WO2018210067A1 - 散热器以及通信设备 - Google Patents

散热器以及通信设备 Download PDF

Info

Publication number
WO2018210067A1
WO2018210067A1 PCT/CN2018/081169 CN2018081169W WO2018210067A1 WO 2018210067 A1 WO2018210067 A1 WO 2018210067A1 CN 2018081169 W CN2018081169 W CN 2018081169W WO 2018210067 A1 WO2018210067 A1 WO 2018210067A1
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
heat sink
fluid
orifice plate
heat
Prior art date
Application number
PCT/CN2018/081169
Other languages
English (en)
French (fr)
Inventor
贾晖
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2018210067A1 publication Critical patent/WO2018210067A1/zh
Priority to US16/685,019 priority Critical patent/US11310935B2/en
Priority to US17/708,657 priority patent/US11641725B2/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/035—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other with U-flow or serpentine-flow inside the conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Definitions

  • the present application relates to a heat sink, and more particularly to a heat sink and a communication device.
  • the heat sink can be mainly divided into a microchannel radiator and a jet radiator combining a jet technique and a microchannel.
  • the heat sink described above has a relatively low heat dissipation efficiency due to its own structure. Therefore, how to make the heat dissipation efficiency of the jet heat sink higher is an urgent problem to be solved.
  • Embodiments of the present application provide a heat sink and a communication device for improving heat dissipation efficiency of the heat sink.
  • a heat sink in a first aspect, includes a cover plate, an orifice plate and a bottom plate which are sequentially stacked, a distribution chamber is arranged between the orifice plate and the cover plate, and a heat exchange chamber is arranged between the orifice plate and the bottom plate.
  • a through hole is arranged in the orifice plate, so that the distribution chamber and the heat exchange chamber communicate through the through hole, and a plurality of needle ribs facing the orifice plate are arranged on the surface of the heat exchange chamber and the bottom plate, and between the plurality of needle ribs
  • the gap constitutes a fluid passage
  • the needle rib includes a coupling pin rib and a flow guiding pin rib, wherein the coupling pin rib is in contact with the orifice plate, and the flow guiding pin rib corresponds to the through hole and has a gap with the through hole.
  • the heat sink provided by the embodiment of the present application, there is a gap between the flow guiding pin rib and the through hole of the orifice plate, and the bonding pin rib is respectively in contact with the bottom plate and the orifice plate, so that when the heat sink performs heat dissipation, the temperature
  • the fluid below the temperature of the heat generating device is injected into the gap between the guiding pin rib and the through hole, enters the circulation channel formed by the combined pin rib and the guiding pin rib, and participates in heat exchange, thereby reducing the non-bonding pin rib and
  • the amount of fluid directly flowing out of the heat exchange chamber by the fluid passage formed by the guide pin rib improves the fluid utilization rate. Therefore, the heat sink provided by the embodiment of the present application can improve the heat dissipation efficiency of the heat sink.
  • the guide pin rib may not be disposed on the surface of the heat exchange cavity or the bottom plate, that is, the pin rib includes a combined pin rib that is in contact with the orifice plate.
  • the gap between the guide pin rib and the through hole is greater than or equal to 0.1 mm, that is, the height difference between the combined pin rib and the guide pin rib is greater than or equal to 0.1 mm.
  • sufficient space can be reserved for the fluid to enter the heat exchange chamber, so that the fluid can be smoothly injected into the fluid passage formed by the combined pin rib and the guide pin rib; in addition, the fluid passes through greater than or After a distance equal to 0.1 mm, the velocity of the fluid can be relatively slowed down, thereby reducing the impact on the guiding pin ribs and avoiding the wear of the guiding pin ribs under the impact of long-term high-speed fluid.
  • an elastic pad may be disposed between the coupling pin rib and the orifice plate such that the coupling pin rib contacts the orifice plate through the elastic pad.
  • the elastic pad will be elastically deformed under the pressure of the pin rib and the orifice plate, so that the elastic pad is in close contact with the combined pin rib and the orifice plate, thereby making up for the influence of the processing precision. Insufficient contact with the pin ribs and the orifice plate.
  • each of the bonded pin ribs is square, circular or diamond shaped.
  • the shape of the cross section of each of the flow guiding pin ribs may also be square, circular or diamond shaped.
  • the square, round or diamond shapes are all symmetrical shapes, which facilitate the design and processing of the heat sink, and are beneficial to the industrial production of the heat sink.
  • the ratio of the height of each of the bonded pin ribs to the feature size is greater than or equal to five.
  • the ratio of the gap between the two adjacent pin ribs to the feature size is 1:0.9 to 1:1.1.
  • the ratio of the height of each of the flow guide ribs to the feature size is greater than or equal to five.
  • the ratio of the gap between the adjacent two guide pin ribs to the feature size is 1:0.9 to 1:1.1.
  • the size and distribution density of the combined pin ribs and the guide pin ribs are within the above numerical range, and the number of the combined pin ribs and the flow guiding pin ribs per unit volume can be increased under the premise of ensuring smooth flow of the fluid, thereby improving fluid and The heat dissipation efficiency of the heat sink is further improved by combining the contact areas of the pin ribs and the flow guiding pin ribs.
  • the bottom plate, the coupling pin ribs, and the flow guiding pin ribs may be formed by integral molding using aluminum alloy, brass or copper. Since the heat dissipation coefficient of the material used for the bottom plate, the combined pin rib and the flow guiding pin rib is larger under the same utilization rate of the fluid, the heat dissipation efficiency of the heat sink is higher, and the aluminum alloy, brass or the heat dissipation coefficient is relatively high.
  • the copper is used to make the bottom plate, the needle ribs and the flow guiding pin ribs, which can further improve the heat dissipation efficiency of the heat sink.
  • the diameter of the through hole is in the range of 0.2 mm to 2.0 mm.
  • the fluid can form a high-speed jet beam after flowing through the through hole, increase the amount of fluid injected to the bottom of the fluid passage, and can appropriately reduce the working pressure of the distribution chamber and improve the safety of the radiator.
  • the heat sink can be divided into a single-phase heat sink and a phase-change heat sink according to different heat dissipation modes, wherein the fluid of the single-phase heat sink does not undergo heat exchange.
  • a phase change occurs (always in the liquid state), and the heat-dissipating fluid of the phase-change heat sink undergoes a phase change (vaporization from liquid to gas) during heat exchange.
  • the heat sink can also be divided into a distributed heat sink and a single-type heat sink according to the flow of the fluid.
  • the heat sink is a distributed heat sink, and in the distribution cavity of the heat sink, a surface of the orifice plate is provided with a partition plate facing the cover plate and contacting the cover plate, and the partition plate will
  • the distribution chamber is partitioned into a plurality of inflow chambers and a plurality of outflow chambers, and the inflow chamber and the outflow chamber respectively communicate with the heat exchange chamber through the through holes; the inflow chamber is provided with a fluid inlet, and the outflow chamber is provided with a fluid outlet.
  • the fluid passes through the through hole and is ejected from one of the inflow chambers into the heat exchange chamber, the fluid passes through the through hole and flows out of the heat exchange chamber into the outflow chamber adjacent to the inflow chamber, thereby shortening the fluid flow.
  • the distributed heat sink can reduce the possibility of the heat exchange chamber being dried by the path of the fluid passage formed by the needle rib and the guide pin rib, especially for the phase change heat sink.
  • the number of the outflow chambers is plural, the number of the through holes communicating with the outflow chamber is also plural, so that the fluid after the heat exchange can flow out from the plurality of through holes into the outflow chamber, thereby reducing heat exchange.
  • the internal pressure of the chamber since the number of the outflow chambers is plural, the number of the through holes communicating with the outflow chamber is also plural, so that the fluid after the heat exchange can flow out from the plurality of through holes into the outflow chamber, thereby reducing heat exchange.
  • the internal pressure of the chamber since the number of the outflow chambers is plural
  • the shape of the partition may be zigzag or spiral, and correspondingly, the partition partitions the distribution chamber into a plurality of zigzag inflow chambers and a plurality of zigzag outflow chambers, or The dispensing chamber is partitioned into a plurality of helical inflow chambers and a plurality of helical outflow chambers.
  • the zigzag partition has a simple structure and the pressure distribution of each inflow chamber is balanced, so that the heat sink having the zigzag partition is more practical.
  • the inflow and outflow chambers are alternately distributed. This can further shorten the path through which the fluid flows in the fluid passage formed by the combination of the needle rib and the flow needle rib.
  • the diameter of the through hole in communication with the inflow chamber is smaller than the diameter of the through hole in communication with the outflow chamber.
  • the relatively small diameter through hole communicating with the inflow chamber can increase the fluid velocity when the fluid is injected into the heat exchange chamber, so that the fluid can be sprayed to the bottom of the heat exchange chamber through the gap between the flow needle ribs, and flow out
  • the relatively large diameter through hole of the cavity is favorable for the fluid after the heat exchange to discharge the heat exchange cavity and reduce the internal pressure of the heat exchange cavity.
  • the diameter of each of the through holes that communicate with the outflow chamber increases in a direction from the fluid inlet to the direction away from the fluid inlet. This is because, in the direction from the fluid inlet to the fluid inlet, the amount of fluid in the heat exchange chamber and the heat exchange is gradually increased, and the diameter of each through hole communicating with the outflow chamber tends to increase, which is more favorable for replacement.
  • the heated fluid exits the heat exchange chamber, further reducing the internal pressure of the heat exchange chamber.
  • the height of the flow needle rib corresponding to the inflow chamber is greater than the height of the flow needle rib corresponding to the outflow chamber. This is more advantageous for the fluid after heat exchange to gather at the position of the through hole communicating with the outflow chamber, thereby facilitating the discharge of the fluid after the heat exchange to the heat exchange chamber, and further reducing the internal pressure of the heat exchange chamber.
  • the heat sink is a single-type heat sink, the dispensing chamber is provided with a fluid inlet, and the heat exchange chamber is provided with a fluid outlet.
  • This single-flow heat sink has a simple structure and a fluid flow pattern.
