WO2018235596A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2018235596A1
WO2018235596A1 PCT/JP2018/021594 JP2018021594W WO2018235596A1 WO 2018235596 A1 WO2018235596 A1 WO 2018235596A1 JP 2018021594 W JP2018021594 W JP 2018021594W WO 2018235596 A1 WO2018235596 A1 WO 2018235596A1
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WO
WIPO (PCT)
Prior art keywords
filling
substrate
display
low melting
melting point
Prior art date
Application number
PCT/JP2018/021594
Other languages
French (fr)
Japanese (ja)
Inventor
梶山　康一
貴文 平野
Original Assignee
株式会社ブイ・テクノロジー
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Publication of WO2018235596A1 publication Critical patent/WO2018235596A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Definitions

  • the present invention relates to a display device in which a display substrate and an opposite substrate are sealed with a low melting point metal material at the periphery thereof, and in particular, maintains a water blocking effect and holds a molten low melting point metal material in a sealing position. It relates to the display device which made it possible.
  • a conventional display of this type is a low melting metal having a melting point of 130 ° C. or less inside a seal formed at the edge between an array substrate and an opposing substrate in which pixels including an organic EL layer are arranged in a matrix.
  • a water blocking portion composed of the above was formed (see, for example, Patent Document 1).
  • the amount of low melting point metal be less than that of the inner seal and the outer seal, so when the pressing force at the time of bonding is weak, the seal There is a problem that the low melting point metal inside the seal does not come in contact with the counter substrate because the deformation of the seal is small, and the water blocking effect is reduced.
  • a display substrate having an image display area at a central portion, an opposing substrate disposed opposite to the display substrate, and a ring along a peripheral portion of the display substrate And a filling and containing section for filling and containing a low melting point metal material for sealing the image display area between the display substrate and the counter substrate, the filling and containing section comprising the low melting point metal
  • the volume for filling and containing the material is formed to be maintainable.
  • the low melting point metal material filled and contained in the filling storage portion without excess and deficiency has a moisture blocking effect. It can be retained in the filling receptacle, i.e. in the sealing position, in the maintained state. Therefore, it is possible to avoid the problem that the low melting point metal material flows out from the inside of the filling container and shorts the peripheral electrical wiring as in the prior art.
  • FIG. 1 is a plan view showing a first embodiment of a display device according to the present invention, and is a transparent view seen through an opposing substrate. It is a centerline sectional view of FIG. It is a center line sectional view explaining a seal of a display substrate and a counter substrate. It is center-line sectional drawing which shows the modification of the seal
  • sticker in the said 1st Embodiment (a) shows a 1st modification
  • (b) shows a 2nd modification.
  • FIG. 5 is a centerline cross-sectional view of a second embodiment of a display device according to the present invention. It is a centerline sectional view showing a 3rd embodiment of a display device by the present invention, and (a) shows an example which provided a filling accommodation part of low melting metal material in a display substrate, (b) shows a filling accommodation part The example provided in the opposing board
  • FIG. 5 is a centerline cross-sectional view of a fifth embodiment of a display device according to the present invention;
  • FIG. 1 is a plan view showing a first embodiment of a display device according to the present invention, and is a transparent view seen through an opposing substrate.
  • FIG. 2 is a center line cross-sectional view of FIG.
  • This display device is configured to prevent moisture and the like from invading the image display area, and is configured to include a display substrate 1, an opposing substrate 2, and a filling container 3.
  • the display substrate 1 has an image display area at the center, and supports, for example, the organic EL display layer 4 provided in the image display area.
  • the display substrate 1 is a flexible substrate having high barrier properties against moisture and oxygen, as well as flexibility, heat resistance, etching resistance, and optical properties necessary for a light emitting device, such as polyimide And the like, and a known barrier film can be used.
  • the organic EL display layer 4 is formed by arranging in a matrix the pixels of an organic EL layer formed by laminating an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode from the display substrate 1 side. It becomes a display layer which emits light according to the video signal supplied from and displays a video.
  • the counter substrate 2 functions as a barrier layer that protects the organic EL display layer 4 by preventing moisture and oxygen from entering from the outside, and, for example, a transparent resin film and a silicon nitride film that transmits visible light. And the like, and a known sealing film layer can be used.
  • the filling and accommodating portion 3 is provided annularly.
  • the filling and containing section 3 is for filling and containing a low melting point metal material 5 for sealing the organic EL display layer 4 between the display substrate 1 and the counter substrate 2, and is filled with the low melting point metal material 5.
  • the volume to accommodate is formed maintainable.
  • the above-mentioned volume of the filling and accommodating portion 3 is provided on the inner side along the outer seal portion 7 and the outer seal portion 7 having the spacer balls 6 uniformly dispersed, It is equal to the size of the space 9 between the spacer ball 6 and the inner seal portion 8 in which the spacer balls 6 having the same diameter are dispersed.
  • the outer seal portion 7 and the inner seal portion 8 use, for example, a dispenser or the like along the peripheral portion of the display substrate 1 with an organic adhesive having the spacer balls 6 such as glass or silica particles dispersed by several ⁇ m. Are formed at predetermined heights and intervals determined in advance.
  • organic adhesive known adhesives such as thermosetting type, thermoplasticity, thermocompression bonding type or UV curing type can be suitably used.
  • FIG. 3 is a center line sectional view for explaining the seal between the display substrate 1 and the counter substrate 2.
  • the low melting point metal material 5 heated and melted is, for example, using a dispenser or by inkjet Filled with just enough.
  • the filling amount of the low melting point metal material 5 can be easily determined by calculation, experiment, or the like because the volume of the filling container 3 can be maintained.
  • the low melting point metal material 5 to be used a material whose melting point is lower than the heat resistance temperature of the organic EL display layer 4 is selected.
  • the heat resistance temperature of the organic EL material is generally said to be a hundred and several tens degrees.
  • the high molecular weight organic EL material has a high heat resistance temperature exceeding 200 ° C. Therefore, as the low melting point metal material 5, a low melting point metal or a low melting point alloy having a melting point of 200 ° C. or less is selected.
  • the melting point of the Sn-Bi-Cu alloy is about 170 ° C.
  • the melting point of the Sn-Bi-Ag alloy is about 130 ° C.
  • the Bi-Sb-In alloy is a material having a very low melting point of 60 ° C. to 70 ° C.
  • the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and is peripheral There is no risk of causing problems such as shorting of electrical wiring.
  • FIG. 4 is a center line sectional view showing a modified example of the seal in the first embodiment, (a) shows a first modified example, and (b) shows a second modified example.
