WO2018218658A1 - Composants de protection intégrés à une carte de circuit imprimé - Google Patents

Composants de protection intégrés à une carte de circuit imprimé Download PDF

Info

Publication number
WO2018218658A1
WO2018218658A1 PCT/CN2017/086983 CN2017086983W WO2018218658A1 WO 2018218658 A1 WO2018218658 A1 WO 2018218658A1 CN 2017086983 W CN2017086983 W CN 2017086983W WO 2018218658 A1 WO2018218658 A1 WO 2018218658A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
pcb
protection components
core housing
conductive layer
Prior art date
Application number
PCT/CN2017/086983
Other languages
English (en)
Inventor
Cheng Hu
Yu Tian
Bing Wang
Jianming BU
Original Assignee
Littelfuse Electronics (Shanghai) Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Littelfuse Electronics (Shanghai) Co., Ltd. filed Critical Littelfuse Electronics (Shanghai) Co., Ltd.
Priority to PCT/CN2017/086983 priority Critical patent/WO2018218658A1/fr
Priority to TW107118895A priority patent/TW201904154A/zh
Publication of WO2018218658A1 publication Critical patent/WO2018218658A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H01M2200/103—Fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H01M50/574—Devices or arrangements for the interruption of current
    • H01M50/581—Devices or arrangements for the interruption of current in response to temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the disclosure relates generally to battery protection devices, and more particularly, to protection components embedded and/or encapsulated within a substrate, such as a printed circuit board.
  • PTC positive temperature coefficient
  • a PTC conductive polymer e.g., a composition comprising an organic polymer and, dispersed or otherwise distributed therein, a particulate conductive filler, e.g. carbon black, or a metal or a conductive metal compound.
  • PTC positive temperature coefficient
  • Such devices may be referred to as polymer PTC, or PPTC resistors or resistive devices.
  • protection circuit including active protection components (e.g., integrated circuits or sensors) and passive protective components (e.g. PTCs, negative temperature coefficient (NTC) , and/or fuses) , is embedded and/or encapsulated therein.
  • active protection components e.g., integrated circuits or sensors
  • passive protective components e.g. PTCs, negative temperature coefficient (NTC) , and/or fuses
  • One approach according to embodiments of the disclosure includes an apparatus having a first printed circuit board (PCB) layer and a second PCB layer, and a plurality of protection components formed between the first and second PCB layers.
  • the apparatus further includes a core housing encasing the plurality of protection components, a first encapsulation layer formed over a first side of the core housing, and a second encapsulation layer formed over a second side of the core housing.
  • PCB printed circuit board
  • the PCB further includes a core housing encasing the plurality of protection components, the core housing provided between the first and second PCB layers.
  • the PCB may further include a first encapsulation layer coupled to a first side of the core housing, and a second encapsulation layer coupled to a second side of the core housing.
  • Yet another approach includes a method including providing a plurality of protection components between a first printed circuit board (PCB) layer and a second PCB layer, and encasing the plurality of protection components within a set of openings of a core housing.
  • the method further includes coupling a first encapsulation layer to a first side of the core housing, and coupling a second encapsulation layer to a second side of the core housing.
  • PCB printed circuit board
  • FIG. 1 is a top view of an apparatus, such as a PCB, according to an exemplary approach of the disclosure
  • FIG. 2 is side cross-section view of the apparatus of FIG. 1 according to an exemplary approach of the disclosure
  • FIG. 3 is an exploded view of the apparatus of FIG. 1 according to an exemplary approach of the disclosure
  • FIGs. 4A-B are perspective views of a number of components coupled to the apparatus of FIG. 1 to form a protection circuit module according to an exemplary approach of the disclosure;
  • FIG. 5 is a perspective view of a battery pack and apparatus according to another exemplary approach of the disclosure.
  • FIGs. 6A-E depict an approach for forming an apparatus according to an exemplary approach of the disclosure.
  • FIG. 7 depicts a process of forming an apparatus according to an exemplary approach of the disclosure.
  • the protection circuit including active protection components (e.g., integrated circuits or sensors) and passive protective components (e.g. PTCs, negative temperature coefficient (NTC) , and/or fuses) , is embedded and/or encapsulated therein.
  • the active and/or passive components may be connected with a conductive layer and/or vias to form an integrated PCM.
  • each protection circuit module is typically designed to meet each battery pack.
  • the positive and passive components are typically the more influential aspects of a protection circuit, integrating positive and passive components together within the PCB, which is the base of the PCM, will simplify the PCM design. Selection of resistors and capacitors to complete the protection circuit, as desired, is all that remains to a designer.
  • an apparatus such as a substrate/PCB in which portions of a protection circuit, including active protection components (e.g., integrated circuits or sensors) and passive protective components (e.g. PTCs, negative temperature coefficient (NTC) , or fuses) are embedded therein.
  • the PCB may include a core housing made of PCB FR-4 material or molding, and encapsulate the protection components with first and second encapsulation layers, such as epoxy or encapsulation.
  • the active and passive components are connected with a conductive layer and/or a via hole to form the protection circuit.
  • an apparatus in some embodiments, includes a first PCB layer and a second PCB layer, and a plurality of protection components formed between the first and second PCB layers.
