WO2019038964A1 - Capteur de courant - Google Patents

Capteur de courant Download PDF

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Publication number
WO2019038964A1
WO2019038964A1 PCT/JP2018/009178 JP2018009178W WO2019038964A1 WO 2019038964 A1 WO2019038964 A1 WO 2019038964A1 JP 2018009178 W JP2018009178 W JP 2018009178W WO 2019038964 A1 WO2019038964 A1 WO 2019038964A1
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WO
WIPO (PCT)
Prior art keywords
magnetic sensor
conductor
magnetic
current sensor
current
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Application number
PCT/JP2018/009178
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English (en)
Japanese (ja)
Inventor
北森　宣匡
清水　康弘
仁志 坂口
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201880053907.0A priority Critical patent/CN111033276B/zh
Publication of WO2019038964A1 publication Critical patent/WO2019038964A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices

Definitions

  • the present invention relates to a current sensor, and more particularly to a current sensor that detects the value of a current to be measured by measuring a magnetic field generated according to the current to be measured.
  • Patent Document 1 JP-A-2015-190930
  • Patent Document 2 JP-A-2007-78418
  • the current sensor described in Patent Document 1 includes a first magnetic sensor and a second magnetic sensor that detect magnetism, a current path, and a signal processing device.
  • the current path is wired in the first circumferential direction around the first magnetic sensor.
  • the current path is wired in a second winding direction opposite to the first winding direction around the second magnetic sensor.
  • the signal processing device processes output signals from the first magnetic sensor and the second magnetic sensor.
  • the first magnetic sensor and the signal processing device are disposed on the first metal plate.
  • the second magnetic sensor is disposed on the second metal plate.
  • an integrated chip on which a magnetic detection element is mounted is disposed in a step space provided between two flat lines parallel to each other.
  • the current sensor described in Patent Document 2 does not mention the mounting structure of the magnetic detection element in the integrated chip.
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide a current sensor in which measurement error due to temperature characteristics of a magnetoresistive element is reduced.
  • the current sensor according to the invention comprises a conductor and a magnetic sensor package.
  • a current to be measured flows through the conductor.
  • the magnetic sensor package includes a plurality of magnetic sensors, a signal processing circuit and a metal plate.
  • the plurality of magnetic sensors detect the strength of the magnetic field generated by the current.
  • the signal processing circuit processes signals output from the plurality of magnetic sensors.
  • the plurality of magnetic sensors, the signal processing circuit and the metal plate are covered with an insulating material.
  • the plurality of magnetic sensors and the signal processing circuit are mounted on the metal plate.
  • the plurality of magnetic sensors are formed in one magnetic sensor chip.
  • the signal processing circuit incorporates a temperature sensor that measures the temperature inside the magnetic sensor package.
  • the signal processing circuit corrects and processes signals output from the plurality of magnetic sensors based on the measurement results of the temperature sensor.
  • the magnetic sensor package further includes a plurality of external output terminals electrically connected to the signal processing circuit.
  • a part of the metal plate constitutes at least one external output terminal among the plurality of external output terminals.
  • the magnetic sensor package further includes a passive circuit electrically connected to the signal processing circuit.
  • the plurality of external output terminals are electrically connected to the signal processing circuit through the passive circuit.
  • the passive circuit is mounted on the metal plate and covered with the insulating material.
  • the magnetic sensor package further comprises an electrostatic shield.
  • An electrostatic shield is electrically connected to the metal plate and covered with the insulating material.
  • the plurality of magnetic sensors and the signal processing circuit are located in an area sandwiched between the metal plate and the electrostatic shield.
  • the magnetic sensor package further includes at least one bias magnet for positioning the plurality of magnetic sensors between each other to apply a bias magnetic field. At least one bias magnet is mounted on the metal plate and covered with the insulating material.
  • the conductor includes a front surface and a back surface, and has a length direction, a width direction orthogonal to the length direction, and a thickness direction orthogonal to the length direction and the width direction. It has a plate-like shape, and includes one flow passage portion and the other flow passage portion where the current is divided and flows halfway along the length direction.
  • the other flow passage portion is located in line with the one flow passage portion in the width direction.
  • a region surrounded by one flow passage portion and the other flow passage portion is formed.
  • the plurality of magnetic sensors are located inside the region as viewed from the width direction, and from one end of one channel portion in the width direction to the other channel portion as viewed from the thickness direction. It is located within the range to the end.
  • the conductor is provided with an opening extending in the longitudinal direction between one flow passage and the other flow passage.
  • the magnetic sensor package is fixed to the conductor in contact with at least a part of the edge of the opening.
  • the magnetic sensor package further includes a metal protruding piece electrically insulated from the metal plate.
  • the projecting piece is welded to the conductor in contact with at least one edge of the opening in the longitudinal direction.
  • the magnetic sensor package is fixed to the conductor by the weld between the projecting piece and the conductor.
  • the current sensor further comprises a mounting member.
  • the mounting member is fixed to the conductor and connected to the magnetic sensor package.
  • the mounting member is fixed to the conductor in contact with at least one edge of the opening in the longitudinal direction.
  • the mounting member and the magnetic sensor package are welded together.
  • the measurement error of the current sensor due to the temperature characteristic of the magnetoresistive element can be reduced.
  • FIG. 24 is a cross-sectional view of the current sensor of FIG.
  • FIG. 1 is a perspective view showing a configuration of a current sensor according to Embodiment 1 of the present invention.
  • FIG. 2 is a plan view showing the configuration of the magnetic sensor package provided in the current sensor according to Embodiment 1 of the present invention.
  • the outer shape of the magnetic sensor package made of an insulating material is indicated by a two-dot chain line, and the insulating material is seen through. Further, in FIG. 1, the electrodes and the wiring are not shown for the sake of clarity. In FIG. 2, for convenience of explanation, the insulating material forming part of the magnetic sensor package is not shown.
  • the longitudinal direction of a conductor 110 described later is illustrated as an X-axis direction, the width direction of the conductor 110 as a Y-axis direction, and the thickness direction of the conductor 110 as a Z-axis direction.
  • the current sensor 100 includes a conductor 110 and a magnetic sensor package 120.
  • a current to be measured flows through the conductor 110.
  • the conductor 110 includes a front surface and a rear surface, and a width direction (Y-axis direction) orthogonal to the length direction (X-axis direction), the length direction (X-axis direction), and a length direction (X-axis direction) It has a plate shape having a thickness direction (Z-axis direction) orthogonal to the direction (Y-axis direction).
  • the conductor 110 includes one flow passage portion 111 and the other flow passage portion 115 in which the current to be measured is divided and flows halfway along the length direction (X-axis direction).
  • the other flow passage portion 115 is located in line with the one flow passage portion 111 in the width direction (Y-axis direction).
  • the conductor 110 is provided with an opening 119 extending in the longitudinal direction (X-axis direction) between one flow passage portion 111 and the other flow passage portion 115.
  • the opening 119 is located at the center of the conductor 110 in the width direction (Y-axis direction).
  • the opening 119 may not necessarily be located at the center of the conductor 110 in the width direction (Y-axis direction).
  • the conductor 110 is made of copper.
  • the material of the conductor 110 is not limited to this, and may be a metal such as silver, aluminum or iron, or an alloy containing these metals.
  • the conductor 110 may be surface-treated. For example, at least one plating layer made of a metal such as nickel, tin, silver or copper, or an alloy containing these metals may be provided on the surface of the conductor 110. Also, the conductor 110 may be coated with an insulating resin.
  • the conductor 110 is formed by casting.
