WO2018205793A1 - 像素界定层及其制造方法、显示基板、显示装置 - Google Patents

像素界定层及其制造方法、显示基板、显示装置 Download PDF

Info

Publication number
WO2018205793A1
WO2018205793A1 PCT/CN2018/082826 CN2018082826W WO2018205793A1 WO 2018205793 A1 WO2018205793 A1 WO 2018205793A1 CN 2018082826 W CN2018082826 W CN 2018082826W WO 2018205793 A1 WO2018205793 A1 WO 2018205793A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
lyophilic
covering
lyophobic
material layer
Prior art date
Application number
PCT/CN2018/082826
Other languages
English (en)
French (fr)
Inventor
宋莹莹
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/323,399 priority Critical patent/US20210288295A1/en
Publication of WO2018205793A1 publication Critical patent/WO2018205793A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • Embodiments of the present invention relate to a pixel defining layer, a method of fabricating the same, a display substrate, and a display device.
  • An Organic Light-Emitting Diode (OLED) display panel includes a film layer of an organic material.
  • an organic material film layer can be fabricated using inkjet printing technology. When the organic material film layer is manufactured by using inkjet printing technology, it is necessary to form a pixel defining layer on the glass substrate, and then eject the solution of the organic light emitting material onto the glass substrate on which the pixel defining layer is formed to form an organic material film layer.
  • the OLED display panel can be fabricated by sequentially forming an anode, a hole injection layer, a hole transport layer, an organic material film layer, an electron transport layer, an electron injection layer, and a cathode on a glass substrate.
  • At least one embodiment of the present disclosure provides a pixel defining layer, a manufacturing method thereof, a display substrate, and a display device to reduce the degree of climbing of a solution on a side surface of a pixel defining layer when ink is ejected, thereby reducing the area within the pixel region.
  • the effect of film formation uniformity is not limited to.
  • At least one embodiment of the present disclosure provides a method of fabricating a pixel defining layer, including:
  • a lyophilic layer on the base substrate, the lyophilic layer comprising an upper surface and a side surface;
  • a lyophobic layer covering at least an upper surface of the lyophilic layer and a surface covering layer covering at least a portion of a side surface of the lyophilic layer, the portion of the side surface being a portion of a side surface of the substrate;
  • the surface covering layer is removed such that at least a portion of the side surface of the substrate substrate is exposed to form a pixel defining layer.
  • the lyophilic layer is attractive to a solution in which an organic electroluminescent material is dissolved, and the lyophobic layer is repellent to a solution in which the organic electroluminescent material is dissolved.
  • the lyophobic layer and the surface covering layer are integrally formed and constitute a surface covering lyophobic layer covering an upper surface and a side surface of the lyophilic layer,
  • the exposed surface layer of the lyophilic material layer is subjected to lyophobic treatment to obtain the surface-covered lyophobic layer.
  • the lyophobic treatment of the exposed surface layer of the lyophilic material layer includes:
  • a reaction coating layer is formed on the exposed surface layer of the lyophilic material layer, and the reaction coating layer is reacted with the lyophilic material layer to obtain the surface-covered lyophobic layer.
  • the lyophobic layer and the surface covering layer are integrally formed and constitute a surface covering lyophobic layer covering an upper surface and a side surface of the lyophilic layer,
  • first lyophilic material layer and a second lyophilic material layer covering the upper surface and the side surface of the first lyophilic material layer, the first lyophilic material layer and the first layer on the base substrate
  • the material of the second lyophilic material layer is different;
  • reaction coating layer for reacting with the second lyophilic material layer on the exposed surface layer of the second lyophilic material layer, and reacting the reaction coating layer with the surface layer of the second lyophilic material layer to form a surface layer Said surface covering the lyophobic layer;
  • first lyophilic material layer and the bottom layer of the second lyophilic material layer not reacted with the reaction coating layer constitute the lyophilic layer.
  • a lyophilic layer is formed on the base substrate, a lyophobic layer covering at least an upper surface of the lyophilic layer, and at least a portion covering the lyophilic layer are formed a surface covering of the side surface, including:
  • first lyophilic material layer and a second lyophilic material layer covering the upper surface of the first lyophilic material layer, the first lyophilic material layer and the second lyophilic liquid on the base substrate
  • the material of the material layer is different;
  • reaction coating layer for reacting with the second lyophilic material layer on the exposed surface layer of the second lyophilic material layer, and reacting the reaction coating layer with at least a surface layer of the second lyophilic material layer;
  • the first lyophilic material layer constitutes the lyophilic layer
  • the second lyophilic material layer after reacting with the reactive coating layer is the lyophobic layer
  • the first lyophilic material a layer and a bottom layer of the second lyophilic material layer not reacting with the reaction coating layer constitute the lyophilic layer, and a surface layer of the second lyophilic material layer after reacting with the reaction coating layer is Lyophilized layer.
  • the second lyophilic material layer is made of silicon dioxide, and the reactive coating layer is made of hydrogen fluoride.
  • the second lyophilic material layer has a thickness of 0.1 to 0.5 ⁇ m.
  • the first lyophilic material layer is made of polyimide.
  • the bare side surface has a height of at least 0.5 microns.
  • a lyophilic layer is formed on the base substrate, a lyophobic layer covering at least an upper surface of the lyophilic layer, and at least a portion covering the lyophilic layer are formed a surface covering of the side surface, including:
  • the exposed surface layer of the lyophilic material layer is subjected to surface lyophobic treatment to form an upper surface covering the lyophilic layer and a lyophobic layer covering a part of the side surface of the lyophilic layer away from the basophilic substrate.
  • the surface covering layer is removed by peeling or etching.
  • the lyophobic layer covers an upper surface of the lyophilic layer and covers a portion of the lyophilic layer away from the substrate Side surface.
  • a side surface of the pixel defining layer includes a liquid-repellent side surface adjacent to the upper surface and a lyophilic side surface away from the upper surface, the lyophilic side surface
  • the ratio to the height of the pixel defining layer is 1/3-2/3.
  • a ratio of a height of the lyophilic side surface to the pixel defining layer is greater than or equal to 1/2 and less than or equal to 2/3.
  • At least one embodiment of the present disclosure also provides a pixel defining layer, which is fabricated by any of the above methods.
  • At least one embodiment of the present disclosure further provides a display substrate comprising: a substrate substrate and a pixel defining layer disposed on the substrate substrate, wherein the pixel defining layer is the pixel defining layer.
  • At least one embodiment of the present disclosure also provides a display device including the above display substrate.
  • Figure 1A is a partial enlarged view of a pixel defining layer
  • FIG. 1B is a schematic diagram showing a manufacturing process of the pixel defining layer shown in FIG. 1A;
  • FIG. 1C is a schematic diagram showing the outline of a pixel corresponding to the pixel defining layer shown in FIG. 1A;
  • FIG. 2 is a flow chart of a method for fabricating a pixel defining layer according to an embodiment of the present invention
  • FIG. 3A is a schematic diagram of forming a lyophilic material layer on a base substrate according to an embodiment of the present invention, and performing lyophobic treatment on the exposed surface layer of the lyophilic material layer to obtain a lyophobic layer covering the upper surface of the lyophilic layer; And a method flow diagram for covering a surface covering layer of a side surface of the lyophilic layer;
  • FIG. 3B is a schematic view showing the structure of forming a lyophilic material layer on a base substrate and forming a surface covering lyophobic layer on the upper surface and the side surface of the lyophilic material layer according to an embodiment of the present invention (a cross-sectional view of the display substrate). ;
  • 4A is a second lyophilic material layer and a second lyophilic material forming a first lyophilic material layer on the base substrate, covering the upper surface and the side surface of the first lyophilic material layer, according to an embodiment of the present invention.
  • a reactive coating layer on the exposed surface layer reacting the reaction coating layer with the surface layer of the second lyophilic material layer to obtain a lyophilic layer, a lyophobic layer covering the upper surface of the lyophilic layer, and a side surface covering the lyophilic layer
  • FIG. 4B is a schematic structural view of a second lyophilic material layer forming a first lyophilic material layer on a base substrate covering the upper surface and the side surface of the first lyophilic material layer according to an embodiment of the invention (display substrate) Sectional view);
  • 4C is a view showing a structure of forming a first lyophilic material layer on a base substrate, covering a second lyophilic material layer on the upper surface and the side surface of the first lyophilic material layer, and a reaction coating layer according to an embodiment of the present invention.
  • Schematic diagram shown a cross-sectional view of the substrate
  • 5A is a second lyophilic material layer on a substrate, a second lyophilic material layer covering the upper surface of the first lyophilic material layer, and a side surface of the first lyophilic material layer, according to an embodiment of the present invention.
  • Surface coating layer and reaction coating layer reacting the reaction coating layer with the surface layer of the second lyophilic material layer to obtain a lyophilic layer, a lyophobic layer covering the upper surface of the lyophilic layer, and a side surface covering the lyophilic layer Flow chart of method for surface covering;
  • FIG. 5B is a view showing a first lyophilic material layer formed on a base substrate, and a second lyophilic material layer covering the upper surface of the first lyophilic material layer, in the first lyophilic material layer, according to an embodiment of the present invention.
  • a surface coating layer formed on the side surface and a surface layer exposed on the second lyophilic material layer form a schematic structural view of the reaction coating layer for reacting with the second lyophilic material layer (a cross-sectional view of the display substrate);
  • 6A is a view showing a layer of forming a lyophilic material on a substrate, forming a surface covering layer on a portion of a side surface of the lyophilic material layer, and performing lyophobic treatment on a surface layer of the lyophilic material layer.
  • FIG. 6B is a view showing a layer of forming a lyophilic material on a base substrate, forming a surface covering layer on a side surface of the lyophilic material layer away from the upper surface thereof, and exposing the lyophilic material layer on the side surface of the lyophilic material layer according to an embodiment of the present invention.
  • Schematic diagram of the layer of lyophobic material formed by the surface layer (a cross-sectional view of the display substrate);
  • FIG. 7A is a schematic structural view of the surface covering layer of FIG. 3B removed by an etching process according to an embodiment of the invention.
  • FIG. 7B is a schematic structural view of the surface covering layer of FIG. 4B removed by an etching process according to an embodiment of the invention
  • FIG. 7C is a schematic view showing the structure of the surface covering layer covering the side surface of the lyophilic layer in FIG. 5B (the second lyophilic material layer is completely converted into a lyophobic layer) according to an embodiment of the present invention
  • FIG. 7D is a schematic structural view of a surface covering layer covering the side surface of the lyophilic layer of FIG. 5B (the second lyophilic material layer is partially converted into a lyophobic layer) according to an embodiment of the present invention
