WO2018199059A1 - キャリアガラス及びその製造方法 - Google Patents
キャリアガラス及びその製造方法 Download PDFInfo
- Publication number
- WO2018199059A1 WO2018199059A1 PCT/JP2018/016539 JP2018016539W WO2018199059A1 WO 2018199059 A1 WO2018199059 A1 WO 2018199059A1 JP 2018016539 W JP2018016539 W JP 2018016539W WO 2018199059 A1 WO2018199059 A1 WO 2018199059A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- carrier
- carrier glass
- less
- mass
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B1/00—Preparing the batches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
- C03B17/064—Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/02—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in electric furnaces, e.g. by dielectric heating
- C03B5/027—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in electric furnaces, e.g. by dielectric heating by passing an electric current between electrodes immersed in the glass bath, i.e. by direct resistance heating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/42—Details of construction of furnace walls, e.g. to prevent corrosion; Use of materials for furnace walls
- C03B5/43—Use of materials for furnace walls, e.g. fire-bricks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
Definitions
- the present invention relates to a carrier glass and a method for manufacturing the same, and specifically to a carrier glass for transporting an organic resin substrate and a method for manufacturing the same.
- Organic EL displays are thin and excellent in moving picture display and have low power consumption. Therefore, they are used for applications such as mobile phone displays.
- glass plates are widely used as substrates for organic EL displays.
- the following characteristics (1) and (2) are required for the carrier glass for this application.
- (1) In order to prevent a situation where alkali ions are diffused in the semiconductor film formed in the heat treatment step, the content of the alkali metal oxide is small.
- an organic EL display using an organic resin substrate is mainly used for a mobile terminal such as a smartphone, so that high resolution is required.
- LTPS Low Temperature Poly-silicon
- oxide semiconductor is used for the thin film transistor for driving the display.
- the organic resin substrate has low heat resistance, its function cannot be maintained in a high-temperature heat treatment process or the like for producing LTPS.
- some resins for example, heat-resistant resins such as polyimide
- the carrier glass for this application is also required to be (3) highly heat resistant. Specifically, it is required that a dimensional change hardly occurs by heat treatment at about 600 ° C. Note that when the carrier glass undergoes dimensional changes in a high-temperature heat treatment process or the like for manufacturing LTPS, it becomes difficult to manufacture a high-definition transistor structure on the organic resin substrate.
- the carrier glass and the organic resin substrate are separated after the semiconductor film is formed on the organic resin substrate, a laser having a wavelength of 308 nm is used. Therefore, in addition to the required characteristics (1) to (3), the carrier glass is also required to have a high transmittance at a wavelength of 308 nm in order to (4) improve the laser utilization efficiency.
- the transmittance at a wavelength of 308 nm is greatly affected by iron, which is an impurity in glass. That is, since Fe 3+ present in glass exhibits absorption near the wavelength of 308 nm, the transmittance at a wavelength of 308 nm decreases when the content is large. Therefore, in order to satisfy the required characteristic (4), it is important to reduce the content of Fe 3+ present in the glass as much as possible.
- Fe 2 O 3 is a component that acts as a fining agent.
- the clarification effect becomes insufficient, so that bubble defects are likely to occur and the productivity of the carrier glass is lowered.
- the carrier glass is made to have a high strain point in order to improve heat resistance, the melting temperature becomes high, and the problem is likely to become obvious.
- the present invention has been made in view of the above circumstances, and its technical problem is to create a carrier glass having high transmittance at a wavelength of 308 nm and excellent productivity (particularly clarity).
- the carrier glass of the present invention is a carrier glass for transporting an organic resin substrate and has a flat plate shape with a thickness of 0.1 to 1.2 mm, and the iron content in the glass is Fe 2 O 3.
- the conversion is 45 to 130 mass ppm, and the transmittance in the plate thickness direction at a wavelength of 308 nm is 71 to 81%.
- the transmittance in the thickness direction at a wavelength of 308 nm refers to the internal transmittance calculated by Equation 1, and can be measured by, for example, UV-3100PC manufactured by Shimadzu Corporation. “Conversion” means that an oxide having a valence different from that of the indicated oxide is handled after being converted to the indicated oxide.
- the carrier glass of the present invention it is preferable that the content of Li 2 O + Na 2 O + K 2 O in the glass composition is less than 0.20 wt%.
- Li 2 O + Na 2 O + K 2 O refers to the total amount of Li 2 O, Na 2 O and K 2 O.
- the carrier glass of the present invention preferably has a ⁇ -OH value of 0.20 / mm or less.
- the “ ⁇ -OH value” is a value calculated by the following formula 2 using FT-IR.
- the carrier glass of the present invention has a glass composition of the following oxide equivalent mass%: SiO 2 55 to 65%, Al 2 O 3 15 to 23%, B 2 O 3 0 to 7%, Li 2 O + Na 2 O + K 2 O 0 to less than 0.20%, MgO 0 to 6%, CaO 0.1 to 10%, SrO 0 to 10%, BaO 0 to 13%, Fe 2 O 3 60 to 130 ppm, As 2 O 3 It is preferable to contain 0 to less than 0.010% and Sb 2 O 3 from 0 to less than 0.010%.
- the carrier glass of the present invention is heated at a rate of 5 ° C./minute from normal temperature, held at 500 ° C. for 1 hour, and has a thermal shrinkage rate of 20 ppm or less when the temperature is lowered at a rate of 5 ° C./minute.
- the “heat shrinkage rate” is calculated as follows. First, a linear marking is written at a predetermined position of the sample, and then the sample is folded perpendicularly to the marking and divided into two glass pieces. Next, only one glass piece is subjected to a predetermined heat treatment (heated at a rate of 5 ° C./minute from normal temperature, held at 500 ° C.
