WO2018205863A1 - 化学液体的等离子体处理设备、方法及其在处理污水中的应用 - Google Patents
化学液体的等离子体处理设备、方法及其在处理污水中的应用 Download PDFInfo
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- WO2018205863A1 WO2018205863A1 PCT/CN2018/085196 CN2018085196W WO2018205863A1 WO 2018205863 A1 WO2018205863 A1 WO 2018205863A1 CN 2018085196 W CN2018085196 W CN 2018085196W WO 2018205863 A1 WO2018205863 A1 WO 2018205863A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/48—Treatment of water, waste water, or sewage with magnetic or electric fields
Definitions
- the present disclosure relates to the field of chemical liquid processing technologies, and more particularly to a plasma processing apparatus and method for chemical liquids and their use in treating sewage.
- the plasma is the fourth state of matter, which is an ionized gas composed of a large number of free electrons and ions and which is electrically neutral in its entirety.
- the plasma can generate a large amount of OH ⁇ free radicals during discharge, and OH ⁇ free radicals can induce a series of free radical chain reactions, which can be applied to sewage treatment.
- OH ⁇ free radicals have large-scale chain reaction ability, and the reaction is rapid and non-selective. It can attack various pollutants in water and degrade it into carbon dioxide, water or other mineral salts, which can effectively remove organic matter in sewage, and Will cause secondary pollution.
- Some chemical reactions that cannot be carried out under "tri-state" conditions can be carried out under plasma conditions. Plasma treatment of pollutants has both physical, chemical and biological reactions.
- the treatment of sewage by plasma technology generates a plasma in the sewage and reacts with harmful substances in the sewage.
- the positive and negative electrodes of the plasma generator must overcome the dielectric constant of water to ionize the gas to generate plasma. This process consumes a large amount of electrical energy, resulting in unnecessary loss of electrical energy.
- the positive and negative electrodes of the plasma generator are directly in contact with the sewage, a part of the electric energy is used for heating the sewage liquid after the positive and negative electrodes are energized, so that the plasma is directly ionized in the liquid phase, and the Joule heat is high. The heat conversion is high and the power consumption is high, thereby causing waste of electric energy.
- An object of the present disclosure includes providing a plasma treatment method for a chemical liquid to alleviate the technical problems of high power consumption, high heat conversion, high investment cost, and low reaction efficiency in the prior art plasma treatment liquid.
- the object of the present disclosure also includes providing a processing apparatus by which plasma treatment of a liquid can alleviate high requirements for equipment installation protection, high equipment cost, slow reaction speed, and difficulty in reaction degradation hardening in current processing equipment.
- Technical problems with pollutants are also included in the processing apparatus.
- the present disclosure provides a plasma processing method for a chemical liquid, comprising the steps of:
- the liquid to be treated is atomized and mixed with the plasma to form a gas-liquid mixture, and the plasma in the gas-liquid mixture reacts with the droplets of the liquid to be treated to effect treatment of the liquid.
- Atomization treatment firstly atomizing some of the liquid to be treated to obtain droplet particles
- the droplet particles are mixed with the plasma to form a gas-liquid mixture, and the product obtained by reacting the plasma in the gas-liquid mixture with the droplet of the liquid to be treated is dissolved in the remaining liquid to be treated;
- the atomization and the steps of reacting with the plasma are repeated until all of the liquid to be treated is processed.
- the droplet particles obtained after atomization of the liquid to be treated have a size of 0.2 to 200 ⁇ m.
- the gas source of the plasma includes any one of chemical liquid vapor, air, water vapor, oxygen, nitrogen or carbon dioxide, chlorine gas, sulfur dioxide, methane, and acetylene.
- a processing apparatus for realizing a plasma processing method of the above chemical liquid comprising a container for holding a liquid to be treated, the container being provided with a liquid inlet, a liquid outlet, and an air inlet for connecting the plasma generator
- the container is connected with an atomizer for atomizing the liquid to be treated;
- the liquid outlet is connected to the liquid inlet through a circulation line, and the circulation pipeline is provided with a circulation pump.
- the atomizer is disposed at the liquid outlet.
- the atomizer is disposed at the liquid inlet.
- the atomizer is disposed inside the container and connected to the extension of the circulation line to the inside of the container at the inlet.
- the atomizer is disposed at the bottom of the container.
- the top of the container is provided with a pressure limiting valve for preventing excessive pressure in the container.
- the pressure limiting valve is connected to the steam separator for preventing the loss of liquid components when the exhaust gas is connected.
- the present disclosure also relates to a processing apparatus for realizing a plasma processing method of the above chemical liquid, comprising a first container for holding a liquid to be treated, a second container for generating a gas-liquid mixture, and for atomizing the to-be-processed a nebulizer for treating liquids;
- the first container includes a first liquid inlet and a first liquid outlet
- the second container includes a second liquid inlet and a second liquid outlet; the first liquid outlet and the second liquid inlet
- the port is connected through the first pipe
- the second liquid outlet is connected to the first liquid inlet through the second pipe
- the second pipe is provided with a circulation pump
- the second container further includes an air inlet connected to the plasma generator.
- the atomizer is disposed at the first liquid outlet
- the atomizer is disposed at the second liquid inlet
- the atomizer is disposed at the bottom of the first container
- the atomizer is disposed inside the second container and connected to the inward extension of the first conduit at the second inlet.
- the present disclosure also relates to a processing apparatus for realizing a plasma processing method of the above chemical liquid, comprising a container for holding the liquid to be treated, a plasma generator, the container being provided with a liquid inlet and a liquid outlet
- the plasma generator is provided with an inlet for the entry of the liquid to be treated and an outlet for the outflow of the reaction liquid, the liquid inlet of the container being in communication with an outlet of the plasma generator, the container
- the liquid outlet is connected to the inlet of the plasma generator, and an atomizer for atomizing the liquid to be treated is further disposed between the liquid outlet of the container and the plasma generator.
