WO2018209595A1 - Dispositif à coefficient de température positif - Google Patents

Dispositif à coefficient de température positif Download PDF

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Publication number
WO2018209595A1
WO2018209595A1 PCT/CN2017/084709 CN2017084709W WO2018209595A1 WO 2018209595 A1 WO2018209595 A1 WO 2018209595A1 CN 2017084709 W CN2017084709 W CN 2017084709W WO 2018209595 A1 WO2018209595 A1 WO 2018209595A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive foil
layer
protection component
core housing
layers
Prior art date
Application number
PCT/CN2017/084709
Other languages
English (en)
Inventor
Cheng Hu
Yu Tian
Bing Wang
Chuanrong MIAO
Jack BU
Original Assignee
Littelfuse Electronics (Shanghai) Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Littelfuse Electronics (Shanghai) Co., Ltd. filed Critical Littelfuse Electronics (Shanghai) Co., Ltd.
Priority to PCT/CN2017/084709 priority Critical patent/WO2018209595A1/fr
Publication of WO2018209595A1 publication Critical patent/WO2018209595A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/022—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being openable or separable from the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material

Definitions

  • the disclosure relates generally to battery protection devices, and more particularly, to a positive temperature coefficient (PTC) device including an L-shaped terminal.
  • PTC positive temperature coefficient
  • PTC positive temperature coefficient
  • PTC conductive polymer e.g., a composition comprising an organic polymer and, dispersed or otherwise distributed therein, a particulate conductive filler, e.g., carbon black, or a metal or a conductive metal compound.
  • PTC positive temperature coefficient
  • Such devices may be referred to as polymer PTC, or PPTC resistors or resistive devices.
  • PTC devices subscribe to the trend of increasingly smaller size and higher integration density, because the size of PTC devices is decreasing, so is the area for mounting with other components, such as battery cells. Therefore, how to increase the connection with the printed circuit board and/or the battery cell (s) , while maintaining device integrity and reliability, is a critical problem to be addressed.
  • a positive temperature coefficient (PTC) device including an angled or L-shaped terminal directly connected to an electrode of a battery cell.
  • the PPTC device includes a number of vias and leads extending through the structure, designed to increase the adhesive strength of the L-shaped terminal.
  • an apparatus in one approach, includes a protection component disposed within an opening of a core housing, and an encapsulation layer disposed over the protection component, the encapsulation layer provided within the opening of the core housing.
  • the apparatus may further include a first conductive foil layer disposed over a first side of the encapsulation layer, and a second conductive foil layer disposed over a second side of the encapsulation layer, wherein the first and second conductive foil layers are electrically connected to the protection component.
  • the apparatus may further include a terminal having a first section directly coupled to the first conductive foil layer and a second section extending substantially perpendicularly from the first section.
  • a positive temperature coefficient (PTC) device may include a protection component disposed within an opening of a core housing, and an encapsulation layer disposed over the protection component, the encapsulation layer provided within the opening of the core housing.
  • the PTC device may further include a first conductive foil layer disposed over a first side of the encapsulation layer, and a second conductive foil layer disposed over a second side of the encapsulation layer, wherein the first and second conductive foil layers are electrically connected to the protection component.
  • the PTC device may further include a terminal having a first section directly coupled to the first conductive foil layer and a second section extending substantially perpendicularly from the first section, wherein the second section is directly coupled to an electrode of a battery cell.
  • a positive temperature coefficient (PTC) assembly may include a protection component disposed between a first conductive foil layer and a second conductive foil layer, wherein the first and second conductive foil layers are electrically connected to the protection component by a plurality of leads extending from each of the first and second conductive foil layers.
  • the PTC assembly may further include a terminal having a first section directly coupled to the first conductive foil layer and a second section extending substantially perpendicularly from the first section, wherein the second section is directly coupled to an electrode of a battery cell.
  • the PTC assembly may further include a printed circuit board coupled to the second conductive foil layer.
  • FIGs. 1A-B are isometric views of a device, such as a PTC device, according to an approach of the disclosure
  • FIG. 2 is side cross-section view of the device of FIG. 1A according to an approach of the disclosure
  • FIG. 3 is an end cross-section view of the device of FIG. 1A according to an approach of the disclosure
  • FIG. 4 depicts an exploded perspective view of the device of FIGs. 1A-B according to an approach of the disclosure
  • FIGs. 5A-B are perspective views of another device according to an approach of the disclosure.
  • FIG. 6 is a side cross-sectional view of the device of FIG. 5A according to an approach of the disclosure
  • FIG. 7 is an end cross-sectional view of the device of FIG. 5A according to an approach of the disclosure