  • the volume of the filling and containing portion 3 is between the outer seal portion 7 and the inner seal portion 8 and is provided for each of the display substrate 1 and the counter substrate 2. It is equal to the size of the space 9 sandwiched between the two grooves 10 annularly provided facing each other.
  • the volume of the filling and containing portion 3 is maintained at a substantially constant size because the height is maintained by the spacer balls 6 dispersed in the outer seal portion 7 and the inner seal portion 8 and the width is maintained by the groove 10 .
  • the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
  • the volume of the filling and containing portion 3 is between the outer seal portion 7 and the inner seal portion 8 so that each of the display substrate 1 and the counter substrate 2 can It is equal to the size of the space 9 sandwiched between the two surface-treated portions 11 which are annularly opposed to each other and treated so as to have a higher affinity for the low melting point metal material 5 compared to the peripheral portion.
  • the surface treatment can be performed by, for example, plasma treatment, chemical treatment, coating of metal or resin, or the like.
  • the volume of the filling and accommodating portion 3 is maintained at a substantially constant size because the height is maintained by the spacer balls 6 dispersed in the outer seal portion 7 and the inner seal portion 8 and the width is maintained by the surface treatment portion 11 Be done. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
  • the inside of the groove 10 of the first modification shown in FIG. 4A may be surface-treated so that the affinity to the low melting point metal material 5 is higher than that of the groove 10.
  • FIG. 5 is a center line sectional view showing a second embodiment of a display device according to the present invention.
  • the filling and accommodating portion 3 in the second embodiment is annularly provided along the peripheral portion of the display substrate 1 and has the same height inside the outer spacer wall 12 and the outer spacer wall 12
  • the inner spacer wall 13 is provided.
  • the volume of the filling receptacle 3 is equal to the size of the space 9 between the outer spacer wall 12 and the inner spacer wall 13.
  • the outer spacer wall 12 and the inner spacer wall 13 can be formed by exposing and developing, for example, a photosensitive acrylic resin or the like coated with a predetermined thickness by a known photolithography technique.
  • An organic adhesive 14 is applied to the outer side of the outer spacer wall 12 and the inner side of the inner spacer wall 13, and the display substrate 1 and the counter substrate 2 are bonded by the organic adhesive 14.
  • the volume of the filling container 3 is maintained because its height is maintained by the outer spacer wall 12 and the inner spacer wall 13 and its width is maintained by the width between the outer spacer wall 12 and the inner spacer wall 13 It is maintained at a substantially constant size. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
  • FIG. 6 is a center line sectional view showing a third embodiment of the display device according to the present invention.
  • the filling and accommodating portion 3 in the third embodiment has its peripheral portion etched by etching the display substrate 1 as shown in FIG. 6A or by etching the opposing substrate 2 as shown in FIG. 6B. And a groove 10 having a predetermined depth provided annularly.
  • the volume of the filling container 3 is equal to the size of the space 9 inside the groove 10 provided in the display substrate 1 or the counter substrate 2.
  • the display substrate 1 or the counter substrate 2 used in the third embodiment is formed by providing a resin layer such as polyimide or acrylic resin that can be etched at least on the opposite surface side.
  • a resin layer such as polyimide or acrylic resin that can be etched at least on the opposite surface side.
  • barrier layers not shown
  • An organic adhesive 14 is applied to the outer side of the outer spacer wall 12 and the inner side of the inner spacer wall 13, and the display substrate 1 and the counter substrate 2 are bonded by the organic adhesive 14.
  • the volume of the filling container 3 is maintained by the depth of the groove 10, that is, by the heights of the outer spacer wall 12 and the inner spacer wall 13, and the width is maintained by the width of the groove 10. Therefore, the size is maintained substantially constant. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
  • the low melting point metal material 5 melted and stored in the groove 10 is applied with the organic adhesive 14 while the counter substrate 2 is on the lower side. After that, the display substrates 1 may be butted and joined.
  • the volume of the filling storage portion 3 for storing the low melting point metal material 5 is formed so as to be maintainable, the low melting point metal filled and stored in the filling storage portion 3 without excess
  • the material 5 can be retained in the filling receptacle 3, ie in the sealing position, with the effect of blocking moisture being maintained. Therefore, it is possible to avoid such a problem as in the prior art that the low melting point metal material 5 flows out from the inside of the filling and accommodating portion 3 to cause a problem such as shorting of the electrical wiring in the periphery.
  • FIG. 7 is a plan view showing a fourth embodiment of the display device according to the present invention, and is a transparent view seen through the opposing substrate.
  • the difference from the first to third embodiments is that, as shown in FIG. 7, one or more of the gas such as air existing in the filling and containing section 3 and the excess low melting point metal material 5 are discharged.
  • the discharge hole 15 is provided in a portion of the filling and accommodating portion 3, for example, a portion of the outer spacer 7.
  • the low melting point metal material 5 is filled in the filling container 3 without excess or deficiency. In this case, in order to reliably obtain the moisture blocking effect of the low melting point metal material 5, it is preferable to roughly fill the low melting point metal material 5 to such an extent that the low melting point metal material 5 does not overflow from the filling container 3.
  • the surplus low melting point metal material 5 is not sufficient at the time of bonding with the counter substrate 2. There is a risk of flowing out of the filling container 3. Therefore, in the fourth embodiment, the excess low melting point metal material 5 is discharged from the discharge hole 15 to the outside.
  • discharge of gas such as air existing in the filling and accommodating portion 3 is performed by, for example, applying ultrasonic vibration to the display device with the discharge hole 15 side up after bonding the opposite substrate 2 to generate gas bubbles. May be moved toward the discharge holes 15 in the molten low melting point metal material 5 and discharged. After the excess low melting point metal material 5 and the gas are exhausted, the exhaust hole 15 is closed by the sealing material.
  • the discharge hole 15 is provided at a portion away from the circuit so that the discharged low melting point metal material 5 does not adversely affect the surrounding electric circuit.
  • FIG. 8 is a center line sectional view showing a fifth embodiment of the display device according to the present invention.
  • the heat resistance of a nickel alloy or the like is applied to the counter substrate 2 side (which may be the display substrate 1 side) corresponding to the filling housing portion 3.
  • a film heater 18 may be provided in which the body 16 is sandwiched by an insulating material 17 such as a polyimide sheet.
  • a space 9 for filling and containing the low melting point metal material 5 of the filling and containing part 3 is provided between the outer seal part 7 and the inner seal part 8 so as to face the display substrate 1 and the counter substrate 2 to form a ring.
  • a metal film such as Ni is used as the surface treated portion 11 in the case of a space sandwiched between two surface treated portions 11 treated such that the affinity with the low melting point metal material 5 is higher than the peripheral portion.
