WO2024111711A1

WO2024111711A1 - Microprobe

Info

Publication number: WO2024111711A1
Application number: PCT/KR2022/018856
Authority: WO
Inventors: 위성엽
Original assignee: (주)마이크로컨텍솔루션
Priority date: 2022-11-25
Filing date: 2022-11-25
Publication date: 2024-05-30
Also published as: KR20240077865A

Abstract

The present invention relates to a microprobe, which has a layered structure, can be manufactured through an MEMS process, can implement a fine pitch, and eliminates the necessity for a separate process for assembling the microprobe.

Description

micro probe

The present invention relates to a microprobe, which has a fine pitch and can be manufactured by a MEMS process.

Microprobes are small contact probe devices that are widely used to transmit electrical signals. For example, microprobes are widely used in devices through which electrical signals are transmitted, such as charging terminals such as board to board connectors and batteries.

As an example, a microprobe can be used in a socket used to test the electrical performance of a semiconductor package. After semiconductor devices go through the manufacturing process, tests are performed to determine their electrical performance. The performance test of a semiconductor device is performed with a microprobe formed to make electrical contact with a terminal of the semiconductor device placed between the semiconductor device and the test circuit board.

The recent trend in semiconductor package development can be said to be light, thin and simple. Accordingly, contact terminals provided in a semiconductor package, for example, in the form of a ball, are also being developed to have a fine pitch. This reduction in size is also true for other electrical devices, and the development of microprobes with a fine pitch is widely required.

As such, there is a need to develop a microprobe with a fine pitch corresponding to the fine pitch of the contact terminals and a method of manufacturing the same.

The purpose of the present invention is to provide a microprobe that has a fine pitch and can be manufactured by a MEMS process.

In order to achieve the above-described object, a microprobe according to the present invention includes an upper contact portion constituting an upper portion; A lower contact part constituting the lower part; a hook portion whose upper portion is connected to the upper contact portion and whose lower portion is connected to the lower contact portion; an elastic portion whose upper portion is connected to the upper contact portion and whose lower portion is connected to the lower contact portion; It includes, wherein the hook part includes an upper hook and a lower hook, an upper end of the upper hook is connected to the upper contact part, a lower end of the lower hook is connected to the lower contact part, and a lower end of the upper hook A hook tip is provided at the top of the lower hook.

According to one embodiment, the hook portion is located in the first layer space of the layer, the elastic portion is located in the third layer space of the layer, and a second layer space is located between the first layer space and the third layer space, , the first to third layer spaces are parallel to each other, and the hook portion and the elastic portion are spaced apart from each other with the second layer space in between.

According to one embodiment, the elastic part is composed of a zigzag spring.

According to one embodiment, the upper contact part includes an upper body and an upper spacing panel, the upper body is located in the first layer space and connected to the elastic portion, and the upper spacing panel is located in the second layer space. It is located between the upper body and the upper hook, the lower contact part includes a lower body and a lower spaced apart panel, the lower body is located in the first layer space and connected to the elastic part, and the lower spaced panel. is located within the second layer space and is located between the lower body and the lower hook.

According to one embodiment, the upper body and the upper spaced apart panel are integrally formed, and the lower body and the lower spaced panel are formed integrally.

According to one embodiment, the hook part includes a first hook part located on the front side of the elastic part, and a second hook part located on the rear side of the elastic part, and the first hook part is located in the first layer space of the layer, , the elastic portion is located in the third layer space of the layer, the second hook portion is located in the second layer space of the layer, a second layer space is located between the first layer space and the third layer space, and the first layer space is located between the first layer space and the third layer space. A fourth layer space is located between the third layer space and the fifth layer space, the first to fifth layer spaces are parallel to each other, and the first hook portion and the elastic portion are positioned between the second layer space. They are spaced apart, and the second hook part and the elastic part are spaced apart from each other across the fourth layer space.

According to one embodiment, the third layer space sequentially includes a layered 3-1 layer space, a 3-2 layer space, and a 3-3 layer space, and the elastic portion overlaps in the front-back direction. It includes a first elastic part and a second elastic part, wherein the first elastic part is located in the 3-1 layer space, the second elastic part is located in the 3-3 layer space, and the upper contact part is located in the 3-3 layer space. , including a third upper spaced apart panel located within the 3-2 layer space, and the lower contact portion includes a third upper spaced apart panel located within the 3-2 layer space.

