WO2018228104A1 - 激光切割设备及控制方法和控制装置 - Google Patents

激光切割设备及控制方法和控制装置 Download PDF

Info

Publication number
WO2018228104A1
WO2018228104A1 PCT/CN2018/086603 CN2018086603W WO2018228104A1 WO 2018228104 A1 WO2018228104 A1 WO 2018228104A1 CN 2018086603 W CN2018086603 W CN 2018086603W WO 2018228104 A1 WO2018228104 A1 WO 2018228104A1
Authority
WO
WIPO (PCT)
Prior art keywords
counter
laser
cutting
substrate
laser cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/086603
Other languages
English (en)
French (fr)
Inventor
刘平
胡庆玉
金用燮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US16/316,636 priority Critical patent/US11389906B2/en
Publication of WO2018228104A1 publication Critical patent/WO2018228104A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0344—Observing the speed of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Definitions

  • the present disclosure relates to the field of display device fabrication technology, and in particular, to a laser cutting device, a control method and a control device.
  • the entire display layer pattern and the cutting mark need to be formed on the entire substrate, and after the completion of the production, the entire substrate is cut along the cutting mark by using a laser cutting device, thereby obtaining a plurality of displays. panel.
  • the structure of the laser cutting device mainly comprises: a worktable, a conveying mechanism, a control device, and an image acquiring unit and a laser cutter disposed above the workbench, wherein: the conveying mechanism comprises a plurality of conveyor belts arranged in parallel for conveying the entire substrate.
  • the conveying mechanism comprises a feeding end and a discharging end; the working table is arranged at the discharging end of the conveying mechanism; the image obtaining unit is used for acquiring the cutting mark on the entire substrate; and the laser cutter is used for performing the entire substrate on the working table Cutting;
  • the control device is respectively connected with the conveying mechanism, the image acquiring unit and the laser cutter for controlling the working state of the conveying mechanism, the image acquiring unit and the laser cutter.
  • the existing display panel usually includes an ITO (Indium Tin Oxide, ITO) pattern layer.
  • ITO Indium Tin Oxide
  • the entire substrate is blindly cut.
  • the main steps of blind cutting include: determining the operating area and setting the coordinates of the cutting line on the worktable according to the size of the entire substrate and setting the position of the cutting line; controlling the laser cutter to move to the coordinate position corresponding to the setting cutting line Control the transfer mechanism to transfer the entire substrate to the operating area of the table; control the laser cutter to cut the entire substrate along the set cutting line.
  • a disadvantage of the prior art is that since each of the conveyor belts has different frictional forces on the entire substrate, the displacement of the two sides of the entire substrate parallel to the extending direction of the conveyor belt is different, resulting in the actual operation of the entire substrate.
  • the cutting line deviates from the set cutting line, resulting in poor cutting accuracy and affecting the product quality of the display panel.
  • An object of the present disclosure is to provide a laser cutting apparatus, a control method and a control apparatus thereof, which improve the cutting precision of the laser cutting apparatus, thereby improving the product quality of the display panel.
  • Embodiments of the present disclosure provide a laser cutting apparatus, including:
  • a conveying mechanism comprising a feeding end and a discharging end
  • the first counter and the second counter are oppositely disposed on a side of the worktable near the discharge end of the transport mechanism, and are respectively driven by two opposite sides of the transfer substrate to be rotated and counted;
  • the control device is respectively connected to the first counter, the second counter and the laser cutter for determining the correct cutting motion of the laser cutter according to the set cutting trajectory and the counting start time and the counting value of the first counter and the second counter Track, and control the laser cutter to cut the substrate according to the modified cutting motion trajectory.
  • the laser cutting apparatus includes a first counter and a second counter disposed opposite to a side of the worktable near the discharge end of the transport mechanism, and the first counter and the second counter when the transport mechanism transfers the substrate to the workbench
  • the two opposite sides of the substrate being driven are rotated for counting;
  • the control device determines the corrected cutting motion trajectory of the laser cutter according to the set cutting trajectory and the counting start time and the counting value of the first counter and the second counter,
  • the laser cutting device controls the laser cutter to cut the substrate according to the modified cutting motion trajectory, thereby improving the cutting precision of the laser cutting device, thereby improving the product quality of the display panel.
  • the first counter comprises an absolute value rotation coding counter or an incremental rotation coding counter
  • the second counter comprises an absolute value rotation coding counter or an incremental rotation coding counter
  • the first counter and the second counter respectively comprise a rotating shaft that abuts a side of the substrate, and an outer wall of the rotating shaft is sleeved with a protective sleeve.
  • the rotating shaft has at least one convex portion
  • the inner wall of the protective sleeve has a groove matching the convex portion corresponding to each convex portion.
