WO2018192463A1 - 一种电子设备机壳 - Google Patents

一种电子设备机壳 Download PDF

Info

Publication number
WO2018192463A1
WO2018192463A1 PCT/CN2018/083269 CN2018083269W WO2018192463A1 WO 2018192463 A1 WO2018192463 A1 WO 2018192463A1 CN 2018083269 W CN2018083269 W CN 2018083269W WO 2018192463 A1 WO2018192463 A1 WO 2018192463A1
Authority
WO
WIPO (PCT)
Prior art keywords
closed
electronic device
capillary channel
working fluid
loop capillary
Prior art date
Application number
PCT/CN2018/083269
Other languages
English (en)
French (fr)
Inventor
朱伟华
方磊
杨立尚
王双礼
王先炉
Original Assignee
青岛海尔股份有限公司
北京一数科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海尔股份有限公司, 北京一数科技有限公司 filed Critical 青岛海尔股份有限公司
Publication of WO2018192463A1 publication Critical patent/WO2018192463A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the present invention relates to the field of electronic device technologies, and in particular, to an electronic device casing.
  • cooling fan For larger electronic devices such as computers, it is also possible to use a cooling fan to promote heat dissipation.
  • smaller electronic devices such as mobile phones, watches, tablets, and other portable electronic devices, in electronic devices. It is not feasible to set the cooling fan on the top, and the heat dissipation by the heat conduction of the casing is very low.
  • the intelligent electronic device there are many applications running, and the components such as the processor and the battery are more heated, only It is obviously insufficient to use the heat conduction of the casing for heat dissipation.
  • Embodiments of the present invention provide an electronic device casing to improve heat dissipation efficiency of an electronic device casing.
  • the specific technical solutions are as follows:
  • An embodiment of the present invention provides an electronic device casing, the casing body enclosing a cavity, the cavity is used for placing an original device of an electronic device, and the casing body has one or more closed loop capillary channels.
  • the closed-loop capillary channel is filled with a low-boiling working medium; the closed-loop capillary channel and the low-boiling working medium are used to dissipate heat for the original device of the electronic device; the closed-loop capillary channel has a diameter of 100-300 ⁇ m.
  • the plurality of closed loop capillary channels are independent of each other.
  • a working medium pool is disposed in the casing body, and the working fluid pool is filled with the low boiling point working medium, and the working medium pool is connected to the closed loop capillary channel to form two on each closed loop capillary channel. Connections.
  • the method further includes: providing a one-way film at the connection port; the one-way film is semi-connected to the connection port.
  • connection ports of a closed-loop capillary channel connecting the working fluid pool are respectively a first connection port and a second connection port; and further comprising: setting the first connection port and the second connection port to be different Caliber.
  • the method further includes: providing a unidirectional film in the closed loop capillary channel.
  • the working fluid pool is disposed at a position corresponding to a heat source of the electronic device.
  • the low boiling point working substance comprises one or more of freon, acetone and methanol.
  • the low boiling point working fluid is filled by one or more of vacuum filling, steam displacing and heating expulsion.
  • the embodiment of the invention provides an electronic device casing, wherein the casing body encloses a cavity, and the cavity is used for placing an original device of the electronic device.
  • the casing body has one or more closed-loop capillary channels, and the closed-loop capillary channel is filled.
  • the low-boiling working fluid When the electronic device heats up, the low-boiling working fluid is vaporized by heat, rapidly diffuses, is cold liquefied at the low temperature of the electronic device casing, and is recirculated in the capillary channel to improve heat transfer efficiency by means of liquid-cooled heat exchange, electronic equipment casing The heat dissipation effect is greatly improved.
  • the capillary channel since there is no large diameter pipe in the electronic device casing, but the capillary channel is used, the physical strength of the electronic device casing is not affected, and the application prospect is very wide.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device casing according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a second structure of an electronic device casing according to an embodiment of the present invention.
  • 01 casing body 02 closed-loop capillary channel, 03 working fluid pool, 04 processing port; 021 first connection port, 022 second connection port.
  • the embodiment of the present invention provides an electronic device casing.
  • the casing body 01 encloses a cavity, and the cavity is used for placing an original device of an electronic device;
  • One or more closed-loop capillary channels 02 (only one is shown in FIG. 1), the closed-loop capillary channel 02 is filled with a low-boiling working medium (not shown in FIG. 1); the closed-loop capillary channel 02 and the The low boiling point working fluid is used to dissipate heat from the original device of the electronic device; the closed loop capillary channel 02 has a diameter of 100-300 ⁇ m.
  • the electronic device casing is the outer casing used by various electronic devices.
  • a computer case a mobile phone case, a watch case, an instrument case, a micro motor case, and the like.