  • the diameter of each of the through holes tends to decrease along the direction from the fluid inlet to the fluid inlet. This is because, in the direction from the fluid inlet to the fluid inlet, the amount of fluid in the heat exchange chamber and the heat exchange is gradually increased, and the diameter of each through hole is decreased, which can prevent the fluid after heat exchange from passing through the hole. Reverse overflow into the distribution chamber.
  • a communication device in a second aspect, includes a heat generating device, and a heat sink of any of the above embodiments; wherein the bottom plate of the heat sink is in contact with the heat generating device.
  • the heat sink of the communication device provided by the embodiment of the present application, there is a gap between the flow guiding pin rib and the through hole of the orifice plate, and the bonding pin rib is respectively in contact with the bottom plate and the orifice plate, so that the heat sink is performed.
  • the fluid whose temperature is lower than the temperature of the heat generating device enters the gap between the guiding pin rib and the through hole, enters the circulation channel formed by the combined pin rib and the guiding pin rib, and participates in heat exchange, thereby reducing the
  • the amount of fluid directly flowing out of the heat exchange chamber in combination with the fluid passage formed by the needle rib and the flow needle rib improves the fluid utilization rate. Therefore, the communication device provided by the embodiment of the present application can improve the heat dissipation efficiency of the communication device.
  • FIG. 1 is a schematic structural view of a heat sink according to an embodiment of the present application.
  • Figure 2 is an exploded view of Figure 1;
  • Figure 3 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 4a is a schematic structural view of an orifice plate of a heat sink according to an embodiment of the present application.
  • FIG. 4b is a schematic structural view of another form of an orifice plate of a heat sink according to an embodiment of the present application, in which a through hole is omitted;
  • Figure 5 is a schematic structural view of a coupling pin rib of the heat sink of Figure 1;
  • FIG. 6 is a schematic structural view of another form of a heat sink according to an embodiment of the present application.
  • Figure 7 is an exploded view of Figure 6;
  • FIG. 8 is a schematic structural view of an orifice plate of the heat sink of FIG. 6.
  • FIG. 8 is a schematic structural view of an orifice plate of the heat sink of FIG. 6.
  • the heat sink includes a cover plate 10 , an orifice plate 20 and a bottom plate 30 which are sequentially stacked, and a distribution between the cover plate 10 and the orifice plate 20 is provided.
  • a heat exchange chamber 50 is disposed between the orifice plate 20 and the bottom plate 30.
  • the orifice plate 20 is provided with a through hole 21 communicating with the distribution chamber 40 and the heat exchange chamber 50.
  • a plurality of needle ribs 61 facing the orifice plate 20 are disposed on the surface of the bottom plate 30, and a plurality of needle ribs are provided.
  • the gap between 61 constitutes a fluid passage.
  • the needle rib 61 includes a coupling pin rib 62 that is in contact with the orifice plate 20, and a flow guiding pin rib 63 that corresponds to the through hole 21 and has a gap with the through hole 21. .
  • the upper surface and the lower surface of the orifice plate 20 are respectively grooved, and then, when the cover 10 and the orifice plate 20 are formed, After being laminated and welded to the bottom plate 30, the cover plate 10 and the bottom plate 30 respectively close the notches of the upper and lower grooves, so that the space in the groove of the upper surface of the orifice plate 20 can serve as the distribution chamber 40 and the lower surface.
  • the space inside the groove serves as the heat exchange chamber 50.
  • the fluid having a temperature lower than the temperature of the heat generating device is injected into the gap between the deflector rib 63 and the through hole 21, and then enters the flow passage formed by the joint pin rib 62 and the guide pin rib 63 to participate in heat exchange.
  • the heat sink provided by the embodiment of the present application can improve the heat dissipation efficiency of the heat sink.
  • the flow guiding pin rib 63 may not be disposed on the surface of the bottom plate 30 in the heat exchange chamber 50, that is, the pin rib 61 includes a coupling pin that is in contact with the orifice plate 20. Rib 62.
  • the number of the through holes 21, the coupling pin ribs 62, and the guide pin ribs 63 are plural. It should be noted that although the number of the through holes 21 and the guide pin ribs 63 are both plural, it does not mean that the two are in one-to-one correspondence, that is, one through hole 21 can correspond to one guide pin.
  • the ribs 63 may correspond to the plurality of flow guiding pin ribs 63, which are not limited herein. It should be further noted that since the diameter of the through hole 21 tends to be larger than the diameter of the flow guide pin rib 63, there is generally no case where one flow guide pin rib 63 corresponds to the plurality of through holes 21.
  • the gap between the flow needle rib 63 and the through hole 21 needs to be greater than or equal to 0.1 mm, for example, the gap between the flow needle rib 63 and the through hole 21 is 0.5.
  • a sufficient space can be reserved for the fluid to enter the heat exchange chamber 50, so that the fluid can be smoothly injected into the fluid passage formed by the joint pin rib 62 and the guide pin rib 63; After passing a distance greater than or equal to 0.1 mm, the velocity of the fluid can be relatively slowed, thereby reducing the impact on the deflector rib 63 and avoiding wear of the deflector rib 63 under the impact of long-term high-speed fluid. .
  • An elastic pad 64 may be disposed between the coupling pin rib 62 and the orifice plate 20, and the coupling pin rib 62 is in contact with the orifice plate 20 through the elastic pad 64.
  • the elastic pad 64 is elastically deformed under the pressure of the coupling pin rib 62 and the orifice plate 20, so that the elastic pad 64 is in close contact with the coupling pin rib 62 and the orifice plate 20, respectively, thereby making up
  • the lack of contact between the pin rib 62 and the orifice plate 20 due to the influence of the processing precision further reduces the amount of fluid directly flowing out of the heat exchange chamber 50 without passing through the fluid passage, improving the fluid utilization rate and the heat sink. Cooling efficiency.
  • the elastic pad 64 may be adhered to the surface of the bonding pin rib 62 or the orifice plate 20 by an adhesive.
  • a fluid elastic material may also be used, which is cured by coating.
  • an elastic pad 64 is formed on the surface of the coupling pin rib 62 or the orifice plate 20.
  • the shape of the cross section of each of the joint pin ribs 62 may be square, circular or diamond; likewise, the cross section of each of the guide pin ribs 63
  • the shape may also be a square, a circle or a diamond, wherein the cross section refers to a section perpendicular to the axial direction of the coupling pin rib 62 or the guide pin rib 63. Since these shapes are all symmetrical shapes, it is convenient to design and process the heat sink, which is beneficial to the industrial production of the heat sink.
  • the combination of the shape of the cross section of the pin rib 62 and the guide pin rib 63 may be various.
  • the cross section of the joint pin rib 62 may be square, and the cross section of the guide pin rib 63 may also be square; or
  • the combination of the pin ribs 62 is rhombic in cross section, and the cross section of the flow guiding pin ribs 63 is square.
  • Such a combination is permissible, but similarly, in consideration of convenience in processing and design and industrial production, the pin ribs 62 are combined.
  • the shape of the cross section of the guide pin rib 63 is the same.
  • the feature size of each of the joint pin ribs 62 is less than or equal to 1 mm, and the ratio of the height of each of the joint pin ribs 62 to the feature size is greater than or equal to 5,
  • the ratio of the gap between the two adjacent pin ribs 62 and the feature size is 1:0.9 to 1:1.1; similarly, the feature size of each of the guide pin ribs 63 is less than or equal to 1 mm, and each of the guide pin ribs 63
  • the ratio of the height to the feature size is greater than or equal to 5, and the ratio of the gap between the adjacent two flow guiding pin ribs 63 to the feature size is 1:0.9 to 1:1.1.
  • the size and distribution density of the combined pin rib 62 and the guide pin rib 63 are within the above numerical range, and the number of the combined pin rib 62 and the guide pin rib 63 per unit volume can be increased while ensuring smooth flow of the fluid. Thereby, the contact area between the fluid and the coupling pin rib 62 and the flow guiding pin rib 63 is increased, and the heat dissipation efficiency of the heat sink is further improved.
  • the above feature size refers to the ratio of the cross-sectional area of the four-fold needle rib to the cross-sectional circumference of the needle rib, for example, when the needle rib (bonding the needle rib 62 and/or the guide needle rib 63)
  • the shape of the cross section of the pin rib is a rectangle
  • the feature size is 4AB/2 (A+B), where A is the width of the rectangle and B is the length of the rectangle.
  • the heat transfer coefficient of the material used for preparing the heat sink is also one of the important factors affecting the heat dissipation efficiency of the heat sink. Therefore, the preparation materials of the bottom plate 30, the combined pin rib 62 and the flow guiding pin rib 63 can be selected. Any one of aluminum alloy, brass or copper having a relatively high heat transfer coefficient, wherein copper has the highest heat transfer coefficient and brass is second.
  • the preparation materials of the combined pin ribs 62 and the flow guiding pin ribs 63 may be the same or different. However, for the convenience of processing, the bottom plate 30, the coupling pin ribs 62 and the flow guiding pin ribs 63 may be selected from the same material by an integral molding process.
  • the diameter of the through hole 21 it may be 0.2 mm to 2.0 mm because if the diameter of the through hole 21 is too large (more than 2.0 mm), the ejection speed of the fluid after passing through the through hole 21 is lowered, so that it cannot be formed.
  • the jet beam is sprayed so that the fluid cannot reach the bottom surface of the heat exchange chamber 50 for exchange, thereby reducing heat exchange efficiency; and if the diameter is too small (less than 0.2 mm), the fluid needs a large pressure to pass through the through hole 21, so that the distribution chamber The working pressure of 40 increased.
  • the diameter of the through hole 21 in the range of 0.2 mm to 2.0 mm, it is possible to form a high-speed jet beam after flowing through the through hole 21, and to increase the amount of fluid injected to the bottom of the fluid passage, and it is also possible to appropriately The working pressure of the distribution chamber 40 is lowered to improve the safety of the radiator.
  • the heat sink provided by the embodiment of the present application can be divided into a single-phase heat sink and a phase change heat sink according to different heat dissipation modes.
  • the structure of the heat sink does not need to be changed.
  • the difference between the two is whether the state of the fluid changes during the heat dissipation process. Specifically, in the heat dissipation process of the single-phase heat sink, the fluid in the liquid state does not undergo a phase change during the heat exchange with the coupling pin rib 62, the flow needle rib 63, and the bottom plate 30, that is, the liquid state is always maintained. .
