WO2019019114A1

WO2019019114A1 - Peeling device and peeling method

Info

Publication number: WO2019019114A1
Application number: PCT/CN2017/094744
Authority: WO
Inventors: 周启豪
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2017-07-27
Filing date: 2017-07-27
Publication date: 2019-01-31
Also published as: CN109791901A

Abstract

A peeling device (10). The peeling device (10) is used for peeling a flexible substrate (20) from a glass substrate (40), the glass substrate (40) and the flexible substrate (20) being bonded by means of a light absorption layer (30), the bonding force of the light absorption layer (30) being reduced under the irradiation of a laser, and the peeling device (10) comprises a laser device (11) and a roller (12). The laser device (11) is used for emitting a laser, such that the laser irradiates the light absorption layer (30) from the side where the flexible substrate (20) is located on the glass substrate (40) and from the side edge of the light absorption layer (30). The roller (12) can be combined with the edge of the flexible substrate (20), and rotates and moves to roll up the flexible substrate (20) so as to peel the flexible substrate (20) from the glass substrate (40). Further disclosed is a peeling method.

Description

Peeling device and peeling method

Technical field

The present invention relates to the field of display screen technologies, and in particular, to a peeling device and a peeling method.

Background technique

In the manufacturing process of the flexible substrate, in order to peel the flexible substrate from the glass substrate, the laser light is usually passed through the glass substrate and then irradiated to the interface between the flexible substrate and the glass substrate, and then the flexible substrate is further peeled off. However, the glass substrate may be There are scratches or dust, etc., which affect the laser passing through the glass substrate, resulting in a decrease in the yield of the peeled flexible substrate.

Summary of the invention

Embodiments of the present invention provide a peeling device and a peeling method.

The peeling device of the embodiment of the present invention is for peeling off a glass substrate and the flexible substrate, the glass substrate and the flexible substrate are bonded by a light absorbing layer, and the light absorbing layer is reduced in adhesion under irradiation of laser light, The stripping device includes:

a laser for emitting a laser such that the laser illuminates the light absorbing layer from a side of the glass substrate on which the flexible substrate is located and from a side of the light absorbing layer;

a roller that is engageable with an edge of the flexible substrate and that is rotated and moved to roll up the flexible substrate to peel the flexible substrate from the glass substrate.

In some embodiments, the roller is attached to the flexible substrate by means of an adhesive; or

The drum is coupled to the flexible substrate by means of adsorption.

In some embodiments, the drum is movable relative to the glass substrate in a thickness direction of the flexible substrate when rotated; and/or

The drum is movable relative to the glass substrate in a direction perpendicular to the thickness of the flexible substrate when rotated.

In some embodiments, the stripping device further includes a bracket, the bracket includes a drum vertical rail, the drum is movably coupled to the drum vertical rail, and the drum is movable on the drum vertical rail to The drum is moved in a thickness direction of the flexible substrate with respect to the glass substrate.

In some embodiments, the stripping device further includes a bracket, the bracket includes a roller cross rail, the drum is movably coupled to the drum cross rail, and the drum is movable on the drum cross rail to The drum is moved relative to the glass substrate in a direction perpendicular to the thickness of the flexible substrate.

In some embodiments, the stripping device further includes a bracket, the laser being mounted on the bracket, the laser being rotatable relative to the bracket to adjust a direction of emission of the laser,

The laser is movable relative to the glass substrate in a thickness direction of the flexible substrate when rotated; and/or

The laser is movable relative to the glass substrate in a direction perpendicular to the thickness of the flexible substrate when rotated.

In some embodiments, the bracket includes a laser vertical rail, the laser is movably coupled to the laser vertical rail, and the laser is movable on the laser vertical rail to cause the laser to be opposite to the laser The glass substrate is moved in the thickness direction of the flexible substrate to change the emission direction of the laser light.

In some embodiments, the bracket includes a laser cross rail, the laser is movably coupled to the laser cross rail, and the laser is movable on the laser cross rail to cause the laser to be opposite to the laser The glass substrate is moved in a direction perpendicular to the thickness of the flexible substrate to change the emission direction of the laser light.

