WO2019002623A1 - Apparatus and method for preparing electronic element composite electrode - Google Patents

Apparatus and method for preparing electronic element composite electrode Download PDF

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Publication number
WO2019002623A1
WO2019002623A1 PCT/EP2018/067821 EP2018067821W WO2019002623A1 WO 2019002623 A1 WO2019002623 A1 WO 2019002623A1 EP 2018067821 W EP2018067821 W EP 2018067821W WO 2019002623 A1 WO2019002623 A1 WO 2019002623A1
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WO
WIPO (PCT)
Prior art keywords
electronic element
mounting plate
spray
substrate mounting
element substrate
Prior art date
Application number
PCT/EP2018/067821
Other languages
French (fr)
Inventor
Fangyuan CHANG
Junfeng Liu
Qirong Li
Wen Yang
Original Assignee
Tdk Electronics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Electronics Ag filed Critical Tdk Electronics Ag
Publication of WO2019002623A1 publication Critical patent/WO2019002623A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the present application relates to the technical field of electronic components, in particular to the technical field of preparation of electronic component composite electrodes.
  • thermal spraying technology enjoys favour due to its advantages such as low cost and simple process.
  • two or more layers of metal material will generally be sprayed, in order to increase the bonding force between an electrode and a ceramic body, and ensure good welding capability.
  • An existing method of preparing composite electrodes is generally to perform single-side spraying, first of all spraying a first metal material on a substrate, then spraying a second metal material on a first layer electrode, and after spraying a first side, flipping over to spray another side. This method greatly lengthens the production time and reduces the production efficiency.
  • An object of the present application is to provide a novel automatic continuous spraying apparatus, capable of spraying two sides simultaneously in a single operation, to greatly increase production efficiency.
  • An apparatus for preparing an electronic element composite electrode comprising a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of spray guns for spraying a metal material onto an electronic element substrate.
  • each pair of the spray guns forms one set, and the two spray guns in each set are symmetrically disposed on two sides of the mounting plate, ensuring that all the spray guns can spray two sides of an electronic element on the electronic element substrate mounting plate.
  • a fixing plate capable of moving forwards and backwards with the conveying apparatus is disposed on the conveying apparatus, the electronic element substrate mounting plate is horizontally fixed to the fixing plate and moves forwards and backwards with the fixing plate, and spray heads of each set of the spray guns are disposed separately above and below a conveying surface of the conveying apparatus, to spray two sides of the electronic element substrate mounting plate.
  • a clamp capable of moving forwards and backwards with the conveying apparatus is disposed on the conveying apparatus, the electronic element substrate mounting plate is vertically clamped in the clamp, and spray heads of each set of the spray guns are disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp, to spray two sides of the electronic element substrate mounting plate.
  • the spray gun is connected to a spray gun driving apparatus, which can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
  • the conveying apparatus may employ a conveyor chain, a conveyor track or a conveyor belt.
  • the electrode preparation time can be shortened by about 50%;
  • the automatic continuous spraying apparatus and multiple sets of spray guns are arranged to form an assembly line, which can continuously spray multiple types of metal electrodes on two sides simultaneously; spraying of two sides is accomplished in a single operation, so the space and time involved in turnover of semi-finished products when single- side spraying is employed are eliminated.
  • the present invention concerns an apparatus for preparing an electronic element composite electrode, comprising a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of spray guns for spraying a metal material onto an electronic element.
  • the at least one set of spray guns may comprise at least one pair of the spray guns, and the two spray guns in each pair may be symmetrically disposed on two sides of the electronic element substrate mounting plate, ensuring that all the pairs of spray guns can spray two sides of an electronic element on the electronic element substrate mounting plate.
  • a fixing plate capable of moving forwards and backwards with the conveying apparatus may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be horizontally fixed to the fixing plate and moves forwards and backwards with the fixing plate, and spray heads of each pair of the spray guns may be disposed separately above and below a conveying surface of the conveying apparatus, to spray two sides of the electronic element on the electronic element substrate mounting plate.
  • a clamp capable of moving forwards and backwards with the conveying apparatus may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be vertically clamped in the clamp, and spray heads of each pair of the spray guns may be disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp, to spray two sides of the electronic element on the electronic element substrate mounting plate.
  • the spray gun may be connected to a spray gun driving apparatus, which can control the movement direction and speed of the spray gun, and can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
  • a spray gun driving apparatus which can control the movement direction and speed of the spray gun, and can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
  • the conveying apparatus may employ a conveyor chain, a conveyor track or a conveyor belt.
