CN104101689A - Humidity sensor - Google Patents

Humidity sensor Download PDF

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Publication number
CN104101689A
CN104101689A CN201410351484.4A CN201410351484A CN104101689A CN 104101689 A CN104101689 A CN 104101689A CN 201410351484 A CN201410351484 A CN 201410351484A CN 104101689 A CN104101689 A CN 104101689A
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China
Prior art keywords
encapsulating compound
humidity
internal layer
sensitive element
humidity sensor
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CN201410351484.4A
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CN104101689B (en
Inventor
杜甜
黄桂蓉
朱增魁
刘洋
郑韬
杨晨峰
史一凡
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Xiaogan Huagong Gaoli Electron Co Ltd
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Xiaogan Huagong Gaoli Electron Co Ltd
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Abstract

The invention relates to a humidity sensor which comprises a circuit board, a humidity sensitive element, an inner layer encapsulating compound, inner layer filter paper, an outer layer encapsulating compound, a metal casing and outer layer filter paper; the humidity sensitive element is arranged on the circuit board; the inner layer encapsulating compound coats the circuit board and enables the humidity sensitive element to be exposed out of the inner layer encapsulating compound, and the inner layer filter paper is adhered to the humidity sensitive element; the outer layer encapsulating compound coats the inner layer encapsulating compound, and enables the humidity sensitive element to be exposed out of the outer layer encapsulating compound; the metal casing wraps the outer layer encapsulating compound, an opening is formed in the metal casing, the humidity sensitive element is positioned right below the opening, the outer layer filter paper is adhered to the opening part of the opening, and is positioned above the inner layer filter paper, and the humidity sensor can achieve the dustproof, waterproof and low temperature resisting effects through the structure.

