WO2019019060A1 - 测试元件组的定位方法和测试元件组 - Google Patents

测试元件组的定位方法和测试元件组 Download PDF

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Publication number
WO2019019060A1
WO2019019060A1 PCT/CN2017/094540 CN2017094540W WO2019019060A1 WO 2019019060 A1 WO2019019060 A1 WO 2019019060A1 CN 2017094540 W CN2017094540 W CN 2017094540W WO 2019019060 A1 WO2019019060 A1 WO 2019019060A1
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Prior art keywords
alignment mark
alignment
detected
test element
test
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Ceased
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PCT/CN2017/094540
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English (en)
French (fr)
Inventor
吕耀生
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to PCT/CN2017/094540 priority Critical patent/WO2019019060A1/zh
Priority to CN201780004636.5A priority patent/CN108513629A/zh
Publication of WO2019019060A1 publication Critical patent/WO2019019060A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Definitions

  • the invention relates to the technical field of testing of displays, and in particular to a positioning method and a test component group of a test component group.
  • the existing method for utilizing the panel typical test group to assist the effective display area of the test panel requires the user to manually hunt the line during the positioning of the target pin position, which may result in the positioning of the pin position is not accurate enough.
  • Embodiments of the present invention provide a positioning method and a test element group of a test element group.
  • test component group is configured to detect electrical characteristics of a position to be detected on a display panel, and each of the to-be-detected locations is provided with an alignment indicator, and the test component group includes The alignment identifier corresponding to the alignment identifier, the positioning method of the test component group includes:
  • the test element set includes a probe and a camera disposed on the probe, the alignment mark is located at a center of a finder frame of the camera, and the position of the test element group is adjusted Until the alignment mark is aligned with the alignment mark at the position to be detected by adjusting the position of the camera until the alignment mark is aligned with the alignment mark at the position to be detected To achieve.
  • the test component group of the embodiment of the present invention is configured to detect electrical characteristics of a position to be detected on a display panel, the to-be-detected position is provided with an alignment indicator, and the test component group includes: alignment corresponding to the alignment identifier Identification, one or more processors, memory, and one or more programs. Wherein the one or more are stored in the memory and are configured to be executed by the one or more processors, the program comprising instructions for performing the following steps:
  • the test component set further includes a probe and a camera disposed on the probe, the alignment mark is located at a center of a finder frame of the camera, and the adjusting the test component group Positioning until the alignment mark is aligned with the alignment mark at the position to be detected is by adjusting a position of the camera until the alignment mark The identification is achieved by aligning with the alignment mark at the position to be detected.
  • the display panel includes a plurality of gate lines and a plurality of data lines, and the plurality of the gate lines are disposed to intersect with the plurality of the data lines to form a plurality of pixels, where the to-be-detected position a start end of a gate line including a target pixel, the alignment mark including a gate alignment identifier corresponding to a start end of each of the gate lines;
  • the moving the test element group to the to-be-detected position is implemented by moving the test element group to a start end of a gate line of the target pixel point;
  • the display panel includes a plurality of gate lines and a plurality of data lines, and the plurality of the gate lines are disposed to intersect with the plurality of the data lines to form a plurality of pixels, where the to-be-detected position a start end of the data line including the target pixel, the alignment identifier including a source alignment identifier corresponding to a start end of each of the data lines;
  • the moving the test element group to the to-be-detected position is implemented by moving the test element group to a start end of a data line of the target pixel point;
  • the display panel includes a plurality of gate lines and a plurality of data lines, and the plurality of the gate lines are disposed to intersect with the plurality of the data lines to form a plurality of pixels, where the to-be-detected position Include a target pixel region where the target pixel is located, the alignment identifier including a drain alignment identifier corresponding to each of the target pixel regions;
  • the moving the test element group to the to-be-detected position is achieved by moving the test element group to the target pixel area;
  • the program further includes instructions for performing the following steps:
  • the program further includes instructions for performing the following steps:
  • the test element group stops at least before reaching the target pixel area. Move once.
  • the number of the intermediate pixel points is plural, and the adjacent intermediate pixel points are separated by at most 200 pixel points.
  • the program further includes instructions for performing the following steps:
  • test element group stops moving at the intermediate pixel point, and adjusts the position of the camera until the alignment mark corresponds to the intermediate pixel region where the intermediate pixel point is located Prior to the alignment, an offset between the alignment mark and the drain alignment mark is recorded.
  • the set of test elements includes a carrier and a panel placement component, the program further comprising instructions for performing the following steps:
  • the loading platform is provided with a plurality of positioning identifiers
  • the display panel is further provided with a plurality of alignment identifiers corresponding to the plurality of positioning identifiers, where the positioning of the display panel is adjusted. Aligning the display panel with the loading platform by adjusting a position of the display panel until a deviation between a plurality of the positioning identifiers and a corresponding plurality of the alignment marks is within a preset deviation range of.
  • the positioning method and the test element group of the test element group of the embodiment of the present invention improve the accuracy of the positioning of the position to be detected by aligning the alignment mark on the test element group with the alignment mark on the display panel.
  • FIG. 1 is a flow chart showing a method of positioning a test component group according to some embodiments of the present invention.
  • FIG. 2 is a block diagram of a test component set of certain embodiments of the present invention.
  • FIG. 3 is a schematic structural view of a display panel according to some embodiments of the present invention.
  • FIG. 4 is a schematic diagram of the principle of a method of locating a test element set according to some embodiments of the present invention.
  • FIG. 5 is a schematic diagram showing the principle of a positioning method of a test component group according to some embodiments of the present invention.
  • FIG. 6 is a schematic diagram showing the principle of a positioning method of a test component group according to some embodiments of the present invention.
  • FIG. 7 is a flow chart showing a method of positioning a test component group according to some embodiments of the present invention.
  • FIG. 8 is a flow chart showing a method of locating a test element group according to some embodiments of the present invention.
  • FIG. 9 is a flow chart showing a method of positioning a test component group according to some embodiments of the present invention.
  • FIG. 10 is a flow chart showing a method of positioning a test component group according to some embodiments of the present invention.
  • FIG. 11 is a block diagram of a test component set of certain embodiments of the present invention.
  • FIG. 12 is a schematic diagram of the principle of a method of locating a test element set according to some embodiments of the present invention.
  • the test component group 100 is used for detecting electrical characteristics of a position to be detected on the display panel 200 .
  • Each check position is set with a registration mark.
  • the test component set 100 includes an alignment mark corresponding to the alignment mark.
  • the positioning method of the test component group 100 includes:
  • test component group 100 of the embodiment of the present invention can be implemented by the test component group 100 of the embodiment of the present invention.
  • the test element group 100 of the embodiment of the present invention is for detecting electrical characteristics of a position to be detected on the display panel 200. Each of the locations to be detected is provided with a registration identifier, and the test component group 100 includes an alignment identifier corresponding to the alignment identifier.
  • Test component set 100 includes one or more processors 12, memory 13, and one or more programs 131. Therein, one or more programs 131 are stored in the memory 13 and are configured to be executed by one or more processors 12.
  • Program 131 includes instructions for performing the following steps:
  • the alignment mark and the alignment mark are used to calibrate the relative position between the test element group 100 and the display panel 200.
  • the alignment mark or alignment mark may be a figure, a symbol, or the like.
  • the alignment mark or the alignment mark may be a "ten" shape, a circle, a triangle, a quadrangle, a polygon, a circle symbol ( ⁇ ), or the like.
  • the probe 14 of the test component group 100 is connected to the gantry 11, and the probe 14 of the test component group 100 is moved by the gantry 11 to the position to be detected, or is driven by the gantry 11 to adjust the probe of the test component group 100. 14 location.
  • the display panel 200 includes a plurality of data lines 21 and a plurality of gate lines 22, and the plurality of data lines 21 and the plurality of gate lines 22 are disposed to intersect and form a plurality of pixel points, and the plurality of pixel points form a pixel array.
  • Each pixel includes a Thin Film Transistor (TFT), a pixel electrode 23, and a common electrode (not shown).
  • TFT Thin Film Transistor
  • the source 211 of the thin film transistor and the data line 21 are electrically connected
  • the gate 221 and the gate line 22 are electrically connected
  • the drain and the pixel electrode 23 are electrically connected.
  • the pixel voltage transmitted on the data line 21 is output to the pixel electrode 23 through the thin film transistor, and the pixel electrode 23 is combined with the common electrode to form a driving electric field for driving the deflection of the liquid crystal molecules, thereby realizing display of characteristic gray scale.