- the plasma generator includes at least one plasma processing unit, each of the plasma processing units including at least one monolithic processing structure, each of the monolithic processing structures including a relative arrangement An anode plate and a cathode plate, wherein the anode plate and the outside of the cathode plate are respectively provided with a first ceramic material plate and a second ceramic material plate having a microporous structure, the first ceramic material plate, the second The ceramic material plate, the anode plate, and the cathode plate are configured such that the liquid to be treated entering the inlet of the plasma generator can sequentially pass through the first ceramic material plate and the second ceramic material plate.
- the ceramic material for preparing the first ceramic material sheet or the second ceramic material sheet comprises any one of the following materials: 1) silicate ceramics, 2) oxide ceramics such as oxidation Aluminum porcelain, magnesia ceramics, titanium oxide porcelain; 3) non-oxide ceramics such as boron nitride ceramics, silicon carbide ceramics, calcium fluoride porcelain; 4) composite ceramics such as magnesium-aluminum alloys composed of a combination of alumina and magnesia Pyrite porcelain, silicon oxynitride ceramics composed of aluminum oxide and silicon nitride; 5) cermets such as oxide-based cermets, carbide-based cermets, boride-based cermets, etc.; 6) fibers A high-strength, high-toughness ceramic in which ceramics are added with a metal fiber or an inorganic fiber in a ceramic matrix.
- the anode plate and the cathode plate are staggered such that the ionization space between the anode plate and the cathode plate has diagonally disposed inlets and outlets.
- the plasma generator includes a plurality of plasma processing units, and the plurality of plasma processing units are arranged in a matrix in a horizontal and vertical direction, and the liquid inlet ends of the plurality of plasma processing units The direction is the same as the direction of the liquid outlet.
- each of the plasma processing units includes a plurality of the single-chip processing structures, and the plurality of the single-chip processing structures are spaced apart in a liquid flow direction.
- a packaging material for encapsulating the first ceramic material plate and the second ceramic material plate is disposed around each of the plasma processing units in a gas-liquid flow direction.
- An outer side of the encapsulating material is respectively provided with an opposite cathode connecting plate and an anode connecting plate, one end of the anode plate is connected to the anode connecting plate through the encapsulating material, and one end of the cathode plate passes through the encapsulating material Connected to the cathode connecting plate.
- a catalyst for promoting the reaction of the liquid to be treated with the plasma is disposed in the gas-liquid circulation passage in each of the plasma processing units.
- the catalyst comprises one or more of oxides of transition metal elements such as Ti, Mn, Fe, Co, Ni, and the like.
- the plasma generator has a voltage of 2V to 100kV, a current of 0.1A to 100kA, and a frequency of 50Hz to 100KHz.
- the present disclosure also relates to the use of the plasma treatment method of the above chemical liquid for treating sewage.
- the liquid to be treated becomes droplet particles, and then the plasma is introduced.
- the liquid droplet particles to be treated are suspended in the plasma, and the plasma is mixed with the droplet particles to form a dense and
- the stable aerosol forms an air-encapsulated liquid, thereby forming a gas-liquid interface, and reacting the plasma with the liquid to be treated at the gas-liquid interface of the gas-encapsulated liquid, thereby purifying the liquid to be treated.
- the gas-liquid interface in the gas-packed liquid structure increases the specific surface area of the reaction interface, the plasma and the liquid to be treated are formed after the droplet particles and the plasma form a gas-filled liquid structure. The reaction is more efficient.
- the plasma generator does not directly perform reactive ionization in the liquid to be treated, but directly performs plasma excitation on the gas, so that only low electric energy is required to generate the plasma. , thereby reducing the loss of electrical energy.
- the plasma generator and the container for holding the liquid to be treated are communicated through the air inlet on the container, and the electrode portion in the plasma generator does not directly contact the liquid to be treated inside the container. It is isolated from the liquid to be treated.
- the plasma generator excites the gas outside of the vessel and then passes the plasma into the vessel. During this process, only the gas is excited by ionization. Since the ionization excitation directly acts on the gas, the safety protection requirements for energy consumption and plasma equipment are greatly reduced during the treatment.
- the liquid to be treated is atomized by the atomizer, and then introduced into the container from the liquid inlet, mixed with the plasma gas to form an aerosol-type air-pack liquid structure, and reacted on the gas-liquid surface in the gas-filled liquid structure. After the reaction, it enters the inside of the liquid to be treated. Then, the above reaction process is repeated under the action of the recirculation pump, thereby realizing a continuous cyclic interfacial reaction, thereby increasing the reaction efficiency due to an increase in the specific surface area of the reaction, and at the same time degrading the stubborn contaminants in the chemical liquid.
- FIG. 1 is a schematic structural diagram of a processing device according to Embodiment 4 of the present disclosure.
- FIG. 2 is a schematic structural diagram of a processing device according to Embodiment 5 of the present disclosure.
- FIG. 3 is a schematic structural diagram of a processing device according to Embodiment 6 of the present disclosure.
- FIG. 4 is a schematic structural diagram of a processing device according to Embodiment 7 of the present disclosure.
- FIG. 5 is a schematic structural diagram of a processing device according to Embodiment 8 of the present disclosure.
- FIG. 6 is a schematic structural diagram of a processing device according to Embodiment 9 of the present disclosure.
- FIG. 7 is a schematic structural diagram of a chemical liquid plasma processing apparatus according to an embodiment of the present invention.
- FIG. 8 is a schematic diagram showing the arrangement of a plurality of plasma processing units inside a plasma generator of a processing device according to an embodiment of the present invention
- FIG. 9 is a schematic structural diagram of a plasma processing module inside a plasma generator of a processing device according to an embodiment of the present invention.
- FIG. 10 is a schematic structural diagram of a plasma processing unit inside a plasma generator of a processing device according to an embodiment of the present invention
- FIG. 11 is a first longitudinal sectional structural view of a single-piece processing structure of a plasma processing unit inside a plasma generator of a processing apparatus according to an embodiment of the present invention
- FIG. 12 is a schematic cross-sectional view showing a first longitudinal processing structure of a plasma processing unit inside a plasma generator of the processing apparatus provided by the embodiment of FIG.
