WO2019000579A1 - 一种微型扬声器及该扬声器的组装方法 - Google Patents

一种微型扬声器及该扬声器的组装方法 Download PDF

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Publication number
WO2019000579A1
WO2019000579A1 PCT/CN2017/096425 CN2017096425W WO2019000579A1 WO 2019000579 A1 WO2019000579 A1 WO 2019000579A1 CN 2017096425 W CN2017096425 W CN 2017096425W WO 2019000579 A1 WO2019000579 A1 WO 2019000579A1
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Prior art keywords
lead
housing
side wall
notch
track groove
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PCT/CN2017/096425
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English (en)
French (fr)
Inventor
张小龙
冯乐喜
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歌尔股份有限公司
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Publication of WO2019000579A1 publication Critical patent/WO2019000579A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of electroacoustics, and more particularly to a microspeaker and a method of assembling the same.
  • the micro-speaker is an important acoustic component of an electronic device, and is an energy conversion device capable of converting between an electrical signal and a sound signal, and belongs to the most basic sounding unit.
  • the utility model comprises a casing formed with a receiving space and a magnetic circuit component and a vibration component housed in the casing, the vibration component comprising a diaphragm and a voice coil coupled to one side of the diaphragm, and the voice coil is respectively led out on both sides of the voice coil
  • the lead wire and the voice coil lead are electrically connected to an external circuit through a conductive terminal provided on the speaker housing to form a loop, and the diaphragm is vibrated and sounded by the principle of electromagnetic induction, thereby realizing the sounding function of the speaker.
  • the voice coil lead is aligned along the straight track.
  • the side wall of the conventional micro speaker housing is opened.
  • the U-shaped notch provides positioning of the lead in the xy plane direction during the transfer process on the one hand, and U on the other hand.
  • the design of the bottom of the slot is close to the bottom surface of the housing, so that the lead is positioned in the z-axis direction, so that the lead can be placed as close as possible to the conductive terminal at the bottom of the housing to facilitate the connection and fixing of the two.
  • the U-shaped notch since the bottom of the U-shaped notch is too close to the bottom surface of the casing, when the diaphragm is sealed with the rubber coating portion at the top end surface of the casing side wall, the U-shaped notch cannot be sealed and filled, thereby causing the diaphragm to meet the air pressure or After the water pressure, the diaphragm located at the U-shaped notch area will have a concave deformation, which affects the normal use of the micro-speaker.
  • connection position of the voice coil lead and the conductive terminal on the micro-speaker and the top edge of the side wall of the casing have a large height difference, and the lead wire cannot be close to the conductive terminal during the assembly process. It makes it very difficult to fix the connection between the two. How to realize the positioning connection between the voice coil lead and the conductive terminal on the micro speaker under the condition of large height difference is an important technical problem.
  • the back side is straight; the microspeaker voice coil leads are connected from the back of the microspeaker and connected to the conductive terminals (ie pads) on the back side of the housing; the drawback of this type of lead structure is that it takes up valuable in the miniature speaker housing. Space, so that the short side of the shell can not design the sidewall structure, so that it can not be further adjusted The distribution of magnetic lines of force ultimately results in a severe loss of sensitivity to the microspeaker.
  • the technical solution of the present invention is:
  • a microspeaker includes a housing, a magnetic circuit assembly housed in the housing, and a vibration assembly, the vibration assembly including a diaphragm and a voice coil coupled under the diaphragm, The voice coil has leads for electrical connection;
  • the housing includes an annular side wall and a bottom wall extending inwardly from the side wall, the top end of the side wall is provided with a fixing surface for fixing to the edge of the diaphragm, and the top end of the side wall is provided for positioning a notch of the last portion of the lead;
  • a conductive terminal is disposed in the housing, an upper surface of the pad at one end of the conductive terminal is exposed by an upper surface of the bottom wall, and an upper surface of the pad is lower than the fixing surface;
  • a boss for positioning the end portion of the lead and for cutting the lead is further provided on the housing between the upper surface of the pad and the fixing surface.
  • the boss comprises a top surface and a side surface, the side surface intersecting a plane of the upper surface of the bottom wall, and before the lead wire is cut, the end portion of the lead wire is along the top surface and the side surface of the boss The bend is positioned in a straight line, the pads being in abutment with the corresponding end portions of the leads.
  • the top surface is on a horizontal plane, the side surface being on a vertical plane perpendicular to the horizontal plane.
  • the notch includes a track groove provided on the fixing surface for accommodating the lead wire,
  • the track groove is disposed through the inner and outer sides of the side wall.
  • the track groove has a depth of 0.05 mm to 0.1 mm.
  • the track groove is filled with glue.
  • the top end of the side wall is disposed on the outer side of the fixing surface with a retaining wall higher than the fixing surface, and the notch includes a notch provided on the retaining wall.
