WO2018199148A1 - 電気素子、アクチュエータ、および通信装置 - Google Patents

電気素子、アクチュエータ、および通信装置 Download PDF

Info

Publication number
WO2018199148A1
WO2018199148A1 PCT/JP2018/016768 JP2018016768W WO2018199148A1 WO 2018199148 A1 WO2018199148 A1 WO 2018199148A1 JP 2018016768 W JP2018016768 W JP 2018016768W WO 2018199148 A1 WO2018199148 A1 WO 2018199148A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
coil
base substrate
hall element
present
Prior art date
Application number
PCT/JP2018/016768
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
伊藤　慎悟
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201890000771.2U priority Critical patent/CN211152314U/zh
Publication of WO2018199148A1 publication Critical patent/WO2018199148A1/ja

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • An object of the present invention is to provide an electric element that can suppress a change in sensitivity of the Hall element even when the base substrate is thinned.
  • FIG. 1A is a side sectional view schematically showing the structure of the electric element 1 according to the first embodiment of the present invention
  • FIG. 1B is a schematic view of the coil 2 in FIG.
  • a coil 2 in FIG. 1A shows a cross section along AA ′ in FIG.
  • the insulating bases 2a, 2b, and 2c in which the conductive patterns 20 and 21 and the electrode 22 are formed and the via holes are filled with the conductive paste are laminated and integrated by a heating press or the like.
  • the conductive paste filled in the via holes is also heated and hardened to form interlayer connection conductors 6a, 6b, 6c, and 6d that electrically connect the conductor patterns of the respective insulating base materials.
  • Conductor patterns 20 and 21 and electrode 22 are electrically connected by interlayer connection conductors 6a, 6b, 6c, and 6d.
  • the coil 2 as shown in FIG. 2B is formed.
  • the base substrate 4 is formed from the same type of resin substrate as the insulating substrates 2a, 2b, 2c forming the coil 2.
  • the base substrate 4 can be formed using a thermoplastic resin such as liquid crystal polymer (LCP: Liquid Crystal Polymer).
  • LCP liquid Crystal Polymer
  • the base substrate 4 of the present embodiment has a first region R1 having a small thickness in the Z-axis direction and a second region R2 having a large thickness.
  • the thick second region R2 is formed, for example, by laminating a liquid crystal polymer in a portion corresponding to the thick second region R2 and integrating them with a hot press or the like.
  • the base substrate 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials in which a copper foil is stretched over the entire surface of one side are prepared. Next, the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. Next, the resin base material on which the electrode 41 and the wiring pattern are formed and the resin base material on which the electrode 42 and the wiring pattern are formed are laminated at a position corresponding to the thick second region R2, and are integrated by a heating press or the like. Make it. The base substrate 4 is formed as described above.
  • the thin first regions R1-1, R1-3, R1-4, and R1-5 of the base substrate 4 are used as one layer of resin substrate, and two thick second regions R2-
  • 1 is a two-layer resin base material
  • the present invention is not limited to such an embodiment, and the number of layers in each region can be changed as appropriate.
  • the coil 2 in the electric element 1 ⁇ / b> C of the present embodiment is different from the first embodiment in that the coil 2 is formed using insulating base materials 2 a, 2 b, and 2 b in which a through hole 9 is formed in the center.
  • the manufacturing method of the coil 2 is the same as that of the first embodiment, and the insulating base materials 2a, 2b, and 2b may be laminated so that the through holes 9 overlap with each other and integrated by a heating press or the like.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2018/016768 2017-04-27 2018-04-25 電気素子、アクチュエータ、および通信装置 WO2018199148A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201890000771.2U CN211152314U (zh) 2017-04-27 2018-04-25 电元件、致动器以及通信装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017088553A JP2020129571A (ja) 2017-04-27 2017-04-27 電気素子、アクチュエータ、および通信装置
JP2017-088553 2017-04-27

Publications (1)

Publication Number Publication Date
WO2018199148A1 true WO2018199148A1 (ja) 2018-11-01

Family

ID=63918490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/016768 WO2018199148A1 (ja) 2017-04-27 2018-04-25 電気素子、アクチュエータ、および通信装置

Country Status (3)

Country Link
JP (1) JP2020129571A (zh)
CN (1) CN211152314U (zh)
WO (1) WO2018199148A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62245700A (ja) * 1986-04-18 1987-10-26 セイコーエプソン株式会社 ブレキシブル基板
JP2000081589A (ja) * 1998-07-09 2000-03-21 Olympus Optical Co Ltd 光偏向器
JP2007212821A (ja) * 2006-02-10 2007-08-23 Matsushita Electric Ind Co Ltd レンズ鏡筒
WO2009031542A1 (ja) * 2007-09-07 2009-03-12 Alps Electric Co., Ltd. 磁気駆動装置
JP2015149405A (ja) * 2014-02-06 2015-08-20 デクセリアルズ株式会社 アンテナ装置、非接触電力伝送用アンテナユニット、及び電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62245700A (ja) * 1986-04-18 1987-10-26 セイコーエプソン株式会社 ブレキシブル基板
JP2000081589A (ja) * 1998-07-09 2000-03-21 Olympus Optical Co Ltd 光偏向器
JP2007212821A (ja) * 2006-02-10 2007-08-23 Matsushita Electric Ind Co Ltd レンズ鏡筒
WO2009031542A1 (ja) * 2007-09-07 2009-03-12 Alps Electric Co., Ltd. 磁気駆動装置
JP2015149405A (ja) * 2014-02-06 2015-08-20 デクセリアルズ株式会社 アンテナ装置、非接触電力伝送用アンテナユニット、及び電子機器

Also Published As

Publication number Publication date
CN211152314U (zh) 2020-07-31
JP2020129571A (ja) 2020-08-27

Similar Documents

Publication Publication Date Title
US10566135B2 (en) Method of manufacturing stacked body and stacked body
US10796837B2 (en) Electronic component, diaphragm, and electronic device
JP4434268B2 (ja) 電子部品モジュール
US10051730B2 (en) Multilayer substrate manufacturing method and multilayer substrate
JP2019016743A (ja) 多層基板
US9324491B2 (en) Inductor device and electronic apparatus
JP2016103591A (ja) コイル部品およびその製造方法
WO2019107131A1 (ja) 多層基板、多層基板の実装構造、多層基板の製造方法、および電子機器の製造方法
JP5697020B2 (ja) 基板および基板の製造方法
US11588382B2 (en) Actuator and method of manufacturing actuator
US11202371B2 (en) Multilayer substrate
US11309113B2 (en) Multilayer substrate, actuator, and method of manufacturing multilayer substrate
WO2014199886A1 (ja) 通信装置および電子機器
WO2018159485A1 (ja) 多層基板
JP6154154B2 (ja) 積層基板
WO2018199148A1 (ja) 電気素子、アクチュエータ、および通信装置
WO2018074104A1 (ja) 磁気素子
US11043626B2 (en) Multilayer substrate
JP5229189B2 (ja) 電子部品モジュール
JP6428203B2 (ja) コイル部品およびその製造方法
KR20130059375A (ko) 배선판
WO2018124004A1 (ja) 電子機器
JP2019033282A (ja) コイル部品およびその製造方法
JP2019024046A (ja) アクチュエータ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18791896

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18791896

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP