CN109489848A - Temperature/humiditydetection detection system and temperature-humidity detecting device - Google Patents
Temperature/humiditydetection detection system and temperature-humidity detecting device Download PDFInfo
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- CN109489848A CN109489848A CN201811642331.XA CN201811642331A CN109489848A CN 109489848 A CN109489848 A CN 109489848A CN 201811642331 A CN201811642331 A CN 201811642331A CN 109489848 A CN109489848 A CN 109489848A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
- G01K1/12—Protective devices, e.g. casings for preventing damage due to heat overloading
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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Abstract
This application discloses a kind of temperature/humiditydetection detection system and temperature-humidity detecting devices, a kind of temperature-humidity detecting device, the temperature-humidity detecting device includes at least shell, first sensor, second sensor, microcontroller, the first connecting line and the second connecting line, second sensor is arranged outside shell, first sensor and microcontroller are arranged in shell, first sensor is connect by the first connecting line with microcontroller, second sensor is connect by the second connecting line with microcontroller, second sensor includes probe, is provided with window on probe；Second sensor further includes integrated circuit, and integrated circuit corresponds to window and is arranged in probe.The temperature-humidity detecting device of the application can be improved the efficiency and accuracy of detection temperature and humidity information.
Description
Technical field
This application involves the technical field of Temperature and Humidity, it is related to a kind of temperature/humiditydetection detection system and Temperature and Humidity dress
It sets.
Background technique
Internet of Things can be realized informationization between people and object, object and object, remote management and control as new information technology
And intelligence.The Internet of Things of the prior art carries out the temperature and humidity of detection environment, but current temperature by temperature-humidity detecting device
Framework between the integrated circuit and external environment of humidity detector will affect the temperature and humidity of integrated circuit acquisition external environment
The accuracy and efficiency of information influences the experience effect of user.
Summary of the invention
In order to solve the above problem existing for the temperature-humidity detecting device of the prior art, the application provides a kind of temperature and humidity inspection
Examining system and temperature-humidity detecting device.
In order to solve the above technical problems, the application also provides a kind of temperature-humidity detecting device, the temperature-humidity detecting device is extremely
It less include that shell, first sensor, second sensor, microcontroller, the first connecting line and the second connecting line, second sensor are set
It sets outside shell, first sensor and microcontroller are arranged in shell, and first sensor passes through the first connecting line and microcontroller
Device connection, second sensor are connect by the second connecting line with microcontroller, and second sensor includes probe, are provided on probe
Window；Second sensor further includes integrated circuit, and integrated circuit corresponds to window and is arranged in probe.
In order to solve the above technical problems, the application also provides a kind of temperature/humiditydetection detection system comprising radio network gateway, long-range
Server and above-mentioned temperature-humidity detecting device, multiple temperature-humidity detecting devices and the radio network gateway establish connection, institute
It states remote server and temperature and humidity information is obtained from the temperature-humidity detecting device by the radio network gateway.
Compared with prior art, the application temperature-humidity detecting device includes at least first sensor and second sensor, the
One sensor and microcontroller are arranged in shell, and second sensor is arranged outside shell, therefore temperature-humidity detecting device can
The temperature and humidity of varying environment is detected, respectively by first sensor and second sensor simultaneously to improve the experience effect of user；
In addition, the probe of second sensor is additionally provided with a window, the integrated circuit of second sensor corresponds to window setting, integrated circuit
It is contacted by window with external environment, preferably acquires the temperature and humidity information of external environment.
Detailed description of the invention
Fig. 1 is the schematic diagram for the temperature/humiditydetection detection system that the application is applied to cold chain；
Fig. 2 is the structural schematic diagram of one embodiment of the application temperature-humidity detecting device；
Fig. 3 is the timing diagram of temperature/humiditydetection detection system in Fig. 1；
Fig. 4 is the structural schematic diagram of the first embodiment of second sensor in Fig. 2；
Fig. 5 is the structural schematic diagram of the second embodiment of second sensor in Fig. 2；
Fig. 6 is the structural schematic diagram of the 3rd embodiment of second sensor in Fig. 2；
Fig. 7 is the structural schematic diagram of the fourth embodiment of second sensor in Fig. 2；
Fig. 8 is the structural schematic diagram of the temperature-humidity detecting device of the application second embodiment；
Fig. 9 is the structural schematic diagram of the 5th embodiment of second sensor in Fig. 2；
Figure 10 is the structural schematic diagram popped one's head in Fig. 9 Temperature Humidity Sensor；
Figure 11 is the structural schematic diagram of window in Fig. 9 Temperature Humidity Sensor；
Figure 12 is the structural schematic diagram of the sixth embodiment of the application sensor；
Figure 13 is the structural schematic diagram of the first embodiment of the application probe；
Figure 14 is the structural schematic diagram of the second embodiment of the application probe.
Specific embodiment
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement
Example is merely to illustrate the application, but is not defined to scope of the present application.Likewise, following embodiment is only the portion of the application
Point embodiment and not all embodiments, institute obtained by those of ordinary skill in the art without making creative efforts
There are other embodiments, shall fall in the protection scope of this application.
The description and claims of this application and term " first ", " second ", " third ", " in above-mentioned attached drawing
The (if present)s such as four " are to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should manage
The data that solution uses in this way are interchangeable under appropriate circumstances, so that embodiments herein described herein for example can be to remove
Sequence other than those of illustrating or describe herein is implemented.In addition, term " includes " and " having " and theirs is any
Deformation, it is intended that cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, system, production
Product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or for this
A little process, methods, the other step or units of product or equipment inherently.
Referring to Figure 1, Fig. 1 discloses the schematic diagram in the application applied to the temperature/humiditydetection detection system 100 of cold chain, warm and humid
It spends detection system 100 and includes at least radio network gateway 11, temperature-humidity detecting device 12 and remote server 13.Wherein, temperature and humidity is examined
Survey temperature information and/or humidity information that device 12 is checked for object to be measured.
It include at least one temperature-humidity detecting device 12 in temperature/humiditydetection detection system 100, temperature-humidity detecting device 12 is installed
In cold chain environment, to obtain the temperature information and/or humidity information of the object to be measured in cold chain environment.
