WO2019043841A1 - Component mounting machine - Google Patents

Component mounting machine Download PDF

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Publication number
WO2019043841A1
WO2019043841A1 PCT/JP2017/031207 JP2017031207W WO2019043841A1 WO 2019043841 A1 WO2019043841 A1 WO 2019043841A1 JP 2017031207 W JP2017031207 W JP 2017031207W WO 2019043841 A1 WO2019043841 A1 WO 2019043841A1
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Prior art keywords
slides
slide
mounting machine
mounting
main body
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PCT/JP2017/031207
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French (fr)
Japanese (ja)
Inventor
山田　修平
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株式会社Ｆｕｊｉ
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Priority to JP2019538827A priority Critical patent/JP7129415B2/en
Priority to PCT/JP2017/031207 priority patent/WO2019043841A1/en
Publication of WO2019043841A1 publication Critical patent/WO2019043841A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the component mounting machine of this type is provided with two XY moving devices for moving two mounting heads separately in the XY directions as described in Patent Document 1 (Japanese Patent Laid-Open No. 2004-241595), and each XY
  • the moving device moves an X slide (X-axis table) for moving each mounting head in the X direction, which is the carrying direction of the circuit board, and a Y slide (Y for moving the X slide in the Y direction, which is orthogonal to the X direction). And an axis table).
  • two mounting heads for mounting components on a circuit board transported by a conveyor and two separately moving the two mounting heads in the X direction which is the transport direction of the circuit board
  • Two XY moving devices configured by combining an X slide and two Y slides that move the two X slides separately in the Y direction that is orthogonal to the X direction, and the Y direction of the two Y slides
  • two linear scales arranged to extend in parallel to the Y direction to measure the position information of the Y position
  • the two Y Component mounter provided with two sensors for reading the information, wherein the two XY moving devices move different regions in the X direction in the two Y slides in the Y direction And each driving source for moving the respective X slide and the X slide in the X direction are supported by the respective Y slides, and the respective mounting heads are supported by the respective X slides
  • the two linear scales are disposed close to the substrate loading side and the substrate unloading side of the mounting machine main body supporting the two XY moving devices, and
  • FIG. 1 is a perspective view showing an arrangement of two component mounters according to one embodiment and removing a feeder, an upper cover and the like from one component mounter.
  • FIG. 2 is an enlarged perspective view showing a component mounting machine from which a feeder, an upper cover, a reinforcing member and the like are removed.
  • FIG. 3 is a plan view of the component mounting machine shown in FIG.
  • FIG. 4 is an enlarged vertical sectional view of the main part shown along the line IV-IV in FIG.
  • FIG. 5 is a block diagram showing the configuration of a control system of the component mounting machine.
  • FIG. 6 is a schematic plan view for explaining the influence of the deformation of the mounting machine main body in the comparative example.
  • FIG. 7 is a schematic plan view for explaining the influence of the deformation of the mounting machine main body in the present embodiment.
  • the two XY moving devices 14L and 14R have the same configuration and the same size, and two X slides 15L and 15R for moving the two mounting heads 13L and 13R separately in the X direction, and the X slides 15L and 15R. Are separately moved in the Y direction, and are configured in combination with two Y slides 16L and 16R.
  • Each mounting head 13L, 13R holds one or a plurality of suction nozzles 18 (see FIG. 2) for suctioning components, and descends the suction nozzles 18 during component suction operation and component mounting operation.
  • Z-axis drive devices 19L and 19R (see FIG. 5) for raising / lowering are provided.
  • Each of the mounting heads 13L and 13R may be a rotary mounting head or a non-rotating mounting head.
  • each X-axis drive device 17L, 17R for moving each X slide 15L, 15R in the X direction
  • an encoder provided on a motor of the feed screw device
  • the position pulses of the X slides 15L and 15R in the X direction may be calculated from the count value of the output pulses of the above.
  • the linear scale 33L for measuring the Y-direction position (Y coordinate) of the Y slide 16L on the substrate loading side The linear scale 33R, which is arranged close to the side and measures the position in the Y direction of the Y slide 33R on the board unloading side, is arranged close to the board unloading side of the mounting machine body 31 (that is, two linear scales 33L , 33R are arranged close to the substrate loading side and substrate unloading side of the mounting machine main body 31, and are not arranged at the center side of the mounting machine main body 31).
  • a linear scale is used to measure the position in the Y direction of the other Y slide being stopped at a portion where the amount of deformation of the mounting machine main body 31 due to the reaction force when one Y slide moves in the Y direction is small. Is arranged.
  • the linear scale that measures the position in the Y direction of the other Y slide being stopped due to the deformation is Y
  • the amount of misalignment in the direction can be significantly reduced, and the amount of misalignment caused by the other Y slide being stopped being driven in the Y direction by misalignment of the linear scale in the Y direction is significantly reduced.
  • the substrate loading side of the mounting main body 31 can be prevented from deforming the left and right frames 34L, 34R holding the linear scales 33L, 33R arranged on the substrate delivery side, and the measurement accuracy of the Y-direction position of each Y slide 16L, 16R is further improved There is an advantage that can be done.

Abstract

This component mounting machine is provided with: two XY-moving devices (14L, 14R) in which two X-slides (15L, 15R) for moving two mounting heads (13L, 13R) separately in the X-direction are combined with two Y-slides (16L, 16R) for separately moving the two X-slides in the Y-direction; and two linear scales (33L, 33R) extending parallel to the Y-direction to measure position information about the two Y-slides with respect to the Y-direction. The two XY-moving devices are arranged to move the two Y-slides in the Y-direction in different regions in the X-direction. The X-slides and drive sources for moving the respective X-slides in the X-direction are respectively supported on the respective Y-slides, the X-slides supporting the respective mounting heads. The two linear scales are arranged on a mounting machine body (31) supporting the two XY-moving devices, and are respectively disposed toward a substrate loading side and a substrate unloading side.

Description

部品実装機Component mounting machine
　本明細書は、コンベアで搬送されてくる回路基板に部品を実装する２つの実装ヘッドを備えた部品実装機に関する技術を開示したものである。 This specification discloses the technology regarding the component mounting machine provided with two mounting heads which mount components on the circuit board conveyed with a conveyor.
　この種の部品実装機は、特許文献１（特開２００４－２４１５９５号公報）に記載されているように、２つの実装ヘッドを別々にＸＹ方向に移動させる２つのＸＹ移動装置を備え、各ＸＹ移動装置は、各実装ヘッドを回路基板の搬送方向であるＸ方向に移動させるＸスライド（Ｘ軸テーブル）と、このＸスライドをＸ方向と直交する方向であるＹ方向に移動させるＹスライド（Ｙ軸テーブル）とを備えた構成となっている。この場合、２つのＸＹ移動装置は、２つのＹスライドがＸ方向に異なる領域（基板搬入側の領域と基板搬出側の領域）をＹ方向に移動するように配置され、且つ、各Ｙスライドに各ＸスライドとそれをＸ方向に移動させる各駆動源（リニアモータ又は送りねじ装置）が支持されていると共に、各Ｘスライドに各実装ヘッドが支持された構成となっている。 The component mounting machine of this type is provided with two XY moving devices for moving two mounting heads separately in the XY directions as described in Patent Document 1 (Japanese Patent Laid-Open No. 2004-241595), and each XY The moving device moves an X slide (X-axis table) for moving each mounting head in the X direction, which is the carrying direction of the circuit board, and a Y slide (Y for moving the X slide in the Y direction, which is orthogonal to the X direction). And an axis table). In this case, the two XY moving devices are arranged so that the two Y slides move different regions in the X direction (the region on the substrate loading side and the region on the substrate unloading side) in the Y direction, and each Y slide Each X slide and each drive source (linear motor or feed screw device) for moving it in the X direction are supported, and each mounting head is supported by each X slide.
