WO2018196679A1 - Module de réfrigération à semi-conducteurs et dispositif de réfrigération - Google Patents

Module de réfrigération à semi-conducteurs et dispositif de réfrigération Download PDF

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Publication number
WO2018196679A1
WO2018196679A1 PCT/CN2018/083811 CN2018083811W WO2018196679A1 WO 2018196679 A1 WO2018196679 A1 WO 2018196679A1 CN 2018083811 W CN2018083811 W CN 2018083811W WO 2018196679 A1 WO2018196679 A1 WO 2018196679A1
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WO
WIPO (PCT)
Prior art keywords
heat
semiconductor refrigeration
heat insulating
insulating bracket
conducting seat
Prior art date
Application number
PCT/CN2018/083811
Other languages
English (en)
Chinese (zh)
Inventor
王定远
裴玉哲
卞伟
刘杰
王晔
张立臣
赵建芳
胡成
李新远
孟令博
Original Assignee
青岛海尔智能技术研发有限公司
青岛海尔特种电冰柜有限公司
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Application filed by 青岛海尔智能技术研发有限公司, 青岛海尔特种电冰柜有限公司 filed Critical 青岛海尔智能技术研发有限公司
Publication of WO2018196679A1 publication Critical patent/WO2018196679A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/042—Air treating means within refrigerated spaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/14—Collecting or removing condensed and defrost water; Drip trays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D25/00—Charging, supporting, and discharging the articles to be cooled
    • F25D25/02—Charging, supporting, and discharging the articles to be cooled by shelves
    • F25D25/024—Slidable shelves
    • F25D25/025—Drawers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/002—Liquid coolers, e.g. beverage cooler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/04—Treating air flowing to refrigeration compartments
    • F25D2317/041—Treating air flowing to refrigeration compartments by purification
    • F25D2317/0411—Treating air flowing to refrigeration compartments by purification by dehumidification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/04—Treating air flowing to refrigeration compartments
    • F25D2317/041—Treating air flowing to refrigeration compartments by purification
    • F25D2317/0413—Treating air flowing to refrigeration compartments by purification by humidification

Definitions

  • the present invention relates to a refrigeration device, and more particularly to a semiconductor refrigeration module and a refrigeration device.
  • Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration device that uses a cold amount generated by a semiconductor refrigeration chip to achieve refrigeration.
  • the semiconductor refrigerating chip includes a cold end for releasing cold and a hot end for releasing heat.
  • the cold end of the semiconductor refrigerating chip releases the cooling amount into the refrigerating compartment of the refrigerating device through the cold end radiator, and the semiconductor refrigerating unit
  • the hot end of the chip needs to dissipate heat to the outside through the hot end heat sink.
  • the cold end and the hot end of the semiconductor refrigerating chip are disposed opposite each other, the cold end heat sink and the hot end heat sink are adjacent to each other, and the cold end heat sink and the hot end heat sink are prone to heat exchange.
  • the loss of cooling capacity results in lower cooling efficiency and increased energy consumption of the refrigeration equipment.
  • the present invention provides a semiconductor refrigeration module and a refrigeration device, which can reduce the amount of cooling loss of a semiconductor refrigeration module, thereby improving the refrigeration efficiency of the refrigeration device and reducing energy consumption.
  • a semiconductor refrigeration module includes a semiconductor refrigeration chip and a heat pipe, the semiconductor refrigeration chip including a cold end surface that releases a cold amount and a heat end surface that releases heat, and further includes an assembly module, wherein the assembly module includes a first heat insulation a bracket, a second heat insulating bracket, a hot end heat conducting seat and a cold end heat conducting seat, wherein the first heat insulating bracket is fixed on the second heat insulating bracket, the first heat insulating bracket and the second heat insulating Forming a mounting cavity between the brackets, the first heat insulating bracket is provided with a mounting hole that communicates with the mounting cavity, the semiconductor cooling chip is located in the mounting hole, and the cold end heat conducting seat is disposed in the Installed in the cavity and with the The cold end contact of the semiconductor refrigeration chip is disposed on the first heat insulating bracket and is in contact with the hot end surface of the semiconductor refrigeration chip, and the heat pipe is connected to the cold end heat conducting seat.
  • the assembly module includes a first heat insulation a bracket, a
  • the outer surface of the first heat insulating bracket is provided with a heat insulating groove around the mounting hole, and the heat insulating groove is provided with heat insulating cotton; the hot end surface of the semiconductor refrigeration chip is convex outward Out of the outer surface of the first insulated support.
