WO2018211701A1 - Fil supraconducteur, procédé de jonction de fil supraconducteur, bobine supraconductrice et dispositif supraconducteur - Google Patents

Fil supraconducteur, procédé de jonction de fil supraconducteur, bobine supraconductrice et dispositif supraconducteur Download PDF

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Publication number
WO2018211701A1
WO2018211701A1 PCT/JP2017/018880 JP2017018880W WO2018211701A1 WO 2018211701 A1 WO2018211701 A1 WO 2018211701A1 JP 2017018880 W JP2017018880 W JP 2017018880W WO 2018211701 A1 WO2018211701 A1 WO 2018211701A1
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Prior art keywords
superconducting
layer
wire
superconducting layer
joining
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PCT/JP2017/018880
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English (en)
Japanese (ja)
Inventor
康太郎 大木
永石　竜起
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住友電気工業株式会社
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Priority to PCT/JP2017/018880 priority Critical patent/WO2018211701A1/fr
Publication of WO2018211701A1 publication Critical patent/WO2018211701A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F6/00—Superconducting magnets; Superconducting coils
    • H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor

Definitions

  • the present disclosure relates to a superconducting wire, a superconducting wire joining method, a superconducting coil, and a superconducting device.
  • the superconducting wire described in Patent Document 1 has a first wire, a second wire, and a bonding layer.
  • the first wire includes a first superconducting layer formed of a high temperature superconductor.
  • the 2nd wire contains the 2nd superconducting layer constituted by the high temperature superconductor.
  • the bonding layer is composed of a high-temperature superconductor.
  • the first wire and the second wire are arranged so that the first superconducting layer and the second superconducting layer are opposed to each other through the bonding layer.
  • the crystal orientation of the bonding layer is along the crystal orientation of the first superconducting layer and the second superconducting layer.
  • the superconducting wire includes a first wire and a second wire.
  • the first wire has a first superconducting layer.
  • the second wire has a second superconducting layer and a bonding layer disposed on the second superconducting layer, and is disposed so that the bonding layer faces the first superconducting layer.
  • the material constituting the first superconducting layer, the second superconducting layer, and the bonding layer is a high-temperature superconductor.
  • the first superconducting layer includes a portion that is superconductingly bonded to the bonding layer.
  • the first wire and the second wire overlap each other while being spaced apart from each other around the bonding layer to be superconductively bonded to the first superconducting layer.
  • a superconducting wire connection method includes a step of preparing a first wire having a first superconducting layer and a second wire having a second superconducting layer, and a bonding layer on the second superconducting layer.
  • a step of forming, a step of applying pressure while heating between the first wire and the second wire with the first superconducting layer and the bonding layer facing each other, and a step of introducing oxygen into the bonding layer Prepare. The pressure is applied so that the first wire and the second wire are separated from each other around the bonding layer bonded to the first superconducting layer, including the portion where the first superconducting layer is bonded to the bonding layer.
  • a superconducting coil according to an aspect of the present disclosure includes the superconducting wire described above.
  • the superconducting wire is wound around the central axis of the superconducting coil.
  • a superconducting device includes the superconducting coil, a cryostat that stores the superconducting coil therein, and a refrigerator that cools the superconducting coil.
  • FIG. 1 is a top view of the superconducting wire according to the first embodiment.
  • FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a process diagram showing the superconducting wire joining method according to the first embodiment.
  • FIG. 6 is a cross-sectional view of the bonding portion in the heating and pressing step S3.
  • FIG. 7 is a cross-sectional view of a superconducting wire joint according to the second embodiment.
  • FIG. 8 is a top view of the superconducting wire according to the third embodiment.
  • FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. 10 is a cross-sectional view taken along the line XX of FIG.
  • FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG.
  • FIG. 12 is a schematic diagram showing a state of a magnetic field when a coil is formed using a superconducting wire.
  • FIG. 13 is an enlarged schematic view in a region XIII in FIG.
  • FIG. 14 is a schematic cross-sectional view of a superconducting device according to the fourth embodiment.
  • the present disclosure has been made in view of such problems of the prior art. Specifically, the present disclosure provides a superconducting wire and a superconducting wire joining method that can reduce the time required to introduce oxygen into the joining layer.