  • FIG. 7E is a schematic structural view showing a surface covering layer formed in the lower half of the side surface of the lyophilic material layer in FIG. 6B after being peeled off according to an embodiment of the present invention
  • FIG. 8 is a schematic diagram showing a set height of a solution in which an organic electroluminescent material is dissolved in an inkjet printing of a display substrate according to an embodiment of the present invention.
  • organic electroluminescent diode displays Compared with liquid crystal displays, organic electroluminescent diode displays have the advantages of self-luminescence, fast response, wide viewing angle, high brightness, colorful color and light weight.
  • the methods for manufacturing the film in organic electroluminescent diodes mainly include evaporation process and solution process. Two.
  • the evaporation process is suitable for film formation of organic small molecular materials, and has the advantages of good film formation uniformity and relatively mature technology.
  • Solution processes include spin coating, ink jet printing, nozzle coating, and screen printing. Due to the high material utilization of inkjet printing technology and the outstanding advantages in the production of large-sized products, it is widely used in the manufacturing process of large-sized organic electroluminescent diode displays.
  • the pixel defining layer is composed of a film layer which is made of a fluorine-containing material, the upper surface of which is lyophobic, and the rest is lyophilic.
  • Figure 1A for a partial enlargement.
  • 1 is a pixel defining layer portion which exhibits lyophobicity
  • 2 is a pixel defining layer portion which exhibits lyophilicity.
  • FIG. 1B for the manufacturing process of the pixel defining layer.
  • a pixel defining material layer 020 is formed on the base substrate 01, and a pixel defining material layer 020 is patterned to form a pixel defining layer 0201, and the pixel defining layer 0201 is baked to obtain a pixel defining layer 0202.
  • Black dots indicate fluorine-containing components in the fluorine-containing material, and the density of black dots indicates the concentration of the fluorine-containing component.
  • the fluorine-containing component moves up to the upper surface of the pixel defining layer under baking.
  • the upper surface of the pixel defining layer is made liquid-repellent, and the rest is lyophilic.
  • the pixel defining layer can be considered to be composed of two laminated film layers, the lower layer is made of a lyophilic material (inorganic or other organic material), and the upper layer is made of a lyophobic fluorine-containing resin material.
  • baking also moves the fluorine-containing component of the fluorine-containing resin material in the upper layer up to the upper surface of the upper layer, so that the upper surface exhibits lyophobicity, and the remaining portion exhibits lyophilicity.
  • the upper surface of the pixel defining layer behaves as lyophobic, the remainder appears to be lyophilic.
  • the liquid repellency of the side surface of the pixel defining layer is insufficient, and therefore, when inkjet printing, the ink has a certain degree of climbing on the side surface of the pixel defining layer (as indicated by a broken line in FIG. 1A), and further
  • the film thickness formed in the pixel region corresponding to the pixel defining layer is less than a predetermined value, the uniformity inside the pixel is not good, and the pixel outline is U-shaped (as shown by the curve in FIG. 1C).
  • the dimensions in Figure 1C are the relative dimensions of the pixels.
  • the pixel defining layer is made of a fluorine-containing resin material, and the fluorine-containing resin material is baked during the manufacturing process, in which the fluorine-containing component in the fluorine-containing resin material is moved up.
  • a fluorine-containing layer having a certain thickness is formed, the fluorine-containing layer has better liquid repellency, and the portion of the pixel defining layer other than the fluorine-containing layer has better lyophilic property.
  • the fluorine-containing component only moves up to the upper portion of the pixel defining layer, with little or no upward movement to the side surface of the pixel defining layer.
  • the lyophobic fluorine-containing layer in the pixel-defining layer repels the solution in which the organic light-emitting material is dissolved to prevent the solution from being ejected into adjacent pixel regions.
  • the lyophilic portion of the pixel defining layer attracts the solution in which the organic luminescent material is dissolved, and the solution has a certain degree of climbing on the side surface when the ink is ejected, thereby affecting the formation of the solution in the pixel region.
  • the film uniformity forms an organic material film layer having a non-uniform thickness in the pixel region.
  • At least one embodiment of the present invention provides a method for fabricating a pixel defining layer. As shown in FIG. 2, the method may include:
  • Step 101 Providing a substrate.
  • Step 102 forming a lyophilic layer on the base substrate, the lyophilic layer comprising an upper surface and a side surface; forming a lyophobic layer covering at least an upper surface of the lyophilic layer and a surface covering at least a portion of the side surface of the lyophilic layer a cover layer, the portion of the side surface being a portion of a side surface adjacent to the base substrate.
  • Step 103 Removing the surface covering layer to expose at least a portion of the side surface of the substrate substrate to form a pixel defining layer.
  • the lyophilic layer is attractive to a solution in which the organic electroluminescent material is dissolved, and the lyophobic layer is repellent to the solution in which the organic electroluminescent material is dissolved.
  • a method for fabricating a pixel defining layer by forming a lyophilic layer on a substrate, forming a lyophobic layer covering at least an upper surface of the lyophilic layer, and covering at least a portion of a side surface of the lyophilic layer Surface coating layer, and removing the surface covering layer, so that at least a part of the side surface of the lyophilic layer close to the substrate substrate is exposed, so that the manufactured pixel defining layer includes a lyophobic layer, and the upper surface and the side surface of the lyophobic layer are both
  • the solution in which the organic electroluminescent material is dissolved is repulsive such that the side surface of the pixel defining layer includes a liquid-repellent side surface having lyophobic properties, which reduces the climbing of the solution on the side surface of the pixel defining layer when ink is ejected. To the extent that the effect on film formation uniformity in the pixel region is reduced.
  • the upper surface and the side surface are in contact, and the side surface includes a portion that is in contact with the upper surface and a portion that is away from the upper surface.
  • the base substrate may be a substrate made of a light-guided and non-metallic material having at least one of glass, silicon wafer, quartz, plastic, and the like, which is generally a transparent substrate.
  • the material of the base substrate is glass.
  • a process of forming a lyophilic layer on the base substrate, forming a lyophobic layer covering at least the upper surface of the lyophilic layer, and covering a surface covering layer covering at least a portion of the side surface of the lyophilic layer may be In the embodiment of the present invention, the following four ways are taken as an example to describe the forming process.
  • a lyophilic material layer is formed on the base substrate, and the exposed surface layer of the lyophilic material layer is subjected to lyophobic treatment to obtain a lyophobic layer covering at least the upper surface of the lyophilic layer and covering the lyophilic layer.
  • a surface covering layer of a portion of the side surface can include:
  • Step 1021a forming a lyophilic material layer on the base substrate.
  • the lyophilic material layer may be made of polyimide (PI), or may be made of a material that is attractive to a solution in which an organic electroluminescent material is dissolved, such as silicon dioxide or silicon nitride. Made of at least one.
  • PI polyimide
  • the lyophilic material layer may be made of polyimide (PI), or may be made of a material that is attractive to a solution in which an organic electroluminescent material is dissolved, such as silicon dioxide or silicon nitride. Made of at least one.
  • the lyophilic material layer is made of PI
  • a layer of PI having a certain thickness may be coated on the base substrate to obtain a PI film layer, and then the PI film layer is subjected to exposure, development, baking, and the like to obtain A layer of lyophilic material with a certain pattern.
  • the lyophilic material layer is made of at least one of inorganic lyophilic materials such as silicon dioxide and silicon nitride, magnetron sputtering, thermal evaporation, or plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical) may be employed.
  • Vapor Deposition (PECVD) and other methods deposit a layer of lyophilic material with a certain thickness on the substrate to obtain a lyophilic material film layer, and then process the lyophilic material film layer by a patterning process to obtain a lyophilic material with a certain pattern.
  • PECVD Vapor Deposition
  • Step 1022a Perform lyophobic treatment on the exposed surface layer of the lyophilic material layer to obtain a lyophilic layer and a surface covering lyophobic layer covering the upper surface and the side surface of the lyophilic layer.
  • the lyophobic layer and the surface covering layer are integrally formed and constitute a surface covering lyophobic layer covering the upper surface and the side surface of the lyophilic layer.
  • the process of lyophobic treatment of the exposed surface layer of the lyophilic material layer may include:
  • a reaction coating layer is formed on the exposed surface layer of the lyophilic material layer, and the reaction coating layer is reacted with the lyophilic material layer to obtain a surface-covered lyophobic layer comprising a lyophobic layer and a surface covering layer.
  • a lyophobic material layer is formed on the exposed surface layer of the lyophilic material layer, the lyophobic material layer is made of a lyophobic material layer, and the lyophobic material layer formed is a surface covering lyophobic layer, the surface covering the lyophobic layer Includes a lyophobic layer and a surface covering.
  • the material of the reaction coating layer may be sprayed on the exposed surface layer of the lyophilic material layer to form a reaction coating having a certain thickness, and the reaction coating layer reacts with the lyophilic material layer to obtain a lyophobic property.
  • the lyophobic material may be a material such as fluorinated polymethyl methacrylate or polysiloxane which is repulsive to a solution in which an organic electroluminescent material is dissolved.
  • FIG. 3B illustrates a method of forming a lyophilic material layer 012 on a substrate 011 and forming a surface on a substrate 011 on which a lyophilic material layer 012 is formed.
  • the surface covering lyophobic layer 013 covers the layers of the upper surface and the side surface of the lyophilic material layer 012.
  • the surface covering lyophobic layer 013 includes a lyophobic layer 01301 and a surface covering layer 01302.
  • the range of the thickness of the lyophilic material layer 012 and the surface-covering lyophobic layer 013 can be set according to actual needs, which is not limited by the embodiment of the present invention.
  • a first lyophilic material layer is formed on the base substrate, a second lyophilic material layer covering the upper surface and the side surface of the first lyophilic material layer, and a reaction layer coated with the exposed surface layer of the second lyophilic material layer.
  • the reaction coating is reacted with a surface layer of the second lyophilic material layer to obtain a lyophilic layer, a lyophobic layer covering at least the upper surface of the lyophilic layer, and a surface covering layer covering a part of the side surface of the lyophilic layer, such as shown in FIG. 4A, the process can include:
  • Step 1021b sequentially forming a first lyophilic material layer and a second lyophilic material layer covering the upper surface and the side surface of the first lyophilic material layer on the base substrate.
  • the first lyophilic material layer may be made of at least one of materials which are attractive to a solution in which the organic electroluminescent material is dissolved, such as PI, silicon dioxide, and silicon nitride, and the second lyophilic material layer It may also be made of at least one of materials which are attractive to a solution in which the organic electroluminescent material is dissolved, such as PI, silicon dioxide, silicon nitride, or the like, and the material of the second lyophilic material layer is first