  • a metal film of Ni or the like may be used as the heating resistor 16.
  • the defect can be repaired by causing the low melting point metal material 5 to be melted or annealed by generating heat by supplying current to the metal film such as Ni.
  • the image display area may be a liquid crystal display layer.
  • the display substrate 1 and the counter substrate 2 are flexible substrates, a flexible liquid crystal display can be configured.
  • the display substrate 1 and the counter substrate 2 are not limited to the flexible substrate, and at least one of the display substrate 1 and the counter substrate 2 may be formed of a hard substrate such as glass.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present invention is provided with: a display substrate 1 which includes an organic EL display layer 4 in a central section; a counter substrate 2 which is disposed opposite the display substrate 1; and a filling/containing portion 3 which is provided annularly along the periphery of display substrate 1, and in which a low melting-point metal material 5 for sealing the organic EL display layer 4 between the display substrate 1 and the counter substrate 2 is filled and accommodated. The filling/containing portion 3 is formed so that a volume for filling and accommodating the low melting-point metal material 5 can be maintained. In this way, a water shield effect is maintained, and a molten low melting-point metal material can be kept remaining in a sealing position.

Description

表示装置Display device
　本発明は、表示基板と対向基板とをその周縁部で低融点金属材料により封止した表示装置に関し、特に水分の遮断効果を維持すると共に、溶融した低融点金属材料を封止位置に留め置くことができるようにした表示装置に係るものである。 The present invention relates to a display device in which a display substrate and an opposite substrate are sealed with a low melting point metal material at the periphery thereof, and in particular, maintains a water blocking effect and holds a molten low melting point metal material in a sealing position. It relates to the display device which made it possible.
　従来のこの種の表示装置は、有機ＥＬ層を含む画素がマトリクス状に配列されたアレイ基板と対向基板との間の縁部に形成されたシール内部に、融点が１３０℃以下の低融点金属よりなる水分遮断部が形成されたものとなっていた（例えば、特許文献１参照）。 A conventional display of this type is a low melting metal having a melting point of 130 ° C. or less inside a seal formed at the edge between an array substrate and an opposing substrate in which pixels including an organic EL layer are arranged in a matrix. A water blocking portion composed of the above was formed (see, for example, Patent Document 1).
特開２０１５－２２２６４４号公報JP, 2015-222644, A
　しかし、このような従来の表示装置は、アレイ基板に接着剤を塗布して形成した外シールと内シールとの間に低融点金属を充填した後、外シールと内シールを介して対向基板とアレイ基板とを貼り合せるものであるため、貼り合せ時の押圧力が強い場合には、シールが変形してシール内の容積が変化し、シール内部に充填された低融点金属が外に流れ出して周辺の電気配線を短絡させてしまうという問題がある。 However, in such a conventional display device, after filling the low melting point metal between the outer seal and the inner seal formed by applying the adhesive to the array substrate, the conventional display device and the counter substrate are formed via the outer seal and the inner seal. Since the array substrate is bonded, if the pressing force at the time of bonding is strong, the seal is deformed to change the volume in the seal, and the low melting metal filled in the seal flows out. There is a problem that the electrical wiring in the periphery is shorted.
　また、特許文献１に記載されているように、低融点金属の量は、内シールと外シールとよりも少なく充填するのが望ましいことから、貼り合せ時の押圧力が弱い場合には、シールの変形が小さいためシール内部の低融点金属が対向基板に接触せず、水分の遮断効果が低下してしまうという問題がある。 In addition, as described in Patent Document 1, it is desirable that the amount of low melting point metal be less than that of the inner seal and the outer seal, so when the pressing force at the time of bonding is weak, the seal There is a problem that the low melting point metal inside the seal does not come in contact with the counter substrate because the deformation of the seal is small, and the water blocking effect is reduced.
　そこで、本発明は、このような問題点に対処し、水分の遮断効果を維持すると共に、溶融した低融点金属材料を封止位置に留め置くことができるようにした表示装置を提供することを目的とする。 Therefore, it is an object of the present invention to provide a display device which copes with such problems and maintains the effect of blocking water while keeping molten low melting point metal material in the sealing position. To aim.
　上記目的を達成するために、本発明による表示装置は、中央部に画像表示領域を有する表示基板と、前記表示基板に対向配置される対向基板と、前記表示基板の周縁部に沿って環状に設けられ、前記画像表示領域を前記表示基板と前記対向基板との間に封止するための低融点金属材料を充填収容する充填収容部と、を備え、前記充填収容部は、前記低融点金属材料を充填収容する容積が維持可能に形成されている。 In order to achieve the above object, in the display device according to the present invention, a display substrate having an image display area at a central portion, an opposing substrate disposed opposite to the display substrate, and a ring along a peripheral portion of the display substrate And a filling and containing section for filling and containing a low melting point metal material for sealing the image display area between the display substrate and the counter substrate, the filling and containing section comprising the low melting point metal The volume for filling and containing the material is formed to be maintainable.
　本発明によれば、低融点金属材料を収容する充填収容部の容積が維持可能に形成されているため、充填収容部に過不足なく充填収容された低融点金属材料は、水分の遮断効果を維持した状態で充填収容部内、即ち封止位置に留め置くことができる。したがって、従来技術におけるような、低融点金属材料が充填収容部内から流れ出して周辺の電気配線を短絡させる、という問題を回避することができる。 According to the present invention, since the volume of the filling storage portion for storing the low melting point metal material is formed so as to be maintainable, the low melting point metal material filled and contained in the filling storage portion without excess and deficiency has a moisture blocking effect. It can be retained in the filling receptacle, i.e. in the sealing position, in the maintained state. Therefore, it is possible to avoid the problem that the low melting point metal material flows out from the inside of the filling container and shorts the peripheral electrical wiring as in the prior art.