  • FIG. 8 depicts an exploded perspective view of the device of FIGs. 5A-B according to an approach of the disclosure.
  • FIG. 9 depicts a side view of a PTC assembly according to an approach of the disclosure.
  • an assembly includes a protection component disposed between a first conductive foil layer and a second conductive foil layer, wherein the first and second conductive foil layers are electrically connected to the protection component by a plurality of leads extending from each of the first and second conductive foil layers.
  • the assembly may further include an L-shaped terminal having a first section directly coupled to the first conductive foil layer and a second section coupled to an electrode of a battery cell.
  • the assembly may further include a printed circuit board directly coupled to the second conductive foil layer. As configured, the battery cell may be oriented substantially perpendicularly to the printed circuit board.
  • protection circuit including active protection components (e.g., integrated circuits or sensors) and passive protective components (e.g. PTCs, negative temperature coefficient (NTC) , or fuses) is embedded in a core housing made of PCB FR-4 material or molding case, and encapsulated with a coating, such as epoxy or encapsulation.
  • active protection components e.g., integrated circuits or sensors
  • passive protective components e.g. PTCs, negative temperature coefficient (NTC) , or fuses
  • NTCs negative temperature coefficient
  • the active and passive components are connected with a conductive layer and/or a via hole to form the protection circuit.
  • the device 100 such as a PTC device or a polymeric PTC device, includes a protection component 102 disposed within an opening 104 of a core housing 106.
  • the device 100 further includes an encapsulation layer 110 disposed over the protection component 102, the encapsulation layer 110 provided partially or entirely within the opening 104 of the core housing 106.
  • the illustrated PTC device 100 may be located in, for example, a charge/discharge circuit of a secondary cell, and used as a circuit protection device to interrupt an excess current when such current passes through the circuit.
  • the PTC material of protection component 102 may be made of a positive temperature coefficient conductive composition comprising a polymer and a conductive filler.
  • the polymer of the PTC material may be a crystalline polymer selected from the group consisting of polyethylene, polypropylene, polyoctylene, polyvinylidene chloride and a mixture thereof.
  • the conductive filler may be dispersed in the polymer and is selected from the group consisting of carbon black, metal powder, conductive ceramic powder and a mixture thereof.
  • the PTC conductive composition may also include an additive, such as a photo initiator, cross-link agent, coupling agent, dispersing agent, stabilizer, anti-oxidant and/or nonconductive anti-arcing filler.
  • an additive such as a photo initiator, cross-link agent, coupling agent, dispersing agent, stabilizer, anti-oxidant and/or nonconductive anti-arcing filler.
  • the core housing 106 encases the protection component 102.
  • the core housing 106 extends entirely around an outer perimeter of the encapsulation layer 110.
  • the opening 104 of the core housing 106 may be dimensioned to receive the encapsulation layer 110 therein.
  • the core housing 106 may have a generally rectangular shape.
  • the core housing 106 is made from a FR-4 glass-reinforced epoxy laminate.
  • the core housing 106 is made from a ceramic or a moldable material.
  • the device 100 further includes a first conductive foil layer 112 disposed over a first side 114 of the encapsulation layer 110, and a second conductive foil layer 118 disposed over a second side 120 of the encapsulation layer 110.
  • the first and second conductive foil layers 112, 118 are electrically connected to the protection component 102.
  • each of the first and second conductive foil layers 112, 118 may include one or more layers of conductive material joined together.
  • the first conductive foil layer 112 may include an inner layer 113 coupled to an outer layer 115, while the second conductive foil layer 118 may similarly include an inner layer 119 coupled to an outer layer 121.
  • the device 100 may include a terminal 130 including a first section 132 directly coupled to the first conductive foil layer 112 (e.g., the outer layer 115) and a second section 134 extending substantially perpendicularly from the first section 132.
  • the terminal 130 is an electrically conductive component having a substantially L-shaped side profile.
  • the terminal 130 may include an opening 136, as shown, or may be a solid piece of material.
  • the first section 132 may be joined to the second section 134 at a joint or elbow 140, which may have an increased thickness relative to the first and second sections 132, 134 to provide more stability and durability when the terminal 130 is joined with other components.
  • the horizontally oriented first section 132 of the terminal 130 is electrically connected to the outer layer 115 of the first conductive foil layer 112, which is formed atop or adjacent an upper side of a first bonding layer 148.
  • Such connection may be carried out in any appropriate manner as long as both electric and physical connections are achieved.
  • welding e.g., resistance welding
  • soldering connecting with an electrically conductive adhesive or an electrically conductive paste, or the like, may be employed.