During cold chain, the carrier of stored product is generally refrigerating equipment.Refrigerating equipment can be refrigerator, refrigerator-freezer or cold
Room etc. is hidden, refrigerating equipment is mainly used for storing drug, vaccine or other articles for needing cold chain transportation.Specifically, temperature and humidity is examined
Device 12 is surveyed to be mounted in refrigerating equipment or nearby, temperature-humidity detecting device 12 be used to acquire temperature information in refrigerating equipment with
Humidity information.
The revealed temperature/humiditydetection detection system 100 of the present embodiment includes radio network gateway 11 and multiple temperature-humidity detecting devices
12, wherein multiple temperature-humidity detecting devices 12 establish that whether there is or not line channels to connect with radio network gateway 11 in pre-determined distance.Therefore,
One-to-many communication may be implemented in the revealed radio network gateway 11 of this implementation and multiple temperature-humidity detecting devices 12.Temperature and Humidity dress
After setting temperature information and the humidity information of 12 acquisition refrigerating equipments, temperature-humidity detecting device 12 sends out temperature information and humidity information
It send to the radio network gateway 11 having connected, temperature information and humidity information are uploaded to remote server 13 again by radio network gateway 11.
Remote server 13 stores and processs the temperature information and humidity information of cold chain process, specifically, remotely
Server 13 analyzes temperature information and humidity information, detects whether the temperature and humidity for meeting cold chain process by default Threshold of Temperature And Humidity
It is required that the requirement to guarantee specific low temperature environment in cold chain.Further, remote server 13 can also connect local computer
The record case of temperature information and humidity information and analysis result are passed through local computing by (not shown), remote server 13
Machine shows, specifically, operation has corresponding application software on local computer, can be to receiving and temperature information and humidity information
It is shown in the form of table, real-time curve etc., and C/S, B/S is supported to remotely access.
Specifically, when above-mentioned refrigerating equipment is cold-chain box, the temperature-humidity detecting device 12 of the present embodiment can be examined simultaneously
Survey the temperature and humidity outside cold chain box house and cabinet.As shown in Fig. 2, Fig. 2 is that the application temperature-humidity detecting device one is real
The structural schematic diagram of example is applied, temperature-humidity detecting device includes at least shell 21, first sensor 22, second sensor 23, first
Connecting line 241, the second connecting line 242 and microcontroller (mcu) 211, the temperature-humidity detecting device are above-mentioned Temperature and Humidity
Device 12.
Wherein, microcontroller 211 and first sensor 22 are arranged in shell 21, and first sensor 22 passes through the first connection
Line 241 is connect with microcontroller 211；Second sensor 23 is arranged outside shell 21, and second sensor 23 passes through the second connecting line
242 connect with microcontroller 211.First sensor 22 may be provided with the first integrated circuit 221, and second sensor 23 may be provided with
Second integrated circuit 231.In other embodiments, multiple first sensors 22 and multiple have can be set in temperature-humidity detecting device
Second sensor 23, i.e., according to product demand, multiple sensors are can be set in temperature-humidity detecting device, warm and humid for acquiring environment
Spend information.
Shell 21 can be set outside cold chain cabinet 201, such as shell 21 can be attached on the outer wall of cold chain cabinet 201.
In other embodiments, cold-chain box can pass through the modes such as groove, protruding part or fixed card buckle for temperature-humidity detecting device
It is fixed on cold chain cabinet 201.First sensor 22 is arranged outside cold chain cabinet 201, for detecting first outside cold chain cabinet 201
Temperature and humidity information.The setting of second sensor 23 can be inside cold chain cabinet 201, for detecting second in cold chain cabinet 201
Temperature and humidity information.Specifically, second sensor 23 can be attached to 201 inner wall of cold chain cabinet, alternatively, second sensor 23 can also be put
It sets among 201 inside any position of cold chain cabinet or the transport article being placed in cold chain cabinet 201.In other embodiments
In, shell 21 can be set in cold chain cabinet 201, and second sensor 23 can be set outside cold chain cabinet 201.
Cold chain cabinet 201 may be provided with a through-hole, and the diameter of through-hole is slightly larger than the diameter of second sensor 23.Second connection
One end of line 242 passes through the through-hole of cold chain cabinet 201, and second sensor 23 is placed in cold chain cabinet 201.May be used also in through-hole
To be provided with encapsulating structure, encapsulating structure is used to encapsulate the gap between the second connecting line 242 and through-hole, by the second connecting line
242 are fixed on cold chain cabinet 201, to guarantee the ambient stable inside cold chain cabinet 201.
In other embodiments, the diameter for the through-hole that cold chain cabinet 201 is arranged is slightly larger than the diameter of the second connecting line 242.
Temperature-humidity detecting device to be mounted on 201 process of cold chain cabinet as follows: second sensor 23 is separated with the second connecting line 242,
And second sensor 23 is placed in cold chain cabinet 201；One end of second connecting line 242 is passed through into through-hole, and is passed through logical
The one end in hole is connect with second sensor 23.
The working principle of temperature-humidity detecting device described in detail below:
When the temperature and humidity information outside microcontroller 211 needs to obtain cold chain cabinet 201, microcontroller 211 needs elder generation
Wake up first sensor 22.It is specific as follows:
First integrated circuit 221 of first sensor 22 can be previously stored with unique identification code, microcontroller 211 and
One integrated circuit 221 works when carrying out positive communication in wake-up period or duty cycle.First integrated circuit 221 is waking up week
It is provided with first time window in phase, the second time window is provided in the duty cycle.Wherein, first time window is waking up week
Position in phase is determined that position of second time window within the duty cycle is determined by identification code, so that microcontroller by identification code
Different location of the device 211 in wake-up period corresponds to multiple first time windows, difference of the microcontroller 211 within the duty cycle
Position corresponds to multiple second time windows.
In wake-up period:
Microcontroller 211 sends the wake-up packet comprising unique encodings；First integrated circuit 221 in a dormant state, and
First time window monitors microcontroller 211, if it find that wake-up packet then starts to receive wake-up packet, and is terminating currently
Enter the duty cycle after wake-up period.
