WO2018189592A1 - Appareil pour dégager automatiquement une pâte de soudure résiduelle, comprenant un canal de gaz dans la plate-forme de travail servant de support à une cuve de pâte à souder - Google Patents

Appareil pour dégager automatiquement une pâte de soudure résiduelle, comprenant un canal de gaz dans la plate-forme de travail servant de support à une cuve de pâte à souder Download PDF

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Publication number
WO2018189592A1
WO2018189592A1 PCT/IB2018/000496 IB2018000496W WO2018189592A1 WO 2018189592 A1 WO2018189592 A1 WO 2018189592A1 IB 2018000496 W IB2018000496 W IB 2018000496W WO 2018189592 A1 WO2018189592 A1 WO 2018189592A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
gas
nozzle
moving plate
automatically removing
Prior art date
Application number
PCT/IB2018/000496
Other languages
English (en)
Chinese (zh)
Inventor
杨宁
Original Assignee
伊利诺斯工具制品有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201720395631.7U external-priority patent/CN207266403U/zh
Priority claimed from CN201710245207.9A external-priority patent/CN108738246B/zh
Application filed by 伊利诺斯工具制品有限公司 filed Critical 伊利诺斯工具制品有限公司
Priority to EP18734284.5A priority Critical patent/EP3610974B1/fr
Priority to KR1020197033356A priority patent/KR102456216B1/ko
Priority to US16/604,463 priority patent/US11072033B2/en
Priority to JP2019555891A priority patent/JP7152416B2/ja
Publication of WO2018189592A1 publication Critical patent/WO2018189592A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Definitions

  • the present application relates to an apparatus for automatically removing residual solder paste, and more particularly to an apparatus for automatically removing residual solder paste from a solder paste printer used in printed circuit board surface mount technology.
  • solder paste printer also known as a stencil printer
  • Solder paste printing machines generally include a stencil (or a stencil), a paste paste device, a squeegee or a squeegee.
  • the board is automatically fed into a solder paste printer having a pattern of solder pads or some other conductive surface on which the solder paste can be deposited, and having a reference point on the board
  • One or more apertures or indicia for use as a reference point to align the board with the screen in the solder paste printer prior to printing the solder paste onto the board.
  • the solder paste is dispensed by moving the wiper or squeegee through the stencil to force the solder paste through the holes in the stencil and onto the board. After the printing operation, the board is then sent to another workstation within the printed circuit board processing line.
  • the automatic solder paste device on the solder paste printer is used to automatically add canned or cartridge solder paste to the stencil of the solder paste printer to replenish the solder paste that is consumed during the printing process.
  • the solder paste can usually form a solder paste canister assembly with a solder paste nozzle inserted into the solder paste can from the opening of the solder paste can, and distribute the solder paste from the solder paste can by the relative displacement of the solder paste can and the solder paste nozzle (or squeeze) Press it out.
  • the automatic solder paste device first install the solder paste can assembly on the automatic solder paste device so that the solder paste can is opened downward, and then move the solder paste can assembly to a certain position above the mesh plate.
  • the solder paste is dispensed from the solder paste tank nozzle to the stencil by extrusion or extraction (this action is simply referred to as “plus tin”).
  • the two actions of positioning and tinning are usually driven by two separate drive components (eg pusher cylinders, rotary cylinders, motors, etc.). With two drive units
  • the automatic solder paste device makes the mechanical structure and control system of the solder paste printing machine complicated, and takes up a lot of space and costs.
  • solder paste after the solder paste is dispensed from the solder paste can nozzle to the stencil by performing an action such as pressing or drawing, the solder paste itself has its own weight, and since the solder paste is sticky, the solder paste can be finished after the tinning action is completed.
  • the nozzle opening of the nozzle usually has solder paste residue.
  • a tray for receiving the residual solder paste which is dripped is usually added near the nozzle opening of the solder paste can nozzle, and then the tray is periodically cleaned. Maintenance costs are increased due to the need for the operator to clean the pallets. Summary of the invention
  • An object of the present application is to provide an apparatus for automatically removing residual solder paste which can effectively and automatically remove the solder paste remaining at the nozzle opening of the solder paste of the automatic solder paste apparatus at a low cost.