  • the method of forming the conductor 110 is not limited to this, and the conductor 110 may be formed by cutting, pressing, or the like.
  • the magnetic sensor package 120 includes a first magnetic sensor 10, a second magnetic sensor 20, a signal processing circuit 30, and a metal plate 40.
  • the first magnetic sensor 10, the second magnetic sensor 20, the signal processing circuit 30 and the metal plate 40 are covered with an insulating material 121.
  • an insulating resin such as a silicone resin or an epoxy resin can be used.
  • Magnetic sensor package 120 further includes a plurality of external output terminals 50 electrically connected to signal processing circuit 30.
  • the tip side of each of the plurality of external output terminals 50 is not covered by the insulating material 121 and is exposed.
  • a part of the metal plate 40 constitutes at least one external output terminal of the plurality of external output terminals 50.
  • the magnetic sensor package 120 includes, as a plurality of external output terminals 50, a first external output terminal 51, a second external output terminal 52, a third external output terminal 53, and a fourth external output terminal 54. Including. A part of the metal plate 40 constitutes a second external output terminal 52.
  • the number of external output terminals is not limited to four, and may be plural.
  • the first magnetic sensor 10 and the second magnetic sensor 20 detect the strength of the magnetic field generated by the current of the measurement object flowing through the conductor 110.
  • each of the first magnetic sensor 10 and the second magnetic sensor 20 has a Hall element, and detects a magnetic field in the thickness direction (Z-axis direction).
  • Each of the first magnetic sensor 10 and the second magnetic sensor 20 outputs a positive value when a magnetic field directed to one side in the thickness direction (Z-axis direction) is detected, and the first magnetic sensor 10 and the second magnetic sensor 20 When a magnetic field directed to the other side is detected, a negative value is output.
  • Each of the first magnetic sensor 10 and the second magnetic sensor 20 is not limited to a magnetic sensor having a Hall element, but may be a magnetic sensor or a flux gate type magnetic sensor having an MI (Magneto Impedance) element utilizing a magnetic impedance effect. May be.
  • MI Magnetic Impedance
  • each of the first magnetic sensor 10 and the second magnetic sensor 20 may have a Wheatstone bridge type bridge circuit composed of four AMR (Anisotropic Magneto Resistance) elements.
  • AMR Anaisotropic Magneto Resistance
  • Each of the first magnetic sensor 10 and the second magnetic sensor 20 is replaced with an AMR element, and GMR (Giant Magneto Resistance), TMR (Tunnel Magneto Resistance), BMR (Ballistic Magneto Resistance), CMR (Colossal Magneto Resistance), etc. It may have a magnetoresistive element.
  • each of the first magnetic sensor 10 and the second magnetic sensor 20 may have a half bridge circuit composed of two magnetoresistance elements.
  • the first magnetic sensor 10 is formed in the first magnetic sensor chip 1C.
  • the second magnetic sensor 20 is formed on the second magnetic sensor chip 2C.
  • the signal processing circuit 30 processes the signals output from the first magnetic sensor 10 and the second magnetic sensor 20.
  • the signal processing circuit 30 calculates the value of the current to be measured flowing through the conductor 110 by computing the detection value of the first magnetic sensor 10 and the detection value of the second magnetic sensor 20.
  • the signal processing circuit 30 includes a differential amplifier.
  • the signal processing circuit 30 may include a subtractor.
  • the first magnetic sensor 10, the second magnetic sensor 20, and the signal processing circuit 30 are mounted on one metal plate 40.
  • the metal plate 40 has a substantially rectangular parallelepiped outer shape, and a portion to be the second external output terminal 52 protrudes from the end.
  • the first magnetic sensor chip 1C, the second magnetic sensor chip 2C, the signal processing circuit 30, and the plurality of external output terminals 50 are arranged in line in this order.
  • the first magnetic sensor chip 1C, the second magnetic sensor chip 2C, the signal processing circuit 30, and the plurality of external output terminals 50 are electrically connected to each other by wire bonding.
  • first magnetic sensor chip 1C a part of the plurality of first electrodes 1T provided in the first magnetic sensor chip 1C and the first magnetic sensor 10 correspond to the wiring 1L corresponding to each other. Connected to each other.
  • second magnetic sensor chip 2C a part of the plurality of second electrodes 2T provided in the second magnetic sensor chip 2C and the second magnetic sensor 20 are connected to each other by the corresponding wiring 2L. .
  • a part of the plurality of first electrodes 1T provided on the first magnetic sensor chip 1C corresponds to a part of the plurality of second electrodes 2T provided on the second magnetic sensor chip 2C Are connected to one another by wiring 3L.
  • a part of the plurality of second electrodes 2T provided in the second magnetic sensor chip 2C and a part of the plurality of third electrodes 30T provided in the signal processing circuit 30 correspond to the wiring 4L. Connected to each other. Some of the plurality of third electrodes 30T provided in the signal processing circuit 30 and the plurality of external output terminals 50 are connected to each other by the corresponding wires 5L.
  • the first magnetic sensor chip 1C, the second magnetic sensor chip 2C, the signal processing circuit 30, and the plurality of external output terminals 50 are electrically connected to one another, the output from the first magnetic sensor 10
  • the signal thus obtained and the signal output from the second magnetic sensor 20 are processed together in the signal processing circuit 30 and output from the plurality of external output terminals 50.
  • connection method of the first magnetic sensor chip 1C, the second magnetic sensor chip 2C, the signal processing circuit 30, and the metal plate 40 is not limited to wire bonding, and may be die bonding or flip chip.
  • die bonding material an epoxy-based or silicone-based material can be used.
  • the metal plate 40 is made of copper.
  • the material which comprises the metal plate 40 is not restricted to copper, What is necessary is just a metal with high heat conductivity and electrical conductivity.
  • the plating layer may be provided in the surface of the metal plate 40. FIG. Furthermore, the material and thickness of the metal plate 40 are appropriately set so that the metal plate 40 has sufficient strength.
  • the entire package may be formed by transfer molding, or the first magnetic sensor chip 1C, the second magnetic sensor chip may be formed into a molded body integrally formed with the metal plate 40 by premolding.
  • a 2C and signal processing circuit 30 may be implemented.
  • the magnetic sensor package 120 is mounted on the conductor 110 such that the metal plate 40 is positioned parallel to the conductor 110.
  • the magnetic sensor package 120 includes one flow passage portion 111, an opening portion 119, and the other so that the metal plate 40 faces each of the one flow passage portion 111 and the other flow passage portion 115. It is disposed above the flow path portion 115.
  • the magnetic sensor package 120 is arranged such that the middle position between the first magnetic sensor 10 and the second magnetic sensor 20 and the central position of the opening 119 coincide with each other in the width direction (Y-axis direction). It is arranged. The first magnetic sensor 10 and the second magnetic sensor 20 overlap the opening 119 when viewed in the thickness direction (Z-axis direction). The shortest distance between the first magnetic sensor 10 and the one flow passage portion 111 and the shortest distance between the second magnetic sensor 20 and the other flow passage portion 115 are substantially the same.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are arranged at the above-described positions, when the current to be measured flows through the conductor 110, the first magnetic sensor 10 is provided with the one flow passage portion 111.
  • a circulating magnetic field mainly acts on the second magnetic sensor 20, and a magnetic field circulating on the other flow path portion 115 mainly acts on the second magnetic sensor 20.
  • the first magnetic sensor 10 detects the magnetic field directed to one side in the thickness direction (Z-axis direction), and the second magnetic sensor 20 detects the magnetic field directed to the other side in the thickness direction (Z-axis direction).