  • the time required for the treatment for introducing oxygen into the bonding layer can be shortened.
  • the time required for the treatment for introducing oxygen into the bonding layer can be shortened.
  • the time required for the treatment for introducing oxygen into the bonding layer can be shortened.
  • the time required for the treatment for introducing oxygen into the bonding layer can be shortened.
  • a superconducting wire includes a first wire having a first superconducting layer, a second superconducting layer, and a bonding layer disposed on the second superconducting layer, and the bonding layer is A second wire disposed to face the first superconducting layer.
  • the material constituting the first superconducting layer, the second superconducting layer, and the bonding layer is a high-temperature superconductor.
  • the first superconducting layer includes a portion that is superconductingly bonded to the bonding layer.
  • the first wire and the second wire overlap each other while being spaced apart from each other around the bonding layer to be superconductively bonded to the first superconducting layer.
  • the first wire and the second wire are separated around the bonding layer to be superconductingly bonded to the first superconducting layer.
  • Oxygen passes between the first wire and the second wire and is supplied to the bonding layer that is superconductively bonded to the first superconducting layer. Therefore, according to the superconducting wire (1), the time for introducing oxygen into the bonding layer can be shortened.
  • the first superconducting layer may be superconductingly bonded to the bonding layer along the longitudinal direction of the first wire. According to the superconducting wire (2) above, the time for introducing oxygen into the bonding layer can be shortened.
  • the surface of the first superconducting layer on the bonding layer side may protrude from the periphery at the portion where the superconducting bonding with the bonding layer is performed. According to the superconducting wire (3) above, the time for introducing oxygen into the bonding layer can be shortened.
  • the first superconducting layer is constituted by a plurality of portions extending along the longitudinal direction of the first wire and separated from each other along the width direction of the first wire. May be.
  • the second superconducting layer may be constituted by a plurality of portions extending along the longitudinal direction of the second wire and separated from each other along the width direction of the second wire.
  • each of the first superconducting layer and the second superconducting layer is electrically separated. Therefore, when a coil is formed using the superconducting wire of (4), it is possible to reduce the shielding current due to the magnetic field generated by the current flowing through the coil.
  • the high-temperature superconductor may be REBCO.
  • the crystal orientation of the bonding layer may be along the crystal orientation of the first superconducting layer and the second superconducting layer. According to the superconducting wire (5), the time for introducing oxygen into the bonding layer can be shortened.
  • a superconducting wire joining method includes a step of preparing a first wire having a first superconducting layer and a second wire having a second superconducting layer, and joining on the second superconducting layer A step of forming a layer, a step of applying pressure while heating between the first wire and the second wire with the first superconducting layer and the bonding layer facing each other, and a step of introducing oxygen into the bonding layer With. The pressure is applied so that the first wire and the second wire are separated from each other around the bonding layer bonded to the first superconducting layer, including the portion where the first superconducting layer is bonded to the bonding layer.
  • the time for introducing oxygen into the bonding layer can be shortened.
  • the pressure is such that the first wire and the second wire are sandwiched by a pressure jig, and at least one of the pressure jig, the first wire, and the second wire. It may be applied by inserting a plate-like member between them. The plate-like member may be disposed at a position overlapping the first superconducting layer joined to the joining layer in plan view. According to the superconducting wire bonding method of (7) above, the time for introducing oxygen into the bonding layer can be shortened.
  • a superconducting coil according to an aspect of the present disclosure includes the superconducting wires of (1) to (5) above.
  • the superconducting wire is wound around the central axis of the superconducting coil.
  • a superconducting device includes the superconducting coil according to (8), a cryostat, and a refrigerator.
  • the cryostat houses a superconducting coil inside.
  • the refrigerator cools the superconducting coil.
  • FIG. 1 is a top view of the superconducting wire according to the first embodiment.
  • FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • the superconducting wire according to the first embodiment has a first wire 1 and a second wire 2.
  • the first wire 1 and the second wire 2 are joined together.
  • the longitudinal direction of the first wire 1 is preferably along the longitudinal direction of the second wire 2.
  • the direction orthogonal to the longitudinal direction of the first wire 1 (longitudinal direction of the second wire 2) may be referred to as the width direction of the first wire 1 (width direction of the second wire 2).