  • the notch further comprises a track groove disposed on the fixing surface for receiving the lead, and the track groove is connected to the notch.
  • the track groove is disposed through inner and outer sides of the side wall.
  • the track groove has a depth of 0.05 mm to 0.1 mm.
  • the track groove is filled with glue.
  • an upper cover is disposed above the housing, the upper cover is provided with an upper cover edge on the inner side of the retaining wall, and the diaphragm edge is fixed between the upper cover edge and the fixed surface .
  • the present invention provides a method of assembling the above-described microspeaker, comprising the following steps:
  • the voice coil lead is aligned along the trajectory, the middle of the lead is fixed, and the end of the lead is extended and fixed by the notch on the top end of the side wall, and the last part of the lead passes through the notch Positioning the XY plane;
  • the notch includes a track groove disposed on the fixing surface for receiving the lead wire, and after step S3, the track groove is filled with glue to form a flat surface of the fixing surface, and then the edge of the diaphragm is The fixing surface is bonded and fixed.
  • the micro-speaker provided by the invention makes the voice coil lead line trajectory accurate, and the voice coil lead is connected with the micro-speaker conductive terminal, even if the voice coil lead is connected with the conductive terminal and the side wall edge of the housing There is a large height difference.
  • the lead With the housing design in the microspeaker of the present invention, the lead can be positioned in the xy plane through the notch on the side wall of the housing when the lead is straight, and the lead is in the z-axis direction through the boss. The positioning enables the wire bonding position to abut against the pad, and the state can be maintained until the wire and the conductive terminal are connected and fixed, so that the wire and the pad can be reliably connected to avoid welding defects such as soldering. Occur
  • the design of the boss provides a reference platform for the cutting of the end of the lead after the lead and the pad are fixed, and the position and height are controllable, which facilitates accurate cutting of the lead; and the boss does not occupy the voice coil additionally.
  • the space between the housings facilitates the design between the yoke and the side wall structure of the magnetic circuit assembly, thereby adjusting the distribution of magnetic lines of force to ensure that the sensitivity is not lost.
  • the notch can be set only to have a shallow depth at the top end of the side wall of the casing a track groove penetrating the side wall; for the side wall of the casing having the retaining wall, the notch may be provided with a notch for the wire positioning only on the retaining wall, or may include a through side with a shallow depth on the fixing surface The track groove of the wall.
  • the notch When the notch is in the direction of the voice coil lead, on the one hand, the position and shape of the burned area during the wire bonding can be standardized, and the hot stamping on the fixed surface is not uniform, and the automatic filling process cannot be realized; It is shallower, and after the end of the lead is cut, it is easy to realize the filling process, so that the fixing surface recovers the flat surface, and the deep U-shaped notch provided on the side wall of the conventional micro-speaker housing can not be sealed and filled. Further, when the diaphragm encounters air pressure or water pressure, the diaphragm located at the U-shaped notch region may be deformed by depression, resulting in poor sealing effect and affecting the waterproof performance of the speaker.
  • FIG. 1 is a schematic view showing the structure of a speaker housing according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the cooperation of the voice coil lead of the embodiment of the present invention with the housing during the mounting process.
  • Figure 3 is an enlarged schematic view of a portion A of Figure 2.
  • FIG. 4 is a schematic view showing the assembly structure between the voice coil lead and the housing in the speaker according to an embodiment of the present invention.
  • Fig. 5 is a front elevational view showing the assembly structure between the voice coil lead and the casing in the speaker according to an embodiment of the present invention.
  • Figure 6 is a cross-sectional view taken along line B-B of Figure 5;
  • Fig. 7 is a view showing the appearance of a speaker according to an embodiment of the present invention.
  • Fig. 8 is a view showing the structure of a speaker housing according to another embodiment of the present invention.
  • the present invention provides a miniature speaker.
  • the speaker includes a casing 1 and is fixed to the casing 1.
  • the upper magnetic circuit assembly and the vibration assembly include a diaphragm and a voice coil 2 coupled under the diaphragm, corresponding to the short-axis side of the housing 1, the voice coil 2 having leads 21 for electrical connection.
  • the housing 1 includes an annular side wall 11 and a bottom wall 12 extending inwardly from the side wall 11.
  • the top end of the side wall 11 is provided with a fixing for fixing to the edge of the diaphragm. a surface 111, a top end of the side wall 11 is disposed on the outer side of the fixing surface 111 with a retaining wall 112 higher than the fixing surface 111; further, a top end of the side wall 11 is provided with a last section for positioning the lead wire 21. Part of the notch.
  • two voice coils 2 are provided symmetrically.
  • the lead wires 21 are positioned and fixed during the connection with the speaker conductive terminals 3.
  • a notch the notch includes a track groove 1111 disposed on the fixing surface 111 for receiving the lead wire 21, and a notch 1121 disposed on the retaining wall 112, the track groove 1111 and the notch 1121 is connected.