- the thermal shrinkage rate is calculated by the equation of ⁇ L / L 0 (unit: ppm).
- the carrier glass of the present invention preferably has a liquidus temperature of 1300 ° C. or lower.
- the “liquid phase temperature” is obtained by passing the standard sieve 30 mesh (500 ⁇ m) and putting the glass powder remaining on the 50 mesh (300 ⁇ m) in a platinum boat, and holding it in a temperature gradient furnace for 24 hours. It can be calculated by measuring the temperature at which precipitation occurs.
- the carrier glass of the present invention preferably has a temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s of 1700 ° C. or lower.
- the “temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s” can be measured by a platinum ball pulling method.
- the glass resin laminate of the present invention is a glass resin laminate in which a carrier glass and an organic resin substrate are laminated, and the carrier glass is preferably the above carrier glass.
- the method for producing a carrier glass of the present invention is a method for producing a carrier glass for transporting an organic resin substrate, wherein the glass composition is SiO 2 55 to 65%, Al 2 O in terms of the following oxide equivalent mass%. 3 15-23%, B 2 O 3 0-7%, Li 2 O + Na 2 O + K 2 O 0-less than 0.20%, MgO 0-6%, CaO 0.1-10%, SrO 0-10%, Thickness direction of BaO 0-13%, Fe 2 O 3 45-130 ppm by mass, As 2 O 3 0-less than 0.010%, Sb 2 O 3 0-less than 0.010%, and at a wavelength of 308 nm
- the “overflow down draw method” is a method in which molten glass overflows from both sides of a heat-resistant bowl-shaped structure, and the overflowed molten glass is stretched downward while joining at the lower end of the bowl-shaped structure. This is a method of forming a glass plate.
- the carrier glass production method of the present invention is to prepare a glass batch so that the iron content (total amount) derived from the MgO-introduced raw material and the CaO-introduced raw material is 30 to 70 ppm by mass in terms of Fe 2 O 3. It is preferable to do.
- the plate thickness is 0.1 to 1.2 mm, preferably 0.2 to 1.0 mm, 0.3 to 0.7 mm, particularly 0.4 to 0.6 mm. If the plate thickness is too small, the flexibility increases, so that the function as a carrier glass is hardly exhibited. On the other hand, if the plate thickness is too large, the transmittance in the plate thickness direction at a wavelength of 308 nm tends to decrease. In addition, plate
- Fe 2 O 3 is a component that exhibits a clarification effect in a high temperature range around 1600 ° C., but is a component that lowers the transmittance in the ultraviolet region.
- the iron content in the glass is 45 to 130 mass ppm in terms of Fe 2 O 3 , preferably 60 to 125 mass ppm, 80 to 120 mass ppm, particularly 90 to 110 mass ppm, In particular, it is 95 to 105 ppm by mass.
- the transmittance in the plate thickness direction at a wavelength of 308 nm is 71 to 81%, preferably 71 to 79%, 72 to 78%, 73 to 77%, particularly 74 to 76%.
- the transmittance in the plate thickness direction at a wavelength of 308 nm is low, it becomes difficult to separate the carrier glass and the organic resin substrate with a laser with a wavelength of 308 nm.
- the transmittance in the plate thickness direction at a wavelength of 308 nm is high, it is difficult to enjoy the fining effect due to Fe 2 O 3 .
- the ⁇ -OH value is preferably 0.20 / mm or less, 0.16 / mm or less, 0.13 / mm or less, 0.12 / mm or less, 0.10 / mm or less, In particular, it is less than 0.10 / mm. If the ⁇ -OH value is too large, the heat resistance tends to decrease. On the other hand, if the ⁇ -OH value is too small, the meltability tends to decrease. Therefore, the ⁇ -OH value is preferably 0.01 / mm or more, particularly 0.02 / mm or more.
- a method for lowering the ⁇ -OH value there are the following methods (1) to (7), among which the methods (1) to (4) are effective.
- (1) Select a raw material having a low moisture content.
- (2) Add a desiccant such as Cl or SO 3 into the glass batch.
- (3) Conducting heating with a heating electrode.
- (4) Adopt a small melting furnace.
- (6) N 2 bubbling is performed in molten glass. (7) Increase the flow rate of the molten glass.
- the content of Li 2 O + Na 2 O + K 2 O in the glass composition is preferably less than 0.20% by mass, less than 0.10% by mass, less than 0.08% by mass, particularly 0.06%. It is less than mass%.
- the total amount and individual content of Li 2 O, Na 2 O and K 2 O are preferably 0.01% by mass or more, 0.02% by mass or more, 0.03% by mass or more, 0.04% by mass. % Or more, particularly 0.05% by mass or more.
- Na 2 O is preferably introduced preferentially among Li 2 O, Na 2 O, and K 2 O.
- the carrier glass of the present invention has a glass composition of the following oxide equivalent mass%, SiO 2 55 to 65%, Al 2 O 3 15 to 23%, B 2 O 3 0 to 7%, Li 2 O + Na 2 O + K. 2 O 0 to less than 0.20%, MgO 0 to 6%, CaO 0.1 to 10%, SrO 0 to 10%, BaO 0 to 13%, Fe 2 O 3 60 to 130 ppm, As 2 O 3 0 to It is preferable to contain less than 0.010% and Sb 2 O 3 0 to less than 0.010%.
- SiO 2 is a component that forms a glass skeleton and increases the strain point.
- the content of SiO 2 is preferably 55 to 65%, 58 to 65%, in particular 59 to 62%.