Description

Humidity sensor
Technical field
The present invention relates to a kind of sensor, relate in particular to a kind of humidity sensor.
Background technology
Tradition humidity sensor, in departments such as industrial and agricultural production, meteorology, environmental protection, national defence, scientific research, space flight, often need to be measured and control ambient humidity.But in conventional environmental parameter, humidity is a parameter of difficult Measurement accuracy.
Humidity sensor is by humidity-sensitive element, to gather the data of moisture in air, by digital analogue signal, feeds back to central processing unit, according to the humidity situation of testing environment, takes the measures such as a series of dehumidifying, humidification, makes its environment reach perfect condition.
General design is now: for the airborne humidity of accurate detection, when testing environment humidity, humidity-sensitive element wants long term exposure in environment to be measured, because the linearity of humidity-sensitive element and resistance tocrocking are poor, be easy to contaminated and affect its measuring accuracy and long-time stability, add low temperature, the steam factor such as freeze, traditional humidity sensor is very easily impaired.
Therefore be necessary to design a kind of new humidity sensor, to overcome the problems referred to above.
Summary of the invention
The object of the invention is to overcome the defect of prior art, a kind of dustproof, waterproof and low temperature resistant humidity sensor are provided.
The present invention is achieved in that
The invention provides a kind of humidity sensor, comprise wiring board, humidity-sensitive element, internal layer encapsulating compound, internal layer filter paper, outer encapsulating compound, metal shell and outer filter paper; Described humidity-sensitive element is located on described wiring board, and described internal layer encapsulating compound is coated on described wiring board, and makes described humidity-sensitive element be revealed in described internal layer encapsulating compound, and described internal layer filter paper adheres on described humidity-sensitive element; Described outer encapsulating compound is coated on described internal layer encapsulating compound, and makes described humidity-sensitive element be revealed in described outer encapsulating compound; Described metal shell is coated on described outer encapsulating compound, and described metal shell is provided with a perforate, described humidity-sensitive element be positioned at described perforate under, described outer filter paper adheres on the opening part of described perforate, and is positioned at described internal layer filter paper top.
Further, described wiring board and described internal layer encapsulating compound are one-body molded, and described outer encapsulating compound and described internal layer encapsulating compound are one-body molded.
Further, two metal sleeves penetrate described wiring board, described internal layer encapsulating compound, described outer encapsulating compound and described metal shell simultaneously.
Further, two described metal sleeves are symmetricly set in the both sides of described wiring board, and one-body molded with described internal layer encapsulating compound.
Further, the acquisition port of described humidity-sensitive element outside is provided with waterproof grommet.
Further, described internal layer encapsulating compound is provided with two-layer ring-type fin, and described waterproof grommet is located between two-layer ring-type fin, and described humidity-sensitive element is located at the center of described ring-type fin.
Further, a plurality of PVC wires are connected with described wiring board, and the position that described PVC wire contacts with described metal shell is arranged with waterproof coil.
Further, the bottom of described outer encapsulating compound is provided with foam-rubber cushion.
Further, described internal layer encapsulating compound top is provided with a plurality of projections.
The present invention has following beneficial effect:
Described humidity-sensitive element is connected with wiring board, and one-body molded with described internal layer encapsulating compound, again at the outer encapsulating compound of described internal layer encapsulating compound outer cladding, finally metal shell is coated on to described outer encapsulating compound, internal layer filter paper and outer filter paper are located on humidity-sensitive element, thereby described humidity-sensitive element is coated completely, makes described humidity sensor there is dustproof, waterproof and low temperature resistant effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The cut-open view of the humidity sensor that Fig. 1 provides for the embodiment of the present invention;
The three-dimensional exploded view of the humidity sensor that Fig. 2 provides for the embodiment of the present invention;
The stereographic map of the humidity sensor that Fig. 3 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, all other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belong to the scope of protection of the invention.
As Fig. 1 to Fig. 3, the embodiment of the present invention provides a kind of humidity sensor, comprises wiring board 9, humidity-sensitive element 8, internal layer encapsulating compound 7, internal layer filter paper 5, outer encapsulating compound 3, metal shell 2 and outer filter paper 1.
As Fig. 1 to Fig. 3, described humidity-sensitive element 8 is located on described wiring board 9, and described internal layer encapsulating compound 7 is coated on described wiring board 9, and makes described humidity-sensitive element 8 be revealed in described internal layer encapsulating compound 7, and described wiring board 9 is one-body molded with described internal layer encapsulating compound 7, that is to say employing injection mo(u)lding.Described internal layer filter paper 5 adheres on described humidity-sensitive element 8.Wherein, described internal layer encapsulating compound 7 tops are provided with a plurality of projections (illustrating, not label), position when facilitating injection molding.
As Fig. 1 to Fig. 3, described outer encapsulating compound 3 is coated on described internal layer encapsulating compound 7, and makes described humidity-sensitive element 8 be revealed in described outer encapsulating compound 3, and wherein, described outer encapsulating compound 3 is one-body molded with described internal layer encapsulating compound 7.
As Fig. 1 to Fig. 3, described metal shell 2 is coated on described outer encapsulating compound 3, wherein, described metal shell 2 is stainless steel casing, described metal shell 2 is provided with a perforate (illustrating, not label), described humidity-sensitive element 8 be positioned at described perforate under, described outer filter paper 1 adheres on the opening part of described perforate, and is positioned at described internal layer filter paper 5 tops.The acquisition port outside of described humidity-sensitive element 8 is provided with waterproof grommet 6, described internal layer encapsulating compound 7 is provided with two-layer ring-type fin and (illustrates, label not), described waterproof grommet 6 is located between two-layer ring-type fin, and described humidity-sensitive element 8 is located at the center of described ring-type fin.Described waterproof grommet 6 is also folded between described outer encapsulating compound 3 and described metal shell 2 simultaneously.
As Fig. 1 to Fig. 3, described humidity sensor also has two metal sleeves 4, two metal sleeves 4 penetrate described wiring board 9, described internal layer encapsulating compound 7, described outer encapsulating compound 3 and described metal shell 2 simultaneously, two described metal sleeves are symmetricly set in the both sides of described wiring board 9, and one-body molded with described internal layer encapsulating compound 7, that is to say employing injection mo(u)lding, for described wiring board 9, described internal layer encapsulating compound 7, described outer encapsulating compound 3 and described metal shell 2 are connected.
As Fig. 1 to Fig. 3, in addition, the bottom of described outer encapsulating compound 3 is provided with foam-rubber cushion 10, for increasing buffer action.A plurality of PVC wires 12 are connected with described wiring board 9, and described PVC wire 12 is arranged with waterproof coil 11 with the position that described metal shell 2 contacts, and for anti-sealing entry-line plate 9, thereby have guaranteed the normal work of humidity-sensitive element 8.
As Fig. 1 to Fig. 3, the assembling process of described humidity sensor is as follows: humidity-sensitive element 8 is welded on wiring board 9, two metal sleeves 4 are through in the hole of wiring board 9 both sides, by low-pressure injection molding, make internal layer encapsulating compound 7 encase wiring board 9 and humidity-sensitive element 8, the acquisition port of humidity-sensitive element 8 is out exposed, again the internal layer filter paper 5 of waterproof and breathable is attached to the acquisition port place of humidity-sensitive element 8, and then place it in metal shell 2, and place described waterproof grommet 6 around in humidity-sensitive element 8 acquisition port, finally by low-pressure injection molding, make outer encapsulating compound 3 encase internal layer encapsulating compound 7, by two metal sleeves 4, make described internal layer encapsulating compound 7, described outer encapsulating compound 3 and metal shell 2 are connected, and outer filter paper 1 is adhered on to the opening part of metal shell 2, thereby make described humidity sensor reach dustproof, waterproof, low temperature resistant effect.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.