  • the phase of the detection value of the first magnetic sensor 10 and the phase of the detection value of the second magnetic sensor 20 become opposite. Therefore, when the strength of the magnetic field detected by the first magnetic sensor 10 is a positive value, the strength of the magnetic field detected by the second magnetic sensor 20 is a negative value.
  • the detection value of the first magnetic sensor 10 and the detection value of the second magnetic sensor 20 are calculated by the signal processing circuit 30. Specifically, the signal processing circuit 30 subtracts the detection value of the second magnetic sensor 20 from the detection value of the first magnetic sensor 10. From this result, the value of the current to be measured that has flowed through the conductor 110 is calculated.
  • the phase of the detection value of the first magnetic sensor 10 and the phase of the detection value of the second magnetic sensor 20 are in phase. Become. Therefore, if the strength of the magnetic field detected by the first magnetic sensor 10 is a positive value, the strength of the magnetic field detected by the second magnetic sensor 20 is a positive value. As a result, when the signal processing circuit 30 subtracts the detection value of the second magnetic sensor 20 from the detection value of the first magnetic sensor 10, the external magnetic field is hardly detected, and the influence thereof is reduced.
  • the magnetic field directions in which the detection value is positive may be opposite to each other.
  • the signal processing circuit 30 includes an adder or a summing amplifier instead of the differential amplifier.
  • the phase of the detection value of the first magnetic sensor 10 and the phase of the detection value of the second magnetic sensor 20 In phase. Therefore, if the strength of the magnetic field detected by the first magnetic sensor 10 is a positive value, the strength of the magnetic field detected by the second magnetic sensor 20 is a positive value.
  • the signal processing circuit 30 adds the detection value of the first magnetic sensor 10 and the detection value of the second magnetic sensor 20. From this result, the value of the current to be measured that has flowed through the conductor 110 is calculated.
  • the phase of the detection value of the first magnetic sensor 10 and the phase of the second magnetic sensor 20 is opposite to the phase. Therefore, when the strength of the magnetic field detected by the first magnetic sensor 10 is a positive value, the strength of the magnetic field detected by the second magnetic sensor 20 is a negative value. As a result, when the signal processing circuit 30 adds the detection value of the first magnetic sensor 10 and the detection value of the second magnetic sensor 20, the external magnetic field is hardly detected, and the influence thereof is reduced.
  • the current sensor 100 according to the present embodiment and the current sensor according to the first modification of the present embodiment can measure the current to be measured with high sensitivity while reducing the influence of the external magnetic field. .
  • the first magnetic sensor 10, the second magnetic sensor 20, and the signal processing circuit 30 are mounted on a single metal plate 40, the periphery of the first magnetic sensor 10 can be obtained. The difference between the temperature and the temperature around the second magnetic sensor 20 can be reduced. As a result, it is possible to reduce the measurement error of the current sensor 100 due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • the shortest distance between the first magnetic sensor 10 and the one flow passage portion 111 and the shortest distance between the second magnetic sensor 20 and the other flow passage portion 115 are substantially the same as each other, Since the amount of heat transferred to each of the first magnetic sensor 10 and the second magnetic sensor 20 is substantially the same, the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 is smaller. can do. As a result, it is possible to further reduce the measurement error of the current sensor 100 due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • the first magnetic sensor 10 and the second magnetic sensor 20 can be disposed close to each other. Therefore, since the external magnetic field acts equally on both the first magnetic sensor 10 and the second magnetic sensor 20, the signal processing circuit 30 can reduce the influence of the external magnetic field. Further, the current sensor 100 can be miniaturized. Furthermore, since the length of the wiring connecting the first magnetic sensor 10, the second magnetic sensor 20, and the signal processing circuit 30 can be shortened, parasitic resistance and parasitic inductance can be reduced. Thereby, the induced electromotive force generated in the loop formed by the wiring can be reduced, the transient characteristic of the current sensor 100 can be improved, and in turn, the detection sensitivity of the current sensor 100 can be improved.
  • the conductor 110 and the magnetic sensor package 120 are separately configured, and the thermal resistance between the conductor 110 and the magnetic sensor package 120 is increased. Can suppress the heating of the first magnetic sensor 10 and the second magnetic sensor 20 due to the heat generation, thereby reducing the thermal influence on the first magnetic sensor 10 and the second magnetic sensor 20 and improving the reliability of the current sensor 100 it can.
  • the metal plate 40 since a part of the metal plate 40 constitutes the second external output terminal 52, the metal plate 40 and the plurality of external output terminals 50 are separately formed. Compared with the case, the mounting strength of the plurality of external output terminals 50 with the magnetic sensor package 120 can be increased, and the reliability of the current sensor 100 can be improved.
  • the arrangement of the first magnetic sensor 10, the second magnetic sensor 20, and the signal processing circuit 30 in the magnetic sensor package 120 is not limited to the above, and can be changed as appropriate.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are disposed such that the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 are equal.
  • the number of magnetic sensors disposed is not limited to two, and may be four or more even numbers.
  • FIG. 3 is a perspective view showing a configuration of a current sensor according to a second modified example of the first embodiment of the present invention.
  • the current sensor according to the second modification of the first embodiment of the present invention is the same as the current sensor 100 according to the first embodiment of the present invention because it differs from the current sensor 100 according to the first embodiment of the present invention only in the shape of the conductor. The description will not be repeated for certain configurations.
  • a current sensor 100 a includes a conductor 110 a and a magnetic sensor package 120.
  • the conductor 110a includes one flow passage portion 111a and the other flow passage portion 115a in which the current to be measured is divided and flows halfway along the length direction (X-axis direction).
  • the other flow passage portion 115 a is located in line with the one flow passage portion 111 a in the width direction (Y-axis direction).
  • Each of the one flow passage portion 111 a and the other flow passage portion 115 a protrudes outward in the width direction (Y-axis direction).
  • the cross-sectional area along the width direction (Y-axis direction) of one flow passage portion 111a and the cross-sectional area along the width direction (Y-axis direction) of the other flow passage portion 115a are substantially the same.
  • the total cross-sectional area of the cross-sectional area is substantially the same as the cross-sectional area of the non-dividing portion along the width direction (Y-axis direction) of the conductor 110.
  • the conductor 110a can secure a flow passage area of substantially the same current as that of the portion not divided even in the flow dividing portion, and heat generation locally in one flow passage portion 111a and the other flow passage portion 115a. Can be suppressed. Thereby, it is possible to further suppress the heating of the first magnetic sensor 10 and the second magnetic sensor 20 due to the heat generation of the conductor 110, and to further reduce the thermal influence on the first magnetic sensor 10 and the second magnetic sensor 20. The reliability of the sensor 100 can be further improved.
  • the current sensor according to the second embodiment is the same as the current sensor 100 according to the first embodiment because the current sensor according to the second embodiment is different from the current sensor 100 according to the first embodiment only in that a plurality of magnetic sensors are formed in one magnetic sensor chip.
  • the same reference symbols are attached to the configurations that are and the description thereof will not be repeated.
  • FIG. 4 is a plan view showing the configuration of the magnetic sensor package provided in the current sensor according to Embodiment 2 of the present invention.
  • the insulating material forming part of the magnetic sensor package is not shown.
  • the current sensor according to Embodiment 2 of the present invention includes a magnetic sensor package 220.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are formed in one magnetic sensor chip 3C.
  • the magnetic sensor chip 3C, the signal processing circuit 30, and the plurality of external output terminals 50 are arranged in line in this order.
  • the magnetic sensor chip 3C, the signal processing circuit 30, and the plurality of external output terminals 50 are electrically connected to each other by wire bonding.