In certain embodiments, the stripping device further includes a mounting platform on which the glass substrate is secured.

In some embodiments, the mounting platform is provided with a fixing groove, and the glass substrate covers the fixing groove, and a negative pressure can be formed in the fixing groove, so that the glass substrate is fixed under the negative pressure. On the installation platform.

The peeling method of the embodiment of the present invention is for peeling off a glass substrate and the flexible substrate, the glass substrate and the flexible substrate are bonded by a light absorbing layer, and the light absorbing layer is reduced in adhesion under irradiation of laser light, Stripping methods include:

Emulating a laser such that the laser illuminates the light absorbing layer from a side of the glass substrate on which the flexible substrate is located and from a side of the light absorbing layer; and

Rotating and moving the edge of the flexible substrate to wind up the flexible substrate to peel the flexible substrate from the glass substrate.

In the peeling device and the peeling method of the embodiment of the present invention, the laser can irradiate the side of the light absorbing layer from the side of the flexible substrate of the glass substrate, and the laser can irradiate the light absorbing layer without passing through the glass substrate, thereby avoiding the glass substrate. The effect of defects on the laser, which in turn increases the yield of the flexible substrate.

The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a perspective view showing the working state of a peeling device according to an embodiment of the present invention;

2 is a schematic view showing a state in which a peeling device of an embodiment of the present invention peels off a flexible substrate and a glass substrate;

3 is a schematic view showing the combination of a drum and a flexible substrate according to an embodiment of the present invention;

4 is a schematic view showing the combination of a drum and a flexible substrate according to an embodiment of the present invention;

5 is a schematic view showing a state in which a peeling device of an embodiment of the present invention peels off a flexible substrate and a glass substrate;

Figure 6 is a perspective view of a peeling device according to an embodiment of the present invention;

Figure 7 is a schematic view showing the cooperation of the drum, the roller cross rail and the drum vertical rail according to the embodiment of the present invention;

Figure 8 is a cross-sectional view of the drum, the roller cross rail and the drum vertical rail of Figure 7 taken along line VIII-VIII;

9 is a schematic view showing a state in which a peeling device of an embodiment of the present invention peels off a flexible substrate and a glass substrate;

Fig. 10 is a flow chart showing a peeling method according to an embodiment of the present invention.

The main component symbol drawing description:

Stripping device 10, laser 11, roller 12, rotating shaft 121, cylinder 122, adhesive 123, suction cup 124, mounting platform 13, fixing groove 131, bracket 14, roller vertical guide 141, first guide groove 1411, second guide groove 1412, roller cross rail 142, laser vertical rail 143, laser cross rail 144, flexible substrate 20, light absorbing layer 30, and glass substrate 40.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are merely illustrative of the embodiments of the invention, and are not to be construed as limiting.

In the present invention, the first feature "on" or "under" the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

Referring to FIG. 1 and FIG. 6, the peeling device 10 of the embodiment of the present invention is used for peeling off the flexible substrate 20 from the glass substrate 40. The glass substrate 40 and the flexible substrate 20 are bonded by the light absorbing layer 30, and the light absorbing layer 30 is The adhesive force is reduced under irradiation of the laser, and the peeling device 10 includes the laser 11 and the drum 12. The laser 11 is for emitting laser light such that the laser light is irradiated from the side where the flexible substrate 20 of the glass substrate 40 is located and from the side of the light absorbing layer 30. The drum 12 can be coupled to the edge of the flexible substrate 20 and rotated and moved to wind up the flexible substrate 20 to peel the flexible substrate 20 from the glass substrate 40.

In the peeling device 10 of the embodiment of the present invention, the laser light can be irradiated from the side where the flexible substrate 20 of the glass substrate 40 is located to the side of the light absorbing layer 30, and the laser can be irradiated to the light absorbing layer 30 without passing through the glass substrate 40, thereby avoiding The influence of the defects of the glass substrate 40 on the laser light further improves the yield of the flexible substrate 20.