  • the track groove 1111 is disposed through the inner and outer sides of the side wall 11.
  • the depth of the track groove 1111 is 0.05 mm-0.1 mm.
  • the present embodiment only provides a preferred size range, based on the general understanding of those skilled in the art, Make further selections and modifications in the actual situation.
  • the short-axis side of the housing 1 is symmetrically injection-molded with a conductive terminal 3; the upper surface of the pad 31 at one end of the conductive terminal 3 is covered by the bottom The upper surface of the wall 12 is exposed, and the upper surface of the pad 31 is lower than the fixing surface 111, wherein the lead 21 is soldered to the pad 31 or fixed by a conductive paste.
  • the microspeaker avoids the collision of the voice coil 2 lead 21 with the upper surface of the bottom wall 12 of the casing 1 during operation. Vibrato is generated, and a height difference of more than 0.5 mm exists between the upper surface of the pad 31 and the fixed surface 111.
  • the position and shape of the burned area of the lead 21 can be standardized on the one hand, and the hot stamping on the fixed surface 111 can be avoided, and the automatic filling can not be realized.
  • the track groove 1111 is set shallowly, and after the end of the lead wire 21 is cut, the glue filling process can be easily realized, so that the fixing surface 111 recovers the flat surface, and the setting on the side wall of the conventional micro speaker housing is solved.
  • Deep U-shaped notch can not be sealed and filled
  • the diaphragm located at the U-shaped notch region may be deformed by depression, resulting in poor sealing effect and affecting the waterproof performance of the speaker.
  • connection position of the voice coil 2 lead 21 and the conductive terminal 3 pad 31 and the edge of the side wall 11 of the housing 1 have a large height difference, in order to solve Under the large height difference, the problem that the lead wire cannot be positioned in the z-axis direction during the connection and fixing process of the voice coil lead and the speaker conductive terminal pad, the shell between the upper surface of the pad 31 and the fixing surface 111 of the present invention
  • the body 1 is also provided with a boss 4 for positioning the end portion of the lead 21 and for cutting the lead 21.
  • the boss 4 includes a top surface 41 and a side surface 42 intersecting the plane of the upper surface of the bottom wall 12, and the lead 21 is not cut before the lead 21 is
  • the end portion is bent along the top surface 41 and the side surface 42 of the boss 4, and the pad 31 abuts against the corresponding end portion of the lead wire 21.
  • the top surface 41 is on a horizontal plane and the side surface 42 is on a vertical plane perpendicular to the horizontal plane.
  • the design of the boss 4 is such that the lead 21 is fixed to the pad 31 to provide a reference platform for cutting the end of the lead 21. The position and height are controllable, and the precise cutting of the lead 21 is facilitated, and the boss 4 is not extra.
  • the space between the voice coil 2 and the housing 1 is occupied, which facilitates the design between the magnetic yoke of the magnetic circuit assembly and the sidewall structure of the housing, thereby adjusting the distribution of magnetic lines of force and ensuring no loss of sensitivity.
  • the positioning of the lead in the xy plane can be realized by the notch on the side wall 11 of the housing 1, and the lead 21 can be realized in the z-axis direction by the boss 4.
  • Positioning, the soldering position of the lead 21 is closely contacted with the pad 31, and the state can be maintained until the lead 21 and the conductive terminal 3 are connected and fixed, so that the lead 21 and the pad 31 can be reliably connected to avoid soldering.
  • soldering position of the lead 21 is closely contacted with the pad 31, and the state can be maintained until the lead 21 and the conductive terminal 3 are connected and fixed, so that the lead 21 and the pad 31 can be reliably connected to avoid soldering.
  • soldering position of the lead 21 is closely contacted with the pad 31, and the state can be maintained until the lead 21 and the conductive terminal 3 are connected and fixed, so that the lead 21 and the pad 31 can be reliably connected to avoid soldering.
  • soldering Such as the occurrence of poor welding.
  • the speaker further includes an upper cover 5 disposed above the casing 1, and the upper cover 5 is provided with an upper cover edge located inside the retaining wall 112, the diaphragm An edge is fixed between the rim of the upper cover 5 and the fixing surface 111.
  • the track groove is filled with glue, so that the fixed surface is restored to a flat surface and the edge of the diaphragm is sealed and fixed, and in order to ensure the overall sealing performance of the speaker, the notch is also Fill the glue seal.
  • the notch may be set only to the depth of the top end of the side wall of the casing.
  • the shallow track groove passing through the inner and outer sides of the side wall, the lead wire is positioned on the xy plane through the track groove on the side wall of the casing when the voice coil lead is in line, and the track groove is filled with glue after the wire is fixed and assembled, so that the wire is fixed.
  • the surface is restored to a flat surface and sealed to the edge of the diaphragm.
