WO2018225237A1 - Dispositif d'alimentation électrique - Google Patents

Dispositif d'alimentation électrique Download PDF

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Publication number
WO2018225237A1
WO2018225237A1 PCT/JP2017/021432 JP2017021432W WO2018225237A1 WO 2018225237 A1 WO2018225237 A1 WO 2018225237A1 JP 2017021432 W JP2017021432 W JP 2017021432W WO 2018225237 A1 WO2018225237 A1 WO 2018225237A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
power module
control board
heat
position detection
Prior art date
Application number
PCT/JP2017/021432
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English (en)
Japanese (ja)
Inventor
拓也 吉岡
Original Assignee
新電元工業株式会社
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Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP2018532344A priority Critical patent/JP6556362B2/ja
Priority to PCT/JP2017/021432 priority patent/WO2018225237A1/fr
Publication of WO2018225237A1 publication Critical patent/WO2018225237A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a power supply device having a heat sink.
  • a heat sink has a flat surface, and an electronic element such as a switching element is provided on the flat surface (Japanese Patent Laid-Open No. 2002-12039).
  • the present invention provides a power supply device that can realize high reliability while preventing an increase in size in the longitudinal direction.
  • the power supply device includes: A first heat sink, a first power module disposed on one side of the first heat sink, and disposed on one side of the first power module, connected to the first power module and the first power module A first assembly having a first control board to be controlled; A second heat sink, a second power module disposed on the other side of the second heat sink, a second power module disposed on the other side of the second power module, connected to the second power module and the second power module A second assembly having a second control board to be controlled; A position detection board that is arranged on the rotation drive unit side of the first heat sink and the second heat sink and acquires information about the rotation position of the rotation drive unit; With The other side of the first heat sink and the one side of the second heat sink may be arranged to face each other.
  • Only one of the first heat sink and the second heat sink may be provided with a positioning unit that positions the position detection board.
  • the positioning portion has two or more positioning protrusions;
  • the position detection board may have a positioning hole into which the positioning protrusion is inserted without a gap.
  • the position detection board has a position detection element;
  • the position detection element may be provided on a center line between the two positioning protrusions.
  • the first control board and the position detection board are disposed adjacent to each other at an end of the first control board on the side of the rotational drive unit,
  • the second control board and the position detection board may be disposed adjacent to each other at an end of the second control board on the rotation drive unit side.
  • the first heat sink and the second heat sink may be exposed.
  • the first heat sink has a first recess on the other side;
  • the second heat sink has a second recess on one side; At least a portion of the first current module is provided in the first recess; At least a part of the second current module may be provided in the second recess.
  • the first assembly and the second assembly that can perform the same function are used. For this reason, high reliability is realizable.
  • the position detection board is arranged on the rotation drive unit side of the first assembly and the second assembly
  • the first control board is arranged on one side of the first power module
  • the second control board is arranged on the other side of the power module. Since it is not necessary to provide a large control substrate in the longitudinal direction, it is possible to prevent the longitudinal size from increasing.
  • the first heat sink and the second heat sink are separate, even if heat is generated in one of the first assembly and the second assembly, the influence on the other is reduced. be able to.
  • FIG. 1 is a side view showing a power supply device according to an embodiment of the present invention.
  • FIG. 2 is a view of the power supply device shown in FIG. 1 as viewed from the rotation drive unit side (right side of FIG. 1).
  • FIG. 3A is a plan view of the first heat sink and the first current module
  • FIG. 3B is a plan view of the second heat sink and the second current module.
  • FIG. 4 is a side view showing the power supply device and the rotation drive unit according to the embodiment of the present invention.
  • 5 is a view of a part of the power supply device shown in FIG. 1 as viewed from the side opposite to the rotation drive unit (left side in FIG. 1).
  • FIG. 1 is a side view showing a power supply device according to an embodiment of the present invention.
  • FIG. 6A is a cross-sectional view of the first power module, the first heat radiating portion, and the first heat sink that can be used in the present embodiment
  • FIG. 6B is the first power module that can be used in the present embodiment. It is sectional drawing of a 2 power module, a 2nd thermal radiation part, and a 2nd heat sink.
  • FIG. 7A is a plan view showing the relationship between the first power module that can be used in the present embodiment and the first protrusion
  • FIG. 7B can be used in the present embodiment. It is the top view which showed the relationship between a 2nd power module and a 2nd protrusion part.
