WO2018221931A1 - Thermal driving switch structure body and method for manufacturing same - Google Patents

Thermal driving switch structure body and method for manufacturing same Download PDF

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Publication number
WO2018221931A1
WO2018221931A1 PCT/KR2018/006088 KR2018006088W WO2018221931A1 WO 2018221931 A1 WO2018221931 A1 WO 2018221931A1 KR 2018006088 W KR2018006088 W KR 2018006088W WO 2018221931 A1 WO2018221931 A1 WO 2018221931A1
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WO
WIPO (PCT)
Prior art keywords
substrate
contact
driving body
deforming
anchor structure
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PCT/KR2018/006088
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French (fr)
Korean (ko)
Inventor
조일주
채의규
임혜인
우지완
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한국과학기술연구원
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Publication of WO2018221931A1 publication Critical patent/WO2018221931A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/01—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]

Definitions

  • the present invention relates to a thermally driven switch structure and a method of manufacturing the same, and more particularly, to a switch structure and a method of manufacturing the same that are formed to be deformed by heat and controlled to switch a circuit.
  • a switch for driving in a thermal manner has been developed.
  • heat is transferred in a state where two materials having different coefficients of thermal expansion are integrally combined, a portion having a relatively higher coefficient of thermal expansion is more deformed to bend toward a portion having a lower coefficient of thermal expansion.
  • the switch can be driven by deforming the switch by heat generated by passing a current through the switch.
  • the present invention has been made to solve the problems of the above-described switch structure, the heating is deformed toward the electrode, and the body is coupled to the heating is deformed from the electrode is coupled to the drive is turned on by the thermal drive It is an object of the present invention to provide a switch structure and a method for manufacturing the same, which perform all of the off operation and maintain a contact state by using electrostatic force between the driving body and the electrode during contact.
  • the switch structure for solving the above problems includes a first anchor structure connected to the contact control electrode provided on the substrate, and a second anchor structure connected to the separation control electrode provided on the substrate.
  • a first driver connected to the first anchor structure and deformed to approach the substrate when heated, a second driver connected to the second anchor structure and deformed to be spaced apart from the substrate when heated;
  • a body part including a connecting body connecting the first driving body and the second driving body so that the first driving body and the second driving body are deformable by each other and insulated from each other;
  • the first driving member includes a first deforming member extending from the first anchor structure and a first connection member provided at a free end of the first deforming member.
  • the second driving member may include a second deforming member extending from the second anchor structure and a second connecting member provided at a free end of the second deforming member.
  • the first driving member includes two first deformation members disposed in parallel with each other, and the first connection member connects free ends of each of the two first deformation members.
  • the second driving member includes two second deforming members disposed in parallel with each other, and the second connection member connects free ends of each of the two second deforming members.
  • the second deforming member may be disposed in parallel to each other.
  • the two second deforming members are disposed between the two first deforming members, and the first connection member is disposed closer to the free end side than the second connection member. Can be.
  • the connecting member may block heat transfer between the first driver and the second driver.
  • the contact portion may include a protrusion formed to protrude toward the substrate.
  • the first connection member may be disposed above the ground electrode provided on the substrate.
  • a method of manufacturing a switch structure including: forming a sacrificial layer covering a contact control electrode, a separation control electrode, and a signal electrode installed on a substrate; Depositing a conductive material on the sacrificial layer above the signal electrode to form a contact portion; Removing the sacrificial layer above the contact control electrode and the separation control electrode and forming a first anchor structure and a second anchor structure on the contact control electrode and the separation control electrode, respectively; Forming a second driver on the sacrificial layer, the second driver connected to the second anchor structure and deformed to approach the substrate when heated; Forming a connector on the second driver, the contact portion, and the sacrificial layer; Forming a first driving body connected to the first anchor structure on the connecting body and deformed to be spaced apart from the substrate when heated; And removing the sacrificial layer, wherein the connector is configured to separate the first driving body and the second driving body so that the first driving body
  • the switch structure according to the present invention includes a body portion coupled with a driving body heated and deformed toward the electrode, and a heated body deformed from the electrode to perform both on and off operations of the switch by thermal driving.
  • the contact state may be maintained using a constant power between the driving body and the electrode.
  • FIG. 1 is a schematic perspective view of a switch structure according to an embodiment of the present invention.
  • FIG. 2 is a schematic side cross-sectional view of the switch structure of FIG. 1 along line A-A.
  • FIG. 3 is a flow chart showing each step of the method for manufacturing a switch structure according to another embodiment of the present invention.
  • 4A to 4H are schematic side cross-sectional views showing states at each manufacturing step of the switch structure of FIG. 1 along the lines A-A and B-B.
  • the switch structure 100 is configured to electrically connect or disconnect the separated signal electrodes 21. That is, the flow of current to the signal electrode 21 can be controlled by the opening and closing operation of the switch structure 100.
  • the signal electrode 21 and the ground electrodes 22a and 22b are provided on the substrate 40.
  • Contact control electrodes 11a and 11b and separate control electrodes 12a and 12b for transmitting a control signal to the switch structure 100 are also provided on the substrate 40.
  • Such electrodes may be electrodes disposed on a high frequency circuit.
  • the switch structure 100 may be a microelectromechanical system (MEMS) switch for switching such high frequency circuits.
  • MEMS microelectromechanical system
  • the substrate 40 may be coated with the insulating layer 50.
  • the electrodes may be installed on the insulating layer 50 in a state where they are separated from each other.
  • the insulating layer 50 may be made of silicon oxide.
  • the switch structure 100 includes an anchor portion 110, a body portion 120, and a contact portion 130.
  • the anchor portion 110 includes a first anchor structure 111 and a second anchor structure 112.
  • the first anchor structure 111 is connected to the contact control electrodes 11a and 11b.
  • the first anchor structure 111 may be formed on the contact control electrodes 11a and 11b to be electrically connected to the contact control electrodes 11a and 11b.
  • the second anchor structure 112 is connected to the separation control electrodes 12a and 12b.
  • the second anchor structure 112 may be formed on the separation control electrodes 12a and 12b and electrically connected to the separation control electrodes 12a and 12b.
  • the first anchor structure 111 and the second anchor structure 112 may be arranged in a line. As shown, the contact control electrodes 11a and 11b and the separation control electrodes 12a and 12b are arranged in a line, and a first anchor structure 111 and a second anchor structure 112 are formed on each electrode. Can be.
  • the second anchor structure 112 may be disposed between the first anchor structures 111.
  • An anode and a cathode of the separation control electrodes 12a and 12b may be disposed between the anode and the cathode of the contact control electrodes 11a and 11b.
  • the switching operation by the body portion 120 can be simple and accurate.
  • the first driving body 121 and the second driving body 122 that are deformed in different directions may be deformed together by deformation of each other.
  • the body part 120 includes a first driving body 121, a second driving body 122, and a connecting body 123.
  • the first driving member 121 includes a first deforming member 121a extending from the first anchor structure 111 and a first connection member 121b provided at a free end of the first deforming member 121a. do.
  • One end of the first driving body 121 is connected to and supported by the first anchor structure 111, and the other end of the first driving body 121 may move up and down by deformation of the first driving body 121. .
  • the first deforming member 121a may extend in parallel with the substrate 40. In addition, the first deforming member 121a may extend in a direction perpendicular to the arrangement direction of the anchor structures 111 and 112.
  • the two first deforming members 121a may be arranged in parallel with each other.
  • the first deforming members 121a extending from the two first anchor structures 111 may be symmetrically supported in a direction perpendicular to the deformation direction.
  • the first connecting member 121b may connect the free ends of each of the two first deforming members 121a. As the first deforming member 121a is connected by the first connection member 121b, current may flow from the contact control electrodes 11a and 11b through the first driving body 121.
  • the first driver 121 is deformed to approach the substrate 40 when heated.
  • the upper portion of the first deformable member 121a is made of a material having a relatively high thermal expansion coefficient
  • the lower portion of the first deformable member 121a is made of a material having a relatively low thermal expansion coefficient, and thus is heated by the first driving body ( 121 may be modified to move the first connection member 121b toward the substrate 40.
  • the second driving body 122 includes a second deforming member 122a extending from the second anchor structure 112 and a second connecting member 122b provided at the free end of the second deforming member 122a. do.
  • One end of the second drive body 122 is connected to and supported by the second anchor structure 112, and the other end of the second drive body 122 may move up and down by deformation of the second drive body 122. .
