WO2018214393A1 - Procédé de détection rapide de défaut fonctionnel d'une micro-pastille de pcb présentant une largeur minimale de 1 millimètre - Google Patents

Procédé de détection rapide de défaut fonctionnel d'une micro-pastille de pcb présentant une largeur minimale de 1 millimètre Download PDF

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Publication number
WO2018214393A1
WO2018214393A1 PCT/CN2017/106652 CN2017106652W WO2018214393A1 WO 2018214393 A1 WO2018214393 A1 WO 2018214393A1 CN 2017106652 W CN2017106652 W CN 2017106652W WO 2018214393 A1 WO2018214393 A1 WO 2018214393A1
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WIPO (PCT)
Prior art keywords
micro
test
pad
needle
flying probe
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PCT/CN2017/106652
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English (en)
Chinese (zh)
Inventor
聂兴培
李敬虹
陈春
樊廷慧
吴世亮
Original Assignee
惠州市金百泽电路科技有限公司
深圳市金百泽电子科技股份有限公司
西安金百泽电路科技有限公司
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Application filed by 惠州市金百泽电路科技有限公司, 深圳市金百泽电子科技股份有限公司, 西安金百泽电路科技有限公司 filed Critical 惠州市金百泽电路科技有限公司
Publication of WO2018214393A1 publication Critical patent/WO2018214393A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Definitions

  • the invention relates to a printed circuit board pad width: lmil ⁇ PAD Size ⁇ 4 mil chip-level micro-sized pad in the field of circuit and short-circuit functional detection, specifically a micro pad with a pad width of l-4 mil A quick detection method for short-circuit defects.
  • test probe The physical contact between the test probe and the conductive pad of the printed circuit board to detect the conduction performance of the substrate line and the insulation performance (Isolation) are conventional solutions for verifying the electrical performance characteristics of the PCB substrate.
  • PCB substrate as a bridge for signal transmission.
  • 5G generation smart device integrated chips led by mobile phone communication have entered the lOnm-class chip packaging technology from surface mount.
  • the pad size of the BGA/IC area is also getting smaller due to the package space requirements (regular width requirement ⁇ 61 ⁇ 1, minimum ⁇ 4mil), and the current IC package has reached the limit of 1-4 mil.
  • the PCB factory In order to ensure the short circuit electrical performance of the PCB substrate, the PCB factory must conduct electrical measurement on the network structure of all solder joints of the PCB substrate before shipment.
  • the micro-pads of less than 4 mils are proposed for the technical capabilities and testing methods of the PCB factory testing equipment. higher requirement.
  • PAD Size ⁇ 6mil day use general or compound fixture test
  • PAD Size ⁇ 4mil day size small batch order adopts flying probe test
  • large batch order can only use one kind of special conductive material PCR (Pressure) Differential Conductive Rubber) and PTB (PitchTranslation Board) made of conductive rubber fixture test
  • PCR Pressure
  • PTB PitchTranslation Board
  • PCB factories usually use AOI scanning lines + outer manual visual inspection methods, not only slow detection speed, low efficiency, and not suitable for mass production, because the human eye can not find potential functional defects between inner layers or holes. Therefore, there is a serious risk of a huge shortfall in the face of a short-circuit loss.
  • PCB boards are affected by various factors such as plate and film shrinkage and etching during the production process.
  • the test device itself has a precision deviation of l-2 mil, resulting in a normal offset of the pad center test bit of 1-2 mils. Therefore, the flying probe machine is inefficient or unable to test when testing a micro-position pad of less than 4 mil.
  • the following will study the electrical performance testing technology of the flying needle machine from the data production of the flying needle machine, equipment precision adjustment, test tool selection, alignment mode selection, test program optimization, etc., to eliminate the precision deviation, find the use of flying needle machine
  • the test equipment In the production process, due to the combined influence of various factors such as plate and film expansion and etching, the test equipment itself has a precision deviation of l-2mil, resulting in a normal test position of the pad center of l-2mil. Offset. Therefore, the flying probe machine is inefficient or unable to test when testing micro-position pads of less than 4 mil.
