cleaning semiconductor devices using the same, and more specifically, As a cleaning solution for removing dry etching residues on the surface of semiconductor devices, a cleaning solution composition comprising an alkali metal compound such as potassium iodide, an anticorrosive agent such as a peroxide and an alkanolamine, an alkaline earth metal compound, and water is described. .

In addition, Korean Patent Application Laid-Open No. 10-2010-0107399 (published on October 5, 2010) relates to a selective etching solution for gold and nickel, and more specifically, selects gold and nickel from a material in which gold and nickel coexist. In the etching method with iodine, there is described a technique related to a selective etching method for gold and nickel, characterized in that it includes adjusting the mixing ratio of each component of an etching solution containing iodide and iodine, or an acid or an organic solvent. .

The prior document has some similarities with the present invention in that it relates to a metal mask cleaning solution composition containing iodine or potassium iodine, but without corrosion of the alloy without affecting the alloy such as iron-nickel (Fe-Ni). High solubility in deposition materials such as gold (Au) or silver (Ag) allows 100% dissolution in deposition materials just by immersion, does not form complex compounds with gold (Au) or silver (Ag) materials, The mask did not include a composition for cleaning a metal mask that did not cause corrosion or a description of a method for manufacturing the same.

Korean Patent Publication No. 10-1250777 (2013.04.08. Announced) Korean Patent Publication No. 10-2017-0083025 (published on July 17, 2017) Korean Patent Publication No. 10-2010-0107399 (published on October 5, 2010)

The present invention was created to solve the above problems, and in a metal mask cleaning composition, it is water-soluble and does not damage alloys such as iron-nickel (Fe-Ni), gold (Au) and silver (Ag) ) has a high solubility in the deposition material, so that it is an object to provide a metal mask cleaning composition capable of dissolving 100% of the deposition material by immersion even without using a physical method, and a method for manufacturing the same.

In addition, in the composition for cleaning a metal mask as described above, the present invention prevents corrosion of an alloy such as iron-nickel (Fe-Ni) and forms a complex with dissolved gold (Au) or silver (Ag) to form a solid An object of the present invention is to provide a composition for cleaning a metal mask that prevents particle deposits from being generated, and a method for manufacturing the same.

In addition, an object of the present invention is to provide a composition for cleaning a metal mask that can be stably maintained while lowering the T-N value as much as possible for wastewater treatment in the composition for cleaning a metal mask as described above, and a method for manufacturing the same.

In addition, an object of the present invention is to provide a composition for cleaning a metal mask as described above, and a method for manufacturing the same, which is easy for commercial mass production by mixing a chemical substance at room temperature in the composition for cleaning a metal mask.

to solve the above problem. The metal mask cleaning composition of the present invention may include potassium iodide, iodine, a ketone-based organic solvent and/or an ester-based organic solvent, alkanolamine, EDTA-4Na, and ultrapure water.

In one embodiment of the present invention, the ketone-based organic solvent is gamma butyrolactone (γ-butyrolactone), methylethylketone (methylethylketone), methylpropylketone (methylbutylketone), methylbutylketone (methylbutylketone), isopropylmethylketone (isopropylmethylketone), ethylethylketone (ethylethylketone), isobutylmethylketone (isobutylmethylketone), ethylpropylketone (ethylpropylketone), methylcyclohexanone (methylcyclohexanone), methylcyclopentanone (Methylcyclopentanone), cyclomethylketone (cyclomethylketone), 1 -Hexen-3-one (1-HEXEN-3-ONE), dihydrofurane-3-one (dehydrofurane-3-one), acetoxyethylene (acetoxyethylene), 2-oxobutanaldehyde (2-oxobutanaldehyde), 2 -Heptanone (2-Heptanone) and diisobutyl ketone (diisobutylketone) may be characterized in that it contains at least one or more.

As another embodiment of the present invention, the ester-based organic solvent may include carbitol acetate.