  • the L-shaped terminal 130 forms an angle of 90 degrees between the first section 132 and the second section 134. In other embodiments, however, the angle between the first section 132 and the second section 134 may be approximately 45° to 135°.
  • an electrical connection may be formed between the vertical second section 134 and the other electric element. Due to the shape of the terminal 130, high temperature heat applied when the electric connection is formed (for example, heat by means of heating upon connecting with soldering, welding, an electrically conductive adhesive or the like) is supplied primarily to the vertical second section 134 and not directly to the horizontal first section 132. In other words, an amount of heat transferred to the first section 132 is reduced, which decreases the likelihood of damage to other layers of the device 100.
  • the device 100 may further include the first bonding layer 148 coupled to a first side 150 of the core housing 106, and a second bonding layer 152 coupled to a second side 154 of the core housing 106.
  • the first and second bonding layers 148, 152 enclose the protection component 102 within the opening 104 of the core housing 106.
  • the first and second bonding layers 148, 152 are directly coupled to opposite sides of the frame of the core housing 106 and the encapsulation layer 110 so to sandwich those components therebetween.
  • the protection component 102 may be disposed directly atop the second bonding layer 152.
  • the first and second bonding layers 148, 152 are layers of epoxy.
  • the first and second bonding layers 148, 152 may be coupled to the core housing 106, for example, by injection molding.
  • the device 100 may further include a plurality of leads 147, 149 extending from each of the first and second conductive foil layers 112, 118, respectively, wherein the plurality of leads 147, 149 are electrically connected to the protection component 102.
  • the plurality of leads 147 may extend through a plurality of vias formed through each of the encapsulation layer 110 and the first bonding layer 148, while the plurality of leads 149 may extend through vias formed in the second bonding layer 152.
  • the first and second bonding layers 148, 152 may be provided with vias 156 and 158, respectively, while the encapsulation layer 110 may include a plurality of vias 160.
  • the leads 147 may further extend through vias 161 of the inner layer 113 of the first conductive foil 112, while leads 149 may extend through vias 163 of the inner layer 119 of the second conductive foil layer 118.
  • the plurality of leads 147, 149 provide an electrical connection between the terminal 130 and the protection component 102.
  • one or more of the vias 156, 158, 160, 161, and 163 may be formed by mechanical drilling, followed by electro or electroless plating.
  • the vias may be filled with a conductive paste.
  • the protection component 102 is selected from the non-limiting group consisting of: fuses, PTCs, NTCs, ICs, sensors, MOSFETS, resistors, and capacitors. Of these protection components, ICs and sensors are considered to be active protection components, while PTCs, NTCs, and fuses are considered to be passive components. In the embodiment shown, the protection component 102 may be a polymeric PTC. It will be appreciated, however, that this arrangement is non-limiting, and the number and configuration of protection components may vary depending on the application.
  • the encapsulation layer 110 may be positioned or formed within the core housing 106 so as to cover the protection component 102.
  • the encapsulation layer 110 may be an injectable epoxy, which is deposited within the opening 104 so as to partially or completely fill the opening 104 and cover the protection component 102.
  • the encapsulation layer 110 may include vias 160 to provide a connection between the terminal 130, the first conductive layer 112, and the protection component 102.
  • the encapsulation layer 110 may be a multiple-layer structure with different layers providing different functions.
  • one example 3-layer structure of the encapsulation layer 110 may include a first layer which is oxidization-resistant epoxy, a second layer that is humidity-resistant epoxy, and a third layer that is corrosion-resistant epoxy. It will be appreciated, however, that this tri-layered arrangement is non-limiting, and the number and layers of the encapsulation layer 110 may vary depending on the application.
  • the device 200 such as a PTC device, includes a protection component 202 disposed within an opening 204 of a core housing 206.
  • the device 200 further includes an encapsulation layer 210 disposed over the protection component 202, the encapsulation layer 210 provided within the opening 204 of the core housing 206.
  • the device 200 further includes a first conductive foil layer 212 disposed over a first side 214 of the encapsulation layer 210, and a second conductive foil layer 218 disposed over a second side 220 of the encapsulation layer 210.
  • the first and second conductive foil layers 212, 218 are electrically connected to the protection component 202.
  • each of the first and second conductive foil layers 212, 218 may include one or more layers of conductive material joined together.
  • the first conductive foil layer 212 may include an inner layer 213 coupled to an outer layer 215, while the second conductive foil layer 218 may similarly include an inner layer 219 coupled to an outer layer 221.
  • the inner layer 213 and/or the outer layer 215 includes respective upper planar sheets 223A-B, end walls 225A-B, and lower flanges 227A-B.
  • one or more of the lower flanges 227A-B may extend along a bottom surface 231 of a second bonding layer 252, beneath the encapsulation layer 210, as more clearly shown in FIG. 5B and FIG. 6.
