WO2018192062A1

WO2018192062A1 - Temperature-humidity sensor

Info

Publication number: WO2018192062A1
Application number: PCT/CN2017/086762
Authority: WO
Inventors: 龙克文; 颜天宝
Original assignee: 佛山市川东磁电股份有限公司
Priority date: 2017-04-21
Filing date: 2017-06-01
Publication date: 2018-10-25
Also published as: CN106871973A

Abstract

Provided is a temperature-humidity sensor, comprising a hollow encapsulation case (1), wherein a PCB board (2) is arranged in the encapsulation case (1), and a humidity-sensing chip (21) is arranged at the front portion of the PCB board (2); a detection window (11) is arranged on a panel of the encapsulation case (1), a shaping frame (3) and a sizing frame (4) which are of a collared structure are arranged on the PCB board (2), the shaping frame (3), the sizing frame (4) and the detection window (11) are nested successively and are in an interference fit with each other, and the shaping frame (3) is arranged annularly around the humidity-sensing chip (21) and is connected to the PCB board (2) in a fitted manner; an upper port of the shaping frame (3) is coated by a filter membrane (33), and a rim of the filter membrane (33) is sandwiched between the sizing frame (4) and the shaping frame (3); and a threading base (24) insulates an inner cavity of the encapsulation case (1), which may decrease the consumption amount of sealant (17) in an encapsulation opening (12), the PCB board (2) is fixed by a guiding groove (14) in the encapsulation case (1), the shaping frame (3) and the sizing frame (4) cooperate with the filter membrane (33) to surround the humidity-sensing chip (21) so as to form sealed protection, which may improve the efficiency and effect of encapsulation, further improving and increasing the protective property, the sensitivity and the reliability.

Description

Temperature and humidity sensor

Technical field

[0001] The present invention relates to the technical field of temperature and humidity sensing devices, and specifically relates to a temperature and humidity sensor.

Background technique

[0002] Industrial and agricultural production, meteorology, environmental protection, national defense, scientific research, aerospace and other departments often need to measure and control the environmental humidity. Among the conventional environmental parameters, humidity is the most difficult parameter to measure accurately. A humidity sensor is a sensing device that collects moisture data in the air through a humidity sensor. It feeds back the digital analog signal to the central processor to take a series of dehumidification and humidification measures to achieve an ideal environment.

[0003] In order to obtain a more accurate detection value, the humidity sensitive chip is often directly exposed to the environment to be tested, because the dust is unfavorable and long-term in a humidity environment, and the sensor detection value is distorted due to factors such as low temperature and water vapor. The existing moisture sensitive chip packages are mostly packaged in a transistor package, a single in-line package, a SOP small-sized plastic package, and other packaging methods. The packages have different structures and different performances. A humidity sensor as proposed in Chinese Patent No. 201410351484.4, which passes through inner filter paper, inner sealant, and outer sealant

The structural layer protection of the waterproof sealing ring makes the inner chip get the protection effect of dustproof, waterproof and low temperature resistance. However, such a packaging process is complicated and the yield is low, and interference between the protective structures of the layers tends to cause the detection sensitivity of the wet chip to decrease and the measurement deviation value to be excessive. Existing humidity sensors still have many deficiencies in measurement accuracy control and environmental tolerance, and the complexity of the package structure leads to low production efficiency and yield. Therefore, the prior art has yet to be improved and developed.

technical problem

[0004] The object of the present invention is to provide a reasonable structure and convenient packaging for the defects and deficiencies of the prior art.

A temperature and humidity sensor that reduces the amount of sealant and has high sensitivity and reliability.