According to one embodiment, the first elastic part and the second elastic part are each composed of a zigzag spring and have a symmetrical structure.

The micro probe according to the present invention may have an integrated structure in which the elastic portion and the hook portion do not interfere with each other.

In particular, the microprobe according to an embodiment of the present invention has a layered structure, so it can be manufactured using a MEMS process. Therefore, a microprobe with a fine pitch can be implemented, and a separate process for assembling the microprobe is not required.

In addition, microprobes of various structures can be implemented. In particular, by applying the MEMS process, the structure of the microprobe can be freely and selectively implemented.

In addition, when the microprobe is compressed by receiving a contact force, the elastic part with a zigzag spring structure is compressed, allowing additional contact between each part of the elastic part. Not only that, but contact occurs on all sides except the outside, such as between the hook part and the elastic part, and between the elastic part and the elastic part. Accordingly, electrical signal transmission efficiency can be further improved.

According to the microprobe manufacturing method according to the present invention, a microprobe with a fine pitch can be easily constructed through a plurality of photoresist processes.

That is, the microprobe manufactured by the manufacturing method according to the present invention may have a fine area and fine pitch. Therefore, a more stable electrical connection can be achieved when connecting a semiconductor device on the microprobe and the PCB below.

That is, since the microprobe manufactured by the microprobe manufacturing method according to the present invention is manufactured using the MEMS process, it may have a smaller pitch compared to the existing manufacturing method.

In addition, by subdividing or selectively adding MEMS process steps, microprobes of various structures can be manufactured.

FIG. 1 is a diagram showing a microprobe according to an embodiment of the present invention, and FIG. 2 is a diagram showing the microprobe of FIG. 1 viewed from another direction.

FIG. 3 is an exploded view of the microprobe of FIG. 1 broken down into its respective parts.

FIG. 4 is a view showing the microprobe of FIG. 1 as seen from the side.

Figure 5 is an enlarged view of a portion of Figure 4.

Figure 6 is an exploded view of a microprobe according to another embodiment of the present invention broken down into individual parts.

Figure 7 is a diagram showing a microprobe according to an embodiment of the present invention.

Figure 8 is an exploded view showing the elastic part of the microprobe of Figure 7.

FIG. 9 is an enlarged view showing a portion of the microprobe of FIG. 7.

Figure 10 is a diagram showing a microprobe according to an embodiment of the present invention before and after receiving a contact force.

11 to 16 are diagrams showing a portion of a method for manufacturing a microprobe according to an embodiment of the present invention.

The microprobe according to the present invention includes an upper contact portion constituting the upper portion; A lower contact part constituting the lower part; a hook portion whose upper portion is connected to the upper contact portion and whose lower portion is connected to the lower contact portion; an elastic portion whose upper portion is connected to the upper contact portion and whose lower portion is connected to the lower contact portion; It includes, wherein the hook part includes an upper hook and a lower hook, an upper end of the upper hook is connected to the upper contact part, a lower end of the lower hook is connected to the lower contact part, and a lower end of the upper hook A hook tip is provided at the top of the lower hook.

Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings.

In the following description, “up and down” and “front and back” meaning directions are based on the direction shown in FIG. 1.

The micro probe according to an embodiment of the present invention may be a micro probe used in a socket for testing a semiconductor chip. step. It is not limited to this.

The microprobe according to an embodiment of the present invention includes an upper contact part 100, a lower contact part 200, a hook part 300, and an elastic part 400. The upper contact part 100, the lower contact part 200, the hook part 300, and the elastic part 400 may not be separate members, but may be part of a microprobe formed integrally.

The upper contact part 100 is a part that constitutes the upper part of the microprobe. For example, when a microprobe is mounted in a socket, the upper contact unit 100 may contact an electrical terminal of a semiconductor chip package mounted in the socket and located on top of the microprobe.

The upper contact part 100 may include an upper body 110 and an upper separation panel 120. The upper body 110 and the upper spacing panel 120 may not be separate members, but may be a part of the upper contact portion 100 that is integrally formed.