  • FIG. 8 is a side view showing a power supply device according to a modification of the embodiment of the present invention.
  • Embodiment ⁇ Configuration >>
  • “one side” means the upper side in FIG. 1
  • “the other side” means the lower side in FIG.
  • the vertical direction in FIG. 1 (the direction from the other to the one and the direction from the other to the other) is referred to as a “first direction”, the horizontal direction in FIG. “Third direction”.
  • the power supply device of the present embodiment may be used for an electric power steering device (EPS), for example.
  • the power supply apparatus may include a power unit that is energized with a drive current that drives a rotation driving unit 500 (see FIG. 4) such as a motor, and a control unit that controls the rotation driving unit 500 such as a motor.
  • the power unit may include a first current module 110 and a second current module 120 which will be described later, and a first power module 30 and a second power module 40.
  • the control unit may include a first control board 130 and a second control board 140 which will be described later.
  • the power supply device of the present embodiment may have a first assembly and a second assembly.
  • the first assembly includes a first heat sink 10 having a first recess 16 on the other side, a first power module 30 disposed on one side of the first heat sink 10, and a first power module 30 disposed on one side.
  • the first control board 130 that is electrically connected to the first power module 30 and controls the first power module 30 may be included.
  • the second assembly is disposed on the other side of the second power module 40, the second power module 40 disposed on the other side of the second heat sink 20, the second heat sink 20 having the second recess 26 on one side.
  • a second control board 140 that is electrically connected to the second power module 40 and controls the second power module 40 may be included.
  • the first assembly may include a first current module 110 that is at least partially disposed in the first recess 16 and electrically connected to the first power module 30.
  • the second assembly may include a second current module 120 that is at least partially disposed within the second recess 26 and electrically connected to the second power module 40.
  • the first heat radiation unit 50 may be disposed between the first power module 30 and the first control board 130. More specifically, the first heat radiating part 50 may be provided on one side of the first power module 30 and on the other side of the first control board 130. Further, the second heat radiating unit 60 may be disposed between the second power module 40 and the second control board 140. More specifically, the second heat radiation part 60 may be provided on the other side of the second power module 40 and on one side of the second control board 140.
  • the 1st heat radiating part 50 and the 2nd heat radiating part 60 may consist of plate shape, the 1st heat radiating part 50 may be comprised by the 1st heat radiating plate, and the 2nd heat radiating part 60 may be comprised by the 2nd heat radiating plate. .
  • the other side of the first heat sink 10 and the one side of the second heat sink 20 may be arranged to face each other.
  • a rotation drive unit 500 such as a motor used in vehicles such as automobiles and two-wheels may be disposed (see FIG. 4).
  • substrate 150 which acquires the information regarding the rotational position of the rotational drive part 500 may be provided in the rotational drive part 500 side (right side of FIG. 1) of the 1st heat sink 10 and the 2nd heat sink 20.
  • the first heat sink 10 may have a first protrusion 11 protruding to the other side
  • the second heat sink 20 may have a second protrusion 21 protruding to one side.
  • the other surface of the first protrusion 11 may be a flat surface
  • the one surface of the second protrusion 21 may be a flat surface (see FIG. 3).
  • the flat surface on the other side of the first protrusion 11 and the flat surface on the one side of the second protrusion may be in contact with each other.
  • a part of the first power module 30 is provided on one side of the first protrusion 11 (see FIG. 7A), and the second power is provided on the other side of the second protrusion 21.
  • a part of the module 40 may be provided (see FIG. 7B).
  • the first power module 30 includes a first module terminal 31 that extends toward the first control board 130 and the first current module 110 and is electrically connected to the first control board 130 and the first current module 110. Also good.
  • the second power module 40 includes a second module terminal 41 that extends to the second control board 140 side and the second current module 120 side and is electrically connected to the second control board 140 and the second current module 120. Good.
  • the first control board 130 and the position detection board 150 are disposed adjacent to each other at the end of the first control board 130 on the rotation driving unit 500 side, and the second control board 140 and the position detection board 150 are disposed. May be arranged adjacent to each other at the end of the second control board 140 on the side of the rotational drive unit 500.
  • “adjacent” means an aspect in which the gap is disposed without a gap or an aspect in which the gap is disposed at a certain distance or less (for example, 1 cm or less or several millimeters or less).