  • the material of the electronic device casing can be various, for example, a plastic casing, a metal casing, a composite casing, and the like.
  • the low boiling point working substance is a substance which is liquid at normal temperature and has a low boiling point. That is to say, the low boiling point working fluid is liquid at normal temperature, and can be vaporized after absorbing the heat generated by the operation of the electronic device.
  • the low boiling point working fluid may include one or more of freon, acetone, and methanol.
  • freon freon
  • acetone acetone
  • methanol low-boiling working fluids
  • other low-boiling working fluids can also be used. As long as the liquid is at a normal temperature, the low-boiling working fluid can be vaporized when the electronic device is heated, and is not specifically limited herein.
  • the electronic device casing provided by the embodiment of the present invention is preferably used for a small electronic device, such as a mobile phone or a wristwatch, which is small in size and cannot be installed with a heat dissipating fan, a heat dissipating tube, or the like.
  • Electronic equipment can also be used for large-scale electronic devices, such as computers, televisions and other large-scale electronic devices, to assist the heat dissipation of heat-dissipating components such as cooling fans and heat-dissipating pipes, further improve heat dissipation efficiency and enhance heat dissipation, which is reasonable.
  • the shape of the electronic device casing can be determined by a person skilled in the art according to factors such as the type and model of the electronic device, and is not specifically limited herein.
  • the material of the electronic device casing provided by the embodiment of the present invention is preferably a metal-based material, and the heat dissipation efficiency of the electronic device casing can be further improved due to the good thermal conductivity of the metal.
  • the number of closed-loop capillary channels 02 may be plural, and then the plurality of closed-loop capillary channels 02 may be independent of each other. That is to say, each closed-loop capillary channel 02 is not in communication with each other, and the low boiling point working fluid does not flow from one closed-loop capillary channel 02 to the other closed-loop capillary channel 02 to ensure that a low-boiling working medium exists in each closed-loop capillary channel 02.
  • the heat dissipation of the electronic device case more uniform and improve the heat dissipation effect.
  • the low boiling point working fluid is only diffused and liquefied in a closed loop capillary channel 02 after vaporization, ensuring that the amount of low boiling point working fluid in each closed loop capillary channel 02 is stable and the heat dissipation stability is good.
  • the plurality of closed-loop capillary channels 02 described above can also communicate with each other to form a capillary channel network, which is also reasonable.
  • the number of the closed-loop capillary channels can be set by a person skilled in the art according to the volume of the electronic device casing, the heat generation condition of the electronic device, and the like, and is not specifically limited herein.
  • a working fluid pool 03 may be disposed in the casing of the electronic device, and the working fluid pool 03 is filled with a low boiling point working medium, the working medium pool 03 and a plurality of closed loops.
  • the capillary channel 02 is in communication, and two connection ports, that is, a first connection port 021 and a second connection port 022 are formed on each closed-loop capillary channel 02 to connect the working fluid pool 03.
  • the thermal conductivity of the electronic device casing can be improved as a whole.
  • silver is about 429
  • pure copper is about 401
  • pure aluminum is about 237 (W/(m ⁇ K)).
  • the thermal conductivity of the casing with a closed-loop capillary channel can reach about 20,000 (W / (m ⁇ K)).
  • the flow of the low boiling point working fluid in the closed loop capillary channel 02 and the working fluid pool 03 may be disordered.
  • the disorderly flow of low-boiling working fluid can still greatly improve the thermal conductivity of the entire electronic equipment casing.
  • a unidirectional film (not shown in FIG. 2) may be disposed at the connection port of the closed loop capillary 02 and the working fluid pool 03. That is to say, the resistance of the fluid passing from one side of the one-way membrane is much smaller than the resistance that passes from the other side.
  • the one-way film may be semi-connected to the connection port.
  • the specific material and structure of the one-way film are not specifically limited.
  • the one-way film may be disposed on the first connection port 021 or the second connection port 022, or may be disposed on the first connection port 021 and the second connection port 022 at the same time.
  • the unidirectional film may be disposed within the closed loop capillary 02 regardless of whether the working fluid pool 03 is disposed in the electronic device housing. This can ensure that the vaporized gas of the low boiling point working fluid in the working fluid pool 03 can only enter the closed loop capillary channel 02 from one connection port, and the low boiling point working fluid enters the working fluid pool 03 from the other connecting port after the liquefaction, forming a low
  • the one-way flow cycle of the boiling point working fluid further enhances the heat dissipation effect.
  • the first connection port 021 and the second connection port 022 of a closed-loop capillary channel connection working fluid pool may be set to different diameters.