  • the protective cover comprises a rubber protective cover or a silicone protective cover.
  • the first counter and the second counter that are oppositely disposed are at least two groups. According to the counting start time and the counting value of the at least two groups of the first counter and the second counter, a plurality of modified cutting motion trajectories can be obtained, and by correcting the cutting motion trajectory for multiple corrections, a more accurate correcting cutting motion of the laser cutter can be determined.
  • the trajectory makes the cutting precision of the laser cutting equipment more precise.
  • the conveying mechanism comprises a plurality of first conveyor belts arranged in parallel.
  • the conveying mechanism further comprises a roller device disposed on one side of the discharging end, and the roller device is capable of moving out to the working table and retracting under the plurality of first conveyor belts.
  • the present disclosure also provides a control method for the laser cutting apparatus according to the foregoing technical solution, including:
  • the corrected cutting motion trajectory of the laser cutter is determined according to the set cutting trajectory, and the counting start time and the counting value of the first counter and the second counter, and the laser cutter is used to cut the substrate according to the corrected cutting motion trajectory.
  • the control method of the laser cutting device determines the corrected cutting motion trajectory of the laser cutter according to the counting start time and the counting value of the first counter and the second counter, and the method controls the laser compared with the prior art.
  • the cutter cuts the substrate along the modified cutting motion trajectory, thereby improving the cutting precision of the laser cutting device, thereby improving the product quality of the display panel.
  • the present disclosure also provides a control device applied to the laser cutting device of the foregoing technical solution, including:
  • a transfer control unit for controlling the transfer mechanism to transfer the substrate to the workbench
  • a receiving unit configured to receive a counting start time and a count value of the first counter and the second counter
  • a cutting control unit configured to determine a modified cutting motion trajectory of the laser cutter according to the set cutting trajectory, and the counting start time and the counting value of the first counter and the second counter, and control the laser cutter to the substrate according to the modified cutting motion trajectory Cut.
  • the control device of the laser cutting device provided by the embodiment of the present disclosure, the cutting control unit determines the correction of the laser cutter according to the set cutting trajectory and the counting start time and the counting value of the first counter and the second counter received by the receiving unit. Cutting the motion track and controlling the laser cutter to cut the substrate according to the modified cutting motion track. Compared with the prior art, the control device controls the laser cutter to cut the substrate along the modified cutting motion track, thereby improving the cutting of the laser cutting device. Accuracy, which in turn improves the quality of the display panel.
  • FIG. 1 is a schematic view of a laser cutting apparatus according to an embodiment of the present disclosure
  • FIG. 2 is a schematic view of a rotating shaft of an embodiment of the present disclosure
  • FIG. 3 is a schematic view of a laser cutting apparatus according to another embodiment of the present disclosure.
  • FIG. 4 is a schematic flow chart of a control method of a laser cutting device according to an embodiment of the present disclosure
  • FIG. 5 is a schematic diagram of a control device of a laser cutting apparatus according to an embodiment of the present disclosure.
  • the present disclosure provides a laser cutting device, a control method and a control device.
  • the present disclosure will be further described in detail in the following examples for the purpose of the present disclosure.
  • an embodiment of the present disclosure provides a laser cutting apparatus, including:
  • the conveying mechanism 1 comprises a feeding end and a discharging end
  • the work table 2 is disposed at the discharge end of the conveying mechanism 1;
  • the first counter 3 and the second counter 4 are oppositely disposed on the side of the table 2 near the discharge end of the transport mechanism 1, and are respectively driven and rotated by the two opposite sides of the transfer substrate 6 to be counted;
  • Control means respectively connected to the first counter 3, the second counter 4 and the laser cutter 5 for determining laser cutting according to the set cutting trajectory and the counting start time and count value of the first counter 3 and the second counter 4
  • the corrected cutting motion trajectory of the device 5 controls the laser cutter 5 to cut the substrate 6 in accordance with the corrected cutting motion trajectory.
  • the laser cutting apparatus includes a first counter 3 and a second counter 4 disposed opposite to a side of the table 2 near the discharge end of the conveying mechanism 1, when the conveying mechanism 1 transfers the substrate 6 to the table 2.
  • the first counter 3 and the second counter 4 are counted by the two opposite sides of the transfer substrate 6 being driven to rotate; the control means according to the set cutting trajectory, and the counting start time and count of the first counter 3 and the second counter 4
  • the value of the modified cutting motion trajectory of the laser cutter 5 is determined.