The upper body 110 is connected to the elastic portion 400. Specifically, the upper body 110 may be configured in a plate shape with a predetermined thickness in the front-back direction. A contact tip may be formed at the upper end of the upper body 110. The lower end of the upper body 110 may be continuously connected to the upper end of the elastic portion 400.

The upper spacing panel 120 may be positioned between the upper body 110 and the upper hook 310 in the front-to-back direction. The upper spacing panel 120 may be configured in a plate shape with a predetermined thickness. The upper spacing panel 120 may be a portion of the upper body 110 that extends continuously forward or backward, or may protrude.

The lower contact part 200 is a part that constitutes the lower part of the microprobe. For example, when the micro probe is mounted in a socket, the lower contact unit 200 may contact the electrical terminal of the PCB located below the micro probe.

The lower contact part 200 may include a lower body 210 and a lower separation panel 220. The lower body 210 and the lower separation panel 220 may not be separate members, but may be a part of the lower contact portion 200 that is integrally formed.

The lower body 210 is connected to the elastic portion 400. Specifically, the lower body 210 may be configured in a plate shape with a predetermined thickness in the front-back direction. A contact tip may be formed at the lower end of the lower body 210. The upper end of the lower body 210 may be continuously connected to the lower end of the elastic portion 400.

The lower spacing panel 220 may be positioned between the lower body 210 and the lower hook 320 in the front-back direction. The lower spacing panel 220 may be configured in a plate shape with a predetermined thickness. The lower spacing panel 220 may be a portion of the lower body 210 that extends continuously forward or backward, or may protrude.

The hook portion 300 is a part that constitutes the middle part of the microprobe.

The upper portion of the hook portion 300 is connected to the upper contact portion 100 and the lower portion is connected to the lower contact portion 200.

The hook portion 300 includes an upper hook 310 and a lower hook 320.

The upper hook 310 is a bar-shaped portion that extends overall in the vertical direction and has a predetermined length. The upper end of the upper hook 310 is connected to the upper contact portion 100. More specifically, a portion of the bottom surface of the upper end of the upper hook 310 is located on at least a portion of the upper surface of the upper spacer panel 120 of the upper contact portion 100, and the portions are continuous with each other. Compose.

A hook tip is provided at the bottom of the upper hook 310. The hook tip is a predetermined hook portion that protrudes in the side direction.

The lower hook 320 is a bar-shaped portion that extends overall in the vertical direction and has a predetermined length. The lower end of the lower hook 320 is connected to the lower contact portion 200. More specifically, a portion of the bottom of the lower end of the lower hook 320 is located on at least a portion of the upper surface of the lower spaced panel 220 of the lower contact portion 200, and the portions are continuous with each other. Compose.

A hook tip is provided at the top of the lower hook 320. The hook tip is a predetermined hook portion that protrudes in the side direction.

The upper portion of the elastic portion 400 is connected to the upper contact portion 100 and the lower portion is connected to the lower contact portion 200. Specifically, the upper end of the elastic part 400 is connected to the upper body 110 of the upper contact part 100, and the lower part of the elastic part 400 is connected to the lower body 210 of the lower contact part 200. can be connected with

According to one embodiment, the elastic part 400 may be composed of a zigzag spring. That is, the elastic portion 400 may be composed of a plate-shaped zigzag spring located on the same plane as the plate-shaped upper body 110 and the lower body 210. According to an embodiment, the thickness of the upper body 110, the lower body 210, and the elastic portion 400 may be the same.

FIG. 3 is an exploded view of the microprobe of FIG. 1 broken down into its respective parts. FIG. 4 is a view showing the microprobe of FIG. 1 as seen from the side. Figure 5 is an enlarged view of a portion of Figure 4.

The positional relationship of the upper contact part 100, lower contact part 200, hook part 300, and elastic part 400 may be as follows.

The hook portion 300 may be located within the first layer space (L1) of the layer.

The elastic portion 400 may be located within the third layer space L3.

A second layer space (L2) is located between the first layer space (L1) and the third layer space (L3). The upper contact part 100 and the lower contact part 200 may be located in the second layer space L2 and the third layer space L3.