  • the diameter of the first connection port 021 is set to 100 ⁇ m
  • the second connection port 022 is The caliber is set to 300 ⁇ m. Because the diameter of the fluid flowing through the channel will affect the flow velocity of the fluid, the flow velocity of the working fluid at different diameters of the first connection port 021 and the second connection port 022 is different under the specific temperature and pressure of the working fluid pool, thereby also It can realize the guiding work for single item flow.
  • the low-boiling working medium or the low-boiling working medium vaporized in the working fluid pool 03 can enter the plurality of closed-loop capillary channels 02 from the connection port, and the gas state in the plurality of closed-loop capillary channels 02 is low. After the liquefied working fluid is liquefied away from the heat source, it can flow back from the connection port to the working fluid pool 03 to form a stable gas-liquid circulation.
  • the working fluid pool 03 Due to the limited volume of the closed-loop capillary channel 02, it is impossible to fill a large amount of low boiling point working fluid, and the working fluid pool 03 has a large volume, and can be filled with a relatively large amount of low boiling point working medium, so that the low boiling point working medium is in the evaporation-boiling-condensing process.
  • the heat dissipation efficiency is higher and the heat dissipation is larger.
  • the specific filling amount of the low-boiling working medium can be determined by a person skilled in the art according to the heat generation condition of the electronic device used for the electronic device casing, and is not specifically limited herein.
  • the working fluid pool 03 may be disposed at a position corresponding to a heat source of the electronic device. That is to say, the working fluid pool 03 can be disposed at a position closer to the heat source of the electronic device.
  • the working fluid pool 03 can be disposed in a portion of the electronic device casing that is in contact with the battery, so that the low boiling point working medium in the working fluid pool 03 can It absorbs heat to the maximum extent and vaporizes, improving the heat dissipation efficiency of the electronic device casing, and the heat dissipation effect is better.
  • FIG. 1 and FIG. 2 are only schematic structural diagrams of an electronic device casing provided by an embodiment of the present invention.
  • the shape of the electronic device casing appears in FIG. 1 and FIG. 2, the shape and number of the closed-loop capillary channel and The position and the shape and position of the working fluid pool, but the electronic device casing in the technical solution provided by the embodiment of the present invention is not the shape shown in FIG. 1 or FIG. 2, nor does it represent the embodiment of the present invention.
  • the closed-loop capillary channel 02 can be fabricated by a sintered trench tube fabrication process and a metal mesh fabrication process, that is, a processing opening is generally required on the surface of the electronic device casing, and then The capillary channel is formed by washing, etching, etc., as shown in Fig.
  • the processing port 04 when processing the closed-loop capillary channel 02, the processing port 04 can be first opened, and then the capillary channel is formed by washing, etching, etc., after the capillary channel is formed, the ion channel can be passed.
  • the sealing method of the welding, argon welding and the like seals the machining port 04 to form a closed loop capillary channel 02.
  • the low boiling point working fluid can be filled into the capillary channel and then passed through the ion ion.
  • Sealing methods such as welding and argon welding block the processing port to form a closed-loop capillary channel filled with a low boiling point working fluid.
  • the position of the processing port is determined according to the position of the closed-loop capillary channel.
  • the shape and position of the processing port shown in FIG. 2 cannot be limited to the technical solutions provided by the embodiments of the present invention.
  • the filling method of the low boiling point working medium may be one or several modes of vacuum filling, steam expulsion, and heating expulsion, as long as the low boiling point working medium can be filled into the closed loop capillary channel. Yes, there is no specific limit here.
  • an enclosure of an electronic device encloses a cavity, and a cavity is used for placing an original device of an electronic device.
  • the housing has one or more closed-loop capillary channels and a closed-loop capillary.
  • the channel is filled with low boiling point working fluid, closed loop capillary channel and low boiling point working medium are used for heat dissipation of the original device of the electronic device, and the diameter of the closed loop capillary channel is 100-300 ⁇ m.
  • the low-boiling working fluid When the electronic device heats up, the low-boiling working fluid is vaporized by heat, rapidly diffuses, is cold liquefied at the low temperature of the electronic device casing, and is recirculated in the capillary channel to improve heat transfer efficiency by means of liquid-cooled heat exchange, electronic equipment casing The heat dissipation effect is greatly improved.
  • the capillary channel since there is no large diameter pipe in the electronic device casing, but the capillary channel is used, the physical strength of the electronic device casing is not affected, and the application prospect is very wide.