In another embodiment of the present invention, the alkanolamine is diglycolamine, amino-3-methoxy-propanol, diethanolamine, 2 ,2-dimethoxyethaneamine (2,2-Dimethoxyethaneamine), 3- (amino)-1-propanol (3-Aminoxy-1-propanol), 2- (methoxyamino) ethanol (2- (methoxyamino) ethanol), 2-(2-aminoethoxy)methanol (2-(2-Aminoethoxy)methanol), 2-(2-methoxyethoxy)ethane amine (2-(2-methoxyethoxy)ethane amine), 2- It may include at least one of (3-aminopropoxy)ethanol (2-(3-Aminopropoxy)ethanol) and 2-(2-methoxyethylamino)ethanol (2-(2-methoxyethylamino)ethanol).

In another embodiment of the present invention, the composition for cleaning a metal mask may contain 1 to 7 wt% of the potassium iodide.

In another embodiment of the present invention, the metal mask cleaning composition may have an iodine content of 0.5 to 4 wt%.

In another embodiment of the present invention, the composition for cleaning a metal mask may have an organic solvent content of 20 to 50 wt%.

As another embodiment of the present invention, the metal mask cleaning composition may have a content of 1 to 8 wt% of diglycolamine.

In another embodiment of the present invention, the metal mask cleaning composition may have a content of 0.1 to 3 wt% of EDTA-4Na.

The metal mask cleaning composition according to the present invention contains potassium iodine, iodine, a ketone-based or ester-based organic solvent, an alkanolamine, EDTA-4Na, and ultrapure water, thereby preventing damage to alloys such as iron-nickel (Fe-Ni). Since it has a high solubility in deposition materials such as gold (Au) and silver (Ag), there is an effect that 100% of deposition materials can be dissolved by immersion even without using a physical method.

In addition, the metal mask cleaning composition according to the present invention prevents corrosion of alloys such as iron-nickel (Fe-Ni) in dissolving deposition materials such as gold (Au) and silver (Ag), and molten gold Forming a complex compound with (Au) or silver (Ag) has the effect of preventing the formation of solid particle precipitates.

In addition, the metal mask cleaning composition according to the present invention has an effect of minimizing adverse environmental effects such as wastewater generation by stably maintaining a low T-N value.

In addition, the metal mask cleaner composition according to the present invention has the effect of maximizing commercial efficiency because it is possible to mix chemical substances at room temperature, so that mass production is possible.

1 is a flowchart showing a method of manufacturing a metal mask cleaning agent composition with improved cleaning, corrosion prevention and precipitation prevention performance according to the present invention.

Hereinafter, with reference to the accompanying drawings, a metal mask cleaning agent composition with improved cleaning, corrosion prevention and precipitation prevention performance according to the present invention so that those of ordinary skill in the art can easily practice the present invention, and its A preferred embodiment of the manufacturing method will be described in detail.

In the detailed description of the principle of the preferred embodiment of the present invention, if it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, the configuration shown in the embodiments and drawings described in the present specification is only the most preferred embodiment of the present invention and does not represent all the technical spirit of the present invention, so at the time of the present application, various It should be understood that there may be equivalents and variations.

The present invention relates to a metal mask cleaning composition with improved cleaning, corrosion prevention and precipitation prevention performance containing potassium iodide, iodine, ketone-based organic solvent and/or ester-based organic solvent, alkanolamine, EDTA-4Na and ultrapure water, and preparation thereof it's about how

In the metal mask cleaning composition and the method for manufacturing the same according to the present invention, the ketone-based organic solvent is gamma butyrolactone (γ-butyrolactone), methylethylketone (methylethylketone), methylpropylketone (methylbutylketone), methylbutylketone ( methylbutylketone), isopropylmethylketone, ethylethylketone, isobutylmethylketone, ethylpropylketone, methylcyclohexanone, methylcyclopentanone, cyclopentanone Methyl ketone (cyclomethylketone), 1-hexen-3-one (1-HEXEN-3-ONE), dihydrofurane-3-one, acetoxyethylene, 2-oxobutanaldehyde (2-oxobutanaldehyde) and at least one of 2-heptanone (2-Heptanone).

In addition, in the metal mask cleaning composition and the method for manufacturing the same according to the present invention, the ester-based organic solvent includes carbitol acetate.