Within the duty cycle:
First integrated circuit 221 sends the identification code of first sensor 22 to microcontroller 211 in the second time window；It is micro-
Controller 211 receives different identification codes in the second different time windows, and finds corresponding sensing according to identification code
Device.
Timing diagram as shown in Figure 3 needs and the first integrated circuit 221 and/or the second integrated circuit in microcontroller 211
When 231 progress forward direction communication, microcontroller 211 sends multiple wake-up packets.Wherein, unique including wake-up packet in each wake-up packet
Coding, for required average current as shown in the T0-T1 period in Fig. 3 a, every one wake-up packet of transmission is corresponding at this time for microcontroller 211
One pulse current.Microcontroller 211 is in the duty cycle of first sensor 22 and/or second sensor 23 in monitoring shape
State, required average current is as shown in the T1-T2 period in Fig. 3 a at this time.
As shown in Fig. 3 b and Fig. 3 c, first sensor 22 or second sensor 23 determine in wake-up period according to identification code
First time window, such as: the first integrated circuit 221 according to a few positions of identification code, such as after three when determining first for 100
Between window be 100ms；Second integrated circuit 231 according to a few positions of identification code, such as after three determined at the first time for 250
Window is 250ms；First integrated circuit 221 is monitored in 100ms, and the second integrated circuit is monitored in 250ms.
If first sensor 22 or second sensor 23 are terminating currently when first time window is monitored less than wake-up packet
Next wake-up period is gone successively to after wake-up period.Such as: the first integrated circuit 221 according to a few positions of identification code, such as after
Three determine that first time window is 200ms for 200, and microcontroller 211 does not send wake-up packet in 200ms；First
Integrated circuit 221 is monitored in first time window t1 less than carrier wave, then is entered after terminating current wakeup cycle T0-T1 next
Wake-up period T1-T2, as shown in Figure 3d.
If the first integrated circuit 221 listens to wake-up packet in first time window t1, start receive wake-up packet, and according to
The serial number of the wake-up packet received calculates the time needed to wait for into duty cycle T1-T2, for example, the first integrated circuit
221 and second the wake-up period of integrated circuit 231 be disposed as 1000ms, the first integrated circuit 221 is in first time window
100ms listens to the wake-up packet of serial number 100, and being calculated according to the serial number 100 of wake-up packet also needs equal 900ms just to can enter work
Make the period；Second integrated circuit 231 listens to the wake-up packet of serial number 250 in first time window 250ms, according to wake-up packet
Serial number 250 be calculated equal 750ms also needed just to can enter the duty cycle.First integrated circuit 221 and the second integrated circuit 231
The second time window for sending temperature and humidity information to microcontroller 211 in the duty cycle can be determined previously according to the identification code of itself
Mouthful, latter three of identification code can be specifically taken as the time point sent in second time period, for example, the first integrated circuit 221
Identification code be 10100065, the identification code of the second integrated circuit 231 is 10100075, then the first integrated circuit 221 is working
65ms in period sends the identification code of itself, the second integrated circuit 231 to microcontroller 211 as the second time window
75ms in the duty cycle sends the identification code of itself to microcontroller 211 as the second time window.Wherein, first
Integrated circuit 221 and the second integrated circuit 231 can be in dormant state in addition to the second time window in the duty cycle.
The identification code of the application can be 8, such as the first integrated circuit 221 can choose several pre-determined bits of factory number
The data set obtain identification code, and are stored in the nonvolatile storage of the first integrated circuit 221, the second integrated circuit 231
It can also obtain through the above way and store identification code.
In the present embodiment, the first integrated circuit 221 and the second integrated circuit 231 are only in the first time window of wake-up period
Mouth is monitored, can in a dormant state, since electric current required under dormant state is less than 5 in the other time of wake-up period
μ A, therefore can reduce the power consumption of the first integrated circuit 221 and the second integrated circuit 231；Moreover, the first integrated circuit 221 and
Two integrated circuits 231 can monitor microcontroller 211 in first time window, and send temperature and humidity letter in the second time window
Breath, realizes the two-way communication with microcontroller 211.In addition, the first integrated circuit 221 and the second integrated circuit 231 are sharp respectively
The second time window is determined with itself identification code, sends temperature and humidity letter to microcontroller 211 simultaneously to reduce different integrated circuits
A possibility that breath, and then reduce and even avoid data collision between multiple integrated circuits, improve between multiple integrated circuits with it is micro-
The reliability that controller 211 communicates.
Therefore, the temperature-humidity detecting device of the application can be distinguished by first sensor 22 and second sensor 23 simultaneously
The temperature and humidity of varying environment is detected, to improve the experience effect of user.
In another embodiment, to further increase communication reliability, the first integrated circuit 221 and the second integrated circuit
Third time window is additionally provided in 231 duty cycle, third time window is located at after the second time window, such as Fig. 3 b-
T3 shown in 3c, by taking the communication process of the first integrated circuit 221 and microcontroller 211 as an example, in which:
For microcontroller 211 after the identification code for receiving the first integrated circuit 221, then transmission immediately, which has confirmed that, receives this
The confirmation packet of identification code confirms to include the identification code for sending the first integrated circuit 221 of the identification code in packet.First integrated circuit
221 after sending identification code to microcontroller 211, monitor microcontroller 211 in third time window t3, to receive
The confirmation packet that microcontroller 211 is sent after receiving identification code.First integrated circuit 221 is after receiving confirmation packet, to true
The identification code recognized in packet is judged:
Determine confirmation packet in identification code it is consistent with the identification code that itself is stored when, the first integrated circuit 221 is in institute
It states and keeps dormant state in the remaining time of duty cycle, and in the first time window of next wake-up period to microcontroller
211 are monitored；
Determining, the identification code in confirmation packet and the identification code that itself stores are inconsistent or do not have in third time window
When receiving confirmation packet, the first integrated circuit 221 redefines another second time window according to corresponding identification code, and
The second time window in the subsequent work period repeats to send identification code to microcontroller 211.Wherein, the subsequent work period can be adjacent
It connects after current operating cycle.