  • the first wire 1 has a first superconducting layer 13. More specifically, the first wire 1 has a first base material 11, a first intermediate layer 12, a first superconducting layer 13, a first protective layer 14, and a first stabilization layer 15. ing.
  • the first base material 11 is made of, for example, a clad material in which stainless steel, a nickel (Ni) layer, and a copper (Cu) layer are stacked.
  • the first substrate 11 may be made of Hastelloy (registered trademark) or the like.
  • the first intermediate layer 12 is disposed on the first base material 11.
  • the first intermediate layer 12 is a layer for reducing lattice mismatch between the first base material 11 and the first superconducting layer 13.
  • the material used for the first intermediate layer 12 is appropriately selected according to the first superconducting layer 13.
  • the first intermediate layer 12 is, for example, cerium oxide (CeO 2 ).
  • the first intermediate layer 12 preferably has a uniform crystal orientation.
  • the first superconducting layer 13 is disposed on the first intermediate layer 12. It is composed of a high-temperature superconductor.
  • a high-temperature superconductor refers to a material having a superconducting transition temperature of liquid nitrogen temperature (77 Kelvin) or higher.
  • the high temperature superconductor constituting the first superconducting layer 13 is, for example, REBCO.
  • REBCO is (RE) Ba 2 Cu 3 O x
  • RE is, for example, yttrium (Y), gadolinium (Gd), europium (Eu), dysprosium (Dy), erbium (Er), lanthanum (La), thulium (Tm), rare earth elements such as ytterbium (Yb)).
  • the material which comprises the 1st superconducting layer 13 is not restricted to this.
  • the material constituting the first superconducting layer 13 may be, for example, Bi 2 Sr 2 Ca 2 Cu 3 O x (Bi-2223).
  • the first superconducting layer 13 preferably has a uniform crystal orientation. Specifically, the c-axis of the material constituting the first superconducting layer 13 is along the direction from the first intermediate layer 12 toward the first protective layer 14 (the thickness direction of the first superconducting layer 13). preferable. From another viewpoint, it is preferable that the ab surface of the material constituting the first superconducting layer 13 is parallel to the longitudinal direction and the width direction of the first wire 1.
  • the first protective layer 14 and the first stabilization layer 15 are layers for bypassing current when a quench occurs in the first superconducting layer 13 (a phenomenon in which a transition from a superconducting state to a normal conducting state) occurs.
  • the first protective layer 14 is disposed on the first superconducting layer 13.
  • the first stabilization layer 15 is disposed on the first protective layer 14.
  • the first protective layer 14 is made of, for example, silver (Ag).
  • the first stabilization layer 15 is made of, for example, Cu.
  • the second wire 2 has a second superconducting layer 23. More specifically, the second wire 2 has a second base material 21, a second intermediate layer 22, a second superconducting layer 23, a second protective layer 24, and a second stabilization layer 25. ing.
  • the 2nd base material 21 is comprised by the clad material which laminated
  • the second base material 21 may be made of Hastelloy (registered trademark) or the like.
  • the second intermediate layer 22 is disposed on the second base material 21.
  • the second intermediate layer 22 is a layer for reducing lattice mismatch between the second base material 21 and the second superconducting layer 23.
  • the material used for the second intermediate layer 22 is appropriately selected according to the second superconducting layer 23.
  • second superconducting layer 23 is REBCO
  • second intermediate layer 22 is, for example, CeO 2.
  • the second intermediate layer 22 preferably has a uniform crystal orientation.
  • the second superconducting layer 23 is disposed on the second intermediate layer 22. It is composed of a high-temperature superconductor.
  • the high temperature superconductor constituting the second superconducting layer 23 is, for example, REBCO.
  • the material which comprises the 2nd superconducting layer 23 is not restricted to this.
  • the material constituting the second superconducting layer 23 may be, for example, Bi-2223.
  • the high temperature superconductor constituting the second superconducting layer 23 is preferably the same as the high temperature superconductor constituting the first superconducting layer 13.