  • a method for quickly detecting a short defect of a micro pad having a minimum width of 1 mil includes the following steps:
  • the first step the production of the test file, firstly using the engineering software to automatically generate a test file, and then manually adjust the test position of the micro pad in the test file according to the shape of the pad and generate a test file;
  • the second step the selection of the test machine, selects the high-precision flying probe tester with the screw motion system, and uses the test board to detect the CPK accuracy test value of the flying probe tester, and the detected CPK accuracy test value and The calculated CPK accuracy value is compared, the optimal flying probe test machine is selected, and then the system software is used to correct the screw precision of the flying probe test machine again, that is, the second test of the flying probe test machine is performed, so that the fly is made.
  • the XY displacement accuracy of the needle testing machine reaches the optimal state;
  • the third step is to replace the micro test tool and perform the accuracy correction, and replace the conventional knife type test pin on the flying probe tester with a microneedle, which is a pin type test pin for the micro pad, and after replacement, utilize
  • the calibration plate makes small corrections to the accuracy of the micro-needle tip on the flying probe tester, ensuring that the precision of the microneedle tip alignment after installation is optimal;
  • the fourth step the micro pad alignment design, the selection of the micro pad as the opposite site, using the micro pad center straight
  • the alignment method is used for alignment.
  • the micro-pad alignment design adopts the method of direct alignment of the micro-pad center in the board to effectively reduce the influence of shrinkage and etching on the alignment accuracy, and improve the pair of physical plates and data coordinates.
  • the bit precision specifically, the matching of the microneedle with the tip diameter smaller than the pad width and the moving speed is preferred, thereby minimizing the influence of the pad precision variation on the test accuracy and efficiency due to the board, the film expansion and the manufacturing process deviation. , creating conditions for automated rapid mass production of chip-scale micro pads;
  • the fifth step the test machine running parameter setting, setting the test machine operating parameters, adjusting the displacement accuracy, so that the front or rear two micro needles do not collide during the test.
  • the probe can be moved and tested using the flying probe tester Controllable features, optimized micro-needle, needle position and alignment scheme for tiny chip-scale micro-pads with a pad width of 1-4 mil, and matched with moving speed to minimize shrinkage and test efficiency And the influence of precision, to ensure that the micro-needle can effectively detect the electrical performance of tiny chip-level micro-position pads with a width of l-4mil, which can realize the rapid automatic mass production of the machine instead of the traditional AOI scanning + manual visual inspection.
  • the detection method first uses the engineering software to automatically generate a test file, and then manually adjusts the test position of the micro-bit pad in the test file according to the shape of the pad to generate a test file, and then selects the high precision with the screw motion system.
  • Flying probe tester using the flying needle tester to move and test the speed controllable characteristics, combined with micro-needle and needle position and micro-position pad alignment design, the whole detection process realizes rapid automated mass production of flying probe tester. Instead of the traditional AOI scanning and manual visual inspection methods, it has high operability, low production difficulty, high efficiency and guaranteed quality.
  • test file is produced, and the specific steps are as follows:
  • test file is prepared according to the parameters of the flying probe tester, and the round or shaped pad test point is designed at the center position, the strip pads are staggered at both ends, and the chip-level micro-plate test file is indicated on the process card. Name
  • the pin type test pin for the micro pad in the third step is a tapered needle shape, and includes a needle and a needle seat, wherein the needle is a thick and thin conical needle, the needle and the needle seat.
  • the protruding length of the needle extending from the needle seat portion is 3 mm
  • the diameter of the needle tip of the needle is less than 2 mil
  • the tail of the needle is connected by flying metal wire Needle test machine
  • the signal wires of the test circuit are connected to form a passage
  • the injection portion of the needle seat is provided with a fixing hole for mounting the needle seat on the flying probe tester, and the needle seat is mounted on the flying pin by the micro chip-level microneedle through the fixing hole.