  • a part of the plurality of first electrodes 1T provided in the magnetic sensor chip 3C and the first magnetic sensor 10 are connected to each other by the corresponding wiring 1L.
  • a part of the plurality of second electrodes 2T provided in the magnetic sensor chip 3C and the second magnetic sensor 20 are connected to each other by the corresponding wiring 2L.
  • a part of the plurality of first electrodes 1T and a part of the plurality of second electrodes 2T are connected to each other by the corresponding wiring 3L.
  • a part of the plurality of second electrodes 2T provided in the magnetic sensor chip 3C and a part of the plurality of third electrodes 30T provided in the signal processing circuit 30 are mutually connected by corresponding wires 4L. It is done.
  • Some of the plurality of third electrodes 30T provided in the signal processing circuit 30 and the plurality of external output terminals 50 are connected to each other by the corresponding wires 5L.
  • the magnetic sensor chip 3C, the signal processing circuit 30, and the plurality of external output terminals 50 are electrically connected to each other, the signal output from the first magnetic sensor 10, and the second magnetic sensor The signals output from 20 are processed together by the signal processing circuit 30 and output from the plurality of external output terminals 50.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are formed in one magnetic sensor chip 3C. Therefore, the distance between the first magnetic sensor 10 and the second magnetic sensor 20 can be further reduced compared to the current sensor 100 according to the first embodiment.
  • the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be further reduced.
  • the magnetic sensor By mounting the chip 3 ⁇ / b> C on the metal plate 40, it is possible to reduce the variation in relative position between the first magnetic sensor 10 and the second magnetic sensor 20, so the reliability of the current sensor can be improved. .
  • the current sensor according to the third embodiment differs from the current sensor according to the second embodiment only in that the temperature sensor for measuring the temperature inside the magnetic sensor package is incorporated in the signal processing circuit.
  • the same components as those of the current sensor are denoted by the same reference numerals, and the description thereof will not be repeated.
  • FIG. 5 is a plan view showing the configuration of the magnetic sensor package provided in the current sensor according to Embodiment 3 of the present invention.
  • the insulating material forming a part of the magnetic sensor package is not shown.
  • the current sensor according to Embodiment 3 of the present invention includes a magnetic sensor package 320.
  • the signal processing circuit 30 incorporates a temperature sensor 60 that measures the temperature inside the magnetic sensor package 320.
  • the signal processing circuit 30 corrects and processes signals output from the first magnetic sensor 10 and the second magnetic sensor 20 based on the measurement result of the temperature sensor 60.
  • the detection error of the 1st magnetic sensor 10 and the 2nd magnetic sensor 20 by the temperature characteristic of the magnetoresistive element which each of the 1st magnetic sensor 10 and the 2nd magnetic sensor 20 has can be corrected.
  • the current sensor according to the fourth embodiment is different from the current sensor according to the second embodiment mainly in that the magnetic sensor package includes a passive circuit electrically connected to the signal processing circuit, the second embodiment relates to the second embodiment.
  • the same components as those of the current sensor are denoted by the same reference numerals, and the description thereof will not be repeated.
  • FIG. 6 is a plan view showing the configuration of the magnetic sensor package provided in the current sensor according to Embodiment 4 of the present invention.
  • the insulating material forming a part of the magnetic sensor package is not shown.
  • the current sensor according to the fourth embodiment of the present invention includes a magnetic sensor package 420.
  • the magnetic sensor package 420 includes a passive circuit 70 electrically connected to the signal processing circuit 30.
  • the plurality of external output terminals 50 are electrically connected to the signal processing circuit 30 through the passive circuit 70.
  • the signal processing circuit 30 is mounted on the metal plate 40 and covered with the insulating material 121.
  • the passive circuit 70 has a function such as a filter.
  • EMI Electro-Magnetic Interference
  • Embodiment 5 the current sensor according to the fifth embodiment of the present invention will be described.
  • the current sensor according to the fifth embodiment differs from the current sensor according to the fourth embodiment mainly in that the magnetic sensor package includes an electrostatic shield, and thus the configuration similar to that of the current sensor according to the fourth embodiment The same reference numerals are assigned and the description will not be repeated.
  • FIG. 7 is a plan view showing the configuration of the magnetic sensor package provided in the current sensor according to Embodiment 5 of the present invention.
  • FIG. 8 is a perspective view showing the configuration of a magnetic sensor package provided in the current sensor according to Embodiment 5 of the present invention.
  • the insulating material forming part of the magnetic sensor package is not shown.
  • the current sensor according to the fifth embodiment of the present invention includes a magnetic sensor package 520.
  • the magnetic sensor package 520 includes an electrostatic shield 80.
  • the electrostatic shield 80 is electrically connected to the metal plate 40 and is covered with the insulating material 121.
  • the electrostatic shield 80 is composed of a flat portion 81 opposed to the metal plate 40 and a circumferential surface portion 82 erected from the edge of the flat portion 81.
  • the electrostatic shield 80 and the metal plate 40 are integrally configured by bonding the metal plate 40 and the peripheral surface portion 82 to each other with a conductive bonding material such as solder or conductive paste.
  • the metal plate 40 and the circumferential surface portion 82 may be mechanically joined to each other by press fitting or the like.
  • a material which comprises the electrostatic shield 80 a nonmagnetic metal can be used and a metal with high thermal conductivity is more preferable.
  • the first magnetic sensor 10, the second magnetic sensor 20, the signal processing circuit 30 and the passive circuit 70 are located in an area sandwiched between the metal plate 40 and the electrostatic shield 80.
  • the first magnetic sensor 10, the second magnetic sensor 20, the signal processing circuit 30, and the passive circuit 70 are located in a space surrounded by the metal plate 40 and the electrostatic shield 80.
  • the metal plate 40 and the electrostatic shield 80 are in contact with each other, the heat of the metal plate 40 is diffused to the electrostatic shield 80, and the temperature inside the magnetic sensor package 520 is equalized. Thereby, the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced. As a result, it is possible to reduce the measurement error of the current sensor due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • FIG. 9 is a plan view showing the configuration of a magnetic sensor package provided in a current sensor according to a modification of Embodiment 5 of the present invention.
  • FIG. 10 is a perspective view showing a configuration of a magnetic sensor package provided in a current sensor according to a modification of Embodiment 5 of the present invention.
  • the insulating material which comprises a part of magnetic sensor package is not illustrated for convenience of explanation.
  • the current sensor according to the modification of the fifth embodiment of the present invention is the same as the current sensor according to the fifth embodiment of the present invention because only the shape of the electrostatic shield is different from that of the current sensor according to the fifth embodiment. The description will not be repeated.
  • the current sensor according to the modification of the fifth embodiment of the present invention includes a magnetic sensor package 520a.
  • the magnetic sensor package 520a includes an electrostatic shield 80a.
  • the electrostatic shield 80 a is electrically connected to the metal plate 40 and covered with the insulating material 121.
  • the electrostatic shield 80 a is configured of a flat portion 81 facing the metal plate 40 and a leg portion 82 a erected from a corner of the flat portion 81.
  • the electrostatic shield 80a and the metal plate 40 are integrally configured by bonding the metal plate 40 and the leg portion 82a to each other with a conductive bonding material such as solder or conductive paste.
  • the metal plate 40 and the leg portion 82a may be mechanically joined to each other by press-fitting or the like.
  • the first magnetic sensor 10, the second magnetic sensor 20, and the signal processing circuit 30 are located in an area sandwiched between the metal plate 40 and the electrostatic shield 80a. Thereby, the influence of the electric field due to the noise on the first magnetic sensor 10, the second magnetic sensor 20, and the signal processing circuit 30 can be reduced.