Abstract

本发明提供了一种电子设备机壳，机壳本体内具有一个或多个闭环毛细管道，闭环毛细管道内填充有低沸点工质，闭环毛细管道的口径为100-300μm。所述电子设备机壳能够大大提高散热效果，并且电子设备机壳的物理强度不会受到任何影响，应用前景非常广泛。

Description

一种电子设备机壳
本申请要求了申请日为2017年04月18日，申请号为201710253445.4，发明名称为“一种电子设备机壳”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子设备技术领域，特别是涉及一种电子设备机壳。
背景技术
电子科技飞速发展，手机、电脑等几乎已成为人们日常生活中必不可少的电子设备。这些电子设备在工作时，处理器、电池等部件会产生热量，影响电子设备的运行效率和寿命，因此，一般电子设备均采用金属机壳，以利于热量的散发，降低电子设备的温度。
对于电脑等体积较大的电子设备，还可以采用安装降温风扇的方式促进散热，但是，对于体积较小的电子设备而言，例如，手机、腕表、平板电脑等便携式电子设备，在电子设备上设置降温风扇是不可行的，而只通过机壳的热传导进行散热的效率又很低，特别是对于智能电子设备，其运行的应用程序较多，处理器和电池等部件发热更大，仅仅利用机壳的热传导作用进行散热显然是不足的。
为了提高散热效率，现有的散热部件中，有些利用围合液态单质金属/金属合金散热。但该方案中，由于需要在散热部件内填充液态单质金属/金属合金，所以会导致电子设备机壳的内部出现口径较大的管道，使得电子设备机壳的物理强度大幅度降低，难以满足电子设备防跌落、防碰撞等性能需求，应用前景非常有限。
发明内容
本发明实施例提供了一种电子设备机壳，以提高电子设备机壳的散热效率。具体技术方案如下：
本发明实施例提供了一种电子设备机壳，机壳本体围合形成空腔，所述空腔用于放置电子设备的原器件；所述机壳本体内具有一个或多个闭环毛细管道，所述闭环毛细管道内填充有低沸点工质；所述闭环毛细管道和所述低沸点工质用于为所述电子设备的原器件散热；所述闭环毛细管道的口径为100-300μm。
可选的，当所述闭环毛细管道的数量为多个时，则所述多个闭环毛细管道相互独立。
可选的，所述机壳本体内设置工质池，所述工质池内填充有所述低沸点工质，所述工质池与所述闭环毛细管道连通，在每个闭环毛细管道上形成两个连接口。
可选的，还包括：在所述连接口处设置单向膜；所述单向膜与所述连接口半连接。
可选的，一个闭环毛细管道连接工质池的所述两个连接口分别是第一连接口和第二连接口；则还包括：将所述第一连接口和第二连接口设置成不同的口径。
可选的，还包括：在所述闭环毛细管道内设置单向膜。
可选的，所述工质池设置于与电子设备发热源对应的位置。
可选的，所述低沸点工质包括：氟利昂、丙酮及甲醇中的一种或几种。
可选的，所述低沸点工质通过真空填充、蒸汽驱逐及加热驱逐中的一种或几种方式进行填充。
本发明实施例提供的一种电子设备机壳，机壳本体围合形成空腔，空腔用于放置电子设备的原器件，机壳本体内具有一个或多个闭环毛细管道，闭环毛细管道内填充有低沸点工质，闭环毛细管道和低沸点工质用于为电子设备的原器件散热，闭环毛细管道的口径为100-300μm。当电子设备发热时，低沸点工质受热汽化，快速扩散，在电子设备机壳低温处受冷液化，在毛细管道中进行回流循环，通过液冷换热的方式提高传热效率，电子设备机壳的散热效果大大提高，同时，由于电子设备机壳中不存在口径较大的管道，而是采用毛细管道，所以电子设备机壳的物理强度不会受到任何影响，应用前景非常广泛。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例所提供的电子设备机壳的第一种结构示意图；
图2为本发明实施例所提供的电子设备机壳的第二种结构示意图。
其中，图1和图2中各组件名称与相应附图标记之间的对应关系为：
01机壳本体、02闭环毛细管道、03工质池、04加工口；021第一连接口、022第二连接口。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例提供了一种电子设备机壳，如图1所示，机壳本体01围合形成空腔，所述空腔用于放置电子设备的原器件；所述机壳本体01内具有一个或多个闭环毛细管道02(图1中只示出1个)，所述闭环毛细管道02内填充有低沸点工质(图1中未示出)；所述闭环毛细管道02和所述低沸点工质用于为所述电子设备的原器件散热；所述闭环毛细管道02的口径为100-300μm。