  • the peripheral edge portion in the radial direction of the position detection board 150 is positioned adjacent to the ends of the first control board 130 and the second control board 140 on the rotation drive unit 500 side. .
  • the position detection board 150 may have a positioning hole into which the positioning protrusions are inserted without a gap.
  • the position detection board 150 has a position detection main body plate 154, and the position detection main body plate 154 is provided with a pair of positioning holes 152 into which the positioning protrusions 29 are inserted.
  • the pair of positioning protrusions 29 are provided on the surface of the second heat sink 20 on the side of the rotation drive unit 500, but the present invention is not limited to this, and the rotation of the first heat sink 10 is not limited thereto.
  • a pair of positioning protrusions or three or more positioning protrusions may be provided on the surface on the drive unit 500 side. It should be noted that the phrase “without a gap” means that there is substantially no gap, and an aspect in which a minute gap exists is included in the aspect “without a gap”.
  • the position detection substrate 150 may have a position detection element 151 at the center position in the surface direction (the paper surface direction in FIG. 2).
  • the position detection element 151 can detect the rotational position of the rotational drive unit 500 such as a motor.
  • the position detection board 150 may be fixed to the surface of the first heat sink 10 on the rotation driving unit 500 side and the surface of the second heat sink 20 on the rotation driving unit 500 side.
  • a fastening hole 153 for inserting a fastening member such as a screw may be provided in the position detection main body plate 154. It should be noted that a certain degree of “play” is provided between the fastening hole 153 and the fastening member, and accurate positioning cannot be performed.
  • the first heat sink 10 and the second heat sink 20 may be exposed. More specifically, a mode in which the control board, the position detection board 150, and the like are not provided on the front surface and the back surface of the first heat sink 10 and the second heat sink 20 in FIG. .
  • the first heat sink 10 has a first positioning member such as a first positioning protrusion (for example, a positioning pin) 18 a that protrudes to the other side
  • the second heat sink 20 has a first positioning member that protrudes to one side.
  • the first heat sink 10 has a first positioning hole 18 into which the second positioning protrusion 28a is inserted without a gap
  • the second heat sink 20 has a second positioning hole 28 into which the first positioning protrusion 18a is inserted without a gap. You may have.
  • first positioning protrusion 18 a may protrude from the flat surface of the first heat sink 10 to the other side, and the second positioning protrusion 28 a may protrude from the flat surface of the second heat sink 20 to one side.
  • the first positioning hole 18 may be provided on the flat surface of the second heat sink 20, and the second positioning hole 28 may be provided on the flat surface of the first heat sink 10.
  • the first control board 130 and the second control board 140 may be fixed to the position detection board 150 at the end on the rotation drive unit 500 side (the right end in FIG. 1). More specifically, when the first control fixing portion 139 of the first control board 130 is inserted into the fixing hole 159 (see FIG. 2) provided in the position detection board 150, the first control board 130 is moved to the position detection board. 150, and the second control board 140 is inserted into a fixing hole 159 (see FIG. 2) provided in the position detection board 150 so that the second control board 140 detects the position. It may be fixed to the substrate 150.
  • the first current module 110 includes a first current board 111 and the other side of the first current board 111 (the front side of the paper surface of FIG. 3A, the lower side of FIG. 1).
  • the second current module 120 includes a second current substrate 121 and one side of the second current substrate 121 (the front surface of FIG. 3B). Side, the upper side in FIG. 1).
  • the first current device 115 provided on the other side (the lower side in FIG. 5) of the first current substrate 111 and the one side (the upper side in FIG. 5) of the second current substrate 121 are provided.
  • the second current device 125 may be nested, and may overlap in a first direction from one side to the other side. As shown in FIG.
  • the first current module 110 has a plurality of first current devices 115, a part of which is provided on the other side of the first current substrate 111, and the remaining part of the first current substrate 111. It may be provided on one side.
  • the second current module 120 includes a plurality of second current devices 125, a part of which is provided on one side of the second current substrate 121 and the remaining part is provided on the other side of the second current substrate 121. May be.
  • the first current module 110 may be fixed to the first control board 130 by a first current module fixing member 119 such as a claw member.
  • the second current module 120 may be fixed to the second control board 140 by a second current module fixing member 129 such as a claw member.
  • another first current module fixing member 119 may be provided on the back side of the paper (see FIG. 5).