The flexible substrate 20 may be an OLED screen. The flexible substrate 20 generally needs to fabricate a flexible substrate on the glass substrate 40, and a device layer, a protective layer or the like is prepared on the flexible substrate to form the flexible substrate 20, and then the flexible substrate 20 is required. It is peeled off from the glass substrate 40. In the manufacturing process of the flexible substrate 20, in order to ensure good bonding between the flexible substrate 20 and the glass substrate 40, when the flexible substrate 20 and the glass substrate 40 are bonded using the light absorbing layer 30, the coating of the light absorbing layer 30 is performed. The area needs to cover the area of the flexible substrate 20, or the coated area of the light absorbing layer 30 needs to be greater than or equal to the area of the flexible substrate 20.

Specifically, in conjunction with FIG. 2, when the flexible substrate 20 and the glass substrate 40 need to be peeled off, the roller 12 is bonded to the edge of the flexible substrate 20 (as in the a state of FIG. 2), and the laser 11 emits the side of the laser irradiation light absorbing layer 30. The edge, that is, the laser does not pass through the flexible substrate 20 to avoid damage of the device layer in the flexible substrate 20 by the laser, and the laser does not pass through the glass substrate 40 to avoid defects of the glass against the laser light irradiated on the light absorbing layer 30. influences. The laser light is directly irradiated on the light absorbing layer 30 to reduce the adhesion of the light absorbing layer 30. When the drum 12 is rotated and moved (as in the b state of FIG. 2), the edge of the flexible substrate 20 is separated from the glass substrate 40 by the bonding force of the drum 12 and the flexible substrate 20, and is exposed to the laser light. The light absorbing layer 30, the laser re-irradiates the newly exposed light absorbing layer 30 to reduce its adhesion, and the drum 12 can be further rotated or moved to pull the flexible substrate 20 away from the glass substrate 40, and finally the flexible substrate 20 is finally obtained. It is completely peeled off from the glass substrate 40.

During the stripping process, the light absorbing layer 30 may be bonded to the flexible substrate 20 and peeled off from the glass substrate 40. The light absorbing layer 30 may also be bonded to the glass substrate 40 at all times and gradually separated from the flexible substrate 20, The absorbing layer 30 may also be partially left on the glass substrate 40 and partially bonded to the flexible substrate 20. After the flexible substrate 20 is peeled off from the glass substrate 40, the light absorbing layer 30 remaining on the flexible substrate 20 does not affect the subsequent processing steps and use of the flexible substrate 20, and a protective layer may be further formed on the flexible substrate 20 to encapsulate light absorption. Layer 30.

It can be understood that the bonding force when the roller 12 is combined with the flexible substrate 20 needs to be greater than the bonding force of the light absorbing layer 30 after the laser irradiation, so that the flexible substrate 20 is gradually separated from the glass substrate 40 under the pulling of the roller 12. When the separation roller 12 and the flexible substrate 20 are required, the bonding force between the roller 12 and the flexible substrate 20 is easily undone to ensure that the flexible substrate 20 is not damaged.

Referring to FIG. 3, in some embodiments, the drum 12 is coupled to the flexible substrate 20 by means of an adhesive 123. The combination of the drum 12 and the flexible substrate 20 is simple, and the structure of the peeling device 10 is simple.

Specifically, the drum 12 includes a rotating shaft 121, a cylinder 122, and an adhesive 123. The rotating shaft 121 is fixedly connected to the cylindrical body 122. The rotating shaft 121 can be rotated and moved to drive the rotating and moving of the cylindrical body 122. The cylindrical body 122 can have a cylindrical shape or the like, and the adhesive 123 is coated on the outer surface of the cylindrical body 122. When it is required to combine the drum 12 and the flexible substrate 20, the rotating shaft 121 is moved such that the cylindrical body 122 approaches the flexible substrate 20, and finally the adhesive 123 is brought into contact with the flexible substrate 20, and the adhesive 123 is bonded to the cylindrical body 122 and the flexible substrate 20. The adhesive 123 may be applied to the entire outer surface of the cylinder 122 or may be applied to a specific position of the outer surface of the cylinder 122, which is not limited herein.

Referring to FIG. 4, in some embodiments, the drum 12 can also be coupled to the flexible substrate 20 by means of adsorption. The bonding force of the drum 12 and the flexible substrate 20 is easily controlled and easily undone.