In addition, in the composition for cleaning a metal mask and a method for manufacturing the same according to the present invention, the alkanolamine is, diglycolamine, amino-3-methoxy-propanol (1-amino-3-methoxy-propanol), Diethanolamine, 2,2-dimethoxyethaneamine, 3-(amino)-1-propanol, 2-(methoxyamino) ) Ethanol (2-(methoxyamino)ethanol), 2-(2-aminoethoxy)methanol (2-(2-Aminoethoxy)methanol), 2-(2-methoxyethoxy)ethanamine (2-(2- methoxyethoxy)ethaneamine), 2-(3-aminopropoxy)ethanol (2-(3-Aminopropoxy)ethanol), and at least one of 2-(2-methoxyethylamino)ethanol (2-(2-methoxyethylamino)ethanol) includes more than

In addition, the composition for cleaning a metal mask according to the present invention contains 1 to 7 wt% of potassium iodide, 0.5 to 4 wt% of iodine, 20 to 50 wt% of an organic solvent, and 1 to 8 wt% of an alkanolamine based on the total weight of the composition. , EDTA-4Na 0.1 to 3 wt% and the remaining wt% of ultrapure water.

More preferably, the composition for cleaning a metal mask according to the present invention contains 3 to 5 wt% of potassium iodide, 1 to 3 wt% of iodine, 30 to 45 wt% of an organic solvent, and 2 to 6 alkanolamines based on the total weight of the composition. wt%, EDTA-4Na 1 to 2 wt% and the remaining wt% of ultrapure water.

Hereinafter, the present invention will be described in more detail through examples. These examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention by these examples.

Examples 1 to 42

As Examples 1 to 42, a metal mask cleaning composition having a composition according to Table 1 below was prepared according to the following manufacturing method.

KI and iodine in each compounding ratio based on 100 parts by weight of the detergent composition were dissolved by stirring for 30 minutes in deionized water having a solvent and specific resistance of 18Ω/cm or more, and an alkanolamine and an alkali compound were added and stirred for about 1 hour. .

In the table below, GBL: γ-butyrolactone, MEK: methylethylketone, MCH: methylcyclohexanone, HO: 1-HEXEN-3-ONE, DHPO: dehydrofurane-3-one, AE: acetoxyethylene, OBA: 2-oxobutanaldehyde, HTN: 2-Heptanone , DIBK: DiisobutylKetone, CA:　Carbitol acetate, MA: Methyl Acetate, MEG: Methyl Ethylene Glycol, DMAC: Dimethylacetamide, DGA: Diglycolamine, AMP: 1-amino-3-methoxy-propanol, DMEA: 2,2-Dimethoxyethaneamine, MAE : 2-(methoxyamino)ethanol, AEM: 2-(2-Aminoethoxy)methanol, MEEA: 2-(2-methoxyethoxy)ethaneamine, MEA: Monoethylamine, DEA: Diethylamine, DEMA: N,N-diethylmethylamine.