Here, layer space means a virtual area on a layer having a predetermined width in the front-back direction. In Figure 5, as the microprobe is in a lying position, the layer space is expressed as a layered virtual area with a predetermined thickness in the vertical direction.

The respective layer spaces are parallel to each other. Accordingly, the first layer space (L1), the second layer space (L2), and the third layer space (L3) are parallel to each other. In addition, the first layer space (L1) and the third layer space (L3) are positioned to be spaced apart from each other in the front-back direction with the second layer space (L2) interposed therebetween.

A separation space W formed in the second layer space L2 is formed between the elastic part 400 and the hook part 300.

That is, the microprobe according to an embodiment of the present invention has a layered structure in the front-back direction as described above. At this time, an upper contact part 100 and a lower contact part 200 are provided at the end positions of the elastic part 400, and the front surfaces of the upper contact part 100 and the lower contact part 200 are the elastic part ( It is located in a position that protrudes further forward than the front of 400). The hook portion 300 is located on the front side of the upper contact portion 100 and the lower contact portion 200. Accordingly, a separation space W is formed between the elastic part 400 and the hook part 300, and the elastic part 400 and the hook part 300 do not interfere with each other.

The hook portion 300 includes an upper hook 310 and a lower hook 320, and the upper hook 310 and lower hook 320 are hooked to each other through hook tips.

The microprobe according to an embodiment of the present invention has the above-described structure, so that the elastic part 400 and the hook part 300 can have an integrated structure without interfering with each other.

In addition, as will be described later, microprobes of various structures can be implemented. In particular, by applying the MEMS process, the structure of the microprobe can be freely and selectively implemented.

In addition, when the microprobe is compressed by receiving a contact force, the elastic part 300 having a zigzag spring structure is compressed, so that contact between each part of the elastic part 300 can be additionally made. Accordingly, electrical signal transmission efficiency can be further improved.

In addition, when the microprobe is compressively deformed, except for the outside, such as between the hook portion 300 and the elastic portion 400, and between the elastic portion 400 and the elastic portion 400 (each part of the elastic portion 400), Contact can occur in various places. Accordingly, electrical signal transmission efficiency can be further improved.

According to one embodiment of the present invention, there may be a plurality of hook parts 300.

For example, as shown in FIG. 6, an embodiment in which hook parts 300 are provided at the front and rear of the elastic part 400, respectively, is possible.

In this embodiment, it may include a first hook portion 300A located in front of the elastic portion 400 and a second hook portion 300B located behind the elastic portion 400.

At this time, the upper contact part 100 includes an upper spacing panel 120, and includes a first upper spacing panel 120A and a second upper spacing panel 120B located at the front and rear of the upper body 110, respectively. It can be included.

The lower contact portion 200 includes a lower spaced apart panel 220, and may include a first lower spaced apart panel 220A and a second lower spaced apart panel 220B located at the front and rear sides of the lower body 210, respectively. You can.

In the above embodiment, in addition to the first to third layer spaces L3 described in FIGS. 3 to 5, a second upper spaced apart panel 120B and a second lower spaced panel 220B are formed in the fourth layer space L4. ) is located, and it can be explained that the second hook portion 300B is located within the fifth layer space L5. The second hook portion 300B and the elastic portion 400 are spaced apart from each other by a space formed in the fourth layer space L4.

According to the above embodiment, the hook portion 300 is located at the front and rear of the elastic portion 400, respectively, so that when contact force is applied in the vertical direction and the contact force is released, the elastic portion 400 is stably deformed. and can be restored.

Also, preferably, as shown in FIG. 6, the first hook portion 300A and the second hook portion 300B may have a structure that is symmetrical to each other. Here, the symmetrical structure means left-right symmetry when viewed in the front-to-back direction, and point symmetry when viewed from the center point, and can also be understood as a cross structure. Accordingly, as shown in FIG. 6, when the upper hook 310A of the first hook portion 300A is located on the left, the upper hook 310B of the second hook portion 300B may be located on the right. . This is the same for the second hook portion 300B. In this way, as the first hook portion 300A and the second hook portion 300B have a symmetrical structure, structural stability is further improved, and the electrical contact area can be increased to improve signal transmission efficiency. Additionally, unnecessary displacement, unintended deformation, and buckling can be prevented during the compression deformation process.