  • the second deforming member 122a may extend in parallel with the substrate 40.
  • the second deformable member 122a may extend in a direction perpendicular to the arrangement direction of the anchor structures 111 and 112.
  • the two second deforming members 122a may be disposed in parallel to each other.
  • the second deforming members 122a extending from the two second anchor structures 112 may be symmetrically supported in a direction perpendicular to the deformation direction.
  • the second connection member 122b may connect the free ends of each of the two second deformation members 122a. As the second deformable member 122a is connected by the second connection member 122b, current may flow from the separation control electrodes 12a and 12b through the second driver 122.
  • the second driver 122 is deformed to be spaced apart from the substrate 40 when heated.
  • the upper part of the second deformable member 122a is made of a material having a relatively low thermal expansion coefficient
  • the lower part of the second deformable member 122a is made of a material having a relatively high thermal expansion coefficient, so that the second driving body ( 122 may be modified such that the second connection member 122b is spaced apart from the substrate 40.
  • the first deforming member 121a and the second deforming member 122b may be disposed in parallel to each other. As a result, when any one of the deforming members 121a and 122a is heated and deformed, the other deforms together in the same direction and may be supported by the anchor structures 111 and 112.
  • Two second deforming members 122a may be disposed between the two first deforming members 121a. That is, the U-shaped structure formed by the second deforming member 122a and the second connecting member 122b is disposed inside the U-shaped structure formed by the first deforming member 121a and the first connecting member 121b. Can be. In this case, the first connection member 121b may be disposed closer to the free end side than the second connection member 122b.
  • the first driving body 121 and the second driving body 122 are symmetrically disposed with respect to the center line of each pair of the deforming members 121a and 122a, thereby deforming by the first driving body 121.
  • Deformation by the second driving body 122 may be made on the same plane.
  • the second driving body 122 is disposed inside the first driving body 121, deformation by any one driving body can be effectively transmitted to the other driving body, and in particular, a larger force is required for the deformation.
  • Deformation in the direction of approach toward the substrate 40 may be made larger by deformation in the separation direction.
  • the first driving body 121 and the second driving body 122 are connected by the connecting body 123.
  • the connecting body 123 connects the first driving body 121 and the second driving body 122 such that the first driving body 121 and the second driving body 122 are deformable by each other but are insulated from each other. Let's do it.
  • the connecting body 123 is disposed between the upper surface of the second driving body 122, the lower surface of the first driving body 121, and the first driving body 121 and the second driving body 122 as shown. It may be formed to.
  • the connecting member 123 is bent between the first connecting member 121b and the second connecting member 122b to be coupled to the upper surface of the second connecting member 122b and the lower surface of the first connecting member 121b. Can be formed.
  • the connecting body 123 blocks heat transfer between the first driving body 121 and the second driving body 122 so that any one of the first driving body 121 and the second driving body 122 is heated and deformed. At this time, it is preferable that the other one is also heated to prevent deformation in different directions from occurring at the same time.
  • the connecting member 123 may be deformed by the deformation of the first driving body 121 and the second driving body 122, respectively, and the first driving body 121 and the second driving body 122 may be modified.
  • the first driving body 121 and the second driving body 122 are connected to be insulated from each other in order to separate the current flowing in each.
  • the contact portion 130 is provided in the connecting body 123.
  • the contact portion 130 may be disposed at the end of the free end of the connector 123.
  • the contact unit 130 is provided on the lower surface of the connecting body 123, and the signal electrode 21 is moved by the free end of the connecting body 123 caused by the deformation of the first driving body 121 and the second driving body 122. ) May be contacted or spaced apart from the signal electrode 21.
  • the contact unit 130 contacts the signal electrode 21 to form an electrical connection.
  • the signal electrode 21 may be installed on the substrate 40 in various structures, and may be installed such that an electrical connection is formed or blocked by contact or separation of the contact unit 130.
  • the contact unit 130 approaches the signal electrode 21 when the first driver 121 is heated and deformed, and contacts the signal electrode 21 to form an electrical connection.
  • the contact part 130 is spaced apart from the signal electrode 21 when the second driving body 122 is heated and deformed, and blocks the electrical connection at the signal electrode 21.
  • the contact unit 130 may include a protrusion 131 protruding toward the substrate 40.
  • the first connection member 121b may be disposed on the substrate 40 and disposed above the ground electrode 22a that is grounded.
  • the ground electrode By generating a potential difference between the first connection member 121b with respect to 22a, an electrostatic force may be generated between the ground electrode 22a and the first connection member 121b.
  • the body 120 may be maintained in the state of approaching the substrate 40 by the electrostatic force between the ground electrode 22a and the first connection member 121b, thereby minimizing power consumption for maintaining the switching state.
  • the method for manufacturing a switch structure includes forming a sacrificial layer (S110), forming a contact portion (S120), and forming an anchor portion. (S130), forming the second driver (S140), forming the connector (S150), forming the first driver (S160), and removing the sacrificial layer (S170). do.
  • the sacrificial layer 60 is formed to cover the control electrode 11, the ground electrode 22, and the signal electrode 21 provided on the substrate (S110).
  • the substrate 40 may be coated by an insulating layer 50 made of a silicon oxide film, and electrodes made of a conductive material may be provided on the insulating layer 50.
  • the sacrificial layer 60 is coated to entirely cover the electrodes and the insulating layer 50.
  • the sacrificial layer 60 may be made of polyimide (PI).
  • the thickness of the sacrificial layer 60 may be appropriately selected in consideration of the distance between the contact portion 130 and the electrode.
  • a conductive material is deposited on the sacrificial layer 60 above the signal electrode 21 to form the contact portion 130 (S120).
  • an upper portion of the sacrificial layer 60 above the signal electrode 21 is etched to form a groove for forming the protrusion 131 of the contact portion 130.
  • a conductive material may be deposited on the etched groove and the top surface of the sacrificial layer 60 to form the contact portion 130 as illustrated in FIG. 4D.
  • the sacrificial layer 60 on the control electrode 11 on which the anchor portion 110 is to be formed may be etched and the anchor portion 110 may be formed by electroplating.
  • the respective anchor structures may be formed on the contact control electrode and the separation control electrode.
  • a second driver 122 connected to the anchor structure on the separation control electrode and deformed to be spaced apart from the substrate 40 when heated is formed on the sacrificial layer 60 (S140).
  • the second driver 122 is formed on the sacrificial layer 60 to be connected to the anchor structure on the separation control electrode among the anchor parts 110 formed on the control electrode.
  • the anchor structure and the second driver 122 on the separation control electrode may be formed at the same time.
  • the connector 123 is formed on the second driver 122, the contact part 130, and the sacrificial layer 60 (S150).
  • the interconnect 123 is formed by depositing an insulating material on the second driver 122, the contact 130, and the sacrificial layer 60 of the remaining portions formed in the above-described steps.
  • the connecting body 123 may be coupled to the second driving body 122 and the contacting part 130 to be fixed to each other even after removing the sacrificial layer 60.
  • the first driving body 121 is formed on the connecting body 123 and connected to the anchor structure on the contact control electrode and deformed to approach the substrate 40 when heated (S160).
  • the first driver 121 is formed on the connector 123 to be connected to the anchor structure on the contact control electrode among the anchor parts 110 formed on the control electrode.
  • the first driver 121 and the second driver 122 may be coupled by the connecting member 123.
  • a switch structure 100 operable on the substrate 40 is manufactured.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)

Abstract

A switch structure body comprises: a first anchor structure body which is connected to a contact control electrode installed on a substrate; an anchor portion which includes a second anchor structure body which is connected to a separation control electrode installed on the substrate; a first driving body which is connected to the first anchor structure body and upon heating deforms so as to approach the substrate; a second driving body which is connected to the second anchor structure body and upon heating deforms so as to be spaced apart from the substrate; a body portion which includes a connecting body which connects the first driving body and the second driving body so that the first driving body and the second driving body are deformable by mutual deformation but insulated, respectively, and a contact portion which is provided on the connector, and is made of a conductive material, is in contact with a signal electrode which is provided on the substrate to form an electrical connection, wherein the contact portion is in contact with or separated from the signal electrode as either the first driving body or the second driving body is heated and deformed.