Problem solution

Technical solution

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A temperature and humidity sensor according to the present invention includes a hollow package shell, and a PCB board is disposed in the package shell, P The front part of the CB board is provided with a humidity sensitive chip; the panel of the package shell is provided with a detection window corresponding to the upper and lower sides of the humidity sensitive chip, and the plastic board is provided with a plastic frame and a shaping frame of the ring structure, the shaping frame and the shaping frame The detection window is sequentially nested and has an interference fit with each other, and the shaping frame ring is disposed around the humidity sensitive chip and is connected with the PCB board; the upper port of the shaping frame is coated with a filter film, and the edge of the filter film is clamped Set between the shaping frame and the shaping frame

[0007] According to the above solution, the rear end of the package is provided with a package port, and the rear end of the PCB is provided with a plurality of leads

The rear end of the PCB board is provided with a threading board for blocking the front and rear inner cavities of the encapsulating shell, and the threading board is provided with a plurality of threading holes.

According to the above aspect, the inner side walls of the encapsulating shell are provided with convex guiding strips, and the guiding strips are provided with guiding grooves, and the two sides of the PCB board are respectively disposed in the guiding grooves on the corresponding sides.

[0009] According to the above solution, the front end edge of the PCB board is in contact with the front end panel of the package shell, and the rear end edge of the PCB board is flush with the rear end of the guide strip, and the two sides of the threading board are respectively provided with two guide strip rear ends. In contrast to the setting, the sealing port on the back side of the threading plate is filled with a sealant.

[0010] According to the above solution, the front end side of the PCB board is provided with a positioning recessed groove, the front end of the shaping frame is provided with a fastening component, and the fastening component is provided with an adapter card slot laterally; the positioning insertion slot and the adaptation The card slot constitutes a cross-staggered snap structure, and the fastener is assembled on the positioning slot of the front end of the PCB board and the fastener is in contact with the front end plate of the package shell.

[0011] According to the above solution, the probe window is provided with a probe frame integrated with the package shell, the sizing frame is nested in the lower port of the probe frame, and the drafting port is provided in the port on the probe frame.

Advantageous effects of the invention

Beneficial effect

[0012] The beneficial effects of the invention are as follows: The structure of the invention is reasonable, and the inner cavity of the encapsulating shell is cut off by the threading board, and the amount of the sealing glue in the sealing mouth is reduced, and the PCB board is fixed by the guiding groove in the encapsulating shell, and the shaping frame and the shaping frame are matched with the filter. The membrane is sealed around the moisture sensitive chip to improve the packaging efficiency and effect. The port on the probe frame is easy to die and assemble through the drafting oblique port, and forms a normal water vapor outflow to the detection window; the temperature and humidity sensor is at 25 ° C, Under the condition of 65% RH, the repeated measurement deviation is in the range of 3% RH, and the detection response is within 10 s. When the operation is performed for 24 hours at 85 °C and 85% RH, the deviation of the detection value is in the range of 5<3⁄4RH; Further improvement and improvement in protection, sensitivity and reliability under operating conditions.

Brief description of the drawing

DRAWINGS 1 is a schematic view of the overall exploded structure of the present invention.

[0014] In the figure:

[0015] 1, the package shell; 2, the PCB board; 3, the plastic frame; 4, the shaped frame; 11, the detection window; 12, the package mouth; 13, the guide strip; 14, the guide groove; 15, the probe frame; Drafting oblique; 17, sealant; 21, humidity sensitive chip; 22, lead; 23, positioning slot; 24, threading plate; 25, threading hole; 31, fastener; 3 2, adapter card slot; , filter membrane.

BEST MODE FOR CARRYING OUT THE INVENTION

[0016] The technical solution of the present invention will be described below with reference to the accompanying drawings and embodiments.