FIG. 7 is a diagram showing a microprobe according to an embodiment of the present invention, FIG. 8 is an exploded view showing the elastic portion 400 of the microprobe of FIG. 7, and FIG. 9 is a portion of the microprobe of FIG. 7. This is an enlarged view of .

According to one embodiment of the present invention, the elastic portion 400 may have a multi-layer structure. In addition, the third layer space L3 where the elastic portion 400 is located may also have a multi-layer structure.

That is, as shown in FIG. 8, the elastic portion 400 may include a first elastic portion 400A and a second elastic portion 400B. The first elastic portion 400A may be located within the 3-1 layer space L3-1, and the second elastic portion 400B may be located within the 3-3 layer space L3-3. In addition, the 3-2 layer space (L3-2) is located between the 3-1 layer space (L3-1) and the 3-3 layer space (L3-3), and the 3-2 layer space (L3-2) is located between the 3-1 layer space (L3-1) and the 3-3 layer space (L3-3). As a separation space is formed within -2), the first elastic part 400A and the second elastic part 400B do not interfere with each other.

As described above, as the elastic portion 400 includes the first elastic portion 400A and the second elastic portion 400B, the elastic force in the vertical direction can be increased and the contact force can be increased.

In addition, if the structure has a plurality of elastic parts 400, the first elastic part 400A and the second elastic part 400B may have a structure that is symmetrical to each other. Here, the symmetrical structure means left-right symmetry when viewed in the front-to-back direction, and point symmetry when viewed from the center point, and can also be understood as a cross structure. That is, as shown in FIG. 8, the first elastic portion 400A and the second elastic portion 400B have a configuration in which zigzag directions intersect each other, so that they do not overlap each other but are symmetrical (or zigzag cross each other). ) has a structure. Therefore, it is possible to prevent the shape or position of the microprobe from being unintentionally deformed, deviated, or buckled when compressed by receiving a contact force.

Additionally, in this embodiment, the hook portion 300 may include a first hook portion 300A and a second hook portion 300B. The first hook portion 300A may be located in front of the elastic portion 400, and the second hook portion 300B may be located in the rear of the elastic portion 400. In addition, the upper contact part 100 includes an upper spacing panel 120, and includes a first upper spacing panel 120 and a second upper spacing panel 120 located at the front and rear of the upper body 110, respectively. It can be included. In addition, the lower contact part 200 includes a lower spacing panel 220, and includes a first lower spacing panel 220 and a second lower spacing panel 220 located at the front and rear of the lower body 210, respectively. It can be included.

In the above embodiment, in addition to the first to third layer spaces L3 described in FIGS. 3 to 5, a first lower spacing panel 220 and a second lower spacing panel 220 are installed in the fourth layer space L4. ) is located, and it can be explained that the second hook portion 300B is located within the fifth layer space L5. The second hook portion 300B and the elastic portion 400 are spaced apart from each other by a space formed in the fourth layer space L4.

In addition, when the microprobe is compressed by receiving a contact force, the elastic part 300 having a zigzag spring structure is compressed, so that contact between each part of the elastic part 300 can be additionally made. Accordingly, electrical signal transmission efficiency can be further improved. This is, for example, as shown in Figure 10. Figure 10 is a diagram showing a microprobe according to an embodiment of the present invention before (a) and after (b) receiving a contact force. It can be confirmed that as the elastic part 300 is compressed, a contact portion P between each part of the elastic part 300 is generated.

Hereinafter, a method for manufacturing a microprobe according to an embodiment of the present invention will be described with reference to the drawings.

First, prepare a growth substrate 10 as shown in (a) of FIG. 11. Subsequently, the conductive layer 12 may be formed on the growth substrate 10. The growth substrate 10 may be, for example, a glass wafer. The conductive layer 12 is deposited on the growth substrate 10 to make the surface of the growth substrate 10 in a conductive state capable of electroplating. At this time, deposition of the conductive layer 12 may be performed, for example, by sputtering Ti/Cu.

Next, a sacrificial layer 14 is formed on the conductive layer 12 as shown in (b) of FIG. 11. The sacrificial layer 14 may be formed by plating the upper surface of the conductive layer 12. The sacrificial layer 14 may be made of Cu, for example.