  • the material of the lyophilic material layer is different.
  • the thickness of the second lyophilic material layer may be from 0.1 ⁇ m to 0.5 ⁇ m, but is not limited thereto.
  • the first lyophilic material layer is made of PI
  • the second lyophilic material layer may be made of silicon dioxide.
  • step 1021a Forming a first lyophilic material layer on the base substrate, and forming a second lyophilic material layer covering the upper surface and the side surface of the first lyophilic material layer on the base substrate on which the first lyophilic material layer is formed
  • the process of forming the lyophilic material layer on the substrate substrate in step 1021a can be referred to correspondingly, and details are not described herein again.
  • Step 1022b forming a reaction coating layer for reacting with the second lyophilic material layer on the exposed surface layer of the second lyophilic material layer, and reacting the reaction coating layer with the surface layer of the second lyophilic material layer.
  • the bottom layer of the first lyophilic material layer and the second lyophilic material layer not reacted with the reaction coating layer constitute a lyophilic layer
  • the surface layer of the second lyophilic material layer after reacting with the reaction coating layer is a surface covering lyophobic layer
  • the surface covering lyophobic layer covers the upper surface and the side surface of the lyophilic layer.
  • the surface covering lyophobic layer comprises a surface covering layer and a lyophobic layer.
  • the lyophobic layer and the surface covering layer are integrally formed to constitute a surface covering lyophobic layer.
  • the reactive coating layer may be made of hydrogen fluoride, and an aqueous solution of hydrogen fluoride may be sprayed on the exposed surface layer of the second lyophilic material layer to form a surface.
  • a hydrogen fluoride layer having a certain thickness, the hydrogen fluoride layer being capable of reacting with a lyophilic material layer made of silica, and the contact angle of the silicon fluorochemical formed by the reaction of the two is about 70°, and the organic electroluminescence is dissolved therein.
  • the solution of the material has repellency, and the film layer formed by the fluorochemical formed after the reaction is a layer having lyophobic properties, and the lyophobic layer of the lyophobic property comprises a lyophobic layer and a surface covering layer, and the first lyophilic material The layer and the second lyophilic material layer not reacted with hydrogen fluoride together form a lyophilic layer.
  • an embodiment of the present invention provides a first lyophilic material layer 022 and a top surface and a side surface covering the first lyophilic material layer 022 on a substrate 021.
  • the range of the thickness of the first lyophilic material layer 022 and the second lyophilic material layer 023 may be set according to actual needs, which is not limited by the embodiment of the present invention.
  • the reactive coating layer 050 may be further included on the exposed surface layer of the second lyophilic material layer.
  • the thickness of the reactive coating is very thin.
  • a reaction layer and a second lyophilic material layer may be reacted to obtain a lyophobic layer or a surface-covered lyophobic layer.
  • a first lyophilic material layer, a second lyophilic material layer covering the upper surface of the first lyophilic material layer, and a surface covering layer covering the side surface of the first lyophilic material layer are formed on the base substrate, and Forming a reaction coating layer to react the reaction coating layer with the surface layer of the second lyophilic material layer to obtain a lyophilic layer, a lyophobic layer covering the upper surface of the lyophilic layer, and a surface covering layer covering the side surface of the lyophilic layer, As shown in FIG. 5A, the process can include:
  • Step 1021c sequentially forming a first lyophilic material layer and a second lyophilic material layer covering the upper surface of the first lyophilic material layer on the base substrate.
  • the first lyophilic material layer may be made of at least one of materials which are attractive to a solution in which the organic electroluminescent material is dissolved, such as PI, silicon dioxide, and silicon nitride, and the second lyophilic material layer It may also be made of at least one of materials which are attractive to a solution in which the organic electroluminescent material is dissolved, such as PI, silicon dioxide, silicon nitride, or the like, and the material of the second lyophilic material layer is first The material of the lyophilic material layer is different.
  • step 1021a a process of forming a first lyophilic material layer on a base substrate, and a process of forming a second lyophilic material layer covering the upper surface of the first lyophilic material layer on the base substrate on which the first lyophilic material layer is formed,
  • the process of forming a layer of lyophilic material on the substrate in step 1021a can be referred to correspondingly, and details are not described herein again.
  • Step 1022c forming a surface covering layer on a side surface of the first lyophilic material layer.
  • the formed surface covering layer can block the side surface of the first lyophilic material layer to facilitate the first lyophilic material layer when the second lyophilic material layer covering the upper surface of the first lyophilic material layer is processed.
  • the side surfaces are not affected by the process.
  • the material of the surface covering layer can be determined according to the treatment of the second lyophilic material layer, as long as the treatment does not affect the surface covering layer. For example, when the second lyophilic material layer is treated to form a reaction coating on the second lyophilic material layer, and the reaction coating layer is reacted with the second lyophilic material layer, the surface coating layer is not reacted with the reaction layer. The coating reacts with the material.
  • the material of the surface covering layer is an inorganic material
  • a layer of inorganic material having a certain thickness may be deposited on the substrate substrate on which the second lyophilic material layer is formed by magnetron sputtering, thermal evaporation or PECVD.
  • a surface covering film layer is obtained, and then the surface covering film layer is processed by a patterning process to obtain a surface covering layer having a pattern such that the surface covering layer covers the side surface of the first lyophilic material layer.
  • the surface covering layer may cover only the side surface of the first lyophilic material layer, but is not limited thereto.
  • the surface covering layer may cover a location other than the second lyophilic material layer, for example, the location includes a location between a side surface of the first lyophilic material layer and an adjacent first lyophilic material layer.
  • the material of the surface covering layer is an organic material
  • an organic material having a certain thickness may be coated on the base substrate on which the second lyophilic material layer is formed, a surface covering film layer is obtained, and then the surface covering film is applied.
  • the layer is subjected to exposure, development, baking, and the like to obtain a surface covering layer having a pattern such that the surface covering layer covers the side surface of the first lyophilic material layer.
  • Step 1023c forming a reaction coating layer for reacting with the second lyophilic material layer on the exposed surface layer of the second lyophilic material layer, and reacting the reaction coating layer with the surface layer of the second lyophilic material layer.
  • the bottom layer of the first lyophilic material layer and the second lyophilic material layer not reacted with the reaction coating layer constitute a lyophilic layer
  • the surface layer of the second lyophilic material layer after the reaction with the reaction coating layer is a lyophobic layer.
  • the lyophobic layer covers the upper surface of the lyophilic layer and covers a portion of the side surface of the lyophilic layer near the upper surface.
  • step 1022b in the process of forming a reaction coating layer for reacting with the second lyophilic material layer in the exposed surface layer of the second lyophilic material layer, and reacting the reaction coating layer with the surface layer of the second lyophilic material layer, reference may be made to step 1022b. The implementation process is not repeated here.
  • a first lyophilic material layer 032 is formed on a substrate 031, and a second lyophilic layer covering the upper surface of the first lyophilic material layer 032 is provided.
  • the material layer 033, the surface covering layer 034 formed on the side surface of the first lyophilic material layer 032, and the surface layer exposed in the second lyophilic material layer 033 form a reaction coating layer 035 for reacting with the second lyophilic material layer 033.
  • the range of the thickness of the first lyophilic material layer 032, the second lyophilic material layer 033, the surface covering layer 034, and the reaction coating layer 035 can be set according to actual needs, which is not limited by the embodiment of the present invention.
  • the second lyophilic material layer 033 covers only the upper surface of the first lyophilic material layer 032.
  • the surface covering layer 034 is formed on the side surface of all of the first lyophilic material layer 032.
  • a lyophilic material layer is formed on the base substrate, a surface covering layer is formed on the lower half of the side surface of the lyophilic material layer, and the exposed surface layer of the lyophilic material layer is subjected to lyophobic treatment to obtain a pro a liquid layer, a lyophobic layer covering at least an upper surface of the lyophilic layer, and a surface covering layer covering a part of the side surface of the lyophilic layer, as shown in FIG. 6A, the process may include:
  • Step 1021d forming a lyophilic material layer on the base substrate.
  • the lyophilic material layer may be made of at least one of materials which are attractive to a solution in which an organic electroluminescent material is dissolved, such as PI, silicon dioxide, and silicon nitride.
  • the process of forming a layer of the lyophilic material on the substrate may be referred to the process of forming a layer of the lyophilic material on the substrate in step 1021a, and details are not described herein again.
  • Step 1022d forming a surface covering layer on a portion of the side surface of the lyophilic material layer.
  • the portion of the side surface is a portion of the side surface away from the upper surface.
  • a portion of the side surface of the lyophilic material layer may be a portion of the lyophilic material layer having a certain height from the substrate substrate, for example, a height of 0.5 ⁇ m.
  • the process of forming a surface covering layer on a portion of the side surface of the lyophilic material layer may refer to the process of forming a surface covering layer on the side surface of the first lyophilic material layer in step 1022c, which will not be described herein.
  • Step 1023d Perform surface lyophobic treatment on the exposed surface layer of the lyophilic material layer, so that the exposed surface layer of the lyophilic material layer forms a lyophobic layer, and the lyophilic material layer does not expose the bottom layer to form a lyophilic layer.
  • a lyophilic layer and a lyophobic layer covering at least the upper surface of the lyophilic layer can be formed on the base substrate.
  • the lyophobic layer may cover the upper surface of the lyophilic layer and cover at least a portion of the side surface that is in contact with the upper surface.
  • the process of lyophobic treatment of the exposed surface layer of the lyophilic material layer may include: forming a reaction coating on the exposed surface layer of the lyophilic material layer, and reacting the reaction coating layer with the lyophilic material layer to obtain a lyophobic layer .
  • the lyophobic treatment may form a surface covering lyophobic layer to cover the upper surface and all of the side surfaces of the lyophilic layer, and the surface covering lyophobic layer may include a lyophobic layer and a surface covering layer.
  • a lyophobic material layer is formed on the exposed surface layer of the lyophilic material layer, the lyophobic material layer is made of a lyophobic material layer, and the lyophobic material layer formed is a surface covering lyophobic layer, the surface covering the lyophobic layer A lyophobic layer and a surface covering layer may be included.
  • a portion of the surface of the lyophilic material layer 042 on the side surface of the lyophilic material layer 042 is formed on the surface of the lyophilic material layer 042.