  • the track slot is on the one hand
  • the xy plane positioning is provided for the lead wire; on the other hand, the track groove is set shallowly, and the filling process can be easily realized after the end of the lead wire is cut, so that the fixing surface recovers the flat surface, and the setting on the side wall of the conventional micro speaker housing is solved.
  • the deep U-shaped notch can not be sealed and filled, which leads to the deformation of the diaphragm at the U-notch area when the diaphragm encounters air pressure or water pressure, resulting in poor sealing effect and affecting the waterproof performance of the speaker. The problem.
  • the notch may also be provided with a notch 1121 for positioning the lead 21 on the retaining wall 112.
  • the fixing surface 111 is sealed and fixed to the edge of the diaphragm.
  • the notch 1121 is filled with glue for Ensure the overall sealing performance of the speaker.
  • the lead 21 is soldered to the pad 31 or fixed by a conductive paste, and then the end portion of the lead 21 is cut at the position of the top surface 41 of the boss 4.
  • the notch includes a track groove 1111 disposed on the fixing surface 111 for receiving the lead wire 21.
  • the track groove 1111 is filled with glue to form a flat surface of the fixing surface 111, and then the diaphragm is formed. The edge is bonded to the fixing surface 111.
  • the micro-speaker provided by the invention makes the voice coil lead line trajectory accurate, and the voice coil lead is connected with the micro-speaker conductive terminal, even if the connection position of the voice coil lead and the conductive terminal and the edge of the side wall of the housing are compared.
  • Large height difference through the housing design of the micro-speaker of the invention, the lead can be positioned in the xy plane through the notch on the side wall of the housing when the lead is straight, and the positioning of the lead in the z-axis direction is realized by the boss