  • the fluid in the liquid state undergoes a phase change during heat exchange with the coupling pin rib 62, the flow needle rib 63 and the bottom plate 30, and vaporizes from the liquid into a gas. Since the liquid absorbs a large amount of heat during the gasification process, the phase change type heat sink has higher heat dissipation efficiency than the single-phase heat sink, and is more suitable for heat dissipation of a high-power heat generating device.
  • the heat sink provided by the embodiment of the present application can be divided into a distributed heat sink and a single-type heat sink according to different fluid flow modes, and the structures of the two heat sinks are different.
  • the flow of the fluid flows from the distribution chamber 40 and flows out of the distribution chamber 40.
  • the surface of the orifice plate 20 is provided with an orientation cover. a plate 10 and a partition 22 in contact with the cover plate 10, the partition 22 partitioning the distribution chamber 40 into a plurality of inflow chambers 41 and an outflow chamber 42, and the inflow chamber 41 and the outflow chamber 42 respectively pass through the through holes 21 and the heat exchange chamber 50 is connected; the inflow chamber 41 is provided with a fluid inlet 43 and the outflow chamber 42 is provided with a fluid outlet 44.
  • the process of dissipating heat from the heat generating device by using the distributed heat sink is as follows: the fluid enters the inflow chamber 41 of the distribution chamber 40 from the fluid inlet 43 and flows through the through hole 21 communicating with the inflow chamber 41 under the pressure of the internal pressure of the distribution chamber 40. Thereafter, the jet enters the fluid passage formed by the joint pin rib 62 and the guide pin rib 63, exchanges heat with the joint pin rib 62, the guide pin rib 63 and the bottom plate 30, and the heat exchanged fluid is pressurized inside the heat exchange chamber 50. After flowing out of the heat exchange chamber 50 through the through hole 21 communicating with the outflow chamber 42, it enters the outflow chamber 42 and flows out from the fluid outlet 44.
  • the distributed heat sink when the fluid passes through the through hole 21 and is ejected from one of the inflow chambers 41 into the heat exchange chamber 50, the portion of the fluid will flow out through the through hole 21, from the heat exchange chamber 50 to the inflow.
  • the chamber 41 is adjacent to the outflow chamber 42 to shorten the path of fluid flow in the fluid passage formed by the joint pin rib 62 and the guide pin rib 63, particularly for a phase change heat sink, distributed
  • the heat sink can reduce the possibility of the heat exchange chamber 50 being dried.
  • the number of the outflow chambers 42 is plural, the number of the through holes 21 communicating with the outflow chamber 42 is also plural, so that the heat exchanged fluid can flow out from the plurality of through holes 21 into the outflow chamber 42, thereby The internal pressure of the heat exchange chamber 50 can be reduced.
  • the shape of the partition 22 may be zigzag, as shown in FIG. 4a, the zigzag partition 22 partitions the distribution chamber 40 into a plurality of mutually communicating zigzag inflow chambers 41 and a plurality of interconnected The zigzag-shaped outflow chamber 42; or the shape of the partition 22 may be spiral, as shown in Fig. 4b, thereby partitioning the distribution chamber 40 into a plurality of mutually communicating spiral inflow chambers 41 and a plurality of interconnected Spiral outflow chamber 42.
  • the zigzag-shaped partition plate 22 has a simple structure and the pressure distribution of each of the inflow chambers 41 is balanced, so that the heat sink having the zigzag-shaped partition plate 22 is more practical than the spiral-shaped partition plate 22.
  • the inflow chamber 41 and the outflow chamber 42 may be arranged alternately, thereby further shortening the fluid.
  • the path through which the fluid passage formed by the pin rib 62 and the guide pin rib 63 is combined has been experimentally proven to substantially eliminate the possibility of drying out.
  • the diameter of the through hole 21 communicating with the inflow chamber 41 is smaller than the diameter of the through hole 21 communicating with the outflow chamber 42, for example, the diameter of the through hole 21 communicating with the inflow chamber 41 may be 0.2 mm.
  • the through hole 21 communicating with the outflow chamber 42 may have a diameter of 0.5 mm to 2.0 mm.
  • the relatively small diameter through hole 21 communicating with the inflow chamber 41 can increase the fluid velocity when the fluid is injected into the heat exchange chamber 50, so that the fluid can be ejected to the heat exchange chamber 50 through the gap between the guide pin ribs 63.
  • the bottom portion, and the relatively large diameter through hole 21 communicating with the outflow chamber 42 facilitates the discharge of the fluid after the heat exchange to the heat exchange chamber 50, reducing the internal pressure of the heat exchange chamber 50.
  • the number of fluid inlets 43 is at least one, which may be provided on the side of the inflow chamber 41.
  • the inflow chamber 41 includes a plurality of sides, when the number of the fluid inlets 43 is one, it is located on the same side of the inflow chamber 41; and when the number of the fluid inlets 43 is plural, the plurality of fluids
  • the inlets 43 may be located on the same side of the inflow chamber 41, but may of course be located on different sides of the inflow chamber 41.
  • the number of fluid outlets 44 is at least one, which may be provided on the side of the outflow chamber 42.
  • the outflow chamber 42 includes a plurality of sides, when the number of fluid outlets 44 is one, it is located on the same side of the outflow chamber 42; and when the number of fluid outlets 44 is plural, multiple fluids
  • the outlets 44 may be located on the same side of the outflow chamber 42, although of course on different sides of the outflow chamber 42.
  • the height of the flow needle rib 63 corresponding to the inflow chamber 41 may be greater than the height of the flow needle rib 63 corresponding to the outflow chamber 42. This is more advantageous for the fluid after heat exchange to gather at the position of the through hole 21 communicating with the outflow chamber 42, thereby facilitating the discharge of the fluid after the heat exchange to the heat exchange chamber 50, further reducing the internal pressure of the heat exchange chamber 50.
  • the fluid flows by flowing from the distribution chamber 40 and flowing out of the heat exchange chamber 50.
  • the distribution chamber 40 is provided with a fluid inlet 43
  • the heat exchange chamber 50 is provided with a fluid. Exit 44.
  • the process of dissipating heat from the heat generating device by using a single-type heat sink is as follows: the fluid enters the distribution chamber 40 from the fluid inlet 43 and flows through the through hole 21 under the pressure of the internal pressure of the distribution chamber 40, and then is injected into the heat exchange chamber 50. In the fluid passage, heat exchange is performed with the coupling pin rib 62, the flow needle rib 63 and the bottom plate 30, and the heat exchanged fluid flows out from the fluid outlet 44 in the heat exchange chamber 50 under the pressure of the internal pressure of the heat exchange chamber 50. Cavity 50.
  • This single-flow heat sink has a simple structure and a fluid flow pattern.
  • the number of fluid inlets 43 is at least one, which may be provided on the side of the distribution chamber 40.
  • the dispensing chamber 40 includes a plurality of sides, when the number of fluid inlets 43 is one, it is located on the same side of the dispensing chamber 40; and when the number of fluid inlets 43 is plural, multiple fluids
  • the inlets 43 can be located on the same side of the dispensing chamber 40, although of course on different sides of the dispensing chamber 40.
  • the number of fluid outlets 44 is at least one, which may be provided on the side of the heat exchange chamber 50.
  • the heat exchange chamber 50 includes a plurality of sides, when the number of the fluid outlets 44 is one, it is located on the same side of the heat exchange chamber 50; and when the number of the fluid outlets 44 is plural, The fluid outlets 44 may be located on the same side of the heat exchange chamber 50, and may of course be located on different sides of the heat exchange chamber 50.
  • each through hole The diameter of 21 is decreasing. This is because, in the direction from the fluid inlet 43 to the distance from the fluid inlet 43, the amount of fluid after heat exchange in the heat exchange chamber 50 is gradually increased, and the diameter of each through hole 21 is decreased, thereby preventing heat exchange.
  • the fluid overflows from the through hole 21 to the distribution chamber 40 in the reverse direction.
  • the law of diameter reduction can be gradually changed from 0.8mm to 0.5mm and then to 0.3mm. It can also be changed from 1.0mm to 0.8mm and then to 0.5mm. In the design process of the radiator, it can be changed according to the exchange.
  • the requirements for the internal pressure of the thermal chamber 50 are designed and are not limited herein.
  • a plurality of reinforcing ribs 23 are provided on the bottom surface of the distribution chamber 40.
  • the heat dissipation method adopts phase change heat dissipation, and the structure is a distributed heat sink.
  • the bottom plate 30, the combined pin rib 62 and the flow guiding pin rib 63 are all made of aluminum alloy material, the fluid adopts electronic fluorinating liquid, and the fluid flow rate is 0.5 L/min.
  • the chip power is 300W, and the contact area between the bottom plate 30 and the chip is 60mm ⁇ 60mm. Under the above conditions, the distributed heat sink was tested for thermal resistance value with a thermal resistance of 0.04 ° C / W.
  • the heat dissipation method adopts phase change heat dissipation, and the structure is a single-type heat sink.
  • the bottom plate 30, the combined pin rib 62 and the guide pin rib 63 are all made of brass material, and the fluid adopts an electronic fluorinating liquid, and the fluid flow rate is 0.5 L/ Min, the chip power is 300W, and the contact area between the bottom plate 30 and the chip is 60 mm ⁇ 60 mm.
  • the heat resistance value of the single-type heat sink was tested, and the thermal resistance value was 0.037 ° C / W.
  • the thermal resistance of the heat sink provided by the embodiment of the present application is less than 0.04 ° C / W, and the heat dissipation performance is compared with the prior art jet heat sink (the thermal resistance is 0.06 ° C / W). Significantly improved.
  • an embodiment of the present application provides a communication device including a heat generating device and the heat sink; wherein a bottom plate of the heat sink is in contact with a heat generating device for dissipating heat from the heat generating device.
  • the heat sink of the communication device provided by the embodiment of the present application, there is a gap between the flow guiding pin rib and the through hole of the orifice plate, and the bonding pin rib is respectively in contact with the bottom plate and the orifice plate, so that the heat sink is performed.
  • the fluid whose temperature is lower than the temperature of the heat generating device enters the gap between the guiding pin rib and the through hole, enters the circulation channel formed by the combined pin rib and the guiding pin rib, and participates in heat exchange, thereby reducing the
  • the amount of fluid directly flowing out of the heat exchange chamber in combination with the fluid passage formed by the needle rib and the flow needle rib improves the fluid utilization rate. Therefore, the communication device provided by the embodiment of the present application can improve the heat dissipation efficiency of the communication device.