  • the laser cutting device controls the laser cutter 5 to cut the substrate 6 according to the modified cutting motion trajectory, thereby improving the cutting precision of the laser cutting device. Improve the product quality of the display panel.
  • the specific type of the first counter 3 is not limited, and may be, for example, an absolute value rotation encoding counter or an incremental rotation encoding counter, and the second counter 4 includes an absolute value rotation encoding counter or an incremental rotation encoding counter.
  • the first counter 3 and the second counter 4 respectively include a rotating shaft 9 abutting against a side of the substrate 6 , and the outer wall of the rotating shaft 9 is sleeved with a protective sleeve 11 .
  • this structural design it is possible to reduce the occurrence of chipping by the hard contact of the side of the substrate 6 with the rotating shaft 9, thereby reducing the wear of the substrate 6.
  • the rotating shaft 9 has at least one convex portion 10 corresponding to each convex portion 10, and the inner wall of the protective sleeve 11 has a groove 12 that cooperates with the convex portion 10.
  • the structural design can reduce the slip phenomenon between the protective cover 11 and the rotating shaft 9.
  • the specific type of the protective cover 11 is not limited, and may be, for example, a rubber protective cover 11 or a silicone protective cover 11.
  • the first counter 3 and the second counter 4 that are oppositely disposed are at least two groups. According to the counting start time and the counting value of the first counter 3 and the second counter 4 of at least two groups, a plurality of corrected cutting motion trajectories can be obtained, and by taking the average value of the plurality of modified cutting motion trajectories, the laser cutter 5 can be determined. More precise correction of the cutting motion trajectory, so that the cutting precision of the laser cutting equipment is more accurate.
  • the specific type of the transport mechanism 1 is not limited.
  • the transport mechanism 1 includes a first conveyor belt 7; as shown in FIG. 1, another embodiment of the present disclosure
  • the conveying mechanism 1 includes a plurality of first conveyor belts 7 arranged in parallel.
  • the conveying mechanism 1 further comprises a roller device 8 disposed on one side of the discharge end, and the roller device 8 is capable of moving out to the table 2 and retracted under the plurality of first conveyor belts 7.
  • the roller device 8 is capable of moving out to the table 2 and retracted under the plurality of first conveyor belts 7.
  • the present disclosure further provides a control method of the laser cutting apparatus applied to the foregoing embodiment, including:
  • Step 101 Control transmitting a substrate to the workbench
  • Step 102 Receive a count start time and a count of the first counter and the second counter.
  • Step 103 Determine a modified cutting motion trajectory of the laser cutter according to the set cutting trajectory, and the counting start time and the counting value of the first counter and the second counter, and control the laser cutter to cut the substrate according to the modified cutting motion trajectory.
  • the control method of the laser cutting device determines the corrected cutting motion trajectory of the laser cutter 5 according to the counting start time and the counting value of the first counter 3 and the second counter 4, compared with the prior art, The method controls the laser cutter 5 to cut the substrate 6 along the corrected cutting motion trajectory, thereby improving the cutting precision of the laser cutting device, thereby improving the product quality of the display panel.
  • control method further includes: controlling the driving device to drive the roller device to extend to the workbench; after step 102, before step 103, the controlling method further comprises: controlling the driving device to drive The roller device is retracted to the workbench.
  • control device 13 applied to the laser cutting apparatus of the foregoing embodiment, comprising:
  • a transfer control unit 14 for controlling the transfer mechanism 1 to transfer the substrate 6 to the workbench 2;
  • the receiving unit 15 is configured to receive a counting start time and a count value of the first counter 3 and the second counter 4;
  • the cutting control unit 16 is configured to determine a corrected cutting motion trajectory of the laser cutter 5 according to the set cutting trajectory, and the counting start time and the counting value of the first counter 3 and the second counter 4, and control the laser according to the corrected cutting motion trajectory
  • the cutter 5 cuts the substrate 6.
  • the control device 13 of the laser cutting apparatus determines the cutting control unit 16 according to the set cutting trajectory and the counting start and end time and the count value of the first counter 3 and the second counter 4 received by the receiving unit 14.
  • the modified cutting motion trajectory of the laser cutter 5 controls the laser cutter 5 to cut the substrate 6 according to the modified cutting motion trajectory.
  • the control device 13 controls the laser cutter 5 to correct the cutting movement trajectory to the substrate 6 compared to the prior art.
  • the cutting is performed to improve the cutting precision of the laser cutting device, thereby improving the product quality of the display panel.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种激光切割设备及控制方法和控制装置，激光切割设备包括：传送机构（1），包括进料端和出料端；工作台（2），设置于传送机构（1）的出料端；第一计数器（3）和第二计数器（4），相对设置于工作台（2）靠近传送机构（1）出料端的一侧，分别被传送中基板（6）的两个相对的侧边驱动旋转而计数；激光切割器（5）设置于工作台（2）上方；控制装置（13）分别与第一计数器（3）、第二计数器（4）和激光切割器（5）连接，用于根据设定切割轨迹以及第一计数器（3）和第二计数器（4）的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，根据修正切割运动轨迹控制激光切割器对基板（6）进行切割。