Description

열구동 스위치 구조체 및 그 제조 방법Thermal drive switch structure and manufacturing method thereof
본 발명은 열구동 스위치 구조체 및 그 제조 방법에 관한 것으로서, 보다 상세하게는 열에 의해 변형되도록 형성되어 회로를 스위칭하도록 제어되는 스위치 구조체 및 그 제조 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermally driven switch structure and a method of manufacturing the same, and more particularly, to a switch structure and a method of manufacturing the same that are formed to be deformed by heat and controlled to switch a circuit.
[국가지원 연구개발에 대한 설명][Description of National Support R & D]
본 연구는 한국산업기술평가관리원의 관리 하에 산업통상자원부의 전자정보디바이스 산업 원천기술개발 사업의 IoT향 다중대역 RF MEMS 소자 원천기술 개발에 관한 연구(과제 고유번호: 1711041040)의 지원에 의하여 이루어진 것이다.This study was supported by the Ministry of Trade, Industry and Energy's support for the development of IoT-based multi-band RF MEMS device technology (Project No. 1711041040) under the Ministry of Trade, Industry and Energy. .
최근 각광받는 사물 인터넷(internet of things) 분야에서, 각종 전자 제품에 고주파수의 다중 대역 통신칩이 필요함에 따라, 고주파수에서 신호 손실이 매우 높은 전자적인 스위치를 대신할 수 있는 기계적인 스위치에 대한 요구가 증가하고 있다.Recently, in the field of the Internet of things, as the need for a high-frequency multi-band communication chip for various electronic products, there is a need for a mechanical switch that can replace an electronic switch with a high signal loss at high frequencies It is increasing.
기계적인 스위치의 경우, 스위칭을 위한 스위치와 전극 간의 접촉에 있어서, 강성이 높은 스위치와 전극 간에 접촉이 이루어질 경우, 면적이 좁은 점의 형태로 접촉이 이루어짐에 따라 접촉 저항이 높아지는 문제점이 있다. 접촉 저항이 높아질 경우 발생열에 의해 스위치와 전극이 서로 달라붙을 수 있으며, 상대적으로 전류의 세기가 큰 신호를 처리하기 곤란하다.In the case of a mechanical switch, in the contact between the switch and the electrode for switching, when the contact between the switch and the electrode with high rigidity, there is a problem that the contact resistance is increased as the contact is made in the form of a narrow point. When the contact resistance is increased, the switch and the electrode may stick together due to the generated heat, and it is difficult to process a signal having a relatively large current strength.
한편, 열 방식으로 구동하는 스위치가 개발되었다. 서로 다른 열팽창계수를 가지는 두 재료가 일체로 결합된 상태에서 열이 전달되면, 상대적으로 열팽창계수가 높은 부분이 더 많이 변형되어 열팽창계수가 낮은 부분쪽으로 휘어지게 된다. 이러한 현상을 이용하여 스위치에 전류를 흘려 발생하는 열에 의해 스위치를 변형시킴으로써 스위치를 구동시킬 수 있다.Meanwhile, a switch for driving in a thermal manner has been developed. When heat is transferred in a state where two materials having different coefficients of thermal expansion are integrally combined, a portion having a relatively higher coefficient of thermal expansion is more deformed to bend toward a portion having a lower coefficient of thermal expansion. By using such a phenomenon, the switch can be driven by deforming the switch by heat generated by passing a current through the switch.
이러한 열구동 스위치를 이용하면서 스위치와 전극의 접촉 및 분리를 더욱 용이하게 구현할 수 있는 스위치 구조체가 요구된다.There is a need for a switch structure that can more easily implement contact and separation of the switch and the electrode while using such a thermally driven switch.
본 발명은 전술한 스위치 구조체의 문제점을 해결하고자 안출된 것으로, 가열되어 전극을 향하여 변형되는 구동체와, 가열되어 전극으로부터 이격되도록 변형되는 구동체가 결합된 몸체부를 포함하여 열구동에 의해 스위치의 온오프 동작을 모두 수행하며, 접촉 시 구동체와 전극 간의 정전력을 이용하여 접촉 상태를 유지할 수 있는 스위치 구조체 및 그 제조 방법을 제공함에 그 목적이 있다.The present invention has been made to solve the problems of the above-described switch structure, the heating is deformed toward the electrode, and the body is coupled to the heating is deformed from the electrode is coupled to the drive is turned on by the thermal drive It is an object of the present invention to provide a switch structure and a method for manufacturing the same, which perform all of the off operation and maintain a contact state by using electrostatic force between the driving body and the electrode during contact.
본 발명의 과제는 이상에서 언급한 과제로 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.
상기 과제를 해결하기 위한 본 발명의 일 실시예에 따른 스위치 구조체는 기판 상에 설치된 접촉 제어 전극과 연결되는 제1 앵커 구조체와, 상기 기판 상에 설치된 분리 제어 전극과 연결되는 제2 앵커 구조체를 포함하는 앵커부; 상기 제1 앵커 구조체와 연결되며, 가열 시 상기 기판에 접근하도록 변형되는 제1 구동체와, 상기 제2 앵커 구조체와 연결되며, 가열 시 상기 기판으로부터 이격되도록 변형되는 제2 구동체와, 상기 제1 구동체와 상기 제2 구동체가 각각 서로의 변형에 의해 변형 가능하되 절연되도록 상기 제1 구동체와 상기 제2 구동체를 연결시키는 연결체를 포함하는 몸체부; 및 상기 연결체에 구비되고, 전도성 재질로 이루어져 상기 기판 상에 설치된 신호 전극과 접촉하여 전기적인 연결을 형성하는 접촉부를 포함하며, 상기 제1 구동체 및 상기 제2 구동체 중 어느 하나가 가열되어 변형됨에 따라 상기 접촉부가 상기 신호 전극과 접촉되거나 분리된다.The switch structure according to an embodiment of the present invention for solving the above problems includes a first anchor structure connected to the contact control electrode provided on the substrate, and a second anchor structure connected to the separation control electrode provided on the substrate. An anchor portion; A first driver connected to the first anchor structure and deformed to approach the substrate when heated, a second driver connected to the second anchor structure and deformed to be spaced apart from the substrate when heated; A body part including a connecting body connecting the first driving body and the second driving body so that the first driving body and the second driving body are deformable by each other and insulated from each other; And a contact portion provided in the connection body, the contact portion being made of a conductive material and contacting a signal electrode provided on the substrate to form an electrical connection, wherein any one of the first driving body and the second driving body is heated to As deformed, the contact portion is brought into contact with or separated from the signal electrode.
본 발명의 일 실시예에 따르면, 상기 제1 구동체는 상기 제1 앵커 구조체로부터 연장 형성되는 제1 변형부재와, 상기 제1 변형부재의 자유 단부에 구비되는 제1 연결부재를 포함하고, 상기 제2 구동체는 상기 제2 앵커 구조체로부터 연장 형성되는 제2 변형부재와, 상기 제2 변형부재의 자유 단부에 구비되는 제2 연결부재를 포함할 수 있다.According to an embodiment of the present invention, the first driving member includes a first deforming member extending from the first anchor structure and a first connection member provided at a free end of the first deforming member. The second driving member may include a second deforming member extending from the second anchor structure and a second connecting member provided at a free end of the second deforming member.
본 발명의 일 실시예에 따르면, 상기 제1 구동체는 서로 평행하게 배치되는 두 개의 상기 제1 변형부재를 포함하고, 상기 제1 연결부재는 두 개의 상기 제1 변형부재 각각의 자유 단부를 연결시키며, 상기 제2 구동체는 서로 평행하게 배치되는 두 개의 상기 제2 변형부재를 포함하고, 상기 제2 연결부재는 두 개의 상기 제2 변형부재 각각의 자유 단부를 연결시키며, 상기 제1 변형부재와 상기 제2 변형부재는 서로 평행하게 배치될 수 있다.According to an embodiment of the present invention, the first driving member includes two first deformation members disposed in parallel with each other, and the first connection member connects free ends of each of the two first deformation members. The second driving member includes two second deforming members disposed in parallel with each other, and the second connection member connects free ends of each of the two second deforming members. And the second deforming member may be disposed in parallel to each other.
본 발명의 일 실시예에 따르면, 두 개의 상기 제2 변형부재는 두 개의 상기 제1 변형부재의 사이에 배치되며, 상기 제1 연결부재는 상기 제2 연결부재보다 자유단 측에 더 가까이 배치될 수 있다.According to an embodiment of the present invention, the two second deforming members are disposed between the two first deforming members, and the first connection member is disposed closer to the free end side than the second connection member. Can be.