Abstract

本申请的实施例涉及一种散热装置，尤其涉及一种散热器以及通信设备，能够提高散热器的散热效率。该散热器包括依次层叠布置的盖板、孔板和底板，孔板与盖板之间设有分配腔，孔板与底板之间设有换热腔，分配腔和换热腔通过孔板上设置的通孔连通，在换热腔内、底板的表面上设有多根朝向孔板的针肋，多根针肋之间的间隙构成流体通道，针肋包括与孔板相接触的结合针肋、以及与通孔对应且与通孔存在间隙的导流针肋。该通信设备包括发热装置以及上述散热器，散热器的底板与发热装置接触。本申请可用于对通信设备中的发热装置进行散热。

Description

散热器以及通信设备
本申请要求于2017年05月17日提交中国专利局、申请号为201710349131.4、申请名称为“散热器以及通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及一种散热装置，尤其涉及一种散热器以及通信设备。
背景技术
随着通信设备中发热装置(例如，芯片)功率的持续提升，其在运行过程中所产生的热量也越来越多，因此，对用于发热装置散热的散热器的要求也越来越高。目前，散热器主要可以分为微通道式散热器、以及将射流技术和微通道相结合的射流散热器。
但是，上述散热器由于其自身结构的原因，散热效率相对较低。因此，如何让射流散热器的散热效率更高，是目前亟待解决的问题。
发明内容
本申请的实施例提供一种散热器及通信设备，用于提高散热器的散热效率。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，公开了一种散热器，该散热器包括依次层叠布置的盖板、孔板和底板，孔板与盖板之间设有分配腔，孔板与底板之间设有换热腔，孔板上设有通孔，使得分配腔和换热腔通过该通孔连通，在换热腔内、底板的表面上设有多根朝向孔板的针肋，多根针肋之间的间隙构成了流体通道，该针肋包括结合针肋和导流针肋，其中，结合针肋与孔板相接触，导流针肋与通孔对应、且与通孔之间具有间隙。
由于本申请的实施例提供的散热器中，在导流针肋和孔板的通孔之间存在间隙，而结合针肋分别与底板和孔板相接触，使得在散热器进行散热时，温度低于发热装置温度的流体喷射进入导流针肋与通孔之间的间隙后，进入结合针肋和导流针肋构成的流通通道中，参与热交换，从而减少了不经过结合针肋和导流针肋构成的流体通道而直接流出换热腔的流体的量，提高了流体的利用率。因此，本申请的实施例提供的散热器能够提高散热器的散热效率。
需要说明的是，为了避免通孔被堵住，在换热腔内、底板的表面上也可以不设置导流针肋，即针肋包括与孔板相接触的结合针肋。
在一种可能的设计中，导流针肋与通孔之间的间隙大于或等于0.1mm，即结合针肋与导流针肋的高度差大于或等于0.1mm。这样，在与通孔对应的位置，可以为流体进入换热腔预留足够的空间，使得流体能够顺畅地喷射进入结合针肋和导流针肋构成的流体通道；另外，流体在经过大于或等于0.1mm的距离后，流体的速度可以相对减慢，从而减少了对导流针肋的冲击，避免导流针肋在长期的高速流体的冲击下造成的磨损。
在一种可能的设计中，可以在结合针肋与孔板之间设置弹性垫，使得结合针肋通 过弹性垫与孔板相接触。当散热器制作完成后，弹性垫会在结合针肋和孔板的压力下，发生弹性形变，使得弹性垫分别与结合针肋和孔板紧密接触，从而弥补了由于加工精度的影响而产生的结合针肋和孔板未能接触的不足。
在一种可能的设计中，每根结合针肋的横截面的形状为方形、圆形或菱形。
在一种可能的设计中，每根导流针肋的横截面的形状也可以为方形、圆形或菱形。
方形、圆形或菱形这几种形状都是对称形状，便于散热器的设计和加工，有利于实现散热器的工业化生产。
在一种可能的设计中，每根结合针肋的特征尺寸小于或等于1mm，特征尺寸＝4×结合针肋的横截面面积/结合针肋的横截面周长。
在一种可能的设计中，每根结合针肋的高度与特征尺寸的比值大于或等于5。
在一种可能的设计中，相邻两根结合针肋之间的间隙与特征尺寸的比值为1:0.9～1:1.1。
在一种可能的设计中，每根导流针肋的特征尺寸小于或等于1mm，特征尺寸＝4×导流针肋的横截面面积/导流针肋的横截面周长。
在一种可能的设计中，每根导流针肋的高度与特征尺寸的比值大于或等于5。
在一种可能的设计中，相邻两根导流针肋之间的间隙与特征尺寸的比值为1:0.9～1:1.1。
结合针肋和导流针肋的尺寸和分布密度在上述数值范围内，可以在保证流体能够顺畅流动的前提下，提高单位体积内结合针肋和导流针肋的根数，从而提高流体与结合针肋和导流针肋的接触面积，进一步提高散热器的散热效率。
需要说明的是，所谓特征尺寸是指四倍的针肋的横截面面积与针肋的横截面周长的比值，举例来说，当针肋(结合针肋和/或导流针肋)的横截面的形状为圆形，其特征尺寸＝4πR 2/2πR＝2R，也就是说，圆形的特征尺寸为其直径D，其中，R为圆形的半径，D为圆形的直径；当针肋(结合针肋和/或导流针肋)的横截面的形状为长方形，其特征尺寸＝4AB/2(A+B)其中，A为长方形的宽，B为长方形的长。
在一种可能的设计中，底板、结合针肋以及导流针肋可以采用铝合金、黄铜或紫铜、通过一体成型制成。由于在流体的利用率相同的情况下，底板、结合针肋以及导流针肋所用材料的散热系数越大，散热器的散热效率就越高，散热系数相对较高的铝合金、黄铜或紫铜来制作底板、结合针肋以及导流针肋，能够进一步提高散热器的散热效率。
在一种可能的设计中，通孔的直径在0.2mm～2.0mm的范围内。这样既可以使流体在流经通孔后能够形成高速喷射束，增加喷射至流体通道的底部的流体量，也能够适当降低分配腔的工作压力，提高散热器的安全性。
在一种可能的设计中，散热器可以根据散热方式的不同，分为单相式的散热器和相变式的散热器，其中，单相式的散热器的流体在进行热交换过程中不会发生相变(始终保持液态)，而相变式的散热器的散热流体在进行热交换过程中会发生相变(由液态气化为气态)。
散热器也可以根据流体的流动方式，分为分布式的散热器和单通式的散热器。
在一种可能的设计中，散热器为分布式的散热器，在该散热器的分配腔内、孔板 的表面上设有朝向盖板且与盖板相接触的隔板，该隔板将分配腔隔成多个流入腔和多个流出腔，流入腔和流出腔分别通过通孔与换热腔连通；流入腔设有流体进口，流出腔设有流体出口。当流体通过通孔、从其中一个流入腔喷射进入换热腔换热后，这部分流体会通过通孔、从换热腔流出到与该流入腔相邻的流出腔内，从而缩短了流体在结合针肋和导流针肋构成的流体通道中所流经的路径，特别是应用于相变式的散热器，分布式的散热器能够减少换热腔烧干的可能性。此外，由于流出腔的数量为多个，那么与流出腔连通的通孔的数量也为多个，使得换热后的流体能够从多个通孔流出到流出腔内，从而可以减小换热腔的内部压力。
在一种可能的设计中，隔板的形状可以为锯齿形或螺旋形，相应地，该隔板会将分配腔隔成多个锯齿形的流入腔和多个锯齿形的流出腔，或者，将分配腔隔成多个螺旋形的流入腔和多个螺旋形的流出腔。相较于螺旋状的隔板，锯齿形的隔板结构简单，且各流入腔的压力分配均衡，使得具有锯齿形的隔板的散热器更具实用性。
在一种可能的设计中，流入腔与流出腔交替分布。这样能够进一步缩短流体在结合针肋和导流针肋构成的流体通道中所流经的路径。
在一种可能的设计中，与流入腔连通的通孔的直径小于与流出腔连通的通孔的直径。其中，与流入腔连通的直径相对较小的通孔可以提高流体喷射进入换热腔时的流体速度，使得流体能够通过导流针肋之间的间隙喷射到换热腔的底部，而与流出腔连通的直径相对较大的通孔有利于换热后的流体排出换热腔，减小换热腔的内部压力。
在一种可能的设计中，沿靠近流体进口至远离流体进口的方向，与流出腔连通的各通孔的直径呈增大的趋势。这是因为，沿靠近流体进口至远离流体进口的方向，换热腔内、换热后的流体的量逐渐增多，与流出腔连通的各通孔的直径呈增大的趋势，更有利于换热后的流体排出换热腔，进一步减小换热腔的内部压力。
在一种可能的设计中，与流入腔对应的导流针肋的高度大于与流出腔对应的导流针肋的高度。这样更有利于换热后的流体聚集在与流出腔连通的通孔的位置，从而更加利于换热后的流体排出换热腔，进一步减小换热腔的内部压力。
在一种可能的设计中，该散热器为单通式的散热器，其分配腔设有流体进口，换热腔设有流体出口。这种单通式的散热器的结构简单，流体的流动规律。
在一种可能的设计中，沿靠近流体进口至远离流体进口的方向，各通孔的直径呈减小的趋势。这是因为，沿靠近流体进口至远离流体进口的方向，换热腔内、换热后的流体量逐渐增多，各通孔的直径呈减小的趋势，可以防止换热后的流体从通孔反向溢出到分配腔。