- Icon 10-container; 101-inlet port; 102-outlet port; 103-inlet port; 110-first container; 111-first inlet port; 112-first outlet port; 120-second Container; 121-second liquid inlet; 122-second liquid outlet; 20-plasma generator; 210-plasma processing unit; 220-cathode connection plate; 230-anode connection plate; 240-monolithic processing structure ; 241 - first ceramic material plate; 242 - second ceramic material plate; 250 - packaging material; 243 - anode plate; 244 - cathode plate; 201 - inlet; 202 - outlet; 30 - atomizer; 40 - circulation pump .
- connection and “connected” are to be understood broadly, and may be, for example, a fixed connection, a detachable connection, or an integral, unless otherwise explicitly defined and defined.
- Ground connection it can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal connection of two components.
- intermediate medium which can be the internal connection of two components.
- One aspect of the present disclosure provides a plasma processing method for a chemical liquid, comprising the steps of:
- the liquid to be treated is atomized and mixed with the plasma to form a gas-liquid mixture, and the plasma in the gas-liquid mixture reacts with the droplets of the liquid to be treated to effect treatment of the liquid.
- the liquid to be treated becomes droplet particles, and then the plasma is introduced.
- the liquid droplet particles to be treated are suspended in the plasma, and the plasma is mixed with the droplet particles to form a dense and
- the stable aerosol forms an air-encapsulated liquid, thereby forming a gas-liquid interface, and reacting the plasma with the liquid to be treated at the gas-liquid interface of the gas-encapsulated liquid, thereby purifying the liquid to be treated.
- the gas-liquid interface in the gas-packed liquid structure increases the specific surface area of the reaction interface, the plasma and the liquid to be treated are formed after the droplet particles and the plasma form a gas-filled liquid structure. The reaction is more efficient.
- the plasma generator does not directly perform reactive ionization in the liquid to be treated, but directly performs plasma excitation on the gas, so that only low electric energy is required to generate the plasma. , thereby reducing the loss of electrical energy.
- Non-limiting chemical liquids in the present disclosure are, for example, papermaking sewage, printing and dyeing sewage, leather sewage, medical sewage or petrochemical sewage.
- the atomization method includes atomizer fogging or micropore fogging or other forms.
- Atomization treatment firstly atomizing some of the liquid to be treated to obtain droplet particles
- the droplet particles are mixed with the plasma to form a gas-liquid mixture, and the product obtained by reacting the plasma in the gas-liquid mixture with the droplet of the liquid to be treated is dissolved in the remaining liquid to be treated;
- the atomization and the steps of reacting with the plasma are repeated until all of the liquid to be treated is processed.
- the size of the droplet particles obtained after atomization of the liquid to be treated is 0.2 to 200 ⁇ m.
- the droplet particles obtained after atomization of the liquid to be treated have a size of 10 to 150 ⁇ m.
- the droplet particles obtained after atomization of the liquid to be treated have a size of 30 to 110 ⁇ m.
- the size of the droplets obtained after atomization of the liquid to be treated is too small, the specific surface area of the gas-liquid interface is large, and the reaction efficiency is obviously increased, but gas-liquid separation is difficult.
- the particle size of the liquid droplet to be treated is too large, and the stability of the droplet particles is poor.
- the large size also affects the reaction between the liquid to be treated and the plasma inside the droplet particles, which is unfavorable for the reaction.
- the achievement of reaction efficiency is maximized by the introduction of droplets of a particular size.
- the gas source of the plasma includes any one of chemical liquid vapor, air, water vapor, oxygen, nitrogen, or carbon dioxide.
- the gas source of the plasma is the liquid vapor to be treated.
- the chemical liquid vapor source can also select steam of other chemical liquids depending on the chemical properties of the liquid to be treated.
- a plasma treatment method for a chemical liquid comprising the steps of:
- a plasma the plasma generated by the excitation of the air in the plasma generator
- Step a) and step b) are repeated until all of the liquid to be treated is completely treated, thereby effecting the treatment of the liquid.
- the liquid to be treated is sewage.
- the plasma generated in the plasma generator reacts with organic substances in the droplet particles of the sewage to form harmless substances such as water or carbon dioxide, thereby achieving the purpose of removing organic substances.
- a plasma treatment method for a chemical liquid comprising the steps of:
- a plasma the plasma generated by the excitation of the air in the plasma generator
- Step a) and step b) are repeated until all of the liquid to be treated is completely treated, thereby effecting the treatment of the liquid.
- the liquid to be treated is sewage.
- the plasma generated in the plasma generator reacts with organic substances in the droplet particles of the sewage to form harmless substances such as water or carbon dioxide, thereby achieving the purpose of removing organic substances.
- a plasma treatment method for a chemical liquid comprising the steps of:
- a plasma the plasma generated by the excitation of the air in the plasma generator
- Step a) and step b) are repeated until all of the liquid to be treated is completely treated, thereby effecting the treatment of the liquid.
- the liquid to be treated is sewage.
- the plasma generated in the plasma generator reacts with organic substances in the droplet particles of the sewage to form harmless substances such as water or carbon dioxide, thereby achieving the purpose of removing organic substances.
- Sewage treatment is carried out using the traditional sewage treatment process Fenton method.
- the plasma is generated directly by the plasma generator in the sewage treatment tank, and the generated plasma reacts with the organic matter in the sewage to achieve the purpose of removing organic matter.
- Example 1 Example 2
- Example 3 Comparative example 1 Power consumption / kW ⁇ h 105 45 78 157 Processing time / min 75 32 45 270
- the power consumption in the examples 1-3 is reduced by more than 33% compared with the power consumption in the comparative example 1, wherein the power consumption in the embodiment 2 is the least, and the power consumption is compared with that of the comparative example 1.
- the amount is reduced by 70%, and thus it can be seen that the treatment method provided by the present disclosure can significantly reduce energy consumption.
- the processing time in Comparative Example 1 was 270 min, and the processing time in Example 1-3 was 32-75 min. From this, it is understood that the processing method provided by the present disclosure can significantly shorten the processing time and improve the processing efficiency.