  • the apparatus further includes a core housing encasing the plurality of protection components, and a set of encapsulation layers formed over a first and second sides of the core housing.
  • the plurality of protection components are selected from the group consisting of: fuses, positive temperature coefficient devices, integrated circuits, and/or sensors.
  • the apparatus may be connected to external circuits and/or external equipment, such as a battery.
  • embodiments of the present disclosure may simplify the protection circuit design into electronic components selection work to meet each battery pack capacity, thus simplifying client-end assembly and installation techniques and processes, which reduces costs. Furthermore, some of the protection components are encapsulated within the core housing, and protective layering is applied thereto, thus improving the performance of current existing products, and strengthening product reliability.
  • the apparatus 100 such as a substrate or PCB included as part of a battery protection circuit module, may include a first PCB layer 102A and a second PCB layer 102B, and a plurality of protection components 104A-B formed between the first and second PCB layers 102A-B.
  • the protection components 104A-B may be provided within a core housing 110, for example, within a set of openings 112A-B provided therein.
  • the protection components 104A-B may be further encased by a first encapsulation layer 114A formed over a first side 116 (e.g., a top surface) of the core housing 110, and by a second encapsulation layer 114B formed over a second side 118 (e.g., a bottom surface) of the core housing 110.
  • the apparatus 100 may include a first conductive layer 120A provided between the first PCB layer 102A and the first encapsulation layer 114A, and a second conductive layer 120B provided between the second PCB layer 102B and the second encapsulation layer 114B.
  • the first PCB layer 102A may include one or more openings 122A-B to expose and provide access to an outer surface 124 (e.g., an upper surface) of the first conductive layer 120A for attachment with a set of terminals, as will be described in greater detail below.
  • the second PCB layer 102B may include one or more openings 126A-B to expose and provide access to an outer surface 129 (e.g., a bottom surface) of the second conductive layer 120B.
  • the apparatus 100 may further include a first set of leads 130 formed through openings 132 in the first conductive layer 120A and openings 134 in the first encapsulation layer 114A.
  • the leads 130 provide an electrical pathway between the plurality of protection components 104A-B and a set of terminals (not shown) coupled to the first conductive layer 120A.
  • a second set of leads 140 may similarly be formed through openings 142 in the second conductive layer 120B and openings 144 in the second encapsulation layer 114B.
  • the plurality of protection components 104A-B are selected from the non-limiting group consisting of: fuses, PTCs, NTCs, ICs, and sensors. Of these protection components, ICs and sensors are considered to be active protection components, while PTCs, NTCs, and fuses are considered to be passive components.
  • the protection component 104-A may be a PTC
  • the protection component 104-B may be an IC (e.g., may be integrated with MOSFET) . It will be appreciated, however, that this arrangement is non-limiting, and the number and configuration of protection components may vary depending on the application.
  • the PTC material of protection component 104-A may be made of a positive temperature coefficient conductive composition comprising a polymer and a conductive filler.
  • the polymer of the PTC material may be a crystalline polymer selected from the group consisting of polyethylene, polypropylene, polyoctylene, polyvinylidene chloride and a mixture thereof.
  • the conductive filler may be dispersed in the polymer and is selected from the group consisting of carbon black, metal powder, conductive ceramic powder and a mixture thereof.
  • the PTC conductive composition may also include an additive, such as a photo initiator, cross-link agent, coupling agent, dispersing agent, stabilizer, anti-oxidant and/or nonconductive anti-arcing filler.
  • an additive such as a photo initiator, cross-link agent, coupling agent, dispersing agent, stabilizer, anti-oxidant and/or nonconductive anti-arcing filler.
  • the core housing 110 extends entirely around an outer perimeter of each of the protection components 104A-B.
  • the core housing 110 may have a frame 150 defining the set of openings 112A-B, which receive the protection components 104A-B therein.
  • the protection components 104A-B are recessed slightly below the first and second sides 116, 118 of the core housing 110 so as not to interfere with the first and second encapsulation layers 114A-B coupled to the core housing 110.
  • the core housing 110 may have a generally rectangular shape.
  • the core housing 110 is made from a FR-4 glass-reinforced epoxy laminate.
  • the core housing 110 is made from a ceramic or a moldable material.
  • the first and second encapsulation layers 114A-B are bonding layers directly coupled to opposite sides (e.g., top and bottom) of the frame 150 of the core housing 110 so as to fully encapsulate the plurality of protection components 104A-B housed therein.
  • the first and second bonding layers encapsulation layers 114A-B are layers of epoxy, which may be provided with vias 134 and 144 formed therein, respectively.
  • the vias 134 and 144 may be formed by mechanical drilling, followed by electro or electroless plating. In other embodiments, the vias 134 and 144 may be filled with a conductive paste.
  • the first and second encapsulation layers 114A-B are coupled to the core housing 110, for example, by injection molding.
  • the apparatus 100 may further include one or more terminals 155A-B coupled to the first conductive layer 120A to form a protection circuit module 168.