The second time window that first integrated circuit 221 can use rear three determinations of identification code original, and using knowledge
Latter three of other code add the fourth from the last position of identification code and determining another second time window, can be avoided again while sending out
Send data.For example, the identification code of the first integrated circuit 221 and the second integrated circuit 231 is respectively 10100065 and 10101065,
The second time window that two integrated circuits are determined using latter three of identification code is 65ms, therefore two integrated circuits are equal
Temperature and humidity information is sent in the 65ms of second time period, leads to data collision, the first integrated electricity that microcontroller 211 receives
The error of the identification code of road 221 and the second integrated circuit 231.For microcontroller 211 after receiving identification code, sending includes receiving
Wrong identification code confirmation packet, the first integrated circuit 221 and the second integrated circuit 231 listen to confirmation in third time window
Packet, and judge that the identification code in confirmation packet and itself identification code are inconsistent, therefore determine that transmission data are unsuccessful, and start repeating transmission machine
System:
First integrated circuit 221 is according to latter three of the identification code fourth from the last positions plus identification code and determining corresponding
Another second time window is 65+0=65ms, when the second integrated circuit 231 determines corresponding another second according to same strategy
Between window be 65+1=66ms.65ms of first integrated circuit 221 in the subsequent work period retransmits identification code, the second integrated electricity
66ms of the road 231 in next period retransmits identification code.First integrated circuit 221 and the second integrated circuit 231 are another second
The adjacent third time window of time window continues to monitor the confirmation packet of microcontroller 211.Wherein, 221 He of the first integrated circuit
If the second integrated circuit 231 continues to start retransmission mechanism according to the confirmation packet received, institute is true in each retransmission mechanism
The strategy of the second fixed time window is different from strategy before, identical with the transmission data time for reducing different sensors
Possibility.
Referring to Fig. 4, Fig. 4 is the structural schematic diagram of the first embodiment of second sensor in Fig. 2.Second sensor 23 to
It less include heat-sensitive sensor 232, microcontroller 211 is used to obtain the resistance value of heat-sensitive sensor, and obtains temperature letter according to resistance value
Breath, therefore the revealed second sensor 23 of the present embodiment is for detecting temperature information.
Second connecting line 242 includes at least the first sub- connecting line 243 and the second sub- connecting line 244, the second connecting line 242
One end connects the heat-sensitive sensor 232 in temperature-humidity detecting device, and the other end connects the microcontroller of temperature-humidity detecting device
211.Specifically, heat-sensitive sensor 232 can be thermistor, and the first sub- connecting line 243 is used to connect the anode of thermistor
With microcontroller 211, the second sub- connecting line 244 is used to connect the cathode and microcontroller 211 of thermistor.
Thermistor can be divided into according to different materials: semiconductor thermistor, metal thermo-sensitive resistance and alloy thermal responsive
Resistance etc..Thermistor can be divided into according to different principles: posive temperature coefficient thermistor (PTC) and negative temperature coefficient heat-sensitive
Resistance (NTC).The resistance value of posive temperature coefficient thermistor increases as the temperature rises, also, when reaching a certain temperature,
Resistance value becomes very big suddenly；The resistance value of negative tempperature coefficient thermistor reduces as the temperature rises.
The resistance value of thermistor and the relationship of temperature are in non-linear relation, and temperature-sensitive electricity is stored in heat-sensitive sensor 232
Hinder corresponding resistance value table.Wake-up packet comprising unique encodings is sent to temperature-sensitive by the second sub- connecting line 244 by microcontroller 211
Sensor 232, heat-sensitive sensor 232 receives wake-up packet, and the working time is arranged according to wake-up packet and the identification code of storage.Temperature-sensitive
Sensor 232 is by the temperature information of thermistor interior acquisition environment at work, and heat-sensitive sensor 232 is by resistance Value Data
Microcontroller 211 is sent to by the first sub- connecting line 243 with resistance value table, microcontroller 211 is according to resistance Value Data and resistance value
Table can calculate corresponding temperature data.
The resistance value of thermistor is constantly transferred to microcontroller 211 by 232 need of heat-sensitive sensor of the present embodiment, and
It does not need to handle resistance value；Therefore, it can be omitted a large amount of processing unit in heat-sensitive sensor 232, to reduce heat
The volume of dependent sensor 232.Processing for temperature data is responsible for by microcontroller 211 according to resistance Value Data and resistance value table
Corresponding temperature data is obtained, to improve the treatment effeciency of microcontroller 211.
Wherein, the temperature range that can detecte of the heat-sensitive sensor 232 of the present embodiment is 10-40 DEG C, such as temperature-sensitive passes
The accuracy when the temperature detected is 25 DEG C of sensor 232 is high, therefore heat-sensitive sensor 232 is detected suitable for room temperature.
Wherein, oversheath and inner sheath (not shown) are also wrapped in outside the second connecting line 242.First sub- connecting line
243 and second sub- connecting line 244 can be used the wire of the materials such as copper, aluminium as transmission conductor.In the first sub- 243 He of connecting line
Second sub- 244 periphery of connecting line, is respectively arranged with one layer of inner sheath, inner sheath is also known as insulating sheath；Insulating sheath it is main
Effect be to insulate, guarantee the second connecting line 242 energization safety, allow the first sub- connecting line 243 and the second sub- connecting line 244 not
Any leaky can be generated；And the material softness of insulating sheath, it can guarantee well in the second connecting line 242.It is interior
Sheath is usually igelite or vinyon, is also possible to low-smoke halogen-free material.Oversheath is also known as protective sheath,
The outermost layer of second connecting line 242 is set.Oversheath plays a part of protecting the second connecting line 242, and oversheath has as resistance to
High temperature, low temperature resistant, anti-available light interference, the characteristics such as winding degree performance is good, service life is high, material is environmentally friendly.
Wherein, the diameter of the second connecting line 242 can be 1mm~3mm.Such as second the diameter of connecting line 242 can be
1.5mm, 1mm, 2mm or 3mm.The diameter of second connecting line 242 of the present embodiment is 2mm, therefore, the second connecting line 242
Diameter is small, improves the convenience of temperature-humidity detecting device.