본 발명의 일 실시예에 따르면, 상기 연결체는 상기 제1 구동체와 상기 제2 구동체 간의 열전달을 차단할 수 있다.According to an embodiment of the present invention, the connecting member may block heat transfer between the first driver and the second driver.
본 발명의 일 실시예에 따르면, 상기 접촉부는 상기 기판을 향하여 돌출 형성된 돌출부를 포함할 수 있다.According to an embodiment of the present invention, the contact portion may include a protrusion formed to protrude toward the substrate.
본 발명의 일 실시예에 따르면, 상기 제1 연결부재는, 기판 상에 설치된 접지 전극의 상측에 배치될 수 있다.According to an embodiment of the present invention, the first connection member may be disposed above the ground electrode provided on the substrate.
상기 과제를 해결하기 위한 본 발명의 다른 실시예에 따른 스위치 구조체 제조방법은 기판 상에 설치된 접촉 제어 전극, 분리 제어 전극 및 신호 전극을 덮도록 희생층을 형성하는 단계; 상기 신호 전극 상방의 상기 희생층 상에 전도성 재료를 증착시켜 접촉부를 형성하는 단계; 상기 접촉 제어 전극 및 상기 분리 제어 전극 상방의 상기 희생층을 제거하고 상기 접촉 제어 전극과 상기 분리 제어 전극 상에 각각 제1 앵커 구조체 및 제2 앵커 구조체를 형성하는 단계; 상기 제2 앵커 구조체와 연결되며, 가열 시 상기 기판에 접근하도록 변형되는 제2 구동체를 상기 희생층 상에 형성하는 단계; 상기 제2 구동체, 상기 접촉부 및 상기 희생층 상에 연결체를 형성하는 단계; 상기 연결체 상에 상기 제1 앵커 구조체와 연결되며 가열 시 상기 기판으로부터 이격되도록 변형되는 제1 구동체를 형성하는 단계; 및 상기 희생층을 제거하는 단계를 포함하며, 상기 연결체는 상기 제1 구동체와 상기 제2 구동체가 각각 서로의 변형에 의해 변형 가능하되 절연되도록 상기 제1 구동체와 상기 제2 구동체를 연결시키며, 상기 제1 구동체 및 상기 제2 구동체 중 어느 하나가 가열되어 변형됨에 따라 상기 접촉부가 상기 신호 전극과 접촉되거나 분리된다.According to another aspect of the present invention, there is provided a method of manufacturing a switch structure, the method including: forming a sacrificial layer covering a contact control electrode, a separation control electrode, and a signal electrode installed on a substrate; Depositing a conductive material on the sacrificial layer above the signal electrode to form a contact portion; Removing the sacrificial layer above the contact control electrode and the separation control electrode and forming a first anchor structure and a second anchor structure on the contact control electrode and the separation control electrode, respectively; Forming a second driver on the sacrificial layer, the second driver connected to the second anchor structure and deformed to approach the substrate when heated; Forming a connector on the second driver, the contact portion, and the sacrificial layer; Forming a first driving body connected to the first anchor structure on the connecting body and deformed to be spaced apart from the substrate when heated; And removing the sacrificial layer, wherein the connector is configured to separate the first driving body and the second driving body so that the first driving body and the second driving body are deformable and insulated by deformation of each other. The contact portion is in contact with or separated from the signal electrode as one of the first and second drivers is heated and deformed.
본 발명에 따른 스위치 구조체는 가열되어 전극을 향하여 변형되는 구동체와, 가열되어 전극으로부터 이격되도록 변형되는 구동체가 결합된 몸체부를 포함하여 열구동에 의해 스위치의 온오프 동작을 모두 수행하는 바, 접촉 시 구동체와 전극 간의 정전력을 이용하여 접촉 상태를 유지할 수 있다.The switch structure according to the present invention includes a body portion coupled with a driving body heated and deformed toward the electrode, and a heated body deformed from the electrode to perform both on and off operations of the switch by thermal driving. The contact state may be maintained using a constant power between the driving body and the electrode.
도 1은 본 발명의 일 실시예에 따른 스위치 구조체의 개략적인 사시도이다.1 is a schematic perspective view of a switch structure according to an embodiment of the present invention.
도 2는 A-A선에 따른 도 1의 스위치 구조체의 개략적인 측단면도이다.2 is a schematic side cross-sectional view of the switch structure of FIG. 1 along line A-A.
도 3은 본 발명의 다른 실시예에 따른 스위치 구조체 제조 방법의 각 단계를 나타내는 흐름도이다.3 is a flow chart showing each step of the method for manufacturing a switch structure according to another embodiment of the present invention.
도 4a 내지 도 4h는 A-A선 및 B-B선에 따른 도 1의 스위치 구조체의 각 제조 단계에서의 상태를 도시하는 개략적인 측단면도이다.4A to 4H are schematic side cross-sectional views showing states at each manufacturing step of the switch structure of FIG. 1 along the lines A-A and B-B.
이하, 첨부된 도면을 참고로 하여 본 발명의 일 실시예에 따른 스위치 구조체에 대해 설명하기로 한다.Hereinafter, a switch structure according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.
스위치 구조체(100)는 분리된 신호 전극(21)을 전기적으로 연결하거나 차단되도록 구성된다. 즉, 스위치 구조체(100)의 개폐 동작에 의해 신호 전극(21)으로의 전류 흐름을 제어할 수 있다.The switch structure 100 is configured to electrically connect or disconnect the separated signal electrodes 21. That is, the flow of current to the signal electrode 21 can be controlled by the opening and closing operation of the switch structure 100.
신호 전극(21) 및 접지 전극(22a, 22b)은 기판(40) 상에 설치된다. 스위치 구조체(100)에 제어 신호를 전달하는 접촉 제어 전극(11a, 11b)　및 분리 제어 전극(12a, 12b) 또한 기판(40) 상에 설치된다.The signal electrode 21 and the ground electrodes 22a and 22b are provided on the substrate 40. Contact control electrodes 11a and 11b and separate control electrodes 12a and 12b for transmitting a control signal to the switch structure 100 are also provided on the substrate 40.
이러한 전극들은 고주파수 회로 상에 배치되는 전극일 수 있다. 본 실시예에서, 스위치 구조체(100)는 이러한 고주파수 회로를 스위칭하는 미세 전자 기계 시스템(microelectromechanical system, MEMS) 스위치일 수 있다.Such electrodes may be electrodes disposed on a high frequency circuit. In this embodiment, the switch structure 100 may be a microelectromechanical system (MEMS) switch for switching such high frequency circuits.
기판(40)은 절연층(50)으로 코팅될 수 있다. 이로써, 전극들은 절연층(50) 상에 서로 분리된 상태로 설치될 수 있다. 절연층(50)은 실리콘 산화물로 이루어질 수 있다.The substrate 40 may be coated with the insulating layer 50. Thus, the electrodes may be installed on the insulating layer 50 in a state where they are separated from each other. The insulating layer 50 may be made of silicon oxide.
스위치 구조체(100)는 앵커부(110)와, 몸체부(120)와, 접촉부(130)를 포함한다.The switch structure 100 includes an anchor portion 110, a body portion 120, and a contact portion 130.
앵커부(110)는 제1 앵커 구조체(111)와, 제2 앵커 구조체(112)를 포함한다.The anchor portion 110 includes a first anchor structure 111 and a second anchor structure 112.
제1 앵커 구조체(111)는 접촉 제어 전극(11a, 11b)과 연결된다. 제1 앵커 구조체(111)는 접촉 제어 전극(11a, 11b) 상에 형성되어, 접촉 제어 전극(11a, 11b)과 전기적으로도 연결될 수 있다.The first anchor structure 111 is connected to the contact control electrodes 11a and 11b. The first anchor structure 111 may be formed on the contact control electrodes 11a and 11b to be electrically connected to the contact control electrodes 11a and 11b.
제2 앵커 구조체(112)는 분리 제어 전극(12a, 12b)과 연결된다. 제2 앵커 구조체(112)는 분리 제어 전극(12a, 12b) 상에 형성되어, 분리 제어 전극(12a, 12b)과 전기적으로도 연결될 수 있다.The second anchor structure 112 is connected to the separation control electrodes 12a and 12b. The second anchor structure 112 may be formed on the separation control electrodes 12a and 12b and electrically connected to the separation control electrodes 12a and 12b.