　この種の部品実装機は、２つの実装ヘッドのＸＹ方向の位置（ＸＹ座標）を精度良く位置決め制御するために、２つの実装ヘッドのＸＹ方向の位置を正確に測定する必要がある。特許文献１には、実装ヘッドのＸ座標（ＸスライドのＸ座標）の測定を、Ｘスライドの移動方向に沿ってＹスライドに設けたリニアスケールを使用して行うことが記載されているが、実装ヘッドのＹ座標（ＹスライドのＹ座標）の測定方法については記載されていない。一般には、実装ヘッドのＹ座標（ＹスライドのＹ座標）の測定は、Ｙスライドの移動方向に沿って実装機本体側に固定したリニアスケールを使用して行うものが多い。 In this type of component mounter, it is necessary to accurately measure the positions of the two mounting heads in the X and Y directions in order to control the positions of the two mounting heads in the X and Y directions (X and Y coordinates) with high accuracy. Patent Document 1 describes that measurement of the X coordinate of the mounting head (X coordinate of X slide) is performed using a linear scale provided on the Y slide along the moving direction of the X slide. The method of measuring the Y coordinate of the mounting head (Y coordinate of Y slide) is not described. Generally, measurement of the Y coordinate of the mounting head (Y coordinate of Y slide) is often performed using a linear scale fixed on the mounting machine main body side along the moving direction of the Y slide.
特開２００４－２４１５９５号公報Unexamined-Japanese-Patent No. 2004-241595
　ところで、各Ｙスライドには、各実装ヘッドを支持する各ＸスライドとそれをＸ方向に移動させる各駆動源（リニアモータ又は送りねじ装置）が支持されているため、各ＹスライドをＹ方向に移動させるときに、各Ｙスライドと一体的に各実装ヘッドと各Ｘスライド及びその駆動源の全てを同時にＹ方向に移動させることになる。これにより、各ＹスライドをＹ方向に移動させるときに各Ｙスライド側から実装機本体に作用する反力がかなり大きくなるため、２つのＹスライドのうち、片方のＹスライドがＹ方向に移動するときに、大きな反力が２つのＸＹ移動装置を支持する実装機本体にＹ方向に作用して該実装機本体がＹ方向に変形してしまう。その際、実装機本体の変形は、一様に生じるものではなく、図６に示すように、ＹスライドがＹ方向に移動した側がＹ方向に大きく変形し、Ｙスライドが停止している側は、変形量が小さい。 By the way, since each X slide supporting each mounting head and each drive source (linear motor or feed screw device) for moving it in the X direction are supported by each Y slide, each Y slide in the Y direction When moving, each mounting head, each X slide, and all of its drive sources are simultaneously moved in the Y direction integrally with each Y slide. As a result, when moving each Y slide in the Y direction, the reaction force acting on the mounter main body from each Y slide side becomes considerably large, so one Y slide of the two Y slides moves in the Y direction. Sometimes, a large reaction force acts on the mounting machine body supporting the two XY moving devices in the Y direction, and the mounting machine body is deformed in the Y direction. At that time, the deformation of the mounting machine main body does not occur uniformly, and as shown in FIG. 6, the side where the Y slide moves in the Y direction is largely deformed in the Y direction, and the side where the Y slide stops is , The amount of deformation is small.
　１台の部品実装機に２つのＸＹ移動装置を設ける場合、同一構成のＸＹ移動装置を２つ並べて配置した構成とするのが一般的である。この場合、２つの実装ヘッドのＹ座標（ＹスライドのＹ座標）を２つのリニアスケールを使用して測定する場合、各リニアスケールの配置も各Ｙスライドに対して同じ配置となり、各Ｙスライドの左側（基板搬入側）に各リニアスケールを配置した構成、又は、各Ｙスライドの右側（基板搬出側）に各リニアスケールを配置した構成のどちらかとなる。いずれの場合も、２つのリニアスケールのうちの片方のリニアスケールが実装機本体の中央側に配置された構成となる。 When two XY movers are provided in one component mounter, generally, two XY movers having the same configuration are arranged side by side. In this case, when measuring the Y coordinate of two mounting heads (Y coordinate of Y slide) using two linear scales, the arrangement of each linear scale is also the same for each Y slide, and Either the configuration in which each linear scale is disposed on the left side (substrate loading side) or the configuration in which each linear scale is disposed on the right side (substrate unloading side) of each Y slide. In either case, one of the two linear scales is arranged at the center of the mounting machine body.
　この場合、例えば、各Ｙスライドの左側（基板搬入側）に各リニアスケールを配置した構成では、図６に示すように、左側のＹスライドがＹ方向に移動して実装機本体が変形した場合に、右側のＹスライドは停止しているのに、該実装機本体の中央側がＹ方向に変形して該実装機本体の中央側に固定されたリニアスケールの位置がＹ方向にずれてしまう。その結果、停止している右側のＹスライドのＹ座標の測定値がずれるため、そのずれを補正するように右側のＹスライドがＹ方向に駆動されて右側の実装ヘッドの位置がＹ方向にずれてしまい、そのずれが実装ヘッドの位置決め精度を低下させて部品実装精度を低下させる要因となる。 In this case, for example, in the configuration in which each linear scale is disposed on the left side (substrate loading side) of each Y slide, as shown in FIG. 6, the Y slide on the left side moves in the Y direction and the mounter body is deformed. Although the Y slide on the right side is stopped, the center side of the mounting machine main body is deformed in the Y direction, and the position of the linear scale fixed to the center side of the mounting machine main body is shifted in the Y direction. As a result, since the measurement value of the Y coordinate of the stopped right Y slide shifts, the right Y slide is driven in the Y direction to correct the shift, and the position of the right mounting head shifts in the Y direction. The misalignment reduces the positioning accuracy of the mounting head and causes the component mounting accuracy to decrease.
　この対策として、実装機本体全体の機械的強度を高めて該実装機本体の変形を防ぐことが考えられるが、近年の部品実装機は、部品実装速度を高速化するために各ＹスライドのＹ方向の移動速度が高速化されて各Ｙスライド側から実装機本体に作用する反力が益々大きくなる傾向があるため、実装機本体全体の機械的強度の増強によって上述した課題を解決するには、実装機本体全体の機械的強度を大幅に高める必要があり、実装機本体の製造コストが大幅にアップする欠点がある。 As a countermeasure, it is conceivable to increase the mechanical strength of the entire mounting machine main body to prevent the deformation of the mounting machine main body, but in the recent component mounting machine, the Y of each Y slide is used to speed up the component mounting speed. As the moving speed in the direction is accelerated and the reaction force acting on the mounting machine main body from each Y slide side tends to increase further, the above-mentioned problem can be solved by enhancing the mechanical strength of the entire mounting machine main body However, the mechanical strength of the mounting machine main body needs to be greatly increased, and the manufacturing cost of the mounting machine main body is greatly increased.
