WO2014073813A1

WO2014073813A1 - Interposer, and method for manufacturing same

Info

Publication number: WO2014073813A1
Application number: PCT/KR2013/009630
Authority: WO
Inventors: 신희석; 임종개
Original assignee: 주식회사 씨엔플러스
Priority date: 2012-11-12
Filing date: 2013-10-28
Publication date: 2014-05-15
Also published as: KR101425931B1; KR20140062550A

Abstract

The present invention discloses an interposer that shows no change in terminal elasticity, maintains a shape, and prevents the terminal from being separated from a housing even when an external force is repeatedly applied to a terminal, and a method for manufacturing same. The interposer according to the present invention, includes: a substrate in which multiple conductive patterns are formed; a housing that is made of an insulating material and arranged in a state corresponding to the substrate; and at least one terminal which is independently arranged in the inner space of the housing, in which a partial area thereof is exposed outside the housing so as to be electrically connected to the conductive pattern and in which the other partial area is exposed outside the housing so as to be electrically connected to an external substrate. Herein, the terminal is configured such that a partial area of a fixed portion is exposed outside the housing while being fixed to the housing and a bonding portion is extended from the fixed portion. Further, the housing has a terminal exposure space. The terminal exposure space maintains a predetermined gap with another terminal exposure space that is adjacent thereto, and the upper end and lower end thereof are open so as to expose the bonding portion of the terminal outside.

Description

Interposer and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an interposer and a method of manufacturing the same, and to an interposer having a structure capable of simplifying a manufacturing process and preventing deformation of a terminal and a method of manufacturing the same.

In general, a board-to-board type connector is used to implement an electrical connection between an external device and a printed circuit board. This board-to-board connector electrically connects a printed circuit board with a flexible printed circuit board ("FPCB") containing a conductive pattern.

The connector used to electrically connect the FPCB to the printed circuit board has a problem that the electronic device to which the connector is mounted is bulky because the connector is relatively bulky. In addition, it is necessary to arrange a plurality of contacts in the housing of the connector with fine spacing, and when deformation occurs in any one of the contacts, it is impossible to expect complete electrical connection between the FPCB and the printed circuit board.

As an external cable, an interposer (mounted to an external device, of course), which is directly mounted on a printed circuit board and electrically connected to a pattern of the printed circuit board without using a connector having the above problem, It is used. This interposer is electrically connected with the pattern of the printed circuit board by a clamp mounted on the printed circuit board (eg, the "surface mounted clamp" of patent application No. 10-2012-0115618 filed by the applicant). It is fixedly connected.

An object of the present invention is to provide an interposer having a structure in which the terminal is not separated from the housing as well as the elasticity of the terminal can be maintained even when the external force is repeatedly applied to the terminal.

It is also an object of the present invention to provide an interposer having a structure capable of obtaining an insulation effect without including an additional component such as an insulation tape.

Still another object of the present invention is to provide a manufacturing method capable of simply manufacturing an interposer having the above functional and structural features.

An interposer according to the present invention for realizing the above object comprises a substrate on which a plurality of conductive patterns are formed; A housing made of an insulating material and disposed in a state corresponding to the substrate; Independently disposed in the interior space of the housing, some regions include at least one terminal exposed to the exterior of the housing to the conductive pattern of the substrate and another portion to the exterior of the housing and electrically connected to the exterior substrate. .

Here, the terminal is composed of a fixing part exposed to the outside of the housing in the state fixed to the housing and a junction extending from the fixing part. In addition, the housing includes a terminal exposed space, the terminal exposed space at a predetermined distance from other adjacent terminal exposed space, the top and bottom are open to expose the junction of the terminal to the outside.

In addition, the housing may further include a connection space disposed between two adjacent terminal exposure spaces.

Meanwhile, solder balls are formed on the upper surface of the fixing part of each terminal exposed to the outside of the housing so that the terminals are electrically connected to the pattern of the substrate through the solder balls.