- the strain point and acid resistance are likely to be lowered, and the density is likely to be increased.
- the content of SiO 2 is large, the high temperature viscosity becomes high and the meltability tends to be lowered, and the balance of the glass components is lost, and devitrification crystals such as cristobalite are precipitated, and the liquidus temperature Tends to be high.
- Al 2 O 3 is a component that increases the strain point and further increases the Young's modulus.
- the content of Al 2 O 3 is preferably 15 to 23%, 16 to 22%, 17 to 22%, 18 to 22%, 18.6 to 21%, particularly 19.2 to 21%.
- the strain point and specific Young's modulus tends to decrease.
- the content of Al 2 O 3 is large, mullite and feldspar-based devitrified crystals are precipitated, and the liquidus temperature tends to be high.
- B 2 O 3 is a component that enhances meltability and devitrification resistance.
- the content of B 2 O 3 is preferably 0 to 7%, 0 to 6%, 0.1 to less than 3.0%, 0.3 to 2%, particularly 0.5 to 0.75%.
- BHF resistance buffered hydrofluoric acid resistance
- the content of B 2 O 3 is preferably 0 to less than 1.0%, particularly preferably 0 to less than 0.50%.
- Li 2 O, Na 2 suitable content range of O and K 2 O are as described above.
- MgO is a component that increases meltability and Young's modulus.
- the content of MgO is preferably 0 to 6%, 0.01 to 6%, 1 to 6%, 2 to 5%, 2.5 to 4.5%, particularly 3 to 4%. If the content of MgO is small, the Young's modulus and meltability are likely to decrease. On the other hand, when the content of MgO is large, devitrified crystals derived from Mg and Ba such as mullite and devitrified crystals of cristobalite are likely to precipitate, and the strain point is likely to be lowered.
- CaO is a component that lowers the high-temperature viscosity without lowering the strain point and significantly increases the meltability.
- CaO is a component that lowers the raw material cost because the introduced raw material is relatively inexpensive among alkaline earth metal oxides. Furthermore, it is a component that increases the Young's modulus.
- CaO has the effect which suppresses precipitation of the devitrification crystal
- the CaO content is preferably 0.1 to 10%, 1 to 9%, 2 to 8%, 3 to 7%, 3.5 to 6%, particularly 3.5 to 5.5%. When there is little content of CaO, it will become difficult to enjoy the said effect. On the other hand, when the content of CaO is large, devitrified crystals of anorthite tend to precipitate and the density tends to increase.
- SrO is a component that suppresses phase separation and increases devitrification resistance. Furthermore, it is a component that increases the meltability by lowering the high temperature viscosity without lowering the strain point.
- the content of SrO is large, feldspar-based devitrification crystals are likely to precipitate, and devitrification resistance is liable to be lowered. Further, the density tends to increase and the Young's modulus tends to decrease. Therefore, the content of SrO is preferably 0 to 10%, 0 to 8%, 0 to 3%, 0.1 to 2%, particularly 0.5 to less than 1.0%.
- BaO is a component that has a high effect of suppressing precipitation of mullite-based and anorthite-based devitrified crystals among alkaline earth metal oxides.
- the content of BaO is preferably 0 to 13%, 0.1 to 12%, 1 to 11%, 5 to 10.7%, particularly 8 to 10.5%.
- the content of BaO is small, mullite-type and anorthite-type devitrified crystals are likely to precipitate.
- there is much content of BaO while a density will increase or a Young's modulus will fall easily, high temperature viscosity will become high too much and a meltability will fall easily.
- Alkaline earth metal oxides are very important components for increasing the high strain point, devitrification resistance and meltability. If the amount of alkaline earth metal oxide is small, the strain point increases, but it becomes difficult to suppress precipitation of Al 2 O 3 -based devitrified crystals, and the high-temperature viscosity becomes high, so that the meltability is likely to be lowered. On the other hand, when the amount of alkaline earth metal oxide is large, the meltability is improved, but the strain point tends to be lowered, and the liquid phase viscosity may be lowered due to the decrease in the high temperature viscosity. Therefore, the content of MgO + CaO + SrO + BaO (total amount of MgO, CaO, SrO and BaO) is preferably 16-22%, 17-20%, 17.5-19.5%, especially 18-19.3%. .
- the mass% ratio (MgO + CaO + SrO + BaO) / Al 2 O 3 is an important component ratio for suppressing the precipitation of various devitrified crystals and lowering the liquid phase viscosity.
- the mass% ratio (MgO + CaO + SrO + BaO) / Al 2 O 3 decreases, the liquid phase temperature of mullite tends to increase.
- the mass% ratio (MgO + CaO + SrO + BaO) / Al 2 O 3 is increased, the alkaline earth metal oxide is relatively increased, and devitrified crystals containing feldspars and alkaline earth metals are likely to precipitate. Therefore, the mass% ratio (MgO + CaO + SrO + BaO) / Al 2 O 3 is preferably 0.75 to 1.40, 0.80 to 1.20, 0.84 to 1.15, 0.94 to 1.13, particularly 0.94 to 1.05.
- the preferable content range of Fe 2 O 3 is as described above.
- As 2 O 3 and Sb 2 O 3 are components that color the glass when the glass is melted by energization heating with a heating electrode without heating with a burner combustion flame, and their contents are each 0 Less than .010%, especially less than 0.0050% is preferable.
- the following components may be added to the glass composition.
- the content of other components other than the above components is preferably 5% or less, particularly preferably 3% or less in terms of the total amount, from the viewpoint of accurately enjoying the effects of the present invention.
- ZnO is a component that enhances the meltability. However, when ZnO is contained in a large amount, the glass tends to devitrify and the strain point tends to decrease.