KI I ₂ solvent alkanolamines alkali compound ultrapure water weight weight Kinds weight Kinds weight Kinds weight weight Example 1 One 2 GBL 35 DGA 4 EDTA-4Na 1.5 56.5 Example 2 2 2 GBL 35 DGA 4 EDTA-4Na 1.5 55.5 Example 3 3 2 GBL 35 DGA 4 EDTA-4Na 1.5 54.5 Example 4 4 2 GBL 35 DGA 4 EDTA-4Na 1.5 53.5 Example 5 5 2 GBL 35 DGA 4 EDTA-4Na 1.5 52.5 Example 6 6 2 GBL 35 DGA 4 EDTA-4Na 1.5 51.5 Example 7 7 2 GBL 35 DGA 4 EDTA-4Na 1.5 50.5 Example 8 4 0.5 GBL 35 DGA 4 EDTA-4Na 1.5 55 Example 9 4 One GBL 35 DGA 4 EDTA-4Na 1.5 54.5 Example 10 4 3 GBL 35 DGA 4 EDTA-4Na 1.5 52.5 Example 11 4 4 GBL 35 DGA 4 EDTA-4Na 1.5 51.5 Example 12 4 2 GBL 20 DGA 4 EDTA-4Na 1.5 68.5 Example 13 4 2 GBL 30 DGA 4 EDTA-4Na 1.5 58.5 Example 14 4 2 GBL 45 DGA 4 EDTA-4Na 1.5 43.5 Example 15 4 2 GBL 50 DGA 4 EDTA-4Na 1.5 38.5 Example 16 4 2 GBL 35 DGA One EDTA-4Na 1.5 56.5 Example 17 4 2 GBL 35 DGA 2 EDTA-4Na 1.5 55.5 Example 18 4 2 GBL 35 DGA 3 EDTA-4Na 1.5 54.5 Example 19 4 2 GBL 35 DGA 5 EDTA-4Na 1.5 52.5 Example 20 4 2 GBL 35 DGA 6 EDTA-4Na 1.5 51.5 Example 21 4 2 GBL 35 DGA 7 EDTA-4Na 1.5 50.5 Example 22 4 2 GBL 35 DGA 8 EDTA-4Na 1.5 49.5 Example 23 4 2 GBL 35 DGA 4 EDTA-4Na 0.1 54.9 Example 24 4 2 GBL 35 DGA 4 EDTA-4Na 0.5 54.5 Example 25 4 2 GBL 35 DGA 4 EDTA-4Na One 54 Example 26 4 2 GBL 35 DGA 4 EDTA-4Na 2 53 Example 27 4 2 GBL 35 DGA 4 EDTA-4Na 2.5 52.5 Example 28 4 2 GBL 35 DGA 4 EDTA-4Na 3 52 Example 29 4 2 MEK 35 DGA 4 EDTA-4Na 1.5 53.5 Example 30 4 2 MCH 35 DGA 4 EDTA-4Na 1.5 53.5 Example 31 4 2 HO 35 DGA 4 EDTA-4Na 1.5 53.5 Example 32 4 2 DHPO 35 DGA 4 EDTA-4Na 1.5 53.5 Example 33 4 2 AE 35 DGA 4 EDTA-4Na 1.5 53.5 Example 34 4 2 OBA 35 DGA 4 EDTA-4Na 1.5 53.5 Example 35 4 2 HTN 35 DGA 4 EDTA-4Na 1.5 53.5 Example 36 4 2 DIBK 35 DGA 4 EDTA-4Na 1.5 53.5 Example 37 4 2 CA 35 DGA 4 EDTA-4Na 1.5 53.5 Example 38 4 2 GBL 35 AMP 4 EDTA-4Na 1.5 53.5 Example 39 4 2 GBL 35 DMEA 4 EDTA-4Na 1.5 53.5 Example 40 4 2 GBL 35 MAE 4 EDTA-4Na 1.5 53.5 Example 41 4 2 GBL 35 AEM 4 EDTA-4Na 1.5 53.5 Example 42 4 2 GBL 35 MEEA 4 EDTA-4Na 1.5 53.5

Comparative Examples 1 to 16

As Comparative Examples 1 to 16, a composition for cleaning a metal mask having a composition according to Table 2 below was prepared according to the same manufacturing method as in Examples 1 to 42.

KI I ₂ solvent alkanolamines alkali compound ultrapure water weight weight Kinds weight Kinds weight Kinds weight weight Comparative Example 1 0 2 GBL 35 DGA 4 EDTA-4Na 1.5 57.5 Comparative Example 2 8 2 GBL 35 DGA 4 EDTA-4Na 1.5 49.5 Comparative Example 3 4 0 GBL 35 DGA 4 EDTA-4Na 1.5 55.5 Comparative Example 4 4 5 GBL 35 DGA 4 EDTA-4Na 1.5 50.5 Comparative Example 5 4 2 GBL 10 DGA 4 EDTA-4Na 1.5 78.5 Comparative Example 6 4 2 GBL 60 DGA 4 EDTA-4Na 1.5 28.5 Comparative Example 7 4 2 GBL 35 DGA 0 EDTA-4Na 1.5 57.5 Comparative Example 8 4 2 GBL 35 DGA 9 EDTA-4Na 1.5 48.5 Comparative Example 9 4 2 GBL 35 DGA 4 EDTA-4Na 0 55 Comparative Example 10 4 2 GBL 35 DGA 4 EDTA-4Na 3.5 51.5 Comparative Example 11 4 2 GBL 35 MEA 4 EDTA-4Na 1.5 53.5 Comparative Example 12 4 2 GBL 35 DEA 4 EDTA-4Na 1.5 53.5 Comparative Example 13 4 2 GBL 35 DEMA 4 EDTA-4Na 1.5 53.5 Comparative Example 14 4 2 MA 35 DGA 4 EDTA-4Na 1.5 53.5 Comparative Example 15 4 2 MEG 35 DGA 4 EDTA-4Na 1.5 53.5 Comparative Example 16 4 2 DMAC 35 DGA 4 EDTA-4Na 1.5 53.5