　上記課題を解決するために、コンベアで搬送されてくる回路基板に部品を実装する２つの実装ヘッドと、前記２つの実装ヘッドを別々に前記回路基板の搬送方向であるＸ方向に移動させる２つのＸスライドと該２つのＸスライドを別々にＸ方向と直交する方向であるＹ方向に移動させる２つのＹスライドとを組み合わせて構成された２つのＸＹ移動装置と、前記２つのＹスライドのＹ方向の位置情報を測定するためにＹ方向に平行に延びるように配置された２つのリニアスケールと、前記２つのＹスライドにそれぞれ設けられ、前記２つのリニアスケールから各ＹスライドのＹ方向の位置情報を読み取る２つのセンサとを備えた部品実装機であって、前記２つのＸＹ移動装置は、前記２つのＹスライドがＸ方向に異なる領域をＹ方向に移動するように配置され、且つ、前記各Ｙスライドに前記各ＸスライドとそれをＸ方向に移動させる各駆動源が支持されていると共に、前記各Ｘスライドに前記各実装ヘッドが支持され、前記２つのリニアスケールは、前記２つのＸＹ移動装置を支持する実装機本体のうちの基板搬入側と基板搬出側に寄せて配置され、前記２つのセンサは、前記２つのＹスライドのうちの前記２つのリニアスケールから各ＹスライドのＹ方向の位置情報を読み取り可能な位置に配置された構成としたものである。 In order to solve the above problems, two mounting heads for mounting components on a circuit board transported by a conveyor, and two separately moving the two mounting heads in the X direction which is the transport direction of the circuit board Two XY moving devices configured by combining an X slide and two Y slides that move the two X slides separately in the Y direction that is orthogonal to the X direction, and the Y direction of the two Y slides And two linear scales arranged to extend in parallel to the Y direction to measure the position information of the Y position, and the two Y Component mounter provided with two sensors for reading the information, wherein the two XY moving devices move different regions in the X direction in the two Y slides in the Y direction And each driving source for moving the respective X slide and the X slide in the X direction are supported by the respective Y slides, and the respective mounting heads are supported by the respective X slides, The two linear scales are disposed close to the substrate loading side and the substrate unloading side of the mounting machine main body supporting the two XY moving devices, and the two sensors are the two of the two Y slides. The configuration is such that the positional information of each Y slide in the Y direction can be read from the linear scale.
　この場合、２つのＹスライドのうち、基板搬入側のＹスライドをＹ方向に移動させるときには、その反力による実装機本体の変形量は基板搬出側の側面部で最小となり、一方、基板搬出側のＹスライドをＹ方向に移動させるときには、その反力による実装機本体の変形量は基板搬入側の側面部で最小となる。従って、基板搬入側のＹスライドのＹ方向の位置（Ｙ座標）を測定するリニアスケールは、実装機本体の基板搬入側に寄せて配置し、一方、基板搬出側のＹスライドのＹ方向の位置を測定するリニアスケールは、実装機本体の基板搬出側に寄せて配置した構成（つまり２つのリニアスケールを実装機本体のうちの基板搬入側と基板搬出側に寄せて配置して実装機本体の中央側に配置しない構成）とすれば、一方のＹスライドがＹ方向に移動したときの反力による実装機本体の変形量が小さい部位に、停止中の他方のＹスライドのＹ方向の位置を測定するリニアスケールを配置した構成となる。これにより、一方のＹスライドがＹ方向に移動したときの反力により実装機本体が変形しても、その変形によって停止中の他方のＹスライドのＹ方向の位置を測定するリニアスケールがＹ方向に位置ずれする量を大幅に低減することができて、当該リニアスケールのＹ方向への位置ずれによって停止中の他方のＹスライドがＹ方向に駆動されて位置ずれする量を大幅に低減することができ、実装機本体の変形によって実装ヘッドの位置決め精度が低下することを極力防止することができる。しかも、この効果は、リニアスケールの配置を変えるだけで得られるため、実装機本体全体の機械的強度を大幅に高める必要がなく、実装機本体の製造コストの大幅アップも回避できる利点もある。 In this case, when moving the Y slide on the substrate loading side of the two Y slides in the Y direction, the amount of deformation of the mounting machine main body due to the reaction force is minimized at the side surface part on the substrate unloading side. When moving the Y slide in the Y direction, the amount of deformation of the mounting machine body due to the reaction force is minimized at the side surface portion on the substrate loading side. Therefore, the linear scale that measures the Y-direction position (Y coordinate) of the Y slide on the substrate loading side is placed close to the substrate loading side of the mounting machine main body, while the Y position of the Y slide on the substrate unloading side The linear scale to measure the configuration is placed close to the board unloading side of the mounting machine main body (ie two linear scales are placed close to the substrate loading side and board unloading side of the mounting machine main body and If the configuration is not arranged at the center side), the Y-direction position of the other Y-sliding at a stop is at a portion where the amount of deformation of the mounting machine main body by reaction force when one Y-slide moves in the Y-direction It becomes the composition which arranged the linear scale to measure. Thus, even if the mounting machine body is deformed by the reaction force when one Y slide moves in the Y direction, the linear scale that measures the Y direction position of the other Y slide being stopped due to the deformation is Y direction The amount of misalignment can be significantly reduced, and the amount of misalignment caused when the other Y slide at rest is driven in the Y direction by the misalignment of the linear scale in the Y direction is significantly reduced. It is possible to prevent, as much as possible, the lowering of the positioning accuracy of the mounting head due to the deformation of the mounting machine main body. Moreover, since this effect can be obtained only by changing the arrangement of the linear scale, there is no need to greatly increase the mechanical strength of the entire mounting machine main body, and there is also an advantage that significant increase in manufacturing cost of the mounting main body can be avoided.
図１は一実施例の部品実装機を２台配列し、一方の部品実装機からフィーダや上部カバー等を取り除いて示す斜視図である。FIG. 1 is a perspective view showing an arrangement of two component mounters according to one embodiment and removing a feeder, an upper cover and the like from one component mounter. 図２はフィーダ、上部カバー、補強部材等を取り除いた部品実装機を拡大して示す斜視図である。FIG. 2 is an enlarged perspective view showing a component mounting machine from which a feeder, an upper cover, a reinforcing member and the like are removed. 図３は図２に示す部品実装機の平面図である。FIG. 3 is a plan view of the component mounting machine shown in FIG. 図４は図３のIV－IV線に沿って示す主要部の拡大縦断面図である。FIG. 4 is an enlarged vertical sectional view of the main part shown along the line IV-IV in FIG. 図５は部品実装機の制御系の構成を示すブロック図である。FIG. 5 is a block diagram showing the configuration of a control system of the component mounting machine. 図６は比較例における実装機本体の変形の影響を説明する概略平面図である。FIG. 6 is a schematic plan view for explaining the influence of the deformation of the mounting machine main body in the comparative example. 図７は本実施例における実装機本体の変形の影響を説明する概略平面図である。FIG. 7 is a schematic plan view for explaining the influence of the deformation of the mounting machine main body in the present embodiment.
　以下、図面を用いて一実施例を説明する。
　まず、図１乃至図５を用いて部品実装機１０の構成を説明する。
　この部品実装機１０は、部品実装基板を生産する部品実装ラインに少なくとも１台設置される。図１は、２台の部品実装機１０を設置した例を示している。 Hereinafter, one embodiment will be described using the drawings.
First, the configuration of the component mounter 10 will be described using FIGS. 1 to 5.
At least one component mounter 10 is installed in a component mounting line for producing a component mounting board. FIG. 1 shows an example in which two component mounters 10 are installed.