  • the first current module fixing member 119 is fixed to the first control board 130 by sandwiching the first control board 130 by the pair of first current module fixing members 119.
  • another second current module fixing member 129 may be provided on the back side of the drawing (see FIG. 5). In this case, the second current module fixing member 129 is fixed to the second control board 140 by sandwiching the second control board 140 by the pair of second current module fixing members 129.
  • the first current substrate 111 shown in FIG. 3 may be made of a low thermal conductivity material.
  • the second current substrate 121 may be made of a low thermal conductivity material.
  • the low thermal conductivity material for example, polybutylene terephthalate resin (PBT resin), PA (polyamide), PPS (polyphenylene sulfide) or the like can be used.
  • the other end (for example, a flat surface) of the first protrusion 11 may have a first notch 11 a on the opposite side (left side in FIG. 3) from the rotation drive unit 500 side. .
  • One end portion (for example, a flat surface) of the second projecting portion 21 may have a second notch 21a on the side opposite to the rotation driving portion 500 side.
  • the first current device 115 may be provided in the first notch 11a
  • the second current device 125 may be provided in the second notch 21a.
  • the first protrusion 11 has a first notch 11a, and a first current device 115 such as a choke coil is provided in the first notch 11a.
  • 21 has a second notch 21a, and a second current device 125 such as a choke coil is provided in the second notch 21a.
  • the first current device 115 and the second current device 125 may include a capacitor, a power connector and the like in addition to the choke coil described above.
  • the capacitor may be arranged so as to extend along the second direction (see FIGS. 3 and 5).
  • the first heat sink 10 is inverted, and the upper side of the first heat sink 10 in FIG. 3A is aligned with the lower side of the second heat sink 20 in FIG.
  • the mode is as shown in FIG.
  • the first projecting portion 11 and the second projecting portion 21 may be provided with fastening holes 17 and 27 for inserting fastening members 15 (see FIG. 1) such as screws.
  • fastening members 15 see FIG. 1
  • the fastening member are provided with a certain amount of “play”, and accurate positioning cannot be performed.
  • the first heat sink 10 has a first extension 12 on the opposite side (left side in FIG. 1) of the first protrusion 11 to the rotation drive part 500 side, and the second heat sink 20 rotates the second protrusion 21.
  • You may have the 2nd extension part 22 on the opposite side to the drive part 500 side.
  • the surface on the other side of the first extending portion 12 may be a flat surface
  • the surface on one side of the second extending portion 22 may be a flat surface.
  • the flat surface on the other side of the first extension portion 12 and the flat surface on one side of the second extension portion 22 may abut.
  • a fastening hole for inserting a fastening member 15 such as a screw may be provided in the first extending portion 12 and the second extending portion 22, and the fastening member 15 is inserted into the fastening hole,
  • One heat sink 10 may be fixed to the second heat sink 20.
  • FIG. 1 the fastening member 15 inserted into the first extension portion 12 is shown, but the fastening member is inserted into the second extension portion 22 on the back side of the paper surface of FIG. 1.
  • one or more first control elements 135 may be provided on the other side of the first control board 130. Then, the first control element 135 and the first heat radiating part 50 may be in contact with each other, and heat generated from the first control element 135 may be radiated by the first heat radiating part 50.
  • One or more second control elements 145 may be provided on one side of the second control board 140. The second control element 145 and the second heat radiating unit 60 may be in contact with each other, and heat generated from the second control element 145 may be radiated by the second heat radiating unit 60.
  • the mode in which the heat sinks 10 and 20 are in contact with the power modules 30 and 40 includes a mode in which a third member or a third material such as a heat radiating sheet, a heat radiating insulating sheet, a heat radiating grease, or a heat radiating insulating grease is interposed. Yes.
  • a third member such as a heat radiating sheet, an insulating sheet, a heat radiating insulating sheet, a heat radiating grease, a heat radiating insulating grease, etc.
  • a mode in which three materials are brought into contact with each other is also included.
  • the first current module 110 is electrically connected to the first power module 30 via the first module terminal 31 and electrically connected to the first control board 130 via the first current terminal 116. It is connected to the.
  • the second current module 120 is electrically connected to the second power module 40 via the second module terminal 41, and is electrically connected to the second control board 140 via the second current terminal 126.
  • the first power module 30 may have a stack structure having electronic elements made of stacked semiconductor elements or the like.