[0017] As shown in FIG. 1 , a temperature and humidity sensor according to the present invention includes a hollow package 1 , a package 2 is provided with a PCB 2 , and a front portion of the PCB 2 is provided with a humidity sensitive chip 21 ; The panel of the package 1 is provided with a detection window 11 corresponding to the upper and lower sides of the humidity sensitive chip 21. The PCB 2 is provided with a ring frame 3 and a shaping frame 4, a shaping frame 3, a shaping frame 4 and a detection window. 11 is sequentially nested and has an interference fit with each other, and the shaping frame 3 is disposed around the humidity sensitive chip 21 and is connected with the PCB board 2; the upper port of the shaping frame 3 is coated with a filter film 33, and the filter film 33 The rim edge is sandwiched between the sizing frame 4 and the shaping frame 3; the filter film 33 is fixed by the shaping frame 3 and the sizing frame 4, and the sizing frame 4 and the detecting window 11 are both "back" shaped interference nesting fits. Thereby, the detection window 11 is closed, and the filter film 33 surrounds and covers the moisture sensitive chip 21 on the PCB board 2 to form a package structure, and the PCB board 2 of the package package is loaded from the rear end of the package case 1 and the humidity sensitive chip 21 thereon is placed thereon. The shaping frame 3 is facing the detection window, and the filter 33 and the shaping frame 4 are directly pressed from the detection window 11 The package can be completed, the packaging process is fast and efficient, and the protection level of the moisture sensitive chip 21 can be effectively improved; the filter film 33 is a porous air filter film, preferably a polytetrafluoroethylene, AAO/PTFE composite film or PVDF, PTFE film. The invention has the repeated measurement deviation in the range of 3% RH at 25 ° C, 65 < 3⁄4 RH, and the detection response time is within 10 s; the power is operated for 240 hours at 85 ° C, 85% RH, the detection value deviation In the range of 5% RH. Further improvements and improvements in protection, sensitivity and reliability under long-term operating conditions.

[0018] The rear end of the encapsulating shell 1 is provided with a sealing port 12, and the rear end of the PCB board 2 is provided with a plurality of lead wires 22. The rear end of the PCB board 2 is provided with a threading board 24 for blocking the front and rear inner cavities of the encapsulating shell 1. The threading plate 24 is provided with a plurality of threading holes 25; the threading plate 24 is connected to the plurality of leads 22 through the threading holes 25, and the lead wires 22 are positioned at the rear end of the PCB board 2, and the sealing port 12 on the rear side of the threading board 24 constitutes a mouthpiece Slot structure for easy sealing, threading The arrangement of the board 24 can prevent the sealant from polluting the circuit on the PCB board 2, and the threading board 24 divides the space of the package port 12 to reduce the amount of the sealant 17 to save cost.

[0019] The inner side walls of the encapsulating shell 1 are respectively provided with a convex guiding strip 13 , and the guiding strip 13 is provided with a guiding groove 14 , and the two sides of the PCB board 2 are respectively disposed through the guiding grooves 14 on the corresponding sides. The PCB board 2 is positioned and fixed in the lateral direction and the vertical direction through the guiding groove 14 and the two side walls of the package housing 1. The PCB board 2 is mounted along the guiding slot 14 and has its front end against the front end panel of the package housing 1 . The rear end is fixed by the threading plate 24 and the sealant 17, thereby facilitating the assembly of the filter film 33 and the shaping frame 4, and improving the packaging precision and efficiency of the temperature and humidity sensor.

[0020] The front end side of the PCB board 2 is disposed in contact with the front end board of the package shell 1, the rear end side of the PCB board 2 is flush with the rear end of the guide strip 13 , and the two side strips of the threading board 24 are respectively provided with two guide strips The back end of the threading plate 24 is filled with a sealant 17; the PCB board 2 is defined in the lateral direction and the vertical direction in the package shell 1, and the threading board 24 and the front end of the package shell 1 are defined. The board forms the front and rear ends of the PCB board 2, and the guide strip 13 constitutes the assembly stop structure of the threading board 24, so that the filling space of the package opening 12 is limited, and the amount of the sealant 17 is reduced.