Specifically, the drum 12 includes a rotating shaft 121, a cylinder 122, and a suction cup 124. The rotating shaft 121 is fixedly connected to the cylindrical body 122. The rotating shaft 121 can be rotated and moved to drive the rotating and moving of the cylindrical body 122. The cylindrical body 122 can have a cylindrical shape or the like, and the suction cup 124 is disposed on the outer surface of the cylindrical body 122. The suction cup 124 is connected to a vacuum pump through an opening formed in the side wall of the cylinder 122. After the vacuum pump is turned on, the air in the suction cup 124 can be extracted to form a negative pressure in the suction cup 124. When it is desired to combine the drum 12 and the flexible substrate 20, the vacuum pump is turned on and the rotating shaft 121 is moved so that the suction cup 124 approaches the flexible substrate 20 until the flexible substrate 20 is attracted by the suction cup 124. The magnitude of the suction force of the suction pad 124 to the flexible substrate 20 can be adjusted by adjusting the power of the vacuum pump. When the separation roller 12 and the flexible substrate 20 are required, the vacuum pump is turned off to undo the suction force of the suction pad 124 on the flexible substrate 20.

Referring to FIG. 5, in some embodiments, the drum 12 is movable relative to the glass substrate 40 in the thickness direction of the flexible substrate 20 (direction D1 in FIG. 5) when rotated.

It can be understood that when the flexible substrate 20 is bent, the flexible substrate 20 has a tendency to return to the original state. In the embodiment of the present invention, when the roller 12 is combined with the flexible substrate 20, the roller 12 is rotated to make the flexible substrate 20 which is originally in the form of a flat plate. Winding on the drum 12, the flexible substrate 20 is bent and the flexible substrate 20 generates stress returning to the flat plate. The stress increases as the flexible substrate 20 is bent. When the stress is gradually increased, the flexible substrate 20 is increased. It may be detached from the drum 12 that causes the drum 12 to be unable to pull the flexible substrate 20 to move. In particular, when the size of the flexible substrate 20 is large, the stress accumulated in the flexible substrate 20 is large during the peeling of the flexible substrate 20, and the flexible substrate 20 is more easily separated from the drum 12.

Since the drum 12 is also movable in the direction D1 while rotating, the distance between the drum 12 and the glass substrate 40 is increased, so that the partial flexible substrate 20 that has been peeled off from the glass substrate 40 does not need to be bent, thereby reducing the flexible substrate. The stress within 20 prevents the flexible substrate 20 from being detached from the drum 12.

Referring again to FIG. 5, in some embodiments, the drum 12 is movable relative to the glass substrate 40 in a direction perpendicular to the thickness of the flexible substrate 20 (direction D2 in FIG. 5) when rotated.

Since the drum 12 can also be moved in the direction D2 while rotating, so that the partial flexible substrate 20 that has been peeled off from the glass substrate 40 does not need to be bent, the stress in the flexible substrate 20 is reduced, and the flexible substrate 20 is avoided. It is detached from the drum 12.

The drum 12 may be moved in the direction D1 alone or in the direction D2 alone or in the D1 direction and the D2 direction to increase the degree of freedom of movement of the drum 12. In one embodiment, the drum 12 is first rotated by a predetermined angle, for example, by 360 degrees or 180 degrees, so that the flexible substrate 20 is partially wound on the drum 12, and the combination of the drum 12 and the flexible substrate 20 is sufficient, and the flexible substrate 20 is not easy. Disengaged from the drum 12, the drum 12 is moved in the direction D1 or the direction D2. In another embodiment, after the roller 12 is adjacent to the flexible substrate 20 and combined with the flexible substrate 20, The drum 12 may first be moved in the direction D1 or the direction D2, and the drum 12 is rotated to wind up the flexible substrate 20. Of course, the rotation and movement of the drum 12 do not affect each other, and the user can control the rotation or movement of the drum 12 as needed.

1 and 6, in some embodiments, the stripping device 10 further includes a mounting platform 13 on which the glass substrate 40 is secured.

It can be understood that in the process of peeling off the flexible substrate 20 and the glass substrate 40, it is necessary to keep the glass substrate 40 stationary so that the flexible substrate 20 can be separated from the glass substrate 40 when the flexible substrate 20 is rolled up.