第二方面，公开了一种通信设备，其包括发热装置、以及上述任一实施例中的散热器；其中散热器的底板与发热装置接触。
由于本申请的实施例提供的通信设备中的散热器中，在导流针肋和孔板的通孔之间存在间隙，而结合针肋分别与底板和孔板相接触，使得在散热器进行散热时，温度低于发热装置温度的流体喷射进入导流针肋与通孔之间的间隙后，进入结合针肋和导流针肋构成的流通通道中，参与热交换，从而减少了不经过结合针肋和导流针肋构成的流体通道而直接流出换热腔的流体的量，提高了流体的利用率。因此，本申请的实施例提供的通信设备能够提高通信设备的散热效率。
附图说明
图1为本申请的实施例中散热器的结构示意图；
图2为图1的爆炸图；
图3为图1的A-A向的剖视图；
图4a为本申请的实施例中散热器的孔板的结构示意图；
图4b为本申请的实施例中散热器的孔板的另一种形式的结构示意图，此图中省略了通孔；
图5为图1的散热器的结合针肋的结构示意图；
图6为本申请的实施例中散热器的另一种形式的结构示意图；
图7为图6的爆炸图；
图8为图6的散热器的孔板的结构示意图。
具体实施方式
下面将结合本申请的实施例中的附图，对本申请的实施例中的技术方案进行清楚、完整地描述。
本申请的实施例提供了一种散热器，参见图1至图8，该散热器包括依次层叠布置的盖板10、孔板20和底板30，盖板10与孔板20之间设有分配腔40，孔板20与底板30之间设有换热腔50。其中，孔板20设有连通分配腔40和换热腔50的通孔21；在换热腔50内，底板30的表面上设有多根朝向孔板20的针肋61，多根针肋61之间的间隙构成了流体通道，如图3所示，针肋61包括与孔板20接触的结合针肋62、以及与通孔21对应且与通孔21存在间隙的导流针肋63。
对于分配腔40和换热腔50的形成方式，示例性地，如图1至图3所示，孔板20的上表面和下表面分别开设凹槽，那么，当盖板10、孔板20和底板30层叠焊接在一起后，盖板10和底板30分别将上、下两个凹槽的槽口封闭，使得孔板20的上表面的凹槽内的空间可以作为分配腔40，下表面的凹槽内的空间作为换热腔50。
由于本申请的实施例提供的散热器中，在导流针肋63和孔板20的通孔21之间存在间隙，而结合针肋62分别与底板30和孔板20相接触，使得在散热器进行散热时，温度低于发热装置温度的流体喷射进入导流针肋63与通孔21之间的间隙后，进入结合针肋62和导流针肋63构成的流通通道中，参与热交换，从而减少了不经过结合针肋62和导流针肋63构成的流体通道而直接流出换热腔50的流体的量，提高了流体的利用率。因此，相比于现有技术，本申请的实施例提供的散热器能够提高散热器的散热效率。
需要说明的是，为了避免通孔21被堵住，在换热腔50内、底板30的表面上也可以不设置导流针肋63，即针肋61包括与孔板20相接触的结合针肋62。
上述散热器中，通孔21、结合针肋62和导流针肋63的数量均为多个。在此需要说明的是，虽然通孔21和导流针肋63的数量均为多个，但并不能说明两者是一一对应的，也就是说，一个通孔21可以对应一个导流针肋63，也可以对应多个导流针肋63，在此不做限定。需要进一步说明的是，由于通孔21的直径往往大于导流针肋63的直径，因此，通常不存在一个导流针肋63对应多个通孔21的情况。
为了使流体能够顺畅地喷射进入换热腔50，导流针肋63与通孔21之间的间隙需 要大于或等于0.1mm，例如，导流针肋63与通孔21之间的间隙为0.5mm～2.0mm，也就是说，结合针肋62与导流针肋63的高度差需要大于或等于0.1mm。这样，在与通孔21对应的位置，可以为流体进入换热腔50预留足够的空间，使得流体能够顺畅地喷射进入结合针肋62和导流针肋63构成的流体通道；另外，流体在经过了大于或等于0.1mm的距离后，流体的速度可以相对减慢，从而减少了对导流针肋63的冲击，避免导流针肋63在长期的高速的流体的冲击下造成的磨损。
由于实际加工精度的影响，在散热器的制作过程中，有可能出现结合针肋62未能与孔板20接触的情况，导致两者之间出现空隙，为了避免这一问题，参见图5，可以在结合针肋62与孔板20之间设置弹性垫64，结合针肋62通过弹性垫64与孔板20相接触。当散热器按照设计尺寸加工完成后，弹性垫64会在结合针肋62和孔板20的压力下，发生弹性形变，使得弹性垫64分别与结合针肋62和孔板20紧密接触，从而弥补了由于加工精度的影响而产生的结合针肋62和孔板20未能接触的不足，进一步减少了流体不经过流体通道而直接流出换热腔50的量，提高了流体的利用率以及散热器的散热效率。
对于弹性垫64的形成方式，示例性地，弹性垫64可以采用粘合剂粘贴在结合针肋62或者孔板20的表面上，当然，也可以采用流体状的弹性材料、通过涂布固化的方式、在结合针肋62或者孔板20的表面上形成弹性垫64。
在了解上述散热器的结构的基础上，下面将对散热器中的结合针肋62、导流针肋63以及通孔21的可选参数进行详细描述。
其中，对于结合针肋62和导流针肋63的形状，每根结合针肋62的横截面的形状可以为方形、圆形或菱形；同样地，每根导流针肋63的横截面的形状也可以为方形、圆形或菱形，其中，所谓横截面是指垂直于结合针肋62或导流针肋63的轴线方向的截面。由于这几种形状都是对称形状，便于散热器的设计和加工，有利于实现散热器的工业化生产。
结合针肋62和导流针肋63的横截面的形状的组合方式可以为多种，例如，结合针肋62的横截面可以为方形，导流针肋63的横截面也为方形；或者，结合针肋62的横截面为菱形，导流针肋63的横截面为方形，这样的组合都是允许的，但是，同样地，考虑到加工和设计的方便性以及工业化生产，结合针肋62和导流针肋63的横截面的形状相同。
对于结合针肋62和导流针肋63的尺寸和分布密度，每根结合针肋62的特征尺寸小于或等于1mm，每根结合针肋62的高度与特征尺寸的比值大于或等于5，相邻两根结合针肋62之间的间隙与特征尺寸的比值为1:0.9～1:1.1；同样地，每根导流针肋63的特征尺寸小于或等于1mm，每根导流针肋63的高度与特征尺寸的比值大于或等于5，相邻两根导流针肋63之间的间隙与特征尺寸的比值为1:0.9～1:1.1。结合针肋62和导流针肋63的尺寸和分布密度在上述数值范围内，可以在保证流体能够顺畅流动的前提下，提高单位体积内结合针肋62和导流针肋63的根数，从而提高流体与结合针肋62和导流针肋63的接触面积，进一步提高散热器的散热效率。
需要说明的是，上述特征尺寸是指四倍的针肋的横截面面积与针肋的横截面周长的比值，举例来说，当针肋(结合针肋62和/或导流针肋63)的横截面的形状为圆形， 其特征尺寸＝4πR 2/2πR＝2R，也就是说，圆形的特征尺寸为其直径D，其中，R为圆形的半径，D为圆形的直径；当针肋的横截面的形状为长方形，其特征尺寸＝4AB/2(A+B)其中，A为长方形的宽，B为长方形的长。
考虑到除了流体的利用率，制备散热器所用材料的换热系数也是影响散热器的散热效率的重要因素之一，因此，底板30、结合针肋62以及导流针肋63的制备材料可以选用换热系数相对较高的铝合金、黄铜或紫铜中的任意一种，其中，紫铜的换热系数最高，黄铜其次。结合针肋62以及导流针肋63的制备材料可以相同也可以不同，但是，为了便于加工，底板30、结合针肋62以及导流针肋63可以选择同一种材料采用一体成型工艺制成。
而对于通孔21的直径，其可以为0.2mm～2.0mm，这是因为，如果通孔21的直径过大(超过2.0mm)，会降低流体通过通孔21后的喷射速度，从而无法形成喷射束，以致流体无法到达换热腔50的底面进行交换，从而降低了换热效率；而直径过小(小于0.2mm)，会导致流体需要很大压力才能够通过通孔21，使得分配腔40的工作压力增加。因此，将通孔21的直径设置在0.2mm～2.0mm的范围内，既可以使流体在流经通孔21后能够形成高速喷射束，增加喷射至流体通道的底部的流体量，也能够适当降低分配腔40的工作压力，提高散热器的安全性。
根据散热方式的不同，本申请的实施例提供的散热器可以分为单相式的散热器和相变式的散热器。对于这两种散热方式，散热器的结构是不需要改变的，两者的区别在于，在散热过程中，流体的状态是否发生变化。具体来说，单相式的散热器在散热过程中，处于液态的流体在与结合针肋62、导流针肋63和底板30进行热交换过程中，不会发生相变，即始终保持液态。而相变式的散热器在散热过程中，处于液态的流体在与结合针肋62、导流针肋63和底板30进行热交换过程中，会发生相变，从液体气化为气体。由于液体在气化的过程中会吸收大量的热量，因此，相比于单相式的散热器，相变式的散热器的散热效率更高，更加适用于大功率发热装置的散热。