  • the apparatus for automatically removing residual solder paste includes: a workbench for carrying a solder paste can, the solder paste can accommodate a solder paste nozzle, the solder paste nozzle having a solder paste nozzle,
  • the workbench has a solder paste through hole for accommodating a solder paste nozzle port; a gas passage provided in the work table, the gas passage including a gas inlet and a gas outlet, the gas inlet being configured In order to communicate with a source of cleaning gas, the gas outlet is configured to blow a gas toward a solder paste nozzle port received in the through-hole of the solder paste, thereby cutting the solder paste remaining at the nozzle opening of the solder paste.
  • the gas passage includes a first passage portion and a second passage portion that communicate with each other, the first passage portion is connected to the cleaning gas source, and the second passage portion is connected to the gas.
  • the outlet, the second passage portion is thinner than the first passage portion such that the flowing gas in the first passage portion is accelerated in the second passage portion.
  • the gas outlet is flat, so that the gas for cutting the residual solder paste flowing out from the gas outlet is sharper.
  • the gas is a compressed gas.
  • the stage includes a first thicker portion and a second thinner portion, and a bottom surface of the second thinner portion is higher than a bottom surface of the first thicker portion, thereby Forming a stepped surface connected to a bottom surface of the second thinner portion on the first thicker portion;
  • the solder paste via extends through the second thinner portion, and the gas outlet is disposed on the stepped surface.
  • the gas outlet is adjacent to the solder paste via.
  • the gas passage is provided in the first thick portion.
  • the table is fixedly coupled to one end of the table support device.
  • the solder paste can includes a case, the case accommodating the solder paste nozzle, the case being movable relative to a solder paste nozzle, the solder paste can The solder paste nozzle is carried upside down on the table, and the case of the solder paste can be pressed by a press plate that moves up and down over the solder paste can to move relative to the solder paste nozzle So that the solder paste can be extruded from the solder paste can.
  • the means for automatically removing residual solder paste is configured to blow a gas through the gas outlet to be accommodated in the chamber after the press plate stops pressing the solder paste can The solder paste nozzle port in the through-hole of the solder paste, thereby cutting the tin remaining at the nozzle of the solder paste.
  • the device for automatically removing the residual solder paste of the present application can be automatically adopted after the automatic solder paste device is completed.
  • the air knife cuts the residual solder paste at the nozzle of the solder paste, so that the solder paste remaining at the nozzle of the solder paste of the automatic solder paste device can be automatically and effectively removed at a low cost, and no manual operation is required to remove the residual solder paste. .
  • FIGS. 1A and 1B are respectively a perspective view and an exploded view of the automatic solder paste device of the present application;
  • FIGs. 2A and 2B are respectively a perspective view showing the inside and outside of the moving plate of the present application;
  • FIG. 3A and 3B respectively show an inside and outside perspective view of the pressure plate of the present application
  • Figure 4 is a cross-sectional view taken along line AA of Figure 1A;
  • Figure 5 shows a duty cycle of the automatic solder paste device of the present application
  • Figure 6 shows a perspective view of the cage and height adjustment device of the present application
  • 7A and 7B are respectively a perspective view and an exploded view of the solder paste can of the present application.
  • Figure 8A shows a cross-sectional view of the solder paste can assembly of the present application
  • Figure 8B is a perspective view of the nozzle in the solder paste can assembly of the present application.
  • Figure 8C shows a cross-sectional view of the assembly for providing solder paste of the present application
  • Figure 9A shows a perspective view of the workbench of the present application
  • Figure 9B is a partial cross-sectional view of the station of Figure 1A showing the gas passages and solder paste vias in the table. detailed description
  • the automatic solder paste device 100 includes a support plate 130, a push rod 110, a platen 120, a moving plate 140, and a table 150.
  • the support plate 130 is mounted on a solder paste printer (not shown) for supporting the automatic solder paste device 100.
  • the pressure plate 120 is disposed at the end of the push rod 110, and the push rod 110 can be driven by the driving device 160 to move up and down, thereby driving the pressure plate 120 to move up and down.
  • the support plate 130 is relatively fixed with respect to the up and down movement of the push rod 110.
  • the table 150 is fixed to the moving plate 140 on the inner side 141 of the moving plate 140, for example, at the lower end 143 of the moving plate 140.
  • the outer side 145 of the moving plate 140 is slidably disposed on the support plate 130 so that the moving plate 140 can slide up and down with respect to the support plate 130, thereby causing the table 150 to ascend and descend.
  • the moving plate 140 slides down to the bottom dead center, the moving plate 140 reaches its working position.
  • the stage 150 is used to carry the solder paste can 700 and the solder paste nozzle 500 housed in the solder paste can 700.