  • the present invention concerns a method of preparing an electronic element composite electrode, comprising the steps of:
  • the at least one set of spray guns may comprise at least one pair of the spray guns, and the two spray guns in each pair may be symmetrically disposed on two sides of the electronic element substrate mounting plate, wherein in step d. all the pairs of spray guns may spray two sides of the electronic element on the electronic element substrate mounting plate.
  • a fixing plate capable of moving forwards and backwards with the conveying apparatus may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be horizontally fixed to the fixing plate and may move forwards and backwards with the fixing plate in step b., and spray heads of each pair of the spray guns may be disposed separately above and below a conveying surface of the conveying apparatus, and may spray two sides of the electronic element on the electronic element substrate mounting plate in step d..
  • a clamp capable of moving forwards and backwards with the conveying apparatus in step b. may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be vertically clamped in the clamp, and spray heads of each pair of the spray guns may be disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp, and may spray two sides of electronic element substrate on the electronic element substrate mounting plate in step d..
  • the spray gun may be connected to a spray gun driving apparatus, which can control the movement direction and speed of the spray gun, and can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
  • a spray gun driving apparatus which can control the movement direction and speed of the spray gun, and can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
  • the conveying apparatus may employ a conveyor chain, a conveyor track or a conveyor belt.
  • Fig. 1 is a structural schematic diagram of a first particular embodiment of the present application.
  • Fig. 2 is a structural schematic diagram of second and third particular embodiments of the present application.
  • An apparatus for preparing an electronic element composite electrode comprises a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of movable spray guns for spraying a metal material onto an electronic element substrate.
  • Each pair of the spray guns forms one set, and the two spray guns in each set are symmetrically disposed on two sides of the mounting plate, ensuring that all the spray guns can spray two sides of an electronic element on the electronic element substrate mounting plate.
  • Each spray gun is connected to a spray gun driving apparatus; the spray gun driving apparatus drives the spray gun to move, realizing adjustability of movement direction and speed, and can move up/down, left/right, forwards/backwards, or in any direction.
  • the driving apparatus may be a mechanical hand; the spray gun is clamped by the mechanical hand to perform spraying, or fully manual spraying may be performed.
  • the spray guns on the two sides may be in one, two or more sets; each type of spray gun can spray one type of metal material, and can realize the preparation of a multi-layer composite electrode.
  • the electronic element substrate mounting element may be horizontally fixed to a fixing plate on the conveying apparatus, or vertically fixed to a clamp on the conveying apparatus, hence the spray guns on the two sides of the mounting plate may also be placed vertically or horizontally in a corresponding manner.
  • the mounting plate can move forwards and backwards with the conveying apparatus. Spraying of multiple layers of electrode material is realized through coordinated movement of the conveying apparatus and the movable spray guns.
  • the conveying apparatus may convey by chain, track or belt, etc.
  • the electronic element may be a varistor, a thermistor, a ceramic capacitor or a film capacitor, etc., but is not limited to these.
  • the sensing apparatus may be a sensor disposed on the conveying apparatus, and may be an infrared sensor or a laser sensor, etc.
  • a first spraying apparatus/spraying method as shown in fig. 1, an electronic element is fixed to an electronic element substrate mounting plate 1.
  • the electronic element substrate mounting plate 1 is horizontally fixed to a fixing plate 31 of a conveying apparatus 3.
  • a sensing apparatus 4 senses that the electronic element substrate mounting plate 1 has been conveyed to below a movable spray gun 2, first spray guns 21 and 22, which are vertically symmetrical on two sides of the electronic element substrate mounting plate 1, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of left-right movement of the spray guns and conveying of the electronic element substrate mounting plate.
  • the spray guns When the sensing apparatus 4 senses that the mounting plate has reached second spray guns 23 and 24, the spray guns are activated and, in the same way as the first set of spray guns, spray a second electrode material. It must be explained that when the second spray guns are activated, spraying of the second electrode material may begin when spraying of the first electrode material is completed, or not yet completed.
  • an electronic element is fixed to an electronic element substrate mounting plate 1.
  • the electronic element substrate mounting plate 1 is vertically fixed to a clamp 31 of a conveying apparatus 3.
  • a sensing apparatus 4 senses that the electronic element substrate mounting plate 1 has been conveyed to below a movable spray gun, the electronic element substrate mounting plate stops moving, and first spray guns 21 and 22, which are horizontally symmetrical on two sides of the electronic element substrate mounting plate, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of up-down movement and forward-backward movement of the spray guns.