　部品実装機１０は、コンベア１１で搬送されてくる回路基板１２に部品を実装する２つの実装ヘッド１３Ｌ，１３Ｒ（図２参照）と、２つの実装ヘッド１３Ｌ，１３Ｒを別々に回路基板１２の搬送方向であるＸ方向とこのＸ方向と直交する方向であるＹ方向に移動させる２つのＸＹ移動装置１４Ｌ，１４Ｒとを備えた構成となっている。 The component mounting machine 10 transports the circuit board 12 separately from the two mounting heads 13L and 13R (see FIG. 2) for mounting components on the circuit board 12 transported by the conveyor 11 and the two mounting heads 13L and 13R. It is configured to include two X and Y movement devices 14L and 14R which move in the X direction which is the direction and in the Y direction which is the direction orthogonal to the X direction.
　２つのＸＹ移動装置１４Ｌ，１４Ｒは、同一の構成でサイズも同じであり、２つの実装ヘッド１３Ｌ，１３Ｒを別々にＸ方向に移動させる２つのＸスライド１５Ｌ，１５Ｒと、該Ｘスライド１５Ｌ，１５Ｒを別々にＹ方向に移動させる２つのＹスライド１６Ｌ，１６Ｒとを組み合わせて構成されている。２つのＸＹ移動装置１４Ｌ，１４Ｒは、２つのＹスライド１６Ｌ，１６ＲがＸ方向に異なる領域（基板搬入側の領域と基板搬出側の領域）をＹ方向に移動するように配置され、且つ、各Ｙスライド１６Ｌ，１６Ｒには、各Ｘスライド１５Ｌ，１５Ｒが支持されていると共に、各Ｘスライド１５Ｌ，１５ＲをＸ方向に移動させる各駆動源である各Ｘ軸駆動装置１７Ｌ，１７Ｒ（図５参照）が支持されている。 The two XY moving devices 14L and 14R have the same configuration and the same size, and two X slides 15L and 15R for moving the two mounting heads 13L and 13R separately in the X direction, and the X slides 15L and 15R. Are separately moved in the Y direction, and are configured in combination with two Y slides 16L and 16R. The two XY moving devices 14L and 14R are arranged so that the two Y slides 16L and 16R move different areas in the X direction (area on the substrate loading side and area on the substrate unloading side) in the Y direction, and The X-slides 15L and 15R are supported by the Y- slides 16L and 16R, and X-axis drive devices 17L and 17R serving as drive sources for moving the X-slides 15L and 15R in the X direction (see FIG. 5) Is supported.
　各Ｘ軸駆動装置１７Ｌ，１７Ｒは、例えば送りねじ装置又はリニアモータ等を用いて構成されている。更に、各Ｙスライド１６Ｌ，１６Ｒに支持された各Ｘスライド１５Ｌ，１５Ｒには、各実装ヘッド１３Ｌ，１３Ｒが支持されていると共に、回路基板１２の基板マークを撮像するマーク撮像用のカメラ（図示せず）が支持されている。 Each X-axis drive device 17L, 17R is configured using, for example, a feed screw device or a linear motor. Furthermore, the mounting heads 13L and 13R are supported by the X slides 15L and 15R supported by the Y slides 16L and 16R, respectively, and a camera for imaging a mark that captures the board mark of the circuit board 12 (FIG. Not shown) is supported.
　各実装ヘッド１３Ｌ，１３Ｒには、それぞれ部品を吸着する１本又は複数本の吸着ノズル１８（図２参照）が保持されていると共に、部品吸着動作時と部品実装動作時に各吸着ノズル１８を下降／上昇させるＺ軸駆動装置１９Ｌ，１９Ｒ（図５参照）が設けられている。各実装ヘッド１３Ｌ，１３Ｒは、回転型の実装ヘッドであっても良いし、回転しない実装ヘッドであっても良い。 Each mounting head 13L, 13R holds one or a plurality of suction nozzles 18 (see FIG. 2) for suctioning components, and descends the suction nozzles 18 during component suction operation and component mounting operation. Z- axis drive devices 19L and 19R (see FIG. 5) for raising / lowering are provided. Each of the mounting heads 13L and 13R may be a rotary mounting head or a non-rotating mounting head.
　一方、各Ｙスライド１６Ｌ，１６ＲをＹ方向に移動させる駆動源であるＹ軸駆動装置は、リニアモータ２１Ｌ，２１Ｒを用いて構成されている。２つのリニアモータ２１Ｌ，２１Ｒは、各々のシャフト状の固定子２３Ｌ，２３ＲがＹ方向に平行に延びて各固定子２３Ｌ，２３ＲのＹ方向両端部が実装機本体３１に支持され、各固定子２３Ｌ，２３Ｒに沿って直線運動する各可動子２２Ｌ，２２Ｒに各Ｙスライド１６Ｌ，１６Ｒが取り付けられている。各リニアモータ２１Ｌ，２１ＲのＸ方向の位置は、各Ｙスライド１６Ｌ，１６ＲのＸ方向幅の中央に相当する位置となっている。本実施例では、各リニアモータ２１Ｌ，２１Ｒは、シャフト型のリニアモータを用いているが、フラット型のリニアモータを用いても良い。その他、Ｙ軸駆動装置は、リニアモータに代えて、送りねじ装置を用いて構成しても良い。 On the other hand, Y-axis drive devices, which are drive sources for moving the Y- slides 16L and 16R in the Y direction, are configured using linear motors 21L and 21R. In each of the two linear motors 21L and 21R, shaft- shaped stators 23L and 23R extend in parallel in the Y direction, and both ends of each stator 23L and 23R in the Y direction are supported by the mounting machine body 31. Each Y slide 16L, 16R is attached to each mover 22L, 22R which linearly moves along 23L, 23R. The position in the X direction of each linear motor 21L, 21R is a position corresponding to the center of the width in the X direction of each Y slide 16L, 16R. In the present embodiment, shaft linear motors are used as the linear motors 21L and 21R, but flat linear motors may be used. In addition, the Y-axis drive device may be configured using a feed screw device in place of the linear motor.
　各リニアモータ２１Ｌ，２１Ｒの固定子２３Ｌ，２３Ｒの両端部を支持する実装機本体３１は、部品実装機１０の骨組みを構成する箱型の構造体であり、その内側には、回路基板１２をＸ方向に搬送するコンベア１１が配置され、その上方を２つの実装ヘッド１３Ｌ，１３ＲがＸＹ方向に移動するようになっている。実装機本体３１の正面側には、部品を供給するテープフィーダ、トレイフィーダ等の部品供給装置３２（図１参照）をセットするスペースが設けられている。 The mounting machine main body 31 supporting both ends of the stators 23L and 23R of the linear motors 21L and 21R is a box-shaped structure forming a framework of the component mounting machine 10, and the circuit board 12 is provided inside thereof. A conveyor 11 for conveying in the X direction is disposed, and the two mounting heads 13L and 13R move in the XY direction above the conveyor 11. On the front side of the mounting machine body 31, there is provided a space for setting a component feeder 32 (see FIG. 1) such as a tape feeder for feeding components and a tray feeder.
　この種の部品実装機１０は、２つの実装ヘッド１３Ｌ，１３ＲのＸＹ方向の位置（ＸＹ座標）を精度良く位置決め制御するために、２つの実装ヘッド１３Ｌ，１３ＲのＸＹ方向の位置を正確に測定する必要がある。 The component mounter 10 of this type accurately measures the positions of the two mounting heads 13L and 13R in the XY direction in order to accurately control the positions (X and Y coordinates) of the two mounting heads 13L and 13R in the XY direction. There is a need to.