- the content of ZnO is preferably 0 to 5%, 0 to 3%, 0 to 0.5%, particularly 0 to 0.2%.
- P 2 O 5 is a component that increases the strain point. However, when P 2 O 5 is contained in a large amount, the glass is likely to be phase-separated.
- the content of P 2 O 5 is preferably 0 to 1.5%, 0 to 1.2%, particularly 0 to 1%.
- TiO 2 is a component that lowers the viscosity at high temperature and increases the meltability, and is a component that suppresses solarization. However, when TiO 2 is contained in a large amount, the glass is colored and the transmittance tends to decrease. . Therefore, the content of TiO 2 is preferably 0 to 3%, 0 to 1%, 0 to 0.1%, particularly 0 to 0.02%.
- Y 2 O 3 , Nb 2 O 5 , and La 2 O 3 have a function of increasing the strain point, Young's modulus, and the like. However, when there is too much content of these components, a density and raw material cost will increase easily. Therefore, the content of Y 2 O 3 , Nb 2 O 5 and La 2 O 3 is preferably 0 to 3%, 0 to 1%, 0 to less than 0.10%, particularly preferably 0 to less than 0.05%, respectively. .
- Cl is a component that acts as a desiccant and lowers the ⁇ -OH value. Therefore, when introducing Cl, a suitable lower limit content is 0.001% or more, 0.003% or more, and particularly 0.005% or more. However, if the Cl content is too large, the strain point tends to decrease. Therefore, the preferable lower limit content of Cl is 0.5% or less, 0.2% or less, particularly 0.08% or less.
- an alkaline earth metal oxide chloride such as strontium chloride, aluminum chloride, or the like can be used as an introduction source of Cl.
- SO 3 is a component that acts as a desiccant and lowers the ⁇ -OH value. Therefore, when SO 3 is introduced, the preferred lower limit content is 0.0001% or more, particularly 0.0005% or more. However, when the content of SO 3 is too large, reboil bubbles are likely to be generated. Therefore, the preferable lower limit content of SO 3 is 0.05% or less, 0.01% or less, 0.005% or less, particularly 0.001% or less.
- SnO 2 is a component that has a good clarification action in a high temperature range, a component that increases the strain point, and a component that decreases high temperature viscosity.
- the SnO 2 content is preferably 0 to 1%, 0.001 to 1%, 0.05 to 0.5%, particularly preferably 0.1 to 0.3%.
- the content of SnO 2 is too large, the devitrification crystal SnO 2 is likely to precipitate.
- the content of SnO 2 is less than 0.001%, it becomes difficult to enjoy the above-mentioned effects.
- a refining agent other than SnO 2 may be used as long as the glass properties are not significantly impaired.
- CeO 2 , F, and C may be added in a total amount of, for example, 1%, or metal powders such as Al and Si may be added in a total amount of, for example, 1%.
- the carrier glass of the present invention preferably has the following characteristics.
- the strain point is preferably more than 720 ° C., 730 ° C. or more, 740 ° C. or more, particularly 750 to 850 ° C. If the strain point is low, the carrier glass is likely to be thermally contracted in the process of forming the semiconductor film, so that it is difficult to increase the definition of the organic EL display.
- the heat shrinkage rate is preferably 20 ppm or less, 18 ppm or less, 15 ppm or less, 12 ppm or less when the temperature is increased from normal temperature at a rate of 5 ° C./min, held at 500 ° C. for 1 hour, and decreased at a rate of 5 ° C./min. In particular, it is 1 to 10 ppm.
- the heat shrinkage rate is large, the carrier glass is easily heat-shrinked in the process of forming the semiconductor film, so that it is difficult to increase the definition of the organic EL display.
- the average coefficient of thermal expansion in the temperature range of 30 to 380 ° C. is preferably 35 ⁇ 10 ⁇ 7 / ° C. or more, particularly 38 ⁇ 10 ⁇ 7 to 41 ⁇ 10 ⁇ 7 / ° C. If the average coefficient of thermal expansion in the temperature range of 30 to 380 ° C. is too low, it does not match the coefficient of thermal expansion of the organic resin substrate, and peeling of the organic resin substrate and warping of the carrier glass are likely to occur.
- “average thermal expansion coefficient in the temperature range of 30 to 380 ° C.” refers to a value measured with a dilatometer.
- Liquid phase temperature is preferably 1300 ° C. or lower, 1280 ° C. or lower, 1260 ° C. or lower, particularly 1100 to 1240 ° C.
- the liquidus temperature is high, devitrification crystals are generated at the time of molding by the overflow down draw method or the like, and the productivity of the carrier glass tends to be lowered.
- the viscosity at the liquidus temperature is preferably 10 4.4 dPa ⁇ s or more, 10 4.8 dPa ⁇ s or more, 10 5.0 dPa ⁇ s or more, 10 5.2 dPa ⁇ s or more, particularly 10 5.5. ⁇ 10 7.0 dPa ⁇ s.
- the viscosity at the liquidus temperature is low, devitrification crystals are generated at the time of molding by the overflow down draw method or the like, and the productivity of the carrier glass is likely to be lowered.
- the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s is preferably 1700 ° C. or lower, 1680 ° C. or lower, 1660 ° C. or lower, 1640 ° C. or lower, 1630 ° C. or lower, particularly 1540 to 1620 ° C.
- the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s is high, melting of the glass batch becomes difficult, and the production cost of the carrier glass increases.