  • the measurement of the electrical characteristics of the display panel 200 is to measure whether each thin film transistor is turned on. Specifically, the source 211, the drain 231, and the gate 221 can be pinned by the probe 14, and the gate 221 is applied to the gate 221.
  • the required voltage is such that it is determined whether the source 211 and the drain 231 are turned on based on the electrical signal detected by the probe 14. It is determined that the thin film transistor is turned on when the source 211 and the drain 231 are turned on.
  • the measurement of the electrical characteristics of the display panel 200 is typically performed by randomly selecting one or several pixels for measurement.
  • the random selection refers to that the processor 12 randomly generates the coordinates of the to-be-detected position corresponding to the target pixel point, and the processor 12 controls the gantry 11 to move according to the data of the coordinates indicated by the processor 12, thereby achieving the target. Measurement of the electrical characteristics of a pixel.
  • the hardware movement of the gantry 11 still has some deviation due to the limitation of the process and the like, and thus the positioning manner of the position to be detected may have a risk of offset.
  • the existing positioning method of the position to be detected does not compensate for the offset, and thus may cause inaccurate positioning or even positioning errors.
  • the alignment mark is disposed on the test component group 100
  • the alignment mark is disposed on the display panel 200. Therefore, the movement of the test component group 100 is driven by the gantry 11 By aligning the alignment mark and the alignment mark, the displacement deviation during the movement of the test component group 100 can be calibrated, thereby accurately positioning the position to be detected where the target pixel is located, and improving the accuracy of the positioning of the test component group 100. .
  • the test component set 100 includes a probe 14 and a camera 15 disposed on the probe 14.
  • the alignment mark is located at the center of the finder frame of the camera 15.
  • Step S14 adjusts the position of the test element group 100 until the alignment mark is aligned with the alignment mark at the position to be detected by adjusting the position of the camera 15 until the alignment mark is aligned with the registration mark at the position to be detected.
  • the camera 15 is disposed on the probe 14, and the alignment mark of the test component group 100 is located at the center of the finder frame of the camera 15.
  • the framing frame of the camera 15 is mapped to the framing field of view of the actual camera 15, and the center of the framing frame is the center of the framing field of view.
  • the test component group 100 needs to determine the pin position of the probe 14 by judging whether the center of the view field and the alignment mark on the display panel 200 are aligned. Therefore, the relative position between the camera 15 and the probe 14 needs to satisfy the camera 15 .
  • the alignment of the center of the field of view with the position of the pin 14 of the probe 14 can ensure the accuracy of the positioning of the probe 14.
  • the gantry 11 drives the probe 14 to move to the position to be detected, there may be a positional offset between the alignment mark and the alignment mark.
  • the camera 15 captures an image corresponding to the current position of the probe 14, the coordinates corresponding to the position of the center of the finder frame can be calculated. Since the coordinates corresponding to the alignment mark of the position to be detected are fixed, the processor 12 determines the position to be detected.
  • the coordinate corresponding to the position of the alignment mark and the coordinate corresponding to the position of the center of the framing frame can be used to calculate the offset of the center of the finder frame of the camera 15 (the coordinate corresponding to the alignment mark of the position to be detected and the position of the center of the finder frame)
  • the coordinates are two coordinate values in the same coordinate system), and the gantry 11 is controlled to move the probe 14 according to the calculated offset to align the alignment mark and the alignment mark. In this way, the pin position of the probe 14 is accurately positioned to improve the accuracy of the electrical characteristic detection of the display panel 200.
  • the method of locating the test element set 100 of an embodiment of the present invention includes simultaneously positioning and pinning the source 211, the gate 221, and the drain 231 of the target pixel.
  • the plurality of gate lines 22 electrically connected to the plurality of gate electrodes 211 have been led to the periphery of the display panel 200 by wires; the plurality of data lines 21 electrically connected to the plurality of source electrodes 211 have been led to the display through the leads.
  • the periphery of the panel 200 is given to establish a coordinate system xy as shown in FIG. 4 and FIG. 6 , wherein the position of the black point (ie, the position of the pixel at any right angle position of the display panel) is used as the coordinate system xy.
  • the origin is such that the gate line 22 located at the outermost periphery of the display panel 200 is the x-axis, and the data line 21 located at the outermost periphery of the display panel is the y-axis.
  • the probe 14 of the pin gate 221 moves along the y axis to find the gate line 22 of the corresponding target pixel
  • the probe 14 of the pin source 211 moves along the x axis to find the source of the corresponding target pixel.
  • the pole line 21, the probe 14 of the pin drain 231 moves along the y-axis and the x-axis (time-sharing or simultaneous) to find a corresponding target pixel point.
  • the test component set 100 includes a probe 14 and a camera 15 for pinning the gate 221 of the target pixel.
  • the position to be detected includes the start end of the gate line 22 of the target pixel, and the alignment mark includes a gate pair corresponding to the start end of each gate line 22.
  • Bit identifier As shown in FIG. 4, the start end of each gate line 22 is located on the y-axis, and the gate alignment mark 222 corresponding to each gate line 22 is disposed on the y-axis.
  • Step S12 moves the test component group 100 to the position to be detected by moving the test component group 100 to the start end of the gate line 22 of the target pixel.
  • the gantry 11 drives the test component group 100, that is, the gate is driven.
  • the corresponding probe 14 and camera 15 of 221 move the distance of y0 from the origin O along the y-axis such that the coordinates of the position where the final probe 14 and the camera 15 are located are (0, y0).
  • Step S14 adjusts the position of the test component group 100 until the alignment mark is aligned with the alignment mark at the position to be detected by adjusting the position of the camera 15 until the alignment mark is aligned with the gate alignment mark 222, specifically
  • the camera 15 captures an image corresponding to the current position of the probe 14, and the processor 12 calculates coordinates (Gx, Gy) corresponding to the current position of the center of the framing frame, and the processor 12 further coordinates (Gx, Gy) and coordinates (0). , y0) calculate the gate offset of the center of the finder frame of the camera 15 and control the gantry 11 to drive the probe 14 to move according to the calculated gate offset. Align the alignment mark with the gate alignment mark 222.
  • the test component set 100 includes a probe 14 and a camera 15 for pinning the source 211 of the target pixel.
  • the position to be detected includes the start end of the data line 21 of the target pixel
  • the alignment mark includes the source alignment mark corresponding to the start end of each data line 21. 212.
  • the start end of each data line 22 is located on the x-axis
  • the source alignment mark 212 corresponding to each data line 22 is disposed on the x-axis.
  • Step S12 moving the test component group 100 to the position to be detected is implemented by moving the test component group 100 to the beginning end of the data line 21 of the target pixel.
  • the gantry 11 drives the test component group 100, that is, the source 211 is driven.
  • the corresponding probe 14 and camera 15 are moved by a distance of x0 along the x-axis such that the coordinates of the position at which the final probe 14 and the camera 15 are located are (x0, 0).
  • Step S14 adjusts the position of the test component group 100 until the alignment mark is aligned with the alignment mark at the position to be detected by adjusting the position of the camera 15 until the alignment mark is aligned with the source alignment mark 212, specifically
  • the camera 15 captures an image corresponding to the current position of the probe 14, and the processor 12 calculates coordinates (Sx, Sy) corresponding to the position of the center of the finder frame, and the processor 12 further coordinates (Sx, Sy) and coordinates (x0, 0) Calculate the source offset of the center of the finder frame of the camera 15 and control the gantry 11 to drive the probe 14 to move according to the calculated source offset to make the alignment mark and the source alignment mark 212. alignment.
  • the to-be-detected position includes a target pixel area where the target pixel is located, and for the target pixel, the pixel electrode 23 is the position of the target pixel area.
  • the drain electrode 231 and the pixel electrode 23 are electrically connected, and the alignment mark includes a drain alignment mark 232 corresponding to each target pixel dot area, and the drain alignment mark 232 is disposed on the pixel electrode 23.
  • the test element set 100 includes a probe 14 and a camera 15 for pinning a target pixel area of a target pixel point. Assume that the coordinates of the target pixel point are (x0, y0). At this time, the coordinates of the position to be detected are (x0, y0).
  • Step S12 moves the test component group 100 to the position to be detected by moving the test component group 100 to the target pixel region.