　そこで、本実施例では、各実装ヘッド１３Ｌ，１３ＲのＹ方向の位置情報（Ｙ座標）である各Ｙスライド１６Ｌ，１６ＲのＹ方向の位置情報（Ｙ座標）を測定するために、実装機本体３１に２つのリニアスケール３３Ｌ，３３Ｒ（図３、図４参照）がＹ方向に平行に延びるように設けられている。各リニアスケール３３Ｌ，３３Ｒは、例えば磁気式、光電式（光学式）、電磁誘導式等、いずれの方式のものであっても良い。 Therefore, in this embodiment, in order to measure Y-direction position information (Y-coordinate) of each Y slide 16L, 16R which is Y-direction-position information (Y-coordinate) of each mounting head 13L, 13R Two linear scales 33L and 33R (see FIG. 3 and FIG. 4) are provided on 31 so as to extend in parallel to the Y direction. Each of the linear scales 33L and 33R may be of any type, such as a magnetic type, a photoelectric type (optical type), or an electromagnetic induction type.
　２つのリニアスケール３３Ｌ，３３Ｒは、実装機本体３１の左右両端側（基板搬入側と基板搬出側）に寄せて配置され、実装機本体３１の中央側には配置されていない。各リニアスケール３３Ｌ，３３Ｒを取り付ける部分は、図３及び図４に示すように、実装機本体３１の左右両端部（基板搬入側の端部と基板搬出側の端部）にフランジ状に設けられた左右の各フレーム３４Ｌ，３４Ｒであり、左右の各フレーム３４Ｌ，３４Ｒの下面側には、各Ｙスライド１６Ｌ，１６Ｒの外側の端部をＹ方向にガイドする各ガイドレール３５Ｌ，３６Ｒ（図１、図４参照）が取り付けられていると共に、各リニアスケール３３Ｌ，３３Ｒが各ガイドレール３５Ｌ，３６Ｒと平行に取り付けられている。 The two linear scales 33L and 33R are disposed close to the left and right end sides (substrate loading side and substrate unloading side) of the mounting machine main body 31, and are not disposed at the center side of the mounting main body 31. The portions to which the linear scales 33L and 33R are attached are provided in the form of flanges at the left and right end portions of the mounting machine body 31 (the end portion on the substrate loading side and the end portion on the substrate unloading side) as shown in FIGS. Guide rails 35L and 36R for guiding the outer end portions of the Y slides 16L and 16R in the Y direction on the lower surface side of the left and right frames 34L and 34R. 4) are attached, and each linear scale 33L, 33R is attached in parallel with each guide rail 35L, 36R.
　実装機本体３１の中央部（２つのＸＹ移動装置１４Ｌ，１４Ｒの間）に梁状に設けられた中フレーム３７（図１乃至図３参照）の下面側には、各Ｙスライド１６Ｌ，１６Ｒの内側の端部をＹ方向にガイドする各ガイドレール３５Ｒ，３６Ｌ（図２参照）が取り付けられている。各Ｙスライド１６Ｌ，１６Ｒの左右両端部には、各ガイドレール３５Ｌ，３５Ｒ，３６Ｌ，３６Ｒと摺動自在に嵌合するガイド部材３８（図１、図４参照）が設けられている。 On the lower surface side of the middle frame 37 (see FIGS. 1 to 3) provided in a beam shape at the central portion (between the two XY moving devices 14L and 14R) of the mounting machine main body 31, the Y slides 16L and 16R are provided. Guide rails 35R and 36L (see FIG. 2) for guiding the inner end in the Y direction are attached. Guide members 38 (see FIGS. 1 and 4) slidably fitted with the guide rails 35L, 35R, 36L, 36R are provided at the left and right end portions of the Y slides 16L, 16R.
　各Ｙスライド１６Ｌ，１６Ｒのうち、各リニアスケール３３Ｌ，３３Ｒから各Ｙスライド１６Ｌ，１６ＲのＹ方向の位置情報を読み取り可能な位置に、その位置情報を読み取る各センサ４０Ｌ，４０Ｒ（図４、図５、図７参照）が設けられている。本実施例では、２つのリニアスケール３３Ｌ，３３Ｒと２つのセンサ４０Ｌ，４０Ｒは、実装機本体３１の左右両側（基板搬入側と基板搬出側）に対称に配置されている。 Among the Y slides 16L and 16R, the sensors 40L and 40R that read the position information of the Y scales 16L and 16R from the linear scales 33L and 33R so that the position information of the Y slides 16L and 16R can be read. 5, see FIG. 7). In the present embodiment, the two linear scales 33L, 33R and the two sensors 40L, 40R are disposed symmetrically on the left and right sides (substrate loading side and substrate unloading side) of the mounting machine main body 31.
　各実装ヘッド１３Ｌ，１３ＲのＸ方向の位置情報（Ｘ座標）である各Ｘスライド１５Ｌ，１５ＲのＸ方向の位置情報（Ｘ座標）を測定するために、各センサ４１Ｌ，４１Ｒ（図５参照）が設けられている。各Ｘスライド１５Ｌ，１５ＲのＸ方向の位置情報を測定する構成については図示しないが、例えば、各Ｙスライド１６Ｌ，１６Ｒに各Ｘスライド１５Ｌ，１５Ｒの移動方向であるＸ方向に沿って各リニアスケールを設け、各リニアスケールから各Ｘスライド１５Ｌ，１５ＲのＸ方向の位置情報を読み取る各センサ４１Ｌ，４１Ｒを各Ｘスライド１５Ｌ，１５Ｒに設けた構成としても良い。或は、各Ｘスライド１５Ｌ，１５ＲをＸ方向に移動させる各Ｘ軸駆動装置１７Ｌ，１７Ｒとして送りねじ装置を用いる場合には、その送りねじ装置のモータに設けられたエンコーダ（センサ４１Ｌ，４１Ｒ）の出力パルスをカウントして、そのカウント値から各Ｘスライド１５Ｌ，１５ＲのＸ方向の位置情報（実装ヘッド１３Ｌ，１３ＲのＸ座標）を算出するようにしても良い。 Each sensor 41L, 41R (refer to FIG. 5) to measure positional information (X coordinate) in the X direction of each X slide 15L, 15R, which is positional information (X coordinate) in the X direction of each mounting head 13L, 13R. Is provided. Although a configuration for measuring positional information of each X slide 15L, 15R in the X direction is not shown, for example, each linear scale along the X direction which is the moving direction of each X slide 15L, 15R in each Y slide 16L, 16R. The X-slides 15L and 15R may be provided with sensors 41L and 41R that read the position information of the X-slides 15L and 15R in the X direction from the linear scales. Alternatively, when using a feed screw device as each X-axis drive device 17L, 17R for moving each X slide 15L, 15R in the X direction, an encoder ( sensor 41L, 41R) provided on a motor of the feed screw device The position pulses of the X slides 15L and 15R in the X direction (X coordinates of the mounting heads 13L and 13R) may be calculated from the count value of the output pulses of the above.