- Specific modulus is preferably 29.5GPa / g ⁇ cm -3 greater, 30GPa / g ⁇ cm -3 or more, 30.5GPa / g ⁇ cm -3 or more, 31GPa / g ⁇ cm -3 or more, 31.5GPa / G ⁇ cm ⁇ 3 or more, particularly 32 GPa / g ⁇ cm ⁇ 3 or more.
- specific Young's modulus is high, the carrier glass is easily bent by its own weight.
- the carrier glass of the present invention has a molding joining surface at the center of the plate thickness, that is, formed by the overflow down draw method.
- the surface to be the glass surface is not in contact with the bowl-like refractory, and is formed in a free surface state. For this reason, the glass plate which is unpolished and has a good surface quality can be manufactured at low cost.
- the overflow downdraw method also has an advantage that a thin glass plate can be easily formed.
- the glass resin laminate of the present invention is a glass resin laminate in which a carrier glass and an organic resin substrate are laminated, and the carrier glass is preferably the above carrier glass.
- the carrier glass and the organic resin substrate are preferably integrated with an adhesive.
- the technical characteristics of the glass resin laminate of the present invention overlap with the technical characteristics of the carrier glass of the present invention. In the present specification, for the sake of convenience, detailed description of the overlapping portions is omitted.
- the method for producing a carrier glass of the present invention is a method for producing a carrier glass for transporting an organic resin substrate, wherein the glass composition is SiO 2 55 to 65%, Al 2 O in terms of the following oxide equivalent mass%. 3 15-23%, B 2 O 3 0-7%, Li 2 O + Na 2 O + K 2 O 0-less than 0.20%, MgO 0-6%, CaO 0.1-10%, SrO 0-10%, Thickness direction of BaO 0-13%, Fe 2 O 3 45-130 ppm by mass, As 2 O 3 0-less than 0.010%, Sb 2 O 3 0-less than 0.010%, and at a wavelength of 308 nm
- the manufacturing process of carrier glass generally includes a melting process, a fining process, a supplying process, a stirring process, and a forming process.
- the melting step is a step of obtaining a molten glass by melting a glass batch prepared by mixing glass raw materials.
- the clarification step is a step of clarifying the molten glass obtained in the melting step by the action of a clarifier or the like.
- a supply process is a process of transferring a molten glass between each process.
- the stirring step is a step of stirring and homogenizing the molten glass.
- the forming step is a step of forming molten glass into flat glass. If necessary, a step other than the above, for example, a state adjusting step for adjusting the molten glass to a state suitable for molding may be introduced after the stirring step.
- the iron content derived from the MgO-introduced raw material and the CaO-introduced raw material is 30 to 70 mass ppm, 40 to 60 mass ppm, 45 to 55 mass ppm in terms of Fe 2 O 3 , In particular, it is preferable to prepare the glass batch so as to be 50 to 55 ppm by mass. The reason is as follows.
- the main introduction sources (mixing sources) of Fe 2 O 3 into the glass are two kinds of MgO introduction raw material, CaO introduction raw material, Al 2 O 3 introduction raw material, in particular MgO introduction raw material and CaO introduction raw material.
- MgO introduction raw material MgO-introducing raw material
- CaO introduction raw material MgO-introducing raw material
- CaO-introducing raw material MgO-introducing raw material
- CaO-introducing raw material CaO-introducing raw material
- the MgO-introduced raw material and the CaO-introduced raw material are naturally derived raw materials, the iron content varies greatly depending on the production lot, which contributes to the variation of the iron content in the continuous production of carrier glass. Therefore, if the iron content mixed from the MgO-introduced raw material and the CaO-introduced raw material is strictly controlled as described above, the transmittance in the plate thickness direction at a wavelength of 308 nm can be easily regulated within a predetermined range. On the other hand, when there is too little iron content mixed from a MgO introduction raw material and a CaO introduction raw material, it becomes difficult to exhibit a clarification effect as mentioned later.
- the MgO-introduced raw material and the CaO-introduced raw material are naturally derived raw materials, even those with a low iron content are inexpensive. Therefore, in order to reduce the iron content in the glass, it is preferable from the viewpoint of cost to select these introduction raw materials.
- a raw material subjected to low soda treatment is generally used as the Al 2 O 3 introduction raw material.
- iron is inevitably mixed in the raw material.
- the Al 2 O 3 introduction raw material it is possible to combine a raw material treated with low soda and a raw material not treated with low Na 2 O, but in this case, the amount of alkali mixed in the glass fluctuates. There is a risk of adversely affecting the current heating conditions and the characteristics of the semiconductor film, which is not realistic. Considering the above points, it can be said that it is difficult to control the amount of iron in the Al 2 O 3 introduced raw material.
- the Al 2 O 3 introduced raw material is hardly soluble, it does not dissolve much at the initial stage of melting, and Fe 2 O 3 in the Al 2 O 3 introduced raw material is introduced into the molten glass at the final stage of melting. It does not function effectively as a refining agent.
- Fe 2 O 3 introduced from the MgO-introduced raw material and CaO-introduced raw material is more likely to exhibit a clarification effect than Fe 2 O 3 mixed from the Al 2 O 3- introduced raw material. It can be said.
- MgO and CaO are introduced into the molten glass, the optical basicity of the molten glass increases.
- Low alkali glass is generally melted by combustion heating of a burner.
- the burner is usually disposed above the melting kiln, and fossil fuel, specifically liquid fuel such as heavy oil, gaseous fuel such as LPG, or the like is used as the fuel.
- the combustion flame can be obtained by mixing fossil fuel and oxygen gas.
- the method for producing the carrier glass of the present invention it is preferable to perform current heating with a heating electrode on the glass batch.