  • the wire bonding position is closely contacted with the pad, and the state can be maintained until the wire and the conductive terminal are connected and fixed, so that the wire and the pad can be reliably connected to avoid welding defects such as soldering.

Abstract

一种微型扬声器及该扬声器的组装方法，包括壳体(1)、磁路组件和振动组件，壳体(1)包括环形侧壁(11)和由侧壁(11)向内延伸出的底壁(12)，侧壁(11)顶端设有用于与振膜边缘固定的固定面(111)，且侧壁(11)顶端上设有用于定位引线(21)的末段部分的槽口；壳体(1)内设有导电端子(3)，该导电端子(3)一端的焊盘(31)的上表面由底壁(12)的上表面露出；在焊盘(31)的上表面与固定面(111)之间的壳体(1)上还设有用于定位引线(21)的末段部分并用于对引线进行裁切的凸台(4)。通过对扬声器壳体(1)结构的改进，一方面使音圈引线(21)顺线轨迹准确；另一方面轨迹槽(1111)设置较浅，可以在引线(21)端部被裁切后，很容易实现填胶处理，解决了传统微型扬声器壳体侧壁(11)上设置的较深的U型槽口无法进行密封填充，进而影响扬声器防水性能的问题。

Description

一种微型扬声器及该扬声器的组装方法 技术领域
本发明涉及电声领域，更具体地，涉及一种微型扬声器及该扬声器的组装方法。
背景技术
微型扬声器是电子设备的重要声学部件，其是一种能够完成电信号与声音信号之间转换的能量转换器件，属于最基本的发声单元。其包括形成有容纳空间的壳体和收容于所述壳体内的磁路组件和振动组件，所述振动组件包括振膜和结合于振膜一侧的音圈，音圈两侧分别引出音圈引线，音圈引线通过扬声器壳体上所设置的导电端子与外部电路电连接形成回路，通过电磁感应原理带动振膜振动发声，进而实现扬声器的发声功能。
在扬声器装配过程中，音圈与壳体位置相对固定后，音圈引线按照顺线轨迹进行顺线，为了便于音圈引线与扬声器中导电端子电性连接，传统微型扬声器壳体侧壁上开设有底部靠近壳体底面的U型槽口，引线的末段部分通过槽口穿出，该U型槽口一方面为引线在转配过程中提供x-y平面方向上的定位，另一方面利用U型槽口底部靠近壳体底面的设计，为引线提供在z轴方向上的定位，使得引线可以尽量贴靠位于壳体底部的导电端子，便于二者的连接固定。
但是由于该U型槽口底部过于靠近壳体底面，当振膜与壳体侧壁顶端面涂胶部进行封接时，该U型槽口无法进行密封填充，进而导致当振膜遇气压或水压后，位于U型槽口区域处的振膜会产生凹陷变形，影响微型扬声器的正常使用。但如果不在壳体侧壁设置U型槽口，音圈引线与微型扬声器上导电端子的连接位置和壳体侧壁顶端边缘又存在较大高度差，引线在装配过程中无法与导电端子贴近，使得二者之间的连接固定变得非常困难。如何实现大高度差条件下音圈引线与微型扬声器上导电端子间的定位连接，是一个重要的技术问题。
当前存在的解决方案，主要有以下几种：
(1)背侧顺线；微型扬声器音圈引线从微型扬声器背部顺线并与壳体背侧的导电端子(即焊盘)连接；此种引线结构的缺陷在于，会占用微型扬声器壳体内宝贵空间，使壳体短边无法设计侧壁结构，从而无法进一步调节 磁力线分布，最终造成微型扬声器灵敏度损失严重。
(2)悬空点焊；直接对存在大高度差的音圈引线进行悬空点焊；此种引线结构的缺陷在于，这样会造成点焊位置超出图纸要求，且存在虚焊等焊接不良的问题。
(3)钢环设计；在保留微型扬声器壳体上的较深U型槽口的同时，为了防止振膜在U型槽口区域下陷造成微型扬声器防水失效，会在振膜与壳体涂胶部间额外增加钢环结构；此种引线结构的缺陷在于，这样会使产品制作工序增加，同时大大增加产品成本。
发明内容
本发明要解决的一个技术问题是提供一种微型扬声器；通过对扬声器壳体结构的改进，解决了振膜在壳体侧壁顶端槽口区域下陷造成扬声器防水失效的问题，同时还解决了音圈引线与导电端子的连接位置和壳体侧壁边缘存在较大高度差，音圈引线与扬声器导电端子连接固定过程中无法对引线进行z轴方向定位的问题。本发明要解决的另一个技术问题是提供一种上述扬声器的组装方法。
为解决上述技术问题，本发明的技术方案是：
根据本发明的一个方面，本发明提供一种微型扬声器，包括壳体、收容于壳体内的磁路组件和振动组件，所述振动组件包括振膜和结合于振膜下方的音圈，所述音圈具有用于电连接的引线；
所述壳体包括环形侧壁和由侧壁向内延伸出的底壁，所述侧壁顶端设有用于与所述振膜边缘固定的固定面，且所述侧壁顶端上设有用于定位引线的末段部分的槽口；
所述壳体内设有导电端子，该导电端子一端的焊盘的上表面由所述底壁的上表面露出，且所述焊盘的上表面低于所述固定面；
在所述焊盘的上表面与所述固定面之间的壳体上还设有用于定位引线的末段部分并用于对引线进行裁切的凸台。
优选地，所述凸台包括顶面和侧面，所述侧面与所述底壁上表面所在平面相交，引线未裁切前，所述引线的末段部分沿所述凸台的顶面和侧面弯折顺线定位，所述焊盘与相对应的所述引线的末段部分两者相贴靠。