　更に、本実施例では、実装機本体３１のうちの基板搬入側と基板搬出側の両側面部にはそれぞれ機械的強度を補強する板状の補強部材４４（図１、図３参照）が設けられている。各補強部材４４には、コンベア１１に載せて回路基板１２を搬入・搬出するための開口部が形成されている。 Furthermore, in the present embodiment, plate-like reinforcing members 44 (see FIGS. 1 and 3) for reinforcing mechanical strength are provided on both the substrate loading side and the substrate unloading side of the mounting machine main body 31, respectively. ing. Each reinforcing member 44 is formed with an opening for loading on and unloading the circuit board 12 from the conveyor 11.
　部品実装機１０の制御装置４５は、１台又は複数台のコンピュータ（ＣＰＵ）により構成され、コンベア１１の基板搬送動作を制御すると共に、各ＸＹ移動装置１４Ｌ，１４Ｒにより各実装ヘッド１３Ｌ，１３Ｒを別々にＸＹ方向に移動させて、部品供給装置３２から供給される部品を吸着ノズル１８で吸着する部品吸着動作と、該部品を回路基板１２に実装する部品実装動作とを制御する。 The control device 45 of the component mounter 10 is configured of one or more computers (CPUs) and controls the substrate transfer operation of the conveyor 11, and the mounting heads 13L and 13R are controlled by the XY moving devices 14L and 14R. The component suctioning operation for suctioning the component supplied from the component supply device 32 with the suction nozzle 18 and the component mounting operation for mounting the component on the circuit board 12 are controlled by separately moving in the X and Y directions.
　部品実装機１０の制御装置４５は、各ＸＹ移動装置１４Ｌ，１４Ｒにより各実装ヘッド１３Ｌ，１３ＲをＸＹ方向に移動させる際に、各実装ヘッド１３Ｌ，１３ＲのＸＹ方向の位置（ＸＹ座標）を各センサ４１Ｌ，４１Ｒ，４０Ｌ，４０Ｒで測定して各実装ヘッド１３Ｌ，１３ＲのＸＹ方向の位置を位置決め制御する。この際、各Ｘスライド１５Ｌ，１５ＲのＸ方向の位置を各センサ４１Ｌ，４１Ｒで測定して、その測定値を各実装ヘッド１３Ｌ，１３ＲのＸ方向の位置（Ｘ座標）としてＸ方向の位置決め制御を行い、各Ｙスライド１６Ｌ，１６ＲのＹ方向の位置を各センサ４０Ｌ，４０Ｒで測定して、その測定値を各実装ヘッド１３Ｌ，１３ＲのＹ方向の位置（Ｙ座標）としてＹ方向の位置決め制御を行う。 When moving each mounting head 13L, 13R in the XY direction by each XY moving device 14L, 14R, the control device 45 of the component mounter 10 measures the position (XY coordinates) of the mounting head 13L, 13R in the XY direction. The positions of the mounting heads 13L and 13R in the XY direction are controlled by measurement using the sensors 41L, 41R, 40L and 40R. At this time, the X-direction position of each X slide 15L, 15R is measured by each sensor 41L, 41R, and the measured value is used as the X-direction position (X coordinate) of each mounting head 13L, 13R. To measure the position of each Y slide 16L, 16R in the Y direction with each sensor 40L, 40R, and use the measured value as the position (Y coordinate) of each mounting head 13L, 13R in the Y direction. I do.
　ところで、各Ｙスライド１６Ｌ，１６Ｒには、各実装ヘッド１３Ｌ，１３Ｒを支持する各Ｘスライド１５Ｌ，１５ＲとそれをＸ方向に移動させる各Ｘ軸駆動装置１７Ｌ，１７Ｒが支持されているため、各Ｙスライド１６Ｌ，１６ＲをＹ方向に移動させるときに、各Ｙスライド１６Ｌ，１６Ｒと一体的に各実装ヘッド１３Ｌ，１３Ｒと各Ｘスライド１５Ｌ，１５Ｒ及び各Ｘ軸駆動装置１７Ｌ，１７Ｒの全てを同時にＹ方向に移動させることになる。これにより、各Ｙスライド１６Ｌ，１６ＲをＹ方向に移動させるときに各Ｙスライド１６Ｌ，１６Ｒ側から実装機本体３１に作用する反力がかなり大きくなるため、図６、図７に示すように、２つのＹスライド１６Ｌ，１６Ｒのうち、片方のＹスライドがＹ方向に移動するときに、大きな反力が２つのＸＹ移動装置１４Ｌ，１４Ｒを支持する実装機本体３１にＹ方向に作用して該実装機本体３１がＹ方向に変形してしまう。その際、実装機本体３１の変形は、一様に生じるものではなく、ＹスライドがＹ方向に移動した側がＹ方向に大きく変形し、Ｙスライドが停止している側は、変形量が小さい。 The Y slides 16L and 16R support the X slides 15L and 15R for supporting the mounting heads 13L and 13R and the X axis drive devices 17L and 17R for moving the X slides in the X direction. When moving the Y slides 16L and 16R in the Y direction, all the mounting heads 13L and 13R, the X slides 15L and 15R, and the X axis drive devices 17L and 17R are integrated with the Y slides 16L and 16R simultaneously. It will be moved in the Y direction. Thereby, when moving each Y slide 16L, 16R in the Y direction, the reaction force acting on the mounting machine main body 31 from each Y slide 16L, 16R side becomes considerably large, as shown in FIG. 6, FIG. When one of the two Y slides 16L and 16R moves in the Y direction, a large reaction force acts on the mounting machine main body 31 supporting the two XY moving devices 14L and 14R in the Y direction. The mounting machine main body 31 is deformed in the Y direction. At that time, the deformation of the mounting machine main body 31 does not occur uniformly, and the side where the Y slide moves in the Y direction is largely deformed in the Y direction, and the side where the Y slide stops has a small amount of deformation.
　２つの実装ヘッド１３Ｌ，１３ＲのＹ座標（Ｙスライド１６Ｌ，１６ＲのＹ座標）を２つのリニアスケール３３Ｌ，３３Ｒを使用して測定する場合、各リニアスケール３３Ｌ，３３Ｒの配置を各Ｙスライド１６Ｌ，１６Ｒに対して同じ配置とすると、図６の比較例に示すように、２つのリニアスケール３３Ｌ，３３Ｒのうちの片方のリニアスケールが実装機本体３１の中央側に配置された構成となる。 When measuring the Y-coordinates (Y-coordinates of Y- slides 16L, 16R) of the two mounting heads 13L, 13R using two linear scales 33L, 33R, the arrangement of the respective linear scales 33L, 33R is each Y-slide 16L, Assuming that the arrangement is the same with respect to 16R, as shown in the comparative example of FIG. 6, one linear scale of the two linear scales 33L and 33R is arranged on the center side of the mounting machine main body 31.
　この場合、例えば、各Ｙスライド１６Ｌ，１６Ｒの左側（基板搬入側）に各リニアスケール３３Ｌ，３３Ｒを配置した構成では、図６に示すように、左側のＹスライド１６ＬがＹ方向に移動して実装機本体３１が変形した場合に、右側のＹスライド１６Ｒは停止しているのに、該実装機本体３１の中央側がＹ方向に変形して該実装機本体３１の中央部に固定されたリニアスケール３３Ｒの位置がＹ方向にずれる。その結果、停止している右側のＹスライド１６ＲのＹ座標の測定値がずれるため、そのずれを補正するように右側のＹスライド１６ＲがＹ方向に駆動されて右側の実装ヘッド１３Ｒの位置がＹ方向にずれてしまい、そのずれが実装ヘッド１３Ｒの位置決め精度を低下させて部品実装精度を低下させる要因となる。 In this case, for example, in the configuration in which the linear scales 33L and 33R are disposed on the left side (substrate loading side) of the Y slides 16L and 16R, the left Y slide 16L moves in the Y direction as shown in FIG. When the mounting machine body 31 is deformed, the right side Y slide 16R is stopped, but the center side of the mounting machine body 31 is deformed in the Y direction and is fixed to the central portion of the mounting machine body 31 The position of the scale 33R shifts in the Y direction. As a result, since the measurement value of the Y coordinate of the stopped right Y slide 16R shifts, the right Y slide 16R is driven in the Y direction so as to correct the shift, and the position of the right mounting head 13R is Y The misalignment in the direction causes the positioning accuracy of the mounting head 13R to be lowered and the component mounting accuracy to be lowered.
