JP6556362B2 - 電源装置 - Google Patents

電源装置 Download PDF

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Publication number
JP6556362B2
JP6556362B2 JP2018532344A JP2018532344A JP6556362B2 JP 6556362 B2 JP6556362 B2 JP 6556362B2 JP 2018532344 A JP2018532344 A JP 2018532344A JP 2018532344 A JP2018532344 A JP 2018532344A JP 6556362 B2 JP6556362 B2 JP 6556362B2
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Japan
Prior art keywords
heat sink
power module
heat
control board
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018532344A
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English (en)
Japanese (ja)
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JPWO2018225237A1 (ja
Inventor
拓也 吉岡
拓也 吉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2018225237A1 publication Critical patent/JPWO2018225237A1/ja
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Publication of JP6556362B2 publication Critical patent/JP6556362B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018532344A 2017-06-09 2017-06-09 電源装置 Active JP6556362B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/021432 WO2018225237A1 (fr) 2017-06-09 2017-06-09 Dispositif d'alimentation électrique

Publications (2)

Publication Number Publication Date
JPWO2018225237A1 JPWO2018225237A1 (ja) 2019-06-27
JP6556362B2 true JP6556362B2 (ja) 2019-08-07

Family

ID=64566984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018532344A Active JP6556362B2 (ja) 2017-06-09 2017-06-09 電源装置

Country Status (2)

Country Link
JP (1) JP6556362B2 (fr)
WO (1) WO2018225237A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3774624B2 (ja) * 2000-10-18 2006-05-17 三菱電機株式会社 電動パワーステアリング装置
JP5435286B2 (ja) * 2009-06-24 2014-03-05 株式会社デンソー 駆動装置
JP5249365B2 (ja) * 2011-01-26 2013-07-31 三菱電機株式会社 電力変換装置

Also Published As

Publication number Publication date
WO2018225237A1 (fr) 2018-12-13
JPWO2018225237A1 (ja) 2019-06-27

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