  • the outer surface of the first heat insulating bracket is further provided with a wiring groove, and the wiring groove is in communication with the mounting hole.
  • the cold-end heat-conducting seat is provided with a avoidance notch
  • the first heat-insulating bracket, the second heat-insulating bracket and the hot-end heat-conducting seat are respectively provided with through holes, and the bolts are pierced In the corresponding through hole, the bolt passes through a region formed by the avoidance notch.
  • the cold-end heat conducting seat comprises a first heat conducting plate and a second heat conducting plate connected together, and the heat pipe is sandwiched between the first heat conducting plate and the second heat conducting plate.
  • the inner surface of the first heat conducting plate is provided with a first mounting groove disposed laterally
  • the inner surface of the second heat conducting plate is provided with a second mounting groove disposed longitudinally
  • the heat pipe is divided into a lateral flat heat pipe and a longitudinal flat heat pipe
  • the horizontal flat heat pipe is disposed in the first installation groove
  • the longitudinal flat heat pipe is disposed in the second installation groove
  • the flat heat pipes are in contact with each other.
  • an inner surface of the first heat insulating bracket is provided with a first pipe groove for mounting the heat pipe, and an edge of the second heat insulating bracket is provided with a gap or a through hole for the heat pipe to pass through Hole or second tube slot
  • an outer surface of the first heat insulating bracket is disposed with a plurality of positioning baffles around the outer side of the mounting hole, and the hot end heat conducting seat is disposed between the plurality of positioning baffles.
  • the semiconductor refrigeration module includes a plurality of the semiconductor refrigeration chips, and the assembly module is configured with the hot end heat conduction seat and the cold end heat conduction seat corresponding to the semiconductor refrigeration chip, and
  • the first heat insulating bracket is provided with the mounting hole corresponding to the semiconductor cooling chip.
  • the present invention also provides a refrigeration apparatus including a liner, and further comprising the above semiconductor refrigeration module; the heat pipe of the semiconductor refrigeration module is attached to a surface of the inner tank.
  • the advantages and positive effects of the present invention are: installing a cold-end heat-conducting seat by using a mounting cavity formed between two heat-insulating brackets, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat
  • the effective insulation interval of the heat-insulating bracket can greatly reduce the amount of heat exchange between the cold-end heat-conducting seat and the hot-end heat-conducting seat, effectively reduce the loss of cooling capacity, and improve the cooling efficiency and energy of the refrigeration equipment. Consumption.
  • the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulating bracket, and ensures the good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conducting seat to ensure the heat conduction between the hot end surface and the hot end of the semiconductor refrigeration chip. Good contact, ensuring rapid heat dissipation and improved reliability.
  • FIG. 1 is a schematic structural view of an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 2 is a front structural view of a first heat insulating bracket in an embodiment of a semiconductor refrigeration module according to the present invention
  • FIG. 3 is a schematic view showing the reverse structure of a first heat insulating bracket in an embodiment of a semiconductor refrigeration module according to the present invention
  • FIG. 4 is a front structural view of a second heat insulating bracket of an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 5 is a schematic diagram showing the reverse structure of a second heat insulating bracket in an embodiment of a semiconductor refrigeration module according to the present invention
  • FIG. 6 is a schematic structural view of a first heat conducting plate in an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 7 is a schematic structural view of a second heat conducting plate in an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 8 is an exploded view of an embodiment of a semiconductor refrigeration module of the present invention.
  • FIG. 9 is a reference diagram of a use state of an embodiment of a semiconductor refrigeration module according to the present invention.
  • the semiconductor refrigeration module of the present embodiment includes a semiconductor refrigerating chip 1 and a heat pipe 2, and the semiconductor refrigerating chip 1 includes a cold end surface that releases a cooling amount and a hot end surface that releases heat.
  • the module 3 includes a first heat insulating bracket 31, a second heat insulating bracket 32, a hot end heat conducting seat 33 and a cold end heat conducting seat 34, and the first heat insulating bracket 31 is fixed to the second partition.
  • the first cavity 311 and the second groove 321 are formed in the mounting cavity having the temperature isolation function between the first heat insulating bracket 31 and the second heat insulating bracket 32.
  • the semiconductor refrigerating chip 1 is located in the mounting hole 312, and the cold end heat conducting seat 34 is disposed in the mounting cavity and is in contact with the cold end surface of the semiconductor refrigerating chip 1
  • the hot end heat conducting seat 33 is disposed on the first heat insulating bracket 31 and is in contact with the hot end surface of the semiconductor refrigerating chip 1, and the heat pipe 2 is connected to the cold end heat conducting seat 34.