  • the electrostatic shield 80a is disposed only at a place important for reducing the influence of the electric field due to noise, and the electrostatic shield 80a is miniaturized as compared with the electrostatic shield 80.
  • the cost and weight of the current sensor can be reduced.
  • Embodiment 6 the current sensor according to the sixth embodiment of the present invention will be described.
  • the current sensor according to the sixth embodiment is mainly modified in that the magnetic sensor package includes at least one bias magnet for positioning a plurality of magnetic sensors between each other to apply a bias magnetic field. Since the configuration is the same as that of the current sensor according to the modification of the fifth embodiment, the same reference symbol is attached to the same configuration as that of the current sensor according to the embodiment, and the description thereof will not be repeated.
  • FIG. 11 is a plan view showing the configuration of the magnetic sensor package provided in the current sensor according to Embodiment 6 of the present invention.
  • FIG. 12 is a perspective view showing the configuration of a magnetic sensor package provided in the current sensor according to Embodiment 6 of the present invention.
  • the insulating material forming part of the magnetic sensor package is not shown.
  • the current sensor according to Embodiment 6 of the present invention includes a magnetic sensor package 620.
  • the magnetic sensor package 620 includes two bias magnets 90 that position the first magnetic sensor 10 and the second magnetic sensor 20 between each other to apply a bias magnetic field.
  • the two bias magnets 90 are mounted on the metal plate 40 and covered with the insulating material 121.
  • the bias magnet 90 may be composed of a sintered magnet, a bonded magnet or a thin film.
  • the type of the bias magnet 90 is not particularly limited, and a ferrite magnet, a samarium cobalt magnet, an alnico magnet, a neodymium magnet, or the like can be used.
  • the bias magnets 90 are disposed on both sides of the magnetic sensor chip 3C in the length direction (X-axis direction). A gap is provided between each of the two bias magnets 90 and the magnetic sensor chip 3C.
  • the number of bias magnets 90 disposed is not limited to two, and may be at least one.
  • a composite chip in which the bias magnet 90 is bonded to both sides of the magnetic sensor chip 3C may be mounted on the metal plate 40.
  • the current sensor can be miniaturized as compared with the case where the bias magnet is arranged outside the magnetic sensor package 620.
  • the metal plate 40 and the bias magnet 90 are in contact with each other, the heat of the metal plate 40 is diffused to the bias magnet 90, and the temperature inside the magnetic sensor package 620 is made uniform. Thereby, the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced. As a result, it is possible to reduce the measurement error of the current sensor due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • the contact between the metal plate 40 and the bias magnet 90 makes the internal temperature of the bias magnet 90 and the magnetic characteristics of the bias magnet 90 uniform.
  • the bias magnetic field applied to the first magnetic sensor 10 and the second magnetic sensor 20 is stabilized, and the detection sensitivity of each of the first magnetic sensor 10 and the second magnetic sensor 20 is stabilized.
  • the reliability of the current sensor can be improved.
  • FIG. 13 is a perspective view showing a configuration of a current sensor according to Embodiment 7 of the present invention.
  • the outer shape of the magnetic sensor package made of an insulating material is indicated by a two-dot chain line, and the insulating material is shown through it. Further, in FIG. 13, the electrodes and the wiring are not illustrated for the sake of easy viewing.
  • a current sensor 700 includes a conductor 710 and a magnetic sensor package 120.
  • the conductor 710 includes one flow passage portion 711 and the other flow passage portion 715 in which the current to be measured is divided and flows halfway along the length direction (X-axis direction).
  • the other flow passage portion 715 is located in line with the one flow passage portion 711 in the width direction (Y-axis direction).
  • An opening 119 extending in the length direction (X-axis direction) is provided between one flow passage portion 711 and the other flow passage portion 715.
  • the opening 119 is located at the center of the conductor 710 in the width direction (Y-axis direction).
  • the opening 119 may not necessarily be located at the center of the conductor 710 in the width direction (Y-axis direction).
  • One channel portion 711 bulges to the surface side of the conductor 710 as viewed in the width direction (Y-axis direction).
  • the other flow passage portion 715 bulges on the back surface side of the conductor 710 as viewed in the width direction (Y-axis direction).
  • One flow path portion 711 extends in the length direction (X-axis direction), with a first projection 712 and a second projection 713 projecting orthogonally to the surface of the conductor 710 at intervals. And an extending portion 714 connecting the first protruding portion 712 and the second protruding portion 713.
  • the shape of one flow passage portion 711 is not limited to this, and may have a C-shape or a semicircular shape as viewed from the width direction (Y-axis direction), for example.
  • the other flow path portions 715 extend in the length direction (X-axis direction), with the third projection 716 and the fourth projection 717 projecting orthogonally to the back surface of the conductor 710 at intervals. And an extending portion 718 connecting the third protrusion 716 and the fourth protrusion 717.
  • the shape of the other flow passage portion 715 is not limited to this, and may have a C-shape or a semicircular shape as viewed from the width direction (Y-axis direction), for example.
  • One flow passage portion 711 and the other flow passage portion 715 have shapes that are point-symmetrical to each other.
  • the one flow passage portion 711 and the other flow passage portion 715 may not necessarily have a point-symmetrical shape.
  • a region 710 h surrounded by one flow passage portion 711 and the other flow passage portion 715 is formed.
  • the magnetic sensor package 120 is inserted in a space formed by one flow passage portion 711 and the other flow passage portion 715.
  • the magnetic sensor package 120 is fixed to the conductor 710 by a bonding material or the like.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are located inside the area 710 h when viewed from the width direction (Y-axis direction), and viewed from the thickness direction (Z-axis direction), It is located in the range from one end of one flow passage portion 711 in the width direction (Y-axis direction) to the other end of the other flow passage portion 715.
  • the magnetic sensor package 120 is arranged such that the middle position between the first magnetic sensor 10 and the second magnetic sensor 20 and the central position of the opening 119 coincide with each other in the width direction (Y-axis direction). It is arranged.
  • the current sensor 700 can measure the current of the measurement target with high sensitivity while reducing the influence of the external magnetic field.
  • the conductor 710 generates heat because the magnetic sensor package 120 is disposed in the space formed by the one flow passage portion 711 and the other flow passage portion 715.
  • the temperature inside the magnetic sensor package 120 is made uniform. Thereby, the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced. As a result, it is possible to reduce the measurement error of the current sensor 700 due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • the current sensor 700 since the electric resistance value of one flow path portion 711 and the electric resistance value of the other flow path portion 715 are substantially the same, The calorific value of the one flow path portion 711 due to the flow can be made equal to the calorific value of the other flow path portion 715.
  • the first magnetic sensor 10 and the second magnetic sensor 10 can It is possible to effectively reduce the measurement error of the current sensor 700 due to the temperature characteristic of the magnetoresistive element that each of the magnetic sensors 20 has.
  • FIG. 14 is a perspective view showing a configuration of a current sensor according to a first modified example of the seventh embodiment of the present invention.
  • FIG. 15 is a perspective view showing a configuration of a current sensor according to a second modified embodiment of the seventh embodiment of the present invention.
  • FIG. 16 is a perspective view showing a configuration of a current sensor according to a third modified embodiment of the seventh embodiment of the present invention.
  • the current sensors according to the first to third modifications of the seventh embodiment of the present invention are different from the current sensor 700 according to the seventh embodiment of the present invention only in the shape of the conductor, so the current according to the seventh embodiment of the present invention The description of the same configuration as that of sensor 700 will not be repeated.
  • the current sensor 700 a includes a conductor 710 a and a magnetic sensor package 120.