可以理解的是，电子设备机壳即为各种电子设备所使用的外壳。例如，电脑机壳、手机机壳、腕表机壳、仪器仪表机壳、微型电机机壳等。电子设备机壳的材料可以为多种，例如，塑料机壳、金属机壳、复合材料机壳等。
需要说明的是，上述低沸点工质为在常温下为液态，沸点较低的物质。也就是说，该低沸点工质在常温下为液态，吸收电子设备工作产生的热量后便可以汽化。在一种实施方式中，该低沸点工质可以包括氟利昂、丙酮及甲醇中的一种或几种。当然，也可以采用其他低沸点工质，只要保证在在常温下为液态，电子设备发热时低沸点工质吸热可以汽化即可，在此不做具体限定。
作为本发明实施例的一种实施方式，本发明实施例所提供的电子设备机壳优选用于小型电子设备，例如手机、腕表等体积较小，无法安装散热风扇、散热管等散热部件的电子设备。当然也可以用于大型电子设备，例如电脑、电视等体积较大的电子设备，以辅助散热风扇、散热管等散热部件的散热，进一步提高散热效率，增强散热效果，这都是合理的。对于电子设备机壳的形状，可以由本领域技术人员根据电子设备的种类及型号等因素确定，在此不做具体限定。
另外，本发明实施例所提供的电子设备机壳的材料优选为金属类材料，由于金属导热性能好，可以进一步提高电子设备机壳的散热效率。
作为本发明实施例的一种实施方式，闭环毛细管道02的数量可以为多个，那么该多个闭环毛细管道02可以相互独立。也就是说，各个闭环毛细管道02互不相通，低沸点工质不会从一个闭环毛细管道02流动至另一个闭环毛细管道02中，以保证低沸点工质存在于每一个闭环毛细管道02中，使电子设备机壳散热更加均匀，提高散热效果。同时，也可以保证低沸点工质汽化后只在一个闭环毛细管道02内扩散、液化，保证每一个闭环毛细管道02内的低沸点工质的量稳定不变，散热稳定性好。当然，上述多个闭环毛细管道02也可以相互连通，形成毛细管道网，这也是合理的。
需要说明的是，闭环毛细管道的数量可以由本领域技术人员根据电子设备机壳的体积、电子设备的发热情况等因素设定，在此不做具体限定。
作为本发明实施例的一种实施方式，如图2所示，电子设备机壳内还可以设置一工质池03，工质池03内填充低沸点工质，工质池03与多个闭环毛细管道02连通，在每个闭环毛细管道02上形成两个连接口，即第一连接口021和第二连接口022以连接所述工质池03。
通过所述闭环毛细管道02和工质池03，以及内部填充的低沸点工质，能够从整体上提高电子设备机壳的导热系数。参考常见金属的导热系数：银约为429，纯铜约为401，纯铝 约为237(W/(m·K))。而根据实验室数据，具有闭环毛细管道的机壳导热系数可达到约20000(W/(m·K))。需要说明的是，低沸点工质在闭环毛细管道02和工质池03中的流动可能是无序的。低沸点工质无序的流动依然可以大幅度的提高电子设备机壳整体的导热系数。但是优选的可以通过结构的改进实现引导低沸点工质有序的循环流动，进一步的提高电子设备机壳的散热效果，具体如下：
作为本发明实施例的一种实施方式，在闭环毛细管02与工质池03的连接口处可以设置单向膜(图2中未示出)。也就是说，流体从单向膜一侧通过的阻力远小于从另一侧通过的阻力。所述单向膜可以与所述连接口半连接。本实施例中，对所述单向膜的具体材质和结构不做具体的限定。所述单向膜可以这是在第一连接口021或第二连接口022上，也可同时设置在第一连接口021和第二连接口022上。在另一些实施例中，无论所述电子设备机壳中是否设置工质池03，均可将所述单向膜设置在所述闭环毛细管02之内。这样可以保证工质池03内的低沸点工质汽化后的气体只可以从一个连接口进入闭环毛细管道02内，液化后低沸点工质从另一个连接口进入工质池03内，形成低沸点工质的单向流动循环，进一步提升散热效果。
或者，可以将一个闭环毛细管道连接工质池的第一连接口021和第二连接口022设置成不同的口径，例如，将第一连接口021的口径设置为100μm，将第二连接口022的口径设置为300μm。因为流体流经通道的口径将影响流体的流动速度，所以在工质池特定的温度和压强下，第一连接口021和第二连接口022不同的口径下工质流动速度不同，由此也能够实现引导工质进行单项流动。