  • the lower flange 227A is generally planar with the second conductive foil layer 218.
  • the device 200 may include a terminal 230 including a first section 232 directly coupled to the first conductive foil layer 212 and a second section 234 extending substantially perpendicularly from the first section 232.
  • the terminal 230 is an electrically conductive component having a substantially L-shaped side profile.
  • the terminal 230 may include an opening 236, as shown, or may be a solid piece of material.
  • the first section 232 may be joined to the second section 234 at a joint 240, which may have an increased thickness relative to the first and second sections 232, 234 to provide more stability and durability when joined with other components.
  • the device 200 may further include a first bonding layer 248 coupled to a first side 250 of the core housing 206, and the second bonding layer 252 coupled to a second side 254 of the core housing 206.
  • the first and second bonding layers 248, 252 enclose the protection component 202 within the opening 204 of the core housing 206. More specifically, the first and second bonding layers 248, 252 are directly coupled to opposite sides of the frame of the core housing 206 and the encapsulation layer 210 so to sandwich those components therebetween.
  • the first bonding layer 248 may be disposed directly atop/adjacent the protection component 202.
  • the first and second bonding layers 248, 252 are layers of epoxy. The first and second bonding layers 248, 252 are coupled to the core housing 206, for example, by injection molding.
  • the device 200 may include a pair of cutouts 266, 268 provided on opposite ends of the protection component 202.
  • the pair of cutouts 266, 268 extend through each of the core housing 206, the first conductive foil layer 212, and the first and second bonding layers 248, 252.
  • each of the pair of cutouts 266, 268 may include a rounded indentation that extends inwardly towards the protection component 202.
  • the first conductive foil layer 212 represents an outermost layer/surface of each cutout 266, 268.
  • the pair of cutouts 266, 268 are provided to increase the adhesive strength between the terminal 230, the first bonding layer 248, and the first conductive foil layer 212.
  • the device 200 may further include a plurality of leads 247, 249 extending from each of the first and second conductive foil layers 212, 218, respectively, wherein the plurality of leads 247, 249 are electrically connected to the protection component 202 and to the terminal 230.
  • the plurality of leads 247 may extend through a plurality of vias formed through the first bonding layer 248, while the plurality of leads 249 may extend through a plurality of vias formed through the encapsulation layer 210 and the second bonding layer 252. More specifically, the first and second bonding layers 248, 252 may be provided with vias 256 and 258, respectively, while the encapsulation layer 210 may include a plurality of vias 260.
  • leads 247 may extend through vias 261 of the inner layer 213 of the first conductive foil layer 212, while leads 249 may extend through vias 263 of the inner layer 219 of the second conductive foil layer 218.
  • the plurality of leads 247, 249 provide an electrical connection between the terminal 230 and the protection component 202. Furthermore, the leads 247 and 249 connect together each inner and outer layer of the first and second conductive foil layers 212, 218, and provide increased adhesive strength between the first and second bonding layers 248, 252 and the first and second conductive foil layers 212, 218.
  • one or more of the vias 256, 258, 260, 261, and 263 may be formed by mechanical drilling, followed by electro or electroless plating. In other embodiments, the vias may be filled with a conductive paste.
  • the core housing 206 encases the protection component 202.
  • the core housing 206 extends entirely around an outer perimeter of the encapsulation layer 210.
  • the opening 204 of the core housing 206 is dimensioned to receive the encapsulation layer 210 therein.
  • the encapsulation layer 210 may be positioned or formed within the core housing 206 so as to cover the protection component 202.
  • the encapsulation layer 210 may be an injectable epoxy, which is deposited within the opening 204 so as to partially or completely fill the opening 204 and cover the protection component 202.
  • the encapsulation layer 210 may include vias 260 to provide a connection between the terminal 230, the first conductive layer 212, and the protection component 202.
  • the assembly 301 includes a device 300, which may be a PPTC device.
  • the device 300 includes many or all of the features previously described in relation to the device 100 and the device 200. As such, only certain aspects of the device 300 will hereinafter be described for the sake of brevity.
  • the device 300 includes a terminal 330 including a first section 332 directly coupled to a first conductive foil layer 312 and a second section 334 extending substantially perpendicularly from the first section 332. As shown, the second section 334 is coupled to an electrode 370 of a battery cell 372.
  • the assembly 301 further includes a printed circuit board (PCB) 374 directly coupled to a second conductive foil layer 318 of the device 300.
  • the battery cell 372 is oriented perpendicular, or substantially perpendicular, to a top surface 378 of the PCB 374. Stated another way, a plane defined by a surface 380 of battery cell 372 is normal to a plane defined by the top surface 378 of the PCB 374.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