　この場合、２つのＹスライド１６Ｌ，１６Ｒのうち、基板搬入側のＹスライド１６ＬをＹ方向に移動させるときには、その反力による実装機本体３１の変形量は基板搬出側の側面部で最小となり、一方、基板搬出側のＹスライド１６ＲをＹ方向に移動させるときには、その反力による実装機本体の変形量は基板搬入側の側面部で最小となる。この特性を考慮して、本実施例では、図７に示すように、基板搬入側のＹスライド１６ＬのＹ方向の位置（Ｙ座標）を測定するリニアスケール３３Ｌは、実装機本体３１の基板搬入側に寄せて配置し、一方、基板搬出側のＹスライド３３ＲのＹ方向の位置を測定するリニアスケール３３Ｒは、実装機本体３１の基板搬出側に寄せて配置した構成（つまり２つのリニアスケール３３Ｌ，３３Ｒを実装機本体３１のうちの基板搬入側と基板搬出側に寄せて配置して実装機本体３１の中央側に配置しない構成）としている。このようにすれば、一方のＹスライドがＹ方向に移動したときの反力による実装機本体３１の変形量が小さい部位に、停止中の他方のＹスライドのＹ方向の位置を測定するリニアスケールを配置した構成となる。これにより、一方のＹスライドがＹ方向に移動したときの反力により実装機本体３１が変形しても、その変形によって停止中の他方のＹスライドのＹ方向の位置を測定するリニアスケールがＹ方向に位置ずれする量を大幅に低減することができて、当該リニアスケールのＹ方向への位置ずれによって停止中の他方のＹスライドがＹ方向に駆動されて位置ずれする量を大幅に低減することができ、実装機本体３１の変形によって実装ヘッド１３Ｌ，１３Ｒの位置決め精度が低下することを極力防止することができる。しかも、この効果は、リニアスケール３３Ｌ，３３Ｒの配置を変えるだけで得られるため、実装機本体３１全体の機械的強度を大幅に高める必要がなく、実装機本体３１の製造コストの大幅アップも回避できる利点もある。 In this case, when moving the Y slide 16L on the board loading side among the two Y slides 16L and 16R in the Y direction, the amount of deformation of the mounting machine main body 31 due to the reaction force becomes minimum at the side face part on the board unloading side. On the other hand, when moving the Y slide 16R on the board unloading side in the Y direction, the amount of deformation of the mounting machine main body due to the reaction force is minimized at the side face part on the board loading side. Taking this characteristic into consideration, in the present embodiment, as shown in FIG. 7, the linear scale 33L for measuring the Y-direction position (Y coordinate) of the Y slide 16L on the substrate loading side The linear scale 33R, which is arranged close to the side and measures the position in the Y direction of the Y slide 33R on the board unloading side, is arranged close to the board unloading side of the mounting machine body 31 (that is, two linear scales 33L , 33R are arranged close to the substrate loading side and substrate unloading side of the mounting machine main body 31, and are not arranged at the center side of the mounting machine main body 31). In this way, a linear scale is used to measure the position in the Y direction of the other Y slide being stopped at a portion where the amount of deformation of the mounting machine main body 31 due to the reaction force when one Y slide moves in the Y direction is small. Is arranged. As a result, even if the mounting machine body 31 is deformed by the reaction force when one Y slide moves in the Y direction, the linear scale that measures the position in the Y direction of the other Y slide being stopped due to the deformation is Y The amount of misalignment in the direction can be significantly reduced, and the amount of misalignment caused by the other Y slide being stopped being driven in the Y direction by misalignment of the linear scale in the Y direction is significantly reduced. It is possible to prevent the positioning accuracy of the mounting heads 13L and 13R from being reduced due to the deformation of the mounting machine main body 31 as much as possible. Moreover, since this effect can be obtained only by changing the arrangement of the linear scales 33L and 33R, there is no need to significantly increase the mechanical strength of the entire mounting machine main body 31, and the manufacturing cost of the mounting machine main body 31 is also substantially avoided. There is also an advantage that can be done.
　また、本実施例では、実装機本体３１のうちの基板搬入側と基板搬出側の両側面部に、それぞれ機械的強度を補強する補強部材４４を設けているため、実装機本体３１の基板搬入側と基板搬出側に配置した各リニアスケール３３Ｌ，３３Ｒを保持する左右の各フレーム３４Ｌ，３４Ｒが変形することを防止できて、各Ｙスライド１６Ｌ，１６ＲのＹ方向の位置の測定精度をより一層向上できる利点がある。 Further, in the present embodiment, since the reinforcing members 44 for reinforcing the mechanical strength are respectively provided on both the substrate loading side and the substrate unloading side of the mounting machine main body 31, the substrate loading side of the mounting main body 31 Can be prevented from deforming the left and right frames 34L, 34R holding the linear scales 33L, 33R arranged on the substrate delivery side, and the measurement accuracy of the Y-direction position of each Y slide 16L, 16R is further improved There is an advantage that can be done.
　尚、本実施例では、各リニアモータ２１Ｌ，２１ＲのＸ方向の位置は、各Ｙスライド１６Ｌ，１６ＲのＸ方向幅の中央に相当する位置となっているが、これに限定されず、例えば、各リニアモータ２１Ｌ，２１ＲのＸ方向の位置をそれぞれ外側に寄せて、各リニアモータ２１Ｌ，２１Ｒの可動子２２Ｌ，２２Ｒと各センサ４０Ｌ，４０Ｒとの間の距離を接近させて、各可動子２２Ｌ，２２ＲのＹ方向の位置（各Ｙスライド１６Ｌ，１６ＲのＹ方向の位置）の測定精度を更に向上させるようにしても良い。 In the present embodiment, the position in the X direction of each linear motor 21L, 21R is a position corresponding to the center of the width in the X direction of each Y slide 16L, 16R, but is not limited thereto. The positions of the respective linear motors 21L and 21R in the X direction are respectively shifted outward, and the distances between the movers 22L and 22R of the respective linear motors 21L and 21R and the respective sensors 40L and 40R are made close, so that the respective movers 22L 22R in the Y direction (positions of the Y slides 16L and 16R in the Y direction) may be further improved.
　その他、本発明は、本実施例に限定されず、例えば、実装機本体３１の構造を適宜変更したり、各リニアスケール３３Ｌ，３３Ｒとセンサ４０Ｌ，４０Ｒとの相対的な位置関係や両者の取付構造を適宜変更しても良い等、要旨を逸脱しない範囲内で種々変更して実施しても良いことは言うまでもない。 In addition, the present invention is not limited to the present embodiment. For example, the structure of the mounting machine main body 31 may be appropriately changed, the relative positional relationship between each of the linear scales 33L, 33R and the sensors 40L, 40R, or the attachment of both It goes without saying that the structure may be changed as appropriate without departing from the scope of the present invention.