  • the second superconducting layer 23 preferably has a uniform crystal orientation. Specifically, the c-axis of the material constituting the second superconducting layer 23 is along the direction from the second intermediate layer 22 toward the second protective layer 24 (the thickness direction of the second superconducting layer 23). preferable. From another viewpoint, it is preferable that the ab surface of the material constituting the second superconducting layer 23 is parallel to the longitudinal direction and the width direction of the second wire 2.
  • the second protective layer 24 and the second stabilization layer 25 are layers for bypassing current when the second superconducting layer 23 is quenched.
  • the second protective layer 24 is disposed on the second superconducting layer 23.
  • the second stabilization layer 25 is disposed on the second protective layer 24.
  • the second protective layer 24 is made of, for example, Ag.
  • the second stabilization layer 25 is made of, for example, Cu.
  • the second wire 2 further has a bonding layer 3.
  • the first protective layer 14, the first stabilizing layer 15, the second protective layer 24, and the second stabilizing layer 25 are removed.
  • the bonding layer 3 is disposed on the second superconducting layer 23.
  • the first wire 1 and the second wire 2 are arranged so that the first superconducting layer 13 and the joining layer 3 face each other. .
  • the bonding layer 3 is composed of a high-temperature superconductor.
  • the high temperature superconductor constituting the bonding layer 3 is the same as the high temperature superconductor constituting the first superconductor layer 13 and the second superconductor layer 23.
  • the bonding layer 3 includes a first portion 3a, a second portion 3b, and a third portion 3c.
  • the second part 3b is separated from the first part 3a.
  • the first portion 3 a and the second portion 3 b are located at both ends in the width direction of the second wire 2, for example.
  • the third portion 3c is sandwiched between the first portion 3a and the second portion 3b.
  • the third portion 3c is superconductively joined to the first superconducting layer 13.
  • the first portion 3a and the second portion 3b are not joined to the first superconducting layer 13 (separated from the first superconducting layer 13).
  • the bonding layer 3 is overlapped with the first wire 1 and the second wire 2 being separated from each other around the bonding layer 3 that is superconductively bonded to the first superconductive layer 13. ing.
  • the bonding layer 3 is preferably superconductively bonded to the second superconducting layer 23 in the first portion 3a, the second portion 3b, and the third portion 3c.
  • the first superconducting layer 13 (second superconducting layer 23) and the joining layer 3 are superconductingly joined at a temperature not higher than the superconducting transition temperature of the first superconducting layer 13 (second superconducting layer 23). It means that current flows between the first superconducting layer 13 (second superconducting layer 23) and the bonding layer 3 in a superconducting state.
  • the first portion 3a, the second portion 3b, and the third portion 3c extend along the longitudinal direction of the first wire 1 and the second wire 2. That is, the bonding layer 3 is preferably superconductively bonded to the first superconducting layer 13 along the longitudinal direction of the first wire 1 and the second wire 2.
  • the first portion 3a has a width W1.
  • the second portion 3b has a width W2.
  • the third portion 3c has a width W3.
  • the width W ⁇ b> 1 is the width of the first portion 3 a in the width direction of the first wire 1 and the second wire 2.
  • the width W ⁇ b> 2 is the width of the second portion 3 b in the width direction of the first wire 1 and the second wire 2.
  • the width W ⁇ b> 3 is the width of the third portion 3 c in the width direction of the first wire 1 and the second wire 2.
  • a value obtained by dividing the width W3 by the sum of the width W1 and the width W2 is 0.13 or more and 0.75 or less.
  • the first superconducting layer 13 may have a first end at one end of the first wire 1 and a second end at the other end of the first wire 1.
  • the first wire 1 positioned at the other end may have a bonding layer 3 on the second end.
  • the bonding layer 3 may face the first end.
  • the first end portion may have a portion that is superconductively bonded to the bonding layer 3.
  • the one end and the other end of the first wire 1 may overlap with each other while being separated from each other.
  • FIG. 5 is a process diagram showing the superconducting wire joining method according to the first embodiment.
  • the superconducting wire bonding method according to the first embodiment includes a wire rod preparation step S1, a bonding layer forming step S2, a heating and pressing step S3, and a bonding layer oxygen introduction step S4. ing.
  • the first wire 1 and the second wire 2 are prepared.
  • the bonding layer forming step S2 the bonding layer 3 is formed.
  • the bonding layer 3 is formed on the second superconducting layer 23.