When needing to detect the intracorporal environment temperature of cold-chain box due to second sensor 23, need 242 He of the second connecting line
Second sensor 23 is placed in cold-chain box body, at this point, cold chain cabinet needs to open up a through-hole in side, to accommodate the second connection
Line 242.Such as second connecting line 242 diameter be 1.5mm when, the diameter for the through-hole that cold chain body side opens up should be slightly bigger than
1.5mm, such as 1.6mm~1.8mm.
The diameter of second connecting line 242 can be reduced into 1.5mm by connecting line compared with the existing technology, the present embodiment,
While reducing the manufacturing cost of the second connecting line 242 itself, the influence and damage to cold chain cabinet can also be reduced.
Fig. 5 is referred to, Fig. 5 is the structural schematic diagram of the second embodiment of second sensor in Fig. 2.The second sensor 23
Including at least platinum resistance temperature sensor 233, microcontroller 211 is used to obtain the resistance value of platinum resistance temperature sensor 233, and root
Temperature information is obtained according to resistance value, therefore the revealed second sensor 23 of the present embodiment is for detecting temperature information.
Second connecting line 242 includes at least the first sub- connecting line 243 and the second sub- connecting line 244, the second connecting line 242
One end connects the platinum resistance temperature sensor 233 in temperature-humidity detecting device, and the other end connects the micro-control of temperature-humidity detecting device
Device 211 processed.Specifically, platinum resistance temperature sensor 233 can be platinum resistance, and the first sub- connecting line 243 is for connecting platinum resistance
Anode and microcontroller 211, the second sub- connecting line 244 is used to connect the cathode and microcontroller 211 of platinum resistance.
Platinum resistance, which is in different environment temperatures, has different resistance values, and microcontroller 211 passes through detection platinum resistance
Current or voltage obtain the resistance value of platinum resistance, temperature value is then gone out according to the computing the resistor value of platinum resistance.
The resistance value of platinum resistance and the relationship of temperature are in a linear relationship, and the resistance value of platinum resistance increases as the temperature rises
Add.Wake-up packet comprising unique encodings is sent to platinum resistance temperature sensor by the second sub- connecting line 244 by microcontroller 211
233, platinum resistance temperature sensor 233 receives wake-up packet, and the working time is arranged according to wake-up packet and the identification code of storage.Platinum electricity
The temperature information of the interior acquisition environment at work of temperature sensor 233 is hindered, platinum resistance temperature sensor 233 is by resistance Value Data
Microcontroller 211 is sent to by the first sub- connecting line 243 with resistance value table, microcontroller 211 is according to resistance Value Data and resistance value
Table can calculate corresponding temperature data.
Wherein, good stability can guarantee at -200~600 DEG C due to platinum resistance, if not powerful impact or
In the case where person's high current, platinum resistance temperature sensor 233 is able to maintain good working efficiency.Relative to above-described embodiment
Heat-sensitive sensor 232, the temperature range that can be detected of platinum resistance temperature sensor 233 of the present embodiment are -200~600 DEG C, inspection
It is wide to survey range, improves detection accuracy, improves the using effect of user.
Fig. 6 is referred to, Fig. 6 is the structural schematic diagram of the 3rd embodiment of second sensor in Fig. 2.The second sensor 23
Including at least platinum resistance temperature sensor 233, microcontroller 211 is used to obtain the resistance value of platinum resistance temperature sensor 233, and root
Temperature information is obtained according to resistance value, therefore the revealed second sensor 23 of the present embodiment is for detecting temperature information.
Second connecting line 242 includes at least the first sub- connecting line 243, the second sub- connecting line 244 and the sub- connecting line of third
245, one end of the second connecting line 242 connects the platinum resistance temperature sensor 233 in temperature-humidity detecting device, other end connection temperature
The microcontroller 211 of humidity detector.Specifically, platinum resistance temperature sensor 233 can be platinum resistance, the first sub- connecting line
243 for connecting the anode and microcontroller 211 of platinum resistance, and the second sub- connecting line 244 is used to connect the cathode of platinum resistance and micro-
Controller 211, the sub- connecting line 245 of third are used to be used as compensating line, and the sub- connecting line 245 of third is for connecting platinum resistance and microcontroller
Device 211, such as the sub- connecting line 245 of third and the first sub- connecting line 243 are connected in the anode and microcontroller 211 of platinum resistance in parallel
Between, to reduce the resistance value of the second connecting line 242, to compensate line loss, the efficiency of improve data transfer.
Platinum resistance, which is in different environment temperatures, has different resistance values, and microcontroller 211 passes through detection platinum resistance
Current or voltage obtain the resistance value of platinum resistance, temperature value is then gone out according to the computing the resistor value of platinum resistance.
The resistance value of platinum resistance and the relationship of temperature are in a linear relationship, and the resistance value of platinum resistance increases as the temperature rises
Add.Wake-up packet comprising unique encodings is sent to platinum resistance temperature sensor by the second sub- connecting line 244 by microcontroller 211
233, platinum resistance temperature sensor 233 receives wake-up packet, and the working time is arranged according to wake-up packet and the identification code of storage.Platinum electricity
The temperature information of the interior acquisition environment at work of temperature sensor 233 is hindered, platinum resistance temperature sensor 233 is by resistance Value Data
Microcontroller 211 is sent to by the first sub- connecting line 243 with resistance value table, microcontroller 211 is according to resistance Value Data and resistance value
Table can calculate corresponding temperature data.
Wherein, good stability can guarantee at -200~600 DEG C due to platinum resistance, if not powerful impact or
In the case where person's high current, platinum resistance temperature sensor 233 is able to maintain good working efficiency.Relative to above-described embodiment
Heat-sensitive sensor 232, the temperature range that can be detected of platinum resistance temperature sensor 233 of the present embodiment are -200~600 DEG C, inspection
It is wide to survey range, improves detection accuracy, improves the using effect of user.