Experiments and Experimental Results

1. Cleanliness test

For the performance evaluation of the compositions prepared in Examples 1 to 42 and Comparative Examples 1 to 16, cleaning evaluation was performed on the Ag-deposited metal mask in the following process.

After immersing the prepared specimen at a temperature of 30° C. for 120 minutes, washing with ultrapure water and drying with nitrogen, the surface was evaluated using an optical microscope and an Energy Dispersive Spectrometer (EDS). The evaluation measured the ratio of the undefined portion in the total surface area of the metal mask, and converted it into a score according to the rating table according to Table 3 below.

2. Corrosion resistance test

For the performance evaluation of the cleaning solutions prepared in Examples 1 to 42 and Comparative Examples 1 to 16, metal corrosion evaluation was performed on the metal mask in the following process.

The prepared specimen was immersed at a temperature of 50° C. for 300 minutes, washed with ultrapure water, dried with nitrogen, and then the surface was evaluated using an optical microscope and Energy Dispersive Spectrometer (EDS). The evaluation was performed by measuring the ratio of the portion where corrosion occurred in the total surface area of the metal mask, and it was converted into a score according to the rating table according to Table 3 below.

3. Sedimentation prevention test

In order to check whether each of the solutes prepared in Examples 1 to 42 and Comparative Examples 1 to 16 were dissolved, it was evaluated whether the solid component of the solution remained.

In the evaluation, the number of solid particles of 2 μm or more in 1 mL of the solution was measured, and this was converted into a score according to the rating table according to Table 3 below.

cleanliness corrosion protection Precipitation prevention degree Undefined area (%) Corrosion generation area (%) Number of precipitated solids per 1 ml of solution score 10 ~ 0.3 or less ~ 0.3 or less 5 or less 9 greater than 0.3
0.6 or less greater than 0.3
0.6 or less 6 to 10 8 greater than 0.6
0.9 or less greater than 0.6
0.9 or less 11 to 15 7 More than 0.9 and less than 1.2 greater than 0.9
1.2 or less 16 to 20 6 More than 1.2 and less than 1.5 1.2 Exceeded
1.5 or less 21 to 25 5 More than 1.5 and less than 1.8 more than 1.5
1.8 or less 26 to 30 4 More than 1.8 and less than 2.1 greater than 1.8
2.1 and below 31 to 35 3 More than 2.1 and less than 2.4 2.1 Exceeded
2.4 and below 36 to 40 2 More than 2.4 and less than 2.7 over 2.4
2.7 or less 41 to 45 One More than 2.7 and less than 3.0 over 2.7
3.0 or less 46 to 50 0 greater than 3.0 greater than 3.0 51 or more

Experiment result

EXAMPLES EXPERIMENTAL RESULTS

cleanliness corrosion protection Precipitation prevention degree Example 1 10 9 9 Example 2 10 10 9 Example 3 10 10 10 Example 4 10 10 10 Example 5 10 10 10 Example 6 10 10 9 Example 7 10 10 9 Example 8 9 10 10 Example 9 10 10 10 Example 10 10 10 10 Example 11 10 10 9 Example 12 10 10 9 Example 13 10 10 10 Example 14 10 10 10 Example 15 9 10 10 Example 16 10 10 9 Example 17 10 10 10 Example 18 10 10 10 Example 19 10 10 10 Example 20 10 10 10 Example 21 9 10 10 Example 22 9 10 10 Example 23 10 9 9 Example 24 10 10 9 Example 25 10 10 10 Example 26 10 10 10 Example 27 9 10 9 Example 28 9 10 9 Example 29 10 10 10 Example 30 10 10 10 Example 31 10 10 10 Example 32 10 10 10 Example 33 10 10 10 Example 34 10 10 10 Example 35 10 10 10 Example 36 10 10 10 Example 37 10 10 10 Example 38 10 10 10 Example 39 10 10 10 Example 40 10 10 10 Example 41 10 10 10 Example 42 10 10 10