  • the gantry 11 first drives the test component group 100, that is, the probe 14 and the camera corresponding to the drain 231. 15 moves to the start end of the gate line 22 of the target pixel, that is, the position of the coordinates (0, y0), and then takes the coordinate (0, y0) as the initial position, and moves x0 along the x-axis direction to the target pixel area, that is, the coordinates ( The position of x0, y0); or the gantry 11 first drives the test element group 100 to the start end of the data line 21 of the target pixel, that is, the position of the coordinates (x0, 0), and then takes the coordinates (x0, 0) as an initial Position, move y0 in the y-axis direction to the position of the target pixel area, that is, the coordinates (x0, y0).
  • Step S14 adjusts the position of the test component group 100 until the alignment mark is aligned with the alignment mark at the position to be detected by adjusting the position of the camera 15 until the alignment mark is aligned with the drain alignment mark 232, specifically
  • the camera 15 captures an image corresponding to the current position of the probe 14, and the processor 12 calculates coordinates (Dx, Dy) corresponding to the position of the center of the finder frame, and the processor 12 further coordinates (Dx, Dy) and coordinates (x0, Y0) Calculate the amount of drain offset that the camera 15 needs to move in the center of the finder frame, and control the gantry 11 to drive the probe 14 to move according to the calculated drain offset to make the alignment mark and the drain alignment mark 232 alignment.
  • the positioning and alignment of the pin position of the probe 14 according to the offset between the alignment mark and the registration mark improves the accuracy of the positioning of the probe 14 to the position to be detected.
  • the positioning method of the test component group 100 of the embodiment of the present invention further includes:
  • S134 Recording the alignment mark and the drain alignment mark 232 after moving the test element group 100 to the target pixel area and before adjusting the position of the camera 15 until the alignment mark is aligned with the drain alignment mark 232. The offset between.
  • the program 131 further includes instructions for performing the following steps:
  • S134 Recording the alignment mark and the drain alignment mark 232 after moving the test element group 100 to the target pixel area and before adjusting the position of the camera 15 until the alignment mark is aligned with the drain alignment mark 232. The offset between.
  • the processor 12 first records the offset (x0-Dx, y0-Dy), and then controls the gantry 11 to adjust the position of the camera 15 according to the offset (x0-Dx, y0-Dy) so that the alignment mark Aligned with the drain alignment mark 232.
  • the test component group 100 generally needs to detect a large number of display panels 200 of the same batch when measuring the electrical characteristics of the display panel 200, if the electrical characteristics of the first display panel 200 are measured, the gantry 11 is recorded.
  • the offset of the probe 14 and the camera 15 during the measurement of the electrical characteristics of the subsequent plurality of display panels 200 without moving the test component set 100 to the position to be detected, and then adjusting the position of the test component set 100 until the alignment mark Aligned with the alignment mark at the position to be detected, but the offset of the record is added at the beginning of moving the test element group 100, moving to the position to be detected in one step and simultaneously satisfying the alignment mark and waiting
  • the alignment mark alignment at the detection position eliminates the action of adjusting the position of the test element group 100. In this way, the calibration process of the position to be detected when the electrical characteristics of the display panel 200 is detected can be saved, the detection time of the entire process is saved, and the efficiency of detecting the electrical characteristics of the display panel 200 is improved.
  • the positioning method of the test component group 100 of the embodiment of the present invention further includes:
  • S133 Adjust the position of the camera 15 until the alignment mark is aligned with the alignment mark corresponding to the intermediate pixel area where the intermediate pixel is located.
  • the program 131 further includes instructions for performing the following steps:
  • S133 Adjust the position of the camera 15 until the alignment mark is aligned with the alignment mark corresponding to the intermediate pixel area where the intermediate pixel is located.
  • the processor 12 can control the gantry 11 at Stopping movement at one or more intermediate pixel points between the initial position and the target pixel, and aligning the alignment mark with the drain alignment mark 232 at the intermediate pixel point, at this time, the drain alignment mark 232 sets the position of the intermediate pixel area at the intermediate pixel.
  • the initial position of the probe 14 for moving the pin drain and the gantry 11 of the camera 15 is the start end of the gate line 22 of the target pixel point, that is, the coordinates (0).
  • the processor 12 calculates the center of the framing frame.
  • the coordinate corresponding to the position (Dx', Dy') the processor 12 calculates the drain offset of the center of the finder frame of the camera 15 according to the coordinates (Dx', Dy') and the coordinates (x', y0). And controlling the gantry 11 to drive the probe 14 to move according to the calculated drain offset to align the alignment mark with the drain alignment mark 232 of the intermediate pixel.
  • the movement displacement of the test component group 100 is segmented and multiple times calibrated, which can further improve the accuracy of the position to be detected.
  • the positioning method of the test component group 100 of the embodiment of the present invention further includes:
  • test component group 100 stops moving at the intermediate pixel point, and before adjusting the position of the camera 15 until the alignment mark is aligned with the drain alignment mark 232 corresponding to the intermediate pixel region where the intermediate pixel is located, the pair is recorded. The offset between the quasi-identity and the drain alignment mark 232.
  • the program 131 further includes instructions for performing the following steps:
  • test component group 100 stops moving at the intermediate pixel point, and before adjusting the position of the camera 15 until the alignment mark is aligned with the drain alignment mark 232 corresponding to the intermediate pixel region where the intermediate pixel is located, the pair is recorded. The offset between the quasi-identity and the drain alignment mark 232.
  • the processor 12 It is necessary to record the amount of drain offset between the coordinates of the position of the center of the finder frame of the camera 15 and the coordinates of the intermediate pixel at the intermediate pixel point. In this way, when the electrical characteristics of the other display panels 200 are subsequently detected, the movement displacement of the test component group 100 can be directly compensated according to the recorded offset, thereby improving the positioning accuracy and efficiency of the position to be detected.
  • the test element group 100 stops moving at least once before reaching the target pixel area, or the target pixel point When the pixel end point of the data line 21 is separated by 200 pixels, the test element group 100 reaches the target pixel area. At least stop moving before.
  • the position of the intermediate pixel points is plural, and the adjacent intermediate pixel points are separated by at most 200 pixel points.
  • the test element group 100 moves from the initial position to the target. It is necessary to stop moving one or more times during the pixel area. When the number of pixel points between the target pixel area where the target pixel is located and the start end of the data line 21 of the target pixel point exceeds 200, the test element group 100 stops moving at least once, otherwise, the displacement of the test element group 100 is shifted. If it is too long, there may be a problem that the deviation of the displacement is too large, resulting in an error in the target pixel that is finally positioned.
  • the number of intermediate pixels is plural, and at this time, the number of pixels adjacent to each other between the two adjacent intermediate pixels can be at most 200, thus, the test component The deviation of the displacement of the group 100 movement is not too large, and the validity of the calibration and the accuracy of the positioning during the positioning process can be ensured.
  • the number of stop movements of the test component group 100 is variable.
  • the display panel 200 generally includes several thousand pixel points, and therefore, the number of stop movements of the test element group 100 can be determined according to the position of the target pixel point.
  • the position of the target pixel at the display panel 200 is a position where 1000 pixels are counted in the x-axis direction, 800 pixels are counted in the y-axis direction, and the test element group 100 for the pin drain 231 is used as the target pixel.
  • the starting end of the data line 21 of the point is the initial position, and the displacement of the test element group 100 at this time is the distance corresponding to 800 pixel points. Since the above distance is long, the target pixel area of the target pixel point is raised.
  • the distance of 50 pixels can be set to correct the alignment of the alignment mark and the drain alignment mark 232.
  • the number of pixels spaced between two adjacent intermediate pixels may be different.
  • the number of pixels spaced between two adjacent intermediate pixels may be 50, and the other two The number of pixels spaced apart between adjacent intermediate pixels may be 35 or the like.
  • the position of the target pixel at the display panel 200 is a position where 100 pixels are counted in the x-axis direction and 120 pixels are counted in the y-axis direction, and the test element group 100 for pinning the drain 231 is targeted.
  • the starting end of the data line 21 of the pixel is the initial position, and the displacement of the test element group 100 at this time is the distance corresponding to 120 pixel points. Due to the short distance, the deviation of the displacement of the test element group 100 may be small. Therefore, the test component group 100 can be directly moved to the position to be detected where the target pixel is located, thus saving a certain positioning time.