  • the bonding layer 3 In forming the bonding layer 3, first, an organic compound of an element constituting the high-temperature superconductor used in the bonding layer 3 is applied. Secondly, a heat treatment is performed on the coating film of the organic compound. Thereby, the coating film of the organic compound becomes a precursor of the high-temperature superconductor used for the bonding layer 3 (hereinafter, a film containing the precursor is referred to as a calcined film).
  • This precursor contains carbides of elements constituting the high-temperature superconductor used for the bonding layer 3.
  • This heat treatment is performed at a treatment temperature that is equal to or higher than the decomposition temperature of the organic compound and lower than the generation temperature of the high-temperature superconductor used in the bonding layer 3.
  • a heat treatment is performed on the calcined film.
  • the carbide contained in the calcined film is decomposed to become a high-temperature superconductor used for the bonding layer 3.
  • the heat treatment for the calcined film is performed in an atmosphere having an oxygen concentration of 1 percent or more.
  • the bonding layer 3 contains fine crystals of the high-temperature superconductor.
  • FIG. 6 is a cross-sectional view of the joint portion in the heating and pressing step S3.
  • the first wire 1 and the second wire 2 are arranged so that the bonding layer 3 and the first superconducting layer 13 face each other.
  • pressure is applied between the first wire 1 and the second wire (more specifically, between the first superconducting layer 13 and the second superconducting layer 23). In applying this pressure, heating is also performed.
  • This pressure includes a portion where the first superconducting layer 13 is joined to the joining layer 3, and the first wire 1 and the second wire 2 are separated from each other around the joining layer 3 joined to the first superconducting layer 13. To be applied.
  • the pressure is applied by holding the first wire 1 and the second wire 2 with the pressure jig 4 and at least one of the pressure jig 4, the first wire 1 and the second wire 2.
  • the pressure adjustment plate 5 is sandwiched between the two.
  • the pressure adjusting plate 5 is a plate-like member.
  • the pressure adjusting plate 5 is disposed at a position overlapping the first superconducting layer 13 bonded to the bonding layer 3 in plan view.
  • the pressure applied between the first superconducting layer 13 and the second superconducting layer 23 increases in a portion overlapping the pressure adjusting plate 5 in plan view.
  • fine crystals of the high-temperature superconductor contained in the bonding layer 3 are epitaxially grown along the crystal orientations of the first superconducting layer 13 and the second superconducting layer 23.
  • the pressure applied between the first superconducting layer 13 and the second superconducting layer 23 is relatively small in a portion that does not overlap the pressure adjusting plate 5 in plan view.
  • the fine crystals of the high-temperature superconductor contained in the bonding layer are epitaxially grown along the crystal orientation of the second superconducting layer 23, but not epitaxially grown along the crystal orientation of the first superconducting layer 13. That is, superconducting bonding between the bonding layer 3 and the first superconducting layer 13 is achieved in a portion overlapping the pressure adjusting plate 5 in a plan view, but in a portion not overlapping the pressure adjusting plate 5 in a plan view. 3 and the first superconducting layer 13 are not joined.
  • the bonding layer oxygen introduction step S4 oxygen is introduced into the bonding layer 3. Specifically, the first wire 1, the second wire 2, and the bonding layer 3 are subjected to heat treatment in an atmosphere containing oxygen, whereby oxygen is introduced into the bonding layer. Thus, the superconducting wire joining method according to the first embodiment is completed.
  • the first portion 3 a and the second portion 3 b are not joined to the first superconducting layer 13. Therefore, oxygen passes between the first part 3 a and the second part 3 b and the first superconducting layer 13 and is supplied to the third part 3 c joined to the first superconducting layer 13.
  • a path for supplying oxygen to the joining layer contributing to the superconducting junction is secured. The time for introducing oxygen into the layer 3 can be shortened.
  • FIG. 7 is a cross-sectional view at the junction of the superconducting wire according to the second embodiment.
  • the superconducting wire according to the second embodiment has a first wire 1 and a second wire 2.
  • the first wire 1 has a first superconducting layer 13.
  • the second wire 2 has a second superconducting layer 23 and a bonding layer 3.
  • the bonding layer 3 includes a first portion 3a, a second portion 3b, and a third portion 3c.