- the treatment methods in Examples 1-3 are the same, except that the size of the droplet particles obtained after atomization is different. It can be seen from the experimental data in Table 1 that the size of the droplet particles is different, and the liquid to be treated is treated. The processing time and the power consumption during processing have an impact. It can be seen from Table 1 that when the size of the droplet particles of the bubble is 30-110 ⁇ m in Example 2, the treatment effect is the best, and the power consumption and the treatment time are both low.
- a processing apparatus of an embodiment of the present disclosure includes a container 10 for containing a liquid to be treated, and the container 10 is provided with a liquid inlet 101, a liquid outlet 102 and an air inlet 103 for connecting the plasma generator 20; the container 10 is connected with an atomizer 30 for atomizing the liquid to be treated; the liquid outlet 102 passes through the circulation line and the liquid inlet 101 Connected, a circulation pump 40 is provided on the circulation line.
- the plasma generator 20 is in communication with the container 10 for holding the liquid to be treated through the air inlet 103 on the container 10, and the electrode portion in the plasma generator 20 is not in direct contact.
- the liquid to be treated inside the container 10 is isolated from the liquid to be treated.
- the plasma generator 20 energizes and ionizes the gas outside the vessel 10 and then passes into the vessel 10. During this process, only the gas is excited by the plasma. Since the plasma excitation directly acts on the gas, the requirements for energy consumption and plasma equipment safety protection during processing are greatly reduced.
- the liquid to be treated by the atomizer 30 is atomized, and then introduced into the container 10 from the liquid inlet 101, mixed with the plasma gas to generate an aerosol-type gas-filled liquid structure, and the gas-liquid in the gas-filled liquid structure.
- the surface is reacted, and after the reaction, it enters the inside of the liquid to be treated. Then, the above reaction process is repeated under the action of the recirculation pump 40, thereby achieving a continuous cycle interfacial reaction, which further increases the reaction efficiency due to an increase in the specific surface area of the reaction.
- the tip of the plasma generator 20 can also be built directly into the interior of the container 10 containing the liquid to be treated, but does not contact the liquid level, thereby enabling plasma to be introduced into the container 10.
- the liquid inlet 101, the liquid outlet 102, and the air inlet 103 can be disposed at any position on the wall of the container 10 according to the actual processing flow, as long as the corresponding functions can be realized.
- the atomizer 30 is disposed at the liquid outlet 102.
- the atomizer 30 is disposed at the liquid inlet 101.
- the atomizer 30 is disposed inside the container 10 and connected to the extension of the circulation line into the container 10 at the liquid inlet 101.
- the atomizer 30 is disposed at the bottom of the container 10.
- the container 10 is also provided with a pressure limiting valve for preventing excessive pressure in the container 10; and a water vapor separator for preventing loss of liquid components when the pressure limiting valve is connected to the exhausting valve.
- a pressure limiting valve is also provided at the top of the container 10.
- the pressure limiting valve is opened and exhausted.
- a steam separator is provided before flowing through the pressure limiting valve or after the pressure limiting valve.
- a processing apparatus of an embodiment of the present disclosure includes a first container 110 for containing a liquid to be processed, for generating a second container 120 of the gas-liquid mixture and an atomizer 30 for atomizing the liquid to be treated;
- the first container 110 includes a first liquid inlet 111 and a first liquid outlet 112
- the second container 120 includes a second liquid inlet a port 121 and a second liquid outlet 122;
- the first liquid outlet 112 and the second liquid inlet 121 communicate with each other through the first conduit, and the second liquid outlet 122 communicates with the first liquid inlet 111 through the second conduit;
- the first pipe and the second pipe are each provided with a circulation pump 40;
- the second container 120 further includes an air inlet 103 to which the plasma generator 20 is connected.
- the atomizer 30 is disposed at the first liquid outlet 112;
- the atomizer 30 is disposed at the second liquid inlet 121;
- the atomizer 30 is disposed at the bottom of the first container 110;
- the atomizer 30 is disposed inside the second container 120 and connected to the inward extension of the first conduit at the second liquid inlet 121.
- the present embodiment is a processing apparatus including a container 10 for holding a liquid to be treated, the container 10 is provided with a liquid inlet 101, a liquid outlet 102, and a medium for connecting the plasma generator 20.
- the air inlet 103; the container 10 is connected with an atomizer 30 for atomizing the liquid to be treated; the liquid outlet 102 communicates with the liquid inlet 101 through a circulation line, and the circulation line is provided with a circulation pump 40, and the atomizer 30 is arranged At the liquid outlet 102.
- the liquid outlet 102 is located at the bottom of the container 10
- the liquid inlet 101 is located at the top of the container 10
- the air inlet 103 is located at the top of the container 10.
- the treatment process of the liquid to be treated in the above equipment is: the liquid to be treated flows out from the liquid outlet 102 under the action of the circulation pump 40, and the atomization of the atomizer 30 forms small droplets, and then flows to the circulation pump 40.
- the pressure of the circulation pump 40 is driven into the container 10 from the inlet port 101 under pressure.
- the plasma generator 20 injects plasma gas into the container 10 to combine with the small droplets to form an aerosol.
- the plasma and the liquid to be treated in the form of small droplets react at the gas-liquid interface to purify the liquid to be treated.
- the reacted aerosol particles enter the liquid to be treated in the vessel 10. Under the action of the circulation pump 40, the above process is repeated until the liquid to be treated in the vessel 10 is completely purified, and then the operation of the apparatus is stopped.
- the present embodiment is a processing apparatus which is different from the apparatus of Embodiment 4 in that the atomizer 30 is disposed at the liquid inlet 101.
- the treatment process of the liquid to be treated in the above-mentioned equipment is: the liquid to be treated flows out from the liquid outlet 102 to the circulation pump 40 under the action of the circulation pump 40, and is atomized from the liquid inlet 101 by the pressure of the circulation pump 40.
- the atomization of the device 30 forms small droplets which are then injected into the container 10.
- the plasma generator 20 injects plasma gas into the container 10 to combine with the small droplets to form an aerosol.