而根据流体流动方式的不同，可以将本申请的实施例提供的散热器分为分布式的散热器和单通式的散热器，这两种散热器的结构是不同的。
其中，分布式的散热器中，流体的流动方式是从分配腔40流进，从分配腔40流出，参见图1至图5，在分配腔40内、孔板20的表面上设有朝向盖板10且与盖板10相接触的隔板22，该隔板22将分配腔40隔成多个流入腔41和流出腔42，流入腔41和流出腔42分别通过通孔21与换热腔50连通；流入腔41设有流体进口43，流出腔42设有流体出口44。
采用分布式的散热器对发热装置进行散热的过程如下：流体从流体进口43进入分配腔40的流入腔41中，并在分配腔40内部压力的作用下流经与流入腔41连通的通孔21后，喷射进入结合针肋62和导流针肋63构成的流体通道中，与结合针肋62、导流针肋63和底板30进行热交换，换热后的流体在换热腔50内部压力的作用下从与流出腔42连通的通孔21流出换热腔50后，进入到流出腔42，并从流体出口44流出。
这种分布式的散热器，当流体通过通孔21、从其中一个流入腔41喷射进入换热腔50换热后，这部分流体会通过通孔21、从换热腔50流出到与该流入腔41相邻的流出腔42内，从而缩短了流体在结合针肋62和导流针肋63构成的流体通道中所流经 的路径，特别是应用于相变式的散热器，分布式的散热器能够减少换热腔50烧干的可能性。此外，由于流出腔42的数量为多个，那么与流出腔42连通的通孔21的数量也为多个，使得换热后的流体能够从多个通孔21流出到流出腔42内，从而可以减小换热腔50的内部压力。
示例性地，该隔板22的形状可以为锯齿形，如图4a所示，锯齿形的隔板22会将分配腔40隔成多个相互连通的锯齿形的流入腔41和多个相互连通的锯齿形的流出腔42；或者，隔板22的形状也可以为螺旋形，如图4b所示，从而将分配腔40隔成多个相互连通的螺旋形的流入腔41和多个相互连通的螺旋形的流出腔42。其中，相较于螺旋形的隔板22，锯齿形的隔板22结构简单，且各流入腔41的压力分配均衡，使得具有锯齿形的隔板22的散热器更具实用性。
为了进一步缩短流体在结合针肋62和导流针肋63构成的流体通道中所流经的路径，参见图4a，可以将流入腔41与流出腔42设置为交替分布，从而能够进一步缩短了流体在结合针肋62和导流针肋63构成的流体通道中所流经的路径，通过试验证明，这种设置基本上可以避免烧干的可能性。
其中，如图4a所示，与流入腔41连通的通孔21的直径小于与流出腔42连通的通孔21的直径，例如，与流入腔41连通的通孔21的直径可以为0.2mm～0.5mm，与流出腔42连通的通孔21的直径可以为1.5mm～2.0mm。其中，与流入腔41连通的直径相对较小的通孔21可以提高流体喷射进入换热腔50时的流体速度，使得流体能够通过导流针肋63之间的间隙喷射到换热腔50的底部，而与流出腔42连通的直径相对较大的通孔21有利于换热后的流体排出换热腔50，减小换热腔50的内部压力。
在上述分布式的散热器中，流体进口43的数量为至少一个，其可以设在流入腔41的侧面。示例性地，在流入腔41包括多个侧面的情况下，当流体进口43的数量为一个时，其位于流入腔41的同一侧面；而当流体进口43的数量为多个时，多个流体进口43可以位于流入腔41的同一侧面，当然也可以位于流入腔41的不同侧面。
同样地，流体出口44的数量为至少一个，其可以设在流出腔42的侧面。示例性地，在流出腔42包括多个侧面的情况下，当流体出口44的数量为一个时，其位于流出腔42的同一侧面；而当流体出口44的数量为多个时，多个流体出口44可以位于流出腔42的同一侧面，当然也可以位于流出腔42的不同侧面。
当流体进口43位于流入腔41的同一侧面时，为了使换热后的流体能够更容易地排出换热腔50，参见图2和图4a，沿靠近流体进口43至远离流体进口43的方向，与流出腔42连通的各通孔21的直径呈增大的趋势。这是因为，沿靠近流体进口43至远离流体进口43的方向，换热腔50内、换热后的流体量逐渐增多，与流出腔42连通的各通孔21的直径呈增大的趋势，更有利于换热后的流体排出换热腔50，从而可以进一步减小换热腔50的内部压力。
同样是为了进一步利于换热后的流体排出，参见图3，与流入腔41对应的导流针肋63的高度可以大于与流出腔42对应的导流针肋63的高度。这样更有利于换热后的流体聚集在与流出腔42连通的通孔21的位置，从而更加利于换热后的流体排出换热腔50，进一步减小换热腔50的内部压力。
对于单通式的散热器，流体的流动方式是：从分配腔40流入，从换热腔50流出， 参见图6至图8，分配腔40设有流体进口43，换热腔50设有流体出口44。
采用单通式的散热器对发热装置进行散热的过程如下：流体从流体进口43进入分配腔40中，并在分配腔40内部压力的作用下流经通孔21后，喷射进入换热腔50的流体通道中，与结合针肋62、导流针肋63和底板30进行热交换，换热后的流体在换热腔50内部压力的作用下从换热腔50中的流体出口44流出换热腔50。这种单通式的散热器的结构简单，且流体的流动规律。
在上述单通式的散热器中，流体进口43的数量为至少一个，其可以设在分配腔40的侧面。示例性地，在分配腔40包括多个侧面的情况下，当流体进口43的数量为一个时，其位于分配腔40的同一侧面；而当流体进口43的数量为多个时，多个流体进口43可以位于分配腔40的同一侧面，当然也可以位于分配腔40的不同侧面。
同样地，流体出口44的数量为至少一个，其可以设在换热腔50的侧面。示例性地，在换热腔50包括多个侧面的情况下，当流体出口44的数量为一个时，其位于换热腔50的同一侧面；而当流体出口44的数量为多个时，多个流体出口44可以位于换热腔50的同一侧面，当然也可以位于换热腔50的不同侧面。
当流体进口43位于分配腔40的同一侧面时，为了防止换热后的流体从通孔21中溢出，参见图7和图8，沿靠近流体进口43至远离流体进口43的方向，各通孔21的直径呈减小的趋势。这是因为，沿靠近流体进口43至远离流体进口43的方向，换热腔50内换热后的流体量逐渐增多，将各通孔21的直径呈减小的趋势，可以防止换热后的流体从通孔21反向溢出到分配腔40。而直径减小的规律，可以从0.8mm逐渐变成0.5mm再变成0.3mm，也可以从1.0mm逐渐变成0.8mm再变成0.5mm，在散热器的设计过程中，可以根据对换热腔50的内部压力的要求进行设计，在此并不一一限定。
而为了提高单通式的散热器整体的强度，参见图7，在分配腔40的底面设有多根加强筋23。
为了了解散热器的散热性能，对上述散热器的散热性能进行测试，测试结果如下：
采用相变散热的散热方式，结构为分布式的散热器，底板30、结合针肋62以及导流针肋63均采用铝合金材料制成，流体采用电子氟化液，流体流量0.5L/min，芯片功率为300W，底板30与芯片的接触面积为60mm×60mm。在上述条件下，对分布式的散热器进行热阻值测试，其热阻值为0.04℃/W。
采用相变散热的散热方式，结构为单通式的散热器，底板30、结合针肋62以及导流针肋63均采用黄铜材料制成，流体采用电子氟化液，流体流量0.5L/min，芯片功率为300W，底板30与芯片的接触面积为60mm×60mm。在上述条件下，对单通式的散热器进行热阻值测试，其热阻值为0.037℃/W。
通过上述测试可知，相比于现有技术中的射流散热器(热阻值为0.06℃/W)，本申请的实施例提供的散热器的热阻值均为0.04℃/W以下，散热性能明显提高。
另一方面，本申请的实施例提供了一种通信设备，其包括发热装置、以及上述散热器；其中，散热器的底板与发热装置接触，该散热器用于对发热装置进行散热。
由于本申请的实施例提供的通信设备中的散热器中，在导流针肋和孔板的通孔之间存在间隙，而结合针肋分别与底板和孔板相接触，使得在散热器进行散热时，温度 低于发热装置温度的流体喷射进入导流针肋与通孔之间的间隙后，进入结合针肋和导流针肋构成的流通通道中，参与热交换，从而减少了不经过结合针肋和导流针肋构成的流体通道而直接流出换热腔的流体的量，提高了流体的利用率。因此，本申请的实施例提供的通信设备能够提高通信设备的散热效率。
以上的具体实施方式，对本申请的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上仅为本申请的具体实施方式而已，并不用于限定本申请的保护范围，凡在本申请的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本申请的保护范围之内。