  • the range of the thickness of the lyophilic material layer 042, the surface covering layer 043, and the lyophobic material layer 044 can be set according to actual needs, which is not limited in the embodiment of the present invention.
  • the process of removing the surface covering layer and leaving the side surface of the lyophilic layer away from at least a portion of the upper surface may include: removing the surface covering layer by peeling, or removing the surface covering by an etching process.
  • Floor For example, the height of the side surface exposed by removing the surface covering layer may be 0.5 micrometers.
  • the etching process can be a dry etching process.
  • the two methods of removal can be selected according to the actual situation. For example, when the lyophobic treatment is to react the side surface of the lyophilic layer with the reaction coating, or the lyophobic treatment is to react with the second lyophilic material layer covering the upper surface and the side surface of the first lyophilic material layer and the reaction coating layer
  • the surface covering layer covering the side surface of the lyophilic layer may be removed; when the surface covering layer is formed on the side surface of the first lyophilic material layer, the reaction coating layer and the second lyophilic material layer are further formed.
  • the surface layer reaction, or a surface covering layer is formed on a side surface of the lyophilic material layer away from the upper surface, and when the exposed surface layer of the lyophilic material layer is subjected to lyophobic treatment, the peeling method may be selected to remove the covering pro a surface covering layer of the side surface of the liquid layer.
  • FIG. 7A is a schematic structural view after removing the surface covering layer in FIG. 3B by an etching process.
  • a lyophobic material layer 013 is formed on the surface layer of the lyophilic material layer 012 in FIG. 3B, and the surface covering layer is a lyophobic material layer 013 at a certain height on the side surface of the lyophilic material layer 012, for example, a height of 0.5 ⁇ m.
  • the lyophilic material layer 012 is the lyophilic layer 014 in the pixel defining layer shown in FIG. 7A
  • the lyophobic material layer 013 remaining after the etching is the lyophobic layer in the pixel defining layer shown in FIG. 7A. 015.
  • the lyophilic layer 014 includes an upper surface S1 and a side surface S2.
  • the pixel defining layer PDL includes an upper surface TS and a side surface SS
  • the side surface SS of the pixel defining layer PDL includes an adjacent liquid-repellent side surface 001 and a lyophilic side surface 002.
  • the lyophobic side surface 001 is farther away from the base substrate 011 than the lyophilic side surface 002.
  • the lyophobic side surface 001 is closer to the upper surface TS than the lyophilic side surface 002.
  • the upper surface TS of the pixel defining layer PDL is the lyophobic surface 003.
  • the ratio of the height H1 of the lyophilic side surface 002 in the direction perpendicular to the base substrate 011 to the height H0 of the pixel defining layer PDL in the direction perpendicular to the base substrate 011 is less than or equal to 2/3.
  • the ratio of the height H1 of the lyophilic side surface 002 in the direction perpendicular to the base substrate 011 to the height H0 of the pixel defining layer PDL in the direction perpendicular to the base substrate 011 ranges from 1/3 to 2/3, Further for example, the ratio is greater than or equal to 1/2 and less than or equal to 2/3.
  • the lyophobic layer 015 includes a top lyophobic layer 0151 on the upper surface of the lyophilic layer 014 and a side lyophobic layer 0152 on a portion of the side surface of the lyophilic layer 014 near the upper surface.
  • FIG. 7B is a schematic structural view after removing the surface covering layer in FIG. 4B by an etching process.
  • the upper surface and the side surface of the first lyophilic material layer 022 in FIG. 4B form a second lyophilic material layer 023, and the second lyophilic material layer 023 portion reacts with the reaction coating layer, after the reaction
  • the surface layer of the lyophilic material layer 023 is a lyophobic layer, and the lyophobic layer is at a certain height on the side surface of the lyophilic material layer 012, for example, a portion of the film layer having a height of 0.5 ⁇ m is a surface covering layer, after the etching process,
  • the lyophilic material layer 022 and the bottom layer 0230 of the second lyophilic material layer 023 which is not reacted with the reaction coating layer constitute the lyophilic layer 024 in the pixel defining layer shown in FIG. 7B, and the remaining lyophobic layer is etched
  • FIG. 7C is a schematic structural view after peeling off the surface covering layer 034 of FIG. 5B covering the side surface of the lyophilic layer.
  • the upper surface of the first lyophilic material layer 032 in FIG. 5B forms a second lyophilic material layer 033, and the second lyophilic material layer 023 is all reacted with the reaction coating layer, and the second lyophilic solution after the reaction
  • the material layer 033 is expressed as lyophobic.
  • the first lyophilic material layer 032 is the lyophilic layer 036 in the pixel defining layer shown in FIG. 7C, and the second lyophilic material layer 033 after the reaction is shown.
  • the pixel shown in 7C defines the lyophobic layer 037 in the layer.
  • the pixel defining layer PDL includes an upper surface TS and a side surface SS
  • the side surface SS of the pixel defining layer PDL includes an adjacent liquid-repellent side surface 001 and a lyophilic side surface 002.
  • the lyophobic side surface 001 is farther away from the base substrate 011 than the lyophilic side surface 002.
  • the lyophobic side surface 001 is closer to the upper surface TS than the lyophilic side surface 002.
  • the upper surface TS of the pixel defining layer PDL is the lyophobic surface 003.
  • the ratio of the height H1 of the lyophilic side surface 002 in the direction perpendicular to the base substrate 011 to the height H0 of the pixel defining layer PDL in the direction perpendicular to the base substrate 011 is less than or equal to 2/3.
  • the ratio of the height H1 of the lyophilic side surface 002 in the direction perpendicular to the base substrate 011 to the height H0 of the pixel defining layer PDL in the direction perpendicular to the base substrate 011 ranges from 1/3 to 2/3, Further for example, the ratio is greater than or equal to 1/2 and less than or equal to 2/3.
  • FIG. 7D is a schematic diagram of a pixel defining layer fabricated by a method according to an embodiment of the present disclosure.
  • the lyophobic layer 37 includes a top lyophobic layer 371 and a side lyophobic layer 372.
  • the side surface SS, the lyophobic side surface 001, the lyophilic side surface 002, and the height setting of the lyophilic side surface 002, etc. reference may be made to the description of FIG. 7A, and details are not described herein again.
  • FIG. 7E is a structural schematic view after peeling off the surface covering layer 043 formed on a side surface of the lyophilic material layer 042 in FIG. 6B away from the upper surface.
  • the lyophobic material layer 044 formed by the exposed surface layer of the lyophilic material layer 042 in FIG. 6B after the surface covering layer 043 is peeled off, the lyophilic material layer 042 is the lyophilic layer 045 in the pixel defining layer shown in FIG. 7E.
  • the lyophobic material layer 044 formed by the exposed skin layer of the liquid material layer 042 is the lyophobic layer 046 in the pixel defining layer shown in FIG. 7E.
  • FIG. 7E regarding the upper surface TS of the pixel defining layer, the side surface SS, the lyophobic side surface 001, the lyophilic side surface 002, and the height setting of the lyophilic side surface 002, etc., reference may be made to the description of FIG. 7A, here. No longer.
  • the height of the solution 100 in which the organic electroluminescent material is dissolved in the direction perpendicular to the substrate 011 is less than or equal to the lyophilic side surface 002 at the time of inkjet printing.
  • the height in the direction perpendicular to the base substrate 011 is not limited thereto.
  • the height setting of the solution 100 in which the organic electroluminescent material is dissolved as shown in FIG. 8 is also applicable to the pixel defining layer given in other embodiments of the present disclosure.
  • a method for fabricating a pixel defining layer according to at least one embodiment of the present invention for forming a lyophilic layer on a substrate, at least a lyophobic layer covering an upper surface of the lyophilic layer, and a surface covering at least a portion of a side surface of the lyophilic layer Covering layer, removing the surface covering layer, exposing the side surface of the lyophilic layer covered thereby, so that the manufactured pixel defining layer includes a lyophobic layer, and the upper surface and the side surface of the lyophobic layer are dissolved with organic electricity
  • the solution of the luminescent material has repulsiveness, reduces the degree of climbing of the solution on the side surface during ink ejection, reduces the influence on film formation uniformity and pixel profile in the pixel region, and can control ink ejection according to requirements.
  • the height of the mouth and at the same time, by reducing the climbing height of the solution on the side surface of the pixel defining layer, it is possible to print a film of a predetermined thickness using the amount of ink calculated within the error range, thereby improving the printing effect.
  • the sequence of steps of the method for manufacturing the pixel defining layer provided by the embodiment of the present invention may be appropriately adjusted, and the steps may also be correspondingly increased or decreased according to the situation.
  • the patterning or patterning process may include only a photolithography process, or a photolithography process and an etching step, or may include other processes for forming a predetermined pattern, such as printing, inkjet, and the like.
  • the photolithography process refers to a process including film formation, exposure, development, and the like, and forms a pattern by using a photoresist, a mask, an exposure machine, or the like.
  • the corresponding patterning process can be selected in accordance with the structure formed in the embodiments of the present invention.
  • At least one embodiment of the present invention provides a pixel defining layer. Referring to FIG. 7A to FIG. 7E, the pixel defining layer is made by the method for fabricating the pixel defining layer provided by any embodiment of the present disclosure.
  • the upper surface of a certain element/layer refers to the surface of the element/layer that is furthest from the substrate substrate.
  • the side surface of a component/layer refers to the surface between the upper surface of the component/layer and its lower surface adjacent the substrate substrate.
  • At least one embodiment of the present invention provides a pixel defining layer including a lyophilic layer on a base substrate, a lyophobic layer covering at least an upper surface of the lyophilic layer, and a surface covering covering at least a portion of the side surface of the lyophilic layer.
  • the pixel defining layer includes a lyophobic layer, and the upper surface and the side surface of the lyophobic layer are dissolved with the organic electroluminescent material
  • the solution is repulsive, reducing the extent of the solution climbing on the side surface during ink jetting, and reducing the effect on film formation uniformity in the pixel region.
  • Embodiments of the present invention provide a display substrate, which may include: a substrate substrate and a pixel defining layer disposed on the substrate substrate, the pixel defining layer being any pixel defining layer shown in FIG. 7A to FIG. 7E .
  • the display substrate may further include at least an anode disposed between the substrate substrate and the pixel defining layer and a cathode disposed on the pixel defining layer.
  • the display substrate is used to form an OLED display panel, and the OLED display panel may include: a display substrate provided by the embodiment of the invention and a cover plate that is fastened on the cathode of the display substrate.
  • the embodiment of the invention further provides a display device, which may include the above OLED display panel, and the display device may be: a liquid crystal panel, an electronic paper, a mobile phone, a watch, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Any product or part that has a display function.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种像素界定层及其制造方法、显示基板、显示装置。所述方法包括：提供衬底基板(011)；在所述衬底基板(011)上形成亲液层(014)，所述亲液层包括上表面(S1)和侧表面(S2)；形成至少覆盖所述亲液层(014)的上表面(S1)的疏液层(01301)和覆盖所述亲液层(014)的至少一部分侧表面的表面覆盖层(01302)，所述一部分侧表面为靠近所述衬底基板(011)的一部分侧表面；去除所述表面覆盖层(033)，使所述靠近衬底基板(011)的至少一部分侧表面裸露，形成像素界定层(PDL)。该像素界定层的制造方法可减小喷墨时溶液在该侧表面上的攀爬程度，进而减小了对像素区域内的成膜均一性的影响。