Description

激光切割设备及控制方法和控制装置
本申请要求在2017年06月15日提交中国专利局、申请号为201710451027.6、公开名称为“一种激光切割设备及控制方法和控制装置”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示装置制作技术领域，特别是涉及一种激光切割设备及控制方法和控制装置。
背景技术
在显示面板的生产过程中，需要在整张衬底基板上制作整面的显示层图案和切割标记，制作完成后，使用激光切割设备沿切割标记对整张基板进行切割，从而得到多个显示面板。
激光切割设备的结构主要包括：工作台、传送机构、控制装置，以及设置于工作台上方的图像获取单元和激光切割器，其中：传送机构包括平行设置的用于传送整张基板的多条传送带，传送机构包括进料端和出料端；工作台设置于传送机构的出料端；图像获取单元用于获取整张基板上的切割标记；激光切割器用于对工作台上的整张基板进行切割；控制装置分别与传送机构、图像获取单元和激光切割器连接，用于控制传送机构、图像获取单元和激光切割器的工作状态。
现有显示面板通常包括ITO(Indium tin oxide，氧化铟锡，简称ITO)图案层。该显示面板在制作时，如果在具有ITO图案层的整张基板上制作切割标记，极易损坏ITO图案层，因此，现有技术通常不在整张基板上制作切割标记，而是采用激光切割设备对整张基板进行盲切。盲切的主要步骤包括：根据整张基板的尺寸和设定切割线的位置，在工作台上确定操作区域以及设定切割线的坐标；控制激光切割器移动到设定切割线对应的坐标位置；控制传送机构将整张基板传送至工作台的操作区域；控制激光切割器沿设定切割 线对于整张基板进行切割。
现有技术存在的缺陷在于，由于传送机构的每条传送带对整张基板产生的摩擦力不同，使整张基板平行于传送带的延伸方向的两条侧边的位移不同，导致整张基板的实际切割线偏离设定切割线，从而导致切割精度欠佳，影响到显示面板的产品品质。
发明内容
本公开的目的是提供一种激光切割设备及控制方法和控制装置，以提高激光切割设备的切割精度，进而提高显示面板的产品品质。
本公开实施例提供一种激光切割设备，包括：
传送机构，包括进料端和出料端；
工作台，设置于传送机构的出料端；
第一计数器和第二计数器，相对设置于工作台靠近传送机构出料端的一侧，分别被传送中基板的两个相对的侧边驱动旋转而计数；
激光切割器，设置于工作台上方；
控制装置，分别与第一计数器、第二计数器和激光切割器连接，用于根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割。
本公开实施例提供的激光切割设备，包括相对设置于工作台靠近传送机构出料端的一侧的第一计数器和第二计数器，当传送机构向工作台传送基板时，第一计数器和第二计数器被传送中基板的两个相对的侧边驱动旋转而计数；控制装置根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，相比现有技术，该激光切割设备根据修正切割运动轨迹控制激光切割器对基板进行切割，从而提高了激光切割设备的切割精度，进而提高了显示面板的产品品质。
可选的，所述第一计数器包括绝对值旋转编码计数器或增量式旋转编码 计数器，所述第二计数器包括绝对值旋转编码计数器或增量式旋转编码计数器。
可选的，所述第一计数器和第二计数器分别包括与所述基板的侧边相抵接的转轴，转轴的外壁套设有保护套。采用该结构设计，可以减少基板侧边与转轴的硬性接触而产生碎屑的现象，从而减少了基板的磨损。
可选的，所述转轴具有至少一个凸起部，对应每个凸起部，保护套的内壁具有与所述凸起部相配合的凹槽。采用该结构设计可以减少保护套与转轴之间的打滑现象。
可选的，所述保护套包括橡胶保护套或硅胶保护套。
可选的，相对设置的第一计数器和第二计数器至少为两组。根据至少两组第一计数器和第二计数器的计数始末时间和计数值，可以得到多条的修正切割运动轨迹，通过对多条修正切割运动轨迹，可以确定激光切割器的较为精确的修正切割运动轨迹，从而使激光切割设备的切割精度更加精确。
可选的，所述传送机构包括平行设置的多条第一传送带。
可选的，所述传送机构还包括设置于出料端一侧的滚轮装置，滚轮装置能够运动伸出至工作台及收回至所述多条第一传送带下方。采用该结构设计，可以减少基板与工作台台面的摩擦，从而减少对基板的磨损。
本公开还提供了一种应用于前述技术方案所述的激光切割设备的控制方法，包括：
控制传送机构向工作台传送基板；
接收第一计数器和第二计数器的计数始末时间和计数；
根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割。
本公开实施例提供的激光切割设备的控制方法，根据第一计数器和第二计数器的计数始末时间和计数值，来确定激光切割器的修正切割运动轨迹，相比现有技术，该方法控制激光切割器沿修正切割运动轨迹对基板进行切割， 从而提高了激光切割设备的切割精度，进而提高了显示面板的产品品质。
本公开还提供了一种应用于前述技术方案所述的激光切割设备的控制装置，包括：
传送控制单元，用于控制传送机构向工作台传送基板；
接收单元，用于接收第一计数器和第二计数器的计数始末时间和计数值；
切割控制单元，用于根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割。
本公开实施例提供的激光切割设备的控制装置，切割控制单元根据设定切割轨迹，以及接收单元所接收到的第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割，相比现有技术，该控制装置控制激光切割器沿修正切割运动轨迹对基板进行切割，从而提高了激光切割设备的切割精度，进而提高了显示面板的产品品质。