Claims (15)

  1. 一种散热器，包括依次层叠布置的盖板、孔板和底板，所述孔板与所述盖板之间设有分配腔，所述孔板与所述底板之间设有换热腔，所述分配腔和所述换热腔通过所述孔板上设置的通孔连通，在换热腔内、所述底板的表面上设有多根朝向孔板的针肋，多根针肋之间的间隙构成流体通道，其特征在于，所述针肋包括与孔板相接触的结合针肋、以及与通孔对应且与通孔存在间隙的导流针肋。
  2. 根据权利要求1所述的散热器，其特征在于，所述导流针肋与所述通孔之间的间隙大于或等于0.1mm。
  3. 根据权利要求1所述的散热器，其特征在于，所述结合针肋与所述孔板之间设有弹性垫，所述结合针肋通过所述弹性垫与所述孔板相接触。
  4. 根据权利要求1所述的散热器，其特征在于，每根结合针肋的特征尺寸小于或等于1mm；
    其中，所述特征尺寸＝4×横截面面积/横截面周长。
  5. 根据权利要求4所述的散热器，其特征在于，每根结合针肋的高度与特征尺寸的比值大于或等于5。
  6. 根据权利要求4所述的散热器，其特征在于，相邻两根结合针肋之间的间隙与特征尺寸的比值为1:0.9～1:1.1。
  7. 根据权利要求1所述的散热器，其特征在于，所述孔板上的通孔的直径为0.2mm～2.0mm。
  8. 根据权利要求1至7任一项所述的散热器，其特征在于，在分配腔内、孔板的表面上设有朝向盖板的隔板，所述隔板将所述分配腔隔成多个流入腔和多个流出腔，所述流入腔和所述流出腔分别通过孔板上的通孔与所述换热腔连通；
    所述流入腔设有流体进口，所述流出腔设有流体出口。
  9. 根据权利要求8所述的散热器，其特征在于，所述流入腔与所述流出腔交替分布。
  10. 根据权利要求8所述的散热器，其特征在于，与流入腔连通的通孔的直径小于与流出腔连通的通孔的直径。
  11. 根据权利要求8所述的散热器，其特征在于，沿靠近所述流体进口至远离所述流体进口的方向，与流出腔连通的各通孔的直径呈增大的趋势。
  12. 根据权利要求8所述的散热器，其特征在于，与流入腔对应的导流针肋的高度大于与流出腔对应的导流针肋的高度。
  13. 根据权利要求1至7任一项所述的散热器，其特征在于，所述分配腔设有流体进口，所述换热腔设有流体出口。
  14. 根据权利要求13所述的散热器，其特征在于，沿靠近所述流体进口至远离所述流体进口的方向，各通孔的直径呈减小的趋势。
  15. 一种通信设备，其特征在于，所述通信设备包括发热装置、以及如权利要求1至14任一项所述的散热器；
    其中，所述散热器的底板与所述发热装置接触。
PCT/CN2018/081169 2017-05-17 2018-03-29 散热器以及通信设备 WO2018210067A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/685,019 US11310935B2 (en) 2017-05-17 2019-11-15 Heat dissipator and communications device
US17/708,657 US11641725B2 (en) 2017-05-17 2022-03-30 Heat dissipator and communications device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710349131.4 2017-05-17
CN201710349131.4A CN108966583B (zh) 2017-05-17 2017-05-17 散热器以及通信设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/685,019 Continuation US11310935B2 (en) 2017-05-17 2019-11-15 Heat dissipator and communications device