The diameter of second connecting line 242 is 3-4mm.For example, the diameter of the second connecting line 242 can for 3mm, 3.5mm or
Person 4mm.When needing to detect the intracorporal environment temperature of cold-chain box due to second sensor 23, need the second connecting line 242 and
Two sensors 23 are placed in cold-chain box body, at this point, cold chain cabinet needs to open up a through-hole in side, to accommodate the second connecting line
242.Such as second connecting line 242 diameter be 3mm when, the diameter for the through-hole that cold chain body side opens up should be slightly bigger than 3mm, such as
3.1mm~3.2mm.
Fig. 7 is referred to, Fig. 7 is the structural schematic diagram of the fourth embodiment of second sensor in Fig. 2.Second connecting line 242
Including at least the first sub- connecting line 243, the second sub- connecting line 244, the sub- connecting line 245 of third and the 4th sub- connecting line 246, wherein
The second sensor 23 of one end connection temperature-humidity detecting device of second connecting line 242, the other end connect temperature-humidity detecting device
Microcontroller 211.
Specifically, the first sub- connecting line 243 is used to connect the anode and microcontroller 211 of second sensor 23, the second son
Connecting line 244 is used to connect the cathode and microcontroller 211 of second sensor 23, and the sub- connecting line 245 of third is for connecting second
The power end of sensor 23 and the power supply 25 of temperature-humidity detecting device, power supply 25 are used to power for second sensor 23, power supply 25
It is arranged in shell 21, or microcontroller 211 is powered；4th sub- connecting line 246 is for connecting second sensor 23
Ground terminal and ground connection, to discharge the electrostatic of second sensor 23.
Second connecting line 242 of the present embodiment can be I2C bus, and in other embodiments, the second connecting line 242 may be used also
Think other data lines.
The diameter of second connecting line 242 of the present embodiment can be 4-5mm, such as the diameter of the second connecting line 242 can be
4mm, 4.5mm or 5mm.The diameter of second connecting line 242 of the present embodiment is 5mm.
Second connecting line 242 of the present embodiment uses four core connecting lines, and power supply 25 is second by the sub- connecting line 245 of third
Sensor 23 power so that second sensor 23 work normally, avoid second sensor 23 additionally setting power supply, with reduce at
This.
The application also provides the temperature-humidity detecting device of second embodiment, as shown in figure 8, temperature-humidity detecting device is further
Including power supply 25, power supply 25 is connect with the power end of microcontroller 211, and for powering for microcontroller 211, power supply 25 can be set
It sets in shell 21.
Wherein, microcontroller 211 at least provided at least one GPIO (General Purpose Input Output,
Universal input/output) interface, second sensor 23 connect by the second connecting line 242 with GPIO interface, i.e. second sensor 23
Power end connect with GPIO interface.
Microcontroller 211 can control the level of GPIO interface output；GPIO interface output is controlled in microcontroller 211
When level is high level, microcontroller 211 is powered by GPIO interface to second sensor 23, so that second sensor 23 is normal
Work, detection obtain the temperature and humidity information of environment.When the level that microcontroller 211 controls GPIO interface output is low level,
Second sensor 23 stops working.
The power end of the first sensor 22 of the present embodiment can be directly connected to power supply 25 or by the first connecting line
241 connect with GPIO interface, to realize power supply.
The revealed temperature-humidity detecting device of the present embodiment controls the level of GPIO interface output by microcontroller 211,
It is powered with realizing to second sensor 23, avoids additionally being arranged power supply as the power supply of second sensor 23, save cost and space.
Referring to Fig. 9, Fig. 9 is the structural schematic diagram of the 5th embodiment of second sensor in Fig. 2.Wherein, the second sensing
Device 23 includes probe 51, and probe 51 includes framework 511, closed end 512 and open end 513.Wherein, framework 511 is an open circles
Column structure is provided at least one window 5111 in the framework 511 of probe 51.Second sensor is provided in framework 511
23 integrated circuit 52, the temperature and humidity information for collecting environment of integrated circuit 52.
Wherein, the diameter of framework 511 be 5.0mm~5.8mm, framework 511 with a thickness of 0.4mm~0.6mm.
One end of framework 511 is provided with closed end 512, the other end of framework 511 is provided with open end 513, second
Connecting line 242 is connect by open end 513 with integrated circuit 52.Wherein, 242 one end of the second connecting line connects microcontroller 211,
The other end extends to the integrated circuit 52 in framework 511 by the open end 513 of probe 51, and is electrically connected with integrated circuit 52,
So that integrated circuit 52 can transmit temperature and humidity information to microcontroller 211 by the second connecting line 242.
The closed end 512 of probe 51 can be a bullet header structure, i.e. the cross-sectional area of closed end 512 is equal to or less than framework
511 cross-sectional area.On the other hand 512 one side of closed end is used for for preventing extraneous dust and other impurities from entering in framework 511
Integrated circuit 52 in protection and fixed frame 511.
The shape of closed end 512 is not limited to bullet header structure, is Fig. 9 second sensor referring specifically to Figure 10, Figure 10
Probe structural schematic diagram.
In Figure 10 a, pop one's head in 51 closed end 512 can be conical by its shape closed end 512, conical closure end 512 is separate
One end of framework 511 is the vertex at conical closure end 512, and the bottom surface at conical closure end 512 is overlapped with a surface of framework 511.
Since the cross-sectional area on the vertex at conical closure end 512 is sufficiently small, so that second sensor 23 is sticked by conical closure end 512
It is easy to set up in the gap of cold chain article, it can preferably acquire the temperature and humidity information of cold chain article.
In Figure 10 b, pop one's head in 51 closed end 512 can be a boss-shaped closing frame, the closed end 512 of boss-shaped
Cross-sectional area is less than the cross-sectional area of framework 511.Correspondingly, the closed end 512 with boss-shaped can be set in cold-chain box
Compatible groove.When installing second sensor 23 in cold-chain box, 51 closed end 512 of boss-shaped of popping one's head in is stuck in cold chain
In the groove of case, to achieve the effect that fixed second sensor 23, it is easy to accomplish, improve the usage experience of user.