  • the semiconductor refrigerating module of the present embodiment embeds the semiconductor refrigerating chip 1 in the mounting hole 312 of the first heat insulating bracket 31, and the periphery of the semiconductor refrigerating chip 1 is wrapped by the first heat insulating bracket 31.
  • the hot end heat conducting seat 33 and the cold end heat conducting seat 34 are spaced apart by the first heat insulating bracket 31, so that the heat transfer between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 can be effectively reduced, thereby reducing the cold.
  • the cold-end heat-conducting seat 34 is wrapped in a mounting cavity formed by the first heat-insulating bracket 31 and the second heat-insulating bracket 32, and the cold-end heat conduction.
  • the cooling capacity generated by the semiconductor cooling chip 1 conducted by the seat 34 can be quickly transmitted to the required area through the heat pipe 2, thereby reducing the amount of cold loss of the cold-end heat conducting seat 34, and more effectively reducing the energy consumption and improving the cooling efficiency.
  • the inner surface of the first heat insulating bracket 31 and/or the inner surface of the second heat insulating bracket 32 are provided with a groove, and the mounting cavity is formed by the groove, for example: the inner surface of the first heat insulating bracket 31
  • the first recess 311 is disposed with a mounting hole 312 extending through the first heat insulating bracket 31, and the inner surface of the second heat insulating bracket 32 is provided with a second recess.
  • the groove 321 defines a mounting cavity between the first groove 311 and the second groove 321 .
  • the outer surface of the first heat insulating bracket 31 is provided with a heat insulating groove 313 around the mounting hole 312, and the heat insulating groove 313 is provided with heat insulating cotton (not labeled);
  • the hot end face of 1 protrudes outwardly from the outer surface of the first heat insulating bracket 31.
  • the heat insulating groove 313 can be provided with heat insulating cotton on the periphery of the semiconductor refrigeration chip 1, so that the heat insulating ring formed by the heat insulating cotton further reduces the cold amount of the cold end surface of the semiconductor refrigeration chip 1 to be lost, and also The heat of the hot end face of the semiconductor refrigeration chip 1 can be reduced into the mounting cavity to minimize the loss of the cooling capacity; and the thermal end face of the semiconductor refrigerating chip 1 is slightly higher than the outer surface of the first heat insulating support 31, on the one hand, the semiconductor The hot end face of the refrigerating chip 1 and the hot end heat conducting seat 33 can be in good contact with heat transfer. On the other hand, the hot end face of the semiconductor refrigerating chip 1 is separated from the mounting hole.
  • the heat can be reduced from the mounting hole 312 into the mounting cavity, and the loss of the cooling capacity can be effectively reduced.
  • the outer surface of the first heat insulating bracket 31 is further provided with a wiring groove 314, and the wiring groove 314 is in communication with the mounting hole 312.
  • the semiconductor refrigeration module of the present embodiment includes a plurality of the semiconductor refrigeration chips 1 according to the cooling capacity of the refrigeration device, and the assembly module 3 is provided with the hot-end heat conduction seat 33 corresponding to the semiconductor refrigeration chip 1. And the cold end heat conducting seat 34, and the first heat insulating bracket 31 is provided with the mounting hole 312 corresponding to the semiconductor refrigeration chip 1.
  • the cold end heat conducting seat 34 is provided with a avoidance notch 340, the first heat insulating A through hole (not labeled) is disposed on the bracket 31, the second heat insulating bracket 32 and the hot end heat conducting seat 33, and the bolt 35 is disposed in the corresponding through hole, and the bolt 35 passes through the The area formed by the notch 340 is described. Specifically, in the assembly process, the hot end heat conducting seat 33, the first heat insulating bracket 31, the cold end heat conducting seat 34 and the second heat insulating bracket 32 are sequentially assembled and fixed by bolts 35, and the bolts 35 are passed through.
  • the notch 340 avoids the cold end heat conducting seat 34, so that heat exchange between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 by the bolts 35 can be avoided.
  • the inner surface of the first heat insulating bracket 31 is provided with a first pipe groove 316 and a first pipe groove 317 for mounting the heat pipe 2, and an edge of the second heat insulating bracket 32 is provided for the heat pipe. 2 through the gap or through hole 322 or the second tube groove. Specifically, the heat pipe 2 passes through the first pipe groove 316 and the first pipe groove 317 and the through hole 322 to pass through the assembly module 3 to facilitate the arrangement of the heat pipe 2 on the inner casing 100 of the refrigeration equipment.