According to the present invention, a method of manufacturing an interposer mounted on an external substrate through a clamp includes manufacturing a terminal assembly having a structure in which a terminal is connected to a frame; After disposing the terminal assembly on the mold, integrally forming the housing in the terminal assembly in a state of discharging a portion of the fixing portion of the terminal and the joint to the outside through a molding process; Removing the frame of the terminal assembly through a cutting process to separate the housing with each terminal independently disposed therein; And bonding the terminal to the conductive pattern of the substrate.

The terminal assembly used in the method of the present invention may consist of an outer frame and a connecting frame connecting adjacent terminals disposed inside the outer frame and connecting the outermost terminal to the outer frame.

In addition, the housing manufactured by the method of the present invention is a connection space disposed between a terminal exposure space for exposing a portion of the terminal to the outside and two adjacent terminal exposure spaces for exposing a portion of the connection frame of the terminal assembly to the outside. It includes.

Here, the housing separation step may be performed through a cutting and removing process of the connection frame and the outer frame of the terminal assembly exposed to the outside through the connection space of the housing.

In particular, bonding the terminal to the conductive pattern of the substrate may comprise forming solder balls on a fixed portion of the terminal exposed out of the housing; And electrically connecting the fixing part of the terminal and the conductive pattern through the solder ball, so that the final interposer is manufactured.

The interposer according to the present invention as described above can maintain the shape without changing the elasticity of the terminal even when the external force is repeatedly acting, and also the bonding state of the housing and the terminal is not released.

In particular, the interposer according to the present invention can obtain an insulation effect between terminals without including a component such as an insulating tape.

The interposer manufacturing method according to the present invention can simply manufacture an interposer having the above functional and structural features.

1 is a partial cross-sectional view showing a portion of an interposer according to an embodiment of the present invention.

FIG. 2 is a perspective view of the housing shown in FIG. 1. FIG.

3a to 3c show step by step an interposer manufacturing method according to the invention.

Hereinafter, a configuration and a manufacturing method of an interposer according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a partial cross-sectional view showing a part of an interposer according to an embodiment of the present invention, and shows only a portion electrically connected to a printed circuit board (not shown) for convenience. Meanwhile, in FIG. 1, components in contact with each other are illustrated in a separated state in order to clearly illustrate each component.

The interposer 100 according to the embodiment of the present invention includes a flexible printed circuit board 110 (hereinafter referred to as “FPCB”) including a conductive pattern 112 formed on a surface and a contact 111 formed at an end of the conductive pattern 112. And a plurality of terminals 400 fixedly disposed within the housing 200 and a housing 200 positioned below the FPCB 110.

Here, the structure and function of the FPCB 110 is the same as the structure and function of the FPCB constituting the general interposer, and thus description thereof will be omitted.

FIG. 2 is a perspective view of the housing 200 shown in FIG. 1, and for convenience, the terminal 400 of FIG. 1 is not illustrated. In addition, FIG. 1 illustrates only a part of the plurality of terminal exposure spaces 210 in which a part of the terminal 400 is exposed, unlike FIG. 2.

The housing 200 made of an insulating material includes, for example, a plurality of terminal exposing spaces 210 arranged in a matrix form, each terminal exposing space 210 being disposed at a predetermined distance from other adjacent terminal exposing spaces. do. Here, the arrangement of the plurality of terminal exposed spaces 210 should be determined according to the arrangement of the contacts 111 of the FPCB 110 and the alignment of the conductive patterns of the external printed circuit board.

Each terminal 400 is fixedly located in an area adjacent the terminal exposure space 210 of the housing 200. Here, in FIG. 1, the terminal 400 extends from the fixing part 410 and the fixing part 410 fixed in the housing 200 to expose the curved portion exposed through the terminal exposure space 210 of the housing 200. Although illustrated as having a shape consisting of 420, the shape of the terminal 400 is not limited thereto.

On the other hand, the terminal exposed space 210 of the housing 200 is open at the top and bottom, so as shown in Figure 1 of the terminal 400 is fixed to the adjacent area of the terminal exposed space 210 Some, in particular junction 420, are exposed at the bottom of the housing 200 outside. Here, a portion of the upper portion of the housing 200 corresponding to the fixing portion 410 of the terminal 400 is removed, and thus a portion of the upper surface of the fixing portion 410 of the terminal 400 is exposed to the outside.