Further, if 51 closed end 512 of in Figure 10 c, popping one's head in can be a T-shaped closing frame.Wherein, T-shaped
Closed end 512 includes the first box 5121 and the second box 5122, and the cross-sectional area of the first box 5121 is less than the cross of framework 511
Sectional area, the cross-sectional area of the second box 5122 is greater than the cross-sectional area of the first box 5121, in the outer of the first box 5121
It encloses to be formed with annular groove.Due in cold-chain box cold chain article surface and contact surface it is uneven, installation second sensor
When 23, the groove outside the first box 5121 can be embedded in the raised zones of cold chain article surface or contact surface, to be not necessarily to
The case where reequiping cold-chain box, preferably fixed second sensor 23.
The structural schematic diagram popped one's head in above-mentioned Figure 10 is corresponded to, window 5111 is provided in the framework 511 in probe 51, in frame
The integrated circuit 52 of second sensor 23 is provided in body 511.Wherein, the corresponding window 5111 of integrated circuit 52 is arranged in framework
511.Integrated circuit 52 is correspondingly arranged with window 511, be conducive to integrated circuit 52 preferably detect environment temperature information and
Humidity information improves the detection accuracy and detection quality of second sensor 23.
In Fig. 9, window 5111 is shaped to square, and the size dimension and shape adaptation of window 5111 are in integrated
The size dimension and shape of circuit 52, to improve the detection effect of integrated circuit 52.The shape of window 5111 is not limited to pros
The shape of shape is the structural schematic diagram of window in Fig. 9 referring specifically to Figure 11, Figure 11.
In Figure 11 a, window 5111 is shaped to rectangle；In Figure 11 b, window 5111 is shaped to circle
Shape, to adapt to integrated circuit 52 of different shapes.Further, the quantity for window 5111 being arranged in framework 511 is not limited to one
A, in Figure 11 c, there are two windows 5111, two windows 5111 to be oppositely arranged in framework 511 for setting in framework, integrates electricity
Road 52 can be arranged between two windows 5111 toward or away from closed end 512, and 51 two windows 5111 of setting of probe can make
It obtains the air that integrated circuit 52 detects constantly to circulate, so that the accuracy for obtaining temperature and humidity information can be improved in integrated circuit 52.
It corresponds to, the size and shape of two windows 5111 can be different, and further, the shape of two windows 5111 can respectively refer to figure
Shape in 11a and Figure 11 b.
Wherein, 51 framework of probe, 511 diameter of second sensor 23 can be 5.0mm~5.8mm, the diameter of closed end 512
Less than the diameter of framework 511, the wall thickness of framework 511 and closed end 512 can be 0.3mm~0.7mm；The diameter of integrated circuit 52 can
For 2.2mm~2.8mm.Therefore, the volume of the second sensor 23 is very small, is easily installed.
Referring to Figure 12, the sensor of the present embodiment includes hollow framework 61, and pcb board 62 is provided in framework 61,
Equipped with integrated circuit 63 on pcb board 62；It is equipped with window 611 corresponding with integrated circuit 63 in framework 61, is set on window 611
It is equipped with formed frame 612.The revealed sensor of the present embodiment is the revealed second sensor 23 of above-described embodiment, herein no longer
It repeats.
Wherein, formed frame 612 is nested with window 611 and each other in interference fit.It is coated on the surface of window 611 anti-
Water ventilated membrane 64, between the rim sandwiched and window 611 and formed frame 612 of waterproof ventilated membrane 64.Waterproof ventilated membrane 64 passes through window
Mouth 611 and formed frame 612 are fixed, and window 611 and formed frame 612 are all the interference nested arrangements of " returning " font to closed window
Mouthful.The material of waterproof ventilated membrane 64 includes high molecular polymerization species water-repellent paint, polyurethanes water-repellent paint and polyacrylic water-proof
Coating etc..
Certain waterproof performance is needed in pcb board 62 and the integrated circuit 63 being arranged on pcb board 62；In other embodiments
In, formed frame 612 is not provided in sensor, and waterproof ventilated membrane 64 is directly applied to pcb board 62 and/or integrated circuit
On 63, to save the cost and material of sensor.
After the pcb board 62 and the progress waterproofing protection of integrated circuit 63 to sensor internal, the sensor of the present embodiment can
It is placed in liquid environment, the circuit structure without damaging pcb board 62 and integrated circuit 63, to improve the waterproof of sensor
Performance.
Further, since one end of framework 61 is connected with connecting line 65, connecting line 65 passes through one end and the PCB of framework 61
The integrated circuit 63 carried on plate 62 or pcb board 62 connects, and is used for transmission the collected temperature and humidity information of integrated circuit 63.Even
The junction of wiring 65 and framework 61 tends to the case where causing steam to enter, and therefore, the present embodiment is further in connecting line
65 are smeared using above-mentioned waterproof ventilated membrane 64 with the junction of framework 61 and cover, and to guarantee the waterproof effect of sensor, are improved and are passed
The service life of sensor.
Figure 13 is please referred to, probe 700 includes framework 71, closed end 72 and open end 73.Wherein, framework 71 is a hollow knot
Structure is provided with pcb board 711 and integrated circuit 712 in framework 71.Wherein, integrated circuit 712 is mounted on pcb board 711, can
Wiring and assembly problem are greatly reduced, the gentle input of labor of Automated water of manufacture probe 700 is improved.
In the present embodiment, pcb board 711 and the setting of integrated circuit 712 are in probe 700, and microcontroller setting is being visited
Outside first 700, therefore the size of pcb board 711 and integrated circuit 712 determines the actual size of probe 700, and then reduces pcb board
711 and integrated circuit 712 size be conducive to reduce probe 700 occupied space and manufacturing cost.
Connecting line 714 is additionally provided in probe 700, one end of connecting line 714 is arranged in framework 71, and other end setting exists
It outside framework 71, and is connect with microcontroller, which is revealed second connecting line 242 of above-described embodiment.
Specifically, the pcb board 711 of the present embodiment is only equipped with integrated circuit 712 and corresponding with 714 quantity of connecting line connects
Mouthful.Therefore, the size dimension of pcb board 711 is consistent with the size dimension of integrated circuit 712, or than the size ruler of integrated circuit 712
It is very little slightly larger.