  • the conductor 710 a includes one flow passage portion 711 and the other flow passage portion 115 in which the current to be measured is divided and flows halfway along the length direction (X-axis direction).
  • the other flow passage portion 115 is positioned side by side with one flow passage portion 711 in the width direction (Y-axis direction).
  • An opening 119 extending in the length direction (X-axis direction) is provided between one flow passage portion 711 and the other flow passage portion 115.
  • the opening 119 is located at the center of the conductor 710 a in the width direction (Y-axis direction).
  • the opening 119 may not necessarily be located at the center of the conductor 710 a in the width direction (Y-axis direction).
  • a region 710ah surrounded by one flow passage portion 711 and the other flow passage portion 115 is formed.
  • the magnetic sensor package 120 is inserted in the space formed by the one flow passage portion 711 and the other flow passage portion 115.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are located inside the region 710ah when viewed from the width direction (Y-axis direction), and viewed from the thickness direction (Z-axis direction), It is located in the range from one end of one flow passage portion 711 in the width direction (Y-axis direction) to the other end of the other flow passage portion 115.
  • the magnetic sensor package 120 is arranged such that the middle position between the first magnetic sensor 10 and the second magnetic sensor 20 and the central position of the opening 119 coincide with each other in the width direction (Y-axis direction). It is arranged.
  • the current sensor 700a can measure the current of the measurement target with high sensitivity while reducing the influence of the external magnetic field.
  • the magnetic sensor package 120 is disposed in the space formed by the one flow passage portion 711 and the other flow passage portion 115, The temperature inside the magnetic sensor package 120 when the conductor 710 generates heat is made uniform. Thereby, the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced. As a result, it is possible to reduce the measurement error of the current sensor 700a due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • a current sensor 700b includes a conductor 710b and a magnetic sensor package 120.
  • the conductor 710b includes one flow passage portion 711b and the other flow passage portion 715b in which the current to be measured is divided and flows halfway along the length direction (X-axis direction).
  • the other flow passage portion 715 b is located in line with the one flow passage portion 711 b in the width direction (Y-axis direction).
  • the conductor 710 b is located on the surface side of the conductor 710 b with one side in the length direction (X-axis direction) bordering the dividing portion as compared with the other side.
  • An opening 119 extending in the length direction (X-axis direction) is provided between one flow passage portion 711 b and the other flow passage portion 715 b.
  • the opening 119 is located at the center of the conductor 710 b in the width direction (Y-axis direction).
  • the opening 119 may not necessarily be located at the center of the conductor 710 b in the width direction (Y-axis direction).
  • One flow path portion 711b is orthogonal to an extending portion 714b extending in one length direction (X-axis direction) from one portion in the length direction (X-axis direction) of the conductor 710b, and orthogonal to the surface of the conductor 710b. It is bent, and it is comprised from the bent part 713b which connects the extension part 714b and the other part of the length direction (X-axis direction) of the conductor 710b.
  • the other flow path portion 715b is a bent portion 716b which is bent so as to be orthogonal to the back surface of the conductor 710b from one portion in the length direction (X axis direction) of the conductor 710b, and a length direction from the bent portion 716b (X axis direction And an extending portion 718b connecting the bent portion 716b, the extending portion 714b, and the other portion in the length direction (the X-axis direction) of the conductor 710b.
  • a region 710bh surrounded by one flow passage portion 711b and the other flow passage portion 715b is formed.
  • the magnetic sensor package 120 is inserted in a space formed by one flow passage portion 711 b and the other flow passage portion 715 b.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are located inside the region 710bh when viewed from the width direction (Y-axis direction), and viewed from the thickness direction (Z-axis direction), It is located in the range from one end of one flow passage portion 711b to the other end of the other flow passage portion 715b in the width direction (Y-axis direction).
  • the magnetic sensor package 120 is arranged such that the middle position between the first magnetic sensor 10 and the second magnetic sensor 20 and the central position of the opening 119 coincide with each other in the width direction (Y-axis direction). It is arranged.
  • the current sensor 700b can measure the current of the measurement target with high sensitivity while reducing the influence of the external magnetic field.
  • the magnetic sensor package 120 is disposed in the space formed by the one flow passage portion 711b and the other flow passage portion 715b,
  • the temperature inside the magnetic sensor package 120 when the conductor 710 b generates heat is made uniform.
  • the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced.
  • a current sensor 700c includes a conductor 710c and a magnetic sensor package 120.
  • the conductor 710c includes one flow path portion 711b and the other flow path portion 715c in which the current to be measured is divided and flows halfway along the length direction (X-axis direction).
  • the other flow passage portion 715c is located in line with the one flow passage portion 711b in the width direction (Y-axis direction).
  • the conductor 710 c is located on the surface side of the conductor 710 c with one side in the length direction (X-axis direction) bordering the dividing portion as compared with the other side.
  • An opening 119 extending in the length direction (X-axis direction) is provided between one flow passage portion 711 b and the other flow passage portion 715 c.
  • the opening 119 is located at the center of the conductor 710 c in the width direction (Y-axis direction).
  • the opening 119 may not necessarily be located at the center of the conductor 710 c in the width direction (Y-axis direction).
  • the other flow path portion 715c extends in the length direction (X-axis direction), with a third projection 716c and a fourth projection 717 projecting orthogonally to the back surface of the conductor 710c, spaced apart from each other. , And an extending portion 718 connecting the third protruding portion 716 c and the fourth protruding portion 717.
  • the third protrusion 716 c connects one portion in the length direction (X-axis direction) of the conductor 710 c and the extension 718.
  • the fourth projecting portion 717 connects the extending portion 718 and the other portion in the length direction (X-axis direction) of the conductor 710c.
  • a region 710 ch surrounded by one flow passage portion 711 b and the other flow passage portion 715 c is formed.
  • the magnetic sensor package 120 is inserted in a space formed by one flow passage portion 711 b and the other flow passage portion 715 c.
  • the first magnetic sensor 10 and the second magnetic sensor 20 are located inside the area 710ch when viewed from the width direction (Y-axis direction), and viewed from the thickness direction (Z-axis direction), It is located in the range from one end of one flow passage portion 711b in the width direction (Y-axis direction) to the other end of the other flow passage portion 715c.
  • the magnetic sensor package 120 is arranged such that the middle position between the first magnetic sensor 10 and the second magnetic sensor 20 and the central position of the opening 119 coincide with each other in the width direction (Y-axis direction). It is arranged.
  • the current sensor 700c can measure the current of the measurement target with high sensitivity while reducing the influence of the external magnetic field.
  • the magnetic sensor package 120 is disposed in the space formed by one flow passage portion 711b and the other flow passage portion 715c.
  • the temperature inside the magnetic sensor package 120 when the conductor 710c generates heat is made uniform. Thereby, the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced. As a result, it is possible to reduce the measurement error of the current sensor 700c due to the temperature characteristic of the magnetoresistive element that each of the first magnetic sensor 10 and the second magnetic sensor 20 has.
  • the current sensor according to the eighth embodiment differs from the current sensor 700 according to the seventh embodiment mainly in that the current sensor according to the eighth embodiment includes the attachment member. And do not repeat the description.
  • FIG. 17 is a perspective view showing the configuration of a current sensor according to Embodiment 8 of the present invention.
  • FIG. 18 is an exploded perspective view showing a configuration of a current sensor according to Embodiment 8 of the present invention.
  • the magnetic sensor package is shown only in the outer shape.
  • the current sensor 800 includes a conductor 710, a magnetic sensor package 120, and a mounting member 830.
  • the mounting member 830 includes a base 831 and a pair of engaging portions 832 that project from both ends in the lengthwise direction (X-axis direction) of the base 831 and engage with the openings 119 of the conductor 710.