优选地，所述顶面位于水平面上，所述侧面位于与水平面垂直的竖直面上。
优选地，所述槽口包括设于所述固定面上用于容纳所述引线的轨迹槽， 所述轨迹槽贯穿所述侧壁的内、外侧面设置。
优选地，所述轨迹槽的深度为0.05mm-0.1mm。
优选地，在将引线在所述凸台位置裁切后，所述轨迹槽内填充胶水。
优选地，所述侧壁顶端位于所述固定面的外侧设有高出所述固定面的挡墙，所述槽口包括设于所述挡墙上的缺口。
优选地，所述槽口还包括设于所述固定面上用于容纳所述引线的轨迹槽，所述轨迹槽与所述缺口相连接。
优选地，所述轨迹槽贯穿所述侧壁的内、外侧面设置。
优选地，所述轨迹槽的深度为0.05mm-0.1mm。
优选地，在将引线在所述凸台位置裁切后，所述轨迹槽内填充胶水。
优选地，在所述壳体上方设有上盖，所述上盖设有位于所述挡墙内侧的上盖边沿，所述振膜边缘固定于所述上盖边沿和所述固定面之间。
优选地，所述焊盘的上表面与固定面之间存在大于0.5mm的高度差。
根据本发明的另一方面，本发明提供一种上述微型扬声器的组装方法，包括如下步骤：
S1、将音圈引线按照顺线轨迹进行顺线，对引线的中部进行固定，且引线的端点由所述侧壁顶端上的槽口伸出并固定，引线的末段部分通过所述槽口进行X-Y平面的定位；
S2、将引线的末段部分与凸台对应位置进行下压，使其沿着凸台的顶面和侧面进行顺线并定位，焊盘与相对应的引线的末段部分两者相贴靠；
S3、将引线与焊盘焊接或通过导电胶固定，然后在凸台顶面位置对引线的末段部分进行裁切。
优选地，所述槽口包括设于所述固定面上用于容纳所述引线的轨迹槽，步骤S3后，对所述轨迹槽填充胶水使固定面形成平整表面，然后将振膜的边缘与固定面进行粘接固定。
本发明的有益效果如下：
1、本发明所提供的微型扬声器，使音圈引线顺线轨迹准确，在音圈引线在与微型扬声器导电端子连接固定过程中，即便音圈引线与导电端子的连接位置和壳体侧壁边缘存在较大高度差，通过本发明微型扬声器中的壳体设计，引线顺线时可通过壳体侧壁上的槽口实现引线在x-y平面的定位，并通过凸台实现引线在z轴方向上的定位，进而实现引线焊接位置与焊盘近距离贴靠，且在引线与导电端子连接固定完成前能够始终保持此状态，使得引线与焊盘能够实现可靠连接，避免虚焊等焊接不良情况的发生；
另外，凸台的设计为引线与焊盘固定后对引线末端的裁切提供了一个基准平台，其位置、高度可控，方便对引线的精确裁切；且该凸台不额外占用音圈与壳体间的空间，方便磁路组件的导磁轭与侧壁结构之间的设计，从而调节磁力线分布，保证灵敏度不损失。
2、本发明所提供的微型扬声器，进一步的，在设置凸台的基础上，针对不设有挡墙的壳体侧壁，所述槽口可以仅为壳体侧壁顶端设置深度较浅的贯通侧壁的轨迹槽；针对具有挡墙的壳体侧壁，所述槽口可以是仅在挡墙上设置用于引线定位的缺口，也可以包括在固定面上设置深度较浅的贯通侧壁的轨迹槽。
槽口在音圈引线顺线时，一方面可以规范引线焊接时烫伤区域的位置和形状，避免造成固定面上位置形状不统一的烫痕，无法实现自动填胶处理；另一方面轨迹槽设置较浅，可以在引线端部被裁切后，很容易实现填胶处理，使得固定面恢复平整表面，解决了传统微型扬声器壳体侧壁上设置的较深的U型槽口无法进行密封填充，进而导致当振膜遇气压或水压后，位于U型槽口区域处的振膜会产生凹陷变形，导致密封效果变差，影响扬声器防水性能的问题。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1示出本发明一种实施方式的扬声器壳体的结构示意图。
图2示出本发明一种实施方式的音圈引线在安装过程中与壳体之间的配合示意图。
图3为图2中A部放大示意图。
图4示出本发明一种实施方式的扬声器内音圈引线与壳体之间的装配结构示意图。
图5示出本发明一种实施方式的扬声器内音圈引线与壳体之间的装配结构主视图。
图6为图5中的B-B剖视图。
图7示出本发明一种实施方式的扬声器的外观示意图。
图8示出本发明另一种实施方式的扬声器壳体的结构示意图。
具体实施方式
为了更清楚地说明本发明，下面结合优选实施例和附图对本发明做进一 步的说明。附图中相似的部件以相同的附图标记进行表示。本领域技术人员应当理解，下面所具体描述的内容是说明性的而非限制性的，不应以此限制本发明的保护范围。
为了解决传统扬声器振膜在壳体侧壁顶端较深槽口区域下陷造成扬声器防水失效的问题，本发明提供一种微型扬声器，参见图4，所述扬声器包括壳体1、固定于壳体1上的磁路组件和振动组件，所述振动组件包括振膜和结合于振膜下方的音圈2，对应壳体1短轴一侧，所述音圈2具有用于电连接的引线21。