Next, a first photo lithography process is performed as shown in FIG. 12. The first photolithography process may include forming the first photoresist layer 16a on the sacrificial layer 14, arranging the first photo mask M1, exposing, developing, and cleaning. .

First, as shown in (a) of FIG. 12, a first photoresist layer 16a is formed on the sacrificial layer 14. The first photoresist layer 16a is composed of a high molecular weight polymer that reacts to light, such as Novolak (M-Cresol formaldehyde), PMMA (PolyMethyl Methacrylate) ], SU-8, and photo sensitive polyimide.

Next, the first photo mask M1 is arranged on the first photoresist layer 16a as shown in (b) of FIG. 12 and then exposed. According to the first embodiment, the two-dimensional shape of the first optical mask M1 may represent a two-dimensional image of the contact probe 100, which will be described later.

In the process of forming the first photoresist layer 16a, arranging and exposing the first photomask M1, either a negative photoresist or a positive photoresist may be used. For example, if a positive photoresist is used, the portion exposed to light that is not covered by the first photo mask M1 is cured. Conversely, if negative photoresist is used, the portions covered by the first photo mask M1 and not exposed to light are cured.

Next, as shown in (c) of FIG. 12, the exposed first photoresist layer 16a is developed and washed. Depending on the development and cleaning process, the exposed or unexposed portion of the first photoresist layer 16a is dissolved, washed, and removed. Accordingly, a first removal area V1 is formed in the portion where the first photoresist layer 16a has been removed.

Figure 13 is a diagram showing the result after going through this process. A first removal area V1 is formed in a portion where the first photoresist layer 16a has been removed. At this time, the shape of the first removal area V1 is, for example, the same as the two-dimensional shape of a portion of the microprobe. As an example, the shape of the first removal area V1 is the elastic part 400 of the microprobe, the upper body 110 of the upper contact part 100, and the lower body 210 of the lower contact part 200. It may be the same as the shape of .

As described above, when a positive photoresist is used, the unexposed portion is removed during development and cleaning, and when a negative photoresist is used, the exposed portion is removed during development and cleaning.

Preferably, in the above first photolithography process, the thickness of the first photoresist layer 16a and the depth of the first removal area V1 formed by partial removal of the first photoresist layer 16a are It may have a relatively small size. For example, the thickness of the first photoresist layer 16a and the depth of the first removal area V1 may be 50 to 0.1 um, but are not limited thereto.

Next, a first plating process is performed, as shown in FIG. 14(a). The first plating process is a process of forming the first plating layer 18a by plating an electrically conductive material in the first removal area V1 created through the first photolithography process. The first plating process may use electrically conductive materials such as copper, nickel, aluminum, rhodium, palladium, tungsten or other metals. Preferably, the material used in the process of forming the sacrificial layer 14 and the material used in the first plating process may be different from each other.

Subsequently, a first planarization process may be performed as shown in (b) of FIG. 14. Following the planarization process, excess plating is removed. Therefore, preferably, the thickness of the first plating layer 18a filled in the first removal area V1 and the thickness of the first photoresist layer 16a remaining on the sacrificial layer 14 have the same size as the overall thickness. It can have a flat top surface. That is, the thickness of the first plating layer 18a may be 50 to 0.1 um, but is not limited thereto. Meanwhile, this first planarization process may be omitted.

Figure 15 is a diagram showing an example of the shape of the structure created through the above process. The structure in which the growth substrate 10, the conductor layer 12, the sacrificial layer 14, the first photoresist layer 16a, and the first plating layer 18a are stacked is a stacked structure with a layered structure, preferably It may have an overall rectangular planar shape. In the structure of FIG. 6 , the first plating layer 18a is filled in the first removal area V1 in the structure of FIG. 4 .

Next, as shown in FIG. 16, the first photoresist layer 16a is removed. Removal of the first photoresist layer 16a may be performed, for example, by a wet chemical process, an acetone-based removal process, or a plasma removal process.

The above process is performed on the elastic portion 400, the upper body 110 of the upper contact portion 100, and the lower body 210 of the lower contact portion 200, which constitute a part of the microprobe according to an embodiment of the present invention. ) can be said to be the process of forming.