本発明による表示装置の第１の実施形態を示す平面図であり、対向基板を透過して見た透視図である。FIG. 1 is a plan view showing a first embodiment of a display device according to the present invention, and is a transparent view seen through an opposing substrate. 図１の中心線断面図である。It is a centerline sectional view of FIG. 表示基板と対向基板とのシールについて説明する中心線断面図である。It is a center line sectional view explaining a seal of a display substrate and a counter substrate. 上記第１の実施形態におけるシールの変形例を示す中心線断面図であり、（ａ）は第１の変形例を示し、（ｂ）は第２の変形例を示す。It is center-line sectional drawing which shows the modification of the seal | sticker in the said 1st Embodiment, (a) shows a 1st modification, (b) shows a 2nd modification. 本発明による表示装置の第２の実施形態を示す中心線断面図である。FIG. 5 is a centerline cross-sectional view of a second embodiment of a display device according to the present invention; 本発明による表示装置の第３の実施形態を示す中心線断面図であり、（ａ）は低融点金属材料の充填収容部を表示基板に設けた例を示し、（ｂ）は充填収容部を対向基板に設けた例を示す。It is a centerline sectional view showing a 3rd embodiment of a display device by the present invention, and (a) shows an example which provided a filling accommodation part of low melting metal material in a display substrate, (b) shows a filling accommodation part The example provided in the opposing board | substrate is shown. 本発明による表示装置の第４の実施形態を示す平面図であり、対向基板を透過して見た透視図である。It is a top view which shows 4th Embodiment of the display device by this invention, and is the see-through | perspective view seen through the opposing board | substrate. 本発明による表示装置の第５の実施形態を示す中心線断面図である。FIG. 5 is a centerline cross-sectional view of a fifth embodiment of a display device according to the present invention;
　以下、本発明の実施形態を添付図面に基づいて詳細に説明する。図１は本発明による表示装置の第１の実施形態を示す平面図であり、対向基板を透過して見た透視図である。また、図２は図１の中心線断面図である。この表示装置は、水分等が画像表示領域に侵入するのを防止し得るようにしたもので、表示基板１と、対向基板２と、充填収容部３と、を備えて構成されている。 Hereinafter, embodiments of the present invention will be described in detail based on the attached drawings. FIG. 1 is a plan view showing a first embodiment of a display device according to the present invention, and is a transparent view seen through an opposing substrate. FIG. 2 is a center line cross-sectional view of FIG. This display device is configured to prevent moisture and the like from invading the image display area, and is configured to include a display substrate 1, an opposing substrate 2, and a filling container 3.
　上記表示基板１は、中央部に画像表示領域を有するもので、この画像表示領域に設けられた、例えば有機ＥＬ表示層４を支持するものである。詳細には、表示基板１は、フレキシブル基板であり、水分や酸素に対して高いバリア性を有すると共に、屈曲性、耐熱性、エッチング耐性，発光デバイスに必要な光学特性を有するもので、例えばポリイミドとポリエチレンテレフタレート（ＰＥＴ）との積層構造等であり、公知のバリアフィルムを使用することができる。 The display substrate 1 has an image display area at the center, and supports, for example, the organic EL display layer 4 provided in the image display area. Specifically, the display substrate 1 is a flexible substrate having high barrier properties against moisture and oxygen, as well as flexibility, heat resistance, etching resistance, and optical properties necessary for a light emitting device, such as polyimide And the like, and a known barrier film can be used.
　ここで、上記有機ＥＬ表示層４は、表示基板１側から陽極、正孔輸送層、発光層、電子輸送層、陰極を積層形成した有機ＥＬ層の画素をマトリクス状に配置したもので、外部から供給される映像信号に応じて発光して映像を表示する表示層となるものである。 Here, the organic EL display layer 4 is formed by arranging in a matrix the pixels of an organic EL layer formed by laminating an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode from the display substrate 1 side. It becomes a display layer which emits light according to the video signal supplied from and displays a video.
　上記表示基板１に対向して対向基板２が設けられている。この対向基板２は、外部から水分及び酸素が侵入するのを防止して有機ＥＬ表示層４を保護するバリア層として機能するものであり、例えば可視光を透過する透明な樹脂フィルムとシリコン窒化膜等の無機膜とを積層して形成したもので、公知の封止膜層を使用することができる。 An opposing substrate 2 is provided to face the display substrate 1. The counter substrate 2 functions as a barrier layer that protects the organic EL display layer 4 by preventing moisture and oxygen from entering from the outside, and, for example, a transparent resin film and a silicon nitride film that transmits visible light. And the like, and a known sealing film layer can be used.
　上記表示基板１の周縁部に沿って環状に充填収容部３が設けられている。この充填収容部３は、上記有機ＥＬ表示層４を表示基板１と対向基板２との間に封止するための低融点金属材料５を充填収容するものであり、低融点金属材料５を充填収容する容積が維持可能に形成されている。 Along the peripheral edge portion of the display substrate 1, the filling and accommodating portion 3 is provided annularly. The filling and containing section 3 is for filling and containing a low melting point metal material 5 for sealing the organic EL display layer 4 between the display substrate 1 and the counter substrate 2, and is filled with the low melting point metal material 5. The volume to accommodate is formed maintainable.
　詳細には、充填収容部３の上記容積は、図２に示すように、スペーサボール６を均一に分散させて有する外シール部７と、該外シール部７に沿ってその内側に設けられ、上記スペーサボール６と同じ径のスペーサボール６を分散させて有する内シール部８との間の空間９の大きさに等しい。 Specifically, as shown in FIG. 2, the above-mentioned volume of the filling and accommodating portion 3 is provided on the inner side along the outer seal portion 7 and the outer seal portion 7 having the spacer balls 6 uniformly dispersed, It is equal to the size of the space 9 between the spacer ball 6 and the inner seal portion 8 in which the spacer balls 6 having the same diameter are dispersed.
　上記外シール部７と内シール部８とは、例えば数μｍのガラスやシリカ粒子等のスペーサボール６を分散させて有する有機接着剤を表示基板１の周縁部に沿って、ディスペンサー等を使用して予め定められた所定の高さ及び間隔で形成したものである。有機接着剤としては、熱硬化型、熱可塑性、熱圧着型又はＵＶ硬化型等の公知の接着剤を適宜使用することができる。 The outer seal portion 7 and the inner seal portion 8 use, for example, a dispenser or the like along the peripheral portion of the display substrate 1 with an organic adhesive having the spacer balls 6 such as glass or silica particles dispersed by several μm. Are formed at predetermined heights and intervals determined in advance. As the organic adhesive, known adhesives such as thermosetting type, thermoplasticity, thermocompression bonding type or UV curing type can be suitably used.
　図３は表示基板１と対向基板２とのシールについて説明する中心線断面図である。
　先ず、図３（ａ）に示すように、上記外シール部７と内シール部８とに挟まれた空間９には、加熱溶融した低融点金属材料５が例えばディスペンサーを使用して又はインクジェットにより過不足なく充填される。低融点金属材料５の充填量は、充填収容部３の容積が維持可能であるため、計算又は実験等により容易に決定することができる。 FIG. 3 is a center line sectional view for explaining the seal between the display substrate 1 and the counter substrate 2.
First, as shown in FIG. 3A, in the space 9 sandwiched between the outer seal portion 7 and the inner seal portion 8, the low melting point metal material 5 heated and melted is, for example, using a dispenser or by inkjet Filled with just enough. The filling amount of the low melting point metal material 5 can be easily determined by calculation, experiment, or the like because the volume of the filling container 3 can be maintained.