Solder balls (300 of FIG. 1) are disposed at an upper end of a portion of the housing 200, that is, an area corresponding to the fixing part 410 of the terminal 400. The lower end of the solder ball 300 is in contact with the exposed upper surface of the fixing part 410 of the terminal 400, and the upper end is joined to the corresponding contact 111 formed in the plane of the FPCB 100 (wherein “ "Top" and "bottom" are based on drawings). Accordingly, each terminal 400 is electrically connected to the conductive pattern 111 of the FPCB 110 through the solder ball 300.

The interposer 100 having such a structure is fixed by a clamp, and the junction 420 of the terminal 400 exposed to the outside through the terminal exposure space 210 of the housing 200 is electrically conductive on the external printed circuit board. It is electrically connected with an external printed circuit board by contacting / joining with the pattern / contact.

Meanwhile, the housing 200 includes a connection space 211 disposed between two adjacent terminal exposure spaces 210. The function of this connection space 211 formed in the housing 200 will be described later.

Referring to the function and structural features of the interposer 100 according to the present invention shown in Figure 1 as follows.

First, in the interposer 100 according to the present invention, the plurality of terminals 400 are independently disposed at predetermined intervals in a housing 200 made of an insulating material, and in particular, a junction part 420 bonded to an external printed circuit board. ) Is exposed to the outside of the housing 200. Therefore, unlike the structure in which all parts of the terminal are exposed to the outside, no contact between neighboring terminals 400 occurs.

In addition, in the interposer 100 according to the present invention, since a plurality of terminals 400 are disposed in an insulated state in the insulating housing 200 which functions as a substrate, it is necessary to separately use an additional insulating member such as insulating tape. There is no.

On the other hand, the terminal 400 is fixedly located in the housing 200 except for a portion (that is, the junction portion 420) connecting to the external printed circuit board. In such a structure, even if an unintended external force acts on the terminal 400 in the process of mounting the interposer 100 to the external printed circuit board or detaching from the external printed circuit board through the clamp, the terminal 400 remains in the housing 200. It is not separated from the interposer, and thus the interposer 100 can maintain a normal structure.

Hereinafter, a method of manufacturing the interposer 100 illustrated in FIG. 1 will be described with reference to the drawings.

Here, as described above, the structure of the FPCB 110 is the same as the FPCB constituting a general interposer, and therefore will be described below focusing on the manufacturing process of the assembly of the housing 200 and the terminal 400.

3A to 3C are diagrams showing step by step methods of manufacturing an interposer according to the present invention. 3B and 3C show the terminal assembly 410 and the housing 200 upside down in order to clearly show the shape of the terminal 400.

First, a terminal assembly 410 in which a plurality of terminals 400 are arranged in a matrix through a pressing process is manufactured (FIG. 3A). The terminal assembly 410 is made of a metal material, the outer frame 411 of the polygon, the plurality of terminals 400, the plurality of terminals 400 disposed inside the outer frame 411, the outer frame 411 And a connection frame 412 for connecting thereto. Meanwhile, the surface of each terminal 400 may be coated with a material having excellent conductivity.

Here, the connection frame 412 is divided into a connection frame for connecting two adjacent terminals 400 and a connection frame for connecting the terminal 400 to the outer frame 411.

After the terminal assembly 410 manufactured as described above is disposed on the mold, the housing 200 is integrally formed with the terminal assembly 410 through a molding process, preferably an insert injection process (state of FIG. 3B).

Here, the mold is designed such that a housing 200 having the shape shown in FIG. 2 is manufactured. The design of such a mold is known to those skilled in the art of injection molding, and thus description thereof is omitted.

As shown in FIG. 3B, the housing 200 is located inside the central area of the terminal assembly 410, ie the outer frame 411 in which the terminal 400 is aligned and the connecting frame 412 is arranged. In addition, each terminal 400 and the connection frame 412 are exposed to the outside through the terminal exposure space 210 and the connection space 211 formed in the housing 200, respectively.