  • the method of locating the test element set 100 of an embodiment of the present invention includes positioning and pinning the source 211 of the target pixel. That is to say, when the source 211 of the target pixel is positioned, the alignment correction of the alignment mark and the alignment mark can be used to position the source 211. This positioning method is not used for the drain and gate 221.
  • the method of locating the test element set 100 of an embodiment of the present invention includes positioning and pinning the drain of the target pixel. That is to say, when positioning the drain of the target pixel, the alignment correction of the alignment mark and the alignment mark can be used to position the drain. For source 211 and gate 221, this is not used. Bit method.
  • the method of locating the test element set 100 of an embodiment of the present invention includes positioning and pinning the gate 221 of the target pixel. That is to say, when positioning the gate 221 of the target pixel, the alignment correction of the alignment mark and the alignment mark can be used to position the gate 221. This positioning method is not used for the drain 231 and the source 211.
  • the method of locating the test element set 100 of an embodiment of the present invention includes simultaneously positioning and pinning the source 211 and the drain 231 of the target pixel. That is to say, when the source 211 and the drain 231 of the target pixel are positioned, the alignment correction of the alignment mark and the alignment mark can be used to position the source 211 and the drain 231. For the gate 221, this positioning method is not used.
  • the method of locating the test element set 100 of an embodiment of the present invention includes simultaneously positioning and pinning the source 211 and the gate 221 of the target pixel. That is to say, when the source 211 and the gate 221 of the target pixel are positioned, the alignment correction of the alignment mark and the alignment mark can be used to position the source 211 and the gate 221. For the drain 231, this positioning method is not used.
  • the method of locating the test element set 100 of an embodiment of the present invention includes simultaneously positioning and pinning the drain 231 and the gate 221 of the target pixel. That is to say, when the drain 231 and the gate 221 of the target pixel are positioned, the alignment correction of the alignment mark and the alignment mark can be used to position the drain 231 and the gate 221. For the source 221, this positioning method is not used.
  • the test component set 100 further includes a loading platform 16.
  • the positioning method of the test component set 100 of the embodiment of the present invention further includes:
  • S112 Adjust the position of the display panel 200 to align the display panel 200 with the carrying platform 16.
  • test component set 100 further includes a carrier 16 and panel placement component 17, and program 131 further includes instructions for performing the following steps:
  • the control panel placement component 17 places the display panel 200 on the carrier 16;
  • the control panel placement component 17 adjusts the position of the display panel 200 to align the display panel 200 with the carrier 16.
  • the positioning platform 16 is provided with a plurality of positioning identifiers
  • the display panel 200 is further provided with a plurality of alignment identifiers corresponding to the positioning identifiers.
  • Step S112 adjusts the position of the display panel 200 to align the display panel 200 with the loading platform 16 by adjusting the position of the display panel 200 until the deviation between the plurality of positioning identifiers and the corresponding plurality of alignment marks is within a preset deviation range. Realized.
  • the display panel 200 is placed on the carrier 16 by the panel placement component 17.
  • the four corners of the carrying platform 16 shown in the figure are provided with four positioning marks, and the four corners of the display panel 200 are located.
  • the position of the display panel 200 can be adjusted until any two of the four positioning marks are aligned with the corresponding alignment marks, or the display is adjusted.
  • the position of the panel 200 is aligned until any three corresponding alignment marks of the four positioning marks are aligned, or the position of the display panel 200 is adjusted until the four positioning marks are aligned with the corresponding four corresponding alignment marks.
  • the alignment refers to the deviation between the positioning identifier and the alignment identifier within a preset deviation range, wherein the preset deviation range may have a value of 0, and the positioning identifier is completely aligned with the alignment identifier.
  • the deviation between the positioning mark and the alignment mark can be acquired by the camera 15 for the pin source 211 and the camera 15 for the pin gate 221 .