附图说明
图1为本公开一实施例激光切割设备的示意图；
图2为本公开实施例转轴的示意图；
图3为本公开另一实施例激光切割设备的示意图；
图4为本公开实施例激光切割设备的控制方法的流程示意图；
图5为本公开实施例激光切割设备的控制装置的示意图。
附图标记：
1-传送机构；2-工作台；3-第一计数器；4-第二计数器；
5-激光切割器；6-基板；7-第一传送带；8-滚轮装置；
9-转轴；10-凸起部；11-保护套；12-凹槽；13-控制装置；
14-传送控制单元；15-接收单元；16-切割控制单元。
具体实施方式
为了提高激光切割设备的切割精度，进而提高显示面板的产品品质，本公开提供了一种激光切割设备及控制方法和控制装置。为使本公开的目的、技术方案和优点更加清楚，以下举实施例对本公开作进一步详细说明。
如图1所示，本公开实施例提供一种激光切割设备，包括：
传送机构1，包括进料端和出料端；
工作台2，设置于传送机构1的出料端；
第一计数器3和第二计数器4，相对设置于工作台2靠近传送机构1出料端的一侧，分别被传送中基板6的两个相对的侧边驱动旋转而计数；
激光切割器5，设置于工作台2上方；
控制装置，分别与第一计数器3、第二计数器4和激光切割器5连接，用于根据设定切割轨迹，以及第一计数器3和第二计数器4的计数始末时间和计数值，确定激光切割器5的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器5对基板6进行切割。
本公开实施例提供的激光切割设备，包括相对设置于工作台2靠近传送机构1出料端的一侧的第一计数器3和第二计数器4，当传送机构1向工作台2传送基板6时，第一计数器3和第二计数器4被传送中基板6的两个相对的侧边驱动旋转而计数；控制装置根据设定切割轨迹，以及第一计数器3和第二计数器4的计数始末时间和计数值，确定激光切割器5的修正切割运动轨迹，相比现有技术，该激光切割设备根据修正切割运动轨迹控制激光切割器5对基板6进行切割，从而提高了激光切割设备的切割精度，进而提高了显示面板的产品品质。
在本实施例中，第一计数器3的具体类型不限，例如可以为绝对值旋转编码计数器或增量式旋转编码计数器，第二计数器4包括绝对值旋转编码计数器或增量式旋转编码计数器。
如图2所示，可选的，第一计数器3和第二计数器4分别包括与基板6 的侧边相抵接的转轴9，转轴9的外壁套设有保护套11。采用该结构设计，可以减少基板6侧边与转轴9的硬性接触而产生碎屑的现象，从而减少了基板6的磨损。
请继续参照图2所示，可选的，转轴9具有至少一个凸起部10，对应每个凸起部10，保护套11的内壁具有与凸起部10相配合的凹槽12。采用该结构设计可以减少保护套11与转轴9之间的打滑现象。
在本实施例中，保护套11的具体类型不限，例如可以为橡胶保护套11或硅胶保护套11。
可选的，相对设置的第一计数器3和第二计数器4至少为两组。根据至少两组的第一计数器3和第二计数器4的计数始末时间和计数值，可以得到多条的修正切割运动轨迹，通过对多条修正切割运动轨迹取均值，可以确定激光切割器5的较为精确的修正切割运动轨迹，从而使激光切割设备的切割精度更加精确。
在本公开的实施例中，传送机构1的具体类型不限，例如，在本公开的一实施例中，传送机构1包括一条第一传送带7；如图1所示，在本公开的另一实施例中，传送机构1包括平行设置的多条第一传送带7。
如图3所示，可选的，传送机构1还包括设置于出料端一侧的滚轮装置8，滚轮装置8能够运动伸出至工作台2及收回至多条第一传送带7下方。采用该结构设计，可以减少基板6与工作台2台面的摩擦，从而减少对基板6的磨损。
如图4所示，本公开还提供了一种应用于前述实施例的激光切割设备的控制方法，包括：
步骤101、控制向工作台传送基板；
步骤102、接收第一计数器和第二计数器的计数始末时间和计数；
步骤103、根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割。
本公开实施例提供的激光切割设备的控制方法，根据第一计数器3和第二计数器4的计数始末时间和计数值，来确定激光切割器5的修正切割运动轨迹，相比现有技术，该方法控制激光切割器5沿修正切割运动轨迹对基板6进行切割，从而提高了激光切割设备的切割精度，进而提高了显示面板的产品品质。
在本实施例中，可选的，在步骤101之前，控制方法还包括：控制驱动装置驱动滚轮装置伸出至工作台；在步骤102之后，步骤103之前，控制方法还包括：控制驱动装置驱动滚轮装置收回至工作台。采用该设计，可以减少基板6与工作台台面的摩擦，从而减少对基板6的磨损。
如图5所示，本公开还提供了一种应用于前述实施例的激光切割设备的控制装置13，包括：
传送控制单元14，用于控制传送机构1向工作台2传送基板6；
接收单元15，用于接收第一计数器3和第二计数器4的计数始末时间和计数值；
切割控制单元16，用于根据设定切割轨迹，以及第一计数器3和第二计数器4的计数始末时间和计数值，确定激光切割器5的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器5对基板6进行切割。
本公开实施例提供的激光切割设备的控制装置13，切割控制单元16根据设定切割轨迹，以及接收单元14所接收到的第一计数器3和第二计数器4的计数始末时间和计数值，确定激光切割器5的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器5对基板6进行切割，相比现有技术，该控制装置13控制激光切割器5沿修正切割运动轨迹对基板6进行切割，从而提高了激光切割设备的切割精度，进而提高了显示面板的产品品质。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (10)