[0021] The front end of the PCB board 2 is provided with a positioning recess 23, the front end of the shaping frame 3 is provided with a fastening member 31, and the fastening member 31 is laterally provided with an adapter card slot 32; And the adapter card slot 32 forms a cross-interlacing structure, the fastener 31 is mounted on the positioning slot 23 of the front end of the PCB board 2, and the fastener 31 is in contact with the front end panel of the package shell 1; After the card slot 32 is formed, the U-shaped cross-section structure is formed, and the fastening member 31 cooperates with the positioning recess 23 to fix the shaping frame 3 on the PCB board 2. The PCB board 2 and the front end panel of the package housing 1 clamp the fastener 31 to form the frame 3. The humidity sensitive chip 21 and the corresponding detection window 11 can be accurately surrounded.

[0022] The detection window 11 is provided with a probe frame 15 integrally formed with the package body 1. The sizing frame 4 is nested in the lower port of the probe frame 15, and the draft frame 16 is provided with a draft angle 16 in the port of the probe frame 15. The draft angle 16 is an inner bevel or a tongue and groove structure, so that the loading of the shaping frame 35 is facilitated to improve the assembly efficiency, and the water vapor outflow of the detection window 11 in the normal state is formed.

The above description is only a preferred embodiment of the present invention, and equivalent changes or modifications made to the structures, features, and principles described in the scope of the present invention are included in the scope of the present patent application. .

Claims

Claim

A temperature and humidity sensor includes a hollow package shell (1), a PC B board (2) is disposed in the package shell (1), and a humidity sensitive chip (21) is disposed at a front portion of the PCB board (2); The cover of the package (1) is provided with a detection window (11) corresponding to the upper and lower sides of the humidity sensitive chip (21), and the plastic frame (3) and the shaping frame of the loop structure are arranged on the PCB board (2) ( 4), the shaping frame (3), the shaping frame (4) and the detection window (11) are sequentially nested and have an interference fit with each other, and the shaping frame (3) is arranged around the humidity sensitive chip (21) and with the PCB board. (2) mating connection; the upper port of the shaping frame (3) is coated with a filter membrane (33), a filter membrane

The edge of (33) is sandwiched between the sizing frame (4) and the shaping frame (3).

The temperature and humidity sensor according to claim 1, wherein: a rear end of the package casing (1) is provided with a package opening (12), and a rear end of the PCB board (2) is provided with a plurality of leads (22). The rear end of the PCB board (2) is provided with a threading plate (24) for blocking the front and rear inner cavities of the package casing (1), and the threading plate (24) is provided with a plurality of threading holes (25).

The temperature and humidity sensor according to claim 2, wherein: the inner side walls of the encapsulating shell (1) are provided with convex guiding strips (13), and the guiding strips (13) are provided with guiding grooves ( 14), the two sides of the PCB board (2) are respectively disposed in the guiding grooves (14) on the corresponding side.

The temperature and humidity sensor according to claim 3, wherein: the front end side of the PCB board (2) is in contact with the front end board of the package shell (1), and the rear end side of the PCB board (2) and the guide strip (13) The rear end of the threading plate (24) is respectively disposed at the opposite ends of the two guiding strips (13), and the sealing mouth (12) on the rear side of the threading plate (24) is filled with the sealing glue (17) .

The temperature and humidity sensor according to claim 1, wherein: a front side of the PCB board (2) is provided with a positioning recess (23), and a front end of the shaping frame (3) is provided with a fastener (31). The fastening member (31) is laterally provided with an adapter card slot (32); the positioning slot (23) and the adapter slot (32) form a cross-interlacing engagement structure, and the fastener (31) is assembled on the PCB board (2) The positioning recess (23) on the front end and the fastener (31) are in contact with the front end plate of the package (1). [Claim 6] The temperature and humidity sensor according to claim 1, wherein: the detection window (1)

1) There is a probe frame (15) integrated with the package casing (1), the shaping frame (4) is nested in the lower port of the probe frame (15), and the port of the probe frame (15) is provided with a draft Mouth (16