在理想的情况下，工质池03内的低沸点工质或低沸点工质汽化后的气体可以从连接口进入多个闭环毛细管道02内，多个闭环毛细管道02内的气体状态的低沸点工质在远离发热源处液化后，可以从连接口流回工质池03中，形成稳定的气液循环。
由于闭环毛细管道02的容积有限，无法填充较多量的低沸点工质，而工质池03容积较大，可以填充较多量的低沸点工质，这样低沸点工质在蒸发-沸腾-凝结过程中的散热效率更高，散热量更大。低沸点工质的具体填充量可以由本领域技术人员根据电子设备机壳所用于的电子设备的发热情况确定，在此不做具体限定。
作为本发明实施例的一种实施方式，工质池03可以设置于与电子设备发热源对应的位置。也就是说，工质池03可以设置在与电子设备发热源距离较近的位置。例如，如果电子设备为手机、腕表，发热源一般为电池位置，那么便可以将工质池03设置在电子设备机壳 中与电池接触的部分，这样工质池03中低沸点工质可以最大程度地吸收热量而汽化，提高电子设备机壳的散热效率，散热效果更好。
需要说明的是，图1及图2只是本发明实施例所提供的电子设备机壳的结构示意图，虽然图1和图2中出现了电子设备机壳的形状，闭环毛细管道的形状、数量及位置，以及工质池的形状和位置，但并不表示本发明实施例所提供的技术方案中的电子设备机壳就是图1或图2中所示的形状，也不表示本发明实施例所提供的技术方案中就存在相应数量及位置的闭环毛细管道和工质池，图1和图2只能表示本发明实施例所提供的技术方案中可以存在闭环毛细管道和工质池，图1及图2中显示的机壳的形状，闭环毛细管道的形状、数量及位置，以及工质池的形状和位置均不能成为对本发明实施例所提供的技术方案的限定。作为本发明实施例的一种实施方式，上述闭环毛细管道02可以通过烧结沟槽管制作工艺以及金属网制作工艺来制作，也就是说，一般需要在电子设备机壳表面开设加工口，进而通过烧洗、腐蚀等方式形成毛细管道，如图2所示，加工闭环毛细管道02时首先可以开设加工口04，然后通过烧洗、腐蚀等方式形成毛细管道，毛细管道形成后，可以通过电离子焊、氩焊等封口方式将加工口04进行封堵，最终形成闭环毛细管道02。
对于机壳本体内未设置工质池的情况而言，由于低沸点工质需要填充至闭环毛细管道内，所以毛细管道加工完成后，可以先将低沸点工质填充值毛细管道内，再通过电离子焊、氩焊等封口方式将加工口封堵，形成填充有低沸点工质的闭环毛细管道。
需要说明的是，加工口的开设位置是根据闭环毛细管道的位置确定的，图2中显示的加工口的形状及位置，不能成为对本发明实施例所提供的技术方案的限定。
作为本发明实施例的一种实施方式，低沸点工质的填充方式可以为真空填充、蒸汽驱逐及加热驱逐中的一种或几种方式，只要可以将低沸点工质填充至闭环毛细管道内即可，在此不做具体限定。
可见，本发明实施例提供的一种电子设备机壳，机壳本体围合形成空腔，空腔用于放置电子设备的原器件，机壳本体内具有一个或多个闭环毛细管道，闭环毛细管道内填充有低沸点工质，闭环毛细管道和低沸点工质用于为电子设备的原器件散热，闭环毛细管道的口径为100-300μm。当电子设备发热时，低沸点工质受热汽化，快速扩散，在电子设备机壳低温处受冷液化，在毛细管道中进行回流循环，通过液冷换热的方式提高传热效率，电子设备机壳的散热效果大大提高，同时，由于电子设备机壳中不存在口径较大的管道，而是采用毛细管道，所以电子设备机壳的物理强度不会受到任何影响，应用前景非常广泛。
需要进一步说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
本说明书中的各个实施例均采用相关的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于系统实施例而言，由于其基本相似于方法实施例，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
以上所述仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内所作的任何修改、等同替换、改进等，均包含在本发明的保护范围内。