- the plasma and the liquid to be treated in the form of small droplets react at the gas-liquid interface to purify the liquid to be treated. Thereafter, the reacted aerosol particles enter the liquid to be treated in the vessel 10. Under the action of the circulation pump 40, the above process is repeated until the liquid to be treated in the vessel 10 is completely purified, and then the operation of the apparatus is stopped.
- this embodiment is a processing apparatus, which is different from the apparatus of Embodiment 4 in that the liquid outlet 102 is located at the side wall of the container 10, and the liquid inlet 101 is located at the bottom of the container 10.
- the air inlet 103 is located at the top of the container 10; the atomizer 30 is disposed at the bottom of the container 10.
- the treatment process of the liquid to be treated in the above apparatus is: in this embodiment, the atomizer 30 is disposed inside the container 10, and the atomization droplets are generated on the surface of the liquid to be treated by the vibration of the atomizer 30.
- the plasma generator 20 injects plasma gas into the container 10 to combine with the atomized droplets to form an aerosol.
- the plasma and the liquid to be treated in the form of atomized droplets react at the gas-liquid interface to purify the liquid to be treated.
- the atomized droplets after the reaction flow out through the liquid outlet 102 to the circulation pump 40 under the action of the circulation pump 40, and are re-entered into the container 10 from the liquid inlet 101 by the pressure of the circulation pump 40. in.
- this embodiment is another processing apparatus of the structure, including a first container 110 for holding a liquid to be treated, a second container 120 for generating a gas-liquid mixture, and for atomizing to be processed.
- a liquid atomizer 30 the first container 110 includes a first liquid inlet 111 and a first liquid outlet 112, and the second container 120 includes a second liquid inlet 121 and a second liquid outlet 122; the first liquid outlet 112 is connected to the second liquid inlet 121 through the first pipe, the second liquid outlet 122 is connected to the first liquid inlet 111 through the second pipe; the first pipe and the second pipe are provided with an increase pump;
- the second container 120 further includes an air inlet 103 to which the plasma generator 20 is connected, and the atomizer 30 is disposed at the first liquid outlet 112.
- the treatment process of the liquid to be treated in the above-mentioned equipment is: the liquid to be treated flows out from the first liquid outlet 112 of the first container 110 by the circulation pump 40, and the atomization by the atomizer 30 forms small droplets.
- the flow to the circulation pump 40 is then injected into the second container 120 from the second inlet 121 of the second container 120 under the pressure of the circulation pump 40.
- the plasma generator 20 injects plasma gas into the second container 120 to combine with the small droplets to form an aerosol.
- the plasma and the liquid to be treated in the form of small droplets react at the gas-liquid interface to purify the liquid to be treated.
- the reacted aerosol particles flow out from the second liquid outlet 122 in the second container 120 by the circulation pump 40, and enter the liquid to be treated of the first container 110 through the first liquid inlet 111.
- the present embodiment is a processing apparatus which is different from the apparatus of Embodiment 7 in that the atomizer 30 is disposed at the second liquid inlet 121.
- the treatment process of the liquid to be treated in the above equipment is: the liquid to be treated flows out from the first liquid outlet 112 under the action of the circulation pump 40, and flows to the second liquid inlet 121 under the pressure of the circulation pump 40, in the second
- the liquid inlet 121 is atomized by the atomizer 30 to form small droplets, which are then injected into the second container 120.
- the plasma generator 20 injects plasma gas into the container 10 to combine with the small droplets to form an aerosol.
- the plasma and the liquid to be treated in the form of small droplets react at the gas-liquid interface to purify the liquid to be treated.
- the reacted aerosol particles flow out from the second liquid outlet 122 in the second container 120 by the circulation pump 40, and enter the liquid to be treated of the first container 110 through the first liquid inlet 111.
- the present embodiment is a processing apparatus which is different from the apparatus of Embodiment 7 in that the atomizer 30 is disposed at the bottom of the first container 110.
- the processing of the liquid to be treated in the above apparatus is as follows:
- the atomizer 30 is disposed inside the first container 110, and the atomized liquid droplet is generated on the surface of the liquid to be treated by the vibration of the atomizer 30.
- the atomized droplets flow out from the first liquid outlet 112 by the circulation pump 40, and enter the second container 120 through the second liquid inlet 121.
- the plasma generator 20 injects plasma gas into the container 10 to combine with the small droplets to form an aerosol.
- the plasma and the liquid to be treated in the form of small droplets react at the gas-liquid interface to purify the liquid to be treated.
- the reacted aerosol particles flow out from the second liquid outlet 122 in the second container 120 by the circulation pump 40, and enter the liquid to be treated of the first container 110 through the first liquid inlet 111.
- Some embodiments of the present disclosure are also directed to a processing apparatus of a processing apparatus that implements the plasma processing method of the above chemical liquid, as shown in FIG. 7, which includes a container 10 for holding a liquid to be treated, and a plasma generator 20
- the container 10 is provided with a liquid inlet 101 and a liquid outlet 102.
- the plasma generator 20 is provided with an inlet for the liquid to be treated and an outlet for the reaction liquid to flow out, and the inlet 101 of the container 10 is connected to the plasma.
- the outlet of the device 20, the liquid outlet 102 of the container 10 is connected to the inlet of the plasma generator 20, and the atomizer 30 for atomizing the liquid to be treated is further disposed between the liquid outlet of the container 10 and the plasma generator 20.
- the atomization process of the liquid to be treated by the atomizer 30 is carried out, and the inlet of the plasma generator 20 is introduced into the plasma generator 20 to be mixed with the plasma gas generated in the plasma gas generator 20 to generate an aerosol-type gas-filled liquid structure. And reacting on the gas-liquid surface in the air-packing liquid structure, and the reacted product exiting the plasma generator 20 enters the inside of the liquid to be treated in the container 10 through the liquid inlet 101, and then functions as a circulation pump 40. Then, the above reaction process is repeated to achieve a continuous cyclic interfacial reaction, and the reaction efficiency is improved by an increase in the specific surface area of the reaction.
- the liquid inlet 101 and the liquid outlet 102 can be disposed at any position on the wall of the container 10 according to the actual processing procedure, as long as the corresponding functions can be realized.