　１０…部品実装機、１１…コンベア、１２…回路基板、１３Ｌ，１３Ｒ…実装ヘッド、１４Ｌ，１４Ｒ…ＸＹ移動装置、１５Ｌ，１５Ｒ…Ｘスライド、１６Ｌ，１６Ｒ…Ｙスライド、１７Ｌ，１７Ｒ…Ｘ軸駆動装置、１８…吸着ノズル、１９Ｌ，１９Ｒ…Ｚ軸駆動装置、２１Ｌ，２１Ｒ…リニアモータ、２２Ｌ，２２Ｒ…可動子、２３Ｌ，２３Ｒ…固定子、３１…実装機本体、３２…部品供給装置、３３Ｌ，３３Ｒ…リニアスケール、３４Ｌ…左フレーム、３４Ｒ…右フレーム、３５Ｌ，３５Ｒ，３６Ｌ，３６Ｒ…ガイドレール、４０Ｌ，４０Ｒ，４１Ｌ，４１Ｒ…センサ、４４…補強部材、４５…制御装置 DESCRIPTION OF SYMBOLS 10 ... Component mounting machine, 11 ... Conveyor, 12 ... Circuit board, 13L, 13R ... Mounting head, 14L, 14R ... XY movement apparatus, 15L, 15R ... X slide, 16L, 16R ... Y slide, 17L, 17R ... X axis Drive unit 18, suction nozzle 19L, 19R Z- axis drive unit 21L, 21R linear motor, 22L, 22R mover, 23L, 23R stator, 31 mounter main body 32 component supply device 33L, 33R ... Linear scale, 34L ... Left frame, 34R ... Right frame, 35L, 35R, 36L, 36R ... Guide rail, 40L, 40R, 41L, 41R ... Sensor, 44 ... Reinforcement member, 45 ... Control device

Claims (5)

  1. 　コンベアで搬送されてくる回路基板に部品を実装する２つの実装ヘッドと、
    　前記２つの実装ヘッドを別々に前記回路基板の搬送方向であるＸ方向に移動させる２つのＸスライドと該２つのＸスライドを別々にＸ方向と直交する方向であるＹ方向に移動させる２つのＹスライドとを組み合わせて構成された２つのＸＹ移動装置と、
    　前記２つのＹスライドのＹ方向の位置情報を測定するためにＹ方向に平行に延びるように配置された２つのリニアスケールと、
    　前記２つのＹスライドにそれぞれ設けられ、前記２つのリニアスケールから各ＹスライドのＹ方向の位置情報を読み取る２つのセンサと
    　を備えた部品実装機であって、
    　前記２つのＸＹ移動装置は、前記２つのＹスライドがＸ方向に異なる領域をＹ方向に移動するように配置され、且つ、前記各Ｙスライドに前記各ＸスライドとそれをＸ方向に移動させる各駆動源が支持されていると共に、前記各Ｘスライドに前記各実装ヘッドが支持され、
    　前記２つのリニアスケールは、前記２つのＸＹ移動装置を支持する実装機本体のうちの基板搬入側と基板搬出側に寄せて配置され、
    　前記２つのセンサは、前記２つのＹスライドのうちの前記２つのリニアスケールから各ＹスライドのＹ方向の位置情報を読み取り可能な位置に配置されている、部品実装機。     Two mounting heads for mounting components on a circuit board transported by a conveyor,
    Two X slides that move the two mounting heads separately in the X direction that is the transport direction of the circuit board, and two Y that move the two X slides separately in the Y direction that is orthogonal to the X direction Two XY movement devices configured by combining slides,
    Two linear scales arranged to extend parallel to the Y direction to measure positional information of the two Y slides in the Y direction;
    A component mounter comprising: two sensors respectively provided on the two Y slides and reading position information of each Y slide from the two linear scales in the Y direction,
    The two XY moving devices are arranged such that the two Y slides move different regions in the X direction in the Y direction, and each X slide and each X slide are moved in the X direction. The driving source is supported, and the mounting heads are supported by the X slides,
    The two linear scales are disposed close to a substrate loading side and a substrate unloading side of a mounting machine main body that supports the two XY moving devices,
    The component mounting machine according to claim 1, wherein the two sensors are arranged at positions where the Y linear positional information of each Y slide can be read from the two linear scales of the two Y slides.
  2. 　前記実装機本体のうちの基板搬入側と基板搬出側の両側面部にはそれぞれ機械的強度を補強する補強部材が設けられている、請求項１に記載の部品実装機。 The component mounting machine according to claim 1, wherein reinforcing members for reinforcing mechanical strength are respectively provided on both the substrate loading side and the substrate unloading side of the mounting machine main body.
  3. 　前記リニアスケールは、前記実装機本体のうちの前記ＹスライドをＹ方向にガイドするガイドレールを保持する部分に該ガイドレールと平行に取り付けられている、請求項１又は２に記載の部品実装機。 The component mounter according to claim 1, wherein the linear scale is mounted in parallel to the guide rail on a portion of the mounter main body that holds a guide rail for guiding the Y slide in the Y direction. .
  4. 　前記２つのリニアスケールと前記２つのセンサは、前記実装機本体の基板搬入側と基板搬出側に対称に配置されている、請求項１乃至３のいずれかに記載の部品実装機。 The component mounting machine according to any one of claims 1 to 3, wherein the two linear scales and the two sensors are disposed symmetrically on the substrate loading side and the substrate unloading side of the mounting machine main body.
  5. 　前記２つのＸＹ移動装置は、前記２つのＹスライドをＹ方向に移動させる駆動源として２つのリニアモータを備え、前記２つのリニアモータは、各々の固定子がＹ方向に平行に延びて各固定子のＹ方向両端部が前記実装機本体に支持され、各固定子に沿って直線運動する各可動子に各Ｙスライドが取り付けられている、請求項１乃至４のいずれかに記載の部品実装機。 The two XY moving devices are provided with two linear motors as drive sources for moving the two Y slides in the Y direction, and the two linear motors are each fixed with their respective stators extending in parallel in the Y direction The component mounting according to any one of claims 1 to 4, wherein Y-direction both ends of the child are supported by the mounting machine main body, and each Y slide is attached to each mover which linearly moves along each stator. Machine.
PCT/JP2017/031207 2017-08-30 2017-08-30 Component mounting machine WO2019043841A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241595A (en) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd Component mounting machine
EP1906722A2 (en) * 2006-09-26 2008-04-02 Siemens Aktiengesellschaft Positioning system with magnetically preloaded linear axis
JP2009510748A (en) * 2005-09-30 2009-03-12 シーメンス アクチエンゲゼルシヤフト Mounting system and machine body for mounting electrical element on substrate
JP2011054605A (en) * 2009-08-31 2011-03-17 Yamaha Motor Co Ltd Surface mounter and drive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241595A (en) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd Component mounting machine
JP2009510748A (en) * 2005-09-30 2009-03-12 シーメンス アクチエンゲゼルシヤフト Mounting system and machine body for mounting electrical element on substrate
EP1906722A2 (en) * 2006-09-26 2008-04-02 Siemens Aktiengesellschaft Positioning system with magnetically preloaded linear axis
JP2011054605A (en) * 2009-08-31 2011-03-17 Yamaha Motor Co Ltd Surface mounter and drive

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