WO2019000162A1 - Blindage électromagnétique de dispositif électronique - Google Patents

Blindage électromagnétique de dispositif électronique Download PDF

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Publication number
WO2019000162A1
WO2019000162A1 PCT/CN2017/089986 CN2017089986W WO2019000162A1 WO 2019000162 A1 WO2019000162 A1 WO 2019000162A1 CN 2017089986 W CN2017089986 W CN 2017089986W WO 2019000162 A1 WO2019000162 A1 WO 2019000162A1
Authority
WO
WIPO (PCT)
Prior art keywords
absorbing element
heat absorbing
electronic device
electrical
shielding
Prior art date
Application number
PCT/CN2017/089986
Other languages
English (en)
Inventor
Wenxin Huang
George QIN
Ming Li
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing filed Critical Thomson Licensing
Priority to PCT/CN2017/089986 priority Critical patent/WO2019000162A1/fr
Publication of WO2019000162A1 publication Critical patent/WO2019000162A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Definitions

  • the proposed apparatus is directed to electromagnetic shielding and a shielding apparatus including a heat absorbing element for electronic devices.
  • some electrical or optical components can generate electromagnetic interference (EMI) , which interrupts the normal operation of other components.
  • EMI electromagnetic interference
  • EMC electromagnetic compliant
  • ESD electrostatic discharge
  • Heat generated during operation of the electrical or optical components will also heat up the components, in which case the failure of the electronic device may occur. So, additionally, a heat absorbing element is needed to dissipate heat to the external environment.
  • FIG. 1 is an exemplary diagram showing a conventional shielding structure of an electronic devices with EMC and heat absorbing element functionalities.
  • a plurality of electrical or optical components of the electronic device are generally indicated by reference number 101.
  • the electrical or optical components 101 are attached to a printed circuit board (PCB) 102.
  • the electronic device also has a shield 103 enclosing the electrical or optical components 101 on the PCB 102 to provide EMC functionality.
  • a heat absorbing element 104 is placed on and in contact with the shield 103 to dissipate heat generated by the electrical or optical components 101. Due to machine and fit tolerances, there is a gap between the shield 103 and the surface of the electrical or optical components 101, which will lead to a lower thermal transfer efficiency between the shield 103 and the electrical or optical components 101. It should be appreciated that, since the heat absorbing element 104 is not in direct contact with the electrical or optical components 101 to be cooled, the radiating efficiency of the heat absorbing element 104 will depend largely on the above described thermal transfer efficiency. In view of the above problem, an additional thermal conductive material 105 is provided between the electrical or optical components 101 and the shield 103 to improve thermal transfer efficiency. The introduction of the thermal conductive material 105 along with relevant manufacturing processes, increases the cost of the shield structure.
  • the proposed apparatus concerns electromagnetic shielding including a heat absorbing element for use in an electronic device. It will be appreciated that the proposed apparatus is not limited to any specific device.
  • a device includes a component, a heat absorbing element and an electromagnetic shield disposed on a substrate.
  • the heat absorbing element is coupled to the component to dissipate heat generated thereby.
  • the electromagnetic shield surrounds the component and is attached to a portion of the heat absorbing element to protect the component from electrostatic charge generated within the device.
  • the electromagnetic shield includes a plurality of contact pads (or fingers) .
  • the plurality of contact pads are oriented along vertical sidewalls of the electromagnetic shield.
  • the portion of the area of the heat absorbing element attached to the electromagnetic shield includes one or more walls disposed thereon.
  • At least one thermal pad is interposed between the component and the heat absorbing element.
  • the electromagnetic shield comprises a conductive material.
  • the electromagnetic shield comprises a conductive gasket.
  • the device is a set-top-box.
  • FIG. 1 is an exemplary diagram showing a conventional electronic device with EMC and heat absorbing element functionalities
  • FIG. 2 is an exemplary diagram showing an electronic device with EMC and heat absorbing element functionalities according to an embodiment of the disclosure
  • FIG. 3A depicts a plurality of tabs along the vertical walls of the shielding
  • FIG. 3B depicts a feature on the heat absorbing element for contacting the plurality of tabs
  • FIG. 4 shows electromagnetic compliant shielding for the electronic device depicted in FIG. 2;
  • FIG. 5 is a section view showing the heat transfer and heat dissipation path for the electronic device shown in FIG. 2;
  • FIG. 6 is an exemplary diagram showing an electronic device with EMC and heat absorbing element functionalities according to another embodiment of the disclosure.
  • FIG. 7 exploded view of heat absorbing element and shielding shown in FIG. 6;