  • the outer surface of the first heat-insulating bracket 31 is provided with a plurality of positioning baffles 315 around the outer side of the mounting hole 312, and the hot-end heat-conducting seat 33 is disposed in multiple blocks. Between the positioning baffles 315. After assembly, the hot-end heat-conducting seat 33 can be conveniently positioned by the positioning baffle 315, and the hot-end heat-conducting seat 33 can be accurately contacted with the semiconductor refrigerating chip 1.
  • the cold-end heat conducting seat 34 includes a first heat conducting plate 341 and a second heat conducting plate 342 connected together, and the heat pipe 2 is sandwiched between the first heat conducting plate 341 and the second heat conducting layer. Between plates 342. Specifically, the inner surface of the first heat conducting plate 341 is provided with a first mounting groove 3411 disposed laterally, and the inner surface of the second heat conducting plate 342 is provided with a second mounting groove 3421 disposed longitudinally. a lateral flat heat pipe and a longitudinal flat heat pipe, the horizontal flat heat pipe is disposed in the first mounting groove 3411, the longitudinal flat heat pipe is disposed in the second mounting groove 3421, and the horizontal flat heat pipe and the Vertical portrait The flat heat pipes are in contact with each other.
  • the flat heat pipe can effectively increase the contact area between the heat pipe and the cold end heat conducting seat 34.
  • the flat heat pipe can effectively increase the contact area with the inner tank 100 to provide heat exchange efficiency.
  • the horizontal flat heat pipe and the longitudinal flat heat pipe are in contact with each other, so that the heat pipe temperature distribution at different positions is uniform, and the temperature difference is reduced to improve the temperature uniformity.
  • the present invention also provides a refrigeration apparatus including a liner, and further comprising the above semiconductor refrigeration module; the heat pipe of the semiconductor refrigeration module is attached to a surface of the inner tank.
  • the semiconductor refrigeration module in the embodiment of the present invention can employ the semiconductor refrigeration module in the embodiment of the semiconductor refrigeration module of the present invention.
  • the semiconductor refrigeration module of the present invention can employ the semiconductor refrigeration module in the embodiment of the semiconductor refrigeration module of the present invention.
  • FIG. - The description of Fig. 9 will not be repeated here.
  • the advantages and positive effects of the present invention are: installing a cold-end heat-conducting seat by using a mounting cavity formed between two heat-insulating brackets, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat
  • the effective insulation interval of the heat-insulating bracket can greatly reduce the amount of heat exchange between the cold-end heat-conducting seat and the hot-end heat-conducting seat, effectively reduce the loss of cooling capacity, and improve the cooling efficiency and energy of the refrigeration equipment. Consumption.
  • the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulating bracket, and ensures the good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conducting seat to ensure the heat conduction between the hot end surface and the hot end of the semiconductor refrigeration chip. Good contact, ensuring rapid heat dissipation and improved reliability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module de réfrigération à semi-conducteurs et un dispositif de réfrigération. Le module de réfrigération à semi-conducteurs comprend une puce de réfrigération à semi-conducteurs (1), un caloduc (2), et un module d'assemblage (3). Le module d'assemblage (3) comprend un premier support d'isolation thermique (31), un second support d'isolation thermique (32), un siège thermoconducteur d'extrémité chaude (33), et un siège thermoconducteur d'extrémité froide (34). Une première rainure (311) est disposée sur une surface interne du premier support d'isolation thermique (31). Un trou de montage (312) pénétrant à travers le premier support d'isolation thermique (31) est disposé dans la première rainure (311). Une seconde rainure (321) est disposée sur une surface interne du second support d'isolation thermique (32). Le premier support d'isolation thermique (31) est fixé sur le second support d'isolation thermique (32). Une cavité de montage est formée entre la première rainure (311) et la seconde rainure (321). La puce de réfrigération à semi-conducteurs (1) est située dans le trou de montage (312). Le siège thermoconducteur d'extrémité froide (34) est disposé dans la cavité de montage et est en contact avec une surface d'extrémité froide de la puce de réfrigération à semi-conducteurs (1). Le siège thermoconducteur d'extrémité chaude (33) est disposé sur le premier support d'isolation thermique (31) et est en contact avec une surface d'extrémité chaude de la puce de réfrigération à semi-conducteurs (1). Le caloduc (2) est relié au siège thermoconducteur d'extrémité froide (34). Le dispositif de réfrigération de l'invention réduit la perte de réfrigération du module de réfrigération à semi-conducteurs, améliore l'efficacité de réfrigération et réduit la consommation d'énergie.
PCT/CN2018/083811 2017-04-28 2018-04-19 Module de réfrigération à semi-conducteurs et dispositif de réfrigération WO2018196679A1 (fr)

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