参见图1、2、3，所述壳体1包括环形侧壁11和由侧壁11向内延伸出的底壁12，所述侧壁11顶端设有用于与所述振膜边缘固定的固定面111，所述侧壁11顶端位于所述固定面111的外侧设有高出所述固定面111的挡墙112；进一步的，所述侧壁11顶端上设有用于定位引线21的末段部分的槽口。基于音圈2具有两根引线21，本实施例中，在对应壳体1长轴一侧，对称设有两个供音圈2引线21在与扬声器导电端子3连接固定过程中定位引线21的槽口，所述槽口包括设于所述固定面111上用于容纳所述引线21的轨迹槽1111，以及设于所述挡墙112上的缺口1121，所述轨迹槽1111与所述缺口1121相连接。为了便于引线21的末段部分通过轨迹槽1111进行X-Y平面的定位，所述轨迹槽1111贯穿所述侧壁11的内、外侧面设置。其中优选地，所述轨迹槽1111的深度为0.05mm-0.1mm，对于所述轨迹槽1111的深度，本实施方式仅提供一种优选的尺寸范围，基于本领域技术人员的一般理解，可根据实际情况做进一步的选择和修改。
参见图4、5、6，与音圈2引线21相对应的，所述壳体1内短轴侧对称注塑有导电端子3；该导电端子3一端的焊盘31的上表面由所述底壁12的上表面露出，且所述焊盘31的上表面低于所述固定面111，其中引线21与焊盘31焊接或通过导电胶固定。优选地，为了给安装就位后的音圈2引线21所涂抹的保护胶留出相对空间，避免微型扬声器在工作过程中音圈2引线21与壳体1底壁12的上表面发生碰撞，产生颤音，所述焊盘31的上表面与固定面111之间存在大于0.5mm的高度差。
本发明中槽口在音圈2引线21顺线时，一方面可以规范引线21焊接时烫伤区域的位置和形状，避免造成固定面111上位置形状不统一的烫痕，无法实现自动填胶处理；另一方面轨迹槽1111设置较浅，可以在引线21端部被裁切后，很容易实现填胶处理，使得固定面111恢复平整表面，解决了传统微型扬声器壳体侧壁上设置的较深的U型槽口无法进行密封填充，进而导 致当振膜遇气压或水压后，位于U型槽口区域处的振膜会产生凹陷变形，导致密封效果变差，影响扬声器防水性能的问题。
参见图2，基于本发明扬声器壳体1中槽口结构的改进，音圈2引线21与导电端子3焊盘31的连接位置和壳体1侧壁11边缘存在较大高度差，为了解决较大高度差下，音圈引线与扬声器导电端子焊盘连接固定过程中无法对引线进行z轴方向定位的问题，本发明在所述焊盘31的上表面与所述固定面111之间的壳体1上还设有用于定位引线21的末段部分并用于对引线21进行裁切的凸台4。
具体的，参见图2至6，所述凸台4包括顶面41和侧面42，所述侧面42与所述底壁12上表面所在平面相交，引线21未裁切前，所述引线21的末段部分沿所述凸台4的顶面41和侧面42弯折顺线定位，所述焊盘31与相对应的所述引线21的末段部分两者相贴靠。优选地，所述顶面41位于水平面上，所述侧面42位于与水平面垂直的竖直面上。凸台4的设计为引线21与焊盘31固定后对引线21末端的裁切提供了一个基准平台，其位置、高度可控，方便对引线21的精确裁切，且该凸台4不额外占用音圈2与壳体1间的空间，方便磁路组件的导磁轭与壳体侧壁结构之间的设计，从而调节磁力线分布，保证灵敏度不损失。
本发明中的壳体设计，音圈2引线21顺线时可通过壳体1侧壁11上的槽口实现引线在x-y平面的定位，并通过凸台4实现引线21在z轴方向上的定位，实现了引线21焊接位置与焊盘31近距离贴靠，且在引线21与导电端子3连接固定完成前能够始终保持此状态，使得引线21与焊盘31能够实现可靠连接，避免虚焊等焊接不良情况的发生。
进一步的，参见图4、7，所述扬声器还包括在所述壳体1上方设置的上盖5，所述上盖5设有位于所述挡墙112内侧的上盖边沿，所述振膜边缘固定于所述上盖5边沿和所述固定面111之间。在实际装配过程中，当音圈引线固定装配后，所述轨迹槽内填充有胶水，使固定面恢复成平整表面与振膜边缘密封固定，且为了保证扬声器整体密封性能，所述缺口内也填充胶水密封。
基于上述优选地实施方式，作为一种变形的实施方式，在设置凸台的基础上，针对不设有挡墙的壳体侧壁，所述槽口可以仅为壳体侧壁顶端设置深度较浅的贯通侧壁内、外侧面的轨迹槽，音圈引线顺线时通过壳体侧壁上的轨迹槽实现引线在x-y平面的定位，引线固定装配后，轨迹槽内填充有胶水，使固定面恢复成平整表面与振膜边缘密封固定。该实施方式中轨迹槽一方面 为引线提供x-y平面定位；另一方面轨迹槽设置较浅，可在引线端部被裁切后，容易实现填胶处理，使得固定面恢复平整表面，解决了传统微型扬声器壳体侧壁上设置的较深的U型槽口无法进行密封填充，进而导致当振膜遇气压或水压后，位于U型槽口区域处的振膜会产生凹陷变形，导致密封效果变差，影响扬声器防水性能的问题。
作为另一种变形的实施方式，参见图8，针对具有挡墙112的壳体1侧壁11，所述槽口还可以仅是在挡墙112上设置用于引线21定位的缺口1121，音圈2引线21顺线时通过挡墙112上的缺口1121实现引线在x-y平面的定位，引线21固定装配后，固定面111与振膜边缘密封固定，优选地，缺口1121内填充胶水，用以保证扬声器整体密封性能。
参见图1至4，根据本发明的另一方面，本发明还提供一种基于上述优选地实施方式所提供的微型扬声器的组装方法，包括如下步骤：
S1、定位壳体1及音圈2位置，将音圈2引线21按照顺线轨迹进行顺线，对引线21的中部进行固定，且引线21的端点由所述侧壁11顶端上的槽口伸出并固定，引线21的末段部分通过所述槽口进行X-Y平面的定位；