Description

像素界定层及其制造方法、显示基板、显示装置
相关申请的交叉引用
本专利申请要求于2017年5月11日递交的中国专利申请第201710330762.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本公开的实施例的一部分。
技术领域
本发明的实施例涉及一种像素界定层及其制造方法、显示基板、显示装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示面板包括有机材料膜层。例如，有机材料膜层可以使用喷墨打印技术制造而成。在使用喷墨打印技术制造有机材料膜层时，需要先在玻璃基板上形成像素界定层，然后将有机发光材料的溶液喷墨到形成有像素界定层的玻璃基板上，以形成有机材料膜层。例如，OLED显示面板可由在玻璃基板上依次形成阳极、空穴注入层、空穴传输层、有机材料膜层、电子传输层、电子注入层和阴极等制作完成。
发明内容
本公开至少一实施例提供一种像素界定层及其制造方法、显示基板、显示装置，以减小喷墨时溶液在像素界定层侧表面上的攀爬程度，进而减小对像素区域内的成膜均一性的影响。
本公开至少一实施例提供一种像素界定层的制造方法，包括：
提供衬底基板；
在所述衬底基板上形成亲液层，所述亲液层包括上表面和侧表面；
形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，所述一部分侧表面为靠近所述衬底基板的一部分侧表面；
去除所述表面覆盖层，使所述靠近衬底基板的至少一部分侧表面裸露，形成像素界定层。
根据本公开一个或多个实施例提供的方法，所述亲液层对溶解有有机电致发光材料的溶液具有吸引性，所述疏液层对溶解有有机电致发光材料的溶液具有排斥性。
根据本公开一个或多个实施例提供的方法，所述疏液层和所述表面覆盖层一体形成并构成覆盖所述亲液层上表面和侧表面的表面覆盖疏液层，
在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
在所述衬底基板上形成亲液材料层；
对所述亲液材料层裸露的表层进行疏液处理，得到所述表面覆盖疏液层。
根据本公开一个或多个实施例提供的方法，对所述亲液材料层裸露的表层进行疏液处理，包括：
在所述亲液材料层裸露的表层上形成反应涂层，使所述反应涂层与所述亲液材料层反应，以得到所述表面覆盖疏液层。
根据本公开一个或多个实施例提供的方法，所述疏液层和所述表面覆盖层一体形成并构成覆盖所述亲液层上表面和侧表面的表面覆盖疏液层，
在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
在所述衬底基板上依次形成第一亲液材料层和覆盖所述第一亲液材料层上表面和侧表面的第二亲液材料层，所述第一亲液材料层和所述第二亲液材料层的材料不同；
在所述第二亲液材料层裸露的表层形成用于与所述第二亲液材料层反应的反应涂层，使所述反应涂层与所述第二亲液材料层的表层反应形成所述表面覆盖疏液层；
其中，所述第一亲液材料层和未与所述反应涂层反应的所述第二亲液材料层的底层构成所述亲液层。
根据本公开一个或多个实施例提供的方法，在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
在所述衬底基板上依次形成第一亲液材料层和覆盖所述第一亲液材料层上表面的第二亲液材料层，所述第一亲液材料层和所述第二亲液材料层的材料不同；
在所述第一亲液材料层的侧表面形成所述表面覆盖层；
在所述第二亲液材料层裸露的表层形成用于与所述第二亲液材料层反应的反应涂层，使所述反应涂层至少与所述第二亲液材料层的表层反应；
其中，所述第一亲液材料层构成所述亲液层，与所述反应涂层反应后的所述第二亲液材料层为所述疏液层；或者，所述第一亲液材料层和未与所述反应涂层反应的所述第二亲液材料层的底层构成所述亲液层，与所述反应涂层反应后的所述第二亲液材料层的表层为所述疏液层。
根据本公开一个或多个实施例提供的方法，所述第二亲液材料层由二氧化硅制成，所述反应涂层由氟化氢制成。
根据本公开一个或多个实施例提供的方法，所述第二亲液材料层的厚度为0.1至0.5微米。
根据本公开一个或多个实施例提供的方法，所述第一亲液材料层由聚酰亚胺制成。
根据本公开一个或多个实施例提供的方法，所述裸露的侧表面的高度至少为0.5微米。
根据本公开一个或多个实施例提供的方法，在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
在所述衬底基板上形成亲液材料层；
在所述亲液材料层的靠近所述衬底基板的一部分侧表面上设置所述表面覆盖层，以形成覆盖所述亲液层的靠近所述衬底基板的一部分侧表面的表面覆盖层；
对所述亲液材料层裸露的表层进行表面疏液处理，以形成覆盖所述亲液层的上表面和覆盖所述亲液层的远离所述衬底基板的一部分侧表面的疏液层。
根据本公开一个或多个实施例提供的方法，采用剥离或者刻蚀的方式去除所述表面覆盖层。
根据本公开一个或多个实施例提供的方法，所述像素界定层中，所述疏液层覆盖所述亲液层的上表面并且覆盖所述亲液层的远离所述衬底基板的一部分侧表面。
根据本公开一个或多个实施例提供的方法，所述像素界定层的侧表面包括靠近所述上表面的疏液侧表面和远离所述上表面的亲液侧表面，所述亲液侧表面与所述像素界定层的高度之比为1/3-2/3。
根据本公开一个或多个实施例提供的方法，所述亲液侧表面与所述像素界定层的高度之比大于或等于1/2并且小于或等于2/3。
本公开至少一实施例还提供一种像素界定层，由上述任一方法制成。
本公开至少一实施例还提供一种显示基板，包括：衬底基板以及设置在所述衬底基板上的像素界定层，所述像素界定层为上述像素界定层。
本公开至少一实施例还提供一种显示装置，包括上述显示基板。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1A是一种像素界定层的局部放大图；
图1B是图1A所示的像素界定层的制造流程示意图；
图1C是图1A所示的像素界定层对应的像素的轮廓示意图；
图2是本发明一实施例提供的一种像素界定层的制造方法的流程图；
图3A是本发明一实施例提供的一种在衬底基板上形成亲液材料层，并对亲液材料层裸露的表层进行疏液处理，以得到覆盖亲液层的上表面的疏液层和覆盖亲液层的侧表面的表面覆盖层的方法流程图；
图3B是本发明一实施例提供的一种在衬底基板上形成亲液材料层，并在亲液材料层的上表面和侧表面形成表面覆盖疏液层的结构示意图(显示基板的剖视图)；
图4A是本发明一实施例提供的一种在衬底基板上形成第一亲液材料层、覆盖第一亲液材料层上表面和侧表面的第二亲液材料层和第二亲液材料层裸露的表层的反应涂层，使反应涂层与第二亲液材料层的表层反应，以得到亲 液层、覆盖亲液层的上表面的疏液层和覆盖亲液层的侧表面的表面覆盖层的方法流程图；
图4B是本发明一实施例提供的一种在衬底基板上形成第一亲液材料层，覆盖第一亲液材料层上表面和侧表面的第二亲液材料层的结构示意图(显示基板的剖视图)；
图4C是本发明一实施例提供的一种在衬底基板上形成第一亲液材料层，覆盖第一亲液材料层上表面和侧表面的第二亲液材料层以及反应涂层的结构示意图(显示基板的剖视图)；
图5A是本发明一实施例提供的一种在衬底基板上形成第一亲液材料层、覆盖第一亲液材料层上表面的第二亲液材料层、第一亲液材料层侧表面的表面覆盖层和反应涂层，使反应涂层与第二亲液材料层的表层反应，以得到亲液层、覆盖亲液层的上表面的疏液层和覆盖亲液层的侧表面的表面覆盖层的方法流程图；
图5B是本发明一实施例提供的一种在衬底基板上形成第一亲液材料层、覆盖第一亲液材料层上表面的第二亲液材料层、在第一亲液材料层的侧表面形成的表面覆盖层和在第二亲液材料层裸露的表层形成用于与第二亲液材料层反应的反应涂层的结构示意图(显示基板的剖视图)；
图6A是本发明一实施例提供的一种在衬底基板上形成亲液材料层，在亲液材料层的侧表面的一部分形成表面覆盖层，并对亲液材料层裸露的表层进行疏液处理，以得到亲液层、覆盖亲液层的上表面的疏液层和覆盖亲液层的侧表面的表面覆盖层的方法流程图；
图6B是本发明一实施例提供的一种在衬底基板上形成亲液材料层、在亲液材料层的侧表面的远离其上表面的一部分形成表面覆盖层和在亲液材料层裸露的表层形成的疏液材料层的结构示意图(显示基板的剖视图)；
图7A是本发明一实施例提供的一种通过刻蚀工艺去除图3B中的表面覆盖层后的结构示意图；
图7B是本发明一实施例提供的一种通过刻蚀工艺去除图4B中的表面覆盖层后的结构示意图；
图7C是本发明一实施例提供的一种剥离了图5B中覆盖在亲液层的侧表面的表面覆盖层后的结构示意图(第二亲液材料层完全转变为疏液层)；
图7D是本发明一实施例提供的一种剥离了图5B中覆盖在亲液层的侧表面的表面覆盖层后的结构示意图(第二亲液材料层部分转变为疏液层)；
图7E是本发明一实施例提供的一种剥离了图6B中在亲液材料层的侧表面的下半部分形成的表面覆盖层后的结构示意图；
图8为本发明一实施例提供的显示基板在喷墨打印时溶解有有机电致发光材料的溶液的设置高度的示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
有机电致发光二极管显示器相对于液晶显示器具有自发光、反应快、视角广、亮度高、色彩艳和轻薄等优点，制造有机电致发光二极管中的膜层的方法主要有蒸镀制程和溶液制程两种。蒸镀制程适用于有机小分子材料的成膜，具有成膜均匀性好和技术相对成熟的优点。溶液制程包括旋涂、喷墨打印、喷嘴涂覆和丝网印刷等方法。由于喷墨打印技术的材料利用率较高，以及在大尺寸产品的生产上具有突出的优势等优点，其被广泛应用于大尺寸的有机电致发光二极管显示器的制造过程中。在使用喷墨打印技术制造有机材料膜层时，需要先在衬底基板例如玻璃基板上形成像素界定层，然后将有机发光材料的溶液喷墨到形成有像素界定层的衬底基板上，以形成有机材料膜层。
例如，像素界定层的结构主要有两种，一方面，像素界定层由一个膜层构成，该像素界定层由含氟材料制成，其上表面表现为疏液性，其余部分表现为亲液性，其局部放大图请参考图1A。如图1A所示，1为表现为疏液性的像素界定层部分，2为表现为亲液性的像素界定层部分。该像素界定层的制造过程请参考图1B。
如图1B所示，衬底基板01上形成像素界定材料层020，对像素界定材料层020进行构图形成像素界定层0201的图形，对像素界定层0201进行烘 烤得到像素界定层0202。黑点表示含氟材料中的含氟成分，且黑点的密度表示含氟成分的浓度。在制造过程中含氟成分在烘烤作用下会上移至像素界定层的上表面。使得像素界定层的上表面表现为疏液性，其余部分表现为亲液性。例如，像素界定层可看成由层叠的两个膜层构成，下层由亲液性材料(无机或其他有机材料)制成，上层由疏液性的含氟树脂材料制成。在该像素界定层的制造过程中，烘烤也会使上层中的含氟树脂材料的含氟成分上移至上层的上表面，使得上表面表现为疏液性，其余部分表现为亲液性。例如，由于像素界定层的上表面表现为疏液性，其余部分表现为亲液性。也即是，像素界定层的侧表面的疏液性不够，因此，喷墨打印时，墨水在像素界定层的侧表面会有一定程度的攀爬(如图1A中的虚线所示)，进而导致在像素界定层对应的像素区域中形成的膜厚达不到预定值，像素内部的均匀性不好，且像素轮廓呈U形(如图1C中的曲线所示)。例如，图1C中的尺寸为像素的相关尺寸。
例如，通常技术中，像素界定层由含氟树脂材料制成，并在制造过程中对该含氟树脂材料进行烘烤处理，在该处理过程中，含氟树脂材料中的含氟成分上移至像素界定层的上部，形成具有一定厚度的含氟层，该含氟层具有较好的疏液性，像素界定层除了含氟层外的部分具有较好的亲液性。
但是，含氟成分只上移至像素界定层的上部，没有或者很少上移到像素界定层的侧表面。喷墨打印时，像素界定层中的疏液性的含氟层对溶解有有机发光材料的溶液有排斥作用，以避免溶液被喷墨到相邻像素区域中。喷墨打印时，像素界定层的亲液部分对溶解有有机发光材料的溶液有吸引作用，喷墨时溶液在该侧表面上会有一定程度的攀爬，从而影响溶液在像素区域内的成膜均一性，使像素区域内形成厚度不均一的有机材料膜层。
本发明至少一实施例提供一种像素界定层的制造方法，如图2所示，该方法可以包括：
步骤101、提供衬底基板。
步骤102、在衬底基板上形成亲液层，所述亲液层包括上表面和侧表面；形成至少覆盖亲液层的上表面的疏液层和覆盖亲液层的至少一部分侧表面的表面覆盖层，所述一部分侧表面为靠近所述衬底基板的一部分侧表面。
步骤103、去除表面覆盖层，使靠近衬底基板的至少一部分侧表面裸露， 形成像素界定层。
例如，亲液层对溶解有有机电致发光材料的溶液具有吸引性，疏液层对溶解有有机电致发光材料的溶液具有排斥性。
本发明至少一实施例提供的像素界定层的制造方法，通过在衬底基板上形成亲液层、形成至少覆盖亲液层的上表面的疏液层和覆盖亲液层的至少一部分侧表面的表面覆盖层，并去除表面覆盖层，使亲液层的靠近衬底基板的至少一部分侧表面裸露，使得制造的像素界定层中包括疏液层，该疏液层的上表面和侧表面均对溶解有有机电致发光材料的溶液具有排斥性，从而使得像素界定层的侧表面包括具有疏液性质的疏液侧表面，减小了喷墨时溶液在像素界定层的侧表面上的攀爬程度，减小了对像素区域内的成膜均一性的影响。