  • the first power module 30 may include the first heat sink side electronic element 36 and the first heat radiation part side electronic element 37 disposed on one side of the first heat sink side electronic element 36.
  • the second power module 40 may also have a stack structure including electronic elements made of stacked semiconductor elements or the like.
  • the second power module 40 may include the second heat sink side electronic element 46 and the second heat radiation part side electronic element 47 disposed on the other side of the second heat sink side electronic element 46.
  • the total heat generation amount by the first heat sink side electronic element 36 may be larger than the total heat generation amount by the first heat radiating portion side electronic element 37.
  • the total heat generation amount by the second heat sink side electronic element 46 may be larger than the total heat generation amount by the second heat radiation part side electronic element 47.
  • the first power module 30 shown in FIG. 6A includes a first heat sink side substrate 32a, a first heat sink side conductor layer 33a provided on the first heat sink side substrate 32a, a first heat radiation portion side substrate 32b, A first heat dissipating part side conductor layer 33b provided on the first heat dissipating part side substrate 32b, and a first connector 39 provided between the first heat sink side electronic element 36 and the first heat dissipating part side electronic element 37; Have.
  • the first heat dissipating part side conductor layer 33b is provided on the upper side of FIG. 6 (a) of the first connection body 39, and the first heat dissipating part side conductor layer is not limited to the embodiment shown in FIG.
  • the second power module 40 shown in FIG. 6B includes a second heat sink side substrate 42a, a second heat sink side conductor layer 43a provided on the second heat sink side substrate 42a, a second heat radiation portion side substrate 42b, A second heat dissipating part side conductor layer 43b provided on the second heat dissipating part side substrate 42b, and a second connector 49 provided between the second heat sink side electronic element 46 and the second heat dissipating part side electronic element 47.
  • a second heat sink side substrate 42a includes a second heat sink side substrate 42a, a second heat sink side conductor layer 43a provided on the second heat sink side substrate 42a, a second heat radiation portion side substrate 42b, A second heat dissipating part side conductor layer 43b provided on the second heat dissipating part side substrate 42b, and a second connector 49 provided between the second heat sink side electronic element 46 and the second heat dissipating part side electronic element 47.
  • the 2nd thermal radiation part side conductor layer 43b is provided in FIG.6 (b) lower side of the 2nd connection body 49, and the 2nd thermal radiation part side conductor is provided. You may employ
  • the current modules 110 and 120 may not be provided.
  • first heat sink 10 and the second heat sink 20 are separated from each other, even if heat is generated in either the first assembly or the second assembly, the other is performed. Can be reduced.
  • the position detection board 150 is arranged on the rotation driving unit 500 side of the first assembly and the second assembly, the first control board 130 is arranged on one side of the first power module 30, and When the second control board 140 is arranged on the other side of the power module, it is not necessary to provide a large control board in the longitudinal direction (second direction), so that the size in the longitudinal direction is increased. Can be prevented.
  • the first control board 130 and the position detection board 150 are disposed adjacent to each other at the end of the first control board 130 on the rotation drive unit 500 side, and the second control board 140 and the position detection board 150 are disposed.
  • the second control board 140 is arranged adjacent to each other at the end on the rotation driving unit 500 side is advantageous in that the size in the first direction and the second direction can be reduced.
  • the peripheral edge portion of the position detection board 150 is provided on the rotation drive unit 500 side of the first control board 130, and the position detection board 150 is provided on the rotation drive unit 500 side of the second control board 140.
  • a peripheral portion it is advantageous in that the size in the radial direction (especially the size in the first direction) can be reduced by the thickness of the first control board 130 and the second control board 140. .
  • a position detection board 150 for obtaining information on the rotational position of the rotation drive unit 500 is provided on the rotation drive unit 500 side (the right side in FIG. 1) of the first heat sink 10 and the second heat sink 20, as shown in FIGS.
  • the position of the position detection substrate 150 can be positioned using only one of the heat sinks 20 as a reference. If the position of the position detection board 150 is displaced, the rotational position of the rotary drive unit 500 such as a motor may not be accurately measured. Therefore, the position of the position detection board 150 can be accurately determined. is there.
  • the two positioning protrusions 29 are provided.
  • the position detection element 151 can be positioned on the center line between the two.
  • this mode the possibility that the position detection element 151 may be displaced due to various factors such as expansion / contraction of the positioning hole 152 provided in the position detection main body plate 154 of the position detection board 150 can be reduced. Is beneficial.