Based on the design of above-mentioned pcb board 711 and integrated circuit 712, the diameter dimension of pcb board 711 is 2mm~4mm, such as
The diameter dimension of pcb board 711 can be 2mm, 3mm or 4mm；In order to which pcb board 711 and the setting of integrated circuit 712 are being popped one's head in
In 700, therefore the diameter dimension for 700 inner walls of popping one's head in only needs the diameter dimension than pcb board 711 slightly larger, specifically, probe 700
The diameter dimension of inner wall can be 3mm~5mm.
Referring to Figure 14, on the basis of probe 700 of above-described embodiment, the integrated circuit 712 of the present embodiment is by beating
The mode of glue or buckle is fixed on pcb board 711.In other embodiments, integrated circuit 712 can be welded by Surface Mount, straight cutting
Connect, straight cutting crimping etc. modes integrated circuit 712 is mounted on pcb board 711.
In the prior art, probe usually requires that the fixed structures such as fluted or fixing piece are arranged, and is used for pcb board sum aggregate
It installs at circuit to probe.The probe of the prior art is only capable of the pcb board for certain shape and size, and is unfavorable for updating collection
At circuit；In the manufacturing process of probe, it is also desirable to form corresponding fixed structure in framework, will increase manufacturing process and system
Cause this.
In the present embodiment, the cross-sectional area of closed end 72 is less than the cross-sectional area of framework 71.Pcb board 711 can be pros
Shape pcb board, the catercorner length of pcb board 711 is less than the diameter of 71 inner wall of framework, and the catercorner length of pcb board 711 is greater than envelope
The diameter of closed end 72.It therefore,, only need to be flat by pcb board 711 when installing pcb board 711 without installing fixed structure in probe 700
It is put into framework 71, so that pcb board 711 slides into closed end 72；Since the catercorner length of pcb board 711 is greater than closed end
72 diameter, pcb board 711 can be fixed on closed end 72, so that pcb board 711 is fixed on closed end 72 or closed end 72 and framework
71 junction.
Alternatively, pcb board 711 can also be less than the diameter of 71 inner wall of framework for round pcb board, the diameter of pcb board 711, and big
Diameter in closed end 72, the principle and above-mentioned square pcb board that round pcb board 711 is fixed in probe 700 are fixed on probe
Principle in 700 is identical, and details are not described herein.Therefore, the probe 700 of the present embodiment is reduced without additional setting fixed structure
The manufacturing process and manufacturing cost of probe 700.
It should be noted that the above various embodiments belongs to same inventive concept, the description of each embodiment emphasizes particularly on different fields,
Not detailed place is described in separate embodiment, can refer to the description in other embodiments.
Protection circuit and control system provided by the embodiment of the present application are described in detail above, it is used herein
The principle and implementation of this application are described for specific case, and the above embodiments are only used to help understand
The present processes and its core concept；At the same time, for those skilled in the art is having according to the thought of the application
There will be changes in body embodiment and application range, in conclusion the content of the present specification should not be construed as to the application
Limitation.
Claims (10)
1. a kind of temperature-humidity detecting device, which is characterized in that the temperature-humidity detecting device includes at least shell, the first sensing
Device, second sensor, microcontroller, the first connecting line and the second connecting line, the second sensor are arranged outside the shell,
The first sensor and the microcontroller are arranged in shell, and the first sensor passes through first connecting line and institute
Microcontroller connection is stated, the second sensor is connect by second connecting line with the microcontroller, and described second passes
Sensor includes probe, is provided with window on the probe；
The second sensor further includes integrated circuit, and the integrated circuit corresponds to the window and is arranged in the probe.
2. temperature-humidity detecting device according to claim 1, which is characterized in that the probe includes the framework, closing
The closed end is arranged in end and open end, one end of the framework, and the open end is arranged in the other end, and second connecting line is logical
The open end is crossed to connect with the second sensor；
Wherein, the window is arranged in the framework.
3. temperature-humidity detecting device according to claim 2, which is characterized in that the shape of the probe is cylindrical type knot
Structure, bullet header structure or pyramidal structure；
The diameter of the framework be 5.0mm~5.8mm, the framework with a thickness of 0.4mm~0.6mm.
4. temperature-humidity detecting device according to claim 1, which is characterized in that the shape of the window is square, grows
It is rectangular or round；The size of the window is greater than or equal to the size of the integrated circuit.
5. temperature-humidity detecting device according to claim 4, which is characterized in that the integrated circuit includes positive and anti-
Face；
The window further comprises first window and the second window, and the front of the integrated circuit is arranged in the first window
In corresponding framework, in the corresponding framework of reverse side that the integrated circuit is arranged in second window.
6. temperature-humidity detecting device according to claim 1, which is characterized in that the diameter of second connecting line is 3mm.
7. temperature-humidity detecting device according to claim 6, which is characterized in that second connecting line is the connection of two cores
One of line, three core connecting lines or four core connecting lines.
8. temperature-humidity detecting device according to claim 1, which is characterized in that the temperature-humidity detecting device is for detecting
Cold chain cabinet, the shell are arranged on the outer wall of the cold chain cabinet, and the second sensor is arranged in the cold chain cabinet
Interior, the first sensor is used to obtain the first external temperature and humidity information of the cold-chain box, and the second sensor is for obtaining
Take the intracorporal second temperature and humidity information of the cold-chain box.
9. temperature-humidity detecting device according to claim 1, which is characterized in that the microcontroller includes GPIO interface,
The microcontroller is second sensor power supply by the GPIO interface.
10. a kind of temperature/humiditydetection detection system, which is characterized in that the temperature/humiditydetection detection system includes radio network gateway, remote service
Device and temperature-humidity detecting device as described in any one of claims 1-9, multiple temperature-humidity detecting devices and the nothing
Connection is established in gauze pass, and the remote server, which obtains temperature and humidity from the temperature-humidity detecting device by the radio network gateway, to be believed
Breath.
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|---|---|---|---|---|
| CN110118579A (en) * | 2019-05-21 | 2019-08-13 | 深圳洲斯移动物联网技术有限公司 | A kind of detection circuit and its temperature-humidity detecting device, temperature/humiditydetection detection system |
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