  • the table 150 is lowered to the height required above the screen of the printing press (i.e., the L line shown in Fig. 5), and the solder paste can 700 is realized in the height direction.
  • the pressure plate 120 is slidably disposed on the inner side 141 of the moving plate 140.
  • the driving device 160 of the push rod 110 may be a cylinder or a motor or the like.
  • the drive unit 160 can be mounted on the solder paste printer as the support plate 130, or can be mounted on the support plate 130 such that the positions of the drive unit 160 and the support plate 130 remain relatively fixed. Mounting of the drive unit 160 on the support plate 130 can be accomplished by a transverse mounting plate 170 having an aperture 172 through which the push rod 110 extends.
  • a lower one-way locking mechanism 144, 134 is provided between the moving plate 140 and the support plate 130.
  • the lower one-way locking mechanism 144, 134 defines a bottom dead center for the moving plate 140 to move up and down, and locks the moving plate 140 when the moving plate 140 is in the operating position, so that the moving plate 140 cannot continue to move downward.
  • an upper locking mechanism 142, 122 is disposed between the moving plate 140 and the pressing plate 120, and the upper locking mechanism 142, 122 is configured such that the pressing plate 120 can move relative to the moving plate 140 without the moving plate 140 moving. It is also possible to move together with the moving plate 140 while the moving plate 140 is moving.
  • the upper locking mechanisms 142, 122 are configured such that the platen 120 can move the moving plate 140 together to move the moving plate 140 to the working position or move away from the working position, and enable the platen 120 to be locked at the moving plate 140. Moves up and down relative to the moving plate 140 in the working position.
  • the positioning action of moving the solder paste can 700 and the solder paste nozzle 500 to the height above the stencil can be achieved using only one driving device 160.
  • the tinning action of dispensing the solder paste from the solder paste can nozzle onto the stencil.
  • the upper locking mechanisms 142, 122 and the lower one-way locking mechanisms 144, 134 are described in detail below in conjunction with Figures 2A, 2B, 3A and 3B.
  • the lower one-way locking mechanism 144, 134 includes a blocking flange 134 disposed at the lower end 131 of the support plate 130 and a blocked flange disposed on the outer side 145 of the moving plate 140 (see Figure 2A).
  • the blocking flange 134 is located below the blocked flange 144, and has the same The blocked flange 144 forms an overlapping portion.
  • the support plate 130 prevents the moving plate 140 from continuing to move downward, thereby The moving plate 140 is locked in the working position.
  • the blocking flange 134 and the blocked flange 144 are formed by protrusions that extend outwardly from the support plate 130 and the moving plate 140, respectively.
  • the blocked flange 144 may be disposed at the middle or upper end of the outer side 145 of the moving plate 140, and the position of the blocked flange 144 on the outer side 145 of the moving plate 140 depends on the lifting distance of the predetermined table 150.
  • the upper locking mechanism 142, 122 includes a traction edge 122 disposed on the pressure plate 120 and a force bearing flange 142 disposed on the inner side 141 of the moving plate 140, the traction edge 122 being located
  • the force receiving flange 142 is below and has a portion that overlaps with the force receiving flange 142.
  • the moving plate 140 when the moving plate 140 is locked in its operative position by the lower one-way locking mechanism 144, 134, the continued downward movement of the pressure plate 120 causes its traction edge 122 to disengage from the force bearing flange 142 of the moving plate 140, thereby releasing the moving plate. 140. Thereafter, the platen 120 is movable downward relative to the moving plate 140 to press the solder paste can 700 to perform the tinning operation.
  • the pressure plate 120 is fixed in its initial position by the push rod 110. At this time, since the force receiving flange 142 of the moving plate 140 abuts against the pulling edge 122 of the pressure plate 120, the moving plate 140 is fixed by the pressing plate 120. Only when the driving device 160 starts to drive the push rod 110 to move downward, the moving plate 140 can move down with the pressing plate 120 until reaching the working position of the moving plate 140. When the moving plate 140 is locked in its working position by the lower one-way locking mechanism 144, 134, the pressure plate 120 can be moved downward relative to the moving plate 140 to perform the tinning work process.
  • the pressing plate 120 can be driven by moving the pressing plate 120 upward to the pulling edge 122 of the moving plate 140 against the force receiving flange 142.
  • the moving plate 140 moves up.
  • the force receiving flange 142 is formed by a protrusion that extends outward from the moving plate 140, and the traction edge 122 is an inner edge of the pressure plate 120.
  • the force bearing flange 142 may be disposed at an upper end of the inner side 141 of the moving plate 140.