La présente invention concerne des dispositifs à coefficient de température positif (PTC) comprenant une borne inclinée ou en forme de L. Dans une approche, un ensemble comprend un composant de protection disposé entre une première couche de feuille conductrice et une seconde couche de feuille conductrice, les première et seconde couches de feuille conductrice étant électroconnectées au composant de protection par une pluralité de fils s'étendant à partir de chacune des première et seconde couches de feuille conductrice. L'ensemble peut en outre comprendre une borne en forme de L ayant une première section directement couplée à la première couche de feuille conductrice et une seconde section couplée à une électrode d'un élément de batterie. L'ensemble peut en outre comprendre une carte de circuit imprimé couplée à la seconde couche de feuille conductrice. Tel que configuré, l'élément de batterie peut être orienté sensiblement perpendiculairement à une surface supérieure de la carte de circuit imprimé.
PCT/CN2017/084709 2017-05-17 2017-05-17 Dispositif à coefficient de température positif WO2018209595A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/084709 WO2018209595A1 (fr) 2017-05-17 2017-05-17 Dispositif à coefficient de température positif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/084709 WO2018209595A1 (fr) 2017-05-17 2017-05-17 Dispositif à coefficient de température positif

Publications (1)

Publication Number Publication Date
WO2018209595A1 true WO2018209595A1 (fr) 2018-11-22

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101271751A (zh) * 2008-04-17 2008-09-24 上海神沃电子有限公司 表面贴装型高分子ptc热敏电阻器及其制造方法
CN101630674A (zh) * 2008-04-21 2010-01-20 力特保险丝公司 包括电阻和熔线元件的电路保护装置
CN103503085A (zh) * 2011-05-02 2014-01-08 泰科电子日本合同会社 Ptc器件
WO2016039305A1 (fr) * 2014-09-09 2016-03-17 タイコエレクトロニクスジャパン合同会社 Élément de protection
CN106463303A (zh) * 2014-04-09 2017-02-22 力特电子(日本)有限责任公司 保护装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101271751A (zh) * 2008-04-17 2008-09-24 上海神沃电子有限公司 表面贴装型高分子ptc热敏电阻器及其制造方法
CN101630674A (zh) * 2008-04-21 2010-01-20 力特保险丝公司 包括电阻和熔线元件的电路保护装置
CN103503085A (zh) * 2011-05-02 2014-01-08 泰科电子日本合同会社 Ptc器件
CN106463303A (zh) * 2014-04-09 2017-02-22 力特电子(日本)有限责任公司 保护装置
WO2016039305A1 (fr) * 2014-09-09 2016-03-17 タイコエレクトロニクスジャパン合同会社 Élément de protection

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