  • the needle protrudes from the needle portion by 3 mm, and the needle tip has a diameter of less than 2 mil.
  • the needle and the needle holder are integrally formed by injection molding and fixed at the end of the needle holder, and the injection-molded sheet mechanism of the needle holder has The good elasticity ensures that the test pin does not hurt the test pad and protects the safety of the needle, so that the overall performance of the conical test pin is stable, and the test is more accurate.
  • the large correction of the screw precision and the small correction of the microneedle tip in the second step and the third step constitute the accuracy correction of the flying probe tester, and the accuracy correction includes the screw XY axis of the flying probe tester.
  • Displacement accuracy correction, and micro needle tip accuracy correction, the screw XY axis displacement accuracy is corrected to a large correction, and the accuracy correction plate and the calibration program provided by the flying needle tester manufacturer are corrected by the operator, and the micro needle tip precision is corrected. Corrected to a small correction, using the defect correction plate provided by the flying probe tester manufacturer, and then correcting the tip of the replaced microneedle in turn.
  • the correction time of the large correction is about 20 minutes, and the correction time of the small correction is about 5 minutes.
  • the preferred apex angle corresponds to the apex of the unit micro-pad as the alignment point alignment;
  • the design of the detection moving speed is selected when the micro-bit pad width is greater than or equal to 3 mil ⁇ , and the medium speed is selected; when the micro-bit pad width is less than 3 mil ⁇ , select Low speed.
  • the invention selects a high-precision flying needle test machine with a screw motion system, and utilizes the movable characteristics of the flying probe test machine to replace the traditional AOI with the rapid automated production technology of the mobile flying probe tester. Scan + manual visual inspection technology to meet the needs of large-scale production of enterprises, and effectively improve test efficiency;
  • the invention replaces the traditional A with the rapid automated production technology of the mobile flying probe tester. 01 scanning + manual visual inspection technology, effectively avoiding the loss of printed boards with defective short-circuit functional defects to the client, resulting in manufacturers facing huge claims risk of more than 1:10, providing technical support for large-scale automated rapid production of enterprises ;
  • the operability is strong, the production difficulty is low, and the fast detection method of the invention is compared with the traditional AOI scanning + manual visual inspection technical solution, which effectively reduces the production difficulty of the product, and the rapid detection method of the invention first utilizes The engineering software automatically generates test files for the seed, and then selects the high-precision flying probe tester with screw motion. After selecting the test machine, replace the conventional knife test pin with the special pin test pin for the micro pad, and then the micro-position. The pad is tested to set the position, and finally the operating parameters of the flying probe tester are set, and the operability is strong.
  • a method for quickly detecting a short circuit defect of a PCB micro-pad with a minimum width of 1 mil includes the following steps: [0027] The first step, the production of the test file, firstly using the engineering software to automatically generate a test file, and then according to the welding The shape of the disc manually adjusts the test position of the micro-bit pad in the test file and generates a test file.
  • the test file is prepared according to the parameters of the flying probe tester, and the round or shaped pad test point is designed at the center position.
  • the strip pads are staggered at both ends, and the name of the micro pad test file and the width of the micro pad are indicated on the process card;
  • the second step the selection of the test machine, selects the high-precision flying probe tester with the screw motion system, and uses the test board to detect the CPK accuracy test value of the flying probe tester, and the detected CPK accuracy test value and The calculated CPK accuracy value is compared, the optimal flying probe test machine is selected, and then the system software is used to correct the screw precision of the flying probe test machine again, that is, the second test of the flying probe test machine is performed, so that the fly is made.