  • the mounting member 830 is formed of resin, engineering plastic, ceramic, or the like having insulation.
  • the mounting member 830 is made of, for example, silicone resin, epoxy resin, polyphenylene sulfide, polybutylene terephthalate resin, liquid crystal polymer, urethane, nylon or the like.
  • the mounting member 830 is fixed to the conductor 710.
  • the mounting member 830 is fixed to the conductor 710 in contact with at least a part of the edge of the opening 119.
  • the mounting member 830 and the conductor 710 are bonded to each other by a bonding material applied in the vicinity of the contact portion.
  • the pair of engaging portions 832 of the mounting member 830 is inserted into and fixed to the opening 119 of the conductor 710.
  • the pair of engaging portions 832 of the mounting member 830 are in contact with both edges of the opening 119 in the longitudinal direction (X-axis direction) in a one-to-one correspondence.
  • the mounting member 830 is positioned with respect to the conductor 710 in the longitudinal direction (X-axis direction).
  • the pair of engaging portions 832 of the mounting member 830 correspond one-to-one to the side surface on the opening 119 side of one flow passage portion 711 and the side surface on the opening 119 side of the other flow passage portion 715. Are in contact with each other.
  • the mounting member 830 is positioned with respect to the conductor 710 in the width direction (Y-axis direction).
  • the mounting member 830 is connected to the magnetic sensor package 120.
  • the mounting member 830 is in contact with the magnetic sensor package 120 on the inner surface of the base 831 and the pair of engaging portions 832.
  • the mounting member 830 and the magnetic sensor package 120 are bonded to each other by a bonding material applied in the vicinity of the contact portion.
  • the magnetic sensor package 120 is indirectly attached to the conductor 710.
  • the edge in the longitudinal direction (X-axis direction) of the opening portion 119 of the conductor 710 is the portion with the smallest amount of deformation when the diverted portion of the conductor 710 is deformed by heat generation when current flows through the conductor 710.
  • the mounting member 830 is in contact with the edge in the length direction (X-axis direction) of the opening 119, which is the portion with the smallest amount of deformation when the branched portion of the conductor 710 generates heat. In a fixed state, it is fixed to the conductor 710. Therefore, the mounting member 830 is not easily affected by the deformation of the conductor 710 due to the heat generation, and the positional variation is suppressed.
  • the magnetic sensor package 120 Since the magnetic sensor package 120 is indirectly attached to the conductor 710 via the attachment member 830, the magnetic sensor package 120 is also less susceptible to the deformation due to the heat generation of the conductor 710, and the positional variation is suppressed. As a result, the fluctuation of the relative positional relationship between the first flow path portion 711 and the other flow path portion 715 divided from the conductor 710 and the first magnetic sensor 10 and the second magnetic sensor 20 is reduced, and the current sensor The reliability of 800 can be improved.
  • FIG. 19 is a perspective view showing a configuration of a current sensor according to a modification of Embodiment 8 of the present invention.
  • FIG. 20 is an exploded perspective view showing a configuration of a current sensor according to a modification of Embodiment 8 of the present invention.
  • the current sensor according to the modification of the eighth embodiment of the present invention is different from the current sensor 800 according to the eighth embodiment of the present invention mainly in that the mounting member and the magnetic sensor package are welded to each other. The description of the same configuration as that of the current sensor 800 according to the eighth embodiment will not be repeated.
  • a current sensor 800a according to a modification of Embodiment 8 of the present invention includes a conductor 710, a magnetic sensor package 820, and a mounting member 830a.
  • the magnetic sensor package 820 has a pair of protrusions 821 protruding from both sides in the longitudinal direction (X-axis direction). Each of the pair of protrusions 821 is provided with a through hole 822 penetrating in the thickness direction (Z-axis direction).
  • the mounting member 830 a has a cylindrical convex portion 833 which protrudes from the engaging portion 832 in the thickness direction (Z-axis direction) and is fitted to the through hole 822.
  • the shape of the convex portion 833 is not limited to a cylindrical shape, and may be a prismatic shape, an elliptical shape, or the like.
  • the mounting member 830a is made of a thermoplastic resin.
  • the insulating material forming a part of the magnetic sensor package 820 is another thermoplastic resin having a melting point higher than that of the thermoplastic resin forming the mounting member 830a.
  • the mounting member 830 a is connected to the magnetic sensor package 820.
  • the mounting member 830a and the magnetic sensor package 820 are joined to each other by welding of their connection parts. Thereby, the magnetic sensor package 820 is indirectly attached to the conductor 710.
  • the convex portion 833 is The attachment member 830a is inserted into the opening 119 of the conductor 710 and fixed while the attachment member 830a and the magnetic sensor package 820 are connected so as to be inserted into the through hole 822. Fix at 710.
  • the convex portion 833 By heating the assembly in this state at a temperature higher than the melting point of the thermoplastic resin forming the mounting member 830 a and lower than the melting points of other thermoplastic resins forming the magnetic sensor package 820, the convex portion 833. Melt the surface of Thereafter, by cooling the assembly, the surface of the molten convex portion 833 is fixed to the inner surface of the through hole 822. As a result, the magnetic sensor package 820 and the mounting member 830a are connected to each other.
  • the through hole 822 is provided in the projecting portion 821, but instead of the through hole 822, a concave portion into which the convex portion 833 can be inserted may be provided.
  • the insulating material that constitutes a part of the magnetic sensor package 820 may be a thermosetting resin instead of the other thermoplastic resin.
  • the portion that constitutes the convex portion 833 may be made of a thermoplastic resin, and the other portion may be made of another thermoplastic resin or thermosetting resin.
  • the current sensor according to Embodiment 9 of the present invention differs from the current sensor 700 according to the seventh embodiment mainly in that the conductor and the magnetic sensor package are welded to each other, and thus, the same as the current sensor 700 according to the seventh embodiment.
  • the same reference symbols are attached to the configurations that are and the description thereof will not be repeated.
  • FIG. 21 is a perspective view showing the configuration of a current sensor according to Embodiment 9 of the present invention.
  • FIG. 22 is an exploded perspective view showing the configuration of the current sensor according to Embodiment 9 of the present invention.
  • a current sensor 900 includes a conductor 710 and a magnetic sensor package 920.
  • the magnetic sensor package 920 is electrically insulated from the metal plate 40 and has a pair of metal projecting pieces 921 projecting from both sides in the longitudinal direction (X-axis direction).
  • the protruding piece 921 is made of substantially the same material as the conductor 710. However, the material forming the protruding piece 921 is not limited to the material substantially the same as the conductor 710, and may be a material that can be welded to the conductor 710.
  • the pair of projecting pieces 921 is welded to the conductor 710 in contact with at least one edge in the lengthwise direction (X-axis direction) of the opening 119.
  • the magnetic sensor package 920 is fixed to the conductor 710 by the weld 922 between the projecting piece 921 and the conductor 710. Welded portion 922 is provided in the vicinity of the contact portion between projecting piece 921 and conductor 710.
  • a pair of projecting pieces 921 are inserted into and fixed to the opening 119 of the conductor 710.
  • the pair of projecting pieces 921 are in contact with each other in a one-to-one correspondence with both edges in the longitudinal direction (X-axis direction) of the opening 119.
  • the magnetic sensor package 920 is positioned with respect to the conductor 710 in the longitudinal direction (X-axis direction).
  • the pair of projecting pieces 921 are in contact with each other in a one-to-one correspondence with the side surface on the opening 119 side of one flow passage portion 711 and the side surface on the opening 119 side of the other flow passage portion 715.