  1. 一种激光切割设备，包括：
    传送机构，包括进料端和出料端；
    工作台，设置于传送机构的出料端；
    第一计数器和第二计数器，相对设置于工作台靠近传送机构出料端的一侧，分别被传送中基板的两个相对的侧边驱动旋转而计数；
    激光切割器，设置于工作台上方；
    控制装置，分别与第一计数器、第二计数器和激光切割器连接，用于根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，根据修正切割运动轨迹控制激光切割器对基板进行切割。
  2. 如权利要求1所述的激光切割设备，其中，所述第一计数器包括绝对值旋转编码计数器或增量式旋转编码计数器，所述第二计数器包括绝对值旋转编码计数器或增量式旋转编码计数器。
  3. 如权利要求2所述的激光切割设备，其中，所述第一计数器和第二计数器分别包括与所述基板的侧边相抵接的转轴，转轴的外壁套设有保护套。
  4. 如权利要求3所述的激光切割设备，其中，所述转轴具有至少一个凸起部，对应每个凸起部，保护套的内壁具有与所述凸起部相配合的凹槽。
  5. 如权利要求3所述的激光切割设备，其中，所述保护套包括橡胶保护套或硅胶保护套。
  6. 如权利要求1～5任一项所述的激光切割设备，其中，相对设置的第一计数器和第二计数器至少为两组。
  7. 如权利要求1～5任一项所述的激光切割设备，其中，所述传送机构包括平行设置的多条第一传送带。
  8. 如权利要求7所述的激光切割设备，其中，所述传送机构还包括设置于出料端一侧的滚轮装置，滚轮装置能够运动伸出至工作台及收回至所述多 条第一传送带下方。
  9. 一种应用于权利要求1所述的激光切割设备的控制方法，包括：
    控制传送机构向工作台传送基板；
    接收第一计数器和第二计数器的计数始末时间和计数；
    根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割。
  10. 一种应用于权利要求1所述的激光切割设备的控制装置，包括：
    传送控制单元，用于控制传送机构向工作台传送基板；
    接收单元，用于接收第一计数器和第二计数器的计数始末时间和计数值；
    切割控制单元，用于根据设定切割轨迹，以及第一计数器和第二计数器的计数始末时间和计数值，确定激光切割器的修正切割运动轨迹，并根据修正切割运动轨迹控制激光切割器对基板进行切割。
PCT/CN2018/086603 2017-06-15 2018-05-11 激光切割设备及控制方法和控制装置 Ceased WO2018228104A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/316,636 US11389906B2 (en) 2017-06-15 2018-05-11 Laser cutting device, control method and control apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710451027.6 2017-06-15
CN201710451027.6A CN107138861B (zh) 2017-06-15 2017-06-15 一种激光切割设备及控制方法和控制装置