Thereafter, the outer frame 411 and the connection frame 412 are removed through a cutting process. That is, the connecting frame 412 connected to the outer frame 411 through the cutting tool is removed, and also through the connecting space 211 formed between the terminal exposed space 210 of the housing 200 to the outside of the housing 200. The housing 200 shown in FIG. 3C is finally manufactured by removing the connecting frame 412 connecting the two adjacent, adjacent terminals 400.

In the housing 200 illustrated in FIG. 3C, a fixing part (410 of FIG. 1) of each terminal 400 is fixed, and the bonding part (420 of FIG. 1) is exposed to the outside through the terminal exposure space 210. (Of course, as described above, the upper surface of the fixing portion of the terminal 400 is exposed to the outside).

Solder balls (300 of FIG. 1) are formed on a predetermined area of the assembly of the housing 200 and the terminal 400 manufactured as described above, that is, the housing 200 in which the fixing part of each terminal 400 is exposed. To the terminal 111 of the pattern (112 of FIG. 1) formed in the FPCB (110 of FIG. 1), the interposer 100 having the structure as shown in FIG. 1 is finally manufactured.

The embodiments disclosed herein are only presented by selecting the most preferred embodiment in order to help those skilled in the art from the various possible examples, the technical spirit of the present invention is not necessarily limited or limited only to this embodiment, Various changes, additions, and changes are possible without departing from the spirit of the present invention, as well as other equivalent embodiments.

Claims

In an interposer mounted on an external substrate through a clamp,

A substrate on which a plurality of conductive patterns are formed;

A housing made of an insulating material and disposed in a state corresponding to the substrate;

Disposed independently of the interior space of the housing, some regions including at least one terminal exposed to the exterior of the housing to a conductive pattern of the substrate and another portion to the exterior of the housing and electrically connected to the outer substrate. Interposer, characterized in that.
The method of claim 1,

The terminal consists of a fixing part exposed to the outside of the housing and a joint extending from the fixing part while being fixed to the housing.

The housing includes a terminal exposing space, wherein the terminal exposing space maintains a predetermined distance from other adjacent terminal exposing spaces, and wherein the top and bottom are open to expose the junction of the terminal to the outside.
3. The interposer of claim 2, wherein the housing further comprises a connection space disposed between two adjacent terminal exposure spaces.
The interposer of claim 2, wherein solder balls are formed on upper surfaces of the fixing portions of the terminals exposed to the outside of the housing, and the terminals are electrically connected to the pattern of the substrate through the solder balls.
In the manufacturing method of the interposer mounted on an external substrate via a clamp,

Manufacturing a terminal assembly having a structure in which a terminal is connected to the frame;

After disposing the terminal assembly on the mold, integrally forming the housing in the terminal assembly in a state of discharging a portion of the fixing portion of the terminal and the joint to the outside through a molding process;

Removing the frame of the terminal assembly through a cutting process to separate the housing with each terminal independently disposed therein; And

Bonding the terminal to the conductive pattern of the substrate.
6. The method of claim 5, wherein the terminal assembly comprises an outer frame and a connecting frame connecting adjacent terminals disposed inside the outer frame and connecting the outermost terminal to the outer frame.
7. The intercommunication system of claim 6, wherein the housing comprises a terminal exposure space for exposing a portion of the terminal to the outside and a connection space disposed between two adjacent terminal exposure spaces for exposing a portion of the connection frame of the terminal assembly to the outside. Poser manufacturing method.
The method of claim 5, wherein the housing separation step is performed by cutting and removing the connection frame and the outer frame of the terminal assembly exposed to the outside through the connection space of the housing.
The method of claim 6, wherein bonding the terminal to the conductive pattern of the substrate comprises:

Forming a solder ball on a fixed portion of the terminal exposed out of the housing; And

And electrically connecting the fixing part of the terminal to the conductive pattern through the solder ball.