  • the electronic element substrate mounting plate moves forward with the conveying apparatus, and when the sensing apparatus 4 senses that the electronic element substrate mounting plate has reached second spray guns, the spray guns are activated and, in the same way as the first set of spray guns, spray a second electrode material.
  • a third spraying apparatus/spraying method as shown in fig. 2, an electronic element is fixed to an electronic element substrate mounting plate 1.
  • the electronic element substrate mounting plate is vertically fixed to a clamp 31 of a conveying apparatus 3.
  • a sensing apparatus 4 senses that the electronic element substrate mounting plate has been conveyed to below a movable spray gun, a first set of spray guns 21 and 22, which are horizontally symmetrical on two sides of the electronic element substrate mounting plate, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of up-down movement of the movable spray guns and forward- backward movement of the mounting plate.
  • spray guns 21 and 22 which are horizontally symmetrical on two sides of the electronic element substrate mounting plate, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of up-down movement of the movable spray guns and forward- backward movement of the mounting plate.
  • spray guns are activated and, in the same way as the first set of spray guns, spray a second electrode material.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Dispersion Chemistry (AREA)
  • Spray Control Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

Disclosed in the present application is an apparatus for preparing an electronic element composite electrode, comprising a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of movable spray guns for spraying a metal material onto an electronic element substrate. The present application uses a method of spraying two sides simultaneously, so can shorten electrode preparation time by about 50%; an automatic continuous spraying apparatus and multiple sets of spray guns are arranged to form an assembly line, which can continuously spray multiple types of metal electrodes on two sides simultaneously; spraying of two sides is accomplished in a single operation, so the space and time involved in turnover of semi-finished products when single-side spraying is employed are eliminated.

Description

Description
APPARATUS AND METHOD FOR PREPARING ELECTRONIC ELEMENT
COMPOSITE ELECTRODE
Technical field
The present application relates to the technical field of electronic components, in particular to the technical field of preparation of electronic component composite electrodes.
Background art
In the preparation of existing metal electrodes, thermal spraying technology enjoys favour due to its advantages such as low cost and simple process. In the case of electronic components, in particular ceramic elements, two or more layers of metal material will generally be sprayed, in order to increase the bonding force between an electrode and a ceramic body, and ensure good welding capability. An existing method of preparing composite electrodes is generally to perform single-side spraying, first of all spraying a first metal material on a substrate, then spraying a second metal material on a first layer electrode, and after spraying a first side, flipping over to spray another side. This method greatly lengthens the production time and reduces the production efficiency.
Content of the application
An object of the present application is to provide a novel automatic continuous spraying apparatus, capable of spraying two sides simultaneously in a single operation, to greatly increase production efficiency.
To achieve the abovementioned object, the technical solution of the present application is as follows:
An apparatus for preparing an electronic element composite electrode, comprising a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of spray guns for spraying a metal material onto an electronic element substrate.
Furthermore, each pair of the spray guns forms one set, and the two spray guns in each set are symmetrically disposed on two sides of the mounting plate, ensuring that all the spray guns can spray two sides of an electronic element on the electronic element substrate mounting plate.
Furthermore, a fixing plate capable of moving forwards and backwards with the conveying apparatus is disposed on the conveying apparatus, the electronic element substrate mounting plate is horizontally fixed to the fixing plate and moves forwards and backwards with the fixing plate, and spray heads of each set of the spray guns are disposed separately above and below a conveying surface of the conveying apparatus, to spray two sides of the electronic element substrate mounting plate. Furthermore, a clamp capable of moving forwards and backwards with the conveying apparatus is disposed on the conveying apparatus, the electronic element substrate mounting plate is vertically clamped in the clamp, and spray heads of each set of the spray guns are disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp, to spray two sides of the electronic element substrate mounting plate.
Furthermore, the spray gun is connected to a spray gun driving apparatus, which can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
Furthermore, the conveying apparatus may employ a conveyor chain, a conveyor track or a conveyor belt.
Beneficial effects of the present application: using the method of spraying two sides simultaneously, the electrode preparation time can be shortened by about 50%;
the automatic continuous spraying apparatus and multiple sets of spray guns are arranged to form an assembly line, which can continuously spray multiple types of metal electrodes on two sides simultaneously; spraying of two sides is accomplished in a single operation, so the space and time involved in turnover of semi-finished products when single- side spraying is employed are eliminated. The present invention concerns an apparatus for preparing an electronic element composite electrode, comprising a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of spray guns for spraying a metal material onto an electronic element.