Publications (1)

Publication Number Publication Date
WO2018228104A1 true WO2018228104A1 (zh) 2018-12-20

Family

ID=59782412

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/086603 Ceased WO2018228104A1 (zh) 2017-06-15 2018-05-11 激光切割设备及控制方法和控制装置

Country Status (3)

Country Link
US (1) US11389906B2 (zh)
CN (1) CN107138861B (zh)
WO (1) WO2018228104A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114654110A (zh) * 2020-07-30 2022-06-24 中机数控科技（福建）有限公司 一种高精度大幅面激光切割机
CN115922107A (zh) * 2022-12-26 2023-04-07 北新集团建材股份有限公司 激光切割方法及激光切割控制装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107138861B (zh) 2017-06-15 2019-01-04 京东方科技集团股份有限公司 一种激光切割设备及控制方法和控制装置
CN108788474B (zh) * 2018-03-30 2020-10-27 深圳华工激光设备有限公司 金属瓶盖激光标识装置、制备生产线以及制备方法
CN112091456B (zh) * 2020-08-05 2023-04-04 武汉宁致远汽车配件有限公司 一种带有除尘排废功能的激光切割工作台
CN113070593B (zh) * 2021-03-10 2022-09-13 东风柳州汽车有限公司 一种机器人激光切割轨迹调试方法、装置及存储介质
CN113224204B (zh) * 2021-04-15 2023-06-23 山东交通学院 一种用于光伏电池片的切割装置
CN120115855B (zh) * 2025-05-08 2025-07-18 深圳市思迈达智能设备有限公司 一种激光分板机进料与切割协同控制方法及系统

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786131A (ja) * 1993-09-13 1995-03-31 Nikon Corp 露光装置
JPH10197211A (ja) * 1997-01-10 1998-07-31 Nikon Corp 干渉計を備えた測定装置
CN1603072A (zh) * 2003-09-29 2005-04-06 和椿科技股份有限公司 自动产生切割路径的系统及方法
CN102699483A (zh) * 2012-06-21 2012-10-03 洪峰 火焰开坡口机器人自动镭射纠偏系统
CN203095870U (zh) * 2013-02-28 2013-07-31 京东方科技集团股份有限公司 一种玻璃切割装置
CN103846505A (zh) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 一种钢条切断装置
CN104773573A (zh) * 2015-02-12 2015-07-15 华中科技大学 一种用于柔性膜输送的纠偏控制系统
CN106964907A (zh) * 2017-04-25 2017-07-21 重庆邮电大学 一种激光切割的方法和设备
CN107138861A (zh) * 2017-06-15 2017-09-08 京东方科技集团股份有限公司 一种激光切割设备及控制方法和控制装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2790782B2 (ja) * 1994-12-27 1998-08-27 日本リライアンス株式会社 定尺切断装置における測長装置
JP2002172479A (ja) 2000-09-20 2002-06-18 Seiko Epson Corp レーザ割断方法、レーザ割断装置、液晶装置の製造方法並びに液晶装置の製造装置
EP2346690B1 (de) * 2008-10-24 2012-09-12 Koenig & Bauer AG Verfahren zum bereitstellen von druckformen an montagepositionen auf einem von mehreren in einer druckmaschine angeordneten formzylindern
CN106994684B (zh) 2009-02-03 2021-04-09 范努克机器人技术美国有限公司 控制机器人工具的方法
CN102837130A (zh) * 2011-06-24 2012-12-26 太航常青汽车安全设备(苏州)有限公司 弱化激光加工设备
CN103600171B (zh) * 2013-04-28 2015-12-09 宝山钢铁股份有限公司 一种金属板上下料及切割的方法及系统
CN203484589U (zh) * 2013-10-12 2014-03-19 四川蓝彩电子科技有限公司 基于金属传感器的晶片引线成品切割定位装置
CN204504524U (zh) * 2015-01-29 2015-07-29 楚雄吉兴彩印有限责任公司 数控激光模切机
CN106808090B (zh) * 2015-11-27 2018-12-07 南京魔迪多维数码科技有限公司 一种脆性材料基板的激光加工系统
CN205820489U (zh) * 2016-07-12 2016-12-21 杭州良淋电子科技股份有限公司 一种自动纠偏系统
CN206445364U (zh) * 2016-10-27 2017-08-29 常州晶昀新能源有限公司 一种激光切割机