　この場合、使用する低融点金属材料５としては、有機ＥＬ表示層４の耐熱温度よりも融点が低い材料が選択される。有機ＥＬ材料の耐熱温度は、一般に百数十度と言われている。また、高分子有機ＥＬ材料は、２００℃を超える高い耐熱温度を有している。したがって、低融点金属材料５としては、融点が２００℃以下の低融点金属又は低融点合金が選択される。因みに、Ｓｎ―Ｂｉ－Ｃｕ合金は、融点が１７０℃程度であり、Ｓｎ―Ｂｉ－Ａｇ合金は、融点が１３０℃程度である。また、Ｂｉ－Ｓｂ－Ｉｎ合金は、融点が６０℃～７０℃と極めて低温の材料である。 In this case, as the low melting point metal material 5 to be used, a material whose melting point is lower than the heat resistance temperature of the organic EL display layer 4 is selected. The heat resistance temperature of the organic EL material is generally said to be a hundred and several tens degrees. In addition, the high molecular weight organic EL material has a high heat resistance temperature exceeding 200 ° C. Therefore, as the low melting point metal material 5, a low melting point metal or a low melting point alloy having a melting point of 200 ° C. or less is selected. Incidentally, the melting point of the Sn-Bi-Cu alloy is about 170 ° C., and the melting point of the Sn-Bi-Ag alloy is about 130 ° C. In addition, the Bi-Sb-In alloy is a material having a very low melting point of 60 ° C. to 70 ° C.
　表示基板１と対向基板２とを対面させて接合する際には、図３（ｂ）に示すように、表示基板１及び対向基板２の少なくとも何れか一方側から加圧される。その後、外及び内シール部７，８に対向基板２側から例えば紫外線が照射されて硬化され、表示基板１と対向基板２とが接合される。この場合、表示基板１と対向基板２と間の隙間は、上記スペーサボール６によって維持される。したがって、外シール部７と内シール部８とに挟まれた空間９の大きさ、即ち、充填収容部３の低融点金属材料５を充填収容する容積は、両基板の接合後も初期状態が略維持されることになる。それ故、充填収容部３に過不足なく充填収容された低融点金属材料５は、水分の遮断効果を維持した状態で充填収容部３内に留め置かれ、充填収容部３から流れ出して周辺の電気配線を短絡させる等の不具合を生じさせるおそれがない。 When the display substrate 1 and the opposing substrate 2 are faced to each other and joined, as shown in FIG. 3B, pressure is applied from at least one side of the display substrate 1 and the opposing substrate 2. Thereafter, for example, ultraviolet light is irradiated to the outer and inner seal portions 7 and 8 from the side of the counter substrate 2 to be cured, and the display substrate 1 and the counter substrate 2 are bonded. In this case, the space between the display substrate 1 and the counter substrate 2 is maintained by the spacer balls 6. Therefore, the size of the space 9 sandwiched between the outer seal portion 7 and the inner seal portion 8, that is, the volume for filling and storing the low melting point metal material 5 of the filling and storing portion 3 has an initial state after bonding both substrates. It will be almost maintained. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and is peripheral There is no risk of causing problems such as shorting of electrical wiring.
　図４は上記第１の実施形態におけるシールの変形例を示す中心線断面図であり、（ａ）は第１の変形例を示し、（ｂ）は第２の変形例を示す。
　第１の変形例においては、充填収容部３の容積は、図４（ａ）に示すように、外シール部７と内シール部８との間にあって、表示基板１及び対向基板２の夫々に、互いに対向させて環状に設けられた２つの溝１０に挟まれた空間９の大きさに等しい。充填収容部３の容積は、外シール部７及び内シール部８に分散したスペーサボール６によって高さが維持され、上記溝１０によって幅が維持されるため、略一定の大きさに維持される。したがって、充填収容部３に過不足なく充填収容された低融点金属材料５は、水分の遮断効果を維持した状態で充填収容部３内に留め置かれ、充填収容部３から流れ出して周辺の電気配線を短絡させる等の不具合を生じさせるおそれがない。 FIG. 4 is a center line sectional view showing a modified example of the seal in the first embodiment, (a) shows a first modified example, and (b) shows a second modified example.
In the first modified example, as shown in FIG. 4A, the volume of the filling and containing portion 3 is between the outer seal portion 7 and the inner seal portion 8 and is provided for each of the display substrate 1 and the counter substrate 2. It is equal to the size of the space 9 sandwiched between the two grooves 10 annularly provided facing each other. The volume of the filling and containing portion 3 is maintained at a substantially constant size because the height is maintained by the spacer balls 6 dispersed in the outer seal portion 7 and the inner seal portion 8 and the width is maintained by the groove 10 . Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
　第２の変形例においては、充填収容部３の容積は、図４（ｂ）のように、外シール部７と内シール部８との間にあって、表示基板１及び対向基板２の夫々に、互いに対向させて環状に設けられ、低融点金属材料５との親和性が周辺部に比べて高くなるように処理された２つの表面処理部１１に挟まれた空間９の大きさに等しい。この場合、表面処理は、例えばプラズマ処理、薬液処理、金属や樹脂のコーティング等により行うことができる。金属による場合には、低融点金属材料５との親和性の高いＮｉやＣｕ等の金属膜を成膜するとよい。充填収容部３の容積は、外シール部７及び内シール部８に分散したスペーサボール６によって高さが維持され、上記表面処理部１１によって幅が維持されるため、略一定の大きさに維持される。したがって、充填収容部３に過不足なく充填収容された低融点金属材料５は、水分の遮断効果を維持した状態で充填収容部３内に留め置かれ、充填収容部３から流れ出して周辺の電気配線を短絡させる等の不具合を生じさせるおそれがない。なお、図４（ａ）に示す第１の変形例の溝１０内を低融点金属材料５との親和性が溝１０外に比べて高くなるように表面処理してもよい。 In the second modified example, as shown in FIG. 4B, the volume of the filling and containing portion 3 is between the outer seal portion 7 and the inner seal portion 8 so that each of the display substrate 1 and the counter substrate 2 can It is equal to the size of the space 9 sandwiched between the two surface-treated portions 11 which are annularly opposed to each other and treated so as to have a higher affinity for the low melting point metal material 5 compared to the peripheral portion. In this case, the surface treatment can be performed by, for example, plasma treatment, chemical treatment, coating of metal or resin, or the like. In the case of using a metal, it is preferable to form a metal film such as Ni or Cu having high affinity with the low melting point metal material 5. The volume of the filling and accommodating portion 3 is maintained at a substantially constant size because the height is maintained by the spacer balls 6 dispersed in the outer seal portion 7 and the inner seal portion 8 and the width is maintained by the surface treatment portion 11 Be done. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring. The inside of the groove 10 of the first modification shown in FIG. 4A may be surface-treated so that the affinity to the low melting point metal material 5 is higher than that of the groove 10.