Specifically, please refer to FIG. 1 and FIG. 6 . In some embodiments, the mounting platform 13 is provided with a fixing slot 131 , and the glass substrate 40 covers the fixing slot 131 , and a negative pressure can be formed in the fixing slot 131 to make the glass substrate 40 . It is fixedly mounted on the mounting platform 13 under the action of negative pressure.

When the glass substrate 40 needs to be fixed, the glass substrate 40 may be placed on the mounting platform 13 and covered with the fixing groove 131. Then, the air in the fixing groove 131 is sucked by the vacuum pump, a negative pressure is formed in the fixing groove 131, and the glass substrate 40 is adsorbed. On the installation platform 13. When it is necessary to remove the glass substrate 40 from the mounting platform 13, the vacuum pump can be closed and the fixing groove 131 communicates with the atmosphere, and after the negative pressure in the fixing groove 131 disappears, the glass substrate 40 is removed.

1 and 6, in some embodiments, the peeling device 10 further includes a bracket 14 that includes a drum vertical rail 141, the drum 12 is movably coupled to the drum vertical rail 141, and the drum 12 is capable of the drum vertical rail 141. The upper portion is moved to move the drum 12 in the thickness direction of the flexible substrate 20 with respect to the glass substrate 40.

Under the guiding action of the drum vertical rail 141, the drum 12 is movable in the thickness direction of the flexible substrate 20 and the moving direction of the drum 12 is easily controlled. In the embodiment of the present invention, the drum vertical rails 141 are disposed on both sides of the drum 12 to make the drum 12 move more smoothly. Of course, the drum vertical rail 141 may be disposed only on one side of the drum 12, which is not limited herein.

Referring to Figures 1 and 6, in some embodiments, the bracket 14 further includes a roller cross rail 142, the drum 12 is movably coupled to the roller cross rail 142, and the drum 12 is movable on the roller cross rail 142 to cause the roller 12 moves in a direction perpendicular to the thickness of the flexible substrate 20 with respect to the glass substrate 40.

Under the guidance of the roller cross rail 142, the drum 12 is movable in a thickness direction perpendicular to the flexible substrate 20, and the moving direction of the drum 12 is easily controlled. Referring to FIG. 7 and FIG. 8 , in one example, the roller guide rail 141 is provided with a first guiding slot 1411 , the first guiding slot 1411 is a through slot, and the roller cross rail 142 is disposed through the first guiding slot 1411 , and the roller vertical rail 141 is movable relative to the roller transverse rail 142 in the Y direction (as shown in FIG. 8), it being understood that the Y direction coincides with the D2 direction in FIG. The drum vertical rail 141 is further provided with a second guiding groove 1412. The end of the rotating shaft 121 of the drum 12 is embedded in the second guiding groove 1412, and the rotating shaft 121 can move in the Z direction (as shown in FIG. 7) with respect to the vertical rail of the drum. , wherein the Z direction coincides with the direction of D1 in FIG. When the drum 12 needs to move in the thickness direction of the flexible substrate 20, the rotating shaft 121 may be driven by the motor, the hydraulic cylinder or the like along the drum vertical rail 141 (that is, in the Z direction), that is, the thickness direction of the drum 12 along the flexible substrate 20. mobile. When the drum 12 needs to move in a thickness direction perpendicular to the flexible substrate 20, the drum vertical rail 141 may be driven along the drum cross rail 142 by a motor, a hydraulic cylinder or the like (that is, along the Y The direction) is moved, that is, the roller 12 is moved in a thickness direction perpendicular to the flexible substrate 20. Further, the rotating shaft 121 can be rotated by the motor, and the motor can also be disposed in the second guiding groove 1412. When the roller 12 needs to move in the Z direction, the motor and the rotating shaft 121 move together with respect to the second guiding groove 1412; when the roller 12 needs When moving in the Y direction, the drum vertical rail 141, the motor and the rotating shaft 121 move together with respect to the first guide groove 1411.