제1 앵커 구조체(111)와 제2 앵커 구조체(112)는 일렬로 배치될 수 있다. 도시된 바와 같이, 접촉 제어 전극(11a, 11b)과 분리 제어 전극(12a, 12b)이 일렬로 배열되고, 각각의 전극 위에 제1 앵커 구조체(111)와 제2 앵커 구조체(112)가 형성될 수 있다.The first anchor structure 111 and the second anchor structure 112 may be arranged in a line. As shown, the contact control electrodes 11a and 11b and the separation control electrodes 12a and 12b are arranged in a line, and a first anchor structure 111 and a second anchor structure 112 are formed on each electrode. Can be.
제2 앵커 구조체(112)는 제1 앵커 구조체들(111) 사이에 배치될 수 있다. 접촉 제어 전극(11a, 11b)의 양극과 음극 사이에 분리 제어 전극(12a, 12b)의 양극과 음극이 배치될 수 있다.The second anchor structure 112 may be disposed between the first anchor structures 111. An anode and a cathode of the separation control electrodes 12a and 12b may be disposed between the anode and the cathode of the contact control electrodes 11a and 11b.
일렬로 배치되도록 형성된 앵커부(110)에 몸체부(120)에 연결됨으로써 몸체부(120)에 의한 스위칭 동작이 단순하고 정확해질 수 있다. 특히, 이하에서 설명되는 바와 같이, 서로 다른 방향으로 변형되는 제1 구동체(121)와 제2 구동체(122)가 서로의 변형에 의하여 함께 변형될 수 있다.By being connected to the body portion 120 to the anchor portion 110 formed to be arranged in a line, the switching operation by the body portion 120 can be simple and accurate. In particular, as described below, the first driving body 121 and the second driving body 122 that are deformed in different directions may be deformed together by deformation of each other.
몸체부(120)는 제1 구동체(121)와, 제2 구동체(122)와, 연결체(123)를 포함한다.The body part 120 includes a first driving body 121, a second driving body 122, and a connecting body 123.
제1 구동체(121)는 제1 앵커 구조체(111)로부터 연장 형성되는 제1 변형부재(121a)와, 제1 변형부재(121a)의 자유 단부에 구비되는 제1 연결부재(121b)를 포함한다.The first driving member 121 includes a first deforming member 121a extending from the first anchor structure 111 and a first connection member 121b provided at a free end of the first deforming member 121a. do.
제1 구동체(121)의 일단부는 제1 앵커 구조체(111)에 연결되어 지지되며, 제1 구동체(121)의 타단부는 제1 구동체(121)의 변형에 의해 상하로 이동할 수 있다.One end of the first driving body 121 is connected to and supported by the first anchor structure 111, and the other end of the first driving body 121 may move up and down by deformation of the first driving body 121. .
제1 변형부재(121a)는 기판(40)과 평행하게 연장될 수 있다. 또한, 제1 변형부재(121a)는 앵커 구조체들(111, 112)의 배열 방향에 대해 수직한 방향으로 연장될 수 있다.The first deforming member 121a may extend in parallel with the substrate 40. In addition, the first deforming member 121a may extend in a direction perpendicular to the arrangement direction of the anchor structures 111 and 112.
한편, 두 개의 제1 변형부재(121a)는 서로 평행하게 배치될 수 있다. 두 개의 제1 앵커 구조체(111)로부터 각각 연장된 제1 변형부재들(121a)에 의해 변형 방향에 대하여 수직한 방향으로 대칭적으로 지지될 수 있다.Meanwhile, the two first deforming members 121a may be arranged in parallel with each other. The first deforming members 121a extending from the two first anchor structures 111 may be symmetrically supported in a direction perpendicular to the deformation direction.
제1 연결부재(121b)는 두 개의 제1 변형부재(121a) 각각의 자유 단부를 연결시킬 수 있다. 제1 변형부재(121a)가 제1 연결부재(121b)에 의해 연결됨에 따라 접촉 제어 전극(11a, 11b)으로부터 제1 구동체(121)를 통해 전류가 흐를 수 있다.The first connecting member 121b may connect the free ends of each of the two first deforming members 121a. As the first deforming member 121a is connected by the first connection member 121b, current may flow from the contact control electrodes 11a and 11b through the first driving body 121.
제1 구동체(121)는 가열 시 기판(40)에 접근하도록 변형된다. 제1 변형부재(121a)의 상부는 열팽창계수가 상대적으로 높은 재질로 이루어지고, 제1 변형부재(121a)의 하부는 열팽창계수가 상대적으로 낮은 재질로 이루어짐으로써, 가열됨에 따라 제1 구동체(121)는 제1 연결부재(121b)가 기판(40)을 향하여 이동하도록 변형될 수 있다.The first driver 121 is deformed to approach the substrate 40 when heated. The upper portion of the first deformable member 121a is made of a material having a relatively high thermal expansion coefficient, and the lower portion of the first deformable member 121a is made of a material having a relatively low thermal expansion coefficient, and thus is heated by the first driving body ( 121 may be modified to move the first connection member 121b toward the substrate 40.
제2 구동체(122)는 제2 앵커 구조체(112)로부터 연장 형성되는 제2 변형부재(122a)와, 제2 변형부재(122a)의 자유 단부에 구비되는 제2 연결부재(122b)를 포함한다.The second driving body 122 includes a second deforming member 122a extending from the second anchor structure 112 and a second connecting member 122b provided at the free end of the second deforming member 122a. do.
제2 구동체(122)의 일단부는 제2 앵커 구조체(112)에 연결되어 지지되며, 제2 구동체(122)의 타단부는 제2 구동체(122)의 변형에 의해 상하로 이동할 수 있다.One end of the second drive body 122 is connected to and supported by the second anchor structure 112, and the other end of the second drive body 122 may move up and down by deformation of the second drive body 122. .
제2 변형부재(122a)는 기판(40)과 평행하게 연장될 수 있다. 또한, 제2 변형부재(122a)는 앵커 구조체들(111, 112)의 배열 방향에 대해 수직한 방향으로 연장될 수 있다.The second deforming member 122a may extend in parallel with the substrate 40. In addition, the second deformable member 122a may extend in a direction perpendicular to the arrangement direction of the anchor structures 111 and 112.
한편, 두 개의 제2 변형부재(122a)는 서로 평행하게 배치될 수 있다. 두 개의 제2 앵커 구조체(112)로부터 각각 연장된 제2 변형부재들(122a)에 의해 변형 방향에 대하여 수직한 방향으로 대칭적으로 지지될 수 있다.Meanwhile, the two second deforming members 122a may be disposed in parallel to each other. The second deforming members 122a extending from the two second anchor structures 112 may be symmetrically supported in a direction perpendicular to the deformation direction.
제2 연결부재(122b)는 두 개의 제2 변형부재(122a) 각각의 자유 단부를 연결시킬 수 있다. 제2 변형부재(122a)가 제2 연결부재(122b)에 의해 연결됨에 따라 분리 제어 전극(12a, 12b)으로부터 제2 구동체(122)를 통해 전류가 흐를 수 있다.The second connection member 122b may connect the free ends of each of the two second deformation members 122a. As the second deformable member 122a is connected by the second connection member 122b, current may flow from the separation control electrodes 12a and 12b through the second driver 122.
제2 구동체(122)는 가열 시 기판(40)으로부터 이격되도록 변형된다. 제2 변형부재(122a)의 상부는 열팽창계수가 상대적으로 낮은 재질로 이루어지고, 제2 변형부재(122a)의 하부는 열팽창계수가 상대적으로 높은 재질로 이루어짐으로써, 가열됨에 따라 제2 구동체(122)는 제2 연결부재(122b)가 기판(40)으로부터 이격되도록 변형될 수 있다.The second driver 122 is deformed to be spaced apart from the substrate 40 when heated. The upper part of the second deformable member 122a is made of a material having a relatively low thermal expansion coefficient, and the lower part of the second deformable member 122a is made of a material having a relatively high thermal expansion coefficient, so that the second driving body ( 122 may be modified such that the second connection member 122b is spaced apart from the substrate 40.
제1 변형부재(121a)와 제2 변형부재(122b)는 서로 평행하게 배치될 수 있다. 이로써, 변형부재들(121a, 122a) 중 어느 하나가 가열되어 변형될 때, 다른 하나가 함께 동일한 방향으로 변형됨과 동시에, 앵커 구조체들(111, 112)에 의해 지지될 수 있다.The first deforming member 121a and the second deforming member 122b may be disposed in parallel to each other. As a result, when any one of the deforming members 121a and 122a is heated and deformed, the other deforms together in the same direction and may be supported by the anchor structures 111 and 112.