- the temperature of the molten glass decreases from the bottom surface of the melting furnace to the top surface of the melting furnace due to the current heating by the heating electrode installed on the wall surface of the melting furnace, the liquid of the molten glass in the melting furnace.
- Many glass batches in the solid state exist on the surface.
- the water adhering to the glass batch in the solid state evaporates, and an increase in the amount of water due to the raw material can be suppressed.
- current heating with a heating electrode is performed, the amount of energy per mass for obtaining molten glass is reduced, and the amount of molten volatiles is reduced, so that the environmental load can be reduced.
- a carrier glass of the present invention it is more preferable to perform current heating with a heating electrode without performing combustion heating of the burner.
- combustion heating is performed by a burner, moisture generated during combustion of fossil fuel is easily mixed into the molten glass. Therefore, when the combustion heating by the burner is not performed, it becomes easy to reduce the ⁇ -OH value of the molten glass.
- “do not perform combustion heating of the burner but perform energization heating with the heating electrode” refers to continuous melting of the glass batch only by energization heating with the heating electrode. For example, when the melting furnace is started up, When performing the combustion heating, the case where the combustion heating of the burner is locally and auxiliary to a specific portion of the melting furnace is excluded.
- the electric heating by the heating electrode is performed by applying an AC voltage to the heating electrode provided at the bottom or side of the melting kiln so as to contact the molten glass in the melting kiln.
- the material used for the heating electrode is preferably one having heat resistance and corrosion resistance against molten glass, and for example, tin oxide, molybdenum, platinum, rhodium, and the like can be used. Molybdenum is particularly preferable because of its high heat resistance and high degree of freedom for installation in a melting furnace.
- the low alkali glass has a high electric resistivity because the content of the alkali metal oxide is small. For this reason, when applying the electric heating by a heating electrode to low alkali glass, an electric current may flow not only to a molten glass but to the refractory which comprises a melting kiln, and there exists a possibility that the refractory may be damaged early.
- a zirconia refractory having a high electrical resistivity particularly a zirconia electroformed brick, as the refractory in the furnace, and as described above, a component that lowers the electrical resistivity in the molten glass ( It is also preferable to introduce a small amount of Li 2 O, Na 2 O, K 2 O and the like.
- the content of ZrO 2 in the zirconia refractory is preferably 85% by mass or more, particularly 90% by mass or more.
- Tables 1 and 2 show examples of the present invention (sample Nos. 1 to 17). In the table, “NA” means not measured.
- the glass composition and ⁇ -OH value in the table were put into a small test melting furnace constructed with zirconia electrocast bricks, and then heated by a burner flame without using a molybdenum electrode. By conducting current heating with the above, it was melted at 1600 to 1650 ° C. to obtain molten glass. Subsequently, the molten glass was clarified and stirred using a container made of Pt—Rh, then supplied to a zircon molded body, and formed into a flat plate shape having a thickness of 0.5 mm by the overflow down draw method.
- the iron content derived from the MgO-introduced raw material and the CaO-introduced raw material was calculated according to the glass composition by measuring the amount of iron in the raw material with an ICP emission spectroscopic analyzer after dissolving the raw material with an appropriate acid. Is.
- the average coefficient of thermal expansion ⁇ in the temperature range of 30 to 380 ° C. is a value measured with a dilatometer.
- the ⁇ -OH value is a value measured by the above method.
- the thermal contraction rate is calculated as follows. First, a linear marking is written at a predetermined position of the sample, and then the sample is folded perpendicularly to the marking and divided into two glass pieces. Next, only one glass piece is subjected to a predetermined heat treatment (heating from room temperature at a rate of 5 ° C./min, holding at a holding time of 500 ° C. for 1 hour, and cooling at a rate of 5 ° C./min). Then, after the heat-treated glass piece and the unheated glass piece are arranged and both are fixed with the adhesive tape T, the deviation of the marking is measured. When the marking deviation is ⁇ L and the length of the sample before the heat treatment is L 0 , the thermal shrinkage rate is calculated by the equation of ⁇ L / L 0 (unit: ppm).
- the internal transmittance in the thickness direction at a wavelength of 308 nm is a value measured by UV-3100PC manufactured by Shimadzu Corporation.
- strain point Ps, annealing point Ta, and softening point Ts are values measured based on the methods of ASTM C336 and C338.
- the temperatures at high temperature viscosities of 10 4.5 dPa ⁇ s, 10 4.0 dPa ⁇ s, 10 3.0 dPa ⁇ s, and 10 2.5 dPa ⁇ s are values measured by the platinum ball pulling method.
- the liquid phase temperature TL passes through a standard sieve 30 mesh (a sieve opening of 500 ⁇ m), puts the glass powder remaining in 50 mesh (a sieve opening of 300 ⁇ m) in a platinum boat, and holds it in a temperature gradient furnace for 24 hours. This is a value obtained by measuring the temperature at which crystals (initial phase) precipitate.
- the liquidus viscosity log 10 ⁇ TL is a value obtained by measuring the viscosity of the glass at the liquidus temperature TL by a platinum ball pulling method.