Comparative Example Experimental Results

cleanliness corrosion protection Precipitation prevention degree Comparative Example 1 One 8 2 Comparative Example 2 7 10 8 Comparative Example 3 2 8 9 Comparative Example 4 6 9 9 Comparative Example 5 4 6 6 Comparative Example 6 6 8 8 Comparative Example 7 7 3 5 Comparative Example 8 7 9 8 Comparative Example 9 7 8 10 Comparative Example 10 8 7 9 Comparative Example 11 5 7 9 Comparative Example 12 3 6 9 Comparative Example 13 4 7 9 Comparative Example 14 4 8 6 Comparative Example 15 One 8 2 Comparative Example 16 2 7 4

As shown in Tables 4 and 5, iodine, potassium iodide, ketone-based organic solvent or ester-based organic solvent, alkanolamine (diglycolamine) and EDTA-4Na are all included,

As a ketone-based organic solvent, gamma butyrolactone (γ-butyrolactone), methylethylketone (methylethylketone), methylcyclohexanone (methylcyclohexanone), 1-hexen-3-one (1-HEXEN-3-ONE), dihydrofuran containing -3-one, dehydrofurane-3-one, acetoxyethylene, 2-oxobutanaldehyde, 2-heptanone or diisobutylketone; or , including carbitol acetate as an ester-based organic solvent,

Diglycolamine, amino-3-methoxy-propanol (1-amino-3-methoxy-propanol), 2,2-dimethoxyethaneamine (2,2-Dimethoxyethaneamine), 2-( Methoxyamino)ethanol (2-(methoxyamino)ethanol), 2-(2-aminoethoxy)methanol (2-(2-Aminoethoxy)methanol) and 2-(2-methoxyethoxy)ethanamine (2- The compositions according to Examples 1 to 42 containing (2-methoxyethoxy)ethaneamine) were measured to have a cleaning degree, corrosion prevention degree, and precipitation prevention degree of 9 or more.

For reference, in Examples 1 to 42 and the experiments, as ketone-based solvents, gamma butyrolactone (γ-butyrolactone), methylethylketone (methylethylketone), methylcyclohexanone (methylcyclohexanone), 1-hexen-3-one ( 1-HEXEN-3-ONE), dihydrofurane-3-one, acetoxyethylene, 2-oxobutanaldehyde, 2-heptanone ) or diisobutylketone was used, but the metal mask cleaning composition according to the present invention is a ketone-based solvent in addition to methylpropylketone, methylbutylketone, and isopropylmethylketone. , ethylethylketone, isobutylmethylketone, ethylpropylketone, methylcyclopentanone, cyclomethylketone, even when using the same as in Examples 1 to 42 It has a degree of cleaning, corrosion prevention and precipitation prevention.

In addition, in Examples 1 to 42 and the experiments, as alkanolamines, diglycolamine, amino-3-methoxy-propanol, 2,2-dimethoxyethane Amine (2,2-Dimethoxyethaneamine), 2-(methoxyamino)ethanol (2-(methoxyamino)ethanol), 2-(2-aminoethoxy)methanol (2-(2-Aminoethoxy)methanol) and 2-( Although 2-methoxyethoxy)ethaneamine (2-(2-methoxyethoxy)ethaneamine) was used, the metal mask cleaning composition according to the present invention is also an alkanolamine, such as diethanolamine, 3-(ami Noxy)-1-propanol (3-Aminoxy-1-propanol), 2- (3-aminopropoxy) ethanol (2- (3-Aminopropoxy) ethanol) and 2- (2-methoxyethylamino) ethanol ( 2-(2-methoxyethylamino)ethanol) has the same degree of cleaning, corrosion prevention, and precipitation prevention as in Examples 1 to 42.