두 개의 제2 변형부재(122a)는 두 개의 제1 변형부재(121a) 사이에 배치될 수 있다. 즉, 제2 변형부재(122a)와 제2 연결부재(122b)가 이루는 U자 형상의 구조는 제1 변형부재(121a)와 제1 연결부재(121b)가 이루는 U자 형상의 구조 내측에 배치될 수 있다. 이때, 제1 연결부재(121b)는 제2 연결부재(122b)보다 자유단 측에 더 가까이 배치될 수 있다.Two second deforming members 122a may be disposed between the two first deforming members 121a. That is, the U-shaped structure formed by the second deforming member 122a and the second connecting member 122b is disposed inside the U-shaped structure formed by the first deforming member 121a and the first connecting member 121b. Can be. In this case, the first connection member 121b may be disposed closer to the free end side than the second connection member 122b.
각각의 변형부재들(121a, 122a)의 각각의 쌍의 중심선에 대해 제1 구동체(121) 및 제2 구동체(122)가 대칭적으로 배치됨으로써, 제1 구동체(121)에 의한 변형과 제2 구동체(122)에 의한 변형이 동일한 평면 상에서 이루어질 수 있다. The first driving body 121 and the second driving body 122 are symmetrically disposed with respect to the center line of each pair of the deforming members 121a and 122a, thereby deforming by the first driving body 121. Deformation by the second driving body 122 may be made on the same plane.
또한, 제2 구동체(122)가 제1 구동체(121) 내측에 배치됨으로써, 어느 하나의 구동체에 의한 변형이 다른 구동체에 효과적으로 전달될 수 있으며, 특히, 변형에 더 큰 힘이 요구되는 기판(40)을 향해 접근하는 방향으로의 변형이 이격 방향으로의 변형에 의해 더 크게 생성될 수 있다.In addition, since the second driving body 122 is disposed inside the first driving body 121, deformation by any one driving body can be effectively transmitted to the other driving body, and in particular, a larger force is required for the deformation. Deformation in the direction of approach toward the substrate 40 may be made larger by deformation in the separation direction.
이와 같이, 스위치 온오프 방향 각각에 대한 구동이 제1 구동체(121) 및 제2 구동체(122) 각각에 의해 이루어짐으로써, 스위칭 및 복원에 대한 신뢰성을 증대시킬 수 있다.As such, driving in each of the switch on / off directions is performed by each of the first driver 121 and the second driver 122, thereby increasing reliability of switching and restoring.
제1 구동체(121)와 제2 구동체(122)는 연결체(123)에 의해 연결된다. 연결체(123)는 제1 구동체(121)와 제2 구동체(122)가 각각 서로의 변형에 의해 변형 가능하되 절연되도록 제1 구동체(121) 및 제2 구동체(122)를 연결시킨다.The first driving body 121 and the second driving body 122 are connected by the connecting body 123. The connecting body 123 connects the first driving body 121 and the second driving body 122 such that the first driving body 121 and the second driving body 122 are deformable by each other but are insulated from each other. Let's do it.
연결체(123)는 도시된 바와 같이 제2 구동체(122)의 상면과, 제1 구동체(121)의 하면과, 제1 구동체(121) 및 제2 구동체(122) 사이에 배치되도록 형성될 수 있다. 연결체(123)는 제2 연결부재(122b)의 상면과, 제1 연결부재(121b)의 하면에 결합되도록 제1 연결부재(121b)와 제2 연결부재(122b) 사이에서 절곡된 형태로 형성될 수 있다.The connecting body 123 is disposed between the upper surface of the second driving body 122, the lower surface of the first driving body 121, and the first driving body 121 and the second driving body 122 as shown. It may be formed to. The connecting member 123 is bent between the first connecting member 121b and the second connecting member 122b to be coupled to the upper surface of the second connecting member 122b and the lower surface of the first connecting member 121b. Can be formed.
연결체(123)는 제1 구동체(121)와 제2 구동체(122) 간의 열전달을 차단함으로써, 제1 구동체(121) 및 제2 구동체(122) 중 어느 하나가 가열되어 변형될 때, 다른 하나 또한 가열됨으로써 서로 다른 방향으로의 변형이 동시에 발생하는 것을 방지하는 것이 바람직하다.The connecting body 123 blocks heat transfer between the first driving body 121 and the second driving body 122 so that any one of the first driving body 121 and the second driving body 122 is heated and deformed. At this time, it is preferable that the other one is also heated to prevent deformation in different directions from occurring at the same time.
이와 같이, 연결체(123)는 제1 구동체(121)와 제2 구동체(122)가 각각 서로의 변형에 의해 변형 가능하되, 제1 구동체(121)와 제2 구동체(122) 각각에 흐르는 전류가 분리되기 위하여 서로 절연되도록 제1 구동체(121)와 제2 구동체(122)를 연결시킨다.As described above, the connecting member 123 may be deformed by the deformation of the first driving body 121 and the second driving body 122, respectively, and the first driving body 121 and the second driving body 122 may be modified. The first driving body 121 and the second driving body 122 are connected to be insulated from each other in order to separate the current flowing in each.
접촉부(130)는 연결체(123)에 구비된다. 접촉부(130)는 연결체(123)의 자유 단부의 말단에 배치될 수 있다. 접촉부(130)는 연결체(123)의 하면에 구비되어, 제1 구동체(121) 및 제2 구동체(122)의 변형에 의한 연결체(123) 자유단의 이동에 의해 신호 전극(21)과 접촉하거나 신호 전극(21)으로부터 이격될 수 있다.The contact portion 130 is provided in the connecting body 123. The contact portion 130 may be disposed at the end of the free end of the connector 123. The contact unit 130 is provided on the lower surface of the connecting body 123, and the signal electrode 21 is moved by the free end of the connecting body 123 caused by the deformation of the first driving body 121 and the second driving body 122. ) May be contacted or spaced apart from the signal electrode 21.
접촉부(130)는 신호 전극(21)과 접촉하여 전기적인 연결을 형성한다. 신호 전극(21)은 다양한 구조로 기판(40) 상에 설치되며, 접촉부(130)의 접촉 또는 분리에 의해 전기적인 연결이 형성되거나 차단되도록 설치될 수 있다.The contact unit 130 contacts the signal electrode 21 to form an electrical connection. The signal electrode 21 may be installed on the substrate 40 in various structures, and may be installed such that an electrical connection is formed or blocked by contact or separation of the contact unit 130.
접촉부(130)는 제1 구동체(121)가 가열되어 변형되면 신호 전극(21)을 향하여 접근하며 신호 전극(21)과 접촉하여 전기적인 연결을 형성한다. 접촉부(130)는 제2 구동체(122)가 가열되어 변형되면 신호 전극(21)으로부터 이격되며 신호 전극(21)에서의 전기적인 연결을 차단시킨다.The contact unit 130 approaches the signal electrode 21 when the first driver 121 is heated and deformed, and contacts the signal electrode 21 to form an electrical connection. The contact part 130 is spaced apart from the signal electrode 21 when the second driving body 122 is heated and deformed, and blocks the electrical connection at the signal electrode 21.
접촉부(130)는 기판(40)을 향하여 돌출 형성된 돌출부(131)를 포함할 수 있다.The contact unit 130 may include a protrusion 131 protruding toward the substrate 40.
한편, 제1 연결부재(121b)는 기판(40) 상에 설치되며 접지되는 접지 전극(22a)의 상측에 배치될 수 있다. 제1 구동체(121)의 변형에 의해 제1 연결부재(121b)가 접지 전극(22a)에 접근하고 접촉부(130)가 신호 전극(21)과 접촉하여 전기적인 연결을 형성한 경우, 접지 전극(22a)에 대해 제1 연결부재(121b)에 전위차를 발생시킴으로써 접지 전극(22a)과 제1 연결부재(121b) 사이에 정전기력을 발생시킬 수 있다. 이로써, 몸체부(120)는 접지 전극(22a)과 제1 연결부재(121b) 간의 정전기력에 의해 기판(40)에 접근한 상태로 유지되어, 스위칭 상태 유지를 위한 전력 소모를 최소화할 수 있다.Meanwhile, the first connection member 121b may be disposed on the substrate 40 and disposed above the ground electrode 22a that is grounded. When the first connection member 121b approaches the ground electrode 22a by the deformation of the first driving body 121 and the contact portion 130 contacts the signal electrode 21 to form an electrical connection, the ground electrode By generating a potential difference between the first connection member 121b with respect to 22a, an electrostatic force may be generated between the ground electrode 22a and the first connection member 121b. As a result, the body 120 may be maintained in the state of approaching the substrate 40 by the electrostatic force between the ground electrode 22a and the first connection member 121b, thereby minimizing power consumption for maintaining the switching state.