Referring again to Figures 1 and 6, in some embodiments, the stripping device 10 further includes a bracket 14 on which the laser 11 is mounted, the laser 11 being rotatable relative to the bracket 14 to adjust the direction of emission of the laser, the laser 11 being When rotating, it is movable in the thickness direction of the flexible substrate 20 with respect to the glass substrate 40.

In some embodiments, the laser 11 is also movable relative to the glass substrate 40 in a direction perpendicular to the thickness of the flexible substrate 20 while rotating.

That is, the laser 11 can be rotated, moved in the thickness direction of the flexible substrate 20, and moved in a direction perpendicular to the thickness of the flexible substrate 20 to adjust the emission direction of the laser 11. In actual use, as the flexible substrate 20 is gradually rolled up, the position of the newly exposed light absorbing layer 30 is constantly changed. At this time, the emission direction of the laser 11 can be adjusted, and the laser 11 is adjusted and needs to be irradiated. The distance of the light absorbing layer 30 is such that the intensity of the laser light irradiated onto the light absorbing layer 30 is within a suitable range, and the intensity of the laser light emitted from the laser 11 can be made constant, saving energy consumption. For example, in a thickness direction perpendicular to the flexible substrate 20, the laser 11 can be moved following the movement of the drum 12, keeping the distance between the laser 11 and the newly exposed light absorbing layer 30 constant.

Referring again to Figures 1 and 6, in some embodiments, the bracket 14 includes a laser vertical rail 143, the laser 11 is movably coupled to the laser vertical rail 143, and the laser 11 is movable over the laser vertical rail 143 to cause the laser 11 The glass substrate 40 is moved in the thickness direction of the flexible substrate 20 to change the emission direction of the laser light.

In some embodiments, the bracket 14 includes a laser cross rail 144, the laser 11 is movably coupled to the laser cross rail 144, and the laser 11 is movable over the laser cross rail 144 such that the laser 11 is perpendicular to the glass substrate 40. The direction of the thickness of the substrate 20 is moved to change the emission direction of the laser light.

Under the guidance of the laser vertical rail 143 and the laser cross rail 144, the laser 11 can be moved along the thickness direction of the flexible substrate 20 and perpendicular to the thickness direction of the flexible substrate 20, and the emission direction and light absorption of the laser 11 can be flexibly adjusted. The distance of layer 30. In the embodiment of the present invention, the laser vertical rail 143 and the laser cross rail 144 are both disposed on both sides of the laser 11 to make the laser 11 move more smoothly.

The laser vertical rail 143 and the drum vertical rail 141 may be the same rail or different rails. Similarly, the laser rail 144 and the roller rail 142 may be the same rail or different rails. In the embodiment of the present invention, the laser vertical rail 143 and the drum vertical rail 141 are the same rail, and the laser transverse rail 144 and the roller lateral rail 142 are different guide rails.

The connection and transmission mode of the laser 11 and the laser vertical rail 143, the laser 11 and the drum vertical rail 141 can adopt the above-mentioned connection and transmission mode of the drum 12 and the drum vertical rail 141, the drum 12 and the roller cross rail 142, or In other ways, adaptive changes will not be repeated here.

Referring to FIG. 9, in some embodiments, the laser 11 can also remain stationary, and the laser 11 illuminates the light absorbing layer 30 from the side of the light absorbing layer 30. As the flexible substrate 20 is gradually rolled up, the newly exposed light The distance between the absorbing layer 30 and the laser light source is increased. At this time, the intensity of the laser light emitted by the laser 11 can be adjusted to ensure that the illuminating effect of the laser light on the light absorbing layer 30 is sufficient to reduce the adhesion of the light absorbing layer 30.

Referring to FIG. 10, the present invention also discloses a peeling method for peeling off the flexible substrate 20 from the glass substrate 40. The glass substrate 40 and the flexible substrate 20 are bonded by the light absorbing layer 30, and the light absorbing layer 30 is laser-coated. The adhesion is reduced under irradiation. The stripping method includes the steps:

S1: emitting a laser light such that the laser light is irradiated from the side where the flexible substrate 20 of the glass substrate 40 is located and from the side of the light absorbing layer 30; and

S2: Rotating and moving the edge of the flexible substrate 20 to wind up the flexible substrate 20 to peel the flexible substrate 20 from the glass substrate 40.