  • the support plate 130 has a first chute 136 extending between its upper end 132 and lower end 131.
  • the moving plate 140 has a first slider 146 disposed on the outer side 145 thereof.
  • the first slider 146 cooperates with the first chute 136 to slidably connect the moving plate 140 to the support plate 130.
  • the first slider 146 and the first sliding slot 136 are both trapezoidal in cross section, and their dimensions are matched so that the first slider 146 can be inserted into the first sliding from the upper and lower ends of the first sliding slot 136. In the groove 136, and can slide up and down along the first chute 136 without being loosened from the first chute 136 in a direction transverse to the first chute 136.
  • the inner side 141 of the moving plate 140 has a second chute 147 extending between its upper end and lower end.
  • the platen 120 has a second slider 127 on its trailing edge 122.
  • the second slider 127 and the second chute 147 cooperate to connect the pressure plate 120 to the inner side 141 of the moving plate 140 so as to be slidable up and down.
  • the second slider 127 and the second sliding slot 147 are both trapezoidal in cross section, and their dimensions are matched so that the second slider 127 can be inserted into the second slider from the upper and lower ends of the second sliding slot 147. In the groove 147, and can slide up and down along the second sliding groove 147 without being loosened from the second sliding groove 147 in the direction transverse to the second sliding groove 147.
  • Fig. 4 shows a cross-sectional view taken along line A-A of Fig. 1A. 4 shows a cross section of the first slider 146, the first chute 136, the second slider 127, and the second chute 147, and shows the second slider 127 of the pressure plate 120 and the first of the moving plate 140.
  • the thickness of the platen 120 at its trailing edge 122 is greater than the thickness of the remainder of the platen 120. This arrangement is such that the thickness of the second slider 127 at the trailing edge 122 can be set larger to make the sliding of the pressure plate 120 relative to the moving plate 140 smoother.
  • FIGS. 5(a)-(e) are exploded showing the moving plate 140 and the platen 120 in the up and down direction (ie, the height direction) with respect to the stencil L during one duty cycle of the automatic solder paste device 100.
  • the position change on the upper side ie, the travel of the moving plate 140 and the pressure plate 120).
  • the duty cycle includes a positioning process of moving the solder paste can 700 from the initial position to the working position in the height direction, a working process of adding tin (hereinafter referred to as "working process"), and returning the solder paste can 700 from the working position in the height direction.
  • working process a working process of adding tin
  • FIG. 5(a)-(e) does not mean that the automatic solder paste device 100 moves to the left and right with respect to the screen L during the working cycle, and the automatic solder paste device 100 can be relative to the net in one working cycle.
  • the movement of the plate L can also be fixed with respect to the screen L.
  • the automatic solder paste device 100 linearly moves in the horizontal direction with respect to the screen L during the working of adding tin to follow a straight line or curve on the screen L from the initial position where the solder paste is required. Dispensing the solder paste until the end of the stencil L is required to add the solder paste.
  • the automatic solder paste device 100 is in the process of positioning the solder paste can 700 from the initial position to the working position in the height direction and returning the solder paste can 700 from the working position to the initial position in the height direction. It may not move in the horizontal direction with respect to the screen L, or may move in the horizontal direction with respect to the screen L.
  • the automatic solder paste device 100 has a parking position in the printing press.
  • the automatic solder paste device 100 Before starting the duty cycle of the automatic solder paste device 100, the automatic solder paste device 100 needs to be moved from the parking position to the stencil L. The starting position of the solder paste is required, and after the tinning process is completed, the automatic solder paste device 100 needs to be moved from the termination position of the stencil L to the parking position.
  • the positioning process of moving the solder paste can 700 from the initial position to the working position in the height direction may occur at the start position of the solder paste required to move the automatic solder paste device 100 from the parking position to the screen L
  • the process of returning the solder paste can 700 from the working position to the initial position in the height direction may occur when the automatic solder paste device 100 is moved from the termination position of the stencil L to the parking position in the process of.
  • the platen 120 and the moving plate 140 have the following strokes: (i) a stroke that moves together toward the working position of the moving plate 140, and (ii) reaches the moving plate 140.
  • the stroke of the relative movement downward after the working position (ii i) the stroke of the relative movement upward after the end of the working process, (iv) the stroke of the common movement upward.
  • the stroke moving downward toward the working position of the moving plate 140 realizes a positioning process of moving the solder paste can 700 from the initial position to the working position in the height direction, and (ii) reaching the moving plate 140.