In contrast, Comparative Examples 1, 3, 7, and 9 which do not contain any one or more of iodine, potassium iodide, ketone-based organic solvent or ester-based organic solvent, alkanolamine, and EDTA-4Na;

Even if iodine, potassium iodide, ketone-based organic solvent or ester-based organic solvent, alkanolamine, and EDTA-4Na are all included, the content of each component is out of the content range of Examples 1 to 42 Comparative Examples 2, 4, 5, 6 , 8, 10 and

Even if potassium iodide, iodine, ketone-based organic solvent or ester-based organic solvent, alkanolamine, and EDTA-4Na are all included, it is used in Examples 1 to 42 and the composition for cleaning a metal mask according to the present invention further described above. Comparative Examples 11, 12, and 13 containing alkylamines instead of alkanolamines;

Potassium iodide, iodine, ketone-based organic solvent or ester-based organic solvent, alkanolamine, and EDTA-4Na as a ketone-based organic solvent or ester-based organic solvent, Examples 1 to 42 and the present invention further described above Comparative Examples 14, 15, and 16 containing an organic solvent other than the ketone-based solvent used in the composition for cleaning a metal mask according to .

More specifically, in the case of the compositions according to Examples 1 to 28 including gamma-butyrolactone, which is a ketone-based organic solvent, as an organic solvent,

In a composition comprising 1 to 7 wt% of potassium iodide, 0.5 to 4 wt% of iodine, 20 to 50 wt% of an organic solvent, 1 to 8 wt% of diglycolamine, and 0.1 to 3 wt% of EDTA-4Na, the degree of cleanliness, corrosion The overall degree of prevention and settling prevention was found to be over 9.

In particular, in a composition comprising 3 to 5 wt% of potassium iodide, 1 to 3 wt% of iodine, 30 to 45 wt% of a ketone solvent, 2 to 6 wt% of an alkanolamine and 1 to 2 wt% of EDTA-4Na, the degree of cleaning , corrosion prevention and precipitation prevention were found to satisfy 10 overall.

In addition, in the case of the compositions according to Examples 29 to 36 using ketone-based organic solvents other than gamma butyrolactone as organic solvents and Example 37 using carbitol esters, which are ester-based organic solvents,

When 4 wt% of potassium iodide, 2 wt% of iodine, 35 wt% of organic solvent, 4 wt% of diglycolamine and 1.5 wt% of EDTA-4Na are included, gamma butyrolactone, a ketone-based organic solvent, as an organic solvent in the same composition As in Example 4 using

Therefore, the present invention is an organic solvent in the mask cleaning composition, instead of gamma butyrolactone, methylethylketone, methylpropylketone, methylbutylketone, isopropylmethylketone, ethylethyl Ketone (ethylethylketone), isobutylmethylketone (isobutylmethylketone), ethylpropylketone (ethylpropylketone), methylcyclohexanone (methylcyclohexanone), methylcyclopentanone (Methylcyclopentanone), cyclomethylketone (cyclomethylketone), 1-hexen-3-one (1-HEXEN-3-ONE), dihydrofurane-3-one, acetoxyethylene, 2-oxobutanaldehyde, 2-heptanone (2- Heptanone) or carbitol ester, it is possible to prepare a composition for cleaning a mask having the same performance as when gamma butyrolactone is included.

In addition, in the case of the compositions according to Examples 38 to 42 using an alkanolamine other than diglycolamine as the alkanolamine,

Example 4 using diglycolamine as an alkanolamine in the same composition when potassium iodide 4 wt%, iodine 2 wt%, organic solvent 35 wt%, alkanolamine 4 wt%, and EDTA-4Na 1.5 wt% were included It was found that the degree of cleaning, corrosion protection, and precipitation prevention were overall satisfying 10.

Therefore, the present invention is an alkanolamine in the mask cleaning composition, instead of diglycolamine, amino-3-methoxy-propanol (1-amino-3-methoxy-propanol), diethanolamine (Diethanolamine), 2,2- Dimethoxyethaneamine (2,2-Dimethoxyethaneamine), 3-(Aminoxy)-1-propanol (3-Aminoxy-1-propanol), 2-(methoxyamino)ethanol (2-(methoxyamino)ethanol), 2- (2-aminoethoxy) methanol (2- (2-Aminoethoxy) methanol), 2- (2-methoxyethoxy) ethaneamine (2- (2-methoxyethoxy) ethaneamine), 2- (3-amino By including propoxy) ethanol (2- (3-Aminopropoxy) ethanol) or 2- (2-methoxyethylamino) ethanol (2- (2-methoxyethylamino) ethanol), diglycolamine was included as an alkanolamine. It is possible to prepare a composition for cleaning a mask having the same performance as when used.