  • the terminals 155A-B may be connected to the protection components 104A-B by the leads 130, which extend through openings 132 in the first conductive layer 120A and openings 134 of the first encapsulation layer 114A, and wherein the leads 130 can be designed to meet specific battery pack application requirements.
  • Electronic components, such as resistors 164A-B and capacitors 165A-B, may also be coupled to the first conductive layer 120A to complete the protection circuit with protection components 104A-B, as shown.
  • resistors 164A-B and capacitors 165A-B can be adjusted, and these components can be replaced when failure occurs. It will be appreciated, however, that this arrangement is non-limiting, and the number and configuration of protection components externally coupled to the apparatus 100 may vary depending on the application.
  • the apparatus 100 is coupled to a battery pack 170 using the terminals 155A-B.
  • the protection components 104A-B and the electronic components of the apparatus 100 constitute a protection circuit for the battery pack 170.
  • the plurality of protection components 104A-B may be inserted into the openings 112A-B of the core housing 110.
  • the openings 112A-B may be different sizes, and individually dimensioned to accommodate the protection components 104A-B therein.
  • the protection components 104A-B are recessed slightly below the first and second sides 116, 118 of the core housing 110 so as not to interfere with the first and second encapsulation layers 114A-B, which are then coupled to the core housing 110, as shown in FIG. 6B.
  • the first and second encapsulation layers 114A-B may have a same or similar footprint as the core housing 110, and may be substantially planar or flush with the first and second sides 116, 118 thereof. Once secured to each side of the core housing 110, the protection components 104A-B are encapsulated by the first and second encapsulation layers 114A-B and the core housing 110. In some embodiments, the second encapsulation layer 114B may be first attached to the second/bottom side 118 of the core housing 110 prior to the protection components 104A-B being placed into the core housing 110.
  • the first and second conductive layers 120A-B may be coupled to exterior surfaces of the first and second encapsulation layers 114A-B.
  • each of the first and second conductive layers 120A-B may be a laminate copper foil formed on the first and second encapsulation layers 114A-B, respectively, as a continuous sheet of material.
  • the first and second conductive layers 114A-B may be etched to form each distinct section, as shown.
  • the plurality of openings/vias 132 may then be formed through the first encapsulation layer 114A, and the plurality of leads 130 provided therein, as shown in FIG. 6D.
  • the first PCB layer 102A and the second PCB layer 102B may be coupled to each of the first and second encapsulation layers 114A-B to form the apparatus 100.
  • the first and second PCB layers 102A-B may have a same or similar footprint, and may be substantially planar or flush, with the first and second encapsulation layers 114A-B and the core housing 110.
  • the method 200 includes providing a plurality of protection components between first and second PCB layers, as shown at block 201.
  • the first and second PCB layers include one or more openings to expose an outer surface of a first a conductive layer and a second conductive layer to an exterior of the apparatus.
  • the method 200 further includes encasing the plurality of protection components within a set of openings of a core housing, as shown at block 203.
  • the plurality of protection components are selected from the group consisting of: fuses, positive temperature coefficient devices, integrated circuits, and/or sensors.
  • the protection components and the electronic components of the apparatus constitute a protection circuit for an external battery pack.
  • the method 200 further includes coupling a first encapsulation layer to a first side of the core housing and a second encapsulation layer to a second side of the core housing, as shown at block 205.
  • the first and second encapsulation layers are bonding layers directly coupled to opposite sides (e.g., top and bottom) of a frame of the core housing so as to fully encapsulate the plurality of protection components housed therein.
  • the first and second bonding layers encapsulation layers are layers of epoxy, which may be provided with vias formed therein.
  • the method 200 may further include providing a first conductive layer between the first PCB layer and the first encapsulation layer and providing a second conductive layer between the second PCB layer and the second encapsulation layer, as shown at block 207.
  • an outer surface (e.g., an upper surface) of the first conductive layer is coupled to a set of terminals.
  • each of the first and second conductive layers are copper foils configured to connect the protection components within the core housing with externally positioned components, such as capacitors, resistors, and/or the terminals.
  • the first PCB layer includes one or more openings to expose an outer surface of the first conductive layer, and wherein the second PCB layer includes one or more openings to expose an outer surface of the second conductive layer.
  • a first advantage is design simplification, as there is no need to consider multiple protection component configurations. Instead, the protection components are already fixed into position within the circuit.
  • a second advantage is design flexibility, as the externally positioned resistors and capacitors can be selected/modified to meet different battery capacity requirements.
  • a third advantage is size miniaturization, as protection components are the largest PCB mounted components, the protection components are removed from the surface of the PCB to inner layers of the core housing 110. This location change can increase total PCB free space by up to approximately 60%.
  • a fourth advantage is higher reliability performance, as the protection components are encapsulated within the PCB, thus avoiding environmental contamination.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