　図５は本発明による表示装置の第２の実施形態を示す中心線断面図である。
　ここでは、第１の実施形態と異なる部分、即ち、充填収容部３について説明する。
　第２の実施形態における充填収容部３は、表示基板１の周縁部に沿って環状に設けられ外スペーサ壁１２と、該外スペーサ壁１２に沿ってその内側に、同じ高さを有して設けられた内スペーサ壁１３とで構成されている。この場合、充填収容部３の容積は、外スペーサ壁１２と内スペーサ壁１３との間の空間９の大きさに等しい。上記外スペーサ壁１２及び内スペーサ壁１３は、所定の厚みで塗布された例えば感光性のアクリル樹脂等を公知のフォトリソグラフィ技術により露光現像して形成することができる。 FIG. 5 is a center line sectional view showing a second embodiment of a display device according to the present invention.
Here, portions different from the first embodiment, that is, the filling and accommodating portion 3 will be described.
The filling and accommodating portion 3 in the second embodiment is annularly provided along the peripheral portion of the display substrate 1 and has the same height inside the outer spacer wall 12 and the outer spacer wall 12 The inner spacer wall 13 is provided. In this case, the volume of the filling receptacle 3 is equal to the size of the space 9 between the outer spacer wall 12 and the inner spacer wall 13. The outer spacer wall 12 and the inner spacer wall 13 can be formed by exposing and developing, for example, a photosensitive acrylic resin or the like coated with a predetermined thickness by a known photolithography technique.
　外スペーサ壁１２の外側及び内スペーサ壁１３の内側には、有機接着剤１４が塗布されており、この有機接着剤１４により表示基板１と対向基板２が接合される。この場合、充填収容部３の容積は、その高さが外スペーサ壁１２及び内スペーサ壁１３によって維持され、幅が外スペーサ壁１２と内スペーサ壁１３との間の幅によって維持されるため、略一定の大きさに維持される。したがって、充填収容部３に過不足なく充填収容された低融点金属材料５は、水分の遮断効果を維持した状態で充填収容部３内に留め置かれ、充填収容部３から流れ出して周辺の電気配線を短絡させる等の不具合を生じさせるおそれがない。 An organic adhesive 14 is applied to the outer side of the outer spacer wall 12 and the inner side of the inner spacer wall 13, and the display substrate 1 and the counter substrate 2 are bonded by the organic adhesive 14. In this case, the volume of the filling container 3 is maintained because its height is maintained by the outer spacer wall 12 and the inner spacer wall 13 and its width is maintained by the width between the outer spacer wall 12 and the inner spacer wall 13 It is maintained at a substantially constant size. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
　図６は本発明による表示装置の第３の実施形態を示す中心線断面図である。
　ここでは、第１の実施形態と異なる部分、即ち、充填収容部３について説明する。
　第３の実施形態における充填収容部３は、図６（ａ）に示すように表示基板１をエッチングして、又は図６（ｂ）に示すように対向基板２をエッチングして、その周縁部に沿って環状に設けられた所定の深さを有する溝１０である。この場合、充填収容部３の容積は、表示基板１又は対向基板２に設けられた溝１０の内部の空間９の大きさに等しい。 FIG. 6 is a center line sectional view showing a third embodiment of the display device according to the present invention.
Here, portions different from the first embodiment, that is, the filling and accommodating portion 3 will be described.
The filling and accommodating portion 3 in the third embodiment has its peripheral portion etched by etching the display substrate 1 as shown in FIG. 6A or by etching the opposing substrate 2 as shown in FIG. 6B. And a groove 10 having a predetermined depth provided annularly. In this case, the volume of the filling container 3 is equal to the size of the space 9 inside the groove 10 provided in the display substrate 1 or the counter substrate 2.
　なお、上記溝１０を形成するとき、表示基板１又は対向基板２は、その中央領域及び周縁部も同時にエッチングして掘り下げられる。これにより、溝１０の両側には、表示基板１と対向基板２との間に一定の隙間を確保するための外スペーサ壁１２及び内スペーサ壁１３が形成される。このように、第３の実施形態において使用する表示基板１又は対向基板２は、少なくとも対向面側にエッチング可能な、例えばポリイミドやアクリル樹脂等の樹脂層を備えて形成される。この場合、水分等が有機ＥＬ表示層に侵入するのを防止するために、少なくとも有機ＥＬ表示層４の上下に図示省略のバリア層を設けるのが望ましい。 When the groove 10 is formed, the central region and the peripheral portion of the display substrate 1 or the counter substrate 2 are simultaneously etched and dug down. Thereby, the outer spacer wall 12 and the inner spacer wall 13 for securing a fixed gap between the display substrate 1 and the counter substrate 2 are formed on both sides of the groove 10. As described above, the display substrate 1 or the counter substrate 2 used in the third embodiment is formed by providing a resin layer such as polyimide or acrylic resin that can be etched at least on the opposite surface side. In this case, in order to prevent moisture and the like from intruding into the organic EL display layer, it is desirable to provide barrier layers (not shown) above and below the organic EL display layer 4 at least.
　上記外スペーサ壁１２の外側及び内スペーサ壁１３の内側には、有機接着剤１４が塗布されており、この有機接着剤１４により表示基板１と対向基板２が接合される。この場合、充填収容部３の容積は、その高さが上記溝１０の深さ、即ち外スペーサ壁１２及び内スペーサ壁１３の高さによって維持され、幅が上記溝１０の幅によって維持されるため、略一定の大きさに維持される。したがって、充填収容部３に過不足なく充填収容された低融点金属材料５は、水分の遮断効果を維持した状態で充填収容部３内に留め置かれ、充填収容部３から流れ出して周辺の電気配線を短絡させる等の不具合を生じさせるおそれがない。 An organic adhesive 14 is applied to the outer side of the outer spacer wall 12 and the inner side of the inner spacer wall 13, and the display substrate 1 and the counter substrate 2 are bonded by the organic adhesive 14. In this case, the volume of the filling container 3 is maintained by the depth of the groove 10, that is, by the heights of the outer spacer wall 12 and the inner spacer wall 13, and the width is maintained by the width of the groove 10. Therefore, the size is maintained substantially constant. Therefore, the low melting point metal material 5 filled and contained in the filling and containing part 3 without excess and deficiency is retained in the filling and containing part 3 while maintaining the water blocking effect, and flows out from the filling and containing part 3 and the surrounding electricity There is no risk of causing problems such as shorting the wiring.