- the atomizer 30 is disposed at the liquid outlet 102.
- the atomizer 30 is disposed at the inlet of the plasma generator 20.
- the atomizer 30 is disposed on a pipe connecting the liquid outlet 102 and the inlet of the plasma generator 20.
- the atomizer 30 is disposed at the bottom of the container 10.
- the pressure inside the container 10 is continuously increased.
- the top of the container 10 is also provided with a pressure limiting valve.
- the pressure limiting valve is opened and vented.
- a steam separator is provided before flowing through the pressure limiting valve or after the pressure limiting valve. When venting, the liquid component is first recovered by a steam separator, and then the gas is discharged.
- plasma generator 20 includes at least one plasma processing unit 210, each plasma processing unit 210 including at least one monolithic processing structure 240.
- the plasma generator 20 includes a plurality of plasma processing units 210 arranged in a matrix in the horizontal and vertical directions, the direction of the liquid inlet ends of the plurality of plasma processing units 210, and The direction of the liquid outlet is the same. That is, the plasma generator 20 has a casing (not shown), the casing has an inlet and an outlet, and a plurality of plasma processing units 210 arranged in a matrix in the horizontal and vertical directions are disposed in the casing, and the droplets are atomized from the casing.
- the inlet inlet of the body is processed by the plurality of plasma processing units 210 so that the droplets can be sufficiently mixed with the plasma generated in the casing of the plasma generator 20 to generate an aerosol-type gas-filled liquid structure, and the gas-filled liquid structure The gas-liquid surface in the reaction is reacted.
- the plurality of plasma processing units 210 are arranged in a matrix in the horizontal and vertical directions, so that the droplets can be sufficiently reacted, and the processing efficiency is high.
- the plurality of plasma processing units 210 of the entire matrix arrangement may be divided into a plurality of processing modules in a vertical direction, as shown in FIG. 9, one of the processing modules, each of which is uniform in the direction of material flow.
- a plurality of plasma processing units 210 are provided at intervals.
- each plasma processing unit 210 includes a plurality of monolithic processing structures 240 that are spaced apart in the direction of liquid flow, i.e., into the plasma generator 20.
- the droplets of the reaction liquid can sequentially pass through the plurality of monolithic treatment structures 240 to achieve an adequate reaction to the droplets.
- each of the monolithic processing structures 240 includes opposing anode plates 241 and cathode plates 242, which may be placed into the monolithic processing structure 240 by the arrangement of the anode plates 241 and the cathode plates 242, in accordance with some embodiments.
- the gas source can be efficiently ionized into a plasma in the case where the anode plate 241 and the cathode plate 242 are energized, and the plasma can be combined with and reacted with the incoming droplets of the liquid to be reacted.
- the outer sides of the anode plate 241 and the cathode plate 242 are respectively provided with a first ceramic material plate 243 and a second ceramic material plate 244 having a microporous structure, a first ceramic material plate 243, a second ceramic material plate 244, an anode plate 241, and a cathode.
- the plate 242 is configured such that the liquid to be treated entering the inlet of the plasma generator 20 can pass through the first ceramic material plate 243 and the second ceramic material plate 244 in sequence, so that the plasma can be in the first ceramic material plate 243 and the second ceramic material.
- the surface of the plate 244 and the pore structure are sufficiently contacted and reacted to further make the reaction more complete and the effect is more desirable.
- the droplets first combine with the plasma on the surface of the first ceramic material plate 243 and react, and finally flow downward, through the space between the anode plate 241 and the cathode plate 242, and the second ceramic material plate 244, in the first The reaction continues on the second ceramic material sheet 244 and proceeds to the next monolithic processing structure 240.
- the first ceramic material plate 243 and the second ceramic material plate 244 each have a thickness of 0.1 mm to 3 mm.
- the gap between the anode plate 241 and the cathode plate 242 is 0.1 to 5 mm.
- the above range values may be adjusted according to the actual reaction effect.
- the ceramic material of the ceramic material sheet for preparing the first ceramic material sheet 243 or the second ceramic material sheet 244 comprises any one of the following materials: 1) silicate ceramics, 2) oxide ceramics such as alumina ceramics. , magnesia ceramics, titanium oxide porcelain; 3) non-oxide ceramics such as boron nitride ceramics, silicon carbide ceramics, calcium fluoride porcelain; 4) composite ceramics such as magnesium-aluminum spinel composed of a combination of alumina and magnesia Porcelain, silicon oxynitride ceramics composed of aluminum oxide and silicon nitride; 5) cermets such as oxide-based cermets, carbide-based cermets, boride-based cermets, etc.; 6) fiber-reinforced ceramics A high strength, high toughness ceramic formed by adding metal fibers or inorganic fibers to a ceramic matrix.
- the anode plate 241 and the cathode plate 242 are staggered such that the ionization space between the anode plate 241 and the cathode plate 242 has diagonally disposed inlets and outlets.
- the above structure is arranged such that the droplet-incorporating plasma-incorporated gas-in-liquid structure entering the plasma processing unit 210 can sequentially pass through the zigzag processing structure 240, thereby enabling the gas and droplets and the mixed gas-filled liquid structure to be obtained. From one end of the first ceramic material plate 243 and the second ceramic material plate 244 to the other end, the reaction can be sufficiently performed to make the degree of uniformity higher and the reaction effect better.
- a packaging material 250 for encapsulating the first ceramic material plate 243 and the second ceramic material plate 242 is disposed around each of the plasma processing units 210 in the gas-liquid flow direction, and the outer sides of the packaging material 250 are respectively disposed.
- One end of the anode plate 241 is connected to the anode connection plate 230 through the encapsulation material 250, and one end of the cathode plate 242 is connected to the cathode connection plate 220 through the encapsulation material 250.
- the plurality of monolithic processing structures 240 can be surrounded by the encapsulating material to allow the reacted gas and liquid as well as the gas-liquid mixture to flow in a particular direction.
- the plurality of plasma processing units 210 of the same processing module share a cathode connecting plate 220 and an anode connecting plate 230, thereby making the connection structure simpler, and the anode plate in each plasma processing unit 210.