例如，上表面和侧表面相接，侧表面包括与上表面相接的部分和远离上表面的部分。
例如，在步骤101中，衬底基板可以为由玻璃、硅片、石英以及塑料等至少之一具有一定坚固性的导光的且非金属材料制成的基板，通常为透明基板。进一步例如，该衬底基板的材料为玻璃。
例如，在步骤102中，在衬底基板上形成亲液层、形成至少覆盖亲液层的上表面的疏液层和覆盖亲液层的至少一部分侧表面的表面覆盖层的过程，可以有多种可实现方式，本发明实施例以以下四种方式为例对其形成过程进行说明。
第一种方式，在衬底基板上形成亲液材料层，并对亲液材料层裸露的表层进行疏液处理，以得到至少覆盖亲液层的上表面的疏液层和覆盖亲液层的一部分侧表面的表面覆盖层。如图3A所示，该过程可以包括：
步骤1021a、在衬底基板上形成亲液材料层。
例如，亲液材料层可以由聚酰亚胺(Polyimide，PI)制成，或者，也可以由二氧化硅和氮化硅等对溶解有有机电致发光材料的溶液有吸引性的材料中的至少一种制成。
例如，当亲液材料层由PI制成时，可以在衬底基板上涂覆一层具有一定厚度的PI，得到PI膜层，然后对PI膜层进行曝光、显影和烘烤等处理得到具有一定图形的亲液材料层。
例如，当亲液材料层由二氧化硅和氮化硅等无机亲液材料中的至少一种制成时，可以采用磁控溅射、热蒸发或者等离子体增强化学气相沉积法(Plasma Enhanced Chemical Vapor Deposition，PECVD)等方法在衬底基板上沉积一层具有一定厚度的亲液材料，得到亲液材料膜层，然后通过构图工艺对亲液材料膜层进行处理得到具有一定图形的亲液材料层。
步骤1022a、对亲液材料层裸露的表层进行疏液处理，得到亲液层和覆盖亲液层上表面和侧表面的表面覆盖疏液层。疏液层和表面覆盖层一体形成并构成覆盖亲液层上表面和侧表面的表面覆盖疏液层。
例如，对亲液材料层裸露的表层进行疏液处理的过程，可以包括：
在亲液材料层裸露的表层上形成反应涂层，使反应涂层与亲液材料层反应，以得到表面覆盖疏液层，该表面覆盖疏液层包括疏液层和表面覆盖层。或者，在亲液材料层裸露的表层上形成疏液材料层，该疏液材料层由疏液材料制成，该形成的疏液材料层即为表面覆盖疏液层，该表面覆盖疏液层包括疏液层和表面覆盖层。例如，可以使用喷涂的方式将反应涂层的材料喷涂在亲液材料层裸露的表层上，以形成具有一定厚度的反应涂层，该反应涂层与亲液材料层反应能够得到疏液性质的层。疏液材料可以为氟化聚甲基丙烯酸甲酯或聚硅氧烷等对溶解有有机电致发光材料的溶液有排斥性的材料。
例如，请参考图3B，其示出了本发明一实施例提供的一种在衬底基板011上形成亲液材料层012，并在形成有亲液材料层012的衬底基板011上形成表面覆盖疏液层013后的结构示意图。例如，表面覆盖疏液层013覆盖亲液材料层012的上表面和侧表面的层。例如，表面覆盖疏液层013包括疏液层01301和表面覆盖层01302。例如，亲液材料层012和表面覆盖疏液层013的厚度的取值范围可以根据实际需要设置，本发明实施例对此不作限定。
第二种方式，在衬底基板上形成第一亲液材料层、覆盖第一亲液材料层上表面和侧表面的第二亲液材料层和第二亲液材料层裸露的表层的反应涂层，使反应涂层与第二亲液材料层的表层反应，以得到亲液层、至少覆盖亲液层的上表面的疏液层和覆盖亲液层的一部分侧表面的表面覆盖层，如图4A所示，该过程可以包括：
步骤1021b、在衬底基板上依次形成第一亲液材料层和覆盖第一亲液材料层上表面和侧表面的第二亲液材料层。
例如，第一亲液材料层可以由PI、二氧化硅和氮化硅等对溶解有有机电致发光材料的溶液有吸引性的材料中的至少一种材料制成，第二亲液材料层也可以由PI、二氧化硅和氮化硅等对溶解有有机电致发光材料的溶液有吸引性的材料中的至少一种材料制成，且该第二亲液材料层的材料与第一亲液材料层的材料不同。例如，第二亲液材料层的厚度可以为0.1微米至0.5微米，但不限于此。示例地，当第一亲液材料层由PI制成时，第二亲液材料层可以由二氧化硅制成。
在衬底基板上形成第一亲液材料层的过程，和在形成有第一亲液材料层的衬底基板上形成覆盖第一亲液材料层上表面和侧表面的第二亲液材料层的过程，可以相应参考步骤1021a中在衬底基板上形成亲液材料层的过程，此处不再赘述。
步骤1022b、在第二亲液材料层裸露的表层形成用于与第二亲液材料层反应的反应涂层，使反应涂层与第二亲液材料层的表层反应。
例如，第一亲液材料层和未与反应涂层反应的第二亲液材料层的底层构成亲液层，与反应涂层反应后的第二亲液材料层的表层为表面覆盖疏液层，表面覆盖疏液层覆盖亲液层的上表面和侧表面。该表面覆盖疏液层包括表面覆盖层和疏液层。疏液层和表面覆盖层一体形成构成表面覆盖疏液层。
例如，当第二亲液材料层由二氧化硅制成时，反应涂层可以由氟化氢制成，可以使用喷涂的方式将氟化氢的水溶液喷涂在第二亲液材料层裸露的表层上，以形成具有一定厚度的氟化氢层，该氟化氢层能够与二氧化硅制成的亲液材料层反应，且两者反应后生成的硅氟化合物的接触角约为70°，其对溶解有有机电致发光材料的溶液具有排斥性，该反应后生成的硅氟化合物形成的膜层即为具有疏液性质的层，该疏液性质的疏液层包括疏液层和表面覆盖层，第一亲液材料层和未与氟化氢反应的第二亲液材料层共同构成亲液层。
示例地，请参考图4B，其示出了本发明一实施例提供的一种在衬底基板021上形成第一亲液材料层022和覆盖第一亲液材料层022上表面和侧表面的第二亲液材料层023后的结构示意图。例如，第一亲液材料层022和第二亲液材料层023的厚度的取值范围可以根据实际需要设置，本发明实施例对此不作限定。例如，如图4C所示，实际应用中，第二亲液材料层裸露的表层上可能还包括反应涂层050。例如，反应涂层的厚度很薄。例如，反应涂 层与第二亲液材料层反应后可以得到疏液层或表面覆盖疏液层。
第三种方式，在衬底基板上形成第一亲液材料层、覆盖第一亲液材料层上表面的第二亲液材料层、覆盖第一亲液材料层侧表面的表面覆盖层，并形成反应涂层，使反应涂层与第二亲液材料层的表层反应，以得到亲液层、覆盖亲液层的上表面的疏液层和覆盖亲液层的侧表面的表面覆盖层，如图5A所示，该过程可以包括：
步骤1021c、在衬底基板上依次形成第一亲液材料层和覆盖第一亲液材料层上表面的第二亲液材料层。
例如，第一亲液材料层可以由PI、二氧化硅和氮化硅等对溶解有有机电致发光材料的溶液有吸引性的材料中的至少一种材料制成，第二亲液材料层也可以由PI、二氧化硅和氮化硅等对溶解有有机电致发光材料的溶液有吸引性的材料中的至少一种材料制成，且该第二亲液材料层的材料与第一亲液材料层的材料不同。
在衬底基板上形成第一亲液材料层的过程，以及在形成有第一亲液材料层的衬底基板上形成覆盖第一亲液材料层上表面的第二亲液材料层的过程，可以相应参考步骤1021a中在衬底基板上形成亲液材料层的过程，此处不再赘述。
步骤1022c、在第一亲液材料层的侧表面形成表面覆盖层。
该形成的表面覆盖层能够对第一亲液材料层的侧表面形成遮挡，以便于对覆盖在第一亲液材料层上表面的第二亲液材料层进行处理时，第一亲液材料层的侧表面不会受到处理过程的影响。例如，该表面覆盖层的材料可根据对第二亲液材料层进行处理的处理方式进行确定，只要处理方式不会对该表面覆盖层产生影响即可。例如，当对第二亲液材料层的处理为在第二亲液材料层上形成反应涂层，使该反应涂层与第二亲液材料层反应时，该表面覆盖层由不与该反应涂层反应的材料制成。
例如，当表面覆盖层的材料为无机材料时，可以采用磁控溅射、热蒸发或者PECVD等方法在形成有第二亲液材料层的衬底基板上沉积一层具有一定厚度的无机材料，得到表面覆盖膜层，然后通过构图工艺对表面覆盖膜层进行处理得到具有一定图形的表面覆盖层，使该表面覆盖层覆盖在第一亲液材料层的侧表面上。例如，表面覆盖层可仅覆盖在第一亲液材料层的侧表面 上，但不限于此。例如，表面覆盖层可覆盖在除了第二亲液材料层之外的位置，例如，该位置包括第一亲液材料层的侧表面和相邻第一亲液材料层之间的位置。例如，当表面覆盖层的材料为有机材料时，可以在形成有第二亲液材料层的衬底基板上涂覆一层具有一定厚度的有机材料，得到表面覆盖膜层，然后对表面覆盖膜层进行曝光、显影和烘烤等处理得到具有一定图形的表面覆盖层，使得该表面覆盖层覆盖在第一亲液材料层的侧表面上。
步骤1023c、在第二亲液材料层裸露的表层形成用于与第二亲液材料层反应的反应涂层，使反应涂层与第二亲液材料层的表层反应。
例如，第一亲液材料层和未与反应涂层反应的第二亲液材料层的底层构成亲液层，与反应涂层反应后的第二亲液材料层的表层为疏液层。例如，疏液层覆盖亲液层的上表面并覆盖亲液层的靠近上表面的一部分侧表面。
例如，在第二亲液材料层裸露的表层形成用于与第二亲液材料层反应的反应涂层，使反应涂层与第二亲液材料层的表层反应的过程，可以相应参考步骤1022b的实现过程，此处不再赘述。
例如，请参考图5B，其示出了本发明一实施例提供的一种在衬底基板031上形成第一亲液材料层032、覆盖第一亲液材料层032上表面的第二亲液材料层033、在第一亲液材料层032的侧表面形成的表面覆盖层034和在第二亲液材料层033裸露的表层形成用于与第二亲液材料层033反应的反应涂层035(虚线所示涂层)后的结构示意图。例如，第一亲液材料层032、第二亲液材料层033、表面覆盖层034和反应涂层035的厚度的取值范围均可以根据实际需要设置，本发明实施例对此不作限定。例如，第二亲液材料层033仅覆盖第一亲液材料层032的上表面。例如，表面覆盖层034形成在全部的第一亲液材料层032的侧表面上。
第四种方式，在衬底基板上形成亲液材料层，在亲液材料层的侧表面的下半部分形成表面覆盖层，并对亲液材料层裸露的表层进行疏液处理，以得到亲液层、至少覆盖亲液层的上表面的疏液层和覆盖亲液层的一部分侧表面的表面覆盖层，如图6A所示，该过程可以包括：
步骤1021d、在衬底基板上形成亲液材料层。
例如，亲液材料层可以由PI、二氧化硅和氮化硅等对溶解有有机电致发光材料的溶液有吸引性的材料中的至少一种制成。
在衬底基板上形成亲液材料层的过程，可以相应参考步骤1021a中在衬底基板上形成亲液材料层的过程，此处不再赘述。
步骤1022d、在亲液材料层的侧表面的一部分形成表面覆盖层。例如，该一部分侧表面为侧表面远离上表面的一部分。
例如，亲液材料层的侧表面的一部分可以是距离衬底基板的一定高度例如高度为0.5微米的亲液材料层部分。在亲液材料层的侧表面的一部分形成表面覆盖层的过程可以相应参考步骤1022c中在第一亲液材料层的侧表面形成表面覆盖层的过程，此处不再赘述。
步骤1023d、对亲液材料层裸露的表层进行表面疏液处理，使得亲液材料层裸露的表层形成疏液层，亲液材料层未裸露的底层形成亲液层。
对亲液材料层裸露的表层进行表面疏液处理后，就能够在衬底基板上形成亲液层和至少覆盖亲液层的上表面的疏液层。例如，疏液层可覆盖亲液层的上表面并覆盖至少与上表面相接的部分侧表面。例如，对亲液材料层裸露的表层进行疏液处理的过程，可以包括：在亲液材料层裸露的表层上形成反应涂层，使反应涂层与亲液材料层反应，以得到疏液层。例如，该疏液处理后可形成表面覆盖疏液层以覆盖亲液层的上表面和全部的侧表面，表面覆盖疏液层可包括疏液层和表面覆盖层。或者，在亲液材料层裸露的表层上形成疏液材料层，该疏液材料层由疏液材料制成，该形成的疏液材料层即为表面覆盖疏液层，该表面覆盖疏液层可包括疏液层和表面覆盖层。
例如，请参考图6B，其示出了本发明一实施例提供的一种在衬底基板041上形成亲液材料层042、在亲液材料层042的侧表面的远离上表面的部分形成表面覆盖层043和在亲液材料层042裸露的表层形成的疏液材料层044后的结构示意图。例如，亲液材料层042、表面覆盖层043和疏液材料层044的厚度的取值范围可以根据实际需要设置，本发明实施例对此不作限定。
例如，在步骤103中，去除表面覆盖层，使亲液层的侧表面远离上表面的至少一部分裸露的过程，可以包括：通过剥离的方式去除表面覆盖层，或者，通过刻蚀工艺去除表面覆盖层。例如，因去除表面覆盖层而裸露的侧表面的高度可以为0.5微米。例如，刻蚀工艺可以为干刻工艺。
该两种去除的方法可以根据实际情况选择执行。例如，当疏液处理为亲液层的侧表面与反应涂层反应时，或者，疏液处理为覆盖第一亲液材料层上 表面和侧表面的第二亲液材料层与反应涂层反应时，可以选择使用刻蚀工艺去除覆盖在亲液层的侧表面的表面覆盖层；当在第一亲液材料层的侧表面形成表面覆盖层，再使反应涂层与第二亲液材料层的表层反应，或者，在亲液材料层的侧表面的远离上表面的一部分形成表面覆盖层，再对亲液材料层裸露的表层进行疏液处理时，可以选择使用剥离的方法以去除覆盖亲液层的侧表面的表面覆盖层。
例如，请参考图7A，图7A为通过刻蚀工艺去除图3B中的表面覆盖层后的结构示意图。例如，图3B中的亲液材料层012的表层上形成了疏液材料层013，表面覆盖层为亲液材料层012侧表面上一定高度处例如高度为0.5微米的疏液材料层013，经过刻蚀工艺后，亲液材料层012为图7A所示的像素界定层中亲液层014，刻蚀后剩下的疏液材料层013为图7A所示的像素界定层中的疏液层015。