The at least one set of spray guns may comprise at least one pair of the spray guns, and the two spray guns in each pair may be symmetrically disposed on two sides of the electronic element substrate mounting plate, ensuring that all the pairs of spray guns can spray two sides of an electronic element on the electronic element substrate mounting plate.
A fixing plate capable of moving forwards and backwards with the conveying apparatus may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be horizontally fixed to the fixing plate and moves forwards and backwards with the fixing plate, and spray heads of each pair of the spray guns may be disposed separately above and below a conveying surface of the conveying apparatus, to spray two sides of the electronic element on the electronic element substrate mounting plate.
A clamp capable of moving forwards and backwards with the conveying apparatus may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be vertically clamped in the clamp, and spray heads of each pair of the spray guns may be disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp, to spray two sides of the electronic element on the electronic element substrate mounting plate.
The spray gun may be connected to a spray gun driving apparatus, which can control the movement direction and speed of the spray gun, and can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
The conveying apparatus may employ a conveyor chain, a conveyor track or a conveyor belt.
According to another aspect, the present invention concerns a method of preparing an electronic element composite electrode, comprising the steps of:
a. arranging an electronic element on an electronic element substrate mounting plate which is fixed to a conveying apparatus,
b. driving the electronic element substrate mounting plate by the conveying apparatus,
c. sensing a movement position of the electronic element substrate mounting plate by a sensing apparatus, and
d. spraying a metal material onto the electronic element with at least one set of spray guns. The at least one set of spray guns may comprise at least one pair of the spray guns, and the two spray guns in each pair may be symmetrically disposed on two sides of the electronic element substrate mounting plate, wherein in step d. all the pairs of spray guns may spray two sides of the electronic element on the electronic element substrate mounting plate.
A fixing plate capable of moving forwards and backwards with the conveying apparatus may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be horizontally fixed to the fixing plate and may move forwards and backwards with the fixing plate in step b., and spray heads of each pair of the spray guns may be disposed separately above and below a conveying surface of the conveying apparatus, and may spray two sides of the electronic element on the electronic element substrate mounting plate in step d..
A clamp capable of moving forwards and backwards with the conveying apparatus in step b. may be disposed on the conveying apparatus, the electronic element substrate mounting plate may be vertically clamped in the clamp, and spray heads of each pair of the spray guns may be disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp, and may spray two sides of electronic element substrate on the electronic element substrate mounting plate in step d..
The spray gun may be connected to a spray gun driving apparatus, which can control the movement direction and speed of the spray gun, and can selectively drive the spray gun to move up/down, left/right, forwards/backwards, or in any direction.
The conveying apparatus may employ a conveyor chain, a conveyor track or a conveyor belt.
Description of the accompanying drawings
Fig. 1 is a structural schematic diagram of a first particular embodiment of the present application.
Fig. 2 is a structural schematic diagram of second and third particular embodiments of the present application.
Particular embodiments
The concept, specific structure and technical effects of the present application are described clearly and fully below with reference to embodiments and the accompanying drawings, in order to enable a full understanding of the object, features and effects of the present application. Clearly, the embodiments described are merely some, not all, embodiments of the present application; other embodiments obtained by those skilled in the art without expending any inventive effort are included in the scope of protection of the present application.
An apparatus for preparing an electronic element composite electrode comprises a conveying apparatus, an electronic element substrate mounting plate driven by the conveying apparatus, a sensing apparatus for sensing a movement position of the electronic element substrate mounting plate, and at least one set of movable spray guns for spraying a metal material onto an electronic element substrate.
Each pair of the spray guns forms one set, and the two spray guns in each set are symmetrically disposed on two sides of the mounting plate, ensuring that all the spray guns can spray two sides of an electronic element on the electronic element substrate mounting plate. Each spray gun is connected to a spray gun driving apparatus; the spray gun driving apparatus drives the spray gun to move, realizing adjustability of movement direction and speed, and can move up/down, left/right, forwards/backwards, or in any direction. The driving apparatus may be a mechanical hand; the spray gun is clamped by the mechanical hand to perform spraying, or fully manual spraying may be performed. The spray guns on the two sides may be in one, two or more sets; each type of spray gun can spray one type of metal material, and can realize the preparation of a multi-layer composite electrode.