- Both the 241 and the cathode plate 242 are connected to the anode connecting plate 242 via a connecting bolt and a cathode connecting plate 241.
- a catalyst for promoting the reaction of the liquid to be treated with the plasma is disposed in the gas-liquid flow passage in each of the plasma processing units 210.
- the catalyst may be disposed in a gap between adjacent two monolithic processing structures 240 or in a gap between anode plate 241 and cathode plate 242.
- the catalyst comprises one or more of oxides of transition metal elements such as Ti, Mn, Fe, Co, Ni, and the like.
- the plasma generator has a voltage of 2V to 100kV, a current of 0.1A to 100kA, and a frequency of 50Hz to 100KHz.
- the present disclosure also relates to the use of the plasma treatment method of the above chemical liquid for treating sewage.
- the processing apparatus of this embodiment includes a container 10 for holding a liquid to be treated, a plasma generator 20, the container 10 is provided with a liquid inlet 101, a liquid outlet 102, and a plasma generator. 20 is provided with an inlet for the entry of the liquid to be treated and an outlet for the outflow of the reaction liquid, the liquid inlet 101 of the container 10 is in communication with the outlet of the plasma generator 20, and the liquid outlet 102 of the container 10 is connected to the plasma generator 20 The inlet is provided with an atomizer 30 for atomizing the liquid to be treated at the inlet of the plasma generator 20.
- the top of the container 10 is also provided with a pressure limiting valve (not shown). When the pressure in the container 10 is too high, the pressure limiting valve is opened and vented. In order to prevent the loss of liquid components during venting, a steam separator is provided before flowing through the pressure limiting valve or after the pressure limiting valve. When venting, the liquid component is first recovered by a steam separator, and then the gas is discharged.
- the plasma generator 20 includes a plurality of plasma processing units 210 arranged in a matrix in the horizontal and vertical directions, the direction of the liquid inlet end of the plurality of plasma processing units 210, and the liquid discharge end.
- the plasma generator 20 has a casing (not shown) having an inlet and an outlet, and a plurality of plasma processing units 210 arranged in a matrix in the horizontal and vertical directions are disposed in the casing.
- the plurality of plasma processing units 210 arranged in the entire matrix may be divided into a plurality of processing modules in a vertical direction, as shown in FIG. 9, one of the processing modules, each of which is uniform in the direction of material flow.
- a plurality of plasma processing units 210 are provided at intervals.
- each plasma processing unit 210 includes a plurality of single-chip processing structures 240, and a plurality of single-chip processing structures 240 are spaced apart in the liquid flow direction. Further, as shown in FIG. 11, each of the single-chip processing structures 240 includes an anode plate 241 and a cathode plate 242 disposed opposite to each other, and the first ceramic material plate 243 having a microporous structure is respectively disposed outside the anode plate 241 and the cathode plate 242.
- the second ceramic material plate 244, the first ceramic material plate 243, the second ceramic material plate 244, the anode plate 241, and the cathode plate 242 are configured such that the liquid to be treated entering the inlet of the plasma generator 20 can sequentially pass through the first ceramic Material plate 243 and second ceramic material plate 244.
- the first ceramic material plate 243 and the second ceramic material plate 244 each have a thickness of 1 mm.
- the gap between the anode plate 241 and the cathode plate 242 was 1 mm.
- the anode plate 241 and the cathode plate 242 are alternately arranged such that the ionization space between the anode plate 241 and the cathode plate 242 has the inlet 201 and the outlet 202 disposed diagonally.
- An encapsulation material 250 for encapsulating the first ceramic material plate 243 and the second ceramic material plate 242 is disposed around each of the plasma processing units 210 in the gas-liquid flow direction, and the outer sides of the encapsulation material 250 are respectively provided with opposite cathode connections.
- the plurality of plasma processing units 210 of the same processing module share a cathode connecting plate 220 and an anode connecting plate 230, and the anode plate 241 and the cathode plate 242 in each plasma processing unit 210 pass through.
- the connecting bolt and the cathode connecting plate 241 are connected to the anode connecting plate 242.
- the processing of the liquid to be treated in the above apparatus is: in this embodiment, the liquid to be treated is hit by the circulation pump 40 to the atomizer 30, and the liquid to be treated passes through the vibration of the atomizer 30 to act on the liquid to be treated.
- the surface produces atomized droplets.
- the atomized droplets enter from the inlet of the plasma generator 20, and the atomized droplets and gas are carried out in the unit to be treated 210 such that the ionized plasma and the atomized droplets combine to form an aerosol, and in the first ceramic material sheet 243 and The surface and the gap of the second ceramic material plate 244 react and flow, and the plasma and the liquid to be treated in the form of small droplets react at the gas-liquid interface to purify the liquid to be treated, thereby greatly improving the treatment area and the treatment efficiency. Thereafter, the reacted aerosol particles enter the container 10 from the outlet of the plasma generator 20 through the inlet port 101 into the liquid to be treated of the vessel 110.
- the plasma processing method and equipment for chemical liquid of the present disclosure have high work efficiency, low energy consumption, low equipment cost in equipment input, large-scale production, improved reaction efficiency to chemical liquid treatment, and ability to degrade chemical liquid
- the stubborn pollutants in the process can be used in wastewater treatment and are suitable for industrial production.