  • the XY displacement accuracy of the needle testing machine motion system reaches the optimal state;
  • the third step replacing the micro test tool and performing the accuracy correction, replacing the conventional knife type test pin on the flying probe tester with a microneedle, the microneedle is a pin type test pin for the micro pad, and after the replacement, the use
  • the calibration plate makes small corrections to the accuracy of the micro-needle tip on the flying probe tester, ensuring that the precision of the microneedle tip alignment after installation is optimal;
  • the fourth step, the micro pad alignment design, the micro pad is selected as the opposite site, and the micro pad center is directly aligned, and the micro pad alignment design adopts the in-board micro pad center directly.
  • Counterpoint approach Alignment effectively reducing the influence of shrinkage and etching on the alignment accuracy, improving the alignment accuracy of the physical plate and the data coordinates, specifically, preferably matching the microneedle with a tip diameter smaller than the pad width to the moving speed, maximally reducing
  • the influence of pad precision variation on test accuracy and efficiency due to board and film shrinkage and manufacturing process deviations creates conditions for automated rapid mass production of micro chip-level micro pads.
  • the fifth step the test machine operating parameter setting, the test machine operating parameters are set, the displacement accuracy is adjusted, so that the front or rear two micro needles do not collide during the test, and the test machine is adjusted.
  • the design of the detection moving speed is selected.
  • the invention relates to the selection of a high-precision flying probe tester with a screw motion system in a rapid detection method for a micro-pad ⁇ short-circuit defect with a minimum width of 1 mil, which can be moved and tested by a flying probe tester.
  • the influence of precision ensures that the micro-needle can effectively detect the electrical performance of micro-chip-level micro-pads with a width of l-4mil, which can realize the rapid automated mass production of the machine instead of the traditional AOI scanning + manual visual inspection.
  • the detection method first uses the engineering software to automatically generate a test file, and then manually adjusts the test position of the micro-bit pad in the test file according to the shape of the pad to generate a test file, and then selects the high precision with the screw motion system.
  • Flying probe tester using the flying needle tester to move and test the speed controllable characteristics, combined with the micro-needle and needle position and micro-pad alignment design, the whole detection process realizes the rapid automatic mass production of the flying probe test machine, instead of
  • the traditional AOI scanning and manual visual inspection methods have strong operability, low production difficulty, high efficiency and guaranteed quality.
  • the pin type test pin for the micro pad in the third step is a tapered needle shape, and includes a needle and a needle seat, wherein the needle is a thick and thin conical needle, the needle and the needle seat.
  • the protruding length of the needle extending from the needle seat portion is 3 mm
  • the diameter of the needle tip of the needle is less than 2 mil
  • the tail of the needle is connected by flying metal wire
  • the signal wires of the needle tester test circuit are connected to form a passage
  • the injection portion of the needle seat is provided with a fixing hole for mounting the needle seat on the flying probe tester, and the needle seat mounts the micro needle seat on the fly through the fixing hole Needle tester On.
  • the needle of the conventional knife type test needle is in the shape of a flaky knife.
  • the width of the blade is generally designed to be 2 mm to 3 mm, the length is about 5 mm, and the thickness of the new knife is greater than 4 mil. Testing the edge of the pad that is smaller than its diameter will contact the surrounding solder mask, and the test with the pad under test fails. As the number of tests increases, the tip size also increases, so only pads over 4 mils can be tested.
  • a thick and thin conical test needle is used as a microneedle, and a microneedle having a thick and a thin conical shape, the needle protrudes from the needle seat portion by 3 mm, and the tip diameter is less than 2 mil, and the needle and the needle hub are injection molded.
  • the injection part of the needle seat is set according to the type of the flying needle machine, the fixing hole of different positions is set, and the special test pin of the micro pad is mounted on the flying needle testing machine through the fixing hole, and the needle is guaranteed to be a needle type
  • the micro test pin has good contact with the PCB pad, and the injection molded sheet mechanism of the needle seat has good elasticity, which ensures that the test pin does not damage the test pad and protects the safety of the needle, and the thick and thin cone on the same side.