S2、将引线21的末段部分与凸台4对应位置进行下压，使其沿着凸台4的顶面41和侧面42进行顺线并定位，焊盘31与相对应的引线21的末段部分两者相贴靠；
S3、将引线21与焊盘31焊接或通过导电胶固定，然后在凸台4顶面41位置对引线21的末段部分进行裁切。
其中，所述槽口包括设于所述固定面111上用于容纳所述引线21的轨迹槽1111，步骤S3后，对轨迹槽填1111充胶水使固定面111形成平整表面，然后将振膜的边缘与固定面111进行粘接固定。
本发明所提供的微型扬声器，使音圈引线顺线轨迹准确，在音圈引线在与微型扬声器导电端子连接固定过程中，即便音圈引线与导电端子的连接位置和壳体侧壁边缘存在较大高度差，通过本发明微型扬声器中的壳体设计，引线顺线时可通过壳体侧壁上的槽口实现引线在x-y平面的定位，并通过凸台实现引线在z轴方向上的定位，进而实现引线焊接位置与焊盘近距离贴靠，且在引线与导电端子连接固定完成前能够始终保持此状态，使得引线与焊盘能够实现可靠连接，避免虚焊等焊接不良情况的发生。
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定，对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动，这里无法对所有 的实施方式予以穷举，凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。

Claims (15)

  1. 一种微型扬声器，包括壳体、收容于壳体内的磁路组件和振动组件，所述振动组件包括振膜和结合于振膜下方的音圈，所述音圈具有用于电连接的引线，其特征在于，
    所述壳体包括环形侧壁和由侧壁向内延伸出的底壁，所述侧壁顶端设有用于与所述振膜边缘固定的固定面，且所述侧壁顶端上设有用于定位引线的末段部分的槽口；
    所述壳体内设有导电端子，该导电端子一端的焊盘的上表面由所述底壁的上表面露出，且所述焊盘的上表面低于所述固定面；
    在所述焊盘的上表面与所述固定面之间的壳体上还设有用于定位引线的末段部分并用于对引线进行裁切的凸台。
  2. 根据权利要求1所述的一种微型扬声器，其特征在于，
    所述凸台包括顶面和侧面，所述侧面与所述底壁上表面所在平面相交，引线未裁切前，所述引线的末段部分沿所述凸台的顶面和侧面弯折顺线定位，所述焊盘与相对应的所述引线的末段部分两者相贴靠。
  3. 根据权利要求3所述的一种微型扬声器，其特征在于，
    所述顶面位于水平面上，所述侧面位于与水平面垂直的竖直面上。
  4. 根据权利要求1所述的一种微型扬声器，其特征在于，所述槽口包括设于所述固定面上用于容纳所述引线的轨迹槽，所述轨迹槽贯穿所述侧壁的内、外侧面设置。
  5. 根据权利要求4所述的一种微型扬声器，其特征在于，所述轨迹槽的深度为0.05mm-0.1mm。
  6. 根据权利要求4所述的一种微型扬声器，其特征在于，在将引线在所述凸台位置裁切后，所述轨迹槽内填充胶水。
  7. 根据权利要求1所述的一种微型扬声器，其特征在于，所述侧壁顶端位于所述固定面的外侧设有高出所述固定面的挡墙，所述槽口包括设于所述挡墙上的缺口。
  8. 根据权利要求7所述的一种微型扬声器，其特征在于，所述槽口还包括设于所述固定面上用于容纳所述引线的轨迹槽，所述轨迹槽与所述缺口相连接。
  9. 根据权利要求8所述的一种微型扬声器，其特征在于，所述轨迹槽贯穿所述侧壁的内、外侧面设置。
  10. 根据权利要求8所述的一种微型扬声器，其特征在于，所述轨迹槽的深度为0.05mm-0.1mm。
  11. 根据权利要求8所述的一种微型扬声器，其特征在于，在将引线在所述凸台位置裁切后，所述轨迹槽内填充胶水。
  12. 根据权利要求7或11所述的一种微型扬声器，其特征在于，在所述壳体上方设有上盖，所述上盖设有位于所述挡墙内侧的上盖边沿，所述振膜边缘固定于所述上盖边沿和所述固定面之间。
  13. 根据权利要求1所述的一种微型扬声器壳体，其特征在于，所述焊盘的上表面与固定面之间存在大于0.5mm的高度差。
  14. 一种如权利要求1-12任一项所述微型扬声器的组装方法，其特征在于，包括如下步骤：
    S1、将音圈引线按照顺线轨迹进行顺线，对引线的中部进行固定，且引线的端点由所述侧壁顶端上的槽口伸出并固定，引线的末段部分通过所述槽口进行X-Y平面的定位；
    S2、将引线的末段部分与凸台对应位置进行下压，使其沿着凸台的顶面和侧面进行顺线并定位，焊盘与相对应的引线的末段部分两者相贴靠；
    S3、将引线与焊盘焊接或通过导电胶固定，然后在凸台顶面位置对引线的末段部分进行裁切。
  15. 如权利要求14所述的微型扬声器的组装方法，其特征在于，所述槽口包括设于所述固定面上用于容纳所述引线的轨迹槽，步骤S3后，对所述轨迹槽填充胶水使固定面形成平整表面，然后将振膜的边缘与固定面进行粘接固定。
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