  • the two positioning marks are aligned with the corresponding alignment marks.
  • the camera 15 for the pin source 211 and the camera 15 for the pin gate 221 respectively select a positioning mark on the display panel 200 for shooting.
  • the processor 12 calculates a deviation between the positioning mark and the alignment mark based on the captured image, and controls the panel placement component 17 to adjust the position of the display panel 200 according to the calculated deviation to align the positioning mark with the alignment mark.
  • the positioning identifier or the alignment identifier may be a graphic, a symbol, or the like.
  • the positioning identifier or the alignment identifier may be a "ten" shape, a circle, a triangle, a quadrangle, a polygon, a circle symbol ( ⁇ ), or the like.
  • a "computer-readable medium” can be any device that can contain, store, communicate, propagate, or transport the program for use in an instruction execution system, apparatus, or device, or in conjunction with the instruction execution system, apparatus, or device.
  • computer readable media include the following: electrical connections (electronic devices) having one or more wires, portable computer disk cartridges (magnetic devices), random access memory (RAM), Read only memory (ROM), erasable editable read only memory (EPROM or flash memory), fiber optic devices, and portable compact disk read only memory (CDROM).
  • the computer readable medium may even be a paper or other suitable medium on which the program can be printed, as it may be optically scanned, for example by paper or other medium, followed by editing, interpretation or, if appropriate, other suitable The method is processed to obtain the program electronically and then stored in computer memory.
  • portions of the invention may be implemented in hardware, software, firmware or a combination thereof.
  • multiple steps or methods may be performed by software or firmware stored in a memory and executed by a suitable instruction execution system.
  • a suitable instruction execution system For example, if executed in hardware, as in another embodiment, it can be performed by any one of the following techniques or combinations thereof known in the art: having logic gates for performing logic functions on data signals Discrete logic circuits, application specific integrated circuits with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.
  • each functional unit in each embodiment of the present invention may be integrated into one processing module, or each unit may exist physically separately, or two or more units may be integrated into one module.
  • the above integrated modules can be executed in the form of hardware or in the form of software functional modules.
  • the integrated modules, if executed in the form of software functional modules and sold or used as separate products, may also be stored in a computer readable storage medium.
  • the above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like.

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Abstract

一种测试元件组(100)的定位方法。测试元件组(100)用于检测显示面板(200)上待检测位置的电气特性。每个待检测位置设置有一个对位标识，测试元件组(100)包括与对位标识对应的对准标识。测试元件组(100)的定位方法包括：移动测试元件组(100)至待检测位置（S12）；调整测试元件组(100)的位置直至对准标识与待检测位置处的对位标识对准（S14）。还公开了一种测试元件组(100)。

Description

测试元件组的定位方法和测试元件组 技术领域
本发明涉及显示器的测试技术领域，特别涉及一种测试元件组的定位方法和测试元件组。
背景技术
现有的利用面板典型测试群组辅助测试面板的有效显示区域的方法，在定位目标扎针位置过程中需要用户手动寻线，会导致扎针位置定位不够精准。
发明内容
本发明的实施例提供一种测试元件组的定位方法和测试元件组。
本发明实施方式的测试元件组的定位方法，测试元件组用于检测显示面板上待检测位置的电气特性，每个所述待检测位置设置有一个对位标识，所述测试元件组包括与所述对位标识对应的对准标识，所述测试元件组的定位方法包括：
移动所述测试元件组至所述待检测位置；和
调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准。
在某些实施方式中，所述测试元件组包括探针及设置在所述探针上的摄像头，所述对准标识位于所述摄像头的取景框中心，所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述待检测位置处的所述对位标识对准来实现的。
本发明实施方式的测试元件组用于检测显示面板上待检测位置的电气特性，所述待检测位置设置有一个对位标识，所述测试元件组包括：与所述对位标识对应的对准标识、一个或多个处理器、存储器和一个或多个程序。其中所述一个或多个被存储在所述存储器中，并且被配置成由所述一个或多个处理器执行，所述程序包括用于执行以下步骤的指令：
控制所述测试元件组移动至所述待检测位置；和
调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准。
在某些实施方式中，所述测试元件组还包括探针及设置在所述探针上的摄像头，所述对准标识位于所述摄像头的取景框中心，所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标 识与所述待检测位置处的所述对位标识对准来实现的。
在某些实施方式中，所述显示面板包括多条栅极线及多条数据线，多条所述栅极线与多条所述数据线交叉设置并构成多个像素，所述待检测位置包括目标像素点的栅极线的起始端，所述对位标识包括与每条所述栅极线的起始端对应的栅极对位标识；
所述移动所述测试元件组至所述待检测位置是通过移动所述测试元件组至所述目标像素点的栅极线的起始端来实现的；
所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述栅极对位标识对准来实现的。
在某些实施方式中，所述显示面板包括多条栅极线及多条数据线，多条所述栅极线与多条所述数据线交叉设置并构成多个像素，所述待检测位置包括目标像素点的数据线的起始端，所述对位标识包括与每条所述数据线的起始端对应的源极对位标识；
所述移动所述测试元件组至所述待检测位置是通过移动所述测试元件组至所述目标像素点的数据线的起始端来实现的；
所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述源极对位标识对准来实现的。
在某些实施方式中，所述显示面板包括多条栅极线及多条数据线，多条所述栅极线与多条所述数据线交叉设置并构成多个像素，所述待检测位置包括目标像素点所在的目标像素区域，所述对位标识包括与每个所述目标像素区域对应的漏极对位标识；
所述移动所述测试元件组至所述待检测位置是通过移动所述测试元件组至所述目标像素区域来实现的；
所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述漏极对位标识对准来实现的。
在某些实施方式中，所述程序还包括用于执行以下步骤的指令：