  • the type of test pin effectively ensures the stability of the test pin during the test, that is, the overall performance of the conical test pin is stable.
  • a special test pin for the micro-pad that is smaller than the width of the micro-pad can increase the safe distance between the edge of the test pin and the surrounding solder resist, improve the problem of floating with the pad under test, and make the tip and the pad firmly and tightly contact. Make sure the test passes.
  • the needle type is selected using ⁇ , the size of the needle tip is first measured and classified according to the size. According to the width of the pad on the flow card, a microneedle having a needle tip diameter of less than 2 mil is preferred, and the diameter of the needle tip of the microneedle is greater than or equal to 4 mil ⁇ , can only be used to produce conventional boards, or to produce micro-boards after passing the sanding.
  • the large correction of the screw precision and the small correction of the microneedle tip in the second step and the third step constitute the accuracy correction of the flying probe tester, and the accuracy correction includes the screw XY axis of the flying probe tester.
  • Displacement accuracy correction, and micro needle tip accuracy correction, the screw XY axis displacement accuracy is corrected to a large correction, and the accuracy correction plate and the calibration program provided by the flying needle tester manufacturer are corrected by the operator, and the micro needle tip precision is corrected.
  • the correction time of the large correction is about 20 minutes
  • the correction of the small correction is about It is 5 minutes.
  • a plurality of micro-pad regions ⁇ appear in each of the boards, and the apex of the preferred board angle corresponding to the unit micro-pad is aligned as a counter point;
  • the board was flawed due to the shrinkage of the board, film, drilling, etc., and the test file was divided according to each shipping unit, and the micro-pad alignment design in the fourth step above was divided.
  • Counterpoint Conventional flying probe tester It is to select the hole or pad of the diagonal corner of the board as the alignment point between the data pattern and the physical board to facilitate the operation of the staff, but since the conventional alignment pad is much larger than the micro pad, the production hole or pad is produced.
  • the micro pad product selects the solution in the fourth step of the invention, selects the micro pad as the counter point, and adopts the method of direct alignment of the micro pad center to reduce the position.
  • the effect of shrinking and etching on the alignment accuracy can quickly and effectively improve the alignment accuracy of the physical plate and the data coordinates.
  • a method for quickly detecting a short circuit defect of a PCB micro-pad with a minimum width of 1 mil includes the following steps:
  • the first step the production of the test file, firstly using the engineering software to automatically generate a test file, and then manually adjust the test position of the micro-bit pad in the test file according to the shape of the pad and generate a test file, specifically Ground, according to the parameters of the flying probe tester to make test files, the round or shaped pad test points are designed at the center position, the strip pads are staggered at both ends, and the name of the micro pad test file is indicated on the process card.
  • the width of the micro pad is
  • the second step the selection of the test machine, selects the high-precision flying probe tester with the screw motion system, and uses the test board to detect the CPK accuracy test value of the flying probe tester, and the detected CPK accuracy test value and The calculated CPK accuracy value is compared, the optimal flying probe test machine is selected, and then the system software is used to correct the screw precision of the flying probe test machine again, that is, the second test of the flying probe test machine is performed, so that the fly is made.
  • the XY displacement accuracy of the needle testing machine motion system reaches the optimal state;
  • the third step is to replace the micro test tool and perform the accuracy correction, and replace the conventional knife type test pin on the flying probe tester with a microneedle, which is a special pin type test pin for the micro pad, and after replacement, utilize
  • the calibration plate makes small corrections to the accuracy of the micro-needle tip on the flying probe tester, ensuring that the precision of the microneedle tip alignment after installation is optimal;
  • the fourth step, the micro pad alignment design, the micro pad is selected as the opposite site, and the micro pad center is directly aligned, and the micro pad alignment design adopts the in-board micro pad center directly.