Publications (1)

Publication Number Publication Date
WO2018210067A1 true WO2018210067A1 (zh) 2018-11-22

Family

ID=64273274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/081169 WO2018210067A1 (zh) 2017-05-17 2018-03-29 散热器以及通信设备

Country Status (3)

Country Link
US (2) US11310935B2 (zh)
CN (1) CN108966583B (zh)
WO (1) WO2018210067A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021032133A1 (en) * 2019-08-19 2021-02-25 Telefonaktiebolaget Lm Ericsson (Publ) Heat dissipation apparatus, remote radio unit, baseband processing unit and base station
CN115379183A (zh) * 2022-08-26 2022-11-22 歌尔光学科技有限公司 微通道散热装置及电子设备

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7238401B2 (ja) * 2018-03-30 2023-03-14 日本電産株式会社 冷却装置
JP2019179832A (ja) * 2018-03-30 2019-10-17 日本電産株式会社 冷却装置
CN109755199B (zh) * 2019-02-20 2020-11-06 合肥工业大学 一种微小通道射流散热器
CN111356340A (zh) * 2020-03-06 2020-06-30 西安交通大学 一种高热通量冲击冷却式超临界二氧化碳散热器
CN112165282B (zh) * 2020-09-29 2022-04-05 深圳市千里智能控制科技有限公司 一种基于dds技术的步进电机运动控制器
CN112856841A (zh) * 2021-02-07 2021-05-28 爱美达（上海）热能系统有限公司 温控设备
CN115474415B (zh) * 2022-10-14 2024-01-19 苏州浪潮智能科技有限公司 散热器和服务器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
CN1968596A (zh) * 2006-11-24 2007-05-23 北京工业大学 阵列射流式微型换热器
CN101103659A (zh) * 2004-11-24 2008-01-09 通用电气公司 带有用于功率器件的微槽道冷却的散热器
CN201226636Y (zh) * 2008-07-04 2009-04-22 北京奇宏科技研发中心有限公司 一种带有蒸发腔体的液冷散热装置
CN102014598A (zh) * 2010-11-27 2011-04-13 上海大学 棱柱阵列射流微通道散热器
CN202149467U (zh) * 2011-08-02 2012-02-22 苏州迅康纳米科技有限公司 微槽循环散热器
CN105609475A (zh) * 2016-03-21 2016-05-25 南京师范大学 超声波强化微槽道换热器
CN106550588A (zh) * 2016-12-09 2017-03-29 淳铭散热科技股份有限公司 液冷散热系统

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nec Corp Flache Kühlungsstruktur für integrierte Schaltung.
US5365400A (en) * 1988-09-09 1994-11-15 Hitachi, Ltd. Heat sinks and semiconductor cooling device using the heat sinks
US6131650A (en) * 1999-07-20 2000-10-17 Thermal Corp. Fluid cooled single phase heat sink
US6431260B1 (en) * 2000-12-21 2002-08-13 International Business Machines Corporation Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6943444B2 (en) * 2003-10-30 2005-09-13 International Business Machines Corporation Cooling of surface temperature of a device
JP5137379B2 (ja) 2005-11-14 2013-02-06 インターナショナル・ビジネス・マシーンズ・コーポレーション 衝突冷却器
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
JP5523542B1 (ja) * 2012-12-07 2014-06-18 三菱電機株式会社 冷却装置
JP2014135396A (ja) * 2013-01-10 2014-07-24 Fujitsu Ltd 冷却ヘッド及び電子機器
US9437523B2 (en) * 2014-05-30 2016-09-06 Toyota Motor Engineering & Manufacturing North America, Inc. Two-sided jet impingement assemblies and power electronics modules comprising the same
JP6477276B2 (ja) * 2015-06-12 2019-03-06 富士通株式会社 クーリングプレート及びクーリングプレートを備える情報処理装置
WO2016203885A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール及び冷却器
US10265812B2 (en) * 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
US9622380B1 (en) * 2015-09-30 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same
US9953899B2 (en) * 2015-09-30 2018-04-24 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US11948860B2 (en) * 2017-08-29 2024-04-02 Welcon Inc. Heat sink
DE102017217537B4 (de) * 2017-10-02 2021-10-21 Danfoss Silicon Power Gmbh Leistungsmodul mit integrierter Kühleinrichtung
US10700571B2 (en) * 2017-12-08 2020-06-30 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling system for vehicle motor drive
US20190360759A1 (en) * 2018-05-25 2019-11-28 Purdue Research Foundation Permeable membrane microchannel heat sinks and methods of making
US11804418B2 (en) * 2019-01-11 2023-10-31 Intel Corporation Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
CN101103659A (zh) * 2004-11-24 2008-01-09 通用电气公司 带有用于功率器件的微槽道冷却的散热器
CN1968596A (zh) * 2006-11-24 2007-05-23 北京工业大学 阵列射流式微型换热器
CN201226636Y (zh) * 2008-07-04 2009-04-22 北京奇宏科技研发中心有限公司 一种带有蒸发腔体的液冷散热装置
CN102014598A (zh) * 2010-11-27 2011-04-13 上海大学 棱柱阵列射流微通道散热器
CN202149467U (zh) * 2011-08-02 2012-02-22 苏州迅康纳米科技有限公司 微槽循环散热器
CN105609475A (zh) * 2016-03-21 2016-05-25 南京师范大学 超声波强化微槽道换热器
CN106550588A (zh) * 2016-12-09 2017-03-29 淳铭散热科技股份有限公司 液冷散热系统

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021032133A1 (en) * 2019-08-19 2021-02-25 Telefonaktiebolaget Lm Ericsson (Publ) Heat dissipation apparatus, remote radio unit, baseband processing unit and base station
US11737241B2 (en) 2019-08-19 2023-08-22 Telefonaktiebolaget Lm Ericsson (Publ) Heat dissipation apparatus, remote radio unit, baseband processing unit and base station
CN115379183A (zh) * 2022-08-26 2022-11-22 歌尔光学科技有限公司 微通道散热装置及电子设备
CN115379183B (zh) * 2022-08-26 2024-03-12 歌尔光学科技有限公司 微通道散热装置及电子设备

Also Published As

Publication number Publication date
US20220225532A1 (en) 2022-07-14
CN108966583B (zh) 2020-04-14
CN108966583A (zh) 2018-12-07
US20200084913A1 (en) 2020-03-12
US11310935B2 (en) 2022-04-19
US11641725B2 (en) 2023-05-02

Similar Documents

Publication Publication Date Title
WO2018210067A1 (zh) 散热器以及通信设备
CN108712852B (zh) 一种气液两相混合喷射的微通道散热器
CN104465562B (zh) 一种链式交错型微通道结构
CN210868519U (zh) 高热流密度散热用复合射流冷却热沉
US10422592B2 (en) Double-sided cooler
CN104658992A (zh) 一种新型微针肋阵列热沉
CN110957632B (zh) 一种改善半导体激光阵列光谱半宽的微通道热沉
CN108666283B (zh) 一种微通道散热器结构及其制备方法
CN112038311A (zh) 一种双层复杂交错结构微通道热沉
CN105526813A (zh) 一种微通道散热器
CN212695143U (zh) 一种具有叶脉形分流结构的微通道热沉
CN113490394A (zh) 一种叶脉仿生微通道耦合射流换热系统
CN212810289U (zh) 一种具有特殊肋结构的微通道热沉
US11549758B2 (en) Microchannel heat exchanger structure with nozzle and working method thereof
CN213424981U (zh) 一种双层复杂交错结构微通道热沉
CN115371483A (zh) 具有分流结构的歧管微通道换热器
CN109346444B (zh) 一种带梯形脊肋阵列的微散热器
JP4956787B2 (ja) 冷却装置
CN210778560U (zh) 一种具有多流道相联通的微通道换热器
CN112399779A (zh) 一种梯形与波形结合的混合微通道散热器
CN113871359A (zh) 一种用于cpu散热的离心微通道结构及其使用方法
JP2014033015A (ja) 冷却器
CN113175836A (zh) 一种用于电子器件冷却的螺旋仿生微通道换热器
CN219164986U (zh) 一种低热阻低泵功的阵列热源的微通道散热集成系统
CN115966533B (zh) 一种带有逆流区的歧管式微通道散热器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18803052

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18803052

Country of ref document: EP

Kind code of ref document: A1