  • FIG. 5 shows the initial positions of the pressure plate 120 and the moving plate 140.
  • the driving device 160 has not started to drive the push rod 110 to move downward, so that the pressure plate 120 is fixed by the push rod 110, and the moving plate
  • the upper locking mechanism 142, 122 is locked by the pressure plate 120 and cannot be moved downward.
  • Figure 5 (b) shows the moving plate 140 just moved down to its working position, at which time the moving plate 140 is locked by the lower one-way locking mechanism 144, 134 and cannot continue to move downward.
  • the stroke from Fig. 5(a) to Fig. 5(b) is the stroke in which the pressure plate 120 and the moving plate 140 move together toward the working position.
  • the upper locking mechanisms 142, 122 still lock the moving plate 140 so that the moving plate 140 cannot move freely downward, but can move downward as the push rod 110 and the pressure plate 120 move downward. Therefore, as the driving device 160 drives the push rod 110 to move downward, the moving plate 140 moves downward with the pressing plate 120 along with the push rod 110.
  • the end of this trip means that the positioning process of the solder paste can 700 ends and the solder paste can 700 is positioned at the desired height above the stencil L.
  • Figure 5 (c) shows that the platen 120 is pressing the solder pot 700.
  • the stroke from Fig. 5 (b) to Fig. 5 (C) is the stroke of the downward relative movement after reaching the working position of the moving plate 140.
  • the moving plate 140 is locked by the lower one-way locking mechanism 144, 134 and cannot continue to move downward, while the upper locking mechanisms 142, 122 release the moving plate 140 so that the platen 120 can be lowered relative to the moving plate 140 mobile.
  • the pressure plate 120 is moved relative to the moving plate 140 to contact with the solder paste can 700, the tinning work process begins, and the downward movement of the pressure plate 120 presses the solder paste can 700, so that the solder paste can 700 is mounted on the table 150.
  • the nozzles 500 which are accommodated in the solder paste can 700, are relatively moved, thereby distributing the solder paste contained in the solder paste can 700 from the nozzle 500 to the lower screen L.
  • the end of this trip means that the platen 120 has completed the tinning action and the work process is over.
  • Figure 5 (d) shows the platen 120 rising after the end of the working process such that the upper locking mechanism 142, 122 relocks the moving plate 140, at which point the locking is to move the moving plate 140 up to its original position by the platen 120 ( As shown in Figure 5 (e)).
  • the stroke from Fig. 5(c) to Fig. 5(d) is the stroke of the upward relative movement of the pressure plate 120 and the moving plate 140 after the end of the working process.
  • the upper locking mechanisms 142, 122 still release the moving plate 142, and the platen 120 moves upward relative to the moving plate 140 until the trailing edge 122 of the platen 120 abuts the force bearing flange 142 of the moving plate 140.
  • Figure 5 (e) shows the moving plate 130 moving up back to its original position.
  • the stroke from Fig. 5 (d) to Fig. 5 (e) is the stroke of the upward movement of the pressure plate 120 and the moving plate 140.
  • the upper locking mechanism 142, 122 locks the moving plate 140 such that the moving plate 140 moves upward as the push rod 110 moves upward.
  • the end of this stroke means that the platen 120 and the moving plate 140 return to their original positions, and one duty cycle of the automatic solder paste device 100 ends.
  • the automatic solder paste device 100 of the present application can realize the need to move the solder paste can 700 to the top of the stencil using only one driving device 160.
  • the high positioning action and the tinning action of dispensing the solder paste from the solder paste can nozzle 500 onto the stencil. Therefore, the automatic solder paste device 100 of the present application has a simple mechanical structure and a control system, and has a small space and a low cost.
  • the present application also provides a device for preventing solder paste from dripping in the automatic solder paste device 100, and the present application also provides a device for preventing solder paste from dripping.
  • the solder paste is a highly viscous fluid such that the solder paste contained in the solder paste can 700 is adhered to the case 710 (shown in Fig. 7A) of the solder paste can 700, and the solder paste has a certain weight.
  • the solder paste can 700 When the solder paste can 700 is mounted on the table 150 through the solder paste nozzle 500 with the opening facing downward, even if the pressure plate 120 does not press the solder paste can 700, the self-weight of the solder paste causes the solder paste to flow out of the solder paste nozzle 500. . And since the solder paste is adhered to the housing 710 of the solder paste can 700, the self-weight of the solder paste drives the solder paste can 700 to move downward relative to the nozzle 500 housed in the solder paste can 700, and the solder paste can 700 is opposed to the nozzle The downward movement of 500 squeezes the solder paste out of the solder paste can 700, which increases the tendency of the solder paste to flow out of the nozzle 500.