  • the magnetic sensor package 920 is positioned with respect to the conductor 710 in the width direction (Y-axis direction).
  • the magnetic sensor package 920 is fixed to the conductor 710 in contact with at least one edge in the length direction (X-axis direction) of the opening 119.
  • the magnetic sensor package 920 is directly attached to the conductor 710.
  • the protruding piece 921 is in contact with the edge in the length direction (X-axis direction) of the opening 119 which is the portion with the smallest amount of deformation when the divided portion of the conductor 710 generates heat.
  • the magnetic sensor package 920 is unlikely to be affected by the deformation of the conductor 710 due to the heat generation, and the positional variation is suppressed.
  • the fluctuation of the relative positional relationship between the first flow path portion 711 and the other flow path portion 715 divided from the conductor 710 and the first magnetic sensor 10 and the second magnetic sensor 20 is reduced, and the current sensor The reliability of 900 can be improved.
  • the welded portion 922 can be formed by various welding methods. The welding of the magnetic sensor package 920 and the conductor 710 by the welding portion 922 can improve the attachment reliability of the current sensor 900 to the conductor 710.
  • the projecting piece 921 may be provided with a curved portion bent in the height direction (Z-axis direction). In this case, the stress transmitted from the conductor 710 to the first magnetic sensor 10 and the second magnetic sensor 20 can be relieved by the bent portion of the protruding piece 921.
  • the central position of each of the first magnetic sensor 10 and the second magnetic sensor 20 can be grasped.
  • the current sensor according to Embodiment 10 of the present invention differs from the current sensor 700 according to the seventh embodiment mainly in that the conductor and the magnetic sensor package are insert-molded, and thus the same as the current sensor 700 according to the seventh embodiment.
  • the same reference symbols are attached to the configurations that are and the description thereof will not be repeated.
  • FIG. 23 is a perspective view showing the configuration of a current sensor according to Embodiment 10 of the present invention.
  • FIG. 24 is a cross-sectional view of the current sensor of FIG. 23 as viewed in the arrow direction of arrows XXIV-XXIV.
  • the current sensor 1000 includes a conductor 710 and a magnetic sensor package 120.
  • the conductor 710 and the magnetic sensor package 120 are integrated by the mold resin 1010 by being insert-molded.
  • the mold resin 1010 covers the entire diverted portion of the conductor 710. Specifically, a portion inserted in a space formed by one flow passage portion 711, the other flow passage portion 715, the opening portion 119, and one flow passage portion 711 and the other flow passage portion 715.
  • the magnetic sensor package 120 is covered by a mold resin 1010.
  • thermosetting resin such as epoxy resin or thermoplastic resin such as polyphenylene sulfide resin can be used.
  • An additive such as a silica filler may be added to the thermosetting resin.
  • the magnetic sensor package 120 disposed in the space formed by one flow passage portion 711 and the other flow passage portion 715 is covered with the mold resin 1010.
  • the temperature inside the magnetic sensor package 120 when the conductor 710 generates heat is made uniform.
  • the difference between the temperature around the first magnetic sensor 10 and the temperature around the second magnetic sensor 20 can be reduced.
  • FIG. 25 is a perspective view showing the configuration of a current sensor according to a modification of Embodiment 10 of the present invention.
  • the current sensor according to the modification of the tenth embodiment of the present invention is the same as the current sensor 1000 according to the tenth embodiment of the present invention because it is different from the current sensor 1000 according to the tenth embodiment of the present invention. Description of the configuration will not be repeated.
  • FIG. 25 is a perspective view showing the configuration of a current sensor according to a modification of Embodiment 10 of the present invention.
  • a current sensor 1000 a according to a modification of Embodiment 10 of the present invention includes a conductor 710 and a magnetic sensor package 120.
  • the conductor 710 and the magnetic sensor package 120 are integrated by the mold resin 1010 a by being insert-molded.
  • the mold resin 1010 a is formed integrally with the conductor 710 in contact with at least one edge in the lengthwise direction (X-axis direction) of the opening 119.
  • the mold resin 1010 a is not in contact with the extension portion 714 of one flow passage portion 711 and the extension portion 718 of the other flow passage portion 715.
  • the mold resin 1010 a is integrally molded with the magnetic sensor package 120. Thereby, the magnetic sensor package 120 is indirectly attached to the conductor 710 via the mold resin 1010a.
  • the mold resin 1010a has an edge in the length direction (X-axis direction) of the opening 119 which is the portion with the smallest amount of deformation when the divided portion of the conductor 710 generates heat. Since the magnetic sensor package 120 is joined to the magnetic sensor package 120, the magnetic sensor package 120 is less susceptible to the deformation due to the heat generation of the conductor 710, and the positional variation is suppressed. As a result, the fluctuation of the relative positional relationship between the first flow path portion 711 and the other flow path portion 715 divided from the conductor 710 and the first magnetic sensor 10 and the second magnetic sensor 20 is reduced, and the current sensor The reliability of 1000a can be improved.
  • the current sensor according to the eleventh embodiment differs from the current sensor 700 according to the seventh embodiment mainly in that the magnetic sensor package is fixed to the opening of the conductor by the adhesive, and the current according to the seventh embodiment.
  • the same components as those of sensor 700 are denoted by the same reference numerals, and the description thereof will not be repeated.
  • FIG. 26 is a perspective view showing a configuration of a current sensor according to Embodiment 11 of the present invention.
  • the current sensor 1100 according to Embodiment 11 of the present invention includes a conductor 710 and a magnetic sensor package 120.
  • the conductor 710 and the magnetic sensor package 120 are integrated by an adhesive 1110.
  • the adhesive 1110 is applied in the opening 119 of the conductor 110 so as to be in contact with at least one edge in the longitudinal direction (X-axis direction) of the opening 119.
  • a thermosetting adhesive such as epoxy can be used as the adhesive 1110.
  • the adhesive 1110 has an edge in the length direction (X-axis direction) of the opening 119 which is the portion with the smallest amount of deformation when the branched portion of the conductor 710 generates heat. Since the magnetic sensor package 120 is joined to the magnetic sensor package 120, the magnetic sensor package 120 is less susceptible to the deformation due to the heat generation of the conductor 710, and the positional variation is suppressed. As a result, the fluctuation of the relative positional relationship between the first flow path portion 711 and the other flow path portion 715 divided from the conductor 710 and the first magnetic sensor 10 and the second magnetic sensor 20 is reduced, and the current sensor The reliability of 1100 can be improved.

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  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

L'invention comprend un boîtier de capteur magnétique (120) qui comprend une pluralité de capteurs magnétiques, un circuit de traitement de signal (30) et une plaque métallique (40). Les capteurs magnétiques détectent l'intensité d'un champ magnétique généré dû à un courant à mesurer. Le circuit de traitement de signal (30) traite des signaux émis par les capteurs magnétiques. Les capteurs magnétiques, le circuit de traitement de signal (30) et la plaque métallique (40) sont recouverts d'un matériau isolant (121). Les capteurs magnétiques et le circuit de traitement de signal (30) sont montés sur la plaque métallique (40).
PCT/JP2018/009178 2017-08-21 2018-03-09 Capteur de courant WO2019038964A1 (fr)

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EP3974846A1 (fr) * 2020-09-25 2022-03-30 Melexis Technologies SA Dispositif capteur de courant
EP3992653A1 (fr) * 2020-10-31 2022-05-04 Melexis Technologies SA Système de détection de courant
EP4063872A1 (fr) * 2021-03-22 2022-09-28 Allegro MicroSystems, LLC Boîtier de capteur de courant différentiel

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