- Sample No. Nos. 1 to 17 have a ⁇ -OH value of 0.15 / mm or less, the iron content in the glass is 85 to 110 mass ppm in terms of Fe 2 O 3 , and the internal transmittance in the plate thickness direction at a wavelength of 308 nm. It was 73 to 78%. Therefore, sample no. Nos. 1 to 17 are considered suitable as carrier glasses for carrying the organic resin substrate.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Electrochemistry (AREA)
- Glass Compositions (AREA)
- Laminated Bodies (AREA)
Abstract
Description
(1)熱処理工程で成膜された半導体膜中にアルカリイオンが拡散する事態を防止するため、アルカリ金属酸化物の含有量が少ないこと、
(2)生産性に優れること、例えば溶融性、清澄性、耐失透性に優れること。
logTin=log(I1/I0)-logR
logTin:内部透過率(%)
I0:入射した光の強度(%)
I1:特定の光路長を透過した後の光の強度(%)
R:反射による光の減衰率(%)
β-OH値 = (1/X)log(T1/T2)
X:板厚(mm)
T1:参照波長3846cm-1における透過率(%)
T2:水酸基吸収波長3600cm-1付近における最小透過率(%)
Claims (10)
- 有機樹脂基板を搬送するためのキャリアガラスであって、
板厚0.1~1.2mmの平板形状であり、
ガラス中の鉄含有量が、Fe2O3換算で45~130質量ppmであり、
且つ波長308nmにおける板厚方向の透過率が71~81%であることを特徴とするキャリアガラス。 - ガラス組成中のLi2O+Na2O+K2Oの含有量が0.20質量%未満であることを特徴とする請求項1に記載のキャリアガラス。
- β-OH値が0.20/mm以下であることを特徴とする請求項1又は2に記載のキャリアガラス。
- ガラス組成として、下記酸化物換算の質量%で、SiO2 55~65%、Al2O3 15~23%、B2O3 0~7%、Li2O+Na2O+K2O 0~0.20%未満、MgO 0~6%、CaO 0.1~10%、SrO 0~10%、BaO 0~13%、Fe2O3 60~130ppm、As2O3 0~0.010%未満、Sb2O3 0~0.010%未満を含有することを特徴とする請求項1~3の何れかに記載のキャリアガラス。
- 常温から5℃/分の速度で昇温し、500℃で1時間保持し、5℃/分の速度で降温した時の熱収縮率が20ppm以下であることを特徴とする請求項1~4の何れかに記載のキャリアガラス。
- 液相温度が1300℃以下であることを特徴とする請求項1~5の何れかに記載のキャリアガラス。
- 高温粘度102.5dPa・sの粘度における温度が1700℃以下であることを特徴とする請求項1~6の何れかに記載のキャリアガラス。
- キャリアガラスと有機樹脂基板とを積層させたガラス樹脂積層体であって、
キャリアガラスが、請求項1~7の何れかに記載のキャリアガラスであることを特徴とするガラス樹脂積層体。 - 有機樹脂基板を搬送するためのキャリアガラスの製造方法であって、
ガラス組成として、下記酸化物換算の質量%で、SiO2 55~65%、Al2O3 15~23%、B2O3 0~7%、Li2O+Na2O+K2O 0~0.20%未満、MgO 0~6%、CaO 0.1~10%、SrO 0~10%、BaO 0~13%、Fe2O3 45~130質量ppm、As2O3 0~0.010%未満、Sb2O3 0~0.010%未満を含有し、且つ波長308nmにおける板厚方向の透過率が71~81%であるガラスが得られるように、ガラスバッチを調合する調合工程と、調合されたガラスバッチに対して、加熱電極による通電加熱を行うことにより、溶融ガラスを得る溶融工程と、得られた溶融ガラスをオーバーフローダウンドロー法により板厚0.1~1.2mmの平板形状に成形する成形工程と、を有することを特徴とするキャリアガラスの製造方法。 - MgO導入原料とCaO導入原料由来の鉄含有量が、Fe2O3換算で30~70質量ppmになるように、ガラスバッチを調合することを特徴とする請求項9に記載のキャリアガラスの製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201880027633.8A CN110603234A (zh) | 2017-04-27 | 2018-04-24 | 载体玻璃及其制造方法 |
CN202211050398.0A CN115366504A (zh) | 2017-04-27 | 2018-04-24 | 载体玻璃及其制造方法 |
US16/607,403 US12109780B2 (en) | 2017-04-27 | 2018-04-24 | Carrier glass and method for producing same |
JP2019514514A JP7172996B2 (ja) | 2017-04-27 | 2018-04-24 | キャリアガラス及びその製造方法 |
KR1020197027212A KR102706630B1 (ko) | 2017-04-27 | 2018-04-24 | 캐리어 유리 및 그 제조 방법 |
JP2022173042A JP7392916B2 (ja) | 2017-04-27 | 2022-10-28 | キャリアガラス及びその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017088071 | 2017-04-27 | ||
JP2017-088071 | 2017-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018199059A1 true WO2018199059A1 (ja) | 2018-11-01 |
Family
ID=63919026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/016539 WO2018199059A1 (ja) | 2017-04-27 | 2018-04-24 | キャリアガラス及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US12109780B2 (ja) |
JP (2) | JP7172996B2 (ja) |
KR (1) | KR102706630B1 (ja) |
CN (2) | CN110603234A (ja) |
TW (2) | TWI820543B (ja) |
WO (1) | WO2018199059A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021102106A1 (en) * | 2019-11-21 | 2021-05-27 | Corning Incorporated | Recycled glass and glass-ceramic carrier sustrates |
JP2023011770A (ja) * | 2017-04-27 | 2023-01-24 | 日本電気硝子株式会社 | キャリアガラス及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014175215A1 (ja) * | 2013-04-23 | 2014-10-30 | 旭硝子株式会社 | 無アルカリガラス基板およびその製造方法 |
JP2015034122A (ja) * | 2013-07-11 | 2015-02-19 | 日本電気硝子株式会社 | ガラス |
JP2016183091A (ja) * | 2015-03-10 | 2016-10-20 | 日本電気硝子株式会社 | ガラス基板 |
WO2017006801A1 (ja) * | 2015-07-03 | 2017-01-12 | 旭硝子株式会社 | キャリア基板、積層体、電子デバイスの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU666831B2 (en) * | 1993-11-16 | 1996-02-22 | Ppg Industries Ohio, Inc. | Gray glass composition |