  • the present application provides the apparatus for preventing solder paste from dripping and the solder paste can 700 used in conjunction with the apparatus for preventing solder paste from dripping, to prevent the solder paste from the solder paste nozzle due to its own weight. Dripping in 500.
  • Figure 6 shows the holder 180 and height adjustment device 190 in a device for preventing solder paste from dripping.
  • the means for preventing the solder paste from dripping includes a holder 180 and a height adjusting device 190, and one end of the height adjusting device 190 is attached to the holder 180.
  • the holder 180 is provided with a through hole 181 that is sized to match the outer diameter of the housing 710 of the solder can 700.
  • FIGS. 1A and 1B in use, the holder 180 is above the table 150 for carrying the solder paste can 700, and the housing 710 of the solder paste can 700 is connected through its through hole 181.
  • One end of the holder 180 is slidably coupled to the table support device (i.e., the moving plate 140) for supporting the table 150, so that the holder 180 can follow the tin as the solder paste in the solder can 700 is reduced.
  • the paste can 700 is moved downward to accommodate the relative positional changes of the solder paste nozzle 500 and the solder canister housing 710.
  • the table supporting device to which the holder 180 is connected is the moving plate 140, but for the automatic soldering paste device not using the moving plate 140, It is also possible to use the apparatus for preventing solder paste from dripping provided by the present application, and the stage supporting means may be a non-moving part as long as the part is used to support the table 150. That is to say, any automatic solder paste device, as long as it uses an inverted solder paste can to add tin, can use the above-mentioned device for preventing solder paste from dripping provided by the present application, and in use, the holder 180 is connected. On the table support device for supporting the solder paste can stage.
  • the other end of the height adjusting device 190 is also coupled to the moving plate 140 for adjusting the height of the retainer 180 relative to the moving plate 140.
  • the height adjustment device 190 is a spring spring, and the spring spring includes a free end 191 and a spiral roll portion 195.
  • the free end 191 of the spring spring is connected to the holder 180, and the spiral roll portion 195 of the spring spring is mounted on the movement.
  • the moving plate 140 is provided with a corresponding receiving space 149 (see Fig. 2A) to accommodate the spiral coil portion 195 of the spring.
  • the spring force of the spring should match the weight of the solder paste contained in the solder pot 700.
  • the spring force of the spring spring cannot be set too large to prevent the solder paste can 700 from being pulled out from the solder paste nozzle 500, and cannot be set too small to prevent the solder paste can 700 from being applied to the solder paste can 700 to offset The weight of the solder paste.
  • the height adjustment device 190 may include two springs that are coupled to both ends of the holder 180, respectively. The provision of two springs provides a smoother adjustment of the height of the cage 180 relative to the moving plate 140. It is to be noted that, as with the holder 180, when the automatic solder paste device 100 does not use the moving plate 140, the height adjusting device 190 is attached to the table supporting device that supports the table 150.
  • the cage 180 includes a slider 182 on one side thereof.
  • the slider 182 can be coupled to a chute provided on the table support device (such as the moving plate 140) (such as the second chute of the moving plate 140) 147) cooperate to slidably connect the retainer 180 to the table support device (e.g., the moving plate 140).
  • the slider 182 and the second chute 147 on the moving plate 140 are trapezoidal in cross section, and their dimensions are matched so that the slider 182 can be inserted into the second sliding from the upper and lower ends of the second chute 147. In the groove 147, and can slide up and down along the second sliding groove 147 without being loosened from the second sliding groove 147 in the direction transverse to the second sliding groove 147.
  • the solder canister 700 includes a housing 710 and a cover 720 having an outlet 712 that covers the outlet 712. After the solder paste is loaded into the housing 710, the cover 720 seals the outlet 712 to seal the solder paste in the housing 710.
  • the outer wall of the housing 710 is provided with a snapping device 750.
  • the latching device 750 can The through hole 181 of the holder 180 is engaged to snap the solder paste can 700 into the holder 180.
  • the snap-fit device 750 is a limit flange that extends along the circumference of the outer wall of the housing 710.
  • the snap-fit device 750 is disposed adjacent the outlet 712, whereby the snap-fit device 750 can cooperate with the cover 720 to seal the solder paste in the solder pot 700.