例如，如图7A所示，亲液层014包括上表面S1和侧表面S2。
例如，如图7A所示，像素定义层PDL包括上表面TS和侧表面SS，像素定义层PDL的侧表面SS包括相邻的疏液侧表面001和亲液侧表面002。例如，疏液侧表面001比亲液侧表面002更远离衬底基板011。例如，疏液侧表面001比亲液侧表面002更靠近上表面TS。像素定义层PDL的上表面TS为疏液表面003。
例如，亲液侧表面002在垂直于衬底基板011的方向上的高度H1与像素定义层PDL在垂直于衬底基板011的方向上的高度H0的比值范围小于或等于2/3。例如，亲液侧表面002在垂直于衬底基板011的方向上的高度H1与像素定义层PDL在垂直于衬底基板011的方向上的高度H0的比值范围为1/3-2/3，进一步例如，该比值大于或等于1/2并且小于或等于2/3。
例如，如图7A所示，疏液层015包括位于亲液层014的上表面的顶疏液层0151和位于亲液层014的侧表面的靠近上表面的一部分上的侧疏液层0152。
例如，请参考图7B，图7B为通过刻蚀工艺去除图4B中的表面覆盖层后的结构示意图。例如，图4B中第一亲液材料层022的上表面和侧表面形成了第二亲液材料层023，且该第二亲液材料层023部分与反应涂层发生了反应，反应后的第二亲液材料层023的表层为疏液层，该疏液层在亲液材料 层012侧表面上一定高度处例如高度为0.5微米的膜层部分为表面覆盖层，经过刻蚀工艺后，第一亲液材料层022和未与反应涂层反应的第二亲液材料层023的底层0230构成图7B所示的像素界定层中亲液层024，刻蚀后剩下的疏液层为图7B所示的像素界定层中的疏液层025。
例如，请参考图7C，图7C为剥离了图5B中覆盖在亲液层的侧表面的表面覆盖层034后的结构示意图。例如，图5B中第一亲液材料层032的上表面形成了第二亲液材料层033，且该第二亲液材料层023全部与反应涂层发生了反应，反应后的第二亲液材料层033表现为疏液性，剥离表面覆盖层后，第一亲液材料层032为图7C所示的像素界定层中的亲液层036，反应后的第二亲液材料层033为图7C所示的像素界定层中的疏液层037。
例如，如图7C所示，像素定义层PDL包括上表面TS和侧表面SS，像素定义层PDL的侧表面SS包括相邻的疏液侧表面001和亲液侧表面002。例如，疏液侧表面001比亲液侧表面002更远离衬底基板011。例如，疏液侧表面001比亲液侧表面002更靠近上表面TS。像素定义层PDL的上表面TS为疏液表面003。例如，亲液侧表面002在垂直于衬底基板011的方向上的高度H1与像素定义层PDL在垂直于衬底基板011的方向上的高度H0的比值范围小于或等于2/3。例如，亲液侧表面002在垂直于衬底基板011的方向上的高度H1与像素定义层PDL在垂直于衬底基板011的方向上的高度H0的比值范围为1/3-2/3，进一步例如，该比值大于或等于1/2并且小于或等于2/3。
图7D示出了本公开一实施例提供的方法制作的像素界定层的示意图。与土7C相比，图7D中仅第二亲液材料层的表层与反应涂层反应形成疏液层37。例如，如图7D所示，疏液层37包括顶疏液层371和侧疏液层372。有关于像素界定层的上表面TS、侧表面SS、疏液侧表面001、亲液侧表面002、以及亲液侧表面002的高度设置等可参照对于图7A的描述，在此不再赘述。
例如，请参考图7E，图7E为剥离了图6B中在亲液材料层042的侧表面的远离上表面的一部分形成的表面覆盖层043后的结构示意图。例如，图6B中的亲液材料层042裸露的表层形成的疏液材料层044，剥离表面覆盖层043后，亲液材料层042为图7E所示的像素界定层中亲液层045，亲液材料层042裸露的表层形成的疏液材料层044为图7E所示的像素界定层中的疏 液层046。
图7E中，有关于像素界定层的上表面TS、侧表面SS、疏液侧表面001、亲液侧表面002、以及亲液侧表面002的高度设置等可参照对于图7A的描述，在此不再赘述。
例如，如图8所示，为了减小墨水攀爬，喷墨打印时，溶解有有机电致发光材料的溶液100在垂直于衬底基板011的方向上的高度小于或等于亲液侧表面002在垂直于衬底基板011的方向上的高度，但不限于此。例如，图8所示的溶解有有机电致发光材料的溶液100的高度设置也可适用于本公开其他实施例中给出的像素界定层。
本发明至少一实施例提供的像素界定层的制造方法，通过在衬底基板上形成亲液层、至少覆盖亲液层的上表面的疏液层和覆盖亲液层的至少一部分侧表面的表面覆盖层，去除表面覆盖层，使被其覆盖的亲液层的侧表面裸露，使得制造的像素界定层中包括疏液层，该疏液层的上表面和侧表面均对溶解有有机电致发光材料的溶液具有排斥性，减小了喷墨时溶液在该侧表面上的攀爬程度，减小了对像素区域内的成膜均一性和像素轮廓的影响，并且可以按照需求控制喷墨口的高度，同时，由于减小了溶液在像素界定层的侧表面上的攀爬高度，可以使用在误差范围内计算出的墨水量打印出预设厚度的膜层，进而改善打印效果。
需要说明的是，本发明实施例提供的像素界定层的制造方法步骤的先后顺序可以进行适当调整，步骤也可以根据情况进行相应增减。在本发明的实施例中，构图或构图工艺可只包括光刻工艺，或包括光刻工艺以及刻蚀步骤，或者可以包括打印、喷墨等其他用于形成预定图形的工艺。光刻工艺是指包括成膜、曝光、显影等工艺过程，利用光刻胶、掩模板、曝光机等形成图形。可根据本发明的实施例中所形成的结构选择相应的构图工艺。本发明至少一实施例提供一种像素界定层，该像素界定层的结构示意图请参考图7A至图7E，该像素界定层由本公开任一实施例提供的像素界定层的制造方法制成。
例如，本公开的实施例中，某一元件/层的上表面指的是该元件/层的最远离衬底基板的表面。例如，某一元件/层的侧表面指的是该元件/层的上表面和与其靠近衬底基板的下表面之间的表面。
例如，本发明至少一实施例提供的像素界定层，包括在衬底基板上的亲 液层、至少覆盖亲液层的上表面的疏液层和覆盖亲液层的至少一部分侧表面的表面覆盖层，去除表面覆盖层，使亲液层的被其覆盖的侧表面裸露，使得像素界定层中包括疏液层，该疏液层的上表面和侧表面均对溶解有有机电致发光材料的溶液具有排斥性，减小了喷墨时溶液在该侧表面上的攀爬程度，减小了对像素区域内的成膜均一性的影响。
本发明实施例提供了一种显示基板，该显示基板可以包括：衬底基板以及设置在衬底基板上的像素界定层，该像素界定层为图7A至图7E所示的任一像素界定层。
实际应用中，显示基板上至少还可以包括：设置在衬底基板和像素界定层之间的阳极和设置在像素界定层上的阴极。例如，该显示基板用于构成OLED显示面板，该OLED显示面板可以包括：本发明实施例提供的显示基板以及扣置在显示基板的阴极上的盖板。
本发明实施例还提供一种显示装置，可以包括上述OLED显示面板，该显示装置可以为：液晶面板、电子纸、手机、手表、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
在不冲突的情况下，本发明的实施例及实施例中的特征可以相互组合。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种像素界定层的制造方法，包括：
    提供衬底基板；
    在所述衬底基板上形成亲液层，所述亲液层包括上表面和侧表面；
    形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，所述一部分侧表面为靠近所述衬底基板的一部分侧表面；
    去除所述表面覆盖层，使所述靠近衬底基板的至少一部分侧表面裸露，形成像素界定层。
  2. 根据权利要求1所述的方法，其中，所述亲液层对溶解有有机电致发光材料的溶液具有吸引性，所述疏液层对溶解有有机电致发光材料的溶液具有排斥性。
  3. 根据权利要求1或2所述的方法，其中，所述疏液层和所述表面覆盖层一体形成并构成覆盖所述亲液层上表面和侧表面的表面覆盖疏液层，
    在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
    在所述衬底基板上形成亲液材料层；
    对所述亲液材料层裸露的表层进行疏液处理，得到所述表面覆盖疏液层。
  4. 根据权利要求3所述的方法，其中，对所述亲液材料层裸露的表层进行疏液处理，包括：
    在所述亲液材料层裸露的表层上形成反应涂层，使所述反应涂层与所述亲液材料层反应，以得到所述表面覆盖疏液层。
  5. 根据权利要求1或2所述的方法，其中，所述疏液层和所述表面覆盖层一体形成并构成覆盖所述亲液层上表面和侧表面的表面覆盖疏液层，
    在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
    在所述衬底基板上依次形成第一亲液材料层和覆盖所述第一亲液材料层上表面和侧表面的第二亲液材料层，所述第一亲液材料层和所述第二亲液材料层的材料不同；
    在所述第二亲液材料层裸露的表层形成用于与所述第二亲液材料层反应 的反应涂层，使所述反应涂层与所述第二亲液材料层的表层反应形成所述表面覆盖疏液层；
    其中，所述第一亲液材料层和未与所述反应涂层反应的所述第二亲液材料层的底层构成所述亲液层。
  6. 根据权利要求1或2所述的方法，其中，在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
    在所述衬底基板上依次形成第一亲液材料层和覆盖所述第一亲液材料层上表面的第二亲液材料层，所述第一亲液材料层和所述第二亲液材料层的材料不同；
    在所述第一亲液材料层的侧表面形成所述表面覆盖层；
    在所述第二亲液材料层裸露的表层形成用于与所述第二亲液材料层反应的反应涂层，使所述反应涂层至少与所述第二亲液材料层的表层反应；
    其中，所述第一亲液材料层构成所述亲液层，与所述反应涂层反应后的所述第二亲液材料层为所述疏液层；或者，所述第一亲液材料层和未与所述反应涂层反应的所述第二亲液材料层的底层构成所述亲液层，与所述反应涂层反应后的所述第二亲液材料层的表层为所述疏液层。
  7. 根据权利要求5或6所述的方法，其中，所述第二亲液材料层由二氧化硅制成，所述反应涂层由氟化氢制成。
  8. 根据权利要求7所述的方法，其中，所述第二亲液材料层的厚度为0.1至0.5微米。
  9. 根据权利要求7所述的方法，其中，所述第一亲液材料层由聚酰亚胺制成。
  10. 根据权利要求1-9任一项所述的方法，其中，所述裸露的侧表面的高度至少为0.5微米。
  11. 根据权利要求1或2所述的方法，其中，在所述衬底基板上形成亲液层、形成至少覆盖所述亲液层的上表面的疏液层和覆盖所述亲液层的至少一部分侧表面的表面覆盖层，包括：
    在所述衬底基板上形成亲液材料层；
    在所述亲液材料层的靠近所述衬底基板的一部分侧表面上设置所述表面 覆盖层，以形成覆盖所述亲液层的靠近所述衬底基板的一部分侧表面的表面覆盖层；
    对所述亲液材料层裸露的表层进行表面疏液处理，以形成覆盖所述亲液层的上表面和覆盖所述亲液层的远离所述衬底基板的一部分侧表面的疏液层。
  12. 根据权利要求1-11任一项所述的方法，其中，采用剥离或者刻蚀的方式去除所述表面覆盖层。
  13. 根据权利要求1-12任一项所述的方法，其中，所述像素界定层中，所述疏液层覆盖所述亲液层的上表面并且覆盖所述亲液层的远离所述衬底基板的一部分侧表面。
  14. 根据权利要求1-13任一项所述的方法，其中，所述像素界定层的侧表面包括靠近所述上表面的疏液侧表面和远离所述上表面的亲液侧表面，所述亲液侧表面与所述像素界定层的高度之比为1/3-2/3。
  15. 根据权利要求14所述的方法，其中，所述亲液侧表面与所述像素界定层的高度之比大于或等于1/2并且小于或等于2/3。
  16. 一种像素界定层，由权利要求1-15任一项所述的方法制成。
  17. 一种显示基板，包括：衬底基板以及设置在所述衬底基板上的像素界定层，所述像素界定层为权利要求16所述的像素界定层。
  18. 一种显示装置，包括：权利要求17所述的显示基板。
PCT/CN2018/082826 2017-05-11 2018-04-12 像素界定层及其制造方法、显示基板、显示装置 WO2018205793A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/323,399 US20210288295A1 (en) 2017-05-11 2018-04-12 Pixel defining layer, manufacturing method therefor, display substrate, and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710330762.1A CN107123752A (zh) 2017-05-11 2017-05-11 像素界定层及其制造方法、显示基板、显示装置
CN201710330762.1 2017-05-11