  • the size in the radial direction (particularly the size in the third direction) is adopted. ) Is advantageous in that it can be reduced. Further, by exposing the side surfaces in this way, it is also beneficial in that the heat radiation efficiency by the heat sinks 10 and 20 and the heat radiation portions 50 and 60 can be increased.
  • a member such as the first current module 110 is disposed in the first recess 16 of the first heat sink 10, and a member such as the second current module 120 is disposed in the second recess 26 of the second heat sink 20.
  • the aspect it is possible to prevent the size of the radial direction (plane direction including the first direction and the third direction) orthogonal to the longitudinal direction from increasing.
  • the first current module 110 is disposed in the first recess 16 and the second current module 120 is disposed in the second recess 26.
  • the present invention is not limited to this.
  • another member may be disposed in the recesses 16 and 26.
  • a first current device 115 provided on the other side of the first current substrate 111 and a second current device 125 provided on one side of the second current substrate 121 are arranged in a nested manner, Adopting an aspect that overlaps in the first direction from the one side to the other side is advantageous in that the size in the radial direction can be reduced.
  • the first current substrate 111 is made of a low thermal conductivity material and / or the second current substrate 121 is made of a low thermal conductivity material
  • the first current substrate 111 is provided on the other side of the first current substrate 111. This is advantageous in that heat generated by the second current device 125 provided on one side of the first current device 115 and / or the second current substrate 121 can be blocked by the first current substrate 111 and / or the second current substrate 121.
  • the first current substrate 111 has a low thermal conductivity.
  • the second current substrate 121 is made of a low thermal conductivity material and / or the first current device 115 and / or the first current device 115 provided on the other side of the first current substrate 111 is adopted.
  • Heat generated by the second current device 125 provided on one side of the two-current board 121 can be reduced from being transmitted to the first heat sink 10 and the second heat sink 20.
  • the first power module 30 and the second power module 40 can be reduced. This is beneficial in that it can be cooled efficiently.
  • the 1st protrusion part 11 has the 1st notch 11a on the opposite side to the rotation drive part 500 side, and the 2nd protrusion part 21 is a 2nd notch on the opposite side to the rotation drive part 500 side. 21a, the first current device 115 is provided in the first notch 11a, and the second current device 125 is provided in the second notch 21a. ) Is advantageous in that the first current device 115 and the second current device 125 can be arranged while suppressing the increase in size in FIG.
  • a first notch 11a is provided on one side surface of the first projecting portion 11 (the lower side surface in FIG.
  • the first current device 115 such as a heat-generating choke coil and the second current It is advantageous in that the device 125 can be provided at a position separated in the third direction to increase heat dissipation while preventing an increase in size in the second direction.
  • the first power module 30 when adopting a mode in which the first power module 30 is cooled using both the first heat sink 10 and the first heat radiating portion 50, the first power module 30 has a high cooling effect. It is beneficial in that it can be realized. Similarly, when the aspect which cools the 2nd power module 40 using both the 2nd heat sink 20 and the 2nd heat radiating part 60 is employ
  • the heat radiation by the heat sinks 10 and 20 is performed more effectively than the heat radiation by the heat radiating parts (particularly the heat radiating plates) 50 and 60.
  • the first power module 30 has the first heat sink side electronic element 36 and the first heat radiation part side electronic element 37 as shown in FIG. It is conceivable to adopt a mode in which the heat generation amount is larger than the total heat generation amount by the first heat radiation part side electronic element 37. In this case, it is advantageous in that the heat generated in the first power module 30 can be efficiently released.
  • the second power module 40 has the second heat sink side electronic element 46 and the second heat radiation part side electronic element 47 as shown in FIG. It is conceivable to adopt a mode in which the heat generation amount is larger than the total heat generation amount by the second heat radiation part side electronic element 47. In this case, it is beneficial in that heat generated in the second power module 40 can be efficiently released.
  • a first control board 130 that is electrically connected to the first power module 30 and controls the first power module 30 is provided on one side of the first power module 30.
  • the second control board 140 that is electrically connected to the second power module 40 and controls the second power module 40 is provided on the other side of the module 40, the position close to the power module is adopted. This is advantageous in that the control board can be positioned on the board and can be made less susceptible to noise and the like.