在移动所述测试元件组至所述目标像素区域之后，且在通过调整所述摄像头的位置直至所述对准标识与所述漏极对位标识对准之前，记录所述对准标识与所述漏极对位标识之间的偏移量。
在某些实施方式中，所述移动所述测试元件组直至所述目标像素区域是以所述目标像素点的栅极线的起始端开始执行的；或
所述移动所述测试元件组直至所述目标像素区域是以所述目标像素点的数据线的起始 端开始执行的。
在某些实施方式中，所述程序还包括用于执行以下步骤的指令：
控制所述测试元件组停止移动在所述中间像素点处；和
调整所述摄像头的位置直至所述对准标识与所述中间像素点所在的中间像素区域对应的所述对位标识对准。
在某些实施方式中，所述目标像素点与栅极线的起始端或所述数据线的起始端之间相隔达到200像素点时，所述测试元件组到达所述目标像素区域之前至少停止移动一次。
在某些实施方式中，所述停止移动的次数为多次时，所述中间像素点的个数为多个，相邻所述中间像素点之间至多相隔200个像素点。
在某些实施方式中，所述程序还包括用于执行以下步骤的指令：
在所述测试元件组停止移动在所述中间像素点处之后，且在调整所述摄像头的位置直至所述对准标识与所述中间像素点所在的中间像素区域对应的所述漏极对位标识对准之前，记录所述对准标识与所述漏极对位标识之间的偏移量。
在某些实施方式中，所述测试元件组包括承载台和面板放置元件，所述程序还包括用于执行以下步骤的指令：
控制所述面板放置元件放置所述显示面板在所述承载台上；和
控制所述面板放置元件调整所述显示面板的位置以使所述显示面板与所述承载台对准。
在某些实施方式中，所述承载台上设置有多个定位标识，所述显示面板上还设置有与多个所述定位标识对应的多个对齐标识，所述调整所述显示面板的位置以使所述显示面板与所述承载台对准是通过调整所述显示面板的位置直至多个所述定位标识与对应的多个所述对齐标识之间的偏差在预设偏差范围内来实现的。
本发明实施方式的测试元件组的定位方法和测试元件组通过将测试元件组上的对准标识与显示面板上的对位标识进行对准来提升待检测位置的定位的准确性。
本发明的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实施方式的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明某些实施方式的测试元件组的定位方法的流程示意图。
图2是本发明某些实施方式的测试元件组的模块示意图。
图3是本发明某些实施方式的显示面板的结构示意图。
图4是本发明某些实施方式的测试元件组的定位方法的原理示意图。
图5是本发明某些实施方式的测试元件组的定位方法的原理示意图。
图6是本发明某些实施方式的测试元件组的定位方法的原理示意图。
图7是本发明某些实施方式的测试元件组的定位方法的流程示意图。
图8是本发明某些实施方式的测试元件组的定位方法的流程示意图。
图9是本发明某些实施方式的测试元件组的定位方法的流程示意图。
图10是本发明某些实施方式的测试元件组的定位方法的流程示意图。
图11是本发明某些实施方式的测试元件组的模块示意图。
图12是本发明某些实施方式的测试元件组的定位方法的原理示意图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
请一并参阅图1、图2和图4，本发明实施方式的测试元件组100的定位方法，测试元件组100用于检测显示面板200上待检测位置的电气特性。每个待检测位置设置有一个对位标识。测试元件组100包括与对位标识对应的对准标识。测试元件组100的定位方法包括：
S12：移动测试元件组100至待检测位置；和
S14：调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准。
请再参阅图2，本发明实施方式的测试元件组100的定位方法可以由本发明实施方式的测试元件组100实现。本发明实施方式的测试元件组100用于检测显示面板200上待检测位置的电气特性。每个待检测位置设置有一个对位标识，测试元件组100包括与对位标识对应的对准标识。测试元件组100包括一个或多个处理器12、存储器13和一个或多个程序131。其中，一个或多个程序131被存储在存储器13中，并且被配置成由一个或多个处理器12执行。程序131包括用于执行以下步骤的指令：
S12：控制测试元件组100移动至待检测位置；和
S14：调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准。
其中，对位标识和对准标识用于校准测试元件组100与显示面板200的之间的相对位置。对位标识或对准标识可以是图形、符号等，例如，对位标识或对准标识可以是“十”字形、圆形、三角形、四边形、多边形、圆符号(⊙)等。
此外，测试元件组100的探针14与龙门架11连接，测试元件组100的探针14由龙门架11带动移动至待检测位置，或由龙门架11带动以调整测试元件组100的探针14的位置。
请参阅图3，显示面板200包括多条数据线21及多条栅极线22，多条数据线21和多条栅极线22交叉设置并构成多个像素点，多个像素点形成像素阵列。每个像素点包括薄膜晶体管(Thin Film Transistor，简称TFT)、像素电极23和公共电极(图未示)。薄膜晶体管的源极211和数据线21电性连接，栅极221和栅极线22电性连接，漏极和像素电极23电性连接。数据线21上传输的像素电压通过薄膜晶体管输出至像素电极23，像素电极23与公共电极配合，形成驱动液晶分子偏转的驱动电场，实现特性灰阶的显示。显示面板200的电气特性的测量即是测量各个薄膜晶体管是否导通，具体地，可利用探针14对源极211、漏极231和栅极221进行扎针，并对栅极221施加栅极221所需电压，从而根据探针14探测到的电信号来确定源极211和漏极231是否导通。在源极211和漏极231导通时确定薄膜晶体管导通。
显示面板200的电气特性的测量通常是随机选取一个或几个像素点进行测量。其中，随机选取指的是由处理器12随机生成与目标像素点对应的待检测位置的坐标，并由处理器12控制龙门架11根据处理器12指示的坐标的数据进行移动，从而实现对目标像素点的电气特性的测量。但龙门架11的硬体移动由于工艺等因素的限制仍旧存在些许偏差，因此这种待检测位置的定位方式可能有偏移的风险。而现有的待检测位置的定位方法并没有进行偏移量的补偿，因此，可能导致定位不精确甚至定位出错的问题。
本发明实施方式的测试元件组100的定位方法，由于在测试元件组100上设置有对准标识，在显示面板200上设置有对位标识，因此，在龙门架11带动测试元件组100移动过程中，通过将对准标识和对位标识进行对齐校准，即可校测试元件组100移动过程中的位移偏差，从而精确定位目标像素点所在的待检测位置，提升测试元件组100定位的准确性。
请再参阅图4，在某些实施方式中，测试元件组100包括探针14及设置在探针14上的摄像头15。对准标识位于摄像头15的取景框中心。步骤S14调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准是通过调整摄像头15的位置直至对准标识与待检测位置处的对位标识对准来实现的。
其中，摄像头15设置在探针14上，测试元件组100的对准标识位于摄像头15的取景框中心的位置。将摄像头15的取景框映射到实际摄像头15的取景视场中，取景框中心即为取景视场的中心。测试元件组100需要通过判断取景视场的中心与显示面板200上的对位标识是否对准来判断探针14的扎针位置，因此，摄像头15与探针14之间的相对位置需要满足摄像头15的取景视场的中心与探针14的扎针位置对准重合的条件，才能保证探针14定位的准确性。
请结合图5，在龙门架11带动探针14移动到待检测位置时，此时对位标识与对准标识可能存在位置偏移。摄像头15拍摄探针14当前所在位置对应的图像时，可计算出取景框中心所在位置对应的坐标，由于待检测位置的对位标识对应的坐标是固定的，因此，处理器12根据待检测位置的对位标识对应的坐标和取景框中心所在位置对应的坐标即可计算出摄像头15取景框中心需要移动的偏移量(待检测位置的对位标识对应的坐标和取景框中心所在位置对应的坐标是在同一坐标系下的两个坐标值)，并控制龙门架11带动探针14根据计算出的偏移量进行移动以使对准标识和对位标识对准。如此，对探针14的扎针位置进行精确定位，改善显示面板200电气特性检测的准确性。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的源极211、栅极221和漏极231同时进行定位和扎针。
其中，与多个栅极211电性连接的多条栅极线22已通过引线引至显示面板200的外围；与多个源极211电性连接的多条数据线21已通过引线引至显示面板200的外围。此处以建立一个如图4及图6所示的坐标系x-y为例进行说明：其中，以黑点所在位置(即位于显示面板任意一个直角位置处的像素点所在的位置)为坐标系x-y的原点，以位于显示面板200最外围的栅极线22为x轴，以位于显示面板最外围的数据线21为y轴。如此，扎针栅极221的探针14沿y轴进行移动以寻找对应的目标像素点的栅极线22，扎针源极211的探针14沿x轴进行移动以寻找对应的目标像素点的源极线21，扎针漏极231的探针14沿y轴及x轴(分时或同时)进行移动以寻找对应的目标像素点。
请结合图3、图4和图6，测试元件组100包括用于扎针目标像素点的栅极221的探针14和摄像头15。在对目标像素点的栅极221进行定位和扎针时，待检测位置包括目标像素点的栅极线22的起始端，对位标识包括与每条栅极线22的起始端对应的栅极对位标识。如图4所示，每条栅极线22的起始端位于y轴上，y轴上设置有与每条栅极线22一一对应的栅极对位标识222。假设目标像素点的坐标为(x0,y0)，则目标像素点的栅极线22的起始端位于上述的y轴上，此时，待检测位置的坐标为(0,y0)。步骤S12移动测试元件组100至待检测位置是通过移动测试元件组100至目标像素点的栅极线22的起始端来实现的，具体地，龙门架11带动测试元件组100，即带动栅极221对应的探针14和摄像头15，沿y轴自原点O移动y0的距离，使得最终探针14和摄像头15所处的位置的坐标为(0,y0)。步骤S14调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准是通过调整摄像头15的位置直至对准标识与栅极对位标识222对准来实现的，具体地，由摄像头15拍摄探针14当前所在位置对应的图像，处理器12计算出取景框中心当前所在位置对应的坐标(Gx,Gy)，处理器12再根据坐标(Gx,Gy)与坐标(0,y0)计算出摄像头15取景框中心需要移动的栅极偏移量，并控制龙门架11带动探针14根据计算出的栅极偏移量进行移动以 使对准标识和栅极对位标识222对准。
请结合图3、图4和图6，测试元件组100包括用于扎针目标像素点的源极211的探针14和摄像头15。在对目标像素点的源极211进行定位和扎针时，待检测位置包括目标像素点的数据线21的起始端，对位标识包括与每条数据线21的起始端对应的源极对位标识212。如图4所示，每条数据线22的起始端位于x轴上，x轴上设置有与每条数据线22一一对应的源极对位标识212。假设目标像素点的坐标为(x0,y0)，则目标像素点的数据线21的起始端位于上述的x轴上，此时，待检测位置的坐标为(x0,0)。步骤S12移动测试元件组100至待检测位置是通过移动测试元件组100至目标像素点的数据线21的起始端来实现的，具体地，龙门架11带动测试元件组100，即带动源极211对应的探针14和摄像头15，沿x轴移动x0的距离，使得最终探针14和摄像头15所处的位置的坐标为(x0,0)。步骤S14调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准是通过调整摄像头15的位置直至对准标识与源极对位标识212对准来实现的，具体地，由摄像头15拍摄探针14当前所在位置对应的图像，处理器12计算出取景框中心所在位置对应的坐标(Sx,Sy)，处理器12再根据坐标(Sx,Sy)与坐标(x0,0)计算出摄像头15取景框中心需要移动的源极偏移量，并控制龙门架11带动探针14根据计算出的源极偏移量进行移动以使对准标识和源极对位标识212对准。