The electronic element substrate mounting element may be horizontally fixed to a fixing plate on the conveying apparatus, or vertically fixed to a clamp on the conveying apparatus, hence the spray guns on the two sides of the mounting plate may also be placed vertically or horizontally in a corresponding manner. The mounting plate can move forwards and backwards with the conveying apparatus. Spraying of multiple layers of electrode material is realized through coordinated movement of the conveying apparatus and the movable spray guns.
The conveying apparatus may convey by chain, track or belt, etc.
The electronic element may be a varistor, a thermistor, a ceramic capacitor or a film capacitor, etc., but is not limited to these.
The sensing apparatus may be a sensor disposed on the conveying apparatus, and may be an infrared sensor or a laser sensor, etc.
Specifically, the following three types of spraying apparatus/method are possible:
In a first spraying apparatus/spraying method, as shown in fig. 1, an electronic element is fixed to an electronic element substrate mounting plate 1. The electronic element substrate mounting plate 1 is horizontally fixed to a fixing plate 31 of a conveying apparatus 3. When a sensing apparatus 4 senses that the electronic element substrate mounting plate 1 has been conveyed to below a movable spray gun 2, first spray guns 21 and 22, which are vertically symmetrical on two sides of the electronic element substrate mounting plate 1, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of left-right movement of the spray guns and conveying of the electronic element substrate mounting plate. When the sensing apparatus 4 senses that the mounting plate has reached second spray guns 23 and 24, the spray guns are activated and, in the same way as the first set of spray guns, spray a second electrode material. It must be explained that when the second spray guns are activated, spraying of the second electrode material may begin when spraying of the first electrode material is completed, or not yet completed.
In a second spraying apparatus/spraying method, as shown in fig. 2, an electronic element is fixed to an electronic element substrate mounting plate 1. The electronic element substrate mounting plate 1 is vertically fixed to a clamp 31 of a conveying apparatus 3. When a sensing apparatus 4 senses that the electronic element substrate mounting plate 1 has been conveyed to below a movable spray gun, the electronic element substrate mounting plate stops moving, and first spray guns 21 and 22, which are horizontally symmetrical on two sides of the electronic element substrate mounting plate, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of up-down movement and forward-backward movement of the spray guns. When spraying of the first electrode material is complete, the electronic element substrate mounting plate moves forward with the conveying apparatus, and when the sensing apparatus 4 senses that the electronic element substrate mounting plate has reached second spray guns, the spray guns are activated and, in the same way as the first set of spray guns, spray a second electrode material. In a third spraying apparatus/spraying method, as shown in fig. 2, an electronic element is fixed to an electronic element substrate mounting plate 1. The electronic element substrate mounting plate is vertically fixed to a clamp 31 of a conveying apparatus 3. When a sensing apparatus 4 senses that the electronic element substrate mounting plate has been conveyed to below a movable spray gun, a first set of spray guns 21 and 22, which are horizontally symmetrical on two sides of the electronic element substrate mounting plate, are activated, and begin spraying a first electrode material; spraying of the first electrode material is completed by means of up-down movement of the movable spray guns and forward- backward movement of the mounting plate. When spraying of the first electrode material is complete, the electronic element substrate mounting plate moves forward with the conveying apparatus, and when the sensing apparatus 4 senses that the electronic element substrate mounting plate has reached second spray guns 23 and 24, the spray guns are activated and, in the same way as the first set of spray guns, spray a second electrode material.
It must be explained that the embodiments above are merely preferred embodiments of the present application. The present application is not limited to the embodiments above; any arrangement which achieves the technical effects of the present application by the same approach should be included in the scope of protection of the present application.

Claims

Claims
1. An apparatus for preparing an electronic element composite electrode, characterized by comprising a conveying apparatus (3), an electronic element substrate mounting plate (1) driven by the conveying apparatus (3), a sensing apparatus (4) for sensing a movement position of the electronic element substrate mounting plate (1), and at least one set of spray guns (2, 21, 22, 23, 24) for spraying a metal material onto an electronic element.
2 . The apparatus for preparing an electronic element composite electrode as claimed in claim 1 , characterized in that the at least one set of spray guns (2, 21 , 22, 23, 24) comprises at least one pair of the spray guns (21 , 22; 23, 24), and the two spray guns (21, 22; 23, 24) in each pair are symmetrically disposed on two sides of the electronic element substrate mounting plate (1), ensuring that all the pairs of spray guns (21, 22; 23, 24) can spray two sides of an electronic element on the electronic element substrate mounting plate (1).