  • FIG. 8A shows a cross-sectional view of a solder paste can assembly 800 of the present application
  • Figure 8B shows a perspective view of a solder paste nozzle in a solder paste can assembly of the present application
  • the solder paste can assembly 800 of the present application includes a solder paste can 700 as shown in FIG. ,, a solder paste housed in the solder paste can 700, and a solder paste nozzle 500 housed in the solder paste can 700 ( As shown in Figure 8B).
  • the solder paste can assembly 800 is mounted on the table 150 via a solder paste nozzle 500 (shown in Figure 1A).
  • the solder paste nozzle 500 has a nozzle body 510, a nozzle hole 520 extending through the nozzle body 510, an enlarged head portion 530 at the end of the nozzle body 510, and a nozzle opening 550 at the other end of the nozzle body 510.
  • the diameter of the enlarged head 530 matches the inner diameter of the solder can 700.
  • the outer diameter of the nozzle body 510 near the nozzle opening 550 can be set small to mount the solder paste nozzle 500 in the solder paste through hole 155 of the stage 150 (as shown in Fig. 9B).
  • the cover 720 of the solder paste can 700 is first removed from the outlet 712, and then the enlarged head portion 530 of the solder paste nozzle 500 is removed from the solder paste can.
  • the outlet 712 of the 700 is inserted into the housing 710.
  • the vicinity of the outlet 712 in the solder paste can 700 is not filled with solder paste, but has a mounting space for the solder paste nozzle 500.
  • the above-described means for preventing the solder paste from dripping is matched with the solder paste can 700, and the amount of the solder paste which is dropped from the solder paste nozzle opening 550 or remains at the nozzle opening 550 due to the weight of the solder paste can be reduced.
  • Fig. 8C is a cross-sectional view showing the assembly (solder holder holding member) for providing a solder paste of the present application.
  • the assembly for providing a solder paste of the present application includes a holder 180, a height adjusting device 190, a solder paste can 700, and the like for supplying a solder paste to an automatic solder paste device.
  • the assembly for providing solder paste of the present application utilizes the mutual engagement of the limiting flange 750 on the solder canister housing and the holder 180 to prevent the solder paste from dripping due to its own weight when the solder paste is provided, thereby improving
  • the utilization of solder paste saves cost, and also prevents the solder paste from dripping in unnecessary positions and improves the production efficiency of the product.
  • a method of providing a solder paste using the assembly for providing a solder paste has been described above and will not be described herein.
  • Figure 9A shows a perspective view of the table 150 of the present application.
  • Figure 9B is a partial cross-sectional and enlarged view of the table 150 of Figure 1A showing the positional relationship of the gas passages 900 and the solder paste vias 155 in the table 150.
  • the present application also provides an apparatus for automatically removing residual solder paste comprising a gas passage 900 (shown in Figures 9A and 9B) disposed in the table 150.
  • the table 150 is provided with a solder paste through hole 155 for accommodating the solder paste nozzle opening 550 and a gas passage 900 for the cleaning gas source (not The gas in the display is directed toward the solder paste nozzle opening 550 housed in the solder paste via 155 to cut (or remove) the solder paste remaining at the solder paste nozzle opening 550 by gas.
  • the table 150 includes a first thicker portion 157 and a second thinner portion 156, the bottom surface 156a of the second thinner portion 156 being higher than the bottom surface 157a of the first thicker portion 157, thereby being in the first thicker portion
  • a stepped surface 158 is formed on 157 that is coupled to the bottom surface 156a of the second thinner portion 156.
  • a solder paste via 155 extends through the second thinner portion 156, and a gas channel 900 is disposed in the first thicker portion 157.
  • the gas passage 900 includes a gas inlet 910 and a gas outlet 920, the gas inlet 910 is in communication with a source of cleaning gas, and the gas outlet 920 is disposed on the stepped surface 158 to The gas is blown toward the solder paste nozzle opening 550 housed in the solder paste through hole 155.
  • the gas outlet 920 is disposed adjacent to the solder paste via 155 to improve the cleaning efficiency of the cleaning gas.
  • the gas outlet 920 is flat to allow the cutting gas flowing out of the gas outlet 920 to be formed into a gas knife.
  • the gas passage 900 includes a first passage portion 930 and a second passage portion 940 that communicate with each other, the first passage portion 930 is connected to the cleaning gas source through the gas inlet 910, and the second passage portion 940 is connected to the gas outlet 920.