La présente invention concerne des approches pour incorporer un ou plusieurs composants de protection dans un substrat, tel qu'une carte de circuit imprimé (PCB). Selon une approche, un appareil comprend une première couche de carte de circuit imprimé et une seconde couche de carte de circuit imprimé, et une pluralité de composants de protection formés entre les première et seconde couches de carte de circuit imprimé. L'appareil comprend en outre un boîtier central renfermant la pluralité de composants de protection et un ensemble de couches d'encapsulation formées sur des premier et second côtés du boîtier central. Selon certaines approches, la pluralité de composants de protection sont choisis dans le groupe constitué par : des fusibles, des dispositifs à coefficient de température positif, des circuits intégrés et/ou des capteurs. Des composants électroniques, tels que des résistances et des condensateurs, peuvent être montés en surface sur le côté supérieur de la carte de circuit imprimé pour compléter le circuit de protection avec les composants de protection. Par le biais d'une connexion de borne, d'une soudure par refusion ou d'autres approches, l'appareil peut être raccordé à un bloc-batterie pour protéger le fonctionnement de la batterie.
PCT/CN2017/086983 2017-06-02 2017-06-02 Composants de protection intégrés à une carte de circuit imprimé WO2018218658A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2017/086983 WO2018218658A1 (fr) 2017-06-02 2017-06-02 Composants de protection intégrés à une carte de circuit imprimé
TW107118895A TW201904154A (zh) 2017-06-02 2018-06-01 內嵌保護構件的印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/086983 WO2018218658A1 (fr) 2017-06-02 2017-06-02 Composants de protection intégrés à une carte de circuit imprimé