  • the first superconducting layer 13 is superconductingly joined to the third portion 3c.
  • the first wire 1 is separated from the first part 3a and the second part 3b.
  • the first superconducting layer 13 has a portion that is superconductively bonded to the bonding layer 3, and the first wire 1 and the second wire 2 around the bonding layer 3 that is superconductively bonded to the first superconductive layer 13. And overlap each other while being separated from each other.
  • the superconducting wire according to the second embodiment is common to the superconducting wire according to the first embodiment.
  • the first superconducting layer 13 has a first surface 13a and a second surface 13b.
  • the second surface 13b is the opposite surface of the first surface 13a.
  • the second surface 13b is a surface on the first intermediate layer 12 side.
  • the first surface 13a is a surface on the bonding layer 3 side.
  • the first surface 13a protrudes toward the second surface 13b at the portion facing the third portion 3c. That is, the first surface 13a protrudes from the periphery at a portion where the first conductive layer 13a and the bonding layer 3 are superconductively bonded.
  • the superconducting wire according to the second embodiment is different from the superconducting wire according to the first embodiment.
  • the superconducting wire according to the second embodiment a space is formed between the first portion 3a and the second portion 3b and the first surface 13a. Oxygen is supplied to the third portion 3c that is superconductingly bonded to the first superconducting layer 13 through this space. Therefore, according to the superconducting wire according to the second embodiment, the time for introducing oxygen into the bonding layer 3 that contributes to the superconducting junction can be shortened, similarly to the superconducting wire according to the first embodiment.
  • FIG. 8 is a top view of the superconducting wire according to the third embodiment.
  • the superconducting wire according to the third embodiment has a first wire 1 and a second wire 2.
  • FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. 10 is a cross-sectional view taken along the line XX of FIG.
  • FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG.
  • the first wire 1 has a first superconducting layer 13.
  • the second wire 2 has a second superconducting layer 23.
  • the second wire 2 further has a bonding layer 3.
  • the first superconducting layer 13 is in superconducting junction with the third portion 3c.
  • the first wire 1 is overlapped while being separated from the second wire 2 at a portion facing the first portion 3a and the second portion 3b. That is, the first superconducting layer 13 has a portion that is superconductively bonded to the bonding layer 3, and the first wire 1 and the second wire 2 around the bonding layer 3 that is superconductively bonded to the first superconductive layer 13. And overlap each other while being separated from each other.
  • the superconducting wire according to the third embodiment is common to the superconducting wire according to the first embodiment.
  • the first superconducting layer 13 is constituted by a plurality of portions extending along the longitudinal direction of the first wire 1 and arranged at intervals along the width direction of the first wire 1.
  • the second superconducting layer 23 is composed of a plurality of portions that extend along the longitudinal direction of the second wire 2 and are arranged at intervals along the width direction of the second wire 2.
  • the superconducting wire according to the third embodiment is different from the superconducting wire according to the first embodiment.
  • Each of the plurality of portions of the first superconducting layer 13 opposes each of the plurality of portions of the second superconducting layer 23 via the bonding layer 3 (third portion 3c).
  • FIG. 12 is a schematic diagram showing the state of a magnetic field when a coil is formed using a superconducting wire. As shown in FIG. 12, a magnetic field MF is generated when a current flows through the coil 20. This magnetic field MF has a component MF1 in the coil radial direction and a component MF2 in the coil length direction.
  • FIG. 13 is an enlarged schematic diagram in region XIII of FIG.
  • the superconducting wire constituting the coil 20 has a superconducting layer 10.
  • Superconducting layer 10 is uniformly formed in the superconducting wire.
  • an eddy current shielding current
  • This shielding current further generates a magnetic field.
  • the central magnetic field of the coil 20 decreases, the central magnetic field of the coil 20 varies with time, and the magnetic field distribution of the coil 20 is organized.
  • the first superconducting layer 13 extends along the longitudinal direction of the first wire 1 and is arranged at intervals along the width direction of the first wire 1. It is composed of a plurality of parts.