Claims (9)

  1. 一种电子设备机壳，其特征在于，机壳本体(01)围合形成空腔，所述空腔用于放置电子设备的原器件；所述机壳本体(01)内具有一个或多个闭环毛细管道(02)，所述闭环毛细管道(02)内填充有低沸点工质；所述闭环毛细管道(02)和所述低沸点工质用于为所述电子设备的原器件散热；所述闭环毛细管道(02)的口径为100-300μm。
  2. 如权利要求1所述的机壳，其特征在于，当所述闭环毛细管道(02)的数量为多个时，则所述闭环毛细管道(02)相互独立。
  3. 如权利要求1所述的机壳，其特征在于，所述机壳本体(01)内设置工质池(03)，所述工质池(03)内填充有所述低沸点工质，所述工质池(03)与所述闭环毛细管道(02)连通，在每个闭环毛细管道(02)上形成两个连接口。
  4. 根据权利要求3所述的机壳，其特征在于，还包括：在所述连接口处设置单向膜；所述单向透气膜与所述连接口半连接。
  5. 根据权利要求3所述的机壳，其特征在于，一个闭环毛细管道(02)连接工质池(03)的所述两个连接口分别是第一连接口(021)和第二连接口(022)；则还包括：将所述第一连接口021和第二连接口022设置成不同的口径。
  6. 根据权利要求2或3所述的机壳，其特征在于，还包括：在所述闭环毛细管道(02)内设置单向膜。
  7. 如权利要求3所述的机壳，其特征在于，所述工质池(03)设置于与电子设备发热源对应的位置。
  8. 如权利要求1-5任一项所述的机壳，其特征在于，所述低沸点工质包括：氟利昂、丙酮及甲醇中的一种或几种。
  9. 如权利要求8所述的机壳，其特征在于，所述低沸点工质通过真空填充、蒸汽驱逐及加热驱逐中的一种或几种方式进行填充。
PCT/CN2018/083269 2017-04-18 2018-04-17 一种电子设备机壳 WO2018192463A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710253445.4 2017-04-18
CN201710253445.4A CN107072117B (zh) 2017-04-18 2017-04-18 一种电子设备机壳

Publications (1)