이하에서는, 상술한 도 1의 스위치 구조체(100)의 제조 방법에 대하여 설명하도록 한다.Hereinafter, the manufacturing method of the switch structure 100 of FIG. 1 described above will be described.
도 3 및 도 4a 내지 도 4h를 참조하면, 본 발명의 다른 실시예에 따른 스위치 구조체 제조 방법은, 희생층을 형성하는 단계(S110), 접촉부를 형성하는 단계(S120), 앵커부를 형성하는 단계(S130), 제2 구동체를 형성하는 단계(S140), 연결체를 형성하는 단계(S150), 제1 구동체를 형성하는 단계(S160), 및 희생층을 제거하는 단계(S170)를 포함한다.3 and 4A to 4H, the method for manufacturing a switch structure according to another exemplary embodiment of the present disclosure includes forming a sacrificial layer (S110), forming a contact portion (S120), and forming an anchor portion. (S130), forming the second driver (S140), forming the connector (S150), forming the first driver (S160), and removing the sacrificial layer (S170). do.
먼저, 기판 상에 설치된 제어 전극(11), 접지 전극(22) 및 신호 전극(21)을 덮도록 희생층(60)을 형성한다(S110).First, the sacrificial layer 60 is formed to cover the control electrode 11, the ground electrode 22, and the signal electrode 21 provided on the substrate (S110).
도 4a를 참조하면, 기판(40)은 실리콘 산화막으로 이루어진 절연층(50)에 의해 코팅될 수 있으며, 전도성 재질로 이루어진 전극들이 절연층(50) 상에 구비될 수 있다.Referring to FIG. 4A, the substrate 40 may be coated by an insulating layer 50 made of a silicon oxide film, and electrodes made of a conductive material may be provided on the insulating layer 50.
도 4b를 참조하면, 희생층(60)은 전극들과 절연층(50)을 전체적으로 덮도록 코팅된다. 희생층(60)은 폴리이미드(polyimide, PI)로 이루어질 수 있다. 희생층(60)의 두께는 접촉부(130)와 전극 간의 거리를 고려하여 적절하게 선정될 수 있다.Referring to FIG. 4B, the sacrificial layer 60 is coated to entirely cover the electrodes and the insulating layer 50. The sacrificial layer 60 may be made of polyimide (PI). The thickness of the sacrificial layer 60 may be appropriately selected in consideration of the distance between the contact portion 130 and the electrode.
그 다음으로, 신호 전극(21) 상방의 희생층(60) 상에 전도성 재료를 증착시켜 접촉부(130)를 형성한다(S120).Next, a conductive material is deposited on the sacrificial layer 60 above the signal electrode 21 to form the contact portion 130 (S120).
도 4c를 참조하면, 접촉부(130)의 돌출부(131)를 형성하기 위한 홈을 형성하도록 신호 전극(21) 상측의 희생층(60)의 상부 일부분을 식각한다. 식각된 홈과 주변의 희생층(60) 상면에 전도성 재료를 증착시켜 도 4d에 도시된 바와 같이 접촉부(130)를 형성할 수 있다.Referring to FIG. 4C, an upper portion of the sacrificial layer 60 above the signal electrode 21 is etched to form a groove for forming the protrusion 131 of the contact portion 130. A conductive material may be deposited on the etched groove and the top surface of the sacrificial layer 60 to form the contact portion 130 as illustrated in FIG. 4D.
그 다음으로, 제어 전극(11) 상방의 희생층(60)을 제거하고 제어 전극(11) 상에 앵커부(110)를 형성한다(S130).Next, the sacrificial layer 60 above the control electrode 11 is removed and an anchor portion 110 is formed on the control electrode 11 (S130).
도 4e 및 도 4f를 참조하면, 앵커부(110)가 형성될 제어 전극(11) 상의 희생층(60)을 식각하고, 전기 도금을 통해 앵커부(110)를 형성할 수 있다. 전술한 바와 같이, 접촉 제어 전극과 분리 제어 전극 상에 각각의 앵커 구조체를 형성할 수 있다.4E and 4F, the sacrificial layer 60 on the control electrode 11 on which the anchor portion 110 is to be formed may be etched and the anchor portion 110 may be formed by electroplating. As described above, the respective anchor structures may be formed on the contact control electrode and the separation control electrode.
그 다음으로, 분리 제어 전극 상의 앵커 구조체와 연결되며, 가열 시 기판(40)으로부터 이격되도록 변형되는 제2 구동체(122)를 희생층(60) 상에 형성한다(S140).Next, a second driver 122 connected to the anchor structure on the separation control electrode and deformed to be spaced apart from the substrate 40 when heated is formed on the sacrificial layer 60 (S140).
도 4f를 다시 참조하면, 제2 구동체(122)는 제어 전극 상에 형성된 앵커부(110) 중에서 분리 제어 전극 상의 앵커 구조체와 연결되도록 희생층(60) 상에 형성된다. 분리 제어 전극 상의 앵커 구조체와 제2 구동체(122)는 동시에 형성될 수도 있다.Referring again to FIG. 4F, the second driver 122 is formed on the sacrificial layer 60 to be connected to the anchor structure on the separation control electrode among the anchor parts 110 formed on the control electrode. The anchor structure and the second driver 122 on the separation control electrode may be formed at the same time.
그 다음으로, 제2 구동체(122), 접촉부(130) 및 희생층(60) 상에 연결체(123)를 형성한다(S150).Next, the connector 123 is formed on the second driver 122, the contact part 130, and the sacrificial layer 60 (S150).
도 4g를 참조하면, 전술한 단계들에서 형성된 제2 구동체(122), 접촉부(130) 및 나머지 부분의 희생층(60) 상측에 절연 재료를 증착하여 연결체(123)를 형성한다.Referring to FIG. 4G, the interconnect 123 is formed by depositing an insulating material on the second driver 122, the contact 130, and the sacrificial layer 60 of the remaining portions formed in the above-described steps.
연결체(123)는 제2 구동체(122) 및 접촉부(130)와 결합하여, 희생층(60) 제거 후에도 각각이 서로에 대해 고정되도록 할 수 있다.The connecting body 123 may be coupled to the second driving body 122 and the contacting part 130 to be fixed to each other even after removing the sacrificial layer 60.
그 다음으로, 연결체(123) 상에 접촉 제어 전극 상의 앵커 구조체와 연결되며 가열 시 기판(40)에 접근하도록 변형되는 제1 구동체(121)를 형성한다(S160).Next, the first driving body 121 is formed on the connecting body 123 and connected to the anchor structure on the contact control electrode and deformed to approach the substrate 40 when heated (S160).
도 4h를 참조하면, 제1 구동체(121)는 제어 전극 상에 형성된 앵커부(110) 중에서 접촉 제어 전극 상의 앵커 구조체와 연결되도록 연결체(123) 상에 형성된다. 이로써, 제1 구동체(121)와 제2 구동체(122)는 연결체(123)에 의해 결합될 수 있다.Referring to FIG. 4H, the first driver 121 is formed on the connector 123 to be connected to the anchor structure on the contact control electrode among the anchor parts 110 formed on the control electrode. As a result, the first driver 121 and the second driver 122 may be coupled by the connecting member 123.
한편, 제1 구동체(121)가 접지 전극(22)의 상방에 배치됨으로써, 제1 구동체(121)가 기판(40) 측으로 접근하였을 경우, 접지 전극(22)과 제1 구동체(121) 간의 정전력을 이용하여 스위치 구조체의 상태를 유지할 수 있다.On the other hand, when the first drive body 121 is disposed above the ground electrode 22 and the first drive body 121 approaches the substrate 40 side, the ground electrode 22 and the first drive body 121. It is possible to maintain the state of the switch structure by using the constant power between the).
마지막으로, 기판(40)과 몸체부(120) 사이의 희생층(60)을 제거한다(S170).Finally, the sacrificial layer 60 between the substrate 40 and the body portion 120 is removed (S170).