  • the second superconducting layer 23 is composed of a plurality of portions that extend along the longitudinal direction of the second wire 2 and are arranged at intervals along the width direction of the second wire 2. Therefore, each part which comprises the 1st superconducting layer 13 and the 2nd superconducting layer 23 is electrically isolate
  • the first superconducting layer 13 is superconductingly joined to the third portion 3c. Further, in the superconducting wire according to the third embodiment, the first wire 1 is overlapped while being separated from the second wire 2 at a portion facing the first portion 3a and the second portion 3b. Therefore, oxygen is supplied to the bonding layer 3 bonded to the first superconducting layer 13 through the first wire 3 and the first wire 3 between the first portion 3 a and the second portion 3 b. Therefore, according to the superconducting wire according to the third embodiment, similarly to the superconducting wire according to the first embodiment, the time for introducing oxygen into the bonding layer 3 that contributes to the superconducting junction can be shortened.
  • FIG. 14 is a schematic cross-sectional view of a superconducting device according to the fourth embodiment.
  • the superconducting device according to the fourth embodiment includes a superconducting coil 110, a cryostat 120, and a refrigerator 130.
  • Superconducting coil 110 is disposed inside cryostat 120. More specifically, the heat shield 121 is disposed inside the cryostat 120, and the superconducting coil 110 is disposed inside the heat shield 121.
  • Superconducting coil 110 is formed by winding superconducting wire 111 around the central axis of superconducting coil 110.
  • the superconducting wire 111 is a superconducting wire according to the first to third embodiments.
  • the refrigerator 130 cools the superconducting coil 110 disposed inside the cryostat 120 to the superconducting transition temperature of the first superconducting layer 13 and the second superconducting layer 23 or lower.
  • the refrigerator 130 is, for example, a Gifford McMahon refrigerator.

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Abstract

Selon un mode de réalisation de la présente invention, un fil supraconducteur comprend un premier matériau de fil pourvu d'une première couche supraconductrice, un second matériau de fil pourvu d'une seconde couche supraconductrice, et une couche de jonction qui est disposée sur la seconde couche supraconductrice de manière à être en regard de la première couche supraconductrice. Le matériau composant les première et seconde couches supraconductrices et la couche de jonction est un supraconducteur haute température. La première couche supraconductrice comprend une partie qui forme une jonction supraconductrice avec la couche de jonction. Dans la périphérie de la couche de jonction qui forme une jonction supraconductrice avec la première couche supraconductrice, les premier et second matériaux de fil se chevauchent tout en étant séparés l'un de l'autre.
PCT/JP2017/018880 2017-05-19 2017-05-19 Fil supraconducteur, procédé de jonction de fil supraconducteur, bobine supraconductrice et dispositif supraconducteur WO2018211701A1 (fr)

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PCT/JP2017/018880 WO2018211701A1 (fr) 2017-05-19 2017-05-19 Fil supraconducteur, procédé de jonction de fil supraconducteur, bobine supraconductrice et dispositif supraconducteur

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PCT/JP2017/018880 WO2018211701A1 (fr) 2017-05-19 2017-05-19 Fil supraconducteur, procédé de jonction de fil supraconducteur, bobine supraconductrice et dispositif supraconducteur

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JP2007141688A (ja) * 2005-11-18 2007-06-07 Railway Technical Res Inst 低交流損失酸化物超電導導体及びその製造方法
JP2008066399A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 超電導線材の接続構造、超電導コイルおよび超電導線材の接続方法
JP2014130793A (ja) * 2012-11-30 2014-07-10 Fujikura Ltd 酸化物超電導線材の接続構造体とその製造方法
JP2014150223A (ja) * 2013-02-04 2014-08-21 Sumitomo Electric Ind Ltd 超電導コイルおよび超電導コイル装置
JP2016110816A (ja) * 2014-12-05 2016-06-20 株式会社フジクラ 超電導線材の接続構造体および超電導線材の接続構造体の製造方法
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JP2007141688A (ja) * 2005-11-18 2007-06-07 Railway Technical Res Inst 低交流損失酸化物超電導導体及びその製造方法
JP2008066399A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 超電導線材の接続構造、超電導コイルおよび超電導線材の接続方法
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JP2014150223A (ja) * 2013-02-04 2014-08-21 Sumitomo Electric Ind Ltd 超電導コイルおよび超電導コイル装置
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