Publications (1)

Publication Number Publication Date
WO2018218658A1 true WO2018218658A1 (fr) 2018-12-06

Family

ID=64454378

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/086983 WO2018218658A1 (fr) 2017-06-02 2017-06-02 Composants de protection intégrés à une carte de circuit imprimé

Country Status (2)

Country Link
TW (1) TW201904154A (fr)
WO (1) WO2018218658A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024039208A1 (fr) * 2022-08-17 2024-02-22 삼성전자 주식회사 Dispositif électronique comprenant une batterie

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021040019A (ja) * 2019-09-03 2021-03-11 住友電装株式会社 基板ケース及び電気接続箱

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544615A (zh) * 2011-12-14 2012-07-04 李鹏 一种无线充电电池
US8492888B2 (en) * 2011-09-02 2013-07-23 Stats Chippac Ltd. Integrated circuit packaging system with stiffener and method of manufacture thereof
US20130280558A1 (en) * 2012-04-19 2013-10-24 Samsung Sdi Co., Ltd. Rechargeable battery

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492888B2 (en) * 2011-09-02 2013-07-23 Stats Chippac Ltd. Integrated circuit packaging system with stiffener and method of manufacture thereof
CN102544615A (zh) * 2011-12-14 2012-07-04 李鹏 一种无线充电电池
US20130280558A1 (en) * 2012-04-19 2013-10-24 Samsung Sdi Co., Ltd. Rechargeable battery

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024039208A1 (fr) * 2022-08-17 2024-02-22 삼성전자 주식회사 Dispositif électronique comprenant une batterie

Also Published As

Publication number Publication date
TW201904154A (zh) 2019-01-16

Similar Documents

Publication Publication Date Title
EP2309520B1 (fr) Circuit électrique avec un dispositif de protection à montage en surface et une méthode de sa fabrication
US10263238B2 (en) Battery protection circuit module package, battery pack and electronic device including same
US9450428B2 (en) Package module of battery protection circuit
US10193193B2 (en) Structure of battery protection circuit module package coupled with holder, and battery pack having same
CN101599551B (zh) 电池组
WO2015160112A1 (fr) Cellule de batterie à polymère et dispositif électronique comprenant celle-ci
US20080094032A1 (en) Circuit module
KR20120054338A (ko) 보호회로 모듈
WO2018218658A1 (fr) Composants de protection intégrés à une carte de circuit imprimé
CN112218444B (zh) 电池保护电路封装件及其制造方法
US9590227B2 (en) Protection apparatus of battery pack, method of manufacturing the protection apparatus, and battery pack including the protection apparatus
US11605959B2 (en) Battery control system-in-package and method of fabricating the same
CN110114868B (zh) 嵌入式保护电路模块
WO2018209595A1 (fr) Dispositif à coefficient de température positif
KR20190010484A (ko) 연계되는 2-차원 포지티브 온도 계수 장치
WO2018120007A1 (fr) Dispositif polymère à coefficient de température positif pour protection de cellule de batterie
KR101582952B1 (ko) 배터리 보호회로 패키지 및 배터리 팩
KR20210105213A (ko) 노트북 배터리 보호회로 패키지 및 그 제조 방법
KR20220116694A (ko) 방열성이 우수한 배터리 보호회로 패키지
KR101517544B1 (ko) 배터리팩 및 그 제조방법
KR20150087470A (ko) 배터리 보호회로 모듈 패키지 및 그 제조방법
KR20150010857A (ko) 배터리 보호회로 모듈 패키지를 장착할 수 있는 홀더, 상기 홀더의 제조방법 및 상기 홀더를 이용한 배터리팩의 제조방법
TW201703596A (zh) 具有積體電路晶片封裝與固態電池的印刷電路板組件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17911850

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17911850

Country of ref document: EP

Kind code of ref document: A1