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Abstract
Description
处理指标 | 实施例1 | 实施例2 | 实施例3 | 对比例1 |
耗电量/kW·h | 105 | 45 | 78 | 157 |
处理时间/min | 75 | 32 | 45 | 270 |
Claims (20)
- 一种化学液体的等离子体处理方法,其特征在于,包括以下步骤:将待处理液体进行雾化处理后与等离子体混合形成气液混合物,所述气液混合物中的所述等离子体与所述待处理液体的雾滴反应,以实现对所述待处理液体的处理。
- 根据权利要求1所述的化学液体的等离子体处理方法,其特征在于,包括以下步骤:雾化处理:先将部分所述待处理液体进行雾化处理,得到所述雾滴颗粒;与所述等离子体反应:将所述雾滴颗粒与所述等离子体混合形成气液混合物,所述气液混合物中的所述等离子体与所述待处理液体的所述雾滴颗粒反应后得到的产物溶于剩余的所述待处理液体中;重复雾化处理以及与等离子体反应的步骤直至全部的所述待处理液体被处理。
- 根据权利要求1或2所述的化学液体的等离子体处理方法,其特征在于,所述待处理液体经雾化后所得的所述雾滴颗粒的粒径尺寸为0.2-200微米,优选10-150微米,更优选30-110微米。
- 根据权利要求1或2所述的化学液体的等离子体处理方法,其特征在于,所述等离子体的气源包括待化学液体蒸汽、空气、水蒸气、氧气、氮气或二氧化碳、氯气、二氧化硫、甲烷、乙炔中的任意一种。。
- 一种实现权利要求1-4任一项所述的化学液体的等离子体处理方法的处理设备,其特征在于,包括用于盛放所述待处理液体的容器,所述容器设有进液口、出液口和用于连通等离子体发生器的进气口;所述容器连接有用于雾化待处理液体的雾化器;所述出液口通过循环管路与所述进液口连通,所述循环管路上设有循环泵。
- 根据权利要求5所述的处理设备,其特征在于,所述雾化器设置于所述出液口处;或,所述雾化器设置于所述进液口处;或,所述雾化器设置于所述容器内部并连接于所述进液口处的所述循环管路向所述容器内延伸的延伸部。
- 根据权利要求5所述的处理设备,其特征在于,所述雾化器设置于所述容器的底部。
- 根据权利要求5-7任一项所述的处理设备,其特征在于,所述容器的顶部设有用于防止容器内压力过高的限压阀;优选地,所述限压阀连接有排气时用于防止液体成分流失的汽水分离器。
- 一种实现权利要求1-4任一项所述的化学液体的等离子体处理方法的处理设备,其特征在于,包括用于盛放所述待处理液体的第一容器、用于生成所述气液混合物的第二容器和用于雾化所述待处理液体的雾化器;所述第一容器包括第一进液口和第一出液口,所述第二容器包括第二进液口和第二出液口;所述第一出液口与所述第二进液口通过第一管道相连通,所述第二出液口与所述第一进液口通过第二管道相连通;所述第一管道和所述第二管道上均设有循环泵;所述第二容器还包括有进气口,所述进气口连接有等离子体发生器。
- 根据权利要求9所述的处理设备,其特征在于,所述雾化器设置于所述第一出液口处;或,所述雾化器设置于所述第二进液口处;或,所述雾化器设置于所述第一容器的底部;或,所述雾化器设置于所述第二容器的内部并与所述第一管道在所述第二进液口处向内的延伸部连接。
- 一种实现权利要求1-4任一项所述的化学液体的等离子体处理方法的处理设备,其特征在于,包括用于盛放所述待处理液体的容器、等离子体发生器,所述容器设有进液口、出液口;所述等离子体发生器设置有用于所述待处理液体进入的进口和用于反应液体流出的出口,所述容器的所述进液口连通于所述等离子体发生器的出口,所述容器的出液口连通于所述等离子体发生器的进口,所述容器的出液口和所述等离子体发生器之间还设置有用于雾化所述待处理液体的雾化器。
- 根据权利要求11所述的处理设备,其特征在于,所述等离子体发生器包括至少一个等离子体处理单元,每个所述等离子体处理单元至少包括一个单片处理结构,每个所述单片处理结构包括相对设置的阳极板和阴极板,所述阳极板和所述阴极板的外侧分别设置有具有微孔结构的第一陶瓷材料板和第二陶瓷材料板,所述第一陶瓷材料板、所述第二陶瓷材料板、所述阳极板和所述阴极板被配置成所述等离子体发生器的进口进入的所述待处理液能够依次通过第一陶瓷材料板和所述第二陶瓷材料板。
- 根据权利要求12所述的处理设备,其特征在于,制备所述第一陶瓷材料板或所述第二陶瓷材料板的陶瓷材料包括以下材料的任意一种:1)硅酸盐陶瓷;2)氧化物陶瓷;3)非氧化物陶瓷;4)复合陶瓷;5)金属陶瓷;6)纤维增强陶瓷。
- 根据权利要求12所述的处理设备,其特征在于,所述阳极板和所述阴极板交错布置,以使得所述阳极板和所述阴极板之间的电离空间具有对角设置的进口和出口。
- 根据权利要求12所述的处理设备,其特征在于,所述等离子体发生器包括多个等离子体处理单元,多个所述等离子体处理单元呈横竖方向的矩阵布置,所述多个等离子 体处理单元的进液端的方向和出液端的方向相同,优选地,每个所述等离子处理单元包括多个所述单片处理结构,多个所述单片处理结构沿液体流通方向间隔设置。
- 根据权利要求15所述的处理设备,其特征在于,每个所述等离子体处理单元的沿气液流动方向的四周均设置有用于封装所述第一陶瓷材料板和所述第二陶瓷材料板的封装材料,所述封装材料的外侧分别设置有相对的阴极连接板和阳极连接板,所述阳极板的一端穿过所述封装材料连接于所述阳极连接板,所述阴极板的一端穿过所述封装材料连接于所述阴极连接板。
- 根据权利要求12-16任一项所述的处理设备,其特征在于,每个所述等离子处理单元内的气液流通通道内设置有用于促进所述待处理液体与所述等离子体反应的催化。
- 根据权利要求15所述的处理设备,其特征在于,所述催化剂包括Ti,Mn,Fe,Co,Ni,等过渡金属元素的氧化物中的一种或多种。
- 根据权利要求12-18任一项所述的处理设备,其特征在于,所述等离子体发生器的电压为2V~100kV、电流为0.1A~100kA、频率为50Hz~100KHz
- 如权利要求1-4中任一项所述的化学液体的等离子体处理方法在处理污水中的应用。
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CN201810345805.8 | 2018-04-17 | ||
CN201810345805.8A CN108455701B (zh) | 2018-04-17 | 2018-04-17 | 等离子体发生器以及化学液的等离子体处理装置及应用 |
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