  • the alignment of the alignment method effectively reduces the influence of the expansion and contraction and the etching on the alignment accuracy, and improves the alignment accuracy of the physical plate and the data coordinates.
  • the fifth step the test machine operating parameter setting, the test machine operating parameters are set, the displacement accuracy is adjusted, so that the front or rear two micro needles do not collide during the test, and the test machine is adjusted.
  • the design of the detection moving speed is selected.
  • the invention has the minimum width of 1 mil micro-pad ⁇ short-circuit defect rapid detection method in the selection of a high-precision flying probe test machine with a screw motion system, the flying probe tester can be moved, the test speed can be Controlled features, optimized micro-needle, needle position and alignment scheme for tiny chip-scale micro-pads with a pad width of 1-4 mil, and matched with the moving speed to minimize shrinkage and test efficiency
  • the influence of precision ensures that the micro-needle can effectively detect the electrical performance of micro-chip-level micro-pads with a width of l-4mil, which can realize the rapid automated mass production of the machine instead of the traditional AOI scanning + manual visual inspection.
  • the detection method first uses the engineering software to automatically generate a test file, and then manually adjusts the test position of the micro-bit pad in the test file according to the shape of the pad to generate a test file, and then selects the high precision with the screw motion system.
  • Flying probe tester using the flying needle tester to move and test the speed controllable characteristics, combined with the micro-needle and needle position and micro-pad alignment design, the whole detection process realizes the rapid automatic mass production of the flying probe test machine, instead of
  • the traditional AOI scanning and manual visual inspection methods have strong operability, low production difficulty, high efficiency and guaranteed quality.
  • the pin type test pin for the micro pad in the third step is a tapered needle shape, and includes a needle and a needle seat, wherein the needle is a thick and thin conical needle, the needle and the needle seat.
  • the protruding length of the needle extending from the needle seat portion is 3 mm
  • the diameter of the needle tip of the needle is less than 2 mil
  • the tail of the needle is connected by flying metal wire
  • the signal wires of the needle tester test circuit are connected to form a passage
  • the injection portion of the needle seat is provided with a fixing hole for mounting the needle seat on the flying probe tester, and the needle seat mounts the micro needle seat on the fly through the fixing hole Needle test machine.
  • the needle of the conventional knife type test needle is in the shape of a flaky knife.
  • the width of the blade is generally designed to be 2 mm to 3 mm, the length is about 5 mm, and the thickness of the new knife is greater than 4 mil. Testing the edge of the pad which is smaller than its diameter will contact the surrounding solder mask and form a contact with the measured pad. The dangling state test failed. As the number of tests increases, the tip size also increases, so only pads over 4 mils can be tested.
  • a thick and thin conical test needle is used as a microneedle, and a microneedle having a thick and a thin conical shape, the needle protrudes from the needle seat portion by 3 mm, and the tip diameter is less than 2 mil, and the needle and the needle hub are injection molded.
  • the injection part of the needle seat is set according to the type of the flying needle machine, the fixing hole of different positions is set, and the special test pin of the micro pad is mounted on the flying needle testing machine through the fixing hole, and the needle is guaranteed to be a needle type
  • the micro test pin has good contact with the PCB pad, and the injection molded sheet mechanism of the needle seat has good elasticity, which ensures that the test pin does not damage the test pad and protects the safety of the needle, and the thick and thin cone on the same side.
  • the type of test pin effectively ensures the stability of the test pin during the test, that is, the overall performance of the conical test pin is stable.
  • a special test pin for the micro-pad that is smaller than the width of the micro-pad can increase the safe distance between the edge of the test pin and the surrounding solder resist, improve the problem of floating with the pad under test, and make the tip and the pad firmly and tightly contact. Make sure the test passes.
  • the needle type is selected using ⁇ , the size of the needle tip is first measured and classified according to the size. According to the width of the pad on the flow card, a microneedle having a needle tip diameter of less than 2 mil is preferred, and the diameter of the needle tip of the microneedle is greater than or equal to 4 mil ⁇ , can only be used to produce conventional boards, or to produce micro-boards after passing the sanding.