In addition, as shown in the experimental results of Comparative Example 14, it contains iodine, potassium iodide, an organic solvent, alkanolamine, and EDTA-4Na, and in this case, methyl acetate, an ester-based organic solvent other than carbitol acetate, was used as the organic solvent. In this case, it was found that the performance was significantly reduced to 4, 8 for corrosion prevention, and 6 for precipitation prevention. That is, when carbitol acetate is used in the same ester-based organic solvent, the degree of cleaning, corrosion prevention and precipitation prevention are significantly improved.

In addition, as shown in the experimental results of Comparative Examples 15 and 16, in the composition containing iodine, potassium iodide, an organic solvent, an alkanolamine and EDTA-4Na, when using an organic solvent other than a ketone-based organic solvent or an ester-based organic solvent , the cleaning degree was 2 or less, the corrosion protection degree was 8 or less, and the precipitation prevention degree was 4 or less, indicating that the overall performance of the metal mask composition was significantly reduced.

As described above, the present invention has been described with reference to the accompanying drawings, which are merely exemplary and those of ordinary skill in the art to which the present invention pertains will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the technical protection scope of the present invention should be defined by the following claims.

Claims (9)

A metal mask cleaning composition comprising potassium iodide, iodine, a ketone-based organic solvent and/or an ester-based organic solvent, an alkanolamine, EDTA-4Na, and ultrapure water.
According to claim 1,
The ketone-based organic solvent is
Gamma butyrolactone (γ-butyrolactone), methylethylketone (methylethylketone), methylpropylketone (methylbutylketone), methylbutylketone (methylbutylketone), isopropylmethylketone (isopropylmethylketone), ethylethylketone (ethylethylketone), isobutylmethylketone (isobutylmethylketone), ethylpropylketone, methylcyclohexanone, methylcyclopentanone, cyclomethylketone, 1-hexen-3-one (1-HEXEN-3-ONE) , dihydrofurane-3-one, acetoxyethylene, 2-oxobutanaldehyde, 2-heptanone, and diisobutylketone ) A metal mask cleaning composition comprising at least one of.
According to claim 1,
The ester-based organic solvent is
A metal mask cleaning composition comprising carbitol acetate.,
According to claim 1,
The alkanolamine is
Diglycolamine, amino-3-methoxy-propanol (1-amino-3-methoxy-propanol), diethanolamine (Diethanolamine), 2,2-dimethoxyethaneamine (2,2-Dimethoxyethaneamine), 3-(Aminoxy)-1-propanol (3-Aminoxy-1-propanol), 2-(methoxyamino)ethanol (2-(methoxyamino)ethanol), 2-(2-aminoethoxy)methanol (2 -(2-Aminoethoxy)methanol), 2-(2-methoxyethoxy)ethane amine), 2-(3-aminopropoxy)ethanol (2-(3-Aminopropoxy ) ethanol) and 2-(2-methoxyethylamino)ethanol (2-(2-methoxyethylamino)ethanol) A metal mask cleaning composition comprising at least one of ethanol).
According to claim 1,
The metal mask cleaning composition,
The composition for cleaning a metal mask, characterized in that the content of the potassium iodide is 1 to 7 wt%.
According to claim 1,
The metal mask cleaning composition,
The composition for cleaning a metal mask, characterized in that the content of the iodine is 0.5 to 4 wt%.
According to claim 1,
The metal mask cleaning composition,
The composition for cleaning a metal mask, characterized in that the content of the organic solvent is 20 to 50 wt%.
According to claim 1,
The metal mask cleaning composition,
The composition for cleaning a metal mask, characterized in that the content of the alkanolamine is 1 to 8 wt%.
According to claim 1,
The metal mask cleaning composition,
The composition for cleaning a metal mask, characterized in that the content of the EDTA-4Na is 0.1 to 3 wt%.

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