  • FIG. 8 shows electromagnetic compliant shielding for the electronic device depicted in FIG. 6.
  • FIG. 9 is a section view showing the heat transfer and dissipation path for the electronic device shown in FIG. 6.
  • FIG. 2 is an exemplary diagram showing a shielding structure of an electronic device with electromagnetic discharge shielding (ESD) and heat absorbing element functionalities according to an embodiment of the disclosure.
  • ESD electromagnetic discharge shielding
  • the electronic device 200 in FIG. 2 similar to that shown in FIG. 1 and described above, includes a plurality of electrical or optical components, which are generally indicated by the reference number 201.
  • the electrical or optical components 201 are attached to a printed circuit board (PCB) 202.
  • PCB printed circuit board
  • the electronic device 200 includes an electromagnetic shield 203 enclosing the electrical or optical components 201 on the PCB 202 to provide an electromagnetic compliant functionality.
  • the shielding 203 can be mounted onto the PCB 202 by soldering which allows the shield 203 to have a conductive contact with a grounding pad (not shown) on the PCB 202.
  • the shield 203 is provided with an opening 205 at a position surrounding the electrical or optical components 201, through which a heat absorbing element 204 can pass to directly contact the electrical or optical components 201.
  • the shape and the dimension of the opening 205 are substantially identical to an outline of a feature 206 of the heat absorbing element 204, with tolerance to allow the heat absorbing element 204 to pass therethrough.
  • the heat absorbing element 204 has a rectangular cross section for purpose of reducing the manufacturing cost. Therefore, the embodiment of the disclosure will be described taking a heat absorbing element with rectangular cross section as an example for illustrative purposes, but it can be appreciated that a heat absorbing element with other shapes can also be used.
  • the heat absorbing element 204 can be mounted onto the PCB 202 by a fastener 207 with springs or levers which could contribute a downward press. It could be appreciated that, since the heat absorbing element 204 could be in direct contact with the components 201 to be cooled in this embodiment, the thermal transfer efficiency will be improved.
  • a plurality of elastic tabs 208 are provided around the circumference of the opening 205, which are oriented along the vertical sidewalls of the shield 203.
  • the plurality of elastic tabs 208 are made of a conductive material having elasticity, for example, stainless steel.
  • the plurality of the elastic tabs 208 will be in contact with the feature 206 of the heat absorbing element 204, when the heat absorbing element 204 is mounted on PCB 202 and in the position to form a complete electromagnetic compliant shielding structure for the electrical or optical components 201.
  • the heat absorbing element 204 forms an integral part of the shielding.
  • elastic tabs 208 can be provided in pairs, in which case each pair can be provided at a symmetrical position of the circumference of the opening 205. Certainly, the four sides of the rectangular opening 205 can all be provided with elastic tabs 208. In addition, in all cases, each elastic tab 208 can occupy the whole or a portion of the side of the rectangular opening 205.
  • each elastic tab 208 extends vertically in relation to the sidewalls of the shield 203 in a direction parallel to the feature 206 of the heat absorbing element 204.
  • FIG. 2 is an exemplary diagram showing the structure of the plurality of elastic tabs 208 in contact with the feature 206 of the heat absorbing element 204.
  • a portion of each tab 208 is bent to form a v-shaped structure.
  • the bent v-shaped portion 210 acts as a spring to facilitate adequate contact with the surface of the feature 206 of the heat absorbing element 204.
  • the heat absorbing element 204 is formed of a conductive material, such as aluminum. Additionally, in most instances the heat absorbing element 204 will have a conductive oxidation coating formed thereon, for purposes of corrosion resistance.
  • an electromagnetic compliant shielding structure 211 is formed based on the conductive contact between the tabs 208 of the shield 203 and corresponding surface of feature 206 of the heat absorbing element 204 and that between the shield 203 and the PCB 202.
  • the electrical or optical components 201 within the electromagnetic compliant shielding structure 211 are protected from electromagnetic interference generated by other components (e.g., CPU) outside of the shielding structure 211.
  • FIG. 5 depicts the heat transfer and dissipation path for the electrical or optical components 201. Heat is transferred from the electrical or optical components 201 to the heat absorbing element 204 and is dissipated therefrom.
  • FIG. 6 is an exemplary diagram showing a shielding structure of an electronic device with electromagnetic discharge shielding (ESD) and heat absorbing element functionalities according to another embodiment of the disclosure.
  • ESD electromagnetic discharge shielding
  • the electronic device 300 in FIG. 6 includes a plurality of electrical or optical components, which are generally indicated by the reference number 301.