Claims (9)

1. a humidity sensor, is characterized in that, comprises wiring board, humidity-sensitive element, internal layer encapsulating compound, internal layer filter paper, outer encapsulating compound, metal shell and outer filter paper;
Described humidity-sensitive element is located on described wiring board, and described internal layer encapsulating compound is coated on described wiring board, and makes described humidity-sensitive element be revealed in described internal layer encapsulating compound, and described internal layer filter paper adheres on described humidity-sensitive element;
Described outer encapsulating compound is coated on described internal layer encapsulating compound, and makes described humidity-sensitive element be revealed in described outer encapsulating compound;
Described metal shell is coated on described outer encapsulating compound, and described metal shell is provided with a perforate, described humidity-sensitive element be positioned at described perforate under, described outer filter paper adheres on the opening part of described perforate, and is positioned at described internal layer filter paper top.
2. humidity sensor as claimed in claim 1, is characterized in that: described wiring board and described internal layer encapsulating compound are one-body molded, and described outer encapsulating compound and described internal layer encapsulating compound are one-body molded.
3. humidity sensor as claimed in claim 1, is characterized in that: two metal sleeves penetrate described wiring board, described internal layer encapsulating compound, described outer encapsulating compound and described metal shell simultaneously.
4. humidity sensor as claimed in claim 3, is characterized in that: two described metal sleeves are symmetricly set in the both sides of described wiring board, and one-body molded with described internal layer encapsulating compound.
5. humidity sensor as claimed in claim 1, is characterized in that: the acquisition port outside of described humidity-sensitive element is provided with waterproof grommet.
6. humidity sensor as claimed in claim 5, is characterized in that: described internal layer encapsulating compound is provided with two-layer ring-type fin, and described waterproof grommet is located between two-layer ring-type fin, and described humidity-sensitive element is located at the center of described ring-type fin.
7. humidity sensor as claimed in claim 1, is characterized in that: a plurality of PVC wires are connected with described wiring board, and the position that described PVC wire contacts with described metal shell is arranged with waterproof coil.
8. humidity sensor as claimed in claim 1, is characterized in that: the bottom of described outer encapsulating compound is provided with foam-rubber cushion.
9. humidity sensor as claimed in claim 1, is characterized in that: described internal layer encapsulating compound top is provided with a plurality of projections.
CN201410351484.4A 2014-07-23 2014-07-23 Humidity sensor Active CN104101689B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018192062A1 (en) * 2017-04-21 2018-10-25 佛山市川东磁电股份有限公司 Temperature-humidity sensor
CN113514508A (en) * 2020-04-10 2021-10-19 北京中科银河芯科技有限公司 Humidity sensor and humidity detection device

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CN101603937A (en) * 2009-07-23 2009-12-16 河海大学 Cement-based material internal relative humidity proving installation and method of testing thereof
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WO2018192062A1 (en) * 2017-04-21 2018-10-25 佛山市川东磁电股份有限公司 Temperature-humidity sensor
CN113514508A (en) * 2020-04-10 2021-10-19 北京中科银河芯科技有限公司 Humidity sensor and humidity detection device

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