  • the first control board 130 can be positioned relatively close to the first power module 30, so that the generation of noise can be further suppressed. Furthermore, the size in the radial direction can be reduced. Similarly, when a second heat radiating plate is employed as the second heat radiating portion 60, the second control board 140 can be positioned relatively close to the second power module 40, so that more noise is generated. In addition, the radial size can be reduced.
  • the first power module 30 has a first module terminal 31 extending toward the first control board 130 and connected to the first control board 130
  • the first direction of the first module terminal 31 is adopted.
  • the thickness of the first heat radiating plate becomes thinner than the length at.
  • the second power module 40 has the second module terminal 41 extending toward the second control board 140 and connected to the second control board 140
  • the first of the second module terminals 41 is used.
  • the thickness of the second heat radiating plate becomes thinner than the length in the direction.
  • the first power module 30 has a plurality of first electronic elements 38, and the total heat generation amount of the first electronic elements 38 positioned in the high heat dissipation area corresponding to the first protrusion 11 is the first heat module outside the high heat dissipation area.
  • the total heat generation amount of the one electronic element 38 is larger, it is possible to increase the heat radiation efficiency in a place where the heat generation is large in the first power module 30, and it is beneficial in that heat can be radiated in a balanced manner. is there.
  • the second power module 40 has a plurality of second electronic elements 48, and the total heat generation amount of the second electronic elements 48 positioned in the high heat dissipation area corresponding to the second protrusion 21 is the first outside the high heat dissipation area.
  • the total heat generation amount of the two-electron element 48 it is possible to increase the heat dissipation efficiency in a place where the heat generation is large in the second power module 40. is there.
  • the first power module 30 does not have to have a stack structure as shown in FIG. 6, and similarly, the second power module 40 does not have to have a stack structure.
  • each of the first electronic elements 38 becomes the first heat sink side electronic element 36 or the first heat radiation side electronic element 37
  • the second power module 40 has a stack structure.
  • each of the second electronic elements 48 may be the second heat sink side electronic element 46 or the second heat radiation part side electronic element 47.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)

Abstract

La présente invention concerne un dispositif d'alimentation électrique pourvu : d'un premier ensemble comprenant un premier dissipateur thermique (10), un premier module d'alimentation (30) disposé sur une surface d'un côté de direction du premier dissipateur thermique (10), et une première carte de commande (130) disposée sur le côté de direction du premier module d'alimentation (30) ; d'un second ensemble comprenant un second dissipateur thermique (20), un second module d'alimentation disposé sur une surface d'un autre côté de direction du second dissipateur thermique (20), et une seconde carte de commande (140) disposée sur l'autre côté de direction du second module d'alimentation (40) ; et d'une carte de détection de position (150) disposée sur le côté du premier dissipateur thermique (10) et du second dissipateur thermique (20) au moyen d'une unité d'attaque rotative (500), et permettant d'acquérir des informations relatives à la position de rotation de l'unité d'attaque rotative (500). L'autre côté de direction du premier dissipateur thermique (10) et le premier côté de direction du second dissipateur thermique (20) sont disposés de façon à être en regard l'un de l'autre.
PCT/JP2017/021432 2017-06-09 2017-06-09 Dispositif d'alimentation électrique WO2018225237A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018532344A JP6556362B2 (ja) 2017-06-09 2017-06-09 電源装置
PCT/JP2017/021432 WO2018225237A1 (fr) 2017-06-09 2017-06-09 Dispositif d'alimentation électrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/021432 WO2018225237A1 (fr) 2017-06-09 2017-06-09 Dispositif d'alimentation électrique

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WO2018225237A1 true WO2018225237A1 (fr) 2018-12-13

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002120739A (ja) * 2000-10-18 2002-04-23 Mitsubishi Electric Corp 電動パワーステアリング装置
JP2011177001A (ja) * 2009-06-24 2011-09-08 Denso Corp 駆動装置
JP2012157161A (ja) * 2011-01-26 2012-08-16 Mitsubishi Electric Corp 電力変換装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002120739A (ja) * 2000-10-18 2002-04-23 Mitsubishi Electric Corp 電動パワーステアリング装置
JP2011177001A (ja) * 2009-06-24 2011-09-08 Denso Corp 駆動装置
JP2012157161A (ja) * 2011-01-26 2012-08-16 Mitsubishi Electric Corp 電力変換装置

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JPWO2018225237A1 (ja) 2019-06-27

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