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786131A (ja) * 1993-09-13 1995-03-31 Nikon Corp 露光装置
JPH10197211A (ja) * 1997-01-10 1998-07-31 Nikon Corp 干渉計を備えた測定装置
CN1603072A (zh) * 2003-09-29 2005-04-06 和椿科技股份有限公司 自动产生切割路径的系统及方法
CN102699483A (zh) * 2012-06-21 2012-10-03 洪峰 火焰开坡口机器人自动镭射纠偏系统
CN103846505A (zh) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 一种钢条切断装置
CN203095870U (zh) * 2013-02-28 2013-07-31 京东方科技集团股份有限公司 一种玻璃切割装置
CN104773573A (zh) * 2015-02-12 2015-07-15 华中科技大学 一种用于柔性膜输送的纠偏控制系统
CN106964907A (zh) * 2017-04-25 2017-07-21 重庆邮电大学 一种激光切割的方法和设备
CN107138861A (zh) * 2017-06-15 2017-09-08 京东方科技集团股份有限公司 一种激光切割设备及控制方法和控制装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114654110A (zh) * 2020-07-30 2022-06-24 中机数控科技（福建）有限公司 一种高精度大幅面激光切割机
CN114654110B (zh) * 2020-07-30 2024-02-23 中机数控科技（福建）有限公司 一种高精度大幅面激光切割机
CN115922107A (zh) * 2022-12-26 2023-04-07 北新集团建材股份有限公司 激光切割方法及激光切割控制装置

Also Published As

Publication number Publication date
US20200009689A1 (en) 2020-01-09
CN107138861A (zh) 2017-09-08
US11389906B2 (en) 2022-07-19
CN107138861B (zh) 2019-01-04

Similar Documents

Publication Publication Date Title
WO2018228104A1 (zh) 激光切割设备及控制方法和控制装置
RU2671239C1 (ru) Способ вырезания листового стекла и позиционирования вырезанного листового стекла и устройство для его осуществления
US3282140A (en) Method of and apparatus for automatically cutting a glass ribbon
TW201711817A (zh) 板玻璃加工裝置及玻璃基板
US10450145B2 (en) Lug loader
CN210855819U (zh) 一种玻璃切割装置
WO2006090561A1 (ja) ガラス基板の位置決め装置、位置決め方法、端面研削装置及び端面研削方法
CN113001304A (zh) 一种电路板边沿打磨生产线
CN207001586U (zh) 一种输送带跑偏自动调整装置
JP6198314B2 (ja) ミシン目加工装置
CN101279679B (zh) 定位机构及应用其的输送装置与定位方法
EP2371475A1 (en) Device for patterning laminated substrate with guiding bar and roller stage
CN206373440U (zh) 一种便于型材定位的成品锯
JP5397840B2 (ja) ガラス基板の位置決め装置、位置決め方法、端面研削装置及び端面研削方法
JP5982093B2 (ja) ベルト部材からなる成形品の製造装置及び製造方法
EP2197628B1 (en) Grinding head for a grinding machine for glass slabs
EP4711079A1 (en) Plate polishing and grinding device and plate polishing and grinding method
CN118559106A (zh) 一种铝合金铸件用连续定长切割装置
CN102335926A (zh) 旋转切割刀具及其切割管材的方法
KR100591108B1 (ko) 카카스 반제품의 각도 가변 절단 및 이송장치
WO2016088600A1 (ja) 切込線形成方法及び切込線形成装置
JP2797877B2 (ja) 帯板搬送装置
CN219688452U (zh) 一种扇叶工件转运输送线的到料检测机构
CN115056062B (zh) 一种砖坯磨边机及其使用方法
JP2018163541A (ja) 工作機械の制御装置、工作機械の制御方法、及び工作機械の制御プログラム

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18818640

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 14.07.2020)

122 Ep: pct application non-entry in european phase

Ref document number: 18818640

Country of ref document: EP

Kind code of ref document: A1