  • the large correction of the screw precision and the small correction of the microneedle tip in the second step and the third step constitute the accuracy correction of the flying probe tester, and the accuracy correction includes the screw XY axis of the flying probe tester.
  • Displacement accuracy correction, and micro needle tip accuracy correction, the screw XY axis displacement accuracy is corrected to a large correction, and the accuracy correction plate and the calibration program provided by the flying needle tester manufacturer are corrected by the operator, and the micro needle tip precision is corrected.
  • the correction time of the large correction is about 20 minutes
  • the correction of the small correction is about It is 5 minutes.
  • a plurality of micro-pad regions ⁇ appear in each of the boards, and the apex of the preferred board angle corresponding to the unit micro-pad is aligned as a counter point;
  • the test file was divided according to each shipping unit, and the micro-pad alignment design in the fourth step above was divided. Counterpoint.
  • the conventional flying probe tester selects the hole or pad of the diagonal corner of the plate as the alignment point between the data pattern and the physical plate to facilitate the operation of the staff, but since the conventional alignment pad is much larger than the micro pad, the production The effect of the expansion or contraction of the mesopores or pads is naturally larger than that of the micro-pads, resulting in a decrease in the alignment accuracy of the physical board and the test data.
  • the micro pad product selects the solution in the fourth step of the invention, selects the micro pad as the counter point, and adopts the method of direct alignment of the micro pad center to reduce the shrinkage and The influence of etching on the alignment accuracy can quickly and effectively improve the alignment accuracy of the physical plate and the data coordinates.
  • the present invention has a minimum width of 1 mil micro-pad ⁇ short-circuit defect rapid detection method, operability is strong

Abstract

L'invention concerne un procédé de détection rapide d'un défaut fonctionnel d'une micro-pastille de PCB présentant une largeur minimale de 1 millimètre. Le procédé comprend : la génération, au moyen d'une détermination de point automatique d'un logiciel d'ingénierie, d'un fichier test, la réalisation manuelle, en fonction d'une forme de pastille, du réglage local d'une position de test d'une micro-pastille dans le fichier test, et la génération d'un fichier test ; la sélection d'une machine de test de sonde volante de haute précision possédant un système de déplacement d'arbre de vis afin de sélectionner une machine de test de sonde volante optimale ; la réalisation d'un remplacement pour un outil de test à micro-échelle et d'un étalonnage de précision, par le remplacement d'une sonde de test à pointe de lame classique sur la machine de test de sonde volante par une micro-sonde constituant une sonde de test à pointe d'aiguille dédiée aux micro-pastilles ; la réalisation d'une configuration d'alignement de micro-pastilles, la sélection d'une micro-pastille en tant que point d'alignement, et la réalisation d'un alignement au moyen d'un alignement direct avec un centre de la micro-pastille ; et la configuration d'un paramètre de fonctionnement de la machine de test de sonde volante. Ledit procédé rapide de détection d'un défaut de court-circuit ou de circuit ouvert d'une micro-pastille présentant une largeur minimale de 1 millimètre présente divers avantages, tels qu'une exploitabilité forte, des difficultés de fabrication faibles, une efficacité élevée et une qualité garantie.
PCT/CN2017/106652 2017-05-23 2017-10-18 Procédé de détection rapide de défaut fonctionnel d'une micro-pastille de pcb présentant une largeur minimale de 1 millimètre WO2018214393A1 (fr)

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Application Number Priority Date Filing Date Title
CN201710367000.9A CN107356857B (zh) 2017-05-23 2017-05-23 宽度为1mil-4mil的PCB微型焊盘功能性缺陷的快速检测方法
CN201710367000.9 2017-05-23

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WO2018214393A1 true WO2018214393A1 (fr) 2018-11-29

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Cited By (1)

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