　ここで、対向基板２に上記溝１０が形成される場合には、対向基板２を下側にした状態で溝１０に溶融した低融点金属材料５を充填収容すると共に有機接着剤１４を塗布した後、表示基板１を突き合わせて接合するとよい。 Here, in the case where the groove 10 is formed in the counter substrate 2, the low melting point metal material 5 melted and stored in the groove 10 is applied with the organic adhesive 14 while the counter substrate 2 is on the lower side. After that, the display substrates 1 may be butted and joined.
　以上説明したように本発明によれば、低融点金属材料５を収容する充填収容部３の容積が維持可能に形成されているため、充填収容部３に過不足なく充填収容された低融点金属材料５は、水分の遮断効果を維持した状態で充填収容部３内、即ち封止位置に留め置くことができる。したがって、従来技術におけるような、低融点金属材料５が充填収容部３内から流れ出して周辺の電気配線を短絡させる等の不具合を生じさせる問題を回避することができる。 As described above, according to the present invention, since the volume of the filling storage portion 3 for storing the low melting point metal material 5 is formed so as to be maintainable, the low melting point metal filled and stored in the filling storage portion 3 without excess The material 5 can be retained in the filling receptacle 3, ie in the sealing position, with the effect of blocking moisture being maintained. Therefore, it is possible to avoid such a problem as in the prior art that the low melting point metal material 5 flows out from the inside of the filling and accommodating portion 3 to cause a problem such as shorting of the electrical wiring in the periphery.
　図７は本発明による表示装置の第４の実施形態を示す平面図であり、対向基板を透過して見た透視図である。
　上記第１～第３の実施形態との相違点は、図７に示すように、充填収容部３内に存在する空気等のガスや余剰の低融点金属材料５を排出するための１つ以上の排出孔１５を充填収容部３の一部、例えば外スペーサ７の一部に設けている点である。充填収容部３内には、低融点金属材料５が過不足なく充填される。この場合、低融点金属材料５による水分の遮断効果を確実に得るためには、充填収容部３から低融点金属材料５があふれ出ない程度に大目に充填するのがよい。 FIG. 7 is a plan view showing a fourth embodiment of the display device according to the present invention, and is a transparent view seen through the opposing substrate.
The difference from the first to third embodiments is that, as shown in FIG. 7, one or more of the gas such as air existing in the filling and containing section 3 and the excess low melting point metal material 5 are discharged. The discharge hole 15 is provided in a portion of the filling and accommodating portion 3, for example, a portion of the outer spacer 7. The low melting point metal material 5 is filled in the filling container 3 without excess or deficiency. In this case, in order to reliably obtain the moisture blocking effect of the low melting point metal material 5, it is preferable to roughly fill the low melting point metal material 5 to such an extent that the low melting point metal material 5 does not overflow from the filling container 3.
　しかしながら、充填収容部３が上記第１～第３の実施形態のように完全に閉じられた構造を有している場合には、対向基板２との接合時に、余剰の低融点金属材料５が充填収容部３から流れ出す恐れがある。そこで、第４の実施形態においては、余剰の低融点金属材料５は、排出孔１５から外部に排出させるようにしている。また、充填収容部３内に存在する空気等のガスの排出は、例えば対向基板２を接合した後、排出孔１５側を上にした状態で表示装置に超音波振動を与えて、ガスの気泡を溶融した低融点金属材料５中を排出孔１５に向けて移動させ、排出してもよい。余剰の低融点金属材料５及びガスが排出された後には、排出孔１５は、シール材により閉じられる。なお、排出孔１５は、排出された低融点金属材料５が周辺の電気回路に悪影響を及ぼさないように回路から離れた部分に設けられる。 However, in the case where the filling and accommodating portion 3 has a completely closed structure as in the first to third embodiments, the surplus low melting point metal material 5 is not sufficient at the time of bonding with the counter substrate 2. There is a risk of flowing out of the filling container 3. Therefore, in the fourth embodiment, the excess low melting point metal material 5 is discharged from the discharge hole 15 to the outside. In addition, discharge of gas such as air existing in the filling and accommodating portion 3 is performed by, for example, applying ultrasonic vibration to the display device with the discharge hole 15 side up after bonding the opposite substrate 2 to generate gas bubbles. May be moved toward the discharge holes 15 in the molten low melting point metal material 5 and discharged. After the excess low melting point metal material 5 and the gas are exhausted, the exhaust hole 15 is closed by the sealing material. The discharge hole 15 is provided at a portion away from the circuit so that the discharged low melting point metal material 5 does not adversely affect the surrounding electric circuit.
　図８は本発明による表示装置の第５の実施形態を示す中心線断面図である。
　上記第１～第４の実施形態との相違点は、図８に示すように、充填収容部３に対応して対向基板２側（表示基板１側でもよい）に、ニッケル合金等の発熱抵抗体１６をポリイミドシート等の絶縁材１７で挟み込んだフィルムヒータ１８を設けてもよい。これにより、表示装置が折り曲げ使用されるものである場合には、繰り返しの折り曲げ使用によるストレスで低融点金属材料５にクラックやひび割れ等の欠陥が発生しても、フィルムヒータ１８により低融点金属材料５を加熱して溶融させ又はアニールすることにで、上記欠陥を修復させることができる。 FIG. 8 is a center line sectional view showing a fifth embodiment of the display device according to the present invention.
The difference from the first to fourth embodiments is that, as shown in FIG. 8, the heat resistance of a nickel alloy or the like is applied to the counter substrate 2 side (which may be the display substrate 1 side) corresponding to the filling housing portion 3. A film heater 18 may be provided in which the body 16 is sandwiched by an insulating material 17 such as a polyimide sheet. Thereby, when the display device is used in bending, even if defects such as cracks or cracks occur in the low melting point metal material 5 due to stress due to repeated bending use, the low melting point metal material is used by the film heater 18 The defects can be repaired by heating and melting 5 or annealing.