이로써, 도 2에 도시된 바와 같이, 기판(40) 상에서 동작 가능한 스위치 구조체(100)가 제조된다.Thus, as shown in FIG. 2, a switch structure 100 operable on the substrate 40 is manufactured.
한편, 상술한 스위치 구조체 제조 방법을 이루는 각 단계들 간의 순서는 예시적인 것으로 상술한 바와 상이한 순서로 수행될 수도 있음에 유의해야 한다. 또한, 각 단계에서 각각의 구성요소를 형성하게 제거하는 공정은 공지의 상이한 공정을 통해 수행될 수도 있다.Meanwhile, it should be noted that the order between the steps constituting the above-described method for manufacturing a switch structure is exemplary and may be performed in a different order from that described above. In addition, the process of removing each component to form at each step may be carried out through different known processes.

Claims (8)

  1. 기판 상에 설치된 접촉 제어 전극과 연결되는 제1 앵커 구조체와, 상기 기판 상에 설치된 분리 제어 전극과 연결되는 제2 앵커 구조체를 포함하는 앵커부;An anchor portion including a first anchor structure connected to a contact control electrode disposed on a substrate and a second anchor structure connected to a separation control electrode disposed on the substrate;
    상기 제1 앵커 구조체와 연결되며 가열 시 상기 기판에 접근하도록 변형되는 제1 구동체와, 상기 제2 앵커 구조체와 연결되며 가열 시 상기 기판으로부터 이격되도록 변형되는 제2 구동체와, 상기 제1 구동체 및 상기 제2 구동체가 각각 서로의 변형에 의해 변형 가능하되 절연되도록 상기 제1 구동체와 상기 제2 구동체를 연결시키는 연결체를 포함하는 몸체부; 및A first driver connected to the first anchor structure and deformed to approach the substrate when heated, a second driver connected to the second anchor structure and deformed to be spaced apart from the substrate when heated, and the first drive A body portion including a connecting body connecting the first driving body and the second driving body so that the body and the second driving body are deformable by each other and insulated from each other; And
    상기 연결체에 구비되고, 전도성 재질로 이루어져 상기 기판 상에 설치된 신호 전극과 접촉하여 전기적인 연결을 형성하는 접촉부를 포함하며,A contact portion provided in the connection body and made of a conductive material to contact the signal electrode provided on the substrate to form an electrical connection,
    상기 제1 구동체 및 상기 제2 구동체 중 어느 하나가 가열되어 변형됨에 따라 상기 접촉부가 상기 신호 전극과 접촉되거나 분리되는 것을 특징으로 하는 스위치 구조체.The switch structure, characterized in that the contact portion is in contact with or separated from the signal electrode as one of the first drive and the second drive is heated and deformed.
  2. 제1 항에 있어서,According to claim 1,
    상기 제1 구동체는 상기 제1 앵커 구조체로부터 연장 형성되는 제1 변형부재와, 상기 제1 변형부재의 자유 단부에 구비되는 제1 연결부재를 포함하고,The first driving body includes a first deforming member extending from the first anchor structure and a first connection member provided at a free end of the first deforming member.
    상기 제2 구동체는 상기 제2 앵커 구조체로부터 연장 형성되는 제2 변형부재와, 상기 제2 변형부재의 자유 단부에 구비되는 제2 연결부재를 포함하는 것을 특징으로 하는 스위치 구조체.The second driving body includes a second deforming member extending from the second anchor structure and a second connecting member provided at a free end of the second deforming member.
  3. 제2 항에 있어서,The method of claim 2,
    상기 제1 구동체는 서로 평행하게 배치되는 두 개의 상기 제1 변형부재를 포함하고, 상기 제1 연결부재는 두 개의 상기 제1 변형부재 각각의 자유 단부를 연결시키며,The first driving member includes two first deforming members disposed in parallel to each other, and the first connection member connects free ends of each of the two first deforming members.
    상기 제2 구동체는 서로 평행하게 배치되는 두 개의 상기 제2 변형부재를 포함하고, 상기 제2 연결부재는 두 개의 상기 제2 변형부재 각각의 자유 단부를 연결시키며,The second driving body includes two second deforming members disposed in parallel with each other, and the second connecting member connects free ends of each of the two second deforming members.
    상기 제1 변형부재와 상기 제2 변형부재는 서로 평행하게 배치되는 것을 특징으로 하는 스위치 구조체.The switch structure, characterized in that the first deforming member and the second deforming member are disposed in parallel to each other.
  4. 제3 항에 있어서,The method of claim 3, wherein
    두 개의 상기 제2 변형부재는 두 개의 상기 제1 변형부재의 사이에 배치되며,The two second deforming members are disposed between the two first deforming members,
    상기 제1 연결부재는 상기 제2 연결부재보다 자유단 측에 더 가까이 배치되는 것을 특징으로 하는 스위치 구조체.And the first connection member is disposed closer to the free end side than the second connection member.
  5. 제1 항에 있어서,According to claim 1,
    상기 연결체는 상기 제1 구동체와 상기 제2 구동체 간의 열전달을 차단하는 것을 특징으로 하는 스위치 구조체.The connector is characterized in that for blocking the heat transfer between the first drive and the second drive.
  6. 제1 항에 있어서,According to claim 1,
    상기 접촉부는 상기 기판을 향하여 돌출 형성된 돌출부를 포함하는 것을 특징으로 하는 스위치 구조체.And the contact portion includes a protrusion formed to protrude toward the substrate.
  7. 제2 항에 있어서,The method of claim 2,
    상기 제1 연결부재는, 기판 상에 설치된 접지 전극의 상측에 배치되는 것을 특징으로 하는 스위치 구조체.The first connection member, the switch structure, characterized in that disposed on the upper side of the ground electrode provided on the substrate.
  8. 기판 상에 설치된 접촉 제어 전극, 분리 제어 전극 및 신호 전극을 덮도록 희생층을 형성하는 단계;Forming a sacrificial layer covering the contact control electrode, the separation control electrode, and the signal electrode provided on the substrate;
    상기 신호 전극 상방의 상기 희생층 상에 전도성 재료를 증착시켜 접촉부를 형성하는 단계;Depositing a conductive material on the sacrificial layer above the signal electrode to form a contact portion;
    상기 접촉 제어 전극 및 상기 분리 제어 전극 상방의 상기 희생층을 제거하고 상기 접촉 제어 전극과 상기 분리 제어 전극 상에 각각 제1 앵커 구조체 및 제2 앵커 구조체를 형성하는 단계;Removing the sacrificial layer above the contact control electrode and the separation control electrode and forming a first anchor structure and a second anchor structure on the contact control electrode and the separation control electrode, respectively;
    상기 제2 앵커 구조체와 연결되며, 가열 시 상기 기판에 접근하도록 변형되는 제2 구동체를 상기 희생층 상에 형성하는 단계;Forming a second driver on the sacrificial layer, the second driver connected to the second anchor structure and deformed to approach the substrate when heated;
    상기 제2 구동체, 상기 접촉부 및 상기 희생층 상에 연결체를 형성하는 단계;Forming a connector on the second driver, the contact portion, and the sacrificial layer;
    상기 연결체 상에 상기 제1 앵커 구조체와 연결되며 가열 시 상기 기판으로부터 이격되도록 변형되는 제1 구동체를 형성하는 단계; 및Forming a first driving body connected to the first anchor structure on the connecting body and deformed to be spaced apart from the substrate when heated; And
    상기 희생층을 제거하는 단계를 포함하며,Removing the sacrificial layer;
    상기 연결체는 상기 제1 구동체와 상기 제2 구동체가 각각 서로의 변형에 의해 변형 가능하되 절연되도록 상기 제1 구동체와 상기 제2 구동체를 연결시키며,The connecting member connects the first driving member and the second driving member so that the first driving member and the second driving member are deformable by each other but are insulated from each other.
    상기 제1 구동체 및 상기 제2 구동체 중 어느 하나가 가열되어 변형됨에 따라 상기 접촉부가 상기 신호 전극과 접촉되거나 분리되는 것을 특징으로 하는 스위치 구조체 제조방법.And the contact portion is in contact with or is separated from the signal electrode as one of the first and second drivers is heated and deformed.
PCT/KR2018/006088 2017-05-31 2018-05-29 Thermal driving switch structure body and method for manufacturing same WO2018221931A1 (en)

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US20020050882A1 (en) * 2000-10-27 2002-05-02 Hyman Daniel J. Microfabricated double-throw relay with multimorph actuator and electrostatic latch mechanism
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