请结合图3、图4和图6，待检测位置包括目标像素点所在的目标像素区域，对于目标像素点，像素电极23即为目标像素区域所在位置。漏极231和像素电极23电性连接，对位标识包括与每个目标像素点区域对应的漏极对位标识232，漏极对位标识232设置在像素电极23上。测试元件组100包括用于扎针目标像素点的目标像素区域的探针14和摄像头15。假设目标像素点的坐标为(x0,y0)。此时，待检测位置的坐标为(x0,y0)。步骤S12移动测试元件组100至待检测位置是通过移动测试元件组100至目标像素区域来实现的，具体地，龙门架11首先带动测试元件组100，即漏极231对应的探针14和摄像头15移动至目标像素点的栅极线22的起始端，即坐标(0,y0)的位置，再以坐标(0,y0)为初始位置，沿x轴方向移动x0至目标像素区域即坐标(x0,y0)的位置；或者龙门架11首先带动测试元件组100移动至目标像素点的数据线21的起始端，即坐标(x0,0)的位置，再以坐标(x0,0)为初始位置，沿y轴方向移动y0至目标像素区域即坐标(x0,y0)的位置。步骤S14调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准是通过调整摄像头15的位置直至对准标识与漏极对位标识232对准来实现的，具体地，由摄像头15拍摄探针14当前所在位置对应的图像，处理器12计算出取景框中心所在位置对应的坐标(Dx,Dy)，处理器12再根据坐标(Dx,Dy)与坐标(x0,y0)计算出摄像头15取景框中心需要移动的漏极偏移量，并控制龙门架11带动探针14根据计算出的漏极偏移量进行移动以使对准标识和漏极对位标识 232对准。
如此，根据对准标识与对位标识之间的偏移量对探针14的扎针位置进行定位校准，改善了探针14定位到待检测位置的准确性。
请参阅图7，在某些实施方式中，本发明实施方式的测试元件组100的定位方法还包括：
S134：在移动测试元件组100至目标像素区域之后，且在通过调整摄像头15的位置直至对准标识与所述漏极对位标识232对准之前，记录对准标识与漏极对位标识232之间的偏移量。
请再参阅图2，在某些实施方式中，程序131还包括用于执行以下步骤的指令：
S134：在移动测试元件组100至目标像素区域之后，且在通过调整摄像头15的位置直至对准标识与所述漏极对位标识232对准之前，记录对准标识与漏极对位标识232之间的偏移量。
具体地，请结合图6，假设目标像素点的坐标为(x0,y0)，若用于扎针漏极231的探针14和摄像头15移动至目标像素区域之后取景框中心的坐标为(Dx,Dy)，则此时坐标(x0,y0)与坐标为(Dx,Dy)之间的偏移量为(x0-Dx,y0-Dy)。此时，处理器12首先记录下偏移量(x0-Dx,y0-Dy)，再控制龙门架11根据偏移量(x0-Dx,y0-Dy)调整摄像头15的位置以使得对准标识与所述漏极对位标识232对准。由于测试元件组100在测量显示面板200的电气特性时，通常需要检测同一批次的大量的显示面板200，因此，若在测量第一块显示面板200的电气特性时即记录下龙门架11移动探针14和摄像头15过程中的偏移量，则在测量后续多块显示面板200的电气特性时，无需移动测试元件组100至待检测位置后再调整测试元件组100的位置直至对准标识与待检测位置处的对位标识对准，而是在移动测试元件组100之初就加上了记录的偏移量，一步到位地移动到待检测位置处并同时满足了对准标识与待检测位置处的对位标识对准，省去了调整测试元件组100的位置的动作。如此，可以节省后续显示面板200电气特性检测时待检测位置定位的校准过程，节约整个过程的检测时间，提升显示面板200电气特性检测的效率。
进一步地，请参阅图8，在某些实施方式中，本发明实施方式的测试元件组100的定位方法还包括：
S131：停止移动在中间像素点处；和
S133：调整摄像头15的位置直至对准标识与中间像素点所在的中间像素区域对应的对位标识对准。
请再参阅图2，在某些实施方式中，程序131还包括用于执行以下步骤的指令：
S131：控制测试元件组100停止移动在中间像素点处；和
S133：调整摄像头15的位置直至对准标识与中间像素点所在的中间像素区域对应的对位标识对准。
具体地，请再结合图6，在龙门架11带动测试元件组100，即用于扎针漏极231的探针14和摄像头15至待检测位置的过程中，处理器12可以控制龙门架11在初始位置与目标像素点之间的一个或多个中间像素点处停止移动，并在该中间像素点处进行对准标识与漏极对位标识232的对准，此时，漏极对位标识232设置在中间像素点的中间像素区域的位置。假设目标像素点的坐标为(x0,y0)，用于移动扎针漏极的探针14和摄像头15的龙门架11的初始位置为目标像素点的栅极线22的起始端，即坐标(0,y0)的位置。若中间像素点的坐标为(x’,y0)，则在龙门架11沿x轴方向移动x’距离时，摄像头15拍摄探针14当前所在位置对应的图像，处理器12计算出取景框中心所在位置对应的坐标(Dx’,Dy’)，处理器12再根据坐标(Dx’,Dy’)与坐标(x’,y0)计算出摄像头15的取景框中心需要移动的漏极偏移量，并控制龙门架11带动探针14根据计算出的漏极偏移量进行移动以使对准标识和中间像素点的漏极对位标识232对准。
如此，在龙门架11带动测试元件组100移动至待检测位置的过程中，对测试元件组100的移动位移进行分段多次校准，可以进一步提升待检测位置定位的准确性。
进一步地，请参阅图9，在某些实施方式中，本发明实施方式的测试元件组100的定位方法还包括：
S132：在测试元件组100停止移动在中间像素点处之后，且在调整摄像头15的位置直至对准标识与中间像素点所在的中间像素区域对应的漏极对位标识232对准之前，记录对准标识与漏极对位标识232之间的偏移量。
请再参阅图2，在某些实施方式中，程序131还包括用于执行以下步骤的指令：
S132：在测试元件组100停止移动在中间像素点处之后，且在调整摄像头15的位置直至对准标识与中间像素点所在的中间像素区域对应的漏极对位标识232对准之前，记录对准标识与漏极对位标识232之间的偏移量。
也即是说，在测试元件组100移动至待检测位置的过程中，每一次测试元件组100在中间像素点位置停止移动并进行对准标识和漏极对位标识232对准时，处理器12均需要记录在该中间像素点处摄像头15取景框中心所在位置对应坐标与中间像素点的坐标之间的漏极偏移量。如此，在后续检测其他显示面板200的电气特性时，可以直接根据记录的偏移量直接对测试元件组100的移动位移进行补偿，提升待检测位置的定位精度和效率。
进一步地，在某些实施方式中，目标像素点与栅极线22的起始端之间相隔达到200个像素点时，测试元件组100到达目标像素区域之前至少要停止移动一次，或者目标像素点与数据线21的起始端之间相隔达到200个像素点时，测试元件组100到达目标像素区域之 前至少要停止移动一次。
此外，在某些实施方式中，停止移动的次数为多次时，中间像素点的位置为多个，相邻中间像素点之间至多相隔200个像素点。
以目标像素点的数据线21的起始端作为用于扎针漏极231的测试元件组100的初始位置为例，在确定目标像素点的目标像素区域后，测试元件组100从初始位置移动至目标像素区域的过程中需要停止移动一次或多次。在目标像素点所在的目标像素区域与目标像素点的数据线21的起始端之间相隔的像素点超过200个时，测试元件组100至少要停止移动一次，否则，测试元件组100移动的位移过长，可能出现位移的偏差过大导致最终定位到的目标像素点出错的问题。在停止移动的次数为多次时，中间像素点的个数为多个，此时相邻的两个中间像素点之间相隔的像素点的个数至多只能为200个，如此，测试元件组100移动的位移的偏差不会过大，可保证定位过程中校准的有效性和定位的准确性。
请再结合图6，测试元件组100的停止移动次数是可变的。显示面板200通常包括几千个像素点，因此，测试元件组100的停止移动次数可根据目标像素点所在位置进行确定。例如，目标像素点在显示面板200处的位置为沿x轴方向计数1000个像素点、沿y轴方向计数800个像素点所在的位置，用于扎针漏极231的测试元件组100以目标像素点的数据线21的起始端为初始位置，则此时测试元件组100移动的位移为800个像素点对应的距离，由于上述距离较长，因此，为提升目标像素点的目标像素区域定位的准确性，则可设置移动50个像素点的距离即进行对准标识和漏极对位标识232的对准的校正。此外，相邻两个中间像素点之间间隔的像素点的个数也可不同，比如，某两个相邻中间像素点之间间隔的像素点的个数可以为50个，另外某两个相邻中间像素点之间相隔的像素点的个数可以为35个等。再例如，目标像素点在显示面板200处的位置为沿x轴方向计数100个像素点、沿y轴方向计数120个像素点所在的位置，用于扎针漏极231的测试元件组100以目标像素点的数据线21的起始端为初始位置，则此时测试元件组100移动的位移为120个像素点对应的距离，由于上述距离较短，测试元件组100移动的位移的偏差可能较小，因此可将测试元件组100直接移动至目标像素点所在的待检测位置，如此，可节省一定的定位时间。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的源极211进行定位和扎针。也即是说，在对目标像素点的源极211进行定位时，可采用对对准标识和对位标识的对准校正来对源极211进行定位。而对于漏极和栅极221则不采用此种定位方法。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的漏极进行定位和扎针。也即是说，在对目标像素点的漏极进行定位时，可采用对对准标识和对位标识的对准校正来对漏极进行定位。而对于源极211和栅极221则不采用此种定 位方法。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的栅极221进行定位和扎针。也即是说，在对目标像素点的栅极221进行定位时，可采用对对准标识和对位标识的对准校正来对栅极221进行定位。而对于漏极231和源极211则不采用此种定位方法。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的源极211和漏极231同时进行定位和扎针。也即是说，在对目标像素点的源极211和漏极231进行定位时，可采用对对准标识和对位标识的对准校正来对源极211和漏极231进行定位。而对于栅极221则不采用此种定位方法。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的源极211和栅极221同时进行定位和扎针。也即是说，在对目标像素点的源极211和栅极221进行定位时，可采用对对准标识和对位标识的对准校正来对源极211和栅极221进行定位。而对于漏极231则不采用此种定位方法。
在某些实施方式中，本发明实施方式的测试元件组100的定位方法包括对目标像素点的漏极231和栅极221同时进行定位和扎针。也即是说，在对目标像素点的漏极231和栅极221进行定位时，可采用对对准标识和对位标识的对准校正来对漏极231和栅极221进行定位。而对于源极221则不采用此种定位方法。