　また、充填収容部３の低融点金属材料５を充填収容する空間９が外シール部７と内シール部８との間にあって、表示基板１及び対向基板２に互いに対向させて環状に設けられ、低融点金属材料５との親和性が周辺部に比べて高くなるように処理された２つの表面処理部１１に挟まれた空間である場合に、表面処理部１１としてＮｉ等の金属膜が使用されるときには、Ｎｉ等の金属膜を発熱抵抗体１６として使用してもよい。これにより、Ｎｉ等の金属膜に通電することにより発熱させて低融点金属材料５を溶融させ又はアニールすることにで、上記欠陥を修復させることができる。 Further, a space 9 for filling and containing the low melting point metal material 5 of the filling and containing part 3 is provided between the outer seal part 7 and the inner seal part 8 so as to face the display substrate 1 and the counter substrate 2 to form a ring. A metal film such as Ni is used as the surface treated portion 11 in the case of a space sandwiched between two surface treated portions 11 treated such that the affinity with the low melting point metal material 5 is higher than the peripheral portion. When heating, a metal film of Ni or the like may be used as the heating resistor 16. Thus, the defect can be repaired by causing the low melting point metal material 5 to be melted or annealed by generating heat by supplying current to the metal film such as Ni.
　以上の説明においては、画像表示領域が有機ＥＬ表示層４の場合について述べたが、画像表示領域は、液晶表示層であってもよい。この場合、表示基板１及び対向基板２をフレキシブルな基板とすればフレキシブル液晶表示装置を構成することができる。 Although the case where the image display area is the organic EL display layer 4 has been described in the above description, the image display area may be a liquid crystal display layer. In this case, if the display substrate 1 and the counter substrate 2 are flexible substrates, a flexible liquid crystal display can be configured.
　また、表示基板１及び対向基板２はフレキシブル基板に限られず、表示基板１及び対向基板２の少なくとも何れか一方をガラス等の硬質基板で構成してもよい。 Further, the display substrate 1 and the counter substrate 2 are not limited to the flexible substrate, and at least one of the display substrate 1 and the counter substrate 2 may be formed of a hard substrate such as glass.
　１…表示基板
　２…対向基板
　３…充填収容部
　４…有機ＥＬ表示層（画像表示領域）
　５…低融点金属材料
　６…スペーサボール
　７…外シール部
　８…内シール部
　９…空間
　１０…溝
　１１…表面処理部
　１２…外スペーサ壁
　１３…内スペーサ壁
　１５…排出孔 DESCRIPTION OF SYMBOLS 1 ... Display board | substrate 2 ... Opposite board | substrate 3 ... Filling accommodating part 4 ... Organic electroluminescence display layer (image display area)
5 low melting point metal material 6 spacer ball 7 outer seal portion 8 inner seal portion 9 space 10 groove 11 surface treatment portion 12 outer spacer wall 13 inner spacer wall 15 discharge hole

Claims (9)

  1. 　中央部に画像表示領域を有する表示基板と、
    　前記表示基板に対向配置される対向基板と、
    　前記表示基板の周縁部に沿って環状に設けられ、前記画像表示領域を前記表示基板と前記対向基板との間に封止するための低融点金属材料を充填収容する充填収容部と、
    を備え、
    　前記充填収容部は、前記低融点金属材料を充填収容する容積が維持可能に形成されていることを特徴とする表示装置。     A display substrate having an image display area in the center,
    An opposing substrate disposed opposite to the display substrate;
    A filling housing portion provided annularly along the peripheral portion of the display substrate, and filling and storing a low melting point metal material for sealing the image display region between the display substrate and the counter substrate;
    Equipped with
    The display device, wherein the filling and containing portion is formed to be able to maintain a volume for filling and containing the low melting point metal material.
  2. 　前記充填収容部の容積は、スペーサボールを分散させて有する外シール部と、該外シール部に沿ってその内側に設けられ、前記スペーサボールと同じ径のスペーサボールを分散させて有する内シール部との間の空間の大きさに等しいことを特徴とする請求項１記載の表示装置。 The volume of the filling and containing portion is an outer seal portion having dispersed spacer balls, and an inner seal portion provided along the outer seal portion and inside the spacer portion having the same diameter as the spacer balls. The display device according to claim 1, characterized in that the size of the space between and.
  3. 　前記充填収容部の容積は、前記外シール部と前記内シール部との間にあって、前記表示基板及び前記対向基板の夫々に、互いに対向させて環状に設けられた２つの溝に挟まれた空間の大きさに等しいことを特徴とする請求項２記載の表示装置。 A space between the outer seal portion and the inner seal portion, the volume of the filling and containing portion being a space sandwiched by two grooves annularly provided facing each other on the display substrate and the counter substrate. The display device according to claim 2, characterized in that it is equal to the size of.
  4. 　前記充填収容部の容積は、前記外シール部と前記内シール部との間にあって、前記表示基板及び前記対向基板の夫々に、互いに対向させて環状に設けられ、前記低融点金属材料との親和性が周辺部に比べて高くなるように処理された２つの表面処理部に挟まれた空間の大きさに等しいことを特徴とする請求項２又は３記載の表示装置。 The volume of the filling and containing portion is between the outer seal portion and the inner seal portion, and is annularly provided on each of the display substrate and the counter substrate so as to face each other, and is compatible with the low melting point metal material. 4. The display device according to claim 2, wherein the size of the space between the two surface-treated portions processed to be higher than that of the peripheral portion is equal to the size of the space.
  5. 　前記充填収容部の一部には、余剰の前記低融点金属材料を排出するための一つ以上の排出口が設けられていることを特徴とする請求項４記載の表示装置。 5. The display device according to claim 4, wherein one or more discharge ports for discharging the surplus low melting point metal material are provided in a part of the filling and storing unit.
  6. 　前記充填収容部の容積は、外スペーサ壁と、該外スペーサ壁に沿ってその内側に、同じ高さを有して設けられた内スペーサ壁との間の空間の大きさに等しいことを特徴とする請求項１記載の表示装置。 The volume of the filling container is characterized by the size of the space between the outer spacer wall and the inner spacer wall provided along the outer spacer wall and having the same height on the inner side thereof. The display device according to claim 1, wherein
  7. 　前記充填収容部の容積は、前記表示基板又は前記対向基板に設けられた溝内部の空間の大きさに等しいことを特徴とする請求項１記載の表示装置。 The display device according to claim 1, wherein a volume of the filling and accommodating portion is equal to a size of a space inside a groove provided in the display substrate or the counter substrate.
  8. 　前記充填収容部の一部には、余剰の前記低融点金属材料を排出するための一つ以上の排出口が設けられていることを特徴とする請求項１～３，６，７のいずれか１項に記載の表示装置。 The discharge container according to any one of claims 1 to 3, 6 and 7, wherein at least a part of the filling and storing part is provided with one or more discharge ports for discharging the surplus low melting point metal material. The display device according to item 1.
  9. 　前記画像表示領域は、有機ＥＬ層の画素をマトリクス状に配置して備えた有機ＥＬ表示層であることを特徴とする請求項１記載の表示装置。
          The display device according to claim 1, wherein the image display area is an organic EL display layer provided by arranging pixels of the organic EL layer in a matrix.
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