3. The apparatus for preparing an electronic element composite electrode as claimed in claim 2, characterized in that a fixing plate (31) capable of moving forwards and backwards with the conveying apparatus (3) is disposed on the conveying apparatus (3), the electronic element substrate mounting plate (1) is horizontally fixed to the fixing plate (31) and moves forwards and backwards with the fixing plate (31), and spray heads of each pair of the spray guns (21, 22; 23, 24) are disposed separately above and below a conveying surface of the conveying apparatus (3), to spray two sides of the electronic element on the electronic element substrate mounting plate (1).
4. The apparatus for preparing an electronic element composite electrode as claimed in claim 2, characterized in that a clamp (31) capable of moving forwards and backwards with the conveying apparatus (3) is disposed on the conveying apparatus (3), the electronic element substrate mounting plate (1) is vertically clamped in the clamp (31), and spray heads of each pair of the spray guns (21 , 22; 23, 24) are disposed separately on two sides of the electronic element substrate mounting plate vertically placed on the clamp (31), to spray two sides of the electronic element on the electronic element substrate mounting plate.
5. The apparatus for preparing an electronic element composite electrode as claimed in claim 1, 2 or 3, characterized in that the spray gun (2, 21, 22, 23, 24) is connected to a spray gun driving apparatus, which can control the movement direction and speed of the spray gun (2, 21 , 22, 23, 24), and can selectively drive the spray gun (2, 21, 22, 23, 24) to move up/down, left/right, forwards/backwards, or in any direction.
6. The apparatus for preparing an electronic element composite electrode as claimed in claim 1 , 3 or 4, characterized in that the conveying apparatus (3) employs a conveyor chain, a conveyor track or a conveyor belt.
7. A method of preparing an electronic element composite electrode, comprising the steps of:
a. arranging an electronic element on an electronic element substrate mounting plate (1) which is fixed to a conveying apparatus (3),
b. driving the electronic element substrate mounting plate (1) by the conveying apparatus (3),
c. sensing a movement position of the electronic element substrate mounting plate (1) by a sensing apparatus (4), and
d. spraying a metal material onto the electronic element with at least one set of spray guns (2, 21, 22, 23, 24).
8 . The method of preparing an electronic element composite electrode as claimed in claim 7, characterized in that the at least one set of spray guns (2, 21 , 22, 23, 24) comprises at least one pair of the spray guns (21 , 22; 23, 24), and the two spray guns (21, 22; 23, 24) in each pair are symmetrically disposed on two sides of the electronic element substrate mounting plate (1),
wherein in step d. all the pairs of spray guns (21, 22; 23, 24) spray two sides of the electronic element on the electronic element substrate mounting plate (1).
9. The method of preparing an electronic element composite electrode as claimed in claim 8, characterized in that a fixing plate (31) capable of moving forwards and backwards with the conveying apparatus (3) is disposed on the conveying apparatus (3), the electronic element substrate mounting plate (1) is horizontally fixed to the fixing plate (31) and moves forwards and backwards with the fixing plate (31) in step b., and spray heads of each pair of the spray guns (21, 22; 23, 24) are disposed separately above and below a conveying surface of the conveying apparatus (3), and spray two sides of the electronic element on the electronic element substrate mounting plate (1) in step d..
10. The method of preparing an electronic element composite electrode as claimed in claim 8, characterized in that a clamp (31) capable of moving forwards and backwards with the conveying apparatus (3) in step b. is disposed on the conveying apparatus (3), the electronic element substrate mounting plate (1) is vertically clamped in the clamp (3), and spray heads of each pair of the spray guns (21, 22; 23, 24) are disposed separately on two sides of the electronic element substrate mounting plate (1) vertically placed on the clamp (31), and spray two sides of electronic element substrate on the electronic element substrate mounting plate (1) in step d..
11. The method of preparing an electronic element composite electrode as claimed in claim 7, 8 or 9, characterized in that the spray gun (2, 21, 22, 23, 24) is connected to a spray gun driving apparatus, which can control the movement direction and speed of the spray gun (2, 21 , 22, 23, 24), and can selectively drive the spray gun (2, 21, 22, 23, 24) to move up/down, left/right, forwards/backwards, or in any direction.
12. The method of preparing an electronic element composite electrode as claimed in claim 7, 9 or 10, characterized in that the conveying apparatus (3) employs a conveyor chain, a conveyor track or a conveyor belt.
PCT/EP2018/067821 2017-06-30 2018-07-02 Apparatus and method for preparing electronic element composite electrode WO2019002623A1 (en)

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