  • the electrical or optical components 301 are attached to a printed circuit board (PCB) 302.
  • PCB printed circuit board
  • the electronic device 300 includes an electromagnetic shield 303 enclosing the electrical or optical components 301 on the PCB 302 to provide an electromagnetic compliant functionality.
  • the shielding 303 can be mounted onto the PCB 302 by soldering which allows the shield 303 to have a conductive contact with a grounding pad 312 (FIG. 7) on the PCB 302.
  • the shield 303 is provided with an opening 305 at a position surrounding the electrical or optical components 301, through which a heat absorbing element 304 can pass to directly contact the electrical or optical components 301.
  • the shape and the dimension of the opening 305 are substantially identical to an outline of a feature 306 (FIG. 6) of the heat absorbing element 304, with tolerance to allow the heat absorbing element 304 to pass therethrough.
  • the heat absorbing element 304 has a rectangular cross section for purpose of reducing the manufacturing cost.
  • the embodiment of the disclosure will be described taking a heat absorbing element with rectangular cross section as an example for illustrative purposes, but it can be appreciated that a heat absorbing element with other shapes can also be used.
  • the heat absorbing element 304 can be mounted onto the PCB 302 by fasteners 307 with springs or levers which could contribute a downward press. It could be appreciated that, since the heat absorbing element 304 could be in direct contact with the components 301 to be cooled in this embodiment, the thermal transfer efficiency will be improved.
  • the shielding 303 comprising an elastic gasket is provided to surround the feature 306 of the heat absorbing element 304.
  • the shielding 303 is formed of a conductive material having elasticity.
  • the shielding 303 will be in contact with the feature 306 of the heat absorbing element 304, when the heat absorbing element 304 is mounted on PCB 302 and in the position to form a complete electromagnetic compliant shielding structure for the electrical or optical components 301.
  • the heat absorbing element 304 forms an integral part of the shielding. It can be appreciated that generally the heat absorbing element 304 is formed of a conductive material, such as aluminum. Additionally, in most instances the heat absorbing element 304 will have a conductive oxidation coating formed thereon, for purposes of corrosion resistance.
  • an electromagnetic compliant shielding structure 311 (outlined) is formed based on the conductive contact between the shielding 303 and corresponding surface of feature 306 of the heat absorbing element 304 and that between the shield 303 and the PCB 302.
  • the electrical or optical components 301 within the electromagnetic compliant shielding structure 311 are protected from electromagnetic interference generated by other components (e.g., CPU) outside of the shielding structure 311.
  • FIG. 9 depicts the heat transfer and dissipation path for the electrical or optical components 301. Heat is transferred from the electrical or optical components 301 to the heat absorbing element 304 and is dissipated therefrom.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention se rapporte à un blindage électromagnétique d'un dispositif électronique. Le dispositif électronique comprend un composant, un élément d'absorption de chaleur et un blindage électromagnétique disposés sur un substrat. L'élément d'absorption de chaleur est accouplé au composant, afin de dissiper la chaleur dégagée par ce dernier. Le blindage électromagnétique entoure le composant et est fixé à une partie de l'élément d'absorption de chaleur afin de protéger le composant contre une charge électrostatique produite dans le dispositif électronique.
PCT/CN2017/089986 2017-06-26 2017-06-26 Blindage électromagnétique de dispositif électronique WO2019000162A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/089986 WO2019000162A1 (fr) 2017-06-26 2017-06-26 Blindage électromagnétique de dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/089986 WO2019000162A1 (fr) 2017-06-26 2017-06-26 Blindage électromagnétique de dispositif électronique

Publications (1)

Publication Number Publication Date
WO2019000162A1 true WO2019000162A1 (fr) 2019-01-03

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ID=64741911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/089986 WO2019000162A1 (fr) 2017-06-26 2017-06-26 Blindage électromagnétique de dispositif électronique

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040052064A1 (en) * 2001-11-15 2004-03-18 Oliver Michael J. Electromagnetic shielding and cooling device for printed circuit board
CN1953646A (zh) * 2005-10-18 2007-04-25 鸿富锦精密工业（深圳）有限公司 能防电磁干扰的散热装置
CN201104378Y (zh) * 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
CN201853688U (zh) * 2010-10-19 2011-06-01 鸿富锦精密工业（深圳）有限公司 散热结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040052064A1 (en) * 2001-11-15 2004-03-18 Oliver Michael J. Electromagnetic shielding and cooling device for printed circuit board
CN1953646A (zh) * 2005-10-18 2007-04-25 鸿富锦精密工业（深圳）有限公司 能防电磁干扰的散热装置
CN201104378Y (zh) * 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
CN201853688U (zh) * 2010-10-19 2011-06-01 鸿富锦精密工业（深圳）有限公司 散热结构

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