DE10307422B4 (de) * | 2003-02-21 | 2008-08-07 | Schott Ag | Verwendung eines Glassubstrats zur Herstellung eines Datenspeichers |
JP4789059B2 (ja) * | 2004-06-23 | 2011-10-05 | 日本電気硝子株式会社 | 無アルカリガラス基板 |
EP1911725A4 (en) * | 2005-07-06 | 2010-07-07 | Asahi Glass Co Ltd | PROCESS FOR PRODUCING NON-ALKALI GLASS AND NON-ALKALI GLASS |
WO2008029799A1 (fr) * | 2006-09-04 | 2008-03-13 | Nippon Electric Glass Co., Ltd. | Procédé de fabrication de verre |
JP5808069B2 (ja) * | 2007-02-16 | 2015-11-10 | 日本電気硝子株式会社 | 太陽電池用ガラス基板 |
KR101930681B1 (ko) * | 2011-11-18 | 2018-12-18 | 에이지씨 가부시키가이샤 | 화학 강화용 유리 |
CN105164068A (zh) * | 2012-12-21 | 2015-12-16 | 康宁股份有限公司 | 具有改进的总节距稳定性的玻璃 |
EP3008022B1 (en) * | 2013-06-14 | 2020-12-30 | Corning Incorporated | Laminated sealing sheet |
KR101493396B1 (ko) | 2013-07-26 | 2015-02-13 | 코닝정밀소재 주식회사 | 디스플레이 패널용 초 박판 유리 핸들링 방법 |
CN115636583A (zh) | 2014-04-07 | 2023-01-24 | 日本电气硝子株式会社 | 支承玻璃基板及使用其的层叠体 |
WO2016194693A1 (ja) * | 2015-06-02 | 2016-12-08 | 日本電気硝子株式会社 | ガラス |
US12109780B2 (en) | 2017-04-27 | 2024-10-08 | Nippon Electric Glass Co., Ltd. | Carrier glass and method for producing same |
-
2018
- 2018-04-24 US US16/607,403 patent/US12109780B2/en active Active
- 2018-04-24 CN CN201880027633.8A patent/CN110603234A/zh active Pending
- 2018-04-24 WO PCT/JP2018/016539 patent/WO2018199059A1/ja active Application Filing
- 2018-04-24 CN CN202211050398.0A patent/CN115366504A/zh active Pending
- 2018-04-24 KR KR1020197027212A patent/KR102706630B1/ko active IP Right Grant
- 2018-04-24 JP JP2019514514A patent/JP7172996B2/ja active Active
- 2018-04-25 TW TW110147812A patent/TWI820543B/zh active
- 2018-04-25 TW TW107114018A patent/TWI754048B/zh active
-
2022
- 2022-10-28 JP JP2022173042A patent/JP7392916B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014175215A1 (ja) * | 2013-04-23 | 2014-10-30 | 旭硝子株式会社 | 無アルカリガラス基板およびその製造方法 |
JP2015034122A (ja) * | 2013-07-11 | 2015-02-19 | 日本電気硝子株式会社 | ガラス |
JP2016183091A (ja) * | 2015-03-10 | 2016-10-20 | 日本電気硝子株式会社 | ガラス基板 |
WO2017006801A1 (ja) * | 2015-07-03 | 2017-01-12 | 旭硝子株式会社 | キャリア基板、積層体、電子デバイスの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023011770A (ja) * | 2017-04-27 | 2023-01-24 | 日本電気硝子株式会社 | キャリアガラス及びその製造方法 |
US12109780B2 (en) | 2017-04-27 | 2024-10-08 | Nippon Electric Glass Co., Ltd. | Carrier glass and method for producing same |
WO2021102106A1 (en) * | 2019-11-21 | 2021-05-27 | Corning Incorporated | Recycled glass and glass-ceramic carrier sustrates |
US11823967B2 (en) | 2019-11-21 | 2023-11-21 | Corning Incorporated | Recycled glass and glass-ceramic carrier sustrates |
Also Published As
Publication number | Publication date |
---|---|
TW201843120A (zh) | 2018-12-16 |
JP2023011770A (ja) | 2023-01-24 |
JPWO2018199059A1 (ja) | 2020-03-12 |
JP7172996B2 (ja) | 2022-11-16 |
US20200130325A1 (en) | 2020-04-30 |
KR102706630B1 (ko) | 2024-09-13 |
CN110603234A (zh) | 2019-12-20 |
TWI820543B (zh) | 2023-11-01 |
JP7392916B2 (ja) | 2023-12-06 |
CN115366504A (zh) | 2022-11-22 |
KR20190141654A (ko) | 2019-12-24 |
US12109780B2 (en) | 2024-10-08 |
TW202212134A (zh) | 2022-04-01 |
TWI754048B (zh) | 2022-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7036168B2 (ja) | 無アルカリガラス基板 | |
JP7197978B2 (ja) | ガラス | |
JP7382014B2 (ja) | ガラス板及びその製造方法 | |
JP7392916B2 (ja) | キャリアガラス及びその製造方法 | |
JP2022116123A (ja) | ガラス | |
WO2018116731A1 (ja) | ガラス | |
TW202342390A (zh) | 玻璃 | |
JP7226508B2 (ja) | ガラス基板 | |
CN110494402B (zh) | 玻璃基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18791231 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019514514 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197027212 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18791231 Country of ref document: EP Kind code of ref document: A1 |