  • the second passage portion 940 is thinner than the first passage portion 930 such that the gas flowing from the first passage portion 930 to the second passage portion 940 is accelerated, forming a sharper air knife at the gas outlet 920.
  • the cleaning gas may be a compressed gas to increase the flow rate of the gas, thereby facilitating sharpening of the air knife.
  • the above device for automatically removing the residual solder paste is cut off after the tinning work process is finished, that is, after the press plate 120 stops pressing the solder paste can 700, the residual solder which is left by the solder paste nozzle port 550 is cut off, and the residual tin is cut off.
  • the position where the solder paste on the stencil is located, thereby preventing the solder paste nozzle opening 550 during the process of raising the table 150 up to the initial position or moving the automatic solder paste device 100 as a whole.
  • the residual solder paste is randomly dropped on the stencil where no solder paste is dispensed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)

Abstract

La présente invention concerne un appareil destiné à éliminer automatiquement une pâte de soudure résiduelle, comprenant: une plate-forme de travail (150) servant de support à une cuve de pâte à souder comportant une buse de pâte à souder, la buse de pâte à souder ayant une embouchure de buse de pâte à souder, la plate-forme de travail (150) ayant un trou traversant (155) pour la pâte à souder permettant de recevoir l'embouchure de buse de pâte à souder; et un canal de gaz disposé dans la plate-forme de travail (150), le canal de gaz comprenant une entrée de gaz (910) et une sortie de gaz (920), l'entrée de gaz (910) étant conçue pour être en communication avec une source de gaz de nettoyage, et la sortie de gaz (920) étant conçue pour souffler du gaz vers l'embouchure de buse de pâte à souder logée dans le trou traversant (155) de pâte à souder, ce qui permet de couper la pâte à souder restant au niveau de l'embouchure de la buse de pâte à souder.
PCT/IB2018/000496 2017-04-14 2018-04-13 Appareil pour dégager automatiquement une pâte de soudure résiduelle, comprenant un canal de gaz dans la plate-forme de travail servant de support à une cuve de pâte à souder WO2018189592A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP18734284.5A EP3610974B1 (fr) 2017-04-14 2018-04-13 Appareil pour dégager automatiquement une pâte de soudure résiduelle, comprenant un canal de gaz dans la plate-forme de travail servant de support à une cuve de pâte à souder
KR1020197033356A KR102456216B1 (ko) 2017-04-14 2018-04-13 솔더 페이스트 통을 지탱하는 작업 플랫폼 내에 가스 채널을 지닌 잔여 솔더 페이스트 자동 세정 장치
US16/604,463 US11072033B2 (en) 2017-04-14 2018-04-13 Apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub
JP2019555891A JP7152416B2 (ja) 2017-04-14 2018-04-13 残留はんだペーストを自動的に除去する装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201710245207.9 2017-04-14
CN201720395631.7U CN207266403U (zh) 2017-04-14 2017-04-14 用于自动清除残留锡膏的装置
CN201710245207.9A CN108738246B (zh) 2017-04-14 2017-04-14 用于自动清除残留锡膏的装置
CN201720395631.7 2017-04-14

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WO2018189592A1 true WO2018189592A1 (fr) 2018-10-18

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US (1) US11072033B2 (fr)
EP (1) EP3610974B1 (fr)
JP (1) JP7152416B2 (fr)
KR (1) KR102456216B1 (fr)
TW (1) TWI760479B (fr)
WO (1) WO2018189592A1 (fr)

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KR102218105B1 (ko) * 2019-12-19 2021-02-19 고혜원 솔더카트리지의 범용 사용이 가능한 솔더 자동 주입기

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EP3610974B1 (fr) * 2017-04-14 2022-02-16 Illinois Tool Works Inc. Appareil pour dégager automatiquement une pâte de soudure résiduelle, comprenant un canal de gaz dans la plate-forme de travail servant de support à une cuve de pâte à souder
CN112872534B (zh) * 2021-02-26 2022-10-11 中山市诚浩电子有限公司 一种集上锡及除锡一体的半自动焊锡笔

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US11072033B2 (en) 2021-07-27
JP2020516498A (ja) 2020-06-11
JP7152416B2 (ja) 2022-10-12
EP3610974A1 (fr) 2020-02-19
KR102456216B1 (ko) 2022-10-18
TW201836862A (zh) 2018-10-16
TWI760479B (zh) 2022-04-11
US20200147709A1 (en) 2020-05-14
KR20190140960A (ko) 2019-12-20
EP3610974B1 (fr) 2022-02-16

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