Publication Number Publication Date
WO2018192463A1 true WO2018192463A1 (zh) 2018-10-25

Family

ID=59600953

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/083269 WO2018192463A1 (zh) 2017-04-18 2018-04-17 一种电子设备机壳

Country Status (2)

Country Link
CN (1) CN107072117B (zh)
WO (1) WO2018192463A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107072117B (zh) * 2017-04-18 2020-06-12 北京一数科技有限公司 一种电子设备机壳
CN107771017B (zh) * 2017-12-05 2019-10-29 南通沃特光电科技有限公司 手机壳体
CN110191621B (zh) * 2019-06-13 2021-03-19 深圳市锐尔觅移动通信有限公司 一种具有散热结构的印刷电路板叠置组件以及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201267084Y (zh) * 2008-09-24 2009-07-01 深圳华为通信技术有限公司 一种移动终端散热设备及散热型移动终端
CN103327792A (zh) * 2013-06-06 2013-09-25 江苏大学 一种无源驱动的微通道散热冷却装置
US20150055300A1 (en) * 2013-08-22 2015-02-26 Asia Vital Components Co., Ltd. Heat dissipation structure and handheld electronic device with the heat dissipation structure
CN204482215U (zh) * 2015-04-15 2015-07-15 青岛海信移动通信技术股份有限公司 一种手机散热结构
CN107072117A (zh) * 2017-04-18 2017-08-18 北京数科技有限公司 一种电子设备机壳
CN206650981U (zh) * 2017-04-18 2017-11-17 北京一数科技有限公司 一种电子设备机壳

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201267084Y (zh) * 2008-09-24 2009-07-01 深圳华为通信技术有限公司 一种移动终端散热设备及散热型移动终端
CN103327792A (zh) * 2013-06-06 2013-09-25 江苏大学 一种无源驱动的微通道散热冷却装置
US20150055300A1 (en) * 2013-08-22 2015-02-26 Asia Vital Components Co., Ltd. Heat dissipation structure and handheld electronic device with the heat dissipation structure
CN204482215U (zh) * 2015-04-15 2015-07-15 青岛海信移动通信技术股份有限公司 一种手机散热结构
CN107072117A (zh) * 2017-04-18 2017-08-18 北京数科技有限公司 一种电子设备机壳
CN206650981U (zh) * 2017-04-18 2017-11-17 北京一数科技有限公司 一种电子设备机壳

Also Published As

Publication number Publication date
CN107072117B (zh) 2020-06-12
CN107072117A (zh) 2017-08-18

Similar Documents

Publication Publication Date Title
Deng et al. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs
WO2018192463A1 (zh) 一种电子设备机壳
WO2022033289A1 (zh) 一种平板热管及其制备方法和换热器
CN107567248A (zh) 液冷散热装置
TW201040480A (en) Low-pressure circulation type thermosiphon device driven by pressure gradients
US20130213612A1 (en) Heat pipe heat dissipation structure
CN1909771A (zh) 散热装置
TWI801696B (zh) 相變散熱裝置
US20110088873A1 (en) Support structure for flat-plate heat pipe
Khairnasov et al. Heat pipes application in electronics thermal control systems
CN102208375B (zh) 一种循环散热装置、其制作方法及其组件
CN202008994U (zh) 环路热管结构
TW200428925A (en) Temperature conduction heat exchange device of circular-flow channel type
WO2021036701A1 (zh) 一种导热装置及终端设备
CN113013120A (zh) 散热装置及电子设备
CN111146528A (zh) 一种锂离子电池组热管散热装置
Mizutani et al. Experimental and analytical investigation of a 0.3-mm-thick loop heat pipe for 10 W-class heat dissipation
CN206650981U (zh) 一种电子设备机壳
Deng et al. Heat spreader based on room-temperature liquid metal
TWI604173B (zh) Heat sink device applied to loop heat pipe and manufacturing method of its shell
CN206022349U (zh) 一种热管型相变散热装置
CN201893331U (zh) 散热结构
CN212431876U (zh) 一种手机用高效散热板
CN114375146A (zh) 复合相变传热装置、复合热管及终端
CN108601286B (zh) 电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18787157

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18787157

Country of ref document: EP

Kind code of ref document: A1