In the peeling method of the embodiment of the present invention, the laser can irradiate the side of the light absorbing layer 30 from the side where the flexible substrate 20 of the glass substrate 40 is located, and the laser can illuminate the light absorbing layer 30 without passing through the glass substrate 40, thereby avoiding the glass. The influence of the defects of the substrate 40 on the laser light, thereby improving the yield of the flexible substrate 20.

In the description of the present specification, the description with reference to the terms "some embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the examples or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification and features of various embodiments or examples may be combined and combined without departing from the scope of the invention.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present invention, "a plurality" means at least two, for example two, three, unless specifically defined otherwise.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The scope of the invention is defined by the claims and their equivalents.

Claims

A peeling device for peeling off a glass substrate and a flexible substrate, the glass substrate and the flexible substrate being bonded by a light absorbing layer, wherein the light absorbing layer has a reduced adhesive force under irradiation of laser light, characterized in that The stripping device comprises:

a laser for emitting a laser such that the laser illuminates the light absorbing layer from a side of the glass substrate on which the flexible substrate is located and from a side of the light absorbing layer;

a roller that is engageable with an edge of the flexible substrate and that is rotated and moved to roll up the flexible substrate to peel the flexible substrate from the glass substrate.
The peeling device according to claim 1, wherein the roller is attached to the flexible substrate by means of an adhesive; or

The drum is coupled to the flexible substrate by means of adsorption.
The peeling device according to claim 1, wherein the roller is movable relative to the glass substrate in a thickness direction of the flexible substrate when rotated; and/or

The drum is movable relative to the glass substrate in a direction perpendicular to the thickness of the flexible substrate when rotated.
The peeling device according to any one of claims 1 to 3, wherein the peeling device further comprises a bracket, the bracket includes a drum vertical rail, and the drum is movably coupled to the drum vertical rail, The drum is movable on the drum vertical rail to move the drum relative to the glass substrate in the thickness direction of the flexible substrate.
The peeling device according to any one of claims 1 to 3, wherein the peeling device further comprises a bracket, the bracket includes a roller cross rail, and the drum is movably coupled to the drum cross rail, The drum is movable on the drum cross rail to move the drum relative to the glass substrate in a direction perpendicular to the thickness of the flexible substrate.
The stripping device according to any one of claims 1 to 3, wherein the stripping device further comprises a holder, the laser is mounted on the holder, and the laser is rotatable relative to the holder to adjust the laser Direction of launch,

The laser is movable relative to the glass substrate in a thickness direction of the flexible substrate when rotated; and/or

The laser is movable relative to the glass substrate in a direction perpendicular to the thickness of the flexible substrate when rotated.
The stripping device according to claim 6 wherein said holder includes a laser vertical rail, said laser being movably coupled to said laser vertical rail, said laser being movable on said laser vertical rail such that The laser moves in a thickness direction of the flexible substrate with respect to the glass substrate to change a light emitting direction of the laser.
The stripping device of claim 6 wherein said holder includes a laser cross rail, said laser being movably coupled to said laser cross rail, said laser being movable on said laser cross rail such that The laser moves in a direction perpendicular to the thickness of the flexible substrate relative to the glass substrate to change the emission direction of the laser light.
A peeling device according to any one of claims 1 to 3, wherein the peeling device further comprises a mounting platform on which the glass substrate is fixed.
The stripping device according to any one of claims 1 to 3, wherein the mounting platform is provided with a fixing groove, the glass substrate covers the fixing groove, and a negative pressure can be formed in the fixing groove, so that The glass substrate is fixed on the mounting platform under the action of a negative pressure.
A peeling method for peeling off a glass substrate and a flexible substrate, the glass substrate and the flexible substrate being bonded by a light absorbing layer, wherein the light absorbing layer has a reduced adhesive force under irradiation of laser light, characterized in that The peeling method includes:

Emulating a laser such that the laser illuminates the light absorbing layer from a side of the glass substrate on which the flexible substrate is located and from a side of the light absorbing layer; and

Rotating and moving the edge of the flexible substrate to wind up the flexible substrate to peel the flexible substrate from the glass substrate.