请参阅图10，在某些实施方式中，测试元件组100还包括承载台16，本发明实施方式的测试元件组100的定位方法还包括：
S111：放置显示面板200在承载台16上；和
S112：调整显示面板200的位置以使显示面板200与承载台16对准。
请参阅图11，在某些实施方式中，测试元件组100还包括承载台16和面板放置元件17，程序131还包括用于执行以下步骤的指令：
S111：控制面板放置元件17放置显示面板200在承载台16上；和
S112：控制面板放置元件17调整显示面板200的位置以使显示面板200与承载台16对准。
在某些实施方式中，承载台16上设置有多个定位标识，显示面板200上还设置有多个与定位标识对应的多个对齐标识。步骤S112调整显示面板200的位置以使显示面板200与承载台16对准是通过调整显示面板200的位置直至多个定位标识与对应的多个对齐标识之间的偏差在预设偏差范围内来实现的。
具体地，请参阅图12，显示面板200由面板放置元件17放置在承载台16上。图中所示的承载台16的四个角所在位置设置有四个定位标识，显示面板200的四个角所在位置设 置有四个对齐标识。在调整显示面板200的位置使显示面板200与承载台16对准的过程中，可以调整显示面板200的位置直至四个定位标识中的任意两个与对应的对齐标识均对准，或者调整显示面板200的位置直至四个定位标识中的任意三个对应的对齐标识均对准，或者调整显示面板200的位置直至四个定位标识与对应的四个对应的对齐标识均对准。也即是说，在调整显示面板200的位置直至定位标识与对齐标识对准过程中，要确保至少有两个定位标识与对应的对齐标识是对准的。另外，此处的对准指的是定位标识与对齐标识之间的偏差在预设偏差范围内，其中，预设偏差范围的取值可以为0，此时定位标识与对齐标识完全对准。
定位标识与对齐标识之间的偏差可以由用于扎针源极211的摄像头15及用于扎针栅极221摄像头15进行获取。以将两个定位标识与对应的对齐标识进行对准为例，用于扎针源极211的摄像头15和用于扎针栅极221的摄像头15分别选取一个显示面板200上的定位标识进行拍摄，由处理器12根据拍摄的图像计算出定位标识与对齐标识之间的偏差，并控制面板放置元件17根据计算得到的偏差调整显示面板200的位置以使定位标识与对齐标识对准。
定位标识或对齐标识可以是图形、符号等，例如，定位标识或对齐标识可以是“十”字形、圆形、三角形、四边形、多边形、圆符号(⊙)等。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于执行特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本发明的优选实施方式的范围包括另外的执行，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本发明的实施例所属技术领域的技术人员所理解。
在流程图中表示或在此以其他方式描述的逻辑和/或步骤，例如，可以被认为是用于执行逻辑功能的可执行指令的定序列表，可以具体执行在任何计算机可读介质中，以供指令执行系统、装置或设备(如基于计算机的系统、包括处理器的系统或其他可以从指令执行系统、装置或设备取指令并执行指令的系统)使用，或结合这些指令执行系统、装置或设备而使用。就本说明书而言，"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行系统、装置或设备或结合这些指令执行系统、装置或设备而使用的装 置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下：具有一个或多个布线的电连接部(电子装置)，便携式计算机盘盒(磁装置)，随机存取存储器(RAM)，只读存储器(ROM)，可擦除可编辑只读存储器(EPROM或闪速存储器)，光纤装置，以及便携式光盘只读存储器(CDROM)。另外，计算机可读介质甚至可以是可在其上打印所述程序的纸或其他合适的介质，因为可以例如通过对纸或其他介质进行光学扫描，接着进行编辑、解译或必要时以其他合适方式进行处理来以电子方式获得所述程序，然后将其存储在计算机存储器中。
应当理解，本发明的各部分可以用硬件、软件、固件或它们的组合来执行。在上述实施方式中，多个步骤或方法可以用存储在存储器中且由合适的指令执行系统执行的软件或固件来执行。例如，如果用硬件来执行，和在另一实施方式中一样，可用本领域公知的下列技术中的任一项或他们的组合来执行：具有用于对数据信号执行逻辑功能的逻辑门电路的离散逻辑电路，具有合适的组合逻辑门电路的专用集成电路，可编程门阵列(PGA)，现场可编程门阵列(FPGA)等。
本技术领域的普通技术人员可以理解执行上述实施方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。
此外，在本发明各个实施例中的各功能单元可以集成在一个处理模块中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个模块中。上述集成的模块既可以采用硬件的形式执行，也可以采用软件功能模块的形式执行。所述集成的模块如果以软件功能模块的形式执行并作为独立的产品销售或使用时，也可以存储在一个计算机可读取存储介质中。
上述提到的存储介质可以是只读存储器，磁盘或光盘等。尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (15)

  1. 一种测试元件组的定位方法，所述测试元件组用于检测显示面板上待检测位置的电气特性，其特征在于，每个所述待检测位置设置有一个对位标识，所述测试元件组包括与所述对位标识对应的对准标识，所述测试元件组的定位方法包括：
    移动所述测试元件组至所述待检测位置；和
    调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准。
  2. 根据权利要求1所述的测试元件组的定位方法，其特征在于，所述测试元件组包括探针及设置在所述探针上的摄像头，所述对准标识位于所述摄像头的取景框中心，所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述待检测位置处的所述对位标识对准来实现的。
  3. 一种测试元件组，所述测试元件组用于检测显示面板上待检测位置的电气特性，其特征在于，所述待检测位置设置有一个对位标识，所述测试元件组包括：
    与所述对位标识对应的对准标识；
    一个或多个处理器；
    存储器；和
    一个或多个程序，其中所述一个或多个被存储在所述存储器中，并且被配置成由所述一个或多个处理器执行，所述程序包括用于执行以下步骤的指令：
    控制所述测试元件组移动至所述待检测位置；和
    调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准。
  4. 根据权利要求3所述的测试元件组，其特征在于，所述测试元件组还包括探针及设置在所述探针上的摄像头，所述对准标识位于所述摄像头的取景框中心，所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述待检测位置处的所述对位标识对准来实现的。
  5. 根据权利要求4所述的测试元件组，其特征在于，所述显示面板包括多条栅极线及多条数据线，多条所述栅极线与多条所述数据线交叉设置并构成多个像素，所述待检测位置包括目标像素点的栅极线的起始端，所述对位标识包括与每条所述栅极线的起始端对应的栅极对位标识；
    所述移动所述测试元件组至所述待检测位置是通过移动所述测试元件组至所述目标像素点的栅极线的起始端来实现的；
    所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述栅极对位标识对准来实现的。
  6. 根据权利要求4所述的测试元件组，其特征在于，所述显示面板包括多条栅极线及多条数据线，多条所述栅极线与多条所述数据线交叉设置并构成多个像素，所述待检测位置包括目标像素点的数据线的起始端，所述对位标识包括与每条所述数据线的起始端对应的源极对位标识；
    所述移动所述测试元件组至所述待检测位置是通过移动所述测试元件组至所述目标像素点的数据线的起始端来实现的；
    所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述源极对位标识对准来实现的。
  7. 根据权利要求4所述的测试元件组，其特征在于，所述显示面板包括多条栅极线及多条数据线，多条所述栅极线与多条所述数据线交叉设置并构成多个像素，所述待检测位置包括目标像素点所在的目标像素区域，所述对位标识包括与每个所述目标像素区域对应的漏极对位标识；
    所述移动所述测试元件组至所述待检测位置是通过移动所述测试元件组至所述目标像素区域来实现的；
    所述调整所述测试元件组的位置直至所述对准标识与所述待检测位置处的所述对位标识对准是通过调整所述摄像头的位置直至所述对准标识与所述漏极对位标识对准来实现的。
  8. 根据权利要求7所述的测试元件组，其特征在于，所述程序还包括用于执行以下步骤的指令：
    在移动所述测试元件组至所述目标像素区域之后，且在通过调整所述摄像头的位置直至所述对准标识与所述漏极对位标识对准之前，记录所述对准标识与所述漏极对位标识之间的偏移量。
  9. 根据权利要求7所述的测试元件组，其特征在于，所述移动所述测试元件组直至所述目标像素区域是以所述目标像素点的栅极线的起始端开始执行的；或
    所述移动所述测试元件组直至所述目标像素区域是以所述目标像素点的数据线的起始端开始执行的。
  10. 根据权利要求9所述的测试元件组，其特征在于，所述程序还包括用于执行以下步骤的指令：
    控制所述测试元件组停止移动在所述中间像素点处；和
    调整所述摄像头的位置直至所述对准标识与所述中间像素点所在的中间像素区域对应的所述对位标识对准。
  11. 根据权利要求10所述的测试元件组，其特征在于，所述目标像素点与所述栅极线的起始端或所述数据线的起始端之间相隔达到200像素点时，所述测试元件组到达所述目标像素区域之前至少停止移动一次。
  12. 根据权利要求10所述的测试元件组，其特征在于，所述停止移动的次数为多次时，所述中间像素点的个数为多个，相邻所述中间像素点之间至多相隔200个像素点。
  13. 根据权利要求10所述的测试元件组，其特征在于，所述程序还包括用于执行以下步骤的指令：
    在所述测试元件组停止移动在所述中间像素点处之后，且在调整所述摄像头的位置直至所述对准标识与所述中间像素点所在的中间像素区域对应的所述漏极对位标识对准之前，记录所述对准标识与所述漏极对位标识之间的偏移量。
  14. 根据权利要求3至13任意一项所述的测试元件组，其特征在于，所述测试元件组包括承载台和面板放置元件，所述程序还包括用于执行以下步骤的指令：
    控制所述面板放置元件放置所述显示面板在所述承载台上；和
    控制所述面板放置元件调整所述显示面板的位置以使所述显示面板与所述承载台对准。
  15. 根据权利要求14所述的测试元件组，其特征在于，所述承载台上设置有多个定位标识，所述显示面板上还设置有与多个所述定位标识对应的多个对齐标识，所述调整所述显示面板的位置以使所述显示面板与所述承载台对准是通过调整所述显示面板的位置直至多个所述定位标识与对应的多个所述对齐标识之间的偏差在预设偏差范围内来实现的。
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