By repeating the above process again, a microprobe according to an embodiment of the present invention can be manufactured. That is, the elastic portion 400 of the microprobe manufactured through the above process, the upper body 110 of the upper contact portion 100, and the lower body 210 of the lower contact portion 200 are formed. Next, an upper spacing panel 120 and a lower spacing panel 220 are formed on the upper body 110 and the lower body 210, respectively. The upper spacing panel 120 and the lower spacing panel 220 are formed in a state in which only the upper body 110 of the upper contact portion 100 and the lower body 210 of the lower contact portion 200 are exposed (i.e. It can be performed by performing a plating process in a state of photoresist layer formation, exposure, and partial removal.

Next, a microprobe can be manufactured by sequentially forming the hook portion 300. That is, the formation of each part can be accomplished by repeatedly performing each layer forming process, photolithography process, plating process, and photoresist layer removal process described above.

Hereinafter, the effects of the microprobe manufacturing method according to the present invention will be described.

That is, since the microprobe manufactured by the microprobe manufacturing method according to the present invention is manufactured using the MEMS process, it can have a smaller pitch compared to the existing manufacturing method.

Although preferred embodiments have been shown and described above, the present invention is not limited to the specific embodiments described above, and common knowledge in the technical field to which the invention pertains without departing from the gist of the present invention as claimed in the claims. Of course, various modifications can be made by those who have the same, and these modifications should not be understood individually from the technical idea or perspective of the present invention.

Claims

In the micro probe,

An upper contact part constituting the upper part;

A lower contact part constituting the lower part;

a hook portion whose upper portion is connected to the upper contact portion and whose lower portion is connected to the lower contact portion;

an elastic portion whose upper portion is connected to the upper contact portion and whose lower portion is connected to the lower contact portion; Includes,

The hook portion includes an upper hook and a lower hook,

The upper end of the upper hook is connected to the upper contact portion,

The lower end of the lower hook is connected to the lower contact portion,

A micro probe having hook tips provided at the bottom of the upper hook and the top of the lower hook.
According to paragraph 1,

The hook portion is located in the first layer space of the layer,

The elastic portion is located in the third layer space of the layer,

A second layer space is located between the first layer space and the third layer space,

The first to third layer spaces are parallel to each other,

A micro probe wherein the hook portion and the elastic portion are spaced apart from each other with the second layer space in between.
According to paragraph 2,

The elastic part,

Micro probe with zigzag spring.
According to paragraph 2,

The upper contact part includes an upper body and an upper separation panel,

The upper body is located within the first layer space and connected to the elastic portion,

The upper spacing panel is located within the second layer space and is located between the upper body and the upper hook,

The lower contact part includes a lower body and a lower separation panel,

The lower body is located within the first layer space and connected to the elastic portion,

The lower spacing panel is located within the second layer space and is located between the lower body and the lower hook.
According to clause 4,

The upper body and the upper spaced panel are formed as one piece,

A micro probe in which the lower body and the lower separation panel are integrally formed.
According to paragraph 2,

The hook part,

A first hook portion located on the front side of the elastic portion, and

It includes a second hook portion located at the rear of the elastic portion,

The first hook portion is located in the first layer space of the layer,

The elastic portion is located in the third layer space of the layer,

The second hook portion is located in the second layer space of the layer,

A second layer space is located between the first layer space and the third layer space,

A fourth layer space is located between the third layer space and the fifth layer space,

The first to fifth layer spaces are parallel to each other,

The first hook portion and the elastic portion are spaced apart from each other across the second layer space,

The second hook portion and the elastic portion are spaced apart from each other across the fourth layer space.
According to paragraph 2,

The third layer space sequentially includes a layered 3-1 layer space, a 3-2 layer space, and a 3-3 layer space,

The elastic part,

It includes a first elastic part and a second elastic part positioned to overlap in the front-back direction,

The first elastic portion is located in the 3-1 layer space,

The second elastic portion is located within the 3-3 layer space,

The upper contact part,

It includes a third upper spacer panel located within the 3-2 layer space,

The lower contact part,

A micro probe including a third upper spaced apart panel located within the 3-2 layer space.
In clause 7,

The first elastic part and the second elastic part are each composed of a zigzag spring and have a symmetrical structure.