Publications (1)

Publication Number Publication Date
WO2018205793A1 true WO2018205793A1 (zh) 2018-11-15

Family

ID=59728017

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/082826 WO2018205793A1 (zh) 2017-05-11 2018-04-12 像素界定层及其制造方法、显示基板、显示装置

Country Status (3)

Country Link
US (1) US20210288295A1 (zh)
CN (1) CN107123752A (zh)
WO (1) WO2018205793A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4266373A4 (en) * 2020-12-21 2024-09-18 Unijet Co Ltd DISPLAY DEVICE

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107123752A (zh) * 2017-05-11 2017-09-01 京东方科技集团股份有限公司 像素界定层及其制造方法、显示基板、显示装置
CN109698215B (zh) * 2017-10-23 2024-06-25 京东方科技集团股份有限公司 阵列基板及其制备方法、显示装置
CN109065569A (zh) * 2018-07-17 2018-12-21 南京中电熊猫平板显示科技有限公司 显示基板及其制造方法和显示装置
CN109360839B (zh) * 2018-09-26 2020-12-08 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板、纳米微粒的制备方法
CN109545829A (zh) * 2018-11-22 2019-03-29 京东方科技集团股份有限公司 一种阵列基板及其制作方法、显示装置
CN109994532B (zh) * 2019-04-08 2021-04-27 京东方科技集团股份有限公司 像素界定层及其制备方法和包含它的显示基板和显示装置
CN110212007A (zh) * 2019-06-21 2019-09-06 京东方科技集团股份有限公司 显示基板、显示装置以及制作显示基板的方法
CN110828691A (zh) * 2019-10-24 2020-02-21 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制备方法
WO2022224314A1 (ja) * 2021-04-19 2022-10-27 シャープ株式会社 表示装置の製造方法、および表示装置
CN114122203B (zh) * 2021-11-19 2023-03-14 东莞市中麒光电技术有限公司 一种利用液体表面张力实现芯片转移的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752490A (zh) * 2015-04-16 2015-07-01 京东方科技集团股份有限公司 一种有机发光二极管显示面板及其制作方法、显示装置
CN107123752A (zh) * 2017-05-11 2017-09-01 京东方科技集团股份有限公司 像素界定层及其制造方法、显示基板、显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3915806B2 (ja) * 2003-11-11 2007-05-16 セイコーエプソン株式会社 電気光学装置および電子機器
KR101146993B1 (ko) * 2010-06-03 2012-05-22 삼성모바일디스플레이주식회사 실리콘층의 결정화 방법 및 상기 결정화 방법을 이용한 박막 트랜지스터의 형성방법
CN104659287B (zh) * 2015-03-12 2017-05-31 京东方科技集团股份有限公司 像素界定层及制备方法、显示基板及制备方法、显示装置
CN104733505B (zh) * 2015-03-19 2017-11-24 京东方科技集团股份有限公司 发光显示器的像素界定层及其制作方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752490A (zh) * 2015-04-16 2015-07-01 京东方科技集团股份有限公司 一种有机发光二极管显示面板及其制作方法、显示装置
CN107123752A (zh) * 2017-05-11 2017-09-01 京东方科技集团股份有限公司 像素界定层及其制造方法、显示基板、显示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4266373A4 (en) * 2020-12-21 2024-09-18 Unijet Co Ltd DISPLAY DEVICE

Also Published As

Publication number Publication date
CN107123752A (zh) 2017-09-01
US20210288295A1 (en) 2021-09-16

Similar Documents

Publication Publication Date Title
WO2018205793A1 (zh) 像素界定层及其制造方法、显示基板、显示装置
US10811476B2 (en) Pixel definition layer, manufacturing method thereof, display substrate and display device
CN106941112B (zh) 像素界定层及其制造方法、显示基板
US11114514B2 (en) Organic electroluminescent display panel, manufacturing method thereof, and display device
CN107591432B (zh) 像素界定层、显示基板及制造方法、显示装置
CN107393939B (zh) 像素界定层及制造方法、显示面板及制造方法、显示装置
US10957751B2 (en) Pixel defining layer and manufacturing method thereof, display substrate, display panel
EP3270436B1 (en) Method for preparing a display substrate
US9972665B2 (en) Organic light emitting diode display panel, fabrication method thereof, and display device
WO2017012309A1 (zh) 有机电致发光显示基板及制备方法、显示面板、显示装置
US9466650B2 (en) Display panel with pixel defining layer and manufacturing method of pixel defining layer
US10559635B2 (en) Pixel defining layer, production method thereof, and display substrate
JP4745062B2 (ja) 平板表示装置及びその製造方法
WO2016074554A1 (zh) 一种像素单元及其制备方法、发光器件、显示装置
CN109509782B (zh) 像素界定层及其制造方法、自发光显示面板、显示装置
CN110164941B (zh) 像素界定层和制作方法、显示面板和制作方法、显示装置
US20190333974A1 (en) Array substrate and method of manufacturing the same, display panel, and display device
JP4313274B2 (ja) インクジェットプリント用基板及びその製造方法
WO2021238645A1 (zh) 显示用基板及其制备方法、显示装置
CN109545829A (zh) 一种阵列基板及其制作方法、显示装置
CN110098220B (zh) 像素界定结构及发光器件的制作方法
JP5266737B2 (ja) 有機ｅｌ装置および電子機器
CN104716162B (zh) 一种有机发光二极管显示面板及其制作方法、显示装置
CN113937142A (zh) 一种显示面板及其制备方法、显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18797956

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 20-03-2020)

122 Ep: pct application non-entry in european phase

Ref document number